Display module and display device

Abstract

The present disclosure relates to a display module and a display device, the display module comprising: a display panel; a first film layer located at the backlight side of the display panel; a circuit board located at the side of the first film layer away from the display panel; the first film layer comprises a first sub-film layer and a second sub-film layer, the material elastic modulus of the first sub-film layer is greater than that of the second sub-film layer, the first sub-film layer and the second sub-film layer are at least partially in the same horizontal plane parallel to the plane where the display panel is located in the direction perpendicular to the plane where the display panel is located, and the second sub-film layer at least partially overlaps with the circuit board. The display module provided by the present disclosure uses the first sub-film layer and the second sub-film layer with different elastic moduli to splice to form the first film layer, which can ensure the structural strength of the display module, avoid the generation of marks by absorbing the second sub-film layer with stronger deformation capacity, and improve the display effect of the display module.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a display module and a display device. BACKGROUND

[0002] The related art usually sets part of the structure in the display panel on the backlight side of the display module through bending or the like, so as to reduce the occupation of the part of the structure on the front space of the display panel, so as to realize the narrow frame effect. Such design not only improves the appearance and screen ratio of the device, but also provides a wider visual experience for the user. Specifically, some non-display functional components in the traditional display panel, such as flexible printed circuit (FPC), driving chip (IC) and other connectors, usually occupy a certain edge area, resulting in an increase in the frame width. By ingeniously bending these components to the back of the display module, the frame size can be significantly reduced, and even a "frameless" design can be realized. SUMMARY

[0003] In order to solve the above technical problems, the present disclosure provides a display module and a display device.

[0004] The present disclosure provides a display module, comprising: a display panel; a first film layer located on the backlight side of the display panel; a circuit board located on the side of the first film layer away from the display panel; the first film layer comprises a first sub-film layer and a second sub-film layer, the material elastic modulus of the first sub-film layer is greater than the material elastic modulus of the second sub-film layer, the first sub-film layer and the second sub-film layer are at least partially in the same horizontal plane parallel to the plane where the display panel is located in the direction perpendicular to the plane where the display panel is located, and the second sub-film layer at least partially overlaps the circuit board.

[0005] Based on the same inventive concept, the present disclosure also provides a display device comprising any one of the display modules.

[0006] The technical solutions provided by the present disclosure have the following advantages compared with the prior art: the display module provided by the present disclosure uses the first sub-film layer and the second sub-film layer with different elastic moduli to splice to form the first film layer, while ensuring the structural strength of the display module, the second sub-film layer with stronger deformation absorption capacity is used to avoid the generation of indentation, and the display effect of the display module is improved. BRIEF DESCRIPTION OF DRAWINGS

[0007] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present disclosure and, together with the specification, serve to explain the principles of the present disclosure.

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

[0009] Figure 1 A cross-sectional structure schematic diagram of a display module in the related art is shown.

[0010] Figure 2 A partial cross-sectional structure schematic diagram of a display module provided by the embodiments of the present disclosure is shown.

[0011] Figure 3 A partial plane structure schematic diagram of a display module provided by the embodiments of the present disclosure is shown.

[0012] Figure 4 Another partial cross-sectional structure schematic diagram of a display module provided by the embodiments of the present disclosure is shown.

[0013] Figure 5 Another partial cross-sectional structure schematic diagram of a display module provided by the embodiments of the present disclosure is shown.

[0014] Figure 6 Another partial cross-sectional structure schematic diagram of a display module provided by the embodiments of the present disclosure is shown.

[0015] Figure 7 Another partial plane structure schematic diagram of a display module provided by the embodiments of the present disclosure is shown.

[0016] Figure 8 Another partial cross-sectional structure schematic diagram of a display module provided by the embodiments of the present disclosure is shown.

[0017] Figure 9 Another partial cross-sectional structure schematic diagram of a display module provided by the embodiments of the present disclosure is shown.

[0018] Figure 10 Another partial cross-sectional structure schematic diagram of a display module provided by the embodiments of the present disclosure is shown.

[0019] Figure 11 Another partial cross-sectional structure schematic diagram of a display module provided by the embodiments of the present disclosure is shown.

[0020] Figure 12 A plane structure schematic diagram of a display device provided by the embodiments of the present disclosure is shown. DETAILED DESCRIPTION

[0021] In order to enable a more clear understanding of the above-mentioned purposes, features and advantages of the embodiments of the present disclosure, the schemes of the embodiments of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0022] In the following description, a large number of specific details are set forth in order to facilitate a thorough understanding of the embodiments of the present disclosure, but the embodiments of the present disclosure can also be implemented in other manners different from those described herein; obviously, the embodiments described in the specification are only a part of the embodiments of the present disclosure, and not all the embodiments.

[0023] In a related technology, as shown in Figure 1 , the Z1 direction is the light-out direction of the display panel panel, and the light-out side (i.e., the side close to the light-out direction) of the display panel panel includes structures such as the polarizer POL, the glass cover Lens, etc., and the backlight side (i.e., the side away from the light-out direction) of the display panel panel includes structures such as the metal layer M, the pressure-sensitive adhesive layer PSA, and the flexible circuit board FPC, etc. Among them, the flexible circuit board FPC is bent to the backlight side of the display panel panel, thereby reducing the occupation of the structure to the front space of the display panel, so as to realize the narrow frame effect.

[0024] The flexible circuit board FPC contains complex circuit structures, and the surface thereof is often uneven. After the flexible circuit board FPC is assembled to the display module, as shown in Figure 1 , the stress F from the light-out direction received by the flexible circuit board FPC will cause the flexible circuit board FPC to produce an indentation P on other film layer structures, thereby affecting the display effect of the panel. Under the trend of increasingly thinning of the thickness of the display module, the indentation produced by the above-mentioned flexible circuit board FPC will be more obvious, further affecting the display effect.

[0025] In view of this, the embodiments of the present disclosure provide a display module, as shown in Figure 2 and Figure 3 , which includes a display panel 100, a first film layer 11, and a circuit board 20. Among them, Figure 3 shows a planar structure schematic diagram of the display module, Figure 2 shows a part of the cross-sectional structure schematic diagram of the display module in Figure 3 cut along L1.

[0026] Among them, the first film layer 11 is located at the backlight side (i.e., the side away from the light-out direction Z1) of the display panel 100, and the circuit board 20 is located at the side of the first film layer 11 away from the display panel 100. Referring to Figure 1The first film layer 11 in the embodiments of the present disclosure corresponds to the metal layer M in the related art. In actual implementation, the display module further includes an upper structure 50 located at the light-out side of the display panel 100 (i.e., the side close to the light-out direction Z1), and the specific structure of the upper structure 50 will be further described in the following embodiments.

[0027] Specifically, the display panel 100 includes a plurality of pixels for display, each pixel including a light-emitting element and a corresponding connected pixel driving circuit, the pixel driving circuit being electrically connected with the circuit board 20 and receiving a display signal provided by the circuit board 20, and then driving the light-emitting element to emit light to display a corresponding picture.

[0028] Specifically, the circuit board 20 is a flexible circuit board. The flexible circuit board (Flexible Printed Circuit, FPC for short) is a printed circuit board made of a flexible substrate (such as a polyimide film, a polyester film, etc.), which forms a circuit by printing or attaching functional components such as wires and thin lines on the substrate through a special manufacturing process. Compared with traditional rigid circuit boards, flexible circuit boards have better bendability, expandability, light weight, small size and other advantages. The structure of the flexible circuit board mainly includes a substrate layer, a metal layer and a protective layer, the substrate layer is made of a flexible insulating material, the metal layer is generally made of copper foil, and the protective layer is used to protect the wire layer from damage and prevent oxidation, corrosion and other environmental factors.

[0029] In a specific embodiment, as shown in Figure 4 The circuit board 20 includes a non-bending area 21 and a bending area 22, the non-bending area 21 of the circuit board 20 is connected with the display panel 100 through the bending area 22, and then the circuit board 20 can provide the display panel 100 with driving signals required for displaying pictures. Figure 2 As shown in Figure 3 The circuit board 20 in the embodiment mainly refers to its non-bending area, and the following embodiments are the same, which will not be repeated here.

[0030] As shown in Figure 2 As shown in Figure 3 The first film layer 11 includes a first sub-film layer 111 and a second sub-film layer 112, and the first sub-film layer 111 and the second sub-film layer 112 are at least partially in the same horizontal plane parallel to the plane where the display panel 100 is located. Specifically, as shown in Figure 2 The first sub-film layer 111 and the second sub-film layer 112 have the same thickness, and together constitute the first film layer 11 with uniform thickness.

[0031] The material elastic modulus of the first sub-film layer 111 is greater than that of the second sub-film layer 112, and in the direction perpendicular to the plane where the display panel 100 is located, the second sub-film layer 112 at least partially overlaps the circuit board 20.

[0032] The elastic modulus, also known as Young's modulus, is a measure of the ratio of stress to strain in a material during its elastic deformation phase. It describes a material's ability to resist deformation under stress, i.e., the strain per unit stress. Materials with a high elastic modulus exhibit greater rigidity and smaller deformation under stress, while materials with a low elastic modulus are better at absorbing and dissipating energy through larger deformations.

[0033] The first sub-film layer 111 has a higher elastic modulus, ensuring the overall structural strength of the display module and preventing module failure caused by strong stress from the backlight side. The second sub-film layer 112 has a lower elastic modulus, allowing it to absorb and dissipate energy through greater deformation when subjected to external stress, thereby reducing stress transmitted to subsequent film layers. Figure 5 As shown, the second sub-film layer 112 at least partially overlaps with the circuit board 20. When the circuit board 20 is subjected to stress F from the light emission direction, the stress F can be absorbed by the second sub-film layer 112, thereby preventing imprints from forming in other film layers. Furthermore, even if the stress F is not completely absorbed by the second sub-film layer 112 and an imprint is formed, because the elastic modulus of the material of the second sub-film layer 112 is smaller, its ability to recover deformation after the external stress disappears is stronger than that of the first sub-film layer 111, and the imprint can also be quickly dissipated.

[0034] The display module provided in this embodiment utilizes a first sub-film layer 111 and a second sub-film layer 112 with different elastic moduli to form the first film layer 11. While ensuring the structural strength of the display module, the second sub-film layer 112, which has a stronger ability to absorb deformation, avoids the generation of imprints and improves the display effect of the display module.

[0035] In some embodiments, both the first sub-film layer 111 and the second sub-film layer 112 comprise conductive materials. In a specific implementation, the first film layer 11 needs to be grounded.

[0036] In practical applications of display modules, static electricity may accumulate on the metal surfaces of electronic devices, including the display module. If left untreated, this static electricity may be suddenly released upon contact, causing damage to internal circuitry. By using a conductive material to fabricate the first film layer 11 and grounding it, a safe path can be provided for the rapid release of static electricity, thereby protecting the electronic components in the display module from electrostatic damage.

[0037] Meanwhile, the entire first film layer 11, as a large-area conductor, can play a good electromagnetic shielding role, preventing external electromagnetic interference from entering the display module and suppressing the leakage of electromagnetic radiation generated inside the display module, which helps to reduce the impact of noise on the display effect.

[0038] In some embodiments, the first sub-film layer 111 comprises metal.

[0039] The first sub-film layer 111 is used to ensure the structural strength of the display module as a whole, to avoid module failure caused by strong stress from the backlight side of the display module. In the range of conductive materials, metal has simple processing technology and low cost, and is preferred as the material of the first sub-film layer 111.

[0040] At the same time, metal generally has good thermal conductivity, which can help to evenly distribute heat and quickly conduct it to the shell or heat sink. The first sub-film layer 111 made of metal can effectively conduct and dissipate the heat generated during the operation of the display module to the surrounding environment, thereby reducing the working temperature of the display panel and improving the heat dissipation efficiency.

[0041] In a specific embodiment, the first sub-film layer 111 comprises copper.

[0042] Copper has a high thermal conductivity coefficient (about 401 W / m·K) and is a common metal with good thermal conductivity, which can quickly and effectively conduct heat from the heat source, thereby improving the heat dissipation efficiency of the entire system. Moreover, as a conductive material, copper also has a low resistivity, which can further improve the conductivity efficiency of the first sub-film layer 111. And copper has low cost, which can achieve a good balance between performance and price, suitable for mass production and wide application.

[0043] In some embodiments, the second sub-film layer 112 comprises conductive foam.

[0044] In electronic devices, foam materials are widely used due to their lightweight, flexibility, cushioning, and insulation properties. In specific implementation, the above-mentioned conductive foam is made by adding conductive materials to the surface or inside of the foam substrate. The conductive materials can be graphene with good thermal conductivity and high electron mobility.

[0045] In a specific embodiment, the substrate of the above-mentioned conductive foam can be polyurethane foam, polyethylene foam, silica gel foam, polystyrene foam, EVA foam, etc. The conductive material in the conductive foam can be graphene coating or impregnation, graphene composite material, three-dimensional graphene network, graphene fiber or woven mesh, etc.

[0046] In some embodiments, as shown in Figure 6 and Figure 7 In the direction perpendicular to the plane where the display panel 100 is located, the entire area of the circuit board 20 overlaps with the second sub-film layer 112. Among them, Figure 7 shows a plan view of the display module, Figure 6 shows a part of the cross-sectional structure of the display module along L2 in Figure 7 cut.

[0047] Specifically, as shown in Figure 3 The circuit board 20 only occupies a part of the display module area, and the first film layer 11 in the overlapping area with the circuit board 20 can be entirely set as the second sub-film layer 112. Thus, the external stress on the entire area of the circuit board 20 can be absorbed by the second sub-film layer 112, further avoiding the generation of the imprint.

[0048] In some embodiments, as shown in Figure 8 The display module further includes a back adhesive layer 30.

[0049] The back adhesive layer 30 is located between the circuit board 20 and the first film layer 11.

[0050] The material elastic modulus of the first sub-film layer 111 is greater than that of the back adhesive layer 30.

[0051] The circuit board 20 bent to the back of the display panel 100 needs to be fixed by the back adhesive layer. In the related art, only pressure sensitive adhesive (PSA) is usually used as the back adhesive layer. The viscosity performance of the pressure sensitive adhesive accounts for a large proportion, so that after the two film layers are pasted together, the pressure sensitive adhesive itself can be regarded as a solid, and the elastic modulus is large and cannot be restored after deformation. In order to further solve the problem of the imprint of the display panel, the above-mentioned embodiments of the present disclosure use a material with a small elastic modulus as the back adhesive layer 30, so that the display module can further absorb external stress and improve the display effect.

[0052] In specific implementation, the material of the back adhesive layer 30 includes the above-mentioned foam, and specifically can be polyurethane foam, polyethylene foam, silica gel foam, polystyrene foam, EVA foam, etc.

[0053] In a specific embodiment, the back adhesive layer 30 can also include pressure sensitive adhesive, specifically a foam material coated with single-sided or double-sided pressure sensitive adhesive, namely foam adhesive.

[0054] In some embodiments, as shown in Figure 9 The back adhesive layer 30 includes a first back adhesive layer 31 and a second back adhesive layer 32.

[0055] The display panel 100 further includes a support layer 40, which is located between the first back adhesive layer 31 and the second back adhesive layer 32. The material hardness of the support layer 40 is greater than that of the back adhesive layer 30.

[0056] By increasing the support layer 40 with greater hardness between the back adhesive layers, the overall structural strength of the display module can be further improved, thereby avoiding the failure of the module caused by the strong stress from the backlight side of the display module damaging the structure.

[0057] In specific implementation, the materials of the first adhesive layer 31 and the second adhesive layer 32 include the aforementioned foam, which can be polyurethane foam, polyethylene foam, silicone foam, polystyrene foam, EVA foam, etc.

[0058] In one specific embodiment, the first adhesive layer 31 and the second adhesive layer 32 may also include pressure-sensitive adhesive, specifically a foam material coated with pressure-sensitive adhesive on one or both sides, i.e., foam adhesive.

[0059] In some embodiments, the support layer 40 comprises polyester.

[0060] Specifically, the support layer 40 includes polyethylene terephthalate (PET), with the chemical formula (C10H8O4)n, commonly known as polyester resin. It is produced by transesterification of dimethyl terephthalate and ethylene glycol or by esterification of terephthalic acid and ethylene glycol to synthesize diethyl terephthalate, followed by polycondensation reaction. It is a common resin in daily life and, together with polybutylene terephthalate (PBT), is collectively referred to as thermoplastic polyester or saturated polyester, which can be divided into APET, RPET and PETG.

[0061] PET exhibits excellent physical and mechanical properties over a wide temperature range, with a service temperature up to 120℃. It also demonstrates good creep resistance, fatigue resistance, abrasion resistance, and dimensional stability. Furthermore, PET can be manufactured into PET films, which further facilitates the reduction of the overall thickness of display modules.

[0062] In some embodiments, such as Figure 2 As shown, in the direction perpendicular to the plane of the display panel 100, the thickness h1 of the first film layer 11 is between 30 micrometers and 50 micrometers.

[0063] Because the material of the second sub-film layer 112 has a low elastic modulus, it can absorb and dissipate external stress with a small thickness. This allows for a reduction in the overall thickness of the display module while avoiding the formation of imprints, and simultaneously improving the display effect and user experience of the display module.

[0064] In some embodiments, such as Figure 8 As shown, in the direction perpendicular to the plane of the display panel 100, the thickness h2 of the adhesive layer 30 is between 30 micrometers and 80 micrometers.

[0065] Because the material of the adhesive layer 30 has a low elastic modulus, it can absorb and dissipate external stress with a small thickness. This allows for a reduction in the overall thickness of the display module while avoiding the formation of marks, and simultaneously improving the display effect and user experience of the display module.

[0066] In some embodiments, such as Figure 9As shown, in the direction perpendicular to the plane where the display panel 100 is located, the total thickness h3 of the first adhesive layer 31, the second adhesive layer 32 and the support layer 40 is between 30 micrometers and 80 micrometers.

[0067] Since the elastic modulus of the materials of the first adhesive layer 31 and the second adhesive layer 32 is small, and the support layer 40 can be made of polyester film, it can absorb and dissipate external stress with a small thickness, while improving the structural strength of the display module. Thus, while reducing the overall thickness of the display module, it can avoid the generation of marks, and improve the display effect and user experience of the display module.

[0068] In some embodiments, such as Figure 10 As shown, the display module also includes a second film layer 12, which is located on the side of the first film layer 11 near the display panel 100. The first film layer 11 and the second film layer 12 together constitute a composite film layer 10.

[0069] The elastic modulus of the material of the first sub-film layer 111 is greater than that of the material of the second film layer 12, which further prevents the transmission of external stress in the display module.

[0070] In specific implementation, the first film layer 11 and the second film layer 12 are tightly bonded together outside the display module by adhesive or other means to form the composite film layer 10, and then the composite film layer 10 is disposed in the display module. This composite film layer 10 combines the structural strength, stress absorption capacity, electrostatic protection capacity, electromagnetic shielding capacity and heat dissipation capacity of the above embodiments, which can ensure the normal operation of the display module and ensure the final display effect.

[0071] In specific implementation, the material of the second membrane layer 12 includes the aforementioned foam, which can be polyurethane foam, polyethylene foam, silicone foam, polystyrene foam, EVA foam, etc.

[0072] In specific implementation, such as Figure 11 As shown, the display module also includes an upper structure 50 located on the light-emitting side of the display panel 100 (i.e., the side closer to the light-emitting direction Z1). The upper structure 50 specifically includes a polarizer 51, an optical adhesive layer 52, and a glass cover plate 53. In other embodiments, the display module may also include more film layer structures based on the above embodiments, all of which are within the protection scope of this disclosure.

[0073] Based on the same inventive concept, corresponding to any of the above embodiments, such as Figure 12 As shown, this application also provides a display device 2, including the display module 1 in any of the above embodiments.

[0074] The display device provided by the embodiments of the present disclosure utilizes the first sub-film layer and the second sub-film layer with different elastic modulus to splice to form the first film layer, thereby avoiding the generation of marks by absorbing the second sub-film layer with stronger deformation capacity while ensuring the structural strength of the display module, and improving the display effect of the display module.

[0075] Specifically, the display device can be a 3C electronic product of a computer (Computer) and its peripherals, communication and consumer electronics (Consumer Electronics), such as a smart phone, a notebook computer, a tablet computer, a smart wearable device, a household appliance, a game device, and the like. In addition, the display device can also be applied to automobile electronics and other types of electronic devices.

[0076] The device of the above embodiments includes the corresponding display module in any of the above embodiments, and has the beneficial effects of the corresponding embodiments, which are not described here again.

[0077] It should be noted that, in this document, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action, without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without more limitations, an element defined by the statement "comprising a" does not exclude the existence of additional identical elements in the process, method, article, or apparatus including the above element.

[0078] The above is only a specific embodiment of the present disclosure, enabling those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to these embodiments described herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display module, characterized in that, include: Display panel; The first film layer is located on the backlight side of the display panel; The first membrane layer is grounded; The circuit board is located on the side of the first film layer away from the display panel; The second film layer is located on the side of the first film layer that is close to the display panel. The first film layer and the second film layer together constitute a composite film layer. The first film layer includes a first sub-film layer and a second sub-film layer. The elastic modulus of the material of the first sub-film layer is greater than that of the material of the second sub-film layer. The first sub-film layer and the second sub-film layer are at least partially located on the same horizontal plane parallel to the plane of the display panel. In a direction perpendicular to the plane of the display panel, the second sub-film layer at least partially overlaps with the circuit board.

2. The display module according to claim 1, characterized in that, Both the first sub-film layer and the second sub-film layer include conductive materials.

3. The display module according to claim 2, characterized in that, The first sub-film layer comprises metal.

4. The display module according to claim 2, characterized in that, The second sub-film layer includes conductive foam.

5. The display module according to claim 1, characterized in that, In a direction perpendicular to the plane of the display panel, the entire area of ​​the circuit board overlaps with the second sub-film layer.

6. The display module according to claim 1, characterized in that, Also includes: An adhesive backing layer is located between the circuit board and the first film layer; The elastic modulus of the material of the first sub-film layer is greater than that of the material elastic modulus of the adhesive backing layer.

7. The display module according to claim 6, characterized in that, The adhesive layer includes a first adhesive layer and a second adhesive layer; The display panel further includes a support layer, which is located between the first adhesive layer and the second adhesive layer; The material hardness of the support layer is greater than that of the adhesive backing layer.

8. The display module according to claim 6 or 7, characterized in that, The adhesive backing layer includes foam.

9. The display module according to claim 7, characterized in that, The support layer comprises polyester.

10. The display module according to claim 1, characterized in that, In a direction perpendicular to the plane of the display panel, the thickness of the first film layer is between 30 micrometers and 50 micrometers.

11. The display module according to claim 6, characterized in that, The thickness of the adhesive layer is between 30 micrometers and 80 micrometers in a direction perpendicular to the plane of the display panel.

12. The display module according to claim 7, characterized in that, In a direction perpendicular to the plane of the display panel, the total thickness of the first adhesive layer, the second adhesive layer, and the support layer is between 30 micrometers and 80 micrometers.

13. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 12.

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