Method for replacing blue film of die bonder, readable storage medium, computer device and system

Abstract

The present invention discloses a method for replacing a blue film of a die bonder, a readable storage medium, a computer device and a system, which relates to the field of Mini LED display manufacturing. The method includes: driving a magazine to retract the next blue film in the waiting station back to the working layer; driving a manipulator to transfer the current blue film on the wafer table to a transfer platform and regard the current blue film as an invalid blue film; driving the magazine to push out a spare blue film in the spare layer to the waiting station and regard the spare blue film as the new current blue film; driving the manipulator to transfer the new current blue film in the waiting station to the wafer table and pick up chips from the new current blue film to continue the current die bonding process; driving the manipulator to transfer the invalid blue film on the transfer platform to the waiting station; driving the magazine to retract the invalid blue film in the waiting station back to the spare layer. By adopting the present invention, the blue film can be replaced at any time, the equipment will not stop, the equipment efficiency is improved, and the labor cost is saved.

Description

Technical Field

[0001] The present invention relates to the field of Mini LED display manufacturing, and particularly to a method for replacing the blue film of a die bonder, a readable storage medium, a computer device, and a system. Background Art

[0002] In the production process of Mini LED displays, it is a relatively common working step to take a wafer from a wafer blue film and place it on a wafer carrier to complete the operations of die picking and die bonding.

[0003] In the prior art, when the wafers on a wafer blue film are all picked, the equipment usually needs to be stopped and an alarm is issued to prompt the operator to switch to a new wafer blue film; when switching to a new wafer blue film, the operator needs to first take an unfinished blue film, then open the equipment door, remove the produced blue film, and then put in the unproduced blue film. Next, press the machine start button to make the equipment start production again, that is, the equipment can only continue production after the operator replaces the blue film.

[0004] However, each time the blue film is replaced, it takes about 30 seconds, and the manual processing time is about 60 seconds, that is, it takes about 90 seconds on average to replace a blue film. Therefore, the prior art requires the operator to always pay attention to the die picking progress, and the die picking and die bonding operations cannot be continuous, resulting in low production efficiency. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a method for replacing the blue film of a die bonder, a readable storage medium, a computer device, and a system, which can replace the blue film at any time, the equipment will not stop, the equipment efficiency is improved, and the labor cost is saved.

[0006] To solve the above technical problem, the present invention provides a method for replacing the blue film of a die bonder. When all the die chips on the current blue film on the wafer table have been picked and the current die bonding process has not ended, the method for replacing the blue film of the die bonder includes: driving the cassette to retract the next blue film in the waiting station to the working layer; driving the manipulator to transfer the current blue film on the wafer table to the transfer platform and regard the current blue film as an invalid blue film; driving the cassette to push out the spare blue film in the spare layer to the waiting station and regard the spare blue film as the new current blue film; driving the manipulator to transfer the new current blue film in the waiting station to the wafer table and pick die chips from the new current blue film to continue the current die bonding process; driving the manipulator to transfer the invalid blue film on the transfer platform to the waiting station; driving the cassette to retract the invalid blue film in the waiting station to the spare layer.

[0007] As an improvement to the above solution, the method for changing the blue film of the die bonder further includes: after completing the current die bonding process, driving the manipulator to transfer the new current blue film to the transfer platform; driving the cassette to push the next blue film in the working layer to the waiting station; driving the manipulator to transfer the next blue film in the waiting station to the wafer workbench and execute the next die bonding process.

[0008] As an improvement to the above solution, the method for changing the blue film of the die bonder further includes: driving the manipulator to transfer the current blue film on the transfer platform to the waiting station; driving the cassette to retract the current blue film in the waiting station back into the working layer.

[0009] As an improvement to the above solution, the method for changing the blue film of the die bonder further includes: generating a blue film replacement signal when the invalid blue film is retracted to the spare layer.

[0010] As an improvement to the above solution, when not all the chips in the current blue film on the wafer workbench have been picked and the current die bonding process has ended, the method for changing the blue film of the die bonder further includes: driving the manipulator to transfer the current blue film on the wafer workbench to the transfer platform; driving the manipulator to transfer the next blue film in the waiting station to the wafer workbench and execute the next die bonding process.

[0011] As an improvement to the above solution, when all the chips in the current blue film on the wafer workbench have been picked and the current die bonding process has ended, the method for changing the blue film of the die bonder further includes: driving the manipulator to transfer the current blue film on the wafer workbench to the transfer platform and regard the current blue film as an invalid blue film; driving the manipulator to transfer the next blue film in the waiting station to the wafer workbench and execute the next die bonding process; driving the manipulator to transfer the invalid blue film on the transfer platform to the waiting station; driving the cassette to retract the invalid blue film in the waiting station back into the idle spare layer; driving the cassette to push the spare blue film in the spare layer to the waiting station and regard the spare blue film as the new current blue film.

[0012] Correspondingly, the present invention also provides a computer-readable storage medium, on which a computer program is stored, wherein when the computer program is executed by a processor, the steps of the above method for changing the blue film of the die bonder are implemented.

[0013] Correspondingly, the present invention also provides a computer device, including a memory and a processor, the memory stores a computer program, wherein when the processor executes the computer program, the steps of the above method for changing the blue film of the die bonder are implemented.

[0014] Correspondingly, the present invention also provides a system for changing the blue film of the die bonder, which includes a cassette, a transfer platform, a wafer workbench, a waiting station, a manipulator and the above computer device, and the computer device is connected to the manipulator to control the manipulator to perform the blue film changing operation.

[0015] As an improvement to the above solution, at least two reference layers and at least one spare layer are provided in the cartridge.

[0016] Implementing the present invention has the following beneficial effects:

[0017] In the present invention, the extra layers in the cartridge are used as spare layers. After each blue film is processed (i.e., all the crystals in the blue film have been picked), the processed blue film is first placed on the transfer platform, then the blue film on the spare layer is placed on the wafer workbench, and finally the processed blue film is placed on the spare layer. Therefore, the present invention can replace the blue film at any time without the need to stop the equipment, greatly improving the equipment efficiency and saving labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a flowchart of the first embodiment of the method for replacing the blue film of the die bonder of the present invention;

[0019] Figure 2 is a flowchart of the second embodiment of the method for replacing the blue film of the die bonder of the present invention;

[0020] Figure 3 is a flowchart of the third embodiment of the method for replacing the blue film of the die bonder of the present invention;

[0021] Figure 4 is a flowchart of the fourth embodiment of the method for replacing the blue film of the die bonder of the present invention;

[0022] Figure 5 is a flowchart of the fifth embodiment of the method for replacing the blue film of the die bonder of the present invention;

[0023] Figure 6 is a schematic structural diagram of an embodiment of the blue film replacement system of the die bonder of the present invention;

[0024] Figure 7 is a schematic structural diagram of an embodiment of the cartridge in the blue film replacement system of the die bonder of the present invention;

[0025] Figure 8 is a schematic structural diagram of an embodiment of the display module. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] To make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings. It is hereby declared that the orientation terms such as up, down, left, right, front, back, inside, and outside that appear or will appear in the text of the present invention are only based on the accompanying drawings of the present invention, and they do not specifically limit the present invention.

[0027] As Figure 6 and Figure 7 shown, the blue film replacement system of the die bonder of the present invention includes a cartridge 1, a transfer platform 2, a wafer workbench 3, a waiting station 4, a manipulator, and a computer device (seeFigure 6 ),wherein, there are at least two reference layers 11 and at least one spare layer 12 in the cartridge 1 (see Figure 7 ).

[0028] It should be noted that when die-bonding the display module, considering that the grains on different blue films have slight color differences, the present invention needs to pick grains from multiple blue films respectively, and stagger the grains in different blue films to be die-bonded on the display module, so as to ensure uniform transition of the display effects in each area of the display module and between adjacent display modules, and avoid the situation that the brightness of local areas on the display module changes significantly or the brightness difference between adjacent display modules is obvious.

[0029] In the present invention, there are two reference layers 11 and multiple spare layers 12 in the cartridge 1. Among them, blue film A is stored in one reference layer 11, blue film B is stored in the other reference layer 11, and blue film C is stored in one spare layer 12; when die-bonding, grains a can be first picked from blue film A and evenly dispersed and die-bonded on the display module, and then, grains b are picked from blue film B and used to fill the vacancies on the display module, so as to realize the staggered die-bonding of grains a and grains b.

[0030] As Figure 8 shown, when picking grains from blue film A, if all the grains a in blue film A have been picked but the die-bonding process of the current grains a is not finished, a large blank area D will be formed on the display module; at this time, grains b on blue film B cannot be used to die-bond the blank area D, otherwise, if grains b are continued to be used for vacancy filling later, the blank area D will be entirely composed of grains b; therefore, blue film C needs to be replaced to pick grains c to continue die-bonding. After the vacancies are filled with grains b later, the blank area D will be alternately distributed with grains b and grains c, which can overcome certain color difference defects.

[0031] See Figure 1 , Figure 1 shows the flowchart of the first embodiment of the method for changing the blue film of the die bonder of the present invention. When all the grains in the current blue film on the wafer workbench have been picked and the current die-bonding process is not finished, the method for changing the blue film of the die bonder includes:

[0032] S101, driving the cartridge to return the next blue film in the waiting station to the working layer;

[0033] Different from the prior art, the present invention uses the extra layers in the cartridge as spare layers. That is, in this embodiment, there are two reference layers and one spare layer in the cartridge.

[0034] S102, driving the manipulator to transfer the current blue film on the wafer workbench to the transfer platform and taking the current blue film as an invalid blue film;

[0035] S103, the driving cartridge pushes the spare blue film in the spare layer to the waiting station and takes the spare blue film as the new current blue film;

[0036] S104, the driving manipulator transfers the new current blue film at the waiting station to the wafer workbench and picks up the die from the new current blue film to continue the current die bonding process;

[0037] S105, the driving manipulator transfers the invalid blue film on the transfer platform to the waiting station;

[0038] S106, the driving cartridge returns the invalid blue film at the waiting station to the spare layer.

[0039] Therefore, in the present invention, after each blue film is used up (i.e., all the die on the blue film have been picked up), the used-up blue film is first placed on the transfer platform, then the blue film in the spare layer is placed on the wafer workbench, and finally the used-up blue film is placed back in the spare layer.

[0040] Further, when the invalid blue film is returned to the spare layer, a blue film replacement signal is generated to prompt the operator to replace the blue film in the spare layer in a timely manner.

[0041] In summary, the present invention adopts the method of using a spare loop, which allows the blue film to be replaced at any time without stopping the equipment, improving the equipment efficiency and saving labor costs.

[0042] See Figure 2 , Figure 2 which shows the flowchart of the second embodiment of the method for replacing the blue film of the die bonder in the present invention. When all the die on the current blue film on the wafer workbench have been picked up and the current die bonding process has not ended, the method for replacing the blue film of the die bonder includes:

[0043] S201, the driving cartridge returns the next blue film at the waiting station to the working layer;

[0044] S202, the driving manipulator transfers the current blue film on the wafer workbench to the transfer platform and takes the current blue film as the invalid blue film;

[0045] S203, the driving cartridge pushes the spare blue film in the spare layer to the waiting station and takes the spare blue film as the new current blue film;

[0046] S204, the driving manipulator transfers the new current blue film at the waiting station to the wafer workbench and picks up the die from the new current blue film to continue the current die bonding process;

[0047] S205, the driving manipulator transfers the invalid blue film on the transfer platform to the waiting station;

[0048] S206, the driving cartridge returns the invalid blue film at the waiting station to the spare layer.

[0049] S207, after completing the current die bonding process, drive the manipulator to transfer the new current blue film to the transfer platform;

[0050] S208, drive the cassette to push out the next blue film in the working layer to the waiting station;

[0051] S209, drive the manipulator to transfer the next blue film in the waiting station to the wafer workbench and execute the next die bonding process.

[0052] Different from the first embodiment shown in Figure 1 In this embodiment, when the new current blue film completes the current die bonding process, the next blue film in the working layer can be pushed out to the waiting station, so as to continue to execute the subsequent die bonding process to realize the alternating crystal picking of two groups of blue films.

[0053] See Figure 3 , Figure 3 shows the flowchart of the third embodiment of the method for changing the blue film of the die bonder of the present invention. When all the die chips in the current blue film on the wafer workbench have been picked and the current die bonding process is not completed, the method for changing the blue film of the die bonder includes:

[0054] S301, drive the cassette to retract the next blue film in the waiting station back to the working layer;

[0055] S302, drive the manipulator to transfer the current blue film on the wafer workbench to the transfer platform and regard the current blue film as an invalid blue film;

[0056] S303, drive the cassette to push out the spare blue film in the spare layer to the waiting station and regard the spare blue film as the new current blue film;

[0057] S304, drive the manipulator to transfer the new current blue film in the waiting station to the wafer workbench and pick die chips from the new current blue film to continue to execute the current die bonding process;

[0058] S305, drive the manipulator to transfer the invalid blue film on the transfer platform to the waiting station;

[0059] S306, drive the cassette to retract the invalid blue film in the waiting station back to the spare layer.

[0060] S307, after completing the current die bonding process, drive the manipulator to transfer the new current blue film to the transfer platform;

[0061] S308, drive the cassette to push out the next blue film in the working layer to the waiting station;

[0062] S309, drive the manipulator to transfer the next blue film in the waiting station to the wafer workbench and execute the next die bonding process.

[0063] S310, drive the manipulator to transfer the current blue film on the transfer platform to the waiting station;

[0064] S311, drive the cartridge to return the current blue film in the waiting station back to the working layer.

[0065] Different from Figure 2 the second embodiment shown, in this embodiment, after the blue films in the spare layer are produced in one round, they can be put back into the working layer for normal production to replace the blue films whose chips have all been picked.

[0066] Refer to Figure 4 , Figure 4 which shows the flowchart of the fourth embodiment of the method for changing blue films of the die bonder of the present invention. When the chips in the current blue film on the wafer stage have not all been picked and the current die bonding process has ended, the method for changing blue films of the die bonder further includes:

[0067] S401, drive the manipulator to transfer the current blue film on the wafer stage to the transfer platform;

[0068] S402, drive the manipulator to transfer the next blue film in the waiting station to the wafer stage and execute the next die bonding process.

[0069] Different from Figure 3 the third embodiment shown, in this embodiment, when the chips in the current blue film have not all been picked and the current die bonding process has ended, the original method for switching blue films is maintained and there is no need to change the blue film.

[0070] Refer to Figure 5 , Figure 5 which shows the flowchart of the fifth embodiment of the method for changing blue films of the die bonder of the present invention. When the chips in the current blue film on the wafer stage have all been picked and the current die bonding process has ended, the method for changing blue films of the die bonder further includes:

[0071] S501, drive the manipulator to transfer the current blue film on the wafer stage to the transfer platform and regard the current blue film as an invalid blue film;

[0072] S502, drive the manipulator to transfer the next blue film in the waiting station to the wafer stage and execute the next die bonding process;

[0073] S503, drive the manipulator to transfer the invalid blue film on the transfer platform to the waiting station;

[0074] S504, drive the cartridge to return the invalid blue film in the waiting station back to the idle spare layer;

[0075] Different from Figure 1 the first embodiment shown, in this embodiment, there are two reference layers and two spare layers in the cartridge.

[0076] S505, the driving cassette pushes the spare blue film in the spare layer to the waiting station and uses the spare blue film as the new current blue film.

[0077] It should be noted that for the situation of "when all the chips in the current blue film on the wafer table have been picked and the current die bonding process has ended", the embodiments shown Figure 3 can be used for processing, or this embodiment can also be used for processing.

[0078] For example, when all the chips in the current blue film on the wafer table have been picked and the current die bonding process has ended, if no processing is done and when the chips in the current blue film need to be picked again, it will enter the state of "when all the chips in the current blue film on the wafer table have been picked and the current die bonding process has not ended", and the embodiments shown Figure 3 can be used for processing;

[0079] Another example is that when all the chips in the current blue film on the wafer table have been picked and the current die bonding process has ended, if this embodiment is used for processing, the spare blue film can be quickly pushed out, and the invalid blue film can be recycled, further reducing the steps of blue film replacement and improving the equipment efficiency.

[0080] Correspondingly, the present invention also discloses a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the above die bonding machine blue film replacement method are realized.

[0081] At the same time, the present invention also discloses a computer device, including a memory and a processor. The memory stores a computer program. When the processor executes the computer program, the steps of the above die bonding machine blue film replacement method are realized.

[0082] See Figure 6 , Figure 6 shows the specific structure of the die bonding machine blue film replacement system of the present invention, which includes a cassette 1, a transfer platform 2, a wafer table 3, a waiting station 4, a manipulator and the above computer device. The computer device is connected to the manipulator to control the manipulator to perform the blue film replacement operation, so as to realize the steps of the above die bonding machine blue film replacement method.

[0083] As Figure 7 shown, the cassette 1 is provided with at least two reference layers 11 and at least one spare layer 12.

[0084] Different from the prior art, the present invention uses the extra layers in the cassette 1 as the spare layer 12, greatly improving the storage mode of the blue film, so as to better cooperate with the control logic of the die bonding machine blue film replacement method, ensure that the blue film can be replaced at any time, the equipment will not stop, improve the equipment efficiency and save labor costs.

[0085] The above are the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements are also regarded as the protection scope of the present invention.

Claims

1. A method for replacing blue film in a die bonding machine, characterized in that: When all the crystal grains in the current blue film on the wafer workbench have been removed and the current crystal bonding process has not yet ended, the method for replacing the blue film in the crystal bonding machine includes: The drive box returns the next blue film in the waiting position to the working layer; Driving the robot to transfer the current blue film on the wafer workbench to the transfer platform, and treating the current blue film as an invalid blue film; The material box is driven to push the spare blue film in the spare layer to the waiting station, and the spare blue film is used as the new current blue film; The robot is driven to transfer the new current blue film in the waiting station to the wafer workbench, and picks the die from the new current blue film to continue the current die bonding process; Drive the manipulator to transfer the invalid blue film on the transfer platform to the waiting station; The drive material box returns the invalid blue film in the waiting position to the spare layer.

2. The method for replacing blue film in a die bonder according to claim 1, characterized in that: Also includes: After completing the current crystal bonding process, drive the robot to transfer the new current blue film to the transfer platform; The drive box pushes the next blue film in the working layer to the waiting position; The robot arm is driven to transfer the next blue film in the waiting station to the wafer workbench to execute the next die bonding process.

3. The method for replacing blue film in a die bonder according to claim 2, characterized in that: Also includes: Drive the robot to transfer the current blue film on the transfer platform to the waiting position; The drive material box returns the current blue film in the waiting position to the working layer.

4. The method for replacing blue film in a die bonding machine according to claim 1, characterized in that: Also includes: When the invalid blue film is returned to the spare layer, a blue film replacement signal is generated.

5. The method for replacing blue film in a die bonder according to claim 1, characterized in that: When all the grains in the current blue film on the wafer workbench have not been removed and the current crystal bonding process has ended, the method for replacing the blue film in the crystal bonding machine further includes: Driving the manipulator to transfer the current blue film on the wafer workbench to the transfer platform; The robot arm is driven to transfer the next blue film in the waiting station to the wafer workbench to execute the next die bonding process.

6. The method for replacing blue film in a die bonder according to claim 1, characterized in that: When all the crystal grains in the current blue film on the wafer workbench have been removed and the current crystal bonding process has ended, the method for replacing the blue film in the crystal bonding machine further includes: Driving the robot to transfer the current blue film on the wafer workbench to the transfer platform, and treating the current blue film as an invalid blue film; Drive the robot to transfer the next blue film in the waiting position to the wafer workbench to perform the next die bonding process; Drive the manipulator to transfer the invalid blue film on the transfer platform to the waiting station; The drive box returns the invalid blue film in the waiting position to the idle standby layer; The material box is driven to push the spare blue film in the spare layer into the waiting station, and the spare blue film is used as the new current blue film.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method for replacing a blue film in a die bonder according to any one of claims 1 to 6 are implemented.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method for replacing the blue film in a die bonder according to any one of claims 1 to 6 are implemented.

9. A blue film replacement system for a die bonder, characterized in that: It comprises a material box, a transfer platform, a wafer workbench, a waiting station, a robot and the computer device as claimed in claim 8, wherein the computer device is connected to the robot to control the robot to perform a blue film changing operation.

10. The blue film replacement system for a die bonder according to claim 9, characterized in that: At least two reference layers and at least one standby layer are arranged in the material box.

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