Display module, preparation method of display module and display device

Abstract

The invention provides a display module, a preparation method of the display module and a display device.The display module comprises a display panel which comprises a display area, a binding area and a bending area located between the display area and the binding area, and the display area and the binding area are oppositely arranged; the isolation cushion layer is located between the display area and the binding area; the composite film is located between the display area and the spacer layer; wherein the spacer layer comprises a thermocuring material, and the projection, based on the plane where the display area is located, of a first thermocuring area of the spacer layer is covered by the projection, based on the plane where the display area is located, of the binding area; and / or, the composite film comprises a thermocuring material, and the projection, based on the plane where the display area is located, of the second thermocuring area of the composite film is covered by the projection, based on the plane where the display area is located, of the binding area. According to the display module, marks generated in the bending area of the display module after the composite film and / or the spacer layer are / is pressed and deformed can be reduced, and the front impression of the display module is improved.

Description

Technical Field

[0001] The present invention relates to the field of display modules, and in particular to a display module, a method for preparing the display module, and a display device. Background Art

[0002] With the continuous advancement of electronic products with thinner and lighter weight and high screen-to-body ratio design, the narrow frame technology of display modules has become an important trend in the development of the industry. In display modules, in order to achieve reliable connection in the bending area, a spacer layer is usually used as a bonding intermediate between the second support layer and the composite film. Traditional composite films are mostly made of foam materials. With the intensification of the trend of lightweight materials and thinning thickness, the material composition of composite films has gradually evolved towards silicone gel.

[0003] However, compared with traditional foam, the modulus of silicone gel is significantly lower, which makes it more likely to produce irreversible deformation after being compressed. In addition, the modulus of the spacer layer is also low. In the bending area, the composite film and the spacer layer often have obvious marks at the compressed position after bending, which affects the visual effect of the front of the display module.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0005] In view of this, the present invention provides a display module, a method for preparing the display module and a display device, so as to at least solve the problem of marks generated after the composite film and the spacer layer of the display module are deformed under pressure.

[0006] In one aspect, an embodiment of the present invention provides a display module, comprising: a display panel, comprising a display area, a binding area, and a bending area located between the display area and the binding area, the display area and the binding area being arranged opposite to each other; a spacer layer located between the display area and the binding area; a composite film located between the display area and the spacer layer; wherein the spacer layer comprises a thermosetting material, a first thermosetting area of ​​the spacer layer is based on a projection of the plane where the display area is located, and is covered by a projection of the binding area based on the projection of the plane where the display area is located; and / or, the composite film comprises a thermosetting material, a second thermosetting area of ​​the composite film is based on a projection of the plane where the display area is located, and is covered by a projection of the binding area based on the projection of the plane where the display area is located.

[0007] On the other hand, an embodiment of the present invention also provides a method for preparing a display module, comprising: providing a display panel; wherein the display panel includes a display area, a binding area and a bending area located between the display area and the binding area; preparing a spacer layer in the binding area of ​​the display panel and preparing a composite film in the display area of ​​the display panel; wherein the spacer layer and / or the composite film include a thermosetting material; bending the display panel along the bending area so that the display area and the binding area are arranged opposite to each other; thermosetting the first thermosetting area of ​​the spacer layer and / or the second thermosetting area of ​​the composite film; wherein the first thermosetting area is based on a projection of the plane where the display area is located, and is covered by a projection of the binding area based on the plane where the display area is located; and / or the second thermosetting area is based on a projection of the plane where the display area is located, and is covered by a projection of the binding area based on the plane where the display area is located.

[0008] In yet another aspect, an embodiment of the present invention further provides a display device, comprising the above-mentioned display module.

[0009] The display module, the method for preparing the display module and the display device of the present invention form a first thermal curing zone and a second thermal curing zone by adding a thermal curing material to the composite film and / or the spacer layer of the display module and thermally curing the composite film and / or the spacer layer in the binding area, so as to increase the modulus of the composite film and / or the spacer layer in the binding area, reduce the pressure mark of the binding area of ​​the display module, and improve the front appearance of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The accompanying drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present invention, and together with the specification are used to explain the principles of the present invention. Obviously, the accompanying drawings described below are only some embodiments of the present invention, and for those of ordinary skill in the art, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0011] Figure 1 It is a structural schematic diagram of a composite membrane in the related art;

[0012] Figure 2 is a schematic diagram of the structure of another composite membrane in the related art;

[0013] Figure 3 It is a structural schematic diagram of a display module in the related art;

[0014] Figure 4 is a structural schematic diagram of a display module provided by an embodiment of the present invention;

[0015] Figure 5 is a schematic structural diagram of another display module provided by an embodiment of the present invention;

[0016] Figure 6is a structural schematic diagram of another display module provided by an embodiment of the present invention;

[0017] Figure 7 is a structural schematic diagram of another display module provided by an embodiment of the present invention;

[0018] Figure 8 is a structural schematic diagram of another display module provided by an embodiment of the present invention;

[0019] Fig. 9 is a flowchart of a method for preparing a display module provided by an embodiment of the present invention;

[0020] Fig.10 yes Fig. 9 Schematic diagram of the implementation process of step S140;

[0021] Fig.11 is a flowchart of another method for preparing a display module provided by an embodiment of the present invention;

[0022] Fig.12 It is a structural schematic diagram of a display device provided by an embodiment of the present invention.

[0023] Reference numerals:

[0024] 10 Display module

[0025] 11 Display Panel

[0026] 12 Spacer layer

[0027] 121 First thermal curing zone

[0028] 13 Composite membrane

[0029] 131 Second thermal curing zone

[0030] 132 Copper film

[0031] 133 Silicone gel film

[0032] 134 Foam

[0033] 135 Grid Glue

[0034] 14 First support layer

[0035] 15 Second support layer

[0036] 16 Driver chip

[0037] 17 Flexible Circuit Board

[0038] 20 Display device

[0039] 30 Hot Press Head DETAILED DESCRIPTION

[0040] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0041] The words "first", "second" and the like used in the specific description do not indicate any order, quantity or importance, but are only used to distinguish different components. In addition, in the description of the present invention, the orientation or position relationship indicated by the terms "upper" and "lower" are based on the orientation or position relationship shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0042] It should be noted that, in the absence of conflict, the embodiments of the present invention and features in different embodiments may be combined with each other.

[0043] With the continuous advancement of electronic products with thinner and lighter weight and high screen-to-body ratio design, the narrow frame technology of the display module 10 has become an important trend in the development of the industry. In the narrow frame design, the frame width of the display module 10 is continuously compressed, which puts higher requirements on the precision of the internal structure of the module and the material performance.

[0044] In the display module 10, in order to achieve reliable connection of the bending area, a spacer layer 12 is usually used as a bonding intermediate between the second support layer 15 and the composite film 13. The spacer layer 12 can effectively buffer the stress during the bending process and improve the durability and stability of the entire module. Figure 1 As shown, the traditional composite film 13 in the related art is mostly made of foam 134 material. Specifically, the composite film 13 includes: copper film 132, foam 134 and mesh glue 135 in sequence. Generally, the thickness of the copper film 132 is about 35μm, the thickness of the foam 134 is about 160μm, and the thickness of the mesh glue 135 is about 30μm. The foam 134 has a certain recovery ability when under pressure and can maintain the flatness of the module surface to a certain extent. However, with the intensification of the trend of lightweight materials and thinning thickness, the material composition of the composite film 13 has gradually evolved towards silicone gel. As Figure 2As shown, the composite film 13 includes: a copper film 132 and a silicone gel film 133 in sequence. Generally, the thickness of the copper film 132 is about 35 μm, and the thickness of the silicone gel film 133 is about 125 μm. As a new type of buffer material, silicone gel has received widespread attention and gradual application in narrow frame application scenarios due to its low modulus and excellent flexibility. However, compared with traditional foam 134, the modulus of silicone gel is significantly reduced, which makes it more susceptible to irreversible deformation after being compressed.

[0045] like Figure 3 As shown, a display module 10 in the related art includes: a display panel 11, a spacer layer 12 and a composite film 13. The display panel 11 includes a display area, a binding area and a bending area between the display area and the binding area, and the display area and the binding area are arranged opposite to each other. The spacer layer 12 is located between the display area and the binding area. The composite film 13 is located between the display area and the spacer layer 12. The composite film 13 adopts the design of a copper film 132 and a silicone gel film 133.

[0046] In the bending area, the composite film 13 composed of the silicone gel film 133 and the copper film 132 often has obvious marks at the compressed position after bending, thus affecting the visual effect of the front of the display module 10. During the long-term use of silicone gel material, the cumulative effect of its extrusion deformation is more significant, which further has a negative impact on the front appearance and reliability of the display module 10. In addition, the material of the spacer layer 12 is usually prosthetic tape, and the modulus is also low, which will also affect the visual effect of the front of the display module 10. Therefore, how to optimize the material selection and structural design of the composite film 13 and the spacer layer 12 in the narrow frame design, and reduce the pressure marks in the binding area of ​​the display module 10, has become a key technical problem in realizing a high-quality narrow-frame display module 10.

[0047] The inventor of this case has provided a solution to the problems existing in the prior art through careful and in-depth research. The present invention provides a display module 10, a method for preparing the display module, and a display device 20, wherein the display module 10 includes: a display panel 11, including a display area, a binding area, and a bending area between the display area and the binding area, and the display area and the binding area are arranged oppositely; a spacer layer 12, located between the display area and the binding area; a composite film 13, located between the display area and the spacer layer 12; wherein the spacer layer 12 includes a thermosetting material, and the first thermosetting area 121 of the spacer layer 12 is based on the projection of the plane where the display area is located, and is covered by the projection of the binding area based on the projection of the plane where the display area is located; and / or, the composite film 13 includes a thermosetting material, and the second thermosetting area 131 of the composite film 13 is based on the projection of the plane where the display area is located, and is covered by the projection of the binding area based on the projection of the plane where the display area is located. The display module 10, the method for preparing the display module, and the display device 20 of the present invention add a thermosetting material to the composite film 13 and / or the spacer layer 12 of the display module 10, and thermosetting the composite film 13 and / or the spacer layer 12 in the binding area, thereby forming a first thermosetting area 121 and a second thermosetting area 131, so as to increase the modulus of the composite film 13 and / or the spacer layer 12 in the binding area, reduce the pressure mark of the binding area of ​​the display module 10, and improve the front appearance of the display module 10.

[0048] The above is the core idea of ​​the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0049] like Figure 4 As shown, in one aspect, an embodiment of the present invention provides a display module 10 , which includes: a display panel 11 , a spacer layer 12 and a composite film 13 .

[0050] The display panel 11 includes a display area, a binding area, and a bending area between the display area and the binding area, wherein the display area and the binding area are arranged opposite to each other. The spacer layer 12 is located between the display area and the binding area. The composite film 13 is located between the display area and the spacer layer 12.

[0051] Specifically, the spacer layer 12 includes a thermosetting material, and the first thermosetting area 121 of the spacer layer 12 is based on the projection of the plane where the display area is located, and is covered by the projection of the binding area based on the projection of the plane where the display area is located; and / or, the composite film 13 includes a thermosetting material, and the second thermosetting area 131 of the composite film 13 is based on the projection of the plane where the display area is located, and is covered by the projection of the binding area based on the projection of the plane where the display area is located. By adding thermosetting material to the composite film 13 and / or the spacer layer 12 of the display module 10, and thermally curing the composite film 13 and / or the spacer layer 12 in the binding area, the first thermosetting area 121 and the second thermosetting area 131 are formed to increase the modulus of the composite film 13 and / or the spacer layer 12 in the binding area, reduce the pressure mark of the binding area of ​​the display module 10, and improve the front view of the display module 10.

[0052] like Figure 5 As shown, in some alternative embodiments, the composite film 13 includes a thermosetting material, and the second thermosetting area 131 of the composite film 13 is based on the projection of the plane where the display area is located, and coincides with the projection of the binding area based on the plane where the display area is located. In addition, the spacer layer 12 does not include a thermosetting material and a first thermosetting area 121. By making the second thermosetting area 131 of the composite film 13 completely overlap with the binding area, the area of ​​the second thermosetting area 131 can be increased as much as possible to increase the modulus of the second thermosetting area 131 in the binding area, so as to reduce the pressure mark of the binding area of ​​the display module 10 and improve the front view of the display module 10. At the same time, since the thermosetting of the area outside the binding area cannot reduce the pressure mark of the binding area of ​​the display module 10, the above-mentioned setting can avoid the thermosetting of the area outside the binding area, and avoid wasting the thermosetting process. In addition, only adding a thermosetting material to the composite film 13 and forming the second thermosetting area 131 can reduce the pressure mark of the binding area of ​​the display module 10 while simplifying the complexity of the preparation process.

[0053] like Figure 6As shown, in some alternative embodiments, the spacer layer 12 includes a thermosetting material, and the first thermosetting area 121 of the spacer layer 12 is covered by the projection of the binding area based on the plane where the display area is located. In addition, the composite film 13 does not include a thermosetting material and a second thermosetting area 131. By making the first thermosetting area 121 of the spacer layer 12 completely overlap with the binding area, the area of ​​the first thermosetting area 121 can be increased as much as possible to increase the modulus of the first thermosetting area 121 in the binding area, so as to reduce the pressure mark of the binding area of ​​the display module 10 and improve the front view of the display module 10. At the same time, since the thermosetting of the area outside the binding area cannot reduce the pressure mark of the binding area of ​​the display module 10, the above-mentioned setting can avoid the thermosetting of the area outside the binding area and avoid wasting the thermosetting process. In addition, only adding a thermosetting material to the spacer layer 12 and forming the first thermosetting area 121 can reduce the pressure mark of the binding area of ​​the display module 10 while simplifying the complexity of the preparation process.

[0054] like Figure 7 As shown, in some alternative embodiments, both the spacer layer 12 and the composite film 13 include a thermosetting material. The spacer layer 12, the first thermosetting area 121, and the second thermosetting area 131 overlap each other based on the projection of the plane where the display area is located. Adding thermosetting materials to both the spacer layer 12 and the composite film 13 and forming the first thermosetting area 121 and the second thermosetting area 131 can further reduce the pressure mark of the binding area of ​​the display module 10 and improve the front view of the display module 10.

[0055] In some embodiments, the thermosetting material includes a resin and a cross-linking agent, and the resin includes a combination of one or more of epoxy resin, phenolic resin or polyimide, but the present application is not limited thereto. The cross-linking agent includes a combination of one or two of amines or isocyanates, but the present application is not limited thereto. Take the thermosetting material as bisphenol A epoxy resin and the cross-linking agent as isocyanate as an example: at high temperature, the bisphenol A epoxy resin is ring-opened by isocyanate and cross-linked to form a network structure, thereby improving the modulus of the second thermosetting zone 131 of the composite film 13 and the first thermosetting zone 121 of the spacer layer 12, thereby reducing the pressure mark of the binding area of ​​the display module 10 while simplifying the complexity of the preparation process. The specific thermosetting reaction processes of other materials of the resin and the cross-linking agent are similar and will not be repeated here.

[0056] In some embodiments, the modulus of the first thermal curing zone 121 and / or the second thermal curing zone 131 is 0.5 to 5 MPa. In the related art, the modulus of the foam 134 is about 1100, and the modulus of the silicone gel is between 100 and 300. The material of the spacer layer 12 is usually a prosthetic tape, and its modulus is also relatively low. By using a thermal curing process to make the modulus of the first thermal curing zone 121 and / or the second thermal curing zone 131 in the above-mentioned setting, the modulus of the composite film 13 and the spacer layer 12 in the binding area can be effectively improved, the pressure mark of the binding area of ​​the display module 10 can be reduced, and the front view of the display module 10 can be improved. Specifically, the aforementioned modulus is an elastic modulus. The elastic modulus can be regarded as an indicator of the ease of elastic deformation of a material. The larger its value, the greater the stress that causes a certain elastic deformation of the material, that is, the greater the stiffness of the material, that is, under a certain stress, the smaller the elastic deformation.

[0057] In some embodiments, the composite film 13 includes: a copper film 132 and a silicone gel film 133, the copper film 132 is located between the silicone gel film 133 and the spacer layer 12, and the thermosetting material is distributed in the silicone gel film 133. Specifically, before preparing the composite film 13, the thermosetting material is mixed into the silicone gel film 133, and the specific doping ratio can be freely adjusted according to the requirements of the modulus of the second thermal curing zone 131 finally formed, and the present invention does not limit this. In addition, the thickness of the copper film 132 is 20 to 50 microns, and the thickness of the silicone gel film 133 is 100 to 150 microns to reduce the thickness of the display module 10. In addition, because the materials in other areas of the composite film 13 are not heated and do not react, the falling ball cushioning capacity of other areas of the composite film 13 and the risk of 3D bonding virtual bonding are not affected.

[0058] In some embodiments, the material of the spacer layer 12 is usually a prosthetic tape, and the thermosetting material is distributed in the prosthetic tape. Specifically, before preparing the spacer layer 12, the thermosetting material is mixed into the prosthetic tape, and the specific doping ratio can be freely adjusted according to the requirements of the modulus of the first thermosetting area 121 finally formed, and the present invention does not limit this. In addition, because the materials in other areas of the spacer layer 12 are not heated and do not react, the ball drop cushioning capacity of other areas of the spacer layer 12 and the risk of 3D lamination virtual lamination are not affected.

[0059] like Figure 8As shown, in some embodiments, the display module 10 further includes: a first support layer 14, a second support layer 15, a driver chip 16 and a flexible circuit board 17. Among them, the first support layer 14 is located between the display area and the composite film 13. The second support layer 15 is located between the spacer layer 12 and the binding area. The first support layer 14 and the second support layer 15 are used to provide support for the display module 10 and improve the strength of the display module 10. The driver chip 16 is located on the side of the second support layer 15 away from the spacer layer 12. The flexible circuit board 17 is located on the side of the second support layer 15 away from the spacer layer 12. The driver chip 16 converts the image data and signals (such as LVDS, MIPI, etc.) sent by the main control chip into drive signals (such as row and column scanning signals and grayscale voltage signals) suitable for the display panel 11. The flexible circuit board 17 (FPC) serves as a bridge for signal transmission, connects the driver chip 16 with the display module 10, and transmits the electrical signals of the mainboard or the driver chip 16 to the display panel 11.

[0060] Specifically, both the spacer layer 12 and the composite film 13 include a thermosetting material, the first thermosetting area 121 and the second thermosetting area 131 overlap based on the projection of the plane where the display area is located, and the first thermosetting area 121 does not overlap with the driver chip 16 and the flexible circuit board 17, and the second thermosetting area 131 does not overlap with the driver chip 16 and the flexible circuit board 17. Since thermosetting requires the heat pressing device to be as close to the first thermosetting area 121 and the second thermosetting area 131 as possible to improve the thermosetting effect, the above-mentioned non-overlapping setting can make the thermosetting device as close to the first thermosetting area 121 and the second thermosetting area 131 as possible, while avoiding the thermosetting device from thermosetting the driver chip 16 and the flexible circuit board 17, thereby improving the modulus of the spacer layer 12 and the composite film 13 in the binding area, and avoiding thermosetting damage to the driver chip 16 and the flexible circuit board 17 during the thermosetting process.

[0061] The display module 10 of the present invention adds a thermosetting material to the composite film 13 and / or the spacer layer 12 of the display module 10, and thermosetting the composite film 13 and / or the spacer layer 12 in the binding area, thereby forming a first thermosetting area 121 and a second thermosetting area 131, so as to increase the modulus of the composite film 13 and / or the spacer layer 12 in the binding area, reduce the pressure mark of the binding area of ​​the display module 10, and improve the front appearance of the display module 10.

[0062] On the other hand, Fig. 9 As shown, an embodiment of the present invention further provides a method for preparing a display module, comprising:

[0063] S110, providing a display panel 11; wherein the display panel 11 includes a display area, a binding area, and a bending area located between the display area and the binding area;

[0064] S120, preparing a spacer layer 12 in the binding area of ​​the display panel 11 and preparing a composite film 13 in the display area of ​​the display panel 11; wherein the spacer layer 12 and / or the composite film 13 include a thermosetting material;

[0065] S130, bending the display panel 11 along the bending area so that the display area and the binding area are arranged opposite to each other;

[0066] S140, thermally curing the first thermal curing zone 121 of the spacer layer 12 and / or the second thermal curing zone 131 of the composite film 13; wherein the first thermal curing zone 121 is based on the projection of the plane where the display area is located, and is covered by the projection of the binding zone based on the plane where the display area is located; and / or, the second thermal curing zone 131 is based on the projection of the plane where the display area is located, and is covered by the projection of the binding zone based on the plane where the display area is located.

[0067] It is worth noting that the above S110 to S140 are merely step numbers, which are used to facilitate reference and avoid text duplication. Unless otherwise specified, the above and subsequent step numbers will not limit the order of implementation of the various steps of the method. In other embodiments, the above steps of the method can also be written and implemented in an interchangeable order, and are not limited thereto.

[0068] Specifically, for the above step S120, the composite film 13 includes a copper film 132 and a silicone gel film 133, and the thermosetting material is distributed in the silicone gel film 133. The material of the spacer layer 12 is usually a prosthetic tape, and the thermosetting material is distributed in the prosthetic tape. The specific configuration can refer to the above-mentioned display module 10 embodiment, which will not be repeated here.

[0069] like Fig.10 As shown, for the above step S140, after the display module 10 is manufactured, the composite film 13 and the spacer layer 12 can be thermally cured from one side of the flexible circuit board 17 and the driver chip 16 by the hot pressing head 30, thereby forming a first thermal curing area 121 and a second thermal curing area 131. Performing thermal curing after the display module 10 is manufactured can simplify the manufacturing process of the display module 10 and reduce the manufacturing cost. Specifically, by locally heating the first thermal curing area 121 and the second thermal curing area 131 by the hot pressing head 30, the resin inside the spacer layer 12 and the composite film 13 reacts with the cross-linking agent, so that the first thermal curing area 121 and the second thermal curing area 131 are cured, the modulus is improved, the pressure mark of the binding area of ​​the display module 10 is reduced, and the front appearance of the display module 10 is improved.

[0070] Furthermore, the hot pressing area of ​​the hot pressing head 30 can be set to cover the entire binding area, so that the first hot curing area 121 and the second hot curing area 131 formed by hot curing completely overlap with the binding area, so as to maximize the modulus of the composite film 13 and / or the spacer layer 12 in the binding area, reduce the pressure mark of the binding area of ​​the display module 10, and improve the front appearance of the display module 10.

[0071] In some embodiments, the thermal curing temperature of the first thermal curing zone 121 and / or the second thermal curing zone 131 is 120-200° C., and the thermal curing pressure is 0.1-0.5 MPa. The above configuration can make the modulus of the first thermal curing zone 121 and / or the second thermal curing zone 131 reach 0.5-5 MPa after the thermal curing is completed, so as to reduce the pressure mark of the binding area of ​​the display module 10 and improve the front view of the display module 10.

[0072] In some embodiments, the thermosetting material includes a resin and a cross-linking agent, the resin includes a combination of one or more of epoxy resin, phenolic resin or polyimide, and the cross-linking agent includes a combination of one or two of amines or isocyanates. The specific configuration can refer to the embodiment of the display module 10 described above, which will not be repeated here.

[0073] In some embodiments, both the spacer layer 12 and the composite film 13 include a thermosetting material; the spacer layer 12, the first thermosetting area 121 and the second thermosetting area 131 overlap each other based on the projection of the plane where the display area is located. The specific configuration can refer to the embodiment of the display module 10 described above, and will not be repeated here.

[0074] like Fig.11 As shown, in some embodiments, after S110 and before S120, the method for preparing the display module further includes:

[0075] S150, prepare a second supporting layer 15 in the binding area of ​​the display panel 11 and prepare a first supporting layer 14 in the display area of ​​the display panel 11; wherein the second supporting layer 15 is located on the side of the spacer layer 12 away from the composite film 13, and the first supporting layer 14 is located between the display area of ​​the display panel 11 and the composite film 13. The first supporting layer 14 and the second supporting layer 15 are used to provide support for the display module 10 and improve the strength of the display module 10.

[0076] Continue to refer Fig.11 In some embodiments, after S130 and before S140, the method for preparing the display module further includes:

[0077] S160, prepare a driver chip 16 and a flexible circuit board 17 on the side of the second support layer 15 away from the spacer layer 12; wherein the spacer layer 12 and the composite film 13 both include a thermosetting material, the first thermosetting area 121 and the second thermosetting area 131 overlap based on the projection of the plane where the display area is located, and the first thermosetting area 121 does not overlap with the driver chip 16 and the flexible circuit board 17, and the second thermosetting area 131 does not overlap with the driver chip 16 and the flexible circuit board 17. Since thermosetting requires the thermosetting head 30 to be as close as possible to the first thermosetting area 121 and the second thermosetting area 131 to improve the thermosetting effect, the above-mentioned non-overlapping setting can make the thermosetting head 30 as close as possible to the first thermosetting area 121 and the second thermosetting area 131, while avoiding the thermosetting head 30 on the driver chip 16 and the flexible circuit board 17, thereby improving the modulus of the spacer layer 12 and the composite film 13 in the binding area, and avoiding thermosetting damage to the driver chip 16 and the flexible circuit board 17 during the thermosetting process.

[0078] The preparation method of the display module of the present invention adds a thermosetting material to the composite film 13 and / or the spacer layer 12 of the display module 10, and thermosetting the composite film 13 and / or the spacer layer 12 in the binding area, thereby forming a first thermosetting area 121 and a second thermosetting area 131, so as to increase the modulus of the composite film 13 and / or the spacer layer 12 in the binding area, reduce the pressure mark of the binding area of ​​the display module 10, and improve the front appearance of the display module 10.

[0079] On the other hand, Fig.12 As shown, the embodiment of the present invention further provides a display device 20, including the display module 10 provided by the embodiment of the present invention. The display device 20 can be: a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, or any other product or component with a display function.

[0080] The specific implementation and technical effects of the display device 20 of the present invention can refer to the specific embodiment of the display module 10 described above, and the repeated parts will not be repeated.

[0081] In summary, the display module, the method for preparing the display module, and the display device of the present invention add thermosetting material to the composite film and / or the spacer layer of the display module, and thermosetting the composite film and / or the spacer layer in the binding area, thereby forming a first thermosetting area and a second thermosetting area, so as to increase the modulus of the composite film and / or the spacer layer in the binding area, reduce the pressure mark of the binding area of ​​the display module, and improve the front appearance of the display module.

[0082] The above contents are further detailed descriptions of the present invention in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the scope of protection of the present invention.

Claims

1. A display module, characterized in that: include: The display panel comprises a display area, a binding area and a bending area between the display area and the binding area, wherein the display area and the binding area are arranged opposite to each other; A spacer layer, located between the display area and the binding area; A composite film, located between the display area and the spacer layer; The spacer layer includes a thermosetting material, and a first thermosetting area of ​​the spacer layer is covered by a projection of the binding area on the plane where the display area is located based on the projection of the binding area on the plane where the display area is located; and / or, The composite film includes a thermosetting material, and the second thermosetting area of ​​the composite film is based on a projection of the plane where the display area is located, and is covered by the projection of the binding area based on the plane where the display area is located.

2. The display module according to claim 1, characterized in that: The spacer layer and the composite film both include a thermosetting material; The spacer layer, the first heat curing area, and the second heat curing area overlap in pairs based on projections of the plane where the display area is located.

3. The display module according to claim 1, characterized in that: The thermosetting material includes a resin and a cross-linking agent, wherein the resin includes one or more of epoxy resin, phenolic resin or polyimide, and the cross-linking agent includes one or both of amines or isocyanates.

4. The display module according to claim 1, characterized in that: The modulus of the first heat curing zone and / or the second heat curing zone is 0.5-5 MPa.

5. The display module according to claim 1, characterized in that: The composite film comprises: a copper film and a silicone gel film, wherein the copper film is located between the silicone gel film and the spacer layer, and the heat curing material is distributed in the silicone gel film; The copper film has a thickness of 20 to 50 micrometers, and the silicone gel film has a thickness of 100 to 150 micrometers.

6. The display module according to claim 1, characterized in that: Also includes: A first supporting layer, located between the display area and the composite film; a second supporting layer, located between the spacer layer and the binding area; A driving chip is located on a side of the second supporting layer away from the spacer layer; A flexible circuit board is located on a side of the second supporting layer away from the spacer layer; Among them, the spacer layer and the composite film both include thermosetting materials, the first thermosetting zone and the second thermosetting zone overlap based on the projection of the plane where the display area is located, and the first thermosetting zone does not overlap with the driver chip and the flexible circuit board, and the second thermosetting zone does not overlap with the driver chip and the flexible circuit board.

7. A method for preparing a display module, characterized in that: include: A display panel is provided; wherein the display panel comprises a display area, a binding area, and a bending area located between the display area and the binding area; A spacer layer is prepared in the binding area of ​​the display panel and a composite film is prepared in the display area of ​​the display panel; wherein the spacer layer and / or the composite film include a thermosetting material; Bending the display panel along the bending area so that the display area and the binding area are arranged opposite to each other; The first heat curing zone of the spacer layer and / or the second heat curing zone of the composite film are heat cured; wherein the first heat curing zone is based on the projection of the plane where the display area is located, and is covered by the projection of the binding zone based on the plane where the display area is located; and / or the second heat curing zone is based on the projection of the plane where the display area is located, and is covered by the projection of the binding zone based on the plane where the display area is located.

8. The method for preparing a display module according to claim 7, characterized in that: The thermal curing temperature of the first thermal curing zone and / or the second thermal curing zone is 120-200° C., and the thermal curing pressure is 0.1-0.5 MPa.

9. The method for preparing a display module according to claim 7, characterized in that: The thermosetting material includes a resin and a cross-linking agent, wherein the resin includes one or more of epoxy resin, phenolic resin or polyimide, and the cross-linking agent includes one or both of amines or isocyanates.

10. The method for preparing a display module according to claim 7, characterized in that: The spacer layer and the composite film both include a thermosetting material; The spacer layer, the first heat curing area, and the second heat curing area overlap in pairs based on projections of the plane where the display area is located.

11. The method for preparing a display module according to claim 7, characterized in that: After providing a display panel, before preparing a spacer layer in the binding area of ​​the display panel and preparing a composite film in the display area of ​​the display panel, the method further includes: A second supporting layer is prepared in the binding area of ​​the display panel and a first supporting layer is prepared in the display area of ​​the display panel; wherein the second supporting layer is located on the side of the spacer layer away from the composite film, and the first supporting layer is located between the display area of ​​the display panel and the composite film; After the display panel is bent along the bending area so that the display area and the binding area are arranged opposite to each other, and before the first heat curing area of ​​the spacer layer and / or the second heat curing area of ​​the composite film is heat cured, the method further comprises: A driving chip and a flexible circuit board are prepared on the side of the second supporting layer away from the spacer layer; wherein the spacer layer and the composite film both include thermosetting materials, the first thermosetting area and the second thermosetting area overlap based on the projection of the plane where the display area is located, and the first thermosetting area does not overlap with the driving chip and the flexible circuit board, and the second thermosetting area does not overlap with the driving chip and the flexible circuit board.

12. A display device, characterized in that: Comprising a display module according to any one of claims 1 or 6.

Images