A workpiece processing method and related device

Abstract

The present application discloses a workpiece processing method and related devices. The workpiece processing method is implemented using a target processing machine tool, and the target processing machine tool includes a ram and a plurality of displacement detection sensors disposed on the ram. The workpiece processing method includes: obtaining reference position information of a workpiece to be processed in space and determining target dimension data set for the workpiece to be processed; determining a processing method matching the workpiece to be processed based on the reference position information and the target dimension data; processing the workpiece to be processed using the processing method and obtaining real-time dimension data of the workpiece to be processed detected by the displacement detection sensors during the processing; correcting the processing method based on the real-time dimension data until the real-time dimension data is consistent with the target dimension data, thereby obtaining a target workpiece after processing. By the above method, the present application can improve the precision of workpiece processing.

Description

Technical Field

[0001] This application relates to the technical field of machine tool processing, and particularly relates to a workpiece processing method and related devices. Background Art

[0002] During the machine tool processing, in order to ensure the processing accuracy, it is necessary to measure the workpiece to be processed. Currently, the main measurement method is off-line measurement. When using this method to measure the workpiece, it is easy to cause time loss due to the stop for detection, and there will inevitably be a secondary positioning error when the workpiece is unloaded for measurement and then processed continuously, resulting in a large error in the finally processed workpiece.

[0003] In view of this, how to propose a workpiece processing method with higher processing accuracy has become an urgent problem to be solved. Summary of the Invention

[0004] The main technical problem to be solved by this application is to provide a workpiece processing method and related devices, which can improve the processing accuracy of the workpiece.

[0005] To solve the above technical problem, one technical solution adopted by this application is: to provide a workpiece processing method, which is realized by using a target processing machine tool. The target processing machine tool includes a ram and a plurality of displacement detection sensors arranged on the ram. The workpiece processing method includes: obtaining the reference position information of the workpiece to be processed in space and determining the target dimension data set for the workpiece to be processed; based on the reference position information and the target dimension data, determining the processing method matching the workpiece to be processed; using the processing method to process the workpiece to be processed, and obtaining the real-time dimension data of the workpiece to be processed detected by the displacement detection sensors during the processing; based on the real-time dimension data, correcting the processing method until the real-time dimension data is consistent with the target dimension data, and obtaining the target workpiece after processing.

[0006] To solve the above technical problem, another technical solution adopted by this application is: to provide an electronic device, including a memory and a processor coupled to each other. Program instructions are stored in the memory, and the processor is used to execute the program instructions to implement the workpiece processing method mentioned in the above technical solution.

[0007] To solve the above technical problem, another technical solution adopted by this application is: to provide a computer-readable storage medium, including: program instructions capable of being run by a processor, and the program instructions are used to implement the workpiece processing method mentioned in the above technical solution.

[0008] To solve the above technical problems, another technical solution adopted by this application is: to provide a target processing machine tool, including: a ram and a plurality of displacement detection sensors disposed on the ram, and the electronic device mentioned in the above technical solution, wherein the electronic device is coupled to the displacement detection sensors.

[0009] The beneficial effect of this application is: different from the prior art, the workpiece processing method proposed by this application determines the processing method matched with the workpiece to be processed according to the reference position information of the workpiece to be processed and the target dimension data determined for the workpiece to be processed by obtaining the reference position information of the workpiece to be processed and the target dimension data. During the process of processing the workpiece to be processed using the above processing method, the real-time dimension data of the workpiece to be processed detected by the displacement detection sensors is obtained in real time, and the processing method matched with the workpiece to be processed is corrected in real time according to the real-time dimension data, so as to improve the processing accuracy of the workpiece to be processed. Description of the Drawings

[0010] To more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts. Among them:

[0011] Figure 1 is a flowchart of an implementation manner of the workpiece processing method of this application;

[0012] Figure 2 is Figure 1 a flowchart of another implementation manner corresponding to step S101 in;

[0013] Figure 3 is Figure 2 a flowchart of another implementation manner corresponding to step S201 in;

[0014] Figure 4 is Figure 2 a flowchart of another implementation manner corresponding to step S203 in;

[0015] Figure 5 is Figure 1 a flowchart of another implementation manner corresponding to step S103 in;

[0016] Figure 6 is a structural diagram of an implementation manner of the electronic device of this application;

[0017] Figure 7 is a structural diagram of an implementation manner of the computer-readable storage medium of this application. Detailed Embodiments

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments, and different embodiments can be adaptively combined. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0019] Please refer to Figure 1 , Figure 1 which is a schematic flowchart of an implementation manner of the workpiece processing method of the present application. The above workpiece processing method is implemented by using a target processing machine tool. The target processing machine tool includes a ram and a plurality of displacement detection sensors arranged on the ram. The workpiece processing method includes:

[0020] S101: Obtain the reference position information of the workpiece to be machined in space, and determine the target dimension data set for the workpiece to be machined.

[0021] In one implementation manner, in order to achieve precise machining of the workpiece to be machined, obtain the reference position information of the workpiece to be machined in space. And set the target dimension data corresponding to the workpiece to be machined.

[0022] Specifically, construct the machine tool coordinate system corresponding to the target processing machine tool, use the sensors on the target processing machine tool to detect the position of the workpiece to be machined, and obtain the reference position information of the workpiece to be machined in the machine tool coordinate system. Determine the target dimension data of the target workpiece obtained after machining the workpiece to be machined, that is, the target dimension data is preset according to the dimensions at each position on the target workpiece.

[0023] S102: Based on the reference position information and the target dimension data, determine the machining method matching the workpiece to be machined.

[0024] In one implementation manner, generate a machining method matching the workpiece to be machined according to the reference position information corresponding to the workpiece to be machined and the preset target dimension data, so that the workpiece to be machined is machined by this machining method to obtain the corresponding target workpiece.

[0025] In one implementation scenario, based on the reference position information and the target dimension data, obtain the machining strokes at each position of the workpiece to be machined. Obtain the tool data of the target processing machine tool, and generate a machining method matching the workpiece to be machined based on the machining strokes and the tool data.

[0026] Specifically, according to the reference position information of the workpiece to be processed and the target dimension data corresponding to the target workpiece, determine the machining strokes at various positions on the workpiece to be processed, so that after machining the corresponding machining strokes at various positions on the workpiece to be processed, the target workpiece is obtained. Further, to improve the machining accuracy, obtain the tool data corresponding to the machining tool of the target machining tool, and generate a machining method matching the workpiece to be processed according to the machining stroke and the tool data. Among them, the above tool data includes tool length, tool radius, etc., and the machining method is used to control the movement of the machining tool to perform cutting, grinding, etc. on the workpiece to be processed.

[0027] In another embodiment, based on the reference position information and the target dimension data, obtain the machining strokes of the workpiece to be processed at various positions. To further improve the machining accuracy, obtain the tool data and machining compensation data of the target machining tool, and generate a machining method matching the workpiece to be processed based on the machining stroke, the tool data, and the machining compensation data.

[0028] Specifically, the above machining compensation data is obtained by controlling the machining tool of the target machining tool to perform trial cutting on the workpiece to be processed or other reference workpieces, and the specific process will not be elaborated in detail here.

[0029] S103: Use the machining method to machine the workpiece to be processed, and obtain the real-time dimension data of the workpiece to be processed detected by the displacement detection sensor during the machining process.

[0030] In one embodiment, execute the machining method determined in step S102 to machine the workpiece to be processed, and during the machining process, control the ram of the target machining tool to drive the displacement detection sensor to move to the corresponding position, so as to use the displacement detection sensor to detect the real-time dimension data of the workpiece to be processed in real time.

[0031] S104: Modify the machining method based on the real-time dimension data until the real-time dimension data is consistent with the target dimension data, and obtain the machined target workpiece.

[0032] In one embodiment, modify the machining method according to the obtained real-time dimension data until the real-time dimension data of the workpiece to be processed is consistent with the target dimension data, stop machining the workpiece to be processed, and obtain the machined target workpiece.

[0033] The workpiece processing method proposed in this application obtains the reference position information of the workpiece to be processed and determines the target dimension data set for the workpiece to be processed, so as to determine the processing method matching the workpiece to be processed according to the reference position information and the target dimension data. During the process of processing the workpiece to be processed using the above processing method, the real-time dimension data of the workpiece to be processed detected by the displacement detection sensor is obtained in real time, and the processing method matching the workpiece to be processed is corrected in real time according to the real-time dimension data, so as to improve the processing accuracy of the workpiece to be processed.

[0034] Please refer to Figure 2 , Figure 2 which Figure 1 is the schematic flow chart of another implementation manner corresponding to step S101 in

[0035] S201: Obtain the initial position information of the workpiece to be processed in space; wherein, the initial position information includes the positions of multiple reference points on the workpiece to be processed.

[0036] In one implementation manner, after the workpiece to be processed is set on the target machine tool, the position of the workpiece to be processed is detected to obtain the initial position information of the workpiece to be processed in the machine tool coordinate system.

[0037] Specifically, at least one target sensor is provided on the target machine tool, and the target sensor is used to collect data of multiple reference points on the workpiece to be processed to determine the positions of each reference point in the machine tool coordinate system. Thus, the positions of each reference point are used as the corresponding initial position information of the workpiece to be processed.

[0038] In one implementation scenario, the above target sensor is a displacement detection sensor provided on the ram, and by controlling the movement of the ram, the positions of each reference point are detected by using the displacement detection sensor; alternatively, the target sensor can also be other types of detection sensors, for example, a radar sensor, etc.

[0039] S202: Based on the initial position information, obtain the reference distances between each reference point on the workpiece to be processed and the calibration position; wherein, the calibration position is determined based on the position of the spindle of the target machine tool.

[0040] In one implementation manner, a pre-determined calibration position is obtained. In response to the initial position information including the positions of multiple reference points on the workpiece to be processed, the reference distances between each reference point and the calibration position are determined according to the positions of the multiple reference points on the workpiece to be processed. Among them, the above calibration position is determined according to the position of the spindle of the target machine tool.

[0041] In an implementation scenario, the workpiece to be processed is disposed on the carrier table of the target processing machine tool. The carrier table is matched with a corresponding rotating shaft, which is perpendicular to the bearing surface of the carrier table and parallel to the main shaft of the target processing machine tool. The above-mentioned calibration position is the position where the rotating shaft of the carrier table is located.

[0042] S203: Perform position calibration on the workpiece to be processed based on the reference distance, and obtain the reference position information of the workpiece to be processed after position calibration.

[0043] In an implementation manner, according to the reference distance, determine the target deviation between the workpiece to be processed and the calibration position. According to this target deviation, calibrate the position of the workpiece to be processed on the target processing machine tool. In response to completing the calibration of the workpiece to be processed, use the target sensor to collect data on the workpiece to be processed, so as to obtain the reference position information of the workpiece to be processed after position calibration.

[0044] In the above solution, according to the pre-determined calibration position and the positions of each reference point on the workpiece to be processed, perform position calibration on the workpiece to be processed, so that the target processing machine tool can process the workpiece to be processed after position calibration, improving the processing accuracy.

[0045] Please refer to Figure 3 , Figure 3 is Figure 2 the schematic flowchart of another implementation manner corresponding to step S201 in

[0046] S301: Obtain the current angle of the workpiece to be processed relative to the reflection displacement sensor, and determine the positions of multiple reference points corresponding to the current angle.

[0047] In an implementation manner, the target sensor provided on the target processing machine tool is a reflection displacement sensor, and the reflection displacement sensor is fixedly provided on the target processing machine tool. After the workpiece to be processed is disposed on the carrier table of the target processing machine tool, determine the current angle of the workpiece to be processed relative to the reflection displacement sensor at the current moment. Use the workpiece to be processed to collect data on multiple reference points on the workpiece to be processed at the current angle, so as to determine the positions of multiple reference points corresponding to the current angle.

[0048] Specifically, by using the reflection displacement sensor to emit a laser beam and receive the reflected light to determine the distance between each reference point corresponding to the current angle on the workpiece to be processed and the reflection displacement sensor, and determine the position of the corresponding reference point according to the above distance.

[0049] S302: Rotate the workpiece to be processed along the rotating shaft by a preset angle, adjust the current angle, and obtain the positions of multiple reference points corresponding to the adjusted current angle; wherein, the rotating shaft is parallel to the main shaft of the target processing machine tool.

[0050] In one embodiment, a corresponding rotating shaft is matched with the bearing table of the target processing machine tool. The rotating shaft is perpendicular to the bearing surface of the bearing table and parallel to the main shaft of the target processing machine tool. By controlling the bearing table to rotate around the rotating shaft by a preset angle, the angle of the workpiece to be processed on the bearing table is changed. Among them, the specific value of the above preset angle can be set according to the actual situation.

[0051] Specifically, the bearing table is rotated along the rotating shaft by a preset angle to adjust the current angle corresponding to the workpiece to be processed. The reflection displacement sensor is used to obtain the positions of multiple reference points corresponding to the adjusted current angle.

[0052] S303: Return to the step of rotating the workpiece to be processed along the rotating shaft by a preset angle, adjusting the current angle, and obtaining the positions of multiple reference points corresponding to the adjusted current angle until the positions of all reference points corresponding to the workpiece to be processed are obtained, and use the positions of all reference points as the initial position information.

[0053] In one embodiment, return to step S302 above, continue to control the bearing table to rotate along the rotating shaft by a preset angle to adjust the current angle corresponding to the workpiece to be processed, and use the reflection displacement sensor to obtain the positions of multiple reference points corresponding to the adjusted current angle until the positions of repeated reference points are obtained.

[0054] Furthermore, use the positions of all detected reference points as the initial position information.

[0055] In the above solution, the workpiece to be processed is set on the bearing table of the target processing machine tool, and by controlling the rotation of the bearing table, the positions of the corresponding reference points are obtained by changing the current angle corresponding to the workpiece to be processed.

[0056] Please refer to Figure 4 , Figure 4 is Figure 2 a schematic flowchart of another embodiment corresponding to step S203 in . Specifically, the implementation process of step S203 includes:

[0057] S401: Based on all reference distances, obtain the central axis of the current workpiece to be processed.

[0058] In one embodiment, according to the reference distances between the obtained reference points and the calibration positions, determine the central axis of the current workpiece to be processed.

[0059] Specifically, determine a first height and a second height of the workpiece to be processed relative to the surface of the carrier table. For the first height, fit a plurality of reference points at the first height according to the positions of the plurality of reference points corresponding to the workpiece to be processed at the first height, obtain a corresponding first circumscribed circle, and determine a first center of the first circumscribed circle. And, for the second height, fit a plurality of reference points at the second height according to the positions of the plurality of reference points corresponding to the workpiece to be processed at the second height, obtain a corresponding second circumscribed circle, and determine a second center of the second circumscribed circle. Take the straight line where the first center and the second center are located as the central axis of the current workpiece to be processed.

[0060] In another embodiment, the implementation process of the above step S401 may further include: determining a plurality of reference heights of the workpiece to be processed relative to the surface of the carrier table. For each reference height, fit a plurality of reference points at the reference height according to the positions of the plurality of reference points corresponding to the workpiece to be processed at the reference height, obtain a corresponding reference circumscribed circle, and determine a reference center of the reference circumscribed circle. Perform a linear fit on the reference centers corresponding to all reference heights to obtain the central axis of the current workpiece to be processed perpendicular to the surface of the carrier table. Among them, the number and specific values of the reference heights can be set according to the actual height of the workpiece to be processed.

[0061] S402: Based on the central axis and the rotation axis, obtain the target position deviation corresponding to the workpiece to be processed.

[0062] In one embodiment, obtain the target position deviation corresponding to the workpiece to be processed according to the position of the central axis corresponding to the workpiece to be processed and the position of the rotation axis.

[0063] Specifically, obtain the position difference between the position of the central axis and the position of the rotation axis, and take the position difference as the target position deviation corresponding to the workpiece to be processed.

[0064] S403: Based on the target position deviation, adjust the position of the workpiece to be processed to obtain the reference position information of the adjusted workpiece to be processed.

[0065] In one embodiment, use the determined target position deviation to adjust the position of the workpiece to be processed on the carrier table so that the central axis corresponding to the adjusted workpiece to be processed is consistent with the position of the rotation axis.

[0066] Further, use a target sensor to collect data of the workpiece to be processed after the position adjustment to obtain the reference position information of the workpiece to be processed. Among them, the specific acquisition method of the reference position information can refer to the corresponding above embodiments and will not be elaborated in detail here.

[0067] In another embodiment, the position of the workpiece to be processed on the carrier is adjusted by using the determined target position deviation, so that the position difference between the central axis corresponding to the adjusted workpiece to be processed and the rotation axis is less than a preset distance threshold. Wherein, the above preset distance threshold is obtained by estimation, or can also be inversely deduced by relevant technicians through multiple tests.

[0068] In the above solution, by obtaining the target position deviation and using the target position deviation to adjust the position of the workpiece to be processed on the carrier, the adjusted workpiece to be processed is located at a relatively central position on the carrier, which is convenient for subsequent processing and reduces the difficulty of processing the workpiece to be processed by the spindle tool.

[0069] Please refer to Figure 5 , Figure 5 is Figure 1 the schematic flow chart of another embodiment corresponding to step S103 in

[0070] S501: Drive the target processing machine tool to execute the processing mode.

[0071] In one embodiment, drive the target processing machine tool to execute the processing mode to process the workpiece to be processed.

[0072] S502: Use the first displacement detection sensor to detect the first detection data of the workpiece to be processed in the first direction, and use the second displacement detection sensor to detect the second detection data of the workpiece to be processed in the second direction; wherein, the first direction is perpendicular to the second direction, the plane where the first direction is located is parallel to the horizontal plane, and the plane where the second direction is located is perpendicular to the horizontal plane.

[0073] In one embodiment, a first displacement detection sensor and a second displacement detection sensor are arranged on the ram of the target processing machine tool, and the ram is used to drive the first displacement detection sensor and the second displacement detection sensor to move. Control the ram to move to the corresponding position to obtain the first detection data of the workpiece to be processed in the first direction by using the first displacement detection sensor and the second detection data of the workpiece to be processed in the second direction by using the second displacement detection sensor.

[0074] In one implementation scenario, the target processing machine tool is matched with corresponding X-axis and Z-axis, the X-axis is parallel to the horizontal plane, and the Z-axis is perpendicular to the horizontal plane. The positive direction of the X-axis is taken as the first direction, and the positive direction of the Z-axis is taken as the second direction. Control the ram to drive the first displacement detection sensor and the second displacement detection sensor to move to detect the first detection data of the workpiece to be processed in the first direction and the second detection data of the workpiece to be processed in the second direction.

[0075] In a specific application scenario, the first displacement detection sensor and the second displacement detection sensor described above are laser displacement detection sensors.

[0076] S503: Based on the first detection data and the second detection data, determine the real-time dimension data of each target point on the workpiece to be machined.

[0077] In an embodiment, in combination with the obtained first detection data and second detection data, determine the coordinate information of each target point on the current workpiece to be machined in the machine tool coordinate system. According to the coordinate information of each target point, determine the real-time dimension data of each target point.

[0078] Specifically, according to the coordinate information of each target point, determine the real-time distance of each target point from the central axis of the workpiece to be machined, and use the corresponding real-time distance of each target point as the real-time dimension data.

[0079] In the above solution, by using the first displacement detection sensor and the second displacement detection sensor during the machining process to obtain the real-time dimension data corresponding to each target point, the real-time monitoring of the workpiece to be machined during the machining process is realized, which helps to adjust the machining process according to the real-time dimension data subsequently, thereby improving the machining accuracy.

[0080] In yet another embodiment, after determining the real-time dimension data of the workpiece to be machined during the machining process through the above corresponding embodiment, the specific implementation process of step S104 further includes: based on the target dimension data, determine the target position information corresponding to each target point.

[0081] Specifically, according to the target dimension data, determine the target distance between each target point on the machined target workpiece and the central axis of the target workpiece, and use the target distance as the target position information corresponding to the target point.

[0082] Further, in response to the real-time dimension data of all target points being consistent with the corresponding target position information, obtain the machined target workpiece.

[0083] Specifically, for each target point corresponding to the workpiece to be processed, obtain the comparison relationship between the corresponding target distance and the corresponding real-time distance. In response to the target distance being consistent with the corresponding real-time distance, correct the processing method so that the subsequent processing process no longer processes this target point. Alternatively, in response to the target distance being less than the corresponding real-time distance, drive the target processing machine tool to execute the processing method to process the corresponding target point. Or, in response to the target processing machine tool completing the processing of the corresponding target point and the target distance still being less than the corresponding real-time distance, correct the processing method to drive the target processing machine tool to continue processing the corresponding target point until the corresponding target distance is consistent with the real-time distance. By correcting the processing method according to the target size data and the real-time size data, the flexibility of the target processing machine tool in processing the workpiece to be processed is improved.

[0084] Please refer to Figure 6 , Figure 6 FIG. is a schematic structural diagram of an embodiment of the electronic device of the present application. The electronic device includes: a memory 10 and a processor 20 that are coupled to each other. Program instructions are stored in the memory 10, and the processor 20 is configured to execute the program instructions to implement the method described in any of the above embodiments. Specifically, the electronic device includes, but is not limited to: desktop computers, laptop computers, tablet computers, servers, etc., which are not limited herein. In addition, the processor 20 may also be referred to as a CPU (Center Processing Unit, central processing unit). The processor 20 may be an integrated circuit chip with signal processing capabilities. The processor 20 may also be a general-purpose processor, a digital signal processor (Digital Signal Processor, DSP), an application specific integrated circuit (Application Specific Integrated Circuit, ASIC), a field programmable gate array (Field-Programmable Gate Array, FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc. Additionally, the processor 20 may be implemented jointly by integrated circuit chips.

[0085] Please refer to Figure 7 , Figure 7 FIG. is a schematic structural diagram of an embodiment of the computer-readable storage medium of the present application. A program instruction 40 capable of being run by a processor is stored on the computer-readable storage medium 30, and when the program instruction 40 is executed by the processor, the method described in any of the above embodiments is implemented.

[0086] In several embodiments provided in the present application, it should be understood that the disclosed methods and apparatuses can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For example, the division of modules or units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces. The indirect couplings or communication connections of the apparatuses or units can be in electrical, mechanical or other forms.

[0087] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0088] In addition, in each embodiment of the present application, the functional units can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit. The above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.

[0089] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor to execute all or part of the steps of the methods in each embodiment of the present application. The foregoing storage medium includes: USB flash drives, mobile hard disks, read-only memories (ROM, Read-Only Memory), random access memories (RAM, Random Access Memory), magnetic disks or optical disks, and other media that can store program codes.

[0090] In yet another embodiment, the present application also proposes a target processing machine tool. The processing machine tool includes a ram and a plurality of displacement detection sensors provided on the ram, and an Figure 6 electronic device as shown, and the electronic device is coupled to the ram and the displacement detection sensors.

[0091] The above are only the embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of the present application.

Claims

1. A workpiece processing method, characterized in that, The workpiece processing method is implemented by using a target processing machine tool, which includes a ram and a plurality of displacement detection sensors arranged on the ram. The workpiece processing method includes: Obtaining reference position information of a workpiece to be processed in space and determining target dimension data set for the workpiece to be processed; Determining a processing method matching the workpiece to be processed based on the reference position information and the target dimension data; Processing the workpiece to be processed by using the processing method and obtaining real-time dimension data of the workpiece to be processed detected by the displacement detection sensors during the processing; Correcting the processing method based on the real-time dimension data until the real-time dimension data is consistent with the target dimension data, and obtaining a target workpiece after processing; A first displacement detection sensor and a second displacement detection sensor are arranged on the ram of the target processing machine tool. The ram is used to drive the first displacement detection sensor and the second displacement detection sensor to move. The step of processing the workpiece to be processed by using the processing method and obtaining the real-time dimension data of the workpiece to be processed detected by the displacement detection sensors during the processing includes: driving the target processing machine tool to execute the processing method; using the first displacement detection sensor to detect first detection data of the workpiece to be processed in a first direction and using the second displacement detection sensor to detect second detection data of the workpiece to be processed in a second direction; wherein, the first direction is perpendicular to the second direction, the plane where the first direction is located is parallel to the horizontal plane, and the plane where the second direction is located is perpendicular to the horizontal plane; determining the real-time dimension data of each target point on the workpiece to be processed based on the first detection data and the second detection data; Wherein, the step of obtaining the reference position information of the workpiece to be processed in space includes: obtaining the initial position information of the workpiece to be processed in space; wherein, the initial position information includes the positions of a plurality of reference points on the workpiece to be processed; based on the initial position information, obtaining the reference distances between the respective reference points on the workpiece to be processed and a calibration position; wherein, the calibration position is determined based on the position of the spindle of the target processing machine tool; correcting the position of the workpiece to be processed based on the reference distances and obtaining the reference position information of the workpiece to be processed after position correction; Among them, the target processing machine tool includes a reflection displacement sensor, and obtaining the initial position information of the workpiece to be processed in space includes: obtaining the current angle of the workpiece to be processed relative to the reflection displacement sensor, and determining the positions of a plurality of the reference points corresponding to the current angle; rotating the workpiece to be processed by a preset angle along the rotation axis, adjusting the current angle, and obtaining the positions of a plurality of the reference points corresponding to the adjusted current angle; wherein, the rotation axis is parallel to the spindle of the target processing machine tool; returning to the step of rotating the workpiece to be processed by a preset angle along the rotation axis, adjusting the current angle, and obtaining the positions of a plurality of the reference points corresponding to the adjusted current angle until the positions of all the reference points corresponding to the workpiece to be processed are obtained, and taking the positions of all the reference points as the initial position information; Among them, performing position correction on the workpiece to be processed based on the reference distance and obtaining the reference position information of the workpiece to be processed after position correction includes: obtaining the central axis of the current workpiece to be processed; obtaining the target position deviation corresponding to the workpiece to be processed based on the central axis and the rotation axis; adjusting the position of the workpiece to be processed based on the target position deviation, and obtaining the reference position information of the adjusted workpiece to be processed; Among them, obtaining the central axis of the current workpiece to be processed includes: determining a plurality of reference heights of the workpiece to be processed relative to the surface of the carrier; for each reference height, obtaining a corresponding reference circumcircle according to the positions of a plurality of reference points of the workpiece to be processed at the reference height, and determining the reference center of the reference circumcircle; performing linear fitting on the reference centers corresponding to all the reference heights to obtain the central axis.

2. The workpiece processing method according to claim 1, characterized in that, Performing correction on the processing method based on the real-time dimension data until the real-time dimension data is consistent with the target dimension data to obtain the processed target workpiece includes: Determining the target position information corresponding to each of the target points based on the target dimension data; In response to the real-time dimension data of all the target points being consistent with the corresponding target position information, obtaining the processed target workpiece.

3. The workpiece processing method according to claim 1, characterized in that Determining a processing method matching the workpiece to be processed based on the reference position information and the target dimension data includes: Obtaining the processing strokes of the workpiece to be processed at each position based on the reference position information and the target dimension data; Obtaining the tool data and processing compensation data of the target processing machine tool, and generating a processing method matching the workpiece to be processed based on the processing strokes, the tool data, and the processing compensation data.

4. An electronic device, characterized in that, Including a mutually coupled memory and a processor, wherein program instructions are stored in the memory, and the processor is configured to execute the program instructions to implement the workpiece processing method according to any one of claims 1-3.

5. A computer-readable storage medium, characterized in that, Including: Storing program instructions that can be run by a processor, and the program instructions are used to implement the workpiece processing method according to any one of claims 1-3.

6. A target processing machine tool, characterized in that, Including: A ram, a plurality of displacement detection sensors disposed on the ram, and an electronic device as described in claim 4, the electronic device being coupled to the displacement detection sensors.

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