Camera module

Abstract

The invention discloses a camera module and an electronic device. The camera module comprises a module support; the prism is arranged on the module support, the prism is provided with an incident plane and an emergent plane, the incident plane and the emergent plane are arranged on the same side of the prism at intervals in the length direction of the prism, and light enters the prism from the incident plane, is reflected in the prism and then exits from the emergent plane; the lens is arranged on the module support and located on the side where the incident plane is located, and the light is projected on the incident plane after passing through the lens; the image sensing chip is arranged on the module support, and the image sensing chip is located on the side where the emergent surface is located and receives the light rays emitted from the emergent surface; and the flexible circuit board is connected with the image sensing chip, and the flexible circuit board is arranged in a gap between the lens and the image sensor. According to the camera module and the electronic equipment provided by the invention, large long-focus shooting multiplying power and small space volume can be taken into account.

Description

Technical Field

[0001] The present application belongs to the technical field of camera modules, and in particular, relates to a camera module. Background Art

[0002] In order to obtain the long-focus shooting function, the camera module is usually equipped with a long-focus function mechanism; among them, the long-focus function mechanism is mainly composed of a lens, a prism and an image sensor chip. The imaging light emitted by the lens is received through the prism, and multiple reflections are realized in the lens to extend the transmission light path, and finally the imaging light is projected onto the image sensor chip.

[0003] However, the greater the telephoto ratio of the telephoto camera module, the greater the module length and height. Usually, in order to obtain a large telephoto range, the prism specifications can be set longer and higher. In addition, the electrical connection structure such as the module circuit board outside the prism will make the overall specifications of the camera module larger, and the required installation and action space will also be correspondingly larger, which to a certain extent limits the application range of the camera module equipped with a telephoto function mechanism. Summary of the invention

[0004] The present application provides a camera module, which aims to solve the technical problem of the large overall length specification of the telephoto camera module at least to a certain extent. To this end,

[0005] An embodiment of the present application provides a camera module, comprising:

[0006] Module bracket;

[0007] A prism is arranged on the module bracket, and the prism has an incident surface and an exit surface, the incident surface and the exit surface are arranged at the same side of the prism at intervals along the length direction of the prism, and light enters the prism from the incident surface and is emitted from the exit surface after being reflected in the prism;

[0008] A lens is arranged on the module bracket, and the lens is located on the side where the incident surface is located, and the light is projected onto the incident surface after passing through the lens;

[0009] An image sensor chip is disposed on the module bracket, and the image sensor chip is located on the side where the exit surface is located, and receives the light emitted from the exit surface; and

[0010] A flexible circuit board is connected to the image sensor chip, and the flexible circuit board is arranged in the gap between the lens and the image sensor.

[0011] In some embodiments, the flexible circuit board includes:

[0012] A chip connection circuit board is electrically connected to the image sensor chip, and the chip connection circuit board and the image sensor chip are stacked along the thickness direction of the chip connection circuit board;

[0013] A first buffer circuit board connected to the chip connection board, wherein the first buffer circuit board is vertically arranged outside the prism along the thickness direction of the chip connection circuit board;

[0014] The second buffer circuit board is connected to the first buffer circuit board, and the second buffer circuit board is vertically arranged in the gap between the lens and the image sensor along the thickness direction of the chip connection circuit board.

[0015] In some embodiments, the flexible circuit board further includes:

[0016] a third buffer circuit board connected to the chip connection board, the third buffer circuit board being vertically arranged on the outside of the prism along the thickness direction of the chip connection circuit board, and the third buffer circuit board and the first buffer circuit board being symmetrically arranged on both sides of the image sensor chip;

[0017] A fourth buffer circuit board is connected to the third buffer circuit board. The fourth buffer circuit board is vertically arranged in a gap between the lens and the image sensor along a thickness direction of the chip connection circuit board, and the fourth buffer circuit board is connected to the second buffer circuit board.

[0018] In some embodiments, the flexible circuit board includes:

[0019] A chip connection circuit board is electrically connected to the image sensor chip, and the chip connection circuit board and the image sensor chip are stacked along the thickness direction of the chip connection circuit board;

[0020] A fifth buffer circuit board is connected to one end of the chip circuit board close to the lens, the fifth buffer circuit board is reciprocatingly bent in the thickness direction to form a multilayer board, and the thickness direction of the fifth buffer circuit board is arranged along the length direction of the prism, and the fifth buffer circuit board is arranged in the gap between the lens and the image sensor.

[0021] In some embodiments, the lens comprises:

[0022] The first lens group;

[0023] A second lens group is stacked with the first lens group on the same optical axis and arranged on the side where the incident surface is located, and the second lens group and / or the first lens group are configured to be movable along the optical axis;

[0024] The camera module also includes a focus motor connected to the flexible circuit board, and the focus motor is connected to the second lens group and / or the first lens group.

[0025] In some embodiments, the camera module further includes an anti-shake mechanism disposed on the module bracket, and the anti-shake mechanism is connected to the image sensor chip to drive the image sensor chip to translate within a set plane.

[0026] In some embodiments, the anti-shake mechanism includes:

[0027] An anti-shake support, connected to the module support;

[0028] A translation bracket, movably arranged on the anti-shake support, and the moving direction of the translation bracket is located in the set plane, and the image sensor chip is arranged on the translation bracket;

[0029] A driving assembly is connected to the anti-shake support and the translation support to drive the translation support to move relative to the anti-shake support within the set plane.

[0030] In some embodiments, the drive assembly comprises:

[0031] A first driving member, comprising a first coil and a first magnet which are arranged opposite to each other and are respectively arranged on the translation bracket and the anti-shake support, and the first coil is electrically connected to the flexible circuit board;

[0032] A second driving member, comprising a second coil and a second magnet arranged opposite to each other, which are respectively arranged on the translation bracket and the anti-shake support, and the second coil is electrically connected to the flexible circuit board;

[0033] Among them, the first driving member drives the translation bracket to move along the first direction, and the second driving member drives the translation bracket to move along the second direction, the first direction and the second direction are orthogonal, and the first driving member is divided into two groups, which are arranged at intervals along the second direction, and the second driving member is located between the two groups of first driving members, and the second driving member and the two groups of first driving members are both arranged in the gap between the lens and the image sensor.

[0034] In some embodiments, the drive assembly comprises:

[0035] A first driving member, comprising a first coil and a first magnet which are arranged opposite to each other and are respectively arranged on the translation bracket and the anti-shake support, wherein the first coil is electrically connected to the flexible circuit board;

[0036] A second driving member, comprising a second coil and a second magnet arranged opposite to each other, which are respectively arranged on the translation bracket and the anti-shake support, and the second coil is electrically connected to the flexible circuit board;

[0037] The first driving member drives the translation bracket to move along a first direction, and the second driving member drives the translation bracket to move along a second direction, the first direction and the second direction are orthogonal, and the second driving member is arranged in a gap between the lens and the image sensor, or the second driving member is arranged on a side of the image sensor away from the lens, and the first driving member is arranged beside the second driving member.

[0038] In some embodiments, the drive assembly further comprises:

[0039] an intermediate bracket, comprising a first support arm and a second support arm connected at one end, the first support arm and the first driving member being arranged between the translation bracket and the side edge regions of the anti-shake support at intervals along the second direction, and the second support arm and the second driving member being arranged between the translation bracket and the side edge regions of the anti-shake support at intervals along the first direction;

[0040] a first ball bearing, rolling and abutting between the intermediate bracket and the translation bracket;

[0041] The second ball rolls and abuts between the intermediate bracket and the anti-shake support.

[0042] The embodiments of the present application have at least the following beneficial effects:

[0043] The camera module provided in the embodiment of the present application includes a module bracket, a prism, a lens, an image sensor chip and a flexible circuit board; the prism, the lens and the image sensor chip are installed based on the module bracket, and the lens and the image sensor chip are arranged on the same side of the prism at intervals along the length direction of the prism, so that light is projected into the prism after passing through the lens, and is emitted after multiple reflections in the prism, and then projected onto the image sensor chip, thereby realizing telephoto shooting. The flexible circuit board is electrically connected to the image chip, and the flexible circuit board is bent and arranged in the gap between the lens and the image sensor, so that the lens, the image sensor chip and the flexible circuit board are all located within the prism range, thereby reducing the specifications of the flexible circuit board extending outside the prism to a certain extent, thereby reducing the overall specifications of the camera module; that is, the electrical connection structure such as the flexible circuit board is arranged between the lens and the image sensor chip, and its original placement space is left for the prism, so that the prism specification can be relatively larger, thereby obtaining a larger telephoto range when the overall specifications of the camera module are equivalent, which is convenient for expanding the application range; or, only the electrical connection structure such as the flexible circuit board is arranged between the lens and the image sensor chip, so that the overall specifications of the camera module are greatly reduced, which helps to expand the application range of the camera module; in summary, by arranging the electrical connection structure such as the flexible circuit board between the lens and the image sensor core, the camera module can take into account a large telephoto range and an overall smaller specification, thereby expanding the application range of the telephoto camera module to a certain extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0045] Figure 1 A schematic diagram of the three-dimensional structure of the camera module in an embodiment of the present application is shown;

[0046] Figure 2 Shows Figure 1 An exploded view of the camera module in Figure 1;

[0047] Figure 3 Shows Figure 1 A cross-sectional view of the camera module in FIG.

[0048] Figure 4 Shows Figure 1 A schematic diagram of the area planning of the incident surface and the exit surface on the prism in the camera module;

[0049] Figure 5 Shows Figure 1A three-dimensional schematic diagram of the camera module from another angle;

[0050] Figure 6 Shows Figure 1 A cross-sectional view of a lens in a camera module;

[0051] Figure 7 Shows Figure 1 A schematic diagram of a first structure of a flexible circuit board in a camera module;

[0052] Figure 8 Shows Figure 1 A schematic diagram of the structure of a driving component in a camera module;

[0053] Fig. 9 Shows Figure 8 A bottom view of a driving assembly in a camera module;

[0054] Fig.10 Shows Figure 1 A partial cross-sectional view of the length direction of the camera module;

[0055] Fig.11 Shows Figure 1 A partial cross-sectional view of the width direction of the camera module;

[0056] Fig.12 Shows Figure 1 A schematic diagram of the structure of the translation bracket in the camera module;

[0057] Fig.13 Shows Figure 1 A schematic diagram of the structure of a module bracket in a camera module;

[0058] Fig.14 Another schematic diagram of the stereoscopic structure of the camera module in the embodiment of the present application is shown;

[0059] Fig.15 Shows Fig.14 A schematic diagram of the structure of a flexible circuit board in a camera module;

[0060] Fig.16 Shows Fig.14 A cross-sectional view of the camera module in FIG.

[0061] Fig.17 Shows Fig.14 A partial cross-sectional view of the length direction of the camera module;

[0062] Fig.18 Shows Fig.14 A partial cross-sectional view of the width direction of the camera module;

[0063] Fig.19 Shows Fig.14 A schematic diagram of the structure of a driving component in a camera module;

[0064] Fig. 20 Shows Fig.19 A bottom view of a driving assembly in a camera module;

[0065] Fig.21 Shows Fig.14 A three-dimensional schematic diagram of the camera module from another angle;

[0066] Fig. 22 Shows Figure 1 Schematic diagram of another arrangement of the first driving member and the second driving member in the camera module

[0067] Fig.23 Shows Figure 1 Another structural schematic diagram of a flexible circuit board in a camera module;

[0068] Fig.24 Shows Fig.23 A top view of the flexible circuit board in FIG. DETAILED DESCRIPTION

[0069] The present application is described below with reference to the accompanying drawings and specific embodiments:

[0070] The telephoto camera module is equipped with electrical connection structures such as prism, lens, image sensor chip and module circuit board. Usually, in order to obtain a larger telephoto shooting ratio, the length and height specifications of the prism can be set larger, which also makes the specifications of the telephoto module larger, which is not conducive to mounting and installation, and limits the application scope of the telephoto module.

[0071] To this end, the embodiments of the present application provide a camera module and an electronic device, which aim to solve the technical problem of the large length specification of the telephoto camera module to a certain extent, so as to achieve the technical effect of taking into account both a large telephoto shooting ratio and a smaller module specification.

[0072] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 as well as Figure 5 In some embodiments, the camera module can be configured as a telephoto camera module based on the principle of prism folded optical path, and the camera module may include a module bracket 1, a prism 2, a lens 3, an image sensor chip 4 and a flexible circuit board 5.

[0073] The lens 3 and the image sensor chip 4 are respectively arranged on the same side of the prism 2. After the light passes through the lens 3, it enters the prism 2 and is emitted after multiple reflections in the prism 2, and then projected onto the image sensor chip 4. The image sensor chip 4 generates a shooting signal and outputs it through the flexible circuit 5, thereby realizing the acquisition of imaging light and signal conversion, and completing telephoto shooting.

[0074] The module bracket 1 is a supporting base of the camera module, and can be used to install and support the prism 2, the lens 3 and the image sensor chip 4. The module bracket 1 can also be used as a mounting base to mount and fix the camera module as a whole to the terminal device.

[0075] The prism 2 guides the received light to be reflected twice or more in the prism 2, extending the light path, and then emitting from the prism 2. Correspondingly, an incident surface 211 and an exit surface 212 are arranged at intervals on the same side of the prism 2, and the light enters the prism 2 from the incident surface 211 and is emitted from the exit surface 212; correspondingly, a plurality of reflecting surfaces are also arranged in the prism 2, which are used to receive and reflect the light, and finally reach the exit surface 212 and emit from the prism 2. Among them, the angle between the reflecting surface and the incident light can be flexibly set to achieve different reflection times and paths, and to achieve different amplitudes of light path extension.

[0076] The lens 3 is disposed on one side of the prism 2, that is, the side where the incident surface 211 is located, and the light emitting end of the lens 3 is directly opposite to the incident surface 211, and the light emitted from the lens 3 is projected onto the incident surface 211 and then enters the prism 2. Generally speaking, the incident surface 211 can be set as a plane, and the light emitted from the lens 3 is perpendicular to the incident surface 211 and enters the prism 2.

[0077] The image sensor chip 4 is used to receive light signals, convert them into electrical signals and output them to the signal processing device to achieve imaging. The image sensor chip 4 can also be set on one side of the prism 2, that is, the side where the exit surface 212 is located, and the light emitted from the exit surface 212 can be projected onto the image sensor chip 4 to achieve imaging light signal acquisition. Generally speaking, the image sensor chip 4 is configured with a photosensitive surface, which is opposite to the exit surface 212 and receives the light emitted from the exit surface 212. The exit surface 212 can be set as a plane, and the light is emitted from the prism 2 perpendicular to the exit surface 212, and can be projected perpendicularly to the photosensitive surface of the image sensor chip 4.

[0078] It is worth noting that the image sensor chip 4 can be configured with a chip holder, auxiliary circuits and other auxiliary functional parts for fixing and electrically connecting the image sensor chip 4, which will not be described in detail here.

[0079] The flexible circuit board 5 is electrically connected to the image sensor chip 4, and is used for the communication between the image sensor chip 4 and the signal processing device of the camera module. The flexible circuit board 5 can also be arranged in the gap between the lens 3 and the image sensor chip 4; that is, the flexible circuit board 5 can be adapted to be placed in the gap between the lens 3 and the image sensor chip 4 through a morphological bending design, so that the first direction X space of the prism 2 can be fully utilized, and the space occupied by the module circuit board and other electrical connection structures around the prism 2 can be reduced to a certain extent, thereby reducing the overall specifications of the camera module, and the required installation space can also be reduced, which helps to expand the range of terminals that can be equipped with applications.

[0080] The camera module and electronic device provided in the embodiments of the present application include a module bracket, a prism, a lens, an image sensor chip and a flexible circuit board; the prism, the lens and the image sensor chip are installed based on the module bracket, and the lens and the image sensor chip are arranged on the same side of the prism at intervals along the length direction of the prism, so that light is projected into the prism after passing through the lens, and is emitted after multiple reflections in the prism, and then projected onto the image sensor chip, thereby realizing telephoto shooting. The flexible circuit board is electrically connected to the image chip, and the flexible circuit board is bent and arranged in the gap between the lens and the image sensor, so that the lens, the image sensor chip and the flexible circuit board are all located within the prism range, thereby reducing the specifications of the flexible circuit board extending outside the prism to a certain extent, thereby reducing the overall specifications of the camera module; that is, the electrical connection structure such as the flexible circuit board is arranged between the lens and the image sensor chip, and its original placement space is left for the prism, so that the prism specification can be relatively larger, thereby obtaining a larger telephoto range when the overall specifications of the camera module are equivalent, which is convenient for expanding the application range; or, only the electrical connection structure such as the flexible circuit board is arranged between the lens and the image sensor chip, so that the overall specifications of the camera module are greatly reduced, which helps to expand the application range of the camera module; in summary, by arranging the electrical connection structure such as the flexible circuit board between the lens and the image sensor core, the camera module can take into account a large telephoto range and an overall smaller specification, thereby expanding the application range of the telephoto camera module to a certain extent.

[0081] See also Figure 2 , Figure 3 , Figure 4 and Fig.13 In some examples, the module bracket 1 is provided with a corresponding groove 11 for accommodating the prism 2 and exposing a side surface where the incident surface 211 and the exit surface 212 are located.

[0082] The lens 3 and the image sensor chip 4 are correspondingly mounted on the module bracket 1 and face the incident surface 211 and the exit surface 212 .

[0083] Generally speaking, the first surface 21 is the longest surface of the prism 2 ; the prism 2 can be configured as a substantially trapezoidal prism column, that is, the second surface 22 can be substantially trapezoidal.

[0084] See also Figure 2 , Figure 3 , Figure 4 and Figure 6 In some embodiments, in order to meet the focusing requirements and reduce the space requirements for the lens focusing operation, the lens 3 may include a first lens group 31 and a second lens group 32; the first lens group 31 and the second lens group 32 may be stacked on the same optical axis on one side of the incident surface 211, and the light passes through the first lens group 31 and the second lens group 32 in sequence and then is projected onto the incident surface 211.

[0085] In order to achieve the focusing operation, the first lens group 31 or the second lens group 32 can be set to a movable form, that is, the first lens group 31 or the second lens group 32 can be movably installed on the module bracket 1, so that the first lens group 31 or the second lens group 32 can approach or move away from the incident surface 211 along the direction of its optical axis to achieve the focusing operation.

[0086] That is to say, only one group of lenses is moved, rather than moving a complete lens composed of multiple groups of lenses and a lens barrel as a whole, so that the overall installation space and action space of the lens 3 are basically stable, and the risk of interference with the surroundings is low, thereby facilitating adaptation to the installation space of the terminal device.

[0087] Generally speaking, a lens holder 33 may be provided in the lens 3 to fix one of the first lens group 31 or the second lens group 32. Taking the solution in which the first lens group 31 is fixed and the second lens group 32 is movable as an example, the lens holder 33 may be fixed on the lens holder 33, the second lens group 32 may be movably provided on the lens holder 33, and the lens holder 33 has the function of guiding and limiting the second lens group 32 in the direction of its optical axis.

[0088] In some embodiments, the first lens group 31 and the second lens group 32 can of course be configured as two independent lens groups. The first lens group 31 and the second lens group 32 are both movable and have greater adjustment freedom to meet the needs of a larger adjustment range, thereby ensuring that the first lens group 31 and the second lens group 32 can be relatively close or far away to achieve focusing.

[0089] In some embodiments, in order to move the first lens group 31 or the second lens group 32, the camera module may include a focus motor 6, which is connected to the second lens group 32 or the first lens group 31 to drive the second lens group 32 or the first lens group 31 to move along its optical axis.

[0090] The focus motor 6 can be electrically connected to the flexible circuit board 5 to achieve communication with an external control device. In addition, the circuit structure in the camera module can be centrally integrated and arranged in an integrated and shared manner, thereby reducing the scale of the circuit structure to a certain extent.

[0091] Exemplarily, the electrical connection end of the focus motor 6 can be set in the gap area between the lens 3 and the image sensor chip 4, so as to make full use of the installation space of the prism 2 in the connection direction of the lens 3 and the image sensor chip 4, compactly simplify the layout of the circuit structure in the camera module, and reduce the risk of interference.

[0092] In some embodiments, the focus motor 6 can be configured with a motor bracket 61, and the motor bracket 61 is matched and installed on the module bracket 1. The focus motor body 6 can be installed on the module bracket 1 through the motor bracket 61, and the second lens group 32 can be connected to the focus motor 6 to drive the second lens group 32 to move.

[0093] In some embodiments, the lens bracket 33 and the motor bracket 61 can be connected, and the motor bracket 61 can be installed on the module bracket 1. The lens bracket 33 and the motor bracket 61 can be stably installed on the module bracket 1 to form an integrated installation base, thereby maintaining the stability of the relative posture of the first lens group 31 and the second lens group 32.

[0094] In some embodiments, the focus motor 6 may adopt a voice coil motor principle structure, that is, the focus motor 6 may include a focus coil and a focus magnet, and one of the focus coil and the focus magnet is arranged on the second lens group 32, and the other is arranged on the motor bracket 61. By controlling the magnitude and direction of the current loaded on the focus coil, the second lens group 32 is controlled to move along the optical axis to achieve focusing.

[0095] Generally speaking, the focus coil and the focus magnet can be relatively arranged on the side close to the image sensor chip 4, so that the gap between the image sensor chip 4 and the lens 3 can be utilized to a certain extent to accommodate the installation of the focus coil and the focus magnet, so that the gap between the image sensor chip 4 and the lens 3 can be utilized to a certain extent to reduce the overall size of the module to a certain extent.

[0096] See also Figure 4 , Figure 8, Fig. 9 , Fig.10 , Fig.11 , Fig.12 , Fig.19 and Fig. 20 In some embodiments, in order to improve the quality of dynamic shooting, the camera module may further include an anti-shake mechanism 7, and the anti-shake mechanism 7 is arranged on the module bracket 1. The image sensor chip 4 is connected to the anti-shake mechanism 7 to drive the image sensor chip 4 to move, realize optical anti-shake compensation, and improve imaging quality.

[0097] Generally speaking, the anti-shake mechanism 7 can drive the image sensor chip 4 to translate in a set plane S to achieve anti-shake. The set plane S can be perpendicular to the light of the exit surface 212; that is, the set plane S and the exit surface 212 can be set in a parallel state.

[0098] Specifically, the anti-shake mechanism 7 can drive the image sensor chip 4 to move along the set plane S; to this end, the anti-shake mechanism 7 can include an anti-shake support 71, a translation support 72, and a driving component 73. The anti-shake support 71 can be arranged on the module support 1, the translation support 72 can be movably arranged on the anti-shake support 71, and the driving component 73 is connected to the anti-shake support 71 and the translation support 72, so that the driving component 73 can drive the translation support 72 to move in a plane parallel to the set plane S relative to the anti-shake support 71, so as to keep the image sensor chip 4 stable in translation in the set plane S.

[0099] In some embodiments, the driving component 73 can drive the translation bracket 71 and the image sensor chip 4 to translate along two vertical directions within the set plane S to achieve optical image stabilization compensation.

[0100] Generally speaking, the driving component 73 drives the translation bracket 71 to move in two orthogonal directions, which can be set to a first direction X and a second direction Y, so that the structure of the anti-shake mechanism 7 can be regularly arranged along the first direction X and the second direction Y, which can make full use of the installation space of the prism and reduce the overall volume of the camera module to a certain extent.

[0101] In some embodiments, the driving assembly 73 may include a first driving member 731 and a second driving member 732, which are respectively connected between the anti-shake support 71 and the translation bracket 72, and provide driving force along the first direction X and the second direction Y to drive the translation bracket 72 to translate.

[0102] In some embodiments, the driving component 73 may adopt a non-contact driving structure, that is, the driving force between the anti-shake support 71 and the translation bracket 72 is non-contact, which reduces the interference amplitude of the driving component 73 on the moving posture of the image sensor chip 4 and the translation bracket 72 to a certain extent.

[0103] The first driving member 731 may include a first coil 731a and a first magnet 731b, which are respectively arranged on the translation bracket 72 and the anti-shake support 71, the first coil 731a and the first magnet 731b are arranged opposite to each other, the first coil 731a is electrically connected to the flexible circuit board 5, and the first coil 731a is arranged within the magnetic field range of the first magnet 731b. Therefore, current can be applied to both ends of the first coil 731a, so that the first coil 731a that is energized is subjected to the magnetic field force of the first magnet 731b, so that the first coil 731a that is energized and the translation bracket 72 move relative to the anti-shake support 71.

[0104] Generally speaking, the translation bracket 72 and the anti-shake support 71 can be moved along the first direction X by setting the positions of the first magnet 731 b and the first coil 731 a.

[0105] The second driving member 732 may include a second coil 732a and a second magnet 732b, which are respectively arranged on the translation bracket 72 and the anti-shake support 71, the second coil 732a and the second magnet 732b are arranged opposite to each other, the second coil 732a is electrically connected to the flexible circuit board 5, and the second coil 732a is arranged within the magnetic field range of the second magnet 732b. Therefore, current can be applied to both ends of the second coil 732a, so that the energized second coil 732a is subjected to the magnetic field force of the second magnet 732b, so that the energized second coil 732a and the translation bracket 72 move relative to the anti-shake support 71.

[0106] Generally speaking, the translation bracket 72 and the anti-shake support 71 can be moved along the second direction Y by setting the positions of the second magnet 732 b and the second coil 732 a .

[0107] See also Figure 4 In some embodiments, the incident surface 211 and the exit surface 212 can be configured on the same side surface of the prism 2, that is, the surface where the incident surface 211 and the exit surface 212 are located is the first surface 21, and the first direction X can be configured as the direction of the line connecting the incident surface 211 and the exit surface 212, and the second direction can be configured as an orthogonal direction to the direction of the line connecting the incident surface 211 and the exit surface 212.

[0108] In order to realize the driving operation of the driving component 73 in the first direction X and the second direction Y, and take into account the compact layout effect, the first driving member 731 can be arranged on one side of the prism 2 in the second direction Y, and the second driving member 732 can be arranged in the gap between the lens 3 and the image sensor 4.

[0109] Generally speaking, the first surface 21 where the incident surface 211 and the exit surface 212 are located can be set as a regular rectangular surface, the length direction of the rectangular surface is set along the first direction X, and the width direction is set along the second direction Y. Accordingly, the surfaces of the first surface 21 connected on both sides of the second direction Y are configured as the second surface 22 of the prism 2.

[0110] The first driving member 731 drives the translation bracket 72 to move along the length direction of the rectangular surface, and the second driving member 732 drives the translation bracket 72 to move along the width direction of the rectangular surface, so that the translation bracket 72 moves within the range of the first surface 21 without exceeding it, which helps to reduce the overall specifications of the camera module to a certain extent.

[0111] See also Fig.16 , Fig.17 , Fig.19 and Fig. 20 In some embodiments, the second driving member 732 may also be arranged on a side of the image sensor 4 away from the lens 3 to avoid the structure in the gap between the lens 3 and the image sensor chip 4 being too complicated, which can reduce the interference risk and the difficulty of structural arrangement to a certain extent.

[0112] See also Fig.10 and Fig.11 In some embodiments, in order to improve the moving smoothness of the translation bracket 72 , the translation bracket 72 may be rolling supported on the anti-shake support 71 .

[0113] To this end, the driving assembly 73 may also include an intermediate bracket 733, a first ball 734 and a second ball 735; wherein the translation bracket 72, the intermediate bracket 733 and the anti-shake support 71 are stacked in sequence along the normal direction of the set plane S, that is, the translation bracket 72, the intermediate bracket 733 and the anti-shake support 71 are stacked in sequence along the emission direction of the light on the exit surface 212; the first ball 734 rolls and abuts between the translation bracket 72 and the intermediate bracket 733, and the second ball 735 rolls and abuts between the intermediate bracket 733 and the anti-shake support 71.

[0114] That is to say, the translation bracket 72 can translate stably relative to the intermediate bracket 733 through the first ball 734 , and the intermediate bracket 733 can translate stably relative to the anti-shake support 71 through the second ball 735 .

[0115] In some embodiments, in order to prevent the first ball 734 and the second ball 735 from being excessively displaced and affecting the supporting stability of the intermediate bracket 733 and the translation bracket 72, a first guide groove 733a and a second guide groove 733b may be opened on the intermediate bracket 733, and the first ball 734 is rollingly set in the first guide groove 733a, and the second ball 735 is rollingly set in the second guide groove 733b, so as to realize the limiting of the first ball 734 and the second ball 735.

[0116] It is worth noting that the first guide groove 733 a and the second guide groove 733 b may be provided on both side surfaces of the intermediate bracket 733 , that is, on one side surface of the intermediate bracket 733 facing the anti-shake support 71 and the translation bracket 72 .

[0117] In some embodiments, in order to adapt to the anti-shake movement of the translation bracket 72 in the first direction X and the second direction Y, the guiding direction of the first guide groove 733a can be set to the first direction X, and the guiding direction of the second guide groove 733b can be set to the second direction Y. That is, the guiding directions of the first guide groove 733a and the second guide groove 733b are perpendicular.

[0118] See also Figure 8 , Fig. 9 , Fig.19 and Fig. 20 In some embodiments, in order to limit the overall height of the anti-shake mechanism 7, the intermediate bracket 733 can be set as an L-shaped member, that is, the intermediate bracket 733 covers a local area between the translation bracket 72 and the anti-shake support 71, and the remaining area is used to accommodate the first driving member 731 and the second driving member 732, so that the space between the anti-shake support 71 and the translation bracket 72 can be fully utilized, which helps to reduce the overall height of the camera module.

[0119] Specifically, the intermediate bracket 733 may include a first support arm 733c and a second support arm 733d, wherein one end of the first support arm 733c is connected to the second support arm 733d, thereby forming an L-shaped bracket. The first support arm 733c may be arranged between the translation bracket 72 and the anti-shake support 71 along the first direction X, and the second support arm 733d may be arranged between the translation bracket 72 and the anti-shake support 71 along the second direction Y.

[0120] That is to say, the arrangement of the first driving member 731 and the second driving member 732 is similar to an L-shape, which can be staggered with the L-shape of the intermediate bracket 733 to roughly form a ring frame structure, thereby fully improving space utilization and reducing the overall height of the camera module.

[0121] In some embodiments, the first support arm 733c and the second support arm 733d can be arranged adjacent to the edge area of ​​the translation bracket 72, and correspondingly, the first driving member 731 and the second driving member 732 can also be arranged adjacent to the edge area of ​​the translation bracket 72, leaving the middle area as the placement area of ​​the image sensor chip 4, thereby fully reducing the overall height of the anti-shake mechanism 7 and the image sensor chip 4, reducing the overall height specification of the camera module to a certain extent, and facilitating the installation and application of the camera module.

[0122] Specifically, the first driving member 731 and the first supporting arm 733c are arranged at intervals on both side edge areas of the translation bracket 72 along the second direction Y, and the second supporting arm 733d and the second driving member 732 are arranged on both side edge areas of the translation bracket 72, thereby leaving a middle area of ​​the translation bracket 72 for accommodating the installation of the image sensor chip 4.

[0123] See also Fig.12 In some embodiments, a third guide groove 721 may be provided on the translation bracket 72 , opposite to the first guide groove 733 a , so as to jointly constrain the first ball 734 .

[0124] Generally speaking, the third guide groove 721 can be disposed in a side area of ​​the translation bracket 72 .

[0125] The middle parts of the translation bracket 72 and the anti-shake support 71 are formed into windows so that the light emitted from the exit surface 212 can be projected onto the image sensor chip 4 .

[0126] See also Figure 1 , Figure 7 , Fig.10 and Fig.11 In some embodiments, at least part of the flexible circuit board 5 can be placed close to the surface of the prism 2, thereby reducing the overall specifications of the camera module to a certain extent. In order to adapt to the arrangement position of the prism 2 and the image sensor chip 4, and take into account the small space occupation requirement, the flexible circuit board 5 can be configured as a first implementation; that is, the flexible circuit board 5 can include a chip connection circuit board 51, a first buffer circuit board 52, and a second buffer circuit board 53 connected in sequence.

[0127] The chip connection circuit board 51 can be matched and electrically connected with the image sensor chip 4, and the image sensor chip 4 can be mounted and fixed on the chip connection circuit board 51 to ensure the stability of the electrical connection. Generally speaking, the image sensor chip 4 can be stacked along the board thickness direction; that is, the image sensor chip 4, the chip connection circuit board 51 and the exit surface 212 are arranged in a substantially parallel posture.

[0128] The first buffer circuit board 52 is electrically connected to the chip connection circuit board 51, and the first buffer circuit board 52 can be erected on the outer side of the second surface 22 of the prism 2 along the thickness direction of the chip connection circuit board 51, that is, the first buffer circuit board 52 is adjacent to the second surface 22 and is erected on one side of the prism 2 along the thickness direction of the chip connection circuit board 51, so that the overall height of the first buffer circuit board 52 will not exceed the overall height of the prism 2, the image sensor chip 4 and the chip connection circuit board 51 in the stacking direction, thereby not increasing the overall height.

[0129] The second buffer circuit board 53 is electrically connected to the first buffer circuit board 52. The second buffer circuit board 53 is vertically arranged in the gap between the lens 3 and the image sensor 4 along the thickness direction of the chip connection circuit board 51, that is, it is vertically arranged on one side of the first surface 21. The gap between the lens 3 and the image sensor chip 4 can be used to accommodate the second buffer board 53, thereby making full use of the gap between the lens 3 and the image sensor chip 4 without increasing the occupied space of the camera module.

[0130] That is to say, by dividing the flexible circuit board 5 into three continuous sections, which are respectively adapted to the flat position of the image sensor chip 4, the upright position on the outside of the prism 2, and the gap position between the lens 2 and the image sensor chip 4, and correspondingly adapted to the shapes of the above three positions of the prism 2, the flexible circuit board 5 can be segmented to adapt to the posture and layout of each component in the camera module, fully utilize the space between the components, reduce the overall scale of the camera module, and reduce the space occupation requirement.

[0131] In some embodiments, the board surface of the first buffer circuit board 52 can be turned toward the second surface 22, so as to reduce the overall width of the first buffer circuit board 52 and the prism 2 in the second direction Y, which can reduce the overall space occupied by the module circuit board to a certain extent, and help expand the application range of the camera module.

[0132] At the same time, since the translation bracket 72 will translate along the second direction Y for anti-shake, when the surface of the first buffer circuit board 52 is facing the second surface 22, the first buffer circuit board 52 can improve the smoothness of the movement of the translation bracket 72 and the image sensor chip 4 along the second direction Y by smoothly deflecting and deforming, thereby limiting the vibration amplitude.

[0133] In some embodiments, in order to improve the smoothness of the movement of the translation bracket 72 driven by the anti-shake mechanism 7 and limit the vibration amplitude, the surface of the second buffer circuit board 53 can be roughly orthogonal to the first direction X, that is, the second buffer circuit board 53 can improve the smoothness of the movement of the translation bracket 72 and the image sensor chip 4 along the first direction X through smooth deflection deformation and limit the vibration amplitude.

[0134] See also Fig.14 , Fig.15 , Fig.16 , Fig.17 , Fig.18 , Fig.19 and Fig. 20 In other embodiments, in order to improve the force balance of the translation bracket 72 in the second direction Y, the flexible circuit board 5 can also be configured as a second implementation scheme, that is, the flexible circuit board 5 can also include a third buffer circuit board 54 and a fourth buffer circuit board 55 connected to each other on the basis of its first implementation scheme.

[0135] Among them, the third buffer circuit board 54 is electrically connected to the chip connection circuit board 51, and the third buffer circuit board 54 can be erected on the outside of the second direction Y of the prism 2 along the thickness direction of the chip connection circuit board 51, and the third buffer circuit board 54 and the first buffer circuit board 52 are symmetrically arranged on both sides of the prism 2 along the second direction Y.

[0136] On the one hand, the third buffer circuit board 54 can be erected on the outside of the second direction Y of the prism 2, so that the overall height of the third buffer circuit board 54 will not exceed the overall height of the prism 2, the image sensor chip 4 and the chip connection circuit board 51 in the stacking direction, thereby not increasing the overall height; on the other hand, the third buffer circuit board 54 and the first buffer circuit board 52 are symmetrically arranged on both sides of the prism 2 along the second direction Y, so that the translation bracket 72 and the image sensor chip 4 are subjected to force on both sides of the width direction of the prism 2, thereby limiting the posture change amplitude during the anti-shake movement caused by unilateral force, such as the tilting amplitude in the thickness direction.

[0137] The fourth buffer circuit board 55 is electrically connected to the third buffer circuit board 54. The fourth buffer circuit board 55 is vertically arranged in the gap between the lens 3 and the image sensor 4 along the thickness direction of the chip connection circuit board 51. The gap between the lens 3 and the image sensor chip 4 can be used to accommodate the fourth buffer board 55, thereby fully utilizing the gap between the lens 3 and the image sensor chip 4 without increasing the occupied space of the camera module.

[0138] That is to say, by adapting the third buffer circuit board 54 and the fourth buffer circuit board 55 to the standing position of the prism 2 and the gap posture between the lens 2 and the image sensor chip 4, respectively, the flexible circuit board 5 can be segmented to adapt to the posture and layout of each component in the camera module, making full use of the space between the components, reducing the overall scale of the camera module, and reducing the space occupation requirement.

[0139] In some embodiments, the board surface of the third buffer circuit board 54 can be oriented toward the side of the prism 2 in the second direction Y, so that the overall width of the third buffer circuit board 54 and the prism 2 in the second direction Y of the prism 2 can be reduced, which can reduce the overall space occupied by the module circuit board to a certain extent, and help expand the application range of the camera module.

[0140] At the same time, since the translation bracket 72 will translate along the second direction Y with anti-shake, when the surface of the third buffer circuit board 54 is facing the side of the prism 2 in the second direction Y, the third buffer circuit board 54 can improve the smoothness of the movement of the translation bracket 72 and the image sensor chip 4 along the second direction Y by smoothly deflecting and deforming, thereby limiting the vibration amplitude.

[0141] In some embodiments, in order to improve the smoothness of the movement of the translation bracket 72 driven by the anti-shake mechanism 7 and limit the vibration amplitude, the board surface of the fourth buffer circuit board 55 can be turned toward the side of the translation bracket 72 on the first direction X of the prism 2, that is, the fourth buffer circuit board 54 can improve the smoothness of the movement of the translation bracket 72 and the image sensor chip 4 along the first direction X by smoothly deflecting and deforming, thereby limiting the vibration amplitude.

[0142] See also Fig.14 , Fig.15 and Fig. 22In some embodiments, since the first buffer circuit board 52 and the third buffer circuit board 54 are arranged along the first direction X, and the board surfaces of the second buffer circuit board 53 and the fourth buffer circuit board 55 are substantially perpendicular to the first direction X, a door-shaped frame is formed, and the structural strength and stability of the door-shaped frame in the first direction X are greater than the structural strength and stability of the door-shaped frame in the second direction Y.

[0143] That is to say, the resistance of the image sensor chip 4 driven by the anti-shake mechanism 7 to move along the first direction X will also be greater than the resistance of the image sensor chip 4 along the second direction Y.

[0144] To this end, the number of the first driving members 731 can be set to two groups, that is, the first magnets 731b and the first coils 731a are two groups, so as to obtain a greater driving force, overcome the resistance of the flexible circuit board 5, and ensure the accuracy of the anti-shake movement.

[0145] It is worth noting that, in order to maintain the balance and stability of the force, two groups of first driving members 731 may be arranged on both sides of the image sensor chip 4 .

[0146] In some embodiments, considering that the two groups of first driving members 731 double the occupied space, in order to reduce the impact on the overall length and width specifications of the camera module, the two groups of first driving members 731 can be set in the area between the image sensor chip 4 and the lens 3. To a certain extent, there is no need to consider the width of the graphic sensor chip 4, and the two groups of first driving members 731 are set closer, so that the width specification of the entire camera module can be reduced to a certain extent, that is, the area between the image sensor chip 4 and the lens 3 is fully utilized to reduce the width specification of the camera module.

[0147] Generally speaking, the second driving member 732 can also be arranged in the area between the image sensor chip 4 and the lens 3 to form a symmetrical arrangement state such as a U-shape or an I-shape, so as to ensure the balance of the anti-shake force and take into account the driving force strength in the length direction.

[0148] Accordingly, the length specifications of the translation bracket 72 and the anti-shake support 71 can be adaptively set to accommodate the two groups of first driving members 731 and second driving members 732 .

[0149] See also Fig.23 and Fig.24In some embodiments, in order to further limit the width of the flexible circuit board 5, the flexible circuit board 5 can be configured as a third implementation scheme; specifically, the flexible circuit board 5 includes a chip connection circuit board 51 and a fifth buffer circuit board 56, and the chip connection circuit board 51 is electrically connected to the fifth buffer circuit board 56.

[0150] The chip connection circuit board 51 can be matched with the image sensor chip 4 for electrical connection, and the image sensor chip 4 can be mounted and fixed on the chip connection circuit board 51 to ensure the stability of the electrical connection.

[0151] The fifth buffer circuit board 56 can be disposed in the gap between the lens 3 and the image sensor 4 , utilizing the space in the length direction of the prism 2 , improving space utilization, and reducing the specification in the width direction.

[0152] In order to adapt to the anti-shake movement process of the image sensor chip 4, the overall shape of the fifth buffer circuit board 56 can be set to be able to stably deform and reset in the anti-shake movement direction. Specifically, the fifth buffer circuit board 56 is reciprocated in the plate thickness direction to form a multi-layer plate shape, thereby forming a spring-like plate shape, which can generate stable elastic expansion and contraction deformation in the plate thickness direction, and can stably elastically swing left and right in a direction orthogonal to the plate thickness direction.

[0153] One end of the chip circuit board 51 close to the lens 3 is connected to the fifth buffer circuit board 56; and the thickness direction of the fifth buffer circuit board 56 is arranged along the first direction X, so that the fifth buffer board 56 can be elastically deformed along the first direction X to adapt to the anti-shake movement of the image sensor chip 4 along the first direction X; on the other hand, when the image sensor chip 4 moves along the second direction Y for anti-shake, the fifth buffer circuit board 56 can stably swing left and right to adapt to the position change of the image sensor chip 4 and reduce interference with the posture of the image sensor chip 4 during movement.

[0154] In some embodiments, the image sensor chip 4 can be stacked on the chip connection circuit board 51 along the board thickness direction; that is, the image sensor chip 4, the chip connection circuit board 51 and the exit surface 212 are arranged in a substantially parallel posture.

[0155] In some embodiments, the chip connection circuit board 51 can also be set as a gate-shaped circuit board, and the image sensor chip 4 can be set in the middle empty area 512 of the gate-shaped circuit board. The two side edges of the image sensor chip 4 are respectively connected to the two side plates 511 of the gate-shaped circuit board, so as to maintain the balance of force on the image sensor chip 4 during the movement.

[0156] In some embodiments, in order to realize the fifth buffer circuit board 56, the fifth buffer circuit board 56 can be formed into a multi-section plate body through a bending process; that is, the fifth buffer circuit board 56 may include a connecting plate 561, a first plate body 562, a first turning plate 563, a second plate body 564, a second turning plate 565 and a third plate body 566.

[0157] The first plate 562, the second plate 564 and the third plate 566 can be arranged at intervals, and the first plate 562, the second plate 564 and the third plate 566 are vertically arranged in the gap between the lens 3 and the image sensor chip 4 along the thickness direction of the chip connection circuit board 51, and in the initial position state, the plate surfaces of the first plate 562, the second plate 564 and the third plate 566 can be orthogonal to the first direction X; the first end of the first plate 562 is connected to the chip 4 through the connecting plate 561. The first plate 562 is connected to the connecting circuit board 51, the second end of the first plate 562 is connected to the first end of the second plate 564 through the first turning plate 563, the second end of the second plate 564 is connected to the third plate 566 through the second turning plate 565, and in the initial position state, the plate surfaces of the first turning plate 563 and the second turning plate 565 are arranged in parallel, and the first turning plate 563 and the second turning plate 565 are erected in the gap between the lens 3 and the image sensor chip 4 along the thickness direction of the chip connecting circuit board 51.

[0158] That is to say, by setting the fifth buffer circuit board 56 into a bent spring-like plate form, the installation space requirement of the flexible circuit board 5 can be reduced, and the anti-shake position change of the image sensor chip 4 can be cleverly coordinated to ensure the reliability of the anti-shake function.

[0159] In some embodiments, since the translation bracket 72 moves relative to the anti-shake support 71, there is a risk of mutual collision in the event of excessive movement. In order to reduce collision vibration damage, a buffer structure can be set on the anti-shake support 71 and / or the translation bracket 72.

[0160] Generally speaking, a buffer material piece may be provided on the side wall of the translation bracket 72 and / or the side wall of the anti-shake support 71 to absorb collision energy, buffer collision, and reduce damage.

[0161] In some embodiments, an electronic device including the above-mentioned camera module is also provided, and the flexible circuit board 5 can be connected to a signal processing device in the electronic device to achieve the acquisition and imaging of telephoto shooting signals.

[0162] Generally speaking, the flexible circuit board 5 can be configured with a connector for connecting to a signal processing device of an electronic device.

Claims

1. A camera module, characterized in that: include: Module bracket; A prism is arranged on the module bracket, and the prism has an incident surface and an exit surface, the incident surface and the exit surface are arranged at the same side of the prism at intervals along the length direction of the prism, and light enters the prism from the incident surface and is emitted from the exit surface after being reflected in the prism; A lens is arranged on the module bracket, and the lens is located on the side where the incident surface is located, and the light is projected onto the incident surface after passing through the lens; An image sensor chip is arranged on the module bracket, and the image sensor chip is located on the side where the exit surface is located, and receives the light emitted from the exit surface; as well as A flexible circuit board is connected to the image sensor chip, and the flexible circuit board is arranged in the gap between the lens and the image sensor.

2. The camera module according to claim 1, characterized in that: The flexible circuit board comprises: A chip connection circuit board is electrically connected to the image sensor chip, and the chip connection circuit board and the image sensor chip are stacked along the thickness direction of the chip connection circuit board; A first buffer circuit board connected to the chip connection board, wherein the first buffer circuit board is vertically arranged outside the prism along the thickness direction of the chip connection circuit board; The second buffer circuit board is connected to the first buffer circuit board, and the second buffer circuit board is vertically arranged in the gap between the lens and the image sensor along the thickness direction of the chip connection circuit board.

3. The camera module according to claim 2, characterized in that: The flexible circuit board also includes: a third buffer circuit board connected to the chip connection board, the third buffer circuit board being vertically arranged on the outside of the prism along the thickness direction of the chip connection circuit board, and the third buffer circuit board and the first buffer circuit board being symmetrically arranged on both sides of the image sensor chip; A fourth buffer circuit board is connected to the third buffer circuit board. The fourth buffer circuit board is vertically arranged in a gap between the lens and the image sensor along a thickness direction of the chip connection circuit board, and the fourth buffer circuit board is connected to the second buffer circuit board.

4. The camera module according to claim 1, characterized in that: The flexible circuit board comprises: A chip connection circuit board is electrically connected to the image sensor chip, and the chip connection circuit board and the image sensor chip are stacked along the thickness direction of the chip connection circuit board; A fifth buffer circuit board is connected to one end of the chip circuit board close to the lens, the fifth buffer circuit board is reciprocatingly bent in the thickness direction to form a multilayer board, and the thickness direction of the fifth buffer circuit board is arranged along the length direction of the prism, and the fifth buffer circuit board is arranged in the gap between the lens and the image sensor.

5. The camera module according to claim 1, wherein: The lens includes: The first lens group; A second lens group is stacked with the first lens group on the same optical axis and arranged on the side where the incident surface is located, and the second lens group and / or the first lens group are configured to be movable along the optical axis; The camera module also includes a focus motor connected to the flexible circuit board, and the focus motor is connected to the second lens group and / or the first lens group.

6. The camera module according to any one of claims 1 to 5, characterized in that: The camera module also includes an anti-shake mechanism, which is arranged on the module bracket, and the anti-shake mechanism is connected to the image sensor chip to drive the image sensor chip to translate within a set plane.

7. The camera module according to claim 6, characterized in that: The anti-shake mechanism comprises: An anti-shake support, connected to the module support; A translation bracket, movably arranged on the anti-shake support, and the moving direction of the translation bracket is located in the set plane, and the image sensor chip is arranged on the translation bracket; A driving assembly is connected to the anti-shake support and the translation support to drive the translation support to move relative to the anti-shake support within the set plane.

8. The camera module according to claim 7, characterized in that: The drive assembly comprises: A first driving member, comprising a first coil and a first magnet which are arranged opposite to each other and are respectively arranged on the translation bracket and the anti-shake support, and the first coil is electrically connected to the flexible circuit board; A second driving member, comprising a second coil and a second magnet arranged opposite to each other, which are respectively arranged on the translation bracket and the anti-shake support, and the second coil is electrically connected to the flexible circuit board; Among them, the first driving member drives the translation bracket to move along the first direction, and the second driving member drives the translation bracket to move along the second direction, the first direction and the second direction are orthogonal, and the first driving member is divided into two groups, which are arranged at intervals along the second direction, and the second driving member is located between the two groups of first driving members, and the second driving member and the two groups of first driving members are both arranged in the gap between the lens and the image sensor.

9. The camera module according to claim 7, characterized in that: The drive assembly comprises: A first driving member, comprising a first coil and a first magnet which are arranged opposite to each other and are respectively arranged on the translation bracket and the anti-shake support, wherein the first coil is electrically connected to the flexible circuit board; A second driving member, comprising a second coil and a second magnet arranged opposite to each other, which are respectively arranged on the translation bracket and the anti-shake support, and the second coil is electrically connected to the flexible circuit board; The first driving member drives the translation bracket to move along a first direction, and the second driving member drives the translation bracket to move along a second direction, the first direction and the second direction are orthogonal, and the second driving member is arranged in a gap between the lens and the image sensor, or the second driving member is arranged on a side of the image sensor away from the lens, and the first driving member is arranged beside the second driving member.

10. The camera module according to claim 9, characterized in that: The drive assembly also includes: an intermediate bracket, comprising a first support arm and a second support arm connected at one end, the first support arm and the first driving member being arranged between the translation bracket and the side edge regions of the anti-shake support at intervals along the second direction, and the second support arm and the second driving member being arranged between the translation bracket and the side edge regions of the anti-shake support at intervals along the first direction; a first ball bearing, rolling and abutting between the intermediate bracket and the translation bracket; The second ball rolls and abuts between the intermediate bracket and the anti-shake support.

Images