Light modulation module, preparation method thereof and light modulation device

Abstract

The application discloses a light-adjusting module, which comprises a first substrate, a second substrate, a plurality of spacers (4), a frame sealant and a dye liquid crystal; the first substrate comprises a first base (1), a first conductive layer (2) and a first orientation film (3); the first conductive layer (2) and the first orientation film (3) are sequentially stacked on one side of the first base (1) close to the dye liquid crystal; the spacer (4) is located on one side of the first conductive layer (2) close to the dye liquid crystal; the second substrate comprises a second base (11), a second conductive layer (12) and a second orientation film (13); the second conductive layer (12) and the second orientation film (13) are sequentially stacked on one side of the second base (11) close to the dye liquid crystal; the second substrate is opposite to the first substrate; the frame sealant is located between the first substrate and the second substrate and surrounds to form a light-adjusting area; the dye liquid crystal is located in the light-adjusting area; and the interval distance between adjacent spacers in the light-adjusting area is 50-1000 mu m.

Description

Technical Field

[0001] This disclosure pertains to the field of display technology, specifically relating to a dimming module, its preparation method, and a dimming device. Background Technology

[0002] Flexible dye-liquid crystal dimming devices have advantages such as being thin, flexible, and privacy-protecting, which can better meet the needs of passenger car sunroofs and side windows for double-curved and lightweight designs. Moreover, the simple gray-black color makes them look more high-end and brings users a more intelligent and comfortable driving experience. Summary of the Invention

[0003] In a first aspect, embodiments of this disclosure provide a dimming module, which includes: a first substrate, a second substrate, a plurality of spacers, a sealant, and a dye liquid crystal;

[0004] The first substrate includes a first substrate, a first conductive layer, and a first alignment film;

[0005] The first conductive layer and the first alignment film are sequentially stacked on the side of the first substrate closest to the dye liquid crystal;

[0006] The spacer is located on the side of the first conductive layer closer to the dye liquid crystal;

[0007] The second substrate includes a second substrate, a second conductive layer, and a second alignment film;

[0008] The second conductive layer and the second alignment film are sequentially stacked on the side of the second substrate closest to the dye liquid crystal;

[0009] The second substrate is mated with the first substrate, and the sealing adhesive is located between the first substrate and the second substrate, forming a dimming area; the dye liquid crystal is located in the dimming area;

[0010] Within the dimming zone, the spacing between adjacent spacers is 50–1000 μm.

[0011] In some embodiments, the material of the first substrate is any one of polyethylene terephthalate, polycarbonate, cellulose triacetate, and cyclic olefin polymers, and the material of the second substrate is any one of polyethylene terephthalate, polycarbonate, cellulose triacetate, and cyclic olefin polymers.

[0012] In some embodiments, the orthographic projection of the spacer on the first substrate overlaps with the orthographic projection of the sealant on the first substrate.

[0013] In some embodiments, the minimum distance between the spacer and the first edge of the sealing adhesive away from the dimming area is less than the spacing distance between adjacent spacers.

[0014] In some embodiments, the minimum distance between the spacer and the first edge of the sealing adhesive away from the dimming area is greater than the spacing distance between adjacent spacers.

[0015] In some embodiments, the spacing between adjacent spacers ranges from 50 to 500 μm.

[0016] In some embodiments, the radial dimension of the first surface of the spacer on the first conductive layer ranges from 10 to 40 μm;

[0017] The radial dimension of the second surface of the spacer ranges from 5 to 30 μm;

[0018] The height of the spacer ranges from 4 to 30 μm.

[0019] In some embodiments, the radial dimension of the first side of the spacer is 20–30 μm; the radial dimension of the second side of the spacer is 10–20 μm; and the height of the spacer is 8–15 μm.

[0020] In some embodiments, the septum includes a primary septum and a secondary septum;

[0021] The radial dimension of the first surface of the main septum is larger than the radial dimension of the first surface of the auxiliary septum;

[0022] And / or, the radial dimension of the second surface of the primary septum is greater than the radial dimension of the second surface of the secondary septum;

[0023] And / or, the height dimension of the primary spacer is greater than the height dimension of the secondary spacer.

[0024] In some embodiments, the spacing between adjacent spacers ranges from 0.05 to 1 mm.

[0025] The spacer extends along a first direction and a second direction to form a grid, the first direction and the second direction being parallel to and intersecting the first substrate.

[0026] In some embodiments, the width of the first surface of the spacer on the first conductive layer ranges from 10 to 30 μm;

[0027] The width of the second surface of the spacer ranges from 5 to 20 μm;

[0028] The height of the spacer is in the range of 4 to 30 μm;

[0029] The spacer is mesh-shaped; the mesh shape includes square mesh, rectangular mesh, or regular hexagonal mesh.

[0030] In some embodiments, a black matrix is ​​further included, located between the first conductive layer and the spacer, wherein the orthographic projection of the spacer onto the first substrate lies within the orthographic projection area of ​​the black matrix onto the first substrate.

[0031] In some embodiments, at least a portion of the second side of the spacer is in contact with the second orientation film;

[0032] The dimming module includes a curved surface area;

[0033] The second substrate further includes at least one retaining ring, which is located in the arcuate region;

[0034] The fixing ring is located on the side of the second conductive layer closer to the dye liquid crystal and extends through the second alignment film toward the first substrate; or, the fixing ring is located on the side of the second alignment film closer to the dye liquid crystal and extends toward the first substrate.

[0035] The top of the spacer located in the arcuate region is embedded in the retaining ring.

[0036] In some embodiments, the system further includes a first barrier layer, a second barrier layer, and a side coating.

[0037] The first barrier layer and the second barrier layer are located between the first substrate and the second substrate, or the first barrier layer and the second barrier layer are located on the side of the first substrate and the second substrate away from the dye liquid crystal, respectively.

[0038] The side coating is located between the first barrier layer and the second barrier layer, and the side coating is located on the side of the sealing adhesive away from the dimming area.

[0039] In some embodiments, the first barrier layer is located between the first substrate and the first conductive layer;

[0040] The second barrier layer is located between the second substrate and the second conductive layer;

[0041] The orthographic projections of the first conductive layer, the second conductive layer, the first alignment film, and the second alignment film onto the first substrate do not overlap with the orthographic projections of the sealing adhesive and the side coating adhesive onto the first substrate;

[0042] The orthographic projections of the first barrier layer and the second barrier layer on the first substrate overlap with the orthographic projections of the sealing adhesive and the side coating adhesive on the first substrate, and the first barrier layer and the second barrier layer are respectively in contact with the sealing adhesive and the side coating adhesive.

[0043] In some embodiments, the first barrier layer is located on the side of the first substrate opposite to the second substrate;

[0044] The second barrier layer is located on the side of the second substrate opposite to the first substrate;

[0045] The orthographic projection of the side-coated adhesive onto the first barrier layer does not overlap with the first substrate;

[0046] The orthographic projection of the side-coated adhesive onto the second barrier layer does not overlap with the second substrate;

[0047] The side coating is in contact with and connected to the first barrier layer and the second barrier layer, respectively.

[0048] In some embodiments, the materials of the first barrier layer and the second barrier layer include silicon nitride or silicon oxide.

[0049] In some embodiments, the thickness of the first barrier layer ranges from 1 to 2 μm;

[0050] The thickness of the second barrier layer ranges from 1 to 2 μm.

[0051] In some embodiments, the first barrier layer and the second barrier layer respectively include a base film, a barrier film and an optical adhesive film, wherein the base film, the barrier film and the optical adhesive film are stacked sequentially.

[0052] In some embodiments, the thickness of the first barrier layer ranges from 50 to 200 μm;

[0053] The thickness of the second barrier layer ranges from 50 to 200 μm.

[0054] In some embodiments, the elastic recovery rate of the spacer under a pressure of 5 to 30 mN is 80% to 90%.

[0055] In some embodiments, the dimming module has a compressibility greater than 80 kgf / cm². 2 .

[0056] Secondly, this disclosure also provides a dimming device, which includes the dimming module described above;

[0057] It also includes a first cover plate and a second cover plate, with the dimming module located between the first cover plate and the second cover plate;

[0058] The first substrate in the dimming module is bonded to the first cover plate by a first adhesive layer.

[0059] The second substrate and the second cover plate in the dimming module are bonded together by a second adhesive layer.

[0060] The first cover plate and the second cover plate are bonded together by the first adhesive layer and the second adhesive layer.

[0061] In some embodiments, a first edge-masking layer and a second edge-masking layer are also included.

[0062] The first edge-shielding layer is located on the side of the first cover plate opposite to the second cover plate, and the orthographic projection of the first edge-shielding layer on the first cover plate covers the area from the sealing adhesive inside the dimming module to the edge of the first cover plate.

[0063] The second edge shielding layer is located on the side of the second cover plate opposite to the first cover plate, and the orthographic projection of the second edge shielding layer on the second cover plate covers the area from the sealing adhesive inside the dimming module to the edge of the second cover plate.

[0064] Thirdly, this disclosure also provides a method for preparing a dimming module, comprising: preparing a first substrate;

[0065] Fabrication of a second substrate;

[0066] The first substrate and the second substrate are joined together and sealed with a sealing glue, and dye liquid crystal is injected into the dimming area enclosed by the sealing glue.

[0067] The preparation of the first substrate includes: preparing a first conductive layer on a first substrate;

[0068] Multiple spacers are prepared on the first substrate after the above steps are completed;

[0069] A first alignment film is prepared on the first substrate after the above steps are completed;

[0070] The preparation of the second substrate includes: preparing a second conductive layer on the second substrate;

[0071] A second orientation film is prepared on the second substrate after the above steps have been completed.

[0072] In some embodiments, a plurality of spacers are fabricated on the first substrate after the first conductive layer has been fabricated using an exposure process, including:

[0073] A photoresist film is coated on the side of the first conductive layer that is away from the first substrate;

[0074] The photoresist film is dried at 80–100°C for 100–120 seconds.

[0075] The photoresist film is exposed to ultraviolet light using a mask with a transparent pattern, causing the photoresist film in the area corresponding to the transparent pattern to undergo a polymerization reaction;

[0076] A potassium hydroxide solution is sprayed onto the exposed photoresist film to remove the unpolymerized portion of the photoresist film outside the transparent pattern, thereby forming the pattern of the spacer.

[0077] The pattern of the spacer is cured at 100-110°C for 50-60 minutes to form the spacer. Attached Figure Description

[0078] The accompanying drawings are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the disclosure and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the detailed description of exemplary embodiments with reference to the accompanying drawings, in which:

[0079] Figure 1 This is a cross-sectional schematic diagram of the structure of a dye-liquid crystal dimming device in related technologies.

[0080] Figure 2 This is a diagram illustrating the white spot defect caused by the collapse of the box thickness.

[0081] Figure 3 This is a schematic cross-sectional view of the structure of the first substrate in an embodiment of this disclosure.

[0082] Figure 4 The elastic recovery rate test curve for the spacer material.

[0083] Figure 5a This is a schematic diagram of the distribution of multiple spacers on a flexible first substrate.

[0084] Figure 5b This is a schematic diagram of another distribution of multiple spacers on a flexible first substrate.

[0085] Figure 5c This is another schematic diagram showing the distribution of multiple spacers on a flexible first substrate.

[0086] Figure 5d This is a schematic diagram showing the distribution of multiple spacers on a rigid first substrate.

[0087] Figure 6a This is a schematic diagram showing that the spacers are only distributed in the dimming area.

[0088] Figure 6b This is a schematic diagram showing that the spacers are distributed in both the dimming area and the border area.

[0089] Figure 6c This is a schematic diagram showing that the spacers are distributed in both the dimming area and part of the border area.

[0090] Figure 7aThis is a schematic cross-sectional view of the spacer perpendicular to the first substrate in an embodiment of this disclosure.

[0091] Figure 7b This is a schematic cross-sectional view of the spacer perpendicular to the first substrate in an embodiment of this disclosure.

[0092] Figure 8a This is a cross-sectional view of the structure of the first substrate with main spacers and auxiliary spacers in an embodiment of this disclosure.

[0093] Figure 8b This is a schematic diagram showing the distribution of the main septum and the auxiliary septum in an embodiment of this disclosure.

[0094] Figure 9a This is a schematic diagram showing the distribution of the strip-shaped spacers in an embodiment of this disclosure.

[0095] Figure 9b This is a schematic diagram showing the distribution of square grid-shaped spacers in an embodiment of this disclosure.

[0096] Figure 9c This is a schematic diagram showing the distribution of rectangular grid-shaped spacers in an embodiment of this disclosure.

[0097] Figure 9d This is a schematic diagram showing the distribution of hexagonal grid-like spacers in an embodiment of this disclosure.

[0098] Figure 9e This is a schematic diagram showing the distribution of spherical spacers in an embodiment of this disclosure.

[0099] Figure 10 This is a cross-sectional view of the structure of a first substrate formed of a photoresist material containing black pigment, as described in an embodiment of this disclosure.

[0100] Figure 11 This is a cross-sectional view of the first substrate with a black matrix disposed at the location of the spacer in an embodiment of this disclosure.

[0101] Figure 12a This is a schematic diagram of the friction shadow area that appears in the first orientation film during the friction orientation process.

[0102] Figure 12b A schematic diagram illustrating the principle of light leakage caused by the orientation of liquid crystal molecules around the spacer.

[0103] Figure 12c This is a schematic diagram showing light leakage around the spacer in the first oriented film formed by friction orientation and photoorientation processes.

[0104] Figure 13 A schematic diagram of the process of sequentially preparing a spherical spacer and a first orientation film on the first conductive layer.

[0105] Figure 14This is a cross-sectional view of the structure of a dimming module according to an embodiment of the present disclosure.

[0106] Figure 15a This is a cross-sectional view of the arc surface area of ​​the dimming module in an embodiment of this disclosure.

[0107] Figure 15b This is a cross-sectional view of another structure of the curved area of ​​the dimming module in an embodiment of this disclosure.

[0108] Figure 16 This is a schematic diagram showing the nesting of the top of the spacer and the fixing ring in an embodiment of this disclosure.

[0109] Figure 17 This is a cross-sectional view of the structure of a flexible dimming module with an arc-shaped area in related technologies.

[0110] Figure 18 This is a cross-sectional view of another dimming module in an embodiment of this disclosure.

[0111] Figure 19 This is a cross-sectional view of the structure of another dimming module in the embodiments of this disclosure.

[0112] Figure 20 This is a cross-sectional view of the dimming device in an embodiment of this disclosure. Detailed Implementation

[0113] To enable those skilled in the art to better understand the technical solutions of the embodiments of this disclosure, the following describes in further detail a dimming module and its preparation method, as well as a dimming device, provided by the embodiments of this disclosure, in conjunction with the accompanying drawings and specific implementation methods.

[0114] Embodiments of this disclosure will be described more fully below with reference to the accompanying drawings; however, the embodiments shown may be embodied in different forms and should not be construed as limited to the embodiments set forth in this disclosure. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will enable those skilled in the art to fully understand the scope of this disclosure.

[0115] This disclosure is not limited to the embodiments shown in the accompanying drawings, but includes modifications to the configuration based on the manufacturing process. Therefore, the areas illustrated in the drawings are schematic, and the shapes of the areas shown illustrate specific shapes of the areas, but are not intended to be limiting.

[0116] Reference Figure 1This is a cross-sectional schematic diagram of a dye-liquid crystal dimming device in the related technology. The dye-liquid crystal dimming device includes an upper substrate and a lower substrate disposed in a cell, and the cell is filled with dye-liquid crystal. The dye-liquid crystal includes liquid crystal molecules 9 and dye molecules 10. The upper substrate and the lower substrate respectively include a flexible substrate 22, an electrode layer 23 and an alignment film 24. In both the upper substrate and the lower substrate, the alignment film 24 is disposed on the side of the electrode layer 23 opposite to the flexible substrate 22. A support spacer 4 is disposed in the cell and is disposed on one of the substrates (the lower substrate) to support the upper substrate and the lower substrate of the cell.

[0117] In related technologies, the support spacer 4 is spherical. The spherical support spacer 4 is sprayed onto the alignment film 24 of one side of the substrate by spraying, and then bonded to the alignment film 24 of the substrate after thermosetting. On the one hand, the spraying method results in poor uniformity of the distribution of the support spacer 4; on the other hand, due to its spherical shape, the support spacer 4 has point contact with the alignment film 24, so the adhesion between the spherical support spacer 4 and the alignment film 24 after curing is weak, and it is easy to detach under external force. In areas without support spacers or in areas with low distribution density of support spacers 4 within the cell, cell thickness collapse of the flexible dye-liquid crystal dimming device causes white spot defects (see reference). Figure 2 (This is a schematic diagram of white spot defects caused by cell thickness collapse). The specific principle of white spot defects is as follows: When the upper and lower electrode layers 23 are not energized during normal use, the dye liquid crystal cannot allow light to pass through, and the flexible dye liquid crystal dimming device is in an opaque state. When the upper and lower electrode layers 23 are energized, the dye liquid crystal can allow light to pass through, and the flexible dye liquid crystal dimming device is in a transparent state. White spot defects occur when the upper and lower electrode layers 23 are not energized, and due to cell thickness collapse, there is no dye liquid crystal between the upper and lower substrates at the collapsed position. Therefore, the collapsed position cannot achieve the light-blocking function, that is, the collapsed position is in a transparent state.

[0118] In addition, the structure of rigid dye liquid crystal dimming devices in related technologies can also be referenced. Figure 1 In rigid dye-liquid crystal dimming devices, the support spacer 4 is also prepared by spraying it onto the alignment film 24 on one side of the substrate, and then bonding it to the alignment film 24 after thermal curing. However, in rigid dye-liquid crystal dimming devices, the thermal curing condition for the support spacer 4 is 150°C for 50 minutes; in addition, in rigid dye-liquid crystal dimming devices, the alignment film 24 is prepared by film coating and thermal curing processes; the thermal curing condition for the alignment film 24 is 230°C for 20 minutes. However, for flexible dye-liquid crystal dimming devices, the process temperature that the flexible substrate 22 can withstand is generally less than 150°C, so it is necessary to develop a low-temperature preparation process for the support spacer 4 and the alignment film 24.

[0119] To address the aforementioned problems in the related technologies, in a first aspect, embodiments of this disclosure provide a dimming module, comprising: a first substrate, a second substrate, a plurality of spacers, a sealant, and a dye-based liquid crystal; the first substrate includes a first base, a first conductive layer, and a first alignment film; the first conductive layer and the first alignment film are sequentially stacked on the side of the first substrate closest to the dye-based liquid crystal; the spacers are located on the side of the first conductive layer closest to the dye-based liquid crystal; the second substrate includes a second base, a second conductive layer, and a second alignment film; the second conductive layer and the second alignment film are sequentially stacked on the side of the second substrate closest to the dye-based liquid crystal; the second substrate is aligned with the first substrate, and the sealant is located between the first substrate and the second substrate, forming a dimming area; the dye-based liquid crystal is located in the dimming area; within the dimming area, the spacing between adjacent spacers is 50–1000 μm.

[0120] In some embodiments, refer to Figure 3 This is a cross-sectional view of the structure of the first substrate in an embodiment of this disclosure; wherein, the dimming module includes: a first substrate, the first substrate including a first base 1, a first conductive layer 2, a first alignment film 3 and a plurality of spacers 4; the first conductive layer 2 and the first alignment film 3 are stacked sequentially on the first base 1; the spacers 4 are located on the first conductive layer 2 and extend through the first alignment film 3 in a direction away from the first base 1; the fabrication process temperature of the spacers 4 is lower than the tolerance temperature of the first base 1.

[0121] In some embodiments, the first substrate 1 is made of a flexible, light-transmitting material, such as any one of PET (polyethylene terephthalate), PC (polycarbonate), TAC (cellulose triacetate), or COP (cyclic olefin polymer); the first conductive layer 2 is made of indium tin oxide (ITO). The ITO film can be made ultra-thin, which is beneficial for achieving the flexibility of the first conductive layer 2. ITO is also light-transmitting, which is beneficial for achieving the light transmittance of the first substrate.

[0122] In some embodiments, the thickness of the first alignment film 3 ranges from 65 to 100 nm.

[0123] In some embodiments, the spacer 4 is made of a flexible material; the elastic recovery rate of the spacer 4 under a pressure of 5 to 30 mN is 80% to 90%.

[0124] In some embodiments, the dimming module has a compressibility greater than 80 kgf / cm². 2 .

[0125] During the lamination pressure test of the dimming module, an 80 kgf / cm pressure was applied through the pressure head. 2The force applied to the dimming module does not damage the internal spacer 4 under this pressure. Because the bonding pressure on the dimming module and tempered glass during the autoclave assembly is less than 80 kgf / cm², the bonding pressure on the dimming module is also less than 80 kgf / cm². 2 Therefore, the spacer 4 is sufficient to withstand the pressure of the dimming module and the tempered glass being joined together.

[0126] In some embodiments, the spacer 4 is made of photoresist material; the photoresist material includes acrylic copolymer, multifunctional monomer, photoinitiator, diethylene glycol methyl ether (1-Ethoxy-2-(2-methoxyethoxy)ethane) and propylene glycol monomethyl ether (1-methoxy-2-propanol).

[0127] In some embodiments, in the photoresist material of the spacer 4, the mass percentage of the acrylic copolymer ranges from 10% to 20%; the mass percentage of the multifunctional monomer ranges from 6% to 12%; the mass percentage of the photoinitiator ranges from less than or equal to 5%; the mass percentage of diethylene glycol methyl ether ranges from 50% to 67%; and the mass percentage of propylene glycol monomethyl ether ranges from 13% to 17%.

[0128] In some embodiments, as shown in Table 1, the elastic recovery rate test data of the spacer 4 using the above-described photoresist material under pressure of 5 to 30 mN are presented.

[0129] Table 1

[0130]

[0131] See Figure 4 Table 1 shows the elastic recovery rate test curve of the spacer material. As can be seen from the test data in Table 1, the average elastic recovery rate of the spacer material 4 is 83.9%, which can well meet the flexible support performance requirements of the first substrate when applied to the flexible dimming module.

[0132] In some embodiments, a plurality of spacers 4 are arranged in an array at equal intervals, with the spacing between adjacent spacers 4 ranging from 50 to 500 μm. This spacing range between adjacent spacers 4 can well meet the flexible support performance requirements of the first substrate when applied to a flexible dimming module.

[0133] In some embodiments, refer to Figure 5a This is a schematic diagram showing the distribution of multiple spacers on a flexible first substrate; wherein the spacing 'a' between adjacent spacers 4 is 150–180 μm. In some embodiments, the spacing 'a' between adjacent spacers 4 is 166.67 μm; correspondingly, the distribution density of the spacers 4 is 49 ea / mm². 2 .

[0134] In some embodiments, refer to Figure 5b This is a schematic diagram illustrating another distribution of multiple spacers on a flexible first substrate; wherein the spacing b between adjacent spacers 4 is 80–120 μm. In some embodiments, the spacing b between adjacent spacers 4 is 100 μm; correspondingly, the distribution density of the spacers 4 is 121ea / mm². 2 .

[0135] In some embodiments, refer to Figure 5c This is another schematic diagram showing the distribution of multiple spacers on a flexible first substrate; wherein the spacing c between adjacent spacers 4 is 50–80 μm. In some embodiments, the spacing c between adjacent spacers 4 is 71.43 μm; correspondingly, the distribution density of spacers 4 is 225 ea / mm². 2 .

[0136] In this embodiment, since the dimming module is prone to collapse without the support of the spacers 4, the distribution density of the above three types of spacers 4 can well meet the flexible support performance requirements of the first substrate when applied to the flexible dimming module, prevent the local collapse of the flexible dimming module using the first substrate caused by the low distribution density of the spacers 4, and effectively solve the problem of white spot defects in the flexible dimming module.

[0137] In some embodiments, the first substrate 1 is made of a rigid material, such as glass. In some embodiments, the spacer 4 is made of a rigid material, such as hard resin or glass.

[0138] In some embodiments, the spacing between adjacent spacers 4 ranges from 50 to 1500 μm.

[0139] In some embodiments, refer to Figure 5d This is a schematic diagram showing the distribution of multiple spacers on a rigid first substrate; wherein the spacing d between adjacent spacers 4 is 1000μm.

[0140] In this embodiment, when the first substrate 1 is made of a rigid material, the first substrate has a certain rigidity. Since the dimming module with better rigidity is not easy to collapse without the support of the spacer 4, the spacing of the spacer 4 can well meet the rigid support performance requirements of the first substrate when applied to the rigid dimming module.

[0141] In some embodiments, refer to Figure 6a and Figure 6b , Figure 6a This is a schematic diagram showing that the spacers are only distributed in the dimming area; Figure 6bThis is a schematic diagram showing that the spacers are distributed in both the dimming area and the frame area; the dimming module includes a dimming area 100 and a frame area 101, with the frame area 101 surrounding the dimming area 100; the spacers 4 are distributed in the dimming area 100, and the spacers 4 are distributed in at least part of the frame area 101.

[0142] In some embodiments, refer to Figure 6b The orthographic projection of the spacer 4 on the first substrate overlaps with the orthographic projection of the sealant on the first substrate.

[0143] In some embodiments, refer to Figure 6b The minimum distance between the spacer 4 and the first edge s of the sealant away from the dimming area 100 is less than the spacing between adjacent spacers 4. That is, the spacer 4 covers the entire area where the sealant is located.

[0144] In some embodiments, refer to Figure 6c This is a schematic diagram showing that the spacers are distributed in both the dimming area and part of the border area; multiple spacers 4 are distributed in the dimming area 100, and at the same time, multiple spacers 4 are also distributed in a part of the border area 101 near the dimming area 100; no spacers are distributed in a part of the border area 101 away from the dimming area 100.

[0145] In some embodiments, refer to Figure 6c The minimum distance between the spacer 4 and the first edge s of the sealant away from the dimming area 100 is greater than the spacing between adjacent spacers 4. That is, the spacer 4 does not cover the entire area where the sealant is located; the spacer 4 is only distributed in a portion of the sealant distribution area near the dimming area 100.

[0146] When the first substrate is used in a flexible dimming module, its frame area 101 is coated with sealing adhesive to achieve the mating and sealing of the first substrate and the second substrate. The frame area 101 is the area where the sealing adhesive is applied, and the area enclosed by the sealing adhesive is the dimming area 100, excluding the frame area. Spacers 4 are provided in the frame area 101, which can support the sealing adhesive in the frame area 101, thereby supporting the thickness of the frame area 101.

[0147] In some embodiments, the radial dimension of the first side of the spacer 4 located on the first conductive layer 2 ranges from 10 to 40 μm; the radial dimension of the second side of the spacer 4 ranges from 5 to 30 μm; and the height dimension of the spacer 4 ranges from 4 to 30 μm.

[0148] The first and second surfaces of the spacer 4 can be of any shape, and the radial dimension of the first and second surfaces refers to the dimension between the two intersection points of the straight line passing through the center of the surface and the edge of the surface.

[0149] In some embodiments, the spacer 4 is cylindrical; the cylindrical shape includes cylindrical, prismatic, frustum-shaped or truncated pyramidal.

[0150] In some embodiments, refer to Figure 7a This is a schematic cross-sectional view of the spacer perpendicular to the first substrate in an embodiment of this disclosure; the spacer 4 is shaped like a frustum cone; the diameter of the first surface of the spacer 4 on the first conductive layer 2 ranges from 10 to 40 μm; the diameter of the second surface of the spacer 4 ranges from 5 to 30 μm; and the height of the spacer 4 ranges from 4 to 30 μm.

[0151] In some embodiments, the diameter of the first side of the spacer 4 is 20-30 μm; the diameter of the second side of the spacer 4 is 10-20 μm; and the height of the spacer 4 is 8-15 μm.

[0152] In some embodiments, refer to Figure 7a The diameter of the first surface of the spacer 4 is 27 μm; the diameter of the second surface of the spacer 4 is 17 μm; and the height of the spacer 4 is 12 μm.

[0153] In some embodiments, refer to Figure 7a The cross-sectional shape of the spacer 4 perpendicular to the first base 1 is an isosceles trapezoid. The base angle θ of the isosceles trapezoid is 67°.

[0154] In some embodiments, refer to Figure 7b This is a schematic cross-sectional view of the spacer perpendicular to the first substrate in an embodiment of this disclosure; the spacer 4 is shaped like a frustum cone; the diameter of the first surface of the spacer 4 on the first conductive layer 2 ranges from 10 to 25 μm; the diameter of the second surface of the spacer 4 ranges from 8 to 20 μm; and the height of the spacer 4 ranges from 3 to 5 μm.

[0155] In some embodiments, refer to Figure 7b The diameter of the first surface of the spacer 4 is 29 μm; the diameter of the second surface of the spacer 4 is 14 μm; and the height of the spacer 4 is 10 μm.

[0156] In some embodiments, refer to Figure 7b The cross-sectional shape of the spacer 4 perpendicular to the first base 1 is an isosceles trapezoid. The base angle θ of the isosceles trapezoid is 57°.

[0157] In some embodiments, refer to Figure 8a and Figure 8b , Figure 8a This is a schematic cross-sectional view of the structure of the first substrate provided with the main spacer and the auxiliary spacer in an embodiment of this disclosure; Figure 8bThis is a schematic diagram showing the distribution of the main septum and the auxiliary septum in an embodiment of this disclosure; wherein, the septum 4 includes a main septum 41 and an auxiliary septum 42; the diameter of the first surface of the main septum 41 is larger than the diameter of the first surface of the auxiliary septum 42; and / or, the diameter of the second surface of the main septum 41 is larger than the diameter of the second surface of the auxiliary septum 42; and / or, the height of the main septum 41 is larger than the height of the auxiliary septum 42.

[0158] The main spacer 41 and the auxiliary spacer 42 can provide good support for the first substrate and the second substrate in the flexible dimming module using the first substrate. On the other hand, when the flexible dimming module is bent and deformed under external force, the spacer 4 can also ensure stable support for the first substrate and the second substrate, avoiding the problem of white spots.

[0159] In some embodiments, the diameter of the second surface of the main septum 41 is 17 μm, the diameter of the first surface of the main septum 41 is 27 μm, and the height of the main septum 41 is 12 μm; the diameter of the second surface of the auxiliary septum 42 is 15 μm, the diameter of the first surface of the auxiliary septum 42 is 25 μm, and the height of the auxiliary septum 42 is 11.5 μm.

[0160] In some embodiments, the array of spacers 4 includes multiple regions 102, each region 102 having the same number of spacers 4; the number of primary spacers 41 in each region 102 is less than the number of secondary spacers 42; the primary spacers 41 in each region 102 are arranged in an array, and the secondary spacers 42 are arranged in an array.

[0161] In some embodiments, refer to Figure 8b Each area 102 contains 49 spacers 4, of which 9 are main spacers 41 and 40 are auxiliary spacers 42.

[0162] In some embodiments, refer to Figure 9a This is a schematic diagram of the distribution of strip-shaped spacers in an embodiment of this disclosure; the spacer 4 is strip-shaped; the length of the spacer 4 extends along the length or width direction of the first base 1.

[0163] In some embodiments, the length of the strip spacer 4 is equal to the length or width of the first base 1.

[0164] In some embodiments, the spacing between adjacent two shaped spacers 4 is equal; the spacing between adjacent spacers 4 ranges from 0.05 to 1 mm.

[0165] In some embodiments, refer to Figure 9b , Figure 9c and Figure 9d , Figure 9bThis is a schematic diagram showing the distribution of square grid-shaped spacers in an embodiment of this disclosure; Figure 9c This is a schematic diagram showing the distribution of rectangular grid-like spacers in an embodiment of this disclosure; Figure 9d This is a schematic diagram showing the distribution of hexagonal grid-shaped spacers in an embodiment of this disclosure; the spacers 4 extend along a first direction and a second direction to form a grid, the first direction and the second direction being parallel to and intersecting the first substrate. The spacers 4 are grid-shaped; the grid shape includes square grids, rectangular grids, or regular hexagonal grids.

[0166] In some embodiments, refer to Figures 9a-9d The width of the first side of the spacer 4 located on the first conductive layer 2 ranges from 10 to 30 μm; the width of the second side of the spacer 4 ranges from 5 to 20 μm; and the height of the spacer 4 ranges from 4 to 30 μm.

[0167] The widths of the first and second surfaces of the spacer 4 are the widths of their orthographic projections onto the first base 1, respectively. The height of the spacer 4 is the distance between its second and first surfaces.

[0168] In this embodiment, the support area of ​​the strip and grid-like spacers 4 for the dimming module is larger than that of the columnar spacers 4, which makes the cell thickness control capability of the dimming module stronger. When the dimming module is subjected to external force, the strip and grid-like spacers 4 can prevent the liquid crystal from flowing in the dimming module cell, thereby preventing the liquid crystal from flowing to a local area under the action of external force, resulting in poor light blocking or light transmission, and avoiding the phenomenon of local blackening of the dimming module.

[0169] In some embodiments, refer to Figure 9e This is a schematic diagram showing the distribution of spherical spacers in an embodiment of this disclosure; the spacer 4 is spherical in shape. The spherical spacer 4 is in contact with and connected to both the first conductive layer 2 and the first alignment film 3. Compared to the connection method in related technologies that can only achieve point contact between the supporting spacer and the alignment film, this greatly increases the contact area between the spherical spacer 4 and the film layer it is located in, thereby improving the connection strength between the spherical spacer 4 and the film layer it is located in, improving or avoiding the problem of the spherical spacer 4 being prone to falling off, and thus better solving the problem of white spot defects in the dimming module.

[0170] In some embodiments, refer to Figure 10 This is a cross-sectional view of the structure of a first substrate formed by a spacer material containing black pigment in an embodiment of this disclosure; the photoresist material also includes black pigment; the mass percentage of black pigment in the photoresist material ranges from 5 to 10 wt%; the black pigment is in the form of black particles with a particle size of less than 100 nm.

[0171] In some embodiments, a black pigment, such as carbon, is incorporated into the photoresist material to form a black acrylic resin. The absorbance (OD, Optical Desity, representing the light density absorbed by the detected object) of the black acrylic resin material can reach 3 or more, thereby greatly reducing the light transmittance of the spacer 4.

[0172] In this embodiment, the photoresist material is transparent before the addition of black pigment, and its transmittance is greater than 90%, which increases the dark transmittance of the dimming module and causes a decrease in the contrast of the dimming module. By adding black pigment to the photoresist material, the light transmittance of the spacer 4 can be reduced, thereby reducing the dark transmittance of the dimming module, thereby improving the contrast of the dimming module and enhancing the user's visual experience.

[0173] In some embodiments, refer to Figure 11 This is a cross-sectional view of the first substrate with a black matrix disposed at the location of the spacer in this embodiment of the present disclosure; wherein, the dimming module further includes a black matrix 5, located between the first conductive layer 2 and the spacer 4, and the orthographic projection of the spacer 4 on the first substrate 1 is located within the orthographic projection area of ​​the black matrix 5 on the first substrate 1.

[0174] Reference Figure 11 Since the spacer 4 itself is transparent and its transmittance is greater than 90%, the dark state transmittance of the dimming module increases, resulting in a decrease in device contrast. By setting a black matrix 5 between the spacer 4 and the first conductive layer 2, the light irradiated to the spacer 4 can be absorbed, thereby reducing the light transmittance of the spacer 4, thereby reducing the dark state transmittance of the dimming module, improving the contrast of the dimming module, and enhancing the user's visual experience.

[0175] In some embodiments, the thickness of the black matrix 5 is approximately 1–3 μm. To prevent light leakage caused by light passing through the spacer 4, the black matrix 5 needs to completely cover the first surface of the spacer 4, that is, the spacer 4 needs to be completely placed on the black matrix 5, i.e., the orthographic projection area of ​​the black matrix 5 on the first substrate 1 is ≥ the area of ​​the first surface of the spacer 4; the orthographic projection size of the black matrix 5 should be the sum of the size of the first surface of the spacer 4 and the alignment accuracy of the two, and the alignment accuracy of the black matrix 5 and the spacer 4 is generally ±3 μm.

[0176] In some embodiments, the black matrix 5 is made of photoresist material, and the photoresist components include polymer resin, pigment, monomer, photoinitiator, solvent, etc.; the solvent is generally propylene glycol methyl ether acetate (PGMEA); the polymer resin is generally bisphenol fluorene resin; the monomer is a small molecule acrylate; the photoinitiator is a free radical type, generally an oxime ester photoinitiator; the pigment is generally carbon black particles with a particle size of less than 100 nm.

[0177] Based on the above structure of the dimming module, this disclosure also provides a method for preparing the dimming module, which includes: preparing a first substrate; preparing the first substrate includes: step S1: preparing a first conductive layer on the first substrate.

[0178] In this step, the first conductive layer is fabricated using a patterning process. The patterning process includes steps such as film deposition, photoresist coating, exposure, development, and etching.

[0179] The first conductive layer uses indium tin oxide, a light-transmitting material, to achieve the light transmittance of the first substrate, thereby enabling the light transmittance of the dimming module.

[0180] Step S2: Prepare multiple spacers on the first substrate after completing the above steps.

[0181] In some embodiments, step S2 specifically includes: coating a photoresist film on the side of the first conductive layer away from the first substrate; such as coating a negative photoresist film.

[0182] The photoresist film is dried at 80–100°C for 100–120 seconds to remove small molecule solvents and reduce the fluidity of the photoresist.

[0183] A photoresist film is exposed to ultraviolet light (UV light, typically in the 300–436 nm band) using a photomask with a transparent pattern, causing the photoresist film in the corresponding area of ​​the transparent pattern to undergo a polymerization reaction.

[0184] After exposure, a potassium hydroxide (KOH) solution is sprayed onto the photoresist film to remove the unpolymerized photoresist film outside the transparent pattern, forming the spacer pattern; or a 0.04 wt% potassium hydroxide solution is sprayed to clean away the unpolymerized photoresist film.

[0185] The pattern of the spacer is cured at 100-110°C for 50-60 minutes to form the spacer.

[0186] In some embodiments, columnar, strip-shaped, and mesh-shaped spacers can all be prepared by the above-described exposure process, thereby realizing a low-temperature preparation process for spacers in the dimming module and avoiding damage to the flexibility of the first substrate caused by excessively high preparation temperature of the spacers.

[0187] In some embodiments, step S2 specifically includes: spraying spherical spacers onto the side of the first conductive layer away from the first substrate.

[0188] The spherical spacer is heated to 100-110°C for 50-60 minutes to melt the surface of the spherical spacer and collect at the interface between the spherical spacer and the first conductive layer.

[0189] Cooling allows the spherical spacer to bond to the first conductive layer.

[0190] In some embodiments, the spherical spacer can be prepared by the above-described spray curing process, which can also achieve the low-temperature preparation process of the spacer in the dimming module, avoiding damage to the flexibility of the first substrate caused by excessively high preparation temperature of the spacer.

[0191] In some embodiments, the primary septum and the secondary septum can be prepared by the exposure process described above. However, unlike the preparation method of the septum prepared by the exposure process described above, a halftone mask (or grayscale mask) is used to adjust the exposure amount during exposure. For example, the transmittance of the exposed light at the mask pattern corresponding to the formation of the primary septum pattern is 100%, and the transmittance of the exposed light at the mask pattern corresponding to the formation of the secondary septum pattern is 30-50%, thereby achieving different sizes and heights for the primary septum and the secondary septum.

[0192] Step S3: Prepare a first alignment film on the first substrate after completing the above steps.

[0193] In this step, the specific preparation process of the first orientation film includes: forming a first orientation film layer on a first substrate on which the spacer material has been prepared by using a coating process or a spraying process.

[0194] The first orientation film layer is cured at 100–110°C for 80–90 minutes.

[0195] The first orientation film is formed by aligning the first orientation film layer using a triboelectric alignment process or a photo-alignment process.

[0196] The above-mentioned preparation method of the first alignment film can realize the low-temperature preparation process of the first alignment film in the dimming module, and avoid damage to the flexibility of the first substrate caused by excessively high preparation temperature of the first alignment film.

[0197] In some embodiments, refer to Figure 12a This is a schematic diagram of the friction shadow area that appears in the first orientation film during the friction orientation process; Figure 12b This is a schematic diagram illustrating the principle of light leakage caused by the alignment of liquid crystal molecules around the spacer. In the friction alignment process, a friction roller 6 is used to rub and align the surface of the first alignment film layer 7. In the friction direction L, due to the obstruction of the spacer 4, there is a friction shadow region 8 (i.e., a region with weakened friction intensity). Because of the weak alignment in this region, the liquid crystal molecules 9 will have abnormal alignment, resulting in disordered alignment of the liquid crystal molecules 9 around the spacer 4, causing light leakage. The principle is as follows. Figure 12b In some embodiments, the photoalignment process eliminates the rubbing shadow region, thus resolving light leakage caused by disordered liquid crystal molecule alignment in the rubbing shadow region. (See reference...) Figure 12cThis is a schematic diagram showing light leakage around the spacer in the first oriented film formed by frictional orientation and photo-orientation processes. Figure 12c As can be seen, the light leakage around the first orientation film 3 spacer 4 oriented by the photo-alignment process is significantly better than that around the first orientation film 3 spacer 4 oriented by the friction alignment process.

[0198] In some embodiments, the first orientation film layer is formed by coating process. Due to the spacing of the spacers, there may be areas around the spacers where the first orientation film layer liquid is not coated (i.e., not coated). The problem of the first orientation film layer being not coated can be avoided by forming the first orientation film layer by spraying process.

[0199] In some embodiments, refer to Figure 13 This is a schematic diagram illustrating the process of sequentially preparing a spherical spacer and a first alignment film on a first conductive layer. The spacer 4 is bonded to the first conductive layer 2, forming an bonding interface. Then, the first alignment film 3 is prepared, which fills the gap between the spacer 4 and the first conductive layer 2. The thicker the first alignment film 3, the more fully the gap is filled, and the larger the bonding interface between the spacer 4 and the first alignment film 3. For example, in related technologies, the bonding area between the supporting spacer and the alignment film is approximately equal to the bonding interface area between the spacer 4 and the first conductive layer 2 in this solution. However, in this solution, there is still a bonding interface between the spacer 4 and the first alignment film 3. Therefore, the bonding area of ​​the spacer 4 in this solution is larger, and the bonding strength is improved, thereby effectively improving or avoiding the problem of easy detachment of the spacer in related technologies.

[0200] In some embodiments, the method for fabricating the dimming module further includes: fabricating a black matrix after fabricating the first conductive layer and before fabricating the spacer. Fabricating the black matrix specifically includes: coating a photoresist film forming the black matrix onto the side of the first conductive layer opposite to the first substrate; for example, coating a negative black matrix photoresist film.

[0201] The photoresist film is dried at 90°C for 120 seconds to remove small molecule solvents and reduce the fluidity of the photoresist.

[0202] A photoresist film is exposed to ultraviolet light (UV light, typically in the 300–436 nm band) using a photomask with a transparent pattern, causing the photoresist film in the corresponding area of ​​the transparent pattern to undergo a polymerization reaction.

[0203] After exposure, a potassium hydroxide (KOH) solution is sprayed onto the photoresist film to remove the unpolymerized photoresist film outside the transparent pattern, forming a black matrix pattern; or a 0.04 wt% potassium hydroxide solution is sprayed to clean away the unpolymerized photoresist film.

[0204] The black matrix pattern is cured at 110℃ for 50-60 minutes to form a black matrix.

[0205] In some embodiments, the mask used in the process of preparing the black matrix and the mask used in the process of preparing the spacer can be the same mask.

[0206] This disclosure also provides a dimming module, see embodiments thereof. Figure 14 This is a cross-sectional view of a dimming module according to an embodiment of the present disclosure; wherein, the dimming module further includes a second substrate and a liquid crystal; the second substrate and the first substrate are mated to form a mating gap, and the liquid crystal is housed in the mating gap; a spacer 4 is located in the mating gap to provide support for the second substrate; the liquid crystal includes a dye liquid crystal. The dye liquid crystal includes liquid crystal molecules 9 and dye molecules 10; the second substrate includes a second substrate 11, a second conductive layer 12 and a second alignment film 13; the second conductive layer 12 and the second alignment film 13 are sequentially stacked on the second substrate 11.

[0207] In some embodiments, at least a portion of the second surface of the spacer 4 contacts the second alignment film 13; the second substrate 11 is made of a flexible material; see reference Figure 15a This is a cross-sectional view of the arc-shaped region of a dimming module in an embodiment of this disclosure; the dimming module includes an arc-shaped region 103; the second substrate further includes at least one fixing ring 14, which is located in the arc-shaped region 103; the fixing ring 14 is located on the side of the second conductive layer 12 near the dye liquid crystal and extends through the second alignment film 13 towards the first substrate; the top of the spacer 4 located in the arc-shaped region 103 is embedded in the fixing ring 14. (See reference...) Figure 16 This is a schematic diagram showing the nesting of the top of the spacer and the fixing ring in an embodiment of this disclosure.

[0208] In some embodiments, refer to Figure 15b This is a cross-sectional view of another structure of the arc surface area of ​​the dimming module in this embodiment; wherein, the fixing ring 14 is located on the side of the second alignment film 13 near the dye liquid crystal and extends towards the first substrate.

[0209] Reference Figure 17 This is a cross-sectional view of the structure of a flexible dimming module with an arc-shaped area in the related technology. The arc-shaped area 103 of the flexible dimming module is hyperbolic. In the arc-shaped area 103 with a large curvature, the flexible dimming module has a large bending. Since the spacer 4 is only bonded to the first substrate 15 and not to the second substrate 16, the first substrate 15 and the second substrate 16 are prone to misalignment in the arc-shaped area 103 with a large bending, which causes the overall thickness of the arc-shaped area 103 of the flexible dimming module to change.

[0210] In this embodiment, by setting a fixing ring 14 in the area of ​​the corresponding dimming module arc surface area 103 of the second substrate, and embedding the top of the spacer 4 into the fixing ring 14 after the second substrate and the first substrate are aligned, misalignment between the second substrate and the first substrate can be prevented, thereby avoiding changes in the thickness of the dimming module arc surface area 103.

[0211] In some embodiments, the curved area may be an edge curved area formed only at the edge of the dimming module, or it may be an overall curved area formed when the entire dimming module bends.

[0212] In some embodiments, the fixing ring 14 is made of the same material as the spacer 4; the fabrication temperature of the fixing ring 14 is lower than the tolerance temperature of the second substrate 11. In some embodiments, the fixing ring 14 uses the same flexible photoresist material as the spacer 4; the fabrication process of the fixing ring 14 is the same as that of the spacer 4; that is, the fixing ring 14 is fabricated by an exposure process, thereby achieving a low-temperature fabrication process for the fixing ring 14 and avoiding damage to the flexibility of the second substrate 11 caused by excessively high fabrication temperature of the fixing ring 14.

[0213] In some embodiments, the second conductive layer 12 is made of the same material and has the same fabrication process as the first conductive layer 2; the second alignment film 13 is made of the same material and has the same fabrication process as the first alignment film 3. This enables a low-temperature fabrication process for the second alignment film 13, avoiding damage to the flexibility of the second substrate 11 caused by excessively high fabrication temperatures of the second alignment film 13.

[0214] In some embodiments, the dimming structure further includes a sealing adhesive (not shown in the figure), which is located within the frame area, and the second substrate and the first substrate are connected by the sealing adhesive; silicon balls are added to the sealing adhesive, which can support the sealing adhesive; and / or, spacers are provided in the area where the sealing adhesive is located, which can support the sealing adhesive.

[0215] In some embodiments, the height of the spacer is 12 μm; the thickness of the mating gap within the dimming structure is the height of the spacer minus the thickness of the first alignment film.

[0216] In some embodiments, the diameter of the silicon sphere is generally the height of the spacer + 0.1 μm to the height of the spacer + 0.5 μm.

[0217] This disclosure also provides a dimming module, see embodiments thereof. Figure 18 This is a cross-sectional view of another dimming module in an embodiment of this disclosure; Figure 19This is a cross-sectional view of another dimming module in this embodiment of the present disclosure; the dimming module further includes a first barrier layer 25, a second barrier layer 26 and a side coating adhesive, the first barrier layer 25 and the second barrier layer 26 are located between the first substrate and the second substrate, or the first barrier layer 25 and the second barrier layer 26 are respectively located on the side of the first substrate and the second substrate away from the dye liquid crystal; the side coating adhesive 28 is located between the first barrier layer 25 and the second barrier layer 26, and the side coating adhesive 28 is located on the side of the sealing adhesive 27 away from the dimming area.

[0218] In some embodiments, refer to Figure 18 The first barrier layer 25 is located between the first substrate 1 and the first conductive layer 2; the second barrier layer 26 is located between the second substrate 11 and the second conductive layer 12; the orthographic projections of the first conductive layer 2, the second conductive layer 12, the first alignment film 3 and the second alignment film 13 on the first substrate 1 do not overlap with the orthographic projection of the sealant 27 on the first substrate 1; the orthographic projections of the first barrier layer 25 and the second barrier layer 26 on the first substrate 1 overlap with the orthographic projection of the sealant 27 on the first substrate 1, and the first barrier layer 25 and the second barrier layer 26 are respectively in contact with the sealant 27 and the side coating adhesive 28.

[0219] By providing the first barrier layer 25 and the second barrier layer 26, the gas barrier performance of the first substrate side and the second substrate side can be improved. By making the sealant 27 contact with the first barrier layer 25 and the second barrier layer 26, the sealant 27 is prevented from contacting the first alignment film 3 and the second alignment film 13. Compared with the case where the sealant 27 contacts the first alignment film 3 and the second alignment film 13 in related technologies, the sealant 27 can form a larger and more stable and reliable adhesive force with the first barrier layer 25 and the second barrier layer 26, thereby avoiding the risk of gas permeation caused by the sealant 27 debonding from the first alignment film 3 and the second alignment film 13.

[0220] In some embodiments, the materials of the first barrier layer 25 and the second barrier layer 26 include silicon nitride or silicon oxide.

[0221] In some embodiments, the thickness of the first barrier layer 25 is in the range of 1 to 2 μm; the thickness of the second barrier layer 26 is in the range of 1 to 2 μm.

[0222] In some embodiments, the side coating 28 is located in the frame area and on the side of the sealing adhesive 27 opposite to the dimming area. The side coating 28 is located between the first barrier layer 25 and the second barrier layer 26, and is in contact with the first barrier layer 25 and the second barrier layer 26 respectively. The side coating 28 can slow down the speed at which external gas enters the dimming module through the sealing adhesive 27, further improving the moisture barrier performance on the side of the dimming module.

[0223] In some embodiments, the material of the side coating 28 can be a UV-cured acrylic resin, a thermosetting epoxy, or a silicone adhesive. The width of the side coating 28 in the direction away from the sealing adhesive 27 can be 5 to 10 mm.

[0224] In some embodiments, the first substrate 1 and the second substrate 11 can be made of transparent polymer materials such as PET, PEN, PC, PPSU, PES, PMMA, etc., with a thickness of 50-200 μm; the first conductive layer 2 and the second conductive layer 12 can be made of materials such as indium tin oxide, gallium nitride, and silver nanoparticles, with a thickness of 50-100 nm; the first alignment film 3 and the second alignment film 13 can be made of polyimide materials, with a thickness of 500-1000 angstroms; the spacer 4 can be the spacer 4 in the above embodiments, with a height of 8-20 μm; the liquid crystal material can be a gray-black dye liquid crystal material with host-guest effect; the sealant 27 is a mixture of photocurable and thermocurable acrylic resin and epoxy resin, and the width of the sealant 27 along the direction away from the mating gap can be 1-5 mm.

[0225] This disclosure also provides a dimming module, see embodiments thereof. Figure 19 The first barrier layer 25 is located on the side of the first substrate opposite to the second substrate; the second barrier layer 26 is located on the side of the second substrate opposite to the first substrate.

[0226] In some embodiments, the side coating 28 is located in the frame area and on the side of the sealing adhesive 27 away from the dimming area. The side coating 28 is located between the first barrier layer 25 and the second barrier layer 26 and is in contact with the first barrier layer 25 and the second barrier layer 26 respectively.

[0227] In some embodiments, the first barrier layer 25 and the second barrier layer 26 respectively include a base film 29, a barrier film 30 and an optical adhesive film 31, and the base film 29, the barrier film 30 and the optical adhesive film 31 are stacked in sequence.

[0228] In some embodiments, the base film 29 is made of a transparent polymer material; the barrier film 30 is made of silicon nitride or silicon oxide. In some embodiments, the base film 29 may be made of PET material, and the optical adhesive film 31 may be made of a transparent optical adhesive.

[0229] In some embodiments, the thickness of the first barrier layer 25 ranges from 50 to 200 μm; the thickness of the second barrier layer 26 ranges from 50 to 200 μm. The thickness of the base film 29 ranges from 25 to 175 μm; the thickness of the barrier film 30 ranges from 1 to 2 μm; and the thickness of the optical adhesive film 31 ranges from 5 to 25 μm.

[0230] Figure 19The first barrier layer 25 and the second barrier layer 26 are directly attached to the outer sides of the first substrate and the second substrate, respectively. Figure 18 The first barrier layer 25 and the second barrier layer 26 need to be prepared by chemical vapor deposition process. Figure 19 Compared to the dimming module in the middle Figure 18 The dimming module in the image has a relatively simplified fabrication process for the first barrier layer 25 and the second barrier layer 26, and it can still achieve good gas barrier technology effects. Figure 19 The dimming module in this model has more layers and a more complex structure, posing challenges to the durability of the optical adhesive film 31 material in the first barrier layer 25 and the second barrier layer 26, as well as the thermal matching performance between the base film 29 and the first substrate 1 and the second substrate 11. Material selection requires greater attention to the durability of the optical adhesive film 31 against UV light, and it is necessary for the base film 29, the first substrate 1, and the second substrate 11 to have equivalent thermal shrinkage properties.

[0231] In some embodiments, based on the above structure of the dimming module, the method for preparing the dimming module in this embodiment further includes: preparing a second substrate; dropping dye liquid crystal onto the mating surface of the first substrate; coating the four-sided border area of ​​the mating surface of the second substrate with sealant; then vacuum mating the first substrate and the second substrate; and preparing the dimming module by cutting and binding the excess portion of the four-sided border area to the peripheral circuit board.

[0232] In some embodiments, a lamination pressure test is performed on the first substrate and the second substrate. The spacers of three different distribution densities in the first substrate all exhibit a lamination pressure resistance greater than 80 kgf / cm² during the test. 2 .

[0233] In some embodiments, fabricating the first substrate further includes: fabricating a first barrier layer before fabricating the first conductive layer on the first substrate. Fabricating the second substrate includes: fabricating a second barrier layer on the second substrate; fabricating a second conductive layer on the second substrate after completing the above steps; and fabricating a second alignment film on the second substrate after completing the above steps.

[0234] The first and second barrier layers are formed by chemical vapor deposition, exposure, and dry etching.

[0235] In some embodiments, based on the above structure of the dimming module, the method for fabricating the dimming module in this embodiment further includes: fabricating a second substrate; aligning the first substrate and the second substrate; the method further includes: fabricating a first barrier layer on the side of the first substrate opposite to the second substrate; and fabricating a second barrier layer on the side of the second substrate opposite to the first substrate.

[0236] The first barrier layer and the second barrier layer are respectively prepared to form a stacked film layer consisting of a base film, a barrier film and an optical adhesive film stacked in sequence. After the first substrate and the second substrate are aligned, the first barrier layer and the second barrier layer are respectively attached to the first substrate and the second substrate through the optical adhesive film.

[0237] The dimming module provided in this embodiment, on the one hand, by placing the spacer 4 on the first conductive layer 2 and extending it through the first alignment film 3 in a direction away from the first substrate 1, the spacer 4 is in contact and connected with both the first conductive layer 2 and the first alignment film 3. Compared with the connection method in related technologies that can only achieve point contact between the supporting spacer and the alignment film, this greatly increases the contact area between the spacer 4 and the film layer it is on, thereby improving the connection strength between the spacer 4 and the film layer it is on, improving or avoiding the problem of the spacer 4 being prone to falling off, and thus better solving the problem of white spot defects in the dimming module. On the other hand, the surface of the area surrounding the location of the spacer 4 is covered by the first alignment film 3, which can align the liquid crystal molecules in the dimming module, improving the liquid crystal around the spacer 4. The problem of disordered molecular orientation is addressed, thereby improving the light leakage phenomenon around the spacer 4. Furthermore, the first substrate 1 is made of a flexible, transparent material. The first substrate 1 can withstand a lower process temperature during the dimming module fabrication process than traditional rigid substrates (such as glass substrates, which withstand 230°C). For example, the process temperature of a flexible first substrate 1 is generally less than 150°C. Simultaneously, the warpage of the flexible first substrate 1 during the fabrication process needs to be less than 0.5 mm. By ensuring that the fabrication temperature of the spacer 4 is lower than the withstand temperature of the first substrate 1, it can be ensured that the fabrication of the spacer 4 does not change the flexibility performance parameters of the first substrate 1. This makes the flexibility performance of the dimming module with the spacer 4 structure in this embodiment more stable, thus meeting the flexibility performance requirements of the dimming module.

[0238] This disclosure also provides a dimming device, referring to... Figure 20 This is a cross-sectional view of the dimming device in an embodiment of the present disclosure; wherein, the dimming device includes the dimming module 17 in the above embodiment; it also includes a first cover plate 18 and a second cover plate 19, and the dimming module 17 is located between the first cover plate 18 and the second cover plate 19; the first substrate in the dimming module 17 is bonded to the first cover plate 18 by a first adhesive layer 20; the second substrate in the dimming module 17 is bonded to the second cover plate 19 by a second adhesive layer 21; the first cover plate 18 and the second cover plate 19 are framed and bonded by the first adhesive layer 20 and the second adhesive layer 21.

[0239] In some embodiments, the dimming device is formed by aligning the first cover plate 18, the dimming module 17, and the second cover plate 19, heating them to melt the first adhesive layer 20 and the second adhesive layer 21, and then applying pressure to bond them together. The bonding pressure of the dimming device is typically 12 bar ≈ 12 kgf / cm². 2 Therefore, it can be seen that the spacers of the three distribution densities in the dimming module of the above embodiment can all withstand the bonding pressure of the dimming device.

[0240] In some embodiments, the dimming device further includes a first edge-shielding layer 32 and a second edge-shielding layer 33. The first edge-shielding layer 32 is located on the side of the first cover plate 18 opposite to the second cover plate 19, and its orthographic projection on the first cover plate 18 covers the area from the sealing adhesive 27 inside the dimming module 17 to the edge of the first cover plate 18. The second edge-shielding layer 33 is located on the side of the second cover plate 19 opposite to the first cover plate 18, and its orthographic projection on the second cover plate 19 covers the area from the sealing adhesive 27 inside the dimming module 17 to the edge of the second cover plate 19. That is, the orthographic projections of the first edge-shielding layer 32 and the second edge-shielding layer 33 on the first cover plate 18 cover the sealing adhesive 27, the side coating 28, and the edge area of ​​the first cover plate 18 and the second cover plate 19 on the side of the side coating 28 away from the sealing adhesive 27.

[0241] In some embodiments, the first edge-masking layer 32 is formed by printing ink on the periphery of the first cover plate 18, and the second edge-masking layer 33 is formed by printing ink on the periphery of the second cover plate 19.

[0242] The dimming device provided in this embodiment can solve the white spot defect problem of the dimming device and improve the quality of the dimming device by adopting the dimming module in the above embodiment.

[0243] The dimming device in this embodiment can be used as various dimming windows, such as vehicle windows, interior windows, etc.

[0244] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A dimming module, wherein, The present application relates to a light control module, comprising: a first substrate, a second substrate, a plurality of spacers, a sealant and a dye liquid crystal; the first substrate comprises a first base, a first conductive layer and a first orientation film; the first conductive layer and the first orientation film are sequentially stacked on the side of the first base close to the dye liquid crystal; the spacers are located on the side of the first conductive layer close to the dye liquid crystal; the second substrate comprises a second base, a second conductive layer and a second orientation film; the second conductive layer and the second orientation film are sequentially stacked on the side of the second base close to the dye liquid crystal; the second substrate is coupled with the first substrate, the sealant is located between the first substrate and the second substrate, and forms a light control area; the dye liquid crystal is located in the light control area; in the light control area, the interval distance between adjacent spacers is 50-1000 µm; the spacers are located on the first conductive layer and extend away from the first base through the first orientation film; the second surface of at least part of the spacers is in contact with the second orientation film; the light control module comprises an arc area; the second substrate further comprises at least one fixing ring, and the fixing ring is located in the arc area; the fixing ring is located on the side of the second conductive layer close to the dye liquid crystal and extends towards the first substrate through the second orientation film; alternatively, the fixing ring is located on the side of the second orientation film close to the dye liquid crystal and extends towards the first substrate; the top of the spacers located in the arc area is embedded in the fixing ring; the orthographic projection of the spacers on the first substrate overlaps with the orthographic projection of the sealant on the first substrate; the spacers are distributed at least in the part of the sealant distribution area close to the light control area; the spacers are made of photoresist material containing black pigment.

2. The dimming module of claim 1, wherein, The material of the first base is any one of polyethylene terephthalate, polycarbonate, cellulose triacetate and cyclic olefin polymer, and the material of the second base is any one of polyethylene terephthalate, polycarbonate, cellulose triacetate and cyclic olefin polymer.

3. The dimming module of claim 1, wherein, The minimum distance between the spacers and the first edge of the sealant away from the light control area is less than the interval distance between adjacent spacers.

4. The dimming module of claim 1, wherein, The minimum distance between the spacers and the first edge of the sealant away from the light control area is greater than the interval distance between adjacent spacers.

5. The dimming module of claim 1, wherein, The interval distance between adjacent spacers ranges from 50 µm to 500 µm.

6. The dimming module of claim 5, wherein, The radial dimension of the first surface of the spacers on the first conductive layer ranges from 10 µm to 40 µm; The radial dimension of the second surface of the spacers ranges from 5 µm to 30 µm; The height dimension of the spacers ranges from 4 µm to 30 µm.

7. The dimming module of claim 6, wherein, The radial dimension of the first surface of the spacers ranges from 20 µm to 30 µm; the radial dimension of the second surface of the spacers ranges from 10 µm to 20 µm; and the height of the spacers ranges from 8 µm to 15 µm.

8. The dimming module of claim 1, wherein, The spacers comprise main spacers and auxiliary spacers. A radial dimension of the first surface of the main spacer is greater than a radial dimension of the first surface of the auxiliary spacer; A radial dimension of the second surface of the main spacer is greater than a radial dimension of the second surface of the auxiliary spacer; A height dimension of the main spacer is greater than a height dimension of the auxiliary spacer.

9. The dimming module of claim 1, wherein, A spacing distance between adjacent spacers ranges from 0.05 mm to 1 mm, The spacers extend along a first direction and a second direction to form a grid, the first direction and the second direction being parallel to the first substrate and intersecting.

10. The dimming module of claim 9, wherein, A width dimension of the first surface of the spacer on the first conductive layer ranges from 10 µm to 30 µm; A width dimension of the second surface of the spacer ranges from 5 µm to 20 µm; A height dimension of the spacer ranges from 4 µm to 30 µm; The shape of the spacer is a grid shape, and the grid shape includes a square grid shape, a rectangular grid shape, or a regular hexagonal grid shape.

11. The dimming module of claim 1, wherein, A black matrix is further included between the first conductive layer and the spacer, and a direct projection of the spacer on the first substrate is located within a direct projection area of the black matrix on the first substrate.

12. The dimming module of claim 1, wherein, A first barrier layer, a second barrier layer, and a side sealant are further included, The first barrier layer and the second barrier layer are located between the first substrate and the second substrate, or the first barrier layer and the second barrier layer are respectively located on a side of the first substrate and the second substrate away from the dye liquid crystal; The side sealant is located between the first barrier layer and the second barrier layer, and the side sealant is located on a side of the sealant away from the light adjustment area.

13. The dimming module of claim 12, wherein, The first barrier layer is located between the first substrate and the first conductive layer; The second barrier layer is located between the second substrate and the second conductive layer; Direct projections of the first conductive layer, the second conductive layer, the first alignment film, and the second alignment film on the first substrate do not overlap with direct projections of the sealant and the side sealant on the first substrate; Direct projections of the first barrier layer and the second barrier layer on the first substrate overlap with direct projections of the sealant and the side sealant on the first substrate, and the first barrier layer and the second barrier layer are respectively in contact with the sealant and the side sealant.

14. The dimming module of claim 12, wherein, The first barrier layer is located on a side of the first substrate away from the second substrate; The second barrier layer is located on a side of the second substrate away from the first substrate; A direct projection of the side sealant on the first barrier layer does not overlap with the first substrate; A direct projection of the side sealant on the second barrier layer does not overlap with the second substrate; The side sealant is respectively in contact with the first barrier layer and the second barrier layer.

15. The dimming module of claim 13, wherein, Materials of the first barrier layer and the second barrier layer include silicon nitride or silicon oxide.

16. The dimming module of claim 13, wherein, A thickness of the first barrier layer ranges from 1 µm to 2 µm; A thickness of the second barrier layer ranges from 1 µm to 2 µm.

17. The dimming module of claim 14, wherein, The first barrier layer and the second barrier layer respectively include a base film, a barrier film, and an optical adhesive film, which are sequentially stacked.

18. The dimming module of claim 17, wherein, The thickness of the first barrier layer ranges from 50 to 200 µm. The thickness of the second barrier layer ranges from 50 to 200 µm.

19. The dimming module of claim 1, wherein, The elastic recovery rate of the spacer under a pressure of 5 to 30 mN is 80% to 90%.

20. The dimming module of claim 1, wherein, The light-adjusting module has a bearing capacity of greater than 80 kgf / cm to the pressure of the combined sheet 2 .

21. A dimming device, comprising: The light control module of any one of claims 1-20; Further comprising a first cover plate and a second cover plate, the light control module is located between the first cover plate and the second cover plate; The first substrate in the light control module is adhered to the first cover plate through a first adhesive layer; The second substrate in the light control module is adhered to the second cover plate through a second adhesive layer; The first cover plate and the second cover plate are frame-sealed through the first adhesive layer and the second adhesive layer.

22. The dimming device of claim 21, wherein, Further comprising a first edge shielding layer and a second edge shielding layer, The first edge shielding layer is located on the side of the first cover plate away from the second cover plate, and the orthographic projection of the first edge shielding layer on the first cover plate covers the area where the frame sealant in the light control module reaches the edge of the first cover plate; The second edge shielding layer is located on the side of the second cover plate away from the first cover plate, and the orthographic projection of the second edge shielding layer on the second cover plate covers the area where the frame sealant in the light control module reaches the edge of the second cover plate.

23. A method of manufacturing a light modulating module as claimed in any one of claims 1-20, wherein, Comprising: Preparation of the first substrate; Preparation of the second substrate; Opposing the first substrate and the second substrate and frame-sealing through frame sealant, and pouring dye liquid crystal into the light control area surrounded by the frame sealant; The preparation of the first substrate comprises: preparing a first conductive layer on a first substrate; Preparing a plurality of spacers on the first substrate after the above steps are completed; Preparing a first orientation film on the first substrate after the above steps are completed; The preparation of the second substrate comprises: preparing a second conductive layer on a second substrate; Preparing a second orientation film on the second substrate after the above steps are completed.

24. The method of claim 23, wherein the light modulating module is prepared by the steps of: Preparing a plurality of spacers on the first substrate after the first conductive layer is completed using an exposure process, comprising: Coating a photoresist film on the side of the first conductive layer away from the first substrate; Drying the photoresist film at 80-100°C for 100-120 seconds; Exposing the photoresist film to ultraviolet light using a mask plate with a light transmission pattern, causing the photoresist film in the area corresponding to the light transmission pattern to undergo a polymerization reaction; Spraying potassium hydroxide solution on the exposed photoresist film to remove the photoresist film in the area outside the light transmission pattern that has not undergone a polymerization reaction, forming a pattern of spacers; Curing the pattern of spacers at 100-110°C for 50-60 minutes to form the spacers.

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