Shell and electronic equipment

Abstract

The embodiment of the invention provides a shell and electronic equipment, and relates to the technical field of electronic equipment shells. The shell comprises a metal appearance piece and a protective lamination layer, and the protective lamination layer covers the surface of the metal appearance piece. The protection lamination layer comprises an insulation protection layer and a wear-resistant protection layer which are laminated, and the wear-resistant protection layer is located on the side, away from the metal appearance part, of the insulation protection layer. The protective laminated layer comprises the insulating protective layer, so that the risk that the metal appearance piece and other metal parts are corroded and damaged due to primary battery reaction generated when the metal appearance piece is in contact with the other metal parts made of different materials from the metal appearance piece can be reduced. On the basis, the protective laminated layer further comprises a wear-resistant protective layer, so that the protective laminated layer not only can play a role in insulation, but also can play a role in wear resistance and scratch prevention, and the protective effect of the protective laminated layer on the metal exterior part is improved. In addition, the wear-resistant protection layer can protect the insulation protection layer, and the risk of damage to the insulation protection layer is reduced.

Description

Technical Field

[0001] Embodiments of the present application provide a housing and an electronic device, and relate to the technical field of electronic device housings. Background Art

[0002] The electronic device includes a housing, which generally includes metal exterior parts, such as a metal frame or a metal hinge cover, etc. In the related art, the risk of damage to the metal exterior parts is relatively high, which affects the appearance of the electronic device. Summary of the invention

[0003] The embodiments of the present application provide a housing and an electronic device, which reduce the risk of scratches and damages to the metal exterior parts of the housing.

[0004] In one aspect, an embodiment of the present application provides a housing. The housing includes a metal appearance part and a protective laminate. The protective laminate covers the surface of the metal appearance part. The protective laminate includes an insulating protective layer, and the insulating protective layer includes a plurality of stacked sub-insulating layers.

[0005] In the embodiment of the present application, a protective laminate is provided to cover the surface of the metal appearance part, so that the protective laminate can protect the metal appearance part. In addition, the protective laminate includes an insulating protective layer, so that the protective laminate can play an insulating role, thereby reducing the risk of galvanic reaction when the metal appearance part contacts other metal parts of different materials, thereby causing corrosion damage to the metal appearance part and other metal parts.

[0006] Providing an insulating protective layer including a plurality of stacked sub-insulating layers can increase the thickness of the insulating protective layer, thereby ensuring the insulating effect of the insulating protective layer, and can improve the protective effect of the insulating protective layer on the metal appearance parts, reduce the risk of scratching the metal appearance parts, and improve the appearance of the electronic device. In addition, compared with providing a thicker insulating protective layer, providing an insulating protective layer including a plurality of stacked sub-insulating layers can reduce the risk of surface cracking of the insulating protective layer.

[0007] In some possible implementations, the plurality of sub-insulating layers include at least two of an oxide layer, a nitride layer, and an oxynitride layer. At least two of the oxide layer, the nitride layer, and the oxynitride layer are alternately stacked. Such a configuration can ensure the insulating effect of the insulating protective layer and reduce the risk of corrosion damage to the metal appearance part caused by a galvanic cell reaction when the metal appearance part contacts a metal part made of a material different from the metal appearance part.

[0008] In some possible implementations, the material of the oxide layer includes Al 2 O 3 、SiO 2 、Si w Alz O y At least one of the following. The material of the nitride layer includes Si 3 N 4 、AlN、Si w Al z N x At least one of the following. The material of the oxynitride layer includes Si z O y N x 、Al z O y N x 、Si w Al z O y N x Such an arrangement can improve the flexibility of material selection for the oxide layer, the nitride layer and the oxynitride layer to meet different requirements.

[0009] In some possible implementations, the protective stack includes a transition layer, which is located on a side of the insulating protective layer close to the metal appearance part and is stacked with the insulating protective layer. In this way, the transition layer can transitionally connect the metal appearance part and the insulating protective layer, improve the adhesion between the two, and reduce the risk of the insulating protective layer falling off relative to the metal appearance part.

[0010] In some possible implementations, the transition layer includes a first sub-transition layer and a second sub-transition layer stacked in layers, and the first sub-transition layer is closer to the metal appearance part than the second sub-transition layer. The material of the first sub-transition layer includes at least one of W, Cr, Ti, Si, Al, Nb, Ni, Mn, Mo, and C. The material of the second sub-transition layer includes SiO 2 、Al 2 O 3 、Si z O y N x 、TiO 2 Cr 2 O 3 , Nb y O x At least one of the following. With such a configuration, the first sub-transition layer can transitionally connect the metal appearance part and the second sub-transition layer, and the second sub-transition layer can transitionally connect the first sub-transition layer and the insulating protective layer, thereby improving the adhesion between the insulating protective layer and the metal appearance part and reducing the risk of the insulating protective layer falling off relative to the metal appearance part. In addition, the flexibility of the first sub-transition layer and the second sub-transition layer in material selection is improved.

[0011] In some possible implementations, the thickness of the first sub-transition layer ranges from 1 nanometer to 50 nanometers. The thickness of the second sub-transition layer ranges from 3 nanometers to 30 nanometers. It can be understood that setting the thickness of the first sub-transition layer to range from 1 nanometer to 50 nanometers can avoid the thickness of the first sub-transition layer being too large (for example, greater than 50 nanometers) resulting in an increase in the thickness of the protective stack, and can avoid the thickness of the first sub-transition layer being too small (for example, less than 1 nanometer) affecting the transition connection effect between the first sub-transition layer and the second sub-transition layer and the metal appearance part. Setting the thickness of the second sub-transition layer to range from 3 nanometers to 30 nanometers can avoid the thickness of the second sub-transition layer being too large (for example, greater than 30 nanometers) resulting in an increase in the thickness of the protective stack, and can avoid the thickness of the second sub-transition layer being too small (for example, less than 3 nanometers) affecting the bonding effect between the second sub-transition layer and the insulating protective layer.

[0012] In some possible implementations, the thickness of the first transition sub-layer may range from 5 nm (unit: nanometer) to 45 nm, 10 nm to 40 nm, 15 nm to 35 nm, or 20 nm to 30 nm, etc. The thickness of the second transition sub-layer may range from 5 nm to 25 nm, 10 nm to 22 nm, or 15 nm to 20 nm, etc.

[0013] In some possible implementations, the first transition sub-layer may have a value of 8 nm, 12 nm, 23 nm, 38 nm, or 43 nm, etc. The second transition sub-layer may have a value of 8 nm, 13 nm, 18 nm, 22 nm, or 28 nm, etc.

[0014] In some possible implementations, the material of the transition layer includes at least one of W, Cr, Ti, Si, Al, Nb, Ni, Mn, Mo, and C. The sub-insulating layer includes an oxide layer, and the oxide layer and the transition layer are arranged adjacent to each other; or, the sub-insulating layer includes a nitride oxide layer, and the nitride oxide layer and the transition layer are arranged adjacent to each other. In this way, the transition layer can transitionally connect the metal appearance part and the insulating protective layer, improve the adhesion between the insulating protective layer and the metal appearance part, and reduce the risk of the insulating protective layer falling off relative to the metal appearance part. And the flexibility of the transition layer in material selection is improved.

[0015] In some possible implementations, the protective laminate includes a transparent material. Among them, the refractive indexes of at least two adjacent sub-insulating layers in the insulating protective layer are different. In this way, the user can observe the color of the metal appearance layer through the protective laminate, meeting the industrial design (ID) appearance requirements. In addition, the light reflected by the metal appearance part can be refracted by the sub-insulating layers with different refractive indices, so that the protective laminate can be used as an optical film layer. By adjusting the refractive indices of different sub-insulating layers, the color of the metal appearance part observed by the user can be adjusted, thereby improving the appearance effect of the shell.

[0016] In some possible implementations, the protective laminate includes a wear-resistant protective layer, which is located on a side of the insulating protective layer away from the metal appearance part and is stacked with the insulating protective layer. It can be understood that the protective laminate includes the wear-resistant protective layer and the insulating protective layer, so that the protective laminate can play a role in wear resistance, scratch resistance and insulation, thereby improving the protective effect of the protective laminate on the metal appearance part. The wear-resistant protective layer is arranged away from the metal appearance part relative to the insulating protective layer, so that the wear-resistant protective layer can protect the insulating protective layer, thereby reducing the risk of damage to the insulating protective layer.

[0017] In some possible implementations, the thickness of the insulating protective layer is greater than the thickness of the wear-resistant protective layer. This arrangement allows the thickness of the insulating protective layer to be greater, thereby ensuring the insulating effect of the insulating protective layer.

[0018] In some possible implementations, the thickness of the insulating protective layer ranges from 300 nanometers to 3000 nanometers. The thickness of the wear-resistant protective layer ranges from 1 nanometer to 200 nanometers. It can be understood that setting the thickness of the insulating protective layer to range from 300 nanometers to 3000 nanometers can avoid the thickness of the insulating protective layer being too large (for example, greater than 3000 nanometers) causing an increase in the thickness of the protective stack, and can avoid the thickness of the insulating protective layer being too small (for example, less than 300 nanometers), thereby ensuring the insulating effect of the insulating protective layer. Setting the thickness of the wear-resistant protective layer to range from 1 nanometer to 200 nanometers can avoid the thickness of the wear-resistant protective layer being too large (for example, greater than 200 nanometers) causing an increase in the thickness of the protective stack, and can avoid the thickness of the wear-resistant protective layer being too small (for example, less than 1 nanometer), thereby ensuring the protective effect of the wear-resistant protective layer on the insulating protective layer and the metal appearance parts.

[0019] In some possible implementations, the thickness of the insulating protective layer may range from 500nm to 2500nm, 1000nm to 2000nm, or 1200nm to 1800nm, etc. The thickness of the wear-resistant protective layer may range from 10nm to 180nm, 50nm to 150nm, or 100nm to 120nm, etc.

[0020] In some possible implementations, the thickness of the insulating protective layer may be 800 nm, 1500 nm, 2200 nm, or 2800 nm, etc. The thickness of the wear-resistant protective layer may be 5 nm, 30 nm, 80 nm, or 130 nm, etc.

[0021] In some possible implementations, the material of the wear-resistant protective layer includes SiN x , CN x 、SiC x 、SiN x C y , diamond-like carbon or modified diamond-like carbon. In this way, the wear-resistant protective layer can have a greater hardness, play a role in wear resistance and scratch resistance, reduce the risk of scratching the protective laminate, thereby protecting the metal appearance parts, improving the appearance of the electronic equipment, and improving the flexibility of the wear-resistant protective layer in material selection.

[0022] In some possible implementations, the protective laminate includes an anti-fingerprint layer, which is located on a side of the insulating protective layer away from the metal appearance part and is stacked with the insulating protective layer. This arrangement can reduce the risk of fingerprints or other impurities being left on the surface of the metal appearance part when the user touches the housing, improve the appearance of the electronic device, and protect the insulating protective layer.

[0023] In some possible implementations, the water drop angle of the anti-fingerprint layer on the side away from the insulating protective layer ranges from 110° to 120°. This configuration enables the anti-fingerprint layer to have strong hydrophobicity and be less likely to be contaminated, thereby improving the appearance of the electronic device.

[0024] In some possible implementations, the metal appearance part includes a metal appearance part body and a metal appearance layer, and the metal appearance layer covers the surface of the metal appearance part body. The protective laminate covers the metal appearance layer. It can be understood that the metal appearance layer is provided to cover the surface of the metal appearance part body, which can protect the metal appearance part body on the one hand, and improve the surface smoothness of the metal appearance part on the other hand, thereby improving the appearance effect of the metal appearance part. In addition, by changing the color of the metal appearance layer, the metal appearance part can have different colors, meet the industrial design (ID) appearance requirements, and improve the convenience of changing the color of the metal appearance part. The protective laminate is provided to cover the metal appearance layer of the metal appearance part, so that the protective laminate can protect the metal appearance part body and the metal appearance layer, thereby reducing the risk of damage to the metal appearance part.

[0025] In some possible implementations, the surface impedance of the protective stack is greater than or equal to 100MΩ. This arrangement can ensure the insulation effect of the protective stack and reduce the risk of galvanic reaction when the metal appearance part contacts other metal parts with different materials, thereby causing corrosion damage to the metal appearance part and other metal parts.

[0026] In some possible implementations, the thickness of the protective laminate is in the range of 300 nanometers to 5000 nanometers. This configuration can prevent the volume of the housing from increasing due to the thickness of the protective laminate being too large (for example, greater than 5000 nanometers), and can also prevent the thickness of the protective laminate from being too small (for example, less than 500 nanometers), thereby ensuring the protective effect of the protective laminate on the metal exterior part.

[0027] In some possible implementations, the thickness of the protective stack may range from 5000 nm to 4500 nm, 1000 nm to 4000 nm, or 1500 nm to 3500 nm.

[0028] In some possible implementations, the thickness of the protective stack may be 800 nm, 1200 nm, 1800 nm, 2500 nm, 3000 nm or 4000 nm, etc.

[0029] On the other hand, an embodiment of the present application provides a housing. The housing includes a metal appearance part and a protective laminate. The protective laminate covers the surface of the metal appearance part. The protective laminate includes a wear-resistant protective layer.

[0030] In some possible implementations, the protective stack includes an insulating protective layer, which is located on the side of the wear-resistant protective layer close to the metal appearance part and is stacked with the wear-resistant protective layer. It can be understood that the protective stack includes the wear-resistant protective layer and the insulating protective layer, so that the protective stack can play the role of wear resistance, scratch resistance and insulation, and improve the protective effect of the protective stack on the metal appearance part. The insulating protective layer is arranged closer to the metal appearance part relative to the wear-resistant protective layer, so that the wear-resistant protective layer can protect the insulating protective layer, reducing the risk of damage to the insulating protective layer.

[0031] In some possible implementations, the material of the wear-resistant protective layer includes SiN x , CN x 、SiC x 、SiN x C y , diamond-like carbon or modified diamond-like carbon. In this way, the wear-resistant protective layer can have a greater hardness, play a role in wear resistance and scratch resistance, reduce the risk of scratching the protective laminate, thereby protecting the metal appearance parts, improving the appearance of the electronic equipment, and improving the flexibility of the wear-resistant protective layer in material selection.

[0032] In the embodiment of the present application, the protective laminate covers the surface of the metal appearance part, so that the protective laminate can protect the metal appearance part. In addition, the protective laminate includes a wear-resistant protective layer, which can improve the wear resistance of the protective laminate and reduce the risk of the protective laminate being scratched, thereby protecting the metal appearance part and improving the appearance of the electronic device.

[0033] In some possible implementations, the insulating protective layer includes a plurality of stacked sub-insulating layers. Such a configuration can increase the thickness of the insulating protective layer, thereby ensuring the insulating effect of the insulating protective layer, and enable the insulating protective layer to protect the metal appearance parts, reduce the risk of scratching the metal appearance parts, and improve the appearance of the electronic device. In addition, compared with setting a thicker insulating protective layer, setting the insulating protective layer to include a plurality of stacked sub-insulating layers can reduce the risk of surface cracking of the insulating protective layer.

[0034] In some possible implementations, the protective stack includes a transition layer, which is located on a side of the insulating protective layer close to the metal appearance part and is stacked with the insulating protective layer. In this way, the transition layer can transitionally connect the metal appearance part and the insulating protective layer, improve the adhesion between the two, and reduce the risk of the insulating protective layer falling off relative to the metal appearance part.

[0035] On the other hand, an embodiment of the present application provides a housing. The housing includes a metal appearance part and a protective laminate. The protective laminate covers the surface of the metal appearance part. The protective laminate includes an insulating protective layer and a wear-resistant protective layer stacked in layers. The wear-resistant protective layer is located on a side of the insulating protective layer away from the metal appearance part.

[0036] In the embodiment of the present application, the protective laminate covers the surface of the metal appearance part, so that the protective laminate can protect the metal appearance part. In addition, the protective laminate includes a wear-resistant protective layer and an insulating protective layer stacked in layers, so that the protective laminate can play a role in wear resistance, scratch resistance and insulation, thereby improving the protective effect of the protective laminate on the metal appearance part. The wear-resistant protective layer is arranged away from the metal appearance part relative to the insulating protective layer, so that the wear-resistant protective layer can protect the insulating protective layer, thereby reducing the risk of damage to the insulating protective layer.

[0037] On the other hand, an embodiment of the present application provides an electronic device. The electronic device includes a processor and a housing as described above. The processor is located in a receiving space enclosed by the housing.

[0038] The electronic device provided in the embodiment of the present application includes the housing as described above, and thus has all the above-mentioned beneficial effects, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 A schematic diagram of the structure of an electronic device provided in some embodiments of the present application;

[0040] Figure 2 A schematic diagram of the structure of an electronic device provided in some other embodiments of the present application;

[0041] Figure 3 A schematic diagram of the structure of an electronic device provided in some embodiments of the present application;

[0042] Figure 4 A schematic diagram of the structure of a metal appearance part provided in some embodiments of the present application;

[0043] Figure 5 A schematic diagram of the structure of the protective stack and the metal appearance parts provided in some embodiments of the present application;

[0044] Figure 6 Schematic diagram of the structure of the protective stack and metal appearance parts provided in other embodiments of the present application;

[0045] Figure 7 A schematic diagram of the structure of the protective stack and the metal appearance parts provided in some other embodiments of the present application;

[0046] Figure 8 A schematic diagram of the structure of the protective stack and the metal appearance parts provided in some other embodiments of the present application;

[0047] Fig. 9 A schematic diagram of the structure of the protective stack and the metal appearance parts provided in some other embodiments of the present application;

[0048] Fig.10 A schematic diagram of the structure of the protective stack and the metal appearance parts provided in some other embodiments of the present application;

[0049] Fig.11 A schematic diagram of the structure of the protective stack and the metal appearance parts provided in some other embodiments of the present application;

[0050] Fig.12 Schematic diagram of the structure of the protective stack and metal appearance parts provided in some other embodiments of the present application. DETAILED DESCRIPTION

[0051] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments provided by the present application, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present application.

[0052] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present application. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0053] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "plurality" means two or more.

[0054] As used herein, "perpendicular" and "parallel" include the conditions described and conditions similar to the conditions described, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range for approximate perpendicularity may be 5%.

[0055] Figure 1 A schematic diagram of the structure of an electronic device provided for some embodiments of the present application. Figure 2 A schematic diagram of the structure of an electronic device provided for some other embodiments of the present application.

[0056] In some examples, such as Figure 1 and Figure 2 As shown, some embodiments of the present application provide an electronic device 200, which may include a housing 100, and the housing 100 may include a metal appearance part 110. It can be understood that during the use of the electronic device 200, the metal appearance part 110 may be exposed.

[0057] For example, Figure 1 and Figure 2As shown, the housing 100 may include a middle frame 101 and a rear shell 102, and the rear shell 102 is located on one side of the middle frame 101 and is connected to the middle frame 101. The rear shell 102 and the middle frame 101 can enclose a storage space. The middle frame 101 may include a middle plate (not shown in the figure) and a frame 1011. The middle plate is the skeleton of the electronic device and plays a role of bearing and supporting. The frame 1011 surrounds the middle plate and is connected to the middle plate. In some examples, the metal appearance part 110 may be the frame 1011 of the housing 100.

[0058] Continue to refer to Figure 1 and Figure 2 The electronic device 200 may further include a display screen 201 and a camera assembly 202. The display screen 201 is located on a side of the middle frame 101 away from the rear housing 102 and is connected to the middle frame 101. At least a portion of the camera assembly 202 is embedded in a camera receiving hole provided in the rear housing 102 to prevent the rear housing 102 from blocking the camera assembly 202.

[0059] For example, the electronic device 200 may further include a processor (not shown in the figure), which may be a central processing unit (CPU) or a graphics processing unit (GPU). The processor may be located in the accommodation space enclosed by the housing 100, that is, the processor may be located in the accommodation space enclosed by the middle frame 101 and the rear housing 102. The display screen 201 and the camera assembly 202 may be electrically connected to the processor.

[0060] Figure 3 A schematic diagram of the structure of an electronic device provided in some further embodiments of the present application.

[0061] In some examples, such as Figure 3 As shown, the electronic device 200 may be a foldable electronic device, and the housing 100 may include a first housing 1001, a second housing 1002, and a rotating shaft 1003, and the first housing 1001 and the second housing 1002 are rotatably connected via the rotating shaft 1003. The display screen 201 may be a flexible display screen, which has a bendable characteristic. When the first housing 1001 and the second housing 1002 are in a relatively folded state, the display screen 201 can be driven to bend, so that the electronic device 200 can be folded. At this time, the metal appearance part 110 may also be a metal cover of the rotating shaft 1003.

[0062] It can be understood that the metal appearance part 110 can also be other metal parts that can be exposed during the use of the electronic device 200. The embodiment of the present application does not further limit the specific form of the metal appearance part 110.

[0063] Figure 4A schematic diagram of the structure of a metal appearance part provided in some embodiments of the present application.

[0064] In some examples, such as Figure 4 As shown, the metal appearance part 110 may include a metal appearance part body 111 and a metal appearance layer 112 , and the metal appearance layer 112 covers the surface of the metal appearance part body 111 .

[0065] For example, the material of the metal appearance part body 111 may include at least one of stainless steel, titanium alloy, zirconium alloy, and aluminum alloy. The material of the metal appearance layer 112 may include nitrides or carbides of one or more components of Cr (chromium), Ti (titanium), Si (silicon), Al (aluminum), Nb (niobium), Ni (nickel), Mn (manganese), Mo (molybdenum), C (carbon), and W (tungsten). The thickness of the metal appearance layer 112 may range from 100 nanometers (unit: nm) to 3000 nanometers.

[0066] For example, the thickness of the metal appearance layer 112 may range from 300 nm to 2500 nm, 800 nm to 2000 nm, 1000 nm to 1500 nm, etc. For example, the thickness of the metal appearance layer 112 may range from 500 nm, 1200 nm, 1900 nm or 2500 nm, etc. The embodiments of the present application do not further limit the thickness of the metal appearance layer 112.

[0067] The metal appearance layer 112 is provided to cover the surface of the metal appearance part body 111, which can protect the metal appearance part body 111 on the one hand, and improve the surface smoothness of the metal appearance part 110 on the other hand, thereby improving the appearance effect of the metal appearance part 110. In addition, by changing the color of the metal appearance layer 112, the metal appearance part 110 can have different colors, meet the industrial design (ID) appearance requirements, and improve the convenience of changing the color of the metal appearance part 110.

[0068] For example, the metal appearance layer 112 may be formed on the surface of the metal appearance part body 111 by physical vapor deposition (PVD), so that the metal appearance layer 112 has good adhesion. Alternatively, the metal appearance layer 112 may be formed on the surface of the metal appearance part body 111 by chemical vapor deposition (CVD), evaporation, or electroplating. The embodiment of the present application does not further limit the process of forming the metal appearance layer 112.

[0069] In some other examples, the metal appearance part 110 may also include only the metal appearance part body 111, but not the metal appearance layer 112. The embodiment of the present application takes the metal appearance part 110 including the metal appearance part body 111 and the metal appearance layer 112 as an example to continue the description.

[0070] For example, the metal appearance part 110 is usually a conductor with good conductivity. As a result, when the metal appearance part 110 comes into contact with other metal parts made of different materials from the metal appearance part 110, such as when the metal appearance part 110 made of stainless steel comes into contact with other metal parts made of aluminum alloy, a galvanic reaction is likely to occur, causing electrochemical corrosion to the metal appearance part 110 and other metal parts of the electronic device 200, resulting in damage to the shell 100 and affecting the appearance of the electronic device 200.

[0071] In addition, the hardness of the metal appearance part 110 is usually low, and the film layer of the metal appearance layer 112 is loose. During the use of the electronic device 200, the metal appearance part 110 is easily scratched, which affects the appearance of the electronic device 200.

[0072] Figure 5 A schematic diagram of the structure of the protective stack and metal appearance parts provided in some embodiments of the present application. Figure 6 Schematic diagram of the structure of the protective stack and metal appearance parts provided in other embodiments of the present application.

[0073] Based on this, in the embodiments of the present application, Figure 5 and Figure 6 As shown, the housing 100 further includes a protective laminate 120 , which covers the surface of the metal appearance part 110 . For example, the protective laminate 120 covers the metal appearance layer 112 .

[0074] It can be understood that the protective laminate 120 is provided to cover the metal appearance layer 112 of the metal appearance part 110 , so that the protective laminate 120 can protect the metal appearance part body 111 and the metal appearance layer 112 , thereby reducing the risk of damage to the metal appearance part 110 .

[0075] The embodiment of the present application does not further limit the metal appearance part 110 , and the protective stack 120 is described below by way of example.

[0076] In some examples, the thickness of the protection stack 120 ranges from 300 nanometers to 5000 nanometers.

[0077] For example, the thickness of the protective stack 120 may range from 5000nm to 4500nm, 1000nm to 4000nm, or 1500nm to 3500nm. For example, the thickness of the protective stack 120 may range from 800nm, 1200nm, 1800nm, 2500nm, 3500nm, 4000nm, 5000nm, 6000nm, 8000nm, 12000nm, 1800nm, 2500nm, 3500nm, 4000nm, 5000nm, 6000nm, 8000nm, 9000nm, 10000nm, 15 ...

[0078] 3000nm or 4000nm, etc. The embodiment of the present application does not further limit the thickness of the protection stack 120 .

[0079] The thickness of the protective stack 120 is set in the range of 300 nanometers to 5000 nanometers, which can avoid the thickness of the protective stack 120 being too large (for example, greater than 5000 nanometers) causing an increase in the volume of the shell 100; and can avoid the thickness of the protective stack 120 being too small (for example, less than 300 nanometers), thereby ensuring the protective effect of the protective stack 120 on the metal appearance part 110.

[0080] In some examples, such as Figure 5 and Figure 6 As shown, the protection stack 120 includes an insulating protection layer 121 .

[0081] For example, the protective stack 120 may include only the insulating protective layer 121 , or the protective stack 120 may include other film layers in addition to the insulating protective layer 121 , and the insulating protective layer 121 and the other film layers are stacked.

[0082] For example, the insulating protective layer 121 may be formed by PVD, or by CVD, evaporation, or electroplating. The embodiment of the present application does not further limit the process of forming the insulating protective layer 121.

[0083] The protective stack 120 includes an insulating protective layer 121, so that the protective stack 120 can play an insulating role, thereby reducing the risk of galvanic reaction when the metal appearance part 110 contacts other metal parts of a material different from that of the metal appearance part 110, thereby causing corrosion damage to the metal appearance part 110 and other metal parts.

[0084] In some examples, the surface impedance of the protection stack 120 is greater than or equal to 100 MΩ (unit: megaohm).

[0085] For example, the film layers playing an insulating role in the protection stack 120 may only include the insulating protection layer 121 , or the film layers playing an insulating role in the protection stack 120 may also include other film layers except the insulating protection layer 121 .

[0086] Setting the surface impedance of the protection stack 120 to be greater than or equal to 100 MΩ can ensure the insulation effect of the protection stack 120 and reduce the risk of corrosion damage to the metal appearance part 110 and other metal parts due to a galvanic reaction when the metal appearance part 110 contacts other metal parts of a material different from that of the metal appearance part 110. It can be understood that the embodiment of the present application does not further limit the value of the surface impedance of the protection stack 120.

[0087] In some examples, such as Figure 5 and Figure 6 As shown, the insulating protection layer 121 includes a plurality of stacked sub-insulating layers 1211. The materials and thicknesses of the plurality of sub-insulating layers 1211 may be the same or different.

[0088] The insulating protective layer 121 includes a plurality of stacked sub-insulating layers 1211, which can increase the thickness of the insulating protective layer 121, thereby ensuring the insulating effect of the insulating protective layer 121, and can improve the protective effect of the insulating protective layer 121 on the metal appearance part 110, reduce the risk of the metal appearance part 110 being scratched, and improve the appearance effect of the electronic device 200.

[0089] In addition, compared with providing a single insulating protection layer 121 with a relatively large thickness, providing the insulating protection layer 121 including a plurality of stacked sub-insulating layers 1211 can reduce the risk of surface cracking of the insulating protection layer 121 .

[0090] Figure 7 Schematic diagram of the structure of the protective stack and metal appearance parts provided in some other embodiments of the present application. Figure 8 Schematic diagram of the structure of the protective stack and metal appearance parts provided in some other embodiments of the present application.

[0091] In some examples, such as Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, the plurality of sub-insulating layers 1211 include at least two of an oxide layer 1211a, a nitride layer 1211b, and an oxynitride layer 1211c. At least two of the oxide layer 1211a, the nitride layer 1211b, and the oxynitride layer 1211c are alternately stacked.

[0092] For example, Figure 5 As shown, the plurality of sub-insulating layers 1211 may include oxide layers 1211a and nitride layers 1211b that are alternately stacked; or Figure 6 As shown, the plurality of sub-insulating layers 1211 may include oxide layers 1211a and oxynitride layers 1211c that are alternately stacked; or, as shown in FIG. Figure 7As shown, the plurality of sub-insulating layers 1211 may include nitride layers 1211b and oxynitride layers 1211c alternately stacked; or, as shown in FIG. Figure 8 As shown, the plurality of sub-insulating layers 1211 may include oxide layers 1211 a , nitride layers 1211 b , and oxynitride layers 1211 c that are alternately stacked.

[0093] A plurality of sub-insulating layers 1211 are provided, including at least two of an oxide layer 1211a, a nitride layer 1211b and a nitride oxide layer 1211c. At least two of the oxide layer 1211a, the nitride layer 1211b and the nitride oxide layer 1211c are alternately stacked, which can ensure the insulating effect of the insulating protection layer 121 and reduce the risk of corrosion damage to the metal appearance part 110 caused by a galvanic cell reaction when the metal appearance part 110 contacts a metal part made of a material different from that of the metal appearance part 110.

[0094] In some examples, the material of the oxide layer 1211a includes Al 2 O 3 (aluminum oxide), SiO 2 (Silicon oxide), Si w Al z O y (aluminum oxide silicon) at least one. The material of the nitride layer 1211b includes Si 3 N 4 (Silicon Nitride), AlN (Aluminum Nitride), Si w Al z N x (aluminum silicon nitride). The material of the nitride oxide layer 1211c includes Si z O y N x (Silicon Oxynitride), Al z O y N x (aluminum oxynitride), Si w Al z O y N x At least one of (aluminum silicon oxynitride).

[0095] It is understood that the subscripts of the elements in the above chemical formulas, such as x, y, z, and w, represent the number of atoms of the element. z O y N x In (silicon oxynitride), z represents the number of atoms of Si (silicon), y represents the number of atoms of O (oxygen), and x represents the number of atoms of N (nitrogen). The values ​​of x, y, z, and w in different chemical formulas may be the same or different. The embodiments of the present application do not further limit the values ​​of x, y, z, and w.

[0096] For example, the value range of x, y, z, and w can be greater than or equal to 1 and less than or equal to 6. In addition, the values ​​of x, y, z, and w can be fractions. z O y N x Taking silicon oxynitride as an example, the value of the number of nitrogen atoms x can be 5 or The embodiments of the present application do not further limit the values ​​of x, y, z, and w.

[0097] In some possible cases, the values ​​of x, y, z, and w may also be greater than 6.

[0098] The material of the oxide layer 1211a includes Al 2 O 3 (aluminum oxide), SiO 2 (Silicon oxide), Si w Al z O y (aluminum oxide silicon), the material of the nitride layer 1211b includes Si 3 N 4 (Silicon Nitride), AlN (Aluminum Nitride), Si w Al z N x (aluminum silicon nitride), the material of the oxynitride layer 1211c includes Si z O y N x (Silicon Oxynitride), Al z O y N x (aluminum oxynitride), Si w Al z O y N x At least one of (aluminum silicon oxynitride) can improve the flexibility of material selection for the oxide layer 1211a, the nitride layer 1211b and the oxynitride layer 1211c to meet different needs.

[0099] It is understandable that the material of the oxide layer 1211a may also include other materials besides Al. 2 O 3 (aluminum oxide), SiO 2 (Silicon oxide) and Si w Al z O y Other oxides other than aluminum oxide (aluminum silicon oxide), the material of the nitride layer 1211b may also include other oxides other than Si 3 N 4 (Silicon Nitride), AlN (Aluminum Nitride) and Siw Al z N x The material of the nitride oxide layer 1211c may also include other nitrides besides Si z O y N x (Silicon Oxynitride), Al z O y N x (Aluminum Oxynitride) and Si w Al z O y N x Nitrogen oxides other than (aluminum silicon oxynitride).

[0100] In some examples, protective stack 120 includes a transparent material.

[0101] For example, each film layer in the protective stack 120 (the insulating protective layer 121 and other film layers except the insulating protective layer 121, such as the transition layer 122, the wear-resistant protective layer 123 and the anti-fingerprint layer 124, etc.) can include transparent materials, so that the user can observe the color of the metal appearance layer 112 through the protective stack 120, meeting the industrial design (ID) appearance requirements.

[0102] The refractive indexes of at least two adjacent sub-insulating layers 1211 in the insulating protection layer 121 are different.

[0103] It can be understood that the light reflected by the metal appearance part 110 can be refracted by the sub-insulating layers 1211 with different refractive indices, so that the protective laminate 120 can be used as an optical film layer. By adjusting the refractive index of different sub-insulating layers 1211, the color of the metal appearance part 110 observed by the user can be adjusted, thereby improving the appearance effect of the housing 100 and meeting the industrial design (ID) appearance requirements.

[0104] Fig. 9 Schematic diagram of the structure of the protective stack and metal appearance parts provided in some other embodiments of the present application.

[0105] In some examples, such as Fig. 9 As shown, the protective stack 120 includes a transition layer 122 . The transition layer 122 is located on a side of the insulating protective layer 121 close to the metal appearance part 110 , and is stacked with the insulating protective layer 121 .

[0106] It can be understood that the transition layer 122 can play a role of transition connection to improve the adhesion between the metal appearance part 110 and the insulating protection layer 121 and reduce the risk of the insulating protection layer 121 falling off relative to the metal appearance part 110.

[0107] For example, the transition layer 122 may be formed by PVD, or by CVD, evaporation, or electroplating. The embodiment of the present application does not further limit the process of forming the transition layer 122.

[0108] In some examples, such as Fig. 9 As shown, the transition layer 122 includes a first sub-transition layer 122a and a second sub-transition layer 122b stacked, and the first sub-transition layer 122a is closer to the metal appearance part 110 than the second sub-transition layer 122b. The material of the first sub-transition layer 122a may include at least one of W (tungsten), Cr (chromium), Ti (titanium), Si (silicon), Al (aluminum), Nb (niobium), Ni (nickel), Mn (manganese), Mo (molybdenum), and C (carbon). The material of the second sub-transition layer 122b may include SiO 2 (Silicon oxide), Al 2 O 3 (aluminum oxide), Si z O y N x (Silicon Oxynitride), TiO 2 (Titanium oxide), Cr 2 O 3 (chromium oxide), Nb y O x (niobium oxide).

[0109] It is understood that the subscripts of the elements in the above chemical formulas, such as x, y, and z, represent the number of atoms of the element. z O y N x In (silicon oxynitride), z represents the number of atoms of Si (silicon), y represents the number of atoms of O (oxygen), and x represents the number of atoms of N (nitrogen). The values ​​of x, y, and z in different chemical formulas may be the same or different. The embodiments of the present application do not further limit the values ​​of x, y, and z.

[0110] For example, the value range of x, y, and z may be greater than or equal to 1 and less than or equal to 6. Furthermore, the values ​​of x, y, and z may be fractions.

[0111] Si z O y N x Taking silicon oxynitride as an example, the value of the number of nitrogen atoms x can be or The embodiments of the present application do not further limit the values ​​of x, y, and z.

[0112] In some possible cases, the values ​​of x, y, and z may also be greater than 6.

[0113] The material of the first transition layer 122a includes at least one of W (tungsten), Cr (chromium), Ti (titanium), Si (silicon), Al (aluminum), Nb (niobium), Ni (nickel), Mn (manganese), Mo (molybdenum), and C (carbon), and the material of the second transition layer 122b includes SiO 2 (Silicon oxide), Al 2 O 3 (aluminum oxide), Si z O y N x (Silicon Oxynitride), TiO 2 (Titanium oxide), Cr 2 O 3 (chromium oxide), Nb y O x (niobium oxide), so that the first sub-transition layer 122a can transitionally connect the metal appearance part 110 to the second sub-transition layer 122b, and the second sub-transition layer 122b can transitionally connect the first sub-transition layer 122a to the insulating protection layer 121, thereby improving the adhesion between the insulating protection layer 121 and the metal appearance part 110 and reducing the risk of the insulating protection layer 121 falling off relative to the metal appearance part 110. In addition, the flexibility of the first sub-transition layer 122a and the second sub-transition layer 122b in material selection is improved.

[0114] It is understandable that the first transition layer 122a may also include other metals or non-metals besides W (tungsten), Cr (chromium), Ti (titanium), Si (silicon), Al (aluminum), Nb (niobium), Ni (nickel), Mn (manganese), Mo (molybdenum), and C (carbon), and the second transition layer 122b may also include other metals or non-metals besides SiO 2 (Silicon oxide), Al 2 O 3 (aluminum oxide), Si z O y N x (Silicon Oxynitride), TiO 2 (Titanium oxide), Cr 2 O 3 (chromium oxide), Nb y O x (niobium oxide) other than oxides or oxynitrides.

[0115] In some examples, the thickness of the first transition sub-layer 122a ranges from 1 nanometer to 50 nanometers, and the thickness of the second transition sub-layer 122b ranges from 3 nanometers to 30 nanometers.

[0116] For example, the thickness of the first sub-transition layer 122a may range from 5nm to 45nm, 10nm to 40nm, 15nm to 35nm, or 20nm to 30nm, etc. For example, the thickness of the first sub-transition layer 122a may range from 8nm, 12nm, 23nm, 38nm, or 43nm, etc. The thickness of the second sub-transition layer 122b may range from 5nm to 25nm, 10nm to 22nm, or 15nm to 20nm, etc. For example, the thickness of the second sub-transition layer 122b may range from 8nm, 13nm, 18nm, 22nm, or 28nm, etc.

[0117] The thickness of the first sub-transition layer 122a and the thickness of the second sub-transition layer 122b may be the same or different. The embodiment of the present application does not further limit the value of the first sub-transition layer 122a and the value of the second sub-transition layer 122b.

[0118] The thickness of the first sub-transition layer 122a is set in the range of 1 nanometer to 50 nanometers, which can avoid the thickness of the first sub-transition layer 122a being too large (for example, greater than 50 nanometers) resulting in an increase in the thickness of the protective stack 120, and can avoid the thickness of the first sub-transition layer 122a being too small (for example, less than 1 nanometer) affecting the transition connection effect of the first sub-transition layer 122a between the second sub-transition layer 122b and the metal appearance part 110.

[0119] The thickness of the second sub-transition layer 122b is set in the range of 3 nanometers to 30 nanometers, which can avoid the thickness of the second sub-transition layer 122b being too large (for example, greater than 30 nanometers) resulting in an increase in the thickness of the protective stack 120, and can avoid the thickness of the second sub-transition layer 122a being too small (for example, less than 3 nanometers) affecting the bonding effect of the second sub-transition layer 122b on the first sub-transition layer 122a and the insulating protective layer 121.

[0120] Fig.10 Schematic diagram of the structure of the protective stack and metal appearance parts provided in some other embodiments of the present application.

[0121] In other examples, such as Fig.10As shown, the transition layer 122 may also be a single-layer structure, that is, the transition layer 122 does not include the first sub-transition layer 122a and the second sub-transition layer 122b. In this case, the material of the transition layer 122 may include at least one of W (tungsten), Cr (chromium), Ti (titanium), Si (silicon), Al (aluminum), Nb (niobium), Ni (nickel), Mn (manganese), Mo (molybdenum), and C (carbon). The sub-insulating layer 1211 includes an oxide layer 1211a, and the oxide layer 1211a and the transition layer 122 are adjacently arranged; or, the sub-insulating layer 1211 includes an oxynitride layer 1211c, and the oxynitride layer 1211c and the transition layer 122 are adjacently arranged.

[0122] The material of the transition layer 122 includes at least one of W (tungsten), Cr (chromium), Ti (titanium), Si (silicon), Al (aluminum), Nb (niobium), Ni (nickel), Mn (manganese), Mo (molybdenum), and C (carbon), and the transition layer 122 and the oxide layer 1211a or the oxynitride layer 1211c in the insulating protective layer 121 are arranged adjacent to each other, so that the transition layer 122 can transitionally connect the metal appearance part 110 and the insulating protective layer 121, thereby improving the adhesion between the insulating protective layer 121 and the metal appearance part 110 and reducing the risk of the insulating protective layer 121 falling off relative to the metal appearance part 110. In addition, the flexibility of the material selection of the transition layer 122 is improved.

[0123] In some examples, the transition layer 122 may include a transparent material so that light reflected by the metal appearance part 110 can pass through the transition layer 122 and be refracted by the sub-insulating layer 1211 having a different refractive index.

[0124] Fig.11 Schematic diagram of the structure of the protective stack and metal appearance parts provided in some other embodiments of the present application. Fig.12 Schematic diagram of the structure of the protective stack and metal appearance parts provided in some other embodiments of the present application.

[0125] In some examples, such as Fig.11 and Fig.12 As shown, the protective stack 120 includes a wear resistant protective layer 123 .

[0126] The wear-resistant protective layer 123 has a relatively large hardness. The protective laminate 120 includes the wear-resistant protective layer 123, which can improve the wear resistance of the protective laminate 120 and reduce the risk of scratching the protective laminate 120, thereby protecting the metal appearance part 110 and improving the appearance of the electronic device 200.

[0127] For example, the wear-resistant protective layer 123 may be formed by PVD, or by CVD, evaporation, or electroplating. The embodiment of the present application does not further limit the process of forming the wear-resistant protective layer 123.

[0128] In some examples, the material of the wear-resistant protective layer 123 may include SiN x (Silicon Nitride), CN x (Carbon Nitride), SiC x (Silicon Carbide), SiN x C y At least one of (carbon nitride silicon), diamond-like carbon or modified diamond-like carbon.

[0129] It is understandable that the subscripts of the elements in the above chemical formulas, such as x and y, represent the number of atoms of the element. x In silicon nitride, x represents the number of atoms of the N (nitrogen) element. The values ​​of x and y in different chemical formulas may be the same or different. The embodiments of the present application do not further limit the values ​​of x and y.

[0130] For example, the value range of x and y can be greater than or equal to 1 and less than or equal to 6. In addition, the values ​​of x and y can be fractions. x Taking silicon nitride as an example, the value of the number of nitrogen atoms x can be or The embodiments of the present application do not further limit the values ​​of x, y, and z.

[0131] In some possible cases, the values ​​of x and y may also be greater than 6.

[0132] The material of the wear-resistant protective layer 123 includes SiN x (Silicon Nitride), CN x (Carbon Nitride), SiC x (Silicon Carbide), SiN x C y At least one of (carbon nitride silicon), diamond-like carbon or modified diamond-like carbon makes the wear-resistant protective layer 123 have a greater hardness, plays a role in wear resistance and scratch resistance, reduces the risk of scratching the protective laminate 120, thereby protecting the metal appearance part 110, improving the appearance of the electronic device 200, and increasing the flexibility of the wear-resistant protective layer 123 in material selection.

[0133] In some examples, such as Fig.11As shown, the protective stack 120 may include only the wear-resistant protective layer 123, but not the insulating protective layer 121. In other examples, the protective stack 120 may include only the insulating protective layer 121, but not the wear-resistant protective layer 123 (see Fig. 9 and Fig.10 ). In some other examples, such as Fig.12 As shown, the protective laminate 120 may include a wear-resistant protective layer 123 and an insulating protective layer 121. The embodiment of the present application takes the protective laminate 120 including the insulating protective layer 121 and the wear-resistant protective layer 123 as an example, and continues to illustrate.

[0134] In some examples, such as Fig.12 As shown, the wear-resistant protective layer 123 is located on the side of the insulating protective layer 121 away from the metal appearance part 110 and is stacked with the insulating protective layer 121. That is, the insulating protective layer 121 is located on the side of the wear-resistant protective layer 123 close to the metal appearance part 110 and is stacked with the wear-resistant protective layer 123.

[0135] It can be understood that the protective laminate 120 includes a wear-resistant protective layer 123 and an insulating protective layer 121 , so that the protective laminate 120 can play the role of wear resistance, scratch resistance and insulation, and improve the protective effect of the protective laminate 120 on the metal appearance part 110 .

[0136] The wear-resistant protective layer 123 is arranged away from the metal appearance part 110 relative to the insulating protective layer 121 , so that the wear-resistant protective layer 123 can protect the insulating protective layer 121 and reduce the risk of damage to the insulating protective layer 121 .

[0137] For example, the protective stack 120 has a nanoindentation hardness greater than 14 GPa (unit: gigapascals). For example, using a diamond indenter, when the pressure is greater than 14 GPa, the indentation depth is about 150nm to 300nm. For example, when the pressure is greater than 14 GPa, the indentation depth of the protective stack 120 can be 150nm, 180nm, 200nm, 250nm or 280nm, etc. The embodiments of the present application do not further limit the value of the indentation depth.

[0138] In some examples, such as Fig.12 As shown, the thickness of the insulating protective layer 121 is greater than the thickness of the wear-resistant protective layer 123 .

[0139] It can be understood that the thickness of the insulating protection layer 121 is the sum of the thicknesses of the multiple stacked sub-insulating layers 1211. The thickness of the insulating protection layer 121 is set to be greater than the thickness of the wear-resistant protection layer 123, so that the thickness of the insulating protection layer 121 can be larger, ensuring the insulating effect of the insulating protection layer 121.

[0140] In some examples, the thickness of the insulating protective layer 121 ranges from 300 nanometers to 3000 nanometers. The thickness of the wear-resistant protective layer 123 ranges from 1 nanometer to 200 nanometers.

[0141] For example, the thickness of the insulating protective layer 121 may range from 500nm to 2500nm, 1000nm to 2000nm, or 1200nm to 1800nm. For example, the thickness of the insulating protective layer 121 may range from 800nm, 1500nm, 2200nm, or 2800nm. The thickness of the wear-resistant protective layer 123 may range from 10nm to 180nm, 50nm to 150nm, or 100nm to 120nm. For example, the thickness of the wear-resistant protective layer 123 may range from 5nm, 30nm, 80nm, or 130nm. It is understandable that the embodiments of the present application do not further limit the thickness of the insulating protective layer 121 and the wear-resistant protective layer 123.

[0142] The thickness of the insulating protective layer 121 is set in the range of 300 nanometers to 3000 nanometers, which can avoid the thickness of the insulating protective layer 121 being too large (for example, greater than 3000 nanometers) resulting in an increase in the thickness of the protective stack 120, and can avoid the thickness of the insulating protective layer 121 being too small (for example, less than 300 nanometers), thereby ensuring the insulating effect of the insulating protective layer 121.

[0143] The thickness of the wear-resistant protective layer 123 is set in the range of 1 nanometer to 200 nanometers, which can avoid the thickness of the wear-resistant protective layer 123 being too large (for example, greater than 200 nanometers) resulting in an increase in the thickness of the protective stack 120, and can avoid the thickness of the wear-resistant protective layer 123 being too small (for example, less than 1 nanometer), thereby ensuring the protective effect of the wear-resistant protective layer 123 on the insulating protective layer 121 and the metal appearance part 110.

[0144] In some examples, the wear-resistant protective layer 123 includes a transparent material, so that the light refracted by the metal insulating protective layer 121 can pass through the wear-resistant protective layer 123 .

[0145] In some examples, such as Fig.12 As shown, the protective laminate 120 includes an anti-fingerprint layer (Anti Finger Print, AF) 124, which is located on a side of the insulating protective layer 121 away from the metal appearance part 110 and is stacked with the insulating protective layer 121. For example, the anti-fingerprint layer 124 is located on a side of the wear-resistant protective layer 123 away from the insulating protective layer 121.

[0146] It can be understood that the anti-fingerprint layer 124 has hydrophobic, oil-repellent, and anti-fouling properties, which reduces the risk of fingerprints or other impurities being left on the surface of the metal appearance part 110 when the user touches the shell 100, improves the appearance of the electronic device 200, and can protect the insulating protective layer 121.

[0147] For example, the anti-fingerprint layer 124 may be formed by evaporation, or other methods may be used to form the anti-fingerprint layer 124. The embodiment of the present application does not further limit the process of forming the anti-fingerprint layer 124.

[0148] In some examples, the anti-fingerprint layer 124 may include a transparent material so that light reflected by the metal appearance part 110 can pass through the anti-fingerprint layer 124 .

[0149] In some examples, the water drop angle of the surface of the anti-fingerprint layer 124 away from the insulating protection layer 121 ranges from 110° (unit: degree) to 120°. In this way, the anti-fingerprint layer 124 can have strong hydrophobicity and is not easily contaminated, thereby improving the appearance of the electronic device 200.

[0150] For example, the water drop angle of the anti-fingerprint layer 124 away from the insulating protection layer 121 can be 112°, 115° or 118°, etc. The embodiment of the present application does not further limit the water drop angle of the anti-fingerprint layer 124 away from the insulating protection layer 121.

[0151] For example, steel wool, a rubber head or other objects may be used to perform a friction test on the protective laminate 120. After the protective laminate 120 is subjected to the friction test for about 2000 times, the water drop angle of the surface of the anti-fingerprint layer 124 away from the insulating protective layer 121 is greater than or equal to 90 degrees.

[0152] In some embodiments, Fig.12 As shown, the metal appearance part 110 may include a metal appearance part body 111 and a metal appearance layer 112 covering the metal appearance part body 111. The protective laminate 120 is a transparent material, and the protective laminate 120 covers the metal appearance layer 112. Among them, the protective laminate 120 includes a stacked transition layer 122, an insulating protective layer 121, a wear-resistant protective layer 123 and an anti-fingerprint layer 124, and the transition layer 122, the insulating protective layer 121, the wear-resistant protective layer 123 and the anti-fingerprint layer 124 are sequentially away from the metal appearance layer 112.

[0153] The transition layer 122 may include a first sub-transition layer 122a and a second sub-transition layer 122b which are stacked, and the first sub-transition layer 122a is closer to the metal appearance layer 112 than the second sub-transition layer 122b. The first sub-transition layer 122a serves to transition the metal appearance layer 112 to the second sub-transition layer 122b, and the second sub-transition layer 122b serves to transition the first sub-transition layer 122a to the insulating protective layer 121. In this way, the adhesion between the insulating protective layer 121 and the metal appearance layer 112 can be improved, and the risk of relative detachment between the two can be reduced.

[0154] The insulating protection layer 121 may include a plurality of sub-insulating layers 1211 stacked, and the plurality of sub-insulating layers 1211 include at least two of an oxide layer 1211a, a nitride layer 1211b, and an oxynitride layer 1211c. At least two of the oxide layer 1211a, the nitride layer 1211b, and the oxynitride layer 1211c are alternately stacked. On the one hand, the insulating protection layer 121 can play an insulating role, reducing the risk of a galvanic cell reaction when the metal appearance part 110 contacts other metal parts of a material different from that of the metal appearance part 110, thereby causing the risk of corrosion damage to the metal appearance part 110 and other metal parts.

[0155] On the other hand, the insulating protective layer 121 has a relatively large thickness, which not only enhances the insulating effect, but also plays a role in anti-scratch, thereby improving the protective effect of the protective stack 120 on the metal appearance part 110. In addition, compared with providing a thick insulating protective layer 121, providing the insulating protective layer 121 including a plurality of stacked sub-insulating layers 1211 can reduce the risk of surface cracking of the insulating protective layer 121.

[0156] On the basis that the protective laminate 120 includes an insulating protective layer 121, the protective laminate 120 may also include a wear-resistant protective layer 123, so that the protective laminate 120 can not only play an insulating role, but also play a wear-resistant and scratch-resistant role, thereby improving the protective effect of the protective laminate 120 on the metal appearance part 110.

[0157] The anti-fingerprint layer 124 has strong hydrophobicity. The anti-fingerprint layer 124 is arranged on the side of the wear-resistant protective layer 123 away from the insulating protective layer 121, which can reduce the risk of fingerprints or other impurities being left on the surface of the metal appearance part 110 when the user touches the housing 100, improve the appearance of the electronic device 200, and can protect the insulating protective layer 121 and the wear-resistant protective layer 123.

[0158] In summary, the embodiments of the present application have at least the following beneficial effects:

[0159] In the embodiment of the present application, the protective laminate 120 covers the surface of the metal appearance part 110, so that the protective laminate 120 can protect the metal appearance part 110. In addition, the protective laminate 120 includes an insulating protective layer 121, so that the protective laminate 120 can play an insulating role, thereby reducing the risk of galvanic reaction when the metal appearance part 110 contacts other metal parts of different materials from the metal appearance part 110, thereby reducing the risk of corrosion damage to the metal appearance part 110 and other metal parts.

[0160] The insulating protective layer 121 includes a plurality of stacked sub-insulating layers 1211, which can increase the thickness of the insulating protective layer 121, thereby ensuring the insulating effect of the insulating protective layer 121, and enabling the insulating protective layer 121 to protect the metal appearance part 110, reduce the risk of the metal appearance part 110 being scratched, and improve the appearance of the electronic device 200. In addition, compared with providing a thick insulating protective layer 121, the insulating protective layer 121 includes a plurality of stacked sub-insulating layers 1211, which can reduce the risk of surface cracking of the insulating protective layer 121.

[0161] On the basis that the protective laminate 120 includes an insulating protective layer 121 , the protective laminate 120 may further include a wear-resistant protective layer 123 , so that the protective laminate 120 can not only play an insulating role, but also play a wear-resistant and scratch-resistant role, thereby improving the protective effect of the protective laminate 120 on the metal appearance part 110 .

Claims

1. A housing (100), characterized in that: include: Metal appearance part (110); A protective laminate (120) covers the surface of the metal appearance part (110); the protective laminate (120) comprises an insulating protective layer (121), and the insulating protective layer (121) comprises a plurality of stacked sub-insulating layers (1211).

2. The housing (100) according to claim 1, characterized in that: The multiple sub-insulating layers (1211) include at least two of an oxide layer (1211a), a nitride layer (1211b) and a nitride oxide layer (1211c); at least two of the oxide layer (1211a), the nitride layer (1211b) and the nitride oxide layer (1211c) are alternately stacked.

3. The housing (100) according to claim 2, characterized in that: The material of the oxide layer (1211a) includes Al2O3, SiO2, Si w Al z O y At least one of the following; the material of the nitride layer (1211b) includes Si3N4, AlN, Si w Al z N x At least one of; the material of the oxynitride layer (1211c) includes Si z O y N x 、Al z O y N x 、Si w Al z O y N x At least one of .

4. The housing (100) according to claim 2 or 3, characterized in that: The protective stack (120) comprises a transition layer (122), wherein the transition layer (122) is located on a side of the insulating protective layer (121) close to the metal appearance part (110) and is stacked with the insulating protective layer (121).

5. The housing (100) according to claim 4, characterized in that: The transition layer (122) comprises a first sub-transition layer (122a) and a second sub-transition layer (122b) which are stacked, and the first sub-transition layer (122a) is closer to the metal appearance part (110) than the second sub-transition layer (122b); The material of the first sub-transition layer (122a) includes at least one of W, Cr, Ti, Si, Al, Nb, Ni, Mn, Mo, and C; the material of the second sub-transition layer (122b) includes SiO2, Al2O3, Si z O y N x 、TiO2、Cr2O3、Nb y O x At least one of .

6. The housing (100) according to claim 5, characterized in that: The thickness of the first sub-transition layer (122a) ranges from 1 nanometer to 50 nanometers; the thickness of the second sub-transition layer (122b) ranges from 3 nanometers to 30 nanometers.

7. The housing (100) according to claim 4, characterized in that: The material of the transition layer (122) includes at least one of W, Cr, Ti, Si, Al, Nb, Ni, Mn, Mo, and C; the sub-insulating layer (1211) includes an oxide layer (1211a), and the oxide layer (1211a) and the transition layer (122) are arranged adjacent to each other; or the sub-insulating layer (1211) includes an oxynitride layer (1211c), and the oxynitride layer (1211c) and the transition layer (122) are arranged adjacent to each other.

8. The housing (100) according to any one of claims 1 to 7, characterized in that: The protective laminate (120) comprises a transparent material; Wherein, at least two adjacent sub-insulating layers (1211) in the insulating protection layer (121) have different refractive indices.

9. The housing (100) according to any one of claims 1 to 8, characterized in that: The protective laminate (120) comprises a wear-resistant protective layer (123), wherein the wear-resistant protective layer (123) is located on a side of the insulating protective layer (121) away from the metal appearance part (110) and is stacked with the insulating protective layer (121).

10. The housing (100) according to claim 9, characterized in that: The thickness of the insulating protective layer (121) is greater than the thickness of the wear-resistant protective layer (123).

11. The housing (100) according to claim 10, characterized in that: The thickness of the insulating protective layer (121) ranges from 300 nanometers to 3000 nanometers; the thickness of the wear-resistant protective layer (123) ranges from 1 nanometer to 200 nanometers.

12. The housing (100) according to any one of claims 9 to 11, characterized in that: The material of the wear-resistant protective layer (123) includes SiN x , CN x 、SiC x 、SiN x C y , diamond-like carbon or at least one of modified diamond-like carbon.

13. The housing (100) according to any one of claims 1 to 12, characterized in that: The protective stack (120) comprises an anti-fingerprint layer (124), wherein the anti-fingerprint layer (124) is located on a side of the insulating protective layer (121) away from the metal appearance part (110), and is stacked with the insulating protective layer (121).

14. The housing (100) according to claim 13, characterized in that The water drop angle of the surface of the anti-fingerprint layer (124) on the side away from the insulating protective layer (121) ranges from 110° to 120°.

15. The housing (100) according to any one of claims 1 to 14, characterized in that: The metal appearance part (110) comprises a metal appearance part body (111) and a metal appearance layer (112), wherein the metal appearance layer (112) covers the surface of the metal appearance part body (111); and the protective laminate (120) covers the metal appearance layer (112).

16. The housing (100) according to any one of claims 1 to 15, characterized in that: The surface impedance of the protection stack (120) is greater than or equal to 100 MΩ.

17. A housing (100), characterized in that: include: Metal appearance part (110); A protective laminate (120) covers the surface of the metal appearance part (110); the protective laminate (120) comprises a wear-resistant protective layer (123).

18. The housing (100) according to claim 17, characterized in that The material of the wear-resistant protective layer (123) includes SiN x , CN x 、SiC x 、SiN x C y , diamond-like carbon or at least one of modified diamond-like carbon.

19. The housing (100) according to claim 17 or 18, characterized in that: The protective stack (120) comprises an insulating protective layer (121), wherein the insulating protective layer (121) is located on a side of the wear-resistant protective layer (123) close to the metal appearance part (110), and is stacked with the wear-resistant protective layer (123).

20. The housing (100) according to claim 19, characterized in that The insulating protection layer (121) includes a plurality of stacked sub-insulating layers (1211).

21. The housing (100) according to claim 19 or 20, characterized in that: The protective stack (120) comprises a transition layer (122), wherein the transition layer (122) is located on a side of the insulating protective layer (121) close to the metal appearance part (110) and is stacked with the insulating protective layer (121).

22. A housing (100), characterized in that: include: Metal appearance part (110); A protective laminate (120) covers the surface of the metal appearance part (110); the protective laminate (120) comprises an insulating protective layer (121) and a wear-resistant protective layer (123) which are stacked, and the wear-resistant protective layer (123) is located on a side of the insulating protective layer (121) away from the metal appearance part (110).

23. An electronic device (200), characterized in that: include: The housing (100) according to any one of claims 1 to 22; The processor is located in a containing space enclosed by the housing (100).

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