Laser de-bonding equipment and method

Abstract

The invention discloses laser de-bonding equipment and a laser de-bonding method. The device comprises: a laser emitter; the spectroscope is used for dividing the received initial laser into first laser emitted to the focal spot analyzer and second laser emitted to the sacrificial layer of the bonding piece, and the distance from the spectroscope to the focal spot analyzer and the distance from the spectroscope to the sacrificial layer are the same; the infrared vision assembly is used for acquiring an infrared light spot pattern of the second laser on the sacrificial layer; the controller is configured to obtain the spot size of the first laser through the focal spot analyzer, and the spot size of the first laser is equal to the spot size of the second laser; initially adjusting the working distance from the laser emitting part to the sacrificial layer so as to enable the light spot of the second laser to reach the optimal size; an infrared light spot pattern of the second laser is obtained through an infrared vision assembly, and the working distance from the laser emitting part to the sacrificial layer is finely adjusted; and performing laser scanning de-bonding on the sacrificial layer in response to the condition that the laser emitting part is adjusted to the optimal working distance. According to the method, the optimal working distance of the laser emitting part can be quickly and accurately found.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a laser debonding device, a laser debonding method, and a computer-readable storage medium. Background Art

[0002] In laser debonding equipment, the laser needs to be focused and the focus must eventually fall on the sacrificial layer of the bonded part in order to modify the sacrificial layer material or cause it to thermally expand and achieve debonding. Since the power density of the laser is related to whether the sacrificial layer can reach the critical point of modification or thermal expansion, and generally speaking, the power density at the laser focus position is the largest, the laser focus needs to be accurately positioned on the sacrificial layer of the bonded part in order to achieve complete debonding of the bonded part. In the optical system of laser debonding, it is very important to adjust the working distance of the laser scanning head and find the focal position of the laser emission so that it is focused on the target sacrificial layer, which affects the final process effect.

[0003] The existing technology mainly observes the effect of the laser on the sacrificial layer of the bonded part to find the minimum focal spot method, thereby determining the optimal working distance of the laser scanning head. However, the observation method usually needs to be transferred to a microscope. For example, according to the actual process effect, the thinnest line obtained by laser scribing is observed through a microscope. This process is not only time-consuming, but also requires multiple adjustments to adjust the laser scanning head to a working distance suitable for laser debonding. However, this working distance is not accurate, that is, it is not necessarily the optimal working distance. Laser debonding at this working distance may still waste some laser energy, and multiple verifications of the process effect are required to know whether it is the optimal working distance. Therefore, it cannot meet the needs of some systems that have strict requirements on scanning accuracy and focus position.

[0004] In order to solve the above-mentioned problems existing in the prior art, the art is in urgent need of an improved laser debonding technology that can quickly and accurately adjust the laser emitting component to the optimal working distance without the need for multiple process effect verifications, thereby shortening the process time and improving process efficiency. Summary of the invention

[0005] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides a laser debonding device, a laser debonding method, and a computer-readable storage medium, which can quickly and accurately adjust the laser emitting element to the optimal working distance without the need for multiple process effect verifications, thereby shortening the process time and improving process efficiency.

[0007] Specifically, the above-mentioned laser debonding equipment provided according to the first aspect of the present invention includes: a laser emitting element, emitting an initial laser for debonding; a spectroscope, dividing the received initial laser into a first laser directed to a focal spot analyzer and a second laser directed to a sacrificial layer of a bonding element, wherein the distances from the spectroscope to the focal spot analyzer and the sacrificial layer are the same; an infrared vision component, acquiring an infrared spot image of the second laser on the sacrificial layer; and a controller, configured to: acquire a spot size of the first laser via the focal spot analyzer, wherein the spot size of the first laser is equivalent to the spot size of the second laser; preliminarily adjust the working distance from the laser emitting element to the sacrificial layer so that the spot of the second laser reaches an optimal size; acquire the infrared spot image of the second laser via the infrared vision component, fine-tune the working distance from the laser emitting element to the sacrificial layer to compensate for the error of the focal spot analyzer; and in response to the laser emitting element being adjusted to the optimal working distance, perform laser scanning debonding on the sacrificial layer.

[0008] Furthermore, in some embodiments of the present invention, the laser emitting element, the beam splitter and the bonding element are in the same straight line, and the step of initially adjusting the working distance from the laser emitting element to the sacrificial layer so that the spot of the second laser reaches an optimal size includes: moving the laser emitting element along the straight line direction to adjust the working distance from the laser emitting element to the sacrificial layer; and obtaining a first minimum size of the spot of the second laser as the optimal size through a first round of spot size variation law of the first laser in the focal spot analyzer, wherein the spot size variation law includes a process in which the spot first changes from large to small and then from small to large.

[0009] Furthermore, in some embodiments of the present invention, the step of obtaining the spot pattern of the second laser via the infrared vision component and fine-tuning the working distance from the laser emitting element to the sacrificial layer to compensate for the error of the focal spot analyzer includes: judging whether the spot of the second laser meets the process requirements of debonding based on the infrared spot pattern of the second laser obtained by the infrared vision component; in response to the laser energy of the spot of the second laser with the first minimum size being insufficient to ablate the sacrificial layer, continuing to move the laser emitting element along the straight line direction and adjusting the working distance from the laser emitting element to the sacrificial layer; and obtaining the second minimum size of the spot of the second laser as the optimal size via the second round of spot size change rule of the first laser in the focal spot analyzer, wherein the second minimum size is smaller than the first minimum size.

[0010] Furthermore, in some embodiments of the present invention, the step of determining whether the spot of the second laser meets the process requirements of debonding also includes: in response to the laser energy of the spot of the second laser of the first minimum size ablating to the device layer below the sacrificial layer, continuing to move the laser emitting element along the straight line direction, adjusting the working distance from the laser emitting element to the sacrificial layer; and obtaining the third minimum size of the spot of the second laser as the optimal size based on the third round of spot size change rule of the first laser in the focal spot analyzer, wherein the third minimum size is larger than the first minimum size.

[0011] Furthermore, in some embodiments of the present invention, the laser debonding device also includes: a moving platform on which the bonding component is placed, and the step of laser scanning the sacrificial layer for debonding in response to the laser emitting component being adjusted to an optimal working distance includes: fixing the position of the laser emitting component at the optimal working distance, in response to the bonding area on the sacrificial layer being ablated by the second laser, determining the position of the next bonding area to be ablated through the infrared spot pattern of the sacrificial layer collected by the infrared vision component; and translating the bonding component in the x-direction and / or y-direction via the moving platform so that the second laser irradiates the next bonding area.

[0012] Furthermore, in some embodiments of the present invention, after the step of laser scanning debonding the sacrificial layer in response to the laser emitting element being adjusted to the optimal working distance, in response to the completion of the laser scanning debonding, an infrared full image of the sacrificial layer is acquired via the infrared vision component to detect whether each bonding area of ​​the sacrificial layer has completed debonding; in response to the existence of at least one bonding area that has not completed debonding, the at least one bonding area is marked, and the mobile platform is moved so that the at least one bonding area is scanned by the second laser again; in response to the completion of debonding of each bonding area, the peeled device layer is transferred to the next process.

[0013] Furthermore, in some embodiments of the present invention, the laser emitting element includes: a laser for providing the initial laser; and an optical component for adjusting a transmission angle of the initial laser so as to transmit the initial laser to the beam splitter.

[0014] Furthermore, in some embodiments of the present invention, the optical component includes a collimating and expanding system, a reflecting mirror and a field lens, wherein the collimating and expanding system is used to adjust the spot size of the initial laser so that it matches the spot size of the field lens, and the reflecting mirror is used to reflect the initial laser into the field lens so that the field lens focuses the initial laser onto the bonding layer sacrificial layer.

[0015] Furthermore, in some embodiments of the present invention, the reflector is connected to a motor, and the motor is used to drive the reflector to rotate, so as to vibrate and adjust the reflection angle of the reflector, so as to fine-tune the output light path of the second laser reflected by the reflector, so as to make the second laser perform local scanning on the sacrificial layer.

[0016] Furthermore, in some embodiments of the present invention, the laser debonding device further comprises: a power meter, disposed above the reflector, for detecting a power value of a reflected light of the second laser incident on the bonding component and reflected from the surface of the bonding component.

[0017] Furthermore, in some embodiments of the present invention, the laser debonding device also includes: an infrared thermal imager, disposed above the bonding component, for obtaining a temperature distribution diagram of the sacrificial layer, and the step of performing laser scanning debonding on the sacrificial layer in response to the laser emitting component being adjusted to an optimal working distance includes: obtaining, via the power meter and the infrared thermal imager, a power value of the second laser emitted into the sacrificial layer and a temperature distribution diagram of the sacrificial layer, respectively; and in response to the presence of an abnormal temperature value in the temperature distribution diagram, adjusting the output power of the laser, and performing power monitoring of the power adjustment process via the power meter.

[0018] Furthermore, in some embodiments of the present invention, the laser debonding device also includes: a laser rangefinder, arranged at the bottom of the focal spot analyzer, for detecting the distance from the spectroscope to the focal spot analyzer and the sacrificial layer, wherein the distance from the spectroscope to the focal spot analyzer is fixed at L, the distance from the light outlet of the laser rangefinder to the spectroscope is L1, and the distance from the light outlet of the laser rangefinder to the bonding component is L2, and the thickness of the carrier layer above the bonding component is d, so that L=L1+L2+d.

[0019] Furthermore, in some embodiments of the present invention, the ratio of the first laser to the second laser after the initial laser is split by the beam splitter is in a range of 1:9 to 3:7.

[0020] Furthermore, in some embodiments of the present invention, the infrared vision component includes an infrared camera, an infrared light source and a filter, wherein the filter is located in front of the lens of the infrared camera and is used to filter out the reflected light of the second laser incident on the bonding component that is reflected via the surface of the bonding component.

[0021] In addition, the above-mentioned laser debonding method provided according to the second aspect of the present invention includes the following steps: emitting an initial laser for debonding via the laser emitting element in the above-mentioned laser debonding equipment provided by the first aspect of the present invention, wherein the initial laser is divided into two beams via the spectroscope, the first laser is emitted to a focal spot analyzer, and the second laser is emitted to a sacrificial layer of the bonding component, and the distances from the spectroscope to the focal spot analyzer and the sacrificial layer are the same; obtaining the spot size of the first laser via the focal spot analyzer, wherein the spot size of the first laser is equal to the spot size of the second laser; preliminarily adjusting the working distance from the laser emitting element to the sacrificial layer so that the spot of the second laser reaches an optimal size; obtaining an infrared spot image of the second laser via the infrared vision component, and fine-tuning the working distance from the laser emitting element to the sacrificial layer to compensate for the error of the focal spot analyzer; and in response to the laser emitting element being adjusted to the optimal working distance, performing laser scanning debonding on the sacrificial layer.

[0022] In addition, according to the third aspect of the present invention, there is also provided a computer-readable storage medium on which computer instructions are stored. When the computer instructions are executed by a processor, the above-mentioned laser debonding method provided by the second aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0024] Figure 1 A schematic structural diagram of a laser debonding device provided according to some embodiments of the present invention is shown;

[0025] Figure 2 for Figure 1 A partial enlarged view of the beam splitter, the focus analyzer and the bonding component shown;

[0026] Figure 3 A flow chart of a laser debonding method provided according to some embodiments of the present invention is shown;

[0027] Figure 4 A schematic structural diagram of a laser debonding device provided according to some other embodiments of the present invention is shown; and

[0028] Figure 5 A flow chart of a laser debonding method provided according to a specific embodiment of the present invention is shown.

[0029] Reference numerals:

[0030] 100 Laser debonding equipment;

[0031] 110 laser emitting components;

[0032] 111 Laser;

[0033] 112 Collimation and beam expansion system;

[0034] 113 reflector;

[0035] 114 Field mirror;

[0036] 120 Spectroscope;

[0037] 130 infrared vision components;

[0038] 131 infrared camera;

[0039] 1310 lens;

[0040] 132 infrared light source;

[0041] 133 Filters;

[0042] 134 Half-transparent half-reflective mirror;

[0043] 140 Focus Analyzer;

[0044] 150 Bonding parts;

[0045] 151 Sacrificial layer;

[0046] 152 Slide layer;

[0047] 153 device layer;

[0048] 160 mobile platforms;

[0049] 170 Laser rangefinder;

[0050] 210 Initial Laser;

[0051] 211 First Laser;

[0052] 212 Second Laser;

[0053] Steps S310 to S350;

[0054] 410 Power meter;

[0055] 420 infrared thermal imaging camera; and

[0056] Steps S510~S570. DETAILED DESCRIPTION

[0057] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0058] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0060] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0061] As mentioned above, the prior art mainly looks for the minimum focal spot mode by observing the effect of the laser on the sacrificial layer of the bonded parts, thereby determining the optimal working distance of the laser scanning head. However, the observation method usually needs to be transferred to a microscope. For example, according to the actual process effect, the thinnest line obtained by laser scribing is observed through a microscope. This process is not only time-consuming, but also requires multiple adjustments to adjust the laser scanning head to a working distance suitable for laser debonding. However, this working distance is not accurate, that is, it is not necessarily the optimal working distance. Laser debonding at this working distance may still waste some laser energy, and multiple verifications of the process effects are required to know whether it is the optimal working distance. Therefore, it cannot meet the needs of some systems that have strict requirements on scanning accuracy and focus position.

[0062] In order to solve the above-mentioned problems existing in the prior art, the present invention provides a laser debonding device, a laser debonding method, and a computer-readable storage medium, which can quickly and accurately adjust the laser emitting element to the optimal working distance without the need for multiple process effect verifications, thereby shortening the process time and improving process efficiency.

[0063] In some non-limiting embodiments, the laser debonding device provided in the first aspect of the present invention may be used to implement the laser debonding method provided in the second aspect of the present invention.

[0064] Specifically, in some non-limiting embodiments, the third aspect of the present invention further provides a computer-readable storage medium having computer instructions stored thereon. When the computer instructions are executed by a processor, they can be used to implement the above-mentioned laser debonding method provided by the second aspect of the present invention.

[0065] The working principle of the above-mentioned laser debonding device will be described below in conjunction with some embodiments of the laser debonding method. Those skilled in the art will understand that these embodiments of the laser debonding method are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all working modes or all functions of the laser debonding device. Similarly, the laser debonding device is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the implementation subject of each step in these laser debonding methods.

[0066] Please see Figure 1 , Figure 1 A schematic structural diagram of a laser debonding device provided according to some embodiments of the present invention is shown.

[0067] like Figure 1 As shown, in some embodiments of the present invention, the laser debonding device 100 may include a laser emitting element 110, a spectroscope 120, an infrared vision component 130, and a controller (not shown in the drawings). The laser emitting element 110 may be used to emit an initial laser for debonding. The spectroscope 120 may be used to separate the received initial laser 210 into a first laser 211 directed to a focal spot analyzer 140 and a second laser 212 directed to a sacrificial layer 151 of a bonding element 150, wherein the distances from the spectroscope 120 to the focal spot analyzer 140 and the sacrificial layer 151 are the same. The infrared vision component 130 may obtain an infrared spot image of the second laser 212 on the sacrificial layer 151.

[0068] Specifically, if Figure 1 As shown, in some embodiments, the bonding member 150 can be formed by bonding a carrier layer 152 and a device layer 153. By integrating circuits on a wafer, a chip device that can realize a specific function can be formed. With the development of technology, thicker wafer devices are difficult to meet the heat dissipation and packaging requirements of high-end chips. Therefore, in the semiconductor field, it is often necessary to thin the wafer used as a device to achieve the required thickness. When the thickness of the wafer is reduced to less than 200 microns, the ultra-thin wafer becomes fragile and prone to warping. Therefore, the device layer 153 with a relatively fragile structure can be carried by a carrier layer 152 with greater mechanical strength. Optionally, the carrier layer 152 can be carried by a glass substrate or a silicon substrate.

[0069] Continue as Figure 1As shown, the laser emitting element 110 may include a laser 111 and an optical component. The laser 111 is used to provide an initial laser 210. When the carrier layer 152 is made of a glass substrate, the laser 111 may emit an ultraviolet laser to penetrate the glass substrate, reach the sacrificial layer 151 and ablate it, and perform ultraviolet laser debonding. When the carrier layer 152 is made of a silicon substrate, the laser 111 may emit an infrared laser to penetrate the silicon substrate, reach the sacrificial layer 151 and ablate it, and perform infrared laser debonding.

[0070] The optical components in the laser emitting element 110 can be used to adjust the transmission angle of the initial laser 210 to transmit the initial laser 210 to the beam splitter 120, and then the beam splitter 120 transmits the laser beam to the sacrificial layer 151 for laser debonding.

[0071] In some optional embodiments, the optical component may further include a collimating and expanding system 112, a plurality of reflectors 113, and a field lens 114. The collimating and expanding system 112 may be used to improve the spatial divergence angle of the initial laser 210, improve the collimation of the light beam, and enable the laser beam to meet the aperture requirements of subsequent optical components. In this embodiment, the collimating and expanding system 112 may compress the divergence angle of the initial laser 210, and expand the spot size of the initial laser 210 as the beam waist radius increases, so that it matches the spot size of the field lens 114, thereby achieving the purpose of collimating and expanding the initial laser 210. The reflector 113 may be used to reflect the initial laser 210 into the field lens 114, so that the field lens 114 can focus the initial laser 210 onto the sacrificial layer 151.

[0072] Continue as Figure 1 As shown, the beam splitter 120 in the laser debonding device 100 can be a semi-transparent and semi-reflective mirror. Figure 1 As shown, optionally, the laser emitting element 110, the beam splitter 120 and the bonding element 150 can be in the same straight line, and a portion of the initial laser 210 can pass through the beam splitter 120 and be emitted to the bonding element 150 located opposite to produce an effect on the sacrificial layer 151, while another portion of the laser light is reflected at a certain angle through the beam splitter 120 to the focal spot analyzer 140, so as to obtain the size of the laser spot at this time through the focal spot analyzer 140.

[0073] For further information, see Figure 2 , Figure 2 for Figure 1 A magnified view of the area between the spectrometer, focus analyzer and bonding component is shown.

[0074] like Figure 2As shown, in some embodiments, the laser debonding device 100 further includes a laser rangefinder 170. The laser rangefinder 170 may be disposed at the bottom of the focal spot analyzer 140, and is used to detect the distance from the spectroscope 120 to the focal spot analyzer 140 and the sacrificial layer 151, wherein the distance from the spectroscope 120 to the focal spot analyzer 140 may be fixed at L, the distance from the light outlet of the laser rangefinder 170 (located at the bottom of the laser rangefinder 170) to the spectroscope 120 may be L1, and the distance from the light outlet of the laser rangefinder 170 (located at the bottom of the laser rangefinder 170) to the spectroscope 120 may be L2, and the thickness of the carrier layer may be d, so that L=L1+L2+d, and L is the distance from the actual spectroscope 120 to the focus on the sacrificial layer 151. In this embodiment, since the focal length of the field lens 114 is fixed and the addition of the beam splitter 120 does not change the focal length of the field lens 114, the introduction of the laser rangefinder 170 can ensure that the distance from the beam splitter 120 to the sacrificial layer 151 is equal to the distance from the beam splitter 120 to the focal spot analyzer 140. The spot size data of the first laser 211 detected by the focal spot analyzer 140 can be used to represent the spot size data of the second laser 212 on the sacrificial layer 151.

[0075] In some optional embodiments, the ratio of the first laser 211 and the second laser 212 after the initial laser 210 is split by the beam splitter 120 can be in the range of 1:9 to 3:7. The ratio of the first laser 211 and the second laser 212 needs to satisfy the following requirements: the first laser 211 reaching the focal spot analyzer 140 is not too weak to cause the focal spot analyzer 140 to be unable to obtain data, or is not too strong to damage the focal spot analyzer 140, and the second laser 212 reaching the sacrificial layer 151 can produce an ablation effect on the sacrificial layer 151.

[0076] Continue as Figure 1 As shown, in some embodiments, an infrared vision component 130 may be provided on the right side of the spectroscope 120, which can be mainly used to detect the effect of the second laser 212 on the sacrificial layer 151. The infrared vision component 130 may include an infrared light source 132 and an infrared camera 131, which are used to obtain infrared images using the infrared energy radiated by the object. Specifically, after the single-point effect of the second laser 212 ends, the light generated by the infrared light source 132 illuminates the position on the sacrificial layer 151 after the second laser 212 acts, and the infrared camera 131 takes a picture of the position to obtain the effect of the laser acting on the position.

[0077] Optionally, a semi-transparent and semi-reflective mirror 134 may be provided between the infrared light source 132 and the camera lens 1310, so as to reflect the infrared light emitted by the infrared light source 132 and guide it to the optical path of the lens 1310. Furthermore, the infrared vision component 130 may also include a filter 133. The filter 133 may be located in front of the lens 1310 of the infrared camera 131, and is used to filter out the reflected light of the second laser 212 incident on the bonding component 150 that is reflected by the surface of the bonding component 150 (the surface of the carrier layer 152), so as to prevent the reflected light from entering the infrared camera 131 and damaging the camera.

[0078] In an embodiment of the present invention, the controller in the laser debonding device 100 may be configured to: obtain the spot size of the first laser 211 via the focal spot analyzer 140, wherein the spot size of the first laser 211 is equal to the spot size of the second laser 212; preliminarily adjust the working distance from the laser emitting element 110 to the sacrificial layer 151 so that the spot of the second laser 212 reaches the optimal size; obtain the infrared spot image of the second laser 212 via the infrared vision component 130, fine-tune the working distance from the laser emitting element 110 to the sacrificial layer 151 to compensate for the error of the focal spot analyzer 140; and perform laser scanning debonding on the sacrificial layer 151 in response to the laser emitting element 110 being adjusted to the optimal working distance. By integrating the spot size equivalent to the second laser 212 obtained by the focal spot analyzer 140 with the spot position and size of the spot size of the second laser 212 collected by the infrared vision component 130, the time for finding the optimal working distance of the laser emitting element 110 can be shortened, and the accuracy of judging the actual laser ablation effect generated by the optimal working distance can be improved.

[0079] The following will be combined with a laser debonding method provided by the second aspect of the main body to specifically introduce the above steps performed by the controller. Figure 3 , Figure 3 A flow chart of a laser debonding method provided according to some embodiments of the present invention is shown.

[0080] like Figure 3 As shown, in some embodiments of the present invention, the laser debonding method may include the following steps: First, step S310 may be performed: emitting an initial laser for debonding via a laser emitting element in a laser debonding device.

[0081] Specifically, combined Figure 1As shown, in some embodiments, the initial laser 210 for debonding is emitted by the laser 111 in the laser emitting element 110, for example, the initial laser 210 may be an infrared laser. The initial laser 210 is transmitted to the spectroscope 120 via the transmission angle of the optical component adjuster. The initial laser 210 is divided into two beams via the spectroscope 120, wherein the first laser 211 may be reflected into the focal spot analyzer 140 for analyzing the spot size data of the laser, and the second laser 212 may be transmitted to the sacrificial layer 151 of the bonding element 150 for generating ablation on the sacrificial layer 151. In addition, the laser rangefinder 170 may be used to ensure that the distances from the spectroscope 120 to the focal spot analyzer 140 and the sacrificial layer 151 are the same.

[0082] Afterwards, continue as Figure 3 As shown, step S320 may be performed: obtaining the spot size of the first laser via a focal spot analyzer.

[0083] Specifically, combined Figure 1 As shown, since the focal length of the field lens 114 in the laser debonding device 100 is fixed, and the addition of the beam splitter 120 does not change the focal length of the field lens 114, it is ensured that the distance from the beam splitter 120 to the sacrificial layer 151 is equal to the distance from the beam splitter 120 to the focal spot analyzer 140, and the spot size data of the first laser 211 detected by the focal spot analyzer 140 can be used to represent the spot size data of the second laser 212 on the sacrificial layer 151. The spot size of the first laser 211 detected by the focal spot analyzer 140 can be equivalent to the spot size of the second laser 212 acting on the sacrificial layer 151.

[0084] Afterwards, continue as Figure 3 As shown, step S330 may be performed: preliminarily adjusting the working distance from the laser emitting element to the sacrificial layer so that the spot of the second laser reaches an optimal size.

[0085] Specifically, combined Figure 1 As shown, in some embodiments, the laser emitting element 110 can be moved in a straight line direction to adjust the working distance from the laser emitting element 110 to the sacrificial layer 151. Figure 1 In the illustrated embodiment, the laser emitting element 110 can move in the z direction to change the working distance from the laser emitting element 110 to the sacrificial layer 151. The focus analyzer 140 can obtain a series of spot size data corresponding to the first laser 211 emitted by the laser emitting element 110 at different working distances.

[0086] Subsequently, the first minimum size of the spot of the second laser 212 can be obtained as the optimal size through the first round of spot size variation of the first laser 211 in the focal spot analyzer 140, wherein the spot size variation rule may include a process in which the spot first changes from large to small and then from small to large. The smaller the laser spot, the greater the laser power density corresponding to the spot. Therefore, when the laser power emitted by the laser 111 is determined, the minimum spot size of the second laser 212 radiated to the sacrificial layer 151 can be found to obtain the maximum debonding laser power density, which is conducive to rapid ablation of the sacrificial layer 151 or modification and peeling of the sacrificial layer 151. By moving the laser emitting element 110 in the z direction and observing the process in which the spot of the first laser 211 changes from large to small and then from small to large in the focal spot analyzer 140, it is equivalent to obtaining the process in which the spot of the second laser 212 on the sacrificial layer 151 changes from large to small and then from small to large, so that the first minimum size of the spot of the second laser 212 can be determined. In the embodiment of the present invention, the working distance of the laser emitting element 110 can be preliminarily adjusted by observing the spot condition of the first laser 211 in the focal spot analyzer 140 , thereby preliminarily determining the working position of the laser emitting element 110 .

[0087] Afterwards, continue as Figure 3 As shown, step S340 may be performed: acquiring the infrared spot pattern of the second laser via the infrared vision component, and fine-tuning the working distance from the laser emitting element to the sacrificial layer to compensate for the error of the focal spot analyzer.

[0088] Specifically, due to mechanical deviations in the installation of the focus analyzer 140 component, there is a deviation between the adjusted working distance and the actual desired working position, that is, there is an error in the adjustment of the working distance, especially for some systems that have strict requirements on scanning accuracy and focus position. It will have a certain impact and cannot meet their strict system requirements. In this regard, further, in some embodiments of the present invention, an infrared vision component 130 can be added to assist the focus analyzer 140 in adjusting the working distance of the laser emitter 110. The infrared vision component 130 can be used to directly observe the effect of the second laser 212 at the target position (on the sacrificial layer 151), thereby assisting the focus analyzer 140 to quickly and accurately find the optimal working distance of the laser emitter 110.

[0089] Specifically, it can be combined Figure 1It is commonly understood that in some embodiments, based on the infrared spot diagram of the second laser 212 obtained by the infrared vision component 130, it can be determined whether the spot of the second laser 212 meets the process requirements of debonding. When the laser energy of the spot of the second laser 212 with the first minimum size shown in the infrared spot diagram is insufficient to ablate the sacrificial layer 151, the controller can control the laser emitting element 110 to continue to move in a straight line direction (such as the z direction) and adjust the working distance from the laser emitting element 110 to the sacrificial layer 151. Then, the second round of spot size change law of the first laser 211 detected by the focal spot analyzer 140 is equivalent to obtaining the second minimum size of the spot of the second laser 212 as the optimal size, wherein the second minimum size is smaller than the first minimum size. At this time, the laser energy of the spot of the second laser 212 with the second minimum size is greater than the laser energy of the spot of the second laser 212 with the second minimum size previously, and therefore can be sufficient to ablate the process requirements of the sacrificial layer 151.

[0090] When the laser energy of the spot of the second laser 212 with the first minimum size shown in the infrared spot diagram abslates the device layer 153 below the sacrificial layer 151, the controller can control the laser emitting element 110 to continue to move in a straight line direction (such as the z direction) to adjust the working distance from the laser emitting element 110 to the sacrificial layer 151. Then, the third round of spot size change of the first laser 211 detected by the focal spot analyzer 140 is equivalent to obtaining the third minimum size of the spot of the second laser 212 as the optimal size, wherein the third minimum size is greater than the first minimum size. At this time, the laser energy of the spot of the second laser 212 with the third minimum size is slightly lower than the laser energy of the spot of the second laser 212 with the first minimum size previously, so the process requirement of ablating only the sacrificial layer 151 without damaging the device layer 153 can be achieved.

[0091] When the laser emitting element 110 completes a movement in the z direction, a series of spot size data and its corresponding position information of the laser emitting element 110 in a certain z direction and the infrared spot image information of the sacrificial layer 151 can be obtained. The controller can obtain the optimal working position of the laser emitting element 110 by analyzing the spot size data, and the infrared spot image captured by the infrared vision component 130 can be used to compensate for the mechanical installation error of the focal spot analyzer 140.

[0092] In the above embodiment, by analyzing the infrared vision component 130, the actual effect of the second laser 212 on the sacrificial layer 151 of the bonding component 150 when the laser emitting component 110 is located can be obtained, so as to determine whether it meets the actual process requirements, and then make fine adjustments. In this way, it is possible to more accurately determine whether the current working position of the laser emitting component 110 is at the optimal working distance, reduce the error caused by the deviation generated in the actual installation of the focal spot analyzer 140, and ultimately fail to achieve the best process effect, so that the adjustment effect of the laser emitting component 110 is better.

[0093] Finally, continue as Figure 3 As shown, step S350 may be performed: in response to the laser emitting element being adjusted to an optimal working distance, laser scanning debonding is performed on the sacrificial layer.

[0094] Specifically, combined Figure 1 As shown, in some embodiments, the laser debonding device 100 may further include a moving platform 160, on which the bonding member 150 may be placed. When the infrared vision component 130 is used to assist the focal spot analyzer 140 to jointly adjust the working distance of the laser emitting member 110 to the optimal working distance, the working position of the optimal working distance where the laser emitting member 110 is located is fixed, and in response to a bonding area on the sacrificial layer 151 being ablated by the second laser 212, the infrared spot image of the sacrificial layer 151 collected by the infrared vision component 130 can determine the position of the next bonding area to be ablated. Then, the controller can control the moving platform 160 to translate the bonding member 150 in the x-direction and / or y-direction, so that the second laser 212 can irradiate the next bonding area to ablate the next bonding area in the sacrificial layer 151. Optionally, the moving distance of the bond component 150 carried by the moving platform is preferably greater than the diameter of the spot focused by the second laser 212 , so that another set of spot data and an infrared spot diagram of the sacrificial layer 151 can be obtained.

[0095] For further information, see Figure 4 , Figure 4 A schematic structural diagram of a laser debonding device provided according to some other embodiments of the present invention is shown.

[0096] like Figure 4As shown, in other embodiments of the present invention, after the above step S350 is executed, the infrared camera 131 can also obtain an infrared full image of the sacrificial layer 151 in the entire bonding part 150 through the illumination of the infrared light source 132, so as to detect whether each bonding area of ​​the sacrificial layer 151 has completed debonding. When there is at least one bonding area that has not completed debonding, that is, there is at least one bonding area where the sacrificial layer 151 has not been completely destroyed, the controller can mark this bonding area and move the mobile platform 160 so that this bonding area is scanned and ablated by the second laser 212 again. Until each bonding area in the sacrificial layer 151 in the bonding part 150 has completed debonding, the stripped device layer 153 can be transferred to the next process.

[0097] Further, continue back to Figure 1 As shown, in some preferred embodiments, several reflectors 113 in the laser emitting element 11 can be connected to a motor (not shown in the drawings) to form a galvanometer assembly. The reflector 113 is driven to rotate by a motor to adjust the reflection angle of the reflector 113 by vibration, so that the scanning path of the galvanometer can be planned, and the outgoing optical path of the second laser 212 reflected by it can be fine-tuned. The above steps are performed to make the second laser 212 perform a local scan on the sacrificial layer 151. Compared with the above-mentioned method of fine-tuning the position of the bonding component 150 by the moving platform 160 so that the sacrificial layer 151 of a certain bonding area that is not completely destroyed in the sacrificial layer 151 is irradiated again, the movement speed of the galvanometer assembly is faster. Therefore, the use of the galvanometer structure in this preferred embodiment can reduce the scanning radiation time of the debonding, speed up the time of the local scanning debonding, and thus improve the efficiency of the debonding.

[0098] In addition, please continue to Figure 4 As shown, in some preferred embodiments of the present invention, the laser debonding device 100 may further include a power meter 410. The power meter 410 may be disposed above the reflector 113, and may be used to detect the power value of the reflected light of the second laser 212 incident on the bonding component 150 and reflected from the surface of the bonding component 150.

[0099] Alternatively, if Figure 4 As shown, the laser debonding device 100 may further include an infrared thermal imager 420 , which may be disposed above the bonding component 150 to obtain a temperature distribution diagram of the sacrificial layer 151 , thereby feeding back temperature changes on the sacrificial layer 151 during the laser scanning process.

[0100] Furthermore, during the execution of step S350, the power value of the second laser 212 injected into the sacrificial layer 151 and the temperature distribution diagram of the sacrificial layer 151 can be obtained respectively through the power meter 410 and the infrared thermal imager 420. When there is an abnormal temperature value in the temperature distribution diagram, the controller can adjust the output power of the laser 111, and perform real-time power monitoring of the power adjustment process through the power meter 410, so as to achieve uniform temperature change on the sacrificial layer 151 during the debonding process and improve the processing quality.

[0101] Specifically, if Figure 4 As described above, the second laser 212 scans the surface of the bonding part 150, and the temperature change of the surface of the bonding part 150 (that is, the temperature change of the sacrificial layer 151) during the scanning debonding process can be monitored by the infrared thermal imager 420. The second laser 212 is reflected on the upper surface of the bonding part 150, and the reflected light returns along the original path. After passing through the lens of the reflector 113, it is received by the power meter 410, so that the power value can be detected, reflecting the power state of the laser 111 at this time. In combination with the feedback of the infrared thermal imager 420, it can be understood whether the power of the laser 111 has reached the optimal process state at this time. Once the infrared thermal imager 420 monitors the abnormal temperature change on the surface of the sacrificial layer 151, the abnormal temperature can be reflected in real time on the power meter 410, so that the output power of the laser 111 can be adjusted in real time and accurately, so that in the debonding work, it can be ensured that the bonding part 150 will not be damaged due to the excessive power of the laser 111, or the debonding effect will not be achieved due to insufficient power.

[0102] In the above-mentioned multiple embodiments provided by the present invention, by adding the infrared vision component 130, it is possible to observe the laser focal spot while collecting the image of the target sacrificial layer 151 after the laser action, so as to intuitively and directly determine whether the sacrificial layer 151 has achieved the target process effect, and the infrared vision component 130 can also synchronize the auxiliary light spot information to determine whether the working distance of the laser emitting element 110 is in the optimal working position. Therefore, with the infrared vision component 130, the result of adjusting the working distance of the laser emitting element 110 can be made more accurate.

[0103] Next, a specific embodiment will be cited to fully introduce the entire process of the above-mentioned laser debonding method. Figure 5 As shown, Figure 5 A flow chart of a laser debonding method provided according to a specific embodiment of the present invention is shown.

[0104] Combination Figure 1 and Figure 5As shown, in a specific embodiment, the laser emitting element 110 can specifically use a laser scanning head. As shown in step S510, the laser 111 in the laser scanning head can emit the debonded infrared initial laser 210. Then, step S520 is performed, and the infrared initial laser 210 passes through the optical component in the laser scanning head assembly and is emitted to the spectroscope 120, and is divided into 10% of reflected light and 90% of transmitted light at the spectroscope 120, wherein 10% of the reflected light is the first laser 211 emitted to the focal spot analyzer 140, and 90% of the transmitted light is emitted to the sacrificial layer 151 as the second laser 212. In step S531, the focal spot analyzer 140 can analyze and obtain the spot size of the reflected light first laser 211. In step S532, the transmitted light second laser 212 can be focused on the sacrificial layer 151, and at the same time, a destructive effect such as ablation or modification is produced on the sacrificial layer 151. Afterwards, in step S540, the image of the bonding part 150 at this time can be captured by the infrared camera 131 in the infrared vision component 130. It can be understood that the image of the bonding part 150 is also the infrared spot pattern of the sacrificial layer 151, and the upper carrier layer 152 and the device layer 153 in the bonding part 150 are both selected wafers.

[0105] Afterwards, step S550 can be performed, by moving the laser scanning head in the z-axis direction and synchronously cooperating with moving the mobile platform 160 in the x-axis direction, wherein a laser scanning head at a z-axis position and a (x, y) coordinate point position in the bonding part 150 can obtain a focus data and an infrared spot map of the sacrificial layer 151, and different (x, y) coordinate point positions in the bonding part 150 corresponding to the laser scanning head at the same z-axis position can obtain a set of focus data and infrared spot map. And moving the mobile platform 160 in the x-axis or y-axis direction can obtain another set of focus data and infrared spot map. For example, the laser scanning head can be moved in the z-axis direction within a 4mm stroke, each time moving 200um, and the mobile platform can move 500um (greater than the diameter of the spot) in the x-axis direction. Then, after one scanning action is completed, 20 sets of spot data can be generated within the moving range of the z-axis.

[0106] In step S560, the working position of the laser scanning head can be found by analyzing the data of the focal spot analyzer 140. Specifically, the 20 sets of spot data corresponding to different positions of the laser scanning head on the z-axis obtained by the focal spot analyzer 140 can be analyzed to see whether there is a rule that the spot size changes from large to small and then from small to large within a range of 3 mm. On the basis that the change of the spot size conforms to this rule, the z-axis working position of the laser scanning head corresponding to the minimum spot can be found.

[0107] Finally, step S570 can be executed to compare the infrared spot diagram captured by the infrared camera 131 when the laser scanning head is at this z-axis position to see whether the process requirements are met, that is, the laser energy of the debonding laser irradiated on the sacrificial layer is sufficient to destroy the sacrificial layer 151, while not destroying the device layer 153 located below the sacrificial layer 151. In addition, the position of the laser irradiation can be intuitively obtained through the infrared spot diagram. If the position of the laser scanning head at this time meets the process requirements, the position of the laser scanning head can be fixed. If not, the z-axis position can be readjusted to compensate for the error of the focal spot analyzer 140.

[0108] In this embodiment, the deviation caused by the actual installation of the focus analyzer 140 may cause the deviation data of the laser scanning head in the z-axis direction. For example, the focus analyzer 140 data may show that z 1 is the position where the focal spot (i.e., the light spot) is the smallest. However, by comparing the image captured by the infrared camera 131 at this position, it is found that z 1 If the process effect produced by the laser scanning head at the position is not ideal, the z-axis position of the laser scanning head with an ideal process effect can be found from the infrared spot image captured by the infrared camera 131, and the laser scanning head is fixed at this position for subsequent laser scanning debonding. In other words, the working position of the laser scanning head corresponding to the smallest focus can be found through the focus spot analyzer 140, and the infrared image analysis obtained by the infrared vision component 130 can obtain the working position of the laser scanning head when the debonding effect is the best, that is, the optimal working distance.

[0109] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0110] Those skilled in the art will further appreciate that the steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be directly embodied in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0111] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0112] In summary, the present invention provides a laser debonding device, a laser debonding method, and a computer-readable storage medium, which can quickly and accurately adjust the laser emitting element to the optimal working distance without the need for multiple process effect verifications, thereby shortening the process time and improving process efficiency.

[0113] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A laser debonding device, characterized in that: include: A laser emitting component, emitting an initial laser for debonding; A beam splitter, which splits the received initial laser into a first laser directed to a focal spot analyzer and a second laser directed to a sacrificial layer of a bonding component, wherein the distance from the beam splitter to the focal spot analyzer and the sacrificial layer is the same; an infrared vision component, which acquires an infrared spot pattern of the second laser on the sacrificial layer; and The controller is configured to: obtain the spot size of the first laser via the focal spot analyzer, wherein the spot size of the first laser is equal to the spot size of the second laser; preliminarily adjust the working distance from the laser emitting element to the sacrificial layer so that the spot of the second laser reaches an optimal size; obtain the infrared spot image of the second laser via the infrared vision component, and fine-tune the working distance from the laser emitting element to the sacrificial layer to compensate for the error of the focal spot analyzer; and in response to the laser emitting element being adjusted to the optimal working distance, perform laser scanning debonding on the sacrificial layer.

2. The laser debonding device according to claim 1, characterized in that: The laser emitting element, the beam splitter and the bonding element are in the same straight line, The step of preliminarily adjusting the working distance from the laser emitting element to the sacrificial layer so that the spot of the second laser reaches an optimal size comprises: Moving the laser emitting element along the straight line direction to adjust the working distance from the laser emitting element to the sacrificial layer; and The first minimum size of the spot of the second laser is obtained as the optimal size through the first round spot size variation rule of the first laser in the focal spot analyzer, wherein the spot size variation rule includes the process that the spot first changes from large to small and then from small to large.

3. The laser debonding device according to claim 2, characterized in that: The step of acquiring the spot pattern of the second laser via the infrared vision component and fine-tuning the working distance from the laser emitting element to the sacrificial layer to compensate for the error of the focal spot analyzer comprises: Based on the infrared spot image of the second laser obtained by the infrared vision component, judging whether the spot of the second laser meets the process requirements of debonding; In response to the laser energy of the light spot of the second laser of the first minimum size being insufficient to ablate the sacrificial layer, continuing to move the laser emitting element along the straight line direction to adjust the working distance from the laser emitting element to the sacrificial layer; and The second minimum size of the spot of the second laser is obtained as the optimal size through the second round spot size change rule of the first laser in the focal spot analyzer, wherein the second minimum size is smaller than the first minimum size.

4. The laser debonding device according to claim 3, characterized in that: The step of judging whether the spot of the second laser meets the process requirements of debonding also includes: In response to the laser energy of the light spot of the second laser with the first minimum size ablating the device layer below the sacrificial layer, continue to move the laser emitting element along the straight line direction to adjust the working distance from the laser emitting element to the sacrificial layer; and The third minimum size of the spot of the second laser is obtained as the optimal size through the third round of spot size variation of the first laser in the focal spot analyzer, wherein the third minimum size is larger than the first minimum size.

5. The laser debonding device according to claim 4, characterized in that: Also includes: a mobile platform on which the bonding element is placed, In response to the laser emitting element being adjusted to the optimal working distance, the step of performing laser scanning debonding on the sacrificial layer comprises: Fixing the position of the laser emitting element at the optimal working distance, in response to the bonding area on the sacrificial layer being ablated by the second laser, determining the position of the next bonding area to be ablated through the infrared spot image of the sacrificial layer collected by the infrared vision component; as well as The bonding component is translated in the x-direction and / or the y-direction via the moving platform so that the second laser irradiates the next bonding area.

6. The laser debonding device according to claim 5, characterized in that: After the step of performing laser scanning debonding on the sacrificial layer in response to the laser emitting element being adjusted to the optimal working distance, In response to the completion of the laser scanning debonding, obtaining an infrared full image of the sacrificial layer via the infrared vision component to detect whether each bonding area of ​​the sacrificial layer has completed debonding; In response to at least one bonding area not being completely debonded, marking the at least one bonding area, and moving the moving platform so that the at least one bonding area is scanned by the second laser again; In response to the completion of debonding of the bonding regions, the peeled device layer is transferred to a next process.

7. The laser debonding device according to claim 1, characterized in that: The laser emitting element comprises: A laser, used for providing the initial laser; The optical component is used to adjust the transmission angle of the initial laser so as to transmit the initial laser to the beam splitter.

8. The laser debonding device according to claim 7, characterized in that: The optical component includes a collimating and expanding system, a reflecting mirror and a field lens, wherein the collimating and expanding system is used to adjust the spot size of the initial laser so that it matches the spot size of the field lens, and the reflecting mirror is used to reflect the initial laser into the field lens so that the field lens focuses the initial laser onto the sacrificial layer.

9. The laser debonding device according to claim 8, characterized in that: The reflector is connected to a motor, which drives the reflector to rotate, so as to adjust the reflection angle of the reflector by vibration, so as to fine-tune the outgoing light path of the second laser reflected by the reflector, so that the second laser performs local scanning on the sacrificial layer.

10. The laser debonding device according to claim 8, characterized in that: Also includes: The power meter is disposed above the reflective mirror and is used to detect the power value of the reflected light of the second laser light incident on the bonding component and reflected by the surface of the bonding component.

11. The laser debonding device according to claim 10, characterized in that: Also includes: An infrared thermal imager, disposed above the bonding element, for obtaining a temperature distribution diagram of the sacrificial layer, In response to the laser emitting element being adjusted to the optimal working distance, the step of performing laser scanning debonding on the sacrificial layer comprises: Acquiring the power value of the second laser beam incident on the sacrificial layer and the temperature distribution diagram of the sacrificial layer respectively via the power meter and the infrared thermal imager; as well as In response to the presence of abnormal temperature values ​​in the temperature distribution map, the output power of the laser is adjusted, and the power adjustment process is monitored by the power meter.

12. The laser debonding device according to claim 1, characterized in that: Also includes: A laser rangefinder is arranged at the bottom of the focal spot analyzer, and is used to detect the distance from the spectroscope to the focal spot analyzer and the sacrificial layer, wherein the distance from the spectroscope to the focal spot analyzer is fixed at L, the distance from the light outlet of the laser rangefinder to the spectroscope is L1, and the distance from the light outlet of the laser rangefinder to the bonding component is L2, and the thickness of the carrier layer above the bonding component is d, so that L=L1+L2+d.

13. The laser debonding device according to claim 1, characterized in that: The ratio of the first laser light to the second laser light after the initial laser light is split by the beam splitter is in a range of 1:9 to 3:

7.

14. The laser debonding device according to claim 1, characterized in that: The infrared vision component includes an infrared camera, an infrared light source and a filter, wherein the filter is located in front of the lens of the infrared camera and is used to filter out the reflected light of the second laser incident on the bonding component that is reflected by the surface of the bonding component.

15. A laser debonding method, characterized in that: The following steps are involved: The laser emitting element in the laser debonding device according to any one of claims 1 to 14 emits an initial laser for debonding, wherein the initial laser is divided into two beams by the beam splitter, the first laser is emitted to a focal spot analyzer, and the second laser is emitted to a sacrificial layer of the bonded component, and the distances from the beam splitter to the focal spot analyzer and the sacrificial layer are the same; Acquiring a spot size of the first laser through a focal spot analyzer, wherein the spot size of the first laser is equal to the spot size of the second laser; Preliminarily adjusting the working distance from the laser emitting element to the sacrificial layer so that the spot of the second laser reaches an optimal size; Acquiring an infrared spot image of the second laser via the infrared vision component, and fine-tuning a working distance from the laser emitting element to the sacrificial layer to compensate for an error of the focal spot analyzer; and In response to the laser emitting element being adjusted to an optimal working distance, laser scanning debonding is performed on the sacrificial layer.

16. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the laser debonding method according to claim 15 is implemented.

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