Process for manufacturing thick-edge pot body by heating

By heating and spinning the wafer substrate with higher strength, the problem of difficult to form thick edges in the spinning process is solved, and the stable production of thick edge pots is achieved, and the overall performance of the pots is improved.

CN119634538AInactive Publication Date: 2025-03-18YONGKANG CHUANGKE MACHINERY CO LTD
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Patent Information

Application Number
CN202411783249.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-05
Publication Date
2025-03-18
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing spinning process is difficult to mold thick edges on high-strength wafer substrates, and the processing is difficult.

Method used

Heat treatment technology is used to reduce the strength of the edge of the wafer substrate, and a special spinning wheel is used to perform edge compression thickness and thin-wall spinning to form a thick-edged pot.

Benefits of technology

It effectively reduces the difficulty of thick edge processing, and stabilizes the production of pot body with thick edge shape, which improves the overall firmness and service life of the pot body.

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Abstract

According to the technology for manufacturing the thick-edge pot body through heating, a spinning wheel is used for machining a wafer base material, the spinning wheel comprises a connecting disc, an annular concave position, a first convex position step and a second convex position step, the annular concave position is located between the connecting disc and the first convex position step, and the second convex position step is connected to the first convex position step; the diameter of the outermost edge of the first convex step is larger than that of the outermost edge of the second convex step; the technology for manufacturing the thick-edge pot body through heating comprises the following steps of spinning preparation, heating treatment, edge thickening, thin-wall spinning, thick edge forming and thick edge shaping. According to the invention, the problem that a pot body with a thick edge cannot be processed from a wafer base material with relatively high strength is solved.
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