Display module, preparation method thereof and display device

Abstract

The invention provides a display module and a preparation method thereof, and a display device, and relates to the field of display technology, the display module comprises a substrate, a light emitting assembly, a connecting piece and a wire; the light-emitting assembly is arranged on the substrate, the connecting piece is electrically connected with the light-emitting assembly, the connecting piece comprises a first connecting part and a second connecting part which are stacked, the second connecting part is arranged on the substrate, the first connecting part is arranged on the surface, away from the substrate, of the second connecting part, and the first connecting part covers a first part of the second connecting part; the wire comprises a main body and a contact part, the contact part is electrically connected to the main body, and one end of the contact part away from the main body is electrically connected with the first connecting part; the surface, facing the substrate, of the contact part covers the second part of the second connecting part, and the thickness of the contact part is smaller than that of the first connecting part in the thickness direction of the substrate. The display module can reduce the possibility of short circuit and other conditions of the light-emitting assembly and the wiring, and normal use of the display module is guaranteed.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a preparation method thereof, and a display device. Background Art

[0002] Light-Emitting Diode (LED) display modules have the characteristics of high brightness, low power consumption and simple driving method, and are widely used in display devices.

[0003] The display module includes a substrate, a light-emitting component and a driver chip. The light-emitting component is disposed on a first surface of the substrate, and the driver chip is disposed on a second surface of the substrate. The driver chip is electrically connected to the light-emitting component through wiring to control the light-emitting process of the light-emitting component. However, the light-emitting component and the wiring are prone to short circuits, thereby affecting the normal use of the display module. Summary of the invention

[0004] The embodiments of the present application provide a display module and a method for preparing the same, and a display device, so as to solve the problem that light-emitting components and wiring are prone to short circuits, thereby affecting the normal use of the display module.

[0005] The embodiment of the present application provides a display module, including a substrate, a connector and wiring;

[0006] The connector is used to electrically connect the light-emitting component, and includes a first connector and a second connector that are stacked, the second connector is disposed on the substrate, the first connector is disposed on a surface of the second connector that is away from the substrate, and the first connector covers a first portion of the second connector;

[0007] The routing includes a main body and a contact portion, the contact portion is electrically connected to the main body, and one end of the contact portion facing away from the main body is electrically connected to the first connection portion; the contact portion covers the second part of the second connection portion on a surface facing the substrate, and the first part of the second connection portion and the second part of the second connection portion are arranged in a direction perpendicular to the thickness of the substrate.

[0008] By adopting the above technical solution, the connector is arranged to include a first connecting portion and a second connecting portion arranged in a stacked manner, and the first connecting portion covers a first portion of the second connecting portion; when forming a routing, an initial routing can be formed by deposition or the like, a portion of the initial routing covering the surface of the substrate forms a main body, a portion of the initial routing covering the second portion of the second connecting portion away from the surface of the substrate forms a contact portion, and the remaining portion of the initial routing covers the surface of the first connecting portion away from the second connecting portion; then, the portion of the initial routing covering the first connecting portion is removed, so that the main body and the contact portion form a routing;

[0009] In the thickness direction of the substrate, the thickness of the contact portion is smaller than the thickness of the first connecting portion, so that a step is formed between the portion of the initial routing covering the first connecting portion away from the surface of the second connecting portion and the portion of the initial routing covering the second portion of the second connecting portion away from the surface of the substrate, thereby reducing the difficulty of removing the portion of the initial routing covering the first connecting portion, reducing the possibility of the initial routing connecting multiple routings or multiple light-emitting components, thereby reducing the possibility of short circuits between the light-emitting components and the routings, and ensuring the normal use of the display module.

[0010] In some possible implementations, in a thickness direction of the substrate, a thickness of the contact portion is smaller than a thickness of the first connecting portion.

[0011] In some possible implementations, the first portion of the second connecting portion and the second portion of the second connecting portion are arranged along a direction perpendicular to the thickness of the substrate;

[0012] In a direction perpendicular to the thickness of the substrate, the end of the first connection portion facing away from the wiring is flush with the first part of the second connection portion; and / or the second part of the second connection portion is protruding relative to the first connection portion toward one end of the wiring;

[0013] Preferably, in a direction perpendicular to the thickness of the substrate, a length of the second portion of the second connecting portion is greater than or equal to 10 micrometers.

[0014] In some possible implementations, the first portion of the second connecting portion and the second portion of the second connecting portion are arranged along a first direction;

[0015] In the first direction, an end of the first portion of the second connection portion facing away from the wiring is flush with the first connection portion; and / or a length of the second portion of the second connection portion is greater than or equal to 10 micrometers.

[0016] In some possible implementations, the connector further includes a third connecting portion, and the third connecting portion is disposed on the substrate;

[0017] A first portion of the third connection portion is connected to the second connection portion away from a surface of the substrate, and a second portion of the third connection portion is connected to the body away from a surface of the substrate.

[0018] In some possible implementations, at least a portion of the connecting element is configured as a multi-layer structure.

[0019] In some possible implementations, the display module has a display area and a non-display area disposed outside the display area; the connecting member and the wiring are disposed in the non-display area;

[0020] The display module further includes a light-emitting component, the light-emitting component is located in the display area, the light-emitting component includes a conductive layer and a connecting layer, the conductive layer is disposed on the substrate, a surface of the conductive layer away from the substrate is connected to the connecting layer, and the conductive layer is electrically connected to the connecting member;

[0021] At least one of the first connection portion and the second connection portion is disposed in the same layer and the same material as the conductive layer or the connection layer.

[0022] The present application also provides a method for preparing a display module, including:

[0023] providing a substrate;

[0024] A connecting member and a light-emitting component are formed; the connecting member comprises a first connecting portion and a second connecting portion which are stacked, the second connecting portion is arranged on the substrate, the first connecting portion is arranged on a surface of the second connecting portion which is away from the substrate, and the first connecting portion covers a first part of the second connecting portion;

[0025] The routing line is formed; the routing line includes a main body and a contact portion, the contact portion is electrically connected to the main body, and one end of the contact portion facing away from the main body is electrically connected to the first connection portion; the contact portion covers the second part of the second connection portion on the surface facing the substrate.

[0026] By adopting the above technical solution, when forming a routing, an initial routing can be formed by deposition or the like, a portion of the initial routing covering the surface of the substrate forms a main body, a portion of the initial routing covering the surface of the second portion of the second connection part away from the substrate forms a contact portion, and the remaining portion of the initial routing covers the surface of the first connection part away from the second connection part; then, the portion of the initial routing covering the first connection part is removed, so that the main body and the contact portion form a routing;

[0027] In the thickness direction of the substrate, the thickness of the contact portion is smaller than the thickness of the first connecting portion, so that a step is formed between the portion of the initial routing covering the first connecting portion away from the surface of the second connecting portion and the portion of the initial routing covering the second portion of the second connecting portion away from the surface of the substrate, thereby reducing the difficulty of removing the portion of the initial routing covering the first connecting portion, reducing the possibility of the initial routing connecting multiple routings or multiple light-emitting components, thereby reducing the possibility of short circuits between the light-emitting components and the routings, and ensuring the normal use of the display module.

[0028] In some possible implementations, forming the routing includes:

[0029] forming a protective layer; the protective layer covers a surface of the first connecting portion away from the first portion of the second connecting portion;

[0030] forming an initial routing line; wherein a first portion of the initial routing line covers a surface of the substrate, a second portion of the initial routing line covers a second portion of the second connecting portion, and a third portion of the initial routing line covers a surface of the protective layer away from the first connecting portion;

[0031] The protective layer and the third part of the initial routing are removed, the first part of the initial routing forms the main body, the second part of the initial routing forms the contact part, the thickness of the contact part is less than the thickness of the first connecting part, and the main body and the contact part form the routing.

[0032] In some possible implementations, the display module has a display area and a non-display area disposed outside the display area;

[0033] Forming the connecting member includes:

[0034] forming a metal layer, wherein the metal layer is disposed on the surface of the substrate, a first portion of the metal layer is located in the display area, and a second portion of the metal layer is located in the non-display area;

[0035] Part of the first metal layer and part of the second metal layer are removed, the remaining first metal layer in the display area is used to form the light-emitting component, and the remaining second metal layer in the non-display area forms the connecting member.

[0036] An embodiment of the present application further provides a display device, comprising any of the display modules described above.

[0037] Since the display device includes any of the display modules described above, the advantages of the display device including any of the display modules described above can be specifically described in the above related descriptions and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0039] Figure 1 A schematic diagram of the structure of a display module provided in an embodiment of the present application;

[0040] Figure 2 Provided in the embodiments of this application Figure 1 A partial enlarged view of the central non-display area;

[0041] Figure 3 A schematic diagram of the structure of a display module including a third connecting portion provided in an embodiment of the present application;

[0042] Figure 4A schematic structural diagram of a display module including another implementation of a third connecting portion provided in an embodiment of the present application;

[0043] Figure 5 A schematic diagram of a process for preparing a display module provided in an embodiment of the present application;

[0044] Figure 6 A schematic diagram of the structure of a substrate provided in an embodiment of the present application;

[0045] Figure 7 A schematic diagram of a structure for forming a metal layer provided in an embodiment of the present application;

[0046] Figure 8 The embodiment of the present application provides Figure 7 A schematic diagram of a structure in which a conductive layer, a connecting layer, a first connecting portion and a second connecting portion are formed on the basis of a metal layer;

[0047] Fig. 9 A schematic diagram of a structure for forming a partial metal layer provided in an embodiment of the present application;

[0048] Fig.10 The embodiment of the present application provides Fig. 9 A schematic diagram of a structure in which a conductive layer and a first connecting portion are formed on the basis of a metal layer;

[0049] Fig.11 A schematic diagram of a structure for forming a protective layer provided in an embodiment of the present application;

[0050] Fig.12 A schematic diagram of a structure for forming an initial routing provided in an embodiment of the present application;

[0051] Fig.13 A schematic diagram of the structure of the initial routing provided in an embodiment of the present application.

[0052] Description of reference numerals:

[0053] 10. Display area; 20. Non-display area;

[0054] 100. Substrate;

[0055] 200, connector;

[0056] 210, first connection part; 220, second connection part; 230, third connection part;

[0057] 300, routing;

[0058] 310, main body; 320, contact portion; 330, initial routing;

[0059] 400, protective layer;

[0060] 500, driver chip;

[0061] 600, light emitting component;

[0062] 610, conductive layer; 620, connecting layer;

[0063] 700. Metal layer.

[0064] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0065] As described in the background technology, the display module includes a substrate, a light-emitting component and a driving chip. The light-emitting component is arranged on the first surface of the substrate, and the driving chip is arranged on the second surface of the substrate. The driving chip is electrically connected to the light-emitting component through a wiring to control the light-emitting process of the light-emitting component. The display module also includes a connector, a first end of the connector is electrically connected to an end of the wiring away from the driving chip, and a second end of the connector is electrically connected to the light-emitting component, so that the wiring is electrically connected to the light-emitting component through the connector;

[0066] In the process of forming the routing, it is usually necessary to form a protective layer on the surface of the connector facing away from the substrate, and then form the initial routing by deposition or the like, with part of the initial routing covering the surface of the substrate and part of the initial routing covering the surface of the protective layer facing away from the substrate; then the protective layer and the part of the initial routing covered by the protective layer are removed to form the remaining part of the initial routing; however, since the part of the initial routing covering the surface of the substrate is connected to the part of the initial routing covering the protective layer, when the protective layer and the part of the initial routing covering the protective layer are removed, the part of the initial routing covering the surface of the substrate is prone to the possibility of connecting multiple routings or multiple light-emitting components at the same time, making the light-emitting components and the routing prone to short circuits, thereby affecting the normal use of the display module.

[0067] In order to solve the above technical problems, the embodiments of the present application provide a display module and a preparation method thereof, and a display device. The display module is configured by setting a connecting member to include a first connecting portion and a second connecting portion arranged in a stacked manner, wherein the first connecting portion covers a first portion of the second connecting portion; when forming a wiring, an initial wiring can be formed by deposition or the like, wherein a portion of the initial wiring covering the surface of a substrate forms a main body, a portion of the initial wiring covering the second portion of the second connecting portion on a surface away from the substrate forms a contact portion, and the remaining portion of the initial wiring covers the surface of the first connecting portion away from the second connecting portion; and then the portion of the initial wiring covering the first connecting portion is removed, so that the main body and the contact portion form a wiring;

[0068] In the thickness direction of the substrate, the thickness of the contact portion is smaller than the thickness of the first connecting portion, so that a step is formed between the portion of the initial routing covering the first connecting portion away from the surface of the second connecting portion and the portion of the initial routing covering the second portion of the second connecting portion away from the surface of the substrate, thereby reducing the difficulty of removing the portion of the initial routing covering the first connecting portion, reducing the possibility of the initial routing connecting multiple routings or multiple light-emitting components, thereby reducing the possibility of short circuits between the light-emitting components and the routings, and ensuring the normal use of the display module.

[0069] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0070] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0071] Reference Figure 1 and Figure 2 The embodiment of the present application provides a display module, including a substrate 100, a light-emitting component 600, a connector 200 and a wiring 300, wherein the connector 200 and the light-emitting component 600 are both arranged on the first surface of the substrate 100, the connector 200 is electrically connected to the light-emitting component 600, and the connector 200 is electrically connected to the wiring 300, and the end of the wiring 300 away from the connector 200 is electrically used to connect to the driving chip 500, so that the driving chip 500 is electrically connected to the light-emitting component 600 through the wiring 300 and the connector 200 in turn to control the light-emitting process of the light-emitting component 600.

[0072] Exemplarily, the display module may further include a driving chip 500, the light-emitting component 600 may be disposed on the first surface of the substrate 100, the driving chip 500 may be disposed on the second surface of the substrate 100, or the driving chip 500 may also be disposed at other positions of the substrate 100, and the embodiments of the present application do not impose further restrictions on this.

[0073] The display module has a display area 10 and a non-display area 20 arranged outside the display area 10; wherein, the light-emitting component 600 can be arranged in the display area 10, the connector 200 and the wiring 300 can be arranged in the non-display area 20, and the wiring 300 can extend from the first surface of the substrate 100 through the edge of the substrate 100 to the second surface of the substrate 100, so that the driving chip 500 arranged on the second surface of the substrate 100 can be electrically connected to the light-emitting component 600 located on the first surface of the substrate 100 through the wiring 300.

[0074] Reference Figure 1 and Figure 2 In some possible embodiments, the connector 200 may include a first connector 210 and a second connector 220 that are stacked, the second connector 220 being disposed on the substrate 100, the second connector 220 may include a first portion and a second portion that are connected to each other, the first portion of the second connector 220 and the second portion of the second connector 220 being arranged in a direction perpendicular to the thickness of the substrate 100, the first connector 210 being disposed on a surface of the second connector 220 that is away from the substrate 100, and the first connector 210 covering the first portion of the second connector 220.

[0075] Exemplarily, the routing 300 includes a main body 310 and a contact portion 320, and the main body 310 and the contact portion 320 are configured as portions of the routing 300 located on the first surface of the substrate 100, and the main body 310 can be configured as a portion of the routing 300 located on the first surface of the substrate 100 that is not covered by the second connecting portion 220.

[0076] The contact portion 320 is electrically connected to the main body 310, and one end of the contact portion 320 facing away from the main body 310 is electrically connected to the first connection portion 210; the surface of the contact portion 320 facing the substrate 100 covers the second part of the second connection portion 220, and in the thickness direction of the substrate 100, the thickness of the contact portion 320 is less than the thickness of the first connection portion 210.

[0077] It is easy to understand that when forming the routing 300, the initial routing 330 can be formed by deposition or the like, the portion of the initial routing 330 covering the surface of the substrate 100 forms the main body 310, the portion of the initial routing 330 covering the second portion of the second connection portion 220 facing away from the surface of the substrate 100 forms the contact portion 320, and the remaining portion of the initial routing 330 covers the surface of the first connection portion 210 facing away from the second connection portion 220; since the thickness of the contact portion 320 is less than the thickness of the first connection portion 210, a gap is formed between the portion of the initial routing 330 covering the surface of the first connection portion 210 facing away from the second connection portion 220 and the portion of the initial routing 330 covering the second portion of the second connection portion 220 facing away from the surface of the substrate 100, thereby reducing the possibility of the initial routing 330 connecting multiple routings 300 or multiple light-emitting components 600 at the same time.

[0078] In some possible embodiments, the first portion of the second connection portion 220 and the second portion of the second connection portion 220 can be arranged along a first direction (i.e., the X direction in the figure), and the first direction can be set to be a direction from the display area 10 to the non-display area 20, that is, the second portion of the second connection portion 220 is away from the display area 10 relative to the first portion of the second connection portion 220; in the first direction, the wiring 300 can be set at one end of the connector 200 away from the light-emitting component 600.

[0079] In a plane parallel to the first direction and perpendicular to the thickness direction of the substrate 100 as a cross-section, the cross-sectional shape of the first connection part 210 and the cross-sectional shape of the second connection part 220 can both be set to a rectangle, or the cross-sectional shape of the first connection part 210 can also be set to a trapezoid, and the side of the first connection part 210 facing away from the substrate 100 is set as the lower base of the trapezoid, and the side of the first connection part 210 close to the substrate 100 is set as the upper base of the trapezoid, so that it is easier to form a step difference between the partial initial routing 330 covering the first connection part 210 and the partial initial routing 330 covering the second part of the second connection part 220.

[0080] Exemplarily, in the first direction, the end of the first connection portion 210 facing away from the trace 300 can be flush with the first portion of the second connection portion 220, so that the formation process of the first connection portion 210 and the second connection portion 220 is more convenient; and / or, the length of the second portion of the second connection portion 220 can be greater than or equal to 10 microns, for example, the length of the second portion of the second connection portion 220 can be set to one of 10 microns, 12 microns, 14 microns, 16 microns, 18 microns and 20 microns, so that the surface of the contact portion 320 facing the substrate 100 can be stably attached to the second portion of the second connection portion 220.

[0081] In the thickness direction of the substrate 100, the difference between the thickness of the first connection portion 210 and the thickness of the contact portion 320 may be greater than or equal to 200 angstroms, and the thickness of the connector 200 may be set to be greater than or equal to 1000 angstroms. For example, the thickness of the first connection portion 210 may be set to 1200 angstroms, and the thickness of the contact portion 320 may be set to one of 500 angstroms, 600 angstroms, 700 angstroms, 800 angstroms, 900 angstroms, and 1000 angstroms, so as to reduce the possibility that the portion of the initial trace 330 covering the second portion of the second connection portion 220 is connected to the portion of the initial trace 330 covering the first connection portion 210.

[0082] Exemplarily, in the thickness direction of the substrate 100, the surface of the contact portion 320 facing away from the substrate 100 can be flush with the main body 310 to make the structure of the trace 300 more stable; and / or, in the thickness direction of the substrate 100, the thickness of the main body 310 can be set to be greater than or equal to 1 micron, for example, the thickness of the main body 310 can be set to one of 1 micron, 1.2 microns, 1.4 microns, 1.6 microns, 1.8 microns and 2 microns.

[0083] It is easy to understand that in the thickness direction of the substrate 100, the thickness of the connector 200 is greater than the thickness of the main body 310. When the connector 200 is composed of a first connecting portion 210 and a second connecting portion 220, the thickness of the second connecting portion 220 is greater than the thickness of the first connecting portion 210, and the first end of the second connecting portion 220 facing away from the light-emitting component 600 abuts against the main body 310 of the wiring 300 to increase the contact area between the second connecting portion 220 and the wiring 300, improve the electrical contact quality between the connector 200 and the wiring 300, and improve the use effect of the connector 200.

[0084] Reference Figure 3 and Figure 4 In some possible implementations, the connector 200 may further include a third connector 230, and the third connector 230 may be disposed between the substrate 100 and the second connector 220. Figure 4 In the first direction, both ends of the third connection portion 230 may be flush with the second connection portion 200 .

[0085] Or, refer to Figure 3 In the first direction, the third connection part 230 may include a first part and a second part connected to each other, and the end of the first part of the third connection part 230 away from the wiring 300 may be flush with the first part of the second connection part 220, the first part of the third connection part 230 away from the surface of the substrate 100 is connected to the second connection part 220, and the second part of the third connection part 230 away from the surface of the substrate 100 is connected to the main body 310.

[0086] Exemplarily, at least part of the connector 200 is configured as a multi-layer structure. For example, the connector 200 is configured as follows: at least one of the first connecting part 210, the second connecting part 220 and the third connecting part 230 can be configured as a multi-layer structure to facilitate the molding process of the connector 200.

[0087] For example, the first connection part 210, the second connection part 220 and the third connection part 230 are all set to a multi-layer structure, and a multi-layer metal layer 700 can be formed on the surface of the substrate 100 by deposition or the like, and then a portion of each metal layer 700 is removed along the thickness direction of the multi-layer metal layer 700 by etching or the like, so that the remaining portion of the multi-layer metal layer 700 forms the first connection part 210, the second connection part 220 and the third connection part 230, thereby making the molding process of the first connection part 210, the second connection part 220 and the third connection part 230 more convenient.

[0088] The light emitting component 600 may include a conductive layer 610 and a connecting layer 620, as well as a light emitting unit, etc. The conductive layer 610 is disposed on the substrate 100, the connecting layer 620 is electrically connected to the surface of the conductive layer 610 away from the substrate 100, and the surface of the connecting layer 620 away from the conductive layer 610 can be used to electrically connect the light emitting unit, so that the conductive layer 610 is electrically connected to the light emitting unit through the connecting layer 620;

[0089] The connector 200 is electrically connected to the conductive layer 610, so that the driving chip 500 can be electrically connected to the conductive layer 610 through the wiring 300 and the connector 200. The connector 200 is configured as follows: at least one of the first connecting portion 210 and the second connecting portion 220 is disposed on the conductive layer 610 or the connecting layer 620 in the same layer and material. For example, the first connecting portion 210 can be disposed on the conductive layer 610 in the same layer and material, and the second connecting portion 220 can be disposed on the connecting layer 620 in the same layer and material.

[0090] In summary, when forming the wiring 300, the initial wiring 330 can be formed by deposition or the like, the initial wiring 330 covering the surface of the substrate 100 forms the main body 310, the initial wiring 330 covering the second part of the second connection portion 220 away from the surface of the substrate 100 forms the contact portion 320, and the remaining initial wiring 330 covers the surface of the first connection portion 210 away from the second connection portion 220; then, the initial wiring 330 covering the first connection portion 210 is removed, so that the main body 310 and the contact portion 320 form the wiring 300;

[0091] In the thickness direction of the substrate 100, the thickness of the contact portion 320 is less than the thickness of the first connecting portion 210, so that a gap is formed between the portion of the initial routing 330 covering the first connecting portion 210 away from the surface of the second connecting portion 220 and the portion of the initial routing 330 covering the second portion of the second connecting portion 220 away from the surface of the substrate 100, thereby reducing the difficulty of removing the portion of the initial routing 330 covering the first connecting portion 210, and reducing the possibility of the initial routing 330 connecting multiple routings 300 or multiple light-emitting components 600 at the same time, thereby reducing the possibility of short circuits between the light-emitting components 600 and the routing 300, thereby ensuring the normal use of the display module.

[0092] Reference Figure 5 , the embodiment of the present application also provides a method for preparing a display module, including: S100, providing a substrate;

[0093] Reference Figure 1 and Figure 6 , exemplarily, the display module has a display area 10, and a non-display area 20 arranged outside the display area 10. The substrate 100 has a first surface, and a second surface opposite to the first surface. The first surface of the substrate 100 can be used to support subsequent structures such as the light-emitting component 600, the connector 200, and the main body 310 of the wiring 300, wherein the light-emitting component 600 is located in the display area 10, and the connector 200 and the wiring 300 are located in the non-display area 20; the second surface of the substrate 100 can be used to support the driving chip 500, so that the driving chip 500 located on the second surface of the substrate 100 can be electrically connected to the light-emitting component 600 through the wiring 300 and the connector 200.

[0094] After providing the substrate 100, the preparation method further includes: S200, forming a connecting member;

[0095] Reference Figure 6 and Figure 7 In some possible implementations, the connector 200 includes a first connector 210 and a second connector 220 that are stacked, the second connector 220 is disposed on the substrate 100, and the second portion includes a first portion and a second portion that are connected; the first connector 210 is disposed on a surface of the second connector 220 that is away from the substrate 100, the first connector 210 covers the first portion of the second connector 220, and the second portion of the second connector 220 is exposed;

[0096] Exemplarily, forming the connector 200 includes: forming a metal layer 700;

[0097] Reference Figure 7 and Figure 8 , a metal layer 700 can be formed on the surface of the substrate 100 by physical vapor deposition (PVD) and other methods, so that the first part of the metal layer 700 is located in the display area 10, and the second part of the metal layer 700 is located in the non-display area 20. The first part of the metal layer 700 can be used to form the light-emitting component 600, and the second part of the metal layer 700 can be used to form the first connecting part 210 and the second connecting part 220, and the material of the metal layer 700 can be set to aluminum, copper or other materials.

[0098] It should be noted that the number of metal layers 700 can be set to one or more, and the number of metal layers 700 can be adjusted according to the thickness of the metal layer 700. For example, when the thickness of the metal layer 700 is large, the number of metal layers 700 can be set to multiple, that is, the metal layer 700 is formed by multiple depositions. When the thickness of the metal layer 700 is small, the number of metal layers 700 can be set to one, that is, the metal layer 700 is formed by one deposition.

[0099] Reference Figure 8 and Fig. 9 After forming the metal layer 700, the preparation method further includes: removing part of the first metal layer 700 and part of the second metal layer 700, and the remaining first metal layer 700 located in the display area 10 is used to form the light-emitting component 600, and the remaining second metal layer 700 located in the non-display area 20 forms the connector 200, so as to facilitate the molding process of the connector 200 and the light-emitting component 600.

[0100] Exemplarily, part of the first metal layer 700 and part of the second metal layer 700 can be removed along the thickness direction of the metal layer 700 by etching or the like, and the remaining first metal layer 700 located in the display area 10 forms a conductive layer 610 and a connecting layer 620; the remaining second metal layer 700 located in the non-display area 20 forms a first connecting portion 210 and a second connecting portion 220.

[0101] Reference Fig.10 It should be noted that a metal layer 700 can be formed on the surface of the substrate 100 by deposition or the like, wherein the first portion of the metal layer 700 is located in the display area 10 and the second portion of the metal layer 700 is located in the non-display area 20; then part of the first portion of the metal layer 700 and part of the second portion of the metal layer 700 are removed, so that the remaining first portion of the metal layer 700 located in the display area 10 forms the conductive layer 610, and the remaining second portion of the metal layer 700 located in the non-display area 20 forms the second connecting portion 220.

[0102] Subsequently, a third metal layer 700 can be formed on the surface of the conductive layer 610 facing away from the substrate 100 and the surface of the first connecting part 210 facing away from the substrate 100 by deposition or the like, so that the third metal layer 700 covering the conductive layer 610 forms the connecting layer 620, and the third metal layer 700 covering the second connecting part 220 forms the first connecting part 210, thereby making the formation process of the connecting part 200 and the light-emitting component 600 more convenient.

[0103] It is easy to understand that when the connecting member 200 also includes a third connecting portion 230, a portion of the thickness of the second metal layer 700 is removed, and the remaining second metal layer 700 located in the non-display area 20 is used to form a second connecting portion 220 and a third connecting portion 230 connected to each other, and the embodiments of the present application are not repeated here.

[0104] In some possible implementations, after forming the connector 200 , the preparation method further includes: S300 , forming a routing line;

[0105] Reference Figure 1 , Fig.11 and Fig.12 The trace 300 includes a main body 310 and a contact portion 320. The main body 310 is formed on the first surface of the substrate 100. The contact portion 320 is electrically connected to the main body 310. One end of the contact portion 320 facing away from the main body 310 is electrically connected to the first connection portion 210. The surface of the contact portion 320 facing the substrate 100 covers the second part of the second connection portion 220. In the thickness direction of the substrate 100, the thickness of the contact portion 320 is less than the thickness of the first connection portion 210.

[0106] Exemplarily, forming the trace 300 includes: forming a protection layer 400;

[0107] Reference Fig.11 and Fig.12 The protective layer 400 can be set as a thin film structure, so that the protective layer 400 covers the surface of the first connecting part 210 away from the first part of the second connecting part 220. The protective layer 400 can also cover the surface of the light-emitting component 600 away from the substrate 100, so as to provide a certain protection for the light-emitting component 600 through the protective layer 400.

[0108] The protective layer 400 can be formed on the surface of the first connecting part 210 away from the second connecting part 220 and the surface of the light-emitting component 600 away from the substrate 100 by deposition or the like; or, when the protective layer 400 is set to a thin film structure, the protective layer 400 can also be formed on the surface of the first connecting part 210 away from the first part of the second connecting part 220 and the surface of the light-emitting component 600 away from the substrate 100 by bonding or the like, so as to facilitate the molding process of the protective layer 400 and the subsequent removal process of the protective layer 400.

[0109] Exemplarily, after forming the protection layer 400 , the preparation method further includes: forming an initial wiring 330 ;

[0110] Reference Fig.12 and Fig.13, an initial wiring 330 may be formed on the surface of the substrate 100 by physical vapor deposition or chemical vapor deposition (CVD), wherein a first portion 330a of the initial wiring 330 covers the surface of the substrate 100, a second portion 330b of the initial wiring 330 covers the second portion of the second connection portion 220, and a third portion 330c of the initial wiring 330 covers the surface of the protective layer 400 away from the first connection portion 210;

[0111] It is easy to understand that, in the thickness direction of the substrate 100, the surface of the first part 330a of the initial routing 330 facing away from the substrate 100 can be flush with the surface of the second part 330b of the initial routing 330 facing away from the second connecting portion 220, and the thickness of the second part of the initial routing 330 is less than the thickness of the first connecting portion 210, so that a step is formed between the third part 330c of the initial routing 330 and the second part 330b of the initial routing 330.

[0112] It should be noted that the initial routing 330 may also include a fourth part 330d. The fourth part 330d of the initial routing 330 may be formed on the side of the substrate 100 and the second surface of the substrate 100. The first end of the fourth part 330d of the initial routing 330 is electrically connected to the driving chip 500, and the second end of the fourth part 330d of the initial routing 330 is electrically connected to the first part of the initial routing 330.

[0113] Exemplarily, after forming the initial routing 330, the preparation method further includes: removing the protective layer 400 and the third part 330c of the initial routing 330, the first part 330a of the initial routing 330 forms the main body 310, the second part 330b of the initial routing 330 forms the contact part 320, and the main body 310 and the contact part 320 form the routing 300.

[0114] The protective layer 400 and the third portion 330c of the initial routing 330 covering the surface of the protective layer 400 can be removed by peeling off the protective layer 400 or other methods, so that the surface of the light-emitting component 600 and the first connecting portion 210 facing away from the substrate 100 is exposed. Since a step is formed between the third portion 330c of the initial routing 330 and the second portion 330b of the initial routing 330, the difficulty of removing the third portion 330c of the initial routing 330 covering the first connecting portion 210 is reduced, thereby reducing the possibility of the initial routing 330 connecting multiple routings 300 or multiple light-emitting components 600.

[0115] In summary, when forming the wiring 300, the initial wiring 330 can be formed by deposition or the like, the initial wiring 330 covering the surface of the substrate 100 forms the main body 310, the initial wiring 330 covering the second part of the second connection portion 220 away from the surface of the substrate 100 forms the contact portion 320, and the remaining initial wiring 330 covers the surface of the first connection portion 210 away from the second connection portion 220; then, the initial wiring 330 covering the first connection portion 210 is removed, so that the main body 310 and the contact portion 320 form the wiring 300;

[0116] In the thickness direction of the substrate 100, the thickness of the contact portion 320 is less than the thickness of the first connecting portion 210, so that a gap is formed between the portion of the initial routing 330 covering the first connecting portion 210 away from the surface of the second connecting portion 220 and the portion of the initial routing 330 covering the second portion of the second connecting portion 220 away from the surface of the substrate 100, thereby reducing the difficulty of removing the portion of the initial routing 330 covering the first connecting portion 210, reducing the possibility of the initial routing 330 connecting multiple routings 300 or multiple light-emitting components 600, thereby reducing the possibility of short circuits between the light-emitting components 600 and the routing 300, and ensuring the normal use of the display module.

[0117] The embodiment of the present application also provides a display device, including the display module described in any of the above embodiments. Since the display device includes the display module described in any of the above embodiments, the advantages of the display device including the display module described in any of the above embodiments can be specifically referred to the above related description, which will not be repeated here.

[0118] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0119] In the description of the present invention, it should be understood that the terms "including" and "having" and any variations thereof used herein are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0120] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense, for example, it can be fixedly connected, detachably connected, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, and it can make the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, the terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

[0121] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display module, characterized in that: Including substrate, light-emitting components, connectors and wiring; The light-emitting component is disposed on the substrate, the connector is electrically connected to the light-emitting component, the connector includes a first connecting portion and a second connecting portion which are stacked, the second connecting portion is disposed on the substrate, the first connecting portion is disposed on a surface of the second connecting portion which is away from the substrate, and the first connecting portion covers a first portion of the second connecting portion; The routing includes a main body and a contact portion, the contact portion is electrically connected to the main body, and one end of the contact portion facing away from the main body is electrically connected to the first connection portion; the contact portion covers the second part of the second connection portion on a surface facing the substrate, and the first part of the second connection portion and the second part of the second connection portion are arranged in a direction perpendicular to the thickness of the substrate.

2. The display module according to claim 1, characterized in that: In the thickness direction of the substrate, the thickness of the contact portion is smaller than the thickness of the first connecting portion; Preferably, in the thickness direction of the substrate, the difference between the thickness of the first connecting portion and the thickness of the contact portion is greater than or equal to 200 angstroms.

3. The display module according to claim 2, characterized in that: In a direction perpendicular to the thickness of the substrate, the end of the first connection portion facing away from the wiring is flush with the first part of the second connection portion; and / or the second part of the second connection portion is protruding relative to the first connection portion toward one end of the wiring; Preferably, in a direction perpendicular to the thickness of the substrate, a length of the second portion of the second connecting portion is greater than or equal to 10 micrometers.

4. The display module according to claim 1, characterized in that: The connecting member further includes a third connecting portion, and the third connecting portion is arranged on the substrate; A first portion of the third connection portion is connected to the second connection portion at a surface facing away from the substrate, and a second portion of the third connection portion is connected to the main body at a surface facing away from the substrate.

5. The display module according to claim 1 or 4, characterized in that: At least a portion of the connecting element is configured as a multi-layer structure.

6. The display module according to any one of claims 1 to 5, characterized in that: The display module has a display area and a non-display area arranged outside the display area; the connecting member and the wiring are arranged in the non-display area; The display module further includes a light-emitting component, the light-emitting component is located in the display area, the light-emitting component includes a conductive layer and a connecting layer, the conductive layer is disposed on the substrate, a surface of the conductive layer away from the substrate is connected to the connecting layer, and the conductive layer is electrically connected to the connecting member; Preferably, at least one of the first connecting portion and the second connecting portion is provided in the same layer and the same material on the conductive layer or the connecting layer.

7. A method for preparing a display module, characterized in that: include: providing a substrate; A connector and a light-emitting component are formed; the connector is electrically connected to the light-emitting component, the connector includes a first connector and a second connector that are stacked, the second connector is disposed on the substrate, the first connector is disposed on a surface of the second connector that is away from the substrate, and the first connector covers a first portion of the second connector; A wiring is formed; the wiring includes a main body and a contact portion, the contact portion is electrically connected to the main body, and one end of the contact portion facing away from the main body is electrically connected to the first connection portion; the contact portion covers the second part of the second connection portion on the surface facing the substrate.

8. The method for preparing a display module according to claim 7, characterized in that: Forming the routing includes: forming a protective layer; the protective layer covers a surface of the first connecting portion away from the first portion of the second connecting portion; forming an initial routing line; wherein a first portion of the initial routing line covers a surface of the substrate, a second portion of the initial routing line covers a second portion of the second connecting portion, and a third portion of the initial routing line covers a surface of the protective layer away from the first connecting portion; The protective layer and the third part of the initial routing are removed, the first part of the initial routing forms the main body, the second part of the initial routing forms the contact part, the thickness of the contact part is less than the thickness of the first connecting part, and the main body and the contact part form the routing.

9. The method for preparing a display module according to claim 7, characterized in that: The display module has a display area and a non-display area arranged outside the display area; Forming the connecting piece includes: forming a metal layer, wherein the metal layer is disposed on the surface of the substrate, a first portion of the metal layer is located in the display area, and a second portion of the metal layer is located in the non-display area; Part of the first metal layer and part of the second metal layer are removed, the remaining first metal layer in the display area is used to form the light-emitting component, and the remaining second metal layer in the non-display area forms the connecting member.

10. A display device, characterized in that: Comprising a display module as described in any one of claims 1-6.

Images