Vibration device and oscillator

Abstract

The invention provides a resonator device and an oscillator with excellent G sensitivity characteristics. The resonator device includes: a resonator element formed of an SC cut quartz substrate, the SC cut quartz substrate has a plane perpendicular to the Y ''axis of an orthogonal coordinate system (X ', Y' ', Z') obtained by rotating a prescribed angle about the X axis of the orthogonal coordinate system (X, Y, Z) and rotating a prescribed angle about the Z 'axis of a new orthogonal coordinate system (X, Y', Z ') obtained by the rotation. The resonator element includes a support portion provided at one end, an excitation portion having an excitation electrode disposed on a surface thereof, and a slit at least partially provided between the support portion and the excitation electrode. And a substrate on which the support part of the resonator element is mounted, the angle psi formed by the X'axis and an imaginary line passing through the center of the support part and the center of the excitation electrode in plan view being 30-65 DEG, or-150 DEG to-125 DEG, the angle psi being between the X 'axis and an imaginary line passing through the center of the support part and the center of the excitation electrode.

Description

Technical Field

[0001] The present invention relates to a vibration device and an oscillator. Background Art

[0002] For example, Patent Document 1 discloses a quartz oscillator that is fixed in a container by arranging two fixing parts on any one of the first side along the X' axis and the second side along the Z' axis of a twice-rotated quartz plate. In the quartz oscillator, the positions of the two fixing parts are offset to the left end side of one side, and an angle ω formed by a line segment connecting the center of the excitation electrode and the center between the two fixing parts and the other side of the first and second sides is defined. When one side is the first side, the range of the angle ω is set to 7.9° to 20.4°, and when one side is the second side, the range of the angle ω is set to 2.7° to 15°, thereby reducing the frequency change rate caused by temperature.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2021-78062

[0004] However, the crystal resonator described in Patent Document 1 improves temperature characteristics by alleviating support stress caused by temperature changes, but has a problem in that G sensitivity is not taken into consideration. Summary of the invention

[0005] A vibration device comprises: a vibration plate, which is composed of an SC-cut quartz substrate, the SC-cut quartz substrate having a surface perpendicular to the Y" axis of an orthogonal coordinate system (X', Y", Z'), the orthogonal coordinate system (X', Y", Z') being obtained by rotating a specified angle around the X axis of the orthogonal coordinate system (X, Y, Z) and rotating a specified angle around the Z' axis of a new orthogonal coordinate system (X, Y', Z') obtained by the rotation, and when viewed from above, the vibration plate has a support portion arranged at one end, an excitation portion on which an excitation electrode is arranged on the surface, and a gap at least partially arranged between the support portion and the excitation electrode; and a substrate, on which the support portion of the vibration plate is mounted, and when viewed from above, an angle formed by an imaginary line passing through the center of the support portion and the center of the excitation electrode and the X' axis is greater than 30° and less than 65°, or greater than -150° and less than -125°.

[0006] An oscillator includes: the above-mentioned vibration device; and an oscillation circuit connected to the excitation electrode to excite the excitation portion, wherein the oscillation circuit is provided on the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a plan view showing a schematic structure of the vibration device according to the first embodiment.

[0008] Figure 2 yes Figure 1 Cross-sectional view at line A1-A1.

[0009] Figure 3 It is a plan view showing a schematic structure of a vibrating element included in the vibrating device according to the first embodiment.

[0010] Figure 4 1 is a plan view illustrating an angle Ψ which is an in-plane rotation angle of the vibrating element.

[0011] Figure 5 2 is a diagram showing the G sensitivity with respect to the angle Ψ which is the in-plane rotation angle of the vibrator element.

[0012] Figure 6 It is a plan view showing a schematic structure of a vibration device according to a second embodiment.

[0013] Figure 7 yes Figure 6 Cross-sectional view at line A2-A2.

[0014] Figure 8 It is a plan view showing a schematic structure of a vibrator element included in the vibrator device according to the third embodiment.

[0015] Fig. 9 It is a plan view showing Modification 1 of the resonator element included in the resonator device according to the third embodiment.

[0016] Fig.10 It is a plan view showing a schematic structure of a vibrator element included in the vibrator device according to the fourth embodiment.

[0017] Fig.11 It is a plan view showing Modification 1 of the resonator element included in the resonator device according to the fourth embodiment.

[0018] Fig.12 It is a plan view showing Modification 2 of the resonator element included in the resonator device according to the fourth embodiment.

[0019] Fig.13 It is a plan view showing a schematic structure of a vibrator element included in the vibrator device according to the fifth embodiment.

[0020] Fig.14 It is a plan view showing Modification 1 of the resonator element included in the resonator device according to the fifth embodiment.

[0021] Fig.15 It is a plan view showing Modification 2 of the resonator element included in the resonator device according to the fifth embodiment.

[0022] Fig.16 It is a plan view showing Modification 3 of the resonator element included in the resonator device according to the fifth embodiment.

[0023] Fig.17 It is a plan view showing Modification 4 of the resonator element included in the resonator device according to the fifth embodiment.

[0024] Fig.18 It is a plan view showing a schematic structure of a resonator element included in the resonator device according to the sixth embodiment.

[0025] Fig.19 It is a plan view showing Modification 1 of the resonator element included in the resonator device according to the sixth embodiment.

[0026] Fig. 20 It is a plan view schematically showing the structure of an oscillator according to the seventh embodiment.

[0027] Fig.21 yes Fig. 20 A cross-sectional view taken along the A3-A3 line.

[0028] Description of symbols

[0029] 1, 1a: vibration device; 2: oscillator; 3, 3a, 3b, 3c, 3d, 3e: vibration piece; 5: surface; 10: substrate; 11: first electrode pad; 12: second electrode pad; 13: third surface; 14: fourth surface; 15: external terminal; 20: cover; 21: recess; 22: storage space; 25: bonding component; 30: vibration substrate; 31: first surface; 32: second surface; 33: excitation part; 34: support part; 35: gap; 36: excitation electrode; 37: lead electrode; 38: side electrode; 39: first connecting electrode; 40: second connecting electrode; 41, 42: conductive bonding component; 50: imaginary line; 51, 52: center; 60: oscillation circuit; L1, L2: length; Ψ: angle. DETAILED DESCRIPTION

[0030] 1. First Implementation

[0031] First, regarding the vibration device 1 of the first embodiment, a vibration device in which the vibration piece 3 is accommodated in the substrate 10 and the cover 20 is taken as an example. Figure 1 , Figure 2 and Figure 3 In addition, Figure 1 In order to facilitate the description of the internal structure of the vibration device 1, a state in which the cover 20 is removed is shown.

[0032] In addition, for the sake of convenience, in the following drawings of the vibration devices 1, 1a and the oscillator 2, the X-axis, Y-axis and Z-axis are shown as three axes perpendicular to each other. In addition, the direction along the X-axis is called "X direction", the direction along the Y-axis is called "Y direction", and the direction along the Z-axis is called "Z direction". In addition, the front end side of the arrow in each axis direction is also called "positive side", and the base end side is called "negative side".

[0033] In addition, for the sake of convenience of explanation, in the subsequent figures of the vibration plate 3, vibration plate 3a, vibration plate 3b, vibration plate 3c, vibration plate 3d, and vibration plate 3e, the "X" axis, Y" axis, and Z" axis are illustrated as three mutually perpendicular crystal axes equivalent to the crystal axes of quartz. In addition, the direction along the "X" axis is called the "X" direction, the direction along the "Y" axis is called the "Y" direction, and the direction along the "Z" axis is called the "Z" direction. In addition, the front end side of the arrow in each axis direction is also called the "positive side", and the base end side is called the "negative side". In addition, the X-axis is consistent with the X" axis of the crystal axis, the Y-axis is consistent with the Z" axis of the crystal axis, and the Z-axis is consistent with the Y" axis of the crystal axis.

[0034] like Figure 1 and Figure 2 As shown, the vibration device 1 includes a substrate 10 , a cover 20 and a vibration piece 3 .

[0035] The substrate 10 has a third surface 13 and a fourth surface 14 in a front-back relationship, and the third surface 13 is opposite to the vibration piece 3. On the third surface 13, a first electrode pad 11 and a second electrode pad 12 for bonding the vibration piece 3 are arranged along the Y direction, and a plurality of external terminals 15 for supplying power and outputting frequencies are provided on the fourth surface 14. In addition, the first electrode pad 11 and the second electrode pad 12 are electrically connected to the external terminal 15 through wiring or through electrodes not shown. In addition, as a constituent material of the substrate 10, silicon is preferred, but glass, ceramics, etc. may also be used.

[0036] The cover 20 is provided with a recess 21 opened toward the substrate 10, and is bonded to the third surface 13 of the substrate 10 via a bonding member 25, and together with the substrate 10, forms a storage space 22 for storing the vibration piece 3. In addition, the cover 20 and the substrate 10 may be bonded directly without using the bonding member 25. In addition, the storage space 22 is in a reduced pressure state, preferably a state closer to a vacuum. As a result, the viscous resistance is reduced, and the oscillation characteristics of the vibration piece 3 are improved. In addition, as a constituent material of the cover 20, silicon is preferred, but glass, ceramics, etc. may also be used.

[0037] The vibrating element 3 includes a vibrating substrate 30 , an excitation electrode 36 , a first connection electrode 39 , and a second connection electrode 40 .

[0038] The vibration substrate 30 is an SC-cut quartz substrate. The SC-cut quartz substrate has mutually perpendicular crystal axes X, Y, and Z, where the X axis is called the electric axis, the Y axis is called the mechanical axis, and the Z axis is called the optical axis. It has a surface 5 perpendicular to the Y” axis of the orthogonal coordinate system (X', Y", Z'), which is obtained by rotating the X axis of the orthogonal coordinate system (X, Y, Z) to the left at a predetermined angle, for example, about 34°, and rotating the Z’ axis of the new orthogonal coordinate system (X, Y', Z') obtained by the rotation to the left at a predetermined angle, for example, about 22°. In addition, the vibration substrate 30 of the present embodiment has a new orthogonal coordinate system (X", Y", Z") obtained by rotating the Y” axis of the orthogonal coordinate system (X', Y", Z') to the left at a predetermined angle, for example, greater than 30° and less than 65°.

[0039] like Figure 3 As shown, the vibration substrate 30 is rectangular when viewed from above, with the X" direction as the long side direction, the Z" direction as the short side direction, and the Y" direction as the thickness direction. The surface 5 including the X" axis and the Z" axis perpendicular to the Y" axis is the main surface, and thickness shear vibration is excited on the main surface as the main vibration.

[0040] When viewed from above, the vibration substrate 30 includes: a support portion 34 provided at one end of one side of a rectangle; an excitation portion 33 having an excitation electrode 36 disposed on a surface 5; and a slit 35 at least part of which is provided between the support portion 34 and the excitation electrode 36. The support portion 34 is provided at the center of the longitudinal direction of one side, i.e., the Z" direction.

[0041] The surface 5 of the vibration substrate 30 has a first surface 31 and a second surface 32 in a front-back relationship, and the first surface 31 is opposite to the third surface 13 of the substrate 10. An excitation electrode 36, a first connection electrode 39, and a second connection electrode 40 are provided on the first surface 31, which is one surface 5 of the vibration substrate 30. The excitation electrode 36 is arranged in the excitation portion 33, and the first connection electrode 39 and the second connection electrode 40 are arranged in the support portion 34. The first connection electrode 39 and the second connection electrode 40 are arranged along one side, that is, the short side, of the vibration substrate 30. The excitation electrode 36 is provided on the second surface 32, which is the other surface 5 of the vibration substrate 30. In addition, when viewed from above, an imaginary line 50 passing through the center 52 of the support portion 34 and the center 51 of the excitation electrode 36 is along the X" axis.

[0042] The excitation electrode 36 provided on the first surface 31 is electrically connected to the first connection electrode 39 via the lead electrode 37. The excitation electrode 36 provided on the second surface 32 is electrically connected to the second connection electrode 40 provided on the first surface 31 via the lead electrode 37 and the side surface electrode 38 provided on the side surface on the negative side in the X direction of the vibration substrate 30. In addition, the excitation electrode 36 provided on the first surface 31 and the excitation electrode 36 provided on the second surface 32 are arranged so as to overlap when viewed from above.

[0043] The slit 35 penetrating from the first surface 31 to the second surface 32 is provided between the support portion 34 and the excitation electrode 36 , and can suppress deformation and stress associated with temperature changes caused by bonding the vibrator element 3 and the substrate 10 .

[0044] like Figure 1 and Figure 2 As shown, the support portion 34 of the vibrating piece 3 is bonded to the substrate 10 via the conductive bonding components 41 and 42. Specifically, the conductive bonding component 41 bonds and electrically connects the first connection electrode 39 arranged on the support portion 34 to the first electrode pad 11, and the conductive bonding component 42 bonds and electrically connects the second connection electrode 40 arranged on the support portion 34 to the second electrode pad 12. In addition, the constituent materials of the conductive bonding components 41 and 42 are metal bumps, solder, conductive adhesives, etc.

[0045] Next, refer to Figure 4 and Figure 5 The relationship between the G sensitivity and the angle Ψ, which is the in-plane rotation angle of the vibrator element 3 , will be described.

[0046] like Figure 4 As shown, the in-plane rotation angle Ψ of the vibrator element 3 refers to the angle between the imaginary line 50 passing through the center 52 of the support portion 34 and the center 51 of the excitation electrode 36 in a plan view and the X′ axis. Figure 5 The results of simulating the G sensitivity in each direction with respect to the in-plane rotation angle, that is, the angle Ψ, of the vibrating plate 3 are shown. The results are shown when the angle Ψ of left rotation about the Y" axis is set as positive and the angle Ψ of right rotation about the Y" axis is set as negative based on the X' axis. Figure 1 The G sensitivity in the X, Y, and Z directions of the vibration device 1 in FIG. 1 is a value obtained by taking the square root of the sum of the squares of the G sensitivities in the X, Y, and Z directions. The angle Ψ at which Γ is less than 1 ppb / G is 30° to 65° or -150° to -125°. Therefore, by setting the angle Ψ, which is the in-plane rotation angle of the vibration piece 3, to 30° to 65° or -150° to -125°, the G sensitivity in the X, Y, and Z directions can be made less than ±1 ppb / G, respectively.

[0047] As described above, in the vibration device 1 of the present embodiment, since the angle Ψ formed by the imaginary line 50 passing through the center 52 of the support portion 34 of the vibration piece 3 and the center 51 of the excitation electrode 36 and the X' axis is greater than 30° and less than 65°, or greater than -150° and less than -125°, the G sensitivity in the X direction, the Y direction, and the Z direction can be reduced to less than ±1ppb / G, respectively.

[0048] Furthermore, since the gap 35 is provided between the support portion 34 and the excitation electrode 36 , it is possible to suppress the frequency fluctuation and the degradation of the aging characteristics due to the influence of the support stress generated by the bonding between the vibrator element 3 and the substrate 10 .

[0049] 2. Second Implementation

[0050] Next, refer to Figure 6 and Figure 7 A vibration device 1a according to a second embodiment will be described. Figure 6 In order to facilitate the description of the internal structure of the vibration device 1a, the state in which the cover body 20 is removed is shown.

[0051] The resonator device 1a of this embodiment is the same as the resonator device 1 of the first embodiment except that the structure of the substrate 10a and the structure of the resonator plate 3a are different from the resonator device 1 of the first embodiment. The description will focus on the differences from the first embodiment, and the description of the same matters will be omitted.

[0052] like Figure 6 and Figure 7 As shown, the vibration device 1 a includes a substrate 10 a , a cover 20 , and a vibration piece 3 a .

[0053] The substrate 10a has first electrode pads 11a and second electrode pads 12a arranged side by side along the X direction, which is the longitudinal direction, on the third surface 13. A plurality of external terminals 15 for supplying power and outputting frequency are provided on the fourth surface 14.

[0054] The vibrating element 3 a includes a vibrating substrate 30 , an excitation electrode 36 , a first connection electrode 39 a , and a second connection electrode 40 a .

[0055] The vibration substrate 30 includes a support portion 34, an excitation portion 33, and a gap 35 provided between the support portion 34 and the excitation portion 33. The support portion 34 is provided at the center portion in the Z" direction which is the longitudinal direction of one side.

[0056] The surface 5 of the vibration substrate 30 has a first surface 31 and a second surface 32 in a front-back relationship, a first connection electrode 39a is provided on the first surface 31 as one surface 5 of the support portion 34, and a second connection electrode 40a is provided on the second surface 32 as the other surface 5 of the support portion 34. The first connection electrode 39a and the second connection electrode 40a overlap when viewed from above.

[0057] The excitation electrode 36 provided on the first surface 31 of the excitation portion 33 is electrically connected to the first connection electrode 39a via the lead electrode 37. The excitation electrode 36 provided on the second surface 32 of the excitation portion 33 is electrically connected to the second connection electrode 40a via the lead electrode 37.

[0058] The first connection electrode 39a is arranged at a position overlapping with the first electrode pad 11a provided on the substrate 10a and is bonded and electrically connected to the first electrode pad 11a via a conductive bonding member 41. The second connection electrode 40a is electrically connected to the second electrode pad 12a provided on the substrate 10a via a bonding wire 42a.

[0059] With such a structure, the vibrating piece 3 a can be supported at one point, and the influence of the supporting stress can be further reduced, thereby obtaining the same effect as that of the first embodiment.

[0060] 3. Third Implementation

[0061] Next, refer to Figure 8 The vibration piece 3b included in the vibration device of the third embodiment will be described. The vibration device of this embodiment is the same as the vibration device 1 of the first embodiment except that the structure of the vibration piece 3b is different. Figure 8 , a state in which the conductive bonding components 41 and 42 are arranged is illustrated.

[0062] The diaphragm 3b of this embodiment is the same as the diaphragm 3 of the first embodiment except that the shape of the slit 35b is different. The description will focus on the differences from the first embodiment, and the description of the same matters will be omitted.

[0063] like Figure 8 As shown, when viewed from above, the gap 35b of the vibration substrate 30b of the vibration piece 3b includes a first portion 61 extending along a first direction intersecting the imaginary line 50. In addition, the first direction of the present embodiment is the Z" direction. The length L2 of the first portion 61 in the direction perpendicular to the imaginary line 50, i.e., the Z" direction, is longer than the length L1 of the support portion 34 in the perpendicular direction.

[0064] With such a structure, the slit 35 b is longer than the support portion 34 , so that the influence of the support stress can be further reduced, and the same effect as that of the first embodiment can be obtained.

[0065] 3.1. Modification 1 of the Third Embodiment

[0066] Next, refer to Fig. 9 A modification 1 of the vibration piece 3b included in the vibration device of the third embodiment will be described. Fig. 9 , a state in which the conductive bonding components 41 and 42 are arranged is illustrated.

[0067] The diaphragm 13b of this modification 1 is the same as the diaphragm 3b of the third embodiment except that the shape of the slit 135b is different. The description will focus on the differences from the third embodiment, and the description of the same matters will be omitted.

[0068] like Fig. 9 As shown, the first direction in which the slit 135b of the vibration substrate 130b of the vibration piece 13b extends is inclined relative to the Z" direction. In addition, the length L2 of the first portion 61 in the Z" direction is longer than the length L1 of the support portion 34 in the Z" direction.

[0069] By adopting such a structure, it is possible to obtain the same effects as those of the third embodiment.

[0070] 4. Fourth Implementation

[0071] Next, refer to Fig.10 The vibration piece 3c included in the vibration device of the fourth embodiment is described. The vibration device of this embodiment is the same as the vibration device 1 of the first embodiment except that the structure of the vibration piece 3c is different. Fig.10 , a state in which the conductive bonding components 41 and 42 are arranged is illustrated.

[0072] The diaphragm 3c of this embodiment is the same as the diaphragm 3 of the first embodiment except that the shape of the slit 35c is different. The description will focus on the differences from the first embodiment, and the description of the same matters will be omitted.

[0073] like Fig.10 As shown, when viewed from above, the slit 35c of the vibration substrate 30c of the vibration piece 3c includes: a first portion 61 extending along a first direction intersecting the imaginary line 50; and a second portion 62 connected to the first portion 61 and extending along a second direction in which the support portion 34 and the excitation electrode 36 are arranged. In addition, the first direction of this embodiment is the Z" direction, and the second direction is the X" direction.

[0074] With such a structure, the slit 35 c includes the second portion 62 along the second direction, so that the influence of the support stress can be further reduced, and the same effect as that of the first embodiment can be obtained.

[0075] 4.1. Modification 1 of the Fourth Embodiment

[0076] Next, refer to Fig.11 A modification 1 of the vibrating piece 3c included in the vibrating device according to the fourth embodiment will be described. Fig.11 , a state in which the conductive bonding components 41 and 42 are arranged is illustrated.

[0077] The diaphragm 13c of this modification 1 is the same as the diaphragm 3c of the fourth embodiment except that the shape of the slit 135c is different. The description will focus on the differences from the fourth embodiment, and the description of the same matters will be omitted.

[0078] like Fig.11 As shown, when viewed from above, the slit 135c of the vibration substrate 130c of the vibration piece 13c includes: a first portion 161 extending along a first direction intersecting the imaginary line 50; and two second portions 162 connected to both ends of the first portion 161 in the first direction, extending along the second direction in which the support portion 34 and the excitation electrode 36 are arranged. In addition, the first direction of this embodiment is the Z" direction, and the second direction is the X" direction.

[0079] By adopting such a structure, it is possible to obtain the same effects as those of the fourth embodiment.

[0080] 4.2. Modification 2 of the Fourth Embodiment

[0081] Next, refer to Fig.12 A second modification of the vibrating piece 3c included in the vibrating device of the fourth embodiment will be described. Fig.12 , a state in which the conductive bonding components 41 and 42 are arranged is illustrated.

[0082] The diaphragm 23c of this modification 2 is the same as the diaphragm 3c of the fourth embodiment except that the shape of the slit 235c is different. The description will focus on the differences from the fourth embodiment, and the description of the same matters will be omitted.

[0083] like Fig.12As shown, when viewed from above, the slit 235c of the vibration substrate 230c of the vibration piece 23c includes: a first portion 261 extending along a first direction intersecting the imaginary line 50; and two second portions 262 connected to both ends of the first portion 261 in the first direction, extending along the second direction in which the support portion 34 and the excitation electrode 36 are arranged. In addition, the first direction of this embodiment is the Z" direction, and the second direction is the X" direction.

[0084] By adopting such a structure, it is possible to obtain the same effects as those of the fourth embodiment.

[0085] 5. Fifth Implementation

[0086] Next, refer to Fig.13 The vibration piece 3d included in the vibration device of the fifth embodiment will be described. The vibration device of this embodiment is the same as the vibration device 1 of the first embodiment except that the structure of the vibration piece 3d is different. Fig.13 , a state in which the conductive bonding components 41 and 42 are arranged is illustrated.

[0087] The diaphragm 3d of this embodiment is the same as the diaphragm 3 of the first embodiment except that the shape of the slit 35d is different from that of the first embodiment. The description will focus on the differences from the first embodiment, and the description of the same matters will be omitted.

[0088] like Fig.13 As shown, when the vibration substrate 30d of the vibration piece 3d is viewed from above, the gap 35d includes: a first portion 61d, which extends along a first direction intersecting the imaginary line 50; and a second portion 62d, which is connected to the first portion 61d and is arranged on the support portion 34 side than the first portion 61d. In addition, the first direction of this embodiment is the Z" direction.

[0089] With such a structure, the slit 35d includes the second portion 62d provided on the support portion 34 side relative to the first portion 61d. Therefore, the influence of the support stress can be further reduced, and the same effect as that of the first embodiment can be obtained.

[0090] 5.1. Modification 1 of the Fifth Embodiment

[0091] Next, refer to Fig.14 A modification 1 of the vibrating piece 3d included in the vibrating device of the fifth embodiment will be described. Fig.14 , a state in which the conductive bonding components 41 and 42 are arranged is illustrated.

[0092] The diaphragm 13d of the present modification 1 is the same as the diaphragm 3d of the fifth embodiment except that the shape of the slit 135d is different from that of the fifth embodiment. The description will focus on the differences from the fifth embodiment described above, and the description of the same matters will be omitted.

[0093] like Fig.14 As shown, when the vibration substrate 130d of the vibration plate 13d is viewed from above, the gap 135d includes: a first portion 161d extending along a first direction intersecting the imaginary line 50; and two second portions 162d connected to both ends of the first portion 161d in the first direction and arranged on the side closer to the support portion 34 than the first portion 161d. In addition, the first direction of the present embodiment is the Z" direction, and the second direction is the X" direction.

[0094] By adopting such a structure, it is possible to obtain the same effects as those of the fifth embodiment.

[0095] 5.2. Modification 2 of the Fifth Embodiment

[0096] Next, refer to Fig.15 A modification 2 of the vibrating piece 3d included in the vibrating device of the fifth embodiment will be described. Fig.15 , a state in which the conductive bonding components 41 and 42 are arranged is illustrated.

[0097] The diaphragm 23d of this modification 2 is the same as the diaphragm 3d of the fifth embodiment except that the shape of the slit 235d is different from that of the fifth embodiment. The description will focus on the differences from the fifth embodiment described above, and the description of the same matters will be omitted.

[0098] like Fig.15 As shown, when the vibration substrate 230d of the vibration piece 23d is viewed from above, the gap 235d includes: a first portion 261d extending along a first direction intersecting the imaginary line 50; and two second portions 262d, which are connected to the first portion 261d at a position closer to the imaginary line 50 than the two ends of the first direction, and are arranged at a position closer to the support portion 34 than the first portion 261d. In addition, the first direction of this embodiment is the Z" direction.

[0099] By adopting such a structure, it is possible to obtain the same effects as those of the fifth embodiment.

[0100] 5.3. Modification 3 of the Fifth Embodiment

[0101] Next, refer to Fig.16 A modification 3 of the vibration piece 3d included in the vibration device of the fifth embodiment will be described. Fig.16, a state in which the conductive bonding components 41 and 42 are arranged is illustrated.

[0102] The diaphragm 33d of Modification 3 is the same as the diaphragm 3d of the fifth embodiment except that the shape of the slit 335d is different from that of the fifth embodiment. The description will focus on the differences from the fifth embodiment, and the description of the same matters will be omitted.

[0103] like Fig.16 As shown, when the vibration substrate 330d of the vibration piece 33d is viewed from above, the gap 335d includes: a first portion 361d, which extends along the first direction intersecting the imaginary line 50; and two second portions 362d, which are connected to the first portion 361d at a position closer to the imaginary line 50 than the two ends in the first direction, and are arranged on the support portion 34 side than the first portion 361d. In addition, the second portion 362d connected to the positive side of the first direction has a fourth portion 64 extending in the negative direction of the first direction at the end of the second portion 362d, and the second portion 362d connected to the negative side of the first direction has a fourth portion 64 extending in the positive direction of the first direction at the end of the second portion 362d. In addition, the first direction of the present embodiment is the Z" direction.

[0104] By adopting such a structure, it is possible to obtain the same effects as those of the fifth embodiment.

[0105] 5.4. Modification 4 of the Fifth Embodiment

[0106] Next, refer to Fig.17 A modification 4 of the vibrating piece 3d included in the vibrating device of the fifth embodiment will be described. Fig.17 , a state in which the conductive bonding components 41 and 42 are arranged is illustrated.

[0107] The diaphragm 43d of this modification 4 is the same as the diaphragm 3d of the fifth embodiment except that the shape of the slit 435d is different from that of the fifth embodiment. The description will focus on the differences from the fifth embodiment described above, and the description of the same matters will be omitted.

[0108] like Fig.17 As shown, when the vibration substrate 430d of the vibration piece 43d is viewed from above, the gap 435d includes: a first portion 461d extending along the first direction intersecting the imaginary line 50; and two second portions 462d connected to both ends of the first portion 461d in the first direction and arranged at a position closer to the support portion 34 than the first portion 461d. In addition, the interval between the two second portions 462d widens as they extend in the negative direction of the second direction. In addition, the first direction of this embodiment is the Z" direction, and the second direction is the X" direction.

[0109] By adopting such a structure, it is possible to obtain the same effects as those of the fifth embodiment.

[0110] 6. Sixth Implementation

[0111] Next, refer to Fig.18 The vibration piece 3e included in the vibration device of the sixth embodiment will be described. The vibration device of this embodiment is the same as the vibration device 1 of the first embodiment except that the vibration piece 3e is different. Fig.18 , a state in which the conductive bonding components 41 and 42 are arranged is illustrated.

[0112] The diaphragm 3e of this embodiment is the same as the diaphragm 3 of the first embodiment except that the shape of the slit 35e is different. The description will focus on the differences from the first embodiment, and the description of the same matters will be omitted.

[0113] like Fig.18 As shown, when the vibration substrate 30e of the vibration piece 3e is viewed from above, the gap 35e includes: a first portion 61e extending along a first direction intersecting the imaginary line 50; two second portions 62e connected to both ends of the first portion 61e in the first direction, extending along the second direction in which the support portion 34 and the excitation electrode 36 are arranged; and a third portion 63e connected to the first portion 61e and arranged between the first connection electrode 39 and the second connection electrode 40. In addition, the first direction of the present embodiment is the Z" direction, and the second direction is the X" direction.

[0114] With such a structure, the slit 35e includes the third portion 63e disposed between the first connection electrode 39 and the second connection electrode 40. Therefore, the two connection electrodes 39 and 40 are divided, and the influence of the support stress can be further reduced, thereby achieving the same effect as the first embodiment.

[0115] 6.1. Modification 1 of the Sixth Embodiment

[0116] Next, refer to Fig.19 A modification example of the vibrating piece 3e included in the vibrating device of the sixth embodiment will be described. Fig.19 , a state in which the conductive bonding components 41 and 42 are arranged is illustrated.

[0117] The diaphragm 13e of this modification 1 is the same as the diaphragm 3e of the sixth embodiment except that the shape of the slit 135e is different. The description will focus on the differences from the sixth embodiment, and the description of the same matters will be omitted.

[0118] like Fig.19 As shown, when the vibration substrate 130e of the vibration piece 13e is viewed from above, the gap 135e includes: a first portion 161e, which extends along a first direction intersecting the imaginary line 50; two second portions 162e, which are connected to the two ends of the first portion 161e in the first direction and are arranged at a position closer to the support portion 34 than the first portion 161e; and a third portion 163e, which is connected to the first portion 161e and is arranged between the first connecting electrode 39 and the second connecting electrode 40. In addition, the first direction of the present embodiment is the Z" direction.

[0119] By adopting such a structure, it is possible to obtain the same effects as those of the sixth embodiment.

[0120] 7. Seventh Implementation Method

[0121] Next, regarding the oscillator 2 of the seventh embodiment, a crystal oscillator having the above-mentioned vibrating piece 3 is cited as an example, and reference is made to Fig. 20 and Fig.21 In addition, Fig. 20 In order to facilitate the description of the internal structure of the oscillator 2, the state in which the cover 20 is removed is shown.

[0122] like Fig. 20 and Fig.21 As shown, the oscillator 2 includes a substrate 10 , a cover 20 , a vibration piece 3 and an oscillation circuit 60 .

[0123] The structure of the oscillator 2 is substantially the same as that of the resonator device 1 of the first embodiment, and an oscillation circuit 60 is provided on the substrate 10. The oscillation circuit 60 is electrically connected to the excitation electrode 36 provided on the resonator element 3, and can excite the excitation portion 33 of the resonator element 3.

[0124] As described above, since the oscillator 2 of this embodiment uses a vibrating piece 3 in which the angle Ψ formed by the imaginary line 50 passing through the center 52 of the support portion 34 of the vibrating piece 3 and the center 51 of the excitation electrode 36 and the X' axis is greater than 30° and less than 65°, or greater than -150° and less than -125°, the G sensitivity in the X direction, the Y direction, and the Z direction can be reduced to less than ±1ppb / G, respectively.

[0125] Furthermore, since the resonator element 3 having the gap 35 between the support portion 34 and the excitation electrode 36 is used, it is possible to suppress frequency fluctuation and degradation of aging characteristics due to the influence of support stress generated by bonding the resonator element 3 to the substrate 10 .

Claims

1. A vibration device, comprising: A vibration piece, which is composed of an SC-cut quartz substrate, the SC-cut quartz substrate having a surface perpendicular to the Y" axis of an orthogonal coordinate system (X', Y", Z'), the orthogonal coordinate system (X', Y", Z') being obtained by rotating a predetermined angle around the X axis of the orthogonal coordinate system (X, Y, Z) and rotating a predetermined angle around the Z' axis of a new orthogonal coordinate system (X, Y', Z') obtained by the rotation, and when viewed from above, the vibration piece has a support portion provided at one end, an excitation portion having an excitation electrode arranged on the surface, and a gap at least partially provided between the support portion and the excitation electrode; and a substrate on which the support portion of the vibrating piece is mounted, In a plan view, an angle formed by an imaginary line passing through the center of the support portion and the center of the excitation electrode and the X′ axis is greater than or equal to 30° and less than or equal to 65°, or greater than or equal to −150° and less than or equal to −125°.

2. The vibration device according to claim 1, wherein: The support portion includes a first connection electrode and a second connection electrode disposed on one surface of the vibrating piece. The first connection electrode and the second connection electrode are arranged along one side of the vibration piece.

3. The vibration device according to claim 1, wherein The support portion comprises: A first connecting electrode is disposed on one surface of the vibrating piece; and a second connecting electrode disposed on the other surface on the opposite side of one of the surfaces; The first connection electrode overlaps with the second connection electrode in a plan view.

4. The vibration device according to claim 1, wherein When viewed from above, the vibrating plate is rectangular. The one end portion includes a side of the rectangle, The support portion is provided at a center portion in the longitudinal direction of the one side.

5. The vibration device according to any one of claims 1 to 4, wherein: When viewed from above, the gap includes a first portion extending along a first direction intersecting the imaginary line, The length of the first portion in a direction perpendicular to the imaginary line is longer than the length of the support portion in the perpendicular direction.

6. The vibration device according to claim 5, wherein: The gap further includes a second portion, which is connected to the first portion and is along a second direction, and the second direction is a direction in which the support portion and the excitation electrode are arranged.

7. The vibration device according to claim 6, wherein: The second portion is provided closer to the support portion than the first portion.

8. The vibration device according to claim 2, wherein: When viewed from above, the gap comprises: a first portion extending along a first direction intersecting the imaginary line; as well as The third portion is connected to the first portion and is disposed between the first connection electrode and the second connection electrode.

9. An oscillator, comprising: The vibration device according to any one of claims 1 to 4; and an oscillating circuit connected to the excitation electrode to excite the excitation unit, The oscillation circuit is disposed on the substrate.

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