A rapid detection and analysis system for bad pixels in thermal printer heads

Abstract

The application relates to the technical field of heat-sensitive sheet detection, and particularly discloses a heat-sensitive printer head sheet bad point rapid detection and analysis system, which comprises a signal acquisition module: a to-be-detected heat-sensitive sheet is placed on a test tool and fixed; a detection execution module: all pixel points are traversed for power-on test, and initial state resistance values of each pixel point are calculated; a preliminary detection module: whether the initial state resistance value of each pixel point on the to-be-detected heat-sensitive sheet is in a resistance value domain is judged, an initial state qualified rate value of the resistance value is calculated, and an initial state qualified signal is obtained; an internal detection module: based on the initial state qualified signal, a pixel point running state performance value is calculated; a judgment module: the pixel point running state performance value is compared with a pixel point running state performance threshold value, a heat-sensitive sheet running qualified signal is obtained, the heat-sensitive sheet with an initial state disqualification is quickly discharged, and qualified detection of the heat-sensitive sheet is accurately and effectively realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of thermal sensitive sheet detection, and particularly relates to a thermal printer head sheet bad point rapid detection and analysis system. BACKGROUND

[0002] The basic principle of thermal printing is realized by heating thermal paper through a thermal sheet. As a core component of a thermal printer, when a part of controllable heat source pixel points on the thermal sheet are damaged, the thermal paper is not completely displayed due to the fact that part of the pixel points are not normally heated during printing. The existing method for detecting whether a thermal sheet has a bad point is to assemble the thermal sheet to the whole machine for printing test, so as to find out whether the thermal sheet has a bad point.

[0003] The existing detection method is slow in detection efficiency when all pixel points are detected during detection and analysis of the thermal sheet in the production and processing process, and cannot realize multi-angle and multi-direction detection, so that the detection effect is not accurate enough. SUMMARY

[0004] The present application relates to the technical field of thermal sensitive sheet detection, and particularly relates to a thermal printer head sheet bad point rapid detection and analysis system.

[0005] The purpose of the present application can be achieved by the following technical solutions:

[0006] A thermal printer head sheet bad point rapid detection and analysis system, comprising:

[0007] A signal acquisition module: the thermal sheet to be detected is placed on a test tool and fixed, the contact gap value of the thermal sheet to be detected and a fixed base plate is obtained by a range finder, and the contact gap value is compared with a contact fixed threshold value, and a fixed completion signal is obtained;

[0008] A detection execution module: based on the fixed completion signal, triggering detection execution, marking the pixel points on the thermal sheet to be detected as n, wherein n is 1, 2, 3…, all pixel points are traversed for power-on test, and the initial state resistance value RXn of each pixel point is calculated;

[0009] A preliminary detection module: judging whether the initial state resistance value RXn of each pixel point on the thermal sheet to be detected is in the resistance value domain [RXmin, RXmax], calculating the initial state qualified rate value CTHG, and comparing it with the initial state qualified rate threshold value CTY to obtain an initial state qualified signal;

[0010] An internal detection module: based on the initial state qualified signal, maintaining the test current as the pixel point current value IXn to continue power-on test, obtaining the pixel point operating voltage value UYn after the detection time T through AD monitoring sampling, then obtaining the operating temperature value WTn of the pixel point through a temperature sensor, and calculating the pixel point operating state performance value ZBZ.

[0011] The determination module compares the pixel point running state performance value ZBZ with the pixel point running state performance threshold ZBZY to obtain a thermal sensitive sheet running qualified signal.

[0012] As a further scheme of the present application, in the signal acquisition module, the contact gap value is compared with a contact fixing threshold value:

[0013] If the contact gap value is greater than or equal to the contact fixing threshold value, a fixing abnormal signal is generated;

[0014] If the contact gap value is less than the contact fixing threshold value, a fixing completion signal is generated.

[0015] As a further scheme of the present application, in the detection execution module, the initial state resistance value RXn of the pixel point is acquired in the following manner:

[0016] The test tool is connected to a test current, and then an electric signal data of the pixel point is acquired by AD monitoring sampling, wherein the electric signal data includes a pixel point current value IXn and a pixel point voltage value UXn;

[0017] Then the initial state resistance value RXn of each pixel point is calculated and acquired.

[0018] As a further scheme of the present application, the calculation manner of the initial state qualified rate value CTHG includes:

[0019] It is judged whether the initial state resistance value RXn of each pixel point on the to-be-tested thermal sensitive sheet is in a resistance value domain [RXmin, RXmax]:

[0020] If the initial state resistance value RXn is in the resistance value domain [RXmin, RXmax], a resistance initial state good signal is generated;

[0021] If the initial state resistance value RXn is not in the resistance value domain [RXmin, RXmax], a resistance initial state bad signal is generated;

[0022] The number value of the resistance initial state good signal in the pixel point on the to-be-tested thermal sensitive sheet is acquired and recorded as i;

[0023] The initial state qualified rate value CTHG of the resistance value is calculated and acquired.

[0024] As a further scheme of the present application, the initial state qualified rate value CTHG is compared with an initial state qualified rate threshold value CTY:

[0025] If the initial state qualified rate value CTHG is greater than or equal to the initial state qualified rate threshold value CTY, an initial state qualified signal is generated;

[0026] ​​If the initial state qualified rate value CTHG is less than the initial state qualified rate threshold CTY, an initial state unqualified signal is generated.

[0027] As a further scheme of the present application, the acquisition method of the pixel running state performance value ZBZ is:

[0028] Based on the pixel running voltage value UYn, a pixel running resistance value RYn is calculated and obtained, and a pixel resistance running stability performance value ZBR is calculated and obtained;

[0029] Based on the pixel running temperature value WTn, an initial temperature state value WTO of the pixel is acquired; it should be noted that the initial temperature state values of all pixels are the same, and a pixel thermal conversion performance value ZRH is calculated and obtained.

[0030] Based on the pixel resistance running stability performance value ZBR and the pixel thermal conversion performance value ZRH, a pixel running state performance value ZBZ is calculated and obtained through ; wherein g is a preset pixel resistance running stability performance coefficient, and k is a preset pixel thermal conversion performance coefficient.

[0031] As a further scheme of the present application, the calculation method of the pixel running resistance value RYn is: Based on the pixel running voltage value UYn, a pixel running resistance value RYn is calculated and obtained.

[0032] As a further scheme of the present application, the calculation method of the pixel resistance running stability performance value ZBR is:

[0033] An initial resistance value RXn is acquired, and a resistance running change rate RTLn is calculated and obtained through

[0034] The maximum value RTLmax of the resistance running change rate RTLn is acquired;

[0035] The average value of the resistance running change rate RTLn is calculated to obtain a resistance running change rate average value RJB, and the standard deviation of the resistance running change rate RTLn is calculated to obtain a resistance running change standard deviation value BC;

[0036] Then, the pixel resistance running stability performance value ZBR is calculated and obtained through ; wherein a and b are preset proportion coefficients, and both a and b are greater than 0.

[0037] As a further scheme of the present application, the calculation method of the pixel thermal conversion performance value ZRH is:

[0038] Through ​A pixel point thermal conversion value ZRHn is calculated, wherein d is a thermal loss coefficient;

[0039] A pixel point thermal conversion performance mean value ZRJ is calculated based on the pixel point thermal conversion value ZRHn; and a pixel point thermal conversion performance standard deviation value ZRC is further calculated through a standard deviation formula;

[0040] A pixel point thermal conversion performance value ZRH is further calculated through A pixel point thermal conversion performance value ZRH is calculated, wherein e is a pixel point thermal conversion mean preset proportion coefficient, and f is a pixel point thermal conversion performance standard deviation preset proportion coefficient; e and f are both greater than 0.

[0041] As a further scheme of the present application, the pixel point running state performance value ZBZ is compared with a pixel point running state performance threshold value ZBZY;

[0042] If the pixel point running state performance value ZBZ is greater than or equal to the pixel point running state performance threshold value ZBZY, a thermal sensitive sheet running qualified signal is generated;

[0043] If the pixel point running state performance value ZBZ is less than the pixel point running state performance threshold value ZBZY, a thermal sensitive sheet running abnormal signal is generated.

[0044] The present application has the following beneficial effects:

[0045] First, the resistance value of the pixel point on the thermal sensitive sheet is subjected to initial on-current testing, to determine whether the pixel point qualified rate of the pixel point on the thermal sensitive sheet meets the requirement; if the qualified rate of the resistance of the pixel point in the initial state meets the requirement, the pixel point on the thermal sensitive sheet is subjected to running detection, to further determine whether the thermal sensitive sheet in the running process can meet the use requirement; the thermal sensitive sheet that does not meet the initial state requirement can be quickly discharged, without the need for subsequent detection, to shorten the detection time and improve the detection efficiency;

[0046] The stability of the resistance of the pixel point in the running process is determined through a certain length of heating test of each pixel point on the thermal sensitive sheet; since the pixel point needs to be heated in the running process, the thermal conversion of the resistance of the pixel point is further calculated to determine whether the thermal performance of the pixel point resistance can meet the requirement; finally, the thermal sensitive sheet is determined to be qualified based on the comprehensive judgment of the resistance running and thermal conversion of the pixel point, to more accurately and effectively realize the qualified detection of the thermal sensitive sheet from multiple angles. BRIEF DESCRIPTION OF DRAWINGS

[0047] The present application will be further described below in combination with the drawings.

[0048] Figure 1 is a system block diagram of the present application;

[0049] Figure 2 is a detection method flowchart in the present application. DETAILED DESCRIPTION

[0050] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application. EMBODIMENT

[0051] Please refer to Figure 1 As shown in the drawings, the present application is a kind of thermal printer head piece bad point rapid detection analysis method, comprising:

[0052] The signal acquisition module: the to-be-tested thermal sheet is placed on the test tool and fixed, the contact gap value of the to-be-tested thermal sheet and the fixed base plate is obtained by the range finder, and the contact gap value is compared with the contact fixed threshold value, and the fixed completion signal is obtained.

[0053] The detection execution module: based on the fixed completion signal, triggers the detection execution, marks the pixel points on the to-be-tested thermal sheet as n, wherein n is 1, 2, 3…, traverses all the pixel points for power-on test, and calculates the initial state resistance value RXn of each pixel point.

[0054] The initial detection module: judges whether the initial state resistance value RXn of each pixel point on the to-be-tested thermal sheet is in the resistance value domain [RXmin, RXmax], calculates the initial state qualified rate value CTHG, and compares it with the initial state qualified rate threshold value CTY to obtain the initial state qualified signal.

[0055] The internal detection module: based on the initial state qualified signal, keeps the test current as the pixel point current value IXn to continue power-on test, obtains the pixel point operating voltage value UYn after the detection time T through AD monitoring sampling, and then obtains the operating temperature value WTn of the pixel point through the temperature sensor, and calculates the pixel point operating state performance value ZBZ.

[0056] The determination module: compares the pixel point operating state performance value ZBZ with the pixel point operating state performance threshold value ZBZY to obtain the thermal sheet operating qualified signal.

[0057] The detection system is the core of the present application, which is connected to the upper computer through USB, serial port or network port communication cable, and the electrical connection with the to-be-tested thermal sheet is established by the thimble and cable. When the thermal sheet is fixed in place and fixed well, the detection switch transmits this information to the detection execution module, and the detection execution module starts automatic detection work. After the detection work is completed, the test data is automatically saved to the local SD memory card or uploaded to the upper computer, and the detection result OK or NG state indicating lamp is lit.

[0058] The host computer is a computer connected with the detection module through a communication cable, and the computer is installed with a thermal sheet detection data statistical analysis software.

[0059] The software is configured for thermal sheet detection on one hand, and performs statistical analysis on the detection data and outputs the statistical analysis results on the other hand. Embodiment

[0060] Please refer to Figure 2 The application is a kind of thermal printer head sheet bad point rapid detection analysis method, which comprises:

[0061] S1: placing the to-be-tested thermal sheet on the test tool and fixing it, obtaining the contact gap value of the to-be-tested thermal sheet and the fixed base plate through the range finder, comparing the contact gap value with the contact fixing threshold value, and obtaining the fixing completion signal;

[0062] The contact gap value is compared with the contact fixing threshold value:

[0063] If the contact gap value is greater than or equal to the contact fixing threshold value, a fixing abnormal signal is generated; at this time, secondary fixing is needed;

[0064] If the contact gap value is less than the contact fixing threshold value, a fixing completion signal is generated;

[0065] S2: based on the fixing completion signal, triggering detection execution, marking the pixel points on the to-be-tested thermal sheet as n, wherein n is 1, 2, 3…, traversing all the pixel points for energization test, and calculating the initial state resistance value RXn of each pixel point;

[0066] Specifically, the method for obtaining the initial state resistance value RXn of the pixel point comprises:

[0067] The test tool connects the test current, then the AD monitoring sampling obtains the electrical signal data of the pixel point, wherein the electrical signal data includes the pixel point current value IXn and the pixel point voltage value UXn;

[0068] Then the initial state resistance value RXn of each pixel point is calculated and obtained;

[0069] S3: judging whether the initial state resistance value RXn of each pixel point on the to-be-tested thermal sheet is in the resistance value domain [RXmin, RXmax], calculating the initial state qualified rate value CTHG of the resistance value, and comparing it with the initial state qualified rate threshold value CTY to obtain the initial state qualified signal;

[0070] Wherein, the method for obtaining the initial state qualified signal of the pixel point resistance value on the to-be-tested thermal sheet comprises:

[0071] ​S31: judge whether the initial state resistance value RXn of each pixel point on the to-be-tested thermal sensitive sheet is in the resistance value domain [RXmin, RXmax] or not;

[0072] If the initial state resistance value RXn is in the resistance value domain [RXmin, RXmax], a resistance initial state good signal is generated;

[0073] If the initial state resistance value RXn is not in the resistance value domain [RXmin, RXmax], a resistance initial state bad signal is generated;

[0074] S32: obtain the number value of the resistance initial state good signal in the pixel point on the to-be-tested thermal sensitive sheet, and mark it as i;

[0075] By The initial state qualified rate value CTHG of the resistance value is obtained by calculation;

[0076] S33: compare the initial state qualified rate value CTHG with the initial state qualified rate threshold value CTY:

[0077] If the initial state qualified rate value CTHG is greater than or equal to the initial state qualified rate threshold value CTY, an initial state qualified signal is generated;

[0078] If the initial state qualified rate value CTHG is less than the initial state qualified rate threshold value CTY, an initial state unqualified signal is generated; at this time, it is indicated that the resistance value of the pixel point on the to-be-tested thermal sensitive sheet has more unqualified conditions in the initial production process, and at this time, the thermal sensitive sheet is marked;

[0079] First, the resistance value of the pixel point on the thermal sensitive sheet is tested by the initial on-current, and whether the pixel point qualified rate of the pixel point on the thermal sensitive sheet meets the requirements is judged, if the qualified rate of the resistance of the pixel point in the initial state meets the requirements, the pixel point on the thermal sensitive sheet is detected, and whether the thermal sensitive sheet in the running process can meet the use requirements is further judged, the initial state unqualified thermal sensitive sheet can be quickly discharged, and subsequent detection is not needed, the detection time is shortened, and the detection efficiency is improved;

[0080] S4: based on the initial state qualified signal, the test current is kept as the pixel point current value IXn to continue to be tested, the pixel point running voltage value UYn after the detection time T is obtained by AD monitoring sampling, and then the running temperature value WTn of the pixel point is obtained by the temperature sensor, and the pixel point running state performance value ZBZ is obtained by calculation;

[0081] Specifically, it includes:

[0082] S41: based on the pixel point running voltage value UYn, the pixel point running resistance value RYn is obtained, and the pixel point resistance running stability performance value ZBR on the to-be-tested thermal sensitive sheet is obtained;

[0083] The calculation method of the pixel resistance running stability performance value ZBR is:

[0084] S411: based on the pixel running voltage value UYn, the pixel running resistance value RYn is obtained by

[0085] The initial resistance value RXn is obtained, and the resistance running change rate RTLn is obtained by

[0086] S412: the maximum resistance running change rate RTLmax in the resistance running change rate RTLn is obtained;

[0087] S413: the average value of the resistance running change rate RTLn is calculated to obtain the resistance running change rate average value RJB, and the standard deviation of the resistance running change rate RTLn is calculated to obtain the resistance running change standard deviation value BC;

[0088] S414: then the pixel resistance running stability performance value ZBR is obtained by

[0089] S42: based on the running temperature value WTn of the pixel, the initial temperature state value WTO of the pixel is obtained; it should be noted that the initial temperature state values of all pixels are the same; the pixel thermal conversion performance value ZRH is obtained by calculation;

[0090] The calculation method of the pixel thermal conversion performance value ZRH is:

[0091] S421: the pixel thermal conversion value ZRHn is obtained by

[0092] S422: the pixel thermal conversion performance average value ZRJ is obtained based on the pixel thermal conversion value ZRHn; further, the pixel thermal conversion performance standard deviation value ZRC is obtained by the standard deviation formula;

[0093] S423: then the pixel thermal conversion performance value ZRH is obtained by

[0094] S43: based on the pixel resistance running stability performance value ZBR and the pixel thermal conversion performance value ZRH, the pixel running state performance value ZBZ is obtained by ​​​​​​

[0095] S5: comparing the pixel running state performance value ZBZ with the pixel running state performance threshold ZBZY;

[0096] If the pixel running state performance value ZBZ is greater than or equal to the pixel running state performance threshold ZBZY, a thermal sheet running qualified signal is generated; at this time, the next thermal sheet detection is performed.

[0097] If the pixel running state performance value ZBZ is less than the pixel running state performance threshold ZBZY, a thermal sheet running abnormal signal is generated; at this time, it is indicated that the thermal sheet will appear unstable during the running process, and further cause running abnormalities, that is, there is a problem of unqualified.

[0098] By heating test of each pixel point on the thermal sheet for a certain length of time, it is judged whether the stability of the resistance of the pixel point during the running process can meet the requirements, and at the same time, since the pixel point needs to be heated during the running process, the heat conversion of the resistance on the pixel point is further calculated to judge whether the heat performance of the pixel point resistance can meet the requirements, and finally based on the comprehensive judgment of the resistance running and heat conversion of the pixel point, whether the thermal sheet is qualified, the qualified detection of the thermal sheet is more accurate and effective from multiple angles. Embodiment

[0099] Based on the above embodiment, a test tool is provided, which is assembled by an epoxy resin plate and provides fixing and supporting functions for the thermal sheet and the detection system. The test tool panel is provided with a top pin with a cable, a buckle, a detection switch, a key and an indicator. The top pin and the cable provide electrical and communication connection for the thermal sheet to be tested and the detection system. The buckle fixes the thermal sheet. The detection switch detects whether the thermal sheet is installed in place and fixed. The key is used to trigger the detection function. The indicator is used to display the state of the power supply and the detection result.

[0100] The above formulas are dimensionless values, and the formulas are obtained by collecting a large amount of data to simulate the most real situation, and the preset parameters in the formula are set by the person skilled in the art according to the actual situation.

[0101] The above describes one embodiment of the present application in detail, but the content described is only the preferred embodiment of the present application, and cannot be considered as limiting the scope of the present application. Any equivalent changes and improvements made according to the scope of the present application should still belong to the patent scope of the present application.

Claims

1. A thermal printer head chip bad pixel rapid detection and analysis system, characterized by: include: Signal acquisition module: Place the thermal sheet to be tested on the test fixture and fix it. Use the distance meter to obtain the contact gap value between the thermal sheet to be tested and the fixed substrate. Then compare the contact gap value with the contact fixation threshold and obtain a fixation completion signal. Detection execution module: Based on the fixed completion signal, the detection execution is triggered, the pixel points on the thermal chip to be tested are marked as n, where n is 1, 2, 3..., all pixels are traversed for power-on testing, and the initial resistance value RXn of each pixel point is calculated; Initial inspection module: determines whether the initial resistance value RXn of each pixel on the thermal sensor to be tested is within the resistance value range [RXmin, RXmax], calculates the initial qualified rate value CTHG of the resistance value, and compares it with the initial qualified rate threshold CTY to obtain the initial qualified signal; Internal inspection module: Based on the initial qualified signal, the test current is maintained at the pixel current value IXn and the power-on test is continued. The pixel operating voltage value UYn after the test time T is obtained through AD monitoring sampling. The pixel operating temperature value WTn is then obtained through the temperature sensor. The pixel operating status performance value ZBZ is calculated. The pixel point running state performance value ZBZ is obtained as follows: The pixel point operating resistance value RYn is calculated based on the pixel point operating voltage value UYn, and the pixel point resistance operating stability performance value ZBR on the thermal sheet to be tested is calculated; Based on the operating temperature value WTn of the pixel point, the initial temperature state value WTO of the pixel point is obtained; wherein the initial temperature state value of all the pixels is the same; and the thermal conversion performance value ZRH of the pixel point is calculated; Based on the pixel resistance running stable performance value ZBR and pixel thermal conversion performance value ZRH, Calculate and obtain the pixel point operating state performance value ZBZ; where g is the preset pixel point resistance operating stability performance coefficient, and k is the preset pixel point thermal conversion performance coefficient; Judgment module: compares the pixel point operation status performance value ZBZ with the pixel point operation status performance threshold ZBZY to obtain the thermal film operation qualified signal.

2. A thermal printer head chip bad pixel rapid detection and analysis system according to claim 1, characterized in that: In the signal acquisition module: the contact gap value is compared with the contact fixed threshold: If the contact gap value is greater than or equal to the contact fixed threshold, a fixed abnormality signal is generated; If the contact gap value is less than the contact fixation threshold, a fixation completion signal is generated.

3. A thermal printer head chip bad pixel rapid detection and analysis system according to claim 1, characterized in that: In the detection execution module, the method for obtaining the initial resistance value RXn of the pixel includes: The test fixture is connected to the test current, and then the electrical signal data of the pixel point is obtained through AD monitoring sampling, where the electrical signal data includes the pixel point current value IXn and the pixel point voltage value UXn; Then pass Calculate and obtain the initial resistance value RXn of each pixel.

4. A thermal printer head chip bad pixel rapid detection and analysis system according to claim 1, characterized in that: The calculation method of the initial state qualified rate value CTHG includes: Determine whether the initial resistance value RXn of each pixel on the thermistor to be tested is within the resistance value range [RXmin, RXmax]: If the initial resistance value RXn is within the resistance value range [RXmin, RXmax], a resistance initial state good signal is generated; If the initial resistance value RXn is not in the resistance value range [RXmin, RXmax], a resistance initial state bad signal is generated; Obtain the number of good initial resistance signals in the pixels on the thermal chip to be tested and record it as i; pass The initial qualified rate value CTHG of the resistance value is calculated.

5. A thermal printer head chip bad pixel rapid detection and analysis system according to claim 4, characterized in that: Compare the initial state qualified rate value CTHG with the initial state qualified rate threshold CTY: If the initial state qualified rate value CTHG is greater than or equal to the initial state qualified rate threshold CTY, an initial state qualified signal is generated; If the initial state qualified rate value CTHG is less than the initial state qualified rate threshold CTY, an initial state unqualified signal is generated.

6. A thermal printer head chip bad pixel rapid detection and analysis system according to claim 1, characterized in that: The calculation method of the pixel point operating resistance value RYn is: based on the pixel point operating voltage value UYn, The pixel operating resistance value RYn is obtained by calculation.

7. A thermal printer head chip bad pixel rapid detection and analysis system according to claim 6, characterized in that: The calculation method of the pixel resistance stable performance value ZBR is: Get the initial resistance value RXn by Calculate and obtain the resistance operating change rate RTLn; Get the maximum value RTLmax of the resistance running change rate among the resistance running change rates RTLn; Calculate the average value of the resistance operating change rate RTLn to obtain the mean value RJB of the resistance operating change rate, and then calculate the standard deviation of the resistance operating change rate RTLn to obtain the standard deviation value BC of the resistance operating change; Then pass The pixel resistance operating stability performance value ZBR is calculated, where a and b are preset proportional coefficients, and both a and b are greater than 0.

8. The thermal printer head chip bad pixel rapid detection and analysis system according to claim 1, characterized in that: The calculation method of the pixel thermal conversion performance value ZRH is: pass Calculate the pixel point heat conversion value ZRHn, where d is the heat loss coefficient; The pixel thermal conversion performance mean ZRJ is calculated based on the pixel thermal conversion value ZRHn; the pixel thermal conversion performance standard deviation ZRC is further calculated using the standard deviation formula; Then pass The pixel point thermal conversion performance value ZRH is calculated, where e is the preset proportional coefficient of the pixel point thermal conversion mean value, and f is the preset proportional coefficient of the pixel point thermal conversion performance standard deviation; both e and f are greater than 0.

9. A thermal printer head chip bad pixel rapid detection and analysis system according to claim 1, characterized in that: Compare the pixel point operating state performance value ZBZ with the pixel point operating state performance threshold ZBZY; If the pixel point operating status performance value ZBZ is greater than or equal to the pixel point operating status performance threshold ZBZY, a thermal film operating qualified signal is generated; If the pixel point operation state representation value ZBZ is less than the pixel point operation state representation threshold value ZBZY, a thermal sheet operation abnormality signal is generated.

Images