Display panel, preparation method thereof and display device

Abstract

A display panel includes: a driving substrate; the anode layer is arranged on the driving substrate and comprises a plurality of anodes; the isolation structure layer is arranged on the driving substrate, the isolation structure layer is provided with a plurality of first openings, and one first opening is overlapped with one anode; a plurality of laminated structures, wherein one laminated structure is at least partially located in one first opening; the laminated structure comprises a first light-emitting layer, a charge generation layer, a second light-emitting layer and a cathode layer which are laminated in the direction away from the driving substrate; the insulation structure is arranged between the edge of the laminated structure and the conductive structure adjacent to the laminated structure, and the conductive structure comprises the isolation structure layer and / or the laminated structure adjacent to the laminated structure.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) display technology is a technology that uses luminescent materials to emit light under the drive of electric current to achieve display. OLED displays have the advantages of ultra-light, ultra-thin, high brightness, wide viewing angle, low voltage, low power consumption, fast response, high definition, shock resistance, bendability, low cost, simple process, less raw materials, high luminous efficiency and wide temperature range.

[0003] Tandem Organic Light Emitting Diode (TandemOLED) is an OLED device structure formed by stacking multiple traditional OLED devices in series through a charge generation layer (CGL). Display panels manufactured using Tandem OLED technology have the characteristics of high brightness, low power consumption and long life. Summary of the invention

[0004] On the one hand, a display panel is provided. The display panel includes: a driving substrate; an anode layer arranged on the driving substrate, the anode layer including a plurality of anodes; an isolation structure layer arranged on the driving substrate, the isolation structure layer having a plurality of first openings, one first opening overlapping one anode; a plurality of stacked structures, one stacked structure at least partially located in one of the first openings; the stacked structure including a first light-emitting layer, a charge generation layer, a second light-emitting layer and a cathode layer stacked in a direction away from the driving substrate; an insulating structure arranged between an edge of the stacked structure and a conductive structure adjacent to the stacked structure, the conductive structure including the isolation structure layer and / or the stacked structure adjacent to the stacked structure.

[0005] In some embodiments, the insulating structure includes: a first groove, the first groove is located within the range of the first opening, and the first groove separates a portion of the edge of the stacked structure from a conductive structure adjacent to the portion of the edge of the stacked structure.

[0006] In some embodiments, the first groove is located within a boundary range of the stacked structure, and a distance exists between a boundary of the first groove close to the isolation structure layer and a boundary of the stacked structure.

[0007] In some embodiments, a portion of the edge of the stacked structure is recessed toward the center of the first opening to form a notch, and the notch and the isolation structure layer form the first groove.

[0008] In some embodiments, the display panel further includes: a pixel defining layer located on the side of the isolation structure layer close to the driving substrate; the pixel defining layer defines a plurality of second openings, one of the second openings is located within the range of one of the first openings, and one of the second openings overlaps with one of the anodes; the first groove is located between the boundary of the second opening and the boundary of the first opening.

[0009] In some embodiments, the insulating structure includes: a first groove, the first groove is located between two adjacent stacked structures, and the first groove cuts off the isolation structure layer between the two adjacent stacked structures.

[0010] In some embodiments, the isolation structure layer includes a plurality of first isolation parts and a plurality of second isolation parts, and the plurality of first isolation parts and the plurality of second isolation parts are cross-arranged to define a plurality of first openings; a portion of at least one of the first isolation parts and the second isolation parts used to enclose the first opening is interrupted by the first groove.

[0011] In some embodiments, in the two adjacent stacked structures on both sides of the first groove, a portion of the edge of at least one of the stacked structures is recessed toward the center of the first opening to form a portion of the boundary of the first groove.

[0012] In some embodiments, at least two first grooves are arranged around one of the stacked structures, and at least two first grooves are arranged at intervals around the stacked structure.

[0013] In some embodiments, the cathode layer includes: a first sub-portion and a second sub-portion; the first sub-portion overlaps with the anode in a direction perpendicular to the drive substrate; the second sub-portion passes through a gap between two adjacent first grooves, one end of the second sub-portion is electrically connected to the first sub-portion, and the other end of the second sub-portion is electrically connected to the isolation structure layer.

[0014] In some embodiments, the cathode layer further includes: a third sub-portion, the third sub-portion is located between the first groove and the boundary of the first opening, and the third sub-portion is electrically connected to the second sub-portion and the isolation structure layer.

[0015] In some embodiments, the first groove at least penetrates the cathode layer, the second light-emitting layer, and the charge generation layer.

[0016] In some embodiments, within the first groove, edges of at least the cathode layer, the second light emitting layer, and the charge generation layer in the stacked structure are aligned or substantially aligned in a direction perpendicular to the drive substrate.

[0017] In some embodiments, the insulating structure includes: an insulating portion, the insulating portion covers a portion of a sidewall of the first opening and is located between a portion of an edge of the stacked structure and the isolation structure layer.

[0018] In some embodiments, the isolation structure layer includes: a first sub-isolation layer, a second sub-isolation layer, and a third sub-isolation layer stacked in sequence in a direction away from the drive substrate, and the side of the second sub-isolation layer is retracted relative to the side of the first sub-isolation layer and the side of the third sub-isolation layer; the insulating portion covers the side of the third sub-isolation layer, the portion of the third sub-isolation layer that exceeds the second sub-isolation layer and is close to the surface of the drive substrate, and the side of the second sub-isolation layer.

[0019] In some embodiments, the display panel further includes: a first insulating layer disposed on a side of the isolation structure layer away from the drive substrate, and the insulating portion is made of the same material as the first insulating layer and is connected to the first insulating layer.

[0020] In some embodiments, the multiple stacked structures include at least a first stacked structure and a second stacked structure, and the luminous color of the first stacked structure is different from the luminous color of the second stacked structure; the display panel also includes: a first encapsulation sublayer located on the side of the first stacked structure away from the driving substrate, and a second encapsulation sublayer located on the side of the second stacked structure away from the driving substrate; the insulating part located between the second stacked structure and the isolation structure layer includes a first sublayer, and the first sublayer is made of the same material as the first encapsulation sublayer.

[0021] In some embodiments, the multiple stacked structures also include a third stacked structure, and the luminous colors of the first stacked structure, the second stacked structure and the third stacked structure are different: the insulating part located between the third stacked structure and the isolation structure layer includes a second sublayer, and the second sublayer is made of the same material as the first encapsulation sublayer.

[0022] In some embodiments, the insulating structure also includes: a second groove; the second groove is located within the range of the first opening, and the second groove separates a partial edge of the first stacked structure and an isolation structure layer adjacent to the partial edge of the first stacked structure; or, the second groove is located between the first stacked structure and a stacked structure adjacent to the first stacked structure, and the second groove cuts off the isolation structure layer adjacent to the first stacked structure.

[0023] In some embodiments, at least one of the second grooves and at least one of the insulating parts are arranged around one of the first stacking structures, and at least one of the second grooves and at least one of the insulating parts are arranged at intervals around the first stacking structure; at least two of the insulating parts are arranged around one of the second stacking structures and / or one of the third stacking structures, and at least two of the insulating parts are arranged at intervals around the second stacking structure or the third stacking structure.

[0024] On the other hand, a method for preparing a display panel is provided. The method comprises: forming an anode layer on a driving substrate, the anode layer comprising a plurality of anodes; forming an isolation structure layer on the driving substrate, the isolation structure layer having a plurality of first openings, one first opening overlapping one anode; forming a plurality of stacked structures, one stacked structure at least partially located within one of the first openings; the stacked structure comprising a first light-emitting layer, a charge generation layer, a second light-emitting layer and a cathode layer stacked in a direction away from the driving substrate; forming an insulating structure, the insulating structure being disposed between an edge of the stacked structure and a conductive structure adjacent to the stacked structure, the conductive structure comprising the isolation structure layer and / or the stacked structure adjacent to the stacked structure.

[0025] In some embodiments, the forming of the insulating structure includes: etching the stacked structure to form a first groove, and the first groove serves as the insulating structure; wherein the first groove is located within the range of the first opening, and the first groove separates a partial edge of the stacked structure and an isolation structure layer adjacent to the partial edge of the stacked structure; or, etching the isolation structure layer to form a first groove, and the first groove serves as the insulating structure; wherein the first groove is located between two adjacent stacked structures, and the first groove cuts off the isolation structure layer between the two adjacent stacked structures.

[0026] In some embodiments, forming the insulating structure includes: forming an insulating portion, the insulating portion serving as the insulating structure; wherein the insulating portion covers a portion of a side wall of the first opening and is located between a portion of an edge of the stacked structure and the isolation structure layer.

[0027] In some embodiments, the forming of multiple stacked structures and the forming of the insulating part include: sequentially forming a first stacked structure film and a first encapsulation film; the first stacked structure film covers the multiple first openings and the isolation structure layer, and the first encapsulation film covers the first stacked structure; removing the first stacked structure film and the first encapsulation film in the second target opening among the multiple first openings to form a first stacked structure, a first encapsulation sublayer and a first sublayer; wherein the first stacked structure film in the first target opening among the multiple first openings forms the first stacked structure, the first encapsulation film in the first target opening forms the first encapsulation sublayer, and the first encapsulation film covering the side wall of the second target opening forms the first sublayer; the first sublayer serves as the insulating part; forming a second stacked structure in the second target opening; the luminous color of the second stacked structure is different from the luminous color of the first stacked structure.

[0028] In another aspect, a display device is provided, comprising: a display panel as described in any of the above embodiments, and a circuit board electrically connected to the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the products involved in the embodiments of the present disclosure, the actual process of the method, etc.

[0030] Figure 1 is a structural diagram of a display device according to some embodiments;

[0031] Figure 2 is a structural diagram of a display panel according to some embodiments;

[0032] Figure 3 is a structural diagram of another display panel according to some embodiments;

[0033] Figure 4 is a structural diagram of a display panel during preparation according to some embodiments;

[0034] Figure 5 is a structural diagram of another display panel during preparation according to some embodiments;

[0035] Figure 6 is a partial structural diagram of a display panel according to some embodiments;

[0036] Figure 7 is a partial structural diagram of another display panel according to some embodiments;

[0037] Figure 8 is a structural diagram of another display panel according to some embodiments;

[0038] Fig. 9 is a partial top view of a display panel according to some embodiments;

[0039] Fig.10 is a structural diagram of another display panel according to some embodiments;

[0040] Fig.11 is a partial top view of another display panel according to some embodiments;

[0041] Fig.12 is a structural diagram of another display panel according to some embodiments;

[0042] Fig.13 is a partial top view of yet another display panel according to some embodiments;

[0043] Fig.14 is a structural diagram of another display panel according to some embodiments;

[0044] Fig.15 is a partial top view of yet another display panel according to some embodiments;

[0045] Fig.16 is a structural diagram of another display panel according to some embodiments;

[0046] Fig.17 is a partial top view of yet another display panel according to some embodiments;

[0047] Fig.18 is a flow chart of a method for preparing a display panel according to some embodiments;

[0048] Figure 19 to Figure 25 Detailed description of the drawings is provided for the cross-sectional structure diagram corresponding to each step in a method for manufacturing a display panel according to some embodiments. DETAILED DESCRIPTION

[0049] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0050] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0051] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0052] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0053] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0054] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0055] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0056] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0057] Some embodiments of the present disclosure provide a display device, which can be any display device that displays images, whether in motion (e.g., video) or fixed (e.g., still images), and whether text or text. More specifically, it is expected that the display device of the embodiments can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controls and / or displays, displays of camera views (e.g., displays of rear-view cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0058] Figure 1 FIG. 1 is a structural diagram of a display device according to some embodiments. Figure 1 As shown, the display device 1000 includes a frame 100, a cover plate 200, a display panel 300, a circuit board 400 and other electronic components including a camera.

[0059] The longitudinal section of the frame 100 is U-shaped, the display panel 300, the circuit board 400 and other electronic accessories including the camera are arranged in the frame 100, the circuit board 400 is located between the display panel 300 and the frame 100, and the cover plate 200 is located on the light-emitting side of the display panel 300. The side of the display panel 300 used for displaying an image is the light-emitting side of the display panel 300, and the side facing away from the light-emitting side of the display panel 300 is the non-light-emitting side of the display panel 300.

[0060] Exemplarily, the circuit board 400 is located on the non-light-emitting side of the display panel 300 , and the circuit board 400 is electrically connected to the display panel 300 . The circuit board 400 is used to provide a driving signal for the display panel 300 , thereby ensuring normal display of the display panel 300 .

[0061] For example, the display panel 300 may be an organic light emitting diode (OLED).

[0062] Diode, OLED for short) display panel, Quantum Dot Light Emitting

[0063] The present disclosure does not specifically limit this. The following takes the display panel 300 as an OLED display panel as an example to schematically illustrate some embodiments of the present disclosure.

[0064] In some examples, such as Figure 2 and Figure 3 As shown, the display panel 300 includes a driving substrate 1 and a plurality of light emitting devices 2 .

[0065] For example, Figure 2 As shown, the driving substrate 1 includes a substrate 11 and a circuit structure layer 12 which are stacked in sequence.

[0066] Exemplarily, the above-mentioned substrate 11 includes multiple types, which can be selected and set according to actual needs.

[0067] Exemplarily, the substrate 11 may be a rigid substrate, which may be a glass substrate or a polymethyl methacrylate (PMMA) substrate.

[0068] Exemplarily, the substrate 11 may be a flexible substrate. The flexible substrate may be a polyethylene terephthalate (PET) substrate, a polyethylene naphthalate dicarboxylic acid glycol ester (PEN) substrate, or a polyimide (PI) substrate. At this time, the display panel 300 may realize a flexible display, for example.

[0069] Optionally, the substrate 11 may be formed into a single layer, a double layer, or a multi-layer, which is not limited in the embodiments of the present disclosure.

[0070] Exemplarily, the circuit structure layer 12 is disposed on the substrate 11. It is understood that the circuit structure layer 12 refers to a film layer where multiple pixel driving circuit arrays are located, including multiple patterned conductive layers and insulating layers. Exemplarily, the circuit structure layer 12 includes multiple pixel driving circuits 120 and multiple signal lines.

[0071] The pixel driving circuit 120 is generally composed of electronic devices such as thin film transistors (TFT), capacitors, etc. For example, the pixel driving circuit 120 can specifically be a "2T1C", "6T1C", "7T1C", "6T2C" or "7T2C" structure. Here, "T" represents a transistor, such as a thin film transistor. The number before "T" represents the number of transistors. "C" represents a capacitor, and the number before "C" represents the number of capacitors. In the drawings of some embodiments of the present disclosure, only one thin film transistor 121 is used as an example for illustration. For example, the thin film transistor 121 can be a driving transistor.

[0072] It is understandable that the thin film transistor included in the pixel driving circuit 120 may be a top-gate thin film transistor or a bottom-gate thin film transistor, and the present disclosure does not limit this. Figure 2 The thin film transistor 121 shown in FIG. 1 is a top-gate thin film transistor.

[0073] In addition, the plurality of thin film transistors 121 may include low temperature poly-silicon thin film transistors (Low Temperature Poly-silicon TFT, LTPS TFT for short) and / or metal oxide thin film transistors (Oxide TFT).

[0074] like Figure 2 As shown, the light emitting device 2 is located on the driving substrate 1 .

[0075] The light emitting device 2 is electrically connected to the pixel driving circuit 120 in the driving substrate 1. The pixel driving circuit 120 can provide a driving signal for the light emitting device 2 to drive the light emitting device 2 to emit light.

[0076] Exemplarily, there are various electrical connection relationships between the light emitting device 2 and the pixel driving circuit 120 , which can be selected and set according to actual needs, and the present disclosure does not limit this.

[0077] For example, a plurality of pixel driving circuits 120 and a plurality of light emitting devices 2 may be coupled in a one-to-one correspondence. For another example, one pixel driving circuit 120 may be coupled to a plurality of light emitting devices 2. For another example, a plurality of pixel driving circuits 120 may be coupled to one light emitting device 2.

[0078] Below, the present disclosure takes the coupling of a pixel driving circuit 120 and a light emitting device 2 as an example to schematically illustrate the structure of the display panel 300 .

[0079] Exemplarily, in the display panel 300, the pixel driving circuit 120 can generate a driving signal, and each light-emitting device 2 can emit light under the driving action of the driving signal generated by the corresponding pixel driving circuit 120, and the light emitted by multiple light-emitting devices 2 cooperate with each other, so that the display panel 300 can realize image display.

[0080] Exemplarily, the light-emitting device 2 may be a Tandem OLED light-emitting device.

[0081] For example, Figure 2 and Figure 3 As shown, the light emitting device 2 includes: an anode 21, a cathode layer 22, a plurality of light emitting layers 23 stacked between the anode 21 and the cathode layer 22, and a charge generation layer 24 is disposed between any adjacent light emitting layers 23. The plurality of light emitting layers 23, the charge generation layer 24 and the cathode layer 22 can be referred to as a stacked structure 20.

[0082] The anode 21 is closer to the driving substrate 1 than the cathode layer 22. Therefore, the anode 21 can be electrically connected to the drain of the thin film transistor 121 used as a driving transistor in the pixel driving circuit 120.

[0083] Exemplarily, the number of the light-emitting layers 23 may be two, three, or any other number, which is not limited herein.

[0084] For example, Figure 2 and Figure 3 As shown, Figure 2 and Figure 3 Two light-emitting layers 23 are shown schematically. Figure 3As shown, the light emitting layer 23 includes a first light emitting layer 231 and a second light emitting layer 232. The first light emitting layer 231 and the second light emitting layer 232 are respectively away from the driving substrate 1.

[0085] In addition, multiple light-emitting layers 23 in the same light-emitting device 2 emit light of the same or similar color. In this way, the concentration of the spectrum superposition of multiple light-emitting layers 23 in the same light-emitting device 2 can be improved, and the color purity and luminous efficiency of the light emitted by the light-emitting device 2 can be improved.

[0086] For example, Figure 3 As shown, the charge generation layer 24 includes an N-type charge generation layer (N-CGL) 241 and a P-type charge generation layer (P-CGL) 242 which are stacked.

[0087] The N-type charge generation layer 241 is closer to the first light-emitting layer 231 than the P-type charge generation layer 242, so that it can provide electrons to the first light-emitting layer 231. The P-type charge generation layer 242 is closer to the second light-emitting layer 232 than the N-type charge generation layer 241, so that it can provide holes to the second light-emitting layer 232.

[0088] Exemplarily, the materials of the N-type charge generation layer 241 and the P-type charge generation layer 242 may include metal, non-doped organic matter, organic PN junction formed by P-type and N-type doping, or metal oxide, etc., which is not limited here.

[0089] Exemplarily, the first light-emitting layer 231 and the second light-emitting layer 232 are connected in series through the charge generation layer 24 to form a series structure (Tandem structure), and the charge generation layer 24 is arranged between any adjacent light-emitting layers 23 (for example, the first light-emitting layer 231 and the second light-emitting layer 232 mentioned above) to improve the carrier injection ability, thereby effectively improving the luminous efficiency of the light-emitting device 2 and extending the service life of the light-emitting device 2; moreover, the luminous efficiency of the light-emitting device 2 can increase exponentially with the increase in the number of light-emitting layers 23. At the same brightness, the life of the light-emitting device 2 increases exponentially.

[0090] It should be noted that, in addition to the anode 21, the cathode layer 22, and the multiple light-emitting layers 23 stacked between the anode 21 and the cathode layer 22, the light-emitting device 2 may also include an electron transport layer (election transporting layer, referred to as ETL), an electron injection layer (election injection layer, referred to as EIL), a hole blocking layer (hole blocking layer, referred to as HBL), a hole transport layer (hole transporting layer, referred to as HTL), an electron blocking layer (electron blocking layer, referred to as EBL) and a hole injection layer (hole injection layer, referred to as HIL) One or more layers.

[0091] For example, Figure 3 As shown, the light emitting device 2 may further include: a first hole transport layer (HTL) 25 located between the first light emitting layer 231 and the anode 21. The first hole transport layer 25 may be used to improve the transportability of holes.

[0092] Optionally, the light emitting device 2 may further include: a first hole injection layer (HIL) located between the first hole transport layer 25 and the anode 21. The first hole injection layer can reduce the injection barrier of holes.

[0093] For example, Figure 3 As shown, the light emitting device 2 may further include: a first hole blocking layer (HBL) 26 located between the first light emitting layer 231 and the charge generating layer 24. The first hole blocking layer 26 can hinder the transport of electrons.

[0094] For example, Figure 3 As shown, the light emitting device 2 may further include: a second hole blocking layer (HBL) 27 between the second light emitting layer 232 and the cathode layer 22. The second hole blocking layer 27 can hinder the transport of electrons.

[0095] Optionally, the light emitting device 2 may further include: the light emitting device 2 may further include: an electron transport layer (Electron Transport Layer, EIL for short) between the second hole blocking layer 27 and the cathode layer 22. The electron transport layer can improve the transportability of electrons.

[0096] In some examples, such as Figure 2As shown, the display panel 300 further includes: a pixel defining layer 3 disposed on the driving substrate 1 , the pixel defining layer 3 defines a plurality of second openings 31 , and one second opening 31 overlaps with one anode 21 .

[0097] Exemplarily, one second opening 31 exposes the entire anode 21. Also exemplary, one second opening 31 exposes a portion of an anode 21, and another portion of the anode 21 is covered by the pixel defining layer 3. The embodiments of the present disclosure are not limited to this.

[0098] Exemplarily, the plurality of second openings 31 may have various shapes, such as circular, quadrilateral, pentagonal, hexagonal, etc., which is not limited in the embodiments of the present disclosure.

[0099] When the driving substrate 1 includes a substrate 11 and a circuit structure layer 12 which are stacked in sequence, the pixel defining layer is arranged on a side of the circuit structure layer 12 away from the substrate 11 .

[0100] In some examples, such as Figure 2 As shown, the display panel 300 further includes a planar layer 01 located between the driving substrate 1 and the light emitting device 2. The planar layer 01 is used to provide a planar surface for the plurality of light emitting devices 2.

[0101] In one implementation, Figure 4 As shown, a groove 101 is designed on the flat layer 01, and the groove 101 is staggered with the second opening 31 of the pixel defining layer 3, and the surface of the pixel defining layer 3 adjacent to the groove 101, which is away from the flat layer 01, and the surface of the flat layer 01 at the groove 101, which is close to the pixel defining layer 3, have a large step difference. In the process of forming the laminated structure 20 (including the light-emitting layer 23, the charge generation layer 24 and the cathode layer 22 of the light-emitting device 2), the whole laminated structure film is first formed. Due to the large step difference, the laminated structure located on the surface of the pixel defining layer 3 adjacent to the groove 101, which is away from the driving substrate 1, is separated from the laminated structure located in the groove 101. Among them, the laminated structure 20 located on the surface of the pixel defining layer 3 away from the driving substrate 1 is in contact with the anode 21 to form the light-emitting device 2, and the laminated structure located at the groove 101 can be removed.

[0102] However, in the above implementation, combined with Figure 5 and Figure 6As shown, the cathode layer 22 easily wraps the light-emitting layer 23 and the charge generation layer 24 is close to the edge of the groove 101 at the groove 101, resulting in the cathode layer 22 contacting the charge generation layer 24, so that during the operation of the light-emitting device 2, the cathode layer 22 leaks electricity to the charge generation layer 24, resulting in a decrease in the light-emitting efficiency of the light-emitting device 2. Specifically, the cathode layer 22 leaks electricity to the charge generation layer 24, resulting in a decrease in the voltage difference between the anode 21 and the cathode layer 22 of the light-emitting device 2, thereby resulting in insufficient light emission of the light-emitting device 2.

[0103] In other implementations, such as Figure 7 As shown, the display panel 300 further includes: an isolation structure layer 4 disposed on the drive substrate 1. The isolation structure layer 4 has a plurality of first openings 41, and one first opening 41 overlaps with one anode 21. The top view structure of the isolation structure layer 4 is similar to a grid, and the plurality of first openings 41 constitute meshes of the grid structure.

[0104] Exemplarily, the isolation structure layer 4 can be a laminated structure of a metal material. The metal material can be a pure metal material or a metal compound. The metal material includes titanium (Ti), aluminum (Al), molybdenum (Mo) or other ferrous metals. For example, the isolation structure layer 4 can be a laminated structure of Ti / Al / Ti. For another example, the isolation structure layer 4 can be a laminated structure of Mo / Al / Mo. The isolation structure layer 4 can be two layers, three layers or more layers. The embodiments of the present disclosure are not limited to this. It is only necessary to ensure that the isolation structure layer 4 has an undercut structure.

[0105] Exemplarily, the cross-sectional view of the isolation structure layer 4 is in the shape of an I-shaped structure, a T-shaped structure, or an inverted trapezoidal structure. Figure 7 As shown, the cross-sectional view of the isolation structure layer 4 is in the shape of an “I” structure.

[0106] Exemplarily, an orthographic projection of an anode 21 on the driving substrate 1 is located within an orthographic projection of a first opening 41 on the driving substrate 1 .

[0107] Wherein, when the display panel 300 further includes an isolation structure layer 4, the cathode layers 22 of two adjacent light-emitting devices 2 are spaced apart and not directly connected. However, the two adjacent cathode layers 22 are electrically connected through the isolation structure layer 4, so as to ensure that the light-emitting layers 23 in each light-emitting device 2 can receive substantially the same electrical signal transmitted by the cathode layer 22, which is beneficial to improve the accuracy of the electrical signals received by the multiple light-emitting layers 23, and further beneficial to improve the display uniformity of the display panel 300.

[0108] For example, Figure 7As shown, in the first opening 41, the stacked structure 20 (including the light-emitting layer 23, the charge generation layer 24 and the cathode layer 22 of the light-emitting device 2) is close to the edge of the isolation structure layer 4 and contacts the isolation structure layer 4. That is, the edge of the charge generation layer 24 in the stacked structure 20 contacts the isolation structure layer 4. It should be noted that Figure 7 Only the charge generation layer 24 and the cathode layer 22 in the stacked structure 20 are schematically shown, while other film layers in the stacked structure 20 are not marked in detail.

[0109] It can be seen from the above that the cathode layer 22 is electrically connected to the isolation structure layer 4. During the operation of the light-emitting device 2, the charge generation layer 24 and the cathode layer 22 are indirectly connected through the isolation structure layer 4. The cathode layer 22 will leak electricity to the charge generation layer 24 through the isolation structure layer 4, causing the voltage difference between the anode 21 and the cathode layer 22 of the light-emitting device 2 to become smaller, thereby causing the luminous efficiency of the light-emitting device 2 to decrease, resulting in insufficient luminescence of the light-emitting device 2, and further affecting the display effect of the display panel 300.

[0110] Based on this, in an embodiment of the present disclosure, a display panel 300 is provided.

[0111] like Figure 8 As shown, the display panel 300 includes: a driving substrate 1 , an anode layer 02 , an isolation structure layer 4 , a plurality of stacked structures 20 and an insulation structure 5 .

[0112] The anode layer 02 is disposed on the driving substrate 1, and the anode layer 02 includes a plurality of anodes 21. The isolation structure layer 4 is disposed on the driving substrate 1. The isolation structure layer 4 has a plurality of first openings 41, and a first opening 41 overlaps with an anode 21. A stacked structure 20 is at least partially located in a first opening 41.

[0113] Exemplarily, the stacked structure 20 includes a first light emitting layer 231, a charge generation layer 24, a second light emitting layer 232 and a cathode layer 22 stacked in a direction away from the drive substrate 1. It should be noted that: Figure 8 Only the charge generation layer 24 and the cathode layer 22 in the stacked structure 20 are schematically shown, while other film layers in the stacked structure 20 are not marked in detail.

[0114] like Figure 8 and Fig. 9 As shown, the insulating structure 5 is disposed between the edge of the stacked structure 20 and the conductive structure 6 adjacent to the stacked structure 20. The conductive structure 6 includes the isolation structure layer 4 and / or the stacked structure 20 adjacent to the stacked structure 20.

[0115] The insulating structure 5 is disposed between the edge of the stacked structure 20 and the conductive structure 6 adjacent to the stacked structure 20 , so that a portion of the edge of the stacked structure 20 and the conductive structure 6 adjacent to the stacked structure 20 are spaced apart from each other and are not connected or in contact.

[0116] For example, Fig. 9 As shown, part of the edge of the stacked structure 20 is insulated from the isolation structure layer 4 by the insulation structure 5; at the same time, part of the edge of the stacked structure 20 is electrically connected to the isolation structure layer 4, thereby achieving electrical connection between two adjacent cathode layers 22.

[0117] For example, Figure 8 and Fig. 9 As shown, there may be multiple insulating structures 5 .

[0118] In addition, the number of the insulating structures 5 corresponding to one first opening 41 may be one or more, which is not limited in the embodiments of the present disclosure.

[0119] Exemplarily, the conductive structure 6 includes an isolation structure layer 4, such as Figure 8 and Fig. 9 As shown, the insulating structure 5 is disposed between the edge of the stacked structure 20 and the isolation structure layer 4. Also exemplarily, the conductive structure 6 includes a stacked structure 20 adjacent to the stacked structure 20, and the insulating structure 5 is disposed between the two stacked structures 20. Also exemplarily, the conductive structure 6 includes the isolation structure layer 4 and the stacked structure 20 adjacent to the stacked structure 20.

[0120] In this embodiment, an insulating structure 5 is provided between a partial edge of the stacked structure 20 and a conductive structure 6 adjacent to the stacked structure 20 (including an isolation structure layer 4 and / or a stacked structure 20 adjacent to the stacked structure 20), so as to achieve insulation between a partial edge of the charge generation layer 24 in the stacked structure 20 and the conductive structure 6 adjacent to the stacked structure 20. During operation of the light-emitting device 2, the electrical signal on the cathode layer 22 is transmitted to the conductive structure 6 adjacent to the cathode layer 22 and then cut off at the edge of the conductive structure 6 adjacent to the cathode layer 22, thereby reducing the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 through the conductive structure 6 adjacent to the cathode layer 22, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0121] In addition, in some examples, the charge generation layers 24 in the multiple stacked structures 20 are interconnected to form a whole layer of charge generation layer 24. On the basis of reducing the probability of leakage from the cathode layer 22 to the charge generation layer 24, the probability of crosstalk between the multiple light-emitting devices 2 can also be reduced.

[0122] In some embodiments, in combination Figure 8 and Fig. 9 As shown, the insulating structure 5 includes a first groove 51 , which is located within the range of the first opening 41 , and separates a portion of the edge of the stacked structure 20 from the conductive structure 6 adjacent to the portion of the edge of the stacked structure 20 .

[0123] For example, the number of the first grooves 51 corresponding to one first opening 41 may be one or more, which is not limited in the embodiments of the present disclosure.

[0124] In some examples, the orthographic projection of the first groove 51 on the driving substrate 1 is located within the range of the orthographic projection of the first opening 41 on the driving substrate 1 .

[0125] It should be noted that the above “the first groove 51 separates a portion of the edge of the stacked structure 20 from the conductive structure 6 adjacent to the portion of the edge of the stacked structure 20 ” means that the first groove 51 insulates a portion of the edge of the stacked structure 20 from the conductive structure 6 adjacent to the portion of the edge of the stacked structure 20 .

[0126] In this embodiment, by setting the first groove 51, part of the edge of the stacked structure 20 and the conductive structure 6 adjacent to it are spaced apart, so as to achieve an insulation setting between the edge of the charge generation layer 24 in the stacked structure 20 adjacent to the first groove 51 and the conductive structure 6 adjacent to it. During the operation of the light-emitting device 2, the electrical signal on the cathode layer 22 is cut off at the edge of the conductive structure 6 adjacent to it after being transmitted to the conductive structure 6 adjacent to it, thereby reducing the probability that the voltage on the cathode layer 22 in the stacked structure 20 will leak to the charge generation layer 24 through the conductive structure 6 adjacent to the stacked structure 20, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0127] It should be noted that there are many ways to set the first groove 51, and the setting can be selected according to actual needs.

[0128] In one implementation, Figure 8 and Fig. 9 As shown, the first groove 51 is located within the boundary range of the stacked structure 20 , and there is a distance between the boundary of the first groove 51 close to the isolation structure layer 4 and the boundary of the stacked structure 20 .

[0129] Exemplarily, when the first groove 51 is located within the boundary of the stacked structure 20, the conductive structure 6 includes the isolation structure layer 4. The first groove 51 separates a portion of the edge of the stacked structure 20 from the isolation structure layer 4, thereby achieving an insulation setting between the portion of the edge of the stacked structure 20 and the isolation structure layer 4.

[0130] Exemplarily, the orthographic projection of the first groove 51 on the drive substrate 1 is located within the orthographic projection of the first opening 41 on the drive substrate 1 , and there is a gap between the boundary of the orthographic projection of the first groove 51 on the drive substrate 1 and the boundary of the orthographic projection of the first opening 41 on the drive substrate 1 .

[0131] For example, a plurality of first grooves 51 may be formed by etching the stacked structure 20 . The sidewalls of the first grooves 51 are formed by a portion of the edge of the stacked structure 20 .

[0132] By adopting the above-mentioned setting, a first groove 51 is set to space the partial edge of the stacked structure 20 and the conductive structure 6 adjacent to the partial edge of the stacked structure 20, so as to achieve insulation between the partial edge of the charge generation layer 24 in the stacked structure 20 and the conductive structure 6 adjacent to the stacked structure 20. During the operation of the light-emitting device 2, the electrical signal on the cathode layer 22 is transmitted to the conductive structure 6 adjacent to it and then cut off at the edge of the conductive structure 6 adjacent to it, thereby reducing the probability that the voltage on the cathode layer 22 in the stacked structure 20 will leak to the charge generation layer 24 through the conductive structure 6 adjacent to the stacked structure 20, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0133] In other implementations, such as Fig.10 and Fig.11 As shown, part of the edge of the stacked structure 20 is recessed toward the center of the first opening 41 to form a notch, and the notch and the isolation structure layer 4 form a first groove 51 .

[0134] Exemplarily, when a portion of the edge of the stacked structure 20 is recessed toward the center of the first opening 41 to form a notch, and the notch and the isolation structure layer 4 form the first groove 51, the conductive structure 6 includes the isolation structure layer 4. The first groove 51 separates a portion of the edge of the stacked structure 20 from the isolation structure layer 4.

[0135] Exemplarily, the orthographic projection of the first groove 51 on the driving substrate 1 is located within the orthographic projection of the first opening 41 on the driving substrate 1 , and the boundary of the orthographic projection of the first groove 51 on the driving substrate 1 partially overlaps with the boundary of the orthographic projection of the first opening 41 on the driving substrate 1 .

[0136] Exemplarily, a plurality of first grooves 51 may be formed by etching the stacked structure 20. The sidewalls of the first grooves 51 are formed by a portion of the edge of the stacked structure 20 and a portion of the edge of the isolation structure layer 4.

[0137] In this embodiment, the first groove 51 is formed in the above manner to space the partial edge of the stacked structure 20 and the isolation structure layer 4 adjacent to the partial edge of the stacked structure 20, thereby achieving insulation between the partial edge of the charge generation layer 24 in the stacked structure 20 and the isolation structure layer 4. During the operation of the light-emitting device 2, the electrical signal on the cathode layer 22 is sequentially transmitted to the isolation structure layer 4 and then cut off at the edge of the isolation structure layer 4 close to the first groove 51, thereby reducing the probability that the voltage on the cathode layer 22 in the stacked structure 20 will leak to the charge generation layer 24 through the isolation structure layer 4, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0138] In addition, part of the edge of the stacked structure 20 is recessed toward the center of the first opening 41 to form a notch. At the notch, the edge of the stacked structure 20 is isolated from the adjacent isolation structure layer 4, thereby further reducing the contact area between the stacked structure 20 and the isolation structure layer 4, and further reducing the probability that the voltage on the cathode layer 22 will leak to the charge generation layer 24 through the isolation structure layer 4 adjacent to the stacked structure 20, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0139] In some embodiments, Figure 8 and Fig.10 As shown, in the case where the display panel 300 further includes: a pixel defining layer 3 located on a side of the isolation structure layer 4 close to the driving substrate 1 , the first groove 51 is located between a boundary of the second opening 31 and a boundary of the first opening 41 .

[0140] Exemplarily, the orthographic projection of the first groove 51 on the driving substrate 1 is staggered with the orthographic projection of the second opening 31 on the driving substrate 1 .

[0141] In addition, when the first groove 51 is located within the boundary range of the stacked structure 20, the first groove 51 is located between the boundary of the second opening 31 and the boundary of the first opening 41, and there are gaps between the first groove 51 and the boundary of the second opening 31 and the boundary of the first opening 41. Figure 8 When a portion of the edge of the stacked structure 20 is recessed toward the center of the first opening to form a notch, and the notch and the isolation structure layer 4 surround the first groove 51, the first groove 51 is located between the boundary of the second opening 31 and the boundary of the first opening 41, and there is a gap between the first groove 51 and the boundary of the second opening 31, and the first groove 51 partially overlaps with the boundary of the first opening 41 as shown in FIG. Fig.10 shown.

[0142] By adopting the above-mentioned arrangement, the first groove 51 can be used to separate part of the edge of the stacked structure 20 and the isolation structure layer 4 or the conductive structure 6 adjacent thereto, so as to realize insulation between part of the edge of the charge generation layer 24 in the stacked structure 20 and the isolation structure layer 4 or the conductive structure 6 adjacent thereto. During the operation of the light-emitting device 2, the electrical signal on the cathode layer 22 is transmitted to the conductive structure 6 and then cut off at the edge of the conductive structure 6 close to the insulating structure 5, thereby reducing the probability that the cathode layer 22 will leak electricity to the charge generation layer 24 through the isolation structure layer 4, thereby improving the luminous efficiency of the light-emitting device 2. In addition, the first groove 51 is located between the boundary of the second opening 31 and the boundary of the first opening 41, that is, the first groove 51 is staggered with the second opening 31, thereby avoiding affecting the performance of the light-emitting device 2.

[0143] In some embodiments, in combination Fig.12 and Fig.13 As shown, the insulating structure 5 includes: a first groove 51 , the first groove 51 is located between two adjacent stacked structures 20 , and the first groove 51 cuts off the isolation structure layer 4 between the two adjacent stacked structures 20 .

[0144] For example, Fig.12 As shown, the conductive structure 6 includes a stacked structure 20 adjacent to the stacked structure 20. The first groove 51 separates a portion of the edge of the stacked structure 20 from the stacked structure 20 adjacent to the portion of the edge of the stacked structure 20.

[0145] For example, Fig.13 As shown, the edge of the stacked structure 20 adjacent to the first groove 51 is insulated from the adjacent stacked structure 20 through the first groove 51 , and the remaining edges of the stacked structure 20 are connected to the isolation structure layer 4 to achieve electrical connection between multiple cathode layers 22 .

[0146] Exemplarily, during the manufacturing process of the display panel 300, an etching process may be used to remove a portion of the isolation structure layer 4 to form the first groove 51. Also exemplarily, during the manufacturing process of the display panel 300, an etching process may be used to remove a portion of the isolation structure layer 4 and a portion of the stacked structure 20 adjacent to the isolation structure layer 4 to form the first groove 51.

[0147] By adopting the above-mentioned setting, the first groove 51 is formed by removing at least part of the isolation structure layer 4, and the insulation setting between the edge of the charge generation layer 24 adjacent to the first groove 51 in the stacked structure 20 and the conductive structure 6 adjacent thereto is realized. During the operation of the light-emitting device 2, the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 can be reduced, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0148] In some embodiments, Fig.13 As shown, the isolation structure layer 4 includes a plurality of first isolation parts 401 and a plurality of second isolation parts 402. The plurality of first isolation parts 401 and the plurality of second isolation parts 402 are cross-arranged to define a plurality of first openings 41; a portion of at least one of the first isolation parts 401 and the second isolation parts 402 used to enclose the first opening 41 is cut off by the first groove 51.

[0149] Exemplarily, the plurality of first isolation portions 401 extend along the first direction, and the plurality of second isolation portions 402 extend along the second direction. The first direction intersects the second direction. Here, the angle between the first direction and the second direction can be set according to actual needs. For example, the angle between the first direction and the second direction is 85°, 88°, or 90°.

[0150] In some examples, the portion of the first isolating portion 401 used to enclose the first opening 41 is interrupted by the first groove 51. In other examples, the portion of the second isolating portion 402 used to enclose the first opening 41 is interrupted by the first groove 51. In still other examples, the portions of the first isolating portion 401 and the second isolating portion 402 used to enclose the first opening 41 are both interrupted by the first groove 51.

[0151] With the above arrangement, a portion of at least one of the first isolation portion 401 and the second isolation portion 402 used to enclose the first opening 41 is cut off by the first groove 51, that is, the area of ​​the isolation structure layer 4 around the stacked structure 20 located in the first opening is reduced, thereby reducing the contact area between the stacked structure 20 and the isolation structure layer 4. During the operation of the light-emitting device 2, the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 can be reduced, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0152] In some embodiments, Fig.13 As shown, among the two adjacent laminated structures 20 on both sides of the first groove 51 , a portion of the edge of at least one laminated structure 20 is recessed toward the center of the first opening 41 to form a portion of the boundary of the first groove 51 .

[0153] Exemplarily, an orthographic projection of the first groove 51 on the driving substrate 1 partially overlaps with an orthographic projection of the first opening 41 on the driving substrate 1 .

[0154] Exemplarily, the sidewall of the first groove 51 is formed by a portion of the sidewall of the stacked structure 20 and a portion of the sidewall of the isolation structure layer 4 .

[0155] By adopting the above-mentioned setting, a first groove 51 is formed, which reduces the area of ​​the isolation structure layer 4 around the stacked structure 20 located in the first opening, thereby reducing the contact area between the stacked structure 20 and its adjacent conductive structure. During the operation of the light-emitting device 2, the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 can be reduced, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0156] In some embodiments, Fig. 9 , Fig.11 and Fig.13 As shown, at least two first grooves 51 are arranged around a stacked structure 20 , and the at least two first grooves 51 are arranged at intervals around the stacked structure 20 .

[0157] For example, the number of first grooves 51 disposed around a stacked structure 20 may be two, three or more. The embodiments of the present disclosure are not limited to this. Fig. 9 As shown, there are four first grooves 51 arranged around a stacked structure 20. The four first grooves 51 are arranged around the stacked structure 20 at intervals.

[0158] In some examples, among the multiple first grooves 51 arranged around a stacked structure 20, the multiple first grooves 51 may all be located within the boundary range of the stacked structure 20, and there is a spacing between the boundary of the multiple first grooves 51 close to the isolation structure layer 4 and the boundary of the stacked structure 20, such as Fig. 9 In other examples, among the multiple first grooves 51 arranged around a stacked structure 20, the multiple first grooves 51 are formed by partially recessing the edge of the stacked structure 20 toward the center of the first opening 41 to form a notch, and are surrounded by the notch and the isolation structure layer 4, as shown in FIG. Fig.11 In some other examples, among the multiple first grooves 51 arranged around a stacked structure 20, some of the first grooves 51 are formed by recessing a portion of the edge of the stacked structure 20 toward the center of the first opening 41 to form a notch, and are surrounded by the notch and the isolation structure layer 4; some of the first grooves 51 are formed by removing a portion of the isolation structure layer 4, such as Fig.13 The embodiments of the present disclosure are not limited to this.

[0159] By adopting the above-mentioned setting, at least two first grooves 51 are arranged around a stacked structure 20, which can further reduce the contact area between the stacked structure 20 and its adjacent conductive structure. During the operation of the light-emitting device 2, the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 can be further reduced, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0160] In some embodiments, Fig. 9 , Fig.11 As shown, the cathode layer 22 includes: a first sub-portion 221 and a second sub-portion 222. The first sub-portion 221 overlaps with the anode 21 in a direction perpendicular to the drive substrate 1; the second sub-portion 222 passes through the gap between two adjacent first grooves 51, one end of the second sub-portion 222 is electrically connected to the first sub-portion 221, and the other end of the second sub-portion 222 is electrically connected to the isolation structure layer 4.

[0161] It should be noted that, in the top view of the display panel 300 , the orthographic projection of the cathode layer 22 in one stacked structure 20 substantially overlaps with the orthographic projections of other film layers in the stacked structure 20 . Fig. 9 and Fig.11 Only the cathode layer 22 in the stacked structure 20 is illustrated, while other film layers in the stacked structure 20 are not marked in detail.

[0162] Exemplarily, the orthographic projection of the first sub-portion 221 on the driving substrate 1 covers the orthographic projection of the anode 21 on the driving substrate 1. The orthographic projection of the second sub-portion 222 on the driving substrate 1 is staggered with the orthographic projection of the anode 21 on the driving substrate 1.

[0163] For example, the number of the second sub-sections 222 electrically connected to the first sub-section 221 may be one or more. The embodiments of the present disclosure are not limited to this. Fig. 9 and Fig.11 As shown, there are four second subsections 222 electrically connected to the first subsection 221. Thus, it is possible to ensure that the cathode layer 22 has a certain contact area with the isolation structure layer 4, thereby ensuring the effectiveness of the electrical connection between the cathode layer 22 and the isolation structure layer 4.

[0164] The above-mentioned arrangement can not only reduce the contact area between the stacked structure 20 and its adjacent conductive structure 6, but also reduce the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 during the operation of the light-emitting device 2, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300; it can also ensure that the two adjacent cathode layers 22 are electrically connected through the isolation structure layer 4, which is used to ensure that the light-emitting layer 23 located in each light-emitting device 2 can receive approximately the same electrical signal transmitted by the cathode layer 22, which is beneficial to improving the accuracy of the electrical signals received by the multiple light-emitting layers 23, and further beneficial to improving the display uniformity of the display panel 300.

[0165] In some embodiments, Fig. 9 As shown, the cathode layer 22 further includes: a third sub-portion 223 , which is located between the first groove 51 and the boundary of the first opening 41 , and is electrically connected to the second sub-portion 222 and the isolation structure layer 4 .

[0166] For example, the number of the third sub-sections 223 included in a cathode layer 22 may be one or more. The embodiments of the present disclosure are not limited to this. Fig. 9 As shown, one cathode layer 22 includes four third sub-portions 223 .

[0167] As can be seen from the above, the first sub-section 221 is electrically connected to the isolation structure layer 4 through the second sub-section 222. In this embodiment, a plurality of third sub-sections 223 electrically connected to the second sub-section 222 are provided, and the third sub-sections 223 are electrically connected to the isolation structure layer 4, so that the contact area between the edge of the stacked structure 20 and the isolation structure layer 4 can be reduced, and during the operation of the light-emitting device 2, the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 can be reduced, thereby improving the light-emitting efficiency of the light-emitting device 2, and ensuring the display effect of the display panel 300. On the basis of ensuring the effectiveness of the electrical connection between the cathode layer 22 and the isolation structure layer 4, it is ensured that the light-emitting layer 23 located in each light-emitting device 2 can receive substantially the same electrical signal transmitted by the cathode layer 22, which is conducive to improving the accuracy of the electrical signals received by the plurality of light-emitting layers 23, and is conducive to improving the display uniformity of the display panel 300.

[0168] In some embodiments, the first groove 51 at least penetrates the cathode layer 22 , the second light emitting layer 232 , and the charge generation layer 24 .

[0169] In some examples, the first groove 51 also penetrates the first light emitting layer 231 .

[0170] By adopting the above-mentioned setting, the first groove 51 can achieve insulation between the partial edge of the charge generation layer 24 in the stacked structure 20 and the conductive structure 6 adjacent to the stacked structure 20, thereby reducing the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 during the operation of the light-emitting device 2, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0171] In some embodiments, within the first groove 51 , at least the edges of the cathode layer 22 , the second light emitting layer 232 , and the charge generation layer 24 in the stacked structure 20 are aligned or substantially aligned in a direction perpendicular to the driving substrate 1 .

[0172] In some implementations, the cathode layer 22 wraps around the edges of the light-emitting layer 23 and the charge generation layer 24 , that is, the edge of the cathode layer 22 in a direction perpendicular to the drive substrate 1 exceeds the edge of the light-emitting layer 23 and the charge generation layer 24 , thereby wrapping the edge of the light-emitting layer 23 and the charge generation layer 24 .

[0173] In the embodiment of the present disclosure, at least the edges of the cathode layer 22, the second light-emitting layer 232 and the charge generation layer 24 are aligned or approximately aligned in a direction perpendicular to the driving substrate 1, so that the edge of the cathode layer 22 is isolated from the edge of the charge generation layer 24. Thus, during the operation of the light-emitting device 2, the probability that the cathode layer 22 will leak electricity to the charge generation layer 24 through the isolation structure layer 4 or the stacked structure adjacent to the stacked structure 20 is reduced, thereby improving the luminous efficiency of the light-emitting device 2.

[0174] In some embodiments, Fig.14 and Fig.15 As shown, the insulating structure 5 includes an insulating portion 52 , which covers a portion of the sidewall of the first opening 41 and is located between a portion of the edge of the stacked structure 20 and the isolation structure layer 4 .

[0175] Exemplarily, part of the side wall of the isolation structure layer 4 is isolated from the stacked structure 20 by the insulating portion 52, thereby realizing an insulation setting between part of the side wall of the isolation structure layer 4 and the stacked structure 20; part of the side wall of the isolation structure layer 4 is connected to the stacked structure 20, so that adjacent cathode layers 22 are electrically connected through the isolation structure layer 4.

[0176] For example, the material of the insulating portion 52 may include an inorganic material, which may include one or more combinations of silicon nitride (SiNx), silicon dioxide (SiOx), and silicon oxynitride (SiON).

[0177] In this embodiment, an insulating portion 52 is provided to cover a portion of the side wall of the first opening 41 of the isolation structure layer 4, thereby reducing the contact area between the stacked structure 20 and the isolation structure layer 4. This ensures that the two adjacent cathode layers 22 are electrically connected through the isolation structure layer 4, and is used to ensure that the light-emitting layer 23 located in each light-emitting device 2 can receive approximately the same electrical signal transmitted by the cathode layer 22, which is beneficial to improving the accuracy of the electrical signals received by the multiple light-emitting layers 23, and further helps to improve the display uniformity of the display panel 300; it also reduces the contact area between the stacked structure 20 and the isolation structure layer 4, thereby reducing the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 during the operation of the light-emitting device 2, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0178] In some embodiments, Fig.14As shown, the isolation structure layer 4 includes: a first sub-isolation layer 411, a second sub-isolation layer 412, and a third sub-isolation layer 413 which are sequentially stacked in a direction away from the drive substrate 1, and the side surface of the second sub-isolation layer 412 is retracted relative to the side surface of the first sub-isolation layer 411 and the side surface of the third sub-isolation layer 413. The insulating portion 52 covers the side surface of the third sub-isolation layer 413, the surface of the portion of the third sub-isolation layer 413 that exceeds the second sub-isolation layer 412 and is close to the drive substrate 1, and the side surface of the second sub-isolation layer 412.

[0179] Exemplarily, the material of the first sub-isolation layer 411 and the third sub-isolation layer 413 may be titanium (Ti), and the material of the second sub-isolation layer 412 may be aluminum (Al). Due to the different wet etching rates of Ti and Al, in the process of etching to form the isolation structure layer 4, it can be ensured that the second sub-isolation layer 412 is less affected by the etching, and the etching speed of the first sub-isolation layer 411 and the third sub-isolation layer 413 is faster, which is convenient for forming an undercut structure (for example, an "I"-shaped structure). Those skilled in the art may also select other suitable materials as long as the above-mentioned technical effects can be achieved, and the embodiments of the present disclosure are not limited thereto.

[0180] In some examples, the insulating portion 52 also covers a portion of the first sub-isolating layer 411 that extends beyond the second sub-isolating layer 412 and is away from the surface of the driving substrate 1 .

[0181] It is understandable that the thickness of the first sub-isolation layer 411 is relatively thin. During the manufacturing process of the display panel 300, the stacked structure 20 formed in the first opening 41 will be directly deposited on the surface of the first sub-isolation layer 411 that exceeds the second sub-isolation layer 412 and is away from the drive substrate 1.

[0182] In this embodiment, by making the insulating part 52 cover the side of the third sub-isolation layer 413, the part of the third sub-isolation layer 413 that exceeds the second sub-isolation layer 412 and is close to the surface of the drive substrate 1, and the side of the second sub-isolation 412 layer, insulation between the partial edge of the charge generation layer 24 in the stacked structure 20 and the isolation structure layer 4 can be achieved, that is, the contact area between the charge generation layer 24 and the isolation structure layer 4 in the stacked structure 20 is reduced, thereby reducing the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 during the operation of the light-emitting device 2, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0183] In some embodiments, Fig.14 As shown, the display panel 300 further includes: a first insulating layer 7 disposed on a side of the isolation structure layer 4 away from the driving substrate 1 , and the insulating portion 52 is made of the same material as the first insulating layer 7 and is connected to the first insulating layer 7 .

[0184] Exemplarily, the edge of the first insulating layer 7 is aligned or substantially aligned with the edge of the third sub-isolation layer 413 in the isolation structure layer 4 in a direction perpendicular to the drive substrate 1 .

[0185] Exemplarily, the top-view structure of the first insulating layer 7 is grid-like.

[0186] Exemplarily, the material of the first insulating layer 7 may be an inorganic material, which may include one or a combination of silicon nitride (SiNx), silicon dioxide (SiOx), and silicon oxynitride (SiON).

[0187] It can be understood that the insulating portion 52 is made of the same material as the first insulating layer 7 and is connected to the first insulating layer 7 , that is, the insulating portion 52 and the first insulating layer 7 are arranged in the same layer.

[0188] In addition, it is easy to understand that the "same layer" mentioned in each embodiment of the present disclosure refers to a layer structure formed by using the same film forming process to form a film layer for forming a specific pattern, and then using the same mask template through a single patterning process. Depending on the specific pattern, a single patterning process may include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure may be continuous or discontinuous, and these specific patterns may also be at different heights or have different thicknesses.

[0189] The above-mentioned "patterning process" may include photolithography, or photolithography and etching steps, and may also include printing, inkjet and other processes for forming a predetermined pattern; photolithography refers to a process for forming a pattern using photoresist, mask, exposure machine, etc., including film formation, exposure, development and other process processes. The corresponding patterning process can be selected according to the structure formed in the present disclosure.

[0190] In this embodiment, the insulating part 52 is made of the same material as the first insulating layer 7 and is connected to the first insulating layer 7, that is, the insulating part 52 and the first insulating layer 7 can be formed by a single patterning process, that is, the insulating part 52 is formed while the first insulating layer 7 is formed. The process is simple, and the insulating part 52 can be formed without adding any additional steps to prepare the display panel 300, thereby wrapping up part of the edge of the isolation structure layer 4, thereby reducing the contact area between the charge generation layer 24 and the isolation structure layer 4 in the stacked structure 20, thereby reducing the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 during the operation of the light-emitting device 2, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0191] In some embodiments, Fig.16 and Fig.17As shown, the plurality of stacked structures 20 at least include a first stacked structure 210 and a second stacked structure 220, and the luminous color of the first stacked structure 210 is different from the luminous color of the second stacked structure 220. The display panel 300 further includes: a first encapsulation sublayer 81 located on a side of the first stacked structure 210 away from the driving substrate 1, and a second encapsulation sublayer 82 located on a side of the second stacked structure 220 away from the driving substrate 1; the insulating portion 52 located between the second stacked structure 220 and the isolation structure layer 4 includes a first sublayer 521, and the first sublayer 521 is made of the same material as the first encapsulation sublayer 81.

[0192] In some examples, the luminous color of the first stacked structure 210 is red, and the luminous color of the second stacked structure 220 is green. In other examples, the luminous color of the first stacked structure 210 is blue, and the luminous color of the second stacked structure 220 is green. In still other examples, the luminous color of the first stacked structure 210 is blue, and the luminous color of the second stacked structure 220 is red. The embodiments of the present disclosure are not limited to this.

[0193] Exemplarily, the first encapsulation sublayer 81 is used to shield and protect the light emitting layer 23 and the cathode layer 22 in the first stacked structure 210 . The second encapsulation sublayer 82 is used to shield and protect the light emitting layer 23 and the cathode layer 22 in the second stacked structure 220 .

[0194] Exemplarily, the materials of the first encapsulation sublayer 81 and the second encapsulation sublayer 82 may be inorganic materials, which may include one or more combinations of silicon nitride (SiNx), silicon dioxide (SiOx), and silicon oxynitride (SiON).

[0195] Exemplarily, the first sublayer 521 included in the insulating portion 52 between the second stacked structure 220 and the isolation structure layer 4 and the first encapsulation sublayer 81 may be formed by the same patterning process.

[0196] Exemplarily, the insulating portion 52 between the second stacked structure 220 and the isolation structure layer 4 may also include other film layers. For example, the insulating portion 52 may also include: a film layer disposed at the same layer as the light-emitting layer 23 in the first stacked structure 210, a film layer disposed at the same layer as the cathode layer 22 in the first stacked structure 210, and a film layer disposed at the same layer as the charge generation layer 24 in the first stacked structure 210.

[0197] Exemplarily, the first stacked structure 210 and the first encapsulation sub-layer 81 may be formed by a single patterning process.

[0198] In addition, it should be noted that the first stacked structure 210 and the second stacked structure 220 are manufactured separately.

[0199] Specifically, a first stacked structure film and a first encapsulation film may be formed first, and then, through a single patterning process, a first stacked structure 210 and a first encapsulation sublayer 81 located in a first target opening among the plurality of first openings 41 are formed. After the first stacked structure 210 and the first encapsulation sublayer 81 are formed, a second stacked structure 220 and a second encapsulation sublayer 82 are formed in a second target opening among the plurality of first openings 41.

[0200] On this basis, a portion of the first stacked structure film and a portion of the first packaging film are deposited in the second target opening of the plurality of first openings 41 , thereby forming an insulating portion 52 between the second stacked structure 220 and the isolation structure layer 4 .

[0201] In this embodiment, the first sublayer 521 included in the insulating part 52 located between the second stacked structure 220 and the isolation structure layer 4 is made of the same material as the first encapsulation sublayer 81 of the covered first stacked structure 210, and can be formed by a one-time patterning process. The process is simple and can form the insulating part 52 without adding any additional preparation steps for the display panel 300, thereby wrapping up part of the edge of the isolation structure layer 4, thereby reducing the contact area between the charge generation layer 24 and the isolation structure layer 4 in the stacked structure 20, thereby reducing the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 during the operation of the light-emitting device 2, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0202] In some embodiments, Fig.17 As shown, the plurality of stacked structures 20 further include a third stacked structure 230, and the first stacked structure 210, the second stacked structure 220 and the third stacked structure 230 have different luminous colors. The insulating portion 52 located between the third stacked structure 230 and the isolation structure layer 4 includes a second sublayer 522, and the second sublayer 522 is made of the same material as the first encapsulation sublayer 81.

[0203] For example, the light emitting color of the first stacked structure 210 is red, the light emitting color of the second stacked structure 220 is blue, and the light emitting color of the third stacked structure 230 is green.

[0204] Exemplarily, the second sublayer 522 included in the insulating portion 52 between the third stacked structure 230 and the isolation structure layer 4 and the first encapsulation sublayer 81 may be formed by the same patterning process.

[0205] Exemplarily, the insulating portion 52 between the third stacked structure 230 and the isolation structure layer 4 may further include other film layers. For example, the insulating portion 52 may further include: a film layer disposed at the same layer as the light emitting layer 23 in the first stacked structure 210, a film layer disposed at the same layer as the cathode layer 22 in the first stacked structure 210, and a film layer disposed at the same layer as the charge generating layer 24 in the first stacked structure 210.

[0206] Exemplarily, the first stacked structure 210 , the second stacked structure 220 , and the third stacked structure 230 are all manufactured separately.

[0207] Specifically, a first stacked structure film and a first encapsulation film may be formed first, and then, through a single patterning process, a first stacked structure 210 and a first encapsulation sublayer 81 located in a first target opening among the plurality of first openings 41 are formed. After the first stacked structure 210 and the first encapsulation sublayer 81 are formed, a second stacked structure 220 and a second encapsulation sublayer 82 are formed in a second target opening among the plurality of first openings 41, and a third stacked structure 230 is formed in the first opening 41.

[0208] On this basis, a portion of the first stacked structure film and a portion of the first packaging film are deposited in the plurality of first openings 41 for forming the third stacked structure 230 , thereby forming an insulating portion 52 between the third stacked structure 230 and the isolation structure layer 4 .

[0209] In this embodiment, the second sublayer 522 included in the insulating part 52 located between the third stacked structure 230 and the isolation structure layer 4 is made of the same material as the first encapsulation sublayer 81 of the covered first stacked structure 210, and can be formed by a one-time patterning process. The process is simple and can form the insulating part 52 without adding any additional preparation steps for the display panel 300, thereby wrapping up part of the edge of the isolation structure layer 4, thereby reducing the contact area between the charge generation layer 24 and the isolation structure layer 4 in the stacked structure 20, thereby reducing the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 during the operation of the light-emitting device 2, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0210] In some embodiments, Fig.16 and Fig.17As shown, the insulating structure 5 also includes: a second groove 53; the second groove 53 is located within the range of the first opening 41, and the second groove 53 separates a portion of the edge of the first stacked structure 210 and the isolation structure layer 4 adjacent to the portion of the edge of the first stacked structure 210; or, the second groove 53 is located between the first stacked structure 210 and the stacked structure 20 adjacent to the first stacked structure 210, and the second groove 53 cuts off the isolation structure layer 4 adjacent to the first stacked structure 210.

[0211] Exemplarily, the orthographic projection of the second groove 53 on the driving substrate 1 is located within the orthographic projection of the first opening 41 on the driving substrate 1 .

[0212] For example, the number of the second grooves 53 corresponding to one first stacked structure 210 may be one or more, which is not limited in the embodiments of the present disclosure.

[0213] In this embodiment, by setting the second groove 53, the partial edge of the first stacked structure 210 and the conductive structure 6 adjacent to the partial edge of the first stacked structure 210 are spaced apart, so as to realize the insulation setting between the edge of the charge generation layer 24 in the first stacked structure 210 adjacent to the second groove 53 and the conductive structure 6 adjacent to the first stacked structure 210. During the operation of the light-emitting device 2, the electrical signal on the cathode layer 22 is transmitted to the conductive structure 6 adjacent to it and then cut off at the edge of the conductive structure 6 adjacent to it, thereby reducing the probability that the voltage on the cathode layer 22 in the stacked structure 20 will leak to the charge generation layer 24 through the conductive structure 6 adjacent to the stacked structure 20, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0214] In some embodiments, Fig.15 As shown, at least one second groove 53 and at least one insulating portion 52 are arranged around a first stacked structure 210 , and the at least one second groove 53 and the at least one insulating portion 52 are arranged at intervals around the first stacked structure 210 .

[0215] like Fig.15 As shown, at least two insulating parts 52 are disposed around a second stacked structure 220 and / or a third stacked structure 230 , and the at least two insulating parts 52 are disposed at intervals around the second stacked structure 220 or the third stacked structure 230 .

[0216] For example, there may be two or more insulating parts 52 disposed around a second stacked structure 220. For example, there may be two or more insulating parts 52 disposed around a third stacked structure 230. The embodiments of the present disclosure are not limited to this.

[0217] In this embodiment, by providing at least one second groove 53 and at least one insulating portion 52 around the first stacked structure 210, an insulation setting is implemented between a partial edge of the charge generation layer 24 in the first stacked structure 210 and the conductive structure 6 adjacent thereto; at least two insulating portions 52 are provided around a second stacked structure 220 and / or a third stacked structure 230, so as to implement an insulation setting between a partial edge of the charge generation layer 24 in the second stacked structure 220 and the third stacked structure 230 and the conductive structure 6 adjacent thereto; during operation of the light-emitting device 2, the electrical signal on the cathode layer 22 is cut off at the edge of the conductive structure 6 adjacent thereto after being transmitted to the conductive structure 6 adjacent thereto, thereby reducing the probability that the voltage on the cathode layer 22 in the stacked structure 20 (including the first stacked structure 210, the second stacked structure 220 and the third stacked structure 230) will leak to the charge generation layer 24 through the conductive structure 6 adjacent to the stacked structure 20, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0218] In some embodiments, Figure 3 As shown, the display panel 300 further includes a light extraction layer (capping layer, CPL for short) 9 located on a side of the plurality of light emitting devices 2 away from the driving substrate 1 .

[0219] Exemplarily, the light extraction layer 9 may be located on a side of the cathode layer 22 away from the driving substrate 1. The light extraction layer 9 is used to protect the cathode layer 22 and to improve the light extraction efficiency of the light emitting device 2.

[0220] For example, the material of the light extraction layer 9 has the characteristics of high refractive index and low light absorption coefficient, which is beneficial to improving the light extraction effect of the light emitting device 2. On this basis, the microcavity length can be adjusted by changing the thickness of the light extraction layer 9 to adjust the color deviation and efficiency of the light emitting device 2.

[0221] In some embodiments, Figure 3 As shown, the display panel 300 further includes: an encapsulation layer 10. The encapsulation layer 10 is located on the side of the light extraction layer 9 away from the driving substrate 1. The encapsulation layer 10 is configured to encapsulate the pixel driving circuit 120 and the plurality of light-emitting devices 2 in the circuit structure layer 12 on the substrate 11 to block water and oxygen, thereby preventing external water and oxygen from corroding the light-emitting device 2, thereby affecting the luminous efficiency and service life of the light-emitting device 2.

[0222] Exemplarily, the encapsulation layer 10 may be an encapsulation film (Thin Film Encapsulation, TFE for short) or an encapsulation substrate.

[0223] For example, the encapsulation layer 10 includes a first inorganic layer, an organic layer and a second inorganic layer stacked in sequence. The first inorganic layer and the second inorganic layer mainly block water and / or oxygen from invading the light emitting device 2, and the organic layer assists in encapsulation and planarization.

[0224] The material of the organic layer includes a polymer combination of one or more of acrylic polymers, silicon polymers and epoxy polymers. The above materials are made on the above-mentioned light-emitting devices 2 by inkjet printing (Ink Jet Printing, abbreviated as: IJP), and ultraviolet (ultraviolet, abbreviated as: UV) curing is performed to form the organic encapsulation layer.

[0225] The materials of the first inorganic layer and the second inorganic layer include one or more of silicon nitride (SiNx), silicon dioxide (SiOx), and silicon oxynitride (SiON). The inorganic encapsulation layer can be formed by a chemical vapor deposition (CVD) process.

[0226] The embodiments of the present disclosure also provide a method for manufacturing a display panel, which is used, for example, to manufacture the display panel 300 provided in some of the above embodiments. Fig.18 A flowchart of a method for manufacturing a display panel 300 provided in some embodiments of the present disclosure; Figure 19 to Figure 25 They are cross-sectional structural diagrams corresponding to various steps in a method for manufacturing a display panel 300 according to some embodiments.

[0227] It should be understood that Fig.18 The steps shown are not exclusive, and other steps may be performed before, after or between any of the steps shown. In addition, some of the steps may be performed simultaneously, or may be performed in different steps. Figure 5 Executed in the order shown.

[0228] like Fig.18 As shown, the above-mentioned manufacturing method includes the following a1~a4.

[0229] a1: such as Fig.19 As shown, an anode layer 02 is formed on the driving substrate 1 , and the anode layer 02 includes a plurality of anodes 21 .

[0230] For example, the structure of the driving substrate 1 may refer to the description in some of the above embodiments, which will not be described in detail here.

[0231] Exemplarily, the anode layer 02 can be specifically made of transparent metal oxide conductive materials such as indium tin oxide (ITO), indium zinc oxide (IZO), and fluorine-doped tin oxide (FTO). In other examples, the structure of the anode is a laminated composite structure formed by the above-mentioned transparent metal oxide conductive materials and metal materials (such as silver Ag). For example, the anode is a laminated composite structure of ITO / Ag / ITO.

[0232] For example, the anode film can be formed by sputtering or evaporation, and then a photoresist pattern is formed on the anode film by coating, exposure, and development processes, and based on the photoresist pattern, the anode film is etched by an etching process to form an anode layer 02 including multiple anodes 21. Finally, the photoresist pattern is peeled off.

[0233] a2: If Fig. 20 As shown, an isolation structure layer 4 is formed on the driving substrate 1 , and the isolation structure layer 4 has a plurality of first openings 41 , and one first opening 41 overlaps with one anode 21 .

[0234] For example, regarding the material and structure of the isolation structure layer 4 , reference may be made to the description in some of the above embodiments, which will not be described in detail here.

[0235] The isolation structure layer 4 is used to separate the stacked structures 20 of different light-emitting devices 2. By setting the isolation structure layer 4, in the process of preparing the display panel 300, any two stacked structures 20 can be separated by the isolation structure layer 4, and the light-emitting devices 2 in the display panel 300 are separated from each other by the isolation structure layer 4, which effectively reduces the difficulty of preparing the display panel 300, reduces the preparation cost of the display panel 300, and makes the arrangement density of the light-emitting devices in the display panel 300 not limited by the size of the FMM, which is conducive to improving the aperture ratio of the display panel 300, improving the pixel density of the display panel 300, and does not need to use the FMM and etching process, avoiding the occurrence of problems such as inaccurate alignment.

[0236] Exemplarily, the isolation structure layer 4 may be formed by a sputtering process.

[0237] In the case where the isolation structure layer 4 includes a first sub-isolation layer 411, a second sub-isolation layer 412, and a third sub-isolation layer 413 stacked in sequence, forming the isolation structure layer 4 by a sputtering process may specifically include: forming a first sub-isolation film, a second sub-isolation film, and a third sub-isolation film in sequence on the drive substrate 1 by a sputtering process. Etching the first sub-isolation film, the second sub-isolation film, and the third sub-isolation film, since the second sub-isolation film is less affected by the etching, the etching speed of the first sub-isolation film and the third sub-isolation film is faster, thereby forming an isolation structure layer 4 with an undercut structure.

[0238] In some examples, the display panel 300 further includes a pixel defining layer 3. In the case where the display panel 300 further includes the pixel defining layer 3, before forming the isolation structure layer 4 on the driving substrate 1, the preparation method further includes: forming the pixel defining layer 3 on the driving substrate 1, such as Fig.19 shown.

[0239] The material of the pixel defining layer 3 includes inorganic material or organic insulating material.

[0240] Exemplarily, when the pixel defining layer 3 is made of inorganic material, a pixel defining film having a certain thickness can be deposited on the driving substrate 1 by physical vapor deposition (PVD) or plasma enhanced chemical vapor deposition (PECVD), and then the pixel defining film is patterned by a photolithography process to form a pixel defining layer 3 having a plurality of second openings 31.

[0241] Exemplarily, when the pixel defining layer 3 is made of organic material, a coating process can be used to form a pixel defining film with a certain thickness on the driving substrate 1, and then the pixel defining film can be patterned using a photolithography process to form a pixel defining layer 3 with multiple second openings 31.

[0242] In some examples, the display panel 300 further includes a first insulating layer 7 disposed on a side of the isolation structure layer 4 away from the driving substrate 1. In the case where the display panel 300 further includes the first insulating layer 7, after forming the isolation structure layer 4 on the driving substrate 1, the preparation method further includes: forming the first insulating layer 7 on a side of the isolation structure layer 4 away from the driving substrate 1, such as Fig.21 shown.

[0243] The material of the first insulating layer 7 may include inorganic materials. For example, a first insulating film having a certain thickness may be deposited by physical vapor deposition or plasma enhanced chemical vapor deposition, and then the first insulating film may be patterned by photolithography to form the first insulating layer 7.

[0244] a3: forming a plurality of stacked structures 20, wherein one stacked structure 20 is at least partially located in one first opening 41. The stacked structure 20 includes a first light emitting layer 231, a charge generation layer 24, a second light emitting layer 232 and a cathode layer 22 stacked in a direction away from the drive substrate 1.

[0245] Exemplarily, the stacked structure 20 may be formed by using a photolithography process.

[0246] The above-mentioned "photolithography process" may specifically include: first forming a whole layer of laminated structure film, after forming the whole layer of laminated structure film, coating the laminated structure film with photoresist, and then setting a mask plate on the side of the photoresist away from the substrate, exposing and developing the laminated structure film through the mask plate, removing the exposed part of the photoresist, and retaining the unexposed part of the photoresist, thereby forming a patterned photoresist; then etching the laminated structure film using the patterned photoresist as a mask, removing the part of the laminated structure film that is not blocked by the patterned photoresist, and obtaining a plurality of laminated structures 20 located in the first opening 41. Finally, the display panel 300 to be formed can be placed in a stripping solution to dissolve and strip off the patterned photoresist layer.

[0247] a4: forming an insulating structure 5 , wherein the insulating structure 5 is disposed between an edge of the stacked structure 20 and a conductive structure 6 adjacent to the stacked structure 20 , wherein the conductive structure 6 includes an isolation structure layer 4 and / or a stacked structure 20 adjacent to the stacked structure 20 .

[0248] In the present embodiment, in the display panel 300 formed by the above-mentioned preparation method, an insulating structure 5 is formed between the edge of the stacked structure 20 and the conductive structure 6 adjacent to the stacked structure 20, so as to achieve insulation between the partial edge of the charge generation layer 24 in the stacked structure 20 and the conductive structure 6 adjacent to the stacked structure 20. During the operation of the light-emitting device 2, the electrical signal on the cathode layer 22 is transmitted to the conductive structure 6 adjacent to it and then cut off at the edge of the conductive structure 6 adjacent to it, thereby reducing the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 through the conductive structure 6 adjacent to it, thereby improving the luminous efficiency of the light-emitting device 2, thereby ensuring the display effect of the display panel 300.

[0249] In some embodiments, the above step a4 includes: etching the stacked structure 20 to form a first groove 51, the first groove 51 serving as the insulating structure 5, such as Fig.24 shown.

[0250] The first groove 51 is located within the range of the first opening 41 , and the first groove 51 separates a portion of the edge of the stacked structure 20 from the conductive structure 6 adjacent to the portion of the edge of the stacked structure 20 .

[0251] In some embodiments, after the above step a4, the preparation method further comprises forming an encapsulation layer 10, such as Fig.25 shown.

[0252] In some other embodiments, the step a4 includes: etching the isolation structure layer 4 to form a first groove 51 , and the first groove 51 serves as the insulation structure 5 .

[0253] The first groove 51 is located between two adjacent stacked structures 20 , and the first groove 51 cuts off the isolation structure layer 4 between the two adjacent stacked structures 20 .

[0254] By adopting the above method, the first groove 51 is formed by etching the stacked structure 20 or the isolation structure layer 4, and the partial edge of the stacked structure 20 and the conductive structure 6 adjacent to the partial edge of the stacked structure 20 are spaced apart, so as to realize the insulation setting between the edge of the charge generation layer 24 in the stacked structure 20 adjacent to the first groove 51 and the conductive structure 6 adjacent to the stacked structure 20. During the operation of the light-emitting device 2, the electrical signal on the cathode layer 22 is transmitted to the conductive structure 6 adjacent to it, and then cut off at the edge of the conductive structure 6 adjacent to it, thereby reducing the probability that the voltage on the cathode layer 22 in the stacked structure 20 will leak to the charge generation layer 24 through the conductive structure 6 adjacent to the stacked structure 20, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0255] In some embodiments, step a4 includes: forming an insulating portion 52 , the insulating portion 52 serving as an insulating structure 5 ; wherein the insulating portion 52 covers a portion of the sidewall of the first opening 41 and is located between a portion of the edge of the stacked structure 20 and the isolation structure layer 4 .

[0256] Exemplarily, the material of the insulating portion 52 includes an inorganic material. Exemplarily, the insulating portion 52 may be formed by physical vapor deposition or plasma enhanced chemical vapor deposition.

[0257] In this embodiment, an insulating portion 52 is provided to cover a portion of the side wall of the first opening 41 of the isolation structure layer 4, thereby reducing the contact area between the stacked structure 20 and the isolation structure layer 4. This ensures that the two adjacent cathode layers 22 are electrically connected through the isolation structure layer 4, and is used to ensure that the light-emitting layer 23 located in each light-emitting device 2 can receive approximately the same electrical signal transmitted by the cathode layer 22, which is beneficial to improving the accuracy of the electrical signals received by the multiple light-emitting layers 23, and further helps to improve the display uniformity of the display panel 300; it also reduces the contact area between the stacked structure 20 and the isolation structure layer 4, thereby reducing the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 during the operation of the light-emitting device 2, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0258] In some embodiments, the plurality of stacked structures 20 includes a plurality of first stacked structures 210, a plurality of second stacked structures 220, and a plurality of third stacked structures 230. The plurality of first stacked structures 210, the plurality of second stacked structures 220, and the plurality of third stacked structures 230 are manufactured separately.

[0259] Specifically, a first stacked structure 210 is first formed, such as Fig. 22 After the first stacked structure 210 is prepared, the second stacked structure 220 is formed. Fig.23 After the second stacked structure 220 is prepared, the third stacked structure 230 is formed.

[0260] In some examples, forming a plurality of stacked structures 20 and forming the insulating portion 52 includes:

[0261] (1) A first stacked structure film and a first packaging film are formed in sequence; the first stacked structure film covers the plurality of first openings 41 and the isolation structure layer 4, and the first packaging film covers the first stacked structure.

[0262] Exemplarily, the material of the first encapsulation film may be an inorganic material. In the case where the material of the first encapsulation film is an inorganic material, the first encapsulation film may be formed by a chemical vapor deposition (CVD) process.

[0263] (2) The first stacked structure film and the first encapsulation film in the second target opening among the plurality of first openings 41 are removed to form the first stacked structure 210 , the first encapsulation sublayer 81 and the first sublayer 521 .

[0264] The first stacked structure film located in the first target opening among the plurality of first openings 41 forms the first stacked structure 210, the first encapsulation film located in the first target opening forms the first encapsulation sublayer 81, and the first encapsulation film covering the sidewall of the second target opening forms the first sublayer 521. The first sublayer 521 serves as the insulating portion 52.

[0265] (3) A second stacked structure 220 is formed in the second target opening; the luminous color of the second stacked structure 220 is different from the luminous color of the first stacked structure 210 .

[0266] In some examples, the plurality of first openings 41 further include a third target opening, and the third stacked structure 230 is located in the third target opening.

[0267] Exemplarily, in the first encapsulation film, a portion of the first encapsulation film located in the third target opening forms the second sub-layer 522. The insulating portion 52 located between the third stacked structure 230 and the isolation structure layer 4 includes the second sub-layer 522.

[0268] Exemplarily, after the second stacked structure 220 is formed in the second target opening, the third stacked structure 230 is formed in the third target opening.

[0269] In this embodiment, while forming the first stacked structure 210 and the first encapsulation sublayer 71, a first sublayer 521 included in the insulating part 52 located between the second stacked structure 220 and the isolation structure layer 4, and a second sublayer 522 included in the insulating part 52 located between the third stacked structure 230 and the isolation structure layer 4 are formed, so that the insulating part 52 can be formed to wrap part of the edge of the isolation structure layer 4 without adding any additional preparation steps for the display panel 300, thereby reducing the contact area between the charge generation layer 24 and the isolation structure layer 4 in the stacked structure 20, thereby reducing the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 during the operation of the light-emitting device 2, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0270] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display panel, comprising: Driver substrate; An anode layer is provided on the driving substrate, wherein the anode layer includes a plurality of anodes; An isolation structure layer is disposed on the driving substrate, the isolation structure layer having a plurality of first openings, one first opening overlapping with one anode; a plurality of stacked structures, one stacked structure being at least partially located within one of the first openings; The stacked structure includes a first light-emitting layer, a charge generation layer, a second light-emitting layer and a cathode layer stacked in a direction away from the drive substrate; The insulating structure is arranged between the edge of the stacked structure and the conductive structure adjacent to the stacked structure, and the conductive structure includes the isolation structure layer and / or the stacked structure adjacent to the stacked structure.

2. The display panel according to claim 1, wherein: The insulating structure includes a first groove, the first groove is located within the range of the first opening, and the first groove separates a portion of the edge of the stacked structure from a conductive structure adjacent to the portion of the edge of the stacked structure.

3. The display panel according to claim 2, wherein: The first groove is located within the boundary range of the stacked structure, and there is a distance between the boundary of the first groove close to the isolation structure layer and the boundary of the stacked structure.

4. The display panel according to claim 2, wherein: Part of the edge of the stacked structure is recessed toward the center of the first opening to form a notch, and the notch and the isolation structure layer form the first groove.

5. The display panel according to any one of claims 2 to 4, further comprising: A pixel defining layer located on a side of the isolation structure layer close to the driving substrate; The pixel definition layer defines a plurality of second openings, one of the second openings is located within the range of one of the first openings, and one of the second openings overlaps with one of the anodes; The first groove is located between a boundary of the second opening and a boundary of the first opening.

6. The display panel according to claim 1, wherein: The insulating structure includes a first groove, which is located between two adjacent stacked structures and cuts off the isolation structure layer between the two adjacent stacked structures.

7. The display panel according to claim 6, wherein: The isolation structure layer includes a plurality of first isolation parts and a plurality of second isolation parts, wherein the plurality of first isolation parts and the plurality of second isolation parts are cross-arranged to define a plurality of first openings; A portion of at least one of the first partition portion and the second partition portion that is used to enclose the first opening is interrupted by the first groove.

8. The display panel according to claim 6 or 7, wherein: Among the two adjacent stacked structures on both sides of the first groove, a portion of the edge of at least one of the stacked structures is recessed toward the center of the first opening to form a portion of the boundary of the first groove.

9. The display panel according to any one of claims 2 to 8, wherein: At least two first grooves are arranged around one of the stacked structures, and at least two first grooves are arranged at intervals around the stacked structure.

10. The display panel according to claim 9, wherein: The cathode layer comprises: a first sub-section and a second sub-section; The first sub-portion overlaps with the anode in a direction perpendicular to the driving substrate; The second sub-portion passes through a gap between two adjacent first grooves, one end of the second sub-portion is electrically connected to the first sub-portion, and the other end of the second sub-portion is electrically connected to the isolation structure layer.

11. The display panel according to claim 10, wherein: The cathode layer further includes: a third sub-portion, the third sub-portion is located between the first groove and the boundary of the first opening, and the third sub-portion is electrically connected to the second sub-portion and the isolation structure layer.

12. The display panel according to any one of claims 2 to 11, wherein: The first groove at least penetrates the cathode layer, the second light-emitting layer, and the charge generation layer.

13. The display panel according to any one of claims 2 to 12, wherein: In the first groove, at least edges of the cathode layer, the second light emitting layer, and the charge generation layer in the stacked structure are aligned or substantially aligned in a direction perpendicular to the drive substrate.

14. The display panel according to claim 1, wherein: The insulating structure includes an insulating portion, which covers a portion of a side wall of the first opening and is located between a portion of an edge of the stacked structure and the isolation structure layer.

15. The display panel according to claim 14, wherein: The isolation structure layer comprises: a first sub-isolation layer, a second sub-isolation layer and a third sub-isolation layer stacked in sequence in a direction away from the drive substrate, and a side surface of the second sub-isolation layer is retracted relative to a side surface of the first sub-isolation layer and a side surface of the third sub-isolation layer; The insulating portion covers a side surface of the third sub-isolating layer, a surface of a portion of the third sub-isolating layer that extends beyond the second sub-isolating layer and is close to the drive substrate, and a side surface of the second sub-isolating layer.

16. The display panel according to claim 14 or 15, further comprising: A first insulating layer is disposed on a side of the isolation structure layer away from the drive substrate, and the insulating portion is made of the same material as the first insulating layer and is connected to the first insulating layer.

17. The display panel according to any one of claims 14 to 16, wherein: The plurality of stacked structures include at least a first stacked structure and a second stacked structure, wherein the luminescent color of the first stacked structure is different from the luminescent color of the second stacked structure; The display panel further comprises: a first encapsulation sublayer located on a side of the first stacked structure away from the driving substrate, and a second encapsulation sublayer located on a side of the second stacked structure away from the driving substrate; The insulating portion located between the second stacked structure and the isolation structure layer includes a first sublayer, and the first sublayer is made of the same material as the first encapsulation sublayer.

18. The display panel according to claim 17, wherein: The plurality of stacked structures further include a third stacked structure, and the first stacked structure, the second stacked structure, and the third stacked structure have different luminous colors: The insulating portion located between the third stacked structure and the isolation structure layer includes a second sub-layer, and the second sub-layer is made of the same material as the first encapsulation sub-layer.

19. The display panel according to claim 18, wherein: The insulating structure further includes: a second groove; The second groove is located within the range of the first opening, and the second groove separates a portion of the edge of the first stacked structure from an isolation structure layer adjacent to the portion of the edge of the first stacked structure; or, The second groove is located between the first stacked structure and a stacked structure adjacent to the first stacked structure, and the second groove cuts off the isolation structure layer adjacent to the first stacked structure.

20. The display panel according to claim 19, wherein: At least one of the second grooves and at least one of the insulating parts is arranged around one of the first stacked structures, and the at least one of the second grooves and the at least one of the insulating parts is arranged at intervals around the first stacked structure; At least two insulating parts are arranged around one of the second stacked structures and / or one of the third stacked structures, and at least two insulating parts are arranged at intervals around the second stacked structure or the third stacked structure.

21. A method for preparing a display panel, comprising: forming an anode layer on the driving substrate, wherein the anode layer includes a plurality of anodes; forming an isolation structure layer on the driving substrate, wherein the isolation structure layer has a plurality of first openings, and one first opening overlaps with one anode; forming a plurality of stacked structures, wherein one stacked structure is at least partially located in one of the first openings; the stacked structure comprises a first light-emitting layer, a charge generation layer, a second light-emitting layer and a cathode layer stacked in a direction away from the drive substrate; An insulating structure is formed, wherein the insulating structure is disposed between an edge of the stacked structure and a conductive structure adjacent to the stacked structure, wherein the conductive structure includes the isolation structure layer and / or the stacked structure adjacent to the stacked structure.

22. The preparation method according to claim 21, wherein The forming of the insulating structure comprises: Etching the stacked structure to form a first groove, wherein the first groove serves as the insulating structure; wherein the first groove is located within the range of the first opening, and the first groove separates a portion of the edge of the stacked structure from an isolation structure layer adjacent to the portion of the edge of the stacked structure; or, The isolation structure layer is etched to form a first groove, wherein the first groove serves as the insulation structure; wherein the first groove is located between two adjacent stacked structures, and the first groove cuts off the isolation structure layer between the two adjacent stacked structures.

23. The preparation method according to claim 22, wherein: The forming of the insulating structure comprises: forming an insulating portion, wherein the insulating portion serves as the insulating structure; The insulating portion covers a portion of the sidewall of the first opening and is located between a portion of the edge of the stacked structure and the isolation structure layer.

24. The preparation method according to claim 23, wherein: The forming of the plurality of stacked structures and the forming of the insulating portion include: A first stacked structure film and a first encapsulation film are sequentially formed; the first stacked structure film covers the plurality of first openings and the isolation structure layer, and the first encapsulation film covers the first stacked structure; removing the first stacked structure film and the first encapsulation film in a second target opening among the plurality of first openings to form a first stacked structure, a first encapsulation sublayer and a first sublayer; The first stacked structure film located in the first target opening among the plurality of first openings forms the first stacked structure, the first encapsulation film located in the first target opening forms the first encapsulation sublayer, and the first encapsulation film covering the sidewall of the second target opening forms the first sublayer; the first sublayer serves as the insulating portion; A second stacked structure is formed in the second target opening; the second stacked structure emits light of a color different from that of the first stacked structure.

25. A display device comprising: The display panel according to any one of claims 1 to 20; A circuit board is electrically connected to the display panel.

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