Array substrate, display panel, and display device

Abstract

This application provides an array substrate, a display panel, and a display device. The array substrate includes a substrate, common electrode traces, and functional units. The functional units are located in a bezel area. Each functional unit includes a thermoelectric electrode and a heating trace. The heating trace partially surrounds the display area and is located on the side of the common electrode trace closest to the substrate. The heating trace includes a first portion and a second portion connected together. The connection between the first portion and the second portion is electrically connected to one end of the thermoelectric electrode. The thermoelectric electrode and the first portion form a thermocouple, and / or, the thermoelectric electrode and the second portion form a thermocouple. The functional units have heating and temperature sensing functions, and each function is time-division multiplexed. By providing functional units located in the bezel area of ​​the array substrate, this application embodiment can achieve temperature detection of the display panel and can also heat the liquid crystal in low-temperature environments, improving the display speed and display quality of the display panel, and increasing the stability and reliability of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to an array substrate, a display panel, and a display device. Background Technology

[0002] Most liquid crystal displays (LCDs) are backlit LCDs, which consist of a housing, a liquid crystal display panel housed within the housing, and a backlight module within the housing. LCDs require a light source provided by the backlight module to display images properly.

[0003] Typically, a liquid crystal display panel is made by bonding two glass substrates (array glass and color filter glass) together, with liquid crystal injected between the two glass substrates. Pixel electrodes and common electrodes are set on the opposite inner sides of the two glass substrates. The rotation direction of the liquid crystal molecules is controlled by the voltage field, and the light from the backlight module is refracted to produce an image.

[0004] Due to the inherent properties of liquid crystal molecules, LCDs have a high degree of adhesion; and because of their poor response speed, especially at low temperatures, their ghosting effect is more pronounced, seriously affecting the display quality. Summary of the Invention

[0005] The main technical problem addressed by this application is to provide an array substrate, a display panel, and a display device, thereby solving the problem of poor liquid crystal response speed in the prior art.

[0006] To address the aforementioned technical problems, the first technical solution provided in this application is: to provide an array substrate having a display area and a border area; comprising:

[0007] Substrate;

[0008] The common electrode trace is located on one side of the substrate and within the border area;

[0009] The array substrate also includes functional units located in the border area; the functional units include:

[0010] Thermoelectric electrode;

[0011] A heating trace is provided, which partially surrounds the display area and is located on the side of the common electrode trace closer to the substrate; the heating trace includes a first part and a second part that are connected; the connection between the first part and the second part is electrically connected to one end of the heating electrode; the heating electrode and the first part form a thermocouple, and / or the heating electrode and the second part form a thermocouple.

[0012] The functional units have heating and temperature sensing functions, and each function is time-sharing multiplexed.

[0013] in,

[0014] There is one thermoelectric electrode;

[0015] or,

[0016] There are two thermoelectrodes. The heating trace includes a second part and two first parts. The second part is connected between the two first parts. The thermoelectrodes are set one-to-one with the first parts and form thermocouples with the corresponding first parts.

[0017] The second part has a longer line length than the first part; the thermocouple is formed with the first part; the second part has an arc-shaped trace, and the first part has a straight trace.

[0018] The hot electrode is located on the side of the heating trace away from the substrate; the hot electrode and the common electrode trace are patterned using the same metal layer; the hot electrode is located at the end of the common electrode trace and is insulated from the common electrode trace.

[0019] Among them, the projection of the common electrode trace on the substrate covers the orthogonal projection of the heating trace on the substrate;

[0020] The width of the common electrode trace is 150 micrometers to 1500 micrometers.

[0021] in,

[0022] The array substrate also includes virtual pixel electrodes, which are located in the bezel area and surround the display area; the virtual pixel electrodes are located on the side of the common electrode trace closer to the display area and are electrically connected to the common electrode trace.

[0023] The heating trace is located on the side of the virtual pixel electrode closer to the substrate, and the orthogonal projection of the virtual pixel electrode on the substrate covers part of the orthogonal projection of the heating trace on the substrate.

[0024] The array substrate also includes a gate insulating layer and a thin-film transistor located in the display area. The gate insulating layer is located between the source and drain layers of the thin-film transistor and the gate layer of the thin-film transistor.

[0025] The thin-film transistor has a top-gate structure, and the array substrate also includes a light-shielding layer and a buffer layer stacked sequentially. The buffer layer is located between the light-shielding layer and the thin-film transistor. The light-shielding layer and the heating trace are patterned from the same metal layer. The hot electrode passes through the gate insulating layer and the buffer layer sequentially and is electrically connected to the heating trace, or the hot electrode passes through the buffer layer and is electrically connected to the heating trace.

[0026] or,

[0027] The thin-film transistor has a bottom-gate structure, with the heating trace located on the side of the gate insulating layer close to the substrate. The hot electrode passes through the gate insulating layer and is electrically connected to the heating trace.

[0028] in,

[0029] The array substrate includes a heating stage and a temperature sensing stage;

[0030] During the temperature sensing stage, the other end of the thermocouple is connected to a high-level signal and a low-level signal respectively, and the thermocouple senses the temperature.

[0031] During the heating phase, a high-level signal is connected to one end of the heating trace, and a low-level signal is connected to the other end, so that the heating trace is heated.

[0032] To address the aforementioned technical problems, the second technical solution provided in this application is: a display panel, comprising:

[0033] Array substrate, such as the array substrate described above;

[0034] The color filter substrate is positioned opposite to the array substrate;

[0035] The liquid crystal is located between the array substrate and the color filter substrate.

[0036] To solve the above-mentioned technical problems, the third technical solution provided in this application is: to provide a display device, which includes a driver chip and the above-mentioned display panel;

[0037] The driver chip is electrically connected to the common electrode trace, the hot electrode, and the heating trace, respectively.

[0038] The beneficial effects of this application are as follows: Unlike existing technologies, this application provides an array substrate, a display panel, and a display device. The array substrate has a display area and a bezel area. The array substrate includes a substrate, common electrode traces, and functional units. The functional units are located in the bezel area. Each functional unit includes a thermoelectric electrode and a heating trace. The heating trace partially surrounds the display area and is located on the side of the common electrode trace closest to the substrate. The heating trace includes a first portion and a second portion connected together. The connection between the first portion and the second portion is electrically connected to one end of the thermoelectric electrode. The thermoelectric electrode forms a thermocouple with the first portion, and / or, the thermoelectric electrode forms a thermocouple with the second portion. The functional units possess heating and temperature sensing functions, and each function is time-division multiplexed. By providing functional units located in the bezel area of ​​the array substrate, this application embodiment can achieve temperature detection of the display panel and can also heat the liquid crystal in low-temperature environments, improving the display speed and display quality of the display panel, and increasing the stability and reliability of the display panel. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0040] Figure 1 This is a top view of the first embodiment of the array substrate provided in this application.

[0041] Figure 2 This is a top view of the second embodiment of the array substrate provided in this application.

[0042] Figure 3 This is a schematic diagram of the longitudinal section structure of an array substrate provided in this application embodiment;

[0043] Figure 4 This is a top view of the third embodiment of the array substrate provided in this application.

[0044] Figure 5 This is a schematic diagram of the longitudinal section structure of another embodiment of the array substrate provided in this application;

[0045] Figure 6 This is a schematic diagram of the longitudinal section structure of another embodiment of the array substrate provided in this application;

[0046] Figure 7 This is a schematic diagram of the structure of a display panel according to an embodiment of this application;

[0047] Figure 8 This is a schematic diagram of the structure of an embodiment of the display device provided in this application;

[0048] Figure 9 This is a schematic diagram of another embodiment of the display device provided in this application.

[0049] Explanation of icon numbers:

[0050] 100, Array substrate; 101, Display area; 1011, First side; 1012, Second side; 102, Border area; 1021, Fan-out area; 10, Substrate; 20, Common electrode trace; 30, Functional unit; 31, Thermoelectric electrode; 311, Lead portion; 312, Block portion; 32, Heating trace; 321, First part; 322, Second part; 323, Thermocouple node; 40, Virtual pixel electrode; 50, Gate insulating layer; 60, Thin film transistor; 61, Source / drain layer; 62, Gate layer; 63, Active layer; 70, Buffer layer; 80, Interlayer dielectric layer; 90, Light-shielding layer; 200, Color filter substrate; 300, Liquid crystal; 400, Display panel; 500, Driver chip; 600, Flexible printed circuit board; 700, Flexible substrate; 800, Display device. Detailed Implementation

[0051] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0052] In the following description, specific details such as particular system architectures, interfaces, and technologies are presented for illustrative purposes rather than for limiting purposes, in order to provide a thorough understanding of this application.

[0053] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0054] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0055] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0056] Please see Figure 1 and Figure 2 , Figure 1 This is a top view of the first embodiment of the array substrate provided in this application. Figure 2 This is a top view of the second embodiment of the array substrate provided in this application.

[0057] This application provides an array substrate 100, which has a display area 101 and a border area 102. The array substrate 100 includes a substrate 10, a common electrode trace 20, and functional units 30. The functional units 30 are located in the border area 102. The functional unit 30 includes a thermoelectric electrode 31 and a heating trace 32. The heating trace 32 partially surrounds the display area 101 and is located on the side of the common electrode trace 20 closest to the substrate 10. The heating trace 32 includes a first portion 321 and a second portion 322 that are connected. The connection between the first portion 321 and the second portion 322 is electrically connected to one end of the thermoelectric electrode 31. The thermoelectric electrode 31 and the first portion 321 form a thermocouple, and / or, the thermoelectric electrode 31 and the second portion 322 form a thermocouple. The functional unit 30 has heating and temperature sensing functions, and each function is time-division multiplexed.

[0058] This application embodiment, by providing a functional unit 30 located in the border area 102 in the array substrate 100, can realize the display panel 400 (see Figure 7 Temperature detection can also heat the LCD 300 (see) in low-temperature environments. Figure 7 This improves the display speed and quality of the display panel 400, and increases the stability and reliability of the display panel 400.

[0059] The substrate 10 can be a rigid substrate, such as glass, quartz, sapphire, etc.; the substrate 10 can also be a flexible substrate 600, such as polyimide (PI), polyethylene terephthalate (PET), etc. There are no restrictions on the material of the substrate 10; it can be selected according to actual needs. The substrate 10 is a transparent substrate.

[0060] The array substrate 100 also includes an in-plane common electrode layer (not shown), which is located in the display area 101. The in-plane common electrode layer is used to form an electric field, control the alignment of the liquid crystal 300, improve display quality, reduce cross-interference, improve response speed, and reduce power consumption.

[0061] There are no restrictions on the shape and wiring method of the common electrode layer on the surface; the choice can be made according to actual needs.

[0062] Common electrode trace 20 is located in frame area 102 and is used to connect external control circuitry (e.g., driver chip 400, see...) Figure 8 It is electrically connected to the in-plane common electrode layer.

[0063] The material of the common electrode trace 20 can be the same as or different from the material of the in-plane common electrode layer. There are no strict restrictions here; the choice can be made according to actual needs.

[0064] In some embodiments, the material of the common electrode trace 20 is different from the material of the in-plane common electrode layer. The in-plane common electrode layer includes at least one of indium tin oxide (ITO), zinc oxide (ZnO), and gallium-doped zinc oxide (GZO). The common electrode trace 20 partially surrounds the display area 101. The common electrode trace 20 includes a metallic material such as copper or molybdenum.

[0065] In other embodiments, the in-plane common electrode layer can be made of other materials. The common electrode trace 20 can also be made of other non-metallic conductive materials, such as graphene.

[0066] In some embodiments, the display area 101 is rectangular. A border area 102 surrounds the display area 101. The display area 101 is used to house structures such as pixels (not shown), data signal lines (not shown), and scan signal lines (not shown). The border area 102 is used to house structures such as scan circuits (not shown) and test circuits (not shown).

[0067] In other embodiments, the display area 101 may be circular or other shapes, and there is no limitation here; it can be selected according to actual needs.

[0068] The bezel area 102 includes a fan-out area 1021, which is located on one side of the display area 101. The fan-out area 1021 and the common electrode trace 20 are located on different sides of the display area 101. The fan-out area 1021 refers to the area used for signal transmission and connection, which can improve the integration and reliability of the display panel 400 and reduce the bezel width.

[0069] For example, the common electrode trace 20 is located on the other three sides of the display area 101, excluding the side where the fan-out area 1021 is located.

[0070] The array substrate 100 includes a heating stage and a temperature sensing stage. The operating stages of the array substrate 100 are matched with the functions of the functional unit 30.

[0071] Functional unit 30 has heating function and temperature sensing function, and the heating function and temperature sensing function are not performed at the same time.

[0072] During the temperature sensing stage, functional unit 30 has a temperature sensing function. The thermocouple is formed between the thermoelectrode 31 and the first part 321, and / or between the thermoelectrode 31 and the second part 322. The other end of the thermoelectrode 31 is connected to a high-level signal and a low-level signal, respectively, via the heating trace 32, allowing the thermocouple to sense the temperature. At the connection point between the first part 321 and the second part 322, where it contacts one end of the thermoelectrode 31, a thermocouple node 323 is formed, serving as the measuring end of the thermocouple. The thermocouple is used to detect the ambient temperature of the liquid crystal 300 in the display panel 400, thereby improving the low-temperature driving and high-temperature polarization problems of the liquid crystal 300.

[0073] For example, during the temperature sensing stage, a high-level signal is connected to the other end of the thermoelectrode 31, and a low-level signal is connected to the heating trace 32. The thermoelectrode 31 and part of the heating trace 32 form a closed loop, and a thermocouple node 323 is formed at the connection between the thermoelectrode 31 and the heating trace 32.

[0074] During the heating phase, a high-level signal is connected to one end of the heating trace 32 and a low-level signal is connected to the other end, so that the heating trace 32 is heated.

[0075] For example, the heating trace 32 forms a closed loop with the external control circuit. Current circulates in the heating trace 32 to generate continuous heat, thereby heating the liquid crystal 300 in a low-temperature environment, improving the response speed of the liquid crystal 300, thereby improving the display speed and display quality of the display panel 400, and increasing the stability and reliability of the display panel 400.

[0076] The heating electrode 31 includes a lead portion 311 and a block portion 312. The lead portion 311 is used to electrically connect an external control circuit to the block portion 312. The connection point between the first portion 321 and the second portion 322 of the heating lead is electrically connected to the block portion 312.

[0077] For example, the side where the fan-out area 1021 is located is defined as the first side 1011 of the display area 101. The block portion 312 is located on the second side 1012 of the display area 101, which is adjacent to the first side 1011 of the display area 101, and is disposed close to the first side 1011. Alternatively, the block portion 312 is located at the overlap of the first side 1011 and the second side 1012 of the display area 101, that is, the block portion 312 is located at the corner of the border area 102 and is disposed close to the fan-out area 1021. The projection of the measuring end onto the block portion 312 is located within the block portion 312.

[0078] Designing a portion of the thermoelectrode 31 as a block, namely the block portion 312, facilitates electrical connection between the thermoelectrode 31 and the connection points of the first portion 321 and the second portion 322 in the heating wiring 32, thereby improving the detection accuracy of the thermocouple.

[0079] In some embodiments, such as Figure 1 As shown, there are two thermoelectrodes 31, and the heating trace 32 includes a second part 322 and two first parts 321. The second part 322 is connected between the two first parts 321. The thermoelectrodes 31 and the first parts 321 are arranged in a one-to-one correspondence and form a thermocouple with the corresponding first part 321.

[0080] For example, the two thermoelectric electrodes 31 are located on opposite sides of the display area 101, and both are located on the second side 1012 of the display area 101. The heating trace 32 is located on the other three sides of the display area 101, excluding the side where the fan-out area 1021 is located. The two thermoelectric electrodes 31 and the heating trace 32 form two thermocouples respectively. By feeding back the temperature at the measuring end, the ambient temperature of the liquid crystal 300 in the display panel 400 can be better monitored, thereby improving the low-temperature driving and high-temperature polarization problems of the liquid crystal 300.

[0081] In other embodiments, such as Figure 2 As shown, there is one thermoelectrode 31, that is, one measuring end. The thermoelectrode 31 forms a thermocouple with the first part 321, and / or, the thermoelectrode 31 forms a thermocouple with the second part 322.

[0082] When thermoelectrode 31 and the first part 321 form a thermocouple, and thermoelectrode 31 and the second part 322 form another thermocouple, the two thermocouples share the same measuring terminal.

[0083] In some embodiments, the line length of the second portion 322 is greater than that of the first portion 321. The thermoelectrode 31 and the first portion 321 form a thermocouple, with the second portion 322 having an arc-shaped trace and the first portion 321 having a straight trace. Designing the second portion 322 as arc-shaped increases the trace length to increase the heating resistance of the second portion 322 without occupying additional space in the frame area 102, which is beneficial for improving the heating effect and narrow frame design. Designing the first portion 321 as a straight trace, and shorter than the line length of the second portion 322, reduces the heat conduction path length, reduces the heat conduction influence between the measuring end and the non-measuring end in the thermocouple, and improves measurement accuracy.

[0084] For example, the second part 322 is arranged around three sides of the display area 101.

[0085] In other embodiments, the second part 322 can be a non-bow-shaped trace, which is not limited here and can be selected according to actual needs.

[0086] In some embodiments, such as Figure 4 As shown, the hot electrode 31 is located on the side of the heating trace 32 away from the substrate 10. The hot electrode 31 and the common electrode trace 20 are patterned using the same metal layer to simplify the fabrication process. The hot electrode 31 is located at the end of the common electrode trace 20 and is insulated from the common electrode trace 20, which is beneficial for narrow bezel design.

[0087] In other embodiments, the hot electrode 31 and the common electrode trace 20 can be made of different materials; this is not limited here, and the choice can be made according to actual needs. The hot electrode 31 can also be located in other positions.

[0088] Please see Figures 1 to 3 , Figure 3 This is a schematic diagram of the longitudinal section structure of an array substrate according to an embodiment of this application.

[0089] In some embodiments, the projection of the common electrode trace 20 onto the substrate 10 covers the orthographic projection of the heating trace 32 onto the substrate 10. The width of the common electrode trace 20 is 150 micrometers to 1500 micrometers.

[0090] For example, the width of the common electrode trace 20 is greater than the width of the heating trace 32. The orthographic projection of the common electrode trace 20 on the substrate 10 covers the orthographic projection of the second portion 322 of the heating trace 32 on the substrate 10, which can shield the heating signal of the heating trace 32 from interference with other signals of the display panel 400, so that the display panel 400 can display the image and heat up simultaneously.

[0091] Please see Figures 1 to 4 , Figure 4This is a top view of the third embodiment of the array substrate provided in this application.

[0092] In other embodiments, the array substrate 100 further includes a virtual pixel electrode 40 located in the border region 102 and surrounding the display region 101. The virtual pixel electrode 40 is located on the side of the common electrode trace 20 closest to the display region 101 and is electrically connected to the common electrode trace 20. A heating trace 32 is located on the side of the virtual pixel electrode 40 closest to the substrate 10, and the orthographic projection of the virtual pixel electrode 40 on the substrate 10 covers a portion of the orthographic projection of the heating trace 32 on the substrate 10.

[0093] For example, the virtual pixel electrode 40 has a ring-shaped structure. The orthographic projection of the virtual pixel electrode 40 on the substrate 10 covers the orthographic projection of the second portion 322 of the heating trace 32 on the substrate 10, which can shield the heating signal of the heating trace 32 from interference with other signals of the display panel 400, so that the display panel 400 can display the image and heat up at the same time.

[0094] For example, the virtual pixel electrode 40 can compensate for display unevenness in the edge area of ​​the display area 101 and other functions, which will not be described in detail here, referring to related technologies. The virtual pixel electrode 40 can be a transparent electrode. Specifically, the virtual pixel electrode 40 can be indium tin oxide (ITO), zinc oxide (ZnO), gallium-doped zinc oxide (GZO), etc.

[0095] Please see Figures 1 to 6 , Figure 5 This is a schematic diagram of the longitudinal cross-sectional structure of another embodiment of the array substrate provided in this application. Figure 6 This is a schematic diagram of the longitudinal section structure of another embodiment of the array substrate provided in this application.

[0096] In some embodiments, the array substrate 100 further includes a gate insulating layer 50 and a thin-film transistor 60 located in the display area 101. The gate insulating layer 50 is located between the source / drain layer 61 and the gate layer 62 of the thin-film transistor 60. The thin-film transistor 60 has a top-gate structure, and the gate layer 62 of the thin-film transistor 60 is located on the side of the source / drain layer 61 away from the substrate 10. The array substrate 100 also includes a light-shielding layer 90 and a buffer layer 70 stacked sequentially. The buffer layer 70 is located between the light-shielding layer 90 and the thin-film transistor 60. The light-shielding layer 90 blocks light incident on the active layer 63 of the thin-film transistor 60 to improve light leakage current. The light-shielding layer 90 and the heating trace 32 are patterned on the same metal layer, which simplifies the fabrication process. The hot electrode 31 passes through the gate insulating layer 50 and the buffer layer 70 sequentially and is electrically connected to the heating trace 32, or the hot electrode 31 passes through the buffer layer 70 and is electrically connected to the heating trace 32.

[0097] For example, such as Figure 5 As shown, the hot electrode 31 is located on the side of the gate insulating layer 50 away from the substrate 10, and the heating trace 32 is located between the substrate 10 and the buffer layer 70. The hot electrode 31 passes through the gate insulating layer 50 and the buffer layer 70 in sequence and is electrically connected to the heating trace 32.

[0098] For example, such as Figure 6 As shown, the hot electrode 31 is located between the gate insulating layer 50 and the buffer layer 70, and the heating trace 32 is located between the substrate 10 and the buffer layer 70. The hot electrode 31 passes through the buffer layer 70 and is electrically connected to the heating trace 32.

[0099] For example, the heating electrode 31 and the heating trace 32 are made of different materials. The heating electrode 31 is made of copper, and the heating trace 32 is made of constantan.

[0100] In other embodiments, the thermoelectrode 31 and the heating trace 32 can be made of other materials, provided that they can form a thermocouple.

[0101] In other embodiments, the array substrate 100 further includes a gate insulating layer 50 and a thin-film transistor 60 located in the display area 101. The gate insulating layer 50 is located between the source / drain layer 61 and the gate layer 62 of the thin-film transistor 60. The thin-film transistor 60 has a bottom-gate structure, and the gate layer 62 of the thin-film transistor 60 is located on the side of the source / drain layer 61 of the thin-film transistor 60 closest to the substrate 10. The heating trace 32 is located on the side of the gate insulating layer 50 closest to the substrate 10, and the heating electrode 31 passes through the gate insulating layer 50 and is electrically connected to the heating trace 32 (see...). Figure 3 ).

[0102] The array substrate 100 also includes an interlayer dielectric layer 80, which is located on the side of the common electrode trace 20 away from the substrate 10. The material and thickness of the interlayer dielectric layer 80 are not limited here and can be selected according to actual needs.

[0103] Please see Figures 1 to 7 , Figure 7 This is a schematic diagram of the structure of a display panel according to an embodiment of this application.

[0104] This application provides a display panel 400. The display panel 400 includes an array substrate 100, a color filter substrate 200, and a liquid crystal 300.

[0105] The array substrate 100 is the array substrate 100 described above. The color filter substrate 200 is disposed opposite to the array substrate 100. The liquid crystal 300 is located between the array substrate 100 and the color filter substrate 200.

[0106] In some embodiments, the deflection of the liquid crystal 300 is controlled by an electric field formed between the array substrate 100 and the color filter substrate 200, or by an electric field formed on the array substrate 100, to achieve the display of the display panel 400. The color filter substrate 200 is used to achieve the color display of the display panel 400.

[0107] The common electrode trace 20 is located on the side of the substrate 10 near the color filter substrate 200.

[0108] In some embodiments, the functional unit 30 has a temperature sensing function and a heating function. The functional unit 30 can detect the ambient temperature of the liquid crystal 300 in the display panel 400, further improving the low-temperature driving and high-temperature polarization problems of the liquid crystal 300. In addition, the functional unit 30 can also heat the liquid crystal 300 in a low-temperature environment, improving the display speed and display quality of the display panel 400, and increasing the stability and reliability of the display panel 400.

[0109] Please see Figures 1 to 9 , Figure 8 This is a schematic diagram of the structure of an embodiment of the display device provided in this application. Figure 9 This is a schematic diagram of another embodiment of the display device provided in this application.

[0110] This application provides a display device 800. The display device 800 includes a driver chip 500 and the display panel 400 described above.

[0111] The driver chip 500 is electrically connected to the common electrode trace 20, the hot electrode 31, and the heating trace 32, respectively.

[0112] In some embodiments, such as Figure 8As shown, the display device 800 also includes a flexible printed circuit board 600, which is electrically connected to the display panel 400 and is used to transmit image data, control signals, and power signals to the display panel 400. A driver chip 500 may be disposed on the flexible printed circuit board 600.

[0113] In other embodiments, crystal-on-glass (COG) technology is used to directly encapsulate the driver chip 500 onto the glass substrate of the display panel 400. Specifically, the driver chip 500 is directly encapsulated onto the substrate 10 of the array substrate 100.

[0114] In yet another embodiment, such as Figure 9 As shown, the display device 800 also includes a flexible substrate 700, which is electrically connected to the display panel 400. A driver chip 500 is disposed on the flexible substrate 700 using chip-on-film (COF) technology. The flexible substrate 700 serves to support the driver chip 500 and provides functions such as electrical connection and signal transmission.

[0115] The display device 800 may also include one or more of the following components (not shown in the figures): memory, power supply component, processing component, multimedia component, audio component, input / output (I / O) interface, sensor component, and communication component. The specific structure and function of these components are the same as or similar to those in related technologies; please refer to the related technologies for details, which will not be repeated here. The display device 800 may be a computer, digital broadcasting terminal, messaging device, game console, medical device, fitness equipment, personal digital assistant, etc., and this application does not limit this; the choice is based on actual needs.

[0116] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0117] The above are merely embodiments of this application and do not limit the scope of patent protection of this application. Any equivalent structural or procedural changes made using the content of this application’s specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. An array substrate having a display area and a border area; comprising: Substrate; The common electrode trace is located on one side of the substrate and within the border area; The array substrate is characterized in that it further includes a functional unit located in the border area; the functional unit includes: Thermoelectric electrode; A heating trace is provided, partially surrounding the display area, and located on the side of the common electrode trace closer to the substrate; the heating trace includes a first part and a second part connected together; the connection between the first part and the second part is electrically connected to one end of the heating electrode; the heating electrode and the first part form a thermocouple, and / or, the heating electrode and the second part form a thermocouple; The functional unit has heating and temperature sensing functions, and each function is time-division multiplexed. The array substrate includes a heating stage and a temperature sensing stage; During the temperature sensing stage, the other end of the thermoelectrode and the heating trace are respectively connected to a high-level signal and a low-level signal, and the thermocouple senses the temperature. During the heating stage, one end of the heating trace is connected to a high-level signal and the other end is connected to a low-level signal, and the heating trace is heated.

2. The array substrate according to claim 1, characterized in that, The thermoelectrode is one; or, There are two thermoelectrodes, and the heating trace includes one second part and two first parts. The second part is connected between the two first parts. The thermoelectrodes are arranged in a one-to-one correspondence with the first parts and form thermocouples with the corresponding first parts.

3. The array substrate according to claim 2, characterized in that, The length of the second part is greater than that of the first part; the thermoelectrode and the first part form a thermocouple, the second part is an arc-shaped trace, and the first part is a straight trace.

4. The array substrate according to claim 1, characterized in that, The hot electrode is located on the side of the heating trace away from the substrate; the hot electrode and the common electrode trace are patterned using the same metal layer; the hot electrode is located at the end of the common electrode trace and is insulated from the common electrode trace.

5. The array substrate according to claim 1, characterized in that, The projection of the common electrode trace on the substrate covers a portion of the orthogonal projection of the heating trace on the substrate; The width of the common electrode trace is 150 micrometers to 1500 micrometers.

6. The array substrate according to claim 1, characterized in that, The array substrate further includes a virtual pixel electrode, which is located in the border area and surrounds the display area; the virtual pixel electrode is located on the side of the common electrode trace closer to the display area and is electrically connected to the common electrode trace; The heating trace is located on the side of the virtual pixel electrode closer to the substrate, and the orthogonal projection of the virtual pixel electrode on the substrate covers part of the orthogonal projection of the heating trace on the substrate.

7. The array substrate according to claim 1 or 4, characterized in that, The array substrate further includes a gate insulating layer and a thin-film transistor located in the display area, wherein the gate insulating layer is located between the source and drain layers of the thin-film transistor and the gate layer of the thin-film transistor; The thin-film transistor has a top-gate structure, and the array substrate further includes a light-shielding layer and a buffer layer stacked sequentially, with the buffer layer located between the light-shielding layer and the thin-film transistor; the light-shielding layer and the heating trace are patterned on the same metal layer; the hot electrode passes through the gate insulating layer and the buffer layer sequentially and is electrically connected to the heating trace, or the hot electrode passes through the buffer layer and is electrically connected to the heating trace; or, The thin-film transistor has a bottom gate structure, the heating trace is located on the side of the gate insulating layer close to the substrate, and the hot electrode passes through the gate insulating layer and is electrically connected to the heating trace.

8. A display panel, characterized in that, include: An array substrate, as described in any one of claims 1 to 7; A color filter substrate is disposed opposite to the array substrate; The liquid crystal is located between the array substrate and the color filter substrate.

9. A display device, characterized in that, Includes a driver chip and the display panel as described in claim 8; The driver chip is electrically connected to the common electrode trace, the hot electrode, and the heating trace, respectively.

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