Display panel, manufacturing method and display device

Abstract

The invention discloses a display panel, a manufacturing method and a display device. According to one embodiment, the display panel comprises a hole area and a display area at least partially surrounding the hole area, and the display panel comprises a substrate layer, a driving circuit layer, a light-emitting device layer, a packaging layer and a touch layer which are sequentially arranged in a stacked mode, the driving circuit layer comprises a plurality of driving inorganic insulating layers and driving organic flat layers for insulating adjacent conductive layers; the packaging layer comprises a plurality of inorganic packaging layers and organic packaging layers; the hole area comprises a laser hole and at least one buffer hole, the laser hole penetrates through the substrate layer, the driving circuit layer, the light-emitting device layer, the packaging layer and the touch control layer, and each buffer hole penetrates through one or more of the substrate layer, the driving circuit layer, the light-emitting device layer, the packaging layer and the touch control layer. The orthographic projection of the buffer hole on the substrate layer covers the orthographic projection of the laser hole on the substrate layer.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more specifically, to a display panel, a manufacturing method and a display device. Background Art

[0002] A flexible display device is a display device formed based on a flexible substrate material. Since the flexible display device has the characteristics of being rollable, having a wide viewing angle, and being easy to carry, it has broad application prospects and good market potential in portable products and most display application fields.

[0003] In the manufacturing process, cracks are likely to appear on the inorganic film layer of the flexible display device in the opening area, which may cause damage to the flexible display device and prevent normal display. Summary of the invention

[0004] An object of the present invention is to provide a display panel, a manufacturing method and a display device to solve at least one of the problems existing in the prior art.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A first aspect of the present invention provides a display panel, comprising a hole area and a display area at least partially surrounding the hole area, the display panel comprising a substrate layer, a driving circuit layer, a light emitting device layer, a packaging layer and a touch layer stacked in sequence, wherein:

[0007] The driving circuit layer includes a plurality of driving inorganic insulating layers and a driving organic planar layer that insulate adjacent conductive layers;

[0008] The encapsulation layer includes a plurality of inorganic encapsulation layers and an organic encapsulation layer;

[0009] The hole area includes a laser hole that penetrates the substrate layer, the driving circuit layer, the light-emitting device layer, the packaging layer, and the touch layer, and

[0010] At least one buffer hole, each of the buffer holes penetrates one or more layers of the base layer, the drive circuit layer, the light-emitting device layer, the packaging layer, and the touch layer, and the orthographic projection of the buffer hole on the base layer covers the orthographic projection of the laser hole on the base layer.

[0011] In an optional embodiment, the buffer hole includes one or more of a base buffer hole penetrating at least a portion of the base layer, an inorganic buffer hole penetrating at least a portion of the driving inorganic insulating layer, a first organic buffer hole penetrating the driving organic planar layer, an encapsulation buffer hole penetrating at least a portion of the encapsulation layer, and a touch buffer hole penetrating the touch layer.

[0012] In the film layer stacking direction, the closer the buffer hole is to the base layer, the smaller its orthographic projection on the base layer.

[0013] In an optional embodiment, the substrate layer includes a first flexible substrate, an inorganic substrate disposed on the first flexible substrate, and a second flexible substrate disposed on the inorganic substrate away from the first flexible substrate.

[0014] When the buffer hole includes the substrate buffer hole, the substrate buffer hole sequentially penetrates the second flexible substrate, the inorganic substrate, and one or more of the first flexible substrate, and the orthographic projection of the substrate buffer hole on the substrate layer covers the orthographic projection of the laser hole on the substrate layer.

[0015] In an optional embodiment, the apertures of the substrate buffer holes passing through the second flexible substrate, the inorganic substrate, and the first flexible substrate are the same or different, and the closer to the first flexible substrate, the smaller the apertures of the substrate buffer holes passing through the second flexible substrate, the inorganic substrate, and the first flexible substrate.

[0016] In an optional embodiment, when the buffer hole includes an inorganic buffer hole, the inorganic buffer hole sequentially penetrates one or more driving inorganic insulating layers from the driving inorganic insulating layer on the side of the driving circuit layer farthest from the substrate layer toward the substrate layer, and the aperture of the inorganic buffer hole is greater than or equal to the maximum aperture of the substrate buffer hole.

[0017] The aperture of the inorganic buffer hole at a position of the driving inorganic insulating layer farther from the base layer is greater than or equal to the aperture of the inorganic buffer hole at a position of the driving inorganic insulating layer closer to the base layer.

[0018] In an optional embodiment, the encapsulation layer includes a first inorganic encapsulation layer located on a surface of the light-emitting device layer away from the substrate layer, an organic encapsulation layer located on a surface of the first inorganic encapsulation layer away from the substrate layer, and a second inorganic encapsulation layer located on a surface of the organic encapsulation layer away from the substrate layer.

[0019] The orthographic projection of the second inorganic encapsulation layer on the base layer covers the orthographic projection of the organic encapsulation layer on the base layer,

[0020] A portion of the surface of the second inorganic encapsulation layer close to the base layer is bonded to a portion of the surface of the first inorganic encapsulation layer close to the base layer.

[0021] In an optional embodiment, when the buffer hole includes a packaging buffer hole, the packaging buffer hole sequentially penetrates the second inorganic packaging layer and the first inorganic packaging layer, and there is a gap between the boundary of the packaging buffer hole and the boundary of the organic packaging layer on a side close to the packaging buffer hole.

[0022] The aperture of the packaging buffer hole at the position of the second inorganic packaging layer is greater than or equal to the aperture of the packaging buffer hole at the position of the first inorganic packaging layer,

[0023] The aperture of the encapsulation buffer hole at the position of the first inorganic encapsulation layer is greater than or equal to the maximum aperture of the inorganic buffer holes.

[0024] In an optional embodiment, the touch layer includes:

[0025] a touch-sensitive inorganic layer, located on a side of the encapsulation layer away from the base layer; and

[0026] The touch organic layer at least covers the surface of the touch inorganic layer away from the base layer, and the laser hole penetrates the touch organic layer; wherein the touch buffer hole includes a first touch hole penetrating the touch inorganic layer, and the aperture of the first touch hole is greater than or equal to the aperture of the second inorganic encapsulation layer.

[0027] In an optional embodiment, the touch-sensitive organic layer further includes a plurality of first stress release holes surrounding the laser hole, each of the first stress release holes penetrates the touch-sensitive organic layer, and the orthographic projection of each of the first stress release holes on the base layer is a ring-shaped projection.

[0028] In an optional embodiment, the display panel further includes:

[0029] a polarizing adhesive layer located on a side of the touch inorganic layer away from the base layer, the polarizing adhesive layer comprising a first polarizing hole which is arranged at a position corresponding to the laser hole and has the same aperture as the laser hole;

[0030] The polarizing layer is located on a side of the polarizing adhesive layer away from the base layer, and the polarizing layer includes a second polarizing hole which is arranged at a position corresponding to the laser hole and has the same aperture as the laser hole.

[0031] In an optional embodiment, the touch-control organic layer at least covers the surface of the touch-control inorganic layer away from the base layer, and the touch-control organic layer covers the side wall surfaces of each film layer through which the at least one buffer hole penetrates;

[0032] The touch buffer hole further includes a second touch hole vertically arranged and penetrating the touch organic layer, wherein the aperture of the second touch hole is larger than that of the laser hole.

[0033] The polarizing adhesive layer covers a surface of the touch organic layer away from the base layer and adheres to a side wall of the second touch hole.

[0034] In an optional embodiment, the touch-sensitive organic layer covers a first horizontal surface, an inclined surface, and a portion of a second horizontal surface of the touch-sensitive inorganic layer on a side away from the base layer, wherein the second horizontal surface is closer to the laser hole than the first horizontal surface.

[0035] There is a gap between the end of the touch organic layer located on the second horizontal surface and the laser hole.

[0036] The touch buffer hole further includes a third touch hole penetrating the touch organic layer, the third touch hole leaking out of another portion of the second horizontal surface of the touch inorganic layer away from the base layer, and the aperture of the third touch hole close to the base layer is smaller than the aperture of the third touch hole away from the base layer;

[0037] The polarizing adhesive layer covers the surface of the touch-sensitive organic layer away from the base layer, and covers another portion of the second horizontal surface of the touch-sensitive inorganic layer away from the base layer.

[0038] In an optional embodiment, the display panel further includes:

[0039] a color filter layer located on a surface of the touch inorganic layer away from the base layer, the color filter layer comprising a first color filter hole located at a position corresponding to the laser hole, the aperture of the first color filter hole being larger than the laser hole; and

[0040] The color film adhesive layer is located on a side of the color film layer away from the base layer, and the laser hole penetrates the color film adhesive layer.

[0041] In an optional embodiment, the touch-control organic layer covers the surface of the touch-control inorganic layer away from the base layer, and the touch-control organic layer covers the side wall surfaces of each film layer through which the at least one buffer hole penetrates;

[0042] The touch buffer hole further includes a fourth touch hole vertically arranged and penetrating the touch organic layer, wherein the fourth touch hole is larger than the laser hole;

[0043] The color filter layer covers the surface of the touch organic layer away from the base layer, and the aperture of the first color filter hole of the color filter layer is equal to the aperture of the fourth touch hole;

[0044] The color film adhesive layer covers the surface of the touch organic layer away from the base layer, and covers the side walls of the fourth touch hole and the first color film hole. The laser hole penetrates the color film adhesive layer.

[0045] In an optional embodiment, the touch organic layer covers the first horizontal surface, the inclined surface and a portion of the second horizontal surface of the encapsulation layer on a side away from the base layer, and the second horizontal surface is closer to the laser hole than the first horizontal surface.

[0046] There is a gap between the end of the touch organic layer located on the second horizontal surface and the laser hole.

[0047] The touch buffer hole further includes a fifth touch hole penetrating the touch organic layer, the fifth touch hole leaking out of another portion of the second horizontal surface of the touch inorganic layer away from the base layer, and the hole diameter of the fifth touch hole close to the base layer is smaller than the hole diameter of the fifth touch hole away from the base layer;

[0048] The color filter layer covers the surface of the touch organic layer away from the base layer, and the first color filter hole of the color filter layer leaks out of a part of the second horizontal surface of the touch inorganic layer away from the base layer.

[0049] The color film adhesive layer covers the surface of the color film layer away from the base layer, and covers a portion of the second horizontal surface of the touch-control inorganic layer away from the base layer that leaks out of the first color film hole.

[0050] In an optional embodiment, the color film adhesive layer further includes a plurality of second stress release holes surrounding the laser hole, each of the second stress release holes penetrates the color film adhesive layer, and the orthographic projection of each of the second stress release holes on the base layer is a ring projection.

[0051] In an optional embodiment, the display panel includes a plurality of blocking structures, wherein the orthographic projection of the blocking structure on the substrate layer is located in a spaced region between the orthographic projection of the laser hole and the organic encapsulation layer on the substrate layer.

[0052] The distance between the hole boundary of the buffer hole and the hole boundary of the laser hole is smaller than the distance between the blocking structure closest to the laser hole and the hole boundary of the laser hole.

[0053] or

[0054] The distance between the hole boundary of the touch buffer hole corresponding to the touch organic layer and the hole boundary of the laser hole is greater than the distance between the blocking structure farthest from the laser hole and the hole boundary of the laser hole.

[0055] or

[0056] The distance between the hole boundary of the first color filter hole corresponding to the color filter layer and the boundary of the laser hole is greater than the distance between the blocking structure farthest from the laser hole and the hole boundary of the laser hole.

[0057] A second aspect of the present invention provides a display device, comprising the display panel according to the first aspect of the present invention.

[0058] A third aspect of the present invention provides a method for manufacturing the display panel according to the first aspect of the present invention, the method comprising:

[0059] forming a driving circuit layer on the base layer, wherein the driving circuit layer comprises a plurality of driving inorganic insulating layers and a driving organic planar layer that insulate adjacent conductive layers;

[0060] forming a light emitting device layer on the driving circuit layer;

[0061] forming an encapsulation layer on the light-emitting device layer, wherein the encapsulation layer comprises a plurality of inorganic encapsulation layers and an organic encapsulation layer;

[0062] The method further comprises:

[0063] Forming at least one buffer hole penetrating one or more layers of the base layer, the driving circuit layer, the light-emitting device layer, the encapsulation layer, and the touch layer;

[0064] A laser hole is formed in the hole area, penetrating the base layer, the driving circuit layer, the light-emitting device layer, the packaging layer, and the touch layer.

[0065] The beneficial effects of the present invention are as follows:

[0066] In the embodiment of the present invention, a buffer hole with a larger aperture than the laser hole is arranged in one or more film layers in the opening area of ​​the display device, so that a buffer exists between each film layer at the hole boundary position of the buffer hole and the hole boundary of the laser hole, thereby effectively reducing the probability of cracks occurring around the hole area under the laser hole manufacturing process and various reliability test conditions, thereby ensuring the display effect of the flexible display. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] The specific implementation modes of the present invention are further described in detail below in conjunction with the accompanying drawings.

[0068] Figure 1 A schematic diagram showing the structure of a display panel according to an embodiment of the present invention;

[0069] Figure 2 A schematic diagram showing the structure of a display panel having a substrate buffer hole in a substrate layer according to an embodiment of the present invention;

[0070] Figure 3 A schematic structural diagram showing a display panel having substrate buffer holes with different apertures in a substrate layer according to an embodiment of the present invention;

[0071] Figure 4 A schematic diagram showing the structure of a display panel having an inorganic buffer hole in a driving circuit layer according to an embodiment of the present invention;

[0072] Figure 5 A schematic structural diagram showing a display panel having an encapsulation layer with encapsulation buffer holes according to an embodiment of the present invention;

[0073] Figure 6 A schematic structural diagram showing a display panel with a first stress release hole according to an embodiment of the present invention;

[0074] Figure 7 Show Figure 6 A schematic top view of a plurality of first stress relief holes shown;

[0075] Figure 8 A schematic structural diagram of a display panel having a polarizing layer and a first stress release hole according to an embodiment of the present invention is shown;

[0076] Fig. 9 A schematic diagram showing the hole structure of the polarizing adhesive layer and the touch organic layer according to an optional embodiment of the present invention;

[0077] Fig.10 A schematic diagram showing the hole structure of the polarizing adhesive layer and the touch organic layer according to another optional embodiment of the present invention;

[0078] Fig.11 A schematic diagram showing the structure of a display panel with a color filter layer according to an embodiment of the present invention;

[0079] Fig.12 A schematic diagram showing the hole structure of the color filter layer and the touch organic layer according to an embodiment of the present invention;

[0080] Fig.13 A schematic structural diagram showing a display panel having a color filter layer and a second stress release hole according to an optional embodiment of the present invention;

[0081] Fig.14 A schematic structural diagram of a display panel with a color filter layer and a second stress release hole according to an optional embodiment of the present invention is shown. DETAILED DESCRIPTION

[0082] In order to explain the present invention more clearly, the present invention is further described below in conjunction with embodiments and drawings. Similar components in the drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the content specifically described below is illustrative rather than restrictive, and the protection scope of the present invention should not be limited thereto.

[0083] In order to solve the problem that cracks are easily generated in the inorganic film layer of the flexible display device in the opening area during the manufacturing process, thereby causing damage to the flexible display device and failure to display normally, the present invention proposes a display panel, a manufacturing method and a display device to solve the above problem.

[0084] The first embodiment of the present invention provides a display panel, such as Figure 1 to Figure 14 As shown, the display panel includes a hole area HOLE and a display area AA at least partially surrounding the hole area HOLE, and the display panel includes a base layer 10, a driving circuit layer 20, a light-emitting device layer 30, an encapsulation layer 40 and a touch layer 50 stacked in sequence, wherein:

[0085] The driving circuit layer 20 includes a plurality of driving inorganic insulating layers (21, 23, 25, 27) for insulating adjacent conductive layers and a driving organic planar layer 29;

[0086] The encapsulation layer 40 includes a plurality of inorganic encapsulation layers and an organic encapsulation layer;

[0087] The hole area HOLE includes a laser hole H00 penetrating the base layer 10, the driving circuit layer 20, the light emitting device layer 30, the encapsulation layer 40, and the touch layer 50, and

[0088] At least one buffer hole HC00, each of the buffer holes HC00 penetrates one or more layers of the base layer 10, the driving circuit layer 20, the light-emitting device layer 30, the packaging layer 40, and the touch layer 50, and the orthographic projection of the buffer hole HC00 on the base layer 10 covers the orthographic projection of the laser hole H00 on the base layer 10.

[0089] In the embodiment of the present invention, a buffer hole HC00 having a larger aperture than the laser hole H00 is arranged in one or more film layers of the hole area HOLE of the display device, so that a buffer exists between each film layer at the hole boundary position of the buffer hole HC00 and the hole boundary of the laser hole H00, thereby effectively reducing the probability of cracks occurring around the hole area HOLE under the manufacturing process of the laser hole H00 and various reliability test conditions, thereby ensuring the display effect of the flexible display.

[0090] The position designs of different buffer holes HC00 according to the embodiments of the present invention are now described.

[0091] In an optional embodiment, if Figure 1 to Figure 14 As shown, the buffer hole HC00 includes one or more of a base buffer hole H101 that penetrates at least a portion of the base layer 10, an inorganic buffer hole H201 that penetrates at least a portion of the driving inorganic insulating layer (21, 23, 25, 27), an encapsulation buffer hole H401 that penetrates at least a portion of the encapsulation layer 40, and a touch buffer hole HC50 that penetrates the touch layer 50.

[0092] Since the laser hole H00 runs through the entire display panel, buffer holes HC00 can be set in different film layers of the display panel of the embodiment of the present invention, so that there is a certain distance between the hole boundary of the buffer hole HC00 and the hole boundary of the laser hole H00 at the corresponding position of each film layer, thereby reducing the probability of cracks in multiple film layers at the hole area HOLE position of the display panel.

[0093] In the film stacking direction, such as Figure 1 to Figure 14 As shown, for one or more of the substrate buffer hole H101, the inorganic buffer hole H201, the first organic buffer hole H201, and the package buffer hole H401, the aperture of the buffer hole HC00 away from the substrate layer 10 is greater than or equal to the aperture of the buffer hole HC00 close to the substrate layer 10. In other words, from the cross-sectional schematic diagram, the buffer hole HC00 located above and the buffer hole HC00 located below form a stepped hole structure to form a multi-layer buffer structure, further improving the crack problem.

[0094] In an optional embodiment, the substrate layer 10 includes a first flexible substrate 11, an inorganic substrate 12 arranged on the first flexible substrate 11, and a second flexible substrate 13 arranged on the inorganic substrate 12 away from the first flexible substrate 11. Therefore, the display panel of the embodiment of the present invention can be applied to flexible display and adapt to a wider range of application scenarios.

[0095] like Figure 2 As shown, when the buffer hole HC00 includes the substrate buffer hole H101, the substrate buffer hole H101 sequentially penetrates the second flexible substrate 13, the inorganic substrate 12, and one or more of the first flexible substrate 11, and the orthographic projection of the substrate buffer hole H101 on the substrate layer 10 covers the orthographic projection of the laser hole H00 on the substrate layer 10.

[0096] For example Figure 2 As shown, the substrate buffer hole H101 of this embodiment penetrates the second flexible substrate 13 and the inorganic substrate 12, and the first inorganic substrate 12 does not have the substrate buffer hole H101, that is, the first inorganic substrate only has the laser hole H00. Figure 2 Only one implementation of the substrate buffer hole H101 is shown. In the embodiment of the present invention, the substrate buffer hole H101 may be provided only in the second flexible substrate 13, or all three film layers of the substrate layer 10 may be provided with the substrate buffer hole H101, which are all within the protection scope of the embodiment of the present invention.

[0097] In an optional embodiment, if Figure 2 or Figure 3As shown, the apertures of the substrate buffer holes H101 penetrating the second flexible substrate 13, the inorganic substrate 12, and the first flexible substrate 11 are the same or different. Figure 2 As shown, the apertures of the substrate buffer hole H101 at the position of the second flexible substrate 13 and the substrate buffer hole H101 at the position of the inorganic substrate 12 are the same. Figure 3 As shown, the apertures of the substrate buffer hole H101 at the second flexible substrate 13 and the substrate buffer hole H101 at the inorganic substrate 12 are different.

[0098] When the apertures of the substrate buffer holes H101 of the substrate layer 10 are different, the apertures of the substrate buffer holes H101 penetrating the second flexible substrate 13, the inorganic substrate 12, and the first flexible substrate 11 are smaller as they are closer to the first flexible substrate 11. Figure 3 As shown, the aperture of the substrate buffer hole H101 located on the second flexible substrate 13 is larger than the aperture of the substrate buffer hole H101 located on the inorganic substrate 12, that is, the aperture of the substrate buffer hole H101 opened in the film layer of the substrate layer 10 is larger, thereby forming a stepped substrate buffer hole H101 structure, and the crack problem is further improved by using a multi-layer buffer structure.

[0099] Figure 2 and Figure 3 The schematic structural diagram of the substrate layer 10 having a substrate buffer hole H101 is shown. The driving circuit layer 20 of the embodiment of the present invention may also have a buffer hole HC00.

[0100] In an optional embodiment, if Figure 4 As shown, when the buffer hole HC00 includes an inorganic buffer hole H201, the inorganic buffer hole H201 sequentially penetrates one or more driving inorganic insulating layers (21, 23, 25, 27) from the driving circuit layer 20 on the side farthest from the base layer 10 toward the base layer 10, and the aperture of the inorganic buffer hole H201 is greater than or equal to the maximum aperture of the base buffer hole H101.

[0101] The aperture of the inorganic buffer hole H201 at the driving inorganic insulating layer (21, 23, 25, 27) farther from the base layer 10 is greater than or equal to the aperture of the inorganic buffer hole H201 at the driving inorganic insulating layer (21, 23, 25, 27) closer to the base layer 10.

[0102] like Figure 4 As shown, the driving circuit layer 20 includes:

[0103] A buffer barrier layer 21 is disposed on the base layer 10, and an exemplary buffer barrier layer 21 may be a multi-layer structure;

[0104] The active layer 22 is disposed on the buffer barrier layer 21,

[0105] a first gate insulating layer 23 covering the active layer 22;

[0106] A first gate 24 disposed on the first gate insulating layer 23;

[0107] A second gate insulating layer 25 covering the first gate 24;

[0108] A second gate 26 disposed on the second gate insulating layer 25;

[0109] an interlayer insulating layer 27 covering the second gate electrode 26;

[0110] A source-drain electrode layer 28 disposed on the interlayer insulating layer 27;

[0111] The driving organic planarization layer 29 covering the source-drain electrode layer 28 , that is, the driving organic planarization layer 29 is the uppermost organic insulating layer in the driving circuit layer 20 .

[0112] In the layer structure of the driving circuit layer 20 described in the embodiment of the present invention, the driving inorganic insulating layer (21, 23, 25, 27) includes a buffer barrier layer 21, a first gate insulating layer 23, a second gate insulating layer 25, and an interlayer insulating layer 27. The driving inorganic insulating layer (21, 23, 25, 27) is an inorganic material. Therefore, each of the above-mentioned driving inorganic insulating layers (21, 23, 25, 27) can be provided with a buffer hole HC00, and the buffer holes HC00 provided are all inorganic buffer holes H201. When the embodiment of the present invention includes a substrate buffer hole H101, the aperture of the inorganic buffer hole H201 of this embodiment is greater than or equal to the maximum aperture of the substrate buffer hole H101 to form a stepped sleeve hole.

[0113] In an optional embodiment, when the buffer hole HC00 includes an inorganic buffer hole H201, the inorganic buffer hole H201 penetrates one or more driving inorganic insulating layers (21, 23, 25, 27) in sequence from the driving inorganic insulating layer (21, 23, 25, 27) on the side of the driving circuit layer 20 farthest from the base layer 10 toward the base layer 10.

[0114] like Figure 4 As shown, when there are multiple inorganic buffer holes H201, the apertures of the inorganic buffer holes H201 are the same or different. Figure 4 As shown, the inorganic buffer holes H201 at the buffer barrier layer 21 , the first gate insulating layer 23 , the second gate insulating layer 25 , and the interlayer insulating layer 27 have the same aperture.

[0115] In another embodiment, the apertures of the inorganic buffer holes H201 at the buffer barrier layer 21, the first gate insulating layer 23, the second gate insulating layer 25, and the interlayer insulating layer 27 are different. In this embodiment, the aperture of the inorganic buffer hole H201 at the driving inorganic insulating layer (21, 23, 25, 27) farther from the base layer 10 is greater than or equal to the aperture of the inorganic buffer hole H201 at the driving inorganic insulating layer (21, 23, 25, 27) closer to the base layer 10.

[0116] That is, the closer to the base layer 10, the smaller the aperture of the inorganic buffer hole H201 penetrating the second flexible base 13, the inorganic base 12, and the first flexible base 11. In other words, the aperture of the inorganic buffer hole H201 opened in each film layer of the driving inorganic insulating layer (21, 23, 25, 27) is larger, thereby forming a stepped base buffer hole H101 structure, and using a multi-layer buffer structure to further improve the crack problem.

[0117] The opening arrangement of each film layer driving the inorganic buffer layer can refer to the design of the substrate buffer hole H101 of the substrate layer 10 , and the relevant parts can be referred to, which will not be repeated here.

[0118] In an optional embodiment, if Figure 4 As shown, the display panel includes a plurality of blocking structures 80, the orthographic projection of the blocking structure 80 on the base layer 10 is located in the interval area between the laser hole H00 and the orthographic projection of the organic encapsulation layer on the base layer 10, and the blocking structure 80 and the cathode layer 34 are arranged in the same layer, as shown in FIG. Figure 4 As shown, the display panel is provided with three blocking structures 80, and the blocking structures 80 are used to prevent cracks from spreading and protect the display panel.

[0119] In this embodiment, Figure 4 As shown, the light emitting device layer 30 includes:

[0120] A patterned anode layer 31 disposed on the driving organic planar layer 29, wherein the anode layer 31 is electrically connected to one of the source-drain electrode layers 28;

[0121] A pixel defining layer 32 is disposed on the driving organic planar layer 29, and a pixel opening of the pixel defining layer 32 is disposed at a position corresponding to the patterned anode layer 31; a light emitting material layer 33 is disposed in the pixel opening;

[0122] A cathode layer 34 covers the light emitting material layer 33 and the pixel defining layer 32 .

[0123] like Figure 4As shown, the orthographic projection of the light-emitting device layer 30 of the embodiment of the present invention on the base layer 10 is spaced from the orthographic projection of the buffer hole HC00 on the base layer 10, that is, the various film layers of the light-emitting device layer 30 are not arranged to extend to the hole area HOLE, and the various film layers of the light-emitting device layer 30 are not arranged with the buffer hole HC00 to avoid affecting the display effect.

[0124] In an optional embodiment, if Figure 5 As shown, the encapsulation layer 40 includes:

[0125] A first inorganic encapsulation layer 41 is located on the surface of the light-emitting device layer 30 away from the base layer 10. Exemplarily, the first inorganic encapsulation layer 41 can be made by depositing a silicon oxynitride or silicon nitride film layer using a PECVD process, or can be made using a Sputter process, etc. The film thickness of the first inorganic encapsulation layer 41 ranges from 0.3 to 2.5 um. Exemplarily, the distance between the edge of the first inorganic encapsulation layer 41 and the blocking structure 80 closest to the laser hole H00 ranges from 100 to 500 um;

[0126] The organic encapsulation layer 42 is disposed on the surface of the first inorganic encapsulation layer 41 away from the substrate layer 10. For example, the organic encapsulation layer 42 can be formed by inkjet printing, screen printing, flash evaporation, PECVD or other methods. The main material of the organic encapsulation layer 42 can be a polymer such as acrylate, epoxy, polyurethane, etc., with a thickness of 1um to 15um. For example, the distance between the edge of the organic encapsulation layer 42 and the laser hole H00 is less than the distance between the blocking structure 80 farthest from the laser hole H00 and the laser hole H00; and

[0127] A second inorganic encapsulation layer 43 is arranged on the surface of the organic encapsulation layer 42 away from the base layer 10, and the orthographic projection of the second inorganic encapsulation layer 43 on the base layer 10 covers the orthographic projection of the organic encapsulation layer 42 on the base layer 10, and the partial surface of the second inorganic encapsulation layer 43 close to the base layer 10 is bonded to the partial surface of the first inorganic encapsulation layer 41 close to the base layer 10. The second inorganic encapsulation layer 43 can be made by depositing silicon oxynitride or silicon nitride film by PECVD process, or by sputtering and other processes. The film thickness of the first inorganic encapsulation layer 41 ranges from 0.3 to 2.5um. The inorganic-organic-inorganic stacked encapsulation structure based on the above structure has good overall reliability.

[0128] Based on the buffer hole structure of the embodiment of the present invention, in an optional embodiment, when the buffer hole HC00 includes a packaging buffer hole H401, the packaging buffer hole H401 sequentially penetrates the second inorganic packaging layer 43 and the first inorganic packaging layer 41, and there is a gap between the boundary of the packaging buffer hole H401 and the boundary of the organic packaging layer 42 on the side close to the packaging buffer hole H401, that is, the organic packaging layer 42 does not have a packaging buffer hole H401.

[0129] In the embodiment of the present invention, the aperture of the encapsulation buffer hole H401 located at the first inorganic encapsulation layer 41 and the aperture of the encapsulation buffer hole H401 located at the second inorganic encapsulation layer 43 may be the same or different.

[0130] In one example, if Figure 5 As shown, the aperture of the encapsulation buffer hole H401 at the position of the second inorganic encapsulation layer 43 is equal to the aperture of the encapsulation buffer hole H401 at the position of the first inorganic encapsulation layer 41, and the aperture of the encapsulation buffer hole H401 at the position of the first inorganic encapsulation layer 41 is larger than the aperture of the first organic buffer hole H201.

[0131] In other embodiments, the aperture of the encapsulation buffer hole H401 at the position of the second inorganic encapsulation layer 43 is greater than or equal to the aperture of the encapsulation buffer hole H401 at the position of the first inorganic encapsulation layer 41, and the aperture of the encapsulation buffer hole H401 at the position of the first inorganic encapsulation layer 41 is greater than or equal to the maximum aperture of the inorganic buffer hole H201. Those skilled in the art will design according to actual applications.

[0132] In an optional embodiment, if Figure 5 to Figure 13 As shown, the touch layer 50 includes:

[0133] a touch-sensitive inorganic layer 51 , located on a side of the encapsulation layer 40 away from the base layer 10 ; and

[0134] The touch organic layer 52 at least covers the surface of the touch inorganic layer 51 away from the base layer 10, and the laser hole H00 penetrates the touch organic layer 52; wherein the touch buffer hole HC50 includes a first touch hole H501 penetrating the touch inorganic layer 51, and the aperture of the first touch hole H501 is greater than or equal to the aperture of the second inorganic encapsulation layer 43.

[0135] The display panel of the embodiment of the present invention further designs the structure of the touch layer 50 in the hole area HOLE, and also sets a first touch hole H501 in the touch layer 50, so that there is a buffer distance between the touch inorganic layer 51 located at the boundary of the first touch hole H501 and the boundary of the laser hole H00, thereby reducing the probability of cracks in the inorganic layer during the manufacturing process of the laser hole H00 and preventing the cracks from spreading.

[0136] In the related art, the hole area HOLE of the flexible display device is prone to inorganic film cracks and double-layer substrate interface separation of the flexible substrate layer 10 under high temperature and high humidity conditions. After many experiments, the inventor concluded that one of the reasons for the above-mentioned defects is that the stress difference between the film layers around the hole area is large, which leads to the problem of film layer separation under high temperature and high humidity conditions.

[0137] To solve the above problem, in an optional embodiment, Figure 6 and Figure 7 As shown, the touch organic layer 52 further includes a plurality of first stress release holes H521 surrounding the laser hole H00, each of the first stress release holes H521 penetrates the touch organic layer 52, and the orthographic projection of each of the first stress release holes H521 on the base layer 10 is a ring projection.

[0138] In this embodiment, the touch organic layer 52 is patterned to form a Figure 7 The structure of multiple ring-shaped laser holes H00 in the top view shown can effectively reduce the stress value of the double-layer interface of the inorganic film layer and the base layer 10 at the hole area under high temperature and high humidity conditions, thereby ensuring the display effect of the flexible display panel.

[0139] In one embodiment, Figure 7 As shown, the structure of the first stress release hole H521 of the embodiment of the present invention can be formed simultaneously with the structure of the buffer hole HC00. Figure 7 As shown, the buffer barrier layer 21 of the driving circuit layer, the first gate insulating layer 23, the second gate insulating layer 25, the first inorganic encapsulation layer 41, the second inorganic encapsulation layer 43, and the touch inorganic layer 51 are all provided with buffer holes HC00, thereby forming a plurality of inorganic buffer holes H201 and a first touch hole H501. In this embodiment, the orthographic projection of the first stress release hole H521 with the smallest aperture on the base layer 10 also surrounds the buffer hole HC00 with the largest aperture, that is, the first stress release hole H521 is formed at a position between the hole boundary of the buffer hole HC00 and the film edge of the organic encapsulation layer 42, which can not only avoid crack problems in the display panel, but also improve the reliability of the display panel.

[0140] In an optional embodiment, if Figure 8As shown, the display panel also includes:

[0141] a polarizing adhesive layer 61 located on a side of the touch inorganic layer 51 away from the base layer 10 , wherein the polarizing adhesive layer 61 includes a first polarizing hole H601 which is arranged at a position corresponding to the laser hole H00 and has the same aperture as the laser hole H00 ;

[0142] The polarizing layer 62 located on the side of the polarizing adhesive layer 61 away from the base layer 10 includes a second polarizing hole H602 which is arranged at a position corresponding to the laser hole H00 and has the same aperture as the laser hole H00.

[0143] like Figure 8 The schematic diagram of the layer structure when the display panel has a polarizing structure is shown, that is, the display panel with the polarizing structure can also be applied to the embodiment with the buffer hole HC00 of the aforementioned embodiment, and can also be applied to the embodiment with the first stress release hole H521, thereby expanding the application scenarios of the display panel. Figure 8 In the embodiment shown, the apertures of the first polarizing hole H601 and the second polarizing hole H602 are consistent with the aperture of the laser hole H00. Fig. 9 As shown, the touch buffer hole HC50 also includes a second touch hole H502 vertically arranged to penetrate the touch organic layer 52. The aperture of the second touch hole H502 is larger than the laser hole H00. In this embodiment, the second touch hole H502 is a vertical through hole to utilize the second touch hole H502 to buffer the film layer around the laser hole H00.

[0144] In this embodiment, there are multiple buffer holes, which are opened in part of the base layer 10 (the second flexible base 13 and the inorganic base 12), in each driving inorganic insulating layer (21, 23, 25, 27) of the driving circuit layer 20 (buffer barrier layer 21, first gate insulating layer 23, second gate insulating layer 25), in each inorganic encapsulation layer (first inorganic encapsulation layer 41, second inorganic encapsulation layer 43) of the encapsulation layer 40, and in the touch inorganic layer 52. Fig. 9 In the example shown, under the structure of the second touch hole H502, the aperture of the second touch hole H502 is smaller than the aperture of the buffer hole at the corresponding position of the film layer between the touch organic layer 52 and the first flexible substrate 11. For example, the aperture of the second touch hole H502 is smaller than the aperture of the substrate buffer hole H101, the aperture of the inorganic buffer hole H201, the aperture of the package buffer hole H401, and the aperture of the first touch hole H501.

[0145] In the embodiment of the present invention, Fig. 9As shown, the touch organic layer 52 at least covers the surface of the touch inorganic layer 51 away from the base layer 10, and the touch organic layer 52 covers the side wall surfaces of each film layer penetrated by the at least one buffer hole HC00. Therefore, the embodiment of the present invention uses the touch organic layer 52 to protect the side wall surfaces of each buffer hole HC00 to further form a buffer area.

[0146] In the embodiment of the present invention, the polarizing adhesive layer 61 covers the surface of the touch organic layer 52 away from the base layer 10, and adheres to the side wall of the second touch hole H502, that is, the second touch hole H502 of the touch organic layer 52 is further buffered and protected by the polarizing adhesive layer 61. Exemplarily, the polarizing adhesive layer 61 and the touch organic layer 52 are both organic materials. Therefore, in the embodiment of the present invention, the touch organic layer 52 is used to protect the boundary film layer of each buffer hole HC00, and the polarizing adhesive layer 61 is used to protect the touch organic layer 52, so that the organic material is filled between the laser hole H00 and the buffer hole HC00, and buffer protection is further formed in the laser process to prevent the laser from damaging other film layers.

[0147] In an optional embodiment, if Fig.10 As shown, the touch buffer hole HC50 also includes a third touch hole H503 penetrating the touch organic layer 52, the third touch hole H503 leaks out of another part of the second horizontal surface of the touch inorganic layer 51 away from the base layer 10, and the aperture of the third touch hole H503 close to the base layer 10 is smaller than the aperture of the third touch hole H503 away from the base layer 10.

[0148] That is, the third touch hole H503 of the embodiment of the present invention is an inverted trapezoidal structure. The structural design of the inverted trapezoidal third touch hole H503 based on the touch organic layer 52 is as follows: Fig.10 As shown, the buffer holes of this embodiment are multiple, which are opened in part of the base layer 10 (the second flexible base 13 and the inorganic base 12), in each driving inorganic insulating layer (21, 23, 25, 27) of the driving circuit layer 20 (buffer barrier layer 21, first gate insulating layer 23, second gate insulating layer 25), in each inorganic encapsulation layer (first inorganic encapsulation layer 41, second inorganic encapsulation layer 43) of the encapsulation layer 40, and in the touch inorganic layer 52. Fig.10 In the example shown, under the structure of the third touch hole H503, the aperture of the third touch hole H503 is larger than the aperture of the buffer hole at the corresponding position of the film layer between the touch organic layer 52 and the first flexible substrate 11. For example, the aperture of the third touch hole H503 is larger than the aperture of the substrate buffer hole H101, the aperture of the inorganic buffer hole H201, the aperture of the package buffer hole H401, and the aperture of the first touch hole H501.

[0149] Based on the structural diagram of the third touch hole H503, the touch organic layer 52 covers the first horizontal surface, the inclined surface and part of the second horizontal surface of the touch inorganic layer 51 away from the base layer 10, and the second horizontal surface is closer to the laser hole H00 than the first horizontal surface.

[0150] After the third touch hole H503 of the embodiment of the present invention penetrates the touch organic layer 52, the second horizontal surface of the touch inorganic layer 51 close to the laser hole H00 is exposed, and there is a gap between the end of the touch organic layer 52 located on the second horizontal surface and the laser hole H00, such as Fig.10 As shown, the orthographic projection of the third touch hole H503 close to the side of the base layer 10 falls between the orthographic projections of the organic encapsulation layer 42 and the laser hole H00 on the base layer 10, and the opening area of ​​the inverted trapezoidal third touch hole H503 is larger. Therefore, the overall stress of the touch organic layer 52 will be reduced. That is, the third touch hole H503 of the embodiment of the present invention can not only play the role of forming a buffer area with the laser hole H00, but also play the role of stress release.

[0151] The polarizing adhesive layer 61 covers the surface of the touch organic layer 52 away from the base layer 10, and covers another part of the second horizontal surface of the touch inorganic layer 51 away from the base layer 10, that is, the polarizing adhesive layer 61 covers the touch organic layer 52 and fills the third touch hole H503 to protect the touch organic layer 52 and the third touch hole H503.

[0152] In the embodiment of the present invention, the touch buffer hole HC50 is set as a third touch hole H503 with a larger opening, so as to reduce the stress of the inorganic film layer and the double-layer substrate of the display panel under high temperature and high humidity conditions, and the third touch hole H503 with a larger opening is protected by the polarizing adhesive layer 61, so that the organic material is filled between the laser hole H00 and the buffer hole HC00, and buffer protection is further formed in the laser process to prevent the laser from damaging other film layers.

[0153] It is worth noting that, based on the inverted trapezoidal third touch hole H503 of the touch organic layer 52 of the embodiment of the present invention, the base layer 10, the driving circuit layer 20, and the packaging layer 40 can be provided with buffer holes HC00 of different apertures, for example Figure 2 to Figure 5 The embodiment shown can be used with Fig.10 The third inverted trapezoidal touch hole H503 is also used, and the relevant parts are referred to and will not be described again.

[0154] In an optional embodiment, if Fig.10As shown, the polarizing adhesive layer 61 further includes a plurality of third stress release holes H603 surrounding the laser hole H00, each of the third stress release holes H603 penetrates the polarizing adhesive layer 61, and the orthographic projection of each of the third stress release holes H603 on the base layer 10 is a ring projection. The structure of the third stress release holes H603 of the polarizing adhesive layer 61 of the embodiment of the present invention can refer to the first stress release holes H521 of the touch organic layer 52 of the aforementioned embodiment, further reducing the stress value of the double-layer base interface of the inorganic film layer and the base layer 10 at the hole area under high temperature and high humidity conditions.

[0155] In an optional embodiment, if Figure 11 to Figure 13 As shown, the display panel also includes:

[0156] a color filter layer 71 located on a surface of the touch inorganic layer 51 away from the base layer 10, the color filter layer 71 including a first color filter hole H701 located at a position corresponding to the laser hole H00, the aperture of the first color filter hole H701 being larger than the laser hole H00; and

[0157] The color filter adhesive layer 72 is located on a side of the color filter layer 71 away from the base layer 10 , and the laser hole H00 penetrates the color filter adhesive layer 72 .

[0158] The display panel of the embodiment of the present invention may also apply a COE structure, that is, the color filter layer 71 is directly formed on the encapsulation layer 40 and the polarizing layer 62 is removed.

[0159] Figure 11 to Figure 13 A schematic diagram of the layer structure of a display panel applying the COE solution is shown, that is, a display panel having a color film layer 71 structure can also apply the embodiment with the buffer hole HC00 of the aforementioned embodiment to improve the crack defect of the display panel, and a second stress release hole H702 can also be designed to improve the poor separation of the double-layer substrate, thereby expanding the application scenarios of the display panel. Different embodiments are now described.

[0160] In an optional embodiment, if Fig.11 As shown,

[0161] The touch buffer hole HC50 also includes a fourth touch hole H504 vertically arranged to penetrate the touch organic layer 52. The fourth touch hole H504 is larger than the laser hole H00. That is, the fourth touch hole H504 is a vertical through hole to use the fourth touch hole H504 to buffer the film layer around the laser hole H00.

[0162] In this embodiment, the fourth touch hole H504 is a vertical via hole, so as to use the fourth touch hole H504 to buffer the film layer around the laser hole H00. In this embodiment, there are multiple buffer holes, for example, they are opened in each driving inorganic insulating layer of the driving circuit layer 20 (buffer barrier layer 21, first gate insulating layer 23, second gate insulating layer 25), each inorganic encapsulation layer of the encapsulation layer 40 (first inorganic encapsulation layer 41, second inorganic encapsulation layer 43), and opened in the touch inorganic layer 52.

[0163] based on Fig.11 In the structure of the fourth vertical touch hole H504, the aperture of the fourth touch hole H504 is smaller than the aperture of the buffer hole at the corresponding position of the film layer between the touch organic layer 52 and the first flexible substrate 11, and is larger than the aperture of the laser hole H00. For example, the aperture of the fourth touch hole H504 is smaller than the aperture of the substrate buffer hole H101, the aperture of the inorganic buffer hole H201, the aperture of the package buffer hole H401, and the aperture of the first touch hole H501.

[0164] Fig.11 In the embodiment, the touch organic layer 52 covers the surface of the touch inorganic layer 51 away from the base layer 10, and the touch organic layer 52 covers the side wall surfaces of each film layer penetrated by the at least one buffer hole HC00, and the touch organic layer 52 is used to protect the side wall surfaces of each buffer hole HC00 to further form a buffer area.

[0165] In the embodiment of the present invention, Fig.11 As shown, the color film layer 71 covers the surface of the touch organic layer 52 away from the base layer 10, and the aperture of the first color film hole H701 of the color film layer 71 is equal to the aperture of the fourth touch hole H504, that is, the side wall of the first color film hole H701 and the side wall of the fourth touch hole H504 are flush in the vertical direction, and the apertures of both are larger than the laser hole H00, forming a buffer area with a distance from the laser hole H00.

[0166] Further, such as Fig.11 As shown, in this embodiment, the color film adhesive layer 72 covers the surface of the touch organic layer 52 away from the base layer 10, and covers the side walls of the fourth touch hole H504 and the first color film hole H701, that is, the color film adhesive layer 72 covers the color film layer 71, and fills the buffer area between the first color film hole H701 and the fourth touch hole H504 and the laser hole H00 respectively, so as to protect the color film organic layer and the fourth touch hole H504 and prevent laser damage to other film layers.

[0167] In an optional embodiment, if Fig.12 and Fig.14 As shown,

[0168] The touch buffer hole HC50 also includes a fifth touch hole H505 penetrating the touch organic layer 52, the fifth touch hole H505 leaks out of another portion of the second horizontal surface of the touch inorganic layer 51 away from the base layer 10, and the aperture of the fifth touch hole H505 close to the base layer 10 is smaller than the aperture of the fifth touch hole H505 away from the base layer 10.

[0169] That is to say, the fifth touch hole H505 shown in the embodiment of the present invention is an inverted trapezoidal structure.

[0170] Based on the structural design of the inverted trapezoidal fifth touch hole H505, as shown in FIG. Fig.12 As shown, there are multiple buffer holes in this embodiment, which are opened in part of the base layer 10 (the second flexible base 13 and the inorganic base 12), in each driving inorganic insulating layer of the driving circuit layer 20 (the buffer barrier layer 21, the first gate insulating layer 23, the second gate insulating layer 25), in each inorganic encapsulation layer of the encapsulation layer 40 (the first inorganic encapsulation layer 41, the second inorganic encapsulation layer 43), and in the touch inorganic layer 52.

[0171] like Fig.12 As shown, based on the structure of the fifth touch hole H505, the aperture of the fifth touch hole H505 is larger than the aperture of the buffer hole at the corresponding position of the film layer between the touch organic layer 52 and the first flexible substrate 11. For example, the aperture of the fifth touch hole H505 is larger than the aperture of the substrate buffer hole H101, the aperture of the inorganic buffer hole H201, the aperture of the package buffer hole H401, and the aperture of the first touch hole H501.

[0172] like Fig.12 and Fig.14 In the structural design shown, the touch organic layer 52 covers the first horizontal surface, the inclined surface and part of the second horizontal surface of the touch inorganic layer 51 away from the base layer 10, and the second horizontal surface is closer to the laser hole H00 than the first horizontal surface.

[0173] After the fifth touch hole H505 of the embodiment of the present invention penetrates the touch organic layer 52, the second horizontal surface of the touch inorganic layer 51 close to the laser hole H00 is exposed, and there is a gap between the end of the touch organic layer 52 located on the second horizontal surface and the laser hole H00, such as Fig.12 and Fig.14As shown, the orthographic projection of the fifth touch hole H505 close to the side of the base layer 10 falls between the orthographic projections of the organic encapsulation layer 42 and the laser hole H00 on the base layer 10. Therefore, the opening area of ​​the inverted trapezoidal fifth touch hole H505 is larger, so that the overall stress of the touch organic layer 52 is reduced. That is, the fifth touch hole H505 of the embodiment of the present invention can not only play the role of forming a buffer area between the laser hole H00, but also play the role of stress release.

[0174] Based on the structural design of the inverted trapezoidal fifth touch hole H505, as shown in FIG. Fig.12 and Fig.14 As shown, the buffer holes in this embodiment are multiple, which are opened in part of the base layer 10 (the second flexible base 13 and the inorganic base 12), in each driving inorganic insulating layer of the driving circuit layer 20 (the buffer barrier layer 21, the first gate insulating layer 23, and the second gate insulating layer 25), in each inorganic encapsulation layer of the encapsulation layer 40 (the first inorganic encapsulation layer 41, the second inorganic encapsulation layer 43), and in the touch inorganic layer 52. Fig.12 and Fig.14 In the example shown, under the structure of the fifth touch hole H505, the aperture of the fifth touch hole H505 is larger than the aperture of the buffer hole at the corresponding position of the film layer between the touch organic layer 52 and the first flexible substrate 11. For example, the aperture of the fifth touch hole H505 is larger than the aperture of the substrate buffer hole H101, the aperture of the inorganic buffer hole H201, the aperture of the package buffer hole H401, and the aperture of the first touch hole H501.

[0175] like Fig.12 and Fig.14 As shown, the color filter layer 71 covers the surface of the touch organic layer 52 away from the base layer 10, and the first color filter hole H701 of the color filter layer 71 leaks out of a portion of the second horizontal surface of the touch inorganic layer 51 away from the base layer 10. In this embodiment, the aperture of the first color filter hole H701 close to the base layer 10 is smaller than the aperture of the first color filter hole H701 away from the base layer 10, that is, the first color filter hole H701 of this embodiment is also an inverted trapezoidal hole, so that the stress of the color filter layer 71 is also low.

[0176] like Fig.12 and Fig.14 As shown, the color filter adhesive layer 72 covers the surface of the color filter layer 71 away from the base layer 10, and covers a portion of the second horizontal surface of the touch inorganic layer 51 that leaks out of the first color filter hole H701 and is away from the base layer 10. In this embodiment, the polarizing adhesive layer 61 covers the color filter layer 71 and fills the first color filter hole H701 to protect the color filter layer 71 and form a laser buffer to prevent laser damage to other film layers.

[0177] It is worth noting that, based on the inverted trapezoidal fifth touch hole H505 of the touch organic layer 52 of the embodiment of the present invention, the base layer 10, the driving circuit layer 20, and the packaging layer 40 can be provided with buffer holes HC00 of different apertures, for example Figure 2 to Figure 5 The embodiment shown can be used with Fig.11 and Fig.12 The fifth touch hole H505 in the shape of an inverted trapezoid is also used, and the relevant parts are referred to and will not be described again.

[0178] In an optional embodiment, if Fig.13 As shown, the touch organic layer 52 includes a plurality of first stress release holes H521 surrounding the laser hole H00, each of the first stress release holes H521 penetrates the touch organic layer 52, and each of the touch organic layer 52 has an annular projection on the base layer 10, which further reduces the stress value of the double-layer base interface of the inorganic film layer and the base layer 10 at the hole area under high temperature and high humidity conditions.

[0179] In an optional embodiment, if Fig.14 As shown, the color film adhesive layer 72 further includes a plurality of second stress release holes H702 surrounding the laser hole H00, each of the second stress release holes H702 penetrates the color film adhesive layer 72, and the orthographic projection of each of the second stress release holes H702 on the substrate layer 10 is a ring projection. The structure of the second stress release holes H702 of the color film adhesive layer 72 of the embodiment of the present invention can refer to the first stress release holes H521 of the touch organic layer 52 of the aforementioned embodiment, further reducing the stress value of the double-layer substrate interface of the inorganic film layer and the substrate layer 10 at the hole area under high temperature and high humidity conditions.

[0180] In an optional embodiment, if Figure 1 to Figure 14 As shown, the display panel includes a plurality of blocking structures 80, and the orthographic projection of the blocking structure 80 on the base layer 10 is located in the interval area between the orthographic projection of the laser hole H00 and the organic encapsulation layer 42 on the base layer 10. Based on the layer structure design of the display panel, the blocking structure 80 is formed by the organic layer in the display panel film layer, such as driving the organic planar layer 29 or the pixel defining layer 32, to save process efficiency.

[0181] like Fig.14 As shown, three blocking structures 80 are provided, such as Fig.14 In the horizontal direction shown, there are the first blocking structure 801, the second blocking structure 802 and the third blocking structure 803 in sequence, that is, the third blocking structure 803 is closest to the laser hole H00, and the first blocking structure 801 is farthest from the laser hole H00.

[0182] Under the three blocking structures of the embodiments of the present invention, the distance value between the hole boundary of the buffer hole HC00 opened in each film layer and the hole boundary of the laser hole H00 has a preferred embodiment.

[0183] In an optional embodiment, the distance between the hole boundary of the buffer hole HC00 and the hole boundary of the laser hole H00 is smaller than the distance between the blocking structure 80 closest to the laser hole H00 and the hole boundary of the laser hole H00.

[0184] Exemplarily, the boundary of the buffer hole HC00 in the embodiment of the present invention is located between the third blocking structure 803 and the laser hole H00. Based on the aforementioned embodiment, when the buffer hole HC00 in the embodiment of the present invention has different apertures, for example, the boundary of the substrate buffer hole H101 located in the substrate layer 10 is also located between the third blocking structure 803 and the laser hole H00, and the boundary of the package buffer hole H401 located in the package layer 40 is also located between the third blocking structure 803 and the laser hole H00, so as to avoid damage to the blocking structure 80 caused by the buffer area formed by the buffer hole HC00.

[0185] In another embodiment, the distance between the hole boundary of the touch buffer hole HC50 corresponding to the touch organic layer 52 and the hole boundary of the laser hole H00 is greater than the distance between the blocking structure 80 farthest from the laser hole H00 and the hole boundary of the laser hole H00.

[0186] like Figure 1 to Figure 14 As shown, the boundary of the touch organic layer 52 is farther away from the laser hole H00 than the first blocking structure 801 , and the orthographic projection of the touch organic layer 52 on the base layer 10 ends at the outer boundary of the orthographic projection of the first blocking structure 801 on the base layer 10 away from the laser hole H00 , ensuring the packaging effect.

[0187] In another embodiment, Fig.14 As shown, the distance between the hole boundary of the first color filter hole H701 corresponding to the color filter layer 71 and the boundary of the laser hole H00 is greater than the distance between the blocking structure 80 farthest from the laser hole H00 and the hole boundary of the laser hole H00.

[0188] like Fig.12 and Fig.14 As shown, when the touch buffer hole HC50 includes a fifth touch hole H505 penetrating the touch organic layer 52, the fifth touch hole H505 leaks out of a portion of the horizontal surface of the touch inorganic layer 51 away from the base layer 10, and the film boundary of the color film layer 71 formed on the touch organic layer 52 ends on the surface of the touch inorganic layer 51.

[0189] In this embodiment, the orthographic projection of the first color filter hole H701 on the base layer 10 ends at the outer boundary of the orthographic projection of the first blocking structure 801 on the base layer 10 away from the laser hole H00, that is, the boundary of the orthographic projection of the first color filter hole H701 on the base layer 10 is farther away from the laser hole H00 than the first blocking structure 801, thereby preventing the laser crack from extending to the color filter layer 71.

[0190] Based on the present invention Figure 1 to Figure 14 The display panel shown in the figure has a front protective layer 91 such as a flexible protective layer or a glass protective layer attached to the color film adhesive layer 72 or to the surface of the polarizing adhesive layer 61 on the side away from the base layer 10, the color film layer 71 and the front protective layer 91 are bonded and fixed by using the color film adhesive layer 72, or the polarizing layer 62 and the front protective layer 91 are bonded and fixed by using the optical adhesive layer 92, and a functional film layer 93, such as a back protective layer and a heat dissipation film layer, is attached to the surface of the base layer 10 on the side away from the driving circuit layer 20.

[0191] like Figure 1 to Figure 14 As shown, the buffer holes HC00 at the corresponding positions of the film layers composed of inorganic materials adjacent to the hole area HOLE can be formed simultaneously. For example, the first inorganic encapsulation layer 41, the second inorganic encapsulation layer 43 and the touch inorganic layer 51 are adjacent film layers in the hole area HOLE. Therefore, the encapsulation buffer hole H401 of the first inorganic encapsulation layer 41, the encapsulation buffer hole H401 of the second inorganic encapsulation layer 43 and the inorganic buffer hole H501 of the touch inorganic layer 51 can be formed simultaneously. The first touch hole H501 of the touch organic layer 52 and the buffer hole of the inorganic material are formed separately. The first polarizing hole H601 of the polarizing layer 62 and the buffer hole of the inorganic material are formed separately. The first color filter hole H701 of the color filter layer 71 and the buffer hole of the inorganic material are formed separately.

[0192] The second embodiment of the present invention provides a display device, which includes the display panel of the above embodiment of the present invention. The display device can be any product or component with a display function, such as electronic paper, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, navigator, etc., which is not limited in this embodiment.

[0193] A third embodiment of the present invention provides a method for manufacturing a display panel according to the above embodiment of the present invention, the method comprising:

[0194] A driving circuit layer 20 is formed on the base layer 10, wherein the driving circuit layer 20 includes a plurality of driving inorganic insulating layers (21, 23, 25, 27) for insulating adjacent conductive layers and a driving organic flat layer 29;

[0195] forming a light emitting device layer 30 on the driving circuit layer 20;

[0196] forming an encapsulation layer 40 on the light emitting device layer 30, wherein the encapsulation layer 40 includes a plurality of inorganic encapsulation layers and an organic encapsulation layer 42;

[0197] The method further comprises:

[0198] Forming at least one buffer hole HC00 penetrating one or more layers of the base layer 10, the driving circuit layer 20, the light-emitting device layer 30, the encapsulation layer 40, and the touch layer 50;

[0199] A laser hole H00 penetrating the base layer 10 , the driving circuit layer 20 , the light emitting device layer 30 , the encapsulation layer 40 , and the touch layer 50 is formed in the hole region.

[0200] The manufacturing method of the embodiment of the present invention performs a hole process on one or more film layers in the opening area of ​​the display device to form a buffer hole HC00 with a larger hole diameter than the laser hole H00, so that there is a buffer between each film layer at the hole boundary position of the buffer hole HC00 and the hole boundary of the laser hole H00, effectively reducing the probability of cracks occurring around the hole area under the laser hole H00 manufacturing process and various reliability test conditions, thereby ensuring the display effect of the flexible display.

[0201] It is worth noting that the specific embodiment of the method for manufacturing the display panel of the embodiment of the present invention can refer to the display panel of the aforementioned embodiment, which will not be described in detail here.

[0202] In the description of the present invention, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0203] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the embodiments here. All obvious changes or modifications derived from the technical solution of the present invention are still within the protection scope of the present invention.

Claims

1. A display panel, comprising a hole area and a display area at least partially surrounding the hole area, characterized in that: The display panel includes a substrate layer, a driving circuit layer, a light emitting device layer, a packaging layer and a touch layer which are stacked in sequence, wherein: The driving circuit layer includes a plurality of driving inorganic insulating layers and a driving organic planar layer that insulate adjacent conductive layers; The encapsulation layer includes a plurality of inorganic encapsulation layers and an organic encapsulation layer; The hole area includes a laser hole that penetrates the substrate layer, the driving circuit layer, the light-emitting device layer, the packaging layer, and the touch layer, and At least one buffer hole, each of the buffer holes penetrates one or more layers of the base layer, the drive circuit layer, the light-emitting device layer, the packaging layer, and the touch layer, and the orthographic projection of the buffer hole on the base layer covers the orthographic projection of the laser hole on the base layer.

2. The display panel according to claim 1, characterized in that: The buffer hole includes one or more of a base buffer hole penetrating at least a portion of the base layer, an inorganic buffer hole penetrating at least a portion of the driving inorganic insulating layer, a first organic buffer hole penetrating the driving organic planar layer, an encapsulation buffer hole penetrating at least a portion of the encapsulation layer, and a touch buffer hole penetrating the touch layer. In the film layer stacking direction, the closer the buffer hole is to the base layer, the smaller its orthographic projection on the base layer.

3. The display panel according to claim 2, characterized in that: The base layer includes a first flexible base, an inorganic base disposed on the first flexible base, and a second flexible base disposed on the inorganic base away from the first flexible base. When the buffer hole includes the substrate buffer hole, the substrate buffer hole sequentially penetrates the second flexible substrate, the inorganic substrate, and one or more of the first flexible substrate, and the orthographic projection of the substrate buffer hole on the substrate layer covers the orthographic projection of the laser hole on the substrate layer.

4. The display panel according to claim 3, characterized in that: The apertures of the substrate buffer holes passing through the second flexible substrate, the inorganic substrate, and the first flexible substrate are the same or different, and the closer to the first flexible substrate, the smaller the apertures of the substrate buffer holes passing through the second flexible substrate, the inorganic substrate, and the first flexible substrate.

5. The display panel according to claim 4, characterized in that: When the buffer hole includes an inorganic buffer hole, the inorganic buffer hole sequentially penetrates one or more driving inorganic insulating layers from the driving inorganic insulating layer on the side of the driving circuit layer farthest from the base layer toward the base layer, and the aperture of the inorganic buffer hole is greater than or equal to the maximum aperture of the base buffer hole. The aperture of the inorganic buffer hole at a position of the driving inorganic insulating layer farther from the base layer is greater than or equal to the aperture of the inorganic buffer hole at a position of the driving inorganic insulating layer closer to the base layer.

6. The display panel according to claim 5, characterized in that: The encapsulation layer includes a first inorganic encapsulation layer located on a surface of the light emitting device layer away from the base layer, an organic encapsulation layer located on a surface of the first inorganic encapsulation layer away from the base layer, and a second inorganic encapsulation layer located on a surface of the organic encapsulation layer away from the base layer. The orthographic projection of the second inorganic encapsulation layer on the base layer covers the orthographic projection of the organic encapsulation layer on the base layer, A portion of the surface of the second inorganic encapsulation layer close to the base layer is bonded to a portion of the surface of the first inorganic encapsulation layer close to the base layer.

7. The display panel according to claim 6, characterized in that: When the buffer hole includes a packaging buffer hole, the packaging buffer hole sequentially penetrates the second inorganic packaging layer and the first inorganic packaging layer, and there is a gap between the boundary of the packaging buffer hole and the boundary of the organic packaging layer near the packaging buffer hole. The aperture of the packaging buffer hole at the position of the second inorganic packaging layer is greater than or equal to the aperture of the packaging buffer hole at the position of the first inorganic packaging layer, The aperture of the encapsulation buffer hole at the position of the first inorganic encapsulation layer is greater than or equal to the maximum aperture of the inorganic buffer holes.

8. The display panel according to claim 7, characterized in that: The touch layer comprises: a touch-sensitive inorganic layer, located on a side of the encapsulation layer away from the base layer; and The touch organic layer at least covers the surface of the touch inorganic layer away from the base layer, and the laser hole penetrates the touch organic layer; wherein the touch buffer hole includes a first touch hole penetrating the touch inorganic layer, and the aperture of the first touch hole is greater than or equal to the aperture of the second inorganic encapsulation layer.

9. The display panel according to claim 8, characterized in that: The touch-sensitive organic layer further includes a plurality of first stress release holes surrounding the laser hole, each of the first stress release holes penetrates the touch-sensitive organic layer, and an orthographic projection of each of the first stress release holes on the base layer is a ring-shaped projection.

10. The display panel according to claim 8, characterized in that: The display panel further includes: a polarizing adhesive layer located on a side of the touch inorganic layer away from the base layer, the polarizing adhesive layer comprising a first polarizing hole which is arranged at a position corresponding to the laser hole and has the same aperture as the laser hole; The polarizing layer is located on a side of the polarizing adhesive layer away from the base layer, and the polarizing layer includes a second polarizing hole which is arranged at a position corresponding to the laser hole and has the same aperture as the laser hole.

11. The display panel according to claim 10, characterized in that: The touch control organic layer at least covers the surface of the touch control inorganic layer away from the base layer, and the touch control organic layer covers the side wall surfaces of each film layer penetrated by the at least one buffer hole; The touch buffer hole further includes a second touch hole vertically arranged and penetrating the touch organic layer, wherein the aperture of the second touch hole is larger than that of the laser hole. The polarizing adhesive layer covers a surface of the touch organic layer away from the base layer and adheres to a side wall of the second touch hole.

12. The display panel according to claim 10, characterized in that: The touch-control organic layer covers the first horizontal surface, the inclined surface, and a portion of the second horizontal surface of the touch-control inorganic layer away from the base layer, wherein the second horizontal surface is closer to the laser hole than the first horizontal surface. There is a gap between the end of the touch organic layer located on the second horizontal surface and the laser hole. The touch buffer hole further includes a third touch hole penetrating the touch organic layer, the third touch hole leaking out of another portion of the second horizontal surface of the touch inorganic layer away from the base layer, and the aperture of the third touch hole close to the base layer is smaller than the aperture of the third touch hole away from the base layer; The polarizing adhesive layer covers the surface of the touch-sensitive organic layer away from the base layer, and covers another portion of the second horizontal surface of the touch-sensitive inorganic layer away from the base layer.

13. The display panel according to claim 8, characterized in that: The display panel further includes: a color filter layer located on a surface of the touch inorganic layer away from the base layer, the color filter layer comprising a first color filter hole located at a position corresponding to the laser hole, the aperture of the first color filter hole being larger than the laser hole; and The color film adhesive layer is located on a side of the color film layer away from the base layer, and the laser hole penetrates the color film adhesive layer.

14. The display panel according to claim 13, characterized in that: The touch control organic layer covers the surface of the touch control inorganic layer away from the base layer, and the touch control organic layer covers the side wall surfaces of each film layer penetrated by the at least one buffer hole; The touch buffer hole further includes a fourth touch hole vertically arranged and penetrating the touch organic layer, wherein the fourth touch hole is larger than the laser hole; The color filter layer covers the surface of the touch organic layer away from the base layer, and the aperture of the first color filter hole of the color filter layer is equal to the aperture of the fourth touch hole; The color film adhesive layer covers the surface of the touch organic layer away from the base layer, and covers the side walls of the fourth touch hole and the first color film hole. The laser hole penetrates the color film adhesive layer.

15. The display panel according to claim 13, characterized in that: The touch organic layer covers the first horizontal surface, the inclined surface and part of the second horizontal surface of the encapsulation layer away from the base layer, and the second horizontal surface is closer to the laser hole than the first horizontal surface. There is a gap between the end of the touch organic layer located on the second horizontal surface and the laser hole. The touch buffer hole further includes a fifth touch hole penetrating the touch organic layer, the fifth touch hole leaking out of another portion of the second horizontal surface of the touch inorganic layer away from the base layer, and the hole diameter of the fifth touch hole close to the base layer is smaller than the hole diameter of the fifth touch hole away from the base layer; The color filter layer covers the surface of the touch organic layer away from the base layer, and the first color filter hole of the color filter layer leaks out of a part of the second horizontal surface of the touch inorganic layer away from the base layer. The color film adhesive layer covers the surface of the color film layer away from the base layer, and covers a portion of the second horizontal surface of the touch-control inorganic layer away from the base layer that leaks out of the first color film hole.

16. The display panel according to claim 13, characterized in that: The color film adhesive layer also includes a plurality of second stress release holes surrounding the laser hole, each of the second stress release holes penetrates the color film adhesive layer, and the orthographic projection of each of the second stress release holes on the base layer is a ring projection.

17. The display panel according to any one of claims 8, 13 or 15, characterized in that: The display panel includes a plurality of blocking structures, wherein the orthographic projections of the blocking structures on the substrate layer are located in the interval area between the laser hole and the orthographic projections of the organic encapsulation layer on the substrate layer. The distance between the hole boundary of the buffer hole and the hole boundary of the laser hole is smaller than the distance between the blocking structure closest to the laser hole and the hole boundary of the laser hole. or The distance between the hole boundary of the touch buffer hole corresponding to the touch organic layer and the hole boundary of the laser hole is greater than the distance between the blocking structure farthest from the laser hole and the hole boundary of the laser hole, or The distance between the hole boundary of the first color filter hole corresponding to the color filter layer and the boundary of the laser hole is greater than the distance between the blocking structure farthest from the laser hole and the hole boundary of the laser hole.

18. A display device, characterized in that: The display device includes the display panel according to any one of claims 1 to 17.

19. A method for manufacturing a display panel according to any one of claims 1 to 17, characterized in that: The method comprises: forming a driving circuit layer on the base layer, wherein the driving circuit layer comprises a plurality of driving inorganic insulating layers and a driving organic planar layer that insulate adjacent conductive layers; forming a light emitting device layer on the driving circuit layer; forming an encapsulation layer on the light-emitting device layer, wherein the encapsulation layer comprises a plurality of inorganic encapsulation layers and an organic encapsulation layer; The method further comprises: Forming at least one buffer hole penetrating one or more layers of the base layer, the driving circuit layer, the light-emitting device layer, the encapsulation layer, and the touch layer; A laser hole is formed in the hole area, penetrating the base layer, the driving circuit layer, the light-emitting device layer, the packaging layer, and the touch layer.

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