Camera modules and electronic devices

Abstract

The present application discloses a camera module and electronic device. The camera module includes: a base having an opening; a lens disposed on one side of the base; a circuit board assembly, the circuit board assembly including a first plate, an elastic portion, and a second plate, the elastic portion being connected between the first plate and the second plate along a direction perpendicular to the base to the lens, and the second plate being connected to the base; a sensor chip disposed on the side of the first plate facing the base; a first conductive group, the first conductive group including a first conductive member and a first inductive member, one of the first conductive member and the first inductive member being disposed on the first plate, the other being disposed on the second plate, the first conductive member and the first inductive member being arranged parallel and spaced apart, and having a potential difference between the first conductive member and the first inductive member; and when one of the first conductive member and the first inductive member disposed on the first plate moves relative to the other of the first conductive member and the first inductive member disposed on the second plate along with the first plate, the capacitance value of the first inductive member changes.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic devices, and specifically relates to a camera module and electronic equipment. Background Art

[0002] When using electronic devices with camera functions to take photos or videos, the photos and videos taken by the electronic devices may appear blurry or shaky due to external vibrations, affecting the quality of the photos and videos.

[0003] To address the above issues, related technologies have added position sensors to the camera modules of electronic devices and improved circuits. Anti-shake control is performed based on the detection data from the position sensors to compensate for image blur caused by vibration, thereby improving image quality.

[0004] This configuration not only requires adding a position sensor and additional pins to the camera module, but also makes the driving circuit and chip of the camera module more complicated, which increases the size of the camera module and increases the production cost of the camera module. Summary of the Invention

[0005] The present application aims to provide a camera module and an electronic device, which solves one of the problems in the related art of increasing the size of the camera module and increasing the production cost of the camera module by adding a position sensor and improving the circuit in the camera module to give the electronic device an anti-shake function.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] In a first aspect, an embodiment of the present application provides a camera module, comprising: a base having an opening; a lens disposed on one side of the base; a circuit board assembly located on a side of the base facing away from the lens, the circuit board assembly comprising a first plate, an elastic portion, and a second plate, the elastic portion being connected between the first plate and the second plate along a direction perpendicular to the base to the lens, and the second plate being connected to the base; a sensor chip disposed on a side of the first plate facing the base, with the opening located between the lens and the sensor chip; a first conductive group, the first conductive group comprising a first conductive member and a first inductive member, one of the first conductive member and the first inductive member being disposed on the first plate, the other being disposed on the second plate, the first conductive member and the first inductive member being arranged parallel to and spaced apart from each other, and a potential difference being present between the first conductive member and the first inductive member; when one of the first conductive member and the first inductive member disposed on the first plate moves relative to the other of the first conductive member and the first inductive member disposed on the second plate with the first plate, the capacitance value of the first inductive member changes, and the capacitance value of the first inductive member is used to adjust the displacement of the sensor chip relative to the lens, thereby enabling anti-shake of the camera module.

[0008] In a second aspect, an embodiment of the present application provides an electronic device, comprising: a housing; and a camera module as in the first aspect, wherein the camera module is disposed in the housing.

[0009] In an embodiment of the present application, the camera module includes a base, a lens, a circuit board group, a sensor chip and a first conductive group.

[0010] The lens is mounted on one side of the base. The circuit board assembly includes a first plate, an elastic portion, and a second plate, which is connected to the base. The base serves as a mounting support for the lens and circuit board assembly, securing and securing them and ensuring their proper fit.

[0011] The elastic part is connected between the first plate and the second plate along a direction perpendicular to the base to the lens. The sensor chip is provided on the side of the first plate facing the base, and the opening is located between the lens and the sensor chip. The elastic part is elastic, that is, the elastic part can be extended and retracted. Since the second plate is connected to the base and the first plate is not connected to the base, the elastic part can adjust the distance between the first plate and the second plate, the matching size of the first plate and the base, and the matching size of the sensor chip and the lens by extension. In this way, when the camera module shakes, the sensor chip and the first plate can be displaced under the drive of the motor to resist the shake, so that the camera module has an anti-shake function, thereby improving the performance of the electronic device.

[0012] The first conductive group includes a first conductive member and a first inductive member. One of the first conductive member and the first inductive member is mounted on the first plate, and the other is mounted on the second plate. Specifically, the first conductive member is mounted on the first plate, and the first inductive member is mounted on the second plate. Alternatively, the first conductive member is mounted on the second plate, and the first inductive member is mounted on the first plate. In other words, the first plate and the second plate serve as mounting supports for the first conductive member and the first inductive member, respectively.

[0013] The first conductive element and the first sensing element are arranged parallel to and spaced apart from each other. That is, the first conductive element and the first sensing element are arranged opposite each other, parallel to each other, and spaced apart from each other. When the camera module is in operation, a potential difference exists between the first conductive element and the first sensing element. An electric field distribution exists between the first conductive element and the first sensing element. The end surface of the first conductive element facing the first sensing element is the first end surface, and the end surface of the first sensing element facing the first conductive element is the second end surface. The first end surface and the second end surface are each charged with equal amounts of opposite charges. When the camera module shakes, one of the first conductive element and the first sensing element located on the first plate moves relative to the other of the first conductive element and the first sensing element located on the second plate, causing the area of ​​the first end surface and the second end surface to change, and the capacitance of the first sensing element to change. The change in capacitance can be used to determine the displacement of the sensor chip, thereby forming a feedback value for adjusting the displacement of the sensor chip relative to the lens, achieving closed-loop control of camera module anti-shake.

[0014] It can be seen from this that the present application makes reasonable use of the existing assembly positions of the base, lens and circuit board group without the need to add additional position sensors. By limiting the matching structure of the circuit board group, the sensor chip and the first conductive group, the first conductive member and the first inductive member of the first conductive group are constructed into a parallel plate capacitor. By utilizing the principle of the parallel plate capacitor, the displacement of the sensor chip relative to the lens can be adaptively adjusted, so that the camera module has an anti-shake function. Compared with the related art of adding a position sensor to the camera module, this setting simplifies the structure of the camera module while ensuring that the camera module has an anti-shake function, does not increase the external dimensions of the camera module, does not increase the complexity of the driving circuit, and is conducive to reducing the production cost of the camera module. Additional aspects and advantages of the present application will be partially given in the following description, and some will become apparent from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0016] Figure 1 This is a partial structural diagram of a camera module according to an embodiment of the present application;

[0017] Figure 2 This is a schematic structural diagram of the circuit board assembly, sensor chip, flexible circuit board, and connector of the first embodiment of the present application from a first perspective;

[0018] Figure 3is a schematic structural diagram of a circuit board assembly, a sensor chip, a flexible circuit board, and a connector according to a second embodiment of the present application from a first perspective;

[0019] Figure 4 for Figure 3 A partial enlarged view of point A of the circuit board assembly, sensor chip, flexible circuit board, and connector shown;

[0020] Figure 5 is a structural schematic diagram of the circuit board assembly, sensor chip, flexible circuit board, and connector according to the second embodiment of the present application from a second perspective;

[0021] Figure 6 for Figure 5 A partial enlarged view of point B of the circuit board assembly, sensor chip, flexible circuit board, and connector shown;

[0022] Figure 7 1 is a schematic structural diagram of a soldering pad A, a soldering pad B, and a circuit board assembly according to a second embodiment of the present application;

[0023] Figure 8 is a schematic structural diagram of a circuit board assembly, a flexible circuit board, and a connector according to a second embodiment of the present application from a third perspective;

[0024] Figure 9 1 is a schematic structural diagram of a sensor chip, pads A1, A2, B1, and B2 according to a second embodiment of the present application;

[0025] Figure 10 is a schematic structural diagram of the circuit board assembly, sensor chip, flexible circuit board, and connector according to the second embodiment of the present application from a fourth perspective;

[0026] Figure 11 for Figure 10 A partial enlarged view of point C of the circuit board assembly, sensor chip, flexible circuit board, and connector is shown;

[0027] Figure 12 is a schematic structural diagram of two metal plates according to an embodiment of the present application;

[0028] Figure 13 It is a schematic structural diagram of the moving electrode plate and the fixed electrode plate of an embodiment of the present application.

[0029] Reference numerals:

[0030] Figures 1 to 13 The corresponding relationship between the reference numerals and component names is as follows:

[0031] 10 camera module, 100 base, 110 opening, 200 lens, 300 circuit board group, 310 first plate, 320 elastic part, 322 connecting section, 324 suspension wire, 330 second plate, 400 sensor chip, 410 corner, 420 connecting edge, 430 first edge, 440 second edge, 500 first conductive group, 510 first conductive element, 520 first sensing element, 600 second conductive group, 610 second conductive element, 620 second sensing element, 700 coil, 800 magnetic element, 900 filter, 1000 connector, 1100 flexible circuit board, 1200 metal plate, 1300 moving electrode plate, 1400 fixed electrode plate, 1500 pad A, 1600 pad B, 1700 pad A1, 1800 pad A2, 1900 pad B1, 2000 pad B2. DETAILED DESCRIPTION

[0032] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0033] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0034] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0035] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0036] The following is combined with Figures 1 to 13 The camera module 10 and the electronic device provided in the embodiments of the present application are described.

[0037] like Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 10 and Figure 11 As shown, according to some embodiments of the present application, the camera module 10 includes: a base 100, the base 100 is provided with an opening 110; the lens 200 is provided on one side of the base 100; a circuit board group 300 is located on the side of the base 100 away from the lens 200, the circuit board group 300 includes a first plate 310, an elastic portion 320 and a second plate 330, along a direction perpendicular to the base 100 to the lens 200, the elastic portion 320 is connected between the first plate 310 and the second plate 330, and the second plate 330 is connected to the base 100; a sensor chip 400 is provided on a side of the first plate 310 facing the base 100, the opening 110 is located between the lens 200 and the sensor chip 400; a first conductive group 500, the first conductive group 500 includes a first conductive The electrical component 510 and the first sensing component 520, one of the first conductive component 510 and the first sensing component 520 is arranged on the first plate 310, and the other is arranged on the second plate 330, the first conductive component 510 and the first sensing component 520 are arranged in parallel and spaced apart, and there is a potential difference between the first conductive component 510 and the first sensing component 520; when the one of the first conductive component 510 and the first sensing component 520 arranged on the first plate 310 moves with the first plate 310 relative to the other of the first conductive component 510 and the first sensing component 520 arranged on the second plate 330, the capacitance value of the first sensing component 520 changes, and the capacitance value of the first sensing component 520 is used to adjust the displacement of the sensor chip 400 relative to the lens 200, so that the camera module 10 can be anti-shake.

[0038] In the embodiment of the present application, the camera module 10 includes a base 100 , a lens 200 , a circuit board assembly 300 , a sensor chip 400 and a first conductive group 500 .

[0039] The lens 200 is mounted on one side of the base 100. The circuit board assembly 300 includes a first plate 310, an elastic portion 320, and a second plate 330, which is connected to the base 100. The base 100 serves as a mounting support for the lens 200 and circuit board assembly 300, securing and fixing them and ensuring their proper dimensions.

[0040] Along a line perpendicular to the base 100 and extending toward the lens 200, the elastic portion 320 is connected between the first plate 310 and the second plate 330. The sensor chip 400 is disposed on the side of the first plate 310 facing the base 100, with the opening 110 located between the lens 200 and the sensor chip 400. The elastic portion 320 is elastic, meaning it can expand and contract. Because the second plate 330 is connected to the base 100, while the first plate 310 is not, the expansion and contraction of the elastic portion 320 can adjust the spacing between the first and second plates 310, 330, the fit between the first plate 310 and the base 100, and the fit between the sensor chip 400 and the lens 200. Thus, when the camera module 10 experiences vibration, the sensor chip 400 and the first plate 310 can be displaced by the motor to counteract the vibration, providing the camera module 10 with an anti-shake function and thereby improving the performance of the electronic device.

[0041] The first conductive group 500 includes a first conductive member 510 and a first inductive member 520. One of the first conductive member 510 and the first inductive member 520 is disposed on the first plate 310, and the other is disposed on the second plate 330. That is, the first conductive member 510 is disposed on the first plate 310, and the first inductive member 520 is disposed on the second plate 330. Alternatively, the first conductive member 510 is disposed on the second plate 330, and the first inductive member 520 is disposed on the first plate 310. In other words, the first plate 310 and the second plate 330 serve as mounting supports for the first conductive member 510 and the first inductive member 520, respectively.

[0042] Among them, the first conductive member 510 and the first sensing member 520 are arranged in parallel and at intervals. That is, the first conductive member 510 and the first sensing member 520 are arranged opposite to each other, and the first conductive member 510 and the first sensing member 520 are arranged in parallel, and the first conductive member 510 and the first sensing member 520 are arranged at intervals. When the camera module 10 is in working state, there is a potential difference between the first conductive member 510 and the first sensing member 520. There is an electric field distribution between the first conductive member 510 and the first sensing member 520. The end face of the first conductive member 510 facing the first sensing member 520 is the first end face, and the end face of the first sensing member 520 facing the first conductive member 510 is the second end face, and the first end face and the second end face are respectively charged with equal amounts of opposite charges. When camera module 10 shakes, the first conductive element 510 or the first sensing element 520 located on the first plate 310 shifts relative to the first plate 310, causing the area of ​​the first end surface and the second end surface to change, and the capacitance of the first sensing element 520 to change. This change in capacitance can be used to determine the displacement of the sensor chip 400, thereby forming a feedback value for adjusting the displacement of the sensor chip 400 relative to the lens 200, thereby achieving closed-loop control of the camera module 10's anti-shake function.

[0043] It is understood that the lens 200 is disposed on the base 100, and the position of the lens 200 is fixed, and the lens 200 does not move relative to the base 100. The first board 310 of the circuit board assembly 300 is movable relative to the base 100, the first board 310 of the circuit board assembly 300 is movable relative to the lens 200, and the sensor chip 400 is movable relative to the lens 200.

[0044] It can be understood that, along the direction from the first end face to the second end face, the area of ​​the overlapping area between the orthographic projection of the first end face on the second end face and the second end face is the area of ​​the area where the first end face and the second end face are oppositely arranged.

[0045] It is understandable that the elastic portion 320 is disposed around the first plate 310 , and the second plate 330 is disposed around the elastic portion 320 .

[0046] The first conductive element 510 and the first inductive element 520 are configured as a parallel plate capacitor to detect the displacement of the sensor chip 400 , thereby enabling closed-loop signal control.

[0047] The principle of the parallel plate capacitor detecting the position information of the sensor chip 400 is as follows: the parallel plate capacitor includes two parallel metal plates 1200 separated by an insulating medium. The two metal plates 1200 can be understood as the first conductive element 510 and the first inductive element 520.

[0048] like Figure 12 As shown, when edge effects are ignored, capacitance C, dielectric constant ε of the insulating medium, effective area S of the two metal plates 1200, and spacing d between the two metal plates 1200 satisfy the following equation: C = (ε × S) / d. The area of ​​the overlapping region of metal plates 1200, when one metal plate 1200 is projected onto the other along the arrangement direction of the two metal plates 1200, is the effective area S of the two metal plates 1200.

[0049] When the value of one of the three parameters d, S and ε changes, C will change.

[0050] like Figure 13 As shown, when one of the two metal plates 1200 moves relative to the other, the effective area S of the two metal plates 1200 changes, thereby changing the capacitance C. The moving metal plate 1200 is referred to as the moving plate 1300 , and the fixed metal plate 1200 is referred to as the fixed plate 1400 .

[0051] When the movable plate 1300 is translated by Δx relative to the fixed plate 1400 along the plate length a, the capacitance C = (ε×(a-Δx)×b) / d = (ε×a×b) / d-(ε×Δx×b) / d = C0-ΔC, which is recorded as Formula 1. The width of the plate is recorded as b.

[0052] Wherein, C0 = (ε×a×b) / d, C0 is the initial value of the capacitance.

[0053] The change in capacitance due to the displacement of the moving plate 1300 is △C=C-C0=-((ε×b) / d)×△x=-C0×(△x / a), which is expressed as Formula 2.

[0054] From this, it can be seen that the magnitude of the displacement Δx can be determined by the change in capacitance.

[0055] In some embodiments, the first conductive element 510 and the first inductive element 520 are arranged along a direction perpendicular to the base 100 and the lens 200 .

[0056] In this embodiment, the positional relationship between the first conductive element 510 and the first inductive element 520 is further defined.

[0057] The first conductive member 510 and the first inductive member 520 are arranged in a direction perpendicular to the base 100 and the lens 200. That is, in the direction perpendicular to the base 100 and the lens 200, the first conductive member 510 and the first inductive member 520 are arranged in parallel and spaced apart.

[0058] In some other embodiments, the first conductive member 510 and the first inductive member 520 are arranged along the direction from the base 100 to the lens 200. That is, along the direction from the base 100 to the lens 200, the first conductive member 510 and the first inductive member 520 are arranged in parallel and spaced apart.

[0059] In some embodiments, as Figure 3 、 Figure 5 and Figure 10 As shown, there are multiple first conductive groups 500 , and the multiple first conductive groups 500 are arranged at intervals along the circumference of the sensor chip 400 .

[0060] In this embodiment, the number and arrangement positions of the first conductive groups 500 are further defined.

[0061] There are multiple first conductive groups 500, spaced apart along the circumference of the sensor chip 400. This arrangement provides effective and reliable structural support for detecting displacement of the sensor chip 400 in the X, Y, and Z directions. This improves product detection accuracy and contributes to enhanced anti-shake accuracy for the camera module 10.

[0062] Any two of the X direction, the Y direction, and the Z direction are perpendicular to each other.

[0063] In some embodiments, as Figure 3 As shown, the sensor chip 400 has a plurality of corners 410 , and the portion of the outer edge of the sensor chip 400 between any two adjacent corners 410 is a connecting edge 420 ; each connecting edge 420 is disposed opposite to at least one first conductive group 500 .

[0064] In this embodiment, the matching structure of the sensor chip 400 and the plurality of first conductive groups 500 is further defined.

[0065] Multiple first conductive groups 500 are arranged at intervals along the circumference of the sensor chip 400. The sensor chip 400 has multiple corners 410. The portion of the outer edge of the sensor chip 400 between any two adjacent corners 410 is a connecting edge 420. Each connecting edge 420 is disposed opposite to at least one first conductive group 500.

[0066] like Figure 7 As shown, along the X direction, when the camera module 10 shakes, the sensor chip 400 and the first plate 310 are displaced by the motor to resist the shake, and the second plate 330 of the circuit board assembly 300 is fixedly connected to the base 100, and the position of the second plate 330 remains unchanged. Figure 7 The arrow in indicates the movement direction of the sensor chip 400 .

[0067] The first conductive element 510 or first sensing element 520 connected to the first board 310 is denoted as pad A1500, and the first sensing element 520 or first conductive element 510 connected to the second board 330 is denoted as pad B1600. The position of pad A1500 changes, while the position of pad B1600 remains relatively fixed. Relative movement between pads A1500 and B1600 causes a change in capacitance. Equation 2 can be used to calculate the displacement of the sensor chip 400, thereby forming a feedback value and implementing closed-loop control for anti-shake.

[0068] When the camera module 10 shakes along the Y direction, the calculation method of the displacement value of the sensor chip 400 is similar to that of the X direction shake, which is not repeated here.

[0069] When the camera module 10 shakes along the Z direction, the calculation method of the displacement value of the sensor chip 400 is similar to that of the X direction shake, which is not repeated here.

[0070] like Figure 8 and Figure 9 As shown, each connecting edge 420 is arranged opposite to at least one first conductive group 500, that is, a plurality of first conductive groups 500 are arranged in an array around the sensor chip 400. Therefore, when the camera module 10 is tilted and shaken, the capacitance changes between the multiple pads arranged laterally are inconsistent. For example, the capacitance change between the pad A11700 and the pad B11900 close to the outside is 10 units, and the capacitance change between the pad A21800 and the pad B22000 on the inside is 5 units. The corresponding tilt angle can be calculated by the capacitance change ratio of the array pads (e.g., 10 units / 5 units). Among them, Figure 8 and Figure 9 The arrow shown indicates the direction of movement of the sensor chip 400 . Figure 8 and Figure 9 In the figure, the dotted line represents pad B11900 and pad B22000, and the solid line represents pad A11700 and pad A21800.

[0071] In some embodiments, as Figure 2 、 Figure 3 、 Figure 5 and Figure 10As shown, the elastic portion 320 includes: a plurality of connecting segments 322, which are arranged at intervals along the circumference of the sensor chip 400, and each connecting segment 322 connects the first plate 310 and the second plate 330; a plurality of suspension wires 324, and at least one suspension wire 324 is connected between any two adjacent connecting segments 322, and the first plate 310 and the second plate 330 are both arranged at intervals from the suspension wires 324; one of the first conductive member 510 and the first sensing member 520 is provided on the side of the first plate 310 facing the suspension wire 324, and the other is provided on the side of the second plate 330 facing the suspension wire 324.

[0072] In this embodiment, the matching structure of the elastic portion 320 , the first plate 310 , the second plate 330 , the first conductive member 510 and the first inductive member 520 is further defined.

[0073] The elastic portion 320 includes a plurality of connecting segments 322 and a plurality of suspension wires 324 .

[0074] At least one of the plurality of connecting segments 322 is an elastic segment. Each suspension wire 324 is an elastic wire.

[0075] Optionally, the plurality of connecting segments 322 and the plurality of suspension wires 324 are integrally formed.

[0076] Multiple connecting segments 322 are spaced apart along the circumference of the sensor chip 400. Each connecting segment 322 connects the first plate 310 and the second plate 330. At least one suspension wire 324 is connected between any two adjacent connecting segments 322. The combination of the multiple connecting segments 322 and the multiple suspension wires 324 not only allows the elastic portion 320 to connect the first plate 310 and the second plate 330, but also allows the first plate 310 to move relative to the second plate 330.

[0077] The first plate 310 and the second plate 330 are spaced apart from the suspension wire 324. That is, the first plate 310, two adjacent connecting segments 322, and the suspension wire 324 enclose a first hollow area. The second plate 330, two adjacent connecting segments 322, and the suspension wire 324 enclose a second hollow area.

[0078] One of the first conductive member 510 and the first inductive member 520 is disposed on the side of the first plate 310 facing the suspension wire 324, and the other is disposed on the side of the second plate 330 facing the suspension wire 324. That is, the first conductive member 510 is disposed on the side of the first plate 310 facing the suspension wire 324, and the first inductive member 520 is disposed on the side of the second plate 330 facing the suspension wire 324. Alternatively, the first inductive member 520 is disposed on the side of the first plate 310 facing the suspension wire 324, and the first conductive member 510 is disposed on the side of the second plate 330 facing the suspension wire 324. In other words, one of the first conductive member 510 and the first inductive member 520 is located in the first hollow region, and the other of the first conductive member 510 and the first inductive member 520 is located in the second hollow region.

[0079] The first and second hollow areas serve as mounting areas for the first conductive assembly 500, providing clearance for installation. This ensures that the first conductive element 510 and the first sensing element 520 of the first conductive assembly 500 are arranged parallel and spaced apart, while also ensuring that the space on the circuit board assembly 300 in the direction from the lens 200 to the base 100 is not occupied.

[0080] At the same time, the setting of the first hollow area and the second hollow area also has the effect of reducing the structural strength of the circuit board group 300 at this location, making the elastic part 320 easier to deform, and the first plate body 310 and the sensor chip 400 can shift relative to the second plate body 330 under slight shaking, which is beneficial to improving the anti-shake accuracy of the camera module 10.

[0081] In some embodiments, when a plurality of suspension wires 324 are connected between two adjacent connecting segments 322 , the plurality of suspension wires 324 are arranged at intervals along a direction from the first plate 310 to the second plate 330 .

[0082] In this embodiment, the cooperation structure of the plurality of connecting segments 322 and the plurality of suspension wires 324 is further defined.

[0083] When multiple suspension wires 324 are connected between two adjacent connecting segments 322, the multiple suspension wires 324 are spaced apart along the direction from the first plate 310 to the second plate 330. That is, the first plate 310, two adjacent connecting segments 322, and the suspension wires 324 enclose a first hollow area. The second plate 330, two adjacent connecting segments 322, and the suspension wires 324 enclose a second hollow area. Two adjacent connecting segments 322 and two adjacent suspension wires 324 enclose a third hollow area. This arrangement balances the ease of deformation of the elastic portion 320 with the increased strength of the portion of the elastic portion 320 located between two adjacent connecting segments 322.

[0084] In some embodiments, as Figure 1 and Figure 2As shown, the camera module 10 also includes: a second conductive group 600, the second conductive group 600 includes: a second conductive member 610; a second sensing member 620, one of the second conductive member 610 and the second sensing member 620 is arranged on the side of the base 100 facing the circuit board group 300, and the other is arranged on the side of the first plate 310 facing the base 100, along the lens 200 to the base 100, the second conductive member 610 and the second sensing member 620 are arranged in parallel and spaced apart, and there is a potential difference between the second conductive member 610 and the second sensing member 620; when one of the second conductive member 610 and the second sensing member 620 arranged on the first plate 310 moves with the first plate 310 relative to the other of the second conductive member 610 and the second sensing member 620 arranged on the base 100, the capacitance value of the second sensing member 620 changes, and the capacitance value of the second sensing member 620 is used to adjust the displacement of the sensor chip 400 relative to the lens 200.

[0085] In some embodiments, the camera module 10 further includes a second conductive group 600 .

[0086] The second conductive group 600 includes a second conductive element 610 and a second inductive element 620 .

[0087] One of the second conductive member 610 and the second inductive member 620 is disposed on the side of the base 100 facing the circuit board assembly 300, and the other is disposed on the side of the first plate 310 facing the base 100. That is, the second conductive member 610 is disposed on the side of the base 100 facing the circuit board assembly 300, and the second inductive member 620 is disposed on the side of the first plate 310 facing the base 100. Alternatively, the second inductive member 620 is disposed on the side of the base 100 facing the circuit board assembly 300, and the second conductive member 610 is disposed on the side of the first plate 310 facing the base 100. In other words, the base 100 and the first plate 310 serve as mounting supports for the second conductive member 610 and the second inductive member 620, respectively.

[0088] The second conductive member 610 and the second inductive member 620 are arranged in parallel and spaced apart. That is, the second conductive member 610 and the second inductive member 620 are arranged opposite to each other, and the second conductive member 610 and the second inductive member 620 are arranged in parallel, and the second conductive member 610 and the second inductive member 620 are spaced apart. When the camera module 10 is in working state, there is a potential difference between the second conductive member 610 and the second inductive member 620. There is an electric field distribution between the second conductive member 610 and the second inductive member 620. The end face of the second conductive member 610 facing the second inductive member 620 is the third end face, and the end face of the second inductive member 620 facing the second conductive member 610 is the fourth end face, and the third end face and the fourth end face are respectively charged with equal amounts of opposite charges. When the camera module 10 shakes, one of the second conductive member 610 and the second inductive member 620 disposed on the first plate 310 moves with the first plate 310 relative to the other of the second conductive member 610 and the second inductive member 620 disposed on the base 100, the area of ​​the region where the third end face and the fourth end face are relatively arranged changes, and the capacitance value of the second inductive member 620 changes. The displacement of the sensor chip 400 can be determined by the change in capacitance, thereby forming a feedback value for adjusting the displacement of the sensor chip 400 relative to the lens 200, thereby realizing closed-loop control of the anti-shake of the camera module 10. In this way, when the camera module 10 shakes, the sensor chip 400 and the first plate 310 can be displaced under the drive of the motor to counteract the shaking, so that the camera module 10 has an anti-shake function, thereby improving the performance of the electronic device.

[0089] Optionally, the second conductive member 610 includes a metal member.

[0090] Optionally, the second sensing element 620 includes a metal element.

[0091] The working principle of the second conductive group 600 is the same as that of the first conductive group 500 and will not be described again.

[0092] In some embodiments, as Figure 2 As shown, there are multiple second conductive groups 600 , and the multiple second conductive elements 610 are arranged at intervals along the circumference of the sensor chip 400 .

[0093] In this embodiment, the number and arrangement positions of the second conductive groups 600 are further defined.

[0094] There are multiple second conductive groups 600, with multiple second conductive members 610 spaced apart along the circumference of the sensor chip 400. This arrangement provides effective and reliable structural support for detecting displacement of the sensor chip 400 in the X, Y, and Z directions. This improves product detection accuracy and contributes to enhanced anti-shake accuracy for the camera module 10.

[0095] Any two of the X direction, the Y direction, and the Z direction are perpendicular to each other.

[0096] In some embodiments, as Figure 2 As shown, the outer edge of the sensor chip 400 has a first side 430 and a second side 440 that are arranged opposite to each other; a portion of the second conductive groups 600 in the plurality of second conductive groups 600 is located between the first side 430 and the elastic portion 320, and another portion of the second conductive groups 600 in the plurality of second conductive groups 600 is located between the second side 440 and the elastic portion 320.

[0097] In this embodiment, the matching structure between the plurality of second conductive groups 600 and the sensor chip 400 is further defined.

[0098] The outer edge of the sensor chip 400 includes a first side 430 and a second side 440 . The first side 430 and the second side 440 are opposite to each other and spaced apart.

[0099] Some of the second conductive groups 600 are located between the first side 430 and the elastic portion 320, and another portion of the second conductive groups 600 are located between the second side 440 and the elastic portion 320. This arrangement provides structural support for detecting displacement of the sensor chip 400 in multiple directions.

[0100] In some embodiments, as Figure 1 As shown, the camera module 10 further includes: a coil 700, which is provided on the first plate 310; a magnetic member 800, which is provided on the base 100, and the coil 700 and the magnetic member 800 cooperate to drive the first plate 310 to move relative to the base 100.

[0101] In this embodiment, the structure of the camera module 10 is further defined.

[0102] The camera module 10 further includes a coil 700 and a magnetic member 800 .

[0103] The coil 700 is mounted on the first plate 310, and the magnetic member 800 is mounted on the base 100. When the coil 700 is energized, a first magnetic field is generated around the coil 700, and a second magnetic field is generated around the magnetic member 800. The interaction between the first and second magnetic fields generates a driving force on the coil 700, and the movement of the coil 700 drives the first plate 310 and the sensor chip 400 relative to the base 100. The coil 700 and the magnetic member 800 work together to provide power for the movement of the first plate 310 and the sensor chip 400.

[0104] In some embodiments, as Figure 1As shown, the camera module 10 further includes: a filter 900, which is arranged at the opening 110; a connector 1000, which is located on one side of the circuit board assembly 300; and a flexible circuit board 1100, which is connected between the second board 330 and the connector 1000.

[0105] In this embodiment, the structure of the camera module 10 is further defined.

[0106] The camera module 10 further includes a filter 900 , a connector 1000 and a flexible circuit board 1100 .

[0107] The filter 900 is disposed at the opening 110 . The filter 900 has the function of filtering light of a specific wavelength to improve imaging quality.

[0108] For example, filter 900 may absorb infrared light.

[0109] The flexible circuit board 1100 is connected between the second board 330 and the connector 1000 . The connector 1000 is used to electrically connect to other components of the electronic device. The flexible circuit board 1100 can adjust the distance between the circuit board assembly 300 and the connector 1000 .

[0110] According to some other embodiments of the present application, the electronic device includes: a housing; and a camera module 10 as in any of the above embodiments, wherein the camera module 10 is disposed in the housing.

[0111] The electronic device provided in this application includes the camera module 10 of any of the above embodiments, and therefore has all the beneficial effects of the above camera module 10, which will not be described one by one here.

[0112] Optionally, the electronic device may be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, an augmented reality device (also known as an AR (Augmented Reality) device), a virtual reality device (also known as a VR (Virtual Reality) device) and a handheld game console, etc.

[0113] Optionally, the camera module 10 is disposed in a housing, and the housing serves as an installation carrier of the camera module 10 and has the function of installing and fixing the camera module 10 .

[0114] Optionally, the camera module 10 includes a lens 200 , a base 100 , a connector 1000 , a circuit board group 300 , a sensor chip 400 , a first conductive group 500 , a second conductive group 600 , a coil 700 , a magnetic member 800 , a filter 900 and a flexible circuit board 1100 .

[0115] Optionally, the sensor chip 400 is mounted on the first plate 310 by bonding. The circuit board assembly 300 includes a first plate 310, a second plate 330, and an elastic portion 320. The elastic portion 320 includes a suspension wire 324, which is an elastic wire. Driven by a motor, the sensor chip 400 can be displaced within a plane, achieving anti-shake performance for the camera module 10.

[0116] Multiple first pads are arranged in an array on the first plate 310. The first conductive element 510 includes the first pads, or the first sensing element 520 includes the first pads. Furthermore, second pads are provided on the base 100. The first sensing element 520 includes the second pads, or the first conductive element 510 includes the second pads. A parallel plate capacitor is formed between the first and second pads. Equation 2 can be used to calculate the displacement of the sensor chip 400, thereby generating a feedback value and implementing closed-loop control for anti-shake.

[0117] The second solder pad can be set on the base 100 through LDS (Laser-Direct-structuring) technology, or through HD CMI (High-Density Chip Molding Integration) technology, or through plastic-metal composite structure technology.

[0118] Two second conductive groups 600 are provided on the circuit board assembly 300. The second conductive groups 600 include a second conductive element 610 and a second inductive element 620. One of the second conductive element 610 and the second inductive element 620 is provided on the first plate 310, and the other of the second conductive element 610 and the second inductive element 620 is provided on the second plate 330. In the second conductive groups 600, the second conductive element 610 and the second inductive element 620 form a parallel plate capacitor. The displacement of the sensor chip 400 can be calculated based on the change in capacitance. When the camera module 10 shakes, the sensor chip 400 and the first plate 310 can be displaced by the motor to counteract the shake. At this time, the position of the second conductive element 610 or the second inductive element 620 provided on the first plate 310 changes, while the position of the second inductive element 620 or the second conductive element 610 provided on the first plate 310 remains relatively fixed. Relative movement occurs between the second conductive element 610 and the second inductive element 620, causing the capacitance to change.

[0119] The second conductive group 600 may be provided on the circuit board group 300 by a side plating process.

[0120] The anti-shake capability of the camera module 10 is improved through closed-loop control, and the effects of hysteresis, linearity, posture difference, inertial vibration, etc. on imaging quality and imaging speed are reduced, thereby improving the imaging speed and imaging quality of the camera module 10.

[0121] Optionally, the first board 310 and the second board 330 are both printed circuit boards.

[0122] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0123] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A camera module, characterized in that: include: A seat body, wherein the seat body is provided with an opening; A lens is provided on one side of the base; a circuit board assembly located on a side of the base away from the lens, the circuit board assembly comprising a first plate, an elastic portion, and a second plate, extending perpendicularly from the base to the lens, the elastic portion connected between the first plate and the second plate, and the second plate connected to the base; A sensor chip is provided on a side of the first plate body facing the base body, and the opening is located between the lens and the sensor chip; a first conductive group, the first conductive group including a first conductive member and a first inductive member, one of the first conductive member and the first inductive member being disposed on the first plate, and the other being disposed on the second plate, the first conductive member and the first inductive member being arranged in parallel and spaced apart, and having a potential difference between the first conductive member and the first inductive member; When one of the first conductive member and the first sensing member that is located on the first plate body shifts along with the first plate body relative to the other of the first conductive member and the first sensing member that is located on the second plate body, the capacitance value of the first sensing member changes. The capacitance value of the first sensing member is used to adjust the displacement of the sensor chip relative to the lens so that the camera module can be anti-shake.

2. The camera module according to claim 1, wherein: The first conductive element and the first inductive element are arranged along a direction perpendicular to the base and the lens.

3. The camera module according to claim 1 or 2, wherein: There are multiple first conductive groups, and the multiple first conductive groups are arranged at intervals along the circumference of the sensor chip.

4. The camera module according to claim 3, wherein: The sensor chip has a plurality of corners, and a portion of the outer edge of the sensor chip located between any two adjacent corners is a connecting edge; Each of the connecting edges is disposed opposite to at least one of the first conductive groups.

5. The camera module according to claim 1 or 2, wherein: The elastic portion includes: a plurality of connecting segments, the plurality of connecting segments being arranged at intervals along the circumference of the sensor chip, each connecting segment connecting the first plate body and the second plate body; A plurality of suspension wires, wherein at least one suspension wire is connected between any two adjacent connecting segments, and the first plate and the second plate are both spaced apart from the suspension wires; One of the first conductive element and the first inductive element is disposed on a side of the first plate facing the suspension wire, and the other is disposed on a side of the second plate facing the suspension wire.

6. The camera module according to claim 5, wherein: When a plurality of the suspension wires are connected between two adjacent connecting segments, the plurality of suspension wires are arranged at intervals along a direction from the first plate body to the second plate body.

7. The camera module according to claim 1 or 2, characterized in that: Also includes: A second conductive group, the second conductive group comprising: a second conductive member; a second inductive element, wherein one of the second conductive element and the second inductive element is disposed on a side of the base body facing the circuit board assembly, and the other is disposed on a side of the first board body facing the base body, and the second conductive element and the second inductive element are arranged parallel to and spaced apart from each other along the lens to the base body, and a potential difference exists between the second conductive element and the second inductive element; When one of the second conductive member and the second sensing member that is located on the first plate body shifts along with the first plate body relative to the other of the second conductive member and the second sensing member that is located on the base body, the capacitance value of the second sensing member changes. The capacitance value of the second sensing member is used to adjust the displacement of the sensor chip relative to the lens.

8. The camera module according to claim 7, wherein: There are multiple second conductive groups, and the multiple second conductive members are arranged at intervals along the circumference of the sensor chip.

9. The camera module according to claim 8, wherein: The outer edge of the sensor chip has a first side and a second side that are oppositely arranged; A portion of the second conductive groups among the plurality of second conductive groups is located between the first side and the elastic portion, and another portion of the second conductive groups among the plurality of second conductive groups is located between the second side and the elastic portion.

10. The camera module according to claim 1 or 2, wherein: Also includes: a coil, provided on the first plate; The magnetic component is provided on the base, and the coil and the magnetic component cooperate to drive the first plate to move relative to the base.

11. The camera module according to claim 1 or 2, characterized in that: Also includes: a filter, disposed at the opening; a connector located on one side of the circuit board assembly; A flexible circuit board is connected between the second board and the connector.

12. An electronic device, characterized in that: include: case; and The camera module according to any one of claims 1 to 11, wherein the camera module is arranged on the housing.

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