Display module and display device

Abstract

This application provides a display module and a display device, relating to the field of display technology. The display module includes a first display panel and a second display panel connected along a first direction; the first display panel includes a first substrate, a light-emitting component, a driving chip, and connecting traces, and the second display panel includes a second substrate; the light-emitting component is disposed on a first surface of the first substrate, and the driving chip is disposed on a second surface of either the first substrate or the second substrate; the first substrate has an inclined surface, the angle between the inclined surface and the first surface of the first substrate being greater than 90 degrees, and the second substrate has a bonding surface; the connecting traces include a first portion, a second portion, and a third portion connected together, the first portion being disposed on the first surface of the first substrate; the second portion being disposed on the inclined surface or the bonding surface; and the third portion being disposed on the second surface of the second substrate. This application reduces the possibility of breakage in the connecting traces, ensuring the normal use of the display module.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to display modules and display devices. Background Technology

[0002] Light-emitting diode (LED) display modules have the characteristics of high brightness, low power consumption and simple driving method, and are widely used in display devices.

[0003] The display module comprises multiple display panels spliced ​​together. Each display panel includes a substrate, a light-emitting component, and a driver chip. The light-emitting component is disposed on the first surface of the substrate, and the driver chip is disposed on the second surface of the substrate. The driver chip is electrically connected to the light-emitting component through connecting traces to control the light-emitting process of the light-emitting component. However, the connecting traces are prone to breakage, which affects the normal use of the display module. Summary of the Invention

[0004] This application provides a display module and a display device to solve the problem that the connection wiring is prone to breakage, which affects the normal use of the display module.

[0005] The display module provided in this application embodiment includes a first display panel and a second display panel connected to each other, and the first display panel and the second display panel are arranged along a first direction;

[0006] The first display panel includes a first substrate, a light-emitting component, a driving chip, and connecting traces; the second display panel includes a second substrate; both the first substrate and the second substrate have a first surface facing the light-emitting side and a second surface facing away from the light-emitting side; the light-emitting component is disposed on the first surface of the first substrate, and the driving chip is disposed on the second surface of the first substrate, or the driving chip is disposed on the second surface of the second substrate;

[0007] The first substrate is provided with an inclined surface, and the angle between the inclined surface and the first surface of the first substrate is greater than 90 degrees; in the first direction, the inclined surface faces the second substrate, and the second substrate is provided with a bonding surface, which is parallel to and opposite to the inclined surface along the first direction, and the angle between the bonding surface and the second surface of the second substrate is greater than 90 degrees.

[0008] The connection trace includes a first part, a second part, and a third part. The first part is disposed on a first surface of the first substrate and is electrically connected to the light-emitting component. The second part is disposed on the inclined surface or the bonding surface and is electrically connected at a first end to the end of the first part away from the light-emitting component. The third part is disposed on a second surface of the second substrate and is electrically connected to a second end of the second part and is electrically connected to the driver chip.

[0009] By adopting the above technical solution, an inclined surface is provided on the first substrate, the angle between the inclined surface and the first surface of the first substrate is greater than 90 degrees, and a bonding surface is provided on the second substrate, the bonding surface and the inclined surface are arranged parallel to each other along the first direction, and the angle between the bonding surface and the second surface of the second substrate is greater than 90 degrees.

[0010] The connection trace is configured to include a first part, a second part, and a third part. The first part is disposed on the first surface of the first substrate, the second part is disposed on the inclined surface or the bonding surface, and the third part is disposed on the second surface of the second substrate. The angle between the first part and the second part is greater than 90 degrees, and the angle between the second part and the third part is greater than 90 degrees, thereby reducing the possibility of breakage of the connection trace and ensuring the normal use of the display module.

[0011] In some possible implementations, the driver chip is disposed on the second surface of the second substrate;

[0012] The third part extends along the first direction, the first end of the third part is electrically connected to the driver chip, and the second end of the third part is electrically connected to the second part.

[0013] In some possible implementations, the driver chip is disposed on the second surface of the first substrate;

[0014] The connection trace further includes a fourth part, which is disposed on the second surface of the first substrate. The first end of the fourth part is electrically connected to the driver chip, and the second end of the fourth part extends toward the inclined surface.

[0015] The third part is electrically connected to the fourth part, and the third part is electrically connected to the driver chip through the fourth part.

[0016] In some possible implementations, the display module further includes a connector disposed between the first display panel and the second display panel;

[0017] The first end of the connector is electrically connected to the third part, and the second end of the connector is electrically connected to the fourth part.

[0018] In some possible implementations, the angle between the inclined surface and the first surface of the first substrate is greater than or equal to 110 degrees and less than or equal to 160 degrees.

[0019] And / or, the angle between the bonding surface and the second surface of the second substrate is greater than or equal to 110 degrees and less than or equal to 160 degrees.

[0020] In some possible implementations, the second portion is disposed on the inclined surface, and the second portion is integrally disposed with the first portion;

[0021] Preferably, the bonding surface is further provided with a conductive portion, and the surface of the conductive portion facing away from the bonding surface is electrically connected to the second part.

[0022] In some possible implementations, the second portion is disposed on the bonding surface, and the second portion is integrally disposed with the third portion;

[0023] Preferably, the inclined surface is further provided with a conductive portion, and the surface of the conductive portion facing away from the inclined surface is electrically connected to the second part.

[0024] In some possible implementations, the first substrate is further provided with the bonding surface, and the second substrate is further provided with the inclined surface;

[0025] The inclined surface of the first substrate and the bonding surface of the first substrate are disposed at the same end of the first substrate along the first direction. The bonding surface of the first substrate and the inclined surface of the second substrate are disposed parallel to each other along the first direction. The angle between the bonding surface of the first substrate and the first surface of the first substrate is less than 90 degrees.

[0026] Preferably, the number of inclined surfaces and the number of bonding surfaces are both set to multiple, and the multiple inclined surfaces and the multiple bonding surfaces are arranged alternately along a second direction, which is perpendicular to the first direction.

[0027] In some possible implementations, the first substrate is further provided with the bonding surface, the inclined surface of the first substrate is disposed at a first end of the first substrate along the first direction, the bonding surface of the first substrate is disposed at a second end of the first substrate along the first direction, and the included angle between the bonding surface of the first substrate and the first surface of the first substrate is less than 90 degrees.

[0028] Preferably, the display module further includes a third display panel, the third display panel including a third substrate; in the first direction, the third substrate is disposed at one end of the first substrate away from the second substrate, and the third substrate is further provided with the inclined surface; the bonding surface of the first substrate and the inclined surface of the third substrate are disposed parallel to each other in the first direction.

[0029] This application also provides a display device, including the display module described in any of the above embodiments.

[0030] Since the display device includes the display module described in any of the above claims, the advantages of the display device including the display module described in any of the above claims can be specifically found in the relevant descriptions above, and will not be repeated here. Attached Figure Description

[0031] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0032] Figure 1 A schematic diagram of the structure of the display module provided in the embodiments of this application when the first display panel and the second display panel are not connected;

[0033] Figure 2 Provided for the embodiments of this application Figure 1 A schematic diagram of the structure of the display module when the first display panel and the second substrate of the display module are connected;

[0034] Figure 3 A schematic diagram of the structure of a display module in another embodiment of this application, where the first and second display panels are not connected;

[0035] Figure 4 Provided for the embodiments of this application Figure 3 A schematic diagram of the structure of the display module when the first display panel and the second substrate of the display module are connected;

[0036] Figure 5 A schematic diagram of the structure of a display module in another embodiment of this application, where the first and second display panels are not connected;

[0037] Figure 6 Provided for the embodiments of this application Figure 5 A schematic diagram of the structure of the display module when the first display panel and the second substrate of the display module are connected;

[0038] Figure 7 A schematic diagram of the structure of a display module in another embodiment of this application, where the first and second display panels are not connected;

[0039] Figure 8 Provided for the embodiments of this application Figure 7 A schematic diagram of the structure of the display module when the first display panel and the second substrate of the display module are connected;

[0040] Figure 9 A schematic diagram of the structure of a display module including conductive parts when the first display panel and the second display panel are not connected, as provided in an embodiment of this application.

[0041] Figure 10 Provided for the embodiments of this application Figure 9 A schematic diagram of the structure of the display module when the first display panel and the second substrate of the display module are connected;

[0042] Figure 11 A schematic diagram of the structure of a display module including conductive parts in another embodiment of this application, when the first display panel and the second display panel are not connected;

[0043] Figure 12 Provided for the embodiments of this application Figure 11 A schematic diagram of the structure of the display module when the first display panel and the second substrate of the display module are connected;

[0044] Figure 13 This is a schematic diagram of the structure of the first substrate provided in an embodiment of this application;

[0045] Figure 14 This is a schematic diagram of the structure of the first substrate and the second substrate provided in the embodiments of this application;

[0046] Figure 15 This is a schematic diagram of the structure of the first substrate, the second substrate, and the third substrate provided in the embodiments of this application;

[0047] Figure 16 A schematic diagram of the structure of the first substrate provided in another embodiment of this application;

[0048] Figure 17 A schematic diagram of the structure of the first substrate and the second substrate provided in another embodiment of this application;

[0049] Figure 18 A schematic diagram of the structure of the first substrate, the second substrate, and the third substrate provided in another embodiment of this application.

[0050] Explanation of reference numerals in the attached figures:

[0051] 100. First display panel;

[0052] 110. First substrate; 111. Inclined surface; 111a. First inclined surface; 111b. Second inclined surface; 111c. Third inclined surface; 120. Light-emitting component; 130. Driver chip; 140. Connecting trace; 141. First part; 142. Second part; 143. Third part; 144. Fourth part; 145. Connector; 146. Conductive part; 150. Connecting terminal;

[0053] 200. Second display panel;

[0054] 210, Second substrate; 211, Lamination surface; 211a, First lamination surface; 211b, Second lamination surface; 211c, Third lamination surface;

[0055] 300, Third substrate.

[0056] The accompanying drawings have illustrated specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to specific embodiments. Detailed Implementation

[0057] As described in the background section, a display module includes multiple display panels spliced ​​together. Each display panel includes a substrate, a light-emitting component, a driver chip, and connecting traces. The light-emitting component is disposed on a first surface of the substrate, and the driver chip is disposed on a second surface of the substrate. The first and second surfaces are opposite sides of the substrate in the thickness direction. A first end of the connecting trace is electrically connected to the driver chip, and a second end of the connecting trace is electrically connected to the light-emitting component, so that the driver chip is electrically connected to the light-emitting component through the connecting trace, thereby enabling the driver chip to control the light-emitting process of the light-emitting component.

[0058] The connection trace includes a first part, a second part, and a third part. The first part is disposed on the first surface of the substrate and is electrically connected to the light-emitting component. The second part is disposed on the side of the substrate, with the first end of the second part located on the first surface of the substrate and electrically connected to the end of the first part away from the light-emitting component. The second end of the second part is located on the second surface of the substrate. The third part is disposed on the second surface of the substrate and is electrically connected to the driver chip. The end of the third part away from the driver chip is electrically connected to the second end of the second part, so that the driver chip is electrically connected to the light-emitting component in sequence through the third part, the second part, and the first part.

[0059] However, since the side of the substrate is usually perpendicular to the first and second surfaces of the substrate, the connection traces, where the first and second parts are perpendicular, and the third and second parts are perpendicular, are prone to breakage at the connection points of the first and second parts, and the third and second parts. When the side of the substrate is inclined relative to the first surface of the substrate, for example, the angle between the side of the substrate and the first surface of the substrate can be greater than 90 degrees, the angle between the side of the substrate and the second surface of the substrate is less than 90 degrees, making the connection points of the third and second parts even more prone to breakage, thus affecting the normal use of the display module.

[0060] To address the aforementioned technical problems, this application provides a display module and a display device. The display module includes a first display panel and a second display panel connected to each other, arranged along a first direction. The first display panel includes a first substrate, a light-emitting component, a driving chip, and connecting traces. The second display panel includes a second substrate. The light-emitting component is disposed on a first surface of the first substrate, and the driving chip is disposed on a second surface of the first substrate, or the driving chip is disposed on a second surface of the second substrate.

[0061] The first substrate of the display module is provided with an inclined surface, the angle between the inclined surface and the first surface of the first substrate is greater than 90 degrees, the inclined surface faces the second substrate, and the second substrate is also provided with a bonding surface, the bonding surface and the inclined surface are arranged parallel to each other along the first direction, and the angle between the bonding surface and the second surface of the second substrate is greater than 90 degrees.

[0062] The connection trace is configured to include a first part, a second part, and a third part. The first part is disposed on the first surface of the first substrate, the second part is disposed on the inclined surface or the bonding surface, and the third part is disposed on the second surface of the second substrate. The angle between the first part and the second part is greater than 90 degrees, and the angle between the second part and the third part is greater than 90 degrees, thereby reducing the possibility of breakage of the connection trace and ensuring the normal use of the display module.

[0063] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0064] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will be described below with reference to the accompanying drawings.

[0065] Reference Figure 1 and Figure 2 This application provides a display module including a first display panel 100 and a second display panel 200 connected to each other, the first display panel 100 and the second display panel 200 being arranged along a first direction; wherein, the first display panel 100 includes a first substrate 110, a light-emitting component 120, a driving chip 130 and a connecting trace 140, the second display panel 200 includes a second substrate 210, the second substrate 210 and the first substrate 110 being disposed in the same plane; both the first substrate 110 and the second substrate 210 have a first surface facing the light-emitting side and a second surface facing away from the light-emitting side;

[0066] In the first display panel 100, the light-emitting component 120 is disposed on the first surface of the first substrate 110, and the driving chip 130 is disposed on the second surface of the first substrate 110. Alternatively, the driving chip 130 is disposed on the second surface of the second substrate 210. The driving chip 130 is electrically connected to the light-emitting component 120 through the connecting trace 140 to control the light-emitting process of the light-emitting component 120.

[0067] The first display panel 100 further includes a connection terminal 150, which is disposed on the first surface of the first substrate 110. The connection terminal 150 is electrically connected to the light-emitting component 120 and is also electrically connected to the connection trace 140, so that the connection trace 140 can be electrically connected to the light-emitting component 120 through the connection terminal 150.

[0068] It should be noted that the structure of the second display panel 200 can be the same as that of the first display panel 100. For example, the second display panel 200 may also include a light-emitting component 120, a driving chip 130, and connecting traces 140. In the second display panel 200, the light-emitting component 120 is disposed on the first surface of the second substrate 210, and the driving chip 130 is disposed on the second surface of the second substrate 210. The driving chip 130 is electrically connected to the light-emitting component 120 through the connecting traces 140 to control the light-emitting process of the second display panel 200. Alternatively, the structure of the second display panel 200 may differ from that of the first display panel 100, and this embodiment does not impose further limitations on this.

[0069] Reference Figure 1 and Figure 2In the first display panel 100, the first substrate 110 may be provided with an inclined surface 111, the angle between the inclined surface 111 and the first surface of the first substrate 110 being greater than 90 degrees; in a first direction, the inclined surface 111 may face the second substrate 210, the second substrate 210 is provided with a bonding surface 211, the bonding surface 211 and the inclined surface 111 are arranged parallel to each other in the first direction, and the angle between the bonding surface 211 and the second surface of the second substrate 210 is greater than 90 degrees. For example, the first surface of the first substrate 110 may be arranged parallel to the second surface of the second substrate 210, so that the angle between the inclined surface 111 and the first surface of the first substrate 110 is equal to the angle between the bonding surface 211 and the second surface of the second substrate 210.

[0070] The connecting trace 140 includes a first portion 141, a second portion 142, and a third portion 143 connected to each other. The first portion 141 can be disposed on the first surface of the first substrate 110 and is electrically connected to the light-emitting component 120. The second portion 142 is disposed on the inclined surface 111 or the bonding surface 211. The first end of the second portion 142 is electrically connected to the end of the first portion 141 away from the light-emitting component 120. The angle between the second portion 142 and the first portion 141 is equal to the angle between the inclined surface 111 and the first surface of the first substrate 110. The third portion 143 is disposed on the second surface of the second substrate 210 and is electrically connected to the second end of the second portion 142. The angle between the third portion 143 and the second portion 142 is equal to the angle between the bonding surface 211 and the second surface of the second substrate 210. The third portion 143 is electrically connected to the driver chip 130, so that the driver chip 130 is electrically connected to the light-emitting component 120 in sequence through the third portion 143, the second portion 142, and the first portion 141.

[0071] For example, the angle between the inclined surface 111 and the first surface of the first substrate 110 can be set to be greater than or equal to 110 degrees and less than or equal to 160 degrees. For example, the angle between the inclined surface 111 and the first surface of the first substrate 110 can be set to one of 110 degrees, 120 degrees, 130 degrees, 140 degrees, 150 degrees and 160 degrees, so as to increase the angle between the second part 142 and the first part 141 and reduce the possibility of breakage or other phenomena at the connection between the first part 141 and the second part 142.

[0072] And / or, the angle between the bonding surface 211 and the second surface of the second substrate 210 can be set to be greater than or equal to 110 degrees and less than or equal to 160 degrees. For example, the angle between the bonding surface 211 and the second surface of the second substrate 210 can be set to one of 110 degrees, 120 degrees, 130 degrees, 140 degrees, 150 degrees and 160 degrees, so as to increase the angle between the second part 142 and the third part 143 and reduce the possibility of breakage or other phenomena at the connection between the second part 142 and the third part 143.

[0073] By adopting the above technical solution, the angle between the second part 142 and the first part 141 is equal to the angle between the inclined surface 111 and the first surface of the first substrate 110, and the angle between the second part 142 and the first part 141 is greater than 90 degrees; the angle between the third part 143 and the second part 142 is equal to the angle between the bonding surface 211 and the second surface of the second substrate 210, and the angle between the third part 143 and the second part 142 is greater than 90 degrees, thereby reducing the possibility of breakage of the connecting trace 140 and ensuring the normal use of the display module.

[0074] Reference Figures 1-4 In some possible implementations, the driver chip 130 may be disposed on the second surface of the second substrate 210; the third portion 143 extends along the first direction, the first end of the third portion 143 is electrically connected to the driver chip 130, and the second end of the third portion 143 is electrically connected to the second portion 142, so that the driver chip 130 can be electrically connected to the second portion 142 through the third portion 143.

[0075] It is easy to understand that when manufacturing the display module, a first portion 141 can be formed on the first surface of the first substrate 110. The first portion 141 is electrically connected to the light-emitting component 120. One end of the first portion 141 facing away from the light-emitting component 120 is close to the inclined surface 111. A second portion 142 is formed on the inclined surface 111 or the bonding surface 211, and a third portion 143 is formed on the second surface of the second substrate 210. One end of the third portion 143 facing away from the bonding surface 211 is electrically connected to the driver chip 130.

[0076] Reference Figure 1 and Figure 2 The first part 141 is electrically connected to the second part 142 at one end away from the light-emitting component 120, and the first substrate 110 and the second substrate 210 are brought close to each other, so that the third part 143 is electrically connected to the second part 142 at one end away from the driver chip 130, thereby forming a connection trace 140 between the first part 141, the second part 142 and the third part 143.

[0077] Reference Figure 3 and Figure 4 The third part 143 is electrically connected to the second part 142 at one end away from the driver chip 130, bringing the first substrate 110 and the second substrate 210 closer to each other, so that the first part 141 is electrically connected to the second part 142 at one end away from the light-emitting component 120, thereby forming a connection trace 140 between the first part 141, the second part 142 and the third part 143.

[0078] Or, refer to Figures 5-8The driver chip 130 can also be disposed on the second surface of the first substrate 110; the connection trace 140 further includes a fourth portion 144, which is disposed on the second surface of the first substrate 110. The fourth portion 144 can extend along a first direction. The first end of the fourth portion 144 is electrically connected to the driver chip 130, and the second end of the fourth portion 144 extends toward the inclined surface 111; the third portion 143 is electrically connected to the fourth portion 144, and the third portion 143 is electrically connected to the driver chip 130 through the fourth portion 144.

[0079] For example, the display module also includes a connector 145, which is disposed between the first display panel 100 and the second display panel 200; the first end of the connector 145 is electrically connected to the third part 143, and the second end of the connector 145 is electrically connected to the fourth part 144, so that the third part 143 is electrically connected to the fourth part 144 through the connector 145, making the connection between the third part 143 and the fourth part 144 more stable.

[0080] A first portion 141 can be formed on the first surface of the first substrate 110. The first portion 141 is electrically connected to the light-emitting component 120. One end of the first portion 141 facing away from the light-emitting component 120 is close to the inclined surface 111. A fourth portion 144 can be formed on the second surface of the first substrate 110. The fourth portion 144 is electrically connected to the driver chip 130. One end of the fourth portion 144 facing away from the driver chip 130 is close to the inclined surface 111. A second portion 142 can be formed on the inclined surface 111 or the bonding surface 211. A third portion 143 can be formed on the second surface of the second substrate 210.

[0081] Then, the first substrate 110 and the second substrate 210 are brought close to each other, such that the end of the first part 141 facing away from the light-emitting component 120 is electrically connected to the second part 142, the third part 143 is electrically connected to the second part 142, and the third part 143 is also electrically connected to the fourth part 144; then, the connector 145 is installed between the first display panel 100 and the second display panel 200, such that the first end of the first end of the connector 145 is electrically connected to the third part 143, and the second end of the connector 145 is electrically connected to the fourth part 144, so that the third part 143 is electrically connected to the fourth part 144 through the connector 145, and the first part 141, the second part 142, the third part 143 and the fourth part 144 form a connecting trace 140.

[0082] Reference Figure 9 and Figure 10In some possible implementations, the second part 142 can be disposed on the inclined surface 111, and the second part 142 can be integrally disposed with the first part 141 to facilitate the molding process of the first part 141 and the second part 142; the bonding surface 211 can also be provided with a conductive part 146, the conductive part 146 being electrically connected to the second part 142 on the surface away from the bonding surface 211, thereby achieving the conduction between the first part 141 and the third part 143 through the conductive part 146 and the second part 142; the conductive part 146 can also be integrally molded with the third part 143 to facilitate the molding process of the conductive part 146.

[0083] Or, refer to Figure 11 and Figure 12 The second part 142 can also be disposed on the bonding surface 211. The second part 142 can be integrally disposed with the third part 143 to make the molding process of the second part 142 and the third part 143 more convenient. The inclined surface 111 can also be provided with a conductive part 146. The conductive part 146 is electrically connected to the second part 142 on the surface away from the inclined surface 111, so that the first part 141 and the third part 143 are connected through the conductive part 146 and the second part 142. The conductive part 146 can also be integrally molded with the first part 141 to make the molding process of the conductive part 146 more convenient.

[0084] Reference Figures 13-18 In some possible implementations, the structure of the second display panel 200 can be the same as that of the first display panel 100, that is, the first substrate 110 is provided with a first inclined surface 111a and a first bonding surface 211a, the second substrate 210 is provided with a second inclined surface 111b and a second bonding surface 211b, the first inclined surface 111a and the second bonding surface 211b are arranged parallel to each other along a first direction, and the first bonding surface 211a and the second inclined surface 111b are arranged parallel to each other.

[0085] For example, refer to Figure 1 , Figure 2 and Figures 13-18 When the driving chip 130 of the first display panel 100 is disposed on the second surface of the second substrate 210, the driving chip 130 of the second display panel 200 may be disposed on the second surface of the first substrate 110, or the driving chip 130 of the second display panel 200 may also be disposed on the second surface of the second substrate 210. The connection traces 140 of the second display panel 200 may be configured the same as the connection traces 140 of the first display panel 100, or the connection traces 140 of the second display panel 200 may be different from the connection traces 140 of the first display panel 100.

[0086] For example, the driver chip 130 of the first display panel 100 and the driver chip 130 of the second display panel 200 can both be disposed on the second surface of the first display panel 100. The connection trace 140 of the first display panel 100 is configured to include a first part 141, a second part 142, a third part 143 and a fourth part 144 connected together. The connection trace 140 of the second display panel 200 is configured to include a first part 141, a second part 142 and a third part 143 connected together. The specific configuration of the connection trace 140 of the first display panel 100 and the connection trace 140 of the second display panel 200 can be referred to the above description, and will not be repeated here in the embodiments of this application.

[0087] For example, the shapes of the first substrate 110 and the second substrate 210 will be described below using the structure of the first substrate 110 as an example. (Refer to...) Figure 13 and Figure 14 The first substrate 110 can be configured such that the first inclined surface 111a and the bonding surface 211 can be disposed at the same end of the first substrate 110 along the first direction. For example, the first inclined surface 111a and the first bonding surface 211a can both be disposed at the end of the first substrate 110 near the second substrate 210. The first inclined surface 111a and the first bonding surface 211a can be symmetrically disposed with respect to a plane parallel to the first substrate 110.

[0088] The number of first inclined surfaces 111a and the number of first bonding surfaces 211a can both be set to multiple. Multiple inclined surfaces 111a and multiple first bonding surfaces 211a are alternately arranged along a second direction, which is perpendicular to the first direction. For example, the second direction can be set as the extension direction of the first substrate 110 toward the edge of the second substrate 210.

[0089] Alternatively, the first substrate 110 may be configured such that the number of first inclined surfaces 111a and the number of first bonding surfaces 211a can both be multiple. At the first end of the first substrate 110 along the first direction, a plurality of first inclined surfaces 111a and a plurality of first bonding surfaces 211a are alternately arranged along the second direction. At the second end of the first substrate 110 along the first direction, a plurality of first inclined surfaces 111a and a plurality of first bonding surfaces 211a are alternately arranged along the second direction. The second direction is perpendicular to the first direction. For example, the second direction may be set as the extension direction of the first substrate 110 toward the edge of the second substrate 210.

[0090] It is easy to understand that, referring to Figure 13 and Figure 15The display module may further include a third display panel. In the first direction, the third substrate 300 may be disposed at the end of the first substrate 110 away from the second substrate 210. The shape and structure of the third display panel may be the same as those of the first display panel 100. That is, the third display panel may include the third substrate 300. The third substrate 300 has a plurality of third inclined surfaces 111c and a plurality of third bonding surfaces 211c. At the end of the third substrate 300 near the first substrate 110, a plurality of third inclined surfaces 111c and a plurality of third bonding surfaces 211c are alternately disposed in sequence along the second direction. The third substrate 300 is used in conjunction with the first substrate 110. As for the connection method between the third substrate 300 and the first substrate 110, the connection method between the first substrate 110 and the second substrate 210 described above can be referred to. The embodiments of this application will not be repeated here.

[0091] Reference Figure 16 and Figure 17 In some possible implementations, the first substrate 110 may be provided with a first inclined surface 111a and a first bonding surface 211a. The first inclined surface 111a is disposed at a first end of the first substrate 110 along a first direction, and the first bonding surface 211a is disposed at a second end of the first substrate 110 along a first direction. The included angle between the first bonding surface 211a and the first surface of the first substrate 110 is less than 90 degrees. The first bonding surface 211a and the first inclined surface 111a are disposed parallel to each other along the first direction.

[0092] Reference Figure 16 and Figure 18 For example, the display module may also include a third display panel. In the first direction, the third substrate 300 may be disposed at one end of the first substrate 110 away from the second substrate 210. Furthermore, the shape and structure of the second display panel 200 and the shape and structure of the third display panel may be disposed on the first display panel 100 in the same way.

[0093] In the first direction, the first inclined surface 111a can be disposed parallel to the second bonding surface 211b, and the first bonding surface 211 can be disposed parallel to the third inclined surface 111c, so that the third substrate 300 can be used in conjunction with the first substrate 110, and the first substrate 110 can be used in conjunction with the second substrate 210.

[0094] It is easy to understand that in the display module, the number of display panels can be set to multiple, and the multiple display panels are arranged sequentially along the first direction. The shape and structure of each display panel can be set to the same on the first display panel 100, so that the multiple display panels can cooperate with each other, thereby reducing the possibility of breakage of the connecting lines 140 in each display panel.

[0095] In summary, the display module includes a first display panel 100 and a second display panel 200 connected to each other, and the first display panel 100 and the second display panel 200 are arranged along a first direction; the first display panel 100 includes a first substrate 110, a light-emitting component 120, a driving chip 130 and a connecting trace 140, and the second display panel 200 includes a second substrate 210; the light-emitting component 120 is disposed on the first surface of the first substrate 110, and the driving chip 130 is disposed on the second surface of the first substrate 110, or the driving chip 130 is disposed on the second surface of the second substrate 210;

[0096] The first substrate 110 of the display module is provided with an inclined surface 111, the angle between the inclined surface 111 and the first surface of the first substrate 110 is greater than 90 degrees, the inclined surface 111 faces the second substrate 210, and the second substrate 210 is also provided with a bonding surface 211, the bonding surface 211 and the inclined surface 111 are arranged parallel to each other along the first direction, and the angle between the bonding surface 211 and the second surface of the second substrate 210 is greater than 90 degrees.

[0097] In the first display panel 100, the connecting trace 140 is configured to include a first part 141, a second part 142, and a third part 143. The first part 141 is disposed on the first surface of the first substrate 110, the second part 142 is disposed on the inclined surface 111 or the bonding surface 211, and the third part 143 is disposed on the second surface of the second substrate 210. The angle between the first part 141 and the second part 142 is greater than 90 degrees, and the angle between the second part 142 and the third part 143 is greater than 90 degrees, thereby reducing the possibility of breakage of the connecting trace 140 and ensuring the normal use of the display module.

[0098] This application also provides a display device including the display module described in any of the above embodiments. Since the display device includes the display module described in any of the above embodiments, the advantages of this display device including the display module described in any of the above embodiments are specifically described in the relevant above descriptions, and will not be repeated here.

[0099] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0100] In the description of this invention, it should be understood that the terms “comprising” and “having” as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0101] Unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can be a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display module, characterized in that, It includes a first display panel and a second display panel, which are arranged along a first direction; The first display panel includes a first substrate, a light-emitting component, a driving chip, and connecting traces; the second display panel includes a second substrate; both the first substrate and the second substrate have a first surface facing the light-emitting side and a second surface facing away from the light-emitting side; the light-emitting component is disposed on the first surface of the first substrate, and the driving chip is disposed on the second surface of the first substrate, or the driving chip is disposed on the second surface of the second substrate; The first substrate is provided with an inclined surface, and the angle between the inclined surface and the first surface of the first substrate is greater than 90 degrees; in the first direction, the inclined surface faces the second substrate, and the second substrate is provided with a bonding surface, which is parallel to and opposite to the inclined surface along the first direction, and the angle between the bonding surface and the second surface of the second substrate is greater than 90 degrees. The connection trace includes a first part, a second part, and a third part. The first part is disposed on a first surface of the first substrate and is electrically connected to the light-emitting component. The second part is disposed on the inclined surface or the bonding surface and is electrically connected to the first part at its first end. The third part is disposed on a second surface of the second substrate and is electrically connected to the second end of the second part and is electrically connected to the driver chip. The driving chip is disposed on the second surface of the second substrate, the third part extends along the first direction, the first end of the third part is electrically connected to the driving chip, and the second end of the third part is electrically connected to the second part; Alternatively, the driver chip is disposed on the second surface of the first substrate, and the connection trace further includes a fourth part, the fourth part being disposed on the second surface of the first substrate, the first end of the fourth part being electrically connected to the driver chip, and the second end of the fourth part extending toward the second substrate; The angle between the inclined surface and the first surface of the first substrate is greater than or equal to 110 degrees and less than or equal to 160 degrees. And / or, the angle between the bonding surface and the second surface of the second substrate is greater than or equal to 110 degrees and less than or equal to 160 degrees.

2. The display module according to claim 1, characterized in that, The display module further includes a connector, which is disposed between the first display panel and the second display panel; The first end of the connector is electrically connected to the third part, and the second end of the connector is electrically connected to the fourth part.

3. The display module according to claim 1, characterized in that, The second part is disposed on the inclined surface, and the second part is integrally disposed with the first part; The bonding surface is further provided with a conductive part, and the surface of the conductive part facing away from the bonding surface is electrically connected to the second part.

4. The display module according to claim 1, characterized in that, The second part is disposed on the bonding surface, and the second part is integrally disposed with the third part; The inclined surface is also provided with a conductive part, and the surface of the conductive part facing away from the inclined surface is electrically connected to the second part.

5. The display module according to any one of claims 1-4, characterized in that, The first substrate is further provided with the bonding surface, and the second substrate is further provided with the inclined surface; The inclined surface of the first substrate and the bonding surface of the first substrate are disposed at the same end of the first substrate along the first direction. The bonding surface of the first substrate and the inclined surface of the second substrate are disposed parallel to each other along the first direction. The angle between the bonding surface of the first substrate and the first surface of the first substrate is less than 90 degrees. The number of inclined surfaces and the number of bonding surfaces are both set to multiple, and the multiple inclined surfaces and the multiple bonding surfaces are arranged alternately along the second direction, which is perpendicular to the first direction.

6. The display module according to any one of claims 1-4, characterized in that, The first substrate is further provided with the bonding surface, the inclined surface of the first substrate is disposed at the first end of the first substrate along the first direction, the bonding surface of the first substrate is disposed at the second end of the first substrate along the first direction, and the included angle between the bonding surface of the first substrate and the first surface of the first substrate is less than 90 degrees. The display module further includes a third display panel, which includes a third substrate; in the first direction, the third substrate is disposed at one end of the first substrate away from the second substrate, and the third substrate is also provided with the inclined surface; the bonding surface of the first substrate and the inclined surface of the third substrate are disposed parallel to each other in the first direction.

7. A display device, characterized in that, Includes the display module as described in any one of claims 1-6.

Images