Glass cover plate, preparation method thereof and electronic equipment

Abstract

The invention relates to the technical field of electronic equipment, in particular to a glass cover plate and a preparation method thereof and electronic equipment, the glass cover plate comprises a glass substrate and an optical film layer, and the refractive index of the optical film layer is 1.46-1.62; the optical film layer comprises a first material and a second material which are mixed in an atomic scale mode, the mass ratio of the first material to the second material is (1-8): 1, the refractive index of the first material is larger than 1.6, and the refractive index of the second material is smaller than 1.52. According to the glass cover plate, the optical film layer is formed by the first material with the refractive index higher than that of the glass substrate and the second material with the refractive index lower than that of the glass substrate in an atomic-scale mixing mode, the refractive index of the optical film layer is close to that of the glass substrate, and the light transmittance and the reflective rate of the glass substrate are not affected; the refractive index of the optical film layer does not change along with the thickness change; when the optical film layer is formed on the glass substrate of which the edge has radian, the glass substrate does not have color difference in appearance due to the thickness change of the film layer; and meanwhile, the appearance change of the glass cover plate is not caused when the film layer falls off.

Description

Glass cover plate and preparation method thereof, and electronic device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on August 10, 2022, with application number 202210957004.3 and application name “Glass cover, preparation method thereof, and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic equipment, and in particular to a glass cover plate and a preparation method thereof, and electronic equipment. Background Art

[0003] The glass display screen of an electronic device is usually provided with a glass cover on the outermost layer. If the glass cover of the electronic device is not provided with a protective film during use, scratches and other appearance defects will appear after long-term use. These defects will destroy the stress balance of the glass cover and cause the glass cover to have a reduced impact resistance.

[0004] In the prior art, sputtering is typically used to deposit a high-hardness optical film on the outer surface of a glass substrate to improve the scratch resistance of the glass cover. During the sputtering process, when the normal of the coated surface of the glass cover is parallel to the incident direction of the coating particles, the deposition rate is maximized, and a uniformly thick optical film layer can be obtained. However, when sputtering on a 3D glass substrate with a curved edge, the normal of the curved surface forms a certain angle α with the incident direction of the coating particles. The thickness of the optical film layer varies with α at a rate cosα, making it impossible to ensure consistent color between the flat and curved surfaces of the 3D glass substrate.

[0005] Application Contents

[0006] The purpose of this application is to provide a glass cover plate and a method for preparing the same. The method uses a first material with a higher refractive index than a glass substrate and a second material with a lower refractive index than the glass substrate. The first and second materials are mixed at the atomic level to form an optical film layer. The resulting optical film layer has a refractive index close to that of the glass substrate, has no effect on the transmittance and reflectivity of the glass substrate, and the refractive index of the optical film layer does not change with changes in the thickness of the optical film layer. When the optical film layer is formed on a glass substrate with a curved edge, the glass substrate will not have a different color due to changes in the thickness of the optical film layer. Furthermore, when the optical film layer is peeled off, it will not cause a change in the appearance of the glass cover plate. To achieve the above objectives, the present application adopts the following technical solutions:

[0007] In a first aspect of the present application, a glass cover plate is provided, comprising a glass substrate and an optical film layer located on a surface of the glass substrate, wherein the refractive index of the optical film layer is 1.46 to 1.62; the optical film layer comprises a first material and a second material mixed at an atomic level, wherein the mass ratio of the first material to the second material is (1 to 8):1, and the refractive index of the first material is greater than 1.6, and the refractive index of the second material is less than 1.52.

[0008] An optical film layer is formed on the outer surface of a glass substrate to prevent the glass substrate from being scratched or cracked during use, which would affect the aesthetics of the glass substrate. The above solution uses a first material with a refractive index greater than that of the glass substrate and a second material with a refractive index less than that of the glass substrate to form an optical film layer through atomic-level mixing. The refractive index of the formed optical film layer is close to that of the glass substrate, and thus changes in the thickness of the optical film layer will not affect the refractive index of the optical film layer. When the optical film layer is formed on a glass substrate with a curved edge, such as a 2.5D glass substrate or a 3D glass substrate, the glass cover plate will not appear to have a different color due to the difference in thickness between the bent portion and the base portion during the coating process. The optical film layer of the present application not only has scratch resistance but also improves the aesthetics of the electronic device using the glass cover plate.

[0009] In a feasible embodiment, the first material includes at least one of Si3N4, Al2O3, AlN, ZrO2, Nb2O5, Ta2O5, TiO2, etc.

[0010] In the above scheme, the first material has a refractive index greater than that of the glass substrate. The refractive index of the first material or glass substrate refers to the ratio of the speed of light propagating in a vacuum to the speed of light propagating through the first material or glass substrate. The higher the refractive index of the first material or glass substrate, the greater the ability of incident light to refract. Therefore, by mixing a first material with a high refractive index and a second material with a low refractive index, an optical film with a refractive index close to that of the glass substrate can be obtained.

[0011] In a feasible embodiment, the Vickers hardness of the first material is ≥1000 HV.

[0012] When applying an optical film to a glass substrate, in addition to considering the film's refractive index, the film also needs to have a certain degree of hardness. If the hardness of the optical film is low, it can be easily scratched during use, thus reducing the lifespan of the optical film. Therefore, the above solution uses a high-hardness first material to prepare the optical film. The resulting optical film has high hardness, is less susceptible to scratches and other defects during use, and has a long service life.

[0013] In a feasible embodiment, the second material includes at least one of SiO2, MgF2, LaF3, AlF3, etc.

[0014] In the above solution, the second material has a lower refractive index than the glass substrate. The refractive index of the second material or glass substrate refers to the ratio of the speed of light in a vacuum to the speed of light in the second material or glass substrate. The lower the refractive index of the second material or glass substrate, the weaker the ability of incident light to refract. Therefore, by mixing a first material with a high refractive index and a second material with a low refractive index, an optical film with a refractive index close to that of the glass substrate can be obtained.

[0015] In a feasible implementation manner, the thickness of the optical film layer is 500 nm to 5000 nm.

[0016] In the above scheme, the refractive index of the optical film layer does not change with thickness. That is, regardless of the thickness of the optical film layer, its refractive index remains close to that of the glass substrate. However, the thickness of the optical film layer still needs to be controlled during the coating process. If the thickness of the optical film layer is too high, the hardness is high and the scratch resistance is strong, which increases production costs. If the thickness of the optical film layer is too thin, the scratch resistance is reduced and the service life is shortened. The optical film layer thickness within the above range has the characteristics of high hardness and good aesthetics.

[0017] In a feasible implementation manner, using a Mohs hardness pen test, under a test force of 500g, the Mohs hardness of the optical film layer is ≥7.

[0018] In the above scheme, Mohs hardness refers to scratching the surface of the optical film layer being tested with a pyramidal diamond needle using the scratching method and measuring the depth of the scratch. The depth of the scratch is the Mohs hardness. In this application, the optical film layer is prepared using a high-hardness first material, so that the Mohs hardness of the optical film layer is within the above range, and the optical film layer has better scratch resistance.

[0019] In a feasible implementation manner, under a load force of 18 mN, the Vickers hardness of the optical film layer is ≥1000 HV.

[0020] In the above scheme, Vickers hardness refers to the use of a diamond pyramid indenter with an angle of 136 degrees between opposing faces to press into the surface of the optical film under a specified load F. After holding for a specified period of time and then removing the load, the diagonal length d of the indentation is measured, and the surface area of ​​the indentation is calculated. Finally, the average pressure over the indentation surface area is calculated to obtain the Vickers hardness value of the material. In this application, the optical film layer is prepared using a high-hardness first material, so that the Vickers hardness of the optical film layer is within the above range, and the optical film layer has better compressive resistance.

[0021] In a feasible implementation manner, the friction coefficient of the optical film layer is 0.01 to 0.06.

[0022] The optical film layer is placed on the side of the glass substrate away from the other components of the electronic device. During use, the outer surface of the optical film layer comes into contact with the user's fingers. If the optical film layer's coefficient of friction is too high, it can reduce the user's experience when frequently operating the electronic device. If the coefficient of friction is too low, the electronic device can easily receive commands from the user's incorrect operation. The above solution controls the optical film layer's coefficient of friction within this range, ensuring both smooth operation and ensuring the electronic device receives correct commands.

[0023] In a feasible embodiment, the transmittance of the optical film layer to visible light with a wavelength within a range of 380 nm to 780 nm is greater than 90%.

[0024] In the above scheme, transmittance refers to the percentage of light that passes through. The higher the transmittance, the clearer the display on the glass cover. The glass cover is mounted on an electronic device, and the optical film layer is positioned on the side of the glass cover facing away from the other components of the electronic device. When the display screen produces an image, the light representing the image passes through the glass cover and is received by the user. If the transmittance of the optical film layer is too low, the brightness of the electronic device will be reduced, impairing the user's experience. When the transmittance of the optical film layer is within the above range, the displayed image viewed through the glass cover plate is clear.

[0025] In a feasible embodiment, the reflectivity of the optical film layer to visible light with a wavelength within a range of 380 nm to 780 nm is less than 6%.

[0026] The reflectivity of an optical film refers to the degree to which it reflects light. The lower the reflectivity, the less light it reflects, making the display screen of an electronic device more similar to the experience of using paper, and the user experience is better. If the reflectivity of the optical film is too high, it can affect the viewing experience when using the electronic device in a bright light environment. The reflectivity of the optical film used in the above solution is within this range, allowing users to have a good viewing or reading experience on the electronic device.

[0027] In a feasible embodiment, the glass cover further includes a protective layer, and the protective layer is disposed on a side of the optical film layer away from the glass substrate.

[0028] In the above solution, the side of the optical film away from the glass substrate serves as the user's touch surface. During use, fingerprints and dirt are easily left on the optical film, affecting its light transmittance and aesthetics. Therefore, adding a protective layer on the side of the optical film away from the glass substrate not only improves the user experience but also further extends the lifespan of the optical film.

[0029] In a feasible implementation manner, the glass substrate includes one of a 2D glass substrate, a 2.5D glass substrate, and a 3D glass substrate.

[0030] In the above scheme, the 2D glass cover is a flat glass cover; the 2.5D glass cover is based on the fact that the entire piece of glass is on the same plane, and a more obvious arc transition is formed around the glass cover through CNC machine tool processing technology; 3D glass refers to the glass edge being formed into a 3D curved surface through a hot bending mold, thus presenting a rounded feeling in vision and experience. The 3D front cover includes single-curved 3D front cover, micro-hyperbolic 3D front cover and hyperbolic 3D front cover; the single-curved 3D glass cover has only the left and right sides hot-bent into a curved shape; the four sides of the hyperbolic 3D glass cover are hot-bent into a curved shape, and the micro-hyperbolic 3D glass cover reduces the angles and depths of the upper and lower sides on the basis of the hyperbolic 3D glass cover, forming a slightly curved light and shadow effect on the upper and lower sides. The refractive index of the optical film layer used in this application is close to that of the glass substrate, and the glass substrate will not have color differences in appearance due to changes in the thickness of the optical film layer. When the optical film layer is formed on a 2D glass substrate, a 2.5D glass substrate, or a 3D glass substrate, no color changes will occur, thereby ensuring the aesthetics of the electronic device using this glass cover.

[0031] In a feasible embodiment, the glass substrate is a 3D glass substrate, and the 3D glass substrate includes a base portion, a side portion, and a bending portion connecting the base portion and the side portion;

[0032] The optical film layer is formed on the surfaces of the base portion, the bending portion, and the side portion, and a thickness of the optical film layer on the surface of the bending portion is different from a thickness of the optical film layer on the surface of the base portion.

[0033] In the above solution, using a 3D glass substrate as the base of the glass cover can give the electronic device a good appearance and avoid shielding the mobile phone signal. Furthermore, by using an optical film layer on the 3D glass substrate whose refractive index does not change with thickness, the refractive index of the base, side, and curved portions, while varying in thickness, remains close to that of glass, eliminating any apparent color differences.

[0034] In a feasible embodiment, in the (L*, a*, b*) colorimetry system, the a* value of the reflected light that can be reflected by the optical film layer is -2 to 2, and the b* value is -2 to 2; and / or, the a* value of the transmitted light that can be transmitted by the optical film layer is -2 to 2, and the b* value is -2 to 2.

[0035] In the above scheme, L* represents lightness, ranging from 0 to , indicating a color shift from dark (black) to light (white); a* represents redness and greenness, with values ​​ranging from positive to negative, indicating a shift from red (positive) to green (negative). A larger a value indicates a redder color, while a smaller a value indicates a greener color. b* represents yellowness and blueness, with values ​​ranging from positive to negative, indicating a shift from yellow (positive) to blue (negative). A larger b value indicates a yellower color, while a smaller b value indicates a bluer color. The optical film provided in this scheme provides a* and b* values ​​within this range for both transmitted and reflected light, preventing the appearance of rainbow fringing on the glass cover of electronic devices.

[0036] A second aspect of the present application provides a method for preparing a glass cover plate, the method comprising:

[0037] The glass substrate undergoes a pre-treatment process;

[0038] sputtering an alloy target material onto the glass substrate under a vacuum environment to form a composite film layer on the surface of the glass substrate; wherein the alloy target material comprises two or more element atoms;

[0039] A gas is introduced into the composite film layer, and gaseous atoms or gaseous ions formed by the excitation of the gas react with the composite film layer to obtain a glass cover plate with an optical film layer formed on the surface; wherein the refractive index of the optical film layer is 1.46 to 1.62.

[0040] According to a third aspect of the present application, an electronic device is provided, comprising the glass cover plate described in any one of the first aspects or the glass cover plate manufactured by the method for manufacturing the glass cover plate according to the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0042] FIG1 is a schematic structural diagram of a mobile phone provided in an embodiment of the present application;

[0043] FIG2 is an exploded view of a mobile phone provided in an embodiment of the present application;

[0044] Figures 3a, 3b, 3c, and 3d are cross-sectional schematic diagrams of a 2D back cover, a 2.5D back cover, a 3D back cover, and a 5D back cover of a mobile phone provided in embodiments of the present application, respectively;

[0045] FIG4 is an exploded view of another mobile phone provided in an embodiment of the present application;

[0046] Figures 5a, 5b, and 5c are schematic cross-sectional views of a 2D glass substrate, a 2.5D glass substrate, and a 3D glass substrate, respectively, for a mobile phone provided in an embodiment of the present application;

[0047] FIG6 is a flow chart of the preparation of the glass cover plate provided in an embodiment of the present application.

[0048] Figure ID:

[0049] 100-mobile phone;

[0050] 110 - housing; 111 - frame; 112 - back cover; 1121 - textured diaphragm; 113 - mainboard; 114 - battery; 115 - first middle frame; 116 - first groove; 117 - second groove; 118 - second middle frame;

[0051] 120 - glass cover; 121 - glass substrate; 121a - base portion; 121b - side portion; 121c - bending portion. DETAILED DESCRIPTION

[0052] In the description of the embodiments of the present application, it should be understood that the terms "length", "thickness", "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the embodiments of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0053] In the description of the embodiments of the present application, it should be noted that, unless otherwise expressly specified or limited, the term "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection or an indirect connection through an intermediate medium; it can be internal communication between two elements or an interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0054] The present application provides a glass cover plate, which can be applied to the front cover plate, back cover plate or other parts of electronic devices that need to improve scratch resistance, such as camera cover plate. It should be noted that the electronic devices to which the glass cover plate can be applied include but are not limited to mobile phones, tablet computers, wearable devices, vehicle-mounted devices, augmented reality (AR) / virtual reality (VR) devices, laptops, ultra-mobile personal computers (UMPCs), netbooks, personal digital assistants (PDAs) and other mobile terminals, or professional shooting equipment such as digital cameras, SLR cameras / micro-single cameras, sports cameras, pan-tilt cameras, drones, etc. The embodiments of the present application do not limit the specific type of electronic device and can be selected according to actual needs. The electronic device provided in the present application takes a mobile phone 100 as an example. Figure 1 is a structural schematic diagram of the mobile phone provided in the embodiment of the present application. As shown in Figure 1, the shell assembly of the mobile phone 100 includes a shell 110 and a glass cover plate 120, and the glass cover plate 120 is mounted on the shell 110.

[0055] Specifically, the housing 110 includes a frame 111 and a back cover 112. The back cover 112 and the glass cover 120 are respectively located on either side of the frame 111. That is, the glass cover 120 and the back cover 112 are spaced apart. The frame 111 surrounds the outer periphery of the glass cover 120 and the outer periphery of the back cover 112, so that a receiving cavity is formed between the glass cover 120, the frame 111, and the back cover 112. The receiving cavity is used to accommodate electronic components, such as a display screen, a motherboard 113, a battery 114, a processor, an external memory interface, an internal memory, a universal serial bus (USB) interface, a charging management module, a power management module, the battery 114, an antenna, a mobile communication module, a wireless communication module, an audio module, a speaker, a receiver, a microphone, a headphone jack, a sensor module, a button, a motor, an indicator, a camera, etc. During disassembly, if the housing 110 and the glass cover 120 are separated, the electronic components located in the receiving cavity can be observed.

[0056] In the present application, the frame 111 and the back cover 112 are two parts of the shell 110, and the two are integrally formed or detachably connected.

[0057] First, as an optional technical solution of the present application, the frame 111 and the back cover 112 can be two detachable parts, and the housing 110 of the mobile phone 100 can be formed by assembling the frame 111 and the back cover 112 together. Specifically, Figure 2 is an exploded view of a mobile phone provided in an embodiment of the present application. As shown in Figure 2, the mobile phone 100 includes a glass cover plate 120, a back cover 112 and a first middle frame 115. The periphery of the first middle frame 115 (hereinafter referred to as the first middle frame periphery) can serve as the frame 111 of the electronic device, that is, the first middle frame periphery surrounds the periphery of the glass cover plate 120 and surrounds the periphery of the back cover 112. The back cover 112 and the glass cover plate 120 are respectively located on both sides of the first middle frame 115. It can be seen from this that the back cover 112 and the first middle frame 115 can be two different components. By assembling the back cover 112 and the first middle frame 115 together, the shell 110 of the mobile phone 100 can be formed. The assembly method can be welding, or slidable connection through a snap buckle, or connection through the matching of a positioning pin and a positioning hole, etc., and other connection methods can also be used. The connection method of the two can be selected according to actual needs, and is not limited here.

[0058] Furthermore, the first middle frame 115 used in the above solution can be set to a composite structure including a metal frame and a plastic frame. Specifically, the plastic frame can be continuously arranged along the outer peripheral edge of the metal frame, that is, the outer peripheral edge of the metal frame is entirely provided with a plastic frame. With such a setting, the structure is simple and the cost is low; or, a plastic frame can also be provided on the outer peripheral edge of the metal frame; or, the plastic frame and the metal frame are arranged at intervals along the circumferential direction, that is, the first middle frame 115 is mainly a metal frame, but a plastic frame is provided at the position of the signal breakpoint. With such a setting, the overall texture of the mobile phone 100 can be further improved, and the user experience can be enhanced.

[0059] Compared to solutions where the first middle frame 115 is constructed entirely of plastic or metal, the metal frame in the composite structure can reduce the thickness while maintaining overall structural strength, thereby reducing the overall thickness of the mobile phone 100, which helps meet user needs and enhances the user experience. The provision of a plastic frame in the composite structure can prevent the full metal frame from interfering with the signal transmission or reception of the mobile phone 100. Furthermore, in actual use, the metal frame is not a flat plate-like structure. Its specific structure can be configured based on the layout of the various electronic components within the housing of the mobile phone 100. For example, the metal frame includes multiple grooves for accommodating the battery 114 and the motherboard 113, such as a first groove 116 and a second groove 117. The battery 114 can be disposed in the first groove 116, and the motherboard 113 can be disposed in the second groove 117. The battery 114 and the motherboard 113 are electrically connected, so that the battery 114 can provide power to the motherboard 113. In addition to the first middle frame 115 of the composite structure of the metal frame and the plastic frame, the first middle frame 115 can also be made of other materials, such as a glass first middle frame or a ceramic first middle frame. The material of the first middle frame 115 can be selected according to actual needs and is not limited here.

[0060] Furthermore, Figures 3a, 3b, 3c, and 3d are cross-sectional schematic diagrams of a 2D back cover, a 2.5D back cover, a 3D back cover, and a 5D back cover of a mobile phone provided in an embodiment of the present application, respectively. As shown in Figures 3a, 3b, 3c, and 3d, the back cover 112 used in the above solution can be a flat plate-shaped structure, i.e., a 2D structure. In this case, the first middle frame 115 is also a flat rectangular structure, and the edge of the back cover 112 covers and connects to the edge of the first middle frame 115. Alternatively, the back cover 112 can also be a 2.5D back cover, which refers to a back cover 112 with a downwardly curved edge. Since the 2.5D back cover has no protruding edges, it is not easily impacted by other objects, thereby reducing the probability of damage to the housing 110 and making the exterior of the housing 110 more visually appealing. The back cover 112 can also be a 3D back cover, which can also be called a three-dimensional plate, and its surface has a three-dimensional shape. The back cover 112 can also be a 5D back cover, that is, the cover is a 5D cover. The 5D cover can adapt to, for example, the protruding structure of the camera. Of course, it can also be other protruding or recessed structures. The shape of the back cover 112 can be selected according to actual needs and is not limited here.

[0061] The material of the back cover 112 can be metal, glass, plastic, ceramic, or other composite materials. The material of the back cover 112 can be selected according to actual needs and is not limited here. Preferably, the material of the back cover 112 used in this application is a glass fiber composite material. The use of glass fiber composite materials to make the back cover 112 can make the back cover 112 have good mechanical strength and be light and thin. Specifically, the glass fiber composite material includes glass fiber woven cloth and an organic resin coating the glass fiber woven cloth. Glass fiber is an inorganic non-metallic material with the advantages of good insulation, strong heat resistance, good corrosion resistance, and high mechanical strength. By coating a glass fiber substrate with an organic resin to form a glass fiber composite material, the obtained back cover 112 can have the advantages of flame retardancy, drop resistance, corrosion resistance, high mechanical strength, lightness, and the like.

[0062] To enhance the tactile feel of the back cover 112, improve its physical properties, and enhance the user experience, a textured film 1121 can be provided on the outer surface of the back cover 112. The outer surface refers to the surface that comes into direct contact with the user's finger when the phone 100 is touched. The outer surface of the back cover 112, made of the aforementioned fiberglass composite material, is roughened, thereby enhancing the bond between the textured film 1121 and the back cover 112. The roughened surface of the back cover 112 can have a concave-convex cross-section, a curved, wavy cross-section, or other cross-sectional structures, as long as the outer surface has a certain degree of roughness. The textured film 1121 has a texture pattern and color, allowing the user to observe and touch the color and texture of the textured film 1121 on the outer surface of the cover. In some embodiments, the texture pattern can be frosted, dotted, twill, snowflake, or other texture effects, without limitation. Multiple textured films 1121 can be stacked on the outer surface of the back cover 112. The textured microstructure of the texture pattern can be a U-shaped microstructure, a pyramid-shaped microstructure, an arc-shaped microstructure, a groove-shaped microstructure, etc., which are not limited here. The textured film 1121 can improve the visual aesthetics of the back cover 112 and make the back cover 112 both drop-resistant, wear-resistant, and lightweight. The combination of glass fiber composite material and textured film 1121 to form the cover of the electronic device can give the back cover 112 different textures and a more dynamic and colorful appearance through different combinations of the two.

[0063] In the second aspect, as another optional technical solution of the present application, the difference from the first aspect is that the back cover 112 and the frame 111 of this solution are two parts of the structure formed in one piece, that is, the connection between the back cover 112 and the frame 111 cannot be separated. Specifically, Figure 4 is an exploded view of another mobile phone provided in an embodiment of the present application. As shown in Figure 4, the mobile phone 100 includes a glass cover 120, a shell 110 and a second middle frame 118, wherein the shell 110 includes a frame 111 and a back cover 112, and the frame 111 and the back cover 112 are two parts of the shell 110 respectively. The frame 111 and the back cover 112 are connected as one piece, and the connection between the frame 111 and the back cover 112 is usually unable to be separated. The second middle frame 118 is accommodated in the receiving cavity between the glass cover 120, the frame 111 and the back cover 112. As can be seen, during use, the edge of the glass cover plate 120 is directly connected to the edge of the frame 111 of the housing 110, and the middle frame for positioning electronic components such as the motherboard 113 and the battery 114 is located between the glass cover plate 120 and the back cover 112 of the housing 110. Unless otherwise specified above, the structure and material of the second middle frame 118, or the material of the back cover 112, and the arrangement of the textured film 1121 can be the same as in the first aspect and will not be repeated here.

[0064] In some embodiments, the glass cover 120 is provided on the housing of the electronic device to protect the screen assembly. However, if the glass cover 120 of the electronic device is not provided with a protective film during use, it may develop appearance defects such as scratches after prolonged use. These defects may disrupt the stress balance of the glass cover 120, resulting in a decrease in the impact resistance of the glass cover 120.

[0065] In the prior art, a high-hardness optical film layer is applied to the outer surface of the glass substrate 121 to improve the scratch resistance of the glass cover plate 120. For example, protective films made of high-hardness materials with high and low refractive indexes are alternately stacked on the surface of the glass substrate 121 to achieve a glass cover plate 120 with enhanced scratch resistance. However, this solution cannot be used on 3D glass substrates, especially glass substrates 121 with a 3D bending angle greater than 60°. It is only suitable for 2D and 2.5D glass substrates. This is because during the sputtering process on a 3D glass substrate, the deposition rate is maximized when the normal to the coating surface of the glass substrate 121 is parallel to the incident direction of the coating particles, and a uniform optical film layer can be deposited. However, when sputtering on an edge, the normal to the curved surface forms a certain angle α with the incident direction of the coating particles. The resulting optical film layer's thickness varies with α at a rate cosα, making it impossible to ensure consistent color between flat and curved surfaces on the 3D glass substrate. At the same time, this process has high requirements on the cleanliness of the production environment and the glass substrate 121, and the production yield is low. It is only suitable for use on small-sized cover plates such as mobile phone camera cover plates and watch cover plates. The yield is low on large-area glass cover plates 120 such as mobile phones and tablets.

[0066] Alternatively, diamond-like carbon (DLC) coating technology can be used to deposit a DLC film with a Mohs hardness of nearly 10 on the surface of the glass substrate 121 through magnetic filtration technology or CVD technology to obtain an optical film layer with super scratch resistance. However, the DLC film has a certain absorption of visible light, resulting in the thickness of the optical film layer being limited to less than 50 nm. In actual use, the optical film layer is easily pierced by harmful particles, and the scratch resistance of the glass substrate 121 after coating is not significantly improved.

[0067] In view of this, the present application provides a glass cover plate 120, which includes a glass substrate 121 and an optical film layer located on the surface of the glass substrate 121, wherein the refractive index of the optical film layer is 1.46 to 1.62; the optical film layer includes a first material and a second material mixed at the atomic level, and the mass ratio of the first material to the second material is (1 to 8):1; and the refractive index of the first material is greater than 1.6, and the refractive index of the second material is less than 1.52.

[0068] In the above solution, the glass cover plate 120 uses a first material with a higher refractive index than the glass substrate 121 and a second material with a lower refractive index than the glass substrate 121. The first material and the second material are mixed at the atomic level to form an optical film layer. The refractive index of the obtained optical film layer is similar to that of the glass substrate 121, and has no effect on the transmittance and reflectivity of the glass substrate 121. The refractive index of the optical film layer does not change with the thickness of the optical film layer. When the optical film layer is formed on the glass substrate 121 with a curved edge, the color of the glass substrate 121 will not be different due to the change in the thickness of the optical film layer. At the same time, when the optical film layer falls off, it will not cause the appearance of the glass cover plate 120 to change.

[0069] In some embodiments, Figures 5a, 5b, and 5c are cross-sectional schematic diagrams of a 2D glass substrate, a 2.5D glass substrate, and a 3D glass substrate of a mobile phone provided in an embodiment of the present application, respectively. As shown in Figures 5a, 5b, and 5c, the glass substrate 121 used in the present application includes one of a 2D glass substrate, a 2.5D glass substrate, and a 3D glass substrate. Specifically, a 2D glass substrate refers to a glass having a flat plate structure. A 2.5D glass substrate refers to a glass having a relatively obvious arc transition formed around the glass through a CNC machine tool processing process on the basis that the entire piece of glass is on the same plane. A 3D glass substrate refers to a glass edge that is formed into a 3D curved surface by a hot bending mold, thereby presenting a rounded feel in terms of visual appearance and experience. 3D glass substrates include single-curved 3D glass substrates, slightly hyperbolic 3D glass substrates, and hyperbolic 3D glass substrates. Single-curved 3D glass substrates are curved only on the left and right sides, while hyperbolic 3D glass substrates are curved on all four sides. Micro-hyperbolic 3D glass substrates reduce the angle and depth of the top and bottom sides of a hyperbolic 3D glass substrate, creating a slightly curved light and shadow effect on the top and bottom sides. The structure of the glass substrate 121 can be selected based on actual needs and is not limited here.

[0070] It should be noted that the shape of the optical film layer of the present application changes with the shape of the glass substrate 121 , and therefore the shape of the optical film layer is not limited.

[0071] Preferably, the glass substrate 121 used in the present application is a 3D glass substrate. Using a 3D glass substrate as the base of the glass cover 120 can make the electronic device have a good appearance and avoid shielding the signal of the mobile phone.

[0072] In some embodiments, the 3D glass substrate includes a base portion 121a, a side portion 121b, and a bent portion 121c connecting the base portion 121a and the side portion 121b. The side portion 121b and the bent portion 121c allow the glass cover 120 to have a certain curvature when the user observes the glass cover 120 from the front. Compared with a flat display structure, the 3D glass cover 120 is more in line with the structure of the human eye. The electronic device using the glass cover 120 has a larger viewing angle, which can improve the comfort of using the electronic device.

[0073] Furthermore, the optical film layer formed on the outer surfaces of the base portion 121a, the bent portion 121c, and the side portion 121b can improve the scratch resistance of the 3D glass substrate. However, during the process of forming the optical film layer on the glass substrate 121, the thickness of the optical film layer on the bent portion 121c surface during sputtering is different from the thickness of the optical film layer on the base portion 121a surface. Therefore, the material of the optical film layer of this application includes a first material and a second material mixed at the atomic level, with the refractive index of the first material being greater than 1.6 and the refractive index of the second material being less than 1.52. The first material includes at least one of Si3N4, Al2O3, AlN, ZrO2, Nb2O5, T2O5, TiO2, etc., and the second material includes at least one of SiO2, MgF2, LaF3, AlF3, etc. By combining one or more of the above-mentioned first materials with a higher refractive index than the glass substrate 121 and the second material with a lower refractive index than the glass substrate 121, an optical film layer with a refractive index close to that of the glass substrate 121 is formed.

[0074] Specifically, if the refractive index of air is n0, the refractive index of the optical film layer is n1, and the refractive index of the glass substrate 121 is n3, and the refractive index n3 of the glass substrate 121 used in this application is 1.52, the reflectivity R of the optical film layer should be less than or equal to 5.3%, and the transmittance should be ≥90.5%. According to the reflectivity calculation formula:

[0075] It is found that the required refractive index n1 of the optical film layer is approximately 1.56.

[0076] When the first material and the second material are mixed, according to the Lorentz-Lorentz dispersion theory formula of the refractive index and component ratio of a multi-material mixture, the refractive index n of the first material and the second material after mixing is:

[0077] Among them, a i =(n i +2) -1 , ρ i is the density of the first material and the second material, c i is the percentage concentration of the first material and the second material.

[0078] For example, in the preparation of Al2O3-SiO2 mixed film or Si3N4-SiO2 mixed film, if the percentage concentration of the high refractive index material Al2O3 or Si3N4 is c h , the density is ρ h , the percentage concentration of SiO2 is c l , the density is ρ l , it can be seen that the refractive index n of the Al2O3-SiO2 mixed film layer and the Si3N4-SiO2 mixed film layer is:

[0079] According to the percentage concentration of high refractive index material Al2O3 or Si3N4 is c h The value of is different, as shown in the following table, the mixed refractive index of the obtained optical film layer is also different.

[0080] As can be seen from the above example, by controlling the mass ratio of the first material to the second material, the optical film layer with the above-mentioned refractive index of about 1.56 can be obtained, that is, an optical film layer with a refractive index close to that of the glass substrate 121. The mass ratio of the first material to the second material used in this application is (1 to 8):1. Optionally, the mass ratio of the first material to the second material is 1:1:, 2:1:, 3:1:, 4:1:, 5:1:, 6:1:, 7:1:, 8:1, etc., or other values ​​within the range. It can be selected according to actual needs and is not limited here. If the mass ratio of the first material to the second material is too small, that is, the mass proportion of the first material with a high refractive index is too small, and the mass proportion of the second material with a low refractive index is too large, the refractive index of the prepared optical film layer will be smaller than the refractive index of the glass substrate 121; if the mass ratio of the first material to the second material is too large, the mass proportion of the first material with a high refractive index is too large, and the mass proportion of the second material with a low refractive index is too small, the refractive index of the prepared optical film layer will be too large. A refractive index of the optical film layer that is too high or too low compared to the refractive index of the glass substrate 121 will affect the light transmission performance of the glass cover 120. Therefore, when the mass ratio of the first material to the second material used in this application is within the above range, the refractive index of the prepared optical film layer is close to that of the glass substrate 121. Furthermore, changes in the thickness of the optical film layer will not affect the refractive index of the optical film layer. This allows the optical film layer to be formed on a glass substrate 121 with a curved edge, such as a 3D glass substrate, without causing the glass cover 120 to appear different in color due to the thickness difference between the bent portion 121c and the base portion 121a during the coating process. Therefore, the refractive index of the optical film layer does not change with changes in the film thickness. Although the thickness of the optical film layer at the base portion 121a, side portion 121b, and bent portion 121c is different, the refractive index at the base portion 121a, side portion 121b, and bent portion 121c is close to that of the glass, resulting in no apparent color difference.

[0081] At the same time, in order to improve the scratch resistance of the optical film layer, the Vickers hardness of the first material used in this application is ≥1000HV. Optionally, the hardness of the first material can be specifically 1000HV, 1100HV, 1200HV, 1300HV, 1400HV, 1500HV, 1600HV, 1700HV, etc., or other values ​​within the range. It can be selected according to actual needs and is not limited here. If the hardness of the first material is too small, the hardness of the prepared optical film layer is reduced, and the film layer is easily scratched during the use of the electronic device, thereby reducing the service life of the optical film layer. The hardness of the first material used in the optical film layer of this application is within the above range. The optical film layer has high hardness while being aesthetically pleasing, is not prone to defects such as scratches during use, and has a long service life.

[0082] The optical film layer is prepared by a first material with high hardness and a refractive index higher than that of the glass substrate 121 and a material with a refractive index lower than that of the glass substrate 121. The optical film layer of the present application can be prepared by various deposition methods, for example, vacuum deposition technology, such as chemical vapor deposition (such as plasma-enhanced chemical vapor deposition, low-pressure chemical vapor deposition, atmospheric pressure chemical vapor deposition and plasma-enhanced atmospheric pressure chemical vapor deposition), physical vapor deposition (such as reactive or non-reactive sputtering or laser ablation, thermal or electron beam evaporation or atomic layer deposition), to form each film layer. Liquid-based methods such as spraying, dip coating, spin coating or slit coating (such as using sol-gel materials) can also be used. Preferably, the optical film layer of the present application is formed by sputtering a metal target. FIG6 is a flow chart for preparing the glass cover provided in an embodiment of the present application. As shown in FIG6 , the process comprises the following steps:

[0083] Step S10, the glass substrate 121 undergoes a pretreatment process;

[0084] Step S20, sputtering an alloy target onto the glass substrate 121 under a vacuum environment to form a composite film layer on the surface of the glass substrate 121; wherein the alloy target contains two or more element atoms;

[0085] In step S30 , gas is introduced into the composite film layer, and gaseous atoms or gaseous ions formed by gas excitation react with the composite film layer to obtain a glass cover plate 120 with an optical film layer formed on the surface thereof, wherein the refractive index of the optical film layer is 1.46 to 1.62.

[0086] In step S10, the pretreatment process of the glass substrate 121 is a cleaning process, in which the glass substrate 121 is cleaned. Specifically, the glass substrate 121 is placed in a deionized water immersion cleaning tank, and deionized water is added to the inside of the cleaning tank to soak the glass substrate 121. At the same time, the ultrasonic generator in the deionized water immersion cleaning tank is operated to emit ultrasonic waves for a cleaning operation; then the glass substrate 121 is placed in a deionized water spray cleaning tank, and the water pipe nozzle in the deionized water spray cleaning tank sprays deionized water to rinse the glass substrate 121 for a second cleaning operation; then the glass substrate 121 is placed in a drying device to dry it. After cleaning, the surface of the glass substrate 121 is clean, and the bonding force with the optical film layer is stronger, which is convenient for the subsequent preparation process. Other cleaning methods can also be selected according to actual needs and are not limited here.

[0087] In step S20, the sputtering equipment of the present application adopts a vertical single-body magnetron furnace, and the sputtering material adopts a pure metal target material that is evenly mixed and has a purity greater than 99%. The pure metal target material includes two metal atoms. Among them, the preparation method of the pure metal target material can be a casting method or a powder metallurgy method. Specifically, the casting method refers to melting the first metal and the second metal in a ratio of (1 to 8): 1 to obtain an alloy solution, and then pouring the alloy solution into a mold to form an ingot, and finally machining it into a target material. The melting method can be vacuum induction melting, vacuum arc melting, and vacuum electron bombardment melting. The powder metallurgy method refers to melting the first metal and the second metal in a certain composition ratio, pouring them into an ingot and then crushing them, isostatically pressing the powder formed by the crushing, and then sintering it at high temperature to finally form a target material. The metal target material can also be formed by other methods, which can be selected according to actual needs and are not limited again.

[0088] After the metal target is prepared, it is placed in a vertical single-unit magnetron furnace and the vacuum degree is 3.6E. -3 pa, working pressure is 5.6E -1 -6.6E -1 Under the conditions of , the vertical single-body magnetron furnace is turned on, and the glass substrate 121 passes through the metal target. The electrons generated by the glow discharge excite the inert gas in the sputtering equipment to generate plasma. The plasma blasts out the first metal atoms and the second metal atoms of the metal target, which are deposited on the glass substrate 121 to form a composite film layer.

[0089] In step S30, the gas excitation process is achieved using an ICP plasma ionizer. Specifically, after the working gas enters the ICP plasma ionizer, a high-frequency current flows through the induction coil of the ICP plasma ionizer to generate a high-frequency electromagnetic field, ionizing the working gas to form a gas plasma. At this point, the composite film layer on the glass substrate 121 reacts with the gas plasma to form an optical film layer. The gas used in this application is oxygen or nitrogen, for example.

[0090] It should be noted that during the reaction of the composite film layer with the gas plasma, the rotation speed of the glass substrate 121 is maintained at 50 r / min to 120 r / min. Optionally, the rotation speed can be 50 r / min, 60 r / min, 70 r / min, 80 r / min, 90 r / min, 100 r / min, 110 r / min, 120 r / min, or other values ​​within this range. This can be selected based on actual needs and is not limited here. If the rotation speed of the glass substrate 121 is too high or too low, the composite film layer cannot fully react with the gas, resulting in an incomplete reaction and the prepared optical film layer failing to meet the desired requirements.

[0091] The optical film layer prepared by the above preparation method has both scratch resistance and other excellent physical properties, such as high hardness, smoothness, and excellent light transmittance and refractive index performance.

[0092] In some embodiments, the thickness of the optical film layer is 500nm to 5000nm. Optionally, the thickness of the optical film layer can be 500nm, 1000nm, 1500nm, 2000nm, 2500nm, 3000nm, 3500nm, 4000nm, 4500nm, 5000nm, etc., or other values ​​within the range. It can be selected according to actual needs and is not limited here. If the thickness of the optical film layer is too high, the hardness is high and the scratch resistance is strong, but it will also cause the thickness of the glass cover 120 to increase, affecting the aesthetics of the electronic device; if the thickness of the optical film layer is too thin, the scratch resistance is reduced and the service life is short. The thickness of the optical film layer prepared in the present application is within the above range and has the characteristics of high hardness and good aesthetics.

[0093] In some embodiments, the optical film layer has a Mohs hardness of 7 or greater under a test force of 500g using a Mohs hardness pen. Mohs hardness is determined by scratching the surface of the optical film layer using a pyramidal diamond needle and measuring the depth of the scratch. The depth of the scratch represents the Mohs hardness. In this application, the optical film layer is prepared using a high-hardness first material, resulting in a Mohs hardness within the above range, providing improved scratch resistance.

[0094] Using a Vickers indenter tester, the Vickers hardness of the optical film layer is ≥1100HV under a load of 18mN. Vickers hardness refers to using a diamond regular pyramid indenter with an angle between relative surfaces of 136 degrees to press into the surface of the optical film layer under a specified load F, maintaining the load for a certain period of time, and then removing the load, measuring the diagonal length d of the indentation, and then calculating the surface area of ​​the indentation. Finally, the average pressure on the indentation surface area is calculated, which is the Vickers hardness value of the material. The present application uses a first material with high hardness to prepare the optical film layer. The Vickers hardness of the optical film layer is within the above range and has good compressive resistance. When sharp objects or heavy objects squeeze the electronic equipment during use, the optical film layer can play a good protective role.

[0095] In some embodiments, the friction coefficient of the optical film layer is 0.01 to 0.06. Optionally, the friction coefficient of the optical film layer can be specifically 0.01, 0.015, 0.02, 0.025, 0.03, 0.035, 0.04, 0.045, 0.050.055, 0.06, etc., or other values ​​within the range. It can be selected according to actual needs and is not limited here. The optical film layer is arranged on the side of the glass substrate 121 away from other components of the electronic device. During the use of the electronic device, the outer surface of the optical film layer contacts the user's fingers. If the friction coefficient of the optical film layer is too large, it is easy to reduce the user's experience when frequently operating the electronic device; if the friction coefficient is too small, the electronic device is easy to receive action instructions when the user makes an erroneous operation. The friction coefficient of the optical film layer prepared in the present application is controlled within this range, so that the optical film layer has the characteristics of being smooth and allowing the electronic device to receive correct instructions.

[0096] In some embodiments, the transmittance of the optical film layer to visible light with a wavelength of 380nm to 780nm is greater than 90%. Specifically, the transmittance of the optical film layer can be 90%, 91%, 92%, 93%, 94%, 95%, 96%, etc., or other values ​​within the range. It can be selected according to actual needs and is not limited here. Transmittance refers to the percentage of light passing through. The higher the transmittance, the clearer the display of the glass cover 120. The glass cover 120 is installed on the electronic device, and the optical film layer is arranged on the side of the glass cover 120 away from other components of the electronic device. When the display screen generates a display image, the light of the display image is received by the user after passing through the glass cover 120. If the transmittance of the optical film layer is too low, it will cause the brightness of the electronic device to decrease, reducing the user experience. The transmittance of the optical film layer prepared in the present application is within the above range, and the display image observed by the user through the glass cover 120 is clear.

[0097] In some embodiments, the reflectivity of the optical film layer to visible light with a wavelength within the range of 380nm to 780nm is less than 6%. Specifically, the reflectivity of the optical film layer can be 6%, 4.2%, 3.5%, 3%, 2.5%, 2%, 1.5%, 1%, etc., or other values ​​within the range. It can be selected according to actual needs and is not limited here. The reflectivity of the optical film layer refers to the degree to which the optical film layer reflects light. The smaller the reflectivity of the optical film layer, the less light the optical film layer reflects, so that when the electronic device is used, the display screen is closer to the experience of using paper, and the user experience is better. If the reflectivity of the optical film layer is too high, it will affect the viewing process of the electronic device when the electronic device is used in a strong light environment. The reflectivity of the optical film layer prepared in the present application is within this range, and users can have a good viewing or reading experience on the electronic device.

[0098] In some embodiments, the refractive index of the optical film layer is 1.46 to 1.62. Specifically, the refractive index of the optical film layer can be 1.46, 1.47, 1.49, 1.50, 1.52, 1.54, 1.56, 1.59, 1.62, etc., or other values ​​within the range. It can be selected according to actual needs and is not limited here. The optical film layer is formed on the side of the glass substrate 121 away from other components of the electronic device. During use, the user observes the content on the display screen through the glass cover 120. If the refractive index of the optical film layer is too high or too low, that is, the refractive index of the optical film layer is not close to the refractive index of the glass substrate 121, it will affect the transmittance and reflectivity of the glass substrate 121, reducing the user's experience.

[0099] In some embodiments, in the (L*, a*, b*) colorimetric system, the a* value of the reflected light that can be reflected by the optical film layer is -2 to 2, and the b* value is -2 to 2; and / or, the a* value of the transmitted light that can be transmitted by the optical film layer is -2 to 2, and the b* value is -2 to 2. L* represents lightness, ranging from 0 to, indicating that the color ranges from dark (black) to light (white); a* represents red and green, and the value changes from positive to negative, indicating that the color ranges from red (positive) to green (negative). The larger the a value, the redder the color, and the smaller the a value, the greener the color; b* represents yellow and blue, and the value changes from positive to negative, indicating that the color ranges from yellow (positive) to blue (negative). The larger the b value, the yellower the color, and the smaller the b value, the bluer the color. Specifically, the a* value and the b* value can be -2, -1.5, -1, -0.5, 0.5, 1, 1.5, 2, etc., or other values ​​within the range. They can be selected according to actual needs and are not limited here. The a* value and b* value of the transmitted light and reflected light of the optical film layer prepared in the application are within this range, and the glass cover 120 of the electronic device will not appear to have defects such as rainbow edges.

[0100] The side of the optical film layer facing away from the glass substrate 121 serves as the user's touch surface. During use, fingerprints and dirt can easily remain on the optical film layer, affecting its light transmittance and aesthetics. Therefore, the glass cover 120 also includes a protective layer, which is disposed on the side of the optical film layer facing away from the glass substrate 121. This protective layer prevents fingerprints and contamination from sticking to the optical film layer, improving the user experience while further extending the lifespan of the optical film layer.

[0101] The following is elaborated with reference to specific embodiments:

[0102] Example 1:

[0103] The 3D glass substrate is cleaned with deionized water and placed in a vertical single-unit magnetic control furnace;

[0104] Open the vertical single magnetic control furnace and set the vacuum degree to 3.6E -3 pa, working pressure is 5.6E -1 -6.6E -1 Under working conditions, a silicon-aluminum alloy target is sputtered onto a 3D glass substrate to form a composite film layer on the surface of the 3D glass substrate; wherein the mass ratio of silicon oxide to aluminum oxide is 3:2;

[0105] Oxygen is introduced into a vertical single-body magnetron furnace, and an ICP plasma ionizer excites gaseous atoms or gaseous ions formed by the oxygen to react with the composite film layer of the glass substrate rotating at a speed of 85 r / min, thereby obtaining a glass cover plate with an optical film layer with a thickness of 2500 nm formed on the surface.

[0106] The cover plate coated with the hard film was placed in an electron gun evaporation furnace, which was turned on. The coating parameters were set as follows: coating current: 90 mA, Ar flow rate: 220 sccm, and coating time: 3 min, to obtain a 10-30 nm thick perfluoropolyether anti-pollution film layer.

[0107] The optical film layer prepared in Example 1 has a Mohs hardness of 7 (600g force), a Vickers hardness of 1205HV, a friction coefficient of 0.026, a transmittance of 91.7%, a reflectivity of 8.1%, a refractive index of 1.51, an a* value of reflected light of 0.01 and a b* value of 0.02, an a* value of transmittance light of -0.01 and a b* value of 0.02, and no rainbow pattern on the 3D arc edge when viewed visually.

[0108] Example 2:

[0109] The 3D glass substrate is cleaned with deionized water and placed in a vertical single-unit magnetic control furnace;

[0110] Open the vertical single magnetic control furnace and set the vacuum degree to 3.6E -3pa, working pressure is 5.6E -1 -6.6E -1 Under working conditions, a silicon-aluminum alloy target is sputtered onto a 3D glass substrate to form a composite film layer on the surface of the 3D glass substrate; wherein the mass ratio of silicon oxide to aluminum oxide is 2:3;

[0111] Oxygen is introduced into a vertical single-body magnetron furnace, and an ICP plasma ionizer excites gaseous atoms or gaseous ions formed by the oxygen to react with the composite film layer of the glass substrate rotating at a speed of 85 r / min, thereby obtaining a glass cover plate with an optical film layer with a thickness of 2500 nm formed on the surface.

[0112] The cover plate coated with the hard film was placed in an electron gun evaporation furnace, which was turned on. The coating parameters were set as follows: coating current: 90 mA, Ar flow rate: 220 sccm, and coating time: 3 min, to obtain a 10-30 nm thick perfluoropolyether anti-pollution film layer.

[0113] The optical film layer prepared in Example 2 has a Mohs hardness of 7 (1100g force), a Vickers hardness of 1380HV, a friction coefficient of 0.026, a transmittance of 91.3%, a reflectivity of 8.3%, a refractive index of 1.56, an a* value of reflected light of -0.01 and a b* value of -0.01, an a* value of transmittance light of 0.01 and a b* value of 0.1, and no rainbow pattern on the 3D arc edge when viewed visually.

[0114] Example 3:

[0115] The 3D glass substrate is cleaned with deionized water and placed in a vertical single-unit magnetic control furnace;

[0116] Open the vertical single magnetic control furnace and set the vacuum degree to 3.6E -3 pa, working pressure is 5.6E -1 -6.6E -1 Under working conditions, a silicon-aluminum alloy target is sputtered onto a 3D glass substrate to form a composite film layer on the surface of the 3D glass substrate; wherein the mass ratio of silicon oxide to aluminum oxide is 1:4;

[0117] Oxygen is introduced into a vertical single-body magnetron furnace, and an ICP plasma ionizer excites gaseous atoms or gaseous ions formed by the oxygen to react with the composite film layer of the glass substrate rotating at a speed of 85 r / min, thereby obtaining a glass cover plate with an optical film layer with a thickness of 2500 nm formed on the surface.

[0118] The cover plate coated with the hard film was placed in an electron gun evaporation furnace, which was turned on. The coating parameters were set as follows: coating current: 90 mA, Ar flow rate: 220 sccm, and coating time: 3 min, to obtain a 10-30 nm thick perfluoropolyether anti-pollution film layer.

[0119] The optical film layer prepared in Example 3 has a Mohs hardness of 7 (1500g force), a Vickers hardness of 1560HV, a friction coefficient of 0.029, a transmittance of 90.7%, a reflectivity of 9.1%, a refractive index of 1.62, an a* value of reflected light of -0.2 and a b* value of -0.26, an a* value of transmittance light of 0.1 and a b* value of 0.3, and no rainbow pattern on the 3D arc edge when viewed visually.

[0120] Example 4:

[0121] The 3D glass substrate is cleaned with deionized water and placed in a vertical single-unit magnetic control furnace;

[0122] Open the vertical single magnetic control furnace and set the vacuum degree to 3.6E -3 pa, working pressure is 5.6E -1 -6.6E -1 Under working conditions, the silicon target is sputtered onto a 3D glass substrate and passed through an ICP ionizer to react with nitrogen oxide ions, thereby forming a composite film layer on the surface of the 3D glass substrate; wherein the mass ratio of silicon oxide to silicon nitride is 4:1;

[0123] Oxygen and nitrogen were introduced into a vertical single-body magnetron furnace. An ICP plasma ionizer excited gaseous atoms or gaseous ions formed by the oxygen and nitrogen to react with the composite film layer of the glass substrate rotating at a speed of 85 r / min, thereby obtaining a glass cover plate with an optical film layer with a thickness of 2500 nm formed on the surface.

[0124] The cover plate coated with the hard film was placed in an electron gun evaporation furnace, which was turned on. The coating parameters were set as follows: coating current: 90 mA, Ar flow rate: 220 sccm, and coating time: 3 min, to obtain a 10-30 nm thick perfluoropolyether anti-pollution film layer.

[0125] The optical film layer prepared in Example 4 has a Mohs hardness of 7 (600g force), a Vickers hardness of 1160HV, a friction coefficient of 0.024, a transmittance of 91.8%, a reflectivity of 8%, a refractive index of 1.51, an a* value of reflected light of -0.01 and a b* value of 0.02, an a* value of transmittance light of 0.01 and a b* value of 0.00, and no rainbow pattern on the 3D arc edge when viewed visually.

[0126] Example 5:

[0127] The 3D glass substrate is cleaned with deionized water and placed in a vertical single-unit magnetic control furnace;

[0128] Open the vertical single magnetic control furnace and set the vacuum degree to 3.6E -3 pa, working pressure is 5.6E -1 -6.6E-1 Under working conditions, the silicon target is sputtered onto a 3D glass substrate and passed through an ICP ionizer to react with nitrogen oxide ions, forming a composite film layer on the surface of the 3D glass substrate; wherein the mass ratio of silicon oxide to silicon nitride is 7:3;

[0129] Oxygen and nitrogen were introduced into a vertical single-body magnetron furnace. An ICP plasma ionizer excited gaseous atoms or gaseous ions formed by the oxygen and nitrogen to react with the composite film layer of the glass substrate rotating at a speed of 85 r / min, thereby obtaining a glass cover plate with an optical film layer with a thickness of 2500 nm formed on the surface.

[0130] The cover plate coated with the hard film was placed in an electron gun evaporation furnace, which was turned on. The coating parameters were set as follows: coating current: 90 mA, Ar flow rate: 220 sccm, and coating time: 3 min, to obtain a 10-30 nm thick perfluoropolyether anti-pollution film layer.

[0131] The optical film layer prepared in Example 5 has a Mohs hardness of 7 (1100g force), a Vickers hardness of 1280HV, a friction coefficient of 0.026, a transmittance of 91.3%, a reflectivity of 8.3%, a refractive index of 1.56, an a* value of reflected light of -0.1 and a b* value of -0.25, an a* value of transmittance light of -0.01 and a b* value of 0.28, and no rainbow pattern is observed on the 3D arc edge.

[0132] Example 6:

[0133] The 3D glass substrate is cleaned with deionized water and placed in a vertical single-unit magnetic control furnace;

[0134] Open the vertical single magnetic control furnace and set the vacuum degree to 3.6E -3 pa, working pressure is 5.6E -1 -6.6E -1 Under working conditions, the silicon target is sputtered onto a 3D glass substrate and passed through an ICP ionizer to react with nitrogen oxide ions, thereby forming a composite film layer on the surface of the 3D glass substrate; wherein the mass ratio of silicon oxide to silicon nitride is 3:2;

[0135] Oxygen and nitrogen were introduced into a vertical single-body magnetron furnace. An ICP plasma ionizer excited gaseous atoms or gaseous ions formed by the oxygen and nitrogen to react with the composite film layer of the glass substrate rotating at a speed of 85 r / min, thereby obtaining a glass cover plate with an optical film layer with a thickness of 2500 nm formed on the surface.

[0136] The cover plate coated with the hard film was placed in an electron gun evaporation furnace, which was turned on. The coating parameters were set as follows: coating current: 90 mA, Ar flow rate: 220 sccm, and coating time: 3 min, to obtain a 10-30 nm thick perfluoropolyether anti-pollution film layer.

[0137] The optical film layer prepared in Example 6 has a Mohs hardness of 7 (1500g force), a Vickers hardness of 1480HV, a friction coefficient of 0.036, a transmittance of 90.8%, a reflectivity of 9.0%, a refractive index of 1.61, an a* value of reflected light of 0.01 and a b* value of -0.24, an a* value of transmittance light of -0.03 and a b* value of 0.26, and no rainbow pattern on the 3D arc edge when viewed visually.

[0138] Comparative Example 1

[0139] The 3D glass substrate uses deionized water for the cleaning process;

[0140] A first film layer and a second film layer are alternately stacked on the surface of a 3D glass substrate to form a composite film layer with a thickness of 2500nm. The first film layer has a refractive index of 1.46 and a Mohs hardness of 870HV, while the second film layer has a refractive index of 2.1 and a Mohs hardness of 1970HV.

[0141] The optical film prepared in Comparative Example 1 had a Mohs hardness of 7 (1500 g), a Vickers hardness of 1428 HV, a coefficient of friction of 0.055, a light transmittance of 94.48%, a reflectivity of 4.2%, an a* value of 0.19 and a b* value of -0.86 for reflected light, and an a* value of -0.24 and a b* value of 0.87 for transmitted light. Visually, rainbow patterns were observed on the 3D curved edges.

[0142] According to Examples 1 to 6 and Comparative Example 1, the glass cover plate of the present application uses a first material having a higher refractive index than the glass substrate and a second material having a lower refractive index than the glass substrate. When the mass ratio of the first material to the second material is in the range of (1 to 8):1, compared with the stacking arrangement of conventional optical film layers, the first material and the second material of the present application are mixed at the atomic level to form an optical film layer. The resulting optical film layer has a refractive index of 1.46 to 1.62, which is similar to that of the glass substrate, has no effect on the transmittance and reflectivity of the glass substrate, and the refractive index of the optical film layer does not change with the thickness of the film layer. When the optical film layer is formed on a glass substrate with a curved edge, the color of the glass substrate will not be different due to changes in the thickness of the film layer. At the same time, the appearance of the glass cover plate will not change when the film layer falls off.

[0143] Finally, it should be noted that the above embodiments are intended only to illustrate the technical solutions of this application and are not intended to limit them. Although this application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they may modify the technical solutions described in the aforementioned embodiments or replace some or all of the technical features therein with equivalents. However, such modifications or replacements do not deviate from the essence of the corresponding technical solutions within the scope of the technical solutions of the embodiments of this application.

Claims

1. A glass cover plate, characterized in that: The glass cover plate includes a glass substrate and an optical film layer located on the surface of the glass substrate, wherein the refractive index of the optical film layer is 1.46 to 1.62; the optical film layer includes a first material and a second material mixed at the atomic level, wherein the mass ratio of the first material to the second material is (1 to 8):1, and the refractive index of the first material is greater than 1.6, and the refractive index of the second material is less than 1.

52.

2. The glass cover plate according to claim 1, wherein: The first material includes at least one of Si3N4, Al2O3, AlN, ZrO2, Nb2O5, T2O5, TiO2, etc.

3. The glass cover plate according to claim 1, wherein: The Vickers hardness of the first material is ≥1000 HV.

4. The glass cover plate according to claim 1, wherein: The second material includes at least one of SiO2, MgF2, LaF3, AlF3, etc.

5. The glass cover plate according to claim 1, wherein: It meets at least one of the following characteristics: (1) The thickness of the optical film layer is 500nm to 5000nm; (2) Using a Mohs hardness pen test, under a test force of 500g, the Mohs hardness of the optical film layer is ≥7; (3) Using a Vickers indenter tester, under a load of 18 mN, the Vickers hardness of the optical film layer is ≥1100 HV; (4) The friction coefficient of the optical film layer is 0.01 to 0.06; (5) The transmittance of the optical film layer to visible light with a wavelength of 380nm to 780nm is greater than 90%; (6) The reflectivity of the optical film layer to visible light with a wavelength of 380 nm to 780 nm is less than 6%; (7) The glass cover plate further includes a protective layer, which is disposed on a side of the optical film layer away from the glass substrate.

6. The glass cover plate according to claim 1, wherein: The glass substrate includes one of a 2D glass substrate, a 2.5D glass substrate, and a 3D glass substrate.

7. The glass cover plate according to claim 1, wherein: The glass substrate is a 3D glass substrate, and the 3D glass substrate includes a base portion, a side portion, and a bending portion connecting the base portion and the side portion; The optical film layer is formed on the surfaces of the base portion, the bending portion, and the side portion, and a thickness of the optical film layer on the surface of the bending portion is different from a thickness of the optical film layer on the surface of the base portion.

8. The glass cover plate according to claim 1, wherein: In the (L*, a*, b*) colorimetry system, the optical film layer can reflect reflected light with an a* value of -2 to 2 and a b* value of -2 to 2; and / or, the optical film layer can transmit transmitted light with an a* value of -2 to 2 and a b* value of -2 to 2.

9. A method for preparing a glass cover plate, characterized in that: The preparation method comprises: The glass substrate undergoes a pre-treatment process; sputtering an alloy target material onto the glass substrate under a vacuum environment to form a composite film layer on the surface of the glass substrate; wherein the alloy target material comprises two or more element atoms; A gas is introduced into the composite film layer, and gaseous atoms or gaseous ions formed by the excitation of the gas react with the composite film layer to obtain a glass cover plate with an optical film layer formed on the surface; wherein the refractive index of the optical film layer is 1.46 to 1.

62.

10. An electronic device, characterized in that: The electronic device comprises the glass cover plate according to any one of claims 1 to 8 or the glass cover plate manufactured by the method for manufacturing a glass cover plate according to claim 9.

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