Heat dissipation structure and mobile terminal

Abstract

The invention provides a heat dissipation structure and a mobile terminal. The heat dissipation structure comprises a main body and a heat dissipation component, the main body comprises a shell and a first heat source, the first heat source comprises a heat source panel and a heat source protrusion, the heat source panel is connected to the shell, the heat source panel and the shell jointly define a mounting cavity, the heat source panel is provided with a panel back face facing the mounting cavity, and the heat source protrusion is arranged on the panel back face in a protruding mode; the heat dissipation component is located in the installation cavity and spaced from the heat source panel, the heat dissipation component comprises a cold guide plate and a heat dissipation plate, the cold guide plate is connected to the shell and supports the heat dissipation plate, the heat dissipation plate is provided with a heat absorption part and a heat dissipation part which are connected, and the heat absorption part is connected to the side, opposite to the heat source panel, of the heat source protrusion; the projection of the heat dissipation part on the back face of the panel does not coincide with the projection of the heat source protrusion on the back face of the panel. According to the heat dissipation structure, the heat source panel can be prevented from being burnt out due to excessive heat accumulation in a local area, heat dissipation dead angles on the first heat source are eliminated, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present application belongs to the field of terminal technology, and in particular relates to a heat dissipation structure and a mobile terminal. Background Art

[0002] At present, the heat dissipation structure of mobile terminals is to attach a heat sink, such as a vapor chamber (VC), to the back of the display screen and connect it to the core heat source in the mobile terminal to transfer the heat of the core heat source to the display screen, and then dissipate the heat through the display screen. However, this results in a poor thermal experience of the mobile terminal on the display screen side, and the high temperature state affects the life of the luminescent material in the display screen. Summary of the invention

[0003] The purpose of the present application is to provide a heat dissipation structure and a mobile terminal, aiming to solve the technical problems of poor thermal experience and short life of the heat dissipation structure in the related art.

[0004] To achieve the above objectives, the technical solutions adopted in this application are as follows:

[0005] In a first aspect, the present application provides a heat dissipation structure, including a main body and a heat dissipation component;

[0006] The main body includes a shell and a first heat source, the first heat source includes a heat source panel and a heat source protrusion, the heat source panel is connected to the shell, and is jointly surrounded with the shell to form an installation cavity, the heat source panel has a panel back facing the installation cavity, and the heat source protrusion is protruding from the panel back;

[0007] The heat dissipation component is located in the installation cavity and is separated from the heat source panel. The heat dissipation component includes a cold conduction plate and a heat dissipation plate. The cold conduction plate is connected to the shell and supports the heat dissipation plate. The heat dissipation plate has a connected heat absorption part and a heat dissipation part. The heat absorption part is connected to the side of the heat source protrusion facing away from the heat source panel. The projection of the heat dissipation part on the back of the panel does not overlap with the projection of the heat source protrusion on the back of the panel.

[0008] As one implementation manner of the first aspect, the heat dissipation plate is located on a side of the cold conduction plate close to the first heat source.

[0009] As one implementation of the first aspect, the heat source protrusion is arranged at the bottom of the back side of the panel, and the heat dissipation portion extends from the bottom of the back side of the panel at least to the middle of the back side of the panel.

[0010] As one implementation of the first aspect, the heat dissipation structure further includes a second heat source, the second heat source is connected to the shell, and the cold conduction plate is connected to the second heat source.

[0011] As one of the implementation methods of the first aspect, the shell includes a bottom shell and a middle frame, the middle frame includes a support plate and a frame, the frame is arranged around the edge of the support plate, the heat source panel and the bottom shell are respectively connected to opposite sides of the frame, the second heat source is connected to the support plate and / or the bottom shell, and the heat dissipation component is connected to the shell and spaced apart from the frame.

[0012] As one of the implementation methods of the first aspect, the shell includes a bottom shell and a frame, the frame is arranged around the edge of the bottom shell, the second heat source is connected to the bottom shell, the heat source panel is connected to the frame, and the heat dissipation component is connected to the bottom shell and spaced apart from the frame.

[0013] As one of the implementation methods of the first aspect, the cooling plate includes a cooling portion and at least one protrusion portion, the cooling portion is connected to the heat dissipation plate, each of the protrusion portions is connected to the side of the cooling portion away from the heat dissipation plate, the cooling portion is spaced apart from the second heat source, and the protrusion portion is connected to the second heat source.

[0014] As one implementation of the first aspect, the protrusion portion and the cooling conduction portion are integrally formed.

[0015] As one implementation of the first aspect, the second heat source includes a circuit board and at least one control device, the control device includes a shielding cover and at least one chip unit, the circuit board is connected to the shell, the chip unit is connected to the side of the circuit board facing the cold conduction plate, and has a control chip top surface facing the cold conduction plate, the shielding cover is connected to the circuit board and covers at least one of the chip units, the shielding cover has at least one connecting window, the protrusion portion extends into the connecting window and is connected to the top surface of the control chip, and the cold conduction plate and the shielding cover jointly realize the shielding of the chip unit.

[0016] As one of the implementation methods of the first aspect, the shielding cover includes a hard cover body and a soft shielding body, the cover body is provided with a connecting hole, the shielding body is connected to the cover body and forms the connecting window together with the cover body, the protrusion portion is passed through the connecting hole, and the shielding body shields the gap between the cover body and the protrusion portion.

[0017] As one implementation of the first aspect, the cover body has a cover top surface facing the cooling portion, the shielding body is connected to the cover top surface, and is arranged around the protruding block portion.

[0018] In a second aspect, the present application provides a mobile terminal, comprising the heat dissipation structure as described in the above implementations, wherein the first heat source is a display screen, the heat source panel is a display module, and the heat source protrusion is a display chip.

[0019] As one implementation of the second aspect, the heat dissipation structure further includes a second heat source, which is a control component. The control component is connected to the shell, and the cold conduction plate is connected to the control component.

[0020] The technical effect of the present application compared to the prior art is that the heat dissipation structure supports the heat dissipation plate by setting a hard cold conduction plate, thereby realizing the interval setting of the heat dissipation component and the display module, and there is no need to support the heat dissipation plate through the heat source panel, and then the heat absorption part of the heat dissipation plate is connected with the heat source protrusion, so that the heat of the heat source protrusion can be absorbed by the heat plate. Since the projection of the heat dissipation part on the back of the panel does not overlap with the projection of the heat source protrusion on the back of the panel, after the absorption part dissipates the heat to the heat dissipation part, the heat dissipation part can dissipate the heat to the air in the first heat dissipation gap between the heat dissipation part and the heat source panel, and the hot air in the first heat dissipation gap can then transfer the heat to the heat dissipation part The heat panel is finally dissipated to the external atmosphere through the heat dissipation panel. In this way, the heat dissipation structure reduces the heat in the area of ​​the heat source panel corresponding to the heat source protrusion by separating the heat dissipation component from the heat source panel and connecting the heat absorption part to the heat source protrusion. The heat of the heat dissipation part is dissipated into the air in the first heat dissipation gap and then transferred to the heat source panel, which increases the thermal resistance between the heat dissipation plate and the heat source panel, thereby reducing the total heat transferred to the heat source panel. At the same time, the hot air in the first heat dissipation gap can evenly dissipate the heat to the heat source panel, avoiding the heat source panel from being burned due to excessive heat accumulation in local areas, eliminating the heat dissipation dead corners on the first heat source, and improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 is a three-dimensional structural diagram of the heat dissipation structure provided in an embodiment of the present application;

[0023] Figure 2 yes Figure 1 A partial structural diagram of the heat dissipation structure in which the first heat source is removed;

[0024] Figure 3 It is a partial exploded diagram of the heat dissipation structure in the current related technology;

[0025] Figure 4 It is the heat distribution simulation diagram of the current heat dissipation structure;

[0026] Figure 5 is an exploded diagram of the heat dissipation structure provided in an embodiment of the present application;

[0027] Figure 6 is a cross-sectional view of the heat dissipation structure provided in an embodiment of the present application in the Y-axis direction, wherein the support plate is not shown;

[0028] Figure 7 yes Figure 6 A partial enlarged view of the heat dissipation structure in the middle, in which the heat flow direction of the DDIC and the small board in the heat dissipation structure is depicted, and the arrow in the figure indicates the direction of heat transfer;

[0029] Figure 8 is a partial exploded view of the heat dissipation structure provided in an embodiment of the present application, wherein the support plate is not shown;

[0030] Fig. 9 yes Figure 6 Another partial enlarged view of the heat dissipation structure, wherein the heat flow direction on the mainboard in the heat dissipation structure is depicted, and the arrows in the figure indicate the heat flow direction;

[0031] Fig.10 yes Figure 5 An exploded view of the heat dissipation structure in another perspective;

[0032] Fig.11 It is a simulation diagram of the heat dissipation structure after adopting the solution in the above embodiment of the present application.

[0033] Description of reference numerals:

[0034] 10. Main body; 1001. Installation cavity; 101. First heat dissipation gap; 102. Second heat dissipation gap; 10a. First heat source; 10b. Second heat source; 11a. Heat source panel; 11b. Heat source protrusion; 11. Display screen; 111. Display module; 112. DDIC; 1120. Top surface of display chip; 12. Shell; 121. Bottom shell; 122. Frame; 123. Support plate; 12a. Middle frame; 1210. Avoidance hole; 120. Installation slot; 13. Control Components; 131, circuit board; 131a, main board; 131b, small board; 132, control device; 1320, connection hole; 1321, chip unit; 1322, shielding cover; 1322a, cover body; 1322b, shielding body; 1323, connection window; 14, battery; 15, screw; 20, heat dissipation component; 21, heat dissipation plate; 211, heat absorption part; 212, heat dissipation part; 22, cold conduction plate; 221, cold conduction part; 222, bump part; 31, interface material. DETAILED DESCRIPTION

[0035] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0036] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0038] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0039] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0040] The present application provides a heat dissipation structure and a mobile terminal, wherein the heat dissipation structure is a structure capable of achieving heat dissipation, and the mobile terminal includes the heat dissipation structure. The mobile terminal may also be referred to as an electronic device, a user equipment (UE), a mobile station (MS), etc. The specific product form of the mobile terminal may be a mobile phone, a tablet computer, a desktop computer, a personal digital assistant (PDA), a notebook computer, an ultra-mobile personal computer (UMPC), a virtual reality (VR) / augmented reality (AR) device, a vehicle-mounted device, a gaming device, etc.

[0041] See also Figure 1 and Figure 2 , the heat dissipation structure includes a main body 10 and a heat dissipation component 20. The main body 10 includes a shell 12, a first heat source 10a and a second heat source 10b. The first heat source 10a and the second heat source 10b are both installed on the shell 12. The shell 12 and the first heat source 10a are jointly surrounded to form a mounting cavity 1001. The first heat source 10a and the second heat source 10b are both structures that can generate heat by themselves. The heat dissipation component 20 is used to exchange heat between the first heat source 10a and the second heat source 10b. Among them, the first heat source 10a includes a heat source panel 11a and a heat source protrusion 11b. The heat source panel 11a is connected to the shell 12 and is surrounded by the shell 12 to form a mounting cavity 1001. The heat source panel 11a has a panel back facing the mounting cavity 1001. The heat source protrusion 11b is protruded on the back of the panel. The heat source panel 11a and the heat source protrusion 11b can both generate heat by themselves. The heat source panel 11a can also use its own structure, such as a plate-like structure, to dissipate heat. The second heat source 10b may be optionally disposed in the installation cavity 1001. In other embodiments, the heat dissipation component 20 may also only perform heat exchange with the first heat source 10a, while the second heat source 10b dissipates heat through other structures.

[0042] In the following embodiments, for ease of description, the mobile terminal is taken as an example for explanation. Among them, the first heat source 10a can be selected as a display screen 11, and the second heat source 10b can be selected as a control component 13 and a battery 14. The control component 13 is electrically connected to the display screen 11, and the battery 14 is used to power the control component 13 and the display screen 11. The control component 13 includes a circuit board 131 and a control device 132 electrically connected to the circuit board 131, and the circuit board 131 includes a main board 131a and a small board 131b.

[0043] For ease of understanding, Figure 2A rectangular coordinate system is established in the figure, wherein the direction from left to right when the mobile phone is in the user's hand is the X-axis direction, the direction from bottom to top is the Y-axis direction, and the direction from back to front is the Z-axis direction. The main body 10 has a bottom, a middle and a top in sequence along the Y-axis direction. Generally, the main board 131a is arranged near the top of the main body 10, and the small board 131b is arranged near the bottom of the main body 10.

[0044] The control device 132 may be a single chip unit 1321, a combination of multiple chip units 1321, a combination of a chip unit 1321 and a shielding cover 1322 disposed outside the chip unit 1321, or a functional device. At least one control device 132 may be disposed on the main board 131a and the small board 131b. The chip unit 1321 includes but is not limited to a power management integrated circuit (PMIC) and a system on chip (SOC). The functional device includes but is not limited to a mobile communication module, a wireless communication module, an audio module, a sensor module, a motor, an indicator, a camera, etc., which may be specifically configured according to actual needs.

[0045] The display screen 11 includes a display module 111 and a DDIC 112. The heat source panel 11a is the display module 111 of the display screen 11. The display module 111 is connected to the housing 12. The display module 111 has a front panel and a back panel facing each other. The front panel faces away from the mounting cavity 1001 and is used to display the picture. The back panel faces the mounting cavity 1001. The heat source protrusion 11b is a display chip of the display screen. The display chip is used to control the display module to realize the display function. Optionally, the display chip can also control the display module to realize other functions such as touch control. The display chip includes but is not limited to a display driver chip (Display Driver Integrated Circuit, DDIC) 112, which is arranged at the bottom of the display module 111 and protrudes from the back of the panel. The DDIC 112 is electrically connected to the display module 111 and the control component 13, and the DDIC 112 is used to control the display module 111 to display the picture. The DDIC has a display chip top surface facing away from the display module 111, and the top surface of the display chip faces the same direction as the back of the panel.

[0046] See also Figure 3The shell 12' of the mobile phone in the current related technology includes a middle frame and a bottom shell 121', the middle frame includes a support plate and a frame 122' arranged around the edge of the support plate, the bottom shell 121' and the display screen 11' are respectively arranged on the opposite sides of the support plate, and are both connected to the frame 122', and the display module 111' is connected to the frame 122'. Among them, the core heat sources with large heat generation include chip units such as system on chip (System on Chip, SOC), battery management unit (Power Management Unit, PMU) and DDIC112'.

[0047] The current heat dissipation structures of mobile terminals are front-mounted and flip-mounted. The front-mounted heat dissipation structure is to connect the DDIC and the control component to the support plate in the metal middle frame, absorb the heat of the core heat source through the support plate, and conduct the heat to the frame integrally formed with the support plate, and finally dissipate the heat to the external atmosphere through the frame. However, this setting will cause the heat to be concentrated on the frame, and the core heat source is close to the hand-gripping area of ​​the frame, which ultimately leads to a poor thermal experience in the hand-gripping area. At the same time, due to the small heat dissipation area of ​​the frame, the heat dissipation efficiency is low. The flip-mounted heat dissipation structure is to apply a heat sink on the back of the display screen, and connect the heat sink to the core heat source in the control component to transfer the heat of the core heat source in the control component to the display screen, and then dissipate the heat through the display screen. However, some chip covers are provided with a shielding cover. In order to avoid affecting the shielding effect, the heat sink can only be connected to the shielding cover, and then a thermal conductive colloid is set in the shielding cover to transfer the heat of the chip to the shielding cover through the thermal conductive colloid, and then from the shielding cover to the heat sink. The contact thermal resistance is large, and all the heat absorbed by the heat sink is directly transferred to the display screen, which leads to a poor thermal experience of the mobile phone on the display screen side. At the same time, if Figure 3 As shown, since the heat sink 20' is easily deformed and is flat, it can only be attached to the back of the display screen 11'. In addition, the position where the heat sink 20' absorbs the heat from the heat source on the small board is also close to DDIC112'. Therefore, the heat sink 20' cannot dissipate heat for DDIC112' and the heat source on the small board, resulting in heat accumulation in the top area of ​​the display screen 11' close to the heat source on the main board and the bottom area close to the heat source on the small board and DDIC112, resulting in poor heat dissipation, forming a heat dissipation dead angle, and low heat dissipation efficiency. In addition, the high temperature state of the local overheating of the display screen 11' also affects the life of the luminescent material in the display screen 11'. Figure 4 As shown, Figure 4 1 is a simulation diagram of heat distribution of a current mobile phone. It can be seen that heat is concentrated at the bottom and top of the display module 111 ′, and heat is concentrated in the area of ​​the frame 122 ′ close to the motherboard.

[0048] In this regard, an embodiment of the present application provides a heat dissipation structure, which can effectively solve the problem that heat sources such as DDIC and small boards on the main body are prone to forming heat dissipation dead corners through heat dissipation components. It can also reduce the frame temperature, evenly distribute the heat of the display screen, avoid local overheating of the display screen, and improve the heat dissipation efficiency of the main body.

[0049] See also Figure 5 and Figure 6 The heat dissipation structure includes a main body 10 and a heat dissipation member 20. The main body 10 includes the housing 12, the display screen 11, the control component 13 and the battery 14 in the above embodiment.

[0050] The control assembly 13 and the battery 14 are both separated from the display screen 11. The control assembly 13 includes a circuit board 131 and a control device 132. The circuit board 131 includes a main board 131a and a small board 131b. The main board 131a and the small board 131b are each provided with at least one control device 132. The main board 131a is close to the top of the housing 12, the small board 131b is close to the bottom of the housing 12, and the battery 14 is located between the main board 131a and the small board 131b in the Y-axis direction.

[0051] The heat dissipation component 20 is located in the installation cavity 1001 and between the control assembly 13 and the display screen 11. The heat dissipation component 20 includes a cooling plate 22 and a heat dissipation plate 21.

[0052] The heat sink 21 is a device that helps the mobile phone dissipate heat based on the principle of liquid cooling. There is a sealed liquid channel inside the heat sink 21, and the channel is filled with coolant (usually some special heat-conducting liquids, such as a mixture of water, ethylene glycol, etc.). When the heat source generates heat, the heat sink 21 can absorb the heat from the heat source by being in close contact with the heat source. The heat sink 21 brings the heat to the lower temperature area in the heat sink 21 by circulating the coolant in the channel or phase change. The heat sink 21 includes but is not limited to a liquid cooling plate, a VC and a heat pipe. Optionally, the heat sink 21 is flat, and the heat sink 21 has a first liquid cooling surface facing the display screen 11 and a second liquid cooling surface facing the control component 13, and the first liquid cooling surface and the second liquid cooling surface are both planes and parallel.

[0053] The cold plate 22 is supported by a hard material and has a high thermal conductivity, which is used to provide support for the heat sink 21 and exchange heat with the heat sink 21. The elastic modulus of the hard material is greater than 13ksi, and high thermal conductivity refers to a thermal conductivity greater than 310W / mk. The material of the cold plate 22 includes but is not limited to high thermal conductivity metal materials such as aluminum alloy (such as 6 series or 7 series), copper alloy, and can also be other high thermal conductivity metal alloys or non-metallic materials. The cold plate 22 is connected to the shell 12 and can support the heat sink 21. Among them, the cold plate 22 can be directly connected to the shell 12, and can also be indirectly connected to the shell 12 through the control component 13. There is no limitation here. The cold plate 22 and the shell 12 can be connected through an interface material 31 or a metal fusion method. The interface material 31 is an interface material 31 with high thermal conductivity, such as thermal conductive gel, thermal conductive silica gel, graphite sheet, phase change material (Phase-ChangeMaterial, PCM), etc. The cooling plate 22 can be a flat plate that is completely attached to the heat sink 21, or a frame that is completely attached to the heat sink 21. Of course, only a part of the area can be connected to a part of the area of ​​the heat sink 21, as long as the heat sink 21 can be supported to maintain a stable plane state. The cooling plate 22 can be connected to the first liquid cooling surface of the heat sink 21, or to the second liquid cooling surface, or partially connected to the first liquid cooling surface and the other part connected to the second liquid cooling surface, and there is no limitation here.

[0054] The heat dissipation component 20 is spaced from the display module 111, and a first heat dissipation gap 101 is formed between the heat dissipation component 20 and the display module 111. The heat dissipation plate 21 has a heat absorbing portion 211 and a heat dissipation portion 212 connected to each other. The heat absorbing portion 211 is connected to the top surface of the display chip. The connection between the heat absorbing portion 211 and the top surface of the display chip can be directly connected or indirectly connected through the cold conduction plate 22. Among them, the projection of the heat dissipation portion 212 on the back of the panel does not overlap with the projection of the top surface of the display chip on the back of the panel, and the projection of the heat absorbing portion 211 on the back of the panel can overlap with the projection of the top surface of the display chip on the back of the panel.

[0055] The heat dissipation structure supports the heat dissipation plate 21 by setting a hard cold conduction plate 22, thereby realizing the interval setting between the heat dissipation component 20 and the display module 111, and there is no need to support the heat dissipation plate 21 through the display module 111. Figure 7 This is a schematic diagram of the heat flow direction of the DDIC and the small board in the heat dissipation structure provided in the embodiment of the present application, wherein the arrow indicates the heat transfer direction. Figure 7The heat dissipation structure connects the heat absorbing portion 211 of the heat dissipation plate 21 with the top surface of the display chip of the DDIC 112, so that the heat dissipation plate 21 can absorb the heat of the DDIC 112. Since the projection of the heat dissipation portion 212 on the back of the panel does not overlap with the projection of the top surface of the display chip on the back of the panel, after the heat absorption portion dissipates the heat to the heat dissipation portion 212, the heat dissipation portion 212 can dissipate the heat to the air in the first heat dissipation gap 101 between the heat dissipation portion 212 and the display module 111. The hot air in the first heat dissipation gap 101 can then transfer the heat to the display module 111, and finally dissipate the heat to the external atmosphere through the display module 111. In this way, the heat dissipation structure is connected to the heat dissipation structure. The component 20 is spaced apart from the display module 111, and the heat absorbing part 211 is connected to the top surface of the display chip, so that the heat of the display module 111 corresponding to the DDIC112 area is reduced. The heat of the heat dissipating part 212 is dissipated to the air in the first heat dissipation gap 101 and then transferred to the display module 111, thereby increasing the thermal resistance between the heat dissipating plate 21 and the display module 111, thereby reducing the total heat transferred to the display module 111. At the same time, the hot air in the first heat dissipating gap 101 can evenly dissipate the heat to the display module 111, thereby preventing the display module 111 from being burned due to excessive heat accumulation in a local area, eliminating the heat dissipation dead corner on the display screen 11, and improving the heat dissipation efficiency. In addition, since the cold conduction plate 22 has a high thermal conductivity, it can efficiently exchange heat with the heat dissipating plate 21 to assist the heat dissipating plate 21 in absorbing or dissipating heat, thereby increasing the heat dissipation area and the heat absorption area.

[0056] See also Figure 6 and Figure 8 In some embodiments, the cold conduction plate 22 has a first cold conduction surface facing the display module 111 and a second cold conduction surface facing away from the display module 111. The heat sink 21 is located on a side of the cold conduction plate 22 close to the display screen 11, and the first cold conduction surface is connected to the second liquid cooling surface of the heat sink 21. In this way, the heat sink 21 is closer to the display screen 11, so as to directly dissipate heat into the first heat dissipation gap 101, thereby improving the heat dissipation efficiency.

[0057] Optionally, the heat sink 21 and the cold conduction plate 22 are both flat and stacked, with the first cold conduction surface parallel to the second cold conduction surface for ease of processing and installation. At this time, the area of ​​the first cold conduction surface is larger than the area of ​​the second liquid cooling surface, and the second liquid cooling surface can be completely attached to the first cold conduction surface so that the cold conduction plate 22 can support the heat sink 21. The first cold conduction surface can be parallel to the back of the panel of the display screen 11 and the board surface of the circuit board 131 to reduce the space occupied. The flat plate shape of the heat sink 21 and the cold conduction plate 22 is square to adapt to the shape of the shell 12.

[0058] In other embodiments, the heat sink 21 and the cold conduction plate 22 may also be circular, elliptical, regular or irregular polygonal, etc. The cold conduction plate 22 may also have avoidance holes for avoiding other structural parts, which is not limited here.

[0059] In some embodiments, the heat dissipation portion 212 extends from the bottom of the back of the panel to at least the middle of the back of the panel. In this way, the heat dissipation portion 212 can distribute the heat of the DDIC 112 at the bottom of the display module 111 more evenly through the first heat dissipation gap 101 to the area between the bottom and the middle of the display module 111, or even to the area between the bottom and the position closer to the top.

[0060] In the illustrated embodiment, the heat dissipation portion 212 can extend to a position close to the top of the back side of the panel, so that the heat dissipation portion 212 can distribute the heat of the DDIC 112 at the bottom of the display module 111 more evenly over the entire display module 111 through the first heat dissipation gap 101 .

[0061] See also Figure 6 In some embodiments, the heat dissipation member 20 is connected to the control component 13 to absorb the heat of the control component 13 and transfer the heat of the control component 13 to the heat dissipation plate 21. Figure 7 and Fig. 9 , Fig. 9 The schematic diagram of the heat flow direction on the motherboard in the heat dissipation structure provided in the embodiment of the present application, wherein the arrow indicates the heat flow direction. It can be seen that the heat of the control component 13 can be dissipated to the air in the first heat dissipation gap 101 through the heat dissipation member 20, and finally dissipated to the atmosphere through the display module 111, thereby reducing the temperature of the housing 12.

[0062] Since the heat dissipation component 20 is disposed on the side of the control assembly 13 facing the display screen 11, and the control device 132 in the control assembly 13 is generally disposed on the side of the circuit board 131 close to the display screen 11, the heat dissipation component 20 can be directly connected to the control device 132, which improves the heat dissipation efficiency of the control device 132 compared to being disposed between the circuit board 131 and the housing 12. The heat dissipation component 20 can be connected to the heat source on the main board 131a and the heat source on the small board 131b at the same time to reduce the heat of the main board 131a and the small board 131b, and reduce the heat of the positions corresponding to the main board 131a and the small board 131b on the display module 111.

[0063] It should be noted that the heat dissipation component 20 connected to the control component 13 may be a heat conducting plate or a heat dissipation plate 21 . For example, a hole is opened on the heat conducting plate, and the heat dissipation plate 21 is connected to the control component 13 through the hole.

[0064] Optionally, the heat dissipation component 20 may also be connected to the battery 14 to reduce the heat of the battery 14 .

[0065] In other embodiments, the heat dissipation component 20 may also be spaced apart from the control component 13 and the battery 14 , and the control component 13 dissipates heat through the middle frame 122 in the shell 12 , which is not limited here.

[0066] There are many ways to dispose the housing 12, which are described below with examples.

[0067] As one of the configuration modes of the housing 12, the housing 12 may be a housing 12 of a current Android device, such as Figure 5 As shown, the shell 12 includes a bottom shell 121 and a middle frame 12a, the middle frame 12a includes a support plate 123 and a frame 122, the frame 122 is arranged around the support plate 123, the bottom shell 121 and the display screen 11 are respectively installed on opposite sides of the frame 122, and the support plate 123 is located between the bottom shell 121 and the display screen 11. The support plate 123 and the frame 122 are jointly arranged to form a mounting groove 120, and the display screen 11 covers the notch of the mounting groove 120. A first cavity is formed between the display screen 11 and the support plate 123, and the heat dissipation component 20 is arranged in the first cavity. A second cavity is formed between the bottom shell 121 and the support plate 123, and the control component 13 and the battery 14 are both arranged in the second cavity and are spaced apart from the frame 122. The support plate 123 is provided with an avoidance hole 1210, and the heat dissipation component 20 contacts the control component 13 through the avoidance hole 1210, wherein the heat dissipation component 20 may extend through the avoidance hole 1210 to the second cavity to contact the control component 13, or the control device 132 in the control component 13 may extend through the avoidance hole 1210 to the first cavity to contact the heat dissipation component 20.

[0068] In other embodiments, the control assembly 13 and the heat dissipation component 20 may also be disposed in the first cavity, and in this case, the avoidance hole 1210 may not be disposed on the support plate 123 .

[0069] Optionally, the control component 13 may be spaced apart from the support plate 123 or a heat-insulating material may be provided between the control component 13 and the support plate 123, so that the heat of the control component 13 can be dissipated through the heat dissipation member 20 or the heat dissipation component on the bottom shell 121, reducing the heat transferred to the support plate 123, so as to avoid the heat of the control component 13 being directly transferred to the frame 122 through the support plate 123. Of course, the material of the middle frame 12a of the current Android phone can also be improved, such as by setting the support plate 123 to a material with low thermal conductivity to reduce the transfer of heat from the control component 13 to the frame 122, which is not limited here.

[0070] As another arrangement of the shell 12, the shell 12 includes a bottom shell 121 and a frame 122 arranged around the edge of the bottom shell 121, wherein the bottom shell 121 and the frame 122 can be integrally formed to facilitate processing and assembly. The bottom shell 121 and the frame 122 are jointly arranged to form a mounting groove 120, and the display screen 11 covers the notch of the mounting groove 120, and is jointly arranged with the shell 12 to form a mounting cavity 1001. The control component 13 and the battery 14 are connected to the bottom shell 121, the display module 111 is connected to the frame 122, and the heat dissipation component 20 is connected to the bottom shell 121. In this way, the control component 13 and the battery 14 can be fixed in position in the mounting cavity 1001 through the support of the bottom shell 121 or the cold conduction plate 22, without the need to set a support plate, which not only achieves the thinning of the heat dissipation structure, but also simplifies the structure of the heat dissipation structure and saves costs. At the same time, since the bottom shell 121 is provided with a heat dissipation component, part of the heat of the control component 13 and the battery 14 can also be dissipated through the heat dissipation component on the bottom shell 121, thereby reducing the heat transferred to the frame 122.

[0071] Regardless of the configuration of the housing 12, the heat dissipation component 20 is spaced apart from the frame 122, that is, the cold conduction plate 22 and the heat dissipation plate 21 are spaced apart from the frame 122. In this way, the heat of the control component 13 can be dissipated to the air in the edge gap between the heat dissipation component 20 and the frame 122 as a heat transfer medium, and the heat is first dissipated to the air in the edge gap. The hot air in the edge gap then dissipates its own heat to the outside atmosphere through the frame 122, thereby increasing the thermal resistance between the heat dissipation component 20 and the frame 122, thereby reducing the heat of the frame 122. By evenly dissipating the heat on the frame 122, the hand-grip area of ​​the heat dissipation structure (the area at the bottom of the frame 122 that roughly occupies one-third of the length of the frame 122 in the Y-axis direction) is prevented from overheating and affecting the user's thermal experience.

[0072] Optional, see Figure 6 and Figure 8 The heat dissipation component 20 is connected to the circuit board 131 and the bottom shell 121 through the screws 15. Specifically, the screws 15 pass through the cold plate 22 and the circuit board 131 in sequence, and are fixedly connected to the bottom shell 121 for assembly. The screws 15 can also be made of heat conductive material, so that the heat of the circuit board 131 can be transferred to the cold plate 22 through the screws 15.

[0073] In other embodiments, the cold conduction plate 22 may also be directly connected to the bottom shell 121 via screws 15, and the circuit board 131 avoids the screws 15. The connection method between the cold conduction plate 22 and the bottom shell 121 may also be bonding, snapping, plugging, etc., as long as it can be fixed to the bottom shell 121.

[0074] See also Figure 6 and Fig.10In some embodiments, the cold conducting plate 22 includes a cold conducting portion 221 and a convex portion 222. The cold conducting portion 221 is flat and has a first cold conducting surface and a second cold conducting surface opposite to each other. The convex portion 222 is convexly arranged on the second cold conducting surface. The cold conducting portion 221 is spaced apart from the control component 13, and the convex portion 222 is connected to the control component 13. Specifically, the convex portion 222 has a convex top surface facing the same direction as the second cold conducting surface. The convex portion 222 is connected to the control component 13 through the convex top surface. The convex top surface can be connected to the control device 132 or to the circuit board 131, as long as it is connected to a heat source that needs to be dissipated. Of course, the convex portion 222 can also be connected to a position with a smaller heat generation. At this time, the convex portion 222 is only used for support and connection. The setting of the convex portion 222 can adapt to the different heights of each heat source to ensure that it is in contact with each heat source that needs to be dissipated. The setting of the protrusion portion 222 can also space the cooling portion 221 from the circuit board 131, so that a second heat dissipation gap 102 is formed between the cooling portion 221 and the circuit board 131. Most of the heat absorbed by the cooling plate 22 can be transferred to the heat dissipation plate 21, and a small part is dissipated to the second heat dissipation gap 102. Since the second heat dissipation gap 102 is connected to the first heat dissipation gap 101 through the edge gap, the heat of the air in the second heat dissipation gap 102 can be transferred to the air in the first heat dissipation gap 101, and finally dissipated to the external atmosphere through the display module 111. In this way, the heat dissipation component 20 increases the heat dissipation area and improves the heat dissipation efficiency by spacing the cooling portion 221 from the control component 13.

[0075] The convex block 222 can be connected to the control component 13 through the interface material 31 to improve the thermal conductivity. The interface material 31 is an interface material 31 with high thermal conductivity, such as thermal conductive gel, thermal conductive silica gel, graphite sheet, PCM, etc.

[0076] In other embodiments, the cooling plate 22 may also be directly connected to the control assembly 13 via the second cooling surface, which is not limited here.

[0077] In some embodiments, the protrusion and the cooling portion 221 are integrally formed, and the protrusion and the cooling portion 221 are made of the same material to facilitate processing. At the same time, the thermal resistance between the protrusion and the cooling portion 221 is reduced, and the heat absorption efficiency of the cooling plate 22 is improved.

[0078] See also Figure 6 and Fig. 9In some embodiments, in the control assembly 13, at least one control device 132 includes a chip unit 1321 and a shielding cover 1322, wherein the chip unit 1321 may be one or more, and the chip unit 1321 is connected to the board surface of the circuit board 131 on the side facing the cold guide plate 22, and is electrically connected to the circuit board 131. The chip unit 1321 has a control chip top surface facing away from the circuit board 131, and the direction of the control chip top surface is opposite to the direction of the protruding top surface. The shielding cover 1322 is connected to the circuit board 131 and covers at least one chip unit 1321 in the control device 132. The shielding cover 1322 has a cover top surface, and the direction of the cover top surface is the same as the direction of the control chip top surface. The shielding cover 1322 is provided with at least one connection window 1323, and the connection window 1323 is formed on the cover top surface of the shielding cover 1322. The convex part 222 extends into the connection window 1323 and is connected to the top surface of the control chip of the chip unit 1321 through the interface material 31. The cold conducting plate 22 and the shielding cover 1322 are used together to achieve the shielding of the chip unit 1321. It can be understood that at least one of the cold conducting part 221 and the convex part 222 can shield the connection window 1323 in the Z-axis direction, that is, only the cold conducting part 221 can shield the connection window 1323 in the Z-axis direction, or only the convex part 222 can shield the connection window 1323 in the Z-axis direction, or the cold conducting part 221 and the convex part 222 can shield the connection window 1323 in the Z-axis direction together, wherein the cold conducting part 221 and the convex part 222 can both be made of shielding material, or only one of them can be made of shielding material, as long as they can achieve the shielding of the chip unit 1321 together with the shielding cover 1322. In this way, the bump portion 222 can be directly connected to the chip unit 1321 to reduce the thermal resistance between the chip unit 1321 and the cold plate 22, and improve the heat dissipation efficiency of the chip unit 1321. The cold plate 22 also shields the connection window 1323 in the Z-axis direction to prevent electromagnetic radiation leakage of the chip unit 1321 and interference from external electromagnetic signals, thereby improving the heat dissipation performance while avoiding affecting the performance of the control device 132.

[0079] Optionally, the shielding cover 1322 includes a hard cover body 1322a and a soft shielding body 1322b, the soft shielding body 1322b can be made of a flexible shielding material or an elastic shielding material, and the cover body 1322a is made of a metal material. The cover body 1322a has a cover top surface, and the cover body 1322a is provided with a connecting hole 1320 on the cover top surface. The shielding body 1322b is connected to the cover body 1322a, and together with the cover body 1322a, a connecting window 1323 is formed. The protrusion part 222 is penetrated through the connecting hole 1320, and the shielding body 1322b shields the gap between the cover body 1322a and the protrusion part 222. In this way, the shielding cover 1322 and the protrusion part 222 are shielded by setting the shielding body 1322b. Among them, in order to ensure the shielding effect, the shielding body 1322b is interference fit with the cover body 1322a and the cold conduction plate 22.

[0080] Optionally, the shielding body 1322b is connected to the top surface of the cover body 1322a and the peripheral side surface of the protrusion, and is arranged around the protrusion. In this case, the shielding body 1322b is arranged to form a connection window 1323, and the protrusion can be directly inserted into the connection window 1323 when the cold conduction plate 22 is installed. The shielding body 1322b elastically abuts against the peripheral side surface of the protrusion due to its own elasticity, so as to be tightly connected with the protrusion, thereby shielding the chip unit 1321.

[0081] In other embodiments, the shielding body 1322b may also be connected to the hole wall of the connecting hole 1320 and the peripheral side surface of the protrusion or the second cooling surface of the cooling portion 221, and may also be connected to the cover top surface of the cover body 1322a and the second cooling surface of the cooling portion 221. The shielding body 1322b may be annular or extend intermittently along an annular path, which is not limited here.

[0082] Of course, the shielding cover 1322 may not be provided with the shielding body 1322b, but a step structure may be provided on the peripheral side of the protrusion portion 222, and the step structure may be against the top surface of the cover body 1322a to shield the connection window 1323.

[0083] See also Figure 6 and Figure 7 In some embodiments, since the position of the small board 131b is close to the position of the DDIC112, the heat dissipation component 20 in the present application is arranged at a position spaced apart from the display module 111, which can not only realize the connection with the DDIC112, but also simultaneously realize the connection with the heat source on the small board 131b, thereby transferring the heat on the small board 131b to the top of the display module 111 through the air in the first heat dissipation gap 101, so that the display module 111 is heated more evenly, avoiding the bottom of the display module 111 from being overheated due to the heat of the DDIC112 and the heat source on the small board 131b.

[0084] Optional, please combine Fig.10 , a plurality of protrusions are arranged on the second cooling surface of the cooling portion 221, some of the protrusions are connected to the control device 132 on the main board 131a, and some of the protrusions are connected to the control device 132 on the small board 131b. In practical applications, the position of the protrusions can be set according to the position of the heat source for heat dissipation, and the number can also be set according to actual needs. In other embodiments, some of the protrusions can also abut against the battery 14 or the functional device, which is not limited here.

[0085] Fig.11 This is a simulation diagram of the heat dissipation structure after adopting the solution in the above embodiment of the present application. Fig.11 As can be seen from the figure, the heat of the top and bottom of the display module 111 and the heat of the frame 122 are reduced, compared with the current flip-chip solution (such as Figure 4 ), the core temperature of the area of ​​the display module 111 corresponding to the mainboard 131a position will increase by about 2.5°C (the temperature of the display module 111 drops from 43°C to 40.5°C), the temperature of the DDIC112 will increase by about 3.5°C (from 43.6°C to 40.1°C), the core temperature of the area on the bottom shell 121 corresponding to the mainboard 131a position will increase by about 2.5°C (from 44.2°C to 41.8°C), and the core temperature of the frame 122 will increase by about 2°C (from 40.1°C to 38.2°C). Since the control device 132 for charging control is arranged on the small board 131b, as the core temperature of the small board 131b decreases, the screen-on charging speed of the heat dissipation structure can be increased by more than 18%. The heat dissipation structure realizes thermal isolation between the heat source and the core hand-gripping area, greatly improving the user's thermal experience.

[0086] The above are only some specific embodiments of the present application, which only specifically describe the technical principles of the present application. These descriptions are only for explaining the principles of the present application and cannot be interpreted as limiting the scope of protection of the present application in any way. Based on the explanation here, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application, and other specific implementation methods of the present application that can be associated with by technicians in this field without creative work, should be included in the scope of protection of the present application.

Claims

1. A heat dissipation structure, characterized in that: include: The main body includes a shell and a first heat source, wherein the first heat source includes a heat source panel and a heat source protrusion, wherein the heat source panel is connected to the shell and is formed with the shell to form a mounting cavity, wherein the heat source panel has a panel back facing the mounting cavity, and the heat source protrusion is protruded from the panel back; A heat dissipation component is located in the mounting cavity and is spaced apart from the heat source panel. The heat dissipation component includes a cold conduction plate and a heat dissipation plate. The cold conduction plate is connected to the shell and supports the heat dissipation plate. The heat dissipation plate has a connected heat absorption portion and a heat dissipation portion. The heat absorption portion is connected to the side of the heat source protrusion facing away from the heat source panel. The projection of the heat dissipation portion on the back of the panel does not overlap with the projection of the heat source protrusion on the back of the panel.

2. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation plate is located on a side of the cold conduction plate close to the first heat source.

3. The heat dissipation structure according to claim 1, characterized in that: The heat source protrusion is arranged at the bottom of the back side of the panel, and the heat dissipation portion extends from the bottom of the back side of the panel to at least the middle of the back side of the panel.

4. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure further includes a second heat source, wherein the second heat source is connected to the housing, and the cold conduction plate is connected to the second heat source.

5. The heat dissipation structure according to claim 4, characterized in that: The shell includes a bottom shell and a middle frame, the middle frame includes a support plate and a frame, the frame is arranged around the edge of the support plate, the heat source panel and the bottom shell are respectively connected to opposite sides of the frame, the second heat source is connected to the support plate and / or the bottom shell, and the heat dissipation component is connected to the shell and spaced apart from the frame.

6. The heat dissipation structure according to claim 4, characterized in that: The shell includes a bottom shell and a frame, the frame is arranged around the edge of the bottom shell, the second heat source is connected to the bottom shell, the heat source panel is connected to the frame, and the heat dissipation component is connected to the bottom shell and spaced apart from the frame.

7. The heat dissipation structure according to claim 4, characterized in that: The cooling plate includes a cooling portion and at least one protrusion portion, the cooling portion is connected to the heat dissipation plate, each protrusion portion is connected to the side of the cooling portion away from the heat dissipation plate, the cooling portion is spaced apart from the second heat source, and the protrusion portion is connected to the second heat source.

8. The heat dissipation structure according to claim 7, characterized in that: The convex block portion and the cooling conduction portion are integrally formed.

9. The heat dissipation structure according to claim 7, characterized in that: The second heat source includes a circuit board and at least one control device, the control device includes a shielding cover and at least one chip unit, the circuit board is connected to the shell, the chip unit is connected to the side of the circuit board facing the cold conduction plate, and has a control chip top surface facing the cold conduction plate, the shielding cover is connected to the circuit board and covers at least one of the chip units, the shielding cover has at least one connecting window, the protrusion extends into the connecting window and is connected to the top surface of the control chip, the cold conduction plate and the shielding cover jointly realize the shielding of the chip unit.

10. The heat dissipation structure according to claim 9, characterized in that: The shielding cover includes a hard cover body and a soft shielding body, the cover body is provided with a connecting hole, the shielding body is connected to the cover body and forms the connecting window together with the cover body, the protrusion part is passed through the connecting hole, and the shielding body shields the gap between the cover body and the protrusion part.

11. The heat dissipation structure according to claim 10, characterized in that: The cover body has a cover top surface facing the cooling portion, and the shielding body is connected to the cover top surface and is arranged around the protruding block portion.

12. A mobile terminal, characterized in that: It comprises the heat dissipation structure according to any one of claims 1 to 11, wherein the first heat source is a display screen, the heat source panel is a display module, and the heat source protrusion is a display chip.

13. The mobile terminal according to claim 12, characterized in that: The heat dissipation structure further includes a second heat source, which is a control component. The control component is connected to the shell, and the cold conduction plate is connected to the control component.

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