Radiation temperature measurement device and method based on dynamic calibration

Abstract

The present invention provides a radiation temperature measurement device and method based on dynamic calibration, relating to the technical field of radiation temperature measurement. The device is used to measure the temperature information of a hot-end component and includes a first lens group, a temperature measurement probe, a second lens group, an optical switch, a filter, a photodetector, a preamplifier, a data acquisition and monitoring system, and a controller. The spectral energy radiated from the surface of the hot-end component is collected by the first lens group within the temperature measurement probe and focused by the second lens group before passing through the filter to obtain a corresponding temperature measurement characteristic wavelength. The photodetector is a thermoelectric cooling type. The temperature measurement characteristic wavelength is incident on the photodetector for detection, generating a corresponding electrical signal. The electrical signal is amplified by the preamplifier into a collectable voltage signal, which is then collected and post-processed by the data acquisition and monitoring system to obtain the temperature information of the hot-end component. The optical switch is located at the front end of the filter and is controlled to open or close by the controller, which is controlled by the data acquisition and monitoring system.

Description

Technical Field

[0001] The present invention relates to the technical field of radiation temperature measurement, and in particular to a radiation temperature measurement device and method based on dynamic calibration. Background Art

[0002] With the continuous improvement of the performance of aircraft engines and gas turbines, the temperature of the gas at the turbine inlet continues to rise, far exceeding the material operating temperature of the turbine hot end components. To ensure that the turbine hot end components are within a safe temperature range, surface coating of thermal barrier coatings combined with internal flow / film cooling has become the main thermal protection method at present, and the use of ceramic-based composite materials with higher temperature resistance to manufacture hot end components has become a future development trend. In order to accurately guide the design of the thermal protection structure of the hot end components and evaluate the thermal protection effect during the development of turbine components, it is necessary to accurately measure the surface temperature of the hot end components. However, the operating environment temperature of the hot end components is as high as 1500-2000℃, and the surface is made of ceramic-based materials, which limits the application of traditional contact temperature measurement technology. Non-contact radiation temperature measurement technology has become an effective means of obtaining its surface temperature.

[0003] Currently, established radiation temperature measurement systems for turbine hot-end components typically operate in the near-infrared (NIR) band. However, thermal barrier coatings and ceramic-based composites (CMCs) exhibit the semi-transparent radiation properties of participating media in the NIR. Therefore, NIR temperature measurement techniques cannot accurately measure their surface temperatures. Measurement requires the use of the mid-infrared (MIR) and long-wavelength bands, which are opaque to these materials. Current photodetectors used for long-wavelength MIR measurement require either multi-stage thermoelectric cooling or liquid nitrogen cooling. While liquid nitrogen cooling offers improved detection performance, it is inconvenient due to the need for constant liquid nitrogen replenishment. Multi-stage thermoelectric cooling detectors, however, require high ambient temperature stability and suffer from constant output signal drift, making steady-state calibration and measurement in a blackbody furnace impossible. Consequently, significant errors in temperature measurements limit the application of these detectors in radiation temperature measurement. Therefore, a new radiation temperature measurement device is needed to meet the long-wavelength temperature measurement requirements of these detectors. Summary of the Invention

[0004] In view of this, the present invention provides a radiation temperature measurement device and method based on dynamic calibration.

[0005] On one hand, the present invention provides a radiation temperature measurement device based on dynamic calibration, which is used to measure the temperature information of a hot-end component. The radiation temperature measurement device includes a first lens group, a temperature measuring probe, a second lens group, an optical switch, a filter, a photodetector, a pre-amplifier, an acquisition and monitoring system, and a controller, wherein: the first lens group and the second lens group are arranged on opposite sides inside the temperature measuring probe; the spectral energy radiated from the surface of the hot-end component is collected by the first lens group in the temperature measuring probe and focused by the second lens group, and then passes through the filter to obtain a temperature measurement characteristic wavelength corresponding to the spectral energy; the photodetector is a thermoelectric cooling type, and the temperature measurement characteristic wavelength is incident on the photodetector for detection, and an electrical signal corresponding to the temperature measurement characteristic wavelength is obtained. The electrical signal is amplified by the pre-amplifier into a collectable voltage signal, and then collected and post-processed by the acquisition and monitoring system to obtain the temperature information of the hot-end component; the optical switch is arranged at the front end of the filter and is controlled to be opened or closed by the controller, and the controller is controlled by the acquisition and monitoring system.

[0006] According to an embodiment of the present invention, the radiation temperature measurement device also includes: a first water cooling structure and a constant temperature chiller, which are respectively arranged outside the photoelectric detector, wherein the first water cooling structure is used to cool the photoelectric detector, and the constant temperature chiller is used to provide constant temperature cold water for the first water cooling structure.

[0007] According to an embodiment of the present invention, the radiation temperature measurement device further includes: a switch blade, which is arranged inside the optical switch, and the surface of the switch blade is coated with a low-emissivity coating or polished stainless steel.

[0008] According to an embodiment of the present invention, the radiation temperature measurement device further includes: a second water-cooling structure, disposed between the optical switch and the photodetector, the second water-cooling structure having two opposing heat exchange surfaces, and the two heat exchange surfaces are in contact with the optical switch and the photodetector respectively.

[0009] According to an embodiment of the present invention, the optical filter is installed inside the optical switch and is disposed between the switch blade and the second water-cooling structure.

[0010] According to an embodiment of the present invention, the radiation temperature measurement device further includes: an optical fiber, which is arranged between the first lens group and the second lens group, and the spectral energy collected by the first lens group is transmitted to the second lens group through the optical fiber.

[0011] According to an embodiment of the present invention, the radiation temperature measurement device further includes: a heat conducting plate and heat dissipation fins, wherein the heat conducting plate is arranged between the optical switch and the photodetector, and the heat dissipation fins are installed on the outer edge of the heat conducting plate. The heat generated by the optical switch and the photodetector is transferred from the heat conducting plate to the heat dissipation fins for heat dissipation.

[0012] Another aspect of the present invention provides a radiation temperature measurement method based on dynamic calibration, which is applied to the above-mentioned radiation temperature measurement device based on dynamic calibration. The method includes: step S1, when using a blackbody furnace to calibrate the radiation temperature measurement device, aligning the temperature measurement probe with the blackbody furnace; step S2, closing the optical switch, and when the blackbody furnace is at a stable first temperature, recording a first voltage value output by the acquisition monitoring system; step S3, opening the optical switch, and recording a second voltage value output by the acquisition monitoring system; step S4, closing the optical switch, and when the blackbody furnace is at a stable second temperature, recording a third voltage value output by the acquisition monitoring system, wherein the second temperature is different from the first temperature; step S5. Step S5: Turn on the optical switch and record the fourth voltage value output by the acquisition and monitoring system; Step S6: Fit the first voltage value, the second voltage value, the third voltage value, and the fourth voltage value to obtain a correlation between different blackbody furnace temperatures and the output voltage difference corresponding to turning the optical switch on and off; Step S7: When measuring the temperature information of the hot end component, first turn off the optical switch and record the fifth voltage value output by the acquisition and monitoring system; then turn on the optical switch and record the sixth voltage value output by the acquisition and monitoring system; Step S8: Obtain the surface emissivity of the hot end component; and determine the temperature information of the hot end component based on the fifth voltage value, the sixth voltage value, the surface emissivity, and the correlation.

[0013] According to an embodiment of the present invention, step S6 further includes: repeating steps S2 to S5 in sequence a predetermined number of times to obtain multiple real-time voltage values ​​output by the acquisition and monitoring system; and fitting the multiple real-time voltage values ​​to obtain a correlation between different blackbody furnace temperatures and the output voltage differences corresponding to turning the optical switch on and off.

[0014] According to an embodiment of the present invention, in step S8, determining the temperature information of the hot end component based on the fifth voltage value, the sixth voltage value, the surface emissivity and the associated relationship includes: calculating a voltage difference between the sixth voltage value and the fifth voltage value; dividing the voltage difference by the surface emissivity to obtain a correction value; and substituting the correction value into the associated relationship to obtain the temperature information of the hot end component.

[0015] Compared to existing technologies, the dynamic calibration-based radiation temperature measurement device and method provided by the present invention utilizes an optical switch, combined with a cooling and temperature-control structure, to continuously open and close the optical switch during measurement. This allows for dynamic calibration of the radiation temperature measurement device, significantly reducing the significant measurement errors caused by drift in the output signal of the long-wave photodetector, and effectively improving temperature measurement accuracy. This invention implements real-time dynamic calibration during the measurement process of a mid-infrared long-wavelength radiation temperature measurement system, significantly reducing the radiation energy measurement errors caused by signal drift in thermoelectrically cooled long-wavelength infrared photodetectors. This allows for accurate measurement of the surface temperature of thermal barrier coatings and ceramic-based composite materials on hot-end components. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0017] Figure 1 The structure of a radiation temperature measurement device based on dynamic calibration according to an embodiment of the present invention is schematically shown;

[0018] Figure 2 Schematically shows the structure of an air-cooled thermoelectric cooling type photodetector coupled to an optical switch according to an embodiment of the present invention;

[0019] Figure 3 Schematically shows the structure of a liquid-cooled thermoelectric cooling type photodetector coupled to an optical switch according to an embodiment of the present invention;

[0020] Figure 4 The structure of the radiation temperature measurement device using optical fiber transmission according to an embodiment of the present invention is schematically shown;

[0021] Figure 5 Schematically shows a flow chart of a radiation temperature measurement method based on dynamic calibration according to an embodiment of the present invention;

[0022] Figure 6 The flowchart of temperature measurement using an association relationship according to an embodiment of the present invention is schematically shown. DETAILED DESCRIPTION

[0023] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0024] The terms used herein are only for describing specific embodiments and are not intended to limit the present invention. The terms "comprise", "include", etc. used herein indicate the presence of the features, steps, operations and / or components, but do not exclude the presence or addition of one or more other features, steps, operations or components.

[0025] All terms used herein, including technical and scientific terms, have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0026] like Figure 1 As shown, an embodiment of the present invention provides a radiation temperature measurement device based on dynamic calibration, which is used to measure the temperature information of a hot end component 1. The radiation temperature measurement device includes a first lens group 2, a temperature measurement probe 3, a second lens group 4, an optical switch 5, a filter 6, a photodetector 7, a pre-amplifier 9, an acquisition and monitoring system 10, and a controller 12, wherein:

[0027] The first lens group 2 and the second lens group 4 are arranged on opposite sides of the temperature measuring probe 3. The spectral energy radiated from the surface of the hot end component 1 is collected by the first lens group 2 and focused by the second lens group 4 in the temperature measuring probe 3. After passing through the filter 6, the temperature measurement characteristic wavelength corresponding to the spectral energy is obtained.

[0028] The photoelectric detector 7 is a thermoelectric cooling type. The temperature characteristic wavelength is incident on the photoelectric detector 7 for detection, and an electrical signal corresponding to the temperature characteristic wavelength is obtained. The electrical signal is amplified by the pre-amplifier 9 to a collectible voltage signal, and then collected and post-processed by the collection and monitoring system 10 to obtain the temperature information of the hot end component 1;

[0029] The optical switch 5 is provided at the front end of the optical filter 6 , and the opening or closing of the optical switch 5 is controlled by the controller 12 , which is controlled by the acquisition and monitoring system 10 .

[0030] In this embodiment, the photodetector 7 is a thermoelectric cooling type, which can convert optical power into an electrical signal. The temperature measurement characteristic wavelength obtained by the filter 6 is incident on the photodetector 7, and an electrical signal corresponding to the temperature measurement characteristic wavelength can be obtained.

[0031] In this embodiment, the acquisition and monitoring system 10 can acquire the voltage signal amplified by the pre-amplifier 9 and then post-process the acquired voltage signal to obtain the temperature information of the hot end component 1. The post-processing can, for example, convert the analog signal into a digital signal, and the present invention does not impose any specific limitation on the post-processing method.

[0032] In this embodiment, an optical switch 5 is provided at the front end of the optical filter 6 for instantaneously interrupting or connecting the optical path. The optical switch 5 is controlled by a controller 12, which is controlled by the data acquisition and monitoring system 10. As can be seen, the dual control of the on / off state of the optical switch 5 improves the controllability and accuracy of temperature measurement.

[0033] In some embodiments, the radiation temperature measurement device further includes: a first water-cooling structure 8 and a constant-temperature chiller 11, each disposed outside the photodetector 7. The first water-cooling structure 8 is used to cool the photodetector 7, and the constant-temperature chiller 11 is used to provide constant-temperature cold water to the first water-cooling structure 8. Since the thermoelectrically cooled photodetector 7 generates heat during operation, this method can ensure that the photodetector 7 operates at a constant cooling temperature.

[0034] like Figure 2As shown, in some embodiments, the radiation temperature measurement device further includes a switch blade 14 disposed within the optical switch 5. The switch blade 14 is coated with a low-emissivity coating or polished stainless steel. A low-emissivity coating refers to an emissivity below a preset emissivity threshold, such as 0.1. This reduces the effect of radiation from the optical switch 5 on the output signal of the photodetector 7 when it is turned off.

[0035] Since the opening and closing of the switch blade 14 inside the optical switch 5 is usually realized by electrical drive, a certain amount of heat is generated when the optical switch 5 is working. In order to promptly remove the heat generated by the optical switch 5 and maintain it at a constant temperature to reduce the impact of temperature fluctuations on system signals, Figure 3 As shown, in some embodiments, the radiation temperature measurement device further includes a second water-cooling structure 13 disposed between the optical switch 5 and the photodetector 7. The second water-cooling structure 13 has two opposing heat exchange surfaces, which are in contact with the optical switch 5 and the photodetector 7, respectively. The constant-temperature chiller 11 can then continue to provide constant-temperature cold water to the second water-cooling structure 13, thereby cooling and controlling the temperature of the optical switch 5 and the photodetector 7.

[0036] In some embodiments, the optical filter 6 is installed inside the optical switch 5 and disposed between the switch blade 14 and the second water-cooling structure 13 .

[0037] In some embodiments, the radiation temperature measurement device further includes a heat conducting plate 15 and heat dissipation fins 16. The heat conducting plate 15 is positioned between the optical switch 5 and the photodetector 7, and the heat dissipation fins 16 are mounted on the outer edge of the heat conducting plate 15. Heat generated by the optical switch 5 and the photodetector 7 is transferred from the heat conducting plate 15 to the heat dissipation fins 16 for dissipation. A fan can then be used to dissipate heat from the heat dissipation fins 16, thereby reducing the overall complexity of the radiation temperature measurement device.

[0038] like Figure 4 As shown, in some embodiments, the radiation temperature measurement device further includes: an optical fiber 17, which is disposed between the first lens group 2 and the second lens group 4. The spectral energy collected by the first lens group 2 is transmitted to the second lens group 4 via the optical fiber 17. For example, in a restricted installation position, the spectral energy collected by the first lens group 2 is transmitted to the second lens group 4 via the optical fiber 17. The spectral energy is then selected by the filter 6 for a temperature measurement characteristic wavelength and then focused onto the thermoelectric cooling type photodetector 7 for detection, thereby obtaining an electrical signal corresponding to the input spectral energy at the temperature measurement characteristic wavelength.

[0039] Based on the above radiation temperature measurement device based on dynamic calibration, the present invention also provides a radiation temperature measurement method based on dynamic calibration, which will be combined with Figure 5 The method is described in detail.

[0040] like Figure 5 As shown, an embodiment of the present invention further provides a radiation temperature measurement method based on dynamic calibration, which can be applied to the radiation temperature measurement device based on dynamic calibration in any of the above embodiments. The method includes steps S1 to S8.

[0041] Step S1 , when using a blackbody furnace to calibrate the radiation temperature measuring device, align the temperature measuring probe 3 with the blackbody furnace.

[0042] Step S2: close the optical switch 5 and record the first voltage value output by the monitoring system 10 when the blackbody furnace is at a stable first temperature.

[0043] For example, when it is monitored that the temperature of the blackbody furnace is stable within the first preset time period, the stable temperature is at the first temperature, and the surface temperature of the photoelectric detector 7 is also stable, the first voltage value output by the acquisition monitoring system 10 is recorded.

[0044] Step S3 , turning on the optical switch 5 , and recording and collecting the second voltage value output by the monitoring system 10 .

[0045] The second voltage value outputted in this step may be understood as an output voltage value corresponding to the radiation energy of the blackbody furnace at the current temperature.

[0046] Step S4, closing the optical switch 5, and recording and collecting a third voltage value output by the monitoring system 10 when the blackbody furnace is at a stable second temperature, wherein the second temperature is different from the first temperature.

[0047] This step is to adjust the temperature of the blackbody furnace from the first temperature to the second temperature, that is, to adjust the temperature of the blackbody furnace to another calibration point, and record the output voltage value after the temperature stabilizes.

[0048] Step S5 , turning on the optical switch 5 , and recording and collecting the fourth voltage value output by the monitoring system 10 .

[0049] The fourth voltage value outputted in this step may be understood as an output voltage value corresponding to the radiation energy of the blackbody furnace at the current temperature.

[0050] Step S6 , fitting the first voltage value, the second voltage value, the third voltage value, and the fourth voltage value to obtain a correlation between different blackbody furnace temperatures and the output voltage difference corresponding to the optical switch 5 being on and off.

[0051] By adjusting different blackbody furnace temperatures, the difference in the recorded output voltage values ​​of the optical switch 5 after it is turned on and before it is turned on (i.e., closed) corresponding to different blackbody furnace temperatures can be obtained, that is, the output voltage difference, and then the correlation between different blackbody furnace temperatures and the output voltage difference can be fitted.

[0052] For example, when the blackbody furnace temperature is the first temperature, an output voltage difference of the second voltage value minus the first voltage value can be obtained. For the sake of distinction, it can be named the first output voltage difference; when the blackbody furnace temperature is the second temperature, an output voltage difference of the fourth voltage value minus the third voltage value can be obtained. For the sake of distinction, it can be named the second output voltage difference.

[0053] Then, the first temperature, the first output voltage difference, the second temperature, and the second output voltage difference are fitted to obtain the correlation between different blackbody furnace temperatures and the output voltage differences corresponding to the opening and closing of the optical switch 5 .

[0054] It should be noted that linear fitting or nonlinear fitting can be used. For nonlinear fitting, polynomial fitting or least squares curve fitting can be used for fitting. The present invention does not specifically limit the fitting method.

[0055] In step S7 , when measuring the temperature information of the hot end component 1 , the optical switch 5 is first turned off to record the fifth voltage value output by the acquisition monitoring system 10 ; and then the optical switch 5 is turned on to record the sixth voltage value output by the acquisition monitoring system 10 .

[0056] The sixth voltage value outputted in this step may be understood as an output voltage value corresponding to the surface radiation energy of the hot end component 1 measured at the current temperature.

[0057] Step S8, obtaining the surface emissivity of the hot end component 1; and determining the temperature information of the hot end component 1 according to the fifth voltage value, the sixth voltage value, the surface emissivity, and the correlation relationship.

[0058] It can be understood that the aforementioned steps S1 to S6 are steps of calibrating the radiation temperature measuring device using a blackbody furnace to obtain a correlation relationship; and the aforementioned steps S7 to S8 are steps of measuring the temperature information of the hot end component 1 using the radiation temperature measuring device.

[0059] In this embodiment, in step S7, the time difference between closing the optical switch 5 and opening the optical switch 5 is less than a predetermined time difference threshold. In this way, during the short time when the optical switch 5 is open, the signal drift of the photodetector 7 is small, thereby having little impact on the temperature measurement accuracy.

[0060] like Figure 6 As shown, in this embodiment, in step S8, the temperature information of the hot end component 1 is determined according to the fifth voltage value, the sixth voltage value, the surface emissivity and the correlation relationship, including steps S81 to S83.

[0061] Step S81, calculating a voltage difference value obtained by subtracting the fifth voltage value from the sixth voltage value;

[0062] Step S82, dividing the voltage difference by the surface emissivity to obtain a correction value;

[0063] Step S83: Substitute the correction value into the correlation relationship to obtain the temperature information of the hot end component 1.

[0064] In some embodiments, step S6 further includes: repeating steps S2 through S5 a predetermined number of times to obtain multiple real-time voltage values ​​output by the acquisition monitoring system 10; and fitting these multiple real-time voltage values ​​to obtain a correlation between different blackbody furnace temperatures and the output voltage difference corresponding to the opening and closing of the optical switch 5. In this manner, when calibrating the radiation temperature measurement device using a blackbody furnace, a larger number of output voltage values ​​can be collected for fitting, resulting in a more accurate correlation, improving the fitting quality, and thereby increasing the temperature measurement accuracy.

[0065] According to the embodiments of the present invention, after the radiation temperature measuring device is calibrated using a blackbody furnace and a correlation relationship is obtained, the voltage difference before and after the optical switch 5 is opened is recorded during each test. This allows dynamic calibration of the radiation temperature measuring device, greatly reducing the large measurement error caused by signal drift of the photodetector 7, and obtaining accurate temperature information of the thermal barrier coating surface or ceramic matrix composite surface of the hot end component 1.

[0066] It should be noted that the embodiment of the device part is similar to the embodiment of the method part, and the technical effects achieved are also similar.

[0067] In summary, the embodiments of the present invention provide a radiation temperature measurement device and method based on dynamic calibration. By providing an optical switch, combined with a cooling and temperature control structure, the optical switch is continuously opened and closed during measurement, enabling dynamic calibration of the radiation temperature measurement device. This significantly reduces the large measurement errors caused by drift in the output signal of the long-wave photodetector, effectively improving temperature measurement accuracy. This invention implements real-time dynamic calibration during the measurement process of a mid-infrared long-wavelength radiation temperature measurement system, significantly reducing the radiation energy measurement errors caused by signal drift in thermoelectrically cooled long-wavelength infrared photodetectors. It can accurately measure the surface temperature of thermal barrier coatings and ceramic-based composite materials on hot-end components.

[0068] It should be noted that directional terms such as "upper," "lower," "front," "back," "left," and "right" mentioned in the embodiments are merely references to the directions in the accompanying drawings and are not intended to limit the scope of protection of the present invention. Throughout the drawings, identical elements are represented by identical or similar reference numerals. Conventional structures or configurations will be omitted where they may cause confusion in understanding the present invention.

[0069] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly specifying the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined. Furthermore, the word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements.

[0070] The above describes embodiments of the present invention. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention. Although each embodiment has been described separately above, this does not mean that the measures in each embodiment cannot be advantageously used in combination. Without departing from the scope of the present invention, those skilled in the art may make various substitutions and modifications, which should all fall within the scope of the present invention.

Claims

1. A radiation temperature measuring device based on dynamic calibration, used for measuring the temperature information of a hot end component (1), characterized in that: The radiation temperature measurement device comprises a first lens group (2), a temperature measuring probe (3), a second lens group (4), an optical switch (5), a filter (6), a photodetector (7), a pre-amplifier (9), an acquisition and monitoring system (10), and a controller (12), wherein: The first lens group (2) and the second lens group (4) are arranged on opposite sides of the temperature measuring probe (3); the spectral energy radiated from the surface of the hot end component (1) is collected by the first lens group (2) in the temperature measuring probe (3) and focused by the second lens group (4), and then passes through the filter (6) to obtain a temperature measurement characteristic wavelength corresponding to the spectral energy; The photoelectric detector (7) is of a thermoelectric cooling type. The temperature measurement characteristic wavelength is incident on the photoelectric detector (7) for detection, and an electrical signal corresponding to the temperature measurement characteristic wavelength is obtained. The electrical signal is amplified by a pre-amplifier (9) to be a collectible voltage signal, and then collected and post-processed by the collection and monitoring system (10) to obtain temperature information of the hot end component (1); The optical switch (5) is arranged at the front end of the optical filter (6) and is controlled to be opened or closed by a controller (12), and the controller (12) is controlled by the acquisition monitoring system (10).

2. The radiation temperature measurement device based on dynamic calibration according to claim 1, characterized in that: Also includes: A first water cooling structure (8) and a constant temperature chiller (11) are respectively arranged outside the photoelectric detector (7), wherein the first water cooling structure (8) is used to cool the photoelectric detector (7), and the constant temperature chiller (11) is used to provide constant temperature cold water for the first water cooling structure (8).

3. The radiation temperature measurement device based on dynamic calibration according to claim 1, characterized in that: Also includes: A switch blade (14) is arranged inside the optical switch (5), and a surface of the switch blade (14) is coated with a low-emissivity coating or polished stainless steel.

4. The radiation temperature measurement device based on dynamic calibration according to claim 3, characterized in that: Also includes: The second water-cooling structure (13) is arranged between the optical switch (5) and the photodetector (7), and the second water-cooling structure (13) has two opposite heat exchange surfaces, and the two heat exchange surfaces are in contact with the optical switch (5) and the photodetector (7), respectively.

5. The radiation temperature measurement device based on dynamic calibration according to claim 4, characterized in that: The optical filter (6) is installed inside the optical switch (5) and is arranged between the switch blade (14) and the second water-cooling structure (13).

6. The radiation temperature measurement device based on dynamic calibration according to claim 1, characterized in that: Also includes: An optical fiber (17) is arranged between the first lens group (2) and the second lens group (4), and the spectral energy collected by the first lens group (2) is transmitted to the second lens group (4) via the optical fiber (17).

7. The radiation temperature measurement device based on dynamic calibration according to claim 1, characterized in that: Also includes: A heat conducting plate (15) and a heat dissipation fin (16), wherein the heat conducting plate (15) is arranged between the optical switch (5) and the photodetector (7), and the heat dissipation fin (16) is installed on the outer edge of the heat conducting plate (15), and the heat generated by the optical switch (5) and the photodetector (7) is transferred from the heat conducting plate (15) to the heat dissipation fin (16) for heat dissipation.

8. A radiation temperature measurement method based on dynamic calibration, characterized in that: The radiation temperature measurement device based on dynamic calibration according to any one of claims 1 to 7, wherein the method comprises: Step S1, when calibrating the radiation temperature measuring device using a black body furnace, aligning the temperature measuring probe (3) with the black body furnace; Step S2, closing the optical switch (5), and recording a first voltage value output by the acquisition monitoring system (10) when the blackbody furnace is at a stable first temperature; Step S3, turning on the optical switch (5) and recording the second voltage value output by the acquisition monitoring system (10); Step S4, closing the optical switch (5), and recording a third voltage value output by the acquisition monitoring system (10) when the blackbody furnace is at a stable second temperature, wherein the second temperature is different from the first temperature; Step S5, turning on the optical switch (5) and recording the fourth voltage value output by the acquisition and monitoring system (10); Step S6, fitting the first voltage value, the second voltage value, the third voltage value and the fourth voltage value to obtain a correlation between different blackbody furnace temperatures and the output voltage difference corresponding to the optical switch (5) being turned on and off; Step S7, when measuring the temperature information of the hot end component (1), first close the optical switch (5) and record the fifth voltage value output by the acquisition and monitoring system (10); then open the optical switch (5) and record the sixth voltage value output by the acquisition and monitoring system (10); Step S8, obtaining the surface emissivity of the hot end component (1); and determining the temperature information of the hot end component (1) based on the fifth voltage value, the sixth voltage value, the surface emissivity and the correlation relationship.

9. The radiation temperature measurement method based on dynamic calibration according to claim 8, characterized in that: The step S6 further includes: Repeating steps S2 to S5 in sequence for a predetermined number of times to obtain a plurality of real-time voltage values ​​output by the acquisition and monitoring system (10); The multiple real-time voltage values ​​are fitted to obtain the correlation between different blackbody furnace temperatures and the output voltage difference corresponding to the opening and closing of the optical switch (5).

10. The radiation temperature measurement method based on dynamic calibration according to claim 8, characterized in that: In step S8, determining the temperature information of the hot end component (1) based on the fifth voltage value, the sixth voltage value, the surface emissivity and the correlation relationship includes: calculating a voltage difference value of the sixth voltage value minus the fifth voltage value; Dividing the voltage difference by the surface emissivity to obtain a correction value; Substituting the correction value into the association relationship, the temperature information of the hot end component (1) is obtained.

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