LED package structure and LED light source

Abstract

The application relates to an LED packaging structure and an LED light source, which comprise an LED chip, a support electrically connected with the LED chip and an encapsulating glue body, the support is internally provided with a groove with a horizontal bottom surface, the sidewall of the groove is curved downward from an opening end and forms a partial-elliptical sidewall with a reflecting surface, the lower end of the encapsulating glue body is assembled in the groove, the upper end protrudes out of the groove and forms a light-emitting glue body part with a partial-elliptical section, the shape of the groove in the support and the light-emitting glue body part are both limited to be partial-elliptical, the sidewall is mirror-finished, the direct light A and the reflected light B emitted at the light-emitting glue body part can be effectively regulated, the focal length of the ellipse formed by the groove in the support and the light-emitting glue body is regulated, the shape of the groove in the support and the light-emitting glue body is adjusted, the device can regulate the direct deflection angle beta1 of the direct light and the reflection deflection angle beta2 of the reflected light, and the light-emitting angle and range of the device can be regulated according to actual working conditions.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED packaging, in particular to an LED packaging structure and an LED light source. BACKGROUND

[0002] At present, miniaturization of LED light sources is an important development direction to realize ultra-high density light output. Compared with the cover lens process, the molding process is a commonly used process at present, which has the significant advantages of low cost, high process yield and high consistency.

[0003] At present, the light source using the molding process basically adopts a hemispherical or highly protruding packaging glue design. Since the support is not matched with the molding lens, a large amount of light is reflected at the support, and the reflected light cannot be effectively controlled when it is incident to the molding packaging glue and the air interface.

[0004] Therefore, although the light source using the molding process is designed to have a small angle of light emission, it is difficult to achieve precise control, resulting in a large angle deviation of the light, and the light cannot be effectively controlled. SUMMARY

[0005] The present application provides an LED packaging structure, which can solve the problem that the support and the lens of the light source using the molding process are not matched, resulting in inaccurate light emission range and angle of the light source.

[0006] The technical scheme of the present application is as follows: an LED packaging structure, comprising:

[0007] an LED chip;

[0008] a support electrically connected to the LED chip, the support being internally provided with a groove with a horizontal bottom surface, the side wall of the groove being curved downward from the opening end and forming a partially elliptical side wall with a reflecting surface, the partially elliptical side wall being defined on an ellipse with a focus point one close to the groove and a focus point two away from the groove, the LED chip being arranged on the bottom surface of the groove and coinciding with the position of the focus point one;

[0009] a packaging glue body, the lower end of the packaging glue body being assembled in the groove, the upper end of the packaging glue body protruding out of the groove and forming a light emitting glue body part with a partially elliptical cross section, the light emitting glue body part being defined on an ellipse with a focus point three away from the light emitting glue body part, the focus point three being located at any point on the line connecting the focus point one and the focus point two;

[0010] The LED chip emits at the focal point one, and the light emitted by the light-emitting colloid part is straight light, and the included angle between the straight light and the line between the focal point one and the focal point two is defined as the straight deviation angle β1.

[0011] The LED chip emits at the focal point one, and the light emitted by the light-emitting colloid part is straight light, and the included angle between the straight light and the line between the focal point one and the focal point two is defined as the straight deviation angle β1.

[0012] The relative positions among the focal point three, the focal point one and the focal point two are adjusted, so as to change the angle of the straight deviation angle β1 of the straight light, and the shape of the support is adjusted, so as to change the angle of the reflected light after being reflected by the partial elliptical side wall and entering the light-emitting colloid part, and finally the angle of the reflected deviation angle β2 is changed.

[0013] By adopting the above scheme, the straight light A and the reflected light B emitted by the light-emitting colloid part can be effectively adjusted by limiting the shape of the internal groove of the support and the light-emitting colloid part to be partial elliptical and performing mirror processing on the side wall, adjusting the focal length of the elliptical body in which the light-emitting colloid part is located, and adjusting the shape of the internal groove of the support and the light-emitting colloid, so that the device can adjust the straight deviation angle β1 of the straight light and the reflected deviation angle β2 of the reflected light, thereby adjusting the light-emitting angle and range of the device according to actual working conditions.

[0014] In an embodiment of the present application, the packaging colloid further comprises an assembly colloid part and a plate-shaped connecting colloid part, the assembly colloid part is arranged in the groove, and the connecting colloid part is horizontally arranged at the upper end of the assembly colloid part, the horizontal cross-sectional area of the connecting colloid part is equal to the horizontal cross-sectional area of the support, and the light-emitting colloid part is arranged at the upper end of the connecting colloid part.

[0015] By adopting the above scheme, by arranging the plate-shaped connecting colloid part, the normal and uniform propagation of light can be ensured, and the two sides of the connecting colloid part extend to the upper end of the support, so that the packaging colloid is more stable during assembly.

[0016] In an embodiment of the present application, the reflectivity of the partial elliptical side wall is not less than 96%, and the refractive index n1 of the packaging colloid satisfies 1.3≤n1≤1.5.

[0017] By adopting the above scheme, by limiting the range of the refractive index of the packaging colloid, the range of the refractive index of the ellipsoid in which the light-emitting colloid part is located is limited, and the light-emitting range of the device is adjusted when the light is emitted.

[0018] In one of the embodiments of the present application, the LED packaging structure further comprises a support pad, which is arranged at the bottom of the support.

[0019] By using the above scheme, the LED packaging structure can be assembled on the substrate of the external light source and electrically connected with the circuit layer of the external light source by arranging the pad under the support. The device can select different numbers of the LED packaging structures in a dot matrix manner according to actual needs to achieve the ideal light emitting effect.

[0020] In one of the embodiments of the present application, the LED chip is provided with a fluorescent film, and the thickness d of the fluorescent film satisfies 10um≤d≤100um.

[0021] By using the above technical scheme, the thickness of the fluorescent film is limited, thereby further reducing the width of the side light emitting surface of the LED chip and further reducing the influence on the light emitting range of the whole device while ensuring good light emitting effect.

[0022] In one of the embodiments of the present application, the thickness of the connecting glue part is greater than 50um, the upper and lower surfaces of the connecting glue part are respectively provided with a circular first connecting ring and a circular second connecting ring between the assembling glue part and the light emitting glue part, a plurality of first connecting points are arranged on the first connecting ring, and the second connecting ring is correspondingly provided with a second connecting point with the shortest distance from each first connecting point, and the included angle b between the connecting line of the first connecting point and the second connecting point and the focal point is not greater than 10°.

[0023] By using the above scheme, since the LED chip emits light, the light emitted outward through the connecting glue part cannot converge with the light beam emitted by the device due to refraction. By limiting the thickness of the connecting part, the light quantity of this part can be effectively reduced, thereby effectively reducing the loss of light energy.

[0024] In one of the embodiments of the present application, the LED chip is a thin film chip, the width of the side light emitting surface of the LED chip is not greater than 10um, and the length of the LED chip is not greater than 30% of the diameter of the circular opening end of the groove.

[0025] In one of the embodiments of the present application, the first connecting ring and the second connecting ring have equal areas.

[0026] By using the above scheme, the thin film chip with small thickness is used, and the width of the side light emitting surface and the size of the LED chip are further limited, thereby effectively avoiding the situation that the light emitting pattern is affected due to too much side light emitting of the LED chip.

[0027] In one embodiment of the present application, the angle a between the line connecting the first connecting point and the focal point and the normal direction of the tangent line at the first connecting point is not greater than 30 degrees.

[0028] By limiting the range of the angle of the light beam entering the light-emitting colloidal layer, the range of the entire light beam is limited, the number of light rays that are totally reflected when entering the light-emitting colloidal layer is reduced, the situation that the light-emitting angle is affected due to total reflection is avoided, and the light-emitting effect is optimized.

[0029] The second object of the present application is to provide an LED light source.

[0030] To achieve the above object, the technical solution of the present application is as follows:

[0031] The LED light source comprises a plurality of LED packaging structures, and the angle and range of the light beams emitted by the plurality of LED packaging structures are controlled, so that the range and angle of the light beams irradiated by the LED light source are controllable and more uniform.

[0032] In summary, the present application has at least one of the following beneficial technical effects:

[0033] 1. By limiting the shape, size and mounting position of the light-emitting colloidal part and the support, and performing mirror processing on the inner wall of the support, the reflected light rays reflected on the support and directly emitted from the LED chip and directly emitted from the light-emitting colloidal part are effectively controlled in angle when the device emits light, thereby limiting the light-emitting direction and range of the entire device, and further controlling the light-emitting range of the entire light beam.

[0034] 2. By limiting the thickness of the connecting colloidal part, the amount of light emitted by the LED chip and entering the connecting colloidal part is reduced, the amount of light entering the connecting colloidal part and not normally emitted is reduced, and the loss of light energy is reduced.

[0035] 3. By limiting the width of the chip side light-emitting surface, the amount of light emitted by the side light-emitting surface is reduced, and the influence of this part of the light amount on the overall light-emitting range and light-emitting effect of the device is reduced.

[0036] 4. By limiting the range of the angle of the light beam entering the light-emitting colloidal layer, the range of the entire light beam is limited, the number of light rays that are totally reflected when entering the light-emitting colloidal layer is reduced, the situation that the light-emitting angle is affected due to total reflection is avoided, and the light-emitting effect is optimized. BRIEF DESCRIPTION OF DRAWINGS

[0037] Figure 1 is a light path schematic diagram of an LED packaging structure provided in an embodiment of the present application;

[0038] Figure 2 is a light path diagram of LED chip side light emission of the LED packaging structure provided in the embodiment of the present application;

[0039] Figure 3 is a light emission diagram of the thin film chip of the LED packaging structure provided in the embodiment of the present application;

[0040] Figure 4 is a cross-sectional view diagram of the connecting glue part of the LED packaging structure provided in the embodiment of the present application;

[0041] Figure 5 is a light path diagram of the LED packaging structure provided in the first embodiment of the present application when the light rays are emitted at three focal points.

[0042] Explanation of reference numerals: 1, support; 11, partially elliptical sidewall; 12, groove; 2, packaging glue; 21, assembling glue part; 22, connecting glue part; 221, first connecting ring; 222, second connecting ring; 23, light emission glue part; 3, LED chip; 31, fluorescent film; 4, support pad; G1, focal point one; G2, focal point two; G3, focal point three; L1, first connecting point; L2, second connecting point; A, direct light ray; B, reflected light ray. DETAILED DESCRIPTION

[0043] The following will be described in detail with reference to the accompanying drawings Figures 1-5 The LED packaging structure provided in the present application will be described in further detail.

[0044] Please refer to Figure 1 The LED packaging structure provided in the embodiment of the present application comprises: an LED chip 3, a support 1 electrically connected with the LED chip 3, and a packaging glue 2, the support 1 is electrically connected with the LED chip 3, the support 1 is internally provided with a groove 12 with a horizontal bottom surface, the sidewall of the groove 12 is bent downward from the opening end and forms a partially elliptical sidewall 11 with a reflecting surface, the ellipse on which the partially elliptical sidewall 11 is located is defined with a focal point one G1 close to the groove 12 and a focal point two G2 away from the groove 12, the LED chip 3 is arranged on the bottom surface of the groove 12 and coincides in position with the focal point one G1, the lower end of the packaging glue 2 is assembled in the groove 12 and the upper end protrudes out of the groove and forms a light emission glue part 23 with a partially elliptical cross section, the ellipse on which the light emission glue part 23 is located is defined with a focal point three G3 away from the light emission glue part 23, the focal point three G3 is located at any point on the line connecting the focal point one G1 and the focal point two G2;

[0045] The LED chip 3 emits at a focal point G1, and the light emitted from the light-emitting gel part 23 is straight light A, the angle between the straight light A and the line connecting the focal point G1 and the focal point G2 is the straight deviation angle β1, the LED chip 3 emits at the focal point G1, and after being reflected by the partial elliptical side wall 11, the light passes through the focal point G2 and is emitted from the light-emitting gel part 23, which is reflected light B, the angle between the reflected light B and the line connecting the focal point G1 and the focal point G2 is the reflected deviation angle β2, the relative positions among the focal point G3, the focal point G1 and the focal point G2 are adjusted, thereby changing the angle of the straight deviation angle β1 of the straight light A, and the shape of the support 1 is adjusted, thereby changing the angle of the reflected light B after being reflected by the partial elliptical side wall 11 and entering the light-emitting gel part 23, and finally changing the angle of the reflected deviation angle β2.

[0046] After the LED chip 3 emits light, part of the light is reflected by the partial elliptical side wall 11 and emitted from the encapsulating gel 2, and the reflecting surface of the partial elliptical side wall 11 can be polished or coated with a high-reflectivity film.

[0047] In related technologies, two heterogeneous interfaces will generally exist, and the reflectivity thereof follows the Fresnel reflection coefficient, that is: Wherein, Rp and Rs are the reflection coefficients of p-polarized light and s-polarized light, n0 and n1 are the refractive indices of the incident and refractive substances at the interface, θi and θt are the incident angle and refractive angle of the light, respectively.

[0048] It can be obtained that for the light-emitting gel part 23 in the device, when the light is incident from the LED chip 3 to the light-emitting gel part 23, as the light deviates from the long axis direction of the elliptical body to the short axis direction, the incident angle becomes larger and larger, thereby causing the refractive angle to become larger and larger, and further causing the reflection ratio caused by the difference in interface refractive index to become larger and larger, and the reflected light will cause the generation of invalid light. Therefore, in order to control this part of the ratio, it is necessary to control the incident angle of the light-emitting gel part 23. Since the light incident into the light-emitting gel part 23 is the straight light A and the reflected light B, adjusting the straight light A and the reflected light B can effectively reduce the generation of invalid light.

[0049] In the embodiment, the eccentricity e of the ellipse where the light-emitting colloidal part 23 is located satisfies e = c / a = n0 / n1 (Formula 2), where c is the half focal length of the ellipse where the light-emitting colloidal part 23 is located, a is the long semi-axis of the ellipse where the light-emitting colloidal part 23 is located, n1 is the refractive index of the ellipse where the light-emitting colloidal part 23 is located, and n0 is the refractive index of air. Since the refractive index n0 of air is constant and the refractive index n1 of the light-emitting colloidal part 23 can be determined according to the material of the light-emitting colloidal part 23, it is only necessary to ensure that the shape of the light-emitting colloidal part 23 satisfies Formula 2, that is, the light-emitting colloidal part 23 is a component with a partially oval cross section, so that the focal point of the light-emitting colloidal part 23 can be defined, the light emitted from the focal point three G3 to the light-emitting colloidal part 23 can be made parallel, and the distance between the focal point three G3 and the focal point two G2 can be adjusted, so that the device can adjust the refractive angle of the direct light ray A and the reflected light ray B at the light-emitting colloidal part 23 to change the range of the direct deflection angle β1 and the reflected deflection angle β2.

[0050] In the embodiment, the LED chip 3 is arranged at the focal point one G1. According to the optical principle, the light emitted from the focal point of an ellipse will pass through the other focal point after being reflected by the surface of the ellipse. Therefore, in the device, the reflected light ray B emitted from the focal point one G1 can pass through the focal point two G2. By adjusting the shape of the partially oval side wall 11 and the positions of the focal point three G3 relative to the focal point one G1 and the focal point two G2, the angle of the reflected light ray B passing through the focal point two G2 can be adjusted, the incident angle and range of the reflected light ray B entering the air at the light-emitting colloidal part 23 can be adjusted, the value of the reflected deflection angle β2 can be changed, and the light-emitting angle and range of the reflected light ray B emitted from the light-emitting colloidal part 23 can be changed.

[0051] In addition, the direct light ray A emitted from the LED chip 3 to the light-emitting colloidal part 23 can also be adjusted by adjusting the positions of the focal point three G3 relative to the focal point one G1 and the focal point two G2, adjusting the value of the direct deflection angle β1, and adjusting the light-emitting angle and range of the direct light ray A emitted from the light-emitting colloidal part 23. The reflected light ray B and the direct light ray A are combined to form the light beam emitted from the entire LED packaging structure, and the angle and range of the entire light beam can be adjusted.

[0052] It should be noted that, in one of the embodiments, please refer to Figure 1 When the shape of the light-emitting colloidal part 23 is adjusted so that the position of the focal point three G3 is located at the midpoint of the line connecting the focal point one G1 and the focal point two G, the direct deflection angle β1 and the reflected deflection angle β2 are equal. At this time, more than 95% of the light emitted from the LED chip 3 can be emitted from the light-emitting colloidal part 23 within a small angle range smaller than the direct deflection angle β1.

[0053] In another embodiment, please refer to Figure 5When the shape of the light-emitting colloid part 23 is regulated so that the focus point three G3 of the ellipse where the light-emitting colloid part 23 is located coincides with the focus point one G1 of the ellipse where the support is located, at this time, the direct light ray A can be emitted parallel to the long axis direction of the light-emitting colloid part 23 because it is emitted from the focus point three G3 of the light-emitting colloid part 23;

[0054] After the reflected light ray B is emitted from the focus point three G3, because the focus point three G3 coincides with the focus point one G1, that is, with respect to the support 1, the light ray is emitted at the focus point one G1 and can pass through the focus point two G2 after being reflected at the partially-elliptical side wall 11, at this time, with respect to the light-emitting colloid part 23, the light ray passes through the focus point two G2 and is emitted onto the surface of the light-emitting colloid part 23, because at this time, the elliptical focus point of the light-emitting colloid part 23 is at the G1 position and the G2 position is far away from the G1, the reflected light ray B will be emitted at a large angle when it is emitted from the light-emitting colloid part 23, resulting in a large beam angle of the reflected light ray emitted from the part of the reflecting cup, and the light source presents a light-emitting distribution with a large-angle range of weak light intensity and a middle parallel-angle range of strong light intensity, which is suitable for a far-field point light source application environment.

[0055] The packaging colloid 2 further comprises an assembling colloid part 21 and a plate-shaped connecting colloid part 22, the assembling colloid part 21 is arranged in the groove 12, and the connecting colloid part 22 is horizontally arranged at the upper end of the assembling colloid part 21, the horizontal cross-sectional area of the connecting colloid part 22 is equal to the horizontal cross-sectional area of the support 1, and the light-emitting colloid part 23 is arranged at the upper end of the connecting colloid part 22, when the light ray is emitted from the LED chip 3, the light ray can be directly emitted or reflected and then sequentially passes through the assembling colloid part 21, the connecting colloid part 22 and the light-emitting colloid part 23, thereby realizing stable propagation of the light ray.

[0056] In the embodiment, the material of the packaging colloid 2 can be organic silicone glue or organic resin material, and the organic resin material can be silicone resin, epoxy resin or fluororesin.

[0057] The reflectivity of the partially-elliptical side wall 11 is not less than 96%, and the refractive index n1 of the packaging colloid 2 satisfies 1.3≤n1≤1.5, the bottom surface of the groove 12 can be coated with a light-absorbing material coating, which can effectively absorb the stray light emitted from the side of the LED chip 3, avoid the reflection of the light at this position and affect the light-emitting effect of the whole device, so that the device can emit light at a small angle; in addition, the bottom surface of the groove 12 can also be arranged as a scattering surface, so that the stray light emitted from the side of the LED chip 3 is uniformly scattered in all directions on the scattering surface, which is low in cost and can ensure the light-emitting efficiency of the device.

[0058] In the embodiment, in the practical application of the high light efficiency white light LED light source product, a high reflectivity coating can be added to the bottom surface of the groove 12 to reduce the light absorption of the support, so that the light reflection on the bottom surface of the groove 12 does not affect the light output effect of the whole device.

[0059] Please refer to Figure 1 The LED packaging structure further comprises a support pad 4 arranged on both sides of the bottom of the support 1. When the device needs to be assembled in a light source, the support pad 4 is coated with a solder layer and reflow soldered on the circuit layer of the external light source to realize the integration and circuit connection between multiple LED packaging structures.

[0060] In the embodiment, the electrical connection between the LED chip 3 and the support 1 can also be achieved by welding and electrical connection between the electrode pad of the LED chip 3 and the support 1.

[0061] Please refer to Figure 3 The LED chip 3 is provided with a fluorescent film 31, and the thickness d of the fluorescent film 31 satisfies 10um≤d≤100um, wherein the thickness of the fluorescent film 31 can be 50um.

[0062] In the embodiment, when the device needs to emit monochromatic light, the LED chip 3 can be a chip corresponding to the emission of monochromatic light.

[0063] When the device needs to emit white light, the LED chip 3 can be provided with a fluorescent film 31 of other colors on the monochromatic light chip, and the monochromatic light emitted by the fluorescent film 31 and the LED chip 3 is mixed to form white light emission.

[0064] Please refer to Figure 4 The thickness of the connecting glue part 22 is greater than 50um, and the upper and lower surfaces of the connecting glue part 22 form a circular first connecting ring 221 and a second connecting ring 222 between the assembly glue part 21 and the light emitting glue part 23, respectively. A plurality of first connecting points L1 are arranged on the first connecting ring 221, and corresponding second connecting points L2 with the shortest distance from each first connecting point L1 are arranged on the second connecting ring 222. The included angle b between the connecting line between the first connecting point L1 and the second connecting point L2 and the focal point G1 is not greater than 10°. By limiting the thickness of the connecting glue part 22, the whole packaging glue 2 can realize good adhesion, and at the same time, the amount of light emitted by the LED chip 3 and entering the connecting glue part 22 is reduced as much as possible to reduce the loss of light energy.

[0065] In the embodiment, under the premise that the thickness of the connecting glue part 22 is greater than 50um, the included angle b is also less than 10°. According to experiments, when the included angle b is 5°, the loss of light energy of the whole device is about 3%, thereby effectively reducing the loss of light energy.

[0066] Please refer to Figure 2 and Figure 3 The LED chip 3 is a thin film chip, the width of the side light emitting surface of the LED chip 3 is not greater than 10um, and the length of the LED chip 3 is not greater than 30% of the diameter of the opening end of the groove 12.

[0067] The first connecting ring 221 and the second connecting ring 222 have equal areas, adopt a thin film chip with smaller thickness, and limit the size of the entire LED chip 3, and the effect of the narrower width of the side light emitting surface is used to reduce the occurrence of the situation that the light emitting range of the device is affected due to side light emission.

[0068] The included angle a between the line connecting the first connecting point L1 and the focal point G3 and the normal direction of the tangent line where the first connecting point L1 is located is not greater than 30°, by limiting the range of the angle of the light beam entering the light emitting colloid layer, the number of light rays that are totally reflected when the light rays enter the light emitting colloid layer is reduced, the situation that the light emitting angle is affected due to total reflection is avoided, and the light emitting effect is optimized.

[0069] In the embodiment, the total reflection angle of the air interface is about 45°, and according to the Fresnel reflection coefficient formula, it can be found that:

[0070] When the incident angle is 10°, the reflectivity is about 3%;

[0071] When the incident angle is 20°, the reflectivity is about 4%;

[0072] When the incident angle is 30°, the reflectivity is greatly increased to 7%;

[0073] Therefore, the control, preferably the included angle a is less than 20°, determines the minimum value of the entire light beam, can further determine that the incident angle of the entire light beam will not be totally reflected, and further reduces the influence on the light emitting effect of the entire device, so that the device can emit light at a small angle.

[0074] The second purpose of the application is to provide an LED light source.

[0075] In order to achieve the above purpose, the technical scheme of the application is as follows:

[0076] An LED light source includes a plurality of LED packaging structures, by adjusting the light beam angle and range of the plurality of LED packaging structures, the light beam range and angle of the LED light source can be controlled and more uniform.

[0077] The above are all preferred embodiments of the present application, and do not limit the protection scope of the present application, so that: all equivalent changes made according to the structure, shape, principle of the present application should be covered in the protection scope of the present application.

Claims

1. An LED package structure, characterized in that, The application relates to a LED chip (3), a support (1) electrically connected with the LED chip (3), a recess (12) with a horizontal bottom surface in the support (1), a part-elliptical side wall (11) with a reflecting surface formed by bending the side wall of the recess (12) downward from the opening end, a focus point one (G1) near the recess (12) and a focus point two (G2) far from the recess (12) defined on the ellipse where the part-elliptical side wall (11) is located, the LED chip (3) arranged on the bottom surface of the recess (12) and coinciding with the position of the focus point one (G1), a packaging glue (2) with a lower end fitted in the recess (12) and an upper end protruding out of the recess (12) and forming a light-emitting glue part (23) with a part-elliptical cross section, a focus point three (G3) far from the light-emitting glue part (23) defined on the ellipse where the light-emitting glue part (23) is located, the focus point three (G3) located at any point on the line connecting the focus point one (G1) and the focus point two (G2), the light emitted by the LED chip (3) at the focus point one (G1) and the light emitted by the light-emitting glue part (23) being straight light rays (A), and the included angle between the straight light rays (A) and the line connecting the focus point one (G1) and the focus point two (G2) being a straight deviation angle beta1, the packaging glue (2) further comprising a fitting glue part (21) and a plate-shaped connecting glue part (22), the fitting glue part (21) arranged in the recess (12), the connecting glue part (22) horizontally arranged on the upper end of the fitting glue part (21), the horizontal cross-sectional area of the connecting glue part (22) being equal to the horizontal cross-sectional area of the support (1), the light-emitting glue part (23) arranged on the upper end of the connecting glue part (22), the thickness of the connecting glue part (22) being greater than 50 um, a circular first connecting ring (221) formed between the lower surface of the connecting glue part (22) and the fitting glue part (21), a circular second connecting ring (222) formed between the upper surface of the connecting glue part (22) and the light-emitting glue part (23), a plurality of first connecting points (L1) arranged on the first connecting ring (221), a second connecting point (L2) corresponding to each first connecting point (L1) on the second connecting ring (222), and the included angle b between the line connecting the first connecting point (L1) and the second connecting point (L2) and the focus point one (G1) being not greater than 10 DEG, the included angle a between the line connecting the first connecting point (L1) and the focus point three (G3) and the normal direction of the tangent line of the first connecting point (L1) being not greater than 30 DEG, the light emitted by the LED chip (3) at the focus point one (G1) being reflected by the part-elliptical side wall (11), passing through the focus point two (G2) and being emitted by the light-emitting glue part (23) as reflected light rays (B), and the included angle between the reflected light rays (B) and the line connecting the focus point one (G1) and the focus point two (G2) being a reflected deviation angle beta2. ​ ​ ​ ​ ​ ​ The relative positions among the focus three (G3), the focus one (G1) and the focus two (G2) are regulated, the angle of the direct light beam (A) is changed, the shape of the support (1) is regulated, the angle of the reflected light beam (B) after being reflected by the partial elliptical side wall (11) and then entering the light-emitting colloid part (23) is changed, and finally the angle of the reflected light beam (B) is changed.

2. The LED package structure of claim 1, wherein: The reflectivity of the partial elliptical side wall (11) is not less than 96%, and the refractive index n1 of the encapsulating colloid (2) satisfies 1.3≤n1≤1.

5.

3. The LED package structure of claim 1, wherein: The LED encapsulating structure further comprises a support pad (4) arranged on both sides of the bottom of the support (1).

4. The LED package structure of claim 1, wherein: The LED chip (3) is provided with a fluorescent film (31), and the thickness d of the fluorescent film (31) satisfies 10um≤d≤100um.

5. The LED package structure of claim 1, wherein: The LED chip (3) is a thin film chip, the width of the side light-emitting surface of the LED chip (3) is not greater than 10um, and the length of the LED chip (3) is not greater than 30% of the diameter of the opening end of the groove (12).

6. The LED package structure of claim 5, wherein: The first connecting ring (221) and the second connecting ring (222) have equal areas.

7. An LED light source, characterized by: The LED light source is capable of irradiating a light beam range and angle which are controllable and more uniform by regulating the light beam angle and range of a plurality of the LED encapsulating structures.

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