Electronic device

Abstract

The invention provides an electronic device. The housing includes a conductive plate. The Sub 6G antenna assembly comprises a Sub 6G radiator and a Sub 6G signal source. The Sub 6G radiator is all or a part of the conductive plate. And the Sub 6G signal source is arranged in the shell. The Sub 6G signal source is electrically connected with the Sub 6G radiator and is used for exciting the Sub 6G radiator to form a target resonance mode supporting a Sub 6G frequency band. The millimeter wave array antenna assembly comprises a millimeter wave radiator array and a millimeter wave signal source. And the millimeter wave radiator array is arranged on the Sub 6G radiator. And the millimeter wave radiator array and the Sub 6G radiator are arranged at an interval. The millimeter wave signal source is electrically connected with the millimeter wave radiator array and is used for exciting the millimeter wave radiator array to support a millimeter wave frequency band. The space occupied by the antenna is reduced while the communication function of the electronic equipment is ensured.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an electronic device. Background Art

[0002] As the communication functions of electronic devices such as mobile phones increase, the number of antennas that need to be installed on the electronic devices increases, but the space provided for various antennas in electronic devices is limited. Therefore, how to reduce the space occupied by the antenna while ensuring the communication function of the electronic devices has become a technical problem that needs to be solved. Summary of the invention

[0003] The present application provides an electronic device that reduces the space occupied by an antenna while ensuring the communication function of the electronic device.

[0004] The present application provides an electronic device, comprising:

[0005] A housing including a conductive plate;

[0006] A Sub 6G antenna assembly, the Sub 6G antenna assembly comprising a Sub 6G radiator and a Sub 6G signal source, the Sub 6G radiator being all or part of the conductive plate, the Sub 6G signal source being disposed in the housing, the Sub 6G signal source being electrically connected to the Sub 6G radiator and being used to excite the Sub 6G radiator to form a target resonance mode supporting a Sub 6G frequency band; and

[0007] A millimeter wave array antenna assembly, the millimeter wave array antenna assembly comprising a millimeter wave radiator array and a millimeter wave signal source, the millimeter wave radiator array being arranged on the Sub 6G radiator, the millimeter wave radiator array being spaced apart from the Sub 6G radiator, the millimeter wave signal source being electrically connected to the millimeter wave radiator array for stimulating the millimeter wave radiator array to support the millimeter wave frequency band.

[0008] The electronic device provided in the embodiment of the present application sets the radiator of the Sub 6G antenna assembly as all or part of the conductive plate of the shell of the electronic device, and sets the radiator of the millimeter wave array antenna assembly 600 on the radiator of the Sub 6G antenna assembly. The Sub 6G signal source and the millimeter wave signal source in the shell respectively excite signals supporting the Sub 6G frequency band and the millimeter wave frequency band. Since the frequency band difference between the Sub 6G frequency band and the millimeter wave frequency band is large, the Sub 6G signal source and the millimeter wave signal source are not coupled with each other, so that the radiator of the Sub 6G antenna assembly and the radiator of the millimeter wave array antenna assembly can be reused with each other without being interfered by the signals, and finally the conductive plate of the shell, the radiator of the Sub 6G antenna assembly and the radiator of the millimeter wave array antenna assembly are reused, thereby saving costs and reducing the occupied area. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments are briefly introduced below.

[0010] Figure 1 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0011] Figure 2 It is a schematic diagram of a partial decomposition structure of an electronic device provided in an embodiment of the present application;

[0012] Figure 3 It is a schematic diagram of the structure of the Sub 6G antenna assembly and the millimeter wave array antenna assembly provided in the embodiments of the present application;

[0013] Figure 4 It is a top view of a Sub 6G radiator, a millimeter wave radiator array and a camera decoration provided in an embodiment of the present application;

[0014] Figure 5 It is a side view of the first Sub 6G antenna assembly and mainboard provided in an embodiment of the present application;

[0015] Figure 6 It is a side view of the second Sub 6G antenna assembly and mainboard provided in an embodiment of the present application;

[0016] Figure 7 is a structural schematic diagram of a first matching circuit having a capacitive element provided in an embodiment of the present application;

[0017] Figure 8 It is a side view of the third Sub 6G antenna assembly and mainboard provided in the embodiment of the present application;

[0018] Fig. 9It is a top view of another Sub 6G radiator, a millimeter wave radiator array and a camera decoration provided in an embodiment of the present application;

[0019] Fig.10 is a three-dimensional structural diagram of a millimeter wave array assembly provided in an embodiment of the present application;

[0020] Fig.11 This is a first cross-sectional view of a millimeter wave radiator array and a reference stratum provided in an embodiment of the present application, provided on a Sub 6G radiator;

[0021] Fig.12 It is a second cross-sectional view of the millimeter wave radiator array and the reference stratum provided in the embodiment of the present application, which is located at the Sub 6G radiator;

[0022] Fig.13 It is a third cross-sectional view of the millimeter wave radiator array and the reference stratum provided in the embodiment of the present application, which is located at the Sub 6G radiator;

[0023] Fig.14 It is a fourth cross-sectional view of the millimeter wave radiator array and the reference stratum provided in the Sub 6G radiator according to the embodiment of the present application;

[0024] Fig.15 It is a fifth cross-sectional view of the millimeter wave radiator array and the reference stratum provided in the Sub 6G radiator according to the embodiment of the present application;

[0025] Fig.16 It is a structural schematic diagram of a camera decoration provided in an embodiment of the present application being attached to a back cover;

[0026] Fig.17 It is the S parameter curve of the operation of the Sub 6GHz antenna assembly and the millimeter wave array antenna assembly provided in the embodiments of the present application.

[0027] Description of Figure Numbers:

[0028] Electronic device 1000; housing 100; Sub 6G antenna assembly 500; millimeter wave array antenna assembly 600; display screen 200; middle frame 300; back cover 400; middle plate 310; frame 320; main board 700; camera module 800; camera decoration 120; conductive plate 110; Sub 6G radiator 510; Sub 6G signal source 520; millimeter wave radiator array 610; millimeter wave signal source 620; feeding point A; conductive spring 710; light-transmitting portion 121; light-shielding portion 122; first edge point B; first matching circuit M1; capacitor element 22; electrode plate 23; grounding point C; second edge point D; millimeter wave radiator 611; reference ground layer 680; first dielectric layer 630; multiple feed lines 640; feeding network 650; second dielectric layer 660; RF end 651; feeding end 652; power divider 653; phase shifter 654; second matching circuit M2. DETAILED DESCRIPTION

[0029] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the embodiments described in the present application are only a part of the embodiments, not all of the embodiments. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in this field without creative work belong to the protection scope of the present application.

[0030] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it mutually exclusive, independent, or alternative to other embodiments. It can be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0031] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example: a component or device including one or more parts is not limited to the one or more parts listed, but optionally includes one or more parts that are not listed but inherent to the exemplified product, or one or more parts that it should have based on the described function.

[0032] See also Figure 1 , Figure 1The following is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of the present application. The electronic device 1000 includes but is not limited to a mobile phone, a tablet computer, a laptop computer, a computer, a wearable device, a drone, a robot, a digital camera, and other devices with communication functions. The present embodiment of the present application is described using a mobile phone as an example, and other electronic devices may refer to this embodiment.

[0033] See also Figure 2 The electronic device 1000 includes a housing 100, a Sub 6G antenna assembly 500 and a millimeter wave array antenna assembly 600.

[0034] See also Figure 2 , the electronic device 1000 is taken as a mobile phone as an example for the working environment. The electronic device 1000 includes a display screen 200, a middle frame 300 and a back cover 400 arranged in sequence along the thickness direction. The frame 320 and the back cover 400 form the housing 100.

[0035] The middle frame 300 includes a middle plate 310 and a frame 320 surrounding the middle plate 310. The display screen 200, the middle plate 310 and the back cover 400 are stacked in sequence, and a receiving space is formed between the display screen 200 and the middle plate 310, and between the middle plate 310 and the back cover 400 to accommodate components such as the main board 700, the camera module 800, the receiver module, the battery, and various sensors. One side of the frame 320 is connected to the edge of the display screen 200, and the other side of the frame 320 is connected to the edge of the back cover 400 to form a complete appearance structure of the electronic device 1000. In this embodiment, the frame 320 and the middle plate 310 are an integrated structure, and the frame 320 and the back cover 400 can be a split structure. In other embodiments, the frame 320 and the back cover 400 may be an integral structure, and the frame 320 and the middle plate 310 may be a split structure. The above is the working environment of the Sub 6G antenna assembly 500 and the millimeter wave array antenna assembly 600 taking a mobile phone as an example, but the Sub 6G antenna assembly 500 and the millimeter wave array antenna assembly 600 of the present application are not limited to the above working environment.

[0036] See also Figure 2 The housing 100 includes a conductive plate 110. The conductive plate 110 includes, but is not limited to, a camera decoration 120 made of a conductive material disposed on the back cover 400, a conductive back cover 400, etc., and the following description is made by taking the conductive plate 110 as a camera decoration 120 disposed on the back cover 400 as an example. Optionally, the conductive plate 110 may be embedded in a through hole of the back cover 400, or may be attached to the inner side of the light-transmitting back cover 400. In this embodiment, the conductive plate 110 is embedded in a through hole of the back cover 400 as an example.

[0037] See also Figure 3The Sub 6G antenna assembly 500 includes a Sub 6G radiator 510 and a Sub 6G signal source 520 .

[0038] See also Figure 3 , the Sub 6G radiator 510 is all or part of the conductive plate 110 . When the conductive plate 110 is a camera decoration 120 , the camera decoration 120 can be entirely used as the Sub 6G radiator 510 .

[0039] The present application does not specifically limit the shape of the camera decoration 120. For example, the camera decoration 120 is circular, rectangular, square, hexagonal, a combination of half rectangle and half semicircle, etc.

[0040] Optionally, the camera decoration 120 is in the form of a sheet, a layer, a film, etc.

[0041] Optionally, the material of the camera decoration 120 is a conductive material, specifically including but not limited to metal. The form of the camera decoration 120 includes but is not limited to being formed on a flexible printed circuit board (FPC), by laser direct structuring (LDS), by printing direct structuring (PDS), a conductive plate 110 (such as a metal bracket), etc. In this embodiment, the camera decoration 120 is taken as a conductive plate 110 as an example for description.

[0042] The Sub 6G signal source 520 is disposed in the housing 100. The Sub 6G signal source 520 includes but is not limited to a Sub 6G RF transceiver chip, etc. The Sub 6G signal source 520 is disposed on the mainboard 700. The Sub 6G signal source 520 is electrically connected to the Sub 6G radiator 510. In the present application, the electrical connection includes a direct electrical connection, i.e., an electrical connection with physical contact, or a coupled electrical connection, i.e., an electrical connection without direct contact. The signal source coupled electrical connection feeding point is also called capacitive feeding or coupled feeding. The electrical connection method between the Sub 6G signal source 520 and the Sub 6G radiator 510 includes but is not limited to a conductive spring, a RF connection line, etc.

[0043] The Sub 6G signal source 520 is used to excite the Sub 6G radiator 510 (camera decoration 120) to form a target resonance mode supporting the Sub 6G frequency band, so that the camera decoration 120 can not only serve as a camera decoration, but also as a radiator for transmitting and receiving signals in the Sub 6G frequency band. The frequency range of the Sub 6G frequency band is 450MHz to 6GHz.

[0044] Since the camera decoration 120 is arranged on the back cover 400, and the material of the back cover 400 is a non-conductive material, when the camera decoration 120 serves as the Sub 6G radiator 510, the clearance around the Sub 6G radiator 510 is good, and the Sub 6G radiator 510 has better antenna performance when transmitting and receiving signals in the Sub 6G frequency band.

[0045] See also Figure 3 The millimeter wave array antenna assembly 600 includes a millimeter wave radiator array 610 and a millimeter wave signal source 620.

[0046] The millimeter wave radiator array 610 is disposed on the Sub 6G radiator 510. Optionally, the millimeter wave radiator array 610 may be embedded in the Sub 6G radiator 510. The millimeter wave radiator array 610 is spaced apart from the Sub 6G radiator 510. The position where the millimeter wave radiator array 610 is located is located within the position where the Sub 6G radiator 510 is located.

[0047] The millimeter wave signal source 620 is electrically connected to the millimeter wave radiator array 610. The millimeter wave signal source 620 includes but is not limited to a millimeter wave radio frequency transceiver chip, etc. The millimeter wave signal source 620 is arranged on the main board 700. The millimeter wave signal source 620 is electrically connected to the millimeter wave radiator array 610, and the specific electrical connection method is but is not limited to a conductive spring, a radio frequency connecting line, etc.

[0048] The millimeter wave signal source 620 is used to excite the millimeter wave radiator array 610 to support the millimeter wave frequency band. The frequency range of the millimeter wave frequency band is 24.25 GHz to 52.6 GHz.

[0049] The millimeter wave radiator array 610 and the Sub 6G radiator 510 provided in the present application both reuse the conductive plate 110 on the shell 100, such as the camera decoration 120. In this way, the camera decoration 120 not only serves as a camera decoration, but also can serve as a radiator for transmitting and receiving the Sub 6G frequency band, and at the same time as a radiator for transmitting and receiving the millimeter wave frequency band. Since the difference between the Sub 6G frequency band and the millimeter wave frequency band is more than 10GHz, there will be no signal coupling between the millimeter wave signal source 620 and the Sub 6G signal source 520, so the camera decoration 120 does not affect each other when transmitting and receiving the Sub 6G frequency band and the millimeter wave frequency band.

[0050] The electronic device provided in the embodiment of the present application sets the radiator of the Sub 6G antenna assembly 500 as all or part of the conductive plate 110 of the housing 100 of the electronic device, and sets the radiator of the millimeter wave array antenna assembly 600 on the radiator of the Sub 6G antenna assembly 500, multiplexes the conductive plate 110 of the housing 100 into the millimeter wave radiator and the Sub 6G radiator 510, and the Sub 6G signal source 520 and the millimeter wave signal source 620 in the housing 100 respectively excite the signal supporting the Sub 6G frequency band and the signal supporting the millimeter wave frequency band. Since the frequency band difference between the Sub 6G frequency band and the millimeter wave frequency band is large, the Sub 6G signal source 520 and the millimeter wave signal source 620 are not coupled with each other, thereby realizing that the radiator of the Sub 6G antenna assembly 500 and the radiator of the millimeter wave array antenna assembly 600 can be multiplexed with each other without being interfered by the signal, and finally realizes that the conductive plate 110 and the Sub 6G antenna assembly 500 of the housing 100 are connected to each other. The reuse of the radiator of the 6G antenna assembly 500 and the radiator of the millimeter wave array antenna assembly 600 saves costs and reduces the occupied area.

[0051] See also Figure 4 , the Sub 6G radiator 510 further includes a feeding point A. The present application does not specifically limit the position of the feeding point A of the Sub 6G radiator 510. For example, the feeding point A is located close to the edge of the camera decoration 120, or close to the center of the camera decoration 120.

[0052] See also Figure 5 , the feeding point A is electrically connected to the Sub 6G signal source 520. For example, a conductive spring 710 is provided on the main board 700. The Sub 6G signal source 520 is abutted against the camera decoration 120 through the conductive spring 710, and the point on the camera decoration 120 that abuts against the conductive spring 710 is the feeding point A.

[0053] Optional, see Figure 4 The camera decoration 120 includes a light-transmitting portion 121 and a light-shielding portion 122. The light-transmitting portion 121 is directly opposite to the lens of the camera module 800 of the electronic device 1000, so that the camera module 800 receives the light signal through the light-transmitting portion 121. The feeding point A is located at the light-shielding portion 122 outside the light-transmitting portion 121.

[0054] See also Figure 4 , the point on the edge of the Sub 6G radiator 510 that is farthest from the feeding point A is the first edge point B. Taking the outer contour of the camera decoration 120 as an example, the intersection point of the diameter of the feeding point A and the outer edge of the camera decoration 120 is the first edge point B.

[0055] The Sub 6G signal source 520 excites the Sub 6G radiator 510 to form a resonant current of a target resonant mode, and the resonant current of the target resonant mode is mainly distributed between the feed point A and the first edge point B of the Sub 6G radiator 510. The target resonant mode includes a 1 / 4 wavelength mode that supports the Sub 6G frequency band. In other words, the Sub 6G radiator 510 distributes a resonant current between the feed point A and the first edge point B under the excitation of the Sub 6G signal source 520, and the mode of the resonant current includes a 1 / 4 wavelength mode. Optionally, the electrical length between the feed point A and the first edge point B is comparable (close) to the 1 / 4 wavelength of the Sub 6G frequency band. Among them, the electrical length comparable to the 1 / 4 wavelength of the Sub 6G frequency band is (1 / 4 wavelength ± 1 / 10 wavelength) of the Sub 6G frequency band. The current mode of the target resonant current between the feed point A and the first edge point B is the 1 / 4 wavelength mode of the Sub 6G frequency band. Optionally, the electrical length between the feeding point A and the first edge point B is greater than 1 / 4 wavelength of the Sub 6G frequency band, and the current mode of the target resonant current between the feeding point A and the first edge point B includes the 1 / 4 wavelength mode of the Sub 6G frequency band and also includes a part of the resonant current.

[0056] See also Figure 6 , the Sub 6G antenna assembly 500 also includes a first matching circuit M1. The first matching circuit M1 is arranged on the main board 700. One end of the first matching circuit M1 is electrically connected to the Sub 6G signal source 520. The other end of the first matching circuit M1 is electrically connected to the feeding point A. Among them, the first matching circuit M1 is used to adjust the impedance of the radiation path on the Sub 6G radiator 510. Make the impedance of the radiation path on the Sub 6G radiator 510 have a better match with the frequency band of Sub 6G to generate a resonant mode of the required frequency band. And it has better radiation performance in the required frequency band. The present application does not limit the specific structure of the first matching circuit M1. Optionally, the first matching circuit M1 includes a circuit structure composed of multiple components such as capacitors, inductors and resistors.

[0057] In one embodiment, see Figure 6 , the electrical length between the feeding point A and the first edge point B is less than 0.25 times the wavelength of the Sub 6G frequency band. For example, the feeding point A is located near the center of the camera decorative member 120. The Sub 6G signal source 520 is capacitively fed to the feeding point A.

[0058] Since the electrical length between the feeding point A and the first edge point B is less than 0.25 times the wavelength of the Sub 6G frequency band, the electrical length between the feeding point A and the first edge point B is too small to form a current distribution of 1 / 4 wavelength of the Sub 6G frequency band between the feeding point A and the first edge point B. In this case, the Sub 6G signal source 520 can excite a resonant current of a 1 / 4 wavelength mode of the Sub 6G frequency band between the feeding point A and the first edge point B by capacitive feeding.

[0059] The Sub 6G signal source 520 is capacitively fed to the feeding point A, including but not limited to the following implementations:

[0060] In the first implementation, see Figure 6 and Figure 7 The series branch of the first matching circuit M1 electrically connected to the feeding point A includes a capacitor element 22, and one end of the capacitor element 22 is directly connected to the conductive spring 710 abutting the feeding point A. In this embodiment, the RF signal of the Sub 6G signal source 520 is fed to the Sub 6G radiator 510 via the capacitor element 22 in the first matching circuit M1, so that the Sub 6G signal source 520 is capacitively fed to the feeding point A.

[0061] In the second implementation, please refer to Figure 8 , the end of the first matching circuit M1 away from the Sub 6G signal source 520 is an electrode plate 23, and the electrode plate 23 is directly opposite to the area where the feeding point A on the Sub 6G radiator 510 is located and has a small gap, so that the electrode plate 23 is coupled with the Sub 6G radiator 510, and the electrode plate 23 and the Sub 6G radiator 510 form a capacitor structure, and there is a capacitor between the electrode plate 23 and the Sub 6G radiator 510. The RF signal of the Sub 6G signal source 520 is coupled and fed to the Sub 6G radiator 510 through the electrode plate 23, so that the Sub 6G signal source 520 is fed to the feeding point A through capacitive feeding.

[0062] In another embodiment, see Figure 5, the electrical length between the feeding point A and the first edge point B is greater than or equal to 0.25 times the wavelength of the Sub 6G frequency band. For example, the feeding point A is arranged between the center position and the edge position of the camera decoration 120, or the feeding point A is arranged at the edge position of the camera decoration 120. In this embodiment, since the electrical length between the feeding point A and the first edge point B is sufficient to form a current in the 1 / 4 wavelength mode of the Sub 6G frequency band between the feeding point A and the first edge point B. Therefore, the Sub 6G signal source 520 can be directly fed to the feeding point A through the first matching circuit M1 through the conductive spring 710, so that the Sub 6G signal source 520 excites the Sub6G radiator 510 to form a current in the 1 / 4 wavelength mode of the Sub 6G frequency band between the feeding point A and the first edge point B by direct feeding.

[0063] In the above implementations, no grounding point is provided on the Sub 6G radiator 510 .

[0064] In another embodiment, see Fig. 9 The Sub 6G radiator 510 further includes a feeding point A and a grounding point C. The grounding point C is spaced apart from the feeding point A. The position of the grounding point C relative to the feeding point A is not specifically limited in this embodiment.

[0065] See also Fig. 9 , the Sub 6G signal source 520 excites the Sub 6G radiator 510 to form a resonant current of a target resonant mode. The point on the edge of the Sub 6G radiator 510 that is farthest from the grounding point C is the second edge point D. Taking the outer contour of the camera decorative part 120 as an example, the intersection point of the diameter of the grounding point C and the outer edge of the camera decorative part 120 is the second edge point D.

[0066] The resonant current of the target resonant mode is distributed between the ground point C and the second edge point D of the Sub 6G radiator 510. The target resonant mode includes a 1 / 4 wavelength mode supporting the Sub 6G frequency band.

[0067] Optionally, the grounding point C is electrically connected to the reference ground on the mainboard 700 through a grounding spring on the mainboard 700. In other words, a grounding spring is provided on the mainboard 700, and the position where the grounding spring elastically abuts against the camera decorative component 120 is the grounding point C. Optionally, the position of the grounding point C is located at the light shielding portion 122 outside the light-transmitting portion 121.

[0068] In other words, the Sub 6G radiator 510 distributes a resonant current between the ground point C and the second edge point D under the excitation of the Sub 6G signal source 520, and the mode of the resonant current includes a 1 / 4 wavelength mode. Optionally, the electrical length between the ground point C and the second edge point D is comparable (close) to the 1 / 4 wavelength of the Sub 6G frequency band. Among them, the electrical length comparable to the 1 / 4 wavelength of the Sub 6G frequency band is (1 / 4 wavelength ± 1 / 10 wavelength) of the Sub 6G frequency band. The current mode of the target resonant current between the ground point C and the second edge point D is the 1 / 4 wavelength mode of the Sub 6G frequency band. Optionally, the electrical length between the ground point C and the second edge point D is greater than the 1 / 4 wavelength of the Sub 6G frequency band, and the current mode of the target resonant current between the ground point C and the second edge point D includes the 1 / 4 wavelength mode of the Sub 6G frequency band, and also includes a portion of the resonant current.

[0069] See also Fig. 9 , the millimeter wave radiator array 610 is a single-layer patterned metal layer or a multi-layer patterned metal layer. The millimeter wave radiator array 610 includes a plurality of millimeter wave radiators 611 arranged in an array. The shape of the millimeter wave radiator 611 is not specifically limited. For example, the shape of the millimeter wave radiator 611 includes but is not limited to a rectangle, a square, a circle, a circular ring, a square ring, a cross, etc. The arrangement array of the millimeter wave radiator 611 is not specifically limited. For example, the arrangement array of the millimeter wave radiator 611 includes but is not limited to 1*N, N*M, where N is a positive integer and M is a positive integer. The present application does not limit the size of each millimeter wave radiator 611. For example, the maximum size of the millimeter wave radiator 611 is close to 1 / 4 wavelength of the millimeter wave frequency band. Adjacent millimeter wave radiators 611 are spaced and insulated. The spacing between adjacent millimeter wave radiators 611 is close to 1 / 4 wavelength of the millimeter wave frequency band. An insulating medium is filled between adjacent millimeter wave radiators 611.

[0070] The millimeter wave radiator array 610 is arranged in the area where the Sub 6G radiator 510 is located. The millimeter wave radiator array 610 and the Sub 6G radiator 510 are spaced and insulated. Furthermore, an insulating medium is filled between the millimeter wave radiator array 610 and the Sub 6G radiator 510. The present application does not limit the spacing between the millimeter wave radiator array 610 and the Sub 6G radiator 510. For example, the spacing between the millimeter wave radiator array 610 and the Sub 6G radiator 510 is close to 1 / 4 wavelength of the Sub 6G frequency band.

[0071] For example, the Sub 6G radiator 510 has a rectangular hollow area, and the millimeter wave radiator array 610 is located in the hollow area. The hollow area is smaller than the size of the Sub 6G radiator 510, so the setting of the hollow area has no effect on the target resonance mode of the Sub 6G radiator 510.

[0072] The feeding point A is set outside the hollow area. The grounding point C is set outside the hollow area.

[0073] See also Fig.10 and Fig.11 The millimeter wave array antenna assembly 600 also includes a reference ground layer 680, a first dielectric layer 630 and a plurality of feed lines 640.

[0074] See also Fig.10 , the millimeter wave radiator array 610, the first dielectric layer 630, and the reference stratum 680 are stacked in sequence. The reference stratum 680 is a metal layer. The first dielectric layer 630 is an insulating material, and the first dielectric layer 630 is used to insulate the reference stratum 680 from the millimeter wave radiator array 610. Optionally, an insulating medium is filled between the reference stratum 680 and the Sub 6G radiator 510. The present application does not limit the spacing between the reference stratum 680 and the Sub 6G radiator 510. For example, the spacing between the reference stratum 680 and the Sub 6G radiator 510 is close to 1 / 4 wavelength of the Sub6G frequency band.

[0075] For optional reference, see Fig.12 The reference stratum 680 and the Sub 6G radiator 510 are interconnected as one, so that the millimeter wave radiator array 610 has a relatively large reference stratum 680, which improves the antenna performance. In addition, the reference stratum 680 is a part of the Sub 6G radiator 510, that is, the millimeter wave radiator array 610 reuses a part of the Sub 6G radiator 510 as the reference stratum 680, improves the compactness of the antenna assembly and the camera decoration 120 on the electronic device 1000, improves the utilization rate between various components, and can also realize the transmission and reception of Sub 6G frequency band and millimeter wave signals.

[0076] See also Fig.10 The number of feed lines 640 corresponds one-to-one to the number of millimeter wave radiators 611 in the millimeter wave radiator array 610 .

[0077] See also Fig.10One end of each feed line 640 is used to electrically connect to a feed end of the feed network of the millimeter wave array antenna assembly 600, and the other end of each feed line 640 passes through the reference ground layer 680 and the first dielectric layer 630 and is electrically connected to a millimeter wave radiator 611 in the millimeter wave radiator array 610. The feed line 640 is a metal via, a metal conductive hole, etc. along a direction perpendicular to the camera decorative part 120.

[0078] In the implementation manner of the present application, by arranging the millimeter wave radiator array 610 and the reference stratum 680 in the area where the Sub 6G radiator 510 is located, and arranging them together with the Sub 6G radiator 510 on the camera decoration 120, on the one hand, the millimeter wave radiator array 610 and the reference stratum 680 reuse the space on the Sub 6G radiator 510; on the other hand, the millimeter wave radiator array 610 and the reference stratum 680 and the Sub 6G radiator 510 reuse the space on the camera decoration 120, and in addition, the reception and transmission of the Sub 6G frequency band and millimeter wave signals are ensured.

[0079] See also Fig.10 and Fig.13 , the millimeter wave array antenna assembly 600 also includes a feeding network 650 and a second dielectric layer 660. The first dielectric layer 630 is an insulating material, and the first dielectric layer 630 is used to insulate the reference ground layer 680 from the millimeter wave radiator array 610. The feeding network 650, the second dielectric layer 660, the reference ground layer 680, the first dielectric layer 630 and the millimeter wave radiator array 610 are stacked in sequence. The feeding network 650 includes a radio frequency end 651 and a plurality of feeding ends 652. The radio frequency end 651 is used to electrically connect the millimeter wave signal source 620 disposed in the housing 100 through a conductive spring 710 or a radio frequency connecting line. The plurality of feeding ends 652 are respectively used to electrically connect one end of a plurality of feed lines 640 away from the millimeter wave radiator 611. Each of the feed lines 640 is electrically connected to a feeding end 652.

[0080] In this embodiment, not only the millimeter-wave radiator array 610, the reference stratum 680, and the Sub 6G radiator 510 reuse the space on the camera decoration 120, but the feeding network 650 is also arranged in the area where the Sub 6G radiator 510 is located, thereby further increasing the multiplexing degree between the millimeter-wave array antenna assembly 600 and the Sub 6G radiator 510. In addition, by arranging the feeding network 650 on the camera decoration 120, the loss on the RF path between the signal source and the millimeter-wave radiator 611 can be reduced.

[0081] See also Fig.10The feeding network 650 includes a power divider 653, a plurality of phase shifters 654 and a plurality of second matching circuits M2 which are electrically connected in sequence. The end of the power divider 653 away from the phase shifter 654 is the RF end 651. The end of the second matching circuit M2 away from the phase shifter 654 is a feeding end 652.

[0082] Optionally, the power divider 653 and the phase shifter 654 are both conductive traces, and the power divider 653 and the phase shifter 654 can be manufactured in the camera decoration 120 through an etching process, or can be manufactured on the second dielectric layer 660 through a printing process.

[0083] Taking the millimeter wave radiator array 610 as 4*4 as an example, one end of the power divider 653 is the RF end 651, and the power divider 653 is equally divided from the RF end 651 into 16 routing branches, and the 16 routing branches equally divide the RF signal received by the RF end 651 to 16 millimeter wave radiators 611. A phase shifter 654 is provided on at least one routing branch. Optionally, a phase shifter 654 is provided on each routing branch. By designing the length of the conductive routing corresponding to the phase shifter 654, the millimeter wave radiator 611 electrically connected to the phase shifter 654 has a corresponding phase, thereby realizing millimeter wave beam forming and millimeter wave beam scanning. For example, along the X-axis direction, the phase of each column of millimeter wave radiators 611 first increases and then decreases, or increases in sequence, or decreases in sequence, and so on.

[0084] Furthermore, a second matching circuit M2 is provided on each wiring branch, and the second matching circuit M2 is provided between the phase shifter 654 and the millimeter wave radiator 611 .

[0085] The second matching circuit M2 is used to adjust the impedance of the radiation path on the millimeter wave radiator 611 so that the impedance of the radiation path on the millimeter wave radiator 611 has a better match with the millimeter wave frequency band to generate a resonant mode of the required frequency band. And it has good radiation performance in the required frequency band. The present application does not limit the specific structure of the second matching circuit M2. Optionally, the second matching circuit M2 includes a circuit structure composed of multiple components such as capacitors, inductors and resistors.

[0086] In this embodiment, the power divider 653 and the phase shifter 654, the second matching circuit M2, the reference ground layer 680 and the millimeter wave radiator array 610 are formed on the camera decoration 120 together, so as to reduce the transmission path of the radio frequency signal and reduce the loss of the millimeter wave signal transmission; the power divider 653 and the phase shifter 654 are designed to be conductive traces, so that the power divider 653 and the phase shifter 654 can be conveniently arranged on the second dielectric layer 660, thereby reducing the difficulty of production.

[0087] In another embodiment, the power divider 653 is a conductive trace. The phase shifter 654 is an electronic device. The feed network 650 also includes a phase shifter 654 control chip electrically connected to a plurality of the phase shifters 654. The phase shifter 654 control chip is used to control the plurality of phase shifters 654 to change the phase of the electrically connected millimeter wave radiator 611, so as to control the millimeter wave radiator array 610 to have a corresponding phase, thereby realizing millimeter wave beam forming and millimeter wave beam scanning. For example, along the X-axis direction, the phase of each column of millimeter wave radiators 611 increases first and then decreases, or increases in sequence, or decreases in sequence, and so on.

[0088] In this embodiment, the power divider 653 and the phase shifter 654, the second matching circuit M2, the reference ground layer 680 and the millimeter wave radiator array 610 are formed on the camera decoration 120 together, so as to reduce the transmission path of the radio frequency signal and reduce the loss of the millimeter wave signal transmission; the power divider 653 is designed as a conductive trace, and the phase shifter 654 is designed as an electronic device, and the phase shifter 654 control chip controls multiple phase shifters 654 to change the phase of the electrically connected millimeter wave radiator 611, so as to control the millimeter wave radiator array 610 to have a corresponding phase, thereby realizing millimeter wave beam forming and millimeter wave beam scanning, so as to reduce the space occupied by the phase shifter 654.

[0089] The conductive plate 110 is the camera decoration 120. The camera decoration 120 includes a light-transmitting portion 121 and a light-shielding portion 122. The light-transmitting portion 121 is used to transmit light to the camera module 800 of the electronic device 1000.

[0090] The millimeter wave radiator array 610, the first dielectric layer 630, the reference stratum 680, the second dielectric layer 660, and the feeding network 650 are all disposed in the light shielding portion 122 to prevent the millimeter wave radiator array 610, the first dielectric layer 630, the reference stratum 680, the second dielectric layer 660, and the feeding network 650 from being blocked in the light-transmitting portion 121 to affect the shooting quality of the camera module 800. The conductive material in this embodiment can be a metal material, such as copper metal, silver metal, etc.

[0091] For optional reference, see Fig.14 The material of the millimeter wave radiator array 610 is a light-transmitting (having a high transmittance to visible light) conductive material, for example, a transparent conductive oxide, indium tin oxide (ITO). In this embodiment, the millimeter wave radiator array 610 is disposed in the light-transmitting portion 121, so that the millimeter wave radiator 611 and the Sub 6G radiator 510 can be spaced apart, and the millimeter wave radiator array 610 can be prevented from affecting the shooting of the camera module 800.

[0092] For further information, see Fig.14 The reference ground layer 680 is also a light-transmitting (having a high transmittance to visible light) conductive material, such as indium tin oxide (ITO). The first dielectric layer 630 is also a light-transmitting (having a high transmittance to visible light) material. The millimeter wave radiator array 610, the first dielectric layer 630, and the reference ground layer 680 can form a film layer 670 that is integrally attached to the inner surface of the light-transmitting portion 121 of the camera decorative element 120 facing the inside of the housing 100. At the same time, since the ITO material has the characteristics of high visible light transmittance, high infrared reflectivity, and high ultraviolet blocking rate, the film layer 670 formed by the reference stratum 680 + the first dielectric layer 630 + the millimeter wave radiator array 610 is attached to the surface of the light-transmitting portion 121 of the camera decorative component 120, and can also be used as a film layer for filtering infrared light and a film layer for blocking ultraviolet light, so that the film layer 670 formed by the reference stratum 680 + the first dielectric layer 630 + the millimeter wave radiator array 610 can reuse the space on the camera decorative component 120, and reuse it as the infrared filter layer and ultraviolet blocking layer of the camera module 800, so there is no need to additionally set an infrared filter layer and an ultraviolet blocking layer in the camera module 800, thereby reducing the number of components and saving space and cost.

[0093] In other embodiments, see Fig.15 The reference layer 680 and the millimeter wave radiator array 610 are both made of transparent (high transmittance to visible light) conductive materials, such as transparent conductive oxide, indium tin oxide (ITO). Generally, the transparent portion 121 is a transparent cover plate, and the material of the transparent portion 121 is an insulating material. The reference stratum 680 and the millimeter wave radiator array 610 are respectively arranged on opposite sides of the light-transmitting portion 121. For example, the millimeter wave radiator array 610 is formed on the outer surface of the light-transmitting portion 121 facing outward, and the reference stratum 680 is formed on the inner surface of the light-transmitting portion 121 facing inward. With such a design, there is no need to additionally set up a first dielectric layer 630, and the light-transmitting portion 121 is reused as the first dielectric layer 630. The film layer formed by the reference stratum 680 or the millimeter wave radiator array 610 can also be used as a film layer for filtering infrared light and a film layer for blocking ultraviolet light, so that the film layer formed by the reference stratum 680+first dielectric layer 630+millimeter wave radiator array 610 reuses the space on the camera decorative part 120, and is reused as the infrared filter layer and ultraviolet light blocking layer of the camera module 800. There is no need to additionally set up an infrared filter layer and an ultraviolet light blocking layer in the camera module 800, thereby reducing the number of components, saving space and cost.

[0094] In the above embodiments, the feeding network 650 can be arranged at the location of the shading portion 122, and the material of the feed line 640 of the feeding network 650 electrically connected to the millimeter wave radiator 611 can also be a light-transmitting (having a high transmittance to visible light) conductive material, such as indium tin oxide (ITO), to reduce the length of the RF line and reduce losses.

[0095] In another embodiment, see Fig.16 The camera decoration 120 is attached to the back cover 400, and the camera decoration 120 has a light-transmitting portion 121 therein for transmitting light to the camera module 800. In this embodiment, the back cover 400 may be a light-transmitting cover plate without a through-hole design. The camera decoration 120 may be disposed on the back cover 400 by LDS, FPC, printing technology, and other processes.

[0096] The present application does not specifically limit the molding method of the millimeter wave radiator array 610 , the reference ground layer 680 and the feeding network 650 of the millimeter wave array antenna assembly 600 in the camera decoration 120 .

[0097] Optionally, a reference stratum 680 and hollow areas on the outside and inside of the reference stratum 680 are etched on the camera decoration 120, a first dielectric layer 630 is formed in the hollow area on the outside of the reference stratum 680, and a millimeter wave radiator array 610 is formed on the first dielectric layer 630; a second dielectric layer 660 is formed in the hollow area on the inside of the reference stratum 680, a feeding network 650 is formed on the second dielectric layer 660, and a feed line 640 is provided that passes through the reference stratum 680 and the first dielectric layer 630.

[0098] In this embodiment, a reference ground layer 680 is directly etched on the camera decoration 120 to realize the integration of the camera decoration 120 with the millimeter wave radiator array 610, the first dielectric layer 630, the reference ground layer 680, the second dielectric layer 660, and the feeding network 650, and to achieve a tight and firm connection.

[0099] Optionally, the millimeter wave radiator array 610, the reference ground layer 680, the feeding network 650, the first dielectric layer 630, the second dielectric layer 660, the feed line 640, etc. are formed into a millimeter wave module, and the millimeter wave module is attached to the non-conductive area on the camera decoration 120 or fixed to the hollow area on the camera decoration 120.

[0100] In this embodiment, the modular millimeter wave radiator array 610 is disposed on the camera decoration 120. The modular millimeter wave radiator array 610 can be mass-produced, which simplifies costs and improves efficiency.

[0101] The present application does not specifically limit the position of the millimeter wave radiator array 610. Optionally, the millimeter wave radiator array 610 may be located in a current weak region of the Sub 6GHz radiator 510 in the target resonance mode, thereby further avoiding mutual influence between the millimeter wave array antenna assembly 600 and the Sub 6GHz antenna assembly, and being able to support both the millimeter wave frequency band and the Sub 6GHz frequency band.

[0102] See also Fig.17 , Fig.17 It is the S parameter curve of the operation of the Sub 6GHz antenna assembly and the millimeter wave array antenna assembly provided in the embodiment of the present application. Since the frequency band difference between the millimeter wave band and the Sub 6GHz band is large, the two can work at the same time without affecting each other, so the electronic device 1000 provided in the present application can realize the reuse between the millimeter wave array antenna assembly 600 and the Sub6GHz antenna assembly and the camera decoration 120, and can also support the millimeter wave band and the Sub6GHz band at the same time.

[0103] Further, the current weak zone of the Sub 6G radiator 510 in the target resonance mode is located in an area away from the feeding point A to the first edge point B and close to the edge, or an area away from the feeding point A, away from the grounding point C to the second edge point D and close to the edge.

[0104] Generally, in order to realize the millimeter wave communication capability of the electronic device 1000, an independent millimeter wave antenna module is generally used, and a separate Sub 6GHz antenna needs to be designed for wireless communication in the Sub 6GHz frequency band, which is costly and occupies a relatively large space. The present application utilizes the metal camera decorative part 120 of the electronic device 1000 as the radiator of the millimeter wave array antenna assembly 600 and the radiator of the Sub 6GHz antenna assembly, saving cost and space.

[0105] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present application, and these improvements and modifications are also regarded as the scope of protection of the present application.

Claims

1. An electronic device, characterized in that: include: A housing including a conductive plate; A Sub 6G antenna assembly, the Sub 6G antenna assembly comprising a Sub 6G radiator and a Sub 6G signal source, the Sub 6G radiator being all or part of the conductive plate, the Sub 6G signal source being disposed in the housing, the Sub 6G signal source being electrically connected to the Sub 6G radiator, and being used to excite the Sub 6G radiator to form a target resonance mode supporting a Sub 6G frequency band; and A millimeter wave array antenna assembly, the millimeter wave array antenna assembly comprising a millimeter wave radiator array and a millimeter wave signal source, the millimeter wave radiator array being arranged on the Sub 6G radiator, the millimeter wave radiator array being spaced apart from the Sub6G radiator, the millimeter wave signal source being electrically connected to the millimeter wave radiator array for stimulating the millimeter wave radiator array to support the millimeter wave frequency band.

2. The electronic device according to claim 1, wherein: The Sub 6G radiator also includes a feeding point, which is electrically connected to the Sub 6G signal source. The point on the edge of the Sub 6G radiator that is farthest from the feeding point is a first edge point. The resonant current of the target resonant mode is distributed between the feeding point and the first edge point. The target resonant mode includes a 1 / 4 wavelength mode that supports the Sub 6G frequency band.

3. The electronic device according to claim 2, characterized in that: The electrical length between the feeding point and the first edge point is greater than or equal to 0.25 times the wavelength of the Sub 6G frequency band, and the Sub 6G signal source is directly fed to the feeding point.

4. The electronic device according to claim 2, characterized in that: The electrical length between the feeding point and the first edge point is less than 0.25 times the wavelength of the Sub 6G frequency band, and the Sub 6G signal source is capacitively fed to the feeding point.

5. The electronic device according to claim 1, wherein: The Sub 6G radiator also includes a feeding point and a grounding point, the grounding point and the feeding point are spaced apart, the point on the edge of the Sub 6G radiator that is farthest from the grounding point is a second edge point, the resonant current of the target resonant mode is distributed between the grounding point and the second edge point, and the target resonant mode includes a 1 / 4 wavelength mode that supports the Sub 6G frequency band.

6. The electronic device according to any one of claims 1 to 5, characterized in that: The millimeter wave array antenna assembly also includes a reference ground layer, a first dielectric layer and a plurality of feeder lines. The millimeter wave radiator array, the first dielectric layer and the reference ground layer are stacked in sequence. One end of each feeder line is used to electrically connect to the feeding end of the millimeter wave array antenna assembly, and the other end of each feeder line passes through the reference ground layer, the first dielectric layer and is electrically connected to a millimeter wave radiator in the millimeter wave radiator array.

7. The electronic device according to claim 6, characterized in that: The millimeter wave array antenna assembly also includes a feeding network and a second dielectric layer. The feeding network, the second dielectric layer, the reference ground layer, the first dielectric layer and the millimeter wave radiator array are stacked in sequence. The feeding network includes a radio frequency end and multiple feeding ends. Each feed line is electrically connected to one feeding end. The radio frequency end is used to electrically connect to the millimeter wave signal source arranged in the shell through a conductive spring or a radio frequency connecting line.

8. The electronic device according to claim 7, characterized in that: The feeding network includes a power divider, a plurality of phase shifters and a plurality of matching circuits electrically connected in sequence, the end of the power divider away from the phase shifter is the radio frequency end, and the end of the matching circuit away from the phase shifter is one of the feeding ends.

9. The electronic device according to claim 8, characterized in that: The power divider and the phase shifter are both conductive traces.

10. The electronic device according to claim 8, characterized in that: The power divider is a conductive trace, the phase shifter is an electronic device, and the feeding network also includes a phase shifter control chip electrically connected to multiple phase shifters, and the phase shifter control chip is used to control the multiple phase shifters to change the phase of the electrically connected millimeter wave radiator.

11. The electronic device according to claim 6, characterized in that: The reference ground layer and the Sub 6G radiator are interconnected as a whole.

12. The electronic device according to any one of claims 1 to 5 and 7 to 11, characterized in that: The conductive plate is a camera decoration on the shell or a conductive back cover on the shell.

13. The electronic device according to claim 12, characterized in that: The conductive plate is the camera decoration, and the camera decoration includes a light-transmitting portion and a light-shielding portion, and the light-transmitting portion is used to transmit light to the camera of the electronic device; the millimeter-wave radiator array is arranged in the light-shielding portion; or, the material of the millimeter-wave radiator array is a light-transmitting material, and the millimeter-wave radiator array is arranged in the light-transmitting portion.

Images