Substrate, display substrate and display device

Abstract

The invention provides a substrate, a display substrate and a display device, the substrate is provided with a plurality of through hole layout areas, each through hole layout area is polygonal, and each vertex of the polygon is provided with a through hole penetrating along the thickness direction of the substrate; in all the through holes, the through holes located in the two adjacent rows are not located in the same column. According to the invention, the through holes in the two adjacent rows are not located in the same column, the scheme of horizontal and vertical arrangement is avoided, the problem of overlarge stress on the substrate caused by overlarge stress around the through holes due to the layout problem of the through holes is avoided, the durability of the substrate is enhanced by changing the structure of the layout area of the through holes on the substrate, and the reliability of the substrate is improved. And the service life and the performance of the substrate are improved.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of display technology, and in particular to a substrate, a display substrate, and a display device. Background Art

[0002] The through holes on the substrate are mainly used to connect the multilayer boards so as to transmit signals, current or other information in the multilayer boards. The arrangement structure of the through holes will affect the stress of the substrate, and the accumulation of stress may cause cracks in the substrate, and may also cause the substrate to deform or break, affecting the use of the substrate. In addition, it may also cause a short circuit, thereby affecting the performance of the entire circuit.

[0003] Please refer to Figure 1 In the prior art, the through holes are mostly arranged horizontally and vertically, which increases the stress of the substrate and makes it more prone to deformation or fracture. Summary of the invention

[0004] Embodiments of the present invention provide a substrate, a display substrate and a display device to solve the problem that the arrangement of through holes on the existing substrate easily causes the substrate to deform or break.

[0005] In order to solve the above-mentioned technical problems, the present invention is achieved as follows:

[0006] In a first aspect, an embodiment of the present invention provides a substrate having a plurality of through-hole layout areas, each of which is in the shape of a polygon, and each vertex of the polygon is respectively provided with a through-hole penetrating along the thickness direction of the substrate;

[0007] Among all the through holes, the through holes located in two adjacent rows are not located in the same column.

[0008] Optionally, the edges of adjacent through-hole distribution areas overlap, and the through-holes on the same edge are shared.

[0009] Optionally, the through hole distribution area is a regular polygon.

[0010] Optionally, the through hole distribution area is a regular hexagon.

[0011] Optionally, at least part of the through holes in the (i-1)th row and the (i+1)th row are symmetrical with respect to the (i)th row.

[0012] Optionally, edges of adjacent through-hole layout areas are adjacent.

[0013] Optionally, a first reinforcement layer is provided on the inner wall of the through hole.

[0014] Optionally, the first reinforcement layer includes at least one of the following:

[0015] Elastic layer, insulating layer or conductive layer.

[0016] Optionally, a second reinforcement layer is provided on the periphery of both ends of the through hole.

[0017] Optionally, the outer peripheries of both ends of the through hole are smoothly connected to the inner wall of the through hole along the thickness direction of the substrate.

[0018] In a second aspect, an embodiment of the present invention provides a display substrate, comprising the substrate as described in any one of the first aspects and a display film layer disposed on the substrate.

[0019] In a third aspect, an embodiment of the present invention provides a display substrate and a display device, characterized in that they include the display substrate as described in the second aspect.

[0020] In an embodiment of the present invention, a polygonal through-hole layout area is provided on the substrate, and each vertex of the polygon is provided with a through-hole penetrating along the thickness direction of the substrate, and the through-holes on two adjacent rows are not located in the same column, thereby avoiding a horizontal and vertical solution, and avoiding the problem of excessive stress around the through-holes caused by the through-hole layout problem and thus causing excessive stress on the substrate. By changing the structure of the through-hole layout area on the substrate, the durability of the substrate is enhanced, and the service life and performance of the substrate are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0022] Figure 1 It is a schematic diagram of the structure of a substrate in the prior art;

[0023] Figure 2 A schematic diagram of a substrate in which a through hole layout area is a regular triangle provided by an embodiment of the present invention;

[0024] Figure 3 A schematic diagram of a substrate in which a through-hole layout area is a regular octagon provided by an embodiment of the present invention;

[0025] Figure 4 A schematic diagram of a substrate having a through hole layout area in a regular hexagon provided by an embodiment of the present invention;

[0026] Figure 5 A schematic diagram of a substrate with adjacent edges of adjacent through-hole layout areas provided by an embodiment of the present invention;

[0027] Figure numerals: 1, through-hole layout area; 2, through-hole. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Please refer to Figure 2-Figure 4 , an embodiment of the present invention provides a substrate, the substrate having a plurality of through-hole layout areas 1, each of the through-hole layout areas 1 is polygonal, and each vertex of the polygon is respectively provided with a through-hole 2 penetrating along the thickness direction of the substrate;

[0030] Among all the through holes 2, the through holes 2 located in two adjacent rows are not located in the same column. Figure 4 , C1, C2, C3...C8 are columns arranged from left to right, R1, R 2, R 3...R7 are rows arranged from top to bottom, taking R2 and R3 as examples, R2 and R3 are two adjacent rows, through holes 211, 212, 213 and 214 on R2 are located in C2, C3, C6 and C7 columns respectively, through holes 221, 222, 223 and 224 on R3 are located in C1, C4, C5 and C8 columns respectively. It can be seen that R2 and R3 do not have through holes in the same column, and the same applies to other rows. Therefore, the through holes 2 located in two adjacent rows are not located in the same column.

[0031] In an embodiment of the present invention, a polygonal through-hole layout area is provided on the substrate, and each vertex of the polygon is provided with a through-hole penetrating along the thickness direction of the substrate, and the through-holes on two adjacent rows are not located in the same column, thereby avoiding a horizontal and vertical solution, and avoiding the problem of excessive stress around the through-holes caused by the through-hole layout problem and thus causing excessive stress on the substrate. By changing the structure of the through-hole layout area on the substrate, the durability of the substrate is enhanced, and the service life and performance of the substrate are improved.

[0032] Please refer to Figure 2-Figure 4 In the embodiment of the present invention, optionally, the edges of adjacent through-hole layout areas 1 overlap and share the through-holes 2 on the same edge.

[0033] In the embodiment of the present invention, the edges of adjacent through-hole layout areas 1 overlap and the through-holes 2 on the same edge are shared, so that different through-hole layout areas 1 can be closely connected, thereby improving the signal transmission performance of the substrate.

[0034] Please refer to Figure 2 , Figure 3 and Figure 4 In the embodiment of the present invention, optionally, the through hole layout area 1 is a regular polygon.

[0035] Please refer to Figure 2 In the embodiment of the present invention, a substrate is provided in which the through hole layout area 1 is a regular triangle. The triangle has stability. By making the through hole layout area 1 in the embodiment of the present invention a regular triangle, the stability of the entire substrate can be enhanced, which not only avoids the substrate being easily broken due to the horizontal and vertical arrangement of rectangles in the prior art, but also enhances the stability of the substrate and increases the arrangement capacity of the through holes 2 on the substrate.

[0036] Please refer to Figure 3 In an embodiment of the present invention, a substrate is provided in which a through hole layout area 1 is a regular octagon. In an embodiment of the present invention, the through hole layout area 1 is a regular octagon, and the through hole layout area 1 can effectively disperse the stress on the substrate.

[0037] It is worth noting that the shape of the through hole layout area 1 in the embodiment of the present invention is not limited by the listed shapes, and the specific shape setting can be determined according to the design requirements of the user.

[0038] Please refer to Figure 4 In the embodiment of the present invention, optionally, the through hole layout area 1 is a regular hexagon.

[0039] The through-hole layout area 1 in the embodiment of the present invention is a regular hexagon, similar to a "honeycomb structure". The honeycomb structure is the best topological structure for covering a two-dimensional plane. The hexagonal structure has good stability. Compared with the through-hole layout area 1 in the prior art, which is a quadrilateral, the through-hole layout area 1 composed of hexagons has a more compact and stable structure and is suitable for a variety of structures and environments. In addition, the hexagonal through-hole layout can also improve the strength of the substrate, make the substrate distribution symmetrical, and reduce the surface tension and tensile strength of the substrate.

[0040] In the embodiment of the present invention, optionally, at least part of the through holes 2 in the i-1th row and the i+1th row are symmetrical with respect to the i-th row.

[0041] Please refer to Figure 4 Taking rows R2, R3 and R4 as examples, the through holes 211, 212, 213 and 214 on row R2 are symmetrical with the through holes 231, 232, 233 and 234 on row R4 with respect to row R3. In the embodiment of the present invention, by providing symmetrical through holes 2, the coupling relationship between through holes 2 can be effectively reduced, and the complexity of the substrate manufacturing process can also be reduced.

[0042] Please refer to Figure 5 In the embodiment of the present invention, optionally, the edges of adjacent through-hole layout areas 1 are adjacent.

[0043] In the embodiment of the present invention, the diversity of the through hole layout area 1 is increased by setting adjacent edges.

[0044] In the embodiment of the present invention, optionally, the inner wall of the through hole 2 is provided with a first reinforcement layer.

[0045] In order to further reduce the stress on the through hole 2 , the embodiment of the present invention provides a first reinforcement layer on the inner wall of the through hole 2 , thereby reducing the stress on the inner wall of the through hole 2 and reducing the possibility of substrate cracking.

[0046] In the embodiment of the present invention, optionally, the first reinforcement layer includes at least one of the following:

[0047] Elastic layer, insulating layer or conductive layer.

[0048] In the embodiment of the present invention, an elastic layer, an insulating layer or a conductive layer can be set as the first reinforcement layer. While meeting the requirement of setting a through hole 2 on the substrate, the buffering effect of the original filler on the stress can be enhanced to improve the anti-attenuation ability of the substrate, thereby improving the stability of the entire substrate.

[0049] Furthermore, in the embodiment of the present invention, optionally, a second reinforcement layer is provided on the periphery of both ends of the through hole 2 .

[0050] In the embodiment of the present invention, a second reinforcement layer may be provided at the periphery of both ends of the through hole 2 in the thickness direction to reduce stress generated around the through hole 2, avoid breakage of the substrate, and further improve substrate performance.

[0051] Furthermore, in an embodiment of the present invention, optionally, the outer peripheries of both ends of the through hole 2 are smoothly connected to the inner wall of the through hole 2 along the thickness direction of the substrate.

[0052] The direct connection between the outer periphery at both ends of the through hole 2 and the substrate will also increase the stress around the through hole 2. Therefore, by smoothly connecting the outer periphery at both ends of the through hole 2 with the inner wall of the through hole 2 along the thickness direction of the substrate, excessive stress at the connection can be avoided and the stability of the substrate can be enhanced.

[0053] In the embodiment of the present invention, optionally, the material of the substrate can be glass, silicon or a molding compound, that is, the through hole can be a through glass via (TGV), a through silicon via (TSV), or a molding compound through hole (TMV). Taking the through glass via as an example, the size of the through hole is 20um to 400um, and the edge length u (through hole spacing) of the through hole layout area 1 and the spacing between the through holes are determined according to the size of the substrate and design requirements.

[0054] An embodiment of the present invention further provides a display substrate, comprising the substrate as described in any one of the above items and a display film layer disposed on the substrate.

[0055] The display substrate composed of the substrates in the embodiments of the present invention can enhance the stability of the display substrate in the embodiments of the present invention on the basis of enhancing the stability of the substrate itself, and can also enhance the anti-cracking ability through the structure in some embodiments, effectively prevent damage to the surface of the substrate, and then enhance the service life of the display substrate, and by avoiding horizontal and vertical through-hole layouts, it can improve the electromagnetic shielding effect, reduce interference, and improve the stability of the substrate display transmission.

[0056] An embodiment of the present invention further provides a display device, comprising the display substrate as described in any one of the above items.

[0057] The display device composed of the display substrate in the embodiment of the present invention can enhance the stability of the display device in the embodiment of the present invention and enhance the service life of the display device on the basis of enhancing the stability of the display substrate itself.

[0058] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0059] The serial numbers of the above embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0060] The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A substrate, characterized in that: The substrate has a plurality of through-hole layout areas, each of which is in the shape of a polygon, and each vertex of the polygon is provided with a through-hole penetrating along the thickness direction of the substrate; Among all the through holes, the through holes located in two adjacent rows are not located in the same column.

2. The substrate according to claim 1, characterized in that The edges of the adjacent through-hole distribution areas overlap, and the through-holes on the same edge are shared.

3. The substrate according to claim 1, characterized in that The through hole distribution area is a regular polygon.

4. The substrate according to claim 3, characterized in that The through hole distribution area is in a regular hexagon.

5. The substrate according to claim 1, characterized in that At least part of the through holes in the (i-1)th row and the (i+1)th row are symmetrical with respect to the (i)th row.

6. The substrate according to claim 1, characterized in that The edges of adjacent through-hole layout areas are adjacent to each other.

7. The substrate according to claim 1, characterized in that The inner wall of the through hole is provided with a first reinforcement layer.

8. The substrate according to claim 7, characterized in that The first reinforcement layer includes at least one of the following: Elastic layer, insulating layer or conductive layer.

9. The substrate according to claim 1, characterized in that A second reinforcement layer is disposed on the periphery of both ends of the through hole.

10. The substrate according to claim 1, characterized in that The outer peripheries of both ends of the through hole are smoothly connected to the inner wall of the through hole along the thickness direction of the substrate.

11. A display substrate, characterized in that: It comprises a substrate as described in any one of claims 1 to 10 and a display film layer arranged on the substrate.

12. A display device, characterized in that: Comprising the display substrate as claimed in claim 11.

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