Laser punching device for PCB machining

Abstract

The invention discloses a laser punching device for PCB processing, which comprises a base, a processing table top is arranged on the base, the processing table top is of a polygonal structure, each edge of the processing table top is provided with a mounting groove, the left side and the right side of each mounting groove are respectively provided with a laser punching mechanism, and a lifting cylinder is arranged at the center of the processing table top. A lifting plate is arranged at the top of a piston rod of the lifting cylinder, a plurality of pressing plates are arranged on the lower surface of the lifting plate, the number of the pressing plates is consistent with that of the mounting grooves, the pressing plates correspond to the mounting grooves one to one, pressing grooves are formed in the bottoms of the pressing plates, and the number of the pressing grooves is consistent with that of the mounting grooves, and the pressing grooves correspond to the mounting grooves one to one. The PCB can be longitudinally fixed through the mounting groove and the pressing groove, meanwhile, the laser punching mechanisms are arranged on the left side and the right side of the PCB, therefore, laser punching can be conducted on the front face and the back face of the PCB at the same time, meanwhile, punching operation can be conducted on the multiple PCBs, and the punching efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of PCB board processing, and in particular to a laser punching device for PCB board processing. Background Art

[0002] PCB board, or printed circuit board, is mainly used for laying out and loading integrated circuit parts. It is a carrier for connecting electronic components to each other. After the PCB board is processed, it is usually punched with laser punching equipment to facilitate the installation and fixation of the PCB board.

[0003] During the processing of PCB boards, they need to be punched. However, currently only one side of the PCB board is punched, resulting in low punching efficiency, so improvements are needed. Summary of the invention

[0004] The purpose of the present invention is to provide a laser punching device for PCB board processing in view of the defects and shortcomings of the prior art.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a laser punching device for PCB board processing, including a base, and its innovation lies in: a processing table is arranged on the base, the processing table is a polygonal structure, and each side is provided with an installation groove, and laser punching mechanisms are respectively arranged on the left and right sides of each installation groove, a lifting cylinder is arranged at the center of the processing table, a lifting plate is arranged on the top of the piston rod of the lifting cylinder, and a plurality of clamping plates are respectively arranged on the lower surface of the lifting plate, the number of the clamping plates is consistent with that of the installation grooves, and they correspond one to one, and a clamping groove is arranged at the bottom of the clamping plate, the number of the clamping grooves is consistent with that of the installation grooves, and they correspond one to one.

[0006] Furthermore, U-shaped rubber pads are provided in the installation groove and the pressing groove.

[0007] Furthermore, the laser punching mechanism includes a mounting plate, a transverse linear screw is arranged on the front side of the mounting plate, a longitudinal linear screw is arranged on the slider of the transverse linear screw, and a laser puncher is arranged on the slider of the longitudinal linear screw.

[0008] Furthermore, a plurality of spring columns are arranged in a circular array on the processing table, and each spring column is distributed corresponding to the installation groove.

[0009] Furthermore, a scale is set at the installation groove, and the scale starts from the center of the installation groove and extends to the left and right sides.

[0010] Furthermore, a positioning protrusion is arranged at the center of the installation groove, and a positioning groove is opened at the center of the bottom edge of the PCB board, and the positioning groove cooperates with the positioning protrusion for positioning.

[0011] Furthermore, it also includes a PLC control system, which is electrically connected to the laser punching mechanism and the lifting cylinder respectively to set and control the laser punching mechanism and the lifting cylinder.

[0012] After adopting the above structure, the beneficial effects of the present invention are:

[0013] The present invention can longitudinally fix the PCB board by installing the groove and the pressing groove, and at the same time, laser punching mechanisms are arranged on the left and right sides of the PCB board, so as to realize laser punching of the front and back sides of the PCB board at the same time, and can also perform punching operations on multiple PCB boards, so as to improve the punching efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a front view of the present invention;

[0015] Figure 2 A top view of the present invention;

[0016] Figure 3 It is a schematic structural diagram of the laser punching mechanism in the present invention.

[0017] Description of reference numerals:

[0018] 1 base, 2 processing table, 3 mounting groove, 4 laser punching mechanism, 41 mounting plate, 42 transverse linear screw, 43 longitudinal linear screw, 44 laser puncher, 5 lifting cylinder, 6 lifting plate, 7 clamping plate, 8 clamping groove, 9 rubber pad, 10 spring column. DETAILED DESCRIPTION

[0019] The present invention will be further described below in conjunction with the accompanying drawings.

[0020] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described herein are only used to explain the present invention and are not used to limit the present invention.

[0021] See also Figure 1-2A laser punching device for PCB board processing includes a base 1, a processing table 2 is arranged on the base 1, the processing table 2 is a polygonal structure, and each side is provided with a mounting groove 3, and a laser punching mechanism 4 is respectively arranged on the left and right sides of each mounting groove, a lifting cylinder 5 is arranged at the center of the processing table 2, a lifting plate 6 is arranged on the top of the piston rod of the lifting cylinder 5, and a plurality of clamping plates 7 are respectively arranged on the lower surface of the lifting plate 6, and the number of the clamping plates 7 is consistent with that of the mounting groove 3, and they correspond one to one, and a clamping groove 8 is arranged at the bottom of the clamping plate 7, and the number of the clamping groove 8 is consistent with that of the mounting groove 3, and they correspond one to one. Specifically, the PCB board is horizontally embedded or vertically inserted into the mounting groove 3, and then the lifting cylinder 5 is started to move the lifting plate 6 downward, so that the clamping groove 8 and the mounting groove 3 position and fix the PCB board, and then the laser punching mechanism 4 is started to perform laser punching on both the front and back sides of the PCB board at the same time, and punching operation can also be performed on multiple PCB boards at the same time, thereby improving the punching efficiency.

[0022] In this embodiment, a U-shaped rubber pad 9 is provided in both the mounting groove 3 and the pressing groove 8. The rubber pad 9 is used to protect the PCB board to avoid damage to the PCB board, and can also be applied to PCB boards of different thicknesses.

[0023] See also Figure 3 The laser punching mechanism 4 includes a mounting plate 41, a transverse linear screw 42 is arranged on the front of the mounting plate 41, a longitudinal linear screw 43 is arranged on the slider of the transverse linear screw 42, and a laser punch 44 is arranged on the slider of the longitudinal linear screw 43. The laser punch 44 moves along the X-axis and the Y-axis under the action of the transverse linear screw 42 and the longitudinal linear screw 43, thereby realizing accurate punching of the PCB board and improving the punching accuracy.

[0024] In this embodiment, a plurality of spring columns 10 are arranged in a circular array on the processing table 2, and each spring column 10 is distributed corresponding to the mounting groove 3. The spring column 10 buffers the pressing plate 7 when it is pressed down, so as to prevent the pressing plate 7 from damaging the PCB board.

[0025] In this embodiment, a scale is set at the installation groove 3, and the scale starts from the center of the installation groove and extends to the left and right sides, which is convenient for positioning the installation of the PCB board, thereby cooperating with the laser punching mechanism 4 to perform punching operations.

[0026] In this embodiment, a positioning protrusion is set at the center of the installation groove 3, and a positioning groove is opened at the center of the bottom edge of the PCB board. The positioning groove and the positioning protrusion cooperate for positioning, which facilitates rapid positioning and installation, thereby cooperating with the laser punching mechanism 4 to perform punching operations.

[0027] In this embodiment, a PLC control system is also included. The PLC control system is electrically connected to the laser punching mechanism 4 and the lifting cylinder 5, respectively, to set and control the laser punching mechanism and the lifting cylinder. The PLC control system performs programming control on the laser punching mechanism 4, so that laser punching is performed according to the requirements of installing the PCB board; the PLC control system controls the lifting cylinder 5 to achieve the pressing, fixing and loosening of the PCB board.

[0028] Working principle of the present invention:

[0029] First, embed the PCB board horizontally or vertically into the installation groove 3, then start the lifting cylinder 5, move the lifting plate 6 downward, so that the clamping groove 8 and the installation groove 3 can position and fix the PCB board, and then start the laser punching mechanism 4. The laser puncher 44 moves along the X-axis and the Y-axis under the action of the horizontal linear screw 42 and the vertical linear screw 43, so as to realize accurate punching of the PCB board. After the punching is completed, the lifting cylinder 5 rises, and the lifting plate 6 also rises accordingly, and the clamping groove 8 is separated from the PCB board, so that the PCB board is taken out.

[0030] The above description is only used to illustrate the technical solution of the present invention rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the present invention by ordinary technicians in this field should be included in the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. A laser punching device for PCB board processing, comprising a base, characterized in that: A processing table is arranged on the base, and the processing table is a polygonal structure, and a mounting groove is arranged on each side, and laser punching mechanisms are arranged on the left and right sides of each mounting groove respectively. A lifting cylinder is arranged at the center of the processing table, and a lifting plate is arranged on the top of the piston rod of the lifting cylinder, and a plurality of clamping plates are arranged on the lower surface of the lifting plate respectively, and the number of the clamping plates is consistent with that of the mounting grooves, and they correspond one to one. A clamping groove is arranged at the bottom of the clamping plate, and the number of the clamping grooves is consistent with that of the mounting grooves, and they correspond one to one.

2. A laser punching device for PCB board processing according to claim 1, characterized in that: A U-shaped rubber pad is arranged in the installation groove and the pressing groove.

3. The laser punching device for PCB board processing according to claim 1, characterized in that: The laser punching mechanism comprises a mounting plate, a transverse linear lead screw is arranged on the front of the mounting plate, a longitudinal linear lead screw is arranged on the slider of the transverse linear lead screw, and a laser puncher is arranged on the slider of the longitudinal linear lead screw.

4. The laser punching device for PCB board processing according to claim 1, characterized in that: A plurality of spring columns are arranged in a circular array on the processing table, and each spring column is distributed corresponding to the installation groove.

5. The laser punching device for PCB board processing according to claim 1, characterized in that: A scale is arranged at the installation groove, and the scale takes the center of the installation groove as a starting point and extends to the left and right sides.

6. The laser punching device for PCB board processing according to claim 1, characterized in that: A positioning convex point is arranged at the center of the installation groove, and a positioning groove is opened at the center of the bottom edge of the PCB board at the same time, and the positioning groove cooperates with the positioning convex point for positioning. The laser punching device for PCB board processing according to claim 1 is characterized in that: It also includes a PLC control system, which is electrically connected to the laser punching mechanism and the lifting cylinder respectively to set and control the laser punching mechanism and the lifting cylinder.

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