Wafer protection device

Abstract

The wafer protection device comprises a first bearing plate, a second bearing plate and a gas pipeline, the first bearing plate is a concave plate with a low center and a high edge, the center is provided with a first through hole, and the edge bears a wafer; the second bearing plate is arranged on the side, facing the wafer, of the first bearing plate, is opposite to the first through hole and is larger than the first through hole in size, the height from the second bearing plate to the first through hole is not larger than the height from the edge of the first bearing plate to the first through hole, and a diffusion channel is formed between the second bearing plate and the first bearing plate; the edge of the second bearing plate and the edge of the first bearing plate form an annular purging opening; the gas pipeline penetrates through the first through hole to be arranged below the second bearing plate, the end face of one end of the gas pipeline supports the second bearing plate, and a plurality of first gas outlets are formed in the periphery of the side wall of one end of the gas pipeline and located between the first through hole and the second bearing plate to communicate with the diffusion channel. The wafer protection device can purge the back surface and the edge of the wafer so as to protect the wafer.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a wafer protection device. Background Art

[0002] In the process of making chips from wafers, they need to go through multiple processing steps. Some processes only need to process the front side of the wafer. How to protect the back side of the wafer and prevent it from being affected by the processing steps has become an urgent problem to be solved. Summary of the invention

[0003] An embodiment of the present application provides a wafer protection device, which can protect the back side of the wafer at least to a certain extent.

[0004] The present application provides a wafer protection device, including a first carrier plate, which is a concave plate with a low center and a high edge, a first through hole is opened in the center of the first carrier plate, and the edge of the first carrier plate is used to carry the wafer; a second carrier plate is arranged on the side of the first carrier plate facing the wafer, is arranged opposite to the first through hole and has an area larger than the area of ​​the first through hole, the height of the second carrier plate from the first through hole is not greater than the height of the edge of the first carrier plate from the first through hole, a diffusion channel is formed between the second carrier plate and the first carrier plate, and an annular purge port connected to the diffusion channel is formed between the edge of the second carrier plate and the edge of the first carrier plate; a gas pipeline passes through the first through hole and is arranged below the second carrier plate, the end face of one end of the gas pipeline supports the second carrier plate, and a plurality of first air outlet holes are opened around the side wall of one end of the gas pipeline, and the plurality of first air outlet holes are located between the first through hole and the second carrier plate and connected to the diffusion channel.

[0005] Specifically, a blocking portion is protruding from the first supporting plate, and the blocking portion and the plurality of first air outlet holes are arranged opposite to each other in the radial direction of the first supporting plate.

[0006] Specifically, the second supporting plate includes: a second annular inclined surface, which is arranged at the edge of the second supporting plate facing away from the wafer; and a second annular plane, which is arranged between the side wall of one end of the gas pipeline and the second annular inclined surface.

[0007] Specifically, the height of the second supporting plate from the first through hole is less than the height of the edge of the first supporting plate from the first through hole; a second air outlet is provided on the second supporting plate, and the second air outlet is connected to one end of the gas pipeline.

[0008] Specifically, the height of the second carrier plate from the first through hole is equal to the height of the edge of the first carrier plate from the first through hole, and the edge of the first carrier plate and the second carrier plate are used together to carry the wafer.

[0009] Specifically, the wafer protection device also includes a carrying plate and a base, the first carrying plate is connected to the carrying plate to form a carrying platform, the carrying plate has a second through hole, the carrying platform is arranged on the base, and the gas pipeline includes: a purge pipeline connected to the second carrying plate, the side wall of the purge pipeline has the multiple first air outlet holes; a gas sealing tube, one end of the gas sealing tube is connected to the purge pipeline, and extends from the outside of the purge pipeline to the first carrying plate to connect to the first through hole, and the other end of the gas sealing tube passes through the carrying platform through the second through hole; a purge gas inlet pipeline is arranged in the base and connected to the other end of the gas sealing tube.

[0010] Specifically, the cross-section of the purge gas inlet pipe is a polygon, and the purge gas inlet pipe runs through the base. The device also includes: a bottom support, which is arranged at the end of the base away from the supporting platform and has a support hole for plugging in the purge gas inlet pipe, and the shape of the support hole is a polygon that is adapted to the cross-section of the purge gas inlet pipe.

[0011] Specifically, the wafer protection device also includes a carrying base plate, a base and a rotating shaft. The first carrying plate is connected to the carrying base plate to form a carrying platform. The carrying platform is connected to the base through the rotating shaft. The device also includes: an accommodating channel, which is arranged in the base and is used to accommodate the rotating shaft and a bearing assembly connected to the rotating shaft; an annular channel, which is arranged around the accommodating channel and is connected to the top of the bearing assembly; and a protective gas inlet channel, which is arranged in the base and is connected to the annular channel.

[0012] Specifically, the annular channel is connected to a position in the accommodating channel above the bearing assembly through a plurality of first air holes, and the plurality of first air holes are evenly distributed on the inner wall of the accommodating channel along the circumferential direction.

[0013] Specifically, the end of the base close to the supporting platform is the base supporting end, and the annular channel connects the base supporting end and the supporting platform through a plurality of second air holes. The plurality of second air holes are arranged on the end surface of the base supporting end around the accommodating channel and are evenly distributed corresponding to the edge of the supporting platform.

[0014] The wafer protection device of the present application, since the first carrier plate is a concave plate, and the height of the second carrier plate from the first through hole is not greater than the height of the edge of the first carrier plate from the first through hole, the multiple purge gas flow beams from the multiple first air outlets can be blocked by the diffusion channel formed between the second carrier plate and the first carrier plate, and are mixed in the diffusion channel after changing direction, and then diffused from the diffusion channel to the annular purge port and blown out, so as to evenly purge the back and edge of the wafer to protect the wafer.

[0015] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0016] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present application, and together with the specification, are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0018] Figure 1 A schematic cross-sectional structure diagram of a wafer protection device according to an embodiment of the present application is shown;

[0019] Figure 2 A schematic diagram of the structure of a carrier platform according to an embodiment of the present application is shown;

[0020] Figure 3 A schematic diagram of the structure of the second bearing plate supported by the purge pipeline according to an embodiment of the present application is shown;

[0021] Figure 4 A partial structural schematic diagram of a wafer protection device according to an embodiment of the present application is shown;

[0022] Figure 5 A partial structural schematic diagram of a wafer protection device according to an embodiment of the present application is shown;

[0023] Figure 6 Shown Figure 1 Schematic diagram of the wafer protection device when viewed from above in the main cross-sectional view

[0024] Figure 7 A schematic cross-sectional structure diagram of a wafer protection device according to an embodiment of the present application is shown.

[0025] in,

[0026] 100, base, 110, annular channel, 111, first air hole, 112, second air hole, 120, protective gas inlet channel, 130, mounting base plate, 140, bottom support, 141, support plate;

[0027] 200, a carrier platform, 210, a first carrier plate, 211, a first annular inclined surface, 212, a blocking portion, 213, a first annular plane, 214, a first through hole, 220, a second carrier plate, 221, a second annular inclined surface, 222, a second annular plane, 223, a second air outlet, 230, a carrier bottom plate, 240, an annular purge port, 250, a diffusion channel;

[0028] 300, gas pipeline, 310, purge pipeline, 311, first gas outlet, 320, gas sealing tube, 330, purge gas inlet pipeline, 331, inner wall protrusion;

[0029] 400, rotating shaft, 500, bearing assembly, 510, bearing sleeve, 520, bearing, 530, bearing retaining ring, 540, sleeve seat, 550, bearing end cover, 560, bearing positioning member;

[0030] 600, leakage cover, 610, leakage chamber. DETAILED DESCRIPTION

[0031] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

[0032] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided so as to provide a full understanding of the embodiments of the present application. However, it will be appreciated by those skilled in the art that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, known methods, devices, realizations or operations are not shown or described in detail to avoid blurring the various aspects of the present application.

[0033] Please refer to Figures 1 to 6 , this embodiment provides a wafer protection device for blowing the back side and edge of the wafer.

[0034] Embodiment 1:

[0035] like Figure 1 and Figure 2 As shown, the wafer protection device includes a first carrier plate 210 and a second carrier plate 220. The first carrier plate 210 is a concave plate with a lower middle and a higher edge. The wafer is placed on the first carrier plate 210 and supported by the edge of the first carrier plate 210. A purge space is left between the wafer and the first carrier plate 210. The second carrier plate 220 is located in the purge space. Figure 3, a first through hole 214 is opened at the center of the first carrier plate 210, the second carrier plate 220 is located above the first through hole 214, and the height of the second carrier plate 220 from the first through hole 214 is less than the height of the edge of the first carrier plate 210 from the first through hole 214, the area of ​​the second carrier plate 220 is less than the area of ​​the first carrier plate 210 and greater than the area of ​​the first through hole 214, and there is a distance between the edge of the second carrier plate 220 and the first carrier plate 210 in the vertical direction. Therefore, an annular gap is formed between the second carrier plate 220 and the first carrier plate 210 as a diffusion channel 250, refer to Figure 4 , an annular purge port 240 connected to the diffusion channel 250 is formed between the edge of the second carrier plate 220 and the edge of the first carrier plate 210, and the purge gas blown out from the annular purge port 240 can purge the back side and edge of the wafer above the second carrier plate 220 to prevent the processing material from contaminating the back side and edge of the wafer during the wafer front processing. The purge gas can be nitrogen or other inert gases. For example, the chemical solution in the etching process can be prevented from corroding the back side and edge of the wafer, and the formation of a rough surface structure on the back side and edge of the wafer to affect the further etching of the wafer can be avoided, thereby improving the yield rate of semiconductor device products. The first carrier plate 210 in the form of a concave plate can guide the gas blown out of the annular purge port 240 so that the purge gas can better reach the back side of the wafer. The concave plate can also increase the vertical distance between the back side of the wafer and the first carrier plate 210, so that the purge gas can better diffuse to the edge of the wafer.

[0036] The annular purge port 240 may be a circular ring concentric with the wafer, which can make the purge gas diffuse evenly from the center of the back side of the wafer to the edge of the wafer, and while purging and protecting the back side of the wafer, it can also prevent the purge gas from affecting the horizontal placement of the wafer. In other implementations of this embodiment, the size of the second carrier plate 220 can be set smaller than the wafer size, so that the annular purge port 240 can be close to the edge of the wafer, so that the purge gas can better purge the edge of the wafer. The set size can be determined according to the wafer size, for example, it can be no more than 1 / 2 of the wafer size.

[0037] Continue to refer to Figure 1The wafer protection device also includes a gas pipeline 300, one end of the gas pipeline 300 passes through the first through hole 214 and is connected to the second carrier plate 220, the end surface supports the second carrier plate 220 and the end surface is closed by the second carrier plate 220, and the other end of the gas pipeline 300 is connected to the gas supply device (not shown). A plurality of first air outlet holes 311 are opened around the side wall of the aforementioned one end of the gas pipeline 300, and the first air outlet holes 311 are located between the first through hole 214 and the second supporting plate 220. The vertical distance between the second supporting plate 220 and the first through hole 214 is smaller than the vertical distance between the edge of the first supporting plate 210 and the first through hole 214, and the first supporting plate 210 is a concave plate. Therefore, the plurality of purge gas flow beams from the plurality of first air outlet holes 311 can be blocked and changed in direction by the diffusion channel 250 between the first supporting plate 210 and the second supporting plate 220, so as to be evenly mixed in the diffusion channel 250 and then blow the back side of the wafer through the annular purge port 240, so that the purge gas can evenly blow the wafer.

[0038] The first gas outlet hole 311 may be a long hole, and the long hole may be extended along the axial direction of the gas pipeline 300, so that when the diameter of the gas pipeline is constant, the area of ​​the first gas outlet hole 311 is increased as much as possible to blow out more purge gas.

[0039] Reference Figure 4 In a specific embodiment, the edge of the first carrier plate 210 is a first annular plane 213 with a certain width, and the width range of the first annular plane 213 is sufficient to stably carry the wafer, so that the back area of ​​the wafer purged by the purge gas is as large as possible. The first through hole 214 is connected to the first annular plane 213 by the first annular slope 211, that is, the concave plate is composed of the first annular plane 213 and the first annular slope 211, and a diffusion channel 250 is formed between the first annular slope 211 and the second carrier plate 220. The first gas outlet 311 is higher than the first through hole 214 and lower than the second carrier plate 220. After the multiple purge gas flow beams from the first gas outlet 311 are evenly mixed in the diffusion channel 250, they purge the back of the wafer through the annular purge port 240. In order to make the purge gas come out of the annular purge port 240 more uniformly, a circle of blocking portions 212 are also protruded on the first annular inclined surface 211 at a position radially opposite to the first gas outlet 311 of the first carrier plate 210 to block the purge gas from the first gas outlet 311 and change the purge direction of the purge gas so that the purge gas diffuses more uniformly in the diffusion channel 250. The blocking portion 212 can be a structure such as a boss or a convex plate that can block the purge gas from the first gas outlet 311. In other implementations of the embodiments of the present application, the first through hole 214 and the first annular plane 213 can be connected by an annular arc surface.

[0040] The second supporting plate 220 has a second annular slope 221 on its edge facing away from the wafer. The second annular slope 221 guides the purge gas to the edge of the second supporting plate 220 so that the purge gas can reach the annular purge port 240 better. Figure 5 As shown, a second annular plane 222 is further provided between the second annular slope 221 and the other end side wall of the gas pipeline 300 , so that the purge gas blown out of the gas pipeline 300 is swept outward along the second annular plane 222 , so that more purge gas reaches the first annular slope 211 .

[0041] Continue to refer to Figure 3 The gas pipeline 300 may include a purge pipeline 310, a gas sealing pipe 320 connected to the purge pipeline 310, and a purge gas inlet pipeline 330 connected to the gas sealing pipe 320. For example, the purge pipeline 310 is connected to the second supporting plate 220, and the first gas outlet 311 is set on the side wall of the purge pipeline 310. In this embodiment, the gas pipeline 300 is divided into three parts for easy processing. Back Figure 1 As shown, the first carrier plate 210 can be fixed on the carrier bottom plate 230 to form the carrier platform 200, the carrier platform 200 is connected to the base 100, and the carrier bottom plate 230 is provided with a second through hole. The purge pipe 310 and the gas sealing pipe 320 can be arranged in the carrier platform 200, one end of the gas sealing pipe 320 is connected to the purge pipe 310, and extends upward from the outside of the purge pipe 310 to connect to the first through hole 214, and the other end of the gas sealing pipe 320 passes through the second through hole out of the carrier platform 200 to connect to the purge gas intake pipe 330, and the purge gas intake pipe 330 is arranged in the base 100, so as to facilitate the separation of the carrier platform 200 and the base 100.

[0042] The inner wall of one end of the gas sealing tube 320 connected to the purge pipe 310 can be thinned to accommodate the purge pipe 310, and the junction of the thinned inner wall and the unthinned inner wall can also form a purge pipe limiting step to limit the position of the purge pipe 310. The thinned inner wall can also extend upward from the outside of the purge pipe 310 to the first supporting plate 210 and connect to the first through hole 214. For example, the gas sealing tube 320 is integrally arranged with the first supporting plate 210, so that the purge gas leaked at the connection between the purge pipe 310 and the gas sealing tube 320 can flow along the gas sealing tube 320 to the diffusion channel 250.

[0043] The outer wall of the other end of the gas sealing tube 320 connected to the purge gas inlet pipe 330 can be thinned so as to be inserted into the purge gas inlet pipe 330. An inner wall protrusion 331 can be provided on the inner wall of the purge gas inlet pipe 330 connected to one end of the gas sealing tube 320. The inner wall protrusion 331 can leave a gap between the purge gas inlet pipe 330 and the gas sealing tube 320 to allow for tooling errors. At the same time, the inner wall protrusion 331 can also block the gap between the purge gas inlet pipe 330 and the gas sealing tube 320 to prevent the gas from passing between the purge gas inlet pipe 330 and the gas sealing tube 320. The inner wall protrusion 331 can be a plurality of annular protrusions with the pipe axis as the symmetric center to increase the positioning accuracy of the gas sealing tube 320. The inner wall of the purge gas inlet pipe 330 may also be provided with a gas sealing tube limiting step to limit the position of the gas sealing tube 320 in the purge gas inlet pipe 330, and the gas sealing tube limiting step may also cover the gap at the connection between the gas sealing tube 320 and the purge gas inlet pipe 330, so that the gas from the purge gas inlet pipe 330 can better enter the gas sealing tube 320.

[0044] Refer again Figure 2 , a second air outlet 223 connected to the purge pipe 310 can also be provided on the second carrier plate 220, and the second air outlet 223 can purge to the position on the back of the wafer corresponding to the second carrier plate 220, and the annular purge port 240 and the second air outlet 223 are arranged in coordination to ensure that the entire back of the wafer can be completely purged. At the same time, the center of the second air outlet 223 can coincide with the center of the annular purge port 240, further avoiding the purge gas from affecting the horizontal placement of the wafer. The second air outlet 223 can be a circular hole, a square hole or other shape arranged at the center of the annular purge port 240 to purge the position of the wafer corresponding to the annular purge port 240 ring. For example, the second air outlet 223 can be a long strip hole, and the long strip hole can make the long side of the long strip hole farther away from the annular purge port 240, so as to ensure that the annular purge port 240 has a larger blowing area while avoiding interference as much as possible. The second air outlet 223 can be connected to the end of the purge pipe 310, and the end of the purge pipe 310 can be connected to multiple first air outlets 311 inside the purge pipe 310. At the same time, the area of ​​the second air outlet 223 is less than or equal to the area of ​​the first air outlet 311 to limit the amount of purge gas blown out by the second air outlet 223, so that the purge gas can be better blown out from the first air outlet 311.

[0045] The surface of the second carrier plate 220 facing the wafer may be a concave surface to increase the gap between the second carrier plate 220 and the back of the wafer, so that the gas blown out of the second gas outlet 223 can purge the position of the back of the wafer corresponding to the second carrier plate 220, and the gas blown out of the second gas outlet 223 can be better diffused to the edge of the second carrier plate 220. The second gas outlet 223 can be arranged concentrically with the wafer, so that the purge gas can evenly purge the position of the back of the wafer corresponding to the second carrier plate 220.

[0046] Continue to refer to Figure 1 The support platform 200 is connected to one end of the rotating shaft 400, such as Figure 1 As shown, the rotating shaft 400 is connected to the base 100 through the bearing assembly 500. The driving mode of the rotating shaft 400 can be motor drive, magnetic fluid drive or gear drive. For example, the rotating shaft 400 can be driven to rotate by a synchronous pulley, and the synchronous pulley can be connected to the end of the rotating shaft 400 away from the carrier 200, and the end of the rotating shaft 400 away from the carrier 200 can be inserted into the inner wheel of the synchronous pulley, and the inner wheel is connected to the rotating shaft 400, so that the outer wheel of the synchronous pulley drives the inner wheel, thereby driving the rotating shaft 400 to rotate. The inner wheel and the rotating shaft 400 can be connected by screw connection or clamping.

[0047] The rotating shaft 400 can be sleeved outside the purge gas inlet pipe 330. The rotating shaft 400 is a hollow structure to accommodate the purge gas inlet pipe 330. The purge gas inlet pipe 330 can rotate relative to the rotating shaft 400 so that the rotation of the rotating shaft 400 will not interfere with the purge gas transmission.

[0048] The bearing assembly 500 may include a bearing sleeve 510 and a bearing 520 disposed in the bearing sleeve 510. The inner ring of the bearing 520 is connected to the rotating shaft 400, and the outer ring of the bearing 520 is connected to the bearing sleeve 510, so that the rotating shaft 400 rotates relative to the bearing sleeve 510. The bearing sleeve 510 may be tubular, and there may be two bearings 520, which are respectively disposed at both ends of the bearing sleeve 510. The two bearings 520 may be connected by a tubular bearing retaining ring 530, so that the rotating shaft 400 can rotate smoothly. The bearing assembly 500 may also include a sleeve seat 540, which is disposed at one end of the bearing sleeve of the bearing sleeve 510 away from the bearing platform 200. The bearing sleeve 510 may be connected to the base 100 through the sleeve seat 540. A bearing end cover 550 may be disposed at the other end of the bearing sleeve close to the bearing platform 200. The bearing end cover 550 extends from the bearing sleeve 510 into the sleeve to the rotating shaft 400 to cover the gap at the other end of the bearing sleeve, thereby protecting the bearing 520 at the other end of the bearing sleeve.

[0049] The bearing assembly 500 may further include a bearing positioning member 560, which is movably disposed outside the rotating shaft 400 and connected to the bearing 520. The bearing positioning member 560 can drive the rotating shaft 400 to move, thereby adjusting the concentricity of the rotating shaft 400 and the bearing 520. The bearing positioning member 560 may be a nut or a clamping member that is detachably wrapped around the bearing 520, and can enable the rotating shaft 400 to have better concentricity when rotating around the axis.

[0050] Outside the connection between the support platform 200 and the base 100, a leakage cover 600 can also be set and fixed on the base 100. A leakage cavity 610 is set in the leakage cover 600 to connect the connection between the support platform 200 and the base 100 to collect substances leaked from the connection between the support platform 200 and the base 100.

[0051] The base 100 may be a table-like structure with a receiving channel, and the table-like structure has opposite bearing ends ( Figure 1 Upper middle end) and fixed end ( Figure 1 The first support plate 210 and the support bottom plate 230 are arranged at the support end of the support structure, and the rotating shaft 400 passes through the support channel to connect the driving device of the rotating shaft 400. The rotating shaft 400 and the inner wall of the support channel can be connected by a bearing assembly 500 so that the rotating shaft 400 can rotate in the support channel. In other implementations of this embodiment, the base 100 can be columnar or in other shapes, so as to connect the support platform 200 to other devices, or the base 100 can be fixed on the ground.

[0052] The wafer protection device may also include an annular channel 110, which is connected to the accommodating channel, corresponding to the position between the bearing assembly 500 and the bearing end, and is arranged around the accommodating channel. The annular channel 110 is also connected to the protective gas inlet channel 120 to pass the protective gas. The annular channel 110 may be an annular channel 110 arranged around the accommodating channel in the base 100, and the annular channel 110 and the accommodating channel may be directly connected, or the annular channel 110 and the accommodating channel may be connected through a plurality of first air holes 111. The first air holes 111 extend along the radial direction of the base 100. The first air holes 111 may be uniformly distributed on the inner wall of the accommodating channel along the circumferential direction, and located above the bearing assembly 500, so that the first air holes 111 are evenly blown into the accommodating channel. The accommodating channel may be a cylindrical channel, and the annular channel 110 may be coaxial with the cylindrical channel to further achieve uniform blowing. The protective gas inlet channel 120 blows air into the accommodating channel through the annular channel 110 to form an airflow blocking surface above the bearing assembly 500 to prevent the fluid from the carrier 200 from splashing or leaking onto the bearing assembly 500, thereby protecting the bearing assembly 500. The cross-section of the annular channel 110 can be larger than the cross-section of the pores, and is used to store the protective gas so that the flow rate of the protective gas remains stable. The protective gas can be nitrogen or other inert gases. The protective gas inlet channel 120 can be arranged in the base 100 and connected to the protective gas inlet pipe through the fixed end of the base 100. In other implementations of the embodiments of the present application, the protective gas inlet channel 120 can also be partially arranged outside the base 100.

[0053] The wafer protection device may further include a mounting base plate 130 , on which the base 100 and the wafer substrate 100 may be mounted, and the mounting base plate 130 may support and fix the base 100 and the wafer substrate 100 .

[0054] The wafer protection device may further include a bottom support 140, which is fixed to the surface of the mounting base plate 130 facing away from the base 100, and is used to fix the rotating shaft 400 and the purge gas inlet pipe 330. A mounting hole may be provided on the mounting base plate 130, and the rotating shaft 400 and the purge gas inlet pipe 330 in the rotating shaft 400 may pass through the base 100 and the mounting hole on the mounting base plate 130 to connect the bottom support 140, so that the bottom support 140 fixes the rotating shaft 400 and the purge gas inlet pipe 330. The bottom support 140 may be in the shape of a tubular support or a table-mounted support, one end of the bottom support is connected to the surface of the mounting base plate 130 facing away from the base 100, and the other end of the bottom support includes a support plate 141, which is used to support the rotating shaft 400 and the purge gas inlet pipe 330, to ensure that the purge gas inlet pipe 330 has good coaxiality with the rotating shaft 400, thereby reducing friction generated during high-speed rotation. Reference Figure 6A support hole may be provided on the support plate 141, and the purge gas intake duct 330 may be connected to the outside for intake through the support hole. The shape of the support hole may be adapted to the cross section of the purge gas intake duct 330. The purge gas intake duct 330 may be a polygonal prism such as a triangular prism, and the corresponding edges and corners may be rounded. The cross section of the purge gas intake duct 330 may be a polygon such as a hexagon, so as to increase the contact surface and improve the orientation accuracy of its axis. When the rotating shaft 400 is driven by a synchronous pulley, the synchronous pulley may be fixed in the bottom support 140 and may be arranged on the support plate 141.

[0055] Embodiment 2:

[0056] The difference between this embodiment and the first embodiment is that:

[0057] The height between the second carrier plate 220 and the first through hole 214 is the same as the height between the edge of the first carrier plate 210 and the first through hole 214. At this time, the wafer is supported by the first carrier plate 210 and the second carrier plate 220, so that the wafer is placed more stably.

[0058] In this embodiment, the second supporting plate 220 is not provided with the second air outlet 223 .

[0059] The remaining features are the same as those of the first embodiment.

[0060] Embodiment three:

[0061] The difference between this embodiment and the first embodiment is that:

[0062] The annular channel 110 is connected to the bearing end of the base 100 and the bearing platform 200, and the connection mode can be direct connection or connection through the second air hole 112. Figure 7 As shown, the second air holes 112 can be distributed on the end surface of the bearing end of the base 100, facing the surface of the bearing bottom plate away from the wafer, and multiple second air holes 112 can be evenly arranged around the accommodating channel to isolate the substances entering the accommodating channel from the edge of the bearing platform. Further, the second air holes 112 can be arranged close to the edge of the bearing platform, that is, the hole wall of the second air hole 112 extends from the annular channel 110 to the edge of the bearing platform, so that the second air holes 112 can more accurately block the substances at the edge of the bearing platform. The substances blocked by the second air holes 112 can be stored in the leakage chamber 610 of the leakage cover 600.

[0063] The remaining features are the same as those of the first embodiment.

[0064] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the embodiments disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary technical means in the art that are not disclosed in the present application.

[0065] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A wafer protection device, characterized in that: include: The first carrier plate is a concave plate with a lower center and a higher edge, wherein a first through hole is provided in the center of the first carrier plate, and the edge of the first carrier plate is used for carrying wafers; A second carrier plate is arranged on a side of the first carrier plate facing the wafer, is arranged opposite to the first through hole and has an area larger than that of the first through hole, a height of the second carrier plate from the first through hole is not greater than a height of the edge of the first carrier plate from the first through hole, a diffusion channel is formed between the second carrier plate and the first carrier plate, and an annular purge port connected to the diffusion channel is formed between the edge of the second carrier plate and the edge of the first carrier plate; A gas pipeline passes through the first through hole and is arranged under the second supporting plate. The end face of one end of the gas pipeline supports the second supporting plate. A plurality of first air outlet holes are arranged around the side wall of one end of the gas pipeline. The plurality of first air outlet holes are located between the first through hole and the second supporting plate and connected to the diffusion channel.

2. The wafer protection device according to claim 1, characterized in that: A blocking portion is protruding from the first supporting plate, and the blocking portion and the plurality of first air outlet holes are arranged opposite to each other in the radial direction of the first supporting plate.

3. The wafer protection device according to claim 1, characterized in that: The second supporting plate comprises: A second annular inclined surface is arranged at an edge of a surface of the second supporting plate facing away from the wafer; The second annular plane is arranged between the side wall at one end of the gas pipeline and the second annular inclined surface.

4. The wafer protection device according to claim 1, characterized in that: A height between the second supporting plate and the first through hole is smaller than a height between an edge of the first supporting plate and the first through hole; The second supporting plate is provided with a second air outlet, and the second air outlet is connected to one end of the gas pipeline.

5. The wafer protection device according to claim 1, characterized in that: The height of the second carrier plate from the first through hole is equal to the height of the edge of the first carrier plate from the first through hole, and the edge of the first carrier plate and the second carrier plate are used together to carry the wafer.

6. The wafer protection device according to claim 1, characterized in that: It also includes a bearing bottom plate and a base, wherein the first bearing plate is connected to the bearing bottom plate to form a bearing platform, the bearing bottom plate is provided with a second through hole, the bearing platform is arranged on the base, and the gas pipeline includes: A purge pipe connected to the second carrier plate, wherein a side wall of the purge pipe is provided with the plurality of first air outlet holes; A gas sealing tube, one end of which is connected to the purge pipe and extends from the outside of the purge pipe to the first supporting plate to connect to the first through hole, and the other end of the gas sealing tube passes through the second through hole and out of the supporting platform; The purge gas inlet pipeline is arranged in the base and connected to the other end of the gas sealing tube.

7. The wafer protection device according to claim 6, characterized in that: The cross section of the purge gas inlet pipe is polygonal, and the purge gas inlet pipe runs through the base. The device also includes: The bottom support is arranged at one end of the base away from the supporting platform and has a support hole for plugging the purge gas inlet pipe. The shape of the support hole is a polygon that fits the cross-section of the purge gas inlet pipe.

8. The wafer protection device according to claim 1, characterized in that: The device also includes a bearing bottom plate, a base and a rotating shaft, wherein the first bearing plate is connected to the bearing bottom plate to form a bearing platform, and the bearing platform is connected to the base via the rotating shaft, and the device also includes: An accommodating channel, disposed in the base, for accommodating the rotating shaft and a bearing assembly connected to the rotating shaft; An annular channel, arranged around the accommodating channel and connected to the top of the bearing assembly; A protective gas inlet channel is arranged in the base and connected to the annular channel.

9. The wafer protection device according to claim 8, characterized in that: The annular channel is connected to a position in the accommodating channel above the bearing assembly through a plurality of first air holes, and the plurality of first air holes are evenly distributed on the inner wall of the accommodating channel along the circumferential direction.

10. The wafer protection device according to claim 8, characterized in that: The end of the base close to the bearing platform is the base bearing end. The annular channel is connected to the base bearing end and the bearing platform through a plurality of second air holes, and the plurality of second air holes are arranged on the end surface of the base bearing end, surrounding the accommodating channel and evenly distributed corresponding to the edge of the bearing platform.

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