Uniform-stress lossless fixing device for electro-optical crystal wafer slide and preparation method of uniform-stress lossless fixing device

Abstract

The invention discloses an electro-optical crystal wafer slide lossless fixing device with uniform stress and a preparation method thereof.The device comprises a horizontal plate and a vertical plate which are of an L-shaped structure, a first through hole is formed in the middle of the horizontal plate, a sinking groove is formed in the edge of the first through hole, and four adsorption blind holes are evenly formed in the surface of the sinking groove; the adsorption blind hole communicates with a pneumatic pipe connector through an air path, and the pneumatic pipe connector is formed in the side wall of the horizontal plate and connected with a negative pressure pump through a pneumatic pipe. The vertical plate is provided with four second through holes arranged in a rhombic array, and the four second through holes are used for connecting standard optical mechanical parts. Through the reasonable and reliable structural design, the electro-optical crystal wafer slide and the standard optical displacement platform can be combined, the electro-optical crystal wafer slide and the standard optical displacement platform are a good connecting part between the electro-optical crystal wafer slide and the standard optical displacement platform, and the electro-optical crystal wafer slide and the standard optical displacement platform have the advantages of being small in damage to the slide, large in light passing area ratio and good in adaptability and universality.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer glass fixing, and in particular relates to a non-destructive fixing device for an electro-optical crystal wafer glass with uniform stress and a preparation method thereof. Background Art

[0002] In the high-speed, large-capacity information network system, optical fiber communication technology has become the main technology of Internet communication and the foundation of the information society with its unique and incomparable advantages in bandwidth and transmission distance. High-speed photodetectors are a kind of components that quickly convert optical signals (or optical energy) into electrical signals (or electrical energy). They are the core components of optical fiber communication systems. Their bandwidth determines the maximum transmission rate of the system. At the same time, they are also indispensable devices in other high-bandwidth application fields, which often require photoelectric conversion links, such as high-speed oscilloscopes, spectrum analyzers, network analyzers, etc. With the development of these high-speed systems, photodetectors are required to have higher time resolution / high bandwidth.

[0003] Like the research on other optoelectronic devices, the research on high-speed photodetectors must first complete the precise testing of their relevant parameters. With the development of high-speed fiber-optic communication technology, 50GHz, 70GHz and 100GHz high-speed photodetectors have been widely used in people's daily life and industrial production. Their bandwidth (i.e. the corresponding frequency range) has become increasingly difficult to measure accurately. New optical measurement methods, such as electro-optical sampling, have a bandwidth testing capability 2-3 orders of magnitude higher than traditional electrical sampling methods. With the development of science and technology, ultrashort pulse lasers have reached the femtosecond or even attosecond level. This type of optical pulse is very suitable for bandwidth testing of high-speed photodetectors by combining electro-optical sampling and synchronous / asynchronous sampling technology.

[0004] During the electro-optical sampling process, the electro-optical crystal wafer glass slide needs to be fixed. Existing glass slide fixing devices often open a small hole on a metal plane to ensure light transmission, and then use a metal arm to clamp or press it to fix it, such as the way a slide is fixed in a microscope.

[0005] The existing slide fixing device mainly has the following shortcomings:

[0006] (1) Stress damage: The traditional fixing method cannot ensure that the metal arm and the glass slide are "surface-fitted" when the metal arm is clamped or pressed. Once "point-fitting" occurs, this method will cause physical damage to the electro-optical crystal wafer glass slide. In addition, under the action of uneven stress, a serious stress light refraction effect occurs, causing distortion of the optical signal.

[0007] (2) Low light-transmitting area ratio leads to high cost: For example, in the common fixation of glass slides, most of the area is used for bearing, and only a small area is used for light transmission. For expensive electro-optic crystal wafer glass slides, the bearing area should be fully utilized as much as possible to achieve material and cost control.

[0008] (3) Poor adaptability and versatility: Traditional glass slide fixtures are usually custom-made products that cannot be directly combined with standard optomechanical components. They may even require multiple components for connection, which increases the complexity of the system and wastes the internal space of the test system.

[0009] Aiming at the electro-optic sampling process in the new high-speed photoelectric detector bandwidth test technology, the present invention proposes a non-destructive fixing device for an electro-optic crystal wafer glass slide with uniform stress and a preparation method thereof. Through a reasonable and reliable structural design, the electro-optic crystal wafer glass slide can be combined with a standard optical displacement platform, which is a good connecting component between the two and has the characteristics of little damage to the glass slide, a large light-through area ratio, and good adaptability and versatility. Summary of the invention

[0010] In view of the above problems existing in the prior art, the present invention proposes a non-destructive fixing device for an electro-optical crystal wafer glass sheet with uniform stress and a preparation method thereof, which has a reasonable design, solves the shortcomings of the prior art and has good effects.

[0011] In order to achieve the above-mentioned invention objective 1, the present invention adopts the following technical solution:

[0012] A non-destructive fixing device for an electro-optical crystal wafer glass slide with uniform stress comprises a horizontal plate and a vertical plate in an L-shaped structure, wherein a first through hole is arranged in the middle of the horizontal plate, a sinking groove is arranged at the edge of the first through hole, four adsorption blind holes are evenly arranged on the surface of the sinking groove, and the adsorption blind holes are connected to a pneumatic tube interface through an air path.

[0013] Furthermore, the vertical plate is provided with four second through holes arranged in a diamond array for connecting standard optomechanical components.

[0014] Furthermore, the diameter of the second through hole is 6.5 mm.

[0015] Furthermore, the depth of the adsorption blind hole is greater than half the thickness of the horizontal plate, the diameter of the first through hole is smaller than the diameter of the wafer glass slide, the difference between the sinking depth of the sinking groove and the thickness of the wafer glass slide is less than 1 mm, and the diameter of the sinking groove is greater than the diameter of the wafer glass slide.

[0016] Furthermore, the pneumatic tube interface is opened on the side wall of the horizontal plate, and the pneumatic tube interface is connected to the negative pressure pump through the pneumatic tube.

[0017] In order to achieve the above-mentioned invention objective 2, the present invention adopts the following technical solution:

[0018] A preparation method for preparing a non-destructive fixing device for an electro-optical crystal wafer glass sheet with uniform stress as described above comprises the following steps:

[0019] Step 1: First, use aviation aluminum or steel substrate to form an L-shaped structure through CNC machining, process the first through hole on the horizontal plate, then use a milling cutter to process the sinking groove, and then process four adsorption blind holes evenly distributed radially from the top to the bottom on the surface of the sinking groove;

[0020] Step 2: The horizontal plate includes four side walls, the first side wall is connected to the vertical plate, the second side wall is opposite to the first side wall, and the remaining two side walls are the third and fourth side walls; firstly, two first blind holes are respectively opened on the third and fourth side walls, the four first blind holes are respectively connected with the four adsorption blind holes, and then a horizontal third through hole is opened from the third side wall to the fourth side wall;

[0021] Step 3: two horizontal second blind holes are opened on the second side wall, the second blind holes are perpendicular to the first blind hole and the third through hole and are interconnected;

[0022] Step 4: Prepare plugging cylinders that match the first and second blind holes and the third through hole, and set them at the ends of the three first blind holes, the two second blind holes close to the outside, and the two ends of the third through hole. Re-mill the edge of the horizontal plate. The heat fusion during the processing makes the plugging cylinder fully fit the inner wall of the hole to form a seal.

[0023] Step 5: Process the pneumatic tube interface at the first blind hole where no blocking cylinder is provided, and the preparation is completed.

[0024] Beneficial technical effects brought by the present invention:

[0025] (1) No damage to the wafer glass, and uniform stress distribution. Through reliable gas "surface adsorption" method, the wafer glass is tightly fixed on the fixing device, there is no mechanical damage to the glass surface caused by external clamping / pressing, and there is no drastic change in stress distribution inside the glass.

[0026] (2) High light-to-area ratio and effective cost control. Through the narrow edge sinking design, the wafer glass can be used for electro-optical sampling over a large area, and the utilization rate of the wafer glass is effectively improved.

[0027] (3) Good adaptability and versatility. Through reasonable hole design, it can be directly combined with standard optomechanical components without the need for too many adapters. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a front view of the non-destructive fixing device for the electro-optical crystal wafer glass slide in the present invention;

[0029] Figure 2It is a side view of the non-destructive fixing device for the electro-optical crystal wafer glass slide in the present invention;

[0030] Figure 3 A top view of the non-destructive fixing device for the electro-optical crystal wafer glass slide of the present invention;

[0031] Figure 4 for Figure 1 Bottom view of the cross section of middle AA;

[0032] Figure 5 It is a flow chart of the internal gas path processing of the fixing device of the present invention;

[0033] Among them, 1-horizontal plate; 2-vertical plate; 3-first through hole; 4-sinking groove; 5-adsorption blind hole; 6-pneumatic tube interface; 7-second through hole; 8-first blind hole; 9-third through hole; 10-second blind hole; 11-blocking cylinder; DETAILED DESCRIPTION

[0034] The specific implementation of the present invention is further described below in conjunction with specific embodiments:

[0035] A non-destructive fixing device for electro-optical crystal wafer glass with uniform stress, the device is an L-shaped structure, including a horizontal plate 1 and a vertical plate 2, a first through hole 3 is provided in the middle of the horizontal plate, a sinking groove 4 is provided at the edge of the first through hole, four adsorption blind holes 5 are evenly opened on the surface of the sinking groove 4, a pneumatic tube interface 6 is opened on the side wall of the horizontal plate, the adsorption blind hole 5 is connected to the pneumatic tube interface 6 through an air path, and the pneumatic tube interface 6 is connected to a negative pressure pump through a pneumatic tube. Four second through holes 7 arranged in a rhombus array are provided on the vertical plate 2 for connecting standard optomechanical components.

[0036] The depth of the adsorption blind hole 5 is greater than half the thickness of the horizontal plate 1, the diameter of the first through hole 3 is slightly smaller than the diameter of the wafer glass, the difference between the sinking depth of the sinking groove 4 and the thickness of the wafer glass is less than 1mm, and the diameter of the sinking groove is slightly larger than the diameter of the wafer glass.

[0037] like Figure 1 As shown, the processed vertical surface thickness should match the actual requirements, and the horizontal surface thickness should be greater than the maximum diameter of the pneumatic tube interface thread used. In this embodiment, a pneumatic tube interface with a PT1 / 8 thread specification is used.

[0038] like Figure 2 As shown, the overall height of the processed vertical surface should match the actual requirements. In this embodiment, in order to connect with the standard optical-mechanical components, the diameter of the four second through holes 7 to be processed is φ6.5 mm, and the hole layout is a diamond arrangement, with the upper left corner of the structure as the zero point, the unit is mm, the first hole XY position is (36.5, 12.5), the second hole position is (24, 25), the third hole position is (49, 25), and the fourth hole position is (36.5, 37.5);

[0039] like Figure 3 As shown, in this embodiment, a large-sized first through hole 3 slightly smaller than the diameter of the wafer glass of 4 mm is processed in the middle of the horizontal plate according to the actual position requirements. A narrow edge sinking groove 4 larger than the diameter of the wafer glass of 0.5 mm is processed with a milling cutter under the same center of the circle, and the milling depth is close to the wafer glass used. Four adsorption blind holes 5 evenly distributed radially from the top to the bottom are processed on the surface of the sinking groove as the air pressure adsorption holes of the device and the wafer glass. It should be noted that it cannot be completely penetrated, and the processing depth should exceed half of the thickness of the horizontal plate.

[0040] like Figure 4 As shown, the adsorption blind hole is connected to the pneumatic tube interface with a PT1 / 8 thread specification through the internal air path, and the interface is connected to the negative pressure pump with a pneumatic tube, so as to achieve uniform stress and lossless fixation of the electro-optical crystal wafer glass.

[0041] A preparation method for preparing a non-destructive fixing device for an electro-optical crystal wafer glass sheet with uniform stress as described above, wherein the processing method of the internal gas path is to adopt the method of "opening the hole first and then plugging the hole", which greatly reduces the difficulty of the processing technology, and comprises the following steps:

[0042] Step 1: First, use aviation aluminum or steel substrate to form an L-shaped structure through CNC machining, process the first through hole 3 on the horizontal plate, then use a milling cutter to process the sinking groove 4, and then process four adsorption blind holes 5 evenly distributed radially from the top to the bottom on the surface of the sinking groove 4;

[0043] Step 2: The horizontal plate 1 includes four side walls, the first side wall connected to the vertical plate, the second side wall opposite to the first side wall, and the remaining two side walls are the third and fourth side walls; Figure 5 As shown, two first blind holes 8 are respectively opened on the third and fourth side walls from outside to inside, and the four first blind holes 8 are respectively connected with the four adsorption blind holes 5, and then a horizontal third through hole 9 is opened from the third side wall to the fourth side wall;

[0044] Step 3: Two horizontal second blind holes 10 are opened on the second side wall from outside to inside, the two second blind holes 10 are perpendicular to the third through hole 9 and interpenetrate each other, and the two second blind holes are respectively perpendicular to the two first blind holes 8 opened on the third and fourth side walls and interpenetrate each other;

[0045] Step 4: Prepare a plugging cylinder 11 that matches the first and second blind holes and the third through hole, and set it at one end close to the outside of the three first blind holes 8, the two second blind holes 10, and both ends of the third through hole 9. Re-mill the edge of the horizontal plate. The heat fusion during the processing makes the plugging cylinder 11 fully fit the inner wall of the hole to form a seal;

[0046] Step 5: Process the pneumatic tube interface 6 at the first blind hole where no blocking cylinder is provided, and the preparation is completed.

[0047] After the structural processing is completed, place the electro-optical crystal wafer glass slide and fix it on the displacement adjustment frame, connect the pneumatic tube, turn on the negative pressure pump, and start the coupling test of the probe position.

[0048] Compared with traditional fixing devices, the fixing device proposed in the present invention has the characteristics of less damage to the glass slide, large light transmission area ratio, good adaptability and versatility.

[0049] (1) The problem of stress damage to the glass slide by the traditional fixing device is solved. The new high-speed photodetector bandwidth test method combines electro-optical sampling with synchronous sampling or asynchronous sampling of pulsed laser. In order to ensure the stability of the sampling signal in the experiment, the electro-optic crystal wafer glass slide needs to be fixed. The traditional fixing method is to clamp or press with a metal arm. This method has the photoelastic effect (stress light refraction effect) caused by excessive clamping or pressing, which in turn affects the modulation of the optical signal by the electro-optical crystal, and even easily causes the millimeter / submillimeter electro-optic crystal wafer glass slide to break. The present invention combines the glass slide with its fixing device by using an air pressure adsorption method, that is, the glass slide is fitted with a negative pressure air hole. This method can ensure the stability of the fixed position and prevent the glass slide from being affected by excessive stress during the fixing process. The suction force is evenly applied to the glass slide, effectively reducing the damage to the glass slide itself.

[0050] (2) It solves the problem of small "glass slide light transmission area ratio" in traditional fixtures. For transmissive wafer slides, the area of ​​the light path transmission region needs to be as close to the total area of ​​the wafer slide as possible, thereby achieving the usage and cost control of the expensive electro-optical crystal substrate. Traditional fixtures only open very small holes in the light transmission area to complete the transmission of light, and most of the area of ​​the glass slide is used for bearing rather than optical applications. The present invention adopts a narrow edge sinking method to carry the glass slide on the horizontal plane of the fixture. This method optimizes the area occupancy of the edge bearing area on the basis of ensuring the fixed position of the glass slide, thereby improving the light transmission area ratio.

[0051] (3) The compatibility and versatility issues between traditional fixtures and other optomechanical components are resolved. The electro-optic crystal wafer glass slide fixture should be able to connect with standard optomechanical components to improve portability and practicality. Traditional fixtures cannot be directly connected with standard optomechanical components and usually require multiple adapters for connection and fixation. In the present invention, standard optomechanical holes are added, and a φ6.5mm inner diameter hole is opened at an appropriate position on the vertical surface of the fixture. The entire device is connected to the displacement adjustment frame with M6 screws to achieve directional displacement of the glass slide, effectively improving the adaptability and versatility.

[0052] Of course, the above description is not a limitation of the present invention, and the present invention is not limited to the above examples. Changes, modifications, additions or substitutions made by technicians in this technical field within the essential scope of the present invention should also fall within the protection scope of the present invention.

Claims

1. A non-destructive fixing device for an electro-optical crystal wafer glass sheet with uniform stress, characterized in that: It includes a horizontal plate and a vertical plate in an L-shaped structure. A first through hole is arranged in the middle of the horizontal plate. A sinking groove is arranged at the edge of the first through hole. Four adsorption blind holes are evenly opened on the surface of the sinking groove. The adsorption blind holes are connected to the pneumatic tube interface through an air path.

2. The non-destructive fixing device for an electro-optical crystal wafer with uniform stress according to claim 1, characterized in that: The vertical plate is provided with four second through holes arranged in a diamond array for connecting standard optical mechanical components.

3. The non-destructive fixing device for an electro-optical crystal wafer glass sheet with uniform stress according to claim 2, characterized in that: The diameter of the second through hole is 6.5 mm.

4. The non-destructive fixing device for electro-optical crystal wafer glass with uniform stress according to claim 1, characterized in that: The depth of the adsorption blind hole is greater than half the thickness of the horizontal plate, the diameter of the first through hole is smaller than the diameter of the wafer glass slide, the difference between the sinking depth of the sinking groove and the thickness of the wafer glass slide is less than 1 mm, and the diameter of the sinking groove is greater than the diameter of the wafer glass slide.

5. The non-destructive fixing device for electro-optical crystal wafer glass with uniform stress according to claim 1, characterized in that: The pneumatic tube interface is arranged on the side wall of the horizontal plate, and the pneumatic tube interface is connected to the negative pressure pump through the pneumatic tube.

6. A preparation method for preparing a non-destructive fixing device for an electro-optical crystal wafer glass with uniform stress as claimed in any one of claims 1 to 5, characterized in that: The following steps are involved: Step 1: First, use aviation aluminum or steel substrate to form an L-shaped structure through CNC machining, process the first through hole on the horizontal plate, then use a milling cutter to process the sinking groove, and then process four adsorption blind holes evenly distributed radially from the top to the bottom on the surface of the sinking groove; Step 2: The horizontal plate includes four side walls, the first side wall is connected to the vertical plate, the second side wall is opposite to the first side wall, and the remaining two side walls are the third and fourth side walls; firstly, two first blind holes are respectively opened on the third and fourth side walls, the four first blind holes are respectively connected with the four adsorption blind holes, and then a horizontal third through hole is opened from the third side wall to the fourth side wall; Step 3: two horizontal second blind holes are opened on the second side wall, the second blind holes are perpendicular to the first blind hole and the third through hole and are interconnected; Step 4: Prepare plugging cylinders that match the first and second blind holes and the third through hole, and set them at the ends of the three first blind holes, the two second blind holes close to the outside, and the two ends of the third through hole. Re-mill the edge of the horizontal plate. The heat fusion during the processing makes the plugging cylinder fully fit the inner wall of the hole to form a seal. Step 5: Process the pneumatic tube interface at the first blind hole where no blocking cylinder is provided, and the preparation is completed.

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