Display panel, flexible circuit board and display device

Abstract

The present application relates to the technical field of display, and discloses a display panel, a flexible circuit board and a display device, which comprise a first binding area, the first binding area comprises at least one row of first binding pads arranged along a first direction, the width of the first binding pad in the first direction is greater than the length of the first binding pad in a second direction, the first binding area comprises a first center reference line, the first center reference line extends along the second direction, each row of the first binding pads is symmetrical about the first center reference line, and the width of the first binding pads on the same side of the first center reference line gradually increases in the first direction. The width of the first binding pad in the first direction increases as the distance between the first binding pad and the first center reference line increases, the size of the first binding pad in the first direction is increased, the display panel and the flexible circuit board are easily aligned and bound, and the binding yield is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a flexible printed circuit and a display device. BACKGROUND

[0002] In a display device, in order to better realize narrow frame, a flexible printed circuit (FPC) is usually arranged to realize electrical connection of a main driving chip and a circuit trace in a display panel. Bonding pads are arranged on the display panel and the flexible printed circuit respectively, and corresponding binding connection of the bonding pads between the display panel and the flexible printed circuit is realized through anisotropic conductive adhesive. However, with the increase of functions of a display screen, the number of bonding pads in the display screen is also increasing, and the gap between the bonding pads is getting smaller under the condition that the total binding area width of the display screen is unchanged. In the binding process, if there is a deviation in alignment between the display panel and the flexible printed circuit, the bonding pads are prone to misalignment, thereby affecting the binding yield. SUMMARY

[0003] Therefore, it is necessary to provide a display panel, a flexible printed circuit and a display device in view of the problem that a deviation in alignment between a display panel and a flexible printed circuit easily affects the binding yield.

[0004] A display panel comprises a first binding area, the first binding area comprises at least one row of a plurality of first binding pads arranged along a first direction, a width of the first binding pad in the first direction is greater than a length of the first binding pad in a second direction, the first direction and the second direction are perpendicular to each other; the first binding area comprises a first center reference line, the first center reference line extends along the second direction, each row of the first binding pads is symmetrical about the first center reference line, and a width of a plurality of the first binding pads located on the same side of the first center reference line in each row of the first binding pads gradually increases in the first direction.

[0005] In one of the embodiments, according to the device deviation information and the width calculation method, a width of an nth first binding pad located on the same side of the first center reference line in each row of the first binding pads in the first direction is determined.

[0006] In one of the embodiments, the device deviation information comprises a width of a second binding pad in the flexible printed circuit in the first direction, a width tolerance of the second binding pad in the flexible printed circuit in the first direction, a width tolerance of the first binding pad in the display panel in the first direction, an expansion tolerance of the first binding pad in the display panel, and a machine fluctuation amount.

[0007] In one embodiment, the width calculation method comprises:

[0008] L nP = 2(1 / 2(x n + p n + l P + l F + X J ) + L nF ;

[0009] In the formula, L nP represents the width of the nth first binding pad on the left or right side of the first center reference line in the first direction, x n represents the width tolerance of the nth first binding pad on the left side of the first center reference line and the nth first binding pad on the right side of the first center reference line in the first direction, p n represents the expansion tolerance of the nth first binding pad on the left side of the first center reference line and the nth first binding pad on the right side of the first center reference line in the first direction, l P represents the width tolerance of the first binding pad in the display panel in the first direction, l F represents the width tolerance of the second binding pad in the flexible circuit board in the first direction, X J represents the machine fluctuation, L nF represents the width of the second binding pad in the flexible circuit board corresponding to the nth first binding pad on one side of the first center reference line in the display panel in the first direction.

[0010] In one embodiment, the display panel comprises a first integrated unit, and the display panel comprises a plurality of first trace layers, and a plurality of first binding pads on each row are connected to the first integrated unit through traces on one of the first trace layers.

[0011] In one embodiment, the distance between two adjacent first binding pads in the first direction is a first gap, and any two first gaps are equal.

[0012] In one embodiment, the lengths of a plurality of first binding pads in the same row in the second direction are all the same.

[0013] A flexible circuit board includes a second bonding area, the second bonding area includes at least one row of a plurality of second bonding pads arranged along a first direction, a width of the second bonding pads in the first direction is greater than a length of the second bonding pads in a second direction, the first direction and the second direction are perpendicular to each other; the second bonding area includes a second center reference line, the second center reference line extends along the second direction, each row of the arranged second bonding pads is symmetrical about the second center reference line, and a distance between adjacent two second bonding pads on a same side of the second center reference line in each row of the second bonding pads gradually increases in the first direction.

[0014] In one of the embodiments, the width of the plurality of the second bonding pads in the same row in the first direction is the same.

[0015] In one of the embodiments, the length of the plurality of the second bonding pads in the same row in the second direction is the same.

[0016] In one of the embodiments, the flexible circuit board includes a second integrated unit, and the flexible circuit board includes a plurality of second trace layers, and the plurality of the second bonding pads on each row are connected to the second integrated unit through a trace on one of the second trace layers.

[0017] A display device includes the display panel according to any one of the embodiments and the flexible circuit board according to any one of the embodiments, a first bonding pad in the display panel and a second bonding pad of the flexible circuit board are electrically connected one by one, and a width of the first bonding pad in the first direction is greater than a width of the second bonding pad in the first direction.

[0018] In one of the embodiments, a first center reference line in the display panel and a second center reference line in the flexible circuit board coincide.

[0019] In one of the embodiments, the first bonding pad includes opposite first and second edges in the first direction, the second bonding pad includes opposite third and fourth edges in the first direction, a distance between the first edge and the third edge is equal to a distance between the second edge and the fourth edge, and the distance between the first edge and the third edge or the distance between the second edge and the fourth edge is a second gap.

[0020] In one of the embodiments, one of the first bonding pads and one of the second bonding pads are electrically connected to form a bonding pad group, and the second gap of a plurality of the bonding pad groups on a same side of the first center reference line in each row of the bonding pad groups gradually increases.

[0021] In one of the embodiments, according to the device deviation information and the gap calculation method, the second gap of each of the plurality of the bonding pad groups on the same side of the first center reference line in the bonding pad group is determined.

[0022] In one of the embodiments, the device deviation information includes a width of the second bonding pad in the flexible circuit board in the first direction, a width tolerance of the second bonding pad in the flexible circuit board in the first direction, a width tolerance of the first bonding pad in the display panel in the first direction, an expansion tolerance of the first bonding pad in the display panel, and a machine fluctuation amount.

[0023] In one of the embodiments, the gap calculation method includes:

[0024] a n = (1 / 2 (x n + p n + l P + l F ) + X J );

[0025] In the formula, a n represents the second gap of the nth bonding pad group on the same side of the first center reference line, x n represents a width tolerance of the nth first bonding pad on the left side of the first center reference line and the nth first bonding pad on the right side of the first center reference line in the first direction, p n represents an expansion tolerance of the nth first bonding pad on the left side of the first center reference line and the nth first bonding pad on the right side of the first center reference line in the first direction, l P represents a width tolerance of the first bonding pad in the display panel in the first direction, l F represents a width tolerance of the second bonding pad in the flexible circuit board in the first direction, and X J represents the machine fluctuation amount.

[0026] In one of the embodiments, the display device further includes anisotropic conductive adhesive, and the first bonding pad in the display panel is electrically connected to the second bonding pad of the flexible circuit board through the anisotropic conductive adhesive.

[0027] In one of the embodiments, a distance between two adjacent first bonding pads in the display panel in the first direction is a first gap, a distance between two adjacent anisotropic conductive adhesives in the display device is an insulation pitch, and the first gap is greater than the insulation pitch.

[0028] In one of the embodiments, a minimum area of the second bonding pad in the flexible circuit board is greater than or equal to a minimum conduction area of the anisotropic conductive adhesive.

[0029] In one of the embodiments, the minimum area of the second bonding pad is calculated in the following manner:

[0030] Smin = (L F -l F ) * (H F -h F );

[0031] wherein Smin represents the minimum area of the second bonding pad, L F represents a width of the second bonding pad in the first direction, l F represents a width tolerance of the second bonding pad in the first direction, H F represents a length of the second bonding pad in the second direction, h F represents a length tolerance of the second bonding pad in the second direction.

[0032] The display panel includes a first bonding area and a plurality of first bonding pads arranged in at least one row along a first direction in the first bonding area. The width of the first bonding pad in the first direction is greater than the length of the first bonding pad in a second direction, i.e., the first bonding pads in the first bonding area are arranged transversely. By arranging the first bonding pads in the display panel transversely, the size of a single first bonding pad in the first direction can be increased, thereby facilitating alignment and bonding of the display panel and the flexible circuit board, reducing the impact of misalignment in the first direction on the bonding operation, and improving the bonding yield. Meanwhile, the plurality of first bonding pads in each row are symmetrical about a first center reference line, and the width of the first bonding pads on the same side of the first center reference line in each row gradually increases. By making the width of the first bonding pads farther from the first center reference line greater in the first direction, the impact of misalignment in the first direction on the bonding operation can be further reduced. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present specification or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments described in the present specification, and other drawings can also be obtained by those skilled in the art without creative labor.

[0034] Figure 1 A schematic diagram of alignment of a display panel and a pad on a flexible circuit board in the prior art.

[0035] Figure 2 FIG. 2 is a partial enlarged schematic view of a display panel according to an embodiment of the present application;

[0036] Figure 3 FIG. 3 is a partial enlarged schematic view of a display panel according to another embodiment of the present application;

[0037] Figure 4 FIG. 4 is a partial enlarged schematic view of a display panel according to still another embodiment of the present application;

[0038] Figure 5 FIG. 5 is a partial enlarged schematic view of a flexible circuit board according to an embodiment of the present application;

[0039] Figure 6 FIG. 6 is a partial enlarged schematic view of a flexible circuit board according to another embodiment of the present application;

[0040] Figure 7 FIG. 7 is a partial enlarged schematic view of a flexible circuit board according to still another embodiment of the present application;

[0041] Figure 8 FIG. 8 is a partial enlarged schematic view of a display device according to an embodiment of the present application;

[0042] Figure 9 FIG. 9 is a partial enlarged schematic view of a display device according to another embodiment of the present application. DETAILED DESCRIPTION

[0043] For the purpose of promoting an understanding of the principles of the application, reference will now be made to the embodiments illustrated in the drawings. It is expressly understood that the drawings are only meant to illustrate preferred embodiments of the application and that the application can take many different forms. In addition, it should be understood that the drawings are not to scale, and that the specific dimensions shown are intended to be illustrative only and that in no way limit the scope of the application.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this description, the terms "may" and "can" include any one of, or all of, the possible equivalents. The term "and / or" includes any and all combinations of one or more of the associated listed items.

[0045] In the case of using "include", "have", and "contain" in the description herein, unless an explicit limiting term is used, such as "only", "consist of", and the like, another component can be added. Unless otherwise mentioned, the singular form of the term can include the plural form, and it is not understood as the number of one.

[0046] It should be understood that, although the terms "first", "second" and the like can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present application.

[0047] In the present application, unless specifically defined and limited otherwise, the terms "connected", "connected", and the like should be understood broadly, for example, can be directly connected, can be indirectly connected through an intermediate medium, can be internal connection of two elements or interaction relationship of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0048] Figure 1 The figure shows the alignment of the display panel and the bonding pad on the flexible circuit board in the prior art. In the prior art, the bonding pad arranged on the display panel and the flexible circuit board is arranged vertically and aligned. With the development of display technology, the increase of the function of the display screen leads to the increase of the number of bonding pads. However, in the case of constant total horizontal width, the more the number of bonding pads, the smaller the pitch between the bonding pads, and the larger the total size of the bonding pads in the horizontal direction, so that the size fluctuation rate in the horizontal direction is larger. The larger the size fluctuation rate in the horizontal direction, the more likely to cause bonding offset.

[0049] Figure 2 The figure is a partial enlarged view of the display panel in one embodiment of the present application. In one embodiment, the display panel 10 can include a first bonding area 100. The first bonding area 100 can include at least one row of first bonding pads 110 arranged in the first direction X, and the first bonding pads 110 are arranged in a row in the first direction X. Figure 2 The figure shows one embodiment of the arrangement of the first bonding pads 110 in the first bonding area 100. Alternatively, according to different application requirements of the display panel, the first bonding pads 110 in the first bonding area 100 can also be arranged in two rows or more than two rows.

[0050] The width L of the first bonding pad 110 in the first direction X P may be greater than the length H of the first bonding pad 110 in the second direction Y PIn the present embodiment, the first direction X can refer to a horizontal direction, and the second direction Y can refer to a vertical direction. Preferably, the second direction Y is perpendicular to the first direction X. That is, the first bonding pads 110 are arranged horizontally on the first bonding area 100.

[0051] The first bonding area 100 can further include a first central reference line A, which can extend along the second direction Y. The first bonding area 100 can be symmetrical about the first central reference line A, and the first bonding pads 110 arranged in each row of the first bonding area 100 can also be symmetrical about the first central reference line A. The number of the first bonding pads 110 in each row of the first bonding area 100 can be odd or even. Figure 2 An embodiment in which an odd number of first bonding pads 110 are arranged in a row is shown. When the number of the first bonding pads 110 in a row is odd, one of the first bonding pads 110 can be used as a reference pad, the center line of which coincides with the first central reference line A, and the reference pad can be symmetrical about the first central reference line A. The remaining even number of first bonding pads 110 can be arranged symmetrically on both sides of the first central reference line A, with the reference pad as the alignment reference.

[0052] Figure 3 A partial enlarged view of a display panel in another embodiment of the present application is shown, Figure 3 An embodiment in which an even number of first bonding pads 110 are arranged in a row in the first bonding area 100 is shown. When the number of the first bonding pads 110 in a row is even, the first central reference line A can be used as the alignment reference, and the even number of first bonding pads 110 can be arranged symmetrically on both sides of the first central reference line A, with the first central reference line A as the alignment reference.

[0053] Meanwhile, the width Lx of the first bonding pads 110 on the first direction X in each row of the first bonding pads 110 on the same side of the first central reference line A gradually increases. P That is, the width Lx of the first bonding pads 110 on the first direction X in each row of the first bonding pads 110 closer to the first central reference line A is smaller, and the width Lx of the first bonding pads 110 on the first direction X in each row of the first bonding pads 110 farther from the first central reference line A is larger. P P

[0054] ​​In the display panel 10 provided in the present application, the first binding pads 110 in the display panel 10 are designed to be arranged horizontally, which increases the size of the first binding pads 110 in the first direction X, and facilitates the alignment of the pads in the display panel 10 and the pads in the flexible circuit board. Since the size of the first binding pads 110 in the first direction X is increased, the influence of the offset in the first direction X on the binding yield is reduced in the alignment operation, and the misalignment problem caused by the size fluctuation in the first direction X can be solved.

[0055] Meanwhile, considering that the middle position of the display panel 10 is usually taken as the alignment reference in operation, and the fluctuation in the first direction X is smaller for the positions closer to the alignment reference and larger for the positions farther from the alignment reference. Therefore, the first binding pads 110 arranged in each row in the first binding area 100 are designed such that the first binding pads 110 located on the same side of the first center reference line A in each row are closer to the first center reference line A, the width L P of the first binding pads 110 in the first direction X is smaller, and farther from the first center reference line A, the width L P of the first binding pads 110 in the first direction X is larger. That is, the width L P of the first binding pads 110 in the first direction X is larger for the first binding pads 110 farther from the first center reference line A, which can further solve the misalignment problem caused by the size fluctuation in the first direction X and ensure the binding yield.

[0056] In one of the embodiments, since the first binding pads 110 located at different positions in the display panel 10 in the first direction X are affected by various influencing factors to different extents, when designing the width L P of the first binding pads 110 located at different positions in the display panel 10 in the first direction X, the various possible deviation information can be considered comprehensively. According to the equipment deviation information and the width calculation method, the width L P of the nth first binding pad 110 located on the same side of the first center reference line A in each row of the first binding pads 110 in the first direction X is determined.

[0057] Based on the research findings of the applicant, it is found that the thermal expansion and contraction phenomenon exists in the base material PI (Polyimide) in the current FPC and display panel, and the thermal expansion and contraction amount (size) of the base material PI in the FPC and display panel is positively correlated with the total width and length of the FPC and display panel. In addition, there may be a certain equipment deviation in the size of the display panel and the FPC and pad during preparation, and there may also be a certain machine deviation in the alignment equipment when aligning the display panel and the FPC. For example, when the width of the first bonding pad 110 in the display panel in the first direction X is designed as L, the ideal width of the first bonding pad 110 prepared is L. However, in the actual preparation process, there may be a certain deviation, that is, the width of the actually prepared first bonding pad 110 may be L±l P , the difference between the actual width of the actually prepared first bonding pad 110 and the ideal width of the first bonding pad 110 can be referred to as the width tolerance. These deviation amounts can all affect the bonding yield of the display panel and the FPC. Therefore, when designing the width L P of the first bonding pad 110 in the display panel in the first direction X, the influence of the above factors can be considered comprehensively.

[0058] In one of the embodiments, the width L P of each first bonding pad 110 in the display panel 10 can be reasonably designed by comprehensively considering the width size of the second bonding pad in the flexible circuit board in the first direction X, the expansion tolerance between the first bonding pads 110 in different positions in the display panel 10 due to temperature, and the machine fluctuation amount of the alignment equipment, so as to solve the misalignment problem of the display panel 10 in the first direction X. That is, specifically, the equipment deviation information can include the width of the second bonding pad in the flexible circuit board in the first direction X, the width tolerance of the second bonding pad in the flexible circuit board in the first direction X, the width tolerance of the first bonding pad 110 in the display panel 10 in the first direction X, the expansion tolerance of the first bonding pad 110 in the display panel 10, and the machine fluctuation amount.

[0059] In one of the embodiments, the calculation method of the width L nP of the nth first bonding pad 110 in the display panel 10 on the left side or the right side of the first center reference line A in the first direction X can include:

[0060] L nP = 2(1 / 2(x n +p n +l P +l F )+X J )+L nF ;

[0061] In the formula, LnP may represent the width of the nth first bonding pad 110 on the left or right side of the first center reference line A in the first direction X, x n may represent the width tolerance of the nth first bonding pad 110 on the left side of the first center reference line A and the nth first bonding pad 110 on the right side of the first center reference line A in the first direction X, p n may represent the expansion tolerance of the nth first bonding pad 110 on the left side of the first center reference line A and the nth first bonding pad 110 on the right side of the first center reference line A in the first direction X, l P may represent the width tolerance of the first bonding pad 110 in the display panel 10 in the first direction X, l F may represent the width tolerance of the second bonding pad in the flexible circuit board in the first direction X, X J may represent the machine fluctuation, L nF may represent the width of the second bonding pad corresponding to the nth first bonding pad 110 on one side of the first center reference line A in the display panel 10 in the flexible circuit board in the first direction X.

[0062] The tolerance of each pad in the same display panel 10 or in the same flexible circuit board is the same when each device is used to manufacture the display panel 10 or the flexible circuit board, and the machine fluctuation caused by the alignment device to each pad in the display panel 10 and each pad in the flexible circuit board is the same when the alignment device is used to align one display panel 10 and one flexible circuit board. Therefore, in the same display panel 10, the width L nP of the first bonding pad 110 is calculated by the method of l P , l F , X J , which are fixed values. The tolerance of the pads in different display panels 10 or in different flexible circuit boards in the first direction X can be different, and the machine fluctuation caused by the alignment device to the pads in different display panels 10 and the pads in the flexible circuit board can also be different. Therefore, between different display panels 10, the width L nP of the first bonding pad 110 is calculated by the method of l P , l F , X J , which can have different values.

[0063] In this embodiment, the width L nP of the first bonding pad 110 is described in the structure shown in Figure 2 or Figure 3 , which is more specific and detailed, but it cannot be understood as a limitation to the scope of the invention. Please refer to Figure 2When the number of first bonding pads 110 in each row in the first bonding area 100 is odd, the first bonding pad 110 at the center of each row can be used as a reference pad, the center line of the reference pad coincides with the first center reference line A, and the reference pad can be symmetrical about the first center reference line A. The width L P can be set arbitrarily according to different application requirements. The width L P of the reference pad can be the same as the ideal width of the first bonding pad 110. Preferably, the width L P of the reference pad is greater than the second bonding pad in the flexible circuit board corresponding to the reference pad.

[0064] Figure 2 or Figure 3 , the width of the first first bonding pad 110 on the left side of the first center reference line A and the width of the first first bonding pad 110 on the right side of the first center reference line A are both width L 1P , the width L 1P is calculated as L 1P =2(1 / 2(x1+p1+l P +l F )+X J )+L 1F . Wherein x1 is the distance between the first first bonding pad 110 on the left side of the first center reference line A and the first first bonding pad 110 on the right side of the first center reference line A in the first direction X, the width tolerance caused by preparation process or other factors. P1 is the expansion tolerance between the first first bonding pad 110 on the left side of the first center reference line A and the first first bonding pad 110 on the right side of the first center reference line A in the first direction X due to temperature and other factors. L P is the width tolerance of the first bonding pad 110 in the display panel 10 in the first direction X caused by preparation process or other factors, L F is the width tolerance of the second bonding pad in the flexible circuit board aligned with the display panel 10 in the first direction X caused by preparation process or other factors, X J is the machine fluctuation amount of the alignment equipment in the first direction X for aligning the display panel 10 and the flexible circuit board. L 1F is the width of the second bonding pad in the flexible circuit board corresponding to the first first bonding pad 110 on the left side or right side of the first center reference line A in the display panel 10 in the first direction X.

[0065] Similarly, the width of the second first bonding pad 110 on the left side of the first center reference line A and the width of the second first bonding pad 110 on the right side of the first center reference line A are both width L 2P, width L 2P The calculation method is L 2P =2(1 / 2(x2+p2+l P +l F )+X J )+L 2F Wherein, x2 is the distance between the second first bonding pad 110 located to the left of the first center reference line A and the second first bonding pad 110 located to the right of the first center reference line A in the first direction X, which is the width tolerance caused by the manufacturing process or other factors. p1 is the expansion tolerance between the second first bonding pad 110 located to the left of the first center reference line A and the second first bonding pad 110 located to the right of the first center reference line A in the first direction X due to factors such as temperature. P is the width tolerance of the first bonding pad 110 in the display panel 10 in the first direction X due to the manufacturing process or other factors, F is the width tolerance of the second bonding pad in the flexible circuit board aligned with the display panel 10 in the first direction X due to the manufacturing process or other factors, X J L is the fluctuation of the machine platform caused by the alignment equipment for aligning the display panel 10 and the flexible circuit board in the first direction X. 2F is the width in the first direction X of the second bonding pad in the flexible circuit board connected to the second first bonding pad 110 located on the left or right side of the first center reference line A in the display panel 10 .

[0066] It can be further deduced that the width of the nth first bonding pad 110 located on the left side of the first central reference line A and the width of the nth first bonding pad 110 located on the left side of the first central reference line A are both width L nP , width L nP The calculation method is L nP =2(1 / 2(x n +p n +l P +l F )+X J )+L nF .

[0067] Figure 4This is a partially enlarged schematic diagram of a display panel in another embodiment of the present application. In one embodiment, the display panel 10 may include a first integrated unit 120. In an embodiment, the first integrated unit 120 may refer to an integrated circuit chip (IC) in the display panel 10. The first integrated unit 120 may be used to generate a drive signal based on various control signals to drive the display panel 10. The drive signal generated from the first integrated unit 120 may be applied to the gate lines and data lines in the display panel 10 to drive the display panel 10 to implement various functions.

[0068] The display panel 10 may include multiple layers of first wiring layers. Preferably, wiring holes may be used between different first wiring layers to achieve electrical connection between the wiring. The multiple first binding pads 110 on each row of the first binding area 100 may be connected to the first integrated unit 120 via wiring on a corresponding first wiring layer.

[0069] For example, the multiple first binding pads 110 on the first row on the first binding area 100 are connected to the first integrated unit 120 through the routing on the first routing layer of the first layer; the multiple first binding pads 110 on the second row on the first binding area 100 are connected to the first integrated unit 120 through the routing on the second routing layer of the first layer; the multiple first binding pads 110 on the nth row on the first binding area 100 are connected to the first integrated unit 120 through the routing on the nth routing layer of the first layer.

[0070] By setting different first routing layers, the first binding pads 110 on different rows can be connected to the first integrated unit 120 through different first routing layers, which can prevent the routing between multiple first binding pads 110 on different rows from crossing, thereby ensuring the product yield.

[0071] In some embodiments, the distance between the first integrated unit 120 and the first row of first binding pads 110 in the display panel 10 in the second direction Y can be designed to be different values ​​according to different application requirements.

[0072] In one embodiment, the distance between two adjacent first bonding pads 110 in the first direction X can be defined as a first gap X. P , any two first gaps X in the display panel 10 PThe distances between any two adjacent first bonding pads 110 in the display panel 10 in the first direction X are equal. Preferably, when multiple rows of first bonding pads 110 are provided in the display panel 10, the distances between two adjacent rows of first bonding pads 110 in the second direction Y are also equal. In actual applications, the distances between two adjacent rows of first bonding pads 110 in the second direction Y can be set to different values as needed.

[0073] In one embodiment, the lengths H of the multiple first bonding pads 110 in the same row in the second direction Y P may all be the same. Preferably, the lengths H of the multiple first bonding pads 110 in different rows in the second direction Y P may all be the same. The length H of each first bonding pad 110 in the second direction Y P may be designed according to specific application requirements. Similarly, when the length of the first bonding pad 110 in the second direction Y is designed to be H P , the ideal width of the first bonding pad 110 manufactured is H P , the actual length of the first bonding pad 110 manufactured can be H P ± h P , and the difference between the actual length of the first bonding pad 110 manufactured and the ideal length of the first bonding pad 110 can be referred to as the length tolerance.

[0074] The embodiments of the present disclosure can also provide a flexible circuit board, Figure 5 which is a partial enlarged schematic view of the flexible circuit board in one embodiment of the present disclosure. In one embodiment, the flexible circuit board 20 can include a second bonding area 200. The second bonding area 200 can include at least one row of multiple second bonding pads 210 arranged in the first direction X, and the multiple second bonding pads 210 are arranged in a row in the first direction X. The width L F of the second bonding pad 210 in the first direction X F may be greater than the length H of the second bonding pad 210 in the second direction Y.

[0075] Figure 5 which shows one embodiment of the multiple second bonding pads 210 arranged in a row in the second bonding area 200. Alternatively, according to different application requirements of the display panel, the multiple second bonding pads 210 in the second bonding area 200 can also be arranged in two rows or more than two rows.

[0076] The second binding region 200 may further include a second center reference line B, which may extend along the second direction Y. The second binding region 200 may be symmetrical about the second center reference line B, and the plurality of second binding pads 210 arranged in each row in the second binding region 200 may also be symmetrical about the second center reference line B. The number of second binding pads 210 in each row in the second binding region 200 may be an odd number or an even number. Figure 4 The diagram shows an odd number of second binding pads 210 arranged in a row. When the number of second binding pads 210 in a row is odd, one of the second binding pads 210 can be used as a reference pad, with the centerline of the reference pad coinciding with the second center reference line B. The reference pads can be symmetrical about the second center reference line B. The remaining even number of second binding pads 210 can be symmetrically arranged on both sides of the second center reference line B, using the reference pads as alignment references.

[0077] Figure 6 This is a partially enlarged schematic diagram of a flexible circuit board in another embodiment of the present application. Figure 6 What is shown is a schematic diagram of an even number of second binding pads 210 in the second binding area 200 arranged in a row. When the number of second binding pads 210 in a row is an even number, the second center reference line B can be used as the alignment reference, and the even number of second binding pads 210 can be symmetrically arranged on both sides of the second center reference line B with the second center reference line B as the alignment reference.

[0078] At the same time, the distance between two adjacent second binding pads 210 located on the same side of the second center reference line B in each row of second binding pads 210 gradually increases in the first direction X. That is, the distance between a second binding pad 210 in each row of second binding pads 210 and an adjacent second binding pad 210 that is closer to the second center reference line B is smaller; and the distance between a second binding pad 210 in each row of second binding pads 210 and an adjacent second binding pad 210 that is farther from the second center reference line B is larger.

[0079] like Figure 5 As shown, the distance between the first second bonding pad 210 located on the left side of the second center reference line B and the second bonding pad 210 located at the second center reference line B is X. 1F The distance between the second second bonding pad 210 located on the left side of the second center reference line B and the first second bonding pad 210 located on the left side of the second center reference line B is X. 2F , X 2F >X 1F .

[0080] The flexible circuit board 20 provided in the application, by designing the second bonding pads 210 in the flexible circuit board 20 to be arranged horizontally, increasing the size of the second bonding pads 210 in the first direction X, facilitating the alignment of the first bonding pads 110 in the display panel 10 and the second bonding pads 210 in the flexible circuit board 20. Since the size of the second bonding pads 210 in the first direction X is increased, the influence of the offset in the first direction X on the bonding yield is reduced in the alignment operation, and the misalignment problem caused by the size fluctuation in the first direction X can be solved.

[0081] Meanwhile, when the second bonding pads 210 are arranged in the first direction X, the interval distance between the two adjacent second bonding pads 210 closer to the second center reference line B is smaller, and the interval distance between the two adjacent second bonding pads 210 farther from the second center reference line B is larger, with the second center reference line B as the reference. On the one hand, it can avoid the short circuit between the two adjacent second bonding pads 210 caused by the too small interval distance between the second bonding pads 210; on the other hand, it can further solve the misalignment problem caused by the size fluctuation in the first direction X, and ensure the bonding yield.

[0082] In one embodiment, the interval distance between the second bonding pads 210 in the flexible circuit board 20 can match the width L nP variation of the first bonding pads 110 in the display panel 10 in the first direction X. By matching the interval distance between the second bonding pads 210 in the flexible circuit board 20 provided in the application with the width L nP variation of the first bonding pads 110 in the display panel 10 in the first direction X, it can be ensured that the display panel 10 and the flexible circuit board 20 can well match the material and process tolerances in the bonding process, thereby effectively reducing the alignment misalignment problem between the first bonding pads 110 in the display panel 10 and the second bonding pads 210 in the flexible circuit board 20, and improving the bonding yield.

[0083] In one embodiment, the width L F of the plurality of second bonding pads 210 in the same row in the flexible circuit board 20 in the first direction X can be the same.

[0084] In one embodiment, the length H F of the plurality of second bonding pads 210 in the same row in the flexible circuit board 20 in the second direction Y can be the same.

[0085] Similarly, l F is the width tolerance of the second bonding pads 210 in the flexible circuit board 20 in the first direction X caused by the preparation process or other factors, and h FIn order to accommodate the length tolerance of the second bonding pads 210 in the flexible circuit board 20 in the second direction Y due to manufacturing process or other factors. The actual width of the second bonding pads 210 in the flexible circuit board 20 in the first direction X is L F ±l F The actual length of the second bonding pads 210 in the flexible circuit board 20 in the second direction Y is H F ±h F .

[0086] Preferably, the distance between the second bonding pads 210 in two adjacent rows in the flexible circuit board 20 in the second direction Y is equal. In actual applications, the distance between the second bonding pads 210 in two adjacent rows in the second direction Y can be set to different values as needed.

[0087] Figure 7 Fig. 6 is a partial enlarged view of the flexible circuit board according to another embodiment of the present application. In one embodiment, the flexible circuit board 20 can include a second integrated unit 220. In an embodiment, the second integrated unit 220 can refer to an integrated circuit chip (IC) in the flexible circuit board 20. The second integrated unit 220 can be configured to generate driving signals according to various control signals to drive the display panel 10 and / or the flexible circuit board 20. The driving signals generated from the first integrated unit 120 can be applied to the display panel 10 and / or the flexible circuit board 20 to drive the display panel 10 and / or the flexible circuit board 20 to implement various functions.

[0088] The flexible circuit board 20 can include multiple second trace layers. Preferably, the different second trace layers can be electrically connected through the via holes. The multiple second bonding pads 210 in each row can be connected to the second integrated unit 220 through the traces in one of the second trace layers.

[0089] For example, the multiple second bonding pads 210 in the first row in the second bonding area 200 can be connected to the second integrated unit 220 through the traces in the first second trace layer; the multiple second bonding pads 210 in the second row in the second bonding area 200 can be connected to the second integrated unit 220 through the traces in the second second trace layer; and the multiple second bonding pads 210 in the nth row in the second bonding area 200 can be connected to the second integrated unit 220 through the traces in the nth second trace layer.

[0090] By arranging different second trace layers, the second bonding pads 210 in different rows can be connected to the second integrated unit 220 through different second trace layers, which can prevent the traces between the multiple second bonding pads 210 in different rows from crossing each other, thereby ensuring the yield of the product.

[0091] In some embodiments, the distance between the second integrated unit 220 and the first row of second binding pads 210 in the second direction Y of the flexible circuit board 20 can be designed to be different values ​​according to different application requirements.

[0092] The present disclosure also provides a display device, which can be either a rigid display device or a flexible display device. The display device can be applied to any product or component with a display function, including but not limited to the following categories: mobile phones, televisions, digital cameras, tablet computers, laptops, desktop monitors, smart bracelets, smart glasses, vehicle-mounted displays, medical equipment, industrial control equipment, touch-screen interactive terminals, etc., without any particular limitation in the present disclosure.

[0093] Figure 8 This is a partially enlarged schematic diagram of a display device in one embodiment of the present application. In order to better illustrate the structural design of the first bonding pad 110 and the second bonding pad 210 in the display device, Figure 8 The structures of the first binding pads 110 and the second binding pads 210 are primarily shown, while other structures of the display device are concealed. In one embodiment, the display device may include a display panel 10 as described in any of the above embodiments and a flexible circuit board 20 as described in any of the above embodiments, wherein the first binding pads 110 in the display panel 10 are electrically connected to the second binding pads 210 of the flexible circuit board 20 in a one-to-one correspondence. Preferably, the number of first binding pads 110 in the display panel 10 is the same as the number of second binding pads 210 in the flexible circuit board 20.

[0094] The width L of the first bonding pad 110 in the display panel 10 in the first direction X P Greater than the width L of the second bonding pad 210 in the flexible circuit board 20 in the first direction X F , by the width L of the first bonding pad 110 in the display panel 10 P Designed to be larger than the width L of the second bonding pad 210 in the flexible circuit board 20 F , leaving a margin for possible deviation during the binding process, so as to facilitate accurate one-to-one alignment of the first binding pads 110 in the display panel 10 and the second binding pads 210 in the flexible circuit board 20.

[0095] In one embodiment, the first center reference line A in the display panel 10 coincides with the second center reference line B in the flexible circuit board 20, and the electrical connection between a first bonding pad 110 and a second bonding pad 210 in the display device forms a bonding pad group. A plurality of bonding pad groups in the display device can be symmetrical about the first center reference line A and / or the second center reference line B. The number of bonding pad groups in each row in the display device can be odd or even.

[0096] Figure 8 The display is a schematic diagram of odd bonding pad groups arranged in a row. When the number of bonding pad groups in a row is odd, one of the bonding pad groups can be used as a reference bonding pad group, the center line of the reference bonding pad group coincides with the first center reference line A and / or the second center reference line B, and the reference bonding pad group can be symmetrical about the first center reference line A and / or the second center reference line B. The remaining even bonding pad groups can be arranged symmetrically on both sides of the first center reference line A and / or the second center reference line B, respectively, with the reference bonding pad group as the alignment reference.

[0097] Figure 9 The display is a schematic diagram of the display device in another embodiment of the present application. In order to better show the structural design of the first bonding pad 110 and the second bonding pad 210 in the display device, Figure 9 the structures of the first bonding pad 110 and the second bonding pad 210 are mainly displayed, and other structures of the display device are hidden. Figure 9 The display is a schematic diagram of even bonding pad groups arranged in a row in the display device. When the number of bonding pad groups in a row is even, the first center reference line A and / or the second center reference line B can be used as an alignment reference, and the even bonding pad groups can be arranged symmetrically on both sides of the first center reference line A and / or the second center reference line B, respectively, with the first center reference line A and / or the second center reference line B as the alignment reference.

[0098] In one embodiment, the first bonding pad 110 can include opposite first and second edges l P1 and l P2 in the first direction X, and the second bonding pad 210 includes opposite third and fourth edges l F1 and l F2 in the first direction X. As shown in Figure 9 , the distance between the first and second edges l P1 and l P2 in the first direction X is the width L P ± l P of the first bonding pad 110 in the first direction X. The distance between the third and fourth edges l F1 and l F1The distance between the first edge l F ±l F The distance between the first edge l P1 and the first center reference line A is greater than the distance between the second edge l P2 and the first center reference line A, and the distance between the third edge l F1 and the second center reference line B is greater than the distance between the fourth edge l F2 and the second center reference line B.

[0099] In the embodiment, the distance between the first edge l P1 and the third edge l F1 is equal to the distance between the second edge l P2 and the fourth edge l F2 , and the distance between the first edge l P1 and the third edge l F1 or the distance between the second edge l P2 and the fourth edge l F2 may be defined as the second gap a.

[0100] In one of the embodiments, since the width L P of the first bonding pad 110 in the display substrate 10 at different positions in the first direction X is different, and the width L F of the second bonding pad 210 on the flexible circuit board 20 in the first direction X is the same, the second gap a of the plurality of bonding pad groups on the same side of the first center reference line A in each row of bonding pad groups gradually increases.

[0101] In the display device provided by the application, the first bonding pad 110 in the display panel 10 and the second bonding pad 210 in the flexible circuit board 20 are designed to be arranged transversely, the size of the first bonding pad 110 and the second bonding pad 210 in the first direction X is increased, and the one-to-one alignment of the first bonding pad 110 in the display panel 10 and the second bonding pad 210 in the flexible circuit board 20 is facilitated. Since the size of the first bonding pad 110 and the second bonding pad 210 in the first direction X is increased, the influence of the offset in the first direction X on the bonding yield of the display device is reduced, the misalignment problem caused by the size fluctuation in the first direction X is solved, and the stability of the display device is ensured. The display device provided by the application can solve the problems of open circuit and short circuit of the display panel 10 and the flexible circuit board 20 after bonding caused by the large size tolerance of the total pad spacing of the flexible circuit board 20 and the insufficient alignment accuracy of the module factory equipment, improve the bonding process yield, and reduce the material cost.

[0102] In one embodiment, according to the device deviation information and the gap calculation method, the second gap a of the plurality of bonding pad groups on the same side of the first center reference line A in each row of bonding pad groups is determined.

[0103] Since the widths L P of the first bonding pads 110 in the display substrate 10 at different positions in the first direction X are different, and the widths L F of the second bonding pads 210 on the flexible circuit board 20 in the first direction X are the same, the second gap a of the plurality of bonding pad groups on the same side of the first center reference line A in each row of bonding pad groups gradually increases, and the second gap a of the bonding pad group in each bonding pad group is related to the width L P of the first bonding pad 110 in the first direction X in the bonding pad group.

[0104] According to the foregoing analysis, when designing the width L P of the first bonding pad 110 in the first direction X, the width size of the second bonding pad 210 in the flexible circuit board 20 in the first direction X, the expansion tolerance between the first bonding pads 110 at different positions in the display panel 10 due to temperature, and the machine fluctuation of the alignment device can be comprehensively considered. Similarly, the width size of the second bonding pad 210 in the flexible circuit board 20 in the first direction X, the expansion tolerance between the first bonding pads 110 at different positions in the display panel 10 due to temperature, and the machine fluctuation of the alignment device can be comprehensively considered to reasonably design the second gap a of each bonding pad group in the display device, so as to solve the deviation problem of the display device in the bonding process in the first direction X.

[0105] That is, specifically, the device deviation information can include the width of the second bonding pad 210 in the flexible circuit board 20 in the first direction X, the width tolerance of the second bonding pad 210 in the flexible circuit board 20 in the first direction X, the width tolerance of the first bonding pad 110 in the display panel 10 in the first direction X, the expansion tolerance of the first bonding pad 110 in the display panel 10, and the machine fluctuation.

[0106] In one embodiment, the calculation method of the second gap a n of the nth bonding pad group on the left side or the right side of the first center reference line A in the display device can include:

[0107] a n = (1 / 2 (x n + p n + l P + l F ) + X J );

[0108] Where a n It can represent the second gap of the nth bonding pad group located on the same side of the first center reference line A, x n It can represent the width tolerance of the nth first bonding pad 110 located on the left side of the first central reference line A and the nth first bonding pad 110 located on the right side of the first central reference line A in the first direction X, p n It can represent the expansion tolerance of the nth first bonding pad 110 located on the left side of the first central reference line A and the nth first bonding pad 110 located on the right side of the first central reference line A in the first direction X, l F It can represent the width tolerance of the second bonding pad 210 in the flexible circuit board 20 in the first direction X, where X J It can indicate the fluctuation of the machine.

[0109] When each device is preparing a display panel 10 or a flexible circuit board 20, the tolerance of each pad in the same display panel 10 or each pad in the flexible circuit board 20 in the first direction X is the same. At the same time, when the alignment device is aligning a display panel 10 and a flexible circuit board 20, the machine fluctuation caused by the alignment device to each pad in the display panel 10 and each pad in the flexible circuit board 20 is also the same. Therefore, in the same display panel 10, the width L of the first bonding pad 110 is nP The calculation method of l P 、l F 、X J is a fixed amount. The tolerances of the pads in different display panels 10 or different flexible printed circuit boards 20 in the first direction X may be different, and the machine fluctuation caused by the alignment equipment to the pads in different display panels 10 and the pads in the flexible printed circuit board 20 may also be different. Therefore, in different display panels 10, the width L of the first bonding pad 110 is nP The calculation method of l P 、l F 、X J The value of may be different.

[0110] In this embodiment, Figure 8 The structure shown has a second gap a between the bonding pads. n The description is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. Figure 8When the number of binding pad groups in each row of the display device is an odd number, the binding pad group located at the center of each row can be used as a reference pad group, the center line of the reference pad group coincides with the first center reference line A, and the reference pad group can be symmetrical about the first center reference line A. The second gap a in the reference pad group can be arbitrarily set according to different application requirements. Preferably, the second gap in the reference pad group is greater than 0.

[0111] Figure 8 The second gap of the first bonding pad group located on the left side of the first center reference line A (ie, the first edge l of the first first bonding pad 110 located on the left side of the first center reference line A) is P1 and the third edge l of the first second bonding pad 210 located on the left side of the first center reference line A. F1 The distance between them, or the second edge l of the first first bonding pad 110 located on the left side of the first center reference line A P2 and the fourth edge l of the first second bonding pad 210 located on the left side of the first center reference line A. F2 The distance between the first bonding pads and the second gap of the first bonding pad group located on the right side of the first center reference line A are both the second gap a1. The calculation method of the second gap a1 is a1=(1 / 2(x1+p1+l P +l F )+X J ). Wherein, x1 is the distance between the first first bonding pad 110 located to the left of the first center reference line A and the first first bonding pad 110 located to the right of the first center reference line A in the first direction X, which includes the width tolerance caused by the manufacturing process or other factors. p1 is the expansion tolerance between the first first bonding pad 110 located to the left of the first center reference line A and the first first bonding pad 110 located to the right of the first center reference line A in the first direction X due to factors such as temperature. P is the width tolerance of the first bonding pad 110 in the display panel 10 in the first direction X due to the manufacturing process or other factors, F is the width tolerance of the second bonding pad 210 in the flexible circuit board 20 aligned with the display panel 10 in the first direction X due to the manufacturing process or other factors, X J It is the fluctuation amount of the machine in the first direction X caused by the alignment equipment for aligning the display panel 10 and the flexible circuit board 20.

[0112] Similarly, the second gap of the second bonding pad group located on the left side of the first center reference line A and the second gap of the second bonding pad group located on the right side of the first center reference line A are both the second gap a2. The calculation method of the second gap a2 is a2 = (1 / 2 (x2 + p2 + l P +lF )+X J ). Wherein, x2 is the width tolerance of the first binding pad 110 in the first direction X caused by the preparation process or other factors, p1 is the expansion tolerance of the first binding pad 110 in the first direction X caused by temperature and other factors. P is the width tolerance of the first binding pad 110 in the first direction X caused by the preparation process or other factors in the display panel 10, l F is the width tolerance of the second binding pad 210 in the first direction X caused by the preparation process or other factors in the flexible circuit board 20 aligned with the display panel 10, X J is the machine fluctuation amount in the first direction X caused by the alignment equipment for aligning the display panel 10 and the flexible circuit board 20.

[0113] It can be further deduced that the second gap a n of the n th binding pad group on the left side of the first center reference line A and the second gap a n of the n th binding pad group on the right side of the first center reference line A are both a n , the calculation method of the second gap a n is a n =(1 / 2(x n +p n +l P +l F )+X J ).

[0114] In the display device provided by the present application, various equipment deviation factors such as the width of the second binding pad 210 in the first direction X in the flexible circuit board 20, the width tolerance of the second binding pad 210 in the first direction X in the flexible circuit board 20, the width tolerance of the first binding pad 110 in the first direction X in the display panel 10, the expansion tolerance of the first binding pad 110 in the display panel 10 and the machine fluctuation amount are comprehensively considered, the width L P of the first binding pad 110 in the first direction X in the display panel 10 and the second gap a of the first binding pad 110 in the display panel 10 and the second binding pad 210 in the flexible circuit board 20 are reasonably designed, which can effectively solve the misalignment problem in the first direction X.

[0115] When the first bonding pads 110 in the display panel 10 are arranged in the first direction X, the width L of the first bonding pad 110 closer to the first center reference line A is smaller, and the width L of the first bonding pad 110 farther from the first center reference line A is larger. P When the second bonding pads 210 in the flexible circuit board 20 are arranged in the first direction X, the distance between the adjacent second bonding pads 210 closer to the second center reference line B is smaller, and the distance between the adjacent second bonding pads 210 farther from the second center reference line B is larger. P In one aspect, the distance between the adjacent second bonding pads 210 in the flexible circuit board 20 is prevented from being too small to cause short circuit between the two adjacent second bonding pads 210. In another aspect, the display device can solve the misalignment problem caused by the size fluctuation in the first direction X due to various factors, and ensure the bonding yield.

[0116] In one embodiment, the display device can further include anisotropic conductive film (ACF). The first bonding pads 110 in the display panel 10 can be electrically connected to the second bonding pads 210 in the flexible circuit board 20 through the anisotropic conductive film. In some embodiments, the anisotropic conductive film can include a resin gel, and the resin gel can further include a plurality of conductive particles distributed in the resin gel. Under the action of an electric field, the plurality of conductive particles can form an electrically conductive path in the resin gel, thereby realizing the electrical connection between the first bonding pads 110 in the display panel 10 and the second bonding pads 210 in the flexible circuit board 20.

[0117] In one embodiment, the distance between the adjacent two first bonding pads 110 in the display panel 10 in the first direction X can be defined as a first gap X P The distance between the adjacent two anisotropic conductive films in the display device can be defined as an insulation gap Xgap. In this embodiment, the insulation gap Xgap can refer to the minimum distance that can ensure insulation between the adjacent two anisotropic conductive films. When the distance between the adjacent two anisotropic conductive films is less than or equal to the insulation gap Xgap, the conductive particles in the two anisotropic conductive films can form a conductive path under the action of an electric field, thereby causing short circuit between the adjacent two anisotropic conductive films. Therefore, in the design of the display device, the distance between the adjacent two anisotropic conductive films should be greater than the insulation gap Xgap to prevent short circuit between the anisotropic conductive films.

[0118] Further, the first gap X Pgreater than the insulation interval Xgap. Since the first bonding pads 110 in the display panel 10 are electrically connected to the second bonding pads 210 in the flexible circuit board 20 through the anisotropic conductive adhesive, the first gap X P greater than the insulation interval Xgap, it can be ensured that there is no short circuit problem between the adjacent two first bonding pads 110.

[0119] In one embodiment, the anisotropic conductive adhesive can have a minimum conduction area S ACF In this embodiment, the minimum conduction area S ACF may refer to the minimum area that can ensure that the conductive particles in the anisotropic conductive adhesive establish a stable conduction path. When the area of the anisotropic conductive adhesive is less than the minimum conduction area S ACF , the conductive particles in the anisotropic conductive adhesive can not form a conduction path or have an open circuit problem after conduction. Therefore, in the design of the display device, the area of each anisotropic conductive adhesive should be greater than or equal to the minimum conduction area S ACF to prevent the display device from having an open circuit problem due to the anisotropic conductive adhesive.

[0120] Further, the minimum area Smin of the second bonding pad 210 in the flexible circuit board 20 can be greater than or equal to the minimum conduction area S ACF of the anisotropic conductive adhesive, that is, Smin≥S ACF . Since the first bonding pads 110 in the display panel 10 are electrically connected to the second bonding pads 210 in the flexible circuit board 20 through the anisotropic conductive adhesive, the area of the second bonding pad 210 is less than the area of the first bonding pad 110, and thus the area that realizes electrical contact between the first bonding pad 110 and the second bonding pad 210 depends on the area of the first bonding pad 110. By designing the second bonding pad 210 to have a minimum area Smin of the second bonding pad 210 that is greater than or equal to the minimum conduction area S ACF of the anisotropic conductive adhesive, it can be ensured that the first bonding pad 110 and the second bonding pad 210 can realize stable electrical connection through the anisotropic conductive adhesive.

[0121] In one embodiment, the minimum area Smin of the second bonding pad 210 can be calculated as follows:

[0122] Smin=(L F -l F )*(H F -h F );

[0123] wherein Smin can represent the minimum area of the second bonding pad 210, L Fmay represent the width of the second bonding pad 210 in the first direction X, l F may represent the width tolerance of the second bonding pad 210 in the first direction, h F may represent the length of the second bonding pad 210 in the second direction Y, h F may represent the length tolerance of the second bonding pad 210 in the second direction Y.

[0124] In the actual production of the second bonding pad 210, there can be a certain deviation. The ideal design width of the second bonding pad 210 is L F , but the actual width of the second bonding pad 210 produced can be L F ±l F , the difference between the actual width of the second bonding pad 210 produced and the ideal width of the second bonding pad 210 can be referred to as the width tolerance l F . Similarly, the ideal design length of the second bonding pad 210 is H F , but the actual length of the second bonding pad 210 produced can be H F ±h F , the difference between the actual length of the second bonding pad 210 produced and the ideal length of the second bonding pad 210 can be referred to as the length tolerance h F . Generally, the width tolerance l F and / or the length tolerance h F of each second bonding pad 210 on the same flexible circuit board 20 produced by one device is fixed, and the width tolerance l F and / or the length tolerance h F can be determined according to historical production.

[0125] Therefore, based on the ideal design width L F , the ideal design length H F , the width tolerance l F and / or the length tolerance h F caused by the device process, the minimum area Smin that can exist in the second bonding pad 210 actually produced can be determined. By designing the second bonding pad 210 to be greater than or equal to the minimum conduction area S ACF of the anisotropic conductive adhesive, stable electrical connection between the first bonding pad 110 and the second bonding pad 210 through the anisotropic conductive adhesive can be ensured.

[0126] In the description of the specification, the description of the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are contained in at least one embodiment or example of the present application. In the description, the illustrative description of the above terms does not necessarily refer to the same embodiment or example.

[0127] The technical features of the above-described embodiments can be combined arbitrarily, and for the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described, but as long as the combinations of the technical features do not contradict each other, they should be considered within the scope of the present application.

[0128] The above-described embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A display panel, characterized in that: The first binding area includes at least one row of a plurality of first binding pads arranged along a first direction, the width of the first binding pads in the first direction is greater than the length of the first binding pads in a second direction, and the first direction and the second direction are perpendicular to each other; The first binding region includes a first central reference line extending along the second direction, the first binding pads arranged in each row are symmetrical about the first central reference line, and the widths of the first binding pads in each row that are located on the same side of the first central reference line gradually increase in the first direction; Determine, according to the device deviation information and the width calculation method, a width in the first direction of an nth first binding pad in each row of the first binding pads that is located on the same side of the first center reference line; The device deviation information includes a width of the second binding pad in the flexible circuit board in the first direction, a width tolerance of the second binding pad in the flexible circuit board in the first direction, a width tolerance of the first binding pad in the display panel in the first direction, an expansion tolerance of the first binding pad in the display panel, and a machine fluctuation; The width calculation method includes: L nP =2(1 / 2(x n +p n +l P +l F )+X J )+L nF ; Where, L nP represents the width of the nth first binding pad located on the left or right side of the first center reference line in the first direction, x n represents the width tolerance in the first direction between the nth first binding pad located on the left side of the first center reference line and the nth first binding pad located on the right side of the first center reference line, p n represents the expansion tolerance in the first direction between the nth first binding pad located on the left side of the first center reference line and the nth first binding pad located on the right side of the first center reference line, l P represents the width tolerance of the first binding pad in the display panel in the first direction, l F represents the width tolerance of the second binding pad in the flexible circuit board in the first direction, X J Indicates the fluctuation of the machine, L nF It represents the width in the first direction of the second binding pad in the flexible circuit board that is connected to the nth first binding pad in the display panel located on one side of the first center reference line.

2. The display panel according to claim 1, wherein: The display panel includes a first integrated unit, and the display panel includes multiple layers of first wiring layers. The plurality of first binding pads on each row are connected to the first integrated unit via wiring on a layer of the first wiring layer.

3. The display panel according to claim 1, wherein: A distance between two adjacent first binding pads in the first direction is a first gap, and any two first gaps are equal.

4. The display panel according to claim 1, wherein: The lengths of the plurality of first binding pads in the same row in the second direction are all the same.

5. A display device, characterized in that: The display panel and the flexible circuit board according to any one of claims 1 to 4 are provided, wherein the first binding pads in the display panel are electrically connected to the second binding pads on the flexible circuit board in a one-to-one correspondence, and the width of the first binding pads in the first direction is greater than the width of the second binding pads in the first direction; The flexible circuit board includes a second binding area, the second binding area includes at least one row of a plurality of second binding pads arranged along a first direction, the width of the second binding pads in the first direction is greater than the length of the second binding pads in the second direction, and the first direction and the second direction are perpendicular to each other; The second binding area includes a second center reference line, which extends along the second direction. The second binding pads arranged in each row are symmetrical about the second center reference line, and the distance between two adjacent second binding pads on the same side of the second center reference line in each row of the second binding pads gradually increases in the first direction.

6. The display device according to claim 5, wherein: The widths of the plurality of second binding pads in the same row of the flexible circuit board in the first direction are all the same.

7. The display device according to claim 5, wherein: The lengths of the plurality of second binding pads in the same row of the flexible circuit board in the second direction are all the same.

8. The display device according to claim 6 or 7, characterized in that: The flexible circuit board includes a second integrated unit, and the flexible circuit board includes multiple second wiring layers. The plurality of second binding pads on each row are connected to the second integrated unit via wiring on a layer of the second wiring layer.

9. The display device according to claim 5, wherein: A first central reference line in the display panel coincides with a second central reference line in the flexible circuit board.

10. The display device according to claim 5, wherein The first binding pad includes a first edge and a second edge relative to each other in the first direction, the second binding pad includes a third edge and a fourth edge relative to each other in the first direction, the distance between the first edge and the third edge is equal to the distance between the second edge and the fourth edge, and the distance between the first edge and the third edge or the distance between the second edge and the fourth edge is a second gap.

11. The display device according to claim 10, wherein: One first binding pad and one second binding pad are electrically connected to form a binding pad group. In each row of the binding pad groups, the second gaps between the plurality of binding pad groups located on the same side of the first center reference line gradually increase.

12. The display device according to claim 11, wherein The second gap between the plurality of bonding pad groups located on the same side of the first center reference line in each row of the bonding pad groups is determined according to the device deviation information and the gap calculation method.

13. The display device according to claim 5, wherein The equipment deviation information includes the width of the second binding pad in the flexible circuit board in the first direction, the width tolerance of the second binding pad in the flexible circuit board in the first direction, the width tolerance of the first binding pad in the display panel in the first direction, the expansion tolerance of the first binding pad in the display panel and the machine fluctuation.

14. The display device according to claim 12, wherein: The gap calculation method includes: a n =(1 / 2(x n +p n +l P +l F )+X J ); Where a n represents the second gap of the nth bonding pad group located on the same side of the first center reference line, x n represents the width tolerance in the first direction between the nth first binding pad located on the left side of the first center reference line and the nth first binding pad located on the right side of the first center reference line, p n represents the expansion tolerance in the first direction between the nth first binding pad located on the left side of the first center reference line and the nth first binding pad located on the right side of the first center reference line, l P represents the width tolerance of the first binding pad in the display panel in the first direction, l F represents the width tolerance of the second binding pad in the flexible circuit board in the first direction, X J Indicates the fluctuation amount of the machine.

15. The display device according to claim 5, wherein The display device further includes anisotropic conductive adhesive, and the first binding pad in the display panel is electrically connected to the second binding pad of the flexible circuit board through the anisotropic conductive adhesive.

16. The display device according to claim 5, wherein The distance between two adjacent first binding pads in the display panel in the first direction is a first gap, the distance between two adjacent anisotropic conductive adhesives in the display device is an insulation distance, and the first gap is greater than the insulation distance.

17. The display device according to claim 5, wherein: The minimum area of ​​the second binding pad in the flexible circuit board is greater than or equal to the minimum conductive area of ​​the anisotropic conductive adhesive.

18. The display device according to claim 5, wherein The minimum area of ​​the second bonding pad is calculated as follows: Smin=(L F -l F )*(H F -h F ); Wherein, Smin represents the minimum area of ​​the second bonding pad, L F represents the width of the second binding pad in the first direction, l F represents the width tolerance of the second bonding pad in the first direction, H F represents the length of the second bonding pad in the second direction, h F represents the length tolerance of the second binding pad in the second direction.

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