Radiation sensitive detector and radiation inspection equipment

Abstract

The invention provides a radiation sensitive detector which can be applied to the technical field of radiation inspection and the technical field of radiation inspection equipment, the radiation sensitive detector comprises a plurality of pixels, and at least one of the plurality of pixels comprises a radiation sensitive element used for receiving ray photons, the ray photons are converted and output into analog signals; the analog-to-digital conversion element is electrically connected with the radiation sensitive element, and the analog-to-digital conversion element is used for converting the analog signal into a digital signal; wherein the analog signal includes a plurality of subdivided analog signals, the subdivided analog signals being formed by segmenting and converting the ray photons using at least one of a spatial dimension and a temporal dimension. The invention further provides radiation inspection equipment.

Description

Technical Field

[0001] The present disclosure relates to the field of radiation inspection technology, specifically to the field of radiation inspection equipment technology, and more specifically to a radiation sensitive detector and radiation inspection equipment. Background Art

[0002] X-ray detectors can obtain spatial distribution information of incident X-ray photons and are widely used in the fields of medical treatment, security inspection, etc. Currently, most X-ray detectors are linear array or surface array detectors, where each pixel can detect X-ray photons, and the spatial distribution information of incident X-ray photons can be obtained through the spatial arrangement of multiple pixels.

[0003] The general structure of a single pixel of an X-ray detector can include two parts: a sensor part (Sensor) and a signal readout part (Readout). The main function of the sensor part is to convert incident X-ray photons into initial electrical signals, and the signal readout part processes the initial electrical signals of the sensor part and outputs the detection information of the X-ray photons. At present, the performance of the sensor part and / or the signal readout part limits the signal-to-noise ratio of the detector, and there is a problem that the signal-to-noise ratio of the detector cannot be optimized without modifying the existing sensor part and / or the signal readout part.

[0004] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the present invention and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because these solutions are described in the background technology section of the present invention. Summary of the invention

[0005] In view of the above problems, the present disclosure provides a radiation sensitive detector and a radiation inspection device, which solves the problem that the signal-to-noise ratio of the existing radiation sensitive detector cannot be optimized without using more sophisticated equipment in the sensor part and the signal readout part.

[0006] According to a first aspect of the present disclosure, a radiation sensitive detector is provided, which includes a plurality of pixels, at least one of the plurality of pixels including: a radiation sensitive element for receiving radiation photons, and converting and outputting the radiation photons into analog signals; an analog-to-digital conversion element electrically connected to the radiation sensitive element, the analog-to-digital conversion element for converting the analog signal into a digital signal; wherein the analog signal includes a plurality of subdivided analog signals, and the subdivided analog signals are formed by dividing and converting the radiation photons using at least one of a spatial dimension and a temporal dimension.

[0007] According to an embodiment of the present disclosure, the radiation sensitive element includes an indirect radiation sensitive element or a direct radiation sensitive element.

[0008] According to an embodiment of the present disclosure, the analog signal includes a plurality of subdivided analog signals formed by segmentation using a spatial dimension, and the analog-to-digital conversion element includes: a plurality of analog-to-digital conversion components, and the plurality of analog-to-digital conversion components are respectively electrically connected to the radiation sensitive element to convert each of the subdivided analog signals into a subdivided digital signal, wherein the digital signal includes a plurality of the subdivided digital signals.

[0009] According to an embodiment of the present disclosure, the radiation sensitive element includes a light receiving part and a plurality of photoelectric conversion parts; wherein the light receiving part is used to receive the radiation photons; and each of the photoelectric conversion parts is used to convert the radiation photons in the area corresponding to the light receiving part into the subdivided analog signal.

[0010] According to an embodiment of the present disclosure, the radiation sensitive element is the indirect radiation sensitive element, the light receiving part is a scintillator element, and the photoelectric conversion part is a photoelectric conversion element; wherein the scintillator element is used to receive the radiation photons and convert the radiation photons into light signals, and each of the photoelectric conversion elements is used to convert the light signals in the area corresponding to the scintillator element and output them as the subdivided analog signals.

[0011] According to an embodiment of the present disclosure, the plurality of photoelectric conversion units are arranged in an array form of M rows×N columns, wherein M is a positive integer greater than or equal to 1, and N is a positive integer greater than 1.

[0012] According to an embodiment of the present disclosure, the radiation sensitive detector also includes: a first data processing element, used to merge and process the multiple subdivided digital signals into a pixel signal, and the pixel signal is used to characterize at least one of the radiation intensity information and the radiation energy information of the pixel corresponding to the radiation sensitive element.

[0013] According to an embodiment of the present disclosure, the analog signal includes a plurality of subdivided analog signals formed by segmentation using a time dimension, and the analog-to-digital conversion element is used to convert each of the subdivided analog signals in the same time period into subdivided time digital signals respectively.

[0014] According to an embodiment of the present disclosure, the radiation sensitive detector also includes: a second data processing element, which is used to merge and process the multiple subdivided time digital signals into a pixel signal, and the pixel signal is used to characterize at least one of the radiation intensity information and radiation energy information of the pixel corresponding to the radiation sensitive element within a fixed time period.

[0015] According to an embodiment of the present disclosure, the radiation sensitive detector also includes: a preamplifier element, which is arranged between the radiation sensitive element and the analog-to-digital conversion element; wherein, the analog signal output by the radiation sensitive element is a current pulse signal, and the preamplifier element is used to receive the current pulse signal and convert it into a voltage pulse signal, and the preamplifier element can amplify the voltage pulse signal and output the amplified voltage pulse signal to the analog-to-digital conversion element.

[0016] The second aspect of the present disclosure provides a radiation-sensitive detector, comprising: a scintillator element for converting radiation photons into visible light photons, the scintillator element having a light receiving surface facing a radiation source and a light output surface away from the radiation source, the light receiving surface being used to receive the radiation photons, and the light output surface being used to output the visible light photons; a plurality of photoelectric converters, the plurality of photoelectric converters being arranged in an array of M rows × N columns and attached to the light output surface, each of the photoelectric converters being used to convert visible light photons in an area corresponding to the light output surface into a subdivided analog signal, wherein M is a positive integer greater than or equal to 1, and N is a positive integer greater than 1; and a plurality of analog-to-digital converters, the plurality of analog-to-digital converters being electrically connected to the plurality of photoelectric converters respectively to convert each of the subdivided analog signals into a subdivided digital signal.

[0017] According to an embodiment of the present disclosure, the photoelectric conversion element has a light conversion surface, and the light conversion surfaces of a plurality of the photoelectric conversion elements are covered and bonded to the light output surface.

[0018] According to an embodiment of the present disclosure, the light conversion surfaces of the plurality of photoelectric conversion elements have the same area size.

[0019] According to an embodiment of the present disclosure, the light conversion surface of the photoelectric conversion element attached to the edge of the light output surface does not exceed the light output surface.

[0020] A third aspect of the present disclosure provides a radiation inspection device, comprising: a radiation source for emitting radiation; and a radiation sensitive detector for receiving radiation photons emitted from the radiation source and passing through a detection object, wherein the radiation sensitive detector is any one of the radiation sensitive detectors described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings described herein are only for explanation purposes and are not intended to limit the scope of the present invention in any way. In addition, the shapes and proportional dimensions of the components in the drawings are only for illustration purposes and are used to help understand the present invention. They do not specifically limit the shapes and proportional dimensions of the components of the present invention. Under the guidance of the present invention, those skilled in the art can select various possible shapes and proportional dimensions to implement the present invention according to specific circumstances. In the drawings:

[0022] Figure 1 is a schematic structural diagram of a ray scanning detection system according to some exemplary embodiments of the present invention;

[0023] Figure 2 A schematic diagram showing the structure of a linear array pixel of a radiation sensitive detector;

[0024] Figure 3 The structure of the area array pixel of the radiation sensitive detector is schematically shown;

[0025] Figure 4 The structure diagram of a single pixel of a pixel detector is schematically shown;

[0026] Figure 5 The structure of a single pixel of a scintillator detector is schematically shown;

[0027] Figure 6 The schematic diagram shows the principle of segmenting the radiation sensitive detector in the spatial dimension according to the embodiment of the present disclosure;

[0028] Figure 7 A schematic diagram showing a structure of a single pixel of a radiation sensitive detector divided in a spatial dimension according to an embodiment of the present disclosure;

[0029] Figure 8 An experimental test diagram of the electronic noise of a single pixel of a radiation sensitive detector according to an embodiment of the present disclosure is schematically shown.

[0030] Description of Figure Numbers:

[0031] 10. Radiation source;

[0032] 20. Rack;

[0033] 30. Radiation sensitive detectors;

[0034] 300, pixels;

[0035] 310, radiation sensitive element; 311, light receiving unit; 312, photoelectric conversion unit;

[0036] 320, analog-to-digital conversion element; 321, analog-to-digital conversion element;

[0037] 40. Carrying mechanism;

[0038] 50. Controller;

[0039] 60. Data processing device;

[0040] 70. Detection object. DETAILED DESCRIPTION

[0041] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0042] The terms used herein are only for describing specific embodiments and are not intended to limit the present disclosure. The terms "comprise", "include", etc. used herein indicate the existence of the features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0043] All terms (including technical and scientific terms) used herein have the meanings commonly understood by those skilled in the art unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0044] When using expressions such as "at least one of A, B, and C, etc.", it should generally be interpreted as the meaning of the expression generally understood by those skilled in the art. For example, "a system having at least one of A, B, and C" should include but not be limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc. When using expressions such as "at least one of A, B, or C, etc.", it should generally be interpreted as the meaning of the expression generally understood by those skilled in the art. For example, "a system having at least one of A, B, or C" should include but not be limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc.

[0045] The specific embodiments of the present invention will be described in detail below. It should be noted that the embodiments described herein are only for illustration and are not intended to limit the present invention. In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present invention. However, it is obvious to those of ordinary skill in the art that these specific details do not have to be adopted to implement the present invention. In other examples, in order to avoid confusing the present invention, known structures, materials or methods are not specifically described.

[0046] Throughout the specification, references to "one embodiment," "an embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment of the present invention. Therefore, the phrases "in one embodiment," "in an embodiment," "an example," or "an example" appearing in various places throughout the specification do not necessarily all refer to the same embodiment or example. In addition, particular features, structures, or characteristics may be combined in one or more embodiments or examples in any suitable combination and / or subcombination. In addition, it should be understood by those of ordinary skill in the art that the term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0047] The general structure of a single pixel of an X-ray detector can be composed of two parts: a sensor part (Sensor) and a signal readout part (Readout). The main function of the sensor part is to convert the incident X-ray photons into initial electrical signals, and the signal readout part processes the initial electrical signals of the sensor part and outputs the detection information of the X-ray photons.

[0048] The inventor has found through research that the existing X-ray detector is relatively simple and direct in the entire detection signal chain, and the measurement signal in the analog domain corresponds to the output signal in the digital domain in a one-to-one relationship. In short, the sensor measurement signal of a certain area corresponds to the pixel output signal of this area, and the sensor measurement signal within a period of time corresponds to the pixel output signal during this period of time. Under this directly corresponding architecture, in order to reduce the electronic noise of the detector and improve the signal-to-noise ratio, it is only possible to replace the sensor and readout circuit chip with better performance. Taking the scintillator detector as an example, a single pixel is read out by a CsI scintillator crystal coupled to a photodiode (PD) and then connected to an ADC chip. The pixel converts the analog signal of the large PD into a digital signal through the ADC chip and directly outputs it. The area of ​​the PD is consistent with the area of ​​the pixel. Then, if you want to reduce the electronic noise of the pixel, you need to use a PD with better performance, that is, a PD with smaller capacitance and dark current under the same area and an ADC chip with smaller noise under the same range. That is to say, the performance of the PD and ADC chip limits the signal-to-noise ratio of the detector, and there is a problem that the signal-to-noise ratio of the detector cannot be optimized without changing the existing PD and ADC chips.

[0049] To this end, an embodiment of the present disclosure provides a radiation sensitive detector 30, the radiation sensitive detector 30 includes a plurality of pixels 300, at least one of the plurality of pixels 300 includes: a radiation sensitive element 310, for receiving radiation photons, and converting and outputting the radiation photons into analog signals; an analog-to-digital conversion element 320, electrically connected to the radiation sensitive element 310, the analog-to-digital conversion element 320 for converting the analog signals into digital signals; wherein the analog signals include a plurality of subdivided analog signals, the subdivided analog signals are formed by dividing and converting the radiation photons using at least one of the spatial dimension and the temporal dimension. In an embodiment of the present disclosure, the signal acquired by the detector is further subdivided in the spatial dimension and / or the temporal dimension in the analog domain of the signal, so that the signal can be subdivided without changing the size of the pixel 300, effectively reducing the electronic noise generated by the radiation sensitive detector 30, thereby effectively improving the performance of the detector.

[0050] Below, taking CT scanning detection as an example, the embodiments of the present disclosure are described in detail. It should be understood that the embodiments of the present disclosure are not limited to CT scanning detection scenarios. For example, it can be applied to scanning detection scenarios including various different inspection objects, including but not limited to vehicle scanning detection, luggage / package scanning detection, human body scanning detection, etc. It should be noted that the description of the scanning detection scenario here is not an exhaustive description, and the description here should not be understood as limiting the scope of protection of the present disclosure.

[0051] Figure 1 is a schematic diagram of the structure of a radiation inspection device according to some exemplary embodiments of the present invention. Figure 1 In FIG. 1 , a CT scanning device is schematically shown as an example of radiation inspection equipment. Figure 1As shown, the radiation inspection device according to this embodiment includes: a rack 20, a carrying mechanism 40, a controller 50, a data processing device 60 (such as a computer), etc. The rack 20 includes a radiation source 10 that emits X-rays for inspection, such as an X-ray machine, and a radiation sensitive detector 30. The carrying mechanism 40 carries the detection object (such as checked luggage) 70 through the scanning area between the radiation source 10 of the rack 20 and the radiation sensitive detector 30, and the rack 20 rotates around the forward direction of the detection object 70, so that the radiation emitted by the radiation source 10 can pass through the detection object 70, and perform CT scanning on the detection object 70. The radiation sensitive detector 30, for example, includes a module detector having a radiation sensitive element 310 and an analog-to-digital conversion element 320, which is used to receive radiation photons that penetrate the detection object 70 (such as checked luggage), obtain analog signals, and convert the analog signals into digital signals, thereby outputting the projection data of the detection object 70 for X-rays. The controller 50 is used to control the various parts of the entire system to work synchronously. The data processing device 60 is used to process the data collected by the data collector, process and reconstruct the data, and output the results.

[0052] like Figure 1 As shown, the radiation source 10 is placed on one side where the object to be inspected can be placed, and the radiation sensitive detector 30 is placed on the other side of the inspection object 70, including a radiation sensitive element 310 and an analog-to-digital conversion element 320, for acquiring transmission data and / or multi-angle projection data of the inspection object 70. The data output cable of the radiation sensitive detector 30 is connected to the controller 50 and the data processing device 60, and the collected data is stored in the data processing device 60 according to the trigger command.

[0053] In the embodiment of the present disclosure, the ray source 10 may be, for example, an X-ray machine, and a suitable X-ray machine focal spot size may be selected according to the imaging resolution. In other embodiments, an X-ray machine may not be used, but a linear accelerator may be used to generate an X-ray beam.

[0054] The radiation sensitive detector 30 includes a radiation sensitive element 310 and an analog-to-digital conversion element 320. The radiation sensitive element 310 may use a solid detector, a gas detector or other detectors, but the embodiments of the present disclosure are not limited thereto. The analog-to-digital conversion element 320 includes a readout circuit, an acquisition trigger circuit, and a data transmission circuit.

[0055] The combination of the controller 50 and the data processing device 60 includes, for example, a computer device installed with a control program and a data processing program, which is responsible for completing the control of the operation process of the CT scanning device, including mechanical rotation, electrical control, safety interlock control, etc.

[0056] Figure 2 The structure of a linear array pixel of a radiation sensitive detector is schematically shown. Figure 3The structure of a planar array pixel of a radiation sensitive detector is schematically shown. Figure 4 The structure of a single pixel of a pixel detector is schematically shown. Figure 5 The structure of a single pixel of a scintillator detector is schematically shown. Figure 6 The schematic diagram shows the principle of segmenting the radiation sensitive detector 30 in the spatial dimension according to an embodiment of the present disclosure.

[0057] like Figures 2 to 6 As shown, as an aspect of an embodiment of the present disclosure, a radiation sensitive detector 30 is provided, which includes a plurality of pixels 300, and at least one pixel 300 of the plurality of pixels 300 includes: a radiation sensitive element 310, which is used to receive radiation photons, and convert the radiation photons and output them as analog signals; an analog-to-digital conversion element 320, which is electrically connected to the radiation sensitive element 310, and the analog-to-digital conversion element 320 is used to convert the analog signal into a digital signal; wherein the analog signal includes a plurality of subdivided analog signals, and the subdivided analog signals are formed by dividing and converting the radiation photons using at least one of the spatial dimension and the temporal dimension.

[0058] The radiation sensitive detector 30 provided in the embodiment of the present disclosure comprises an analog signal including a plurality of subdivided analog signals formed by dividing the radiation photons by using the spatial dimension, that is, in a single pixel 300, the area area of ​​the single pixel 300 is divided into a plurality of subdivided areas, and the radiation photons in each subdivided area are respectively converted into subdivided analog signals and output, which can effectively reduce the electronic noise of the radiation sensitive detector 30, thereby improving the signal-to-noise ratio; further, the analog signal also comprises a plurality of subdivided analog signals formed by dividing the radiation photons by using the time dimension, that is, for the sampling time of a single pixel 300, the unit sampling time is divided into a plurality of subdivided times, and the radiation photons received in each subdivided time are converted into subdivided analog signals and output, which can also effectively reduce the electronic noise of the radiation sensitive detector 30, thereby improving the signal-to-noise ratio, that is, the division in two dimensions can achieve the effective reduction of the noise generated by the radiation sensitive detector 30 through subdivision processing without changing the size of the pixel 300.

[0059] Specifically in this embodiment, refer to Figures 4 to 6 As shown, taking the multiple subdivided analog signals formed by dividing the ray photons by using the spatial dimension as an example, the area of ​​a single pixel 300 is divided into four subdivided areas for illustration. When a single pixel is not divided into four subdivided areas, the signal output by the radiation sensitive detector 30 is , the electronic noise generated by the radiation sensitive detector 30 is When a single pixel 300 is divided into four equal subdivision areas, since the total area of ​​the pixel 300 remains unchanged, assuming that the detection efficiency loss of the radiation sensitive element 310 of the radiation sensitive detector 30 caused by the division of the spatial dimension alone can be ignored, the sum of the output signals of the four subdivision areas is approximately equal to , that is ,in, They represent the signals of the four divided areas respectively. The electronic noise generated by the four subdivided areas is roughly equal, that is, ,in, They represent the electronic noise generated by the radiation sensitive element 310 corresponding to the four divided subdivision areas. According to the calculation method of the total electronic noise generated when the four equally divided subdivision areas are parallel, the total electronic noise generated by the four subdivision areas is: ,in, , we can further know that Therefore, in this embodiment, when a single pixel 300 is divided into four equal subdivision areas, the expectation of the total analog signal output by the four radiation sensitive elements 310 corresponding to the single pixel 300 remains unchanged, but the total electronic noise generated by the four radiation sensitive elements 310 corresponding to the single pixel 300 is effectively reduced, that is, the capacitive noise is effectively reduced. In this embodiment, the noise sources of the electronic noise include capacitive noise and dark current noise, wherein the capacitive noise is proportional to the area of ​​the radiation sensitive element 310, and the dark current noise is proportional to the integration time.

[0060] In a specific embodiment, if Figure 2 As shown, the radiation sensitive detector is a linear array detector, which is composed of a plurality of pixels arranged in a linear array. Figure 3 As shown, the radiation sensitive detector is a planar array detector, which is composed of a plurality of pixels arranged in a planar array.

[0061] In one embodiment of the present disclosure, for some pixels 300 in the radiation sensitive detector 30, a structure of a radiation sensitive element 310 and an analog-to-digital conversion element 320 is adopted for setting, wherein the analog signal output by the radiation sensitive element 310 includes a plurality of subdivided analog signals; in another embodiment of the present disclosure, for all pixels 300 in the radiation sensitive detector 30, a structure of a radiation sensitive element 310 and an analog-to-digital conversion element 320 is adopted for setting.

[0062] In this embodiment, the radiation photons received by the radiation sensitive element 310 are a form of quantized electromagnetic radiation. Among the radiation rays used in this embodiment, the radiation photons are X-ray photons. The energy of the X-ray photons generated in the X-ray tube is related to the tube voltage. The higher the tube voltage, the greater the kinetic energy obtained by the electrons, and the higher the energy of the X-ray photons generated when hitting the target material, and the wider the energy distribution range. For example, in medical X-ray imaging, by adjusting the tube voltage of the X-ray tube, the energy of the generated X-ray photons can be changed to meet different imaging requirements. For example, higher energy X-rays may be required for bone imaging, while lower energy X-rays can be used for soft tissue imaging. Therefore, the radiation sensitive detector 30 is used to receive radiation photons and generate at least one of the radiation intensity information and radiation energy information of a single pixel 300.

[0063] In this embodiment, the radiation sensitive element 310 converts the incident X-ray photons into initial electrical signals based on the photoelectric effect. That is, when the X-ray photons are incident on the radiation sensitive element 310, the photon energy is absorbed by the material, causing the atoms or molecules in the material to ionize or excite to generate electrical signals. In a specific embodiment, the radiation sensitive element 310 includes an indirect radiation sensitive element or a direct radiation sensitive element.

[0064] In one embodiment, the indirect radiation sensitive element includes a scintillator crystal and a photodiode coupled to the scintillator crystal, or a scintillator crystal and a photomultiplier tube coupled to the scintillator crystal, or a SiPM (Silicon Photomultiplier), etc. The indirect radiation sensitive element will generate visible light photons after receiving X-ray photons. In a specific embodiment, the scintillator crystal of the indirect radiation sensitive element is a cesium iodide (CsI) crystal. When the scintillator crystal receives X-ray photons, the electrons in the atoms of the scintillator crystal absorb the photon energy and transition to a higher energy level. The excited electrons then return to the ground state through radiative transition or non-radiative transition, emitting visible light photons in the process. Further, the photodiode or photomultiplier tube converts the visible light photons into electrical signals.

[0065] In another embodiment, the direct radiation sensitive element includes a semiconductor detector, which directly generates electron-hole pairs after receiving X-ray photons. In a specific embodiment, the semiconductor detector uses silicon semiconductors or germanium semiconductors. When X-ray photons are incident on semiconductor materials, electron-hole pairs are generated through the photoelectric effect. An X-ray photon has a certain amount of energy. After its energy is absorbed by the semiconductor material, it can generate electron-hole pairs with a number related to the photon energy. These electron-hole pairs move in a directed manner under the action of the electric field inside the semiconductor to form a current pulse signal.

[0066] In this embodiment, the analog-to-digital conversion element 320 is used to convert analog signals into digital signals. In a specific embodiment, the analog-to-digital conversion element 320 samples the analog signal at a certain sampling frequency. The sampling frequency must satisfy the Nyquist sampling theorem to ensure that the analog signal can be accurately restored. For example, if the highest frequency of the analog signal is 100kHz, the sampling frequency should be at least 200kHz. In a specific embodiment, the analog-to-digital conversion element 320 compares the sampled analog voltage value with the pre-set quantization level to determine the quantization level to which it belongs. The number of quantization levels depends on the number of bits of the analog-to-digital conversion element 320. For example, an 8-bit analog-to-digital conversion element 320 has 2^8=256 quantization levels, and a 12-bit analog-to-digital conversion element 320 has 2^12=4096 quantization levels. If the analog signal voltage range of the 8-bit analog-to-digital conversion element 320 is 0~5V, then the voltage interval corresponding to each quantization level is 5V / 256≈0.0195V. The sampled analog voltage value is compared with these quantization levels to determine the quantization level to which it belongs, and then the quantization level is converted into a corresponding digital code output. For example, if the sampled analog voltage value is 2.3V, it is at the 118th quantization level (2.3V / 0.0195V≈118), and the corresponding 8-bit binary digital code is 01110110, which is the converted digital signal. In this embodiment, multiple subdivided analog signals are converted into subdivided digital signals using analog-to-digital conversion elements 320.

[0067] Figure 7 The structure diagram of a single pixel 300 of a radiation sensitive detector 30 divided in a spatial dimension according to an embodiment of the present disclosure is schematically shown.

[0068] like Figure 7 As shown, in a specific embodiment, the analog signal includes a plurality of subdivided analog signals formed by segmentation using a spatial dimension, and the analog-to-digital conversion element 320 includes: a plurality of analog-to-digital conversion elements 321, and the plurality of analog-to-digital conversion elements 321 are electrically connected to the radiation sensitive element 310 respectively to convert each subdivided analog signal into a subdivided digital signal, wherein the digital signal includes a plurality of subdivided digital signals.

[0069] The radiation sensitive detector 30 provided by the embodiment of the present disclosure is provided with a plurality of analog-to-digital conversion elements 321, so that the plurality of analog-to-digital conversion elements 321 can respectively correspond to a plurality of subdivided analog signals generated by the radiation sensitive element 310, so as to convert each subdivided analog signal into a corresponding subdivided digital signal. At the same time, since the radiation area in a single pixel 300 corresponding to each analog-to-digital conversion element 321 is smaller than the radiation area corresponding to the analog-to-digital conversion element 320 when the pixel is not divided, the signal strength of the subdivided analog signal corresponding to each analog-to-digital conversion element 321 is greater than the signal strength of the analog signal generated by the radiation sensitive element 310 when the pixel is not divided. The degree is smaller, so that each analog-to-digital converter 321 can use an analog-to-digital converter 321 with a smaller range and poorer noise suppression, which expands the selection range of the analog-to-digital converter 321 and improves the usability and maintainability of the radiation sensitive detector 30. At the same time, compared with the undivided pixels, the pixels 300 divided by the spatial dimension are used. The analog signal formed by the spatial dimension division includes multiple subdivided analog signals, and the multiple subdivided analog signals are converted by multiple analog-to-digital converters 321 and output into multiple subdivided digital signals, which can provide higher energy resolution in terms of the resolution performance of the radiation sensitive detector 30.

[0070] Specifically in the present embodiment, the multiple analog-to-digital conversion components 321 corresponding to the analog-to-digital conversion element 320 respectively occupy multiple channels of the chip corresponding to the analog-to-digital conversion element 320, and the multiple subdivided analog signals output by the radiation sensitive element 310 are respectively input to the channels where the analog-to-digital conversion components 321 are located. Each analog-to-digital conversion component 321 converts each subdivided analog signal into a subdivided digital signal. Compared with using the entire analog-to-digital conversion element 320 for single-channel batch processing, the processing speed is faster.

[0071] In a specific embodiment, the radiation sensitive element 310 includes a light receiving part 311 and a plurality of photoelectric conversion parts 312; wherein the light receiving part 311 is used to receive radiation photons; and each photoelectric conversion part 312 is used to convert radiation photons in the area corresponding to the light receiving part 311 into subdivided analog signals.

[0072] In the radiation sensitive detector 30 provided in the embodiment of the present disclosure, a plurality of photoelectric conversion parts 312 are provided to realize the segmentation processing of the radiation photons received by the light receiving part 311 in the spatial dimension, wherein the light receiving part 311 is located on the side of the radiation sensitive element 310 close to the radiation source 10 for receiving the radiation photons, and the plurality of photoelectric conversion parts 312 are arranged on the side of the light receiving part 311 away from the radiation source 10, and the plurality of photoelectric conversion parts 312 are respectively electrically connected to the light receiving part 311, so as to realize the conversion of the radiation photons into the corresponding fine particles in the form of multiple channels. The analog signal is divided, thereby improving the speed of generating the subdivided analog signal; at the same time, because the area of ​​the light receiving part 311 in a single pixel 300 corresponding to each photoelectric conversion part 312 becomes smaller, the signal intensity of each subdivided analog signal required to be generated by each photoelectric conversion part 312 is reduced compared to the intensity of the analog signal required to be generated by the photoelectric conversion element when not divided, so that each photoelectric conversion part 312 can adopt a photoelectric conversion part 312 with a smaller working range and worse noise suppression, thereby expanding the selection range of the photoelectric conversion part 312 and improving the usability and maintainability of the radiation sensitive detector 30.

[0073] Exemplarily, the radiation sensitive element 310 is an indirect radiation sensitive element, the light receiving part 311 is a scintillator element, and the photoelectric conversion part 312 is a photoelectric conversion element; wherein the scintillator element is used to receive radiation photons and convert the radiation photons into light signals, and each photoelectric conversion element is used to convert the light signal in the area corresponding to the scintillator element and output it into a subdivided analog signal. In this embodiment, the scintillator element includes a scintillator crystal, which has a light receiving surface facing the radiation source 10 and a light output surface away from the radiation source 10. The light receiving surface is used to receive radiation photons and transmit the radiation photons to the scintillator crystal. After the scintillator crystal receives the radiation photons, the electrons in the atoms of the scintillator crystal absorb the photon energy and transition to a higher energy level, emitting visible light photons and outputting the visible light photons from the light output surface. In this embodiment, a plurality of photoelectric converters are attached to the light output surface, each photoelectric converter converts the visible light photons in the area corresponding to the light output surface into subdivided analog signals, and a plurality of analog-to-digital converters 321 are respectively electrically connected to the plurality of photoelectric converters to convert the subdivided analog signals output by each photoelectric converter into subdivided digital signals.

[0074] Exemplarily, the radiation sensitive element 310 is a direct radiation sensitive element, that is, the radiation sensitive element 310 is a semiconductor, the light receiving portion 311 is the surface of the semiconductor facing the radiation source 10 for receiving radiation photons, and multiple photoelectric conversion portions 312 are arranged at one end of the semiconductor away from the radiation source 10. The multiple photoelectric conversion portions 312 are electrically isolated from each other, and each photoelectric conversion portion 312 is used to direct the electron-hole pairs in the region corresponding to the light receiving portion 311 under the action of the internal electric field of the semiconductor to form a current pulse signal output as a subdivided analog signal. In this embodiment, the semiconductor has a light receiving surface facing the radiation source 10 and a plurality of signal receiving surfaces away from the radiation source 10. Output surface, the light receiving surface is used to receive radiation photons and transmit the radiation photons to the semiconductor. Multiple signal output surfaces are respectively formed on the surfaces of multiple photoelectric conversion parts 312 away from the radiation source 10. After the semiconductor receives the radiation photons, electron-hole pairs are generated through the photoelectric effect. The semiconductor is divided into multiple photoelectric conversion areas according to the spatial dimension according to the areas where the multiple photoelectric conversion parts 312 are located. The electron-hole pairs in each photoelectric conversion area move in a directional manner under the action of the internal electric field of the semiconductor to form a current pulse signal, which is converted into a subdivided analog signal through the corresponding photoelectric conversion part 312, and the subdivided analog signal generated by each photoelectric conversion part 312 is output from the signal output surface. Multiple analog-to-digital conversion elements 321 are respectively electrically connected to the multiple photoelectric conversion parts 312 to convert the subdivided analog signals output by each photoelectric conversion part 312 into subdivided digital signals.

[0075] like Figure 7 As shown, in a specific embodiment, the plurality of photoelectric conversion portions 312 are arranged in an array of M rows×N columns, wherein M is a positive integer greater than or equal to 1, and N is a positive integer greater than 1.

[0076] In the radiation sensitive detector 30 provided in the embodiment of the present disclosure, by adopting an array arrangement, it is possible to achieve standard division of the light receiving part 311 in the spatial dimension, that is, to perform standard division of the area of ​​a single light receiving part 311 corresponding to a single pixel 300, so as to facilitate the subsequent calculation of the subdivided analog signals and electronic noise output by each photoelectric conversion part 312.

[0077] In this embodiment, rows and columns do not refer to specific directions, but are only used to indicate the relative position relationship of the plurality of photoelectric conversion units 312, that is, the names of rows and columns can be interchanged. In one specific embodiment, M and N can be the same number, that is, the plurality of photoelectric conversion units 312 are arranged in a square array. In another specific embodiment of the present embodiment, M can be 1, and N can be any positive integer greater than 1, that is, the plurality of photoelectric conversion units 312 are arranged in vertical columns or horizontal rows. In another specific embodiment, the plurality of photoelectric conversion units 312 are arranged in a square array of M rows × N columns, wherein M and N are both positive integers greater than 1, and N and M are unequal positive integers, that is, the plurality of photoelectric conversion units 312 are arranged in a rectangular array.

[0078] The specific array arrangement of the plurality of photoelectric conversion units 312 is set correspondingly according to the shape of the light receiving unit 311 .

[0079] like Figure 7 As shown, in a specific embodiment, the photoelectric conversion element has a light conversion surface, and the light conversion surfaces of a plurality of photoelectric conversion elements are covered and bonded to the light output surface.

[0080] In the radiation-sensitive detector 30 provided in the embodiment of the present disclosure, the light conversion surfaces of multiple photoelectric conversion elements are bonded to and cover the light output surface, thereby avoiding the occurrence of gaps between the multiple photoelectric conversion elements, which may cause the visible light photons output by some light output surfaces to be unable to find the corresponding photoelectric conversion elements. In other words, avoiding the problem of excessive deviation between the sum of multiple subdivided analog signals and the analog signal output by the radiation-sensitive detector 30 when not subdivided.

[0081] In one embodiment, the light conversion surfaces of the plurality of photoelectric conversion elements are of the same size. In the radiation sensitive detector 30 provided in the embodiment of the present disclosure, by setting the light conversion surfaces of the plurality of photoelectric conversion elements to be of the same size, the subdivided analog signals and electronic noise output by each photoelectric conversion unit 312 can be made substantially the same, which is more conducive to reducing the electronic noise generated by the radiation sensitive detector 30. In a specific embodiment, with reference to Figure 7 As shown, the scintillator element has a light output surface with a size of 5×5 mm², and uses 4 photoelectric conversion elements with a size of 2.5×2.5 mm² to be arranged in a square array of 2 rows×2 columns and covered and adhered to the light output surface, that is, to achieve complete coverage.

[0082] In another embodiment, the light conversion surface of the photoelectric conversion element attached to the edge of the light output surface does not exceed the light output surface, that is, by avoiding the light conversion surface from exceeding the light output surface, the utilization efficiency of the photoelectric conversion element is improved. In a specific embodiment, the light conversion surfaces of multiple photoelectric conversion elements cover the light output surface and the light conversion surfaces do not exceed the light output surface, so as to achieve precise setting of multiple photoelectric conversion elements and improve setting efficiency.

[0083] Figure 8 The experimental test diagram of the electronic noise of a single pixel 300 of the radiation sensitive detector 30 according to the embodiment of the present disclosure is schematically shown. Figure 8 In the figure, the horizontal axis represents the range of the analog-to-digital conversion element 320, and the unit is pC; the vertical axis represents the electronic noise, and the unit is fC. The "Meas" in the illustration represents the average measured value, and the "Esti" in the illustration represents the predicted value.

[0084] Related References Figure 5 , Figure 7 and Figure 8 As shown, actual test experiments were carried out for the above embodiments. Figure 5 The structure of a single pixel of the existing scintillator detector shown in FIG. 1 uses a 5×5 mm² photoelectric conversion part electrically connected to a readout part corresponding to a DDC232 chip, wherein the capacitance of the photoelectric conversion part is 180 pF. Figure 7 The structure of a single pixel 300 of the radiation sensitive detector 30 shown is divided in the spatial dimension, and adopts four 2.5×2.5mm² photoelectric converters connected to the analog-to-digital converter element 320 corresponding to the DDC264 chip, wherein the analog-to-digital converter element 320 corresponding to the DDC264 chip has four analog-to-digital converters 321 correspondingly connected to the photoelectric converter, and the capacitance of the photoelectric converter is 45pF.

[0085] The experimental results are as follows Figure 8 As shown in the figure, the top solid line is the electronic noise of a single pixel using a 180 pF photoelectric conversion part and a DDC232 chip. The second solid line from the top to the bottom is twice the value of the measured electronic noise of a single pixel 300 of the radiation sensitive detector 30 using a 45pF photoelectric conversion part and a DDC264 chip. The first dotted line from top to bottom corresponds to twice the theoretical calculated value of the electronic noise of a single pixel 300 of the radiation sensitive detector 30 using a 45pF photoelectric conversion part and a DDC264 chip. .from Figure 8 It can be seen from the experimental data that the measured electronic noise of a single pixel 300 of the radiation sensitive detector 30 is twice the value The electronic noise of a single pixel is lower than that of existing scintillator detectors at all measurement ranges , indicating that the electronic noise of the radiation sensitive detector 30 is much lower than that of the existing scintillator detector.

[0086] It should be noted that the two solid lines from bottom to top, that is, the two solid lines corresponding to the 0pF PD in the figure, represent the basic electronic noise of the DDC232 chip and the DDC264 chip at different ranges. It can be seen from the figure that the noise performance of the DDC232 chip and the DDC264 chip are similar, but the range and number of channels are inconsistent, so it can be considered that there is no change.

[0087] In a specific embodiment, the radiation sensitive detector 30 also includes: a first data processing element for merging multiple subdivided digital signals into a pixel signal, and the pixel signal is used to characterize at least one of the radiation intensity information and the radiation energy information of the pixel 300 corresponding to the radiation sensitive element 310.

[0088] In the radiation sensitive detector 30 provided in the embodiment of the present disclosure, by merging and processing a plurality of subdivided digital signals into pixel signals, at least one of the radiation intensity information and the radiation energy information of the pixel 300 can be substantially fed back, thereby realizing monitoring and feedback of the radiation intensity information and the radiation energy information of the radiation received by the pixel 300. In the present embodiment, the radiation intensity information indicates the strength of the radiation beam, and the unit is usually watts per square meter (W / m²). In radiation imaging, the radiation intensity determines the contrast and brightness of the image, and a stronger radiation intensity can make the image clearer.

[0089] In this embodiment, the radiation energy information refers to the energy of a single radiation photon, and the unit is usually electron volt (eV) or kiloelectron volt (keV). It reflects the intrinsic characteristics of radiation photons. Radiation photons of different energies exhibit different behaviors when interacting with matter, such as penetrating ability, ionizing ability, etc. For example, high-energy radiation photons have stronger penetrating ability and can penetrate thicker materials; while low-energy radiation photons are more easily absorbed or scattered by matter.

[0090] Specifically in this embodiment, the radiation intensity information of the incident radiation corresponding to the pixel 300 during the period of time can be calculated based on the pre-calibrated relationship, wherein the calibration process is usually to establish a corresponding relationship between the pixel signal and the radiation intensity by irradiating the pixel signal output by the radiation sensitive detector 30 under the irradiation of a standard source of known radiation intensity. For example, through experiments, it is obtained that the voltage value contained in the subdivided digital signal under different radiation intensities, thereby determining the functional relationship.

[0091] In actual measurement, according to the voltage value in the measured subdivided digital signal, the ray intensity information corresponding to the subdivided digital signal is calculated through the functional relationship, and the ray intensity information of the incident ray corresponding to the pixel 300 can be calculated by combining and processing multiple subdivided digital signals. In the specific example of this embodiment, the electrical signal converted by the photodiode or the photomultiplier tube is integrated per unit time to obtain the integral result related to the ray intensity information, that is, the ray intensity information of the corresponding area is included in the subdivided analog signal. In the specific example of this embodiment, the number of electron-hole pairs converted by the semiconductor detector is counted to record the number of photons detected within a certain period of time, and this number directly reflects the intensity information of the incident ray.

[0092] In a specific example, since the number of electron-hole pairs is related to the energy of the radiation photons, and the amplitude of the current pulse signal formed by the electron-hole pairs under the action of the electric field is proportional to the number of electron-hole pairs, the energy of each radiation photon can be determined by measuring the amplitude of the voltage pulse signal and according to the pre-calibrated amplitude-energy relationship; wherein the calibration process is to establish a corresponding relationship between the amplitude and energy by measuring the amplitude of the analog signal output by the radiation sensitive detector 30 under the irradiation of the monoenergetic radiation source 10 of known energy. For example, the voltage pulse amplitude corresponding to radiation photons of different energies is obtained through experiments, thereby determining the functional relationship. In actual measurement, the energy of the radiation photon can be calculated through the functional relationship based on the measured voltage amplitude.

[0093] In a specific embodiment, the analog signal includes a plurality of segmented analog signals formed by segmentation using a time dimension, and the analog-to-digital conversion element 320 is used to convert each segmented analog signal in the same time period into a segmented time digital signal.

[0094] In the radiation sensitive detector 30 provided in the embodiment of the present disclosure, a plurality of segmented analog signals are formed by using the time dimension to enable the analog-to-digital conversion element 320 to sequentially convert each segmented analog signal in the same time period into a segmented time digital signal. At the same time, since the sampling time corresponding to each segmented analog signal becomes smaller, the electronic noise can be effectively suppressed, that is, the dark current noise is effectively reduced. The signal strength of the segmented analog signal corresponding to the analog-to-digital conversion element 320 is smaller than the signal strength of the analog signal generated by the analog-to-digital conversion element 320 when not segmented, so that the analog-to-digital conversion element 320 can use an analog-to-digital conversion element 320 with a smaller range and poorer noise suppression, thereby expanding the selection range of the analog-to-digital conversion element 320 and improving the usability and maintainability of the radiation sensitive detector 30. At the same time, compared with pixels that are not segmented, the analog signal segmented by the time dimension in this embodiment includes a plurality of segmented analog signals, and the plurality of segmented analog signals are converted and output into segmented time digital signals by the analog-to-digital conversion element 320. After the plurality of segmented analog signals are combined, a higher energy resolution can be provided in terms of the resolution performance of the radiation sensitive detector 30.

[0095] In a specific embodiment, the radiation sensitive detector 30 also includes: a second data processing element, which is used to merge and process multiple subdivided time digital signals into pixel signals, and the pixel signal is used to characterize at least one of the radiation intensity information and radiation energy information of the pixel 300 corresponding to the radiation sensitive element 310 within a fixed time period.

[0096] In the radiation-sensitive detector 30 provided in the embodiment of the present disclosure, by merging and processing multiple subdivided time digital signals into pixel signals, at least one of the radiation intensity information and radiation energy information of the pixel 300 can be substantially fed back, thereby realizing the monitoring and feedback of the radiation intensity information and radiation energy information of the radiation received by the pixel 300.

[0097] In a specific embodiment, the radiation sensitive detector 30 also includes: a preamplifier element, which is arranged between the radiation sensitive element 310 and the analog-to-digital conversion element 320; wherein the analog signal output by the radiation sensitive element 310 is a current pulse signal, and the preamplifier element is used to receive the current pulse signal and convert it into a voltage pulse signal. The preamplifier element can amplify the voltage pulse signal and output the amplified voltage pulse signal to the analog-to-digital conversion element 320.

[0098] In the radiation sensitive detector 30 provided in the embodiment of the present disclosure, the current pulse signal converted by the photoelectric conversion unit 312 is relatively weak, and its amplitude is easily identified as noise in subsequent circuit processing, resulting in filtering or being easily unrecognizable. Therefore, a preamplifier element is used to convert the current pulse signal into a voltage pulse signal and amplify it, so that the amplitude of the converted voltage pulse signal is sufficient to be processed by the subsequent circuit. Specifically in this embodiment, a low-noise field effect transistor (FET) can be used as the input stage of the preamplifier to reduce the influence of thermal noise and amplifier noise on the signal.

[0099] The embodiments of the present disclosure are described above. However, these embodiments are only for illustrative purposes and are not intended to limit the scope of the present disclosure. Although the embodiments are described above, this does not mean that the measures in the various embodiments cannot be used in combination to advantage. Without departing from the scope of the present disclosure, those skilled in the art may make a variety of substitutions and modifications, which should all fall within the scope of the present disclosure.

Claims

1. A radiation sensitive detector, characterized in that: The radiation sensitive detector comprises a plurality of pixels, at least one pixel of the plurality of pixels comprising: A radiation sensitive element, used for receiving radiation photons, converting the radiation photons and outputting them into analog signals; an analog-to-digital conversion element, electrically connected to the radiation sensitive element, and configured to convert the analog signal into a digital signal; The analog signal includes a plurality of subdivided analog signals, and the subdivided analog signals are formed by splitting and converting the ray photons using at least one of a spatial dimension and a temporal dimension.

2. The radiation sensitive detector according to claim 1, characterized in that The radiation sensitive element includes an indirect radiation sensitive element or a direct radiation sensitive element.

3. The radiation sensitive detector according to claim 2, characterized in that The analog signal includes a plurality of subdivided analog signals formed by segmentation using a spatial dimension, and the analog-to-digital conversion element includes: A plurality of analog-to-digital conversion components are electrically connected to the radiation sensitive elements respectively to convert each of the subdivided analog signals into a subdivided digital signal respectively, wherein the digital signal includes a plurality of the subdivided digital signals.

4. The radiation sensitive detector according to claim 3, characterized in that The radiation sensitive element includes a light receiving portion and a plurality of photoelectric conversion portions; Wherein, the light receiving unit is used to receive the ray photons; Each of the photoelectric converters is used to convert radiation photons in a region corresponding to the light receiving portion into the segmented analog signal.

5. The radiation sensitive detector according to claim 4, characterized in that The radiation sensitive element is the indirect radiation sensitive element, the light receiving unit is a scintillator element, and the photoelectric conversion unit is a photoelectric conversion element; The scintillator element is used to receive the radiation photons and convert the radiation photons into optical signals, and each of the photoelectric converters is used to convert the optical signals in the area corresponding to the scintillator element and output them as the subdivided analog signals.

6. The radiation sensitive detector according to claim 4, characterized in that The plurality of photoelectric conversion units are arranged in an array of M rows×N columns, wherein M is a positive integer greater than or equal to 1, and N is a positive integer greater than 1.

7. The radiation sensitive detector according to claim 3, characterized in that The radiation sensitive detector further comprises: The first data processing element is used to merge the multiple subdivided digital signals into a pixel signal, and the pixel signal is used to represent at least one of the radiation intensity information and the radiation energy information of the pixel corresponding to the radiation sensitive element.

8. The radiation sensitive detector according to claim 1 or 2, characterized in that: The analog signal includes a plurality of subdivided analog signals formed by segmentation using a time dimension, and the analog-to-digital conversion element is used to convert each of the subdivided analog signals in the same time period into a subdivided time digital signal.

9. The radiation sensitive detector according to claim 8, characterized in that The radiation sensitive detector further comprises: A second data processing element, the second data processing element is used to merge and process the multiple subdivided time digital signals into a pixel signal, and the pixel signal is used to characterize at least one of the radiation intensity information and radiation energy information of the pixel corresponding to the radiation sensitive element within a fixed time period.

10. The radiation sensitive detector according to claim 1, characterized in that The radiation sensitive detector further comprises: A preamplifier element, the preamplifier element being disposed between the radiation sensitive element and the analog-to-digital conversion element; Among them, the analog signal output by the radiation sensitive element is a current pulse signal, the preamplifier element is used to receive the current pulse signal and convert it into a voltage pulse signal, the preamplifier element can amplify the voltage pulse signal and output the amplified voltage pulse signal to the analog-to-digital conversion element.

11. A radiation sensitive detector, characterized in that: include: A scintillator element, used for converting radiation photons into visible light photons, the scintillator element having a light receiving surface facing the radiation source and a light output surface facing away from the radiation source, the light receiving surface is used for receiving the radiation photons, and the light output surface is used for outputting the visible light photons; A plurality of photoelectric conversion elements, which are arranged in an array of M rows×N columns and attached to the light output surface, and each of the photoelectric conversion elements is used to convert visible light photons in a region corresponding to the light output surface into subdivided analog signals, wherein M is a positive integer greater than or equal to 1, and N is a positive integer greater than 1; A plurality of analog-to-digital conversion components are respectively electrically connected to the plurality of photoelectric conversion components to convert each of the subdivided analog signals into a subdivided digital signal.

12. The radiation sensitive detector according to claim 11, characterized in that The photoelectric conversion element has a light conversion surface, and the light conversion surfaces of a plurality of the photoelectric conversion elements are covered and bonded to the light output surface.

13. The radiation sensitive detector according to claim 12, characterized in that The light conversion surfaces of the plurality of photoelectric conversion elements have the same area size.

14. The radiation sensitive detector according to claim 12 or 13, characterized in that The light conversion surface of the photoelectric conversion element attached to the edge of the light output surface does not exceed the light output surface.

15. A radiation inspection device, characterized in that: include: A ray source, used for emitting rays; A radiation sensitive detector, used to receive radiation photons emitted from the radiation source and passing through a detection object, wherein the radiation sensitive detector is the radiation sensitive detector according to any one of claims 1 to 14.

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