Automatic welding device for SMD LED lamp bead substrate

Abstract

The automatic welding device comprises a shell, a cylindrical groove is formed in the middle of the bottom wall of the shell, a base is fixedly connected to the inner surface of the cylindrical groove, a pressing assembly is slidably installed on the inner surface of the shell, and an adjusting assembly is slidably installed on the inner surface of the shell; the adjusting assembly is located on the lower side of the pressing assembly, bearing assemblies are fixedly installed on the bottom walls of the four first guide grooves, and a clamping assembly is fixedly installed on the bottom wall of the shell. According to the automatic welding device for the SMD LED lamp bead substrate, through the arranged adjusting assembly, adjustment can be conducted according to the position, needing tin soldering, of the SMD LED lamp bead substrate, the adjusting assembly can be matched with the pressing assembly, and after the tin soldering structure of the adjusting assembly makes contact with the SMD LED lamp bead substrate, the tin soldering position of the SMD LED lamp bead substrate is adjusted. And the solder paste in the adjusting assembly can be extruded out through the pressing assembly, and therefore tin soldering machining of the SMD LED lamp bead substrate is completed.

Description

Technical Field

[0001] The invention relates to the technical field of welding devices, and in particular to an automatic welding device for a SMD LED lamp bead substrate. Background Art

[0002] The SMD LED lamp bead substrate is an important component of the LED lamp bead, mainly used to support and connect the LED chip. It is usually made of materials with good thermal conductivity, such as aluminum substrate, ceramic substrate or copper substrate, to ensure the heat dissipation effect of the LED chip. There are generally metal electrodes on the surface of the substrate for electrical connection with the pins of the LED chip.

[0003] In the prior art, the SMD LED lamp bead substrate needs to be soldered. The main purpose of soldering the SMD LED lamp bead substrate is to ensure reliable electrical connection and mechanical fixation between the LED chip and the substrate. Soldering is a common electronic component connection method. It uses molten tin alloy to weld the LED chip pins to the electrodes on the substrate to form a firm electrical channel.

[0004] Chinese patent announcement number CN111787781 B discloses an automatic welding device for a SMD LED lamp bead substrate, comprising a linear displacement mechanism, a welding mechanism, a rotary table, a size adjustment mechanism, a clamping mechanism, an industrial robot and a controller; the welding mechanism is mounted above the end of the linear displacement mechanism, the rotary table is mounted on the working end of the linear displacement mechanism, the size adjustment mechanism is arranged at the outer edge of the rotary table and a plurality of working ends move radially along the rotary table, the clamping mechanism is mounted above the outer side of the working end of the size adjustment mechanism and the working end is arranged vertically downward, the linear displacement mechanism, the welding mechanism, the rotary table, the size adjustment mechanism, the clamping mechanism and the industrial robot are all electrically connected to the controller; the above patent document has a high degree of automation, greatly improves welding efficiency, can automatically adapt to the size of the substrate, has a wide range of applications, a stable structure and high safety.

[0005] Although the device in the above patent document can be used to weld the SMD LED lamp bead substrate during use, it cannot be used to solder the SMD LED lamp bead substrate. Summary of the invention

[0006] The main purpose of the present invention is to provide an automatic soldering device for SMD LED lamp bead substrates, which can effectively solve the problem that although it can play the role of soldering the SMD LED lamp bead substrates, it cannot solder the SMD LED lamp bead substrates.

[0007] To achieve the above object, the technical solution adopted by the present invention is:

[0008] A device for automatically welding a chip LED lamp bead substrate comprises a shell, a cylindrical groove is provided in the middle of the bottom wall of the shell, a base is fixedly connected to the inner surface of the cylindrical groove, four guide grooves are provided in a circular array at the upper end of the shell, a pressing component is slidably mounted on the inner surface of the shell, an adjusting component is slidably mounted on the inner surface of the shell, the adjusting component is located on the lower side of the pressing component, a bearing component is fixedly mounted on the bottom walls of the four guide grooves, and a clamping component is fixedly mounted on the bottom wall of the shell.

[0009] Preferably, the pressing assembly includes a pressing plate, wherein four pressing blocks 1 are fixedly connected to the outer surface of the pressing plate in an annular array, and the four pressing blocks 1 are respectively slidably connected to the inner surfaces of the four guide grooves 1, and a handle is fixedly connected to the middle part of the upper end of the pressing plate, and four guide grooves 2 are formed in the outer annular array of the upper end of the pressing plate, and the upper ends of the four pressing blocks 1 are each provided with a guide hole 1 that passes through the lower end of the pressing block on the same side, and four guide columns 1 are fixedly connected to the outer side of the lower end of the pressing plate in an annular array, and the four guide columns 1 are respectively located on the inner sides of two pressing plates close to each other, and a baffle is fixedly connected to the lower end of the four guide columns, and four springs 1 are fixedly connected to the annular array at the lower end of the pressing plate, and the four springs 1 are respectively located on the outer sides of the four guide columns 1.

[0010] Preferably, the adjusting assembly includes a mounting plate, the outer surface of the mounting plate is fixedly connected with four pressing blocks 2 in an annular array, the four pressing blocks 2 are respectively slidably connected to the inner surfaces of the four guide grooves, the upper ends of the four pressing blocks 2 are each provided with a guide hole 2 that passes through the lower ends of the pressing blocks 2 on the same side, the upper end of the mounting plate is provided with a limiting hole that passes through the lower end of the mounting plate, the outer surfaces of the four guide columns are respectively slidably connected to the inner surfaces of the four limiting holes, a lower end of the four springs is fixedly connected to the upper end of the mounting plate, the upper end of the mounting plate is provided with four limiting grooves that pass through the lower end of the mounting plate, the inner surfaces of the four limiting grooves are provided with a sliding groove in the middle of one end that is close to each other, and the inner surfaces of the four limiting grooves are slidably installed with a soldering assembly.

[0011] Preferably, the soldering assembly includes a tin barrel, the upper front end and the upper rear end of the tin barrel are fixedly connected to rectangular plates, the two rectangular plates are respectively slidably connected to the inner surface of the slide groove on the same side, the inner surface of the tin barrel is slidably connected to an extrusion plate, the middle part of the upper end of the extrusion plate is fixedly connected to an extrusion rod, the lower end of the tin barrel is fixedly connected to a discharge shell, the middle part of the bottom wall of the discharge shell is provided with a discharge port running through the lower end thereof, the middle part of the left side of the upper end of the tin barrel is fixedly connected to an L-shaped push rod, and the middle part of the left end of the tin barrel is fixedly connected to an electric soldering iron.

[0012] Preferably, the four L-shaped push rods are respectively slidably connected to the inner surfaces of the four guide grooves 2, and the widths of the four guide grooves 2 are all greater than the widths of the four extrusion rods.

[0013] Preferably, the four bearing assemblies each include four guide grooves with bearing rods fixedly connected in the middle of the bottom wall, the outer surfaces of the four bearing rods are slidably connected to bearing plates, the four guide grooves with one bottom wall and one end close to the bearing plates on the same side are commonly fixedly connected to springs 2, and the four springs 2 are respectively located on the outside of the bearing rods on the same side.

[0014] Preferably, the four guide holes 1 and the four guide holes 2 cooperate with the four bearing rods.

[0015] Preferably, the clamping assembly includes an annular shell fixedly connected to the bottom wall of the outer shell, the inner surface of the annular shell is provided with four mounting grooves in an annular array, the inner surfaces of the four mounting grooves are slidably connected with soft-headed rods, the mounting grooves on the same side are provided with guide grooves three at one end close to the mounting grooves on the same side, the inner surfaces of the four guide grooves three are slidably connected with sliding rods, the soft-headed rods on the same side and the ends of the mounting grooves on the same side close to each other are commonly and fixedly connected with springs three, the sliding rods on the same side are fixedly connected to the soft-headed rods on the same side, and the springs three on the same side are respectively located on the outside of the sliding rods on the same side.

[0016] Preferably, the outer surfaces of the pressing plate and the pressing block are both in contact with the inner surface of the outer shell.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The present invention can drive the entire device by pressing downwards through the setting of the pressing component, and provide a sufficient stroke difference, so as to provide a sufficient processing stroke in the subsequent soldering process. The pressing component can also facilitate the removal of the welding device after the subsequent processing is completed, which is simple and easy to operate.

[0019] 2. The present invention can adjust the position of the SMD LED lamp bead substrate required for soldering by setting an adjustment component, and can cooperate with the pressing component. After the structure of the adjustment component for soldering contacts the SMD LED lamp bead substrate, the pressing component can squeeze out the solder paste inside the adjustment component, thereby completing the soldering process of the SMD LED lamp bead substrate, and there will be no direct contact with the soldering device during the overall operation, thereby improving the safety of the device when in use.

[0020] 3. The present invention provides a clamping assembly that can be used to clamp SMD LED lamp bead substrates of different sizes, thereby improving stability during soldering and improving the versatility of the entire device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 It is a half-section schematic diagram of the overall structure of the present invention;

[0023] Figure 3 It is a schematic diagram of another operating state of the overall structure of the present invention;

[0024] Figure 4 It is a schematic diagram of another operating state of the overall structure of the present invention;

[0025] Figure 5 It is a schematic diagram of the structure of the pressing assembly of the present invention;

[0026] Figure 6 It is a schematic diagram of the structure of the regulating component of the present invention;

[0027] Figure 7 It is a schematic diagram of the structure of the soldering assembly of the present invention;

[0028] Figure 8 It is a schematic diagram of the installation position of the bearing assembly of the present invention;

[0029] Fig. 9 It is a schematic diagram of the structure of the clamping assembly of the present invention;

[0030] Fig.10 For the present invention Fig. 9 A schematic diagram of the enlarged structure in the middle.

[0031] In the figure: 1, housing; 2, base; 21, cylindrical groove; 3, guide groove 1; 4, pressing assembly; 41, pressing plate; 42, pressing block 1; 43, grip; 44, guide groove 2; 45, guide hole 1; 46, guide column 1; 47, baffle; 48, spring 1; 5, adjustment assembly; 51, mounting plate; 52, pressing block 2; 53, guide hole 2; 54, limiting hole; 55, limiting groove; 56, slide groove; 57, tin Welding assembly; 571, tin barrel; 572, rectangular plate; 573, extrusion plate; 574, extrusion rod; 575, discharge shell; 576, discharge port; 577, L-shaped push rod; 578, electric soldering iron; 6, bearing assembly; 61, bearing rod; 62, bearing plate; 63, spring two; 7, clamping assembly; 71, annular shell; 72, mounting groove; 73, guide groove three; 74, soft head rod; 75, slide rod; 76, spring three. DETAILED DESCRIPTION

[0032] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0033] Embodiment 1, as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, an automatic soldering device for a SMD LED lamp bead substrate comprises a shell 1, a cylindrical groove 21 is provided in the middle of the bottom wall of the shell 1, a base 2 is fixedly connected to the inner surface of the cylindrical groove 21, four guide grooves 3 are provided in a circular array at the upper end of the shell 1, and a pressing component 4 is slidably installed on the inner surface of the shell 1. The pressing component 4 can be pressed downward to drive the entire device, and provide a sufficient stroke difference, so as to provide a sufficient processing stroke in the subsequent soldering process, and the pressing component 4 can also facilitate the removal of the soldering device after the subsequent processing is completed, which is simple and easy to operate;

[0034] An adjustment component 5 is slidably mounted on the inner surface of the housing 1. The adjustment component 5 can be adjusted according to the position of the SMD LED lamp bead substrate required for soldering, and can cooperate with the pressing component 4. After the structure of the adjustment component 5 for soldering contacts the SMD LED lamp bead substrate, the pressing component 4 can squeeze out the solder paste inside the adjustment component 5, thereby completing the soldering process of the SMD LED lamp bead substrate, and the overall operation process will not directly contact the soldering device, thereby improving the safety of the device when in use;

[0035] The adjusting component 5 is located at the lower side of the pressing component 4, the bottom walls of the four guide grooves 3 are fixedly installed with a bearing component 6, and the bottom wall of the shell 1 is fixedly installed with a clamping component 7. Through the provided clamping component 7, it can be clamped according to different sizes of SMD LED lamp bead substrates, thereby improving the stability during soldering and improving the overall versatility of the device.

[0036] Embodiment 2: Based on Embodiment 1, this embodiment is for achieving the purpose of limiting and clamping SMD LED lamp bead substrates of different sizes.

[0037] For details, see Figure 2 , Figure 3 , Figure 4 , Figure 8 , Fig. 9 and Fig.10 The clamping assembly 7 includes an annular shell 71 fixedly connected to the bottom wall of the outer shell 1, and four mounting grooves 72 are arranged in an annular array on the inner surface of the annular shell 71. The inner surfaces of the four mounting grooves 72 are slidably connected with soft-head rods 74. The same-side mounting groove 72 is provided with a guide groove three 73 at one end close to the same-side mounting groove 72, and the inner surfaces of the four guide grooves three 73 are slidably connected with sliding rods 75. The same-side soft-head rod 74 and the same-side mounting groove 72 are both fixedly connected with springs three 76 at one end close to each other. The same-side sliding rods 75 are fixedly connected to the same-side soft-head rod 74, and the same-side springs three 76 are respectively located on the outside of the same-side sliding rod 75.

[0038] When it is necessary to clamp the SMD LED lamp bead substrates of different sizes before processing, it is only necessary to place the SMD LED lamp bead substrate on the upper end of the base 2. During the placement process, press the SMD LED lamp bead substrate downward so that the outer surface of the SMD LED lamp bead substrate squeezes the four soft-headed rods 74 at the same time, and then the four soft-headed rods 74 slide into the mounting groove 72 on the same side under the squeezing force. In the process of sliding into the mounting groove 72, the soft-headed rod 74 squeezes and contracts the spring three 76, and the sliding rod 75 slides into the guide groove three 73. Under the action of the spring three 76, an outward pressing force can be always applied to the soft-headed rod 74, thereby prompting the soft-headed rod 74 to always fit the outer surface of the SMD LED lamp bead substrate, so that the SMD LED lamp bead substrate is more stable during subsequent processing, which is convenient for subsequent soldering work.

[0039] Embodiment 3: Based on Embodiment 2, this embodiment is for achieving the purpose of soldering the SMD LED lamp bead substrate after clamping and limiting.

[0040] For details, see Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 The pressing assembly 4 includes a pressing plate 41, and four pressing blocks 42 are fixedly connected to the outer surface of the pressing plate 41 in an annular array. The four pressing blocks 42 are respectively slidably connected to the inner surfaces of the four guide grooves 3. A handle 43 is fixedly connected to the middle part of the upper end of the pressing plate 41. Four guide grooves 44 that penetrate the lower end of the pressing plate 41 are opened in an annular array on the outer side of the upper end of the pressing plate 41. The upper ends of the four pressing blocks 42 are all provided with guide holes 45 that penetrate the lower ends of the pressing blocks 42 on the same side. Four guide columns 46 are fixedly connected to the outer side of the lower end of the pressing plate 41 in an annular array. The four guide columns 46 are respectively located on the inner sides of two pressing plates 41 close to each other. The lower ends of the four guide columns 46 are fixedly connected to baffles 47. Four springs 48 are fixedly connected to the lower end of the pressing plate 41 in an annular array. The four springs 48 are respectively located on the outer sides of the four guide columns 46.

[0041] Furthermore, the adjustment component 5 includes a mounting plate 51, and four pressing blocks 52 are fixedly connected to the outer surface of the mounting plate 51 in an annular array. The four pressing blocks 52 are respectively slidably connected to the inner surfaces of four guide grooves 3. The upper ends of the four pressing blocks 52 are each provided with a guide hole 53 that passes through the lower end of the pressing block 52 on the same side. A limiting hole 54 that passes through the lower end of the mounting plate 51 is provided in an annular array at the upper end of the mounting plate 51. The outer surfaces of the four guide columns 46 are respectively slidably connected to the inner surfaces of the four limiting holes 54. The lower ends of the four springs 48 are fixedly connected to the upper end of the mounting plate 51. Four limiting grooves 55 that pass through the lower end of the mounting plate 51 are provided in an annular array at the upper end of the mounting plate 51. The inner surfaces of the four limiting grooves 55 are each provided with a sliding groove 56 in the middle of one end close to each other. The inner surfaces of the four limiting grooves 55 are each slidably installed with a soldering assembly 57.

[0042] Furthermore, the soldering assembly 57 includes a tin barrel 571, which has rectangular plates 572 fixedly connected to the upper front end and the upper rear end of the tin barrel 571, and the two rectangular plates 572 are respectively slidably connected to the inner surfaces of the slide grooves 56 on the same side. The inner surface of the tin barrel 571 is slidably connected to an extrusion plate 573, and the middle part of the upper end of the extrusion plate 573 is fixedly connected to an extrusion rod 574, and the lower end of the tin barrel 571 is fixedly connected to a discharge shell 575, and the middle part of the bottom wall of the discharge shell 575 is provided with a discharge port 576 running through the lower end thereof, an L-shaped push rod 577 is fixedly connected to the middle part of the left side of the upper end of the tin barrel 571, and an electric soldering iron 578 is fixedly connected to the middle part of the left end of the tin barrel 571.

[0043] Preferably, the four L-shaped push rods 577 are respectively slidably connected to the inner surfaces of the four guide grooves 2 44 , and the widths of the four guide grooves 2 44 are all greater than the widths of the four extrusion rods 574 .

[0044] Furthermore, the four bearing assemblies 6 each include four guide grooves 3 with bearing rods 61 fixedly connected in the middle of the bottom wall, the outer surfaces of the four bearing rods 61 are slidably connected to bearing plates 62, the bottom walls of the four guide grooves 3 and the ends of the bearing plates 62 on the same side close to each other are commonly fixedly connected to springs 2 63, and the four springs 2 63 are respectively located on the outside of the bearing rods 61 on the same side.

[0045] Furthermore, the four guide holes 1 45 and the four guide holes 2 53 cooperate with the four bearing rods 61 .

[0046] Furthermore, the outer surfaces of the pressing plate 41 and the second pressing block 52 are in contact with the inner surface of the housing 1 .

[0047] First, according to the required soldering position of the SMD LED lamp bead substrate, pull the L-shaped push rod 577 at the corresponding position to slide in the corresponding guide groove 44, so that the L-shaped push rod 577 drives the tin barrel 571 fixedly connected thereto to move in the inner surface of the limiting groove 55 on the same side. During the movement of the tin barrel 571, the two rectangular plates 572 fixedly connected thereto are respectively slidably connected to the inner surface of the slide groove 56 on the same side. Then, after pulling the L-shaped push rod 577 at the corresponding position to drive the tin barrel 571 fixedly connected thereto to slide to the position where soldering is required, the next step can be performed.

[0048] Hold the handle 43 fixedly connected to the upper end of the pressing plate 41, and then align the guide holes 1 45 opened at the upper ends of the four pressing blocks 1 42 with the four bearing rods 61 respectively. As can be seen from the above, the four guide holes 1 45 and the four guide holes 2 53 cooperate with the four bearing rods 61, so it is only necessary to align the four guide holes 1 45 with the four bearing rods 61 respectively, and the four guide holes 2 53 are also aligned with the four bearing rods 61 accordingly, and then the handle 43 can be pressed downward, so that the handle 43 drives the pressing plate 41 fixedly connected thereto to slide downward on the inner surface of the housing 1. As can be seen from the above, the outer surfaces of the pressing plate 41 and the pressing block 2 52 are in contact with the inner surface of the housing 1, so that the pressing plate 41 can slide downward on the inner surface of the housing 1, and the overall fit of the device is improved;

[0049] When the pressing plate 41 is pressed downward, the four springs 48 fixedly connected to the lower end of the pressing plate 41 will simultaneously push the mounting plate 51 to slide downward. When the mounting plate 51 slides downward, it can simultaneously drive the fixedly connected pressing block 2 52 to slide downward on the inner surface of the guide groove 3. When the four pressing blocks 2 52 move downward, they will squeeze the supporting plate 62 on the same side, causing the supporting plate 62 on the same side to squeeze the spring 2 63 fixedly connected thereto. When the pressing block 2 52 drives the supporting plate 62 on the same side to move downward to squeeze the spring 2 63 to the maximum threshold, at this time, the center point of the discharge shell 575 fixedly connected to the lower end of the tin barrel 571 is parallel to the position required for soldering of the SMD LED lamp bead substrate, and the distance between the two is just the appropriate distance for soldering. The specific state is as follows Figure 2 As shown;

[0050] Then, it is only necessary to continue to press the pressing plate 41 downward, so that the pressing plate 41 drives the guide column 1 46 fixedly connected at its lower end to slide downward in the corresponding limiting hole 54. After sliding a certain distance, the lower end of the pressing plate 41 and the upper ends of the four extrusion rods 574 fit each other. As can be seen from the above, the widths of the four guide grooves 2 44 are all greater than the widths of the four extrusion rods 574. Therefore, when the lower end of the pressing plate 41 contacts the upper ends of the four extrusion rods 574, the four extrusion rods 574 cannot pass through the corresponding guide grooves 2 44.

[0051] Then, when the pressing plate 41 is pressed downward, the pressing plate 41 can be urged to squeeze the squeezing rod 574 downward, and then the squeezing rod 574 drives the squeezing plate 573 fixedly connected thereto to move downward in the tin barrel 571, so that the squeezing plate 573 squeezes the solder paste inside the tin barrel 571 out of the discharge port 576 opened at the lower end of the discharge shell 575. Before squeezing out the solder paste, the electric soldering iron 578 fixedly connected to one side of the tin barrel 571 is preheated at the end close to the discharge port 576, so that the squeezed solder paste can be soldered to the required soldering position of the SMD LED lamp bead substrate. For specific working conditions, please refer to Figure 4 ;

[0052] When the device needs to be taken out later, it is only necessary to lift the pressing plate 41 upwards, and the lower ends of the four guide pillars 46 are fixedly connected to the baffles 47, so when the baffles 47 move upwards, they will hook around the lower side of the limiting holes 54 on the same side, thereby achieving the purpose of lifting the pressing component 4 and the adjusting component 5 at the same time, and then the processed SMD LED lamp bead substrate can be taken out;

[0053] In order to meet the different elastic force requirements of the springs in different operation steps, in this solution, the elastic force of the four guide pillars 46 is greater than the elastic force of the four springs 2 63, so as to meet the above operation process.

[0054] The electric soldering iron 578 and solder paste mentioned above are conventional settings in the prior art, and the two need to be used in conjunction with each other. The specific working principle is as follows:

[0055] Solder paste is a paste-like substance composed of metallic tin, flux and other chemical ingredients. It is usually used in surface mount technology and manual soldering. The functions of solder paste are as follows:

[0056] Solder metal source: Solder paste contains tin and other alloying elements, which melt when heated and form solder joints to connect with the pins of electronic components and pads on circuit boards;

[0057] The role of flux: The flux in the solder paste can clean the oxide layer on the soldering surface and reduce the surface tension of the metal surface, helping the solder paste to flow and solder better, thereby improving the quality of the solder joints. The flux can also prevent the solder joints from producing cold solder joints or virtual solder joints when they are cooled;

[0058] Melting and fluidity: When the temperature rises, the solder component in the solder paste will melt to form liquid solder, which will form a strong connection with the surface to be soldered.

[0059] The function of electric soldering iron 578:

[0060] Electric soldering iron 578 is a tool that uses a heating element, usually a resistance wire or a ceramic heating element, to transfer temperature to the metal welding head. Its function can be divided into several steps:

[0061] Heating: The electric soldering iron 578 generates heat by passing current through the heating element, and the temperature of the soldering tip increases. Usually, the working temperature of the electric soldering iron 578 is between 300°C and 400°C, which is enough to melt the solder component in the solder paste;

[0062] Soldering process: When the heating tip of the electric soldering iron 578 contacts the soldering point, it will quickly heat the soldering part and melt the solder in the solder paste. At this time, the electric soldering iron 578 will also provide heat to promote the metal contact between the solder and the pad or pin, thereby forming a stable electrical connection;

[0063] Controlling temperature: The temperature of the electric soldering iron 578 needs to be precisely controlled, because too high a temperature may cause the solder joint to overheat, causing damage or poor soldering, while too low a temperature may not completely melt the solder paste, resulting in a poor connection.

[0064] Therefore, the electric soldering iron 578 and solder paste mentioned above are conventional designs in the prior art, and their specific installation methods, circuit connection methods and control methods are all conventional designs, which will not be elaborated in detail in the present invention.

[0065] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. An automatic soldering device for SMD LED lamp bead substrates, comprising a housing (1), characterized in that: A cylindrical groove (21) is provided in the middle of the bottom wall of the shell (1), and a base (2) is fixedly connected to the inner surface of the cylindrical groove (21). Four guide grooves (3) are provided in a circular array at the upper end of the shell (1). A pressing component (4) is slidably mounted on the inner surface of the shell (1). An adjusting component (5) is slidably mounted on the inner surface of the shell (1), and the adjusting component (5) is located at the lower side of the pressing component (4). A bearing component (6) is fixedly mounted on the bottom walls of the four guide grooves (3), and a clamping component (7) is fixedly mounted on the bottom wall of the shell (1).

2. According to claim 1, the automatic soldering device for SMD LED lamp bead substrate is characterized in that: The pressing assembly (4) comprises a pressing plate (41), the outer surface of the pressing plate (41) is fixedly connected with four pressing blocks (42) in an annular array, the four pressing blocks (42) are respectively slidably connected to the inner surfaces of four guide grooves (3), the middle part of the upper end of the pressing plate (41) is fixedly connected with a handle (43), the outer side of the upper end of the pressing plate (41) is provided with four guide grooves (44) penetrating the lower end of the pressing plate (41) in an annular array, the upper ends of the four pressing blocks (42) are all provided with a guide groove (44) penetrating the same guide groove (3). A guide hole (45) is provided at the lower end of the pressing block (42) on the side, and four guide columns (46) are fixedly connected in an annular array on the outer side of the lower end of the pressing plate (41). The four guide columns (46) are respectively located on the inner sides of two pressing plates (41) close to each other. A baffle (47) is fixedly connected at the lower ends of the four guide columns (46). Four springs (48) are fixedly connected in an annular array on the lower end of the pressing plate (41). The four springs (48) are respectively located on the outer sides of the four guide columns (46).

3. According to claim 2, the automatic soldering device for SMD LED lamp beads substrate is characterized in that: The adjustment assembly (5) comprises a mounting plate (51), the outer surface of the mounting plate (51) is fixedly connected with four pressing blocks (52) in an annular array, the four pressing blocks (52) are respectively slidably connected to the inner surfaces of the four guide grooves (3), the upper ends of the four pressing blocks (52) are each provided with a guide hole (53) penetrating the lower end of the pressing block (52) on the same side, the upper end of the mounting plate (51) is provided with a limiting hole (54) penetrating the lower end of the mounting plate (51), and the four The outer surface of the guide column (46) is slidably connected to the inner surfaces of the four limiting holes (54), the lower ends of the four springs (48) are fixedly connected to the upper end of the mounting plate (51), the upper end of the mounting plate (51) is provided with four limiting grooves (55) in a circular array that penetrate the lower end of the mounting plate (51), the inner surfaces of the four limiting grooves (55) are each provided with a sliding groove (56) in the middle of one end that is close to each other, and the inner surfaces of the four limiting grooves (55) are each slidably installed with a soldering assembly (57).

4. The automatic soldering device for SMD LED lamp bead substrate according to claim 3 is characterized by: The soldering assembly (57) comprises a tinning barrel (571), wherein the upper front end and the upper rear end of the tinning barrel (571) are fixedly connected to rectangular plates (572), and the two rectangular plates (572) are respectively slidably connected to the inner surface of the slide groove (56) on the same side, and the inner surface of the tinning barrel (571) is slidably connected to an extrusion plate (573), and the middle part of the upper end of the extrusion plate (573) is fixedly connected to an extrusion rod (574), and the lower end of the tinning barrel (571) is fixedly connected to a discharge shell (575), and the middle part of the bottom wall of the discharge shell (575) is provided with a discharge port (576) penetrating the lower end thereof, and the middle part of the left side of the upper end of the tinning barrel (571) is fixedly connected to an L-shaped push rod (577), and the middle part of the left end of the tinning barrel (571) is fixedly connected to an electric soldering iron (578).

5. The automatic soldering device for SMD LED lamp bead substrate according to claim 4 is characterized in that: The four L-shaped push rods (577) are respectively slidably connected to the inner surfaces of the four guide grooves (44), and the widths of the four guide grooves (44) are all greater than the widths of the four extrusion rods (574).

6. The automatic soldering device for SMD LED lamp bead substrate according to claim 3 is characterized by: The four bearing assemblies (6) each include four bearing rods (61) fixedly connected to the middle of the bottom wall of the guide grooves (3), the outer surfaces of the four bearing rods (61) are slidably connected to bearing plates (62), the bottom walls of the four guide grooves (3) and the ends of the bearing plates (62) on the same side that are close to each other are commonly fixedly connected to springs (63), and the four springs (63) are respectively located on the outer sides of the bearing rods (61) on the same side.

7. The automatic soldering device for SMD LED lamp bead substrate according to claim 6, characterized in that: The four guide holes one (45) and the four guide holes two (53) all cooperate with the four bearing rods (61).

8. The automatic soldering device for SMD LED lamp bead substrate according to claim 1, characterized in that: The clamping assembly (7) comprises an annular shell (71) fixedly connected to the bottom wall of the outer shell (1); the inner surface of the annular shell (71) is provided with four mounting grooves (72) in an annular array; the inner surfaces of the four mounting grooves (72) are all slidably connected with soft-headed rods (74); the mounting grooves (72) on the same side are provided with guide grooves three (73) at one end close to the mounting grooves (72) on the same side; the inner surfaces of the four guide grooves three (73) are all slidably connected with sliding rods (75); the ends of the soft-headed rods (74) on the same side and the mounting grooves (72) on the same side close to each other are both fixedly connected with springs three (76); the sliding rods (75) on the same side are fixedly connected to the soft-headed rods (74) on the same side; and the springs three (76) on the same side are respectively located on the outside of the sliding rods (75) on the same side.

9. The automatic soldering device for SMD LED lamp bead substrate according to claim 3 is characterized by: The outer surfaces of the pressing plate (41) and the second pressing block (52) are both in contact with the inner surface of the outer shell (1).

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