Focusing device, lens module, ray machine and display equipment

Abstract

The embodiment of the invention provides a focusing device, a lens module, an optical machine and display equipment. The focusing device is used for focusing a lens, and comprises a semiconductor refrigeration ring, the semiconductor refrigeration ring is provided with an electric connecting wire, and the electric connecting wire is configured to be electrically connected with an external circuit; the telescopic structural member is arranged in the axial direction of the semiconductor refrigeration ring and located in the semiconductor refrigeration ring, and one end of the telescopic structural member is configured to be connected with the lens; and under the condition that the semiconductor refrigeration ring is conducted with the external circuit, the telescopic structural member is extended or shortened along the axial direction of the semiconductor refrigeration ring so as to adjust the position of the lens to realize focusing.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of focusing technology, and more specifically, to a focusing device, a lens module, an optical machine and a near-eye display device. Background Art

[0002] The purpose of focusing is to ensure that the projection or imaging system can produce clear and accurate images. Taking the DLP projector as an example, during the operation of the DLP projector, the LED light source and lens components will generate heat, causing the temperature inside the projector to rise. This temperature change will cause the internal components of the projector (such as lenses, lens barrels, etc.) to expand and contract. Due to thermal expansion and contraction, the position and shape of the lens may change, resulting in the inability to accurately focus the light on the projection screen, resulting in a blurred projection virtual image, which is the phenomenon of thermal defocus.

[0003] At present, the conventional focusing method of DLP projector is to adjust the position of the lens by rotating the gear. However, this focusing method has obvious defects in practical applications. The gears are prone to get stuck during operation, resulting in focusing failure, which seriously affects the projection display effect and user experience.

[0004] In view of this, it is necessary to provide a new technical solution to solve the above technical problems. Summary of the invention

[0005] The purpose of this application is to provide a new technical solution for a focusing device, a lens module, an optical machine and a display device.

[0006] In a first aspect, an embodiment of the present application provides a focusing device. The focusing device is used to focus a lens, and the focusing device includes:

[0007] A semiconductor refrigeration ring, wherein the semiconductor refrigeration ring is provided with an electrical connection line, and the electrical connection line is configured to be electrically connected to an external circuit;

[0008] A retractable structural member, the retractable structural member is arranged along the axial direction of the semiconductor refrigeration ring and is located inside the semiconductor refrigeration ring, and one end of the retractable structural member is configured to be connected to the lens;

[0009] When the semiconductor refrigeration ring is connected to the external circuit, the retractable structure is extended or shortened along the axial direction of the semiconductor refrigeration ring to adjust the position of the lens to achieve focusing.

[0010] Optionally, the retractable structure includes an element capable of adjusting the position of the lens based on the principle of thermal expansion and contraction.

[0011] Optionally, the telescopic structure comprises a cylinder, a medium located in the cylinder, and a piston rod, and the cylinder is located in the semiconductor refrigeration ring;

[0012] When the semiconductor refrigeration ring is connected to the external circuit, the semiconductor refrigeration ring transmits its temperature to the cylinder barrel and then to the medium;

[0013] The medium acts on the piston rod based on the principle of thermal expansion and contraction, and the position of the lens is adjusted by the piston rod to achieve focusing.

[0014] Optionally, the medium is in liquid state within a target temperature range, and the target temperature range is: a temperature variation range of the semiconductor refrigeration ring in a conducting state.

[0015] Optionally, the target temperature range is: -50°C to 200°C.

[0016] Optionally, the telescopic structure includes a telescopic rod, and when the semiconductor refrigeration ring is in a conducting state, the length change ΔL of the telescopic rod ranges from 0 mm to 0.06 mm.

[0017] Optionally, the thermal conductivity of the telescopic rod is in the range of 1 W / mK to 2 W / mK.

[0018] Optionally, the telescopic rod is made of ethylene material containing a thermal conductivity enhancer.

[0019] Optionally, the focusing device further includes a heat dissipation component, and the heat dissipation component is connected to the semiconductor refrigeration ring.

[0020] Optionally, the heat dissipation component includes a thermal pad and a heat sink, the thermal pad is provided on at least a portion of the outer peripheral side of the semiconductor refrigeration ring, and the thermal pad is connected to the heat sink on a side facing away from the semiconductor refrigeration ring.

[0021] In a second aspect, an embodiment of the present application further provides a lens module, wherein the lens module comprises a lens and a focusing device as described in the first aspect, wherein a retractable structural member of the focusing device is connected to the lens.

[0022] Optionally, the lens module further includes a support ring, the support ring is connected to the lens, and the center of the support ring is located at the optical axis of the lens; the retractable structural member is connected to the support ring.

[0023] Optionally, the lens module includes a plurality of the focusing devices, the focusing devices are distributed along the circumference of the support ring, and each of the focusing devices is connected to the support ring.

[0024] In a third aspect, an embodiment of the present application further provides an optical machine, wherein the optical machine comprises an optical machine housing and a lens module as described in the second aspect, wherein the lens module is disposed in the optical machine housing.

[0025] Optionally, the optical machine further comprises a supporting portion, wherein the supporting portion is disposed on the optical machine housing, and an end of the focusing device facing away from the lens is disposed on the supporting portion.

[0026] In a fourth aspect, an embodiment of the present application further provides a display device, wherein the display device includes the lens module as described in the second aspect, or the display device includes the optical machine as described in the third aspect.

[0027] According to the embodiments of the present application, the focusing device utilizes the temperature control characteristics of the semiconductor refrigeration ring, and the characteristic that the retractable structure can deform under the temperature control characteristics of the semiconductor refrigeration ring, to adjust the lens position to achieve the purpose of lens focusing, thereby ensuring that the projection or imaging display system can output clear and accurate images.

[0028] Other features and advantages of the present specification will become apparent from the following detailed description of exemplary embodiments of the present specification with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the specification and, together with the description, serve to explain the principles of the specification.

[0030] Figure 1 The structure of the focusing device provided in the embodiment of the present application is shown as follows Figure 1 .

[0031] Figure 2 The structure of the focusing device provided in the embodiment of the present application is shown as follows Figure 2 .

[0032] Figure 3 Shown is a structural diagram of a semiconductor refrigeration ring provided in an embodiment of the present application.

[0033] Figure 4 Shown is a structural diagram of the optical machine provided in an embodiment of the present application.

[0034] Figure 5 The figure shows a partial structure of the optical machine provided in the embodiment of the present application. Figure 1 .

[0035] Figure 6 The figure shows a partial structure of the optical machine provided in the embodiment of the present application. Figure 2 .

[0036] Figure 7 The figure shows a partial structure of the optical machine provided in the embodiment of the present application. Figure 3 .

[0037] Description of reference numerals:

[0038] 1. Focusing device; 10. Semiconductor refrigeration ring; 101. Electrical connection wire; 11. Telescopic structural member; 111. Cylinder; 112. Medium; 113. Piston rod; 114. Telescopic rod; 12. Heat dissipation component; 121. Thermal pad; 122. Heat sink;

[0039] 2. Lens module; 20. Lens; 21. Support ring;

[0040] 3. Optical machine; 31. Optical machine housing; 32. Supporting part; DETAILED DESCRIPTION

[0041] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0042] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0043] Techniques and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the techniques and equipment should be considered part of the specification.

[0044] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0045] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0046] The embodiment of the present application provides a focusing device 1, which is intended to optimize the focusing performance of the lens 20 and improve the image quality of the display screen. The core components of the focusing device 1 include a semiconductor refrigeration ring 10 and a retractable structure 11. By adjusting the intensity and direction of the electrical signal (current or voltage) input to the semiconductor refrigeration ring 10, its internal temperature state (cooling or heating) changes. This change then causes the length of the retractable structure 11 to be adjusted along the axial direction of the semiconductor refrigeration ring 10. Using this principle, we can adjust the position of the lens 20, thereby realizing the focusing function of the lens 20.

[0047] Specifically, refer to Figure 1 and Figure 2The focusing device 1 includes: a semiconductor refrigeration ring 10, wherein the semiconductor refrigeration ring 10 is provided with an electrical connection line 101, and the electrical connection line 101 is configured to be electrically connected to an external circuit.

[0048] The telescopic structure 11 is arranged along the axial direction of the semiconductor refrigeration ring 10 and is located inside the semiconductor refrigeration ring 10 . One end of the telescopic structure 11 is configured to be connected to the lens 20 .

[0049] When the semiconductor refrigeration ring 10 is connected to the external circuit, the retractable structure 11 is extended or shortened along the axial direction of the semiconductor refrigeration ring 10 to adjust the position of the lens 20 to achieve focusing.

[0050] In the embodiment of the present application, the focusing device 1 mainly includes two core components: a semiconductor refrigeration ring 10 and a retractable structure 11. The working principle of the semiconductor refrigeration ring 10 is based on the combination of N-type and P-type semiconductor materials. When these two types of semiconductor materials are connected into an electric couple and direct current is passed through the circuit, energy migration will occur. Specifically, the joint where the current flows from the N-type semiconductor element to the P-type semiconductor element absorbs the surrounding heat and forms a cold end; on the contrary, the current flows from the P-type to the N-type joint and releases heat to become a hot end. The heat absorption and heat release intensity of the cold end and the hot end can be controlled by adjusting the magnitude of the current and the logarithm of the N-type and P-type elements in the semiconductor material.

[0051] In order to significantly enhance the temperature change effect of the semiconductor refrigeration ring 10 itself, the semiconductor refrigeration ring 10 used in the embodiment of the present application integrates hundreds of such pairs of thermocouples inside, forming an efficient thermopile structure. It is particularly worth mentioning that the semiconductor refrigeration ring 10 exhibits extremely low thermal inertia, which means that its cooling and heating response is extremely rapid. When the heat dissipation conditions at the hot end are excellent and there is no load at the cold end, the semiconductor support ring 21 can quickly reach its maximum temperature difference effect in less than one minute after power-on.

[0052] Based on the above working principle, an electrical connection line 101 is provided on the semiconductor refrigeration ring 10, and the electrical connection line 101 is used to realize the conduction between the semiconductor refrigeration ring 10 and the external circuit (providing a voltage signal). By adjusting the magnitude and direction of the voltage, the semiconductor refrigeration ring 10 can realize heating and cooling.

[0053] For example, refer to Figure 1-Figure 3The semiconductor refrigeration ring 10 is a hollow ring structure. Two electrical connection wires 101 are arranged at the end of the semiconductor refrigeration ring 10. One of the electrical connection wires 101 is connected to the N-type semiconductor material of the semiconductor refrigeration ring 10, and the other electrical connection wire 101 is connected to the P-type semiconductor material of the semiconductor refrigeration ring 10. When the electrical connection wire 101 is connected to the external circuit, the semiconductor refrigeration ring 10 and the external circuit form a series circuit. By adjusting the size and direction of the voltage or current, the heating and cooling of the semiconductor refrigeration ring 10 can be achieved.

[0054] A retractable structural member 11 is provided inside the semiconductor refrigeration ring 10 . The retractable structural member 11 is arranged along the axial direction of the semiconductor refrigeration ring 10 , and one end of the retractable structural member 11 is connected to the lens 20 to ensure accuracy and stability during the focusing process.

[0055] For example, the telescopic structure 11 can be directly or indirectly connected to the lens barrel of the lens 20, and the telescopic structure 11 can be extended / contracted along the axial direction of the semiconductor refrigeration ring 10 to adjust the positions of all lenses inside the lens 20 to achieve the purpose of focusing the lens 20. Alternatively, the telescopic structure 11 can be directly or indirectly connected to one / some lenses inside the lens 20, and the telescopic structure 11 can be extended / contracted along the axial direction of the semiconductor refrigeration ring 10 to adjust the positions of one / some lenses inside the lens 20 to achieve the purpose of focusing the lens 20.

[0056] When the semiconductor refrigeration ring 10 is successfully connected to the external circuit, the temperature inside the semiconductor refrigeration ring 10 will change due to the action of current / voltage. When the temperature of the semiconductor refrigeration ring 10 changes, the telescopic structure 11 will be deformed along its axial direction to extend or shorten. This deformation directly drives the adjustment of the position of the lens 20 connected to the telescopic structure 11, thereby achieving the purpose of focusing the lens 20.

[0057] In the embodiment of the present application, the focusing device 1 utilizes the temperature control characteristics of the semiconductor refrigeration ring 10, and the characteristic that the retractable structure 11 can be deformed under the temperature control characteristics of the semiconductor refrigeration ring 10, to adjust the position of the lens 20, to achieve the purpose of focusing the lens 20, and thus ensure that the projection or imaging display system can output clear and accurate images. Compared with the traditional mechanical (gear) focusing solution, the focusing device 1 provided in this embodiment shows higher flexibility and simplicity, and it is more convenient for users to focus the lens 20.

[0058] In one embodiment, the retractable structure 11 includes an element capable of adjusting the position of the lens 20 based on the principle of thermal expansion and contraction.

[0059] In this embodiment, the retractable structural member 11 uses elements based on the principle of thermal expansion and contraction, which can automatically adjust their lengths according to the temperature changes of the semiconductor refrigeration ring 10, or these elements can automatically adjust the extension or retraction of the associated components according to the temperature changes of the semiconductor refrigeration ring 10, thereby achieving precise control of the position of the lens 20. This design not only utilizes the temperature control characteristics of the semiconductor refrigeration ring 10, but also combines the physical principle of thermal expansion and contraction, which work together to adjust the position of the lens 20 to achieve the purpose of focusing.

[0060] In a specific embodiment, referring to Figure 1 The retractable structure 11 includes a cylinder 111, a medium 112 located in the cylinder 111, and a piston rod 113, and the cylinder 111 is located in the semiconductor refrigeration ring 10;

[0061] When the semiconductor refrigeration ring 10 is connected to the external circuit, the semiconductor refrigeration ring 10 transmits its temperature to the cylinder 111 and then to the medium 112;

[0062] The medium 112 acts on the piston rod 113 based on the principle of thermal expansion and contraction, and the position of the lens 20 is adjusted by the piston rod 113 to achieve focusing.

[0063] In this embodiment, the telescopic structure 11 in the focusing device 1 is a piston mechanism including a medium 112, a cylinder 111 and a piston rod 113. The cylinder 111 is arranged inside the semiconductor refrigeration ring 10 so as to effectively receive the temperature transfer from the semiconductor refrigeration ring 10.

[0064] When the semiconductor refrigeration ring 10 is connected to the external circuit, it will efficiently transfer the generated temperature (whether cooling or heating) to the cylinder 111, thereby affecting the medium 112 inside the cylinder 111. This medium 112 has the physical property of thermal expansion and contraction, that is, the volume expands or contracts with the change of temperature.

[0065] Based on this characteristic of the medium 112, when the medium 112 in the cylinder 111 is affected by temperature changes, it acts on the piston rod 113, pushing or pulling the piston rod 113 to move along the axial direction of the cylinder 111. This movement process directly drives the adjustment of the position of the lens 20 connected to the piston rod 113, thereby achieving the focus adjustment of the projection or imaging system.

[0066] That is, the medium 112 in the cylinder 111 needs to have a high thermal expansion coefficient, so as to ensure that when the temperature of the semiconductor refrigeration ring 10 changes, the medium 112 can undergo a significant volume change, thereby effectively driving the piston rod 113 to move and realizing accurate adjustment of the position of the lens 20.

[0067] Exemplarily, the medium 112 may be a liquid or a gas having a relatively high thermal expansion coefficient.

[0068] Exemplarily, the medium 112 may be an oily liquid. For example, the medium 112 may be silicone oil, mineral oil, or synthetic oil. Preferably, the medium 112 is silicone oil, which has a large thermal expansion coefficient of about 500 ppmK^-1.

[0069] Optionally, in order to ensure the strength of the telescopic structure 11 and meet its thermal conductivity (when the telescopic structure 11 has good thermal conductivity, the medium 112 in the cylinder 111 is more likely to expand and contract due to heat), the cylinder 111 and the piston rod 113 may be made of metal. For example, the cylinder 111 and the piston rod 113 may be made of aluminum alloy or copper alloy.

[0070] Optionally, in order to prevent the medium 112 from flowing out of the cylinder 111 , black rubber is provided at one end of the piston rod 113 connected to the lens 20 to prevent the medium 112 from flowing out.

[0071] In a specific embodiment, the medium 112 is in liquid state within a target temperature range, and the target temperature range is: a temperature variation range of the semiconductor refrigeration ring 10 in a conducting state.

[0072] That is, in this embodiment, within the operating temperature range of the semiconductor refrigeration ring 10 (the temperature variation range of the semiconductor refrigeration ring 10 itself under the pressurized state), the state of the medium 112 in the cylinder 111 is always kept as liquid or gas, and does not change into solid. Keeping the medium 112 in the liquid or gas state can ensure that it has good fluidity and compressibility, so that it can respond more sensitively to the temperature changes generated by the semiconductor refrigeration ring 10. The medium 112 in the solid state cannot effectively respond to temperature changes and produce volume changes like liquid or gas, and thus cannot drive the piston rod 113 to move to achieve focusing.

[0073] It should be noted that the temperature variation range of the semiconductor refrigeration ring 10 itself is related to the external voltage intensity and voltage direction, and is also related to the structure of the semiconductor refrigeration ring 10 itself.

[0074] In an exemplary embodiment, the target temperature range is: -50°C to 200°C. That is, within this temperature range, the medium can push the piston rod 113 to extend or retract based on the principle of thermal expansion and contraction. For example, the medium 112 is silicone oil (organic silicon compound), which has good fluidity and expansion properties at -50 to 200°C.

[0075] In another specific embodiment, referring to Figure 2The telescopic structure 11 includes a telescopic rod 114, which also needs to have a high thermal expansion coefficient. Based on the principle of thermal expansion and contraction, the range of the length change ΔL of the telescopic rod is: 0mm~0.06mm.

[0076] In this embodiment, when the semiconductor refrigeration ring 10 is connected to the external circuit and a temperature change occurs, the temperature change is transmitted to the telescopic rod 114 by heat conduction. Since the thermal expansion coefficient of the telescopic rod 114 is high, it can quickly respond to the temperature change and produce a corresponding length change. The length change is mechanically connected or directly acts on the lens 20 to adjust the position of the lens 20, thereby achieving the purpose of focusing.

[0077] The range of the telescopic rod length change ΔL is: 0mm~0.06mm, which meets the lens focusing requirements.

[0078] It should be noted that the length of the telescopic rod 114 changes in response to the temperature change of the semiconductor refrigeration ring 10, and this change is also related to the original size of the telescopic rod 114. In order to meet the focusing requirements, the original size of the telescopic rod 114 is 7mm to 15mm.

[0079] In this embodiment, the thermal conductivity of the telescopic rod 114 ranges from 1 W / mK to 2 W / mK.

[0080] In this embodiment, since the telescopic rod 114 has a high thermal conductivity, when the semiconductor refrigeration ring 10 is connected to the external circuit and a temperature change occurs, the temperature change can be transmitted to the telescopic rod 114 in almost real time. The telescopic rod 114 then expands or contracts in length according to the temperature change, and this change acts on the lens 20 through a mechanical connection or directly, thereby achieving precise adjustment of the position of the lens 20. This fast response time and precise adjustment capability together ensure the efficiency and accuracy of the focusing process.

[0081] In a specific embodiment, the telescopic rod 114 is made of ethylene material containing a thermal conductivity enhancer.

[0082] In this embodiment, the telescopic rod 114 is made of ethylene material, which has a relatively high thermal expansion coefficient. In order to further optimize the performance of the telescopic rod 114, a thermal conductivity enhancer is incorporated into the ethylene material. This not only ensures that the telescopic rod 114 can maintain its original high thermal expansion coefficient characteristics, but also significantly improves its thermal conductivity. Therefore, when the temperature of the semiconductor refrigeration ring 10 changes, the telescopic rod 114 can respond quickly and sensitively, and achieve the purpose of focusing the lens 20 by expanding or contracting in length.

[0083] For example, the thermal expansion coefficient of the high-density ethylene material after adding the thermal conductivity enhancer is about 150ppmK^-1. If the length of the telescopic rod 114 made of the high-density ethylene material after adding the thermal conductivity enhancer is 10mm, and the temperature difference of the whole rod is 35°C, then the change in the length of the telescopic rod is ΔL = rod length * rod expansion coefficient * temperature difference = 10*150e-6*35*10^-6 = 0.0525mm, which meets the focusing requirements.

[0084] In a specific embodiment, referring to Figure 4 and Figure 6 The focusing device 1 also includes a heat dissipation component 12 , and the heat dissipation component 12 is connected to the semiconductor refrigeration ring 10 .

[0085] In this embodiment, the focusing device 1 further includes a heat dissipation component 12, the design of which fully considers the working characteristics and heat release requirements of the semiconductor refrigeration ring 10 to ensure that it can effectively reduce the temperature of the semiconductor refrigeration ring 10, thereby maintaining it within a suitable working temperature range. This not only helps to improve the performance stability of the semiconductor refrigeration ring 10, but also prolongs its service life.

[0086] Specifically, the energy generated by the semiconductor refrigeration ring 10 is transferred to the heat dissipation component 12 to avoid the surface temperature concentration of the semiconductor refrigeration ring 10. For example, the heat generated by the semiconductor refrigeration ring 10 is transferred to the heat dissipation component 12 to avoid local overheating of the outer surface of the semiconductor refrigeration ring 10.

[0087] In this embodiment, refer to Figure 4 , Figure 6 and Figure 7 The heat dissipation component 12 includes a thermal pad 121 and a heat sink 122. The thermal pad 121 is provided on at least a portion of the outer peripheral side of the semiconductor refrigeration ring 10. The thermal pad 121 is connected to the heat sink 122 on a side away from the semiconductor refrigeration ring 10.

[0088] Specifically, the side of the thermal pad 121 facing away from the semiconductor refrigeration ring 10 is closely connected to the heat sink 122. The main function of the heat sink 122 is to provide a wide heat dissipation area so as to effectively release the heat transferred from the thermal pad 121 to the surrounding environment to avoid the surface temperature concentration of the semiconductor refrigeration ring 10. The design of the heat sink 122 usually includes multiple heat dissipation fins or channels to increase the heat dissipation area and improve the heat dissipation efficiency.

[0089] The present application embodiment also provides a lens module 2. Figure 4 , Figure 5 and Figure 7The lens module 2 includes a lens 20 and the focusing device 1 as described above, and the retractable structure 11 of the focusing device 1 is connected to the lens 20.

[0090] In an embodiment of the present application, a lens module 2 is provided, and the lens module 2 includes the focusing device 1 described above. The focusing device 1 utilizes the temperature control characteristics of the semiconductor refrigeration ring 10, and the ability of the retractable structure 11 to deform under the temperature control characteristics of the semiconductor refrigeration ring 10, thereby realizing the adjustment of the position of the lens 20 and achieving the purpose of focusing the lens 20.

[0091] In a specific embodiment, referring to Figure 4 , Figure 6 and Figure 7 The lens module 2 also includes a support ring 21, which is connected to the lens 20, and the center of the support ring 21 is located at the optical axis of the lens 20; the retractable structure 11 is connected to the support ring 21.

[0092] In this embodiment, the lens module 2 further includes a support ring 21, which is sleeved on the lens 20, and the center of the support ring 21 is located at the optical axis of the lens 20, that is, the center line of the support ring 21 is colinear with the optical axis of the lens 20. For example, the support ring 21 is fixedly connected to the lens 20.

[0093] That is, in this embodiment, the retractable structure 11 is indirectly connected to the lens 20. Specifically, the retractable structure 11 is connected to the lens 20 through the support ring 21. For example, the retractable structure 11 is connected to the center of the support ring 21, and the retractable structure 11 is extended or shortened in length to adjust the axial position of the lens 20 to achieve the purpose of focusing the lens 20.

[0094] In another specific embodiment, referring to Figure 4 , Figure 6 and Figure 7 The lens module 2 includes a plurality of focusing devices 1 , and the focusing devices 1 are distributed along the circumference of the support ring 21 , and each of the focusing devices 1 is connected to the support ring 21 .

[0095] In this embodiment, the lens module 2 includes a plurality of focusing devices 1, for example, Figure 4 , Figure 6 and Figure 7 The lens module 2 includes four focusing devices 1, which can be evenly distributed around the support ring 21. Alternatively, the lens module 2 can also include three focusing devices 1, which can be evenly distributed around the support ring 21.

[0096] It should be noted that the multiple focusing devices 1 may be unevenly distributed in the circumference of the support ring 21. When focusing the lens 20, the semiconductor refrigeration rings 10 of the focusing devices 1 at different positions may be connected to voltage signals of different sizes or intensities to adjust the axial position of the lens 20 or adjust the axial and tilt directions of the lens 20.

[0097] For example, the lens module 2 includes four focusing devices 1 as an example for description:

[0098] When the image recognition system identifies that only the axial position of the lens 20 needs to be adjusted, the axial position of the lens 20 can be adjusted by controlling the voltage signal and adjusting the strength and direction of the voltage signals at the four positions to be the same.

[0099] When the image recognition system recognizes that the axial position of the lens 20 needs to be adjusted and the lens 20 is tilted, the strength and / or direction of the voltages at the four positions are adjusted to be inconsistent, thereby achieving adjustment of the axial position and tilt direction of the lens 20.

[0100] The present application embodiment also provides an optical machine 3. Figure 4-Figure 5 The optical machine 3 includes an optical machine housing 31 and the lens module 2 as described above, and the lens module is arranged in the optical machine housing 31.

[0101] The embodiment of the present application further provides an optical machine 3, which may be a DLP optical machine 3. A lens module 2 having a focusing device 1 is mounted on an optical machine housing 31.

[0102] For example, the lens module 2 includes four focusing devices 1 as an example for description:

[0103] When the image recognition system identifies that only the axial position adjustment is required between the lens 20 and the optical machine housing 31, the voltage signal will be controlled to simultaneously adjust the strength and direction of the voltage signals at the four positions to be the same, thereby achieving the axial position adjustment of the lens 20; when it is identified that not only the axial position adjustment of the lens 20 and the optical machine housing 31 but also the tilt angle adjustment of the lens 20 is required, the strength and / or direction of the voltages at the four positions are adjusted to be not completely consistent, thereby achieving the adjustment of the axial position and tilt direction of the lens 20.

[0104] In a specific embodiment, referring to Figure 4 , Figure 5 and Figure 7 The optical machine 3 further includes a supporting portion 32 , and the supporting portion 32 is disposed on the optical machine housing 31 , and one end of the focusing device 1 away from the lens 20 is disposed on the supporting portion 32 .

[0105] In this embodiment, the optical machine 3 further includes a support portion 32, which serves to connect the lens module 2 and the optical machine housing 31. Exemplarily, the support portion 32 may be a flange.

[0106] One end of the focusing device 1 away from the lens 20 is arranged on the support part 32 , for example, one side of the retractable structure away from the lens 20 is arranged on the support part 32 , and the heat sink 122 of the focusing device 1 may also be arranged on the support part 32 .

[0107] The embodiment of the present application further provides a display device, wherein the display device includes the lens module 2 as described above, or the display device includes the optical machine 3 as described above.

[0108] In an embodiment of the present application, a display device is further provided, and the display device may be a near-eye display device, for example, the display device may be an AR device or a VR device, etc. Alternatively, the display device may also be a vehicle-mounted head-up display device, etc.

[0109] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0110] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A focusing device, characterized in that: Used for focusing a lens (20), the focusing device comprises: A semiconductor refrigeration ring (10), wherein the semiconductor refrigeration ring (10) is provided with an electrical connection line (101), and the electrical connection line (101) is configured to be electrically connected to an external circuit; a retractable structural member (11), the retractable structural member (11) being arranged along the axial direction of the semiconductor refrigeration ring (10) and being located inside the semiconductor refrigeration ring (10), and one end of the retractable structural member (11) being configured to be connected to the lens (20); When the semiconductor refrigeration ring (10) is connected to the external circuit, the retractable structural member (11) is extended or shortened along the axial direction of the semiconductor refrigeration ring (10) to adjust the position of the lens (20) to achieve focusing.

2. The focusing device according to claim 1, characterized in that: The retractable structural member (11) comprises an element capable of adjusting the position of the lens (20) based on the principle of thermal expansion and contraction.

3. The focusing device according to claim 1 or 2, characterized in that: The telescopic structure (11) comprises a cylinder (111), a medium (112) located in the cylinder (111), and a piston rod (113); the cylinder (111) is located in the semiconductor refrigeration ring (10); When the semiconductor refrigeration ring (10) is connected to the external circuit, the semiconductor refrigeration ring (10) transmits its temperature to the cylinder (111), and then transmits it to the medium (112); The medium (112) acts on the piston rod (113) based on the principle of thermal expansion and contraction, and the position of the lens (20) is adjusted by the piston rod (113) to achieve focusing.

4. The focusing device according to claim 3, characterized in that: The medium (112) is in a liquid state within a target temperature range, and the target temperature range is: the temperature variation range of the semiconductor refrigeration ring (10) in a conducting state.

5. The focusing device according to claim 4, characterized in that: The target temperature range is: -50°C to 200°C.

6. The focusing device according to claim 1 or 2, characterized in that: The telescopic structural component (11) comprises a telescopic rod (114); when the semiconductor refrigeration ring (10) is in a conducting state, a length variation ΔL of the telescopic rod (114) ranges from 0 mm to 0.06 mm.

7. The focusing device according to claim 6, characterized in that: The thermal conductivity of the telescopic rod (114) ranges from 1 W / mK to 2 W / mK.

8. The focusing device according to claim 7, characterized in that: The telescopic rod (114) is made of ethylene material containing a heat conductivity enhancer.

9. The focusing device according to claim 1, characterized in that: The focusing device also includes a heat dissipation component (12), and the heat dissipation component (12) is connected to the semiconductor refrigeration ring (10).

10. The focusing device according to claim 9, characterized in that: The heat dissipation component (12) comprises a thermal pad (121) and a heat sink (122); the thermal pad (121) is provided on at least a portion of the outer peripheral side of the semiconductor refrigeration ring (10); and the thermal pad (121) is connected to the heat sink (122) on a side facing away from the semiconductor refrigeration ring (10).

11. A lens module (2), characterized in that: The lens module (2) comprises a lens (20) and a focusing device as claimed in any one of claims 1 to 10, wherein a retractable structural member (11) of the focusing device is connected to the lens (20).

12. The lens module (2) according to claim 11, characterized in that: The lens module (2) further comprises a support ring (21), wherein the support ring (21) is connected to the lens (20), and the center of the support ring (21) is located at the optical axis of the lens (20); and the retractable structural member (11) is connected to the support ring (21).

13. The lens module (2) according to claim 12, characterized in that: The lens module (2) comprises a plurality of focusing devices, the focusing devices are distributed along the circumference of the support ring (21), and each of the focusing devices is connected to the support ring (21).

14. An optical machine, characterized in that: The optical machine (3) comprises an optical machine housing (31) and a lens module (2) according to any one of claims 11 to 13, wherein the lens module (2) is arranged in the optical machine housing (31).

15. The optical machine according to claim 14, characterized in that: The optical machine (3) further comprises a support portion (32), wherein the support portion (32) is arranged on the optical machine housing (31), and an end of the focusing device (1) facing away from the lens (20) is arranged on the support portion (32).

16. A display device, characterized in that: The display device comprises the lens module (2) as described in any one of claims 11 to 13, or the display device comprises the optical machine (3) as described in claim 14 or 15.

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