Photothermal sensing device based on RGB and thermal infrared technology and anti-photobleaching detection method

Abstract

The present invention discloses a photothermal sensing device based on RGB and thermal infrared technology and an anti-photobleaching detection method, belonging to the field of detection technology. A photothermal sensing device based on RGB and thermal infrared technology comprises a light source mechanism, a detection mechanism and an analysis control mechanism arranged in sequence, the detection mechanism comprises a sample placement unit, a thermal infrared module and an RGB chip module are respectively arranged above and below the sample placement unit, and the thermal infrared module and the RGB chip module are both electrically connected to the analysis control mechanism. At the same time, an anti-photobleaching detection method based on the above device is disclosed. By using the above photothermal sensing device based on RGB and thermal infrared technology and the anti-photobleaching detection method, the RGB chip module can analyze the color change of the light signal in real time, which is convenient for the subsequent elimination of the signal distortion data caused by the photobleaching phenomenon, and timely shutting down the laser light source, and the thermal infrared module can provide high-precision temperature measurement, which improves the stability and accuracy of the photothermal sensor.

Description

Technical Field

[0001] The invention relates to the field of detection technology, in particular to a photothermal sensing device based on RGB and thermal infrared technology and an anti-photobleaching detection method. Background Art

[0002] A photothermal sensor is a device that detects light signals by using the temperature changes caused by light signals. Its working principle is mainly based on the light source irradiating on the photosensitive material or photodetector. The material absorbs the light energy and converts it into heat energy, causing the material temperature to rise. This temperature change is monitored in real time by a temperature sensor (such as a thermocouple, thermistor or infrared thermal imaging module), and the temperature change is converted into an electrical signal for processing and analysis. The processed signal can be used for applications such as light intensity measurement and spectral analysis, and has been widely used in biomedicine, environmental monitoring, materials science and other fields. Due to its high sensitivity and non-contact measurement advantages, photothermal sensors have become one of the hot spots for research and application.

[0003] However, in the actual use of photothermal sensors, the impact of photobleaching on experimental results has always been one of the problems that has troubled researchers. Photobleaching refers to the change in the molecular structure of photosensitive materials under strong light irradiation, which causes permanent or temporary changes in the optical absorption characteristics of the material, thereby weakening or eliminating its response to light signals. This phenomenon is particularly common in fluorescent probes, dyes and other optical materials, which directly affects the sensitivity of optical sensors, leading to inaccuracy and non-repeatability of experimental results. Especially under long-term or high-intensity light conditions, photothermal sensors rely on temperature changes caused by light absorption for detection. Photobleaching can cause the sensor signal to be significantly weakened or even completely lost, greatly reducing the stability and reliability of the sensor in long-term observations or high-precision measurements.

[0004] Photothermal sensors based on infrared thermal imaging technology combine the advantages of optoelectronic technology and infrared thermal imaging technology, and can simultaneously obtain optical and thermal information of samples. During illumination, the photosensitive material absorbs light energy, causing the temperature to rise, and the infrared thermal imaging module detects and displays this temperature change in real time. Using this method, researchers can detect and analyze the photothermal effect of samples with high precision. For example, in materials science research, through infrared thermal imaging technology, researchers can accurately measure the temperature changes of materials under illumination, evaluate the light resistance of materials, or detect their potential thermal damage risks.

[0005] However, even with the assistance of infrared thermal imaging technology, photothermal sensors may still be affected by photobleaching in practical applications. When photosensitive materials undergo molecular structural changes under strong light, the sensor's response to light signals will weaken or disappear, thus affecting the accuracy and repeatability of the experiment. Summary of the invention

[0006] The purpose of the present invention is to provide a photothermal sensing device and an anti-photobleaching detection method based on RGB and thermal infrared technology to solve the above technical problems.

[0007] To achieve the above object, the present invention provides a photothermal sensing device based on RGB and thermal infrared technology, comprising a light source mechanism, a detection mechanism and an analysis control mechanism arranged in sequence, wherein the detection mechanism is electrically connected to the analysis control mechanism;

[0008] The detection mechanism comprises a sample placement unit, and a thermal infrared module and an RGB chip module are respectively arranged above and below the sample placement unit, and both the thermal infrared module and the RGB chip module are electrically connected to the analysis control mechanism.

[0009] Preferably, the light source mechanism includes a laser light source and a laser area housing, the laser light source is installed in the laser area housing, the laser light source is electrically connected to the analysis control mechanism or the laser light source is connected to a start control circuit board, the start control circuit board is connected to a power supply, and the laser area housing is provided with a light-transmitting hole.

[0010] Preferably, the sample placement unit includes a sample area shell with a light-transmitting hole, a sample placement base and a sample placement cover are arranged in the sample area shell, a sample pulling assembly is arranged on the sample placement base, an RGB signal collection hole is arranged in the sample placement base, the RGB signal collection hole is arranged opposite to the RGB chip module, the sample placement cover is provided with a thermal infrared signal collection hole, the thermal infrared signal collection hole is arranged opposite to the thermal infrared module, and the thermal infrared module and the RGB chip module are installed at the top and bottom of the sample area shell.

[0011] Preferably, the sample pulling assembly includes two fixed guide rails fixed on the sample placement base, the two fixed guide rails are arranged in parallel, a slide plate with a guide groove is provided on the fixed guide rail, a positioning groove is provided in the guide groove at the bottom of the slide plate, and at least one accommodating groove for placing the sample pool is provided on the upper part of the slide plate. The two ends of the two slides are fixedly connected by a connecting plate, a handle is provided on the connecting plate, entry and exit through holes are provided on both sides of the sample area shell, and sliding doors are provided on both sides of the sample area shell.

[0012] Preferably, a positioning piece is provided at a position of the fixed guide rail relative to the RGB signal collection hole, and the positioning piece is a ball plunger.

[0013] Preferably, the analysis control mechanism comprises a control area housing and a control circuit board arranged in the control area housing, the control circuit board comprises a signal processing unit, a microcontroller unit, a communication unit, a data output unit and a power supply unit, the signal processing unit, the communication unit, the data output unit and the power supply module are all electrically connected to the microcontroller unit, and the microcontroller unit is connected to a display;

[0014] The thermal infrared module and the RGB chip module are both electrically connected to the signal processing unit.

[0015] The anti-photobleaching detection method based on the above-mentioned photothermal sensing device based on RGB and thermal infrared technology has the following specific steps:

[0016] Step S1: prepare a sample, place a sample pool with the sample on a sample pull-out assembly, and push the sample pool on the sample pull-out assembly to a detection position;

[0017] Step S2: start the RGB chip module, thermal infrared module and laser light source in sequence;

[0018] Step S3: collecting optical signal data and temperature data of the sample through the RGB chip module and the thermal infrared module;

[0019] Step S4: the signal processing unit receives the optical signal data and the temperature data, and generates an optical signal distribution graph and a temperature distribution graph;

[0020] Step S5: determining whether the color change of the sample reaches a set value according to the optical signal distribution diagram; when the color change reaches the set value, turning off the laser light source and determining the time when photobleaching occurs;

[0021] Step S6: The temperature data after removing the temperature data when photobleaching occurs is output data of the current sample;

[0022] Step S7: Push the sample pulling assembly to a station, and repeat steps S2 to S6 to test the next sample.

[0023] Therefore, the present invention adopts the above-mentioned photothermal sensing device based on RGB and thermal infrared technology and anti-photobleaching detection method, which has the following beneficial effects:

[0024] (1) The RGB chip module can analyze the color changes of the light signal in real time, which facilitates the subsequent elimination of signal distortion caused by photobleaching and timely shuts down the laser light source, thereby improving the stability of the photothermal sensor. The thermal infrared module can provide high-precision temperature measurement, ensuring that reliable temperature data can be obtained even in complex environments.

[0025] (2) High level of integration, small device size, and easy to carry.

[0026] (3) Multiple sample pools can be tested sequentially.

[0027] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1This is an assembly diagram of a photothermal sensing device based on RGB and thermal infrared technology of the present invention;

[0029] Figure 2 This is an exploded diagram of a photothermal sensing device based on RGB and thermal infrared technology of the present invention;

[0030] Figure 3 This is a diagram showing the positional relationship between the thermal infrared module, the RGB chip module and the sample pool to be tested according to the present invention;

[0031] Figure 4 A top view of the skateboard of the present invention;

[0032] Figure 5 It is a partial schematic diagram of the bottom of the skateboard of the present invention;

[0033] Figure 6 This is a schematic diagram of the positioning member structure of the present invention;

[0034] Figure 7 It is the circuit principle diagram of the present invention;

[0035] Figure 8 This is a temperature distribution diagram of an embodiment of the present invention;

[0036] Fig. 9 This is a color light signal distribution diagram of an embodiment of the present invention.

[0037] Reference numerals

[0038] 1. Light source mechanism; 11. Laser light source; 12. Laser zone housing; 2. Detection mechanism; 21. Sample placement unit; 211. Sample zone housing; 2111. Inlet and outlet holes; 2112. Sliding door; 212. Sample placement base; 2121. RGB signal acquisition hole; 213. Sample placement cover; 2131. Thermal infrared signal acquisition hole; 22. Thermal infrared module; 23. RGB chip module; 3. Analysis and control mechanism; 31. Control zone housing; 32. Control circuit board; 321. Signal processing unit; 322. Microcontroller unit; 323. Communication unit; 324. Data output unit; 325. Power supply unit; 33. Display; 4. Light transmission hole; 5. Sample pulling assembly; 51. Fixed guide rail; 52. Slide plate; 521. Guide groove; 522. Positioning groove; 523. Accommodating groove; 53. Connecting plate; 54. Handle; 55. Positioning piece; 6. Sample pool. DETAILED DESCRIPTION

[0039] Example

[0040] In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the invented product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "setting", "installation", and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] The embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0042] like Figure 1 - Figure 2 As shown, a photothermal sensing device based on RGB and thermal infrared technology includes a light source mechanism 1, a detection mechanism 2 and an analysis and control mechanism 3 which are arranged in sequence, and the detection mechanism 2 is electrically connected to the analysis and control mechanism 3.

[0043] The light source mechanism 1 includes a laser light source 11 and a laser area housing 12. The laser light source 11 is installed in the laser area housing 12. In this embodiment, the laser light source 11 is connected to a starting control circuit board through a power module. The laser area housing 12 is provided with a light-transmitting hole 4 for the laser beam to pass through, thereby realizing independent control of the laser light source 11. At the same time, it can also be connected to the analysis control mechanism 3 to control the opening and closing of the laser light source 11 through the analysis control mechanism 3.

[0044] The detection mechanism 2 includes a sample placement unit 21, such as Figure 3 As shown, a thermal infrared module 22 and an RGB chip module 23 are respectively disposed above and below the sample placement unit 21. The RGB chip module 23 is used to detect and feed back the intensity of the light signal by analyzing the color change of the sample under light. The RGB chip module 23 can capture and analyze the changes of the three primary colors of red, green and blue in real time, and then generate accurate optical information through color combination, which is used to detect the moment when the signal is weakened or disappears due to the photobleaching phenomenon. The thermal infrared module 22 is used to detect the temperature change of the sample, and can capture its thermal response in real time when the sample absorbs light energy and causes temperature change. The sample placement unit 21 includes a sample area housing 211 with a light-transmitting hole 4, and a sample placement base 212 and a sample placement cover 213 are disposed in the sample area housing 211. A sample pulling assembly 5 is disposed on the sample placement base 212, as shown in FIG. Figure 4 - Figure 6 As shown, the sample pulling assembly 5 includes two fixed guide rails 51 fixed on the sample placement base 212, the two fixed guide rails 51 are arranged in parallel, a slide plate 52 with a guide groove 521 is provided on the fixed guide rail 51, a positioning groove 522 is provided in the guide groove 521 at the bottom of the slide plate 52, and four pairs of receiving grooves 523 for placing the sample pool 6 are provided on the upper part of the slide plate 52 of this embodiment, and the two ends of the two slide plates 52 are fixedly connected by a connecting plate 53, and a handle 54 is provided on the connecting plate 53. Inlet and outlet holes 2111 are provided on both sides of the sample area shell 211, and sliding doors 2112 are provided on both sides of the sample area shell 211. When detecting, the sliding door 2112 is pulled down, and when the slide plate 52 is moved, the sliding door 2112 is lifted to realize the sequential detection of multiple sample pools 6. The sliding door 2112 is provided at the inlet and outlet holes 2111 to block external light and reduce the interference of external light with detection. The sample placement base 212 is provided with an RGB signal collection hole 2121, which is arranged opposite to the RGB chip module 23. The sample placement cover plate 213 is provided with a thermal infrared signal collection hole 2131, which is arranged opposite to the thermal infrared module 22. The thermal infrared module 22 and the RGB chip module 23 are installed at the top and bottom of the sample area housing 211. A positioning member 55 is provided at the position of the fixed guide rail 51 relative to the RGB signal collection hole 2121. The positioning member 55 is a ball plunger. When reaching the detection position, the ball plunger is stuck in the positioning groove 522 to achieve the positioning of the sample pool 6. When advancing, the ball head of the ball plunger shrinks after being squeezed by the slide plate 52, and then pops out when the next positioning groove 522 is reached. Through the cooperation between the positioning groove 522 on the slide plate 52 and the ball plunger, the sample pool 6 is accurately positioned and stably fixed, ensuring that the position of the sample pool 6 will not be displaced during the detection process, thereby improving the accuracy and repeatability of the detection results.

[0045] This embodiment adopts manual propulsion, and can also adopt electric propulsion.

[0046] like Figure 7 As shown, the analysis control mechanism 3 includes a control area housing 31 and a control circuit board 32 arranged in the control area housing 31, the control circuit board 32 includes a signal processing unit 321, a microcontroller unit 322, a communication unit 323, a data output unit 324 and a power supply unit 325, the signal processing unit 321, the communication unit 323, the data output unit 324 and the power supply module are all electrically connected to the microcontroller unit 322, and the microcontroller unit 322 is connected to a display 33. In this embodiment, an STM32 microcontroller is used to control the working state, signal acquisition and output of the RGB chip module 23 and the thermal infrared module 22. The STM32 module realizes precise control of each module through programming, and the specific control functions are as follows:

[0047] 1) RGB chip module 23 control: The STM32 module controls the startup, shutdown and data acquisition frequency of the RGB chip according to the set working mode.

[0048] 2) Thermal infrared module 22 control: The STM32 module controls the temperature acquisition process of the thermal infrared module 22 in real time to ensure the accuracy and real-time performance of the temperature data.

[0049] At the same time, data transmission and reception are performed through the communication unit 323 and the data output unit 324 (wireless or wired), so as to realize on-site and remote monitoring and control.

[0050] The thermal infrared module 22 and the RGB chip module 23 are both electrically connected to the signal processing unit 321, which is used to receive the detection signals of the thermal infrared module 22 and the RGB chip module 23, and process and analyze the signals. The signal processing unit 321 can fuse the optical signal with the temperature data and intercept the effective detection data to improve the accuracy and reliability of the experimental data.

[0051] Based on the above-mentioned anti-photobleaching detection method of the photothermal sensing device based on RGB and thermal infrared technology, the specific steps are as follows:

[0052] Step S1: Prepare samples.

[0053] Step S11: Take a centrifuge tube and add 100 μL of 100 mM glucose solution and 20 μL of 10 mM glucose oxidase solution into the tube. Mix and incubate for 5 minutes (Note: Glucose is decomposed into hydrogen peroxide and gluconic acid under the action of glucose oxidase).

[0054] Step S12: At the same time, take another centrifuge tube and add the following into the tube: 80 μL, 10 mM 3,3′,5,5′-tetramethylbenzidine (TMB) solution, 100 μL, 1 mM horseradish peroxidase solution, mix and incubate for 5 minutes.

[0055] Step S13: Mix the solutions of step S11 and step S12 and incubate them together for 10 minutes. (Note: The horseradish catalase in step S12 can catalyze the hydrogen peroxide generated in step S11 to produce water and oxidized horseradish hydroperoxide, and the latter can oxidize colorless TMB into blue TMB oxide. TMB oxide is a common photothermal conversion material that can produce a strong temperature change under near-infrared laser irradiation).

[0056] Step S14: placing the solution generated in step S13 into a plurality of sample pools 6, placing the sample pools 6 with samples on the sample drawing component 5, and pushing the sample pools 6 on the sample drawing component 5 to the detection position.

[0057] Step S2: Start the microcontroller unit 322 and establish communication with the host computer (computer or mobile phone) through the data output unit 324 and the communication unit 323. The host computer sends control instructions to the microcontroller unit 322 to regulate the operation of each device. The operation of each component can also be directly controlled through the microcontroller unit 322, and the RGB chip module 23, the thermal infrared module 22 and the laser light source 11 are started in sequence.

[0058] Step S3: The optical signal data and temperature data of the sample are collected through the RGB chip module 23 and the thermal infrared module 22 . Under the irradiation of the laser light source 11 , the sample (TMB oxide) can rapidly generate photothermal conversion.

[0059] Step S4: the signal processing unit 321 receives the optical signal data and the temperature data, and generates an optical signal distribution graph and a temperature distribution graph.

[0060] Step S5: judging whether the color change of the sample reaches a set value according to the optical signal distribution diagram; when the color change reaches the set value, turning off the laser light source 11 and determining the time when photobleaching occurs.

[0061] Step S6: The temperature data after removing the temperature data when photobleaching occurs is the output data of the current sample.

[0062] Step S7: Push the sample drawing assembly 5 to a station, and repeat steps S2 to S6 to test the next sample.

[0063] like Figure 8 and Fig. 9 As shown, as the laser irradiation time increases, the thermal infrared module 22 can capture the temperature increase of the sample in real time. At the same time, the B channel of the RGB chip (the B channel data is selected because the solution color is blue, so the B channel data is more accurate as quantitative data) collects data and can record the color change of the sample in real time, effectively detecting and avoiding the photobleaching phenomenon that affects the detection results.

[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solution of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solution to deviate from the spirit and scope of the technical solution of the present invention.

Claims

1. A method for detecting anti-photobleaching of a photothermal sensing device based on RGB and thermal infrared technology, characterized in that: The specific steps are as follows: Step S1: prepare a sample, place a sample pool with the sample on a sample pull-out assembly, and push the sample pool on the sample pull-out assembly to a detection position; Step S2: Start the communication unit to establish a communication connection between the microcontroller unit and the host computer, and then send a control instruction to the microcontroller unit through the host computer, and the microcontroller unit starts the RGB chip module, the thermal infrared module and the laser light source in turn; Step S3: collecting optical signal data and temperature data of the sample through the RGB chip module and the thermal infrared module; Step S4: the signal processing unit receives the optical signal data and the temperature data, and generates an optical signal distribution graph and a temperature distribution graph; Step S5: determining whether the color change of the sample reaches a set value according to the optical signal distribution diagram; when the color change reaches the set value, turning off the laser light source and determining the time when photobleaching occurs; Step S6: The temperature data after removing the temperature data when photobleaching occurs is output data of the current sample; Step S7: Push the sample pulling assembly to a station, and repeat steps S2 to S6 to test the next sample.

2. The anti-photobleaching detection method of a photothermal sensing device based on RGB and thermal infrared technology according to claim 1, characterized in that: The photothermal sensing device based on RGB and thermal infrared technology comprises a light source mechanism, a detection mechanism and an analysis control mechanism which are arranged in sequence, and the detection mechanism is electrically connected to the analysis control mechanism; The detection mechanism includes a sample placement unit for placing the sample to be tested, a thermal infrared module is arranged above the sample placement unit, and an RGB chip module is arranged below the sample placement unit. The thermal infrared module and the RGB chip module are both electrically connected to the analysis control mechanism to realize the collection and analysis of the optical signal and temperature signal of the sample to be tested.

3. The anti-photobleaching detection method of a photothermal sensing device based on RGB and thermal infrared technology according to claim 2, characterized in that: The light source mechanism includes a laser light source and a laser area housing. The laser light source is installed in the laser area housing, and the laser area housing is provided with a light-transmitting hole for the laser beam to pass through. The laser light source is electrically connected to the analysis control mechanism or the start control circuit board through a power module.

4. The anti-photobleaching detection method of a photothermal sensing device based on RGB and thermal infrared technology according to claim 3, characterized in that: The sample placement unit includes a sample area shell with a light-transmitting hole, a sample placement base and a sample placement cover for placing samples are arranged in the sample area shell, a sample pulling assembly is arranged on the sample placement base, an RGB signal collection hole is arranged in the sample placement base, and the RGB signal collection hole is arranged opposite to the RGB chip module, the sample placement cover is provided with a thermal infrared signal collection hole, and the thermal infrared signal collection hole is arranged opposite to the thermal infrared module, and the thermal infrared module and the RGB chip module are installed at the top and bottom of the sample area shell.

5. The anti-photobleaching detection method of a photothermal sensing device based on RGB and thermal infrared technology according to claim 4, characterized in that: The sample pulling assembly includes two fixed guide rails fixed on the sample placement base, the two fixed guide rails are arranged in parallel, a slide with a guide groove is provided on the fixed guide rail, a positioning groove is provided in the guide groove at the bottom of the slide, and at least one accommodating groove for placing the sample pool is provided on the upper part of the slide. The two ends of the two slides are fixedly connected by a connecting plate, and a handle for pushing and pulling the slide is provided on the connecting plate. Inlet and outlet through holes are provided on both sides of the sample area shell, and sliding doors are provided on both sides of the sample area shell.

6. The anti-photobleaching detection method of a photothermal sensing device based on RGB and thermal infrared technology according to claim 4, characterized in that: A positioning piece is arranged at a position of the fixed guide rail relative to the RGB signal collection hole, and the positioning piece is a ball plunger.

7. The anti-photobleaching detection method of a photothermal sensing device based on RGB and thermal infrared technology according to claim 6, characterized in that: The analysis control mechanism includes a control area shell and a control circuit board arranged in the control area shell, the control circuit board includes a signal processing unit, a microcontroller unit, a communication unit, a data output unit and a power supply unit, the signal processing unit, the communication unit, the data output unit and the power supply module are all electrically connected to the microcontroller unit, and the microcontroller unit is connected to a display for real-time on-site display of optical signals and temperature signals; The thermal infrared module and the RGB chip module are both electrically connected to the signal processing unit.

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