Dark color housing and electronic device including same

Abstract

According to one embodiment of the present disclosure, in an electronic device including a glossy case, the case includes a metal substrate, and an anodized layer overlapping the metal substrate, in which the anodized layer may include: a hole wall including a plurality of holes; and colored dye particles comprising an organic dye and a conductive enhancer injected into the plurality of pores.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a dark-colored housing and an electronic device including the same. Background Art

[0002] With the development of information and communication technology and semiconductor technology, the distribution and use of various mobile devices are increasing rapidly. Recent mobile devices provide ordinary users with an environment in which they can be carried when performing communication. In addition, the mobile device can output the stored information as voice or image. As mobile devices are highly integrated and high-speed, large-capacity wireless communications become common, mobile devices such as mobile communication terminals are recently being equipped with various functions. For example, mobile devices have integrated functionality, including entertainment functions such as playing video games, multimedia functions such as playing music / videos, communications and security functions for mobile banking, and / or schedule and electronic wallet functions. These mobile devices have been reduced in size to facilitate user carrying. As compact and slim mobile devices such as smart phones are carried and used in general, users require diversified high-end appearance designs of mobile devices.

[0003] The user's demand for diversified advanced appearance design of mobile devices has led to methods for implementing various colors or shapes. Generally, metallic colors such as silver and gold have been preferred, but recently, in terms of design, there is an increasing preference for bright colors such as deep black.

[0004] The surface treatment method for aluminum material comprises anodizing, chemical conversion coating, plating and / or vacuum coating.Anodizing is widely used in the surface treatment of aluminum alloy material, has the ability of using dye to implement various colors and can obtain the advantage of various colors by mixing various dyes or under coloring conditions.But, implement dark color and have certain limitation, as described below.For example, when coloring under the concentration of higher dye, if the concentration of dye is 10g / L or higher, then due to the difficulty of dissolving dye and the interference of coloring by undissolved dye particles, quality deterioration may occur.For example, when coloring time increases, processing time also increases, causes cost rise.These limitations can make it difficult to implement brightness (brightness) (L*) 24 or lower dark color in conventional mobile device.

[0005] The above information may be provided as background to assist in understanding the present disclosure. No assertion or determination is made as to whether any of the above may be applicable as background art relevant to the present disclosure. Summary of the invention

[0006] Technical Solution

[0007] In an electronic device including a glossy housing according to an embodiment of the present disclosure, the housing may include a metal substrate and an anodized layer formed overlapping the metal substrate. The anodized layer may include a hole wall including a plurality of holes and colored dye particles including a conductive enhancer (conductive enhancer) and an organic dye injected into the plurality of holes.

[0008] According to an embodiment of the present disclosure, a method for manufacturing a shiny housing of an electronic device may include a glazing operation for polishing a metal substrate of the housing, an anodizing operation for forming an oxide film including a plurality of pores, and a coloring operation for coloring by adsorbing an organic dye in the plurality of pores. The coloring operation may be performed by applying a conductive enhancer together with the organic dye.

[0009] In an electronic device including a glossy housing according to an embodiment of the present disclosure, the housing may include a metal substrate and an anodized layer formed overlapping the metal substrate. The anodized layer may include a hole wall including a plurality of holes, an organic dye injected into the plurality of holes and a conductivity enhancer having a pH of 6 or higher and a pH of 8 or lower, and the housing may have a value of L*22 or lower in the CIE L*a*b* color space. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment of the present disclosure;

[0011] Figure 2 is a front perspective view showing an electronic device according to an embodiment of the present disclosure;

[0012] Figure 3 is a rear perspective view showing an electronic device according to an embodiment of the present disclosure;

[0013] Figure 4 is an exploded perspective view showing an electronic device according to an embodiment of the present disclosure;

[0014] Figure 5 is a flow chart showing a pretreatment process and anodizing process according to an embodiment of the present disclosure;

[0015] Figure 6 is a diagram showing a cross section of a housing according to an embodiment of the present disclosure;

[0016] Figure 7 is a diagram showing the relationship between coloring time and brightness in a conventional electronic device;

[0017] Figure 8 is a graph showing changes in applied potential values ​​according to a conductivity enhancing agent;

[0018] Fig. 9A is a graph showing a comparison of black dye brightness between a conventional electronic device and an electronic device to which a conductivity enhancing agent is added according to the present invention;

[0019] Fig. 9B is a graph showing comparison of red, green, and blue (RGB) values ​​between a conventional electronic device and an electronic device to which a conductivity enhancing agent is added according to the present invention;

[0020] Fig. 10A is a graph showing changes in potential when unremoved acid is mixed with colored dye particles in a conventional electronic device;

[0021] Fig. 10B is a graph showing changes in potential according to the amount of conductivity enhancer added when unremoved acid is mixed with colored dye particles;

[0022] Fig. 10C is a graph showing comparison between the brightness of a shell colored by a coloring operation according to an embodiment of the present disclosure, the brightness of a shell in which an unremoved acid is further mixed, and the brightness of a shell in which a conductivity enhancing agent is further mixed according to an embodiment of the present disclosure;

[0023] Fig.11A is a diagram showing analysis of a casing colored with dye particles according to a conventional electronic device by a GDOES method;

[0024] Fig. 11B is a graph showing analysis of a shell colored with a colored dye particle according to an embodiment of the present invention by a GDOES method; and

[0025] Fig. 11C It shows that according to Fig.11A Coloring dye particles and according to Fig. 11B Figure 2 is a comparison between the colored dye particles. DETAILED DESCRIPTION

[0026] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment.

[0027] Reference Figure 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0028] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0029] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0030] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0031] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0032] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0033] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0034] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0035] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0036] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. Depending on the embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0037] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0038] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0040] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0041] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0042] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0043] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0044] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). Depending on the embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0045] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0046] According to an embodiment, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0047] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0048] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the function or service requested, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or without further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0049] The electronic device according to the embodiment may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0050] It should be understood that the embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0051] As used in connection with embodiments of the present disclosure, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, depending on the embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0052] The embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0053] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be published in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be published online (e.g., downloaded or uploaded) via an application store (e.g., Play StoreTM), or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a manufacturer's server, an application store's server, or a memory of a forwarding server).

[0054] According to an embodiment, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be detachably arranged in different components. According to an embodiment, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to an embodiment, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to an embodiment, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0055] Figure 2 is a front perspective view showing an electronic device 101 according to an embodiment of the present disclosure. Figure 3 is a rear perspective view showing the electronic device 101 according to an embodiment of the present disclosure.

[0056] Reference Figure 2 and 3 According to an embodiment, the electronic device 101 may include a housing 310 having a first (or front) surface 310A, a second (or rear) surface 310B, and a side surface 310C surrounding a space between the first surface 310A and the second surface 310B. According to another embodiment (not shown), the housing 310 may represent a Figure 2 The structure of a portion of the first surface 310A, the second surface 310B and the side surface 310C. According to an embodiment, at least a portion of the first surface 310A may have a substantially transparent front plate 302 (e.g., a glass plate or a polymer plate including various coatings). The second surface 310B may be formed by a substantially opaque rear plate 311. The rear plate 311 may be formed by, for example, laminated or colored glass, ceramics, polymers, metals (e.g., aluminum, stainless steel (STS) or magnesium), or a combination of at least two thereof. The side surface 310C may be formed by a side frame structure (or "side member") 318, which is connected to the front plate 302 and the rear plate 311 and includes metal and / or polymer. According to an embodiment, the rear plate 311 and the side frame structure 318 may be formed integrally together and include the same material (e.g., a metal such as aluminum).

[0057] In the illustrated embodiment, the front plate 302 may include two first regions 310D extending seamlessly and curvedly from the first surface 310A to the rear plate 311 on the two long edges of the front plate 302. Figure 3 ), the back plate 311 may include two second areas 310E extending seamlessly and curvedly from the second surface 310B to the front plate 302 on two long edges. According to an embodiment, the front plate 302 (or the back plate 311) may include only one of the first areas 310 (or the second areas 310E). Alternatively, the first area 310D or the second area 301E may be partially excluded. According to an embodiment, in a side view of the electronic device 101, the side frame structure 318 may have a first thickness (or width) for a side without the first area 310D or the second area 310E and a second thickness less than the first thickness for a side with the first area 310D or the second area 310E.

[0058] According to an embodiment, the electronic device 101 may include at least one or more of the following: a display 301, audio modules 303, 307, and 314, sensor modules 304, 316, and 319, camera modules 305, 312, and 313, a key input device 317, a light emitting device 306, and connector holes 308 and 309. According to an embodiment, the electronic device 101 may exclude at least one of the components (e.g., the key input device 317 or the light emitting device 306), or may add other components.

[0059] According to an embodiment, the display 301 may be exposed through, for example, a large portion of the front plate 302. According to an embodiment, at least a portion of the display 301 may be exposed through the front plate 302 forming the first surface 310A and the first region 310D of the side surface 310C. According to an embodiment, an edge of the display 301 may be formed to be substantially the same in shape as an adjacent outer edge of the front plate 302. According to another embodiment (not shown), the interval between the outer edge of the display 301 and the outer edge of the front plate 302 may be maintained substantially uniform to give the display 301 a larger exposed area.

[0060] According to an embodiment (not shown), the screen display area of ​​the display 301 may have a recess or an opening in a portion thereof, and at least one or more of the audio module 314, the sensor module 304, the camera module 305, and the light emitting device 306 may be aligned with the recess or the opening. According to another embodiment (not shown), at least one or more of the audio module 314, the sensor module 304, the camera module 305, the fingerprint sensor 316, and the light emitting device 306 may be included on the rear surface of the screen display area of ​​the display 301. According to an embodiment (not shown), the display 301 may be provided to be connected or adjacent to: a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field type stylus. According to an embodiment, at least a portion of the sensor modules 304 and 319 and / or at least a portion of the key input device 317 may be provided in the first area 310D and / or the second area 310E.

[0061] According to an embodiment, the audio modules 303, 307, and 314 may include a microphone hole 303 and speaker holes 307 and 314. A microphone for acquiring external sound may be provided in the microphone hole 303. In some embodiments, a plurality of microphones may be provided to detect the direction of the sound. The speaker holes 307 and 314 may include an external speaker hole 307 and a phone receiver hole 314. In an embodiment, the speaker holes 307 and 314 and the microphone hole 303 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be included without the speaker holes 307 and 314.

[0062] According to an embodiment, the sensor modules 304, 316, and 319 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 101. The sensor modules 304, 316, and 319 may include a first sensor module 304 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the first surface 310A of the housing 310, and / or a third sensor module 319 (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module 316 (e.g., a fingerprint sensor) disposed on the second surface 310B of the housing 110. The fingerprint sensor may be disposed on the second surface 310B of the housing 310 as well as the first surface 310A (e.g., the display 301). The electronic device 101 may further include a sensor module not shown, such as at least one of the following: a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip (grip) sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor 304.

[0063] According to an embodiment, the camera modules 305, 312, and 313 may include a first camera device 305 disposed on a first surface 310A of the electronic device 101, and a second camera device 312 and / or a flash 313 disposed on a second surface 310B. The camera modules 305 and 312 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 313 may include, for example, a light emitting diode (LED) or a xenon lamp. According to an embodiment, two or more lenses (an infrared (IR) camera, a wide-angle lens, and a telephoto lens (telescopic lens)) and an image sensor may be disposed on one surface of the electronic device 101.

[0064] According to an embodiment, the key input device 317 may be provided on the side surface 310C of the housing 310. According to another embodiment, the electronic device 101 may exclude all or some of the above-mentioned key input devices 317, and the excluded key input devices 317 may be implemented in other forms, for example, as soft keys on the display 301. According to an embodiment, the key input device 317 may include a sensor module 316 provided on the second surface 310B of the housing 310.

[0065] According to an embodiment, the light emitting device 306 may be disposed, for example, on the first surface 310A of the housing 310. The light emitting device 306 may provide, for example, information about the state of the electronic device 101 in the form of light. According to an embodiment, the light emitting device 306 may provide a light source that interacts with, for example, the camera module 305. The light emitting device 306 may include, for example, a light emitting diode (LED), an infrared (IR) LED, or a xenon lamp.

[0066] The connector holes 308 and 309 may include a first connector hole 308 for receiving a connector for sending or receiving power and / or data to / from an external electronic device (e.g., a universal serial bus (USB) connector) and / or a second connector hole 309 for receiving a connector for sending or receiving audio signals to / from an external electronic device (e.g., a headphone jack).

[0067] Figure 4 is an exploded perspective view showing an electronic device 101 according to an embodiment.

[0068] Reference Figure 4 , the electronic device 101 (eg, Figures 1 to 4The electronic device 101 may include a side frame structure 331, a first support member 332 (e.g., a bracket), a front panel 320, a display 330, a printed circuit board (PCB) 340, a battery 350, a second support member 360 (e.g., a rear case), an antenna 370, and a rear panel 380. According to an embodiment, the electronic device 101 may exclude at least one of the components (e.g., the first support member 332 or the second support member 360), or may add other components. At least one of the components of the electronic device 101 may be different from the components of the electronic device 101. Figure 4 At least one of the components of the electronic device 101 of or 5 is the same or similar and will not be described repeatedly below.

[0069] According to an embodiment, the first support member 332 may be disposed inside the electronic device 101 to be connected to the side frame structure 331 or integrated with the side frame structure 331. The first support member 332 may be formed of, for example, a metal and / or a non-metallic material (e.g., a polymer). The display 330 may be bonded to one surface of the first support member 332, and the printed circuit board 340 may be bonded to the opposite surface of the first support member 311. The processor, memory, and / or interface may be mounted on the printed circuit board 340. The processor may include, for example, one or more of the following: a central processing unit, an application processor, a graphics processing device, an image signal processing, a sensor hub processor, or a communication processor.

[0070] Depending on the implementation, the memory may include, for example, volatile or non-volatile memory.

[0071] According to an embodiment, the interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect, for example, the electronic device 101 to an external electronic device, and may include a USB connector, an SD card / multimedia card (MMC) connector, or an audio connector.

[0072] According to an embodiment, the battery 350 may be a device for supplying power to at least one component of the electronic device 101, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be disposed on substantially the same plane as the printed circuit board 340. The battery 350 may be integrally or detachably disposed inside the electronic device 101.

[0073] According to an embodiment, the antenna 370 may be disposed between the back plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370 may communicate with, for example, an external device over a short distance, or may wirelessly transmit or receive power required for charging. According to an embodiment, the antenna structure may be formed by a portion or a combination of the side frame structure 331 and / or the first support member 332.

[0074] According to an embodiment of the present disclosure, the electronic device may include a plurality of antenna modules 390. For example, some of the plurality of antenna modules 390 may be implemented to send or receive radio waves with different characteristics (referred to as radio waves of frequency bands A and B) to implement MIMO. As another example, some of the plurality of antenna modules 390 may be configured to send or receive radio waves with substantially the same characteristics (referred to as radio waves of frequencies A1 and A2 in frequency band A) to implement diversity. As another example, some of the plurality of antenna modules 390 may be configured to send or receive radio waves with substantially the same characteristics (referred to as radio waves of frequencies B1 and B2 in frequency band B) to implement diversity. According to an embodiment, two antenna modules may be included. Alternatively, the electronic device 101 may include four antenna modules to implement both MIMO and diversity. According to another embodiment, the electronic device 101 may include only one antenna module 390.

[0075] According to an embodiment, in consideration of transmission and reception characteristics of radio waves, when one antenna module is disposed in a first position of the printed circuit board 340, another antenna module may be disposed in a second position separated from the first position of the printed circuit board 340. As another example, one antenna module and another antenna module may be disposed in consideration of a distance therebetween depending on diversity characteristics.

[0076] According to an embodiment, at least one antenna module 390 may include a wireless communication circuit to process radio waves sent or received in an ultra-high frequency band (e.g., 6 GHz or higher and 300 GHz or lower). The conductive plate of at least one antenna module 390 may be formed by a conductive plate of a dipole structure extending in one direction or a patch-type radiating conductor. A plurality of conductive plates may be arranged to form an antenna array. A chip (e.g., an integrated circuit (IC) chip) implementing a portion of the wireless communication circuit may be disposed on the opposite surface of the surface where the conductive plate is disposed or on one side of the region where the conductive plate is disposed, and may be electrically connected to the conductive plate by a line formed by a printed circuit pattern.

[0077] According to an embodiment, at least one of the housing 310, the support member (e.g., the first support member 332 and / or the second support member 360), the side frame structure 331, the front plate 320, and / or the rear plate 380 of the electronic device 101 may at least partially include a metal material. For example, at least some of the housing 310, the support member (e.g., the first support member 332 and / or the second support member 360), the side frame structure 331, the front plate 320, and / or the rear plate 380 of the electronic device 101 may be formed by the following method: Figure 5 The electronic device 101 is manufactured by the pretreatment process and the anodizing process 10. In the illustrated embodiment, the housing 310, the support members (e.g., the first support member 332 and / or the second support member 360), the side frame structure 331, the front plate 320 and / or the rear plate 380 may be at least partially visually exposed to the outside of the electronic device 101.

[0078] Figure 5 is a flow chart illustrating a pretreatment process and anodization process 10 according to an embodiment of the present disclosure. Figure 6 is a diagram illustrating a cross section of a housing 400 according to an embodiment of the present disclosure.

[0079] According to an embodiment, Figure 6 The housing 400 may be used as Figures 2 to 4 The electronic device 101 is provided with at least one of a housing 310, a first supporting member 332 (e.g., a bracket), a second supporting member 360 (e.g., a rear shell), a side frame structure 331, a front plate 320, and / or a rear plate 380. The housing 400 may be provided as an external component, such as a side structure or a rear plate.

[0080] According to the implementation mode, reference Figure 6 The housing 400 may include a metal substrate 410 and an anodized layer 420 formed to overlap the metal substrate 410. The anodized layer 420 may include a pore wall 420a including a plurality of pores 420b, and coloring particles 430 including an organic dye 431 and a conductivity enhancer 432 injected into the plurality of pores 420b.

[0081] According to an embodiment, the housing 400 may be glossy. Generally, the glossiness of the surface of the housing 400 may be measured according to a surface glossiness measurement method. For example, under the condition of a measurement angle of 60 degrees, the glossiness of the housing 400 may be greater than or equal to 40GU. However, the glossiness of the housing 400 is not limited to the above-mentioned embodiment, and various changes may be made to the design.

[0082] According to an embodiment, the metal base 410 of the housing 400 may include all metal external materials that can be anodized. For example, the metal of the metal base 410 may include all structures that can be anodized to be colored by adsorbing dye in the pores. For example, the metal may be aluminum or an aluminum alloy. However, the type of metal is not limited to the above-mentioned embodiment, and the design can be freely changed.

[0083] According to the implementation mode, reference Figure 5 The pretreatment process and anodizing process 10 may include an operation 11 for processing the shape of the frame of the metal substrate 410 , a glazing operation 12 , a degreasing (degreasing) operation 13 , an anodizing operation 14 , a coloring operation 15 and / or a sealing operation 16 .

[0084] According to an embodiment, operation 11 of processing the shape of the frame of the metal substrate 410 is an operation of manufacturing a frame of a metal material (e.g., aluminum, magnesium, and / or titanium) into a designed component shape, and processing or manufacturing the metal material into a metal substrate 410 having a designed shape through a process such as extrusion, pressing, die casting, and / or cutting (e.g., computer numerical control (CNC) processing). The metal substrate 410 may have a substantially flat plate shape, and may be shaped according to a product to be actually manufactured (e.g., Figures 2 to 4 The electronic device 101 may be configured to have the required specifications and shape by at least partially including a curved surface or including holes, recesses and / or ribs or partitions.

[0085] According to an embodiment, the glazing operation 12 is a process of increasing the glossiness of the surface of the manufactured metal substrate 410, and a glossy appearance can be formed by glazing by performing polishing. For example, the surface roughness of the metal substrate 410 can be reduced by physical or chemical polishing. According to an embodiment, the polishing operation can be omitted, or it can be replaced by a process (such as sandblasting) that reduces the glossiness by increasing the surface roughness. For example, a polishing operation or a sandblasting process can be selectively performed as a process for adjusting the glossiness or surface roughness on the surface of the metal substrate 410 according to the specifications required for the product to be actually manufactured. In an embodiment, the surface roughness adjusted by the polishing operation or the sandblasting process can be recognized by the user's sense of touch.

[0086] According to an embodiment, the degreasing operation 13 may be an operation of removing dust and / or foreign matter that is not removed in the treating operation 11 and / or the glazing operation 12 .

[0087] According to an embodiment, the anodizing operation 14 is a process of increasing the reliability of the metal substrate 410 or an external component, and an anodized layer 420 may be formed on the surface of the metal substrate 410. The anodized layer 420 may improve the durability or reliability of the metal substrate 410 by, for example, increasing the strength (e.g., hardness) on the surface of the metal substrate 410 or preventing corrosion of the metal substrate 410 due to the external environment. The anodizing operation 14 is a process of forming a porous oxide film, and an anodized layer 420 may be grown on the surface of the metal substrate 410, for example, by applying a voltage to the metal substrate 410 placed (deposited) in an electrolyte solution (or electrolyte) including at least one of sulfuric acid, hydroxy acid, oxalic acid, and / or chromic acid. According to an embodiment, the applied voltage, temperature, and / or placement (deposition) time may be adjusted according to the use of the film. For example, the applied voltage may be about 5V or more and 40V or less. For example, the placement (deposition) time may be about 10 minutes or more and 3 hours or less. For example, the temperature of the electrolyte may be applied in the range of about 5 degrees to 30 degrees.

[0088] According to the implementation mode, reference Figure 6 After the anodizing operation 14, the housing 400 may further include an anodized layer 420 formed on the surface of the metal substrate 410. The anodized layer 420 may include, for example, a pore wall 420a including a plurality of pores 420b, and may be easily colored. Here, "easily colored" may be understood as being easier to color the anodized layer 420 than coloring the material on which the anodized layer 420 is not formed or the surface of the metal substrate 410.

[0089] According to an embodiment, after forming the anodized layer 420 including the porous oxide film, a coloring operation 15 may be performed by adsorbing the colored dye particles 430 in a plurality of pores 420b. The coloring operation 15 may be a process of dyeing or coloring the surface of the metal substrate 410, such as the anodized layer 420, with a specified color. According to an embodiment, the coloring operation 15 may include an immersion method and / or an electrolytic coloring method. The immersion method may be a method in which the colored dye particles 4.3 are diffused or adsorbed to the anodized layer 420 by placing (depositing) the metal substrate 410 in a solution in which the colored dye particles 430 are added and / or dissolved, so that the colored dye particles 4.3 are diffused or adsorbed to the anodized layer 420 to achieve coloring (color). The electrolytic coloring method may be a method of coloring in a metal salt electrolyte by applying an electric current. According to an embodiment of the present invention, the coloring operation 15 may be colored using an immersion method. However, the coloring method is not limited to the above-mentioned embodiment, and various changes may be made to the design.

[0090] According to an embodiment, the colored dye particles 430 can use an organic dye 431 capable of implementing various colors. This is a method of dissolving the organic dye 431 in water and then dipping the product to color it. In order to implement the desired color, dyes of various colors can be mixed and used, or only a single dye can be used. The color brightness can be adjusted by the dye concentration and the placement (sedimentation) time.

[0091] According to an embodiment, in the coloring operation 15, the organic dye 431 may be dissolved together with the conductive enhancer 432 for coloring. When the conductive enhancer 434 is added, a deeper and more vivid color appearance may be implemented than a coloring operation in which the dye concentration is increased or the coloring time is increased. A detailed description of adding the conductive enhancer 432 is described below.

[0092] According to an embodiment, the anodized layer 420 may be colored through the coloring operation 15. For example, the organic dye 431 may be diffused or adsorbed into the anodized layer 420 or received into the plurality of pores 420b, thereby implementing a designated color on the surface of the metal substrate 410.

[0093] According to an embodiment, a sealing operation 16 of sealing the plurality of pores 420b of the activated anodized layer 420 may be performed. The sealing operation is a process of preventing the coloring dye particles 430 from separating. For example, by sealing the plurality of pores 420b, the coloring dye particles 430 may be substantially retained in the anodized layer 420. The sealing operation 16 includes a metal salt treatment method in which a metal salt is used for sealing and a non-metallic salt treatment method in which an organic material is used for sealing, as well as a hydration sealing treatment using water and water vapor. By performing the sealing operation 16, discoloration (fading) of the metal substrate 410 may be suppressed or prevented.

[0094] Hereinafter, the coloring operation 15 is described in detail.

[0095] According to an embodiment, when coloring is performed by immersion in the coloring operation 15, coloring may be promoted so that many coloring dye particles 430 may diffuse and be absorbed into the plurality of pores 420b in a short time. Figure 2 In order to implement the desired color in the electronic device 101 of the embodiment of the present invention, the treated metal substrate 410 can be anodized and then immersed in a coloring tank in which the colored dye particles 430 are dissolved. The anodized material can be positively charged (+), and the organic dye 431 can have a negative (-) charge. Due to the electrical properties, the organic dye 431 as a (-) ion diffuses and adsorbs to the multiple holes 420b in the film of the (+) pole, and then the colored dye particles 430 in the multiple holes 420b are stabilized by the sealing operation 16, thereby obtaining a film of the desired color. The adsorption amount of the organic dye 431 can vary depending on the concentration of the dye and / or the product placement (deposition) time.

[0096] According to the embodiment of conventional electronic device, coloring operation 15 can be carried out to implement the shell 400 with deep and bright color by increasing the concentration of coloring dye particles 430. In the case of conventional electronic device, the concentration of coloring dye particles 430 during coloring operation 15 can be, for example, available in the range of about 20g / L or lower. In the case of conventional electronic device, the placement (sedimentation) time in coloring operation 15 can be, for example, appropriate in the range of about 5 seconds to 20 minutes. When the concentration of coloring dye particles 430 is applied to the maximum value or more to implement the shell 400 with deep and bright color, the coloring dye particles 430 are difficult to dissolve, and the undissolved coloring dye particles 430 can be precipitated or floated in water, which can interfere with coloring or deteriorate the quality.

[0097] Figure 7 is a diagram showing the relationship between coloring time and brightness in a conventional electronic device.

[0098] According to an embodiment, the coloring time may be increased to implement the housing 400 having a deep and vivid color. Figure 7 , it can be determined that the adsorption amount of the colored dye particles 430 decreases the brightness as the coloring time increases, but under the condition of 8 minutes or longer, the change in the decrease in brightness slows down. This may mean that under the condition of a predetermined time or longer, the adsorption amount of the colored dye particles 430 slows down. It may mean that even if the concentration of the colored dye particles 430 increases and the coloring time increases, there are limitations on the implementation of dark colors. According to an embodiment, the method of increasing the coloring time may lead to an increase in cost due to an increase in processing time. Here, brightness can be represented as a CIE color table L* value. The closer the L* value is to 100, the brighter the color (white). The closer the L* value is to 0, the darker the color (black).

[0099] According to the embodiment of conventional electronic device, in order to implement the housing 400 with deep and bright color, the temperature of the anodized electrolyte can be increased when the anodized film is formed. When the temperature of the electrolyte solution is increased, the size of the plurality of holes 420b can be increased, but the anodized layer 420 with high temperature can not ensure reliability due to its weak durability. For example, when the surface of the anodized layer 420 is changed (for example, a method of designing the shape of the surface with low light reflectivity by making fine bends on an aluminum material or forming fine bends on the anodized layer 420), it is necessary to apply etching to the surface of the aluminum material and / or the anodized layer 420 so that it is limited to a matte housing, and it cannot be implemented to a shiny housing. When the anodized layer 420 is etched, it is difficult to ensure reliability due to poor film durability.

[0100] According to an embodiment of the present invention, in order to overcome the above limitations and implement a dark color, colored dye particles 430 including a conductive enhancer 432 together with an organic dye 431 are applied during the coloring process. The conductive enhancer 432 can increase the energy of the colored dye particles 430 so that the colored dye particles 430 can be easily diffused and stably adsorbed into the pores in the anodized film.

[0101] According to an embodiment, the conductivity enhancer 432 may include all materials that can affect the conductivity enhancement of the colored dye particles 430. For example, it may include an alkali salt (basic salt). For example, it may include a weak alkali salt of pH 6 or higher and pH 8 or lower. For example, the conductivity enhancer 432 may include a gluconate.

[0102] Figure 8 431 is a graph showing a change in potential value according to application of the conductive enhancer 432. Potential is the potential energy for a unit charge, which refers to the amount of work (work amount) required to transfer the charge from a reference point to another location. According to an embodiment, when the conductive enhancer 432 is added to the colored dye particles 430 including the organic dye 431, the potential value may vary.

[0103] Reference Figure 8 , when the conductivity enhancer 432 is not applied (for example, when the amount of the conductivity enhancer added is 0.00 g / L), it can be determined that the potential value is the highest. The high potential value may mean that a large amount of energy is required for the negative (-) colored dye particles 430 to diffuse into the plurality of pores 420b of the positive (+) anodized layer 420. Figure 8 , it can be determined that, with the addition of the conductive enhancer 432, the potential value decreases. This may mean that the negative (-) colored dye particles 430 of the conductive enhancer 432 can be easily diffused into the multiple holes 420b of the anodized layer 420 with only a small amount of energy. When the conductive enhancer 432 is not added in a conventional electronic device, it may be difficult for the colored dye particles 430 to diffuse into the anodized layer 420. When the conductive enhancer 432 according to the embodiment is added, the colored dye particles 430 can be easily diffused with less energy. With the addition of the conductive enhancer 432, the colored dye particles 430 that are difficult to diffuse can be easily diffused, thereby increasing the coloring speed and adsorbing many colored dye particles 430b into the multiple holes 420b, so that a bright and deep color can be implemented.

[0104] Fig. 9A is a graph showing a comparison of black dye brightness between a conventional electronic device and an electronic device 101 to which a conductivity enhancer 432 is added according to the present invention. Fig. 9B : is a graph showing a comparison of red, green and blue (RGB) values ​​between a conventional electronic device and an electronic device 101 to which a conductivity enhancing agent 432 is added according to the present invention.

[0105] According to the implementation mode, reference Fig. 9A , the depth and sharpness of the color of the housing 400 are shown as brightness (L*) values. After preparing the same series of black dyes (e.g., black dye A, black dye B and black dye C in FIG. 9 ) manufactured by different companies, the colored dye particles 430 are dissolved with the maximum concentration (20 g / L) in the soluble range, and the maximum time (20 minutes) is applied as the coloring time in the range suitable for large-scale manufacturing. The housing 400 of the electronic device has a glossy surface, and the same conditions are applied except whether the conductive enhancer 432 is applied. As a result of the experiment, even under the same conditions, each colored dye particle 430 has a different brightness (L*) value (which is depth), and when the conductive enhancer 432 is applied, it shows a brightness value lower than the brightness value of the color when only the conventional organic dye 431 is applied under all conditions. This shows that the color depth of the product appearance can be enhanced by the effect of the conductive enhancer 432. In an embodiment of the present invention, the color depth of the glossy high gloss housing 400 can have a value of brightness (L*)=22.0 or less.

[0106] According to the implementation mode, reference Fig. 9B , the L*, a*, b* values ​​in the CIE color table can be converted into red, green, and blue (RGB) values ​​indicating red, green, and blue as the primary colors of light to compare the degree of white and black. For example, RGB (255, 255, 255) may mean white in which red, green, and blue are all the brightest. For example, RGB (0, 0, 0) may mean black in which no light exists. The closer each value of R, G, and B is to "0", the closer it may be to pure black. Refer to Fig. 9B , the left figure shows each RGB value of a conventional electronic device A including an organic dye, and the right figure shows each RGB value of a glossy housing 400 including an organic dye 431 and a conductive enhancer 432 according to an embodiment of the present invention. According to an embodiment, it can be determined that the RGB value of the glossy housing 400 according to an embodiment of the present invention is lower than the RGB value of the conventional electronic device A. For example, the RGB value of the glossy housing 400 according to an embodiment of the present invention may be 0.20 or more and 0.24 or less. For example, the RGB value of the glossy housing 400 according to an embodiment of the present invention may be RGB (0.22, 0.22, 0.22) or less. For example, the RGB value of the conventional electronic device A may be 0.23 or more and 0.26 or less. For example, the RGB value of the conventional electronic device A may be RGB (0.24, 0.24, 0.24) or more. This may mean that it is closer to pure black under the condition of the conductive enhancer 432 than under normal conditions.

[0107] Fig. 10Ais a graph showing changes in potential when unremoved acid is mixed with colored dye particles 430 in a conventional electronic device. Fig. 10B 4 is a graph showing a change in potential according to an addition amount of a conductivity enhancer when an unremoved acid is mixed with the coloring dye particles 430 . Fig. 10C is a graph showing comparison between the brightness of the shell 400 colored by the coloring operation 15 according to an embodiment of the present disclosure, the brightness of the shell in which the unremoved acid is further mixed, and the brightness of the shell 400 in which the conductivity enhancer 432 is further mixed according to an embodiment of the present invention.

[0108] According to an embodiment, the coloring operation 15 may be performed as follows: after an anodizing process in which the product is immersed in an acid solution (electrolyte solution) such as sulfuric acid, hydroxy acid and / or chromic acid to form micropores, the dye is then adsorbed into the pores to implement color. After the anodizing operation 14, the acid solution may not be completely removed, but may remain in the product and be mixed into the coloring dye particles 430. Typically, after the anodizing process, there is a process of removing the acid remaining in the product through 2 to 3 washing steps, but in the case of Figure 2 and 3 In the case of the complicated electronic device 101 shape shown in , it may be difficult to remove the residual acid. In order to remove the residual acid in the product, a washing process may be added or the washing process time may be increased, but in such a case, the activity level of the anodized layer 420 may be reduced, making it difficult to obtain the desired color quality. When the acid remaining in the electronic device 101 is mixed into the coloring dye particles 430 without being removed, the potential may increase. Fig. 10A As the concentration of the mixed acid (e.g., sulfuric acid) increases, the potential of the colored dye particles 430 may increase. As H+ ions are increased by the mixed acid, diffusion of (-) ions as the colored dye particles 430 into the plurality of holes 420b may be disturbed. When the acid remaining in the electronic device 101 is mixed into the colored dye particles 430 without being removed, the coloring power may be reduced, or it may be difficult to implement a deep and vivid color by coloring.

[0109] Reference Fig. 10B It can be confirmed that as the amount of the conductive enhancer 432 added increases, the potential increased as the acid is mixed into the colored dye particles 430 decreases. The conductive enhancer 432 can counteract the H+ ions in the acid-mixed colored dye particles 430. This makes the management of the colored dye particles 430 easy.

[0110] Reference Fig. 10C, it can be determined that coloring is performed in the same manner as conventional coloring when coloring is performed in a dye tank (e.g., reference mark (1)), where the potential value increased by the mixed acid (e.g., reference mark (2)) is restored to the original potential value by adding the conductivity enhancer 432 (e.g., reference mark (3)).

[0111] Fig.11A is a diagram showing analysis of a housing colored with dye particles according to a conventional electronic device by a GDOES method. Fig. 11B is a graph showing analysis of a housing 400 colored with colored dye particles 430 according to an embodiment of the present invention by a GDOES method. Fig. 11C It shows that according to Fig.11A Coloring dye particles and according to Fig. 11B A diagram comparing the colored dye particles 430 .

[0112] According to an embodiment, the glow discharge optical emission spectroscopy (GDOES) analysis method is a quantitative analysis method using glow discharge, which is a spectral analysis method that can analyze composition changes from the surface to the cross section along the depth direction. In the portion where the anodized layer 420 is formed (X-axis, sputtering time: a period of 0 to 500 seconds), the dye adsorption amount and dye adsorption depth in the embodiment of the present invention can be compared with those in a conventional electronic device using a dye (e.g., a black dye) signal. It can be determined that when dye particles according to a conventional electronic device are used, the signal of the colored dye particles 430 is high at the entrance (start) of the anodized layer 420, and the signal decreases toward the lower end portion. According to an embodiment of the present invention, it can be determined that when the colored dye particles 430 are used, the dye signal is high throughout the upper and lower end portions of the anodized layer 420. It can be determined that the dye is adsorbed to a depth of about 60% or more from the entrance of the anodized layer 420. With reference to Fig. 11C , it can be determined that, in the product to which the conductivity enhancer 432 is applied, the color of the colored dye particles 430 is darker than in the condition in which the conductivity enhancer 430 is not applied. Therefore, when the conductivity enhancer 432 is applied, by diffusing and / or adsorbing more dye particles into the pores compared to a conventional coloring operation, the appearance of a deep and vivid color can be implemented.

[0113] As a surface treatment method for aluminum materials, anodizing can implement various colors using dyes, and various colors can be implemented by mixing various dyes or under coloring conditions. However, there are some limitations in implementing dark colors with a lightness (L*) of 24 or less.

[0114] According to an embodiment of the present invention, an electronic device having an appearance of an aluminum frame including a deep and vivid color may be provided by applying a conductive enhancer together with an organic dye in a coloring step of an anodizing process of the aluminum frame.

[0115] According to an embodiment of the present invention, deep and vivid colors can be implemented in an aluminum frame while including a glossy aluminum frame appearance having a value of L*22 or less in the CIE L*a*b* color space when black is applied, thereby providing an exterior material with a deep and brilliant color for a portable electronic device.

[0116] The objects of the present disclosure are not limited to the above description, and other unmentioned objects will be apparent to those of ordinary skill in the art from the following description.

[0117] According to an embodiment of the present invention, an electronic device including an aluminum frame having a darker and more vivid color can be provided by applying a conductivity enhancer together with an organic dye under the same anodizing conditions (applied voltage, coloring concentration / temperature / time) in the coloring step of the anodizing process of the aluminum frame.

[0118] According to an embodiment of the present invention, a conductive enhancer is applied to implement a deep and vivid color on a glossy appearance. Therefore, by enhancing the diffusion and adsorption of the dye during coloring, a deeper and more vivid color than the color of the appearance that can be implemented in conventional techniques can be implemented.

[0119] Effects obtainable from the present disclosure are not limited to the above-mentioned effects, and other unmentioned effects may be apparent to those of ordinary skill in the art from the following description.

[0120] In an electronic device including a glossy housing according to an embodiment of the present disclosure, the housing may include a metal substrate and an anodized layer formed overlapping the metal substrate. The anodized layer may include a pore wall including a plurality of pores and coloring dye particles including a conductive enhancer and an organic dye injected into the plurality of pores.

[0121] According to an embodiment, the colored dye particles may have the dye adsorbed up to a depth of 60% or more of the anodized layer.

[0122] According to an embodiment, the conductivity enhancer may be a weak base salt having a pH of 6 or more and a pH of 8 or less.

[0123] According to an embodiment, the housing may have a value of L*22 or less in the CIE L*a*b* color space.

[0124] According to an embodiment, the housing may have a value of RGB (0.22, 0.22, 0.22) or less.

[0125] According to an embodiment, the housing may have a glossiness of 40 GU or more.

[0126] According to an embodiment, the speed at which the colored dye particles diffuse into the plurality of pores may be increased as the conductivity enhancer is added.

[0127] According to an embodiment, the number of H+ ions introduced in the colored dye particles may be reduced as the conductivity enhancer is added.

[0128] The method for manufacturing a glossy housing according to an embodiment of the present disclosure may include a glazing operation for polishing a metal substrate of the housing, an anodizing operation for forming an oxide film including a plurality of pores, and a coloring operation for coloring by adsorbing an organic dye into the plurality of pores. The coloring operation may be performed by applying a conductive enhancer together with the organic dye.

[0129] According to an embodiment, after the anodizing operation, the case may include a metal substrate and an anodized layer formed on a surface of the metal substrate.

[0130] According to an embodiment, the anodized layer may include a pore wall including a plurality of pores, and coloring dye particles including a conductivity enhancer and an organic dye injected into the plurality of pores.

[0131] According to an embodiment, the colored dye particles may have the dye adsorbed up to a depth of 60% or more of the anodized layer.

[0132] According to an embodiment, the conductivity enhancer may be a weak base salt having a pH of 6 or more and a pH of 8 or less.

[0133] According to an embodiment, the housing may have a value of L*22 or less in the CIE L*a*b* color space.

[0134] According to an embodiment, the housing may have a value of RGB (0.22, 0.22, 0.22) or less.

[0135] According to an embodiment, the housing may have a glossiness of 40 GU or more.

[0136] According to an embodiment, the speed at which the colored dye particles diffuse into the plurality of pores may be increased as the conductivity enhancer is added.

[0137] According to an embodiment, the number of H+ ions introduced in the colored dye particles may be reduced as the conductivity enhancer is added.

[0138] According to an embodiment, the metal substrate may be at least one metal having a structure capable of adsorbing the coloring dye particles into a plurality of pores by being capable of anodization.

[0139] In an electronic device including a glossy housing according to an embodiment of the present disclosure, the housing may include a metal substrate and an anodized layer formed overlapping the metal substrate. The anodized layer may include a hole wall including a plurality of holes and colored dye particles including a conductive enhancer having a pH of 6 or higher and a pH of 8 or lower and an organic dye injected into the plurality of holes. The housing may have a value of L*22 or less in the CIE L*a*b* color space.

[0140] It is apparent to those skilled in the art that the dark housing 400 and the electronic device 101 including the same according to the embodiments of the present disclosure as described above are not limited to those shown in the above embodiments and the accompanying drawings, and various changes, modifications or alterations may be made thereto without departing from the scope of the present disclosure.

Claims

1. An electronic device (101 of FIG. 1 ), comprising a glossy housing (400 of FIG. 6 ), wherein the housing comprises: A metal substrate (410 of FIG. 6 ); and An anodized layer (420 of FIG. 6 ) formed overlapping the metal substrate, wherein the anodized layer (420 of FIG. 6 ) comprises: A hole wall (420a of FIG. 6 ) including a plurality of holes (420b of FIG. 6 ); as well as The colored dye particles (430 of FIG. 6) including the conductivity enhancer (432 of FIG. 6) and the organic dye (431 of FIG. 6) injected into the plurality of holes. 2 . The electronic device according to claim 1 , wherein the colored dye particles have a dye adsorbed up to a depth of 60% or more of the anodized layer.

3. The electronic device according to claim 1, wherein the conductivity enhancer is a weak base salt having a pH of 6 or higher and a pH of 8 or lower. The electronic device according to claim 1 , wherein the housing has a value of L*22 or less in a CIE L*a*b* color space. The electronic device according to claim 1 , wherein the housing has a value of RGB (0.22, 0.22, 0.22) or less. The electronic device according to claim 1 , wherein the housing has a glossiness of 40 GU or higher. 7 . The electronic device of claim 1 , wherein a speed at which the colored dye particles diffuse into the plurality of pores increases with the addition of the conductivity enhancer.

8. The electronic device according to claim 1, wherein the number of H+ ions introduced into the colored dye particles decreases as the conductivity enhancer is added.

9. A method for manufacturing a glossy housing of an electronic device (10 of FIG. 5 ), the method comprising: A glazing operation (12 of FIG. 5 ) for polishing the metal substrate of the housing; Anodizing operation to form an oxide film containing a plurality of pores (14 in FIG. 5 ); and A coloring operation (15 of FIG. 5) of coloring is performed by adsorbing an organic dye into the plurality of pores, wherein the coloring operation is performed by applying a conductive enhancer together with the organic dye. 10 . The method of claim 9 , wherein after the anodizing operation, the housing includes the metal substrate and an anodized layer formed on a surface of the metal substrate.

11. The method according to claim 10, wherein the anodized layer comprises: a hole wall comprising the plurality of holes; as well as Colored dye particles including an organic dye and a conductivity enhancer injected into the plurality of pores. 12 . The method of claim 9 , wherein the housing has a value of L*22 or less in a CIE L*a*b* color space.

13. The method of claim 11, wherein a rate at which the colored dye particles diffuse into the plurality of pores increases with the addition of the conductivity enhancer.

14. The method according to claim 11, wherein the amount of H+ ions introduced into the colored dye particles decreases as the conductivity enhancer is added.

15. The method according to claim 11, wherein the metal substrate is at least one metal having a structure capable of adsorbing the colored dye particles in the plurality of pores by anodizing.

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