Actuator, liquid discharge head, liquid discharge apparatus, and method for manufacturing actuator

By using a moisture-proof film to cover the leads and some piezoelectric elements in the actuator, the problem of reduced vibration displacement of the piezoelectric elements is solved, and the good vibration efficiency of the vibrating membrane is achieved.

CN119585119APending Publication Date: 2025-03-07RICOH CO LTD
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Patent Information

Application Number
CN202380054553.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2022-07-22
Filing Date
2023-06-26
Publication Date
2025-03-07

AI Technical Summary

Technical Problem

There is a problem that the vibration displacement of the piezoelectric element is reduced.

Method used

An actuator is designed, which includes a vibrating film, a piezoelectric element, a lead wire and a moisture-proof film on a substrate having a pressurized chamber. The moisture-proof film covers the lead and part of the piezoelectric element overlapping the lead to prevent the reduction of vibration displacement.

Benefits of technology

The covering of the anti-humidity film can prevent the vibration displacement of the piezoelectric element from being reduced, and the good vibration efficiency of the vibrating film can be maintained.

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Abstract

An actuator includes: a diaphragm on a substrate having a pressurization chamber, the diaphragm having a first face defining a portion of a wall of the pressurization chamber; a piezoelectric element located on a second surface of the vibrating membrane on the opposite side to the first surface; a lead wire led out from the piezoelectric element to supply power to the piezoelectric element; and a moisture-proof film that covers the lead and a portion of the piezoelectric element that overlaps the lead.
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Description

Technical Field

[0001] The present embodiment relates to an actuator, a liquid discharge head, a liquid discharge apparatus, and a method of manufacturing the actuator. Background Art

[0002] Conventionally, there is known an actuator including a vibration membrane, a piezoelectric element, a lead wire, and a moisture-proof film. The vibration membrane is formed as a layer on a substrate in which a pressurized chamber is formed, and constitutes a part of the wall surface of the pressurized chamber. The piezoelectric element is mounted on the surface of the vibration membrane opposite to the surface of the vibration membrane constituting the wall surface of the pressurized chamber. The lead wire is led out from the piezoelectric element to supply power to the piezoelectric element. The moisture-proof film covers the lead wire.

[0003] Patent Document (PTL) 1 describes a liquid discharge head including the above-mentioned actuator. Leads of the actuator are covered with an insulating film made of silicon nitride (SiN) having moisture resistance, and the entire surface of a driving element as a piezoelectric element is covered with the above-mentioned insulating film.

[0004] Citation list

[0005] Patent Literature

[0006]

PTL1

[0007] Technical issues

[0008] However, there is a problem that the vibration displacement of the piezoelectric element is reduced.

[0009] Solutions to the problem

[0010] An actuator comprises: a vibrating membrane on a substrate having a pressurized chamber, the vibrating membrane having a first surface defining a portion of a wall of the pressurized chamber; a piezoelectric element located on a second surface of the vibrating membrane opposite to the first surface; a lead extending from the piezoelectric element to supply power to the piezoelectric element; and a moisture-proof film covering: the lead; and a portion of the piezoelectric element overlapping the lead.

[0011] Effects of the Invention

[0012] According to this embodiment, it is possible to prevent the vibration displacement of the piezoelectric element from being reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] A more complete understanding of the embodiments of the present disclosure and many of its attendant advantages and features can be readily obtained and understood from the following detailed description with reference to the accompanying drawings.

[0014] [ Figure 1 ]

[0015] Figure 1is a schematic cross-sectional view of a nozzle vibration type liquid discharge head in this embodiment.

[0016] [ Figure 2 ]

[0017] Figure 2 is a schematic perspective view of a liquid discharge head.

[0018] [ Figure 3 ]

[0019] Figure 3 yes Figure 1 Enlarged cross-sectional view of the X portion.

[0020] [ Figure 4 ]

[0021] Figure 4 This is a diagram showing an example of a region where a moisture-proof film is formed.

[0022] [ Figure 5 ]

[0023] Figure 5 It is a diagram showing another example of the region where the moisture-proof film is formed.

[0024] [ Figure 6 ]

[0025] Figure 6 This is a diagram showing still another example of a region where a moisture-proof film is formed.

[0026] [ Figure 7 ]

[0027] Figure 7 It is a diagram for explaining the process of forming a driving circuit, a wiring portion, and a vibration membrane on a fluid channel substrate.

[0028] [ Figure 8 ]

[0029] Figure 8 The diagrams are for explaining the steps of forming a first electrode layer, a piezoelectric layer, and a second electrode layer on a vibration film.

[0030] [ Fig. 9 ]

[0031] Fig. 9 It is a diagram for explaining the process of forming an insulating film.

[0032] [ Fig.10 ]

[0033] Fig.10 A diagram illustrating a process of forming a plurality of contacts.

[0034] [ Fig.11 ]

[0035] Fig.11 It is a diagram for explaining the process of forming the leads.

[0036] [ Fig.12 ]

[0037] Fig.12 It is a figure explaining the process of forming a moisture-proof layer.

[0038] [ Fig.13 ]

[0039] Fig.13 It is a diagram for explaining the process of forming a moisture-proof film on each lead and a part of the piezoelectric element.

[0040] [ Fig.14 ]

[0041] Fig.14 It is a diagram describing a process of performing film formation of a nozzle forming portion.

[0042] [ Fig.15 ]

[0043] Fig.15 is a diagram describing the process of forming nozzle and pad openings.

[0044] [ Fig.16 ]

[0045] Fig.16 It is a diagram for explaining the process of forming a pressurized chamber.

[0046] [ Fig.17 ]

[0047] Fig.17 This is a diagram showing an example in which pads for electrical connection are provided on the side surfaces of the liquid discharge head.

[0048] [ Fig.18 ]

[0049] Fig.18 It is a diagram showing a modified example of the liquid discharge head.

[0050] [ Fig.19 ]

[0051] Fig.19 It is a diagram showing an example in which pads for electrical connection are provided on the side surfaces of a liquid discharge head according to a modified example.

[0052] [ Fig. 20 ]

[0053] Fig. 20 : is an explanatory diagram schematically showing a printer as an inkjet recording apparatus serving as a liquid discharge apparatus in this embodiment.

[0054] [ Fig.21 ]

[0055] Fig.21 This is an explanatory diagram showing a top view of an example of a head device of the printer according to the present embodiment.

[0056] [ Fig. 22 ]

[0057] Fig. 22 This is an explanatory diagram showing a plan view of the main parts of another example of a printer.

[0058] [ Fig.23 ]

[0059] Fig.23 This is an explanatory diagram showing a side view of the main parts of another example of a printer.

[0060] [ Fig.24 ]

[0061] Fig.24 This is an explanatory diagram showing a plan view of a main part of another example of a liquid discharge device.

[0062] [ Fig.25 ]

[0063] Fig.25 This is an explanatory diagram showing a front view of still another example of the liquid discharge device.

[0064] The accompanying drawings are intended to describe embodiments of the present disclosure and should not be construed as limiting the scope thereof. Unless explicitly noted, the accompanying drawings should not be considered to be drawn to scale. Moreover, throughout the several views, the same or similar reference numerals represent the same or similar components. DETAILED DESCRIPTION

[0065] In describing the embodiments shown in the drawings, specific terms are used for clarity. However, the disclosure of this specification is not intended to be limited to the specific terms selected, and it should be understood that each specific component includes all technical equivalents having similar functions, operating in a similar manner and achieving similar results.

[0066] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0067] Hereinafter, a liquid discharge head included in a liquid discharge device according to an embodiment of the present invention will be described.

[0068] The present embodiment is not limited to the embodiments described below, and changes, additions, modifications and deletions such as those of other embodiments may be made within the scope conceivable by those skilled in the art, and any aspects are included in the scope of the present embodiment as long as the functions and effects of the present embodiment are achieved.

[0069] The liquid discharge head according to an embodiment of the present invention is a nozzle vibration type liquid discharge head, which changes the pressure in the pressurized chamber by an actuator including a nozzle to discharge the liquid in the pressurized chamber from the nozzle. The nozzle vibration type is characterized in that the liquid droplets can be scattered with a smaller force than that of a conventional single-crystal piezoelectric head (a method of discharging liquid by vibrating the surface opposite to the surface of the communication port having the nozzle connected to the pressurized chamber), and energy saving of the actuator can be achieved.

[0070] When the nozzle density increases, the layout space of the wiring for applying voltage is limited, and the wiring construction on the substrate surface becomes difficult. When the wiring and the drive circuit are constructed in the substrate, the wiring can be arranged even in a structure with a high nozzle density. Generally, lead zirconate titanate (PZT) is widely used as a material for piezoelectric elements due to its high piezoelectric properties, but the film formation / crystallization temperature of PZT requires 600°C or higher. When PZT is used as a material for piezoelectric elements, the drive circuit and wiring in the substrate may not be able to withstand high temperatures, so a piezoelectric material with a lower film formation temperature than PZT should be used as a piezoelectric material. In this case, a material with a lower piezoelectric property than PZT has to be selected. However, as described above, the nozzle vibration mode has the characteristic of being able to scatter droplets with less force compared to an ordinary single piezoelectric chip type piezoelectric head. Therefore, even if a material with a lower piezoelectric property than PZT is selected, the droplets can be scattered well. Therefore, even a piezoelectric material with a low film formation and crystallization temperature but low power, such as a non-lead material, can scatter droplets well. This allows wiring and drive circuits to be constructed within the substrate, thereby achieving higher density.

[0071] Furthermore, since the nozzle vibration type can reduce the volume of the pressurizing chamber, the size of the head can be reduced.

[0072] Figure 1 is a schematic cross-sectional view of a nozzle vibration type liquid discharge head in this embodiment. Figure 2 is a schematic perspective view of a liquid discharge head.

[0073] The liquid discharge head 1 includes an actuator 110 , a flow path substrate 100 , and a frame member 120 .

[0074] The actuator 110 is in the shape of a thin film and includes a vibration membrane 103, a plurality of nozzles 2, and a piezoelectric element 5. The plurality of nozzles 2 discharge liquid. The piezoelectric element 5 is formed in a ring shape and is arranged around the nozzles 2. The flow path substrate 100 has a plurality of pressurized chambers 4 (also referred to as individual chambers) respectively connected to the plurality of nozzles 2. The frame member 120 has a common chamber 3 connected to the plurality of pressurized chambers 4.

[0075] Electrical connection pads 6 for connecting to electrical components such as an external power source are provided at both ends of the liquid discharge head 1 .

[0076] Figure 3 yes Figure 1 An enlarged cross-sectional view of section X in FIG.

[0077] The flow path substrate 100 is a silicon-on-insulator (SOI) substrate, and has a drive circuit 101 and a wiring section 102 on the film-forming side of the vibration membrane 103. The drive circuit 101 is a circuit including a transistor and a resistor. The wiring section 102 includes a wiring for applying a bias voltage to the first electrode 51 and a wiring for applying a bias voltage to the second electrode 53. The wiring section 102 is electrically connected to the electrical connection pad 6 through the third contact 7c opened on the vibration membrane 103.

[0078] The actuator 110 includes a nozzle forming portion 111 (thin film) in which a plurality of nozzles 2 are formed, covering the piezoelectric element 5. A liquid repellent film may be formed on the nozzle surface of the nozzle forming portion 111. By forming the liquid repellent film on the nozzle surface, it is possible to suppress the liquid from adhering to the nozzle surface. Therefore, it is possible to suppress the liquid discharged from the nozzle 2 from being affected by the liquid adhering to the nozzle surface. In the case where the solvent of the liquid is an aqueous solvent, perfluorodecyltrichlorosilane or perfluorooctyltrichlorosilane may be used as the material of the liquid repellent film.

[0079] The piezoelectric element 5 of the actuator 110 includes a first electrode 51 (also referred to as a lower electrode), a piezoelectric film 52 (also referred to as a piezoelectric portion), and a second electrode 53 (also referred to as an upper electrode). The piezoelectric element 5 is covered with an insulating film 8 .

[0080] The insulating film 8 has a fourth hole-shaped contact 7d electrically connected to the first electrode 51 and a fifth hole-shaped contact 7e electrically connected to the second electrode 53. The fourth contact 7d is also referred to as a "first contact", and the fifth contact 7e is also referred to as a "second contact".

[0081] A first lead 9 a electrically connecting the first electrode of the piezoelectric element and the wiring portion 102 of the fluid channel substrate 100 and a second lead 9 b electrically connecting the second electrode 53 of the piezoelectric element and the wiring portion 102 of the fluid channel substrate 100 are formed on the insulating film 8 .

[0082] The first lead 9a is electrically connected to the first electrode 51 via the fourth contact 7d and to the wiring portion 102 via the first contact 7a. The second lead 9b is electrically connected to the second electrode 53 via the fifth contact 7e and to the wiring portion 102 via the second contact 7b.

[0083] The first lead wire 9a and the second lead wire 9b are covered with the moisture-proof film 11. This prevents moisture that has penetrated into the resin nozzle forming portion 111 from penetrating into the first lead wire 9a and the second lead wire 9b. As a result, corrosion of each lead wire can be prevented.

[0084] The moisture-proof film 11 preferably has electrical insulation. The moisture-proof film 11 has insulation and moisture-proof properties. As a result, the actuator 110 can be made thinner than when an insulating film is formed under the moisture-proof film 11. As a result, the vibration film 103 is easily deformed, so that the vibration efficiency can be improved.

[0085] As the moisture-proof film 11, silicon nitride (SiN) which is widely used as a moisture-proof film for semiconductors is preferably used. This is because SiN can make the moisture-proof film 11 have both insulation and moisture-proof properties. In addition, oxides of aluminum (Al), tantalum (Ta), niobium (Nb), titanium (Ti), hafnium (Hf), zirconium (Zr), or tungsten (W) which can easily form a dense film by atomic layer deposition (ALD) can also be used as the material of the moisture-proof film 11.

[0086] Figure 4 This is a diagram showing an example of a region where the moisture-proof film 11 is formed.

[0087] like Figure 4 As shown in FIG. 1 , the moisture-proof film 11 covers the first lead 9a, the second lead 9b, the fourth contact 7d, the fifth contact 7e and their surroundings. Therefore, the piezoelectric element 5 is covered by the moisture-proof film 11 only around the portion of the first lead 9a overlapping with the piezoelectric element 5, the portion of the second lead 9b overlapping with the piezoelectric element 5, the fourth contact 7d and the fifth contact 7e. That is, the piezoelectric element 5 is configured so that its circuit is covered by the moisture-proof film 11.

[0088] The moisture-proof film 11 is basically a dense and hard film. Therefore, when the entire piezoelectric element is covered with the moisture-proof film 11, the rigidity of the piezoelectric element 5 increases, so that the vibration displacement is reduced. In particular, a piezoelectric material having a low film formation / crystallization temperature but low power, such as a lead-free material, is used in this embodiment as described above. Therefore, the effect of reducing the vibration displacement caused by the moisture-proof film 11 is significant.

[0089] Therefore, in this embodiment, if Figure 4As shown in FIG. 1 , the piezoelectric element 5 is only partially covered with the moisture-proof film 11. Specifically, the piezoelectric element 5 is covered only around the first lead 9a, the second lead 9b, the fourth contact 7d, and the fifth contact 7e with the moisture-proof film 11. As a result, compared with the case where the entire piezoelectric element is covered with the moisture-proof film 11, the reduction in the vibration displacement of the piezoelectric element 5 can be suppressed, and the vibration membrane 103 can be vibrated well.

[0090] As described later, the first and second electrodes of the piezoelectric element 5 are made of a metal having high corrosion resistance such as iridium (Ir) or molybdenum (Mo). Therefore, the first and second electrodes of the piezoelectric element are hardly corroded by moisture intruding into the nozzle forming portion 111.

[0091] Figure 5 This is a diagram showing another example of the region where the moisture-proof film 11 is formed.

[0092] exist Figure 5 In the example shown, the portion of the first electrode 51 of the piezoelectric element where the piezoelectric film 52 is not stacked thereon, the portion of the piezoelectric film 52 where the second electrode 53 is not stacked thereon, the peripheral portion of the second electrode 53 corresponding to the fifth contact 7e, and the edge of the second electrode 53 are covered with the moisture-proof film 11. That is, in the area where the piezoelectric element is provided around the nozzle, the moisture-proof film 11 covers the area between the fourth contact 7d and the fifth contact 7e in an annular shape.

[0093] In the piezoelectric element 5, a portion on which the piezoelectric film 52 as a layer is not formed and a portion on which the second electrode 53 as a layer is not formed on the piezoelectric film 52 are hardly displaced when driven. Therefore, even if a portion of the first electrode 51 of the piezoelectric element 5 on which the piezoelectric film 52 as a layer is not formed and a portion of the piezoelectric film 52 on which the second electrode 53 as a layer is not formed are covered by the moisture-proof film 11, as shown in FIG. Figure 5 As shown in FIG. 1 , by increasing the rigidity of these parts, the vibration displacement of the piezoelectric element 5 is hardly reduced. Figure 5 As shown, even when only a part of the second electrode 53 is covered with the moisture-proof film 11 , it is possible to prevent the vibration displacement of the piezoelectric element 5 from being reduced, and the vibrating film 103 can be vibrated satisfactorily.

[0094] exist Figure 5, the moisture-proof film 11 covers the area extending from the fourth contact 7d to the edge of the second electrode 53 in an annular shape, and protrudes toward the nozzle side (inside) to cover the fifth contact 7e which is closer to the nozzle than the edge of the second electrode 53. Therefore, there is a possibility that the piezoelectric element will be uneven with respect to the vibration load. Therefore, the portion of the piezoelectric element 5 corresponding to the area between the fourth contact 7d and the fifth contact 7e can be covered with the moisture-proof film 11 in an annular shape, so that the moisture-proof film 11 covering the piezoelectric element does not have a portion protruding toward the nozzle side. As a result, the piezoelectric element 5 is evenly covered with the moisture-proof film 11 around the nozzle 2, and the load on the vibration caused by the moisture-proof film 11 can be made uniform.

[0095] Figure 6 This is a diagram showing another example of the region where the moisture-proof film 11 is formed.

[0096] exist Figure 6 In the example shown, the vibration membrane 103 is covered with the moisture-proof film 11 except for the vibration region 103a. The vibration region 103a of the vibration membrane 103 is a part of the vibration membrane 103 that forms the bottom surface of the pressurized chamber 4. The above-mentioned vibration region 103a is covered with the moisture-proof film 11 only around the first lead 9a and the second lead 9b that cross the vibration region. As described above, the vibration region 103a of the vibration membrane 103 is only partially covered by the moisture-proof film 11 (only the first lead 9a and the second lead 9b are covered by the moisture-proof film 11). Therefore, compared with the structure in which the entire vibration region 103a is covered with the moisture-proof film 11, the elastic modulus of the vibration region 103a can be reduced. As a result, the vibration region 103a can be easily vibrated by the displacement of the piezoelectric element 5. Therefore, compared with the structure in which the entire vibration region 103a is covered with the moisture-proof film 11, the vibration efficiency can be improved.

[0097] In addition, Figure 6 In the structure shown, the portion of the piezoelectric element 5 corresponding to the region between the fourth contact 7d and the fifth contact 7e may be covered with the moisture-proof film 11 in an annular shape, and the moisture-proof film 11 may be used to uniformly apply the load on vibration.

[0098] Each of the first electrode 51 and the second electrode 53 may be provided with a lead portion to allow the first electrode 51 and the second electrode 53 to be directly electrically connected to the wiring portion 102 via a contact portion opened at the vibration film.

[0099] In addition, a close contact improving film for ensuring close contact with the nozzle forming portion 111 may be formed on the moisture-proof film 11 .

[0100] In addition, in the case where the inner circumference of the pressurized chamber 4 and the nozzle 2 is corroded by liquid, a liquid-resistant protective film may be provided on the inner circumference of the pressurized chamber 4 and the nozzle 2. As the protective film, metal oxides that have reached a passivation state can be cited. As metals of the metal oxide, tantalum (Ta), niobium (Nb), titanium (Ti), zirconium (Zr), hafnium (Hf), tungsten (W), etc. with flexible oxidation numbers can be used. It is particularly preferred to use Zr or Hf having the same valence as silicon dioxide (SiO2), or to use Ta having a valence close to that of Zr or Hf.

[0101] In addition, the protective film is preferably lyophilic. In the case of using a lyophilic protective film, when the pressurized chamber 4 is filled with liquid, the liquid easily diffuses on the inner circumference of the pressurized chamber 4 and the nozzle 2 to wet the inner circumference of the pressurized chamber 4 and the nozzle 2. As a result, the filling property of the liquid can be improved. In the case where the solvent of the liquid is an aqueous solvent, a mixture of metal oxide and silicon dioxide (SiO2) mixed at the molecular level can be used. By replacing the O of SiO2 on the surface of the protective film with a hydrophilic OH group, the protective film can be made hydrophilic.

[0102] The liquid filling the liquid discharge head enters the nozzle 2 and forms a meniscus in the nozzle. When a predetermined driving waveform (voltage) is applied to each electrode of the piezoelectric element 5, the piezoelectric film 52 vibrates and the vibrating film 103 moves. Figure 3 The vibration of the vibrating membrane 103 causes a change in the pressure of the liquid in the pressurizing chamber. As a result, the liquid is discharged from the nozzle 2.

[0103] Next, a method of manufacturing the liquid discharge head according to the present embodiment will be described.

[0104] Figures 7 to 16 1 is a cross-sectional view showing a cross section perpendicular to the arrangement direction of the nozzles 2, and is used to explain the manufacturing process of the liquid discharge head of this embodiment.

[0105] First, if Figure 7 As shown, a driving circuit 101 including transistors and resistors and a wiring portion 102 are formed on a silicon film of a flow path substrate 100 which is a silicon on insulator (SOI) substrate. When the driving circuit 101 is not included in the flow path substrate 100, an SI substrate may be used as the flow path substrate 100.

[0106] Next, a vibration film 103 is formed on the surface of the flow path substrate 100 on which the drive circuit 101 and the wiring section 102 are formed. As a material for the vibration film 103, SiO2, SiN, metal oxides, resins, etc. can be used as long as they are materials that have at least insulating properties. However, in order to increase displacement, a material with a low Young's modulus is preferred. In addition, considering the difference in linear expansion coefficient with the flow path substrate 100, SiO2 (silicon dioxide) having a relatively small difference is most preferably used as the material for the vibration film 103.

[0107] Then, if Figure 8 As shown, a first electrode layer 151, a piezoelectric layer 152, and a second electrode layer 153 are formed as films on the vibration film 103. The first electrode layer 151 and the second electrode layer 153 are preferably made of a metal with low resistance and low reactivity, preferably Ir, Mo, or the like.

[0108] As the piezoelectric material forming the piezoelectric layer 152, when the drive circuit 101 and the wiring portion 102 are assembled into the flow path substrate 100 to increase the density as in the present embodiment, a piezoelectric material having a film forming temperature of 450° C. or less is preferably used to prevent the piezoelectric material from being damaged. Examples of the piezoelectric material having a film forming temperature of 450° C. or less include aluminum nitride (AlN) and the like.

[0109] By using AlN as the piezoelectric material, the crystal orientation of the piezoelectric film 52 can be made uniform, and the piezoelectric characteristics can be improved. However, in order to control the orientation, an orientation control layer needs to be provided between the vibration film 103 and the first electrode 51. When the piezoelectric material of the piezoelectric film 52 is AlN, by using AlN as the orientation control layer, the lattice constant of the first electrode 51 composed of Mo can be made close to the lattice constant of AlN. As a result, the crystal orientation of the piezoelectric film 52 can be made uniform, and the piezoelectric characteristics can be improved.

[0110] The first electrode layer 151 and the second electrode layer 153 are usually formed by sputtering. Sputtering and sol-gel methods can be used to form the piezoelectric layer 152, but the latter is not suitable for forming the flow path substrate 100 including the drive circuit 101 and the wiring portion 102 due to the high film formation temperature. Therefore, it is also desirable to form the piezoelectric layer 152 by sputtering.

[0111] After forming the first electrode layer 151, the piezoelectric layer 152 and the second electrode layer 153, as shown in FIG. Fig. 9As shown, they are molded into appropriate shapes to obtain a piezoelectric element 5 including a first electrode 51, a piezoelectric film 52, and a second electrode 53. By processing the first electrode layer 151, the piezoelectric layer 152, and the second electrode layer 153 by photolithography and etching, the first electrode 51, the piezoelectric film 52, and the second electrode 53 having a desired shape can be easily obtained. Etching includes wet etching and dry etching, and the latter is preferred because corrosion of the first electrode 51, the second electrode 53, and the piezoelectric film 52 can be reduced. After dry etching, residues are caused by processing, and therefore, a cleaning step can be performed after molding to remove the residues.

[0112] After the first electrode 51, the piezoelectric film 52 and the second electrode 53 are formed, Fig. 9 As shown, the insulating film 8 is formed by film formation and etching. The insulating film 8 is desired to have the same insulating properties as the vibration film 103, a small Young's modulus, and a linear expansion coefficient close to that of the element, and therefore, SiO2, which is the same as the vibration film 103, is preferably used.

[0113] After forming the insulating film 8, as Fig.10 As shown, hole-shaped first to fifth contacts 7a to 7e are formed on the vibration film 103 and the insulating film 8 by photolithography and etching. The first to third contacts 7a to 7c are formed on the vibration film 103, and the nozzle forming hole 103b for forming the nozzle 2 is formed. It is preferable that the nozzle forming hole 103b is processed simultaneously with the first to third contacts 7a to 7c because subsequent processing can be easily performed.

[0114] Then, if Fig.11 As shown, the first lead 9a, the second lead 9b and the electrical connection pad 6 are formed. The materials of the first lead 9a, the second lead 9b and the electrical connection pad 6 are generally Al or AlCu alloy. At this time, the first lead 9a is electrically connected to the first electrode 51 through the fourth contact 7d, and is electrically connected to the wiring portion 102 through the first contact 7a. The second lead 9b is electrically connected to the second electrode 53 through the fifth contact 7e, and is electrically connected to the wiring portion 102 through the second contact 7b. The electrical connection pad 6 is electrically connected through the third contact 7c.

[0115] Then, if Fig.12 As shown, a moisture-proof film 11 is formed, and then, photolithography and etching are performed, as shown in FIG. Fig.13 As shown, a moisture-proof film 11 is formed to cover the first lead 9a, the second lead 9b, the fourth contact 7d, and the fifth contact 7e.

[0116] Through the above steps, the piezoelectric element 5 can be driven.

[0117] Then, if Fig.14As shown in FIG. 1 , a nozzle forming portion 111 for forming a nozzle is formed. The nozzle forming portion 111 is formed by spin coating. As a material for the nozzle forming portion 111, it is desirable to use a resin that can be applied by spin coating, and from the viewpoint of chemical resistance, it is desirable to use SU8 and benzocyclobutene (BCB). Next, as Fig.15 As shown, the nozzle 2 and the pad opening 10 are formed by etching, and the etching of the nozzle 2 and the pad opening 10 is dry etching.

[0118] Then, if Fig.16 As shown, the flow path substrate 100 is processed by Si etching to form a plurality of pressurized chambers 4 having a circular hole shape. In order to improve the discharge efficiency and reduce the crosstalk, the pressurized chamber 4 needs to increase the aspect ratio of the cross section (increase the liquid chamber depth relative to the liquid chamber diameter). Therefore, in this embodiment, the pressurized chamber 4 is formed by deep reactive ion etching (DRIE). In this DRIE, CF-based gases such as CF4 and C4F8 or SF-based gases such as SF6 are used as etching gases.

[0119] Thereafter, the frame member 120 in which the common chamber 3 is formed is bonded to the back surface of the fluid channel substrate 100 , thereby completing the liquid discharge head 1 .

[0120] In a nozzle vibration type liquid discharge head, the accuracy of the positional relationship between the flow path substrate 100 and the actuator 110 having a nozzle greatly affects the discharge characteristics. Therefore, it is necessary to ensure high dimensional accuracy during manufacturing. Therefore, in the case of joining the actuator 110 having a nozzle to the flow path substrate 100 having a pressurized chamber 4 to form a liquid discharge head, it is necessary to perform a high-precision joining process. In contrast, in the present embodiment, a film of a material constituting the actuator 110 is sequentially formed on the flow path substrate 100, and a prescribed process is performed. As a result, the actuator 110 is directly formed on the flow path substrate 100. This eliminates the need for a high-precision joining process, making it possible to easily form a liquid discharge head.

[0121] like Fig.17 As shown, the wiring portion 102 of the flow path substrate 100 may be extended to the end of the side surface of the liquid discharge head 1, and the end of the wiring portion 102 may be electrically connected to the electrical connection pad 6 for connecting to an external power supply or other electrical components. Fig.18 and Fig.19 As shown, the structure without the wiring section 102 and the drive circuit 101 may be adopted. Fig.18 This is a diagram showing an example in which the electrical connection pad 6 is formed by exposing one end of the first lead 9a and the second lead 9b to the outside. Fig.19 This is a diagram showing an example in which a lead wire is extended to the side end of the liquid discharge head 1 , and the end of the lead wire is electrically connected to the electrical connection pad 6 .

[0122] Next, we will refer to Fig. 20 and Fig.21 An example of the liquid discharge apparatus according to the present embodiment is described.

[0123] Fig. 20 : is an explanatory diagram schematically showing a printer as an inkjet recording apparatus serving as a liquid discharge apparatus of the present embodiment.

[0124] Fig.21 This is an explanatory diagram showing a top view of an example of a head device of the printer according to the present embodiment.

[0125] The printer 500 as a liquid discharge device includes: a supplier 501 that supplies a continuous medium 510, a guide conveyor 503 that guides and conveys the continuous medium 510 supplied from the supplier 501 to a printing unit 505, a printing unit 505 that performs printing to discharge liquid onto the continuous medium 510 and form an image, a dryer 507 that dries the continuous medium 510, and a discharger 509 that discharges the continuous medium 510.

[0126] The continuous medium 510 is supplied from the winding roller 511 of the feeder 501, guided and conveyed by the feeder 501, the guide conveyor 503, the dryer 507, and the rollers of the discharger 509, and wound around the winding roller 591 of the discharger 509. In the printing unit 505, the continuous medium 510 is conveyed on the conveyance guide 559 so as to face the head device 550, and liquid is ejected from the head device 550 to form an image on the continuous medium 510.

[0127] In the printer 500 of the present embodiment, the head device 550 includes the two head modules 100A and 100B of the present embodiment described above, which are provided on a common base 552 .

[0128] When the arrangement direction of the liquid discharge heads 1 in the direction orthogonal to the conveying direction of the head modules 100A and 100B is set as the head arrangement direction, the liquid of the same color is discharged by the head arrays 1A1 and 1A2 of the head module 100A. Similarly, the head arrays 1B1 and 1B2 of the head module 100A are set as a group, and the liquid of the same desired color is discharged. The head arrays 1C1 and 1C2 of the head module 100B are set as a group, and the liquid of the same desired color is discharged. The head arrays 1D1 and 1D2 of the head module 100B are set as a group, and the liquid of the same desired color is discharged.

[0129] Next, refer to Fig. 22 and 23 Another example of a printer as a liquid discharge apparatus according to the present embodiment is described.

[0130] Fig. 22 It is a top view explanatory diagram of the main parts of the printer of this embodiment.

[0131] Fig.23 This is a side view for explaining the main parts of the printer of this embodiment.

[0132] The printer 500 of this embodiment is a serial print head device, and the carriage 403 is reciprocated in the main scanning direction by the main scanning moving unit 493. The main scanning moving unit 493 includes a guide rail 401, a main scanning motor 405, a timing belt 408, etc. The guide rail 401 is connected between the left side plate 491A and the right side plate 491B to movably hold the carriage 403. The main scanning motor 405 reciprocates the carriage 403 in the main scanning direction through the timing belt 408 connected between the driving pulley 406 and the driven pulley 407.

[0133] The liquid discharge device 440 in which the liquid discharge head 1 and the head tank 441 are integrated according to the present invention is mounted on the carriage 403. The liquid discharge head 1 discharges liquids of various colors such as yellow (Y), cyan (C), magenta (M), and black (K). The liquid discharge head 1 includes a nozzle array including a plurality of nozzles arranged in a sub-scanning direction orthogonal to the main scanning direction, and the liquid discharge head 1 is mounted on the carriage 403 so as to discharge ink droplets downward. The liquid discharge head 1 is connected to a liquid circulation device, and circulates and supplies liquid of a desired color.

[0134] The printer 500 includes a conveyor 495 for conveying paper 410. The conveyor 495 includes a conveyor belt 412 as a conveyor and a sub-scanning motor 416 for driving the conveyor belt 412. The conveyor belt 412 attracts the paper 410 and conveys the paper 410 to a position facing the liquid discharge head 1. The conveyor belt 412 is an endless belt stretched between a conveyor roller 413 and a tension roller 414, and the attraction of the paper 410 to the conveyor belt 412 can be applied by electrostatic attraction, air suction, etc. The conveyor belt 412 rotates in the sub-scanning direction. The conveyor roller 413 is rotationally driven by the sub-scanning motor 416 through a synchronous belt 417 and a synchronous pulley 418.

[0135] A maintenance unit 420 for keeping the liquid discharge head 1 in good condition is provided on one side of the main scanning direction of the carriage 403, on the side of the conveyor belt 412. The maintenance unit 420 includes, for example, a cap 421 for covering the nozzle surface of the liquid discharge head 1 and a wiper 422 for wiping the nozzle surface. The main scanning moving unit 493, the maintenance unit 420, and the conveyor belt 495 are mounted on a housing having a left side plate 491A, a right side plate 491B, and a back plate 491C.

[0136] In the printer 500 of this structure, the paper 410 is supplied to the conveyor belt 412 and attracted, and the paper 410 is conveyed in the sub-scanning direction by the rotation of the conveyor belt 412. When the slide 403 moves in the main scanning direction, the liquid discharge head 1 is driven according to the image signal to discharge liquid to the stopped paper 410, thereby forming an image on the paper 410.

[0137] Next, refer to Fig.24 Another example of the liquid discharge device according to the present embodiment is described.

[0138] Fig.24 It is a schematic plan view of the main part of the liquid discharge device of this embodiment.

[0139] The liquid discharge device 440 includes the components included in the above-mentioned liquid discharge apparatus, namely, a housing, a main scanning moving unit 493, a carriage 403, and a liquid discharge head 1. The housing includes a left side plate 491A, a right side plate 491B, and a back plate 491C.

[0140] In addition, in the liquid discharge device 440, the maintenance unit 420 may be mounted on the right side plate 491B, for example.

[0141] Next, refer to Fig.25 Another example of the liquid discharge device according to the present embodiment is described.

[0142] Fig.25 It is a front explanatory diagram of the liquid discharge device according to this embodiment.

[0143] The liquid discharge device 440 includes the liquid discharge head 1 to which a flow path portion 444 is attached, and a tube 456 connected to the flow path portion 444 .

[0144] The liquid discharge device 440 may include a head tank 441 instead of the flow path member 444 disposed inside the cover 442. A connector 443 electrically connected to the liquid discharge head 1 is provided on the upper portion of the flow path member 444.

[0145] In this embodiment, the discharge liquid is not limited to a specific liquid as long as it has a viscosity or surface tension that can be discharged from the head (liquid discharge head), but the viscosity of the liquid is preferably 30 mPa·s or less at room temperature and pressure or when heated or cooled. For example, a solution, suspension or emulsion containing a solvent such as water or an organic solvent, a colorant such as a dye or a pigment, a functional substance such as a polymerizable compound, a resin or a surfactant, a biocompatible substance such as DNA, an amino acid, a protein or calcium, or an edible substance such as a natural pigment can be used. For example, it can be used for inkjet inks, surface treatment liquids, component forming liquids for electronic devices or light-emitting devices, anti-etching pattern forming liquids for electronic circuits, raw material solutions for three-dimensional modeling, etc.

[0146] Examples of energy sources that generate energy to discharge liquid include piezoelectric actuators (laminated piezoelectric elements or thin film piezoelectric elements), thermal actuators using thermoelectric conversion elements such as heating resistors, and electrostatic actuators including a diaphragm and opposing electrodes.

[0147] The "liquid discharge device" is an assembly of components related to liquid discharge. The "liquid discharge device" refers to a structure including a head and functional components or units coupled to the head to form a single unit. For example, the "liquid discharge device" includes a combination of a liquid discharge head and at least one of a head tank, a carriage, a supply unit, a maintenance unit, a main scanning moving unit, and a liquid circulation device.

[0148] Examples of a "single unit" include a combination in which a liquid discharge head and one or more functional parts and units are fixed to each other by, for example, fastening, bonding or joining, and a combination in which one of the liquid discharge head and the functional parts and units is movably held by the other. The liquid discharge head may be detachably connected to the functional part or unit.

[0149] For example, the liquid discharge head and the head tank may form a liquid discharge device as a single unit. Or the liquid discharge head and the head tank may be combined (connected) with a tube or the like to form a liquid discharge device as a single unit. A unit including a filter may be added between the head tank and the head of the liquid discharge device.

[0150] In another example, the liquid discharge head and the carriage may form a liquid discharge device as a single unit.

[0151] In another embodiment, the liquid discharge device includes a liquid discharge head movably held by a guide, the guide forming a part of a main scanning moving unit, so that the liquid discharge head and the main scanning moving unit form a single unit. The liquid discharge device may include a head, a carriage and a main scanning moving unit forming a single unit.

[0152] In yet another example, a cover forming a part of the maintenance unit may be fixed to a carriage on which the liquid discharge head is mounted, so that the liquid discharge head, the carriage, and the maintenance unit form a single unit to form the liquid discharge apparatus.

[0153] In another embodiment, the liquid discharge device includes a tube connected to a liquid discharge head mounted with a head tank or a flow path member, so that the liquid discharge head and the supply unit form a single unit. Liquid in a liquid storage source such as an ink cartridge is supplied to the liquid discharge head through the tube.

[0154] The main scanning moving unit may be only a guide unit. The supply unit may be only a tube or only a loading unit.

[0155] The “liquid discharge device” includes a head module having the above-mentioned liquid discharge head, and a head device that combines the above-mentioned functional components and units into a single unit.

[0156] The term "liquid discharge device" used herein also refers to a device including a liquid discharge head, a liquid discharge device, a head module, a head device, which discharges liquid by driving the head. The liquid discharge device can be, for example, a device capable of discharging liquid to a material to which the liquid can adhere, or a device capable of discharging liquid into a gas or a liquid.

[0157] The "liquid discharge device" may include a unit for supplying, conveying and spraying a material to which the liquid can adhere. The liquid discharge device may also include a pre-treatment device for applying the treatment liquid to the material, and a post-treatment device for applying the treatment liquid to the material, wherein the liquid has been discharged to the material.

[0158] The “liquid discharge device” may be, for example, an imaging device that forms an image on a sheet by discharging ink, or a three-dimensional modeling device that discharges modeling liquid into a powder layer in which a powder material is formed into multiple layers to form a three-dimensional modeled object.

[0159] The "liquid discharge device" is not limited to a device that discharges liquid to visualize a meaningful image such as letters or figures. For example, the liquid discharge device also includes a device for forming a pattern that itself has no meaning, or a device for making a three-dimensional image.

[0160] The above-mentioned "liquid-adhesive material" refers to a material to which liquid can at least temporarily adhere, and refers to a material to which liquid adheres and solidifies, a material to which liquid adheres and permeates, etc. Examples of the "liquid-adhesive material" include paper, recording paper, recording paper, film, cloth and other recording media, electronic substrates, piezoelectric elements and other electronic components, powder layers, organ models, inspection units and other media, and include all materials to which liquid adheres unless otherwise specified.

[0161] Examples of the above-mentioned "liquid-adhesive material" include paper, thread, fiber, cloth, leather, metal, plastic, glass, wood, ceramics, etc., including any material to which liquid can adhere even temporarily.

[0162] The "liquid discharge device" includes a device in which a liquid discharge head and a material to which liquid can be attached move relative to each other, but the liquid discharge device is not limited thereto. As specific examples, the liquid discharge device includes a serial type device that moves the liquid discharge head, a linear type device that does not move the liquid discharge head, and the like.

[0163] In addition, as "liquid discharge equipment", there are also processing liquid coating devices that coat the processing liquid on the surface of paper for the purpose of modifying the surface of the paper and discharge the processing liquid onto the paper, and jet granulation devices that granulate particles of the raw material by spraying a composite liquid obtained by dispersing the raw material in a solution through a nozzle, etc.

[0164] In the present disclosure, the terms “image formation”, “recording”, “character printing”, “image printing”, “printing”, “modeling” and the like are all synonyms.

[0165] Although an example has been described above in which the actuator of the present embodiment is applied to a liquid discharge head, the actuator of the present embodiment may be applied to a micropump described in, for example, Japanese Unexamined Patent Application Publication No. 2012-253087 and Japanese Unexamined Patent Application Publication No. 2014-030008.

[0166] The above-described embodiments are limited examples, and the present disclosure includes, for example, the following aspects having advantageous effects.

[0167] [Aspect 1]

[0168] The actuator 110 includes: a vibration membrane 103 stacked on a substrate such as a flow path substrate 100 having a liquid chamber such as a pressurization chamber 4, the vibration membrane 103 having a portion of a wall defining the pressurization chamber; a piezoelectric element 5 located on a surface of the vibration membrane 103 opposite to a surface forming the wall of the pressurization chamber; leads 9a and 9b extending from the piezoelectric element 5 to supply power to the piezoelectric element 5; and a moisture-proof film 11 covering the leads 9a and 9b and a portion of the piezoelectric element 5 overlapping with the leads.

[0169] Generally speaking, a moisture-proof film formed of a material such as silicon nitride is a dense and hard film. Therefore, when the entire surface of the piezoelectric element is covered with the moisture-proof film, there is a possibility that the vibration displacement of the piezoelectric element may be reduced.

[0170] On the other hand, in the first aspect, since the moisture-proof film covers only the lead wire and part of the piezoelectric element, it is possible to prevent a reduction in the vibration displacement of the piezoelectric element compared to a case where the entire piezoelectric element is covered with the moisture-proof film.

[0171] [Aspect 2]

[0172] In aspect 1, the piezoelectric element 5 is covered with the moisture-proof film 11 only around the leads 9a and 9b and around the connecting portions of the piezoelectric element 5 and the leads 9a and 9b such as the contacts 7d and 7e.

[0173] According to this aspect, as referenced Figure 4 As described above, the area of ​​the piezoelectric element 5 covered by the moisture-proof film 11 can be minimized, and the vibration displacement of the piezoelectric element 5 can be prevented from being reduced by the moisture-proof film 11 .

[0174] [Aspect 3]

[0175] In aspect 1, the piezoelectric element 5 includes: a first electrode 51, which is formed in a layer on the surface opposite to the surface of the vibration membrane 103 which forms the wall of a liquid chamber such as a pressurization chamber; a piezoelectric portion, such as a piezoelectric film 52, which is formed in a layer on the first electrode 51; and a second electrode 53, which is formed in a layer on the piezoelectric portion, and at least the second electrode 53 is only partially covered by the moisture-proof film 11.

[0176] According to this aspect, as referenced Figure 5 As described above, in the piezoelectric element 5, in the first electrode 51, the portion where the piezoelectric portion such as the piezoelectric film 52 is not stacked and the portion where the second electrode 53 is not stacked, hardly displaces during driving. Therefore, even when only the second electrode 53 is partially covered by the moisture-proof film 11, the vibration displacement of the piezoelectric element 5 can be prevented from being reduced, and the vibration film 103 can be vibrated well.

[0177] [Aspect 4]

[0178] In any one of the first to third aspects, at least the vibration region 103 a of the vibration film 103 vibrated by the piezoelectric element 5 is covered with the moisture-proof film 11 only around the lead wires 9 a and 9 b .

[0179] According to this aspect, if Figure 6 As described above, the Young's modulus of the vibration region 103a can be reduced compared to the structure in which the entire vibration region 103a is covered with the moisture-proof film 11. As a result, the vibration region 103a can be easily vibrated by the displacement of the piezoelectric element 5. Therefore, compared to the structure in which the entire vibration region 103a is covered with the moisture-proof film 11, the vibration efficiency can be improved.

[0180] [Aspect 5]

[0181] In any one of aspects 1 to 4, the moisture-proof film 11 includes silicon (Si) nitride or an oxide of any one of tantalum (Ta), niobium (Nb), titanium (Ti), hafnium (Hf), zirconium (Zr), and tungsten (W).

[0182] According to this aspect, good moisture resistance can be obtained.

[0183] [Aspect 6]

[0184] In the liquid discharge head including the actuator 110 , the actuator according to any one of Aspects 1 to 5 is used as the actuator 110 , wherein the liquid in the pressurized chamber such as the pressurized chamber 4 is discharged from the nozzle 2 by the actuator.

[0185] According to this aspect, the liquid can be discharged from the nozzle 2 in a good manner.

[0186] [Aspect 7]

[0187] In aspect 6, the nozzle is provided in the actuator 110 .

[0188] According to this aspect, as described in the embodiment, compared with a general unimorph piezoelectric head (a liquid discharge head that ejects liquid by vibrating the surface of the pressurized chamber opposite to the surface having the nozzle), droplets can be ejected with a smaller force. Therefore, it is possible to save power on the piezoelectric element 5. In addition, the volume of the pressurized chamber can be reduced, thereby reducing the size of the head. In addition, compared with the above-mentioned general unimorph piezoelectric head, the selection of piezoelectric elements 5 can be increased. As a result, the nozzle density can be easily increased.

[0189] [Aspect 8]

[0190] In a liquid discharge apparatus including a liquid discharge head and at least one of a head tank, a carriage, a supply unit, a maintenance unit, or a main scanning movement unit, the liquid discharge head according to aspect 6 or 7 is used as the liquid discharge head.

[0191] According to this aspect, the liquid can be discharged from the nozzle 2 in a good manner.

[0192] [Aspect 9]

[0193] A liquid discharge device comprises the liquid discharge head according to aspect 6 or 7, or the liquid discharge device according to aspect 8.

[0194] According to this aspect, the liquid can be discharged from the nozzle 2 in a good manner.

[0195] [Aspect 10]

[0196] A method for manufacturing an actuator, comprising: a process of forming a vibration membrane 103 as a layer on a flow path substrate 100; a process of forming a piezoelectric element 5 on the vibration membrane 103; a process of forming leads 9a and 9b on the vibration membrane 103 to supply power to the piezoelectric element 5; and a process of forming a moisture-proof film 11 on the leads 9a and 9b and a portion of the piezoelectric element 5.

[0197] According to this aspect, it is possible to manufacture an actuator capable of preventing a decrease in the vibration displacement of the piezoelectric element 5 compared to a case where the entire piezoelectric element 5 is covered with the moisture-proof film 11 .

[0198] [Aspect 11]

[0199] An actuator comprises: a vibrating membrane on a substrate having a pressurized chamber, the vibrating membrane having a first surface defining a portion of a wall of the pressurized chamber; a piezoelectric element located on a second surface of the vibrating membrane opposite to the first surface; a lead extending from the piezoelectric element to supply power to the piezoelectric element; and a moisture-proof film covering the lead and a portion of the piezoelectric element overlapping the lead.

[0200] [Aspect 12]

[0201] In the actuator according to aspect 11, the moisture-proof film covers: the lead; a portion of the piezoelectric element; the periphery of the lead; and the periphery of the connection portion connecting the piezoelectric element to the lead.

[0202] [Aspect 13]

[0203] In the actuator according to aspect 12,

[0204] The piezoelectric element includes: a first electrode on the second surface of the vibration film; a piezoelectric portion on the first electrode; and a second electrode on the piezoelectric portion,

[0205] The connecting portion includes: a first contact on the first electrode; and a second contact on the second electrode,

[0206] The lead includes: a first lead electrically connected to the first contact of the first electrode; and a second lead electrically connected to the second contact of the second electrode,

[0207] The moisture-proof film covers: the first contact; the second contact; the first lead; the second lead; and a portion of the piezoelectric element around the first contact, the second contact, the first lead, and the second lead.

[0208] [Aspect 14]

[0209] In the actuator according to aspect 11, the vibration film has a vibration region vibrated by the piezoelectric element, and the moisture-proof film covers a portion of the vibration region around the lead wire.

[0210] [Aspect 15]

[0211] In the actuator according to aspect 11, the moisture-proof film includes a nitride of silicon (Si), or an oxide of any one metal of tantalum (Ta), niobium (Nb), titanium (Ti), hafnium (Hf), zirconium (Zr), or tungsten (W).

[0212] [Aspect 16]

[0213] A liquid discharge head comprises: an actuator according to aspect 13; a substrate having the pressurized chamber; and a nozzle connected to the pressurized chamber, wherein the actuator causes the liquid in the pressurized chamber to be discharged from the nozzle.

[0214] [Aspect 17]

[0215] In the liquid discharge head according to aspect 16, the vibration membrane has a vibration area vibrated by the piezoelectric element, and the moisture-proof film annularly covers the area between the first contact and the second contact in an area where the piezoelectric element is annularly surrounding the nozzle, in addition to the vibration area.

[0216] [Aspect 18]

[0217] In the liquid discharge head according to aspect 17, the moisture-proof film further covers a part of the vibration region around the first contact, the second contact, the first lead, and the second lead.

[0218] [Aspect 19]

[0219] In the liquid discharge head according to aspect 16, the actuator has the nozzle penetrating the vibration film.

[0220] [Aspect 20]

[0221] A liquid discharge device comprises: a liquid discharge head according to aspect 16; and at least one of the following components: a head tank for supplying liquid to the liquid discharge head; a slide for mounting the liquid discharge head; a supply unit for supplying liquid to the head tank; a maintenance unit for maintaining the liquid discharge head; or a main scanning moving unit for moving the slide.

[0222] [Aspect 21]

[0223] A method for manufacturing an actuator, the method comprising: forming a vibration membrane on a substrate; forming a piezoelectric element on the vibration membrane; forming a lead on the vibration membrane, the lead supplying power to the piezoelectric element; and forming a moisture-proof film on the lead and a portion of the piezoelectric element.

[0224] The above embodiments are illustrative and do not limit the present invention. Therefore, many additional modifications and variations are possible based on the above teachings. For example, within the scope of the present invention, the elements and / or features of the different illustrative embodiments may be combined and / or replaced with each other. Any of the above operations may be performed in various other ways, for example, in a different order than described above.

[0225] This patent application is based on and claims the benefit of priority from Japanese Patent Application No. 2022-117508 filed in the Japan Patent Office on July 22, 2022, the disclosure of which is hereby incorporated by reference in its entirety.

[0226] Reference numerals list

[0227] 1Liquid discharge head

[0228] 2 Nozzles

[0229] 3Common Room

[0230] 4Compression chamber

[0231] 5. Piezoelectric Element

[0232] 6 electrical connection pads

[0233] 7a First contact

[0234] 7b Second contact

[0235] 7c Third contact

[0236] 7d fourth contact

[0237] 7e Fifth Contact

[0238] 8 Insulation film

[0239] 9a First lead

[0240] 9b Second lead

[0241] 10 pad opening

[0242] 11 Anti-moisture film

[0243] 51 first electrode

[0244] 52 Piezoelectric film

[0245] 53 second electrode

[0246] 100 flow path substrate

[0247] 101 drive circuit

[0248] 102 Wiring Department

[0249] 103 Vibrating membrane

[0250] 103a vibration area

[0251] 103b Nozzle forming hole

[0252] 110 Actuator

[0253] 111 Nozzle forming part

[0254] 120 frame components

[0255] 403 Slide

[0256] 405 main scanning motor

[0257] 406 drive pulley

[0258] 407 driven pulley

[0259] 408 timing belt

[0260] 440 Liquid discharge device

[0261] 441 head tank

[0262] 493 Main Scanning Mobile Unit

[0263] 500 printers

[0264] 505 printing unit

[0265] 550 head device

Claims

1. An actuator, comprising: a diaphragm on a substrate having a pressurized chamber, the diaphragm having a first face defining a portion of a wall of the pressurized chamber; a piezoelectric element located on a second surface of the vibration membrane opposite to the first surface; A lead wire extending from the piezoelectric element to supply power to the piezoelectric element; as well as Moisture-proof membrane, which covers: the lead wire; and A portion of the piezoelectric element overlaps the lead.

2. The actuator according to claim 1, in, Anti-moisture film covering: the lead wire; a portion of the piezoelectric element; The periphery of the lead; and The piezoelectric element is connected to the periphery of the connection portion of the lead wire.

3. The actuator according to claim 2, in, The piezoelectric element comprises: a first electrode on the second surface of the vibrating membrane; a piezoelectric portion on the first electrode; as well as a second electrode on the piezoelectric portion, The connecting portion comprises: a first contact on the first electrode; as well as a second contact on the second electrode, The lead wire comprises: a first lead electrically connected to the first contact of the first electrode; as well as a second lead electrically connected to the second contact of the second electrode, The moisture-proof film covers: the first contact; the second contact; the first lead; the second lead; and The piezoelectric element includes a portion around the first contact, the second contact, the first lead, and the second lead.

4. The actuator according to claim 1, in, The vibration film has a vibration region vibrated by the piezoelectric element, and The moisture-proof film covers a portion of the vibration region around the lead wire.

5. The actuator according to claim 1, in, The moisture-proof film includes silicon (Si) nitride, or oxide of any one metal of tantalum (Ta), niobium (Nb), titanium (Ti), hafnium (Hf), zirconium (Zr), or tungsten (W).

6. A liquid discharge head comprising: An actuator according to claim 3; a substrate having the pressurized chamber; as well as a nozzle in communication with the pressurized chamber, The actuator causes the liquid in the pressurized chamber to be discharged from the nozzle.

7. The liquid discharge head according to claim 6, in, The vibration film has a vibration region vibrated by the piezoelectric element, and The moisture-proof film annularly covers a region between the first contact and the second contact in addition to the vibration region in a region where the piezoelectric element is annularly surrounding the nozzle.

8. The liquid discharge head according to claim 7, in, The moisture-proof film further covers a portion of the vibration region around the first contact, the second contact, the first lead, and the second lead.

9. The liquid discharge head according to claim 6, in, The actuator has the nozzle penetrating the vibration membrane.

10. A liquid discharge device comprising: The liquid discharge head according to claim 6; and At least one of the following: a head tank for supplying liquid to the liquid discharge head; a carriage for mounting the liquid discharge head; a supply unit for supplying liquid to the head tank; a maintenance unit for maintaining the liquid discharge head; or The main scanning moving unit is used to move the carriage.

11. A method for manufacturing an actuator, the method comprising: forming a vibration film on a substrate; forming a piezoelectric element on the vibration film; forming a lead wire on the vibration film, wherein the lead wire supplies power to the piezoelectric element; as well as A moisture-proof film is formed on the lead wire and a portion of the piezoelectric element.

Citation Information

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