Wafer processing device, wafer processing system and method

Abstract

The present invention relates to the field of wafer glue coating and provides a wafer processing device, a wafer processing system, and a method. The device includes: a first interlayer robot, a first interlayer frame group, a second interlayer frame group, a first liquid processing module, and a second liquid processing module; the first liquid processing module and the second liquid processing module are used to perform different liquid processing processes on the wafer surface; the first liquid processing module and the second liquid processing module are stacked in a vertical direction; the first interlayer frame group is docked with the first side of the first liquid processing module; the second interlayer frame group is docked with the first side of the second liquid processing module, and the second interlayer frame group is used to accommodate wafers to be processed by the second liquid processing module and wafers processed by the second liquid processing module; when the working state of the first interlayer robot is enabled, it is used to transfer wafers on the first interlayer interface to the second interlayer interface. The device is used to improve the transmission efficiency of wafers between vertically stacked modules.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and in particular to a wafer processing device, a wafer processing system and a method. Background Art

[0002] To improve space utilization and shorten wafer processing cycles, a vertically stacked modular design is employed in related technologies. This design allows for the integration of more processing units within a compact space. However, existing vertically stacked wafer processing systems often lack effective solutions for efficiently transferring wafers between different heights, resulting in low wafer transfer efficiency. Therefore, there is an urgent need for a wafer processing device, wafer processing system, and method to address these issues. Summary of the Invention

[0003] An object of the present invention is to provide a wafer processing device, a wafer processing system and a method, which are used to improve the transmission efficiency of wafers between vertically stacked modules.

[0004] In the first aspect, the present invention provides a wafer processing device, comprising: a first interlayer robot, a first interlayer frame group, a second interlayer frame group, a first liquid processing module and a second liquid processing module; the first liquid processing module and the second liquid processing module are used to perform different liquid processing processes on the wafer surface; the first liquid processing module and the second liquid processing module are stacked in the vertical direction; the first interlayer frame group and the second interlayer frame group are stacked in the vertical direction; the first interlayer frame group is docked with the first side of the first liquid processing module, and the first interlayer frame group is used to accommodate wafers processed by the first liquid processing module and wafers processed by the first liquid processing module; the first side is the horizontal side of the first liquid processing module; the first interlayer frame group is provided with N first liquid processing modules arranged in sequence in the vertical direction. An interlayer interface, N is a positive integer greater than 1; when the same wafer enters the first interlayer frame group for the Nth time, it is placed on the Nth first interlayer interface; the second interlayer frame group is docked with the first side of the second liquid processing module, and the second interlayer frame group is used to accommodate wafers to be processed by the second liquid processing module, and wafers after being processed by the second liquid processing module; the second interlayer frame group is provided with M second interlayer interfaces arranged in sequence in the vertical direction, M is a positive integer greater than 1; when the same wafer enters the second interlayer frame group for the Mth time, it is placed on the Mth second interlayer interface; when the working state of the first interlayer robot is enabled, it is used to transfer the wafer on the first interlayer interface to the second interlayer interface, or to transfer the wafer on the second interlayer interface to the first interlayer interface.

[0005] Optionally, the first interlayer robot includes at least one actuator; the actuator is oriented toward the first interlayer frame group or the second interlayer frame group; the actuator is used to pick up the wafer from the first interlayer interface or transfer the wafer to the second interlayer interface.

[0006] Optionally, at least one of a glue coating unit, an anti-reflection unit and a solvent spin coating unit is provided in the first liquid processing module or the second liquid processing module; the glue coating unit is used to coat a photoresist layer on the surface of the wafer; the anti-reflection unit is used to coat an anti-reflection coating on the surface of the wafer; and the solvent spin coating unit is used to coat a polymer solvent layer on the surface of the wafer.

[0007] Optionally, the first liquid processing module is provided with a first liquid processing robot, the anti-reflection unit and the solvent spin coating unit; the second liquid processing module is provided with a second liquid processing robot and the glue coating unit; the first interlayer robot is used to transfer the wafer on the first interlayer interface to the second interlayer interface.

[0008] Optionally, it also includes: a first heat treatment module and / or a second heat treatment module; the first heat treatment module is arranged on the side of the first interlayer frame group away from the first liquid treatment module; the second heat treatment module is arranged on the side of the second interlayer frame group away from the second liquid treatment module; the first heat treatment module and the second heat treatment module are used to heat the wafer according to different heating parameters; the heating parameters include heating temperature and heating time.

[0009] Optionally, a cooling unit is further provided in the first interlayer frame group and / or the second interlayer frame group; the cooling unit is arranged on the upper surface of at least one first interlayer interface and / or the upper surface of at least one second interlayer interface; the cooling unit is used to absorb heat from the wafer when in contact with the wafer.

[0010] Optionally, at least one of a photoresist baking unit, an anti-reflective coating baking unit and a solvent baking unit is provided in the first heat treatment module or the second heat treatment module; the photoresist baking unit is used to bake the photoresist layer on the surface of the wafer to solidify the photoresist layer; the anti-reflective coating baking unit is used to bake the anti-reflective coating on the surface of the wafer to solidify the anti-reflective coating; the solvent baking unit is used to bake the polymer solvent layer on the surface of the wafer to solidify the polymer solvation layer.

[0011] Optionally, an edge exposure unit is further provided in the first heat treatment module or the second heat treatment module; the edge exposure unit is used to perform exposure treatment on the front edge of the wafer to facilitate detachment of the edge of the polymer solvent layer on the surface of the wafer.

[0012] Optionally, a control unit is further included, which is used to control the working state of the first interlayer manipulator to be enabled or disabled; when the working state of the first interlayer manipulator is disabled, the control unit is used to control the first interlayer manipulator to move to an initial position, and the initial position is set on the outside of the first interlayer frame group and the second interlayer frame group.

[0013] Optionally, the first interlayer frame group and the second interlayer frame group are integrally configured as an interlayer interface tower, or the first interlayer frame group and the second interlayer frame group are detachably connected.

[0014] In the second aspect, the present invention provides a wafer processing system, comprising the wafer processing device described in any one of the first aspects, and also comprising a wafer box module; the wafer box module comprises an entry and exit robot, a third interlayer frame group and a fourth interlayer frame group; the third interlayer frame group and the fourth interlayer frame group are stacked in the vertical direction; the third interlayer frame group is docked with the second side of the first liquid processing module, and the third interlayer frame group is used to accommodate wafers to be processed by the first liquid processing module; the second side is the horizontal side of the first liquid processing module, and the second side and the first side are opposite to each other; the third interlayer frame group At least two third-layer interfaces are provided inside; at least two of the third-layer interfaces are arranged in sequence in the vertical direction, and the arrangement order of the third-layer interfaces is consistent with the order in which the same wafer enters the third-layer frame group; the fourth-layer frame group is docked with the second side of the second liquid processing module, and the fourth-layer frame group is used to accommodate wafers processed by the second liquid processing module; at least two fourth-layer interfaces are provided in the fourth-layer frame group; the second-layer robot is used to transfer the wafers on the main interface to the third-layer interface; the entry and exit robot is used to take the wafers on the third-layer interface.

[0015] Optionally, it also includes: a main interface, a film box robot, a first loading interface and a second loading interface; the first loading interface is used to load unprocessed wafers, and the second loading interface is used to load processed wafers; the entry and exit robot is used to transfer the wafers on the first loading interface to the main interface; the entry and exit robot is also used to transfer the wafers on the fourth inter-layer interface to the second loading interface; the film box robot is used to transfer the wafers on the overhead crane to the first loading interface; the film box robot is also used to transfer the wafers on the second loading interface to the overhead crane.

[0016] Optionally, it also includes a bonding unit, which is used to spray a bonding agent on the wafer surface under a heated environment; the second interlayer robot is used to transfer the wafer on the total interface to the bonding unit; the second interlayer robot is also used to transfer the wafer in the bonding unit to the third interlayer frame group.

[0017] In a third aspect, the present invention provides a wafer processing method for controlling the device described in any one of the first aspects, including: obtaining the working status of the first interlayer robot, the working status including an enabled state; when the working status of the first interlayer robot is an enabled state, controlling the first interlayer robot to transfer the wafer on the first interlayer interface to the second interlayer interface; or transferring the wafer on the second interlayer interface to the first interlayer interface.

[0018] Optionally, the working state also includes a disabled state, and the method further includes: when the working state of the first interlayer manipulator is a disabled state, the control unit is used to control the first interlayer manipulator to move to an initial position, and the initial position is set on the outside of the first interlayer frame group and the second interlayer frame group.

[0019] Compared with the prior art, the beneficial effect of the present invention is that by stacking the first liquid processing module and the second liquid processing module in the vertical direction, the space utilization rate of the device is improved. This design allows more processing units to be accommodated with the same floor space, thereby increasing the processing capacity of the production line. By equipping the first inter-layer robot, it is possible to quickly transfer wafers between different height positions. This solves the problem of low efficiency in wafer transmission between vertically stacked modules in the prior art, shortens the wafer processing cycle, and improves the overall throughput of the production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of a top view of the structure of a wafer processing system provided by the present invention;

[0021] Figure 2 A schematic diagram of an interlayer module structure provided by the present invention from a Y-direction perspective;

[0022] Figure 3 A schematic diagram of the process unit distribution of a wafer processing system provided by the present invention from a Y-direction perspective;

[0023] Figure 4 A schematic diagram of the robot distribution of a wafer processing system provided by the present invention from a Y-direction perspective;

[0024] Figure 5 A schematic diagram of a wafer transport path of a wafer processing system provided by the present invention from a Y-direction perspective;

[0025] Figure 6 A schematic diagram of a wafer structure that has been processed provided by the present invention;

[0026] Figure 7 A schematic flow chart of a wafer processing method provided by the present invention.

[0027] Description of reference numerals in the figures:

[0028] 100, interlayer module; 200, liquid processing module; 300, thermal processing module; 400, cassette module; 500, wafer processing device; 600, wafer processing system;

[0029] 1. In-and-out robot; 2. Second-layer robot; 3. First-layer robot; 4. Cassette robot; 5. Wafer; 6. Polymer solvent layer; 7. Anti-reflective coating; 8. Photoresist layer;

[0030] 101, first interlayer frame group; 102, second interlayer frame group; 103, first liquid treatment module; 104, second liquid treatment module; 105, first heat treatment module; 106, second heat treatment module; 107, control unit; 108, third interlayer frame group; 109, fourth interlayer frame group;

[0031] 11. First liquid processing robot; 12. Second liquid processing robot; 13. Third liquid processing robot; 14. Fourth liquid processing robot; 15. Fifth liquid processing robot; 16. Sixth liquid processing robot;

[0032] 21. First heat treatment manipulator; 22. Second heat treatment manipulator; 23. Third heat treatment manipulator; 24. Fourth heat treatment manipulator; 25. Fifth heat treatment manipulator; 26. Sixth heat treatment manipulator. DETAILED DESCRIPTION

[0033] In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be the common meanings understood by people with ordinary skills in the field to which the present invention belongs. The words "including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. In the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "multiple" refers to two or more, unless otherwise clearly defined.

[0034] In view of the problems existing in the existing technology, such as Figure 1 As shown, the first embodiment of the present invention provides a wafer processing device 500, such as Figure 2 and Figure 3As shown, it includes: a first interlayer robot 3, a first interlayer frame group 101, a second interlayer frame group 102, a first liquid processing module 103 and a second liquid processing module 104; the first liquid processing module 103 and the second liquid processing module 104 are used to perform different liquid processing processes on the surface of the wafer 5; the first liquid processing module 103 and the second liquid processing module 104 are stacked in the vertical direction; the first interlayer frame group 101 and the second interlayer frame group 102 are stacked in the vertical direction; the first interlayer frame group 101 is docked with the first side of the first liquid processing module 103, and the first interlayer frame group 101 is used to accommodate the wafers processed by the first liquid processing module 103, and the wafers after being processed by the first liquid processing module 103; the first side is the horizontal side of the first liquid processing module 103; the first interlayer frame group 101 is provided with a vertical direction N first interlayer interfaces are arranged in sequence, N is a positive integer greater than 1; when the same wafer enters the first interlayer frame group for the Nth time, it is placed on the Nth first interlayer interface; the second interlayer frame group 102 is docked with the first side of the second liquid processing module 104, and the second interlayer frame group 102 is used to accommodate wafers to be processed by the second liquid processing module 104, and wafers processed by the second liquid processing module 104; the second interlayer frame group 102 is provided with M second interlayer interfaces arranged in sequence in the vertical direction, M is a positive integer greater than 1; when the same wafer enters the second interlayer frame group for the Mth time, it is placed on the Mth second interlayer interface; when the working state of the first interlayer robot 3 is enabled, it is used to transfer the wafer 5 on the first interlayer interface to the second interlayer interface, or to transfer the wafer 5 on the second interlayer interface to the first interlayer interface.

[0035] Specifically, the first interlayer frame group 101 is stacked in the Z direction of the second interlayer frame group 102. The first interlayer manipulator 3, the first interlayer frame group 101 and the second interlayer frame group 102 together constitute the interlayer module 100. The first liquid processing module 103 is stacked in the Z direction of the second liquid processing module 104. The first liquid processing module 103, the first liquid processing module 103 and the second interlayer frame group 102 together constitute the liquid processing module 200. The interlayer module 100 is located in the X direction of the liquid processing module 200. Figure 1 As shown, the first side is set as the X direction side.

[0036] like Figure 3 As shown, in some specific embodiments, the first liquid processing module 103 includes three liquid processing layers, namely liquid processing layers C4-C6. The second liquid processing module 104 includes three liquid processing layers, namely liquid processing layers C1-C3.

[0037] In some further specific embodiments, each liquid processing layer includes two rows of liquid processing units and a liquid processing robot. More specifically, the two rows of liquid processing units are distributed on the Y direction and the anti-Y direction side of the liquid processing robot. The X direction, Y direction, and Z direction are perpendicular to each other, and the Z direction is vertically upward.

[0038] like Figure 4 As shown, in some examples, the first liquid processing module 103 includes a fourth liquid processing robot 14, a fifth liquid processing robot 15 and a sixth liquid processing robot 16, and the second liquid processing module 104 includes a first liquid processing robot 11, a second liquid processing robot 12 and a third liquid processing robot 13.

[0039] Compared with the prior art, this embodiment improves the space utilization of the device by stacking the first liquid processing module 103 and the second liquid processing module 104 in the vertical direction. This design allows more processing units to be accommodated under the same floor space, thereby increasing the processing capacity of the production line. By equipping the first interlayer robot 3, it is possible to quickly transfer the wafer 5 between different height positions. This solves the problem of low efficiency in the transmission of wafers 5 between vertically stacked modules in the prior art, shortens the processing cycle of wafers 5, and improves the overall throughput of the production line.

[0040] In some embodiments, the first interlayer robot 3 includes at least one actuator; the actuator is oriented toward the first interlayer frame group 101 or the second interlayer frame group 102; the actuator is used to pick up the wafer 5 from the first interlayer interface or transfer the wafer 5 to the second interlayer interface.

[0041] In some examples, the first interlayer robot 3 includes a first actuator for transferring the wafer 5 on the first interlayer interface to the second interlayer interface.

[0042] In other examples, the first interlayer robot 3 includes N actuators, and the Nth actuator is used to transfer the wafer 5 on the Nth first interlayer interface to the Nth second interlayer interface, where N is a positive integer.

[0043] In some embodiments, at least one of a glue coating unit, an anti-reflection unit and a solvent spin coating unit is provided in the first liquid processing module 103 or the second liquid processing module 104; the glue coating unit is used to coat a photoresist layer 8 on the surface of the wafer 5; the anti-reflection unit is used to coat an anti-reflection coating 7 on the surface of the wafer 5; and the solvent spin coating unit is used to coat a polymer solvent layer 6 on the surface of the wafer 5.

[0044] In some specific embodiments, the first liquid processing module 103 is equipped with a first liquid processing robot 11, the anti-reflection unit, and the solvent spin coating unit; the second liquid processing module 104 is equipped with a second liquid processing robot 12 and the glue coating unit; the first interlayer robot 3 is used to transfer the wafer 5 on the first interlayer interface to the second interlayer interface. The wafer processing device in this embodiment is used to perform glue coating and pre-exposure baking processes before the wafer enters the photolithography process.

[0045] In some other specific embodiments, the coating unit, anti-reflection unit, and solvent spin coating unit in the first liquid processing module 103 or the second liquid processing module 104 are replaced with a developing unit and an optical detection unit. The wafer processing apparatus in this embodiment is used to perform the development and post-exposure baking processes after the wafer enters the photolithography stage.

[0046] In some embodiments, the first liquid processing module 103 includes a fourth liquid processing robot 14 , a fifth liquid processing robot 15 and a sixth liquid processing robot 16 ; the second liquid processing module 104 includes a first liquid processing robot 11 , a second liquid processing robot 12 and a third liquid processing robot 13 .

[0047] In some embodiments, it also includes: a first heat treatment module 105 and / or a second heat treatment module 106; the first heat treatment module 105 is arranged on the side of the first interlayer frame group 101 away from the first liquid treatment module 103; the second heat treatment module 106 is arranged on the side of the second interlayer frame group 102 away from the second liquid treatment module 104; the first heat treatment module 105 and the second heat treatment module 106 are used to heat the wafer 5 according to different heating parameters; the heating parameters include heating temperature and heating time.

[0048] In some specific embodiments, at least one of a photoresist baking unit, an anti-reflective coating baking unit and a solvent baking unit is provided in the first heat treatment module 105 or the second heat treatment module 106; the photoresist baking unit is used to bake the photoresist layer 8 on the surface of the wafer 5 to solidify the photoresist layer 8; the anti-reflective coating baking unit is used to bake the anti-reflective coating 7 on the surface of the wafer 5 to solidify the anti-reflective coating 7; the solvent baking unit is used to bake the polymer solvent layer 6 on the surface of the wafer 5 to solidify the polymer solvation layer.

[0049] In some examples, the first thermal treatment module 105 is provided with an anti-reflective coating baking unit and a solvent baking unit, and the second thermal treatment module 106 is provided with a photoresist baking unit. In other examples, the first thermal treatment module 105 and the second thermal treatment module 106 constitute the thermal treatment module 300.

[0050] In some embodiments, a cooling unit is further provided in the first interlayer frame group 101 and / or the second interlayer frame group 102; the cooling unit is arranged on the upper surface of at least one first interlayer interface and / or the upper surface of at least one second interlayer interface; the cooling unit is used to absorb heat from the wafer 5 when in contact with the wafer 5.

[0051] Specifically, cooling units are provided in the first interlayer frame group 101 and the second interlayer frame group 102. In some examples, a first cooling unit is provided at each first interlayer interface adjacent to the anti-reflective coating baking unit, a second cooling unit is provided at each first interlayer interface adjacent to the solvent baking unit, and a third cooling unit is provided at each second interlayer interface adjacent to the photoresist baking unit.

[0052] like Figure 5 and Figure 6 As shown, in some embodiments, an edge exposure unit WES is further provided in the first heat treatment module 105 or the second heat treatment module 106; the edge exposure unit WES is used to perform exposure treatment on the front edge of the wafer so that the edge of the polymer solvent layer 6 on the surface of the wafer 5 is easy to detach, and along with the falling off of the edge of the polymer solvent layer 6, the edge of the anti-reflective coating 7 and the edge of the photoresist layer 8 fall off together.

[0053] In some specific embodiments, the first heat treatment module 105 further includes a fourth heat treatment robot 24 , a fifth heat treatment robot 25 and a sixth heat treatment robot 26 ; the second heat treatment module 106 further includes a first heat treatment robot 21 , a second heat treatment robot 22 and a third heat treatment robot 23 .

[0054] In some embodiments, a control unit 107 is also included, and the control unit 107 is used to control the working state of the first interlayer manipulator 3 to be enabled or disabled; when the working state of the first interlayer manipulator 3 is disabled, the control unit 107 is used to control the first interlayer manipulator 3 to move to an initial position, and the initial position is set on the outside of the first interlayer frame group 101 and the second interlayer frame group 102.

[0055] In some specific embodiments, the initial position is set toward the first interlayer frame group 101. In other specific embodiments, the initial position is set toward the second interlayer frame group 102. In still other specific embodiments, the initial position is set toward between the first interlayer frame group 101 and the second interlayer frame group 102.

[0056] In some embodiments, the first interlayer frame group 101 and the second interlayer frame group 102 are integrally configured as an interlayer interface tower. In other embodiments, the first interlayer frame group 101 and the second interlayer frame group 102 are detachably connected.

[0057] like Figure 1 As shown, the second embodiment provides a wafer processing system 600, including the device described in any one of the above embodiments, and also including a wafer box module 400; the wafer box module 400 includes an in-and-out station robot 1, a third interlayer frame group 108 and a fourth interlayer frame group 109; the third interlayer frame group 108 and the fourth interlayer frame group 109 are stacked in the vertical direction; the third interlayer frame group 108 is docked with the second side of the first liquid processing module 103, and the third interlayer frame group 108 is used to accommodate wafers to be processed by the first liquid processing module 103; the second side is the first liquid processing module On the horizontal side of the module 103, the second side and the first side are opposite to each other; at least two third interlayer interfaces are provided in the third interlayer frame group 108; the fourth interlayer frame group 109 is docked with the second side of the second liquid treatment module 104, and the fourth interlayer frame group 109 is used to accommodate wafers processed by the second liquid treatment module 104; at least two fourth interlayer interfaces are provided in the fourth interlayer frame group 109; the second interlayer robot 2 is used to transfer the wafer 5 on the total interface to the third interlayer interface; the entry and exit robot 1 is used to take the wafer on the third interlayer interface.

[0058] Specifically, the second interlayer manipulator 2 has the same structure as the first interlayer manipulator 3, and the first interlayer manipulator 3 and the second interlayer manipulator 2 are symmetrically arranged with respect to the liquid processing module 200. Figure 1 As shown, the second side is set as the side opposite to the X direction.

[0059] In some embodiments, it also includes: a main interface, a film box robot 4, a first loading interface and a second loading interface; the first loading interface is used to load unprocessed wafers 5, and the second loading interface is used to load processed wafers 5; the entry and exit robot is used to transfer the wafers on the first loading interface to the main interface; the entry and exit robot is also used to transfer the wafers on the fourth interlayer interface to the second loading interface; the film box robot is used to transfer the wafers on the overhead crane to the first loading interface; the film box robot is also used to transfer the wafers on the second loading interface to the overhead crane.

[0060] Some specific embodiments further include: an inbound / outbound robot 1, a third loading interface, and a fourth loading interface. The third loading interface is used to load unprocessed wafers 5, and the fourth loading interface is used to load processed wafers 5. The inbound / outbound robot 1 is used to move wafers 5 on the overhead crane to the first loading interface and the third loading interface, and is also used to move wafers 5 on the second loading interface and the fourth loading interface to the overhead crane.

[0061] In some examples, the third loading interface and the first loading interface are symmetrically arranged with respect to the inbound and outbound robot 1. The fourth loading interface and the second loading interface are symmetrically arranged with respect to the inbound and outbound robot 1. The third loading interface and the fourth loading interface are both located on the Y-direction side of the inbound and outbound robot 1.

[0062] In some embodiments, a bonding unit ADB is also included, which is used to spray a bonding agent on the surface of the wafer 5 in a heated environment; the second interlayer robot 2 is used to transfer the wafer 5 on the total interface to the bonding unit ADB; the second interlayer robot 2 is also used to transfer the wafer 5 in the bonding unit ADB to the third interlayer frame group.

[0063] like Figure 7 As shown, the third embodiment provides a wafer processing method for controlling the device described in any one of the above embodiments, including: obtaining the working status of the first interlayer robot, the working status including the enabled state; when the working status of the first interlayer robot is the enabled state, controlling the first interlayer robot to transfer the wafer on the first interlayer interface to the second interlayer interface; or transferring the wafer on the second interlayer interface to the first interlayer interface.

[0064] like Figure 5 As shown, some specific embodiments further include: controlling the inbound and outbound robots to transfer wafers on the first loading interface to the main interface. Controlling the second inter-layer robot to transfer wafers on the main interface to the adhesion unit ADB. After the wafers complete the adhesion process, controlling the second inter-layer robot to transfer the wafers in the adhesion unit ADB to the interface SCPC1 of the integrated cooling unit to wait for the wafers to cool.

[0065] In some other specific embodiments, the method further includes: controlling the fourth liquid handling robot to transfer the wafers on interfaces SCPC1-SCPC3 to the solvent spin coating unit SOC. After the wafers complete the solvent spin coating process, controlling the fourth liquid handling robot to transfer the wafers in the solvent spin coating unit SOC to the first interlayer interface PSI2. Controlling the fourth thermal treatment robot to transfer the wafers on the first interlayer interface PSI2 to the solvent baking unit SOC Bake to complete the solvent baking process. Controlling the fourth thermal treatment robot to transfer the wafers in the solvent baking unit SOC Bake to the first interlayer interface SCPC4 of the integrated cooling unit to wait for the wafers to cool. Controlling the fourth liquid handling robot to transfer the wafers on the first interlayer interface SCPC4 to the anti-reflection unit BARC to complete the anti-reflection coating process. Controlling the fourth liquid handling robot to transfer the wafers in the anti-reflection unit BARC to the first interlayer interface PSI5. Controlling the fourth thermal treatment robot to transfer the wafers on the first interlayer interface PSI5 to the anti-reflection coating baking unit BARC Bake to complete the anti-reflection coating baking process. Control the fourth heat treatment robot to transfer the wafer in the anti-reflective coating baking unit BARC Bake to the first interlayer interface PSI8, control the first interlayer robot to transfer the wafer on the first interlayer interface PSI8 to the second interlayer interface SCPC9 of the integrated cooling unit, and wait for the wafer to cool down.

[0066] In some other specific embodiments, the method further includes: controlling the third liquid processing robot to transfer the wafer on the second interlayer interface SCPC9 of the integrated cooling unit to the glue coating unit PR, and waiting for the wafer to complete the glue coating process. Controlling the third liquid processing robot to transfer the wafer in the glue coating unit PR to the second interlayer interface PSI13. Controlling the third thermal treatment robot to transfer the wafer on the second interlayer interface PSI13 to the photoresist baking unit Soft Bake, and waiting for the wafer to complete the photoresist baking process. Controlling the third thermal treatment robot to transfer the wafer on the resist baking unit to the edge exposure unit WES, and waiting for the wafer to complete the edge exposure process. Controlling the third thermal treatment robot to transfer the wafer in the edge exposure unit WES to the second interlayer interface PSI16.

[0067] In some specific embodiments, the method further includes: controlling the third liquid handling robot to transfer the wafer on the second inter-layer interface PSI16 to the interface PSI19; and controlling the inbound and outbound robot to transfer the wafer on the interface PSI19 to the second loading interface.

[0068] In some embodiments, the working state also includes a disabled state, and the method also includes: when the working state of the first interlayer manipulator is a disabled state, the control unit is used to control the first interlayer manipulator to move to an initial position, and the initial position is set on the outside of the first interlayer frame group and the second interlayer frame group.

[0069] Specifically, the control unit is configured as a processor. The processor in this embodiment can be an image processing chip or an integrated circuit chip capable of processing image signals. During implementation, each step of the above-described method embodiment can be completed by hardware integrated logic circuits in the processor or by software instructions. The processor can be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic device. The methods, steps, and logic block diagrams disclosed in this embodiment can be implemented or executed. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this embodiment can be directly implemented and executed by a hardware decoding processor, or by a combination of hardware and software modules in the decoding processor. The software module can be located in a storage medium well-known in the art, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, or registers. The storage medium is located in a memory, and the processor reads information from the memory and, in conjunction with its hardware, completes the steps of the above-described method.

[0070] While the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations of these embodiments are possible. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the claims. Furthermore, the invention described herein is susceptible to other embodiments and may be practiced or implemented in a variety of ways.

Claims

1. A wafer processing device, characterized in that: include: A first interlayer manipulator, a first interlayer frame group, a second interlayer frame group, a first liquid processing module, and a second liquid processing module; The first liquid processing module and the second liquid processing module are used to perform different liquid processing processes on the wafer surface; the first liquid processing module and the second liquid processing module are stacked in a vertical direction; The first interlayer frame group and the second interlayer frame group are stacked in a vertical direction; The first interlayer frame group is docked with the first side of the first liquid processing module. The first interlayer frame group is used to accommodate wafers processed by the first liquid processing module and wafers after processing by the first liquid processing module. The first side is a horizontal side of the first liquid processing module. The first interlayer frame group is provided with N first interlayer interfaces arranged in sequence in a vertical direction, where N is a positive integer greater than 1. When the same wafer enters the first interlayer frame group for the Nth time, it is placed on the Nth first interlayer interface. The second interlayer frame group is docked with the first side of the second liquid processing module, and the second interlayer frame group is used to accommodate wafers to be processed by the second liquid processing module and wafers processed by the second liquid processing module; the second interlayer frame group is provided with M second interlayer interfaces arranged in sequence in a vertical direction, where M is a positive integer greater than 1; when the same wafer enters the second interlayer frame group for the Mth time, it is placed on the Mth second interlayer interface; When the working state of the first interlayer robot is enabled, it is used to transfer the wafer on the first interlayer interface to the second interlayer interface, or to transfer the wafer on the second interlayer interface to the first interlayer interface.

2. The device according to claim 1, characterized in that The first interlayer robot includes at least one actuator; the actuator is oriented toward the first interlayer frame group or the second interlayer frame group; the actuator is used to take the wafer from the first interlayer interface or transfer the wafer to the second interlayer interface.

3. The device according to claim 1, characterized in that At least one of a glue coating unit, an anti-reflection unit, and a solvent spin coating unit is provided in the first liquid processing module or the second liquid processing module; The coating unit is used to coat a photoresist layer on the surface of the wafer; The anti-reflection unit is used to apply an anti-reflection coating on the surface of the wafer; The solvent spin coating unit is used to coat a polymer solvent layer on the wafer surface.

4. The device according to claim 3, characterized in that The first liquid processing module is provided with a first liquid processing robot, the anti-reflection unit and the solvent spin coating unit; the second liquid processing module is provided with a second liquid processing robot and the glue coating unit; The first interlayer robot is used to transfer the wafer on the first interlayer interface to the second interlayer interface.

5. The device according to claim 1, characterized in that Also includes: a first heat treatment module and / or a second heat treatment module; The first heat treatment module is arranged on a side of the first interlayer frame group away from the first liquid treatment module; the second heat treatment module is arranged on a side of the second interlayer frame group away from the second liquid treatment module; The first heat treatment module and the second heat treatment module are used to heat the wafer according to different heating parameters; the heating parameters include heating temperature and heating time.

6. The device according to claim 5, characterized in that A cooling unit is further provided in the first interlayer frame group and / or the second interlayer frame group; The cooling unit is provided on the upper surface of at least one first interlayer interface and / or the upper surface of at least one second interlayer interface; The cooling unit is used to absorb heat from the wafer when in contact with the wafer.

7. The device according to claim 5, characterized in that At least one of a photoresist baking unit, an anti-reflective coating baking unit and a solvent baking unit is provided in the first heat treatment module or the second heat treatment module; The photoresist baking unit is used to bake the photoresist layer on the surface of the wafer to solidify the photoresist layer; The anti-reflective coating baking unit is used to bake the anti-reflective coating on the surface of the wafer to solidify the anti-reflective coating; The solvent baking unit is used to bake the polymer solvent layer on the surface of the wafer to solidify the polymer solvent layer.

8. The device according to claim 5, characterized in that The first heat treatment module or the second heat treatment module is further provided with an edge exposure unit; The edge exposure unit is used to perform exposure processing on the front edge of the wafer so as to facilitate the separation of the edge of the polymer solvent layer on the surface of the wafer.

9. The device according to claim 1 or 2, characterized in that Also included is a control unit, the control unit being configured to control the working state of the first inter-layer manipulator to be an enabled state or a disabled state; When the working state of the first interlayer manipulator is a disabled state, the control unit is used to control the first interlayer manipulator to move to an initial position, and the initial position is set outside the first interlayer frame group and the second interlayer frame group.

10. The device according to claim 1, characterized in that The first interlayer frame group and the second interlayer frame group are integrally configured as an interlayer interface tower, or the first interlayer frame group and the second interlayer frame group are detachably connected.

11. A wafer processing system, comprising the wafer processing device according to any one of claims 1 to 10, characterized in that: Also included is a cassette module; The film box module includes an in-and-out station robot, a second inter-layer robot, a third inter-layer frame group and a fourth inter-layer frame group; The third interlayer frame group and the fourth interlayer frame group are stacked in a vertical direction; The third interlayer frame group is docked with the second side of the first liquid processing module, and the third interlayer frame group is used to accommodate wafers to be processed by the first liquid processing module; the second side is a horizontal side of the first liquid processing module, and the second side and the first side are opposite to each other; at least two third interlayer interfaces are provided in the third interlayer frame group; The fourth interlayer frame group is docked with the second side of the second liquid processing module, and the fourth interlayer frame group is used to accommodate wafers processed by the second liquid processing module; at least two fourth interlayer interfaces are provided in the fourth interlayer frame group; The second interlayer robot is used to transfer the wafer to the third interlayer interface; the entry and exit robot is used to take the wafer on the third interlayer interface.

12. The system according to claim 11, wherein: Also includes: Main interface, cassette manipulator, first loading interface and second loading interface; The first loading interface is used to load unprocessed wafers, and the second loading interface is used to load processed wafers; The in-and-out robot is used to transfer the wafers on the first loading interface to the main interface; The in-and-out robot is further used to transfer the wafer on the fourth inter-layer interface to the second loading interface; The cassette robot is used to transfer the wafers on the overhead crane to the first loading interface; the cassette robot is also used to transfer the wafers on the second loading interface to the overhead crane.

13. The system according to claim 12, wherein: It also includes an adhesion promoting unit, which is used to spray an adhesion promoting agent on the surface of the wafer under a heated environment; The second interlayer robot is used to transfer the wafers on the main interface to the adhesion unit; the second interlayer robot is also used to transfer the wafers in the adhesion unit to the third interlayer frame group.

14. A wafer processing method for controlling the apparatus according to any one of claims 1 to 10, characterized in that: include: Acquire a working state of the first inter-layer manipulator, where the working state includes an enabled state; When the working state of the first interlayer robot is enabled, the first interlayer robot is controlled to transfer the wafer on the first interlayer interface to the second interlayer interface; or to transfer the wafer on the second interlayer interface to the first interlayer interface.

15. The method according to claim 14, characterized in that The working state also includes a disabled state, and the method further includes: When the working state of the first interlayer manipulator is a disabled state, the control unit is used to control the first interlayer manipulator to move to an initial position, and the initial position is set outside the first interlayer frame group and the second interlayer frame group.

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