Circuit board fault testing method and system for microcomputer host

Abstract

The present invention relates to the technical field of circuit board fault detection, and specifically to a circuit board fault testing method and system for a microcomputer host. The present invention divides the module area of ​​the circuit board first; collects electromagnetic intensity data in different module areas and at adjacent edges under different load states; then analyzes the change of electromagnetic intensity data of a single module area during load change to obtain the abnormal degree of dynamic response of current in the module area; at the same time, monitors the change of electromagnetic intensity data of two module areas with interaction when the load changes, and evaluates the coordination of signal transmission between interactive module areas; finally, constructs a response abnormality fitting model of the module area, and combines the abnormal degree of dynamic response to achieve accurate positioning of specific abnormal module areas. It has the characteristics of accurate positioning of circuit board fault position and simple operation.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board fault detection, and in particular to a circuit board fault testing method and system for a microcomputer host. Background Art

[0002] Microcomputers are easy to carry, lightweight, and powerful, so they have been widely used in various fields of daily life, such as business, office, entertainment, and learning. The circuit board in a microcomputer is one of the most basic and important components, on which the main circuit system of the microcomputer is installed. Therefore, in order to ensure the normal use of the microcomputer, it is necessary to conduct a comprehensive, accurate, and rapid inspection of its circuit board during production; in addition, damage to the circuit board is also the main factor causing quality problems in microcomputers, and the circuit board also needs to be comprehensively, accurately, and rapidly inspected.

[0003] In the prior art, when testing a circuit board, a plurality of probes corresponding to the plurality of contacts of the circuit board are usually arranged on the multilayer board, and the plurality of probes are connected by a plurality of wires, and then the circuit condition of the circuit board is tested to see if it is qualified through a connection control panel.

[0004] However, compared with the circuit boards of conventional computer hosts, the circuit boards of microcomputer hosts are characterized by high density and multiple layers. In the process of fault monitoring, due to the high degree of integration of its own circuits and the presence of some signal circuits buried in the internal layer, it is difficult to directly obtain internal signals through surface probes. In addition, the circuit board of a microcomputer needs to connect multiple independent unit module areas in a limited space, such as CPU, storage module area, communication module area, etc. These module areas each have different functions when the microcomputer is running, and different methods of repair are required when faults occur in different module areas; however, due to the relatively small size of the circuit board, the high degree of integration of the internal circuits, and the close distance between its various functional areas, it is difficult to accurately locate the fault location, resulting in the inability to carry out accurate and effective repair or replacement. In addition, during the detection process, it is also necessary to avoid collision and damage to the components of the circuit board, so as to ensure the efficiency and yield of circuit board production and not affect the normal use of the microcomputer. Summary of the invention

[0005] In order to solve the above technical problems, the object of the present invention is to provide a circuit board fault testing method and system for a microcomputer host.

[0006] According to a first aspect of an embodiment of the present invention, a circuit board fault testing method for a microcomputer host is provided, and the technical solution adopted is specifically as follows:

[0007] Divide the circuit board into module areas and mark the adjacent edges between two adjacent module areas;

[0008] Collect electromagnetic intensity data in different module areas and at adjacent edges under different load conditions;

[0009] Based on the electromagnetic intensity data under different load states, the corresponding relationship between the electromagnetic intensity variation amplitude and the load variation amplitude in the module area is analyzed to obtain the abnormal degree of dynamic response of each module area;

[0010] Based on the electromagnetic intensity data under different load states, the fuzziness of the adjacent edges and the nonlinearity between the electromagnetic intensity at the adjacent edges and the load size are analyzed to obtain the coordination of the current signal transmission between two adjacent module areas;

[0011] Based on the electromagnetic intensity data under different load states, the degree to which the module area is affected by its interactive module area is analyzed, and the response abnormality of the module area is obtained by combining the coordination of current signal transmission between the two module areas;

[0012] According to the response abnormality degree and in combination with the dynamic response abnormality degree, the abnormality degree of the module area is obtained, and the abnormal module area is determined.

[0013] In some embodiments of the present invention, based on the electromagnetic intensity data under different load states, the corresponding relationship between the electromagnetic intensity change amplitude and the load change amplitude in the module area is analyzed to obtain the abnormal degree of dynamic response of each module area, including:

[0014] In the module area, obtaining an electromagnetic intensity variation curve during a load variation process and a corresponding load variation curve;

[0015] The Pearson correlation coefficient between the electromagnetic intensity variation curve and the load variation curve is analyzed to obtain the abnormal degree of dynamic response of each module area.

[0016] In some embodiments of the present invention, analyzing the ambiguity of the adjacent edges based on electromagnetic intensity data under different load states includes:

[0017] For adjacent edges between two adjacent module areas, a rectangular area is obtained in each of the two adjacent module areas;

[0018] Get two rectangular areas respectively The mean value of electromagnetic intensity at the time;

[0019] Analyze two rectangular areas in The difference in the mean electromagnetic intensity at the time is obtained, and the adjacent edges are The ambiguity of the moment;

[0020] All monitoring moments are traversed, the average of the blurriness at all moments is calculated, and the blurriness of the adjacent edges is obtained.

[0021] In some embodiments of the present invention, based on electromagnetic intensity data under different load states, analyzing the nonlinearity between the electromagnetic intensity at the adjacent edges and the load size includes:

[0022] According to the electromagnetic intensity data under different load states, a curve of electromagnetic intensity changing with load size is constructed to obtain a fitting function;

[0023] The second-order derivative of the fitting function is calculated, and the integral of the second-order derivative within the load size variation range is calculated to obtain the nonlinear degree between the electromagnetic intensity at the adjacent edges and the load size.

[0024] In some embodiments of the present invention, analyzing the degree to which the module area is affected by its interactive module area based on electromagnetic intensity data under different load states includes:

[0025] According to the electromagnetic intensity data under different load states, the standard deviations of the electromagnetic intensity data of the module area and its adjacent module area under different load states are analyzed respectively to obtain the degree of difference in resonance frequency between the module area and its adjacent module area;

[0026] According to the design file of the circuit board, the number of interactive lines between the module area and its adjacent module area is obtained;

[0027] The degree to which the module area is affected by its interactive module area is obtained according to the degree of difference in the resonance frequencies and the number of the interactive lines.

[0028] In some embodiments of the present invention, obtaining the abnormality degree of the module area according to the abnormality degree of the response in combination with the abnormality degree of the dynamic response, and determining the abnormal module area includes:

[0029] Calculating the difference between the dynamic response abnormality degree and the response abnormality degree to obtain the abnormality degree of the module area;

[0030] Preset abnormality threshold;

[0031] Determining whether the abnormality level is greater than the abnormality level threshold;

[0032] If yes, then there is a line abnormality in the module area corresponding to the abnormality degree.

[0033] In some embodiments of the present invention, dividing a circuit board into module areas and obtaining adjacent edges between two adjacent module areas includes:

[0034] According to the design file of the circuit board, each functional module area of ​​the circuit board is marked, the circuit board is divided into module areas, and the adjacent edges between two adjacent module areas are obtained.

[0035] In some embodiments of the present invention, collecting electromagnetic intensity data in different module areas and at adjacent edges under different load conditions includes:

[0036] Using an electromagnetic scanner, collecting electromagnetic intensity data in different module areas and at adjacent edges under different load conditions;

[0037] The electromagnetic scanner has a probe scanning frequency range of 1Mhz-6Ghz and a scanning accuracy of less than 1mm;

[0038] A programmable DC power supply is used to achieve regulation of different loads.

[0039] According to a second aspect of an embodiment of the present invention, a circuit board fault testing system for a microcomputer host is provided, comprising: a memory and a processor, wherein:

[0040] The memory is used to store program codes;

[0041] The processor is used to read the program code stored in the memory and execute the method described in the first aspect of the embodiment of the present invention.

[0042] In some embodiments of the present invention, the processor comprises:

[0043] The electromagnetic intensity data acquisition module is used to divide the circuit board into module areas and mark the adjacent edges between two adjacent module areas; and collect electromagnetic intensity data in different module areas and at the adjacent edges under different load conditions;

[0044] A dynamic response abnormality degree analysis module is used to analyze the corresponding relationship between the electromagnetic intensity change amplitude and the load change amplitude in the module area based on the electromagnetic intensity data under different load states, and obtain the dynamic response abnormality degree of each module area;

[0045] A current signal transmission coordination analysis module is used to analyze the fuzziness of the adjacent edges and the nonlinearity between the electromagnetic intensity at the adjacent edges and the load size based on the electromagnetic intensity data under different load states, so as to obtain the coordination of the current signal transmission between two adjacent module areas;

[0046] A response abnormality analysis module is used to analyze the degree to which the module area is affected by its interactive module area based on the electromagnetic intensity data under different load states, and to obtain the response abnormality of the module area in combination with the coordination of current signal transmission between the two module areas;

[0047] The abnormal module area determination module is used to obtain the abnormal degree of the module area according to the response abnormality and the dynamic response abnormality, and determine the abnormal module area.

[0048] Compared with the prior art, the circuit board fault testing method and system for a microcomputer host provided by the present invention has the following beneficial effects:

[0049] The present invention uses an electromagnetic scanner to detect and analyze the electromagnetic field generated by the circuit board in the working state. First, the module area for collecting data is divided according to the functional module areas of the circuit board; then, the electromagnetic intensity data obtained by the detection of a single module area during the load change process is analyzed to obtain the abnormal degree of the dynamic response of the module area current; at the same time, the electromagnetic field signals of the two module areas with interaction when the load changes are monitored to evaluate the coordination of the signal transmission between the module areas; then, by analyzing the degree of influence of the module area by its interactive module area, combined with the coordination of the current signal transmission between the two module areas, the response abnormality of the module area is obtained; finally, the magnitude of the response abnormality and the dynamic response abnormality is compared to obtain the abnormal degree of the module area, and the precise positioning of the specific abnormal module area is achieved. The method and system of the present invention avoid the problem of collision and damage to the components of the circuit board during the detection process through non-contact detection, thereby ensuring the efficiency and yield of the circuit board production; through the division of the module area and the monitoring and analysis based on the module area, the accurate evaluation and positioning of the specific faults on the high-integration microcomputer circuit board is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the technical solutions and advantages in the embodiments of the present invention or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0051] Figure 1 A basic flow chart of a circuit board fault testing method for a microcomputer host provided by an embodiment of the present invention;

[0052] Figure 2 A schematic diagram of the basic composition of a circuit board fault testing system for a microcomputer host provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0053] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the circuit board fault testing method and system for a microcomputer host proposed by the present invention, its specific implementation method, structure, features and effects are described in detail as follows in combination with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "another embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures or characteristics in one or more embodiments may be combined in any suitable form.

[0054] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. Terms such as "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a circuit structure, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such article or device. In the absence of further restrictions, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the article or device including the element.

[0055] A specific scheme of a circuit board fault testing method for a microcomputer host provided by the present invention is described in detail below with reference to the accompanying drawings.

[0056] See also Figure 1 , which shows the basic process of a circuit board fault testing method for a microcomputer host provided by an embodiment of the present invention.

[0057] like Figure 1 As shown, a circuit board fault testing method for a microcomputer host provided by an embodiment of the present invention specifically includes:

[0058] S100: Divide the circuit board into module areas, and mark adjacent edges between two adjacent module areas.

[0059] The circuit board of a microcomputer needs to connect multiple independent unit module areas within a limited space, such as the CPU, storage module area, communication module area, etc. These module areas each assume different functions when the computer is running. In view of the differences in the power distribution of these module areas during operation, in order to more effectively monitor the faults of the circuit board, the circuit board is first divided into module areas; in addition, in order to facilitate the analysis of the interaction between adjacent module areas, the module area division also marks the adjacent edges between two adjacent module areas. The specific operation method is: obtain the design file of the circuit board (PCB wiring diagram), check the specific location of each module area on the circuit board, use the design file to mark the various functional module areas of the circuit board, divide the circuit board into module areas, and mark the adjacent edges between two adjacent module areas.

[0060] S200: Collect electromagnetic intensity data in different module areas and at adjacent edges under different load conditions.

[0061] For the circuit boards of microcomputers, due to the high integration of internal circuits, it is impossible to directly detect internal signals through surface detection methods. Therefore, a non-contact detection method is used to detect the current circuit boards. According to the characteristics that the internal current of the circuit board will generate electromagnetic fields during operation, the electromagnetic field distribution during the operation of the circuit board is detected by a near-field electromagnetic scanner. For the electromagnetic scanner, a high-frequency probe (range 1Mhz-6Ghz) is used with a scanning accuracy of less than 1mm, and fine-grained scanning is supported. By setting up a probe array to cover the circuit board, the probe and the circuit board are kept at a distance of 1-5mm. In addition, during the monitoring process, an electromagnetic shielding box is arranged to reduce electromagnetic interference from the external environment. An anti-static workbench is used to avoid interference of static electricity on the circuit board or monitoring equipment. Shielded cables are used to connect all devices to reduce background noise.

[0062] During the monitoring process, the main evaluation is whether there is any abnormality in the fluctuation of the current signal transmission during the operation of the circuit board. In actual use, the circuit of the microcomputer must maintain stability under various load pressures. To this end, the load pressure range of the equipment is set, and the current regional load pressure of the computer is classified into low, medium and high pressure values, and the pressure values ​​are 30%, 60% and 100% of the total pressure of the current equipment respectively. The evaluation is carried out by monitoring the data of the circuit board under different load pressures. A programmable DC power supply is used to provide voltage and current to realize the regulation of the load pressure of the circuit board and simulate different load conditions.

[0063] During the acquisition process, the acquisition state under load switching and the acquisition state under long-term operation under a single load are considered respectively, and multiple tests are performed on them respectively.

[0064] Through the above-mentioned equipment and method, the electromagnetic intensity data of the entire circuit board is collected and obtained, and then the module area is divided according to the physical space divided by the module area, so as to obtain the electromagnetic intensity data in different module areas and at adjacent edges under different load conditions.

[0065] S300: Based on the electromagnetic intensity data under different load states, the corresponding relationship between the electromagnetic intensity variation amplitude and the load variation amplitude in the module area is analyzed to obtain the abnormal degree of dynamic response of each module area.

[0066] During the operation of a microcomputer, its load will change according to the user's usage. When the load changes, the current output on the circuit board will also change accordingly. In the specific acquisition module area of ​​the circuit board, the electromagnetic intensity data when different loads are stable is obtained. On the two-dimensional plane of the module area, the magnitude of the current directly determines the electromagnetic intensity. The larger the current, the greater the electromagnetic intensity; in addition, voltage fluctuations will also cause corresponding fluctuations in the electromagnetic intensity. If there is an abnormality in the signal transmission fluctuation of the microcomputer circuit board, the internal circuit of the device will respond slowly when the load changes, the current will fluctuate significantly, and the circuit stability recovery time will be significantly prolonged. The fluctuation of the current can be directly reflected in the fluctuation of the electromagnetic intensity. Therefore, the abnormal degree of dynamic response of the line in each module area of ​​the circuit board can be evaluated by analyzing the changes in the distribution of the electromagnetic intensity when the load of the circuit board changes in each module area.

[0067] Based on the above analysis, in an embodiment of the present invention, based on the electromagnetic intensity data under different load states, the correspondence between the electromagnetic intensity variation amplitude and the load variation amplitude in the module area is analyzed to obtain the abnormal degree of dynamic response of each module area.

[0068] In the process of single monitoring of a specific module area, the electromagnetic intensity data in the continuous time after the load changes are extracted, and the dynamic response characteristics are monitored in real time by analyzing the correspondence between the electromagnetic intensity data change and the load data change in the module area. For the electromagnetic intensity data of the circuit board, when there is an abnormality in its line, the electromagnetic intensity will show abnormal peaks and fluctuations with the change of load pressure, and the response delay of the electromagnetic intensity change will increase.

[0069] The specific implementation method is as follows: during a single monitoring of a specific module area, the electromagnetic intensity data in the continuous time after the load changes are extracted, and the electromagnetic intensity change curve during the load change process and the corresponding load change curve are obtained. At this time, the real-time dynamic response trend of the line can be analyzed by the correlation between the electromagnetic intensity change curve and the load change curve. Therefore, by analyzing the Pearson correlation coefficient between the electromagnetic intensity change curve and the load change curve during multiple load changes, the abnormal degree of dynamic response of each module area can be obtained. Construct the first The calculation formula for the abnormal degree of dynamic response of a module area is:

[0070]

[0071] The above, Indicates The abnormal degree of dynamic response of each module area; Indicates the monitoring times (experiment times) of the load change process; Indicated in In the module area The electromagnetic intensity variation curve obtained during the monitoring process; Indicated in In the module area The load variation curve obtained during the monitoring process; Indicated in In the module area The Pearson correlation coefficient between the electromagnetic intensity change curve and the load change curve obtained during the monitoring process.

[0072] The larger the value, the The change of electromagnetic intensity in each module area increases or decreases regularly with the change of load, with a small fluctuation range. At the same time, the dynamic response is fast and can timely reflect the change of current distribution after load adjustment. The stronger the correlation between the two, the The smaller the abnormality of the dynamic response of each module area; The smaller the value, the If there is a response delay in the module area, and the change has abnormal peaks or discontinuous fluctuations, the worse the correlation between the two, the The higher the abnormality of dynamic response of each module area.

[0073] S400: Based on the electromagnetic intensity data under different load states, the fuzziness of adjacent edges and the nonlinearity between the electromagnetic intensity at adjacent edges and the load size are analyzed to obtain the coordination of current signal transmission between two adjacent module areas.

[0074] In the above process, by analyzing the magnetic field change characteristics of each module area during the load change process, the abnormal degree of dynamic response of a single module area is obtained. During the load change process, when there is a delay between the magnetic field change inside a module area and the response to the load change, the edge magnetic fields between other module areas are also easily disturbed due to the response delay of signal propagation.

[0075] Under standard operating conditions, during load changes, the magnetic field distribution between module areas is clear, and the magnetic field change amplitudes of each module area remain independent and do not interfere with each other. However, once there are defects in the line design, the magnetic field interference between adjacent module areas will increase, and the magnetic field in the edge area will show nonlinear change characteristics with load changes. At the same time, the boundaries of the edge coupling areas between module areas become blurred.

[0076] Based on the above analysis, in an embodiment of the present invention, based on the electromagnetic intensity data under different load states, the fuzziness of adjacent edges is analyzed, and the nonlinearity between the electromagnetic intensity at adjacent edges and the load size is analyzed to obtain the coordination of current signal transmission between two adjacent module areas.

[0077] Based on the electromagnetic intensity data under different load states, the fuzziness of adjacent edges is analyzed. The specific implementation method is as follows: First, for the adjacent edges between two adjacent module areas, a rectangular area is obtained in each of the two adjacent module areas. That is, for the two module areas, the adjacent edge is used as an edge to extend 3mm width area into the two module areas to obtain two rectangular areas. The two rectangular areas form a large rectangular area, which is called the adjacent edge area. Then, the two rectangular areas are obtained in The mean electromagnetic intensity at time is denoted as and Finally, for the adjacent edge between two adjacent module areas, the fuzziness of its boundary is evaluated by the difference in electromagnetic intensity under the two rectangular areas. The difference in the mean electromagnetic intensity at the time instant is obtained, and the adjacent edges are The fuzziness at the moment, and traverse all monitoring moments, calculate the mean of the fuzziness at all moments, and get the fuzziness of the adjacent edges. The calculation formula for the fuzziness of the adjacent edges between two adjacent regions is constructed as follows:

[0078]

[0079] In the formula, Indicates the blurriness of the adjacent edge between two adjacent module areas; represents the number of all monitoring moments at the adjacent edges between two adjacent ones; Indicates The rectangular area within the module area is The mean value of electromagnetic intensity at the time; Indicates The module area adjacent to The rectangular area within the module area is The mean value of electromagnetic intensity at the time; represents the linear normalization function.

[0080] Indicates that two rectangular areas are The difference in the mean electromagnetic intensity at the time. The smaller the value, the closer the two rectangular areas are. The smaller the difference in electromagnetic intensity at each moment, the more blurred the adjacent edges corresponding to the two rectangular areas are, that is, the greater the fuzziness of the adjacent edges between the two adjacent module areas.

[0081] Based on the electromagnetic intensity data under different load states, the nonlinear degree between the electromagnetic intensity at adjacent edges and the load size is analyzed. The specific implementation method is as follows: first, according to the electromagnetic intensity data under different load states, a curve of the electromagnetic intensity changing with the load size is constructed, wherein the load size is the horizontal coordinate and the electromagnetic intensity is the vertical coordinate, and a fitting function is obtained; then, the second-order derivative of the fitting function is calculated, and the integral of the second-order derivative within the load size variation range is calculated to obtain the nonlinear degree between the electromagnetic intensity at adjacent edges and the load size, and the nonlinear degree calculation formula between the electromagnetic intensity at adjacent edges between two adjacent module areas and the load size is constructed as follows:

[0082]

[0083] In the formula, It indicates the nonlinearity between the electromagnetic intensity and the load size at the adjacent edge between two adjacent module areas; represents the second derivative of the fitting function; Indicates the maximum value of load change; Express Integrate over the range of load magnitudes.

[0084] When there is an abnormality in the lines between two adjacent modules, the electromagnetic increase in the interaction area shows a nonlinear growth as the load increases. The larger the value.

[0085] According to the fuzziness of adjacent edges and the nonlinearity between the electromagnetic intensity and the load size at the adjacent edges, the coordination of the current signal transmission between two adjacent module areas is obtained. The calculation formula for the coordination of the current signal transmission between two adjacent module areas is constructed as follows:

[0086]

[0087] In the formula, Indicates the coordination of current signal transmission between two adjacent module areas; It indicates the nonlinearity between the electromagnetic intensity and the load size at the adjacent edge between two adjacent module areas; Indicates the blurriness of the adjacent edge between two adjacent module areas; represents the linear normalization function.

[0088] The larger the value, the greater the nonlinearity between the electromagnetic intensity at the adjacent edge between two adjacent module areas and the load size during the load change process, indicating that the coordination of the current signal transmission between the two adjacent module areas is worse; The larger the value, the greater the fuzziness of the adjacent edges between two adjacent module areas during load changes, which means that the coordination of current signal transmission between the two adjacent module areas is worse.

[0089] At this point, by detecting and analyzing the electromagnetic intensity data inside the module area of ​​the circuit board under load changes and the electromagnetic interaction between module areas, the degree of abnormal dynamic response of a single module area and the coordination of current transmission between adjacent module areas were obtained.

[0090] S500: Based on the electromagnetic intensity data under different load states, the degree to which the module area is affected by its interactive module area is analyzed, and the response abnormality of the module area is obtained by combining the coordination of the current signal transmission between the two module areas.

[0091] When an abnormality occurs inside a module area of ​​the circuit board, the module area will show a higher degree of abnormal current dynamic response. At the same time, the module area interacting with the module area will also show a certain degree of abnormal response due to the interference of the module area. Therefore, in order to analyze and locate the actual abnormal conditions under each module area, it is first necessary to analyze the influence of other interactive module areas on a single module area.

[0092] Based on the above analysis, in an embodiment of the present invention, based on the electromagnetic intensity data under different load states, the degree to which the module area is affected by its interactive module area is analyzed, and the response abnormality of the module area is obtained in combination with the coordination of current signal transmission between the two module areas.

[0093] The more communication lines there are between a single module area and its interactive module area, the more the module area is affected by its interactive module area; at the same time, the closer the resonant frequencies of the two module areas are, the higher the electromagnetic interference between them. Therefore, based on the electromagnetic intensity data under different load states, the degree of influence of the module area on its interactive module area is analyzed, further including:

[0094] First, according to the electromagnetic intensity data under different load conditions, the standard deviation of the electromagnetic intensity data of the module area and its interactive module area under different load conditions is analyzed respectively to obtain the degree of difference in the resonant frequency between the module area and its interactive module area. The module area and The formula for calculating the difference in resonant frequency between module areas is:

[0095]

[0096] In the formula, Indicates The module area and The degree of difference in resonant frequency between the module areas; Indicates Standard deviation of electromagnetic intensity data of each module area under different load conditions; Indicates Standard deviation of electromagnetic intensity data for each module area under different load conditions.

[0097] When The module area and The closer the resonant frequencies of the module regions are, the The module area and The lower the difference in the standard deviation of the electromagnetic intensity data in the module area, the lower the difference in the standard deviation of the electromagnetic intensity data in the module area. The module area and The absolute value of the difference in the standard deviation of the electromagnetic intensity data of the two module areas under different load conditions represents the degree of difference in the resonant frequency between the two interacting module areas.

[0098] Then, according to the design file of the circuit board (PCB wiring diagram), the number of interactive lines between the module area and its interactive module area is obtained, that is, the first The module area and The number of interactive lines between module areas is denoted as .

[0099] Finally, according to the degree of resonance frequency difference and the number of interaction lines, the degree to which the module area is affected by its interaction module area is obtained. The module area is affected by the The calculation formula for the influence degree of each module area is:

[0100]

[0101] In the formula, Indicates The module area is affected by the The degree of influence of each module area; Indicates The module area and The number of interaction lines between module areas; Indicates The module area and The degree of difference in resonant frequency between the module areas; represents the linear normalization function.

[0102] The larger the value, the more interactive lines there are between the two module areas. The module area is affected by the The greater the impact of each module area; The smaller the value, the smaller the difference in resonant frequency between the two module regions. The module area is affected by the The greater the impact of the module area.

[0103] So far, the interference between module areas has been obtained from the physical connection level (the coordination of current signal transmission between adjacent module areas) and the signal interaction level (the degree of influence between interacting module areas).

[0104] For a single module area, if the degree of interference from the interacting module area is higher, the coordination of the current transmission between them is worse. In order to better analyze the abnormal situation of a single module area, the response abnormality of the module area is obtained according to the degree of influence of the interacting module area on the module area and the coordination of the current signal transmission between the two module areas. module area, assuming that the lines in the module area are normal; obtain the The module area set of the interaction of the module area and obtain the coordination of the current transmission between them. It should be noted that the coordination of current transmission is obtained based on the analysis of adjacent module areas. Therefore, in the embodiment of the present invention, the module areas with interaction are considered to be adjacent; in practice, if there is a module area with interaction with the first The module areas that interact with each other are not adjacent. As the interaction distance between module areas increases, the interference will gradually weaken. Therefore, the interference between non-adjacent interaction module areas can be ignored. The response anomaly fitting model of the module area is:

[0105]

[0106] In the formula, Represents the first The abnormal response degree of the module area; among them, Indicates The number of module areas that interact with each other; Indicates The module area is affected by the The degree of influence of each module area; Indicates module area and Coordination of current transmission between module areas.

[0107] S600: According to the response abnormality degree and the dynamic response abnormality degree, the abnormality degree of the module area is obtained, and the abnormal module area is determined.

[0108] According to the response abnormality, combined with the dynamic response abnormality, the abnormality of the module area is obtained, and the abnormal module area is determined. The specific implementation method is as follows:

[0109] First, the difference between the dynamic response abnormality and the response abnormality is calculated to obtain the abnormality of the module area, that is, The calculation formula for the abnormality degree of each module area is:

[0110]

[0111] In the formula, Indicates The degree of abnormality in each module area; Indicates The abnormal degree of dynamic response of each module area; Represents the first The abnormality of the response of each module area.

[0112] For The abnormal degree of dynamic response of the module area , which includes the first The abnormal response degree of each module area part, and the abnormal response part caused by the abnormal line inside itself, so Indicates the abnormal response caused by the abnormal line inside the module area. The larger the value is, the more it means that in addition to the interference from external module areas, the current module area also has certain line anomalies within itself.

[0113] The preset abnormality threshold is 0.4; determine whether the abnormality is greater than the abnormality threshold; if so, , then there is a line abnormality in the module area corresponding to the abnormality degree.

[0114] All module areas on the circuit board are processed according to the above process, the response abnormality of each module area is obtained, whether there is a line abnormality inside it is determined, and the specific location of the module area with line abnormality on the current microcomputer circuit board is determined.

[0115] Based on the same inventive concept as the above method, this embodiment also provides a circuit board fault testing system for a microcomputer host.

[0116] See also Figure 2 , which shows the basic composition of a circuit board fault testing system for a microcomputer host provided by an embodiment of the present invention.

[0117] like Figure 2 As shown, a circuit board fault testing system for a microcomputer host includes: a memory 10 and a processor 20, wherein:

[0118] A memory 10, used for storing program codes;

[0119] The processor 20 is used to read the program code stored in the memory 10, and execute the module area division of the circuit board, and mark the adjacent edges between two adjacent module areas; collect electromagnetic intensity data in different module areas and at adjacent edges under different load conditions; based on the electromagnetic intensity data under different load conditions, analyze the corresponding relationship between the electromagnetic intensity change amplitude in the module area and the load change amplitude, and obtain the dynamic response abnormality of each module area; based on the electromagnetic intensity data under different load conditions, analyze the fuzziness of adjacent edges, and analyze the nonlinearity between the electromagnetic intensity at adjacent edges and the load size, and obtain the coordination of current signal transmission between two adjacent module areas; based on the electromagnetic intensity data under different load conditions, analyze the degree of influence of the module area on its interactive module area, and combine the coordination of current signal transmission between the two module areas to obtain the response abnormality of the module area; according to the response abnormality, combined with the dynamic response abnormality, obtain the abnormality of the module area and determine the abnormal module area.

[0120] Furthermore, the processor 20 includes an electromagnetic intensity data acquisition module 21, a dynamic response abnormality degree analysis module 22, a current signal transmission coordination analysis module 23, a response abnormality degree analysis module 24 and an abnormal module area determination module 25. Among them:

[0121] The electromagnetic intensity data acquisition module 21 is used to divide the circuit board into module areas and mark the adjacent edges between two adjacent module areas; and collect electromagnetic intensity data in different module areas and at adjacent edges under different load conditions;

[0122] The dynamic response abnormality degree analysis module 22 is used to analyze the correspondence between the electromagnetic intensity variation amplitude and the load variation amplitude in the module area based on the electromagnetic intensity data under different load states, and obtain the dynamic response abnormality degree of each module area;

[0123] The current signal transmission coordination analysis module 23 is used to analyze the fuzziness of adjacent edges and the nonlinearity between the electromagnetic intensity at adjacent edges and the load size based on the electromagnetic intensity data under different load states, so as to obtain the coordination of current signal transmission between two adjacent module areas;

[0124] The response abnormality analysis module 24 is used to analyze the degree to which the module area is affected by its interactive module area based on the electromagnetic intensity data under different load states, and to obtain the response abnormality of the module area in combination with the coordination of the current signal transmission between the two module areas;

[0125] The abnormal module area determination module 25 is used to obtain the abnormality degree of the module area according to the response abnormality degree and the dynamic response abnormality degree, and determine the abnormal module area.

[0126] It should be noted that the sequence of the above embodiments of the present invention is only for description and does not represent the advantages and disadvantages of the embodiments. The processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0127] Various embodiments in this specification are described in a progressive manner, and the same or similar parts between various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

Claims

1. A circuit board fault testing method for a microcomputer host, characterized in that: The method comprises: Divide the circuit board into module areas and mark the adjacent edges between two adjacent module areas; Collect electromagnetic intensity data in different module areas and at adjacent edges under different load conditions; Based on the electromagnetic intensity data under different load states, the corresponding relationship between the electromagnetic intensity variation amplitude and the load variation amplitude in the module area is analyzed to obtain the abnormal degree of dynamic response of each module area; Based on the electromagnetic intensity data under different load states, the fuzziness of the adjacent edges and the nonlinearity between the electromagnetic intensity at the adjacent edges and the load size are analyzed to obtain the coordination of the current signal transmission between two adjacent module areas; Based on the electromagnetic intensity data under different load states, the degree to which the module area is affected by its interactive module area is analyzed, and the response abnormality of the module area is obtained by combining the coordination of current signal transmission between the two module areas; According to the response abnormality degree and in combination with the dynamic response abnormality degree, the abnormality degree of the module area is obtained, and the abnormal module area is determined.

2. The circuit board fault testing method for a microcomputer host according to claim 1, characterized in that: Based on the electromagnetic intensity data under different load states, the corresponding relationship between the electromagnetic intensity change amplitude and the load change amplitude in the module area is analyzed to obtain the abnormal degree of dynamic response of each module area, including: In the module area, obtaining an electromagnetic intensity variation curve during a load variation process and a corresponding load variation curve; The Pearson correlation coefficient between the electromagnetic intensity variation curve and the load variation curve is analyzed to obtain the abnormal degree of dynamic response of each module area.

3. The circuit board fault testing method for a microcomputer host according to claim 1, characterized in that: Analyzing the ambiguity of the adjacent edges based on the electromagnetic intensity data under different load states, including: For adjacent edges between two adjacent module areas, a rectangular area is obtained in each of the two adjacent module areas; Get two rectangular areas respectively The mean value of electromagnetic intensity at the time; Analyze two rectangular areas in The difference in the mean electromagnetic intensity at the time is obtained, and the adjacent edges are The ambiguity of the moment; All monitoring moments are traversed, the average of the blurriness at all moments is calculated, and the blurriness of the adjacent edges is obtained.

4. The circuit board fault testing method for a microcomputer host according to claim 3 is characterized in that: Based on the electromagnetic intensity data under different load states, the nonlinearity between the electromagnetic intensity at the adjacent edges and the load size is analyzed, including: According to the electromagnetic intensity data under different load states, a curve of electromagnetic intensity changing with load size is constructed to obtain a fitting function; The second-order derivative of the fitting function is calculated, and the integral of the second-order derivative within the load size variation range is calculated to obtain the nonlinear degree between the electromagnetic intensity at the adjacent edges and the load size.

5. The circuit board fault testing method for a microcomputer host according to claim 1, characterized in that: Based on the electromagnetic intensity data under different load states, the degree to which the module area is affected by its interactive module area is analyzed, including: According to the electromagnetic intensity data under different load states, the standard deviations of the electromagnetic intensity data of the module area and its adjacent module area under different load states are analyzed respectively to obtain the degree of difference in resonance frequency between the module area and its adjacent module area; wherein the degree of difference in resonance frequency between two interactive module areas is the absolute value of the difference in the standard deviations of the electromagnetic intensity data of the two interactive module areas under different load states; According to the design file of the circuit board, the number of interactive lines between the module area and its adjacent module area is obtained; The degree to which the module area is affected by its interactive module area is obtained according to the degree of difference in the resonance frequencies and the number of the interactive lines.

6. The circuit board fault testing method for a microcomputer host according to claim 1, characterized in that: According to the response abnormality degree, combined with the dynamic response abnormality degree, the abnormality degree of the module area is obtained, and the abnormal module area is determined, including: Calculating the difference between the dynamic response abnormality degree and the response abnormality degree to obtain the abnormality degree of the module area; Preset abnormality threshold; Determining whether the abnormality level is greater than the abnormality level threshold; If yes, then there is a line abnormality in the module area corresponding to the abnormality degree.

7. The circuit board fault testing method for a microcomputer host according to claim 1, characterized in that: Divide the circuit board into module areas and obtain the adjacent edges between two adjacent module areas, including: According to the design file of the circuit board, each functional module area of ​​the circuit board is marked, the circuit board is divided into module areas, and the adjacent edges between two adjacent module areas are obtained.

8. The circuit board fault testing method for a microcomputer host according to claim 1, characterized in that: Collecting electromagnetic intensity data in different module areas and at adjacent edges under different load conditions, including: Using an electromagnetic scanner, collecting electromagnetic intensity data in different module areas and at adjacent edges under different load conditions; The electromagnetic scanner has a probe scanning frequency range of 1Mhz-6Ghz and a scanning accuracy of less than 1mm; A programmable DC power supply is used to achieve regulation of different loads.

9. A circuit board fault testing system for a microcomputer host, characterized in that: The system comprises: a memory and a processor, wherein: The memory is used to store program codes; The processor is configured to read the program code stored in the memory and execute the method according to any one of claims 1 to 8.

10. The circuit board fault testing system for a microcomputer host according to claim 9, characterized in that: The processor comprises: The electromagnetic intensity data acquisition module is used to divide the circuit board into module areas and mark the adjacent edges between two adjacent module areas; and collect electromagnetic intensity data in different module areas and at the adjacent edges under different load conditions; A dynamic response abnormality degree analysis module is used to analyze the corresponding relationship between the electromagnetic intensity change amplitude and the load change amplitude in the module area based on the electromagnetic intensity data under different load states, and obtain the dynamic response abnormality degree of each module area; A current signal transmission coordination analysis module is used to analyze the fuzziness of the adjacent edges and the nonlinearity between the electromagnetic intensity at the adjacent edges and the load size based on the electromagnetic intensity data under different load states, so as to obtain the coordination of the current signal transmission between two adjacent module areas; A response abnormality analysis module is used to analyze the degree to which the module area is affected by its interactive module area based on the electromagnetic intensity data under different load states, and to obtain the response abnormality of the module area in combination with the coordination of current signal transmission between the two module areas; The abnormal module area determination module is used to obtain the abnormal degree of the module area according to the response abnormality and the dynamic response abnormality, and determine the abnormal module area.

Images