An adaptive rapid assembly system and method for laser radar

Abstract

The present invention relates to the field of mechanical arm technology, and discloses an adaptive rapid assembly system and method for laser radar, the system includes: an acquisition module, a mechanical arm with a clamping claw and a welding head; a control module is electrically connected to the acquisition module and the mechanical arm, and the control module includes an acquisition unit to control the mechanical arm to place a shell on a working plane, and control the mechanical arm to press the crimping stud into the crimping hole; a judgment unit acquires an image of the shell after crimping to determine whether the plane is flush; when it is determined that the plane is flush, the processing unit controls the mechanical arm to clamp the mainboard module, and passes the crimping stud through the installation hole of the mainboard module; and determines the amount of solder, and controls the welding head to fix the mainboard module; the adjustment unit acquires welding position image data to determine whether there is a welding defect, and controls the welding head to perform repair welding when it is determined that there is a defect. The present application realizes the automation of laser radar assembly through the acquisition module, the mechanical arm, and the control module, and improves the assembly accuracy.

Description

Technical Field

[0001] The present invention relates to the technical field of robotic arms, and in particular to an adaptive rapid assembly system and method for laser radar. Background Art

[0002] With the widespread application of LiDAR technology, the demand for LiDAR equipment in the fields of automobiles, robots, drones, etc. is gradually increasing. In order to improve the accuracy and stability of the LiDAR system, its assembly process needs to meet extremely high precision requirements.

[0003] For example, in utility model patent CN202321990409.3, the lens assembly mainly includes a shell and a template assembly. The traditional lidar assembly process usually relies on manual operation, with low assembly efficiency and prone to defects. When the shell is crimped and the studs are installed, there is a lack of control over the crimping holes and studs, resulting in the studs being misplaced or not fully pressed into the holes during installation. In addition, there are errors in judging whether the plane is flush after installation, and problems cannot be discovered and adjusted in time. The soldering process is used for welding and fixing. The control of the amount of tin during the welding process is relatively extensive, making it difficult to ensure the consistency of welding quality. Welding defects are prone to occur, affecting the performance of the entire machine.

[0004] Therefore, it is necessary to design an adaptive rapid assembly system and method for lidar to solve the problems existing in the current technology. Summary of the invention

[0005] In view of this, the present invention proposes an adaptive rapid assembly system and method for laser radar, aiming to solve the problems existing in the current laser radar assembly technology of relying on manual operation, low assembly accuracy, poor consistency and lack of feedback adjustment mechanism.

[0006] In one aspect, the present invention provides an adaptive rapid assembly system for a laser radar, comprising:

[0007] Acquisition module, including a horizontal array camera and a vertical array camera;

[0008] A robotic arm, provided with gripping claws and a welding head;

[0009] A control module, electrically connected to the acquisition module and the robotic arm, the control module comprising an acquisition unit, a judgment unit, a processing unit and an adjustment unit;

[0010] The acquisition unit is configured to acquire a working plane and control the mechanical arm to place the shell on the working plane. The acquisition unit is also configured to acquire the crimping hole positions on the surface of the shell, determine the running path of the mechanical arm for clamping the crimping stud based on the search model according to the crimping hole positions, and control the mechanical arm to press down to press the crimping stud into the crimping hole positions;

[0011] The judging unit is configured to collect an image of the shell after crimping based on the horizontal array camera, and judge whether the plane of the crimping stud is flat according to the shell image;

[0012] When the judgment unit determines that the plane of the crimping stud is flush, the processing unit is configured to control the mechanical arm to clamp the mainboard module and pass the crimping stud through the mounting hole of the mainboard module; the processing unit is also configured to collect the upper surface image data of the mainboard module, obtain the average gap between the mounting hole and the crimping stud according to the upper surface image data, use the average gap and the crimping stud diameter as characteristic parameters, compare the characteristic parameters with the historical splicing data, determine the solder amount of the welding head according to the comparison result, and control the welding head to fix the mainboard module according to the solder amount;

[0013] The adjustment unit is configured to collect welding position image data, determine whether there is a welding defect based on the welding position image data, and control the welding head to perform repair welding to complete the lens splicing when it is determined that there is a welding defect.

[0014] Further, when the acquisition unit determines the running path of the mechanical arm for clamping the crimping stud based on the search model according to the crimping hole position, it includes:

[0015] S1: The acquisition unit establishes a three-dimensional coordinate system with the crimping hole position, defines an open set and a closed set, and initializes a cost function value, wherein the cost function value is the path length. The open set stores nodes to be explored and initially only contains the starting point, and the closed set stores nodes that have been explored and is initially empty;

[0016] S2: gradually selecting a node expansion path with the minimum cost from the open set, and gradually approaching the coordinates of the terminal position;

[0017] S3: Explore all possible path directions of the current node, update the path cost, and if the neighbor node is not in the open set, add the neighbor node to the open set and record the parent node of the neighbor node; if the neighbor node is in the open set but the new path cost is smaller, update the parent node and the path cost;

[0018] S4: Repeat step S3 until the current node coincides with the end point position coordinates, trace back to the parent node from the end point position coordinates to the start point position coordinates, and the acquisition unit uses this path as the running path.

[0019] Furthermore, when the judgment unit collects the image of the housing after crimping, it includes:

[0020] A line laser is set, the line laser obliquely illuminates the shell surface, and the line laser moves evenly from top to bottom when the horizontal array camera collects the shell image after crimping, and the movement speed of the line laser is proportional to the collection frequency of the horizontal array camera.

[0021] Further, when the judging unit judges whether the plane of the crimping stud is flush according to the housing image, it includes:

[0022] The judging unit acquires the upper boundary of the crimping stud and the upper boundary of the shell according to the shell image;

[0023] When the upper boundary of the crimping stud is parallel to the upper boundary of the housing, the judging unit judges that the planes of the crimping stud are flush;

[0024] When the upper boundary of the crimping stud is not parallel to the upper boundary of the housing, the judging unit determines that the planes of the crimping stud are not flush.

[0025] Furthermore, when the processing unit compares the characteristic parameter with the historical splicing data and determines the amount of solder used for the welding head according to the comparison result, it includes:

[0026] The historical splicing data includes a plurality of historical characteristic parameters and a plurality of historical solder usages, each of the historical characteristic parameters corresponds to a historical solder usage, and the historical characteristic parameters include a historical average gap and a historical crimping stud diameter;

[0027] Calculating the similarity between the characteristic parameter and each historical characteristic parameter;

[0028] When there is data in all the historical characteristic parameters whose similarity with the characteristic parameter is greater than a similarity threshold, the historical solder amount corresponding to the maximum similarity is used as the solder amount;

[0029] When there is no data in all the historical characteristic parameters whose similarity with the characteristic parameters is greater than a similarity threshold, data in all the historical characteristic parameters whose similarity with the characteristic parameters is greater than q% and less than the similarity threshold are selected to establish an initial set, and the solder usage is determined based on the historical solder usage in the initial set.

[0030] Furthermore, when the processing unit determines the solder usage according to the historical solder usage in the initial set, it includes:

[0031] The processing unit determines a historical average usage according to all historical solder usages in the initial set;

[0032] The processing unit classifies the data in the initial set whose historical solder usage is greater than the historical average usage into a first set; classifies the data in the initial set whose historical solder usage is less than the historical average usage into a second set, and determines the solder usage according to the historical average usage and the second set.

[0033] Furthermore, when the processing unit determines the solder usage according to the historical average usage and the second set, it includes:

[0034] ;

[0035] Among them, Y represents the solder usage, Y0 represents the historical average usage, N represents the number of historical solder usage in the second set, and Yi represents the i-th historical solder usage in the second set.

[0036] Furthermore, when the adjustment unit determines whether there is a welding defect according to the welding position image data, it includes:

[0037] The adjustment unit obtains the defect area of ​​the welding surface according to the welding position image, and the defects include pits and pores; the adjustment unit compares the defect area with the area threshold, and determines whether there is a welding defect according to the comparison result;

[0038] When the defect area is greater than the area threshold, the adjustment unit determines that there is a welding defect and controls the welding head to perform repair welding; when the defect area is less than or equal to the area threshold, the adjustment unit determines that there is no welding defect.

[0039] Further, when the adjustment unit determines that there is a welding defect and controls the welding head to perform repair welding, it includes:

[0040] The adjustment unit obtains the defect ratio according to the defect area, determines the adjustment coefficient according to the defect ratio, obtains the product of the adjustment coefficient and the solder amount, and uses the product as the soldering amount;

[0041] The adjustment unit compares the defect proportion with the first proportion and the second proportion respectively, and determines an adjustment coefficient according to the comparison result, wherein the first proportion is smaller than the second proportion;

[0042] When the defect proportion is less than or equal to the first proportion, the adjustment unit determines that the adjustment coefficient is the first adjustment coefficient; when the defect proportion is greater than the first proportion and less than or equal to the second proportion, the adjustment unit determines that the adjustment coefficient is the second adjustment coefficient; when the defect proportion is greater than the second proportion, the adjustment unit determines that the adjustment coefficient is the third adjustment coefficient; the first adjustment coefficient is less than the second adjustment coefficient, the second adjustment coefficient is less than the third adjustment coefficient, and the adjustment coefficient value range is [0.1-0.5].

[0043] Compared with the prior art, the beneficial effect of the present invention is that the automation and precise control of the laser radar adaptive rapid assembly system are realized by combining the acquisition module, the mechanical arm, and the control module. The acquisition unit accurately acquires the working plane and the crimping hole position through the vertical array camera, and provides accurate positioning information for the subsequent crimping stud installation, avoiding the common problems of misalignment or incomplete installation in traditional manual operations. The mechanical arm controls the downward pressure of the crimping stud according to the acquired data, ensures the stable installation of the crimping stud and determines whether it is flush, effectively improving the accuracy of the assembly process. The processing unit in the control module optimizes the coordination between the mainboard module and the crimping stud through real-time image data analysis, and accurately calculates the amount of solder in combination with historical data to ensure the stability and consistency of the welding process. Through the acquisition and analysis of the welding position image data, the welding defects are judged and repaired, the welding quality is guaranteed, the efficiency and reliability of the laser radar assembly are improved, and various defects in the traditional assembly process are solved, and the overall performance and stability of the product are improved.

[0044] On the other hand, the present application also provides an adaptive rapid assembly method for a laser radar, which is applied to the adaptive rapid assembly system for the laser radar, comprising:

[0045] Collecting a working plane and controlling a mechanical arm to place the shell on the working plane, collecting crimping hole positions on the shell surface, determining a running path for the mechanical arm to clamp the crimping stud based on the search model according to the crimping hole positions, and controlling the mechanical arm to press down to press the crimping stud into the crimping hole positions;

[0046] Based on the horizontal array camera, an image of the shell after crimping is collected, and according to the shell image, whether the plane of the crimping stud is flush;

[0047] When it is determined that the plane of the crimping stud is flush, the robot arm is controlled to clamp the mainboard module and pass the crimping stud through the mounting hole of the mainboard module; the upper surface image data of the mainboard module is collected, and the average gap between the mounting hole and the crimping stud is obtained according to the upper surface image data, and the average gap and the crimping stud diameter are used as characteristic parameters, and the characteristic parameters are compared with the historical splicing data, and the amount of solder of the welding head is determined according to the comparison result, and the welding head is controlled to fix the mainboard module according to the amount of solder;

[0048] Collect welding position image data, determine whether there is a welding defect based on the welding position image data, and control the welding head to perform repair welding to complete the lens splicing when it is determined that there is a welding defect.

[0049] It is understandable that the above-mentioned adaptive rapid assembly system and method for lidar have the same beneficial effects and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0051] Figure 1 A structural block diagram of an adaptive rapid assembly system for a laser radar provided in an embodiment of the present invention;

[0052] Figure 2 A flowchart of an adaptive rapid assembly method for a laser radar provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0053] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features described in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0054] In some embodiments of the present application, see Figure 1 As shown, an adaptive rapid assembly system for laser radar includes:

[0055] The acquisition module includes a horizontal array camera and a vertical array camera;

[0056] The robotic arm is provided with a gripping claw and a welding head;

[0057] The control module is electrically connected to the acquisition module and the robotic arm, and the control module includes an acquisition unit, a judgment unit, a processing unit and an adjustment unit;

[0058] The acquisition unit is configured to acquire the working plane and control the robot arm to place the shell on the working plane. The acquisition unit is also configured to acquire the crimping hole positions on the shell surface, determine the running path of the robot arm for clamping the crimping stud based on the search model according to the crimping hole positions, and control the robot arm to press down the crimping stud into the crimping hole positions;

[0059] The judging unit is configured to collect an image of the shell after crimping based on a horizontal array camera, and judge whether the plane of the crimped stud is flush according to the shell image;

[0060] When the judgment unit determines that the plane of the crimping stud is flush, the processing unit is configured to control the robot arm to clamp the mainboard module and pass the crimping stud through the installation hole of the mainboard module; the processing unit is also configured to collect image data of the upper surface of the mainboard module, obtain the average gap between the installation hole and the crimping stud according to the upper surface image data, use the average gap and the crimping stud diameter as characteristic parameters, compare the characteristic parameters with historical splicing data, determine the amount of solder used in the welding head according to the comparison result, and control the welding head to fix the mainboard module according to the solder amount;

[0061] The adjustment unit is configured to collect welding position image data, determine whether there is a welding defect based on the welding position image data, and control the welding head to perform repair welding to complete the lens splicing when it is determined that there is a welding defect.

[0062] Specifically, the acquisition module includes a horizontal array camera and a vertical array camera. The vertical array camera is used to acquire images of the working plane, the crimping holes, the upper surface image data of the motherboard module, and the image data of the welding position. The horizontal array camera is used to acquire the shell image after crimping. The function of the acquisition module is to ensure the monitoring of the working environment and parts, and to provide data support for the subsequent robot arm operation. By acquiring the crimping holes, the installation path of the crimping stud can be accurately determined, avoiding the common positioning deviation problem in the traditional method. The robot arm is equipped with a gripping claw and a welding head to perform the actual assembly operation. According to the instructions of the control module, the robot arm controls the pressing operation of the crimping stud to ensure that the stud is accurately pressed into the crimping hole. At the same time, when processing the motherboard module, the robot arm is responsible for passing the crimping stud through the mounting hole of the motherboard module to complete the assembly task. After the assembly is completed, fixed welding is achieved through the welding head. The control module includes an acquisition unit, a judgment unit, a processing unit, and an adjustment unit. Among them, the acquisition unit acquires the working plane and crimping hole information, and also controls the robot arm to place the shell on the working plane. The judgment unit uses a horizontal array camera to collect the image of the shell after crimping, and judges whether the crimping studs are flush to ensure the crimping accuracy. When the judgment unit confirms that the crimping studs are flush, the processing unit controls the robotic arm to clamp the motherboard module and perform stud punching operations. At the same time, the processing unit also collects the upper surface image of the motherboard module, calculates the average gap between the crimping studs and the installation holes, and compares historical data in combination with characteristic parameters such as the stud diameter, so as to accurately determine the amount of solder used and control the welding head for welding. The adjustment unit is responsible for collecting welding position image data and judging whether there are defects in the welding process. If there are defects, the welding head is controlled to be re-welded to ensure the quality of the final assembly.

[0063] It is understandable that the problems existing in the traditional LiDAR assembly are solved through precise image acquisition and analysis, intelligent robot arm control, and optimized solder quantity control. Through image acquisition and crimping hole positioning, the accurate installation of the crimping studs is ensured, avoiding the problems of misalignment and incomplete installation. The tin quantity control during the welding process is based on real-time image data, which avoids poor welding and improves the consistency and reliability of welding quality. The real-time detection of welding defects and the repair welding mechanism ensure the final quality of the product and improve the assembly efficiency and stability of the LiDAR. It improves production efficiency, effectively reduces manual intervention, and improves the automation level of the entire assembly process.

[0064] In some embodiments of the present application, when the acquisition unit determines the running path of the robot arm for clamping the crimping stud based on the search model according to the crimping hole position, it includes:

[0065] S1: The acquisition unit establishes a three-dimensional coordinate system with the crimping hole position, defines the open set and the closed set and initializes the cost function value. The cost function value is the path length. The open set stores the nodes to be explored and initially only contains the starting point. The closed set stores the nodes that have been explored and is initially empty.

[0066] S2: gradually select the node expansion path with the minimum cost from the open set, and gradually approach the coordinates of the terminal position;

[0067] S3: Explore all possible path directions of the current node and update the path cost. If the neighbor node is not in the open set, add the neighbor node to the open set and record the parent node of the neighbor node. If the neighbor node is in the open set but the new path cost is smaller, update the parent node and path cost.

[0068] S4: Repeat step S3 until the current node coincides with the end point position coordinates, and trace back from the end point position coordinates to the parent node until the start point position coordinates. The acquisition unit uses this path as the running path.

[0069] Specifically, the acquisition unit first defines a three-dimensional coordinate system according to the crimping hole position, which is the basis of path planning. In this coordinate system, the starting position of the robot arm is the current position of the robot arm, and the end position is the target position of the crimping stud. The cost function (path length) is used to measure the path quality from the starting point to the target position. The smaller the cost function, the better the path. In order to optimize the path search, the open set (nodes to be explored) and the closed set (nodes that have been explored) are used. Initially, the open set only contains the starting point, and the closed set is empty. Select the node with the lowest cost from the open set and expand the path, gradually approaching the end point. By selecting the path with the lowest cost, the total length of the path is reduced, thereby improving the movement efficiency of the robot arm. For the current node, explore all possible neighbor nodes (that is, the surrounding reachable positions of the current node) and calculate the new path cost. If the neighbor node is not in the open set, add it to the open set and record the parent node; if the neighbor node is already in the open set, but the new path cost is found to be smaller, update the parent node and path cost of the neighbor node. Repeat step 4 until the end point is found. When the end position is found, trace back to the parent node from the end position until it returns to the starting point, forming a complete path. This path is the optimal running path of the robot from the starting point to the end point.

[0070] It is understandable that by introducing heuristic search and cost function optimization path planning, the operation path of the robot arm can be dynamically determined according to the precise position of the crimping hole. It ensures that the robot arm can complete the installation of the crimping studs in the shortest and safest path, improving the work efficiency and accuracy. By using the strategies of open sets and closed sets, the path can be flexibly selected to avoid redundant path calculations and invalid node expansion. By optimizing path planning, the movement time of the robot arm is reduced, the energy consumption is reduced, the path conflict and interference of the robot arm are avoided, and the automation level and stability of the entire assembly process are improved.

[0071] In some embodiments of the present application, when the judgment unit collects the image of the shell after crimping, it includes: setting a line laser, the line laser obliquely irradiates the shell surface, and the line laser moves evenly from top to bottom when the horizontal array camera collects the image of the shell after crimping, and the movement speed of the line laser is proportional to the collection frequency of the horizontal array camera.

[0072] Specifically, a line laser is a laser that can generate a thin and long beam of light, which can form a line of light when irradiated onto the target surface. By irradiating the line laser obliquely onto the surface of the shell after crimping, the laser line can illuminate the surface of the crimped stud, providing a reference light source, thereby increasing the brightness of the shell and the crimped stud in the camera imaging. The line laser moves from top to bottom in a uniform manner when irradiating the shell surface. In order to ensure the accuracy of image acquisition, the movement speed of the line laser is proportional to the acquisition frequency of the horizontal array camera. Each time the camera captures a frame of image, the line laser has moved a certain distance along the surface of the crimped stud, ensuring that the position of the laser line in the image is uniform. The synchronized movement and acquisition process enables the line laser in the image to accurately display the surface conditions. When the horizontal array camera is used to capture the surface image of the shell after crimping, the line laser will appear in the image. Due to the oblique irradiation of the line laser, the highlighted line laser in the image will only display the surface of the shell and the crimped stud, and the excess line laser will form a fault to effectively distinguish the boundary position.

[0073] It is understandable that by combining the synchronous acquisition of line laser and camera, the accuracy of judging whether the crimping stud is flush can be improved. By uniformly moving the line laser on the shell surface, accurate surface scanning data can be provided, reducing the error of traditional methods that rely on manual or simple sensors. At the same time, the high degree of synchronization between the inclined irradiation of the line laser and the acquisition of the camera ensures a smooth transition of the laser line in the image, which can carefully capture any subtle changes in the surface and improve the accuracy and reliability of the detection.

[0074] In some embodiments of the present application, when the judgment unit judges whether the plane of the crimping stud is flush based on the shell image, it includes: the judgment unit obtains the upper boundary of the crimping stud and the upper boundary of the shell based on the shell image; when the upper boundary of the crimping stud is parallel to the upper boundary of the shell, the judgment unit determines that the plane of the crimping stud is flush; when the upper boundary of the crimping stud is not parallel to the upper boundary of the shell, the judgment unit determines that the plane of the crimping stud is not flush.

[0075] In some embodiments of the present application, when the processing unit compares the characteristic parameter with the historical splicing data and determines the solder amount of the welding joint according to the comparison result, the historical splicing data includes: the historical splicing data includes a plurality of historical characteristic parameters and a plurality of historical solder amounts, each historical characteristic parameter corresponds to a historical solder amount, and the historical characteristic parameters include a historical average gap and a historical crimping stud diameter;

[0076] Calculate the similarity between the feature parameter and each historical feature parameter;

[0077] When there is data in all historical characteristic parameters whose similarity with the characteristic parameters is greater than the similarity threshold, the historical solder consumption corresponding to the maximum similarity is used as the solder consumption;

[0078] When there is no data in all historical feature parameters whose similarity with the feature parameters is greater than the similarity threshold, data in all historical feature parameters whose similarity with the feature parameters is greater than q% and less than the similarity threshold are selected to establish an initial set, and the solder consumption is determined according to the historical solder consumption in the initial set.

[0079] In some embodiments of the present application, when the processing unit determines the solder usage based on the historical solder usage in the initial set, it includes: the processing unit determines the historical average usage based on all historical solder usages in the initial set; the processing unit classifies the data in the initial set whose historical solder usage is greater than the historical average usage into a first set; the data in the initial set whose historical solder usage is less than the historical average usage is classified into a second set, and determines the solder usage based on the historical average usage and the second set.

[0080] In some embodiments of the present application, when the processing unit determines the solder usage according to the historical average usage and the second set, it includes:

[0081] ;

[0082] Among them, Y represents the solder usage, Y0 represents the historical average usage, N represents the number of historical solder usage in the second set, and Yi represents the i-th historical solder usage in the second set.

[0083] Specifically, by analyzing the shell image, the upper boundary of the crimping stud and the upper boundary of the shell are obtained. If the upper boundary of the crimping stud is parallel to the upper boundary of the shell, it means that the plane of the crimping stud is flush with the shell and is judged to be flush; if the two are not parallel, they are judged to be not flush. The judgment of the flushness is based on the relative position of the crimping stud and the shell boundary. The image comparison is used to detect whether the boundary is tilted or offset to ensure the verticality and accuracy of the crimping stud. The processing unit compares the characteristic parameters (such as the average gap and the crimping stud diameter) with the historical splicing data. The historical splicing data includes multiple historical characteristic parameters and their corresponding historical solder usage. The processing unit selects the most appropriate solder usage by calculating the similarity between the characteristic parameters and each historical characteristic parameter. By comparing the similarity threshold with the characteristic parameters, when the similarity is greater than the set threshold, a group of historical data with the greatest similarity is selected to determine the solder usage; when the threshold is not reached, an initial set with a higher similarity is selected, and the solder usage is determined according to the solder usage in the set.

[0084] It is understandable that the plane of the crimped stud is ensured to be flush through image processing and historical data comparison, and the determination of the amount of solder is optimized through multiple data comparisons. High-precision control is achieved through image analysis, avoiding assembly defects caused by uneven studs. The precise control of the amount of solder is adaptively adjusted through similarity analysis and historical data comparison, which improves the accuracy of the welding process and ensures the stability and consistency of each welding. Intelligent adjustment of welding parameters based on real-time data reduces manual intervention and improves the automation and overall quality of lidar equipment assembly.

[0085] In some embodiments of the present application, when the adjustment unit determines whether there is a welding defect according to the welding position image data, the adjustment unit obtains the defect area of ​​the welding surface according to the welding position image, and the defects include pits and pores; the adjustment unit compares the defect area with the area threshold, and determines whether there is a welding defect according to the comparison result;

[0086] Specifically, when the defect area is greater than the area threshold, the adjustment unit determines that a welding defect exists and controls the welding head to perform repair welding; when the defect area is less than or equal to the area threshold, the adjustment unit determines that there is no welding defect.

[0087] In some embodiments of the present application, when the adjustment unit determines that there is a welding defect and controls the welding head to perform repair welding, the adjustment unit includes: obtaining the defect proportion according to the defect area, determining the adjustment coefficient according to the defect proportion, obtaining the product of the adjustment coefficient and the amount of solder, and using the product as the amount of repair welding; the adjustment unit compares the defect proportion with the first proportion and the second proportion respectively, and determines the adjustment coefficient according to the comparison result, and the first proportion is less than the second proportion;

[0088] Specifically, when the defect proportion is less than or equal to the first proportion, the adjustment unit determines the adjustment coefficient as the first adjustment coefficient; when the defect proportion is greater than the first proportion and less than or equal to the second proportion, the adjustment unit determines the adjustment coefficient as the second adjustment coefficient; when the defect proportion is greater than the second proportion, the adjustment unit determines the adjustment coefficient as the third adjustment coefficient; the first adjustment coefficient is less than the second adjustment coefficient, the second adjustment coefficient is less than the third adjustment coefficient, and the adjustment coefficient value range is [0.1-0.5].

[0089] It can be understood that after determining that there is a welding defect and determining the amount of repair welding, it also includes summing the repair welding amount with the previously determined solder amount to obtain the final amount, combining the final amount with the current characteristic parameters, and storing the combined amount in the historical splicing data. When applied next time, the current characteristic parameters and the final amount will be run as historical characteristic parameters and historical solder amounts.

[0090] It is understandable that defect repair in the automated welding process is achieved by analyzing the area of ​​welding defects and dynamically adjusting the amount of repair welding according to the size of the defects. By setting a reasonable area threshold and adjustment coefficient range, the amount of repair welding can be intelligently determined in the face of defects of different degrees to ensure the stability and high quality of the welding operation. Compared with the traditional method of fixing the amount of solder, it can adapt to different welding defects more flexibly, avoid excessive or insufficient use of solder, optimize the welding process, reduce material waste, and improve production efficiency and cost-effectiveness. It improves the consistency and accuracy of welding quality, reduces manual intervention, and improves the reliability of automated assembly.

[0091] In the above-mentioned embodiment, the automation and precise control of the laser radar adaptive rapid assembly system are realized by combining the acquisition module, the mechanical arm, and the control module. The acquisition unit accurately acquires the working plane and the crimping hole position through the vertical array camera, and provides accurate positioning information for the subsequent crimping stud installation, avoiding the common problems of misalignment or incomplete installation in traditional manual operations. The mechanical arm controls the downward pressure of the crimping stud according to the acquired data, ensures the stable installation of the crimping stud and determines whether it is flush, which effectively improves the accuracy of the assembly process. The processing unit in the control module optimizes the coordination between the mainboard module and the crimping stud through real-time image data analysis, and accurately calculates the amount of solder in combination with historical data to ensure the stability and consistency of the welding process. Through the acquisition and analysis of the welding position image data, the welding defects are judged and repaired, the welding quality is guaranteed, the efficiency and reliability of the laser radar assembly are improved, and various defects in the traditional assembly process are solved, and the overall performance and stability of the product are improved.

[0092] In another preferred embodiment based on the above embodiment, refer to Figure 2 As shown, this embodiment provides an adaptive rapid assembly method for a laser radar, which is applied to the adaptive rapid assembly system for the laser radar, including:

[0093] S100: collecting the working plane and controlling the robot arm to place the shell on the working plane, collecting the crimping hole positions on the shell surface, determining the running path of the robot arm for clamping the crimping stud based on the search model according to the crimping hole positions, and controlling the robot arm to press down to press the crimping stud into the crimping hole positions;

[0094] S200: collecting an image of the shell after crimping based on a horizontal array camera, and judging whether the plane of the crimped stud is flush according to the shell image;

[0095] S300: When it is determined that the plane of the crimping stud is flush, control the robot arm to clamp the motherboard module and pass the crimping stud through the installation hole of the motherboard module; collect the image data of the upper surface of the motherboard module, obtain the average gap between the installation hole and the crimping stud according to the upper surface image data, use the average gap and the crimping stud diameter as characteristic parameters, compare the characteristic parameters with the historical splicing data, determine the solder amount of the welding head according to the comparison result, and control the welding head to fix the motherboard module according to the solder amount;

[0096] S400: Collect welding position image data, determine whether there is a welding defect based on the welding position image data, and when it is determined that there is a welding defect, control the welding head to perform repair welding to complete the lens splicing.

[0097] It can be understood that the automation and precise control of the laser radar adaptive rapid assembly system are realized by combining the acquisition module, the robotic arm, and the control module. The acquisition unit accurately acquires the working plane and the crimping hole position through a vertical array camera, providing accurate positioning information for the subsequent crimping stud installation, avoiding the common problems of misalignment or incomplete installation in traditional manual operations. The robotic arm controls the downward pressure of the crimping stud according to the acquired data, ensures the stable installation of the crimping stud and determines whether it is flush, effectively improving the accuracy of the assembly process. The processing unit in the control module optimizes the coordination between the mainboard module and the crimping stud through real-time image data analysis, and accurately calculates the amount of solder based on historical data to ensure the stability and consistency of the welding process. Through the acquisition and analysis of welding position image data, welding defects are judged and repaired, the welding quality is guaranteed, the efficiency and reliability of laser radar assembly are improved, various defects in the traditional assembly process are solved, and the overall performance and stability of the product are improved.

[0098] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems or computer program products. Therefore, the present application may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present application may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0099] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems) and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0100] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0101] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the present invention can still be modified or replaced by equivalents. Any modification or equivalent replacement that does not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. An adaptive rapid assembly system for laser radar, characterized in that: include: Acquisition module, including a horizontal array camera and a vertical array camera; A robotic arm, provided with gripping claws and a welding head; A control module, electrically connected to the acquisition module and the robotic arm, the control module comprising an acquisition unit, a judgment unit, a processing unit and an adjustment unit; The acquisition unit is configured to acquire a working plane and control the mechanical arm to place the shell on the working plane. The acquisition unit is also configured to acquire the crimping hole positions on the surface of the shell, determine the running path of the mechanical arm for clamping the crimping stud based on the search model according to the crimping hole positions, and control the mechanical arm to press down to press the crimping stud into the crimping hole positions; The judging unit is configured to collect an image of the shell after crimping based on the horizontal array camera, and judge whether the plane of the crimping stud is flat according to the shell image; When the judgment unit determines that the plane of the crimping stud is flush, the processing unit is configured to control the mechanical arm to clamp the mainboard module and pass the crimping stud through the mounting hole of the mainboard module; the processing unit is also configured to collect the upper surface image data of the mainboard module, obtain the average gap between the mounting hole and the crimping stud according to the upper surface image data, use the average gap and the crimping stud diameter as characteristic parameters, compare the characteristic parameters with the historical splicing data, determine the solder amount of the welding head according to the comparison result, and control the welding head to fix the mainboard module according to the solder amount; The adjustment unit is configured to collect welding position image data, determine whether there is a welding defect according to the welding position image data, and control the welding head to perform repair welding to complete the lens splicing when it is determined that there is a welding defect; When the acquisition unit determines the running path of the mechanical arm for clamping the crimping stud based on the search model according to the crimping hole position, it includes: S1: The acquisition unit establishes a three-dimensional coordinate system with the crimping hole position, defines an open set and a closed set, and initializes a cost function value, wherein the cost function value is the path length. The open set stores nodes to be explored and initially only contains the starting point, and the closed set stores nodes that have been explored and is initially empty; S2: gradually selecting a node expansion path with the minimum cost from the open set, and gradually approaching the coordinates of the terminal position; S3: Explore all possible path directions of the current node, update the path cost, and if the neighbor node is not in the open set, add the neighbor node to the open set and record the parent node of the neighbor node; if the neighbor node is in the open set but the new path cost is smaller, update the parent node and the path cost; S4: repeating step S3 until the current node coincides with the end point position coordinates, tracing back to the parent node from the end point position coordinates to the start point position coordinates, and the acquisition unit uses this path as the running path; When the judging unit collects the image of the housing after crimping, it includes: A line laser is set, the line laser obliquely illuminates the shell surface, and the line laser moves evenly from top to bottom when the horizontal array camera collects the shell image after crimping, and the movement speed of the line laser is proportional to the collection frequency of the horizontal array camera.

2. The adaptive rapid assembly system for laser radar according to claim 1, characterized in that: When the judging unit judges whether the plane of the crimping stud is flush according to the housing image, it includes: The judging unit acquires the upper boundary of the crimping stud and the upper boundary of the shell according to the shell image; When the upper boundary of the crimping stud is parallel to the upper boundary of the housing, the judging unit judges that the planes of the crimping stud are flush; When the upper boundary of the crimping stud is not parallel to the upper boundary of the housing, the judging unit determines that the planes of the crimping stud are not flush.

3. The adaptive rapid assembly system for laser radar according to claim 2, characterized in that: When the processing unit compares the characteristic parameter with the historical splicing data and determines the amount of solder used for the welding head according to the comparison result, it includes: The historical splicing data includes a plurality of historical characteristic parameters and a plurality of historical solder usages, each of the historical characteristic parameters corresponds to a historical solder usage, and the historical characteristic parameters include a historical average gap and a historical crimping stud diameter; Calculating the similarity between the characteristic parameter and each historical characteristic parameter; When there is data in all the historical characteristic parameters whose similarity with the characteristic parameter is greater than a similarity threshold, the historical solder amount corresponding to the maximum similarity is used as the solder amount; When there is no data in all the historical characteristic parameters whose similarity with the characteristic parameters is greater than a similarity threshold, data in all the historical characteristic parameters whose similarity with the characteristic parameters is greater than q% and less than the similarity threshold are selected to establish an initial set, and the solder usage is determined based on the historical solder usage in the initial set.

4. The adaptive rapid assembly system for laser radar according to claim 3, characterized in that: When the processing unit determines the solder usage according to the historical solder usage in the initial set, it includes: The processing unit determines a historical average usage according to all historical solder usages in the initial set; The processing unit classifies the data in the initial set whose historical solder usage is greater than the historical average usage into a first set; classifies the data in the initial set whose historical solder usage is less than the historical average usage into a second set, and determines the solder usage according to the historical average usage and the second set.

5. The adaptive rapid assembly system for laser radar according to claim 4, characterized in that: When the processing unit determines the solder usage according to the historical average usage and the second set, it includes: ； Among them, Y represents the solder usage, Y0 represents the historical average usage, N represents the number of historical solder usage in the second set, and Yi represents the i-th historical solder usage in the second set.

6. The adaptive rapid assembly system for laser radar according to claim 5, characterized in that: When the adjustment unit determines whether there is a welding defect according to the welding position image data, it includes: The adjustment unit obtains the defect area of ​​the welding surface according to the welding position image, and the defects include pits and pores; the adjustment unit compares the defect area with the area threshold, and determines whether there is a welding defect according to the comparison result; When the defect area is greater than the area threshold, the adjustment unit determines that there is a welding defect and controls the welding head to perform repair welding; when the defect area is less than or equal to the area threshold, the adjustment unit determines that there is no welding defect.

7. The adaptive rapid assembly system for laser radar according to claim 6, characterized in that: When the adjustment unit determines that there is a welding defect and controls the welding head to perform repair welding, it includes: The adjustment unit obtains the defect ratio according to the defect area, determines the adjustment coefficient according to the defect ratio, obtains the product of the adjustment coefficient and the solder amount, and uses the product as the soldering amount; The adjustment unit compares the defect proportion with the first proportion and the second proportion respectively, and determines an adjustment coefficient according to the comparison result, wherein the first proportion is smaller than the second proportion; When the defect proportion is less than or equal to the first proportion, the adjustment unit determines that the adjustment coefficient is the first adjustment coefficient; when the defect proportion is greater than the first proportion and less than or equal to the second proportion, the adjustment unit determines that the adjustment coefficient is the second adjustment coefficient; when the defect proportion is greater than the second proportion, the adjustment unit determines that the adjustment coefficient is the third adjustment coefficient; the first adjustment coefficient is less than the second adjustment coefficient, the second adjustment coefficient is less than the third adjustment coefficient, and the adjustment coefficient value range is [0.1-0.5].

8. An adaptive rapid assembly method for a laser radar, applied to the adaptive rapid assembly system for a laser radar as claimed in any one of claims 1 to 7, characterized in that: include: Collecting a working plane and controlling a mechanical arm to place the shell on the working plane, collecting crimping hole positions on the shell surface, determining a running path for the mechanical arm to clamp the crimping stud based on the search model according to the crimping hole positions, and controlling the mechanical arm to press down to press the crimping stud into the crimping hole positions; Based on the horizontal array camera, an image of the shell after crimping is collected, and according to the shell image, whether the plane of the crimping stud is flush; When it is determined that the plane of the crimping stud is flush, the robot arm is controlled to clamp the mainboard module and pass the crimping stud through the mounting hole of the mainboard module; the upper surface image data of the mainboard module is collected, and the average gap between the mounting hole and the crimping stud is obtained according to the upper surface image data, and the average gap and the crimping stud diameter are used as characteristic parameters, and the characteristic parameters are compared with the historical splicing data, and the amount of solder of the welding head is determined according to the comparison result, and the welding head is controlled to fix the mainboard module according to the amount of solder; Collect welding position image data, determine whether there is a welding defect based on the welding position image data, and control the welding head to perform repair welding to complete the lens splicing when it is determined that there is a welding defect.

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