Display device

Abstract

The present disclosure relates to a display device. A display device according to one embodiment includes: a base substrate including a display area including a plurality of pixels and a non-display area near the display area; a first dam disposed on the base substrate in the non-display area; a second dam disposed on the base substrate in the non-display area and disposed between the first dam and the display area; and a touch sensor layer including a touch conductive layer disposed on the first dam and the second dam, and a touch organic layer on the touch conductive layer, where the touch organic layer terminates within the first dam, and the first dam and the second dam include the same material.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Korean Patent Application No. 10-2023-0112495, filed on Aug. 28, 2024, which is hereby incorporated by reference in its entirety for all purposes. Technical Field

[0003] The present disclosure relates to a display device and a method of manufacturing the display device. Background Art

[0004] As the information society develops, various demands for display devices for displaying images are increasing, and various types of display devices, such as liquid crystal display (LCD) devices and organic light emitting diode (OLED) display devices, are utilized.

[0005] The display device may include a display panel and a touch sensor layer, and the touch sensor layer may be attached to the display panel as a layer separate from the display panel, but may also be directly provided on the display panel.

[0006] Recently, efforts are being made to reduce the number of masks when manufacturing a display device including a display panel and a touch sensor layer. Summary of the invention

[0007] The present disclosure is directed to providing a display device manufactured using a smaller number of masks.

[0008] The purpose of the present disclosure is not limited to the above-mentioned purpose, and other technical purposes can be inferred from the following embodiments.

[0009] A display device according to one embodiment for achieving the purpose includes: a base substrate, which includes a display area including a plurality of pixels and a non-display area near the display area; a first dam, which is arranged on the base substrate in the non-display area; a second dam, which is arranged on the base substrate in the non-display area and is arranged between the first dam and the display area; and a touch sensor layer, which includes a touch conductive layer arranged between the first dam and the second dam and a touch organic layer on the touch conductive layer, wherein the touch organic layer terminates within the first dam, and the first dam and the second dam include the same material.

[0010] According to another embodiment for achieving the purpose, a display device includes: a display area including a plurality of pixels and a non-display area located near the display area, wherein the non-display area includes a first dam portion surrounding the display area and a second dam portion surrounding the display area and arranged between the first dam portion and the display area, and the first dam portion includes a main dam portion having a first separation distance from the second dam portion and a protruding dam portion having a second separation distance from the second dam portion.

[0011] According to an embodiment, by omitting one of a plurality of touch organic layers of a general touch sensor layer, the number of masks may be reduced and the manufacture of a display device may be simplified.

[0012] At the same time, one touch organic layer includes a dam for preventing another organic layer from overflowing to the pad portion. According to an embodiment, since one touch organic layer is omitted, at least one of the organic layers of the display panel can be used to form the dam. In other words, by using at least one of the organic layers of the display panel to form a dam for simplifying the stacking structure of the display device and preventing another organic layer from overflowing to the pad portion, another touch organic layer can be prevented from overflowing to the pad portion.

[0013] According to an embodiment, process optimization may be achieved by reducing the number of masks and simplifying a process when manufacturing a display device.

[0014] However, effects obtainable from the present disclosure are not limited to the above-mentioned effects, and other effects that are not mentioned will be clearly understood from the following description by those skilled in the art to which the present disclosure pertains. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic cross-sectional view of a display device according to an embodiment.

[0016] Figure 2 is based on Figure 1 A plan view of a display device.

[0017] Figure 3 It shows that according to Figure 1 A cross-sectional view of a display device in a bent state.

[0018] Figure 4 is based on Figure 2 A more detailed plan view of the display device.

[0019] Figure 5 yes Figure 4 An enlarged plan view of area A in FIG.

[0020] Figure 6 is along Figure 2 Cross-sectional view along line II′.

[0021] Figure 7 and Figure 8 are cross-sectional views illustrating each operation of a process in a method of manufacturing a display device according to an embodiment.

[0022] Fig. 9 is a cross-sectional view of a display device according to another embodiment.

[0023] Fig.10is a cross-sectional view of a display device according to still another embodiment. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments will be described with reference to the accompanying drawings. In the present disclosure, when a first component (or region, layer, portion, etc.) is described as being "on," "connected," or "coupled to" a second component, this means that the first component may be directly connected / coupled to the second component, or a third component may be disposed between the first component and the second component.

[0025] The same reference numerals indicate the same components. In addition, in the drawings, the thickness, proportion and size of the components are exaggerated in order to effectively describe the technical content. The term "and / or" includes all one or more combinations that can be defined by the associated configurations.

[0026] Terms such as first and second can be used to describe various components, but these components are not limited by these terms. These terms are only used for the purpose of distinguishing one component from another component. For example, without departing from the scope of the embodiment, a first component can be referred to as a second component, and similarly, a second component can also be referred to as a first component. Unless the context clearly indicates otherwise, a singular expression includes a plural expression.

[0027] Terms such as "below", "at the lower side", "above", and "at the upper side" are used to describe the relationship between components shown in the drawings. These terms are relative concepts and are described relative to the directions marked in the drawings.

[0028] It should be understood that terms such as “include” or “have” are intended to specify the presence of features, numbers, steps, operations, components, parts, or a combination thereof described in the present disclosure, and do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or a combination thereof.

[0029] Figure 1 is a schematic cross-sectional view of a display device according to an embodiment.

[0030] Reference Figure 1, a display device 1 according to one embodiment may include a display panel 100 and a touch sensor layer 200 formed on the display panel 100. The display panel 100 may include a substrate portion SUB, a circuit element layer CEL formed on the substrate portion SUB, an organic element layer EL formed on the circuit element layer CEL, a thin film encapsulation layer TFE formed on the organic element layer EL, and a touch sensor layer 200 formed on the thin film encapsulation layer TFE. In one embodiment, the display panel 100 may be an organic light emitting display panel including the organic element layer EL. However, the display panel 100 is not limited thereto, and may be a liquid crystal display panel or an inorganic light emitting display panel. Hereinafter, an example in which the display panel 100 is an organic light emitting display panel will be mainly described.

[0031] The display device 1 may include a display area DA and a non-display area NDA near the display area DA. The display area DA may include a plurality of pixels to generate an image. The non-display area NDA may not generate an image. The non-display area NDA may not include pixels, but is not limited thereto.

[0032] The display device 1 may further include a sensing area SA and a non-sensing area NSA near the sensing area SA. The sensing area SA and the non-sensing area NSA may correspond to the display area DA and the non-display area NDA, respectively, and may have the same area, but is not limited thereto. The sensing area SA may be a region in which a portion of the display area DA and the non-display area NDA are disposed. Figure 4 The area of ​​the touch electrodes TE and RE described in , and the touch lines TL connected to the touch electrodes TE and RE, the touch pads TPAD connected to the touch lines TL, and the like may be disposed in the non-sensing area NSA.

[0033] The substrate portion SUB, the circuit element layer CEL, the organic element layer EL, the thin film encapsulation layer TFE, and the touch sensor layer 200 will be described below.

[0034] Figure 2 is based on Figure 1 A plan view of a display device.

[0035] Reference Figure 2 , the plane shape of the display area DA may have a rectangular shape. However, the present disclosure is not limited thereto, and the plane shape of the display area DA may be a square, a circle, an ellipse, or other polygonal shapes. For example, the display area DA may have a rectangular shape with rounded corners, but is not limited thereto, and may also have a rectangular shape with angled corners.

[0036] In an embodiment, the first direction DR1 and the second direction DR2 are different directions and intersect each other, for example, directions perpendicularly intersecting each other in a plan view. Figure 3) is a direction intersecting with the plane where the first direction DR1 and the second direction DR2 are located, for example, a direction perpendicular to both the first direction DR1 and the second direction DR2. Figure 2 In general, the first direction DR1 may be the same as the extending direction of the short side of the display panel 100, the second direction DR2 may be the same as the extending direction of the long side of the display panel 100, and the third direction DR3 may be the same as the extending direction of the long side of the display panel 100. Figure 1 The stacking direction of the substrate portion SUB, the circuit element layer CEL, the organic element layer EL, the thin film encapsulation layer TFE and the touch sensor layer 200 is the same. However, the directions described in the embodiments should be understood to indicate relative directions, and the embodiments are not limited to the described directions.

[0037] The display area DA may include a short side extending in the first direction DR1 and a long side extending in the second direction DR2. The non-display area NDA may surround the display area DA. The non-display area NDA may be disposed on one side and the other side of the display area DA in the first direction DR1 and on one side and the other side of the display area DA in the second direction DR2.

[0038] The non-display area NDA located on the other side of the display area DA in the second direction DR2 may further extend from a central portion of the other side of the display area DA in the second direction DR2 to the other side in the second direction DR2. The non-display area NDA further extending from a central portion of the other side of the display area DA in the second direction DR2 to the other side in the second direction DR2 may have a width in the first direction DR1 smaller than a width in the first direction DR1 of the non-display area NDA adjacent to the other side of the display area DA in the second direction DR2.

[0039] The display device 1 may include a main region MR, a sub-region SR, and a bending region BR between the main region MR and the sub-region SR. The display region DA and the non-display region NDA surrounding the display region DA on all four surfaces form the main region MR, and a portion extending from a central portion of the other side of the display region DA in the second direction DR2 to the other side in the second direction DR2 may form a bending region BR and a sub-region SR. The bending region BR may be disposed between the sub-region SR and the main region MR. The sub-region SR may include a first pad region PA1 and a second pad region PA2 located at an end portion of the other side of the sub-region SR in the second direction DR2. The display device 1 may further include a data driver 300 and a printed circuit board 500. The data driver 300 may be disposed in the first pad region PA1, and the printed circuit board 500 may be attached to the second pad region PA2. A plurality of pads connected to the data driver 300 and the printed circuit board 500 may be disposed in each of the first pad region PA1 and the second pad region PA2. The data driver 300 may be formed, for example, in the form of a driver chip (IC), but is not limited thereto. In one embodiment, an example is described in which the data driver 300 is provided in a chip on plastic type directly mounted on the display panel 100 , but the present disclosure is not limited thereto and is provided in a chip on glass type or a chip on film type.

[0040] As above Figure 1 As described in the above, the display area DA may include a plurality of pixels PX. The plurality of pixels PX may be connected to a scan line SL and a data line DL respectively. In addition to the scan line SL and the data line DL, the pixel PX may include a high voltage power line, a low voltage power line or various lines in the art and a capacitor.

[0041] The display device 1 according to one embodiment may further include a first dam portion DP1 and a second dam portion DP2. The first dam portion DP1 and the second dam portion DP2 may each surround the display area DA. The first dam portion DP1 and the second dam portion DP2 may each have a closed loop shape that completely surrounds the display area DA. The second dam portion DP2 may be disposed between the first dam portion DP1 and the display area DA. The second dam portion DP2 may be disposed between the display area DA and the bending area BR, which will be described below.

[0042] The first dam portion DP1 and the second dam portion DP2 may be each disposed in the non-display area NDA. For example, the second dam portion DP2 may be disposed in the non-display area NDA adjacent to the display area DA, and may be disposed in the main region MR. The first dam portion DP1 may be disposed outside the second dam portion DP2 to surround the second dam portion DP2. The first dam portion DP1 may include a main dam portion DP1a, a protruding dam portion DP1b, and a connecting dam portion DP1c. Generally, the main dam portion DP1a may be disposed on one side and the other side of the display area DA in the first direction DR1, and in the non-display area NDA disposed adjacent to one side of the display area DA in the second direction DR2. The main dam portion DP1a may be disposed at the periphery of the non-display area NDA adjacent to the other side of the display area DA in the second direction DR2. The main dam portion DP1a disposed in the non-display area NDA disposed adjacent to one side and the other side of the display area DA in the first direction DR1 and one side of the display area DA in the second direction DR2, and disposed at the periphery of the non-display area NDA adjacent to the other side of the display area DA in the second direction DR2 may be formed integrally. The main dam portion DP1a may be provided in the main region MR.

[0043] The protruding dam portion DP1b may be disposed in the bending region BR and may not be disposed in the main region MR. In other words, the main dam portion DP1a and the second dam portion DP2 may be disposed to have a first separation distance d1, and the protruding dam portion DP1b and the second dam portion DP2 may be disposed to have a second separation distance d2 greater than the first separation distance d1. The main dam portion DP1a and the protruding dam portion DP1b may be connected by a connecting dam portion DP1c. The connecting dam portion DP1c may be disposed in the entire bending region BR and the main region MR, but is not limited thereto. In other words, when the protruding dam portion DP1b is disposed in the bending region BR adjacent to the boundary between the bending region BR and the main region MR, the connecting dam portion DP1c may be disposed only in the main region MR.

[0044] In some embodiments, the protruding dam portion DP1b may be disposed in the main region MR.

[0045] In some embodiments, the second separation distance d2 can be equal to the first separation distance d1.

[0046] Figure 3 It shows that according to Figure 1 A cross-sectional view of a display device in a bent state.

[0047] Reference Figure 3, the bending region BR of the display panel 100 of the display device 1 according to one embodiment may be bent in the thickness direction (or the third direction DR3). Therefore, the main region MR and the sub-region SR may overlap each other in the thickness direction. The display panel 100 may be bent in such a manner that the lower surface of the main region MR and the upper surface of the sub-region SR face each other. The printed circuit board 500 may be attached to the end portion of the sub-region SR.

[0048] Figure 4 is based on Figure 2 A more detailed plan view of the display device. Figure 5 yes Figure 4 An enlarged plan view of area A in FIG. Figure 4 is based on Figure 2 FIG. 1 is a plan view of a display device 1 and specifically shows a touch sensor layer 200 (see FIG. Figure 1 ), and the touch lines TL and touch pads TPAD connected to the touch sensor layer 200.

[0049] Reference Figure 4 and Figure 5 The touch sensor layer 200 may include a plurality of touch electrodes TE and RE for detecting a user's touch using a capacitance method, and a touch line TL connecting the plurality of touch electrodes TE and RE with a touch pad TPAD. For example, the touch sensor layer 200 may sense a user's touch using a self capacitance method or a mutual capacitance method.

[0050] A plurality of touch electrodes TE and RE may be disposed in the sensing area SA. The plurality of touch electrodes TE and RE may be disposed on the thin film encapsulation layer TFE and configured to sense a touch of the display area DA.

[0051] The plurality of touch electrodes TE and RE may generate mutual capacitance or self capacitance to detect a touch of an object or a person. The plurality of touch electrodes TE and RE may include a plurality of driving electrodes TE 240_T and a plurality of detecting electrodes RE 240_R.

[0052] A plurality of driving electrodes TE 240_T may be arranged in the first direction DR1 and the second direction DR2. The plurality of driving electrodes TE 240_T may be spaced apart from each other in the first direction DR1 and the second direction DR2. Driving electrodes TE 240_T adjacent to each other in the second direction DR2 may be electrically connected by a bridge electrode 220_B.

[0053] The plurality of sensing electrodes RE 240_R may extend in the first direction DR1 and may be spaced apart from each other in the second direction DR2. The plurality of sensing electrodes RE 240_R may be arranged in the first and second directions DR1 and sensing electrodes RE 240_R adjacent to each other in the first direction DR1 may be electrically connected to the connection portion 240_B.

[0054] The plurality of driving electrodes TE 240_T and the detecting electrodes RE 240_R may each be connected to a plurality of touch pads TPAD through a touch line TL.

[0055] The bridging electrode 220_B may be disposed on a layer different from the plurality of driving electrodes TE 240_T and the plurality of detecting electrodes RE 240_R. The detecting electrodes RE 240_R adjacent to each other in the first direction DR1 may be electrically connected by the connection portion 240_B formed on the same layer as the plurality of driving electrodes TE 240_T or the plurality of detecting electrodes RE 240_R, and the driving electrodes TE 240_T adjacent to each other in the second direction DR2 may be electrically connected by the bridging electrode 220_B formed on a layer different from the plurality of driving electrodes TE 240_T or the plurality of detecting electrodes RE 240_R. Therefore, even when the bridging electrode 220_B overlaps the plurality of detecting electrodes RE 240_R in the thickness direction DR3, the plurality of driving electrodes TE 240_T and the plurality of detecting electrodes RE 240_R may be insulated from each other. Mutual capacitance may be generated between the driving electrodes TE 240_T and the detecting electrodes RE 240_R.

[0056] Figure 6 is along Figure 2 Cross-sectional view along line II′.

[0057] Reference Figure 6 The display device 1 may include a substrate portion SUB, a circuit element layer CEL formed on the substrate portion SUB, an organic element layer EL formed on the circuit element layer CEL, a thin film encapsulation layer TFE formed on the organic element layer EL, and a touch sensor layer 200 formed on the thin film encapsulation layer TFE.

[0058] The substrate portion SUB may include a base substrate 101. The base substrate 101 may support a layer disposed thereon. The base substrate 101 may be disposed in the entire display area DA and the non-display area NDA. The base substrate 101 may be made of an insulating material such as a polymer resin. Examples of polymer materials may include polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl ester, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP) or a combination thereof. The base substrate 101 may be a flexible substrate capable of bending, folding, rolling, etc. An example of a material forming a flexible substrate may be polyimide (PI), but is not limited thereto. The base substrate 101 may be a rigid substrate made of glass, quartz, etc.

[0059] The circuit element layer CEL may be formed on the substrate portion SUB. The circuit element layer CEL may include a semiconductor layer 105, a gate insulating layer 111 formed on the semiconductor layer 105, a gate conductive layer including a gate electrode GE on the gate insulating layer 111, a first interlayer insulating layer 112 formed on the gate conductive layer, a first source-drain conductive layer 130 including a source electrode 131, a drain electrode 133, and a first touch pad portion TPAD1 of a touch pad TPAD, a second interlayer insulating layer 141 formed on the first source-drain conductive layer 130, a second source-drain conductive layer 150 including a connection electrode 151 formed on the second interlayer insulating layer 141, a second touch pad portion TPAD2 of the touch pad TPAD, and a bent bridge electrode CL, and a first organic layer 160 including a planarization layer 161 and a second lower dam DAM21 formed on the second source-drain conductive layer 150.

[0060] The organic element layer EL may include an organic light emitting diode OLED including an anode electrode ANO, an organic layer OL, and a cathode electrode CAT formed on a first organic layer 160 , and a second organic layer 170 including a bank layer 171 , a second upper dam DAM22 , and a first dam DAM1 .

[0061] The thin film encapsulation layer TFE may include a first encapsulation inorganic layer 181 formed on the organic element layer EL, an encapsulation organic layer 182 formed on the first encapsulation inorganic layer 181 , and a second encapsulation inorganic layer 183 formed on the encapsulation organic layer 182 .

[0062] The touch sensor layer 200 may include a touch buffer layer 210 formed on the thin film encapsulation layer TFE, a first touch conductive layer 220 including a bridging electrode 220_B and a first touch line portion TL1 of a touch line TL formed on the touch buffer layer 210, a touch insulating layer 230 formed on the first touch conductive layer 220, a second touch conductive layer 240 including a driving electrode 240_T formed on the touch insulating layer 230, a second touch line portion TL2 of the touch line TL and a third touch pad portion TPAD3 of the touch pad TPAD, and a touch organic layer 250 formed on the second touch conductive layer 240.

[0063] A buffer layer may be disposed on the base substrate 101. The buffer layer may prevent diffusion of impurity ions and prevent penetration of moisture or external air.

[0064] Unlike what is shown, the buffer layer may include a plurality of layers. In other words, the buffer layer may be provided as a layer formed by alternately stacking silicon nitride (SiNx) and silicon oxide (SiOx) at least once.

[0065] The semiconductor layer 105 may be disposed in the display area DA on the buffer layer. The semiconductor layer 105 may include polycrystalline silicon. The semiconductor layer 105 may include a channel region, a source region, and a drain region. Polycrystalline silicon may be formed by crystallizing amorphous silicon. Examples of crystallization methods may include a rapid thermal annealing (RTA) method, a solid phase crystallization (SPC) method, an excimer laser annealing (ELA) method, a metal induced crystallization (MIC) method, a metal induced lateral crystallization (MILC) method, a sequential crystallization (SLS) method, etc., but are not limited thereto.

[0066] The gate insulating layer 111 may be formed on the semiconductor layer 105. The gate insulating layer 111 may generally be disposed throughout the display area DA and the non-display area NDA. The gate insulating layer 111 may be a gate insulating film having a gate insulating function. The gate insulating layer 111 may include a silicon compound, a metal oxide, and the like. For example, the gate insulating layer 111 may include silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, and the like. These materials may be used alone or in combination. Although the accompanying drawings show that the gate insulating layer 111 is formed of a single film, in some cases, the gate insulating layer 111 may be a multilayer film formed of stacked films made of different materials.

[0067] A gate conductive layer may be disposed on the gate insulating layer 111 .

[0068] In one embodiment, the gate conductive layer may include a gate electrode GE. In addition, the gate conductive layer may further include a scan signal line transmitting a scan signal to the gate electrode GE. The gate electrode GE may be disposed to overlap with a channel region of the semiconductor layer 105 .

[0069] The gate conductive layer may include one or more selected from molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W) and copper (Cu). In addition, although the accompanying drawings only show the case where the gate conductive layer is a single layer, in some cases, the gate conductive layer may be formed as a multilayer layer. In this case, the multilayer film of the gate conductive layer may be formed as a stacked film made of different metals among the above-mentioned metals.

[0070] The first interlayer insulating layer 112 may be disposed on the gate conductive layer. The first interlayer insulating layer 112 may be disposed throughout the display area DA and the non-display area NDA.

[0071] The first interlayer insulating layer 112 may insulate the gate conductive layer and the first source drain conductive layer 130. The first interlayer insulating layer 112 may be an interlayer insulating film.

[0072] The first interlayer insulating layer 112 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, hafnium oxide, aluminum oxide, titanium oxide, tantalum oxide, or zinc oxide, or an organic insulating material such as polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene oxide resin, polyphenylene sulfide resin, or benzocyclobutene (BCB). In the drawings, although an example in which the first interlayer insulating layer 112 is a single layer is shown, the present disclosure is not limited thereto, and may be a multilayer layer formed of stacked layers including different materials.

[0073] The first source drain conductive layer 130 may be disposed on the first interlayer insulating layer 112. The first source drain conductive layer 130 may include a source electrode 131, a drain electrode 133, and a first touch pad portion TPAD1. The source electrode 131 may be connected to the source region of the semiconductor layer 105, and the drain electrode 133 may be connected to the drain region of the semiconductor layer 105. The first touch pad portion TPAD1 may be disposed in the second pad area PA2. The first source drain conductive layer 130 may include aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or a single layer. In one embodiment, the first source drain conductive layer 130 may have a multilayer structure of Ti / Al / Ti, but is not limited thereto. The source electrode 131, the drain electrode 133, and the first touch pad portion TPAD1 include the same material and may be formed in the same process.

[0074] The second interlayer insulating layer 141 may be disposed on the first source drain conductive layer 130. The second interlayer insulating layer 141 may be disposed in the display area DA and the non-display area NDA. In the non-display area NDA, the second interlayer insulating layer 141 may be disposed in the bending area BR, and may also be disposed in portions of the main area MR and the sub-area SR adjacent to the bending area BR. The second interlayer insulating layer 141 may include an organic material, such as a polyacrylate resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a polyphenylene ether resin, a polyphenylene sulfide resin, or benzocyclobutene (BCB).

[0075] The second source drain conductive layer 150 may be disposed on the second interlayer insulating layer 141. The second source drain conductive layer 150 may include a connection electrode 151 connected to the drain electrode 133, a second touch pad portion TPAD2 disposed on the first touch pad portion TPAD1 and directly disposed on the first touch pad portion TPAD1, and a curved bridge electrode CL connected to the touch line TL at the periphery of the curved region BR and passing through the curved region BR. The second source drain conductive layer 150 may include aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or a single layer. In one embodiment, the second source drain conductive layer 150 may have a multilayer structure of Ti / Al / Ti, but is not limited thereto. The connection electrode 151, the second touch pad portion TPAD2, and the curved bridge electrode CL may include the same material and may be formed in the same process.

[0076] The first organic layer 160 may be disposed on the second source drain conductive layer 150. The first organic layer 160 may include a planarization layer 161 and a second lower dam DAM21.

[0077] The first organic layer 160 may include an organic material such as polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, or benzocyclobutene (BCB). The planarization layer 161 and the second down dam DAM21 may include the same material and may be formed in the same process.

[0078] The planarization layer 161 may be disposed in the display area DA, the bending area BR, and the sub-area SR. In the display area DA, the planarization layer 161 may be disposed on the connection electrode 151 and the second interlayer insulating layer 141. In the bending area BR, the planarization layer 161 may be disposed on the bent bridge electrode CL and the second interlayer insulating layer 141. In the sub-area SR, the planarization layer 161 may be disposed on the first interlayer insulating layer 112.

[0079] The second lower dam DAM21 may form a second dam DAM2 together with the second upper dam DAM22 .

[0080] The anode ANO may be disposed on the planarization layer 161 in the display area DA. The anode ANO may pass through the planarization layer 161 and may be electrically connected to the connection electrode 151. The connection electrode 151 may electrically connect the anode ANO with the drain electrode 133.

[0081] The second organic layer 170 may be disposed on the anode electrode ANO. The second organic layer 170 may include a bank layer 171, a second upper dam DAM22, and a first dam DAM1.

[0082] The second organic layer 170 may include an organic material such as polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, or benzocyclobutene (BCB). The bank layer 171, the second upper dam DAM22, and the first dam DAM1 may include the same material and may be formed in the same process.

[0083] The bank layer 171 may be disposed in the display area DA and may expose a portion of the upper surface of the anode ANO. The bank layer 171 may define an emission region by exposing a central portion of the upper surface of the anode ANO. In the display area DA, a region where the bank layer 171 is disposed may be defined as a non-emission region.

[0084] The second upper dam DAM22 may be disposed on the second lower dam DAM21. The second upper dam DAM22 may overlap the second lower dam DAM21 in a thickness direction. The second upper dam DAM22 may have a width greater than that of the second lower dam DAM21, and may cover a side surface of the second lower dam DAM21.

[0085] The second dam DAM2 may include a second lower dam DAM21 and a second upper dam DAM22, and one or more second dams DAM2 may be provided. Figure 6 , an example in which two second dams DAM2 are provided is shown. Two or more second dams DAM2 may be provided to be spaced apart from each other. One or more second dams DAM2 may be provided in the second dam portion DP2. The second dam DAM2 may prevent the encapsulation organic layer 182 of the thin film encapsulation layer TFE to be described below from overflowing into the bending region BR. For example, the encapsulation organic layer 182 may terminate at the second dam DAM2 located outside of the two second dams DAM2. Therefore, the encapsulation organic layer 182 does not extend to the bending region BR and may not overlap with the components located in the bending region BR at all. The encapsulation organic layer 182 may not overlap with the first dam DAM1.

[0086] The first dam DAM1 may be disposed in the bending region BR. The first dam DAM1 may be disposed in the first dam portion DP1. One or more first dams DAM1 may be provided. Figure 6 , an example in which two first dams DAM1 are provided has been shown. Two or more first dams DAM1 may be provided in the first dam portion DP1. The first dam DAM1 may prevent the touch organic layer 250, which will be described below, from overflowing into the sub-region SR. For example, the touch organic layer 250 may terminate at the first dam DAM1 located on the outside of the two first dams DAM1. Therefore, the touch organic layer 250 does not extend to the sub-region SR and may not overlap with the components located in the sub-region SR at all. The first dam DAM1 may be provided on the second interlayer insulating layer 141 and the planarizing layer 161. The first dam DAM1 may be provided to overlap with the second interlayer insulating layer 141 and the planarizing layer 161.

[0087] In some embodiments, a spacer may be further disposed on the second organic layer 170. The spacer may include at least one of the example materials of the second organic layer 170. In some embodiments, at least one of the first dam DAM1 and the second dam DAM2 may be formed to further include a spacer. For example, the first dam DAM1 may have a spacer stacked on Figure 6 The second dam DAM2 may have a structure in which a second lower dam DAM21, a second upper dam DAM22, and spacers are stacked.

[0088] For example, the first dam DAM1 and the second dam DAM2 may have various stacking structures. In some embodiments, the first dam DAM1 may have Figure 6The first dam DAM1 and the planarization layer 161 disposed thereunder are stacked. In this case, the planarization layer 161 may be patterned like the first dam DAM1, and the patterned planarization layer 161 may be Figure 6 The first dam DAM1 is stacked to form a first dam.

[0089] In some embodiments, the second dam DAM2 does not include the second lower dam DAM21 , and may be formed only as the second upper dam DAM22 .

[0090] In some embodiments, the second dam DAM2 does not include the second upper dam DAM22 , and may be formed only as the second lower dam DAM21 .

[0091] The upper surface of the first dam DAM1 may have a first surface height H1 from the base substrate 101, and the upper surface of the second dam DAM2 may have a second surface height H2 from the base substrate 101. The first surface height H1 may be greater than the second surface height H2. The first surface height H1 may be greater than the second surface height H2 by the thickness of the first dam DAM1, but is not limited thereto.

[0092] The organic layer OL may be disposed on the upper surface of the anode electrode ANO and in the opening of the bank layer 171. In the drawings, although an example in which the organic layer OL is disposed only in the opening of the bank layer 171 is described, the present disclosure is not limited thereto and may be disposed to extend from the opening of the bank layer 171 to the upper surface of the bank layer 171.

[0093] The organic layer OL may include an organic light emitting layer, a hole injection / transport layer, and an electron injection / transport layer.

[0094] The cathode CAT is disposed on the organic layer OL and the bank layer 171. The cathode CAT may be a common electrode disposed throughout the plurality of pixels PX in the display area DA. The organic layer OL, the anode ANO, and the cathode CAT may form an organic light emitting diode OLED.

[0095] The thin film encapsulation layer TFE is disposed on the cathode CAT. The thin film encapsulation layer TFE may cover the organic light emitting diode OLED. The thin film encapsulation layer TFE may be a stacked film formed by alternately stacking an inorganic film and an organic film. For example, the thin film encapsulation layer TFE may include a first encapsulation inorganic layer 181, an encapsulation organic layer 182, and a second encapsulation inorganic layer 183 stacked in sequence. The encapsulation inorganic layers 181 and 183 may include an inorganic material. The encapsulation organic layer 182 may include an organic material. The encapsulation organic layer 182 may not overflow into the bending region BR through the second dam DAM2, and may terminate within the second dam DAM2. In the second dam portion DP2, the second encapsulation inorganic layer 183 may be in direct contact with the first encapsulation inorganic layer 181. For example, since the encapsulation organic layer 182 terminates within the second dam DAM2, the encapsulation organic layer 182 may not be disposed on the second dam DAM2. On the second dam DAM2, the second encapsulation inorganic layer 183 may be in direct contact with the first encapsulation inorganic layer 181.

[0096] The encapsulation inorganic layers 181 and 183 may be disposed in both the display area DA and the non-display area NDA. The encapsulation inorganic layers 181 and 183 may be disposed in the bending area BR and the sub-area SR, and not disposed in the second pad area PA2, and may expose the second touch pad portion TPAD2.

[0097] The touch sensor layer 200 may be disposed on the thin film encapsulation layer TFE. The touch buffer layer 210 may be disposed on the second encapsulation inorganic layer 183 .

[0098] The touch sensor layer 200 may be disposed on the second encapsulation inorganic layer 183 .

[0099] The touch buffer layer 210 can block the chemical solution (developer, etchant, etc.) used in the manufacturing process of the electrodes 240_T and 240_R provided on the touch buffer layer 210 or moisture from the outside from penetrating the organic light emitting diode OLED including the organic layer. Therefore, the touch buffer layer 210 can prevent damage to the organic light emitting diode OLED that is susceptible to chemical solutions or moisture. The touch buffer layer 210 may include an inorganic material or an organic material. The touch buffer layer 210 may extend from the display area DA to the bending area BR and the sub-area SR, and may expose the second touch pad portion TPAD2 in the second pad area PA2.

[0100] The first touch conductive layer 220 may be disposed on the touch buffer layer 210. The first touch conductive layer 220 may include a bridge electrode 220_B and a first touch line portion TL1. The bridge electrode 220_B may be disposed in the sensing area SA (or the display area DA) to electrically connect the driving electrodes 240_T adjacent to each other. The bridge electrode 220_B may be insulated from the connection portion 240_B and the touch insulation layer 230 interposed therebetween.

[0101] exist Figure 6 Although an example is shown in which the bridging electrode 220_B electrically connects the adjacent driving electrodes 240_T, the present disclosure is not limited thereto, and the bridging electrode 220_B may electrically connect the adjacent detection electrodes 240_R, and the connecting portion 240_B may electrically connect the adjacent driving electrodes 240_T.

[0102] The first touch line portion TL1 may be disposed in the display area DA and the non-display area NDA. The first touch line portion TL1 may be electrically connected to the detection electrode 240_R or the driving electrode 240_T. The first touch line portion TL1 may pass through the second dam portion DP2 and extend to the bending area BR. The first touch line portion TL1 may form a touch line TL together with the second touch line portion TL2 and is used to electrically connect the electrodes 240_T and 240_R to the touch pad TPAD.

[0103] The touch insulating layer 230 may be disposed on the first touch conductive layer 220. The touch insulating layer 230 may include an inorganic material. The touch insulating layer 230 may extend from the display area DA to the bending area BR and the sub-area SR and expose the second touch pad portion TPAD2 in the second pad area PA2.

[0104] The second touch conductive layer 240 may be disposed on the touch insulating layer 230. The second touch conductive layer 240 may include a driving electrode 240_T, a second touch line portion TL2, and a third touch pad portion TPAD3.

[0105] The second touch line portion TL2 may include a 2-1 touch line portion TL2a and a 2-2 touch line portion TL2b. The 2-1 touch line portion TL2a may overlap with the first touch line portion TL1 in the thickness direction. The 2-1 touch line portion TL2a may be disposed in a portion of the main region MR and the bending region BR. The 2-1 touch line portion TL2a may be electrically connected to the first touch line portion TL1 through a third contact hole CT3 passing through the touch insulating layer 230 in the thickness direction. The 2-1 touch line portion TL2a may be electrically connected to the first touch line portion TL1 through a third contact hole CT3 passing through the touch insulating layer 230 in the thickness direction, thereby reducing the resistance of the touch line TL. The third contact hole CT3 may be located on the second dam portion DP2, but is not limited thereto. The 2-1 touch line portion TL1a may be electrically connected to the curved bridging electrode CL in the bending region BR. The 2-1 touch line portion TL1a may be electrically connected to the curved bridge electrode CL through the first contact hole CT1 passing through the touch insulating layer 230, the touch buffer layer 210, the second encapsulation inorganic layer 183, the first encapsulation inorganic layer 181, and the planarization layer 161. The first contact hole CT1 may be provided in the curved region BR, but may not be limited thereto. The first contact hole CT1 may be provided between the second dam DAM2 and the first dam DAM1. The 2-2 touch line portion TL2b may be provided in the sub-region SR and a portion of the curved region BR. The 2-2 touch line portion TL2b may be electrically connected to the curved bridge electrode CL in the curved region BR. The 2-2 touch line portion TL1b may be electrically connected to the curved bridge electrode CL through the second contact hole CT2 passing through the touch insulating layer 230, the touch buffer layer 210, the second encapsulation inorganic layer 183, the first encapsulation inorganic layer 181, and the planarization layer 161. The second contact hole CT2 may be provided in the curved region BR, but may not be limited thereto. The second contact hole CT2 may be provided between the first dam DAM1 and the touch pad TPAD.

[0106] The touch line TL according to one embodiment may include a first touch line portion TL1, a second touch line portion TL2, and a curved bridge electrode CL. Compared with the first touch line portion TL1 and the second touch line portion TL2 in the curved region BR, the touch line TL may include a curved bridge electrode CL made of a flexible material, thereby preventing the touch line TL from being disconnected or broken due to bending. The curved bridge electrode CL may be placed under the first dam portion DP1, and the curved bridge electrode CL may electrically connect the 2-1 touch line portion TL2a with the 2-2 touch line portion TL2b.

[0107] The 2-2 touch line portion TL2b may be connected to the third touch pad portion TPAD3 in the second pad area PA2. The 2-2 touch line portion TL2b may not extend past the second end (e.g., the right end) of the first dam portion DP1. The third touch pad portion TPAD3 may overlap with the second touch pad portion TPAD2 in the thickness direction and may be directly disposed on the second touch pad portion TPAD2. The third touch pad portion TPAD3 may be disposed on both the upper surface and the side surface of the second touch pad portion TPAD2. The third touch pad portion TPAD3 may be in direct contact with the outer portion of the upper surface of the first touch pad portion TPAD1 exposed by the second touch pad portion TPAD2, but is not limited thereto.

[0108] The touch organic layer 250 may be disposed on the second touch conductive layer 240. The touch organic layer 250 may be formed on the second touch conductive layer 240 using an inkjet method. In the process of forming the touch organic layer 250 on the second touch conductive layer 240 using the inkjet method, the touch organic layer 250 may overflow the sub-region SR, and in order to prevent this, the second dam DAM2 and other dams may be additionally required. Conventionally, a separate organic layer is used between the touch organic layer 250 and the second touch conductive layer 240 to form a dam for preventing the touch organic layer 250 from overflowing in the first dam portion DP1. However, in this case, the processing of the display device 1 is complicated because the process of forming a separate organic layer and the process of forming a dam using a separate organic layer as a mask are added. However, based on the display device 1 according to one embodiment, since the first dam DAM1 is formed together without forming a separate organic layer in the process of forming the second upper dam DAM22 of the second dam DAM2, the process of forming a separate organic layer and the process of forming a dam using a separate organic layer as a mask can be omitted. Therefore, the number of masks can be reduced and the manufacture of the display device 1 can be simplified. The touch organic layer 250 may be disposed in the main region MR and the bending region BR, and may be terminated within the first dam DAM1 .

[0109] Hereinafter, a method of manufacturing the display device 1 will be described. Figure 7 and Figure 8 The method of displaying the device will be referred to together with Figure 6 When describing the manufacturing based on Figure 7 and Figure 8 When the method of the display device is used, the Figure 6 The overlapping description of the components of the display device 1 that have been described in the figure is omitted, and the operations of manufacturing the components of the display device 1 that have been described can be performed in the stacking order of the display device 1.

[0110] Figure 7 and Figure 8are cross-sectional views illustrating each operation of a process in a method of manufacturing a display device according to an embodiment.

[0111] Reference Figures 6 to 8 , first, if Figure 7 As shown, the first organic layer 160 is formed on the second source-drain conductive layer 150. The first organic layer 160 may include a planarization layer 161 and a second lower dam DAM21.

[0112] The first organic layer 160 may include an organic material such as polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, or benzocyclobutene (BCB). The planarization layer 161 and the second down dam DAM21 may include the same material and may be formed in the same process.

[0113] The planarization layer 161 may be disposed in the display area DA, the bending area BR, and the sub-area SR. In the display area DA, the planarization layer 161 may be disposed on the connection electrode 151 and the second interlayer insulating layer 141. In the bending area BR, the planarization layer 161 may be disposed on the bent bridge electrode CL and the second interlayer insulating layer 141. In the sub-area SR, the planarization layer 161 may be disposed on the first interlayer insulating layer 112.

[0114] The second lower dam DAM21 may form a second dam DAM2 together with the second upper dam DAM22 .

[0115] like Figure 8 As shown, after the first organic layer 160 is formed, the second organic layer 170 is formed.

[0116] The second organic layer 170 may include an organic material such as polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, or benzocyclobutene (BCB). The bank layer 171, the second upper dam DAM22, and the first dam DAM1 may include the same material and may be formed in the same process.

[0117] The bank layer 171 may be disposed in the display area DA and may expose a portion of the upper surface of the anode ANO. The bank layer 171 may define an emission region by exposing a central portion of the upper surface of the anode ANO. In the display area DA, a region where the bank layer 171 is disposed may be defined as a non-emission region.

[0118] The second upper dam DAM22 may be disposed on the second lower dam DAM21. The second upper dam DAM22 may overlap the second lower dam DAM21 in a thickness direction. The second upper dam DAM22 may have a width greater than that of the second lower dam DAM21, and may cover a side surface of the second lower dam DAM21.

[0119] The second dam DAM2 may include a second lower dam DAM21 and a second upper dam DAM22, and one or more second dams DAM2 may be provided. Figure 6 , an example in which two second dams DAM2 are provided has been shown. Two or more second dams DAM2 may be provided to be spaced apart from each other. Two or more second dams DAM2 may be provided in the second dam portion DP2. The second dam DAM2 may prevent the encapsulation organic layer 182 of the thin film encapsulation layer TFE from overflowing into the bending region BR. For example, the encapsulation organic layer 182 may terminate at the second dam DAM2 located outside of the two second dams DAM2. Therefore, the encapsulation organic layer 182 does not extend to the bending region BR and may not overlap with the components located in the bending region BR at all.

[0120] The first dam DAM1 may be disposed in the bending region BR. The first dam DAM1 may be disposed in the first dam portion DP1. One or more first dams DAM1 may be provided. Figure 6 , an example in which two first dams DAM1 are provided has been shown. One or more first dams DAM1 may be provided in the first dam portion DP1. The first dam DAM1 may prevent the touch organic layer 250 from overflowing into the sub-region SR. For example, the touch organic layer 250 may terminate at the first dam DAM1 located outside of the two first dams DAM1. Therefore, the touch organic layer 250 does not extend to the sub-region SR and may not overlap with the components located in the sub-region SR at all.

[0121] Hereinafter, other embodiments of the display device will be described. Figure 6 Overlapping description of components of display device 1 already described in .

[0122] Fig. 9 is a cross-sectional view of a display device according to another embodiment.

[0123] Reference Fig. 9 According to the present embodiment, the touch line TL_1 of the display device 2 is connected to the touch line TL_2 according to the embodiment. Figure 6 The display device 1 is different in that it does not include the first touch line portion TL1.

[0124] More specifically, the touch line TL_1 may include a second touch line portion TL2 and a bent bridge electrode CL. The first touch conductive layer 220_1 may not include Figure 6 The first touch line portion TL1.

[0125] Since the rest of the description is as above Figure 6 , so its detailed description will be omitted.

[0126] Fig.10 is a cross-sectional view of a display device according to still another embodiment.

[0127] Reference Fig.10 The display device 3 according to this embodiment is different from the display device 3 according to Figure 6 The display device 1 is different in that the second touch conductive layer 240_1 does not include the second touch line portion TL2 and the third touch pad portion TPAD3, and the first touch conductive layer 220_2 includes the first touch line portion TL1_1 and the third touch pad portion TPAD3_1.

[0128] More specifically, according to Figure 6 The upper surface of the second touch line portion TL2 of the display device 1 is in direct contact with the touch organic layer 250. In other words, when moisture enters the second touch line portion TL2 through the touch organic layer 250, corrosion of the second touch line portion TL2 may occur. However, according to the present embodiment, by omitting the second touch line portion TL2, forming the touch line TL_2 through the first touch line portion TL1_1 and the bent bridge electrode CL, and disposing the touch insulating layer 230 between the first touch line portion TL1_1 and the touch organic layer 250, penetration of moisture into the touch line TL_2 can be minimized.

[0129] Since the rest of the description is as above Figure 6 , so its detailed description will be omitted.

[0130] Although the embodiments have been described above with reference to the accompanying drawings, those skilled in the art to which the present disclosure belongs will be able to understand that the above technical configuration can be implemented in other specific forms without changing its technical spirit or basic features. Therefore, it should be understood that the above embodiments are illustrative rather than restrictive in all aspects. In addition, the scope of the present disclosure is described by the claims to be described herein rather than by a detailed description. In addition, the meaning and scope of the claims and all changes or modifications derived from equivalent concepts should be interpreted as being included within the scope of the present disclosure.

[0131] Description of Reference Numerals

[0132] 1: Display device

[0133] 100: Display panel

[0134] 200: Touch sensor layer

[0135] SUB: Substrate unit

[0136] CEL: Circuit Element Layer

[0137] EL: Organic element layer

[0138] TFE: Thin film encapsulation layer.

Claims

1. A display device, comprising: a base substrate including a display area including a plurality of pixels and a non-display area adjacent to the display area; A first dam is disposed on the base substrate in the non-display area; a second dam disposed on the base substrate in the non-display area and disposed between the first dam and the display area; as well as A touch sensor layer comprising: a touch conductive layer disposed between the first dam and the second dam, and a touch organic layer on the touch conductive layer, wherein the touch organic layer is terminated within the first dam, and The first dam and the second dam include the same material.

2. The display device according to claim 1, wherein: The height of the first dam is greater than the surface height of the second dam.

3. The display device according to claim 1, further comprising: A thin film encapsulation layer is provided between the first dam and the touch sensor layer, wherein the thin film encapsulation layer includes a first encapsulation inorganic layer, an encapsulation organic layer disposed on the first encapsulation inorganic layer, and a second encapsulation inorganic layer disposed on the encapsulation organic layer.

4. The display device according to claim 3, wherein: The encapsulating organic layer terminates within the second dam.

5. The display device according to claim 4, wherein: The encapsulating organic layer does not overlap the first dam.

6. The display device according to claim 1, wherein: The non-display area includes a bending area in which the display device is bent in a thickness direction, the first dam is disposed in the bending area, and the second dam is disposed between the bending area and the display area.

7. The display device according to claim 1, further comprising: An organic element layer is arranged on the base substrate of the display area, wherein the organic element layer includes an anode, a dam layer exposing a portion of the upper surface of the anode, an organic layer arranged on the exposed upper surface of the anode, and a cathode arranged on the organic layer.

8. The display device according to claim 7, wherein: The first dam and the second dam are disposed coplanarly with the bank layer.

9. The display device according to claim 1, wherein: Two or more first dams are provided.

10. The display device according to claim 7, wherein: The first dam is disposed on a second interlayer insulating layer between the bank layer and the base substrate.

11. The display device according to claim 7, wherein: The first dam is disposed on a planarization layer between the bank layer and the base substrate.

12. The display device according to claim 10, further comprising: A planarization layer is provided between the second interlayer insulating layer and the bank layer, wherein the first dam is provided on the second interlayer insulating layer and the planarization layer.

13. A display device, comprising: A display area including a plurality of pixels; as well as a non-display area located near the display area, Wherein, the non-display area includes: a first dam portion surrounding the display area; and a second dam portion surrounding the display area and disposed between the first dam portion and the display area, and The first dam portion comprises: a main dam portion having a first separation distance from the second dam portion; and A protruding dam portion is separated from the second dam portion by a second distance.

14. The display device according to claim 13, wherein: The first dam portion and the second dam portion each include a closed loop shape.

15. The display device according to claim 13, wherein: The first dam portion further includes a connecting dam portion connecting the main dam portion and the protruding dam portion.

16. The display device according to claim 14, wherein: The non-display area further includes a curved area in which the display device is curved in a thickness direction, and the protruding dam portion is provided in the curved area.

17. The display device according to claim 13, wherein: The second separation distance is greater than the first separation distance.

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