Electronic device

Abstract

The invention provides electronic equipment. The electronic equipment comprises a front shell assembly, a rear shell assembly covering the front shell assembly, and a functional assembly arranged between the front shell assembly and the rear shell assembly. The functional assembly comprises a fixing frame with a reference surface, and a main board and a battery which are arranged on the fixing frame, and the orthographic projection of the main board on the reference surface is located outside the coverage range of the orthographic projection of the battery on the reference surface; wherein the projection directions of the mainboard and the battery are perpendicular to the reference plane and are parallel to the direction, close to or away from the rear shell assembly, of the front shell assembly, and the two opposite sides, in the projection direction, of the mainboard are further connected with the front shell assembly and the rear shell assembly correspondingly so as to transmit heat to the front shell assembly and the rear shell assembly correspondingly. Through the arrangement, the mainboard can directly utilize the front shell assembly and the rear shell assembly for heat dissipation, so that the battery is arranged outside a main heat dissipation path of the mainboard, and the influence of mainboard heating on the battery is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic devices, and in particular to an electronic device. Background Art

[0002] At present, in order to obtain a better network experience, more and more users are beginning to use MIFI (Mobile WIFI, portable broadband wireless device) devices to connect to the Internet. Among them, the existing MIFI devices are generally equipped with 5G (5th Generation Mobile Communication Technology, fifth generation mobile communication technology) chips, which enable MIFI devices to have a higher data transmission rate to bring users a better network experience. However, due to the high power consumption and high heat generation of 5G chips, the batteries in MIFI devices are very susceptible to overheating, which leads to accelerated battery aging, battery swelling and capacity attenuation, reducing the service life and reliability of MIFI devices. Summary of the invention

[0003] On the one hand, the present application provides an electronic device, which includes: a front shell component, a rear shell component covering the front shell component, and a functional component arranged between the front shell component and the rear shell component; the functional component includes: a fixing frame having a reference plane, and a mainboard and a battery arranged on the fixing frame, and the orthographic projection of the mainboard on the reference plane is outside the coverage range of the orthographic projection of the battery on the reference plane; wherein the projection direction of the mainboard and the battery is perpendicular to the reference plane and parallel to the direction of the front shell component approaching or moving away from the rear shell component, and the opposite sides of the mainboard in the projection direction are also connected to the front shell component and the rear shell component respectively, so as to transfer heat to the front shell component and the rear shell component respectively.

[0004] The electronic device provided by the present application is arranged such that the orthographic projection of the mainboard on the reference plane of the fixing frame is outside the coverage range of the orthographic projection of the battery on the reference plane of the fixing frame, so that the battery can be arranged outside the heat dissipation path of the mainboard in the projection direction. At the same time, by arranging the opposite sides of the mainboard in the projection direction to be connected to the front shell component and the rear shell component respectively, and the mainboard can transfer heat to the front shell component and the rear shell component respectively, the heat generating device (such as a chip) integrated on the mainboard can be dissipated through the front shell component and the rear shell component to reduce the heat transferred from the mainboard to the battery. Through the above-mentioned arrangement, the influence of the mainboard on the battery due to the large heat generation can be reduced, so that the temperature of the battery can maintain a slower rate of increase, and the working time of the battery within the safe temperature range is increased to slow down the aging rate of the battery, thereby reducing the probability of bulging and capacity attenuation of the battery. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0006] Figure 1 is a schematic diagram of the structure of an electronic device 10 provided in an embodiment of the present application;

[0007] Figure 2 yes Figure 1 A schematic diagram of an exploded structure of an electronic device 10;

[0008] Figure 3 yes Figure 1 A schematic cross-sectional structure diagram of the electronic device 10 along V-V;

[0009] Figure 4 yes Figure 2 A schematic structural diagram of the middle front housing assembly 100;

[0010] Figure 5 yes Figure 2 A schematic structural diagram of the middle rear housing assembly 200;

[0011] Figure 6 yes Figure 5 A schematic structural diagram of the middle rear housing 210;

[0012] Figure 7 yes Figure 5 A schematic structural diagram of the middle heat sink 220;

[0013] Figure 8 yes Figure 2 A schematic diagram of the structure of the functional component 300;

[0014] Fig. 9 yes Figure 8 A schematic structural diagram of the middle fixing frame 310;

[0015] Fig.10 yes Figure 3 A local enlarged schematic diagram of point A in the middle. DETAILED DESCRIPTION

[0016] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0017] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0018] See also Figures 1 to 4 , Figure 1 is a schematic diagram of the structure of an electronic device 10 provided in an embodiment of the present application, Figure 2 yes Figure 1 Schematic diagram of the exploded structure of the electronic device 10, Figure 3 yes Figure 1 A schematic diagram of the cross-sectional structure of the electronic device 10 along V-V, Figure 4 yes Figure 2 Schematic diagram of the structure of the middle front shell assembly 100.

[0019] The electronic device 10 provided in the embodiment of the present application may be a MIFI device that integrates the functions of a modem, a router, and an access point, and has the function of converting a SIM card network signal into a WIFI signal. Of course, in addition to a MIFI device, the electronic device 10 may also be other electronic devices with higher heat dissipation requirements. The following only takes a MIFI device as an example for explanation. Figure 1 to Figure 2 As shown, the electronic device 10 may include: a front shell component 100, a rear shell component 200 and a functional component 300. The front shell component 100 may be connected to the rear shell component 200, and may be enclosed together with the rear shell component 200 to form a receiving space 101 ( Figure 3 The functional component is disposed between the front shell component 100 and the rear shell component 200 (that is, located in the accommodating space 101), and the functional component 300 can be connected to the front shell component 100 and the rear shell component 200, respectively, to transfer heat to the front shell component 100 and the rear shell component 200, respectively, thereby improving the heat dissipation efficiency of the functional component 300.

[0020] Exemplarily, the front housing assembly 100 may include: a front housing 110 and a first heat conducting sheet 120. Figure 3 to Figure 4As shown, the front shell 110 can be connected to the rear shell assembly 200, and can be enclosed together with the rear shell assembly 200 to form the aforementioned accommodation space 101, so as to install the functional component 300 and other structural parts required by the electronic device 10. The first heat conductive sheet 120 is arranged on the side of the front shell 110 close to the functional component 300, and is arranged opposite to the functional component 300, and the first heat conductive sheet 120 can be connected to the front shell 110 and the functional component 300 respectively, so as to transfer the heat of the functional component 300 to the front shell 110 for heat dissipation. In this arrangement, since the front shell 110 will be exposed to the external environment and has a large heat dissipation area, the heat of the functional component 300 is transferred to the front shell 110 for heat dissipation through the first heat conductive sheet 120, which is conducive to improving the heat dissipation effect of the functional component 300.

[0021] Optionally, the front shell 110 may be specifically an open structure, and the front shell 110 may include: a top wall 111 and a side wall 112. Among them, the top wall 111 may be arranged roughly in a flat shape, and may be arranged opposite to and spaced from the rear shell assembly 200. The side wall 112 may be connected to the peripheral side of the top wall 111, and may be extended in a direction close to the rear shell assembly 200, and the side wall 112 may also be connected to the rear shell assembly 200, so as to be enclosed together with the top wall 111 and the rear shell assembly 200 to form the aforementioned accommodation space 101. At the same time, the connection between the top wall 111 and the side wall 112 may also be designed with a rounded structure to facilitate the user to hold the front shell 110. Of course, considering different requirements, the top wall 111 and the side wall 112 may also be connected vertically, so that the outer surface of the front shell 110 is formed with edges and corners. It can be understood that the specific structure of the front shell 110 may not be limited to this, and the structure of the front shell 110 may also be adaptively adjusted according to design requirements, and this embodiment will not be repeated here.

[0022] Furthermore, the first heat conductive sheet 120 can be arranged on a side of the top wall 111 close to the functional component 300, and the first heat conductive sheet 120 can also cover a larger area of ​​the top wall 111, so as to transfer the heat of the functional component 300 to different areas on the top wall 111 for heat dissipation. In this way, the first heat conductive sheet 120 can transfer most of the heat of the functional component 300 to the top wall 111 for heat dissipation, while the side wall 112 only dissipates a small part of the heat transferred from the top wall 111, so as to avoid the user getting hot when grasping the side wall 112. At the same time, since the top wall 111 is arranged in a flat shape, attaching the first heat conductive sheet 120 to the top wall 111 can also improve the tightness of the connection between the two, so as to reduce the probability of a gap between the first heat conductive sheet 120 and the top wall 111 affecting the heat transfer efficiency.

[0023] Optionally, in order to improve the heat dissipation uniformity of the top wall 111 and reduce the probability of local overheating of the top wall 111, the first heat conductive sheet 120 may be a graphite sheet. Since the thermal conductivity of the graphite sheet in the thickness direction is much lower than the thermal conductivity of the graphite sheet in the direction perpendicular to the thickness direction, the first heat conductive sheet 120 can quickly diffuse the heat transferred by the functional component 300 and transfer it to the top wall 111 more evenly for heat dissipation. In this way, the first heat conductive sheet 120 helps to improve the efficiency and uniformity of heat dissipation of the functional component 300 through the top wall 111, so as to reduce the probability of local overheating of the top wall 111. It can be understood that, in addition to the embodiment of the graphite sheet, the first heat conductive sheet 120 can also be made of other materials with thermal conductivity, and the first heat conductive sheet 120 only needs to be able to transfer the heat of the functional component 300 to the top wall 111, and this embodiment is not limited to this.

[0024] Optionally, the design of the first heat conducting sheet 120 can also be omitted. In this case, in order to connect with the functional component 300 for heat conduction, a first heat conducting portion protruding toward the functional component 300 can be provided on the top wall 111, and the first heat conducting portion can be connected to the heating area on the functional component 300 to transfer the heat of the heating area to the top wall 111 for heat dissipation. The first heat conducting portion can be a part of the top wall 111. That is, the first heat conducting portion is made integrally with the top wall 111, which is equivalent to the top wall 111 being directly connected to the functional component 300 for heat dissipation, thereby omitting the design of the first heat conducting sheet 120.

[0025] Optionally, in order to facilitate the user to operate the electronic device 10, the front housing assembly 100 may further include: a display screen 130. Figure 3 As shown, the display screen 130 can be arranged on the side of the top wall 111 away from the first heat conductive sheet 120, and the display screen 130 can be used to provide an image interface for the user to click or slide, so that the user can set the function of the electronic device 10. Among them, a mounting groove 1111 can be opened on the side of the top wall 111 away from the first heat conductive sheet 120, and the display screen 130 can be arranged in the mounting groove 1111 to reduce the height of the display screen 130 protruding on the side of the top wall 111 away from the first heat conductive sheet 120, thereby improving the appearance flatness of the front shell assembly 100. In this embodiment, the depth of the mounting groove 1111 can be slightly equal to the thickness of the display screen 130, so that the display screen 130 can be arranged flush with the side of the top wall 111 away from the first heat conductive sheet 120.

[0026] Optionally, when the depth of the mounting groove 1111 is much smaller than the thickness of the display screen 130, the mounting groove 1111 can also penetrate the top wall 111 on opposite sides close to and away from the first heat conductive sheet 120, and the display screen 130 can be directly arranged on the top wall 111 through the mounting groove 1111, so that the display screen 130 as a whole can be displaced a certain amount into the accommodation space 101 to reduce the height of the display screen 130 protruding on the side of the top wall 111 away from the first heat conductive sheet 120. At this time, the first heat conductive sheet 120 can be attached to the side of the display screen 130 facing the functional component 300 to transfer the heat of the functional component 300 to the display screen 130 for heat dissipation. Alternatively, the first heat conductive sheet 120 can be attached to the display screen 130 and the side of the top wall 111 facing the functional component 300 at the same time to transfer the heat of the functional component 300 to the display screen 130 and the top wall 111 for heat dissipation.

[0027] Optionally, the design of the mounting groove 1111 may be omitted, and the display screen 130 may be directly disposed on the side of the top wall 111 away from the first heat conducting plate 120 , or may be equipped with the top wall 111 in other ways, which is not limited in this embodiment.

[0028] Exemplarily, the display screen 130 may include a transparent cover plate, a touch panel and a display panel stacked in sequence, and the transparent cover plate, the touch panel and the display panel may be bonded together by means of colloids such as OCA (Optically Clear Adhesive) and PSA (Pressure Sensitive Adhesive). Among them, the transparent cover plate may be exposed on the side of the top wall 111 away from the first heat conductive sheet 120, and the surface of the transparent cover plate may have a flat and smooth characteristic, so that the user can perform touch operations such as clicking, sliding, and pressing. The material of the transparent cover plate may be a rigid material such as glass, or a flexible material such as polyimide (PI) and colorless polyimide (CPI). The touch panel is arranged between the transparent cover plate and the display panel, and is used to respond to the user's touch operation, and convert the corresponding touch operation into an electrical signal and transmit it to the processor of the electronic device 10, so that the electronic device 10 can respond to the user's touch operation accordingly. The display panel is mainly used to display images, and can serve as an interactive interface to instruct users to perform the above-mentioned touch operations on the transparent cover. The display panel can use an OLED (Organic Light-Emitting Diode) screen or an LCD (Liquid Crystal Display) screen to display the image interface.

[0029] All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0030] Please combine Figure 3 See also Figures 5 to 7 , Figure 5 yes Figure 2 A schematic diagram of the structure of the middle rear housing assembly 200, Figure 6 yes Figure 5 A schematic diagram of the structure of the middle rear housing 210, Figure 7 yes Figure 5 A schematic structural diagram of the heat sink 220.

[0031] Exemplarily, the rear housing assembly 200 may include: a rear housing 210 and a heat sink 220. Figure 3 and Figure 5 As shown, the rear shell 210 can be covered on the front shell 110, and can be enclosed together with the front shell 110 to form a receiving space 101 to install the functional component 300 and other structural components required by the electronic device 10. The heat sink 220 is arranged between the rear shell 210 and the functional component 300, and is connected to the rear shell 210 and the functional component 300 respectively, and the heat sink 220 can transfer the heat of the functional component 300 to the rear shell 210 for heat dissipation. In this arrangement, since the rear shell 210 is also exposed to the external environment and has a large heat dissipation area, the heat of the functional component 300 is transferred to the rear shell 210 for heat dissipation through the heat sink 220, which is conducive to improving the heat dissipation effect of the functional component 300.

[0032] Optionally, the rear shell 210 may include a main body portion 211 and a bent portion 212. Figure 3 and Figure 6As shown, the main body 211 can be arranged in a flat shape, and can be arranged opposite to and spaced from the top wall 111. The curved portion 212 is connected to the peripheral side of the main body 211, and extends in the direction close to the side wall 112, and the curved portion 212 is also connected to the side wall 112, so that the main body 211 and the curved portion 212 can be covered on the side wall 112 as a whole, thereby forming the aforementioned accommodating space 101 together with the front shell 110. At the same time, the curved portion 212 and the surface of the side wall 112 facing away from the accommodating space 101 can also be spliced ​​to form an arc surface, so that the connection between the curved portion 212 and the side wall 112 can also have a rounded corner design, so that the user can grasp the electronic device 10. Of course, considering different needs, the curved portion 212 and the side wall 112 can also be connected without a rounded corner design, and this embodiment is not limited to this. In addition, it is understandable that the specific structure of the rear shell 210 may not be limited thereto, and the structure of the rear shell 210 may also be adaptively adjusted according to design requirements, which will not be described in detail in this embodiment.

[0033] like Figure 3 , Figure 5 as well as Figure 7 As shown, the heat sink 220 is disposed between the main body 211 and the functional component 300, and is connected to the main body 211 and the functional component 300 respectively, and the heat sink 220 can transfer the heat of the functional component 300 to the main body 211 for heat dissipation. Among them, the heat sink 220 can be made of a metal material with a high thermal conductivity, so that the heat sink 220 can transfer the heat on the functional component 300 to the main body 211 for heat dissipation relatively quickly. At the same time, since it is made of a metal material, the heat sink 220 can also support the functional component 300. In addition, in order to cooperate with different heating areas on the functional component 300, the heat sink 220 can also be provided with a plurality of contact portions 221 protruding toward the functional component 300, and the plurality of contact portions 221 can be respectively connected to different heating areas on the functional component 300 to transfer the heat on the functional component 300 to the main body 211. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0034] Optionally, the design of the heat sink 220 can also be omitted. In this case, in order to connect with the functional component 300 for heat conduction, the main body 211 can also be provided with a second heat conduction portion protruding toward the functional component 300, and the second heat conduction portion can be connected to the heating area on the functional component 300 to transfer the heat of the heating area to the main body 211 for heat dissipation. The second heat conduction portion can be a part of the main body 211. That is, the second heat conduction portion is made integrally with the main body 211, which is equivalent to the main body 211 being directly connected to the functional component 300 for heat dissipation, thereby omitting the design of the heat sink 220.

[0035] Optionally, in order to ensure the heat conduction effect between the rear shell 210 and the heat sink 220, the rear shell assembly 200 may further include: a second heat conductive sheet 230. The second heat conductive sheet 230 may be disposed on the side of the main body 211 facing the functional component 300, and located between the main body 211 and the heat sink 220, and the second heat conductive sheet 230 may be connected to the main body 211 and the heat sink 220, respectively, to transfer the heat on the heat sink 220 to the main body 211 for heat dissipation. Since the rear shell 210 and the heat sink 220 are both rigid structures, there may be a gap between the heat sink 220 and the main body 211, and the second heat conductive sheet 230 may play a role in filling the gap to prevent the heat conduction effect between the main body 211 and the heat sink 220 from being affected by the gap.

[0036] Optionally, the second heat conductive sheet 230 can also cover a larger area of ​​the main body 211, so as to transfer the heat on the heat sink 220 to different areas on the main body 211 for heat dissipation, rather than being limited to the area between the main body 211 and the heat sink 220. In this way, the second heat conductive sheet 230 can transfer most of the heat of the functional component 300 to the main body 211 for heat dissipation, while the curved portion 212 only dissipates a small amount of heat transferred from the main body 211, so as to avoid the user getting hot when grasping the curved portion 212. At the same time, since the main body 211 is arranged in a flat shape, attaching the second heat conductive sheet 230 to the main body 211 can also improve the tightness of the connection between the two, so as to reduce the probability of a gap between the second heat conductive sheet 230 and the main body 211 affecting the heat transfer efficiency.

[0037] Optionally, in order to improve the heat dissipation uniformity of the main body 211 and reduce the probability of local overheating of the main body 211, the second heat conductive sheet 230 may also be a graphite sheet. Among them, since the thermal conductivity of the graphite sheet in the thickness direction is much lower than the thermal conductivity of the graphite sheet in the direction perpendicular to the thickness direction, the second heat conductive sheet 230 can also quickly diffuse the heat transferred by the heat sink 220, so as to transfer it to the main body 211 more evenly for heat dissipation. In this way, the second heat conductive sheet 230 helps to improve the efficiency and uniformity of heat dissipation of the functional component 300 through the main body 211, so as to reduce the probability of local overheating of the main body 211. It can be understood that, in addition to the embodiment of the graphite sheet, the second heat conductive sheet 230 can also be made of other materials with thermal conductivity, and the second heat conductive sheet 230 only needs to be able to transfer the heat of the functional component 300 to the main body 211, and this embodiment is not limited to this.

[0038] The terms "first", "second", and "third" in this application are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features.

[0039] Please combine Figure 3 See also Figures 8 to 10 , Figure 8 yes Figure 2 The structural diagram of the functional component 300 is shown in FIG. Fig. 9 yes Figure 8 A schematic diagram of the structure of the middle fixing frame 310, Fig.10 yes Figure 3 A local enlarged schematic diagram of point A in the middle.

[0040] The functional component 300 is disposed between the front housing 110 and the rear housing 210 and can be used to implement the corresponding functions of the electronic device 10. Figure 3 and Figure 8 As shown, the functional component 300 may include: a fixing frame 310, a mainboard 320 and a battery 330. The fixing frame 310 may be arranged between the front shell 110 and the rear shell 210, and the fixing frame 310 may be used to install the mainboard 320 and the battery 330. The mainboard 320 may be arranged on the fixing frame 310, and various electronic devices required to realize the functions of the electronic device 10 may be integrated on the mainboard 320. The battery 330 may also be supported by the fixing frame 310 and electrically connected to the mainboard 320 to supply power to the mainboard 320. At the same time, the orthographic projection of the mainboard 320 on the reference plane 301 of the fixing frame 310 is also located outside the coverage range of the orthographic projection of the battery 330 on the reference plane 301, and the mainboard 320 is also connected to the front shell 110 and the rear shell 210 on opposite sides in the projection direction Y perpendicular to the reference plane 301, and can transfer heat to the front shell 110 and the rear shell 210 respectively. In this way, the battery 330 can be arranged on the main heat dissipation path of the mainboard 320 in the projection direction Y ( Figure 3 The battery 330 is not easily affected by the high heat generated by the mainboard 320, so that the temperature of the battery 330 can maintain a slower rate of increase and increase the working time of the battery 330 within a safe temperature range, thereby delaying the aging of the battery and reducing the probability of battery bulging and capacity attenuation.

[0041] After long-term research by the inventor, it is found that the motherboard 320 and the battery 330 in some schemes are stacked in the projection direction Y. When the motherboard 320 generates high heat during operation, the battery 330 is easily affected by the motherboard 320 and the temperature is too high, which accelerates the aging of the battery 330 and causes problems such as bulging and capacity decay. At the same time, some schemes reduce the heat generated by the motherboard 320 by limiting the power consumption of the motherboard 320 to reduce the impact of the motherboard 320 on the battery 330, while the scheme of limiting power consumption will sacrifice the performance of the motherboard 320, and ultimately lead to the network stability and data transmission rate of the electronic device 10. Based on this, the embodiment of the present application arranges the battery 330 outside the main heat dissipation path of the motherboard 320, which can reduce the impact of the high heat generated by the motherboard 320 on the battery 330, so as to reduce the probability of delaying the aging speed of the battery 330 by sacrificing the performance of the motherboard 320, thereby facilitating the improvement of the network stability and data transmission rate of the electronic device 10.

[0042] Exemplarily, the fixing frame 310 is disposed between the top wall 111 and the main body 211, and the fixing frame 310 can be used to install the mainboard 320 and the battery 330. Figure 3 and Figures 8 to 10 As shown, the side of the fixing frame 310 close to the top wall 111 in the projection direction Y can be the aforementioned reference plane 301, and the main board 320 and the battery 330 can be arranged on the side of the fixing frame 310 away from the reference plane 301, and located between the fixing frame 310 and the main body 211. At the same time, the partial area of ​​the fixing frame 310 and the main board 320 that are arranged opposite to each other in the projection direction Y can also be connected to the first heat conducting sheet 120 and the main board 320 respectively, so as to transfer the heat of the main board 320 to the top wall 111 for heat dissipation. Optionally, the reference plane 301 can also be the side of the fixing frame 310 close to the main body 211 in the projection direction Y.

[0043] Optionally, the fixing frame 310 may include: a first mounting portion 311 and a second mounting portion 312. The first mounting portion 311 and the second mounting portion 312 are connected in a direction perpendicular to the projection direction Y, and the surfaces of the first mounting portion 311 and the second mounting portion 312 facing the top wall 111 together constitute a reference plane 301. At the same time, the mainboard 320 is arranged on the side of the first mounting portion 311 away from the reference plane 301, and the first mounting portion 311 is also connected to the first heat conductive sheet 120 and the mainboard 320 respectively, so as to transfer the heat of the mainboard 320 to the top wall 111. The battery 330 is arranged on the side of the second mounting portion 312 away from the reference plane 301, and is spaced apart from the second heat conductive sheet 230 located on the main body 211, so as to prevent the battery 330 from being affected by the heat transferred by the second heat conductive sheet 230.

[0044] Optionally, the design of the first mounting portion 311 may be omitted, and the mainboard 320 may be connected to the peripheral side of the second mounting portion 312 perpendicular to the projection direction Y. In this case, the mainboard 320 may also be directly connected to the first heat conducting sheet 120 to transfer its own heat to the top wall 111 .

[0045] Optionally, since the heat of the mainboard 320 on the side facing the top wall 111 is transferred to the first heat conductive sheet 120 through the first mounting portion 311, in order to reduce the heat transferred from the first mounting portion 311 to the second mounting portion 312, a heat insulation groove 302 may be provided in the area of ​​the first mounting portion 311 close to the second mounting portion 312. The heat insulation groove 302 may penetrate the first mounting portion 311 in the projection direction Y, and the number of the heat insulation grooves 302 may be multiple. At the same time, the multiple heat insulation grooves 302 may be arranged at intervals along the circumference of the positive projection of the battery 330 on the reference plane 301, so as to reduce the path of heat transfer from the first mounting portion 311 to the area of ​​the second mounting portion 312 where the battery 330 is provided, thereby reducing the influence of the heat transfer from the mainboard 320 to the top wall 111 through the first mounting portion 311 on the battery 330.

[0046] Optionally, the orthographic projection of the battery 330 on the reference plane 301 may have three sides adjacent to the first mounting portion 311, so the plurality of heat-insulating grooves 302 may be arranged at intervals along the three sides to semi-enclose the orthographic projection of the battery 330 on the reference plane 301, thereby reducing the heat transferred from the first mounting portion 311 to the battery 330 through the second mounting portion 312. Of course, the specific arrangement of the plurality of heat-insulating grooves 302 may not be limited thereto, as long as the heat-insulating grooves 302 can reduce the path for transferring heat from the first mounting portion 311 to the second mounting portion 312, and this embodiment is not limited thereto.

[0047] Optionally, the heat insulation groove 302 may not pass through the first mounting portion 311, and multiple heat insulation grooves 302 may also be connected to form a long strip groove arranged around the positive projection of the battery on the reference plane 301, thereby further reducing the path for heat transfer from the first mounting portion 311 to the second mounting portion 312. Of course, multiple heat insulation grooves 302 passing through the first mounting portion 311 may also be connected, and this embodiment is not limited to this.

[0048] Optionally, since the first heat conductive sheet 120 covers a larger area of ​​the top wall 111, the first heat conductive sheet 120 has, in addition to the area between the top wall 111 and the first mounting portion 311, a partial area extending to the surface of the top wall 111 facing the second mounting portion 312, so as to expand the heat conduction area of ​​the first heat conductive sheet 120. At the same time, since the first heat conductive sheet 120 is flat on the reference surface 301 and connected to the first mounting portion 311, the first heat conductive sheet 120 will also contact the second mounting portion 312. At this time, in order to reduce the heat transferred from the first heat conductive sheet 120 to the second mounting portion 312, the second mounting portion 312 constitutes the reference surface 301, that is, the surface facing the top wall 111 is also provided with an avoidance groove 303 ( Fig.10 As shown), and the bottom wall of the avoidance groove 303 is arranged opposite to the battery 330, so that the first heat conductive sheet 120 can be spaced apart from the area of ​​the second mounting portion 312 corresponding to the battery 330 through the avoidance groove 303, that is, the area covered by the positive projection of the battery 330 on the reference plane 301 with the second mounting portion 312, thereby reducing the probability of the first heat conductive sheet 120 transferring heat to the second mounting portion 312.

[0049] Optionally, a limiting structure 313 may be further provided on the side of the second mounting portion 312 away from the reference plane 301 , and the limiting structure 313 may be jointly arranged with the second mounting portion 312 to form a limiting space to accommodate the battery 330 and limit the battery 330 .

[0050] Exemplarily, the mainboard 320 is disposed between the first mounting portion 311 and the heat sink 220, and opposite sides of the mainboard 320 in the projection direction Y can be connected to the first mounting portion 311 and the heat sink 220, respectively, so as to transfer heat to the top wall 111 and the main body 211 for heat dissipation. Fig.10As shown, the mainboard 320 is provided with a first heating portion 321 and a second heating portion 322 on opposite sides in the projection direction Y. Among them, the first heating portion 321 is located on the side of the mainboard 320 facing the first mounting portion 311, and is connected to the first mounting portion 311, and the first heating portion 321 can transfer heat to the top wall 111 through the first mounting portion 311 for heat dissipation. The second heating portion 322 is located on the side of the mainboard 320 facing the heat sink 220, and is connected to the contact portion 221, and the second heating portion 322 can transfer heat to the main body 211 through the heat sink 220 for heat dissipation. In this embodiment, the first heating portion 321 and the second heating portion 322 can specifically be electronic devices (such as 5G chips, etc.) integrated on the mainboard 320, and the number of the first heating portion 321 and the second heating portion 322 can be multiple, and the number of the contact portion 221 can be the same as that of the second heating portion 322. Of course, in addition to the first heating portion 321 and the second heating portion 322 , the mainboard 320 may also be integrated with a charging interface, a button module, a SIM card holder, etc., which are not described in detail in this embodiment.

[0051] Optionally, in order to prevent the gap between the first mounting portion 311 and the first heating portion 321 from affecting the heat conduction efficiency, a first thermal pad 340 is further provided between the first mounting portion 311 and the first heating portion 321, and the first thermal pad 340 can be connected to the first mounting portion 311 and the first heating portion 321, respectively, so as to transfer the heat of the first heating portion 321 to the first mounting portion 311. Similarly, in order to prevent the gap between the contact portion 221 and the second heating portion 322 from affecting the heat conduction efficiency, a second thermal pad 350 is further provided between the contact portion 221 and the second heating portion 322, and the second thermal pad 350 can be connected to the contact portion 221 and the second heating portion 322, respectively, so as to transfer the heat of the second heating portion 322 to the heat sink 220. In this embodiment, the first thermal pad 340 and the second thermal pad 350 can be specifically thermally conductive gel or thermally conductive gasket, and the first thermal pad 340 and the second thermal pad 350 can be used to fill the aforementioned gap to ensure the heat transfer effect of the first heating part 321 and the second heating part 322.

[0052] Optionally, since the orthographic projection of the battery 330 on the reference plane 301 has three sides adjacent to the first mounting portion 311, the mainboard 320 can also be arranged along the three sides on the first mounting portion 311 to semi-enclose the battery 330. Such an arrangement is beneficial to the space utilization of the accommodation space 101, so that a larger mainboard 320 can be arranged in the limited accommodation space 101, so that the mainboard 320 can carry more functional electronic devices to achieve more functions. Of course, the mainboard 320 can also be arranged in a manner other than the aforementioned embodiment, as long as the orthographic projection of the mainboard 320 on the reference plane 301 is located outside the coverage range of the orthographic projection of the battery 330 on the reference plane 301, and this embodiment does not limit this.

[0053] Optionally, since the second heat conductive sheet 230 covers a larger area of ​​the main body 211, the second heat conductive sheet 230 has a partial area extending to the surface of the main body 211 facing the second mounting portion 312 in addition to the area between the heat sink 220 and the main body 211, so as to expand the heat conduction area of ​​the second heat conductive sheet 230. In this case, the battery 330 can be spaced apart from the second heat conductive sheet 230 in the projection direction Y (e.g., Fig.10 As shown), the probability of the second heat conductive sheet 230 transferring heat to the battery 330 is reduced.

[0054] The electronic device 10 provided in the present application is configured such that the orthographic projection of the mainboard 320 on the reference plane 301 of the fixing frame 310 is located outside the coverage of the orthographic projection of the battery 330 on the reference plane 301 of the fixing frame 310, so that the battery 330 can be arranged outside the heat dissipation path of the mainboard 320 in the projection direction Y. At the same time, by configuring the mainboard 320 to be connected to the front shell assembly 100 and the rear shell assembly 200 on opposite sides in the projection direction Y, respectively, and the mainboard 320 can transfer heat to the front shell assembly 100 and the rear shell assembly 200, respectively, the heat generating device (such as a chip) integrated on the mainboard 320 can be dissipated through the front shell assembly 100 and the rear shell assembly 200, so as to reduce the heat transferred from the mainboard 320 to the battery 330. Through the above settings, the impact of the high heat generation of the mainboard 320 on the battery 330 can be reduced, so that the temperature of the battery 330 can maintain a slower rate of increase and increase the working time of the battery 330 within the safe temperature range, so as to delay the aging speed of the battery 330, thereby reducing the probability of bulging and capacity decay of the battery 330.

[0055] The above descriptions are only some embodiments of the present application, and do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An electronic device, characterized in that: The electronic device comprises: a front shell component, a rear shell component covered on the front shell component, and a functional component arranged between the front shell component and the rear shell component; The functional component comprises: a fixing frame having a reference surface, and a mainboard and a battery arranged on the fixing frame, and the orthographic projection of the mainboard on the reference surface is outside the coverage range of the orthographic projection of the battery on the reference surface; wherein, The projection direction of the mainboard and the battery is perpendicular to the reference plane and parallel to the direction in which the front shell component approaches or moves away from the rear shell component, and the mainboard is also connected to the front shell component and the rear shell component on opposite sides in the projection direction, respectively, to transfer heat to the front shell component and the rear shell component, respectively.

2. The electronic device according to claim 1, characterized in that: The side of the fixing frame close to the front shell assembly in the projection direction is the reference plane, and the mainboard and the battery are arranged on the side of the fixing frame away from the reference plane; wherein, A partial area of ​​the fixing frame arranged opposite to the mainboard is respectively connected to the front housing component and the mainboard to transfer the heat of the mainboard to the front housing component.

3. The electronic device according to claim 2, characterized in that: The fixing frame comprises: a first mounting portion and a second mounting portion connected in a direction perpendicular to the projection direction, and the surfaces of the first mounting portion and the second mounting portion close to the front housing component in the projection direction jointly constitute the reference plane; wherein, The mainboard is arranged on a side of the first mounting portion away from the reference plane, and the first mounting portion is also respectively connected to the mainboard and the front shell assembly to transfer the heat of the mainboard to the front shell assembly; the battery is arranged on a side of the second mounting portion away from the reference plane.

4. The electronic device according to claim 3, characterized in that: A heat-insulating groove is further provided in a region of the first mounting portion close to the second mounting portion to reduce heat transferred from the first mounting portion to the second mounting portion.

5. The electronic device according to claim 4, characterized in that: The heat-insulating grooves penetrate two opposite sides of the first mounting portion in the projection direction, and there are multiple heat-insulating grooves; wherein the multiple heat-insulating grooves are arranged at intervals along the circumference of the positive projection of the battery on the reference plane.

6. The electronic device according to claim 3, characterized in that: A first thermal pad is provided between the mainboard and the first mounting portion, and the first thermal pad is respectively connected to the mainboard and the first mounting portion to transfer the heat of the mainboard to the first mounting portion.

7. The electronic device according to claim 3, characterized in that: The front shell assembly comprises: a front shell connected to the rear shell assembly, and a first heat conducting sheet located between the front shell and the first mounting portion; wherein, The first heat conducting sheet is connected to the front shell and the first mounting portion respectively to transfer heat on the first mounting portion to the front shell.

8. The electronic device according to claim 7, characterized in that: A partial area of ​​the first heat conductive sheet also extends to the surface of the front shell facing the second mounting portion to increase the heat conductive area of ​​the connection between the first heat conductive sheet and the front shell; wherein the first heat conductive sheet is also spaced apart from an area of ​​the fixing frame covered by the orthographic projection of the battery on the reference plane.

9. The electronic device according to claim 3, characterized in that: A second thermal pad is provided between the mainboard and the rear shell assembly, and the second thermal pad is respectively connected to the mainboard and the rear shell assembly to transfer the heat of the mainboard to the rear shell assembly.

10. The electronic device according to claim 9, characterized in that: The rear shell assembly comprises: a rear shell covering the front shell, and a heat sink located between the rear shell and the mainboard; wherein, The heat sink is connected to the second thermal pad and the rear shell respectively to transfer the heat of the second thermal pad to the rear shell.

11. The electronic device according to claim 10, characterized in that: The rear housing assembly further comprises: a second heat conducting sheet located between the heat sink and the rear housing; The second heat conducting sheet is connected to the rear housing and the heat sink respectively to transfer the heat of the heat sink to the rear housing.

12. The electronic device according to claim 11, characterized in that: A partial area of ​​the second heat conducting sheet further extends to a side of the rear shell facing the second mounting portion, so as to increase a heat conducting area connected between the second heat conducting sheet and the rear shell.

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