Non-aqueous aluminum anodization

Abstract

The present disclosure relates to non-aqueous aluminum anodizing. A component for an electronic device may include a component including a first metal and a second metal diffusion bonded to the first metal. The first metal may be aluminum, and the second metal may be different from the first metal. A porous alumina layer may overlay a portion of the first metal and may be disposed adjacent an interface between the first metal and the second metal. The component may also include a non-metallic material bonded to the component and extending into pores defined by the porous alumina layer.

Description

[0001] This application is a divisional application of the invention patent application with application date of February 23, 2021, application number 202110202295.0, and invention name “Non-aqueous aluminum anodization”.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This patent application claims priority to U.S. Provisional Patent Application No. 63 / 027926, filed on May 20, 2020, entitled “NON-AQUEOUS ALUMINUMANODIZING,” the entire disclosure of which is hereby incorporated by reference into this document. Technical Field

[0004] The described embodiments generally relate to aluminum anodization. More specifically, the present embodiments relate to aluminum anodization using a non-aqueous electrolyte solution. Background Art

[0005] Electronic devices are ubiquitous in society and can take many forms, from watches to computers. Electronic devices, including portable electronic devices such as handheld phones, tablets, and watches, can come into contact with a variety of surfaces during use. Additionally, the use, transportation, and storage of such devices can impose mechanical and thermal stresses on the devices.

[0006] Components for these devices, such as housings or casings, may benefit from exhibiting different combinations of properties relevant to the use of the device. Casings for portable electronic devices may have a combination of properties, such as strength, appearance, toughness, wear resistance, weight, corrosion resistance, thermal conductivity, electromagnetic shielding, and cost, so that the device operates as desired. Certain metals may provide desired performance levels with respect to certain properties, but may not provide optimal performance levels with respect to other properties. Therefore, it may be desirable to provide a device casing comprising multiple metals to achieve a desired combination of somewhat different properties.

[0007] In addition, the combination of multiple metals in complex design configurations may introduce complexity into traditional manufacturing processes. The housing for consumer devices is usually constructed of a combination of metallic and non-metallic materials to provide functional, structural and aesthetic enhancements. Traditional components formed of only one metal may be modified or processed to enhance the bonding of non-metallic materials thereto and provide a desired amount of tensile strength between the metal and non-metallic materials. However, for components comprising two or more different metals, the traditional process for enhancing the bonding strength between metal components and non-metallic materials may not affect each metal in the same way, thereby increasing manufacturing complexity. In addition, some treatments for one type of metal may actually degrade or damage the different second metal properties of the component. Therefore, it may be desirable to provide a processing technique that can enhance the bonding of non-metallic materials to components comprising two or more different types of metals. Summary of the invention

[0008] According to some aspects of the present disclosure, a component may include an aluminum substrate, a different second metal diffusion-bonded to the aluminum substrate, and a porous aluminum oxide layer formed from the aluminum substrate and disposed adjacent to an interface between the aluminum substrate and the second metal.

[0009] In some examples, the second metal includes at least one of steel, copper, or tin. The porous alumina layer may have a thickness of about 10 nanometers (nm) to about 2 microns. The porous alumina layer defines pores having an average diameter of about 10 nm to about 500 nm. The aluminum substrate defines an undercut feature having an average diameter of about 10 microns to about 50 microns, and the porous alumina layer covers a surface of the aluminum substrate defining the undercut feature. The second metal defines an undercut feature having an average diameter of about 10 microns to about 50 microns. During the anodization process of forming the porous alumina layer, the aluminum and the second metal are immersed in a non-aqueous solution containing an electrolyte.

[0010] According to some examples, a method of anodizing a component comprising aluminum may include immersing the component in a non-aqueous solution comprising an electrolyte, and applying a voltage to an electrolytic cell to form a porous aluminum oxide layer from at least some of the aluminum, the electrolytic cell comprising the component immersed in the non-aqueous solution and a cathode.

[0011] In some examples, the component includes a different second metal diffusion bonded to the aluminum. Immersing the component may include immersing the aluminum and the second metal in the non-aqueous solution. The second metal may include at least one of iron, copper, or tin. The non-aqueous solution may include at least one of ethylene glycol or glycerol. The non-aqueous solution may include a non-hydrolyzable organic solvent. The electrolyte may include a weak acid. The electrolyte may include at least one of phosphoric acid, oxalic acid, or citric acid. The voltage may be in the range of about 1 volt (V) to about 1000V.

[0012] According to some examples, a component for an electronic device may include: a member including aluminum and a different second metal bonded to the aluminum, a porous aluminum oxide layer covering a portion of the aluminum and disposed adjacent to an interface between the aluminum and the second metal; and a non-metallic material bonded to the member and extending into pores defined by the porous aluminum oxide layer.

[0013] In some examples, the component is a first component, the porous alumina layer is a first porous alumina layer, and the component further comprises a second component. The second component may comprise aluminum and a second metal diffusion bonded to the aluminum. The second porous alumina layer may cover a portion of the aluminum on the second component and may be disposed adjacent to an interface between the aluminum and the second metal. The non-metallic material may extend into the pores defined by the second porous alumina layer and bond the first component to the second component. The second metal may define an undercut structure, and the non-metallic material may fill at least some of the undercut structure. The non-metallic material may comprise a polymer. The second metal may comprise at least one of iron, copper, or tin. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present disclosure will be readily understood through the following detailed description in conjunction with the accompanying drawings, in which like reference numerals refer to like structural elements, and in which:

[0015] Figure 1 A perspective view of an electronic device is shown.

[0016] Figure 2 An exploded view of the electronic device is shown.

[0017] Figure 3 A perspective view of a housing for an electronic device is shown.

[0018] Figure 4 An exploded view of a housing for an electronic device is shown.

[0019] Figure 5 A close-up perspective view of a portion of a housing for an electronic device is shown.

[0020] Figure 6 A perspective view of components of an electronic device is shown.

[0021] Fig. 7A A schematic diagram showing an aluminum component undergoing an anodizing process.

[0022] Figure 7B A schematic diagram of a component comprising multiple metals undergoing an anodizing process is shown.

[0023] Figure 8 A schematic diagram of a component comprising multiple metals undergoing an anodizing process is shown.

[0024] Fig. 9A A cross-sectional view of a portion of a component of an electronic device is shown.

[0025] Fig. 9B Shows Fig. 9A A close-up cross-sectional view of a portion of a component.

[0026] Fig. 9C A cross-sectional view of a portion of a component of an electronic device is shown.

[0027] Fig. 10A A cross-sectional view of a portion of a component of an electronic device is shown.

[0028] Fig. 10B Shows Fig. 10A A close-up cross-sectional view of a portion of a component.

[0029] Fig.11A A process flow diagram of a method of anodizing a component comprising aluminum is shown.

[0030] Fig. 11B A process flow diagram of a method of anodizing a component comprising aluminum and a ferrous metal is shown.

[0031] Fig. 11C A process flow diagram for forming components of an electronic device is shown. DETAILED DESCRIPTION

[0032] Reference will now be made specifically to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a preferred embodiment. On the contrary, the following description is intended to cover alternatives, modifications and equivalents that may be included in the spirit and scope of the embodiments defined by the appended claims.

[0033] In some examples, a component for an electronic device, such as a housing or casing, may include a first metal member and a second metal member. The first metal member and the second metal member may be joined to each other by a non-metallic material, such as a polymer material. In some examples, one or both of the first metal member or the second metal member may include an aluminum portion and a portion of a different second metal diffusely bonded to the aluminum portion. The second metal may include a steel alloy, such as stainless steel. The metal member may include a porous anodized aluminum layer located above at least some of the aluminum portion, the porous anodized aluminum layer being disposed adjacent to an interface between the aluminum and the second metal. In some examples, the non-metallic material may bond the first metal member and the second metal member by extending into the pores defined by the porous anodized aluminum layer.

[0034] Electrochemical oxidation processes such as anodization can be performed on metals such as aluminum and its alloys to form a surface oxide layer thereon. Some conventional anodization processes, such as those performed using dilute aqueous solutions of sulfuric acid, phosphoric acid, oxalic acid, or mixtures thereof, can form porous alumina structures from aluminum. The thickness of these anodic porous alumina films can be several microns or even tens of microns, with pores ranging in diameter from about 10 nanometers (nm) to about 1 micron. The pores can also extend through most of the thickness of the alumina layer.

[0035] These anodized aluminum layers can play a variety of roles. For example, the aluminum oxide layer formed above the aluminum substrate or aluminum component can increase the corrosion resistance and wear resistance of the aluminum by acting as a protective layer. The anodized aluminum layer can also be used to color the aluminum by including dyes or other materials in the pores. In some examples, it may be desirable to form a porous aluminum oxide layer, in which the aluminum substrate will be structurally bonded to, for example, a non-metallic material. The porous aluminum oxide layer can provide a large mesoporous surface area, which can allow non-metallic materials (e.g., polymer materials) to penetrate into the surface area. The penetration of non-metallic materials into the pores of the porous aluminum oxide layer can provide very strong bonding. In some examples, the bonding between the non-metallic material and the porous aluminum oxide layer can have a tensile strength of at least about 15MPa, at least about 20MPa, at least about 25MPa, at least about 30MPa or more. This technology can also be used to bond two separate components containing aluminum to each other through non-metallic materials.

[0036] In some examples, it may be desirable to form a metal component of an electronic device from a composite structure of two or more different metals. For example, a component may include aluminum and a second metal or material such as a steel alloy. In some examples, the steel alloy may provide a hard, aesthetically pleasing outer surface for the component, while the aluminum alloy core may provide a lightweight structural core with relatively high thermal conductivity that is easily formed or machined. The composite component design may provide levels of appearance, strength, stiffness, weight, manufacturability, and thermal performance that may not be achievable using conventional single metal components.

[0037] Conventional anodizing processes for forming a porous aluminum oxide layer on the surface of an aluminum component or substrate may use phosphoric acid as the electrolyte in an aqueous electrolyte solution. However, these conventional aqueous anodizing processes are less than ideal when applied to parts containing aluminum in the presence of a second non-anodizable metal, such as steel. During the anodizing process, exposing any steel in electrical contact with the aluminum to the electrolyte can effectively short-circuit the electrochemical aluminum oxide formation process.

[0038] When steel contacts the aqueous electrolyte, it will draw most of the current and will actively corrode during the process conducted at the anodic potential required for porous alumina formation. Under conventional anodizing conditions, several hundred microns of steel will dissolve, and the adjacent aluminum will not be able to achieve the potential necessary to grow a porous alumina layer. Adjusting the various parameters of the process can slow the dissolution of the steel slightly, but the steel will still undesirably escape oxygen. Other methods of anodizing components containing aluminum and non-anodizable materials (such as steel) in aqueous solutions, such as by masking the steel portions, can still be affected by problems such as defects in the mask that can result in the entire batch of components not achieving the desired porous alumina layer. In addition, the small physical size of some components can make masking an extremely complex or even impossible solution.

[0039] Thus, in some examples, a porous aluminum oxide layer can be formed on the aluminum portion of a component comprising aluminum and a second non-anodizable metal by a non-aqueous anodizing process. In some examples, as described herein, the non-aqueous anodizing process may include immersing the component in a non-aqueous solution comprising an electrolyte. In some examples, phosphoric acid may be used as an electrolyte, and a non-aqueous liquid such as ethylene glycol may be used as a solution or solvent. Therefore, in some examples, the non-aqueous anodizing process may be referred to as a non-aqueous phosphoric acid anodizing (NAPA) process. Without wishing to be bound by any one theory, the use of a non-aqueous solvent such as ethylene glycol instead of water can eliminate the undesirable hydrolysis of water and the associated oxygen evolution on the non-anodizable metal portion, thereby avoiding short circuiting of the electrolytic cell and allowing a porous aluminum oxide film to be formed on the aluminum portion.

[0040] The following will refer to Figures 1 to 11C However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these drawings is for illustrative purposes only and should not be construed as limiting.

[0041] Figure 1 A perspective view of an embodiment of an electronic device 100 is shown. Figure 1 The illustrated electronic device 100 is a mobile wireless communications device (eg, a smart phone). Figure 1 The smartphone of is only one representative example of a device that can be used in conjunction with the systems and methods disclosed herein. The electronic device 100 may correspond to any form of wearable electronic device, portable media player, media storage device, portable digital assistant ("PDA"), tablet computer, computer, mobile communication device, GPS unit, remote control device, or other electronic device. The electronic device 100 may be referred to as an electronic device or a consumer device.

[0042] The electronic device 100 may have a housing or case including a border strip or frame 102 that defines the outer perimeter of the electronic device 100. As described herein, the border strip 102 or a portion thereof may be or may include a composite metal component. In some examples, the border strip 102 may include several sidewall components, such as a first sidewall component 104, a second sidewall component 106, a third sidewall component 108 (opposite to the first sidewall component 104), and a fourth sidewall component 110. As described herein, the aforementioned sidewall components may be or may include a composite metal component.

[0043] In some cases, some of the side wall members form antenna components ( Figure 1 104 and 106). Thus, one or more non-metallic materials can separate the sidewall components of the border strip 102 from each other so as to electrically isolate the sidewall components. For example, the first separation material 112 separates the first sidewall component 104 from the second sidewall component 106, and the second separation material 114 separates the second sidewall component 106 from the third sidewall component 108. The aforementioned materials may include non-metallic materials, such as polymer materials. In some examples, as non-limiting examples, the non-metallic material can be electrically inert or insulating, such as plastic and / or resin.

[0044] The electronic device 100 may also include a display assembly 118, which may include a transparent cover that at least partially defines the outer surface of the device 100. The display assembly 118 may include multiple layers, each of which provides a unique function. In some examples, the transparent cover may be formed of a transparent material, such as glass, plastic, sapphire, or a similar transparent material. In this regard, the cover may be referred to as a transparent cover, a transparent cover, or a cover glass (when the cover includes glass). Figure 1 As shown, the cover of the display includes one or more openings 122, 124. The openings 122, 124 can allow acoustic energy (in the form of audible sound) to be transmitted into or out of the electronic device 100. In some examples, the acoustic signal transmitted into the device 100 can be transmitted by a microphone ( Figure 1 In addition, the opening 124 can allow acoustic energy (in the form of audible sound) to be transmitted to the outside of the electronic device 100, which can be received by the audio module ( Figure 1 ) is generated.

[0045] The electronic device 100 may also include a port 126 designed to receive a connector of a cable assembly. The port 126 allows the electronic device 100 to transmit (send and receive) data information, and also allows the electronic device 100 to receive power to charge the battery assembly. Therefore, the port 126 may include a terminal electrically coupled to the connector.

[0046] In addition, the electronic device 100 may include a number of openings. For example, the electronic device 100 may include an opening 132 that allows an additional audio module ( Figure 1 100) emits acoustic energy outside the electronic device 100. The electronic device 100 may also include a feature for receiving a fastener 134, which is designed to be fastened to a rail coupled to the display assembly 118. In this way, the fastener 134 can be designed to couple the display assembly 118 to the bezel strip 102.

[0047] The electronic device 100 may include several control inputs designed to provide commands to the electronic device 100. For example, the electronic device 100 may include a control input 144. As a non-limiting example, the aforementioned control input may be used to adjust the visual information presented on the display assembly 116 or the amount of acoustic energy output by the audio module. The control input may include one of a switch, a sensor, or a button designed to generate a command to the processor circuit. The control input may extend at least partially through an opening in the side wall member. For example, the second side wall member 106 may include or define an opening that receives the first control input 144. Figure 2 Further details of exemplary electronic devices are provided.

[0048] Figure 2 An exploded view of electronic device 200 is shown. Figure 2 The electronic device 200 shown is a smart phone, but is merely a representative example of a device that can be used with or includes the systems and methods described herein. As described with respect to the electronic device 100, the electronic device 200 may also correspond to any form of wearable electronic device, portable media player, media storage device, portable digital assistant ("PDA"), tablet computer, computer, mobile communication device, GPS unit, remote control device, and other electronic devices. In some examples, the electronic device 200 may include some or all of the features described herein with respect to the electronic device 100.

[0049] The electronic device 200 may have a housing including a bezel band 202 that at least partially defines an exterior portion (such as an outer perimeter) of the electronic device. Figure 1The border strip 102 described in the above, the border strip 202 may include several side wall components, such as a first side wall component 204, a second side wall component 206, a third side wall component 208 (opposite to the first side wall component 204), and a fourth side wall component 210. As described herein, the aforementioned side wall components may be or may include composite metal components. As described herein, the border strip 202 may also include one or more non-metallic materials that separate and / or connect the side wall components of the border strip 202 from each other. For example, the separation material 214 may separate and / or join the second side wall component 206 from the third side wall component 208, and the separation material 216 may separate the third side wall component 208 from the fourth side wall component 210.

[0050] The housing including the border band 202 may include one or more features, such as feature 222, that receive or couple to other components of the device 200. For example, the border band 202 may include any number of features, such as holes, cavities, recesses, and other mating features, that are configured to receive and / or attach to one or more components of the device 200. The electronic device 200 may include internal components, such as processors, memory, circuit boards, batteries, and sensors. Such components may be disposed within an internal volume at least partially defined by the border band 202, and may be attached to the border band 202 via an inner surface formed into the border band 202, defined by the border band 202, or otherwise becoming a part of the border band 202, an attachment feature such as feature 222, a threaded connector, a stud, a column, and / or other fixing features.

[0051] Device 200 may include internal components, such as a system-in-package (SiP) 226, which includes one or more integrated circuits, such as a processor, a sensor, and a memory. Device 200 may also include a battery 224 housed in the internal volume of device 200. Device 200 may also include one or more sensors, such as an optical sensor or other sensor, that may sense or otherwise detect information about the environment outside the internal volume of device 200. Additional components, such as a haptic engine, may also be included in device 200. Electronic device 200 may also include a display assembly 218 similar to display assembly 118 described herein. In some examples, display assembly 218 may be received by and / or attached to bezel strip 202 via one or more attachment features.

[0052] The electronic device 200 may also include a chassis 220 that can provide structural support. As described herein, the chassis 220 may include a rigid material such as a metal, or may include a composite construction. The chassis 220 may also be coupled to the border strip 202. In this way, the chassis 220 can provide an electrical ground path for electrically coupling components to the chassis. The electronic device may alternatively or additionally include a backplate 230 having a coating and / or other attachment features so that one or more components of the electronic device 200 can be attached to the backplate 230, for example, via welding. The backplate 230 can form a conductive path for connecting components of the electronic device 200. In some examples, the backplate 230 can be attached to the border strip 202 of the device 200 via one or more attachment features such as feature 222.

[0053] The outer surface of the electronic device 200 may also be defined by a back cover 240 that may be coupled to the bezel strip 202. In this regard, the back cover 240 may be combined with the bezel strip 202 to form a housing or casing of the electronic device 200, wherein the housing or casing (including the bezel strip 202 and the back cover 240) at least partially defines an interior volume. The back cover 240 may include a transparent material such as glass, plastic, sapphire, or other transparent material.

[0054] The shell including the frame band 202 with one or more composite parts can meet the internal dimension requirements as defined by the internal parts. For example, the structure of the shell including the composite frame band 202 can be limited or restricted by the internal parts that the shell is designed to accommodate uniquely or mainly. That is, because the shell including the composite frame band 202 can be extremely light and strong, the shell can be formed to accommodate the internal parts in an efficient manner in size, and is not constrained by factors other than the size of the parts, such as the need for additional structural elements. The composite parts 204,206,208,210 of the frame band can include an aluminum part and a second non-anodizable part bonded thereto, such as a stainless steel part. According to the process described herein, the surface of the aluminum part of the composite parts 204,206,208,210 at least bonded to the separated parts (such as parts 214,216) can have a porous aluminum oxide layer formed thereon.

[0055] While any number or types of components of electronic devices may be formed from or may include components including aluminum and a porous aluminum oxide layer formed by a non-aqueous anodizing process, the structure of these components may be, for example, a composite component including an aluminum portion connected to a second non-anodizable portion, as described herein. The structure of the aluminum portion and the non-anodizable portion and the materials of the non-anodizable portion, as well as the composite component itself, may be applied not only to the specific examples discussed herein, but also to any number or types of embodiments in any combination. Figures 3 to 5 Various embodiments of components, electronic devices, and methods of forming the same are described.

[0056] Figure 3 A perspective view of a border band 302 of a housing or casing of an electronic device is shown, and Figure 4 An exploded view of a border strip 402 of a housing or case of an electronic device is shown. For example, the border strips 302, 402 may be substantially similar to those of the embodiment of the present invention. Figure 1 and Figure 2 The electronic device 100 or the electronic device 200 shown is a part of a housing or a casing of the electronic device.

[0057] The border strip 302 may include one or more portions that are or include a composite component, such as an outer portion comprising a non-anodizable material joined to an inner portion comprising aluminum, as described herein. For example, the border strip 302 may include a first composite sidewall component 304, a second composite sidewall component 306, a third composite sidewall component 308 (opposite the first composite sidewall component 304), and a fourth composite sidewall component 310. In some examples, and as described herein, the composite components 304, 306, 308, 310 may be separated and / or joined together by portions of non-metallic material 312, 314, 316, 318 that may penetrate pores defined by a porous aluminum oxide layer formed over at least some of the aluminum of the composite component.

[0058] like Figure 4 As shown, the composite sidewall component 406 of the frame band 402 may include an outer portion 407, which may be formed by a relatively hard, strong, beautiful and / or durable non-anodizable material such as steel. The inner portion 409 of the composite sidewall component 406 may contain aluminum or an aluminum alloy and may be diffusion bonded to the outer portion 407. The aluminum inner portion 409 may be easily machined to allow low-cost formation of attachment features, and may be relatively lightweight with high thermal conductivity. As further described herein, a porous alumina layer may be formed above at least those areas of the inner portion 409 bonded to non-metallic materials 412, 414 to provide high-strength bonding and structural integrity to the frame band 402. In some examples, the features may also be formed on those areas of the outer portion bonded to non-metallic materials 412, 414. Importantly, the porous alumina layer may be formed on the inner portion 409 after it has been bonded to the outer portion 407, thereby allowing the use of conventional equipment manufacturing or assembly processes after the porous alumina layer has been formed, thereby reducing costs. Border strip 402 may also include additional composite sidewall components 404, 408, and 410 that may be separated and / or joined together by portions of non-metallic material 412, 414, 416, 418, as described herein. Additionally, in some examples, the composite components may form portions of a housing or shell other than the sidewalls, such as a top portion, a bottom portion, or any portion of the housing or shell. Figure 5Further details of the composite sidewall components are provided.

[0059] Figure 5 An exemplary composite metal component 506 is shown that may include a preformed outer portion 507 comprising a non-anodizable material joined to an inner portion 509 comprising aluminum. In some examples, component 506 may be formed with respect to Figure 4 The components 406 described are substantially similar or identical. In some examples, the non-anodizable material may include at least one of iron, copper, or tin. In some examples, the non-anodizable material may include a steel alloy, such as stainless steel. In some examples, the non-anodizable material may include a conductive material, such as graphite, graphene, or carbon fiber. Composite component 506 may include a first bonding surface 522 defined by outer portion 507 and a second bonding surface 524 defined by inner portion 509. It can be seen that surfaces 522, 524 may abut each other along the interface between portions 507, 509.

[0060] In some examples, surface 522 may include one or more engagement features formed thereon. For example, surface 522 may include a plurality of engagement features. As described herein, the engagement features may range in size from nanoscale or micron-scale features to macroscale features having millimeter-scale dimensions. In some examples, the engagement features may have any desired shape to engage non-metallic materials, as described herein. For example, the engagement features may include recesses, cavities, protrusions, undercut features, or combinations thereof. In some examples, the engagement features may include undercut features having an average diameter of about 10 microns to about 50 microns.

[0061] In some examples, the surface 524 may include or be covered by a porous alumina layer 534 formed thereon by a non-aqueous anodizing process, as described herein. In some examples, the porous alumina layer has a thickness of about 10 nm to about 2 microns. In some examples, the porous alumina layer defines pores having an average diameter of about 10 nm to about 500 nm. In some examples, the porous alumina layer defines pores, which include openings having an average main dimension of about 10 nm to about 500 nm at the surface of the porous alumina. In some examples, the pores may be regularly arranged or spaced apart, but in some examples, the pores may have an irregular or substantially random distribution. In some examples, the surface 524 may include one or more engagement features or interlocking features formed thereon, which may be defined by the porous alumina layer. For example, the engagement features may include recesses, protrusions, or combinations thereof. In some examples, the engagement features may include undercut features having an average diameter of about 10 microns to about 50 microns.

[0062] In some examples, surfaces 522, 524 can allow composite component 506 to be joined or bonded to a non-metallic material, as described herein. In some examples, the non-metallic material can also bond to a second component, thereby bonding composite component 506 to the second component. For example, the non-metallic material can mechanically bond the bonding features and pores of porous alumina layer 534 to bond component 506 to another component (such as a component with respect to a substrate). Figure 3 Component 308) shown and described is engaged.

[0063] While any number or types of components of electronic devices may be formed from or may include a member including aluminum and a porous aluminum oxide layer formed by a non-aqueous anodizing process, the structure of these components may be, for example, a composite component including an aluminum portion joined to a second non-anodizable portion, as described herein. The structure of the aluminum portion and the non-anodizable portion and the materials of the non-anodizable portion, as well as the composite component itself, may be applied not only to the specific examples discussed herein, but also to any number or types of embodiments in any combination. Figure 6 Various embodiments of components, electronic devices, and methods of forming the same are described.

[0064] Figure 6 A perspective view of a component 600 of an electronic device is shown, the component including a first member 602 joined or bonded to a second member 604 by a non-metallic material 606, as described herein. In some examples, one or both of the first member 602 or the second member 604 can be a composite part including a non-anodizable portion 612, 614 and an aluminum portion 622, 624. In some examples, the aluminum portion 622, 624 can include aluminum or any anodizable alloy thereof. The non-anodizable portion 612, 614 can be joined or bonded to the aluminum portion 622, 624 along the interface between the two portions. However, in some examples, one or both of the first member 602 and / or the second member 604 can include only the aluminum portion 622, 624.

[0065] In some examples, the non-anodizable portions 612, 614 may be preformed and may include a metallic material such as stainless steel, but other materials are explicitly contemplated as described herein. In some examples, the non-anodizable portions 612, 614 may have a thickness greater than about 25 microns. In some examples, the non-anodizable portions 612, 614 and the aluminum portions 622, 624 may be welded, bonded, diffusion bonded, adhered or otherwise joined together so that they form the members 602, 604 or a portion thereof, and as a composite. That is, in some examples, the composite members 602, 604 may be processed as a single piece of material by any process (such as the processes described herein, including manufacturing and assembly processes). Since the non-anodizable portions 612, 614 and the aluminum portions 622, 624 may include any desired shape or design, the members 602, 604 may include any desired shape or design. In some examples, the component 600 may be a part of a housing of an electronic device. However, in some other examples, component 600 may be any component of an electronic device, such as a structural component, an internal component, an external component, and / or any other component.

[0066] In some examples, the non-anodizable portions 612, 614 may include any material that does not allow the formation of an anodic porous aluminum oxide layer on the aluminum portions 622, 624 by a conventional aqueous anodizing process. In some examples, the non-anodizable portions 612, 614 may include ferrous or ferrous metals. For example, the non-anodizable portions 612, 614 may include any steel alloy, such as a stainless steel alloy. In some examples, the non-anodizable portions 612, 614 may include a metallic material, such as iron, copper, tin, or a combination or alloy thereof. However, in some examples, the non-anodizable portions 612, 614 may include a non-metallic material, such as a conductive non-metallic material. In some examples, the non-anodizable portions 612, 614 may include graphite.

[0067] In some examples, and as described herein, as non-limiting examples, the non-metallic material 606 may include an electrically inert or insulating material, such as a plastic and / or a resin. However, in some examples, the non-metallic material 606 may not be insulating. In some examples, the non-metallic material 606 may include a polymer material, a glass material, a ceramic material, or a combination thereof. In some examples, the non-metallic material 606 may include a material that can flow. That is, in some examples, the non-metallic material 606 may include any material that can be made to at least partially flow or move into the pores of the porous alumina layer, as described herein. In some examples, the non-metallic material 606 may include a material that can be changed or transformed between a flowable state and a substantially solid or non-flowable state, for example, by cooling, curing, or any other process or technology.

[0068] While any number or types of components of electronic devices may be formed from or may include a member including aluminum and a porous aluminum oxide layer formed by a non-aqueous anodizing process, the structure of these components may be, for example, a composite component including an aluminum portion joined to a second non-anodizable portion, as described herein. The structure of the aluminum portion and the non-anodizable portion and the materials of the non-anodizable portion, as well as the composite component itself, may be applied not only to the specific examples discussed herein, but also to any number or types of embodiments in any combination. FIG. 7A to FIG. 7B Various embodiments of components, electronic devices, and methods of forming the same are described.

[0069] Fig. 7A A schematic diagram of an aluminum component undergoing an anodizing or anodizing process is shown. The process may include immersing an aluminum component or substrate 722 in an electrolyte solution 701. The aluminum substrate 722 may be used as an anode of an electrolytic cell 700, which also includes an electrolyte solution 701, a cathode (not shown) also immersed in the electrolyte solution 701, and a voltage source or power supply (not shown). In order to perform the anodizing process and begin to form a porous aluminum oxide film 723, a voltage may be provided to the electrolytic cell 700, which may cause an electric current 702 to flow through the electrolyte solution 701 and form a porous aluminum oxide film 723 from the aluminum substrate 722. It can be seen that the porous aluminum oxide film 723 may define a plurality of pores 725 that may be regularly or irregularly spaced or distributed.

[0070] In some examples, the diameter of the pores can be controlled by controlling the voltage during the process. For example, the diameter of the pores can be nanometer-scale, and can be from about 5 nm to about 500 nm, or even up to 1 micrometer. In some examples, the voltage provided to the electrolytic cell 700 can be from about 2 volts (V) to about 500 V. In some examples, a higher voltage provided to the electrolytic cell 700 can form a porous alumina film 723 having pores 725 with larger diameters. If the electrolyte solution 701 contains water or is an aqueous solution, then relative to Fig. 7A The process described may be considered a conventional or conventional anodizing process. However, in some examples, the electrolyte solution 701 may be a non-aqueous solution and may include a non-aqueous solvent, as described herein. Additional details regarding conventional anodizing processes are provided with respect to Figure 7B Give a description.

[0071] Figure 7B A schematic diagram of a component comprising an aluminum portion 722 and a non-anodizable portion 712 (e.g., steel) that is immersed in an aqueous electrolyte solution 701 and serves as a relative Fig. 7AAnodes of the electrolytic cell 700 are shown. It can be seen that when a voltage is applied to the electrolytic cell 700, exposing any non-anodizable material 712 in electrical contact with the aluminum portion 722 to the aqueous electrolyte solution 701 can effectively short-circuit the electrochemical aluminum oxide formation process and can cause all or substantially all of the current 702 to flow to the non-anodizable portion 712.

[0072] When the non-anodizable portion 712 contacts the aqueous electrolyte solution 701, it will actively corrode in a process conducted at the anodic potential required for porous aluminum oxide formation. Under conventional anodizing conditions, hundreds of microns of the non-anodizable portion 712 may dissolve, and the adjacent aluminum portion 722 will not be able to achieve the potential necessary to grow a porous aluminum oxide layer, and only a relatively thin non-porous aluminum oxide layer 723 will be formed. The electrochemical reaction that draws current 702 to the non-anodizable portion 712 and causes its corrosion may also result in undesirable hydrolysis of water in the aqueous electrolyte solution 701 and the escape of relatively large amounts of oxygen 703 at the non-anodizable portion 712.

[0073] While any number or types of components of electronic devices may be formed from or may include components including aluminum and a porous aluminum oxide layer formed by a non-aqueous anodizing process, the structure of these components may be, for example, a composite component including an aluminum portion connected to a second non-anodizable portion, as described herein. The structure of the aluminum portion and the non-anodizable portion and the materials of the non-anodizable portion, as well as the composite component itself, may be applied not only to the specific examples discussed herein, but also to any number or types of embodiments in any combination. Figure 8 Various embodiments of components, electronic devices, and methods of forming the same are described.

[0074] Figure 8A schematic diagram of a component including an aluminum portion 822 and an adjacent non-anodizable portion 812 (e.g., steel) is shown, which is immersed in a non-aqueous electrolyte solution 801 and serves as an anode of an electrolytic cell 800. The electrolytic cell 800 may include a cathode (not shown) also immersed in the electrolyte solution 801, and a voltage source or power source (not shown). In some examples, the electrolytic cell 800 may be substantially similar to the electrolytic cell 700, except that the electrolyte solution 801 is non-aqueous. Without wishing to be bound by any one theory, in some examples, the use of a non-aqueous electrolyte solution 801 instead of an aqueous electrolyte solution may eliminate the undesirable hydrolysis of water and the associated oxygen evolution on the non-anodizable portion 812, thereby avoiding short circuiting of the electrolytic cell 800 and allowing sufficient current 802 to flow to the aluminum portion 822 to form a porous aluminum oxide film or layer 823 from the aluminum portion 822. The porous aluminum oxide film 823 may define pores 824, which may be substantially similar to the pores 725 defined by the porous aluminum oxide film 723. In some examples, the porous aluminum oxide membrane 823 can be substantially adjacent to the non-anodizable portion 812. Additionally, in some examples, the anodization process can result in the formation of a passivation layer or oxide layer 813 on the surface of the non-anodizable portion 812. Thus, the electrolytic cell 800 can be used to perform a non-aqueous anodization process, as described herein.

[0075] In some examples, the electrolyte solution 801 may include a non-aqueous solvent and one or more electrolytes. In some examples, the solvent may include an organic solvent. In some examples, the solvent may include a non-hydrolyzable organic solvent. That is, the solvent may include an organic solvent that does not hydrolyze when a voltage is provided to the electrolytic cell 800. In some examples, the non-aqueous solvent includes at least one of ethylene glycol or glycerol. In some examples, the electrolyte may include any electrolyte used in a conventional aluminum anodizing process. In some examples, the electrolyte may include a weak acid. The term "weak acid" as used herein refers to any acid that is only partially dissociated into protons and anions, wherein the undissociated acid and its dissociation products are present in the solution in a balance with each other. In some examples, the electrolyte may include at least one of phosphoric acid, oxalic acid, or citric acid. In some examples, the electrolyte may include any combination of weak acids. In some examples, the solvent may include ethylene glycol, and the electrolyte may include phosphoric acid. Therefore, in some examples, the non-aqueous electrolyte solution 801 may include ethylene glycol and phosphoric acid. In some examples, the non-aqueous electrolyte solution 801 can have a pH of less than 7, such as less than about 6.8, less than about 6.6, less than about 6.5, less than about 6.4, or less than about 6.3 or less. In some examples, the electrolyte solution 801 can include an electrolyte to solvent ratio between about 10 grams / liter (g / L) and about 1000 g / L (e.g., about 100 g / L).

[0076] In some examples, a voltage between about 1 V and about 1000 V can be provided to the electrolytic cell 800 as desired. In some examples, a component including the aluminum portion 822 and the adjacent non-anodizable portion 812 can have an anode potential between about 5 V and about 100 V, between about 25 V and about 75 V, or between about 50 V and about 70 V. In some examples, the component can have an anode potential of about 65 V. In some examples, the surface of the aluminum portion 822 can have a current density between about 0.01 amperes per square decimeter (ASD) and about 10 ASD (e.g., about 0.5 ASD).

[0077] In addition, in some examples, the non-aqueous electrolyte solution 801 can be heated during the anodization process. For example, the non-aqueous electrolyte solution 801 can be heated to about 25° C., about 30° C., about 35° C., about 40° C., about 45° C., about 50° C., or more. In some examples, the cathode of the electrolytic cell 800 can include a metal material, such as stainless steel.

[0078] In some examples, the porous alumina membrane 823 may have a thickness between about 10 nm and about 2 microns as desired. In some examples, the thickness of the porous alumina membrane 823 may depend at least in part on the duration of the voltage provided to the electrolytic cell 800. In some examples, the pores 824 may have an average diameter of about 5 nm to about 500 nm or even up to 1 micron. In some examples, the pores 824 may have an average diameter of about 10 nm to about 250 nm, about 20 nm to about 150 nm, about 30 nm to about 100 nm, or about 40 nm to about 60 nm. In some examples, the pores 824 may have an average diameter of about 50 nm.

[0079] While any number or types of components of electronic devices may be formed from or may include a member including aluminum and a porous aluminum oxide layer formed by a non-aqueous anodizing process, the structure of these components may be, for example, a composite component including an aluminum portion joined to a second non-anodizable portion, as described herein. The structure of the aluminum portion and the non-anodizable portion and the materials of the non-anodizable portion, as well as the composite component itself, may be applied not only to the specific examples discussed herein, but also to any number or types of embodiments in any combination. 9A to 10B Various embodiments of components, electronic devices, and methods of forming the same are described.

[0080] Fig. 9A Shown with Figure 6A close-up cross-sectional view of an area of ​​aluminum portion 922 substantially similar to aluminum portion 622 of first member 602 is shown. As described herein, aluminum portion 922 can have a porous alumina layer 923 formed thereon and covering at least a portion of a surface of aluminum portion 922. Additionally, aluminum portion 922 can define any number, size, and / or shape of additional interlocking features, such as undercut features 921, in addition to the pores defined by porous alumina layer 923. In some examples, porous alumina layer 923 can be disposed above the surface of aluminum portion 922 that defines feature 921.

[0081] In some examples, the aluminum portion 922 and / or the porous alumina layer 923 may define an opening having a first width W1, which may lead to an undercut region that extends at least partially into the aluminum portion 922 and / or the porous alumina layer 923 and is further defined by the aluminum portion and / or the porous alumina layer. In some examples, the first width W1 may be between about 5 microns and about 100 microns, or between about 10 microns and about 50 microns, such as about 30 microns. The undercut region may have a second width W2 that is wider than the first width W1. In some examples, the second width W2 may be between about 5 microns and about 100 microns, or between about 10 microns and about 50 microns, such as about 35 microns. The undercut region of the feature 921 may have a height H1. The height H1 may also be considered as the distance or depth that the feature 921 extends into the aluminum portion 922. In some examples, the ratio of the height H1 to the second width W2 of the feature 921 can be between about 0.5 and about 1, or between about 0.6 and about 0.9. Although shown as having a substantially spherical or rounded undercut shape, in some examples, the feature 921 can have substantially any shape or shapes as desired, including regular and / or irregular shapes, or combinations thereof.

[0082] In some examples, feature 921 can be formed in aluminum portion 922 before porous aluminum oxide layer 923 is formed from the aluminum portion. In some examples, feature 921 can be formed by any process or combination of processes, such as etching and / or machining processes.

[0083] Fig. 9B Shows Fig. 9AA close-up cross-sectional view of the region shown, the region including a porous aluminum oxide layer 923 defining a plurality of pores 925. In some examples, the pores 925 may extend from a substantially flat or planar outer surface of the aluminum oxide layer 923 toward the aluminum portion 922. The pores 925 may have a generally columnar shape that is elongated in a direction generally perpendicular to the surface of the aluminum portion 922 on which or from which the aluminum oxide layer 923 is formed. In some examples, the pores 925 are defined by the walls of the aluminum oxide layer 923. Additionally, the pores 925 may be defined by the bottom surface of the aluminum oxide layer 923. In some examples, the pores 925 may extend substantially the entire depth of the aluminum oxide layer 923. In some examples, the bottom surface of the bottom portion of the aluminum oxide layer 923 that may define the pores may have a thickness on the order of nanometers, and may have a thickness similar to the thickness of the walls of the aluminum oxide layer 923, for example between about 1 nm and about 50 nm. Relative Fig. 9C Additional details of a composite member including an aluminum portion and a non-anodizable portion are described.

[0084] Fig. 9C Shown with Figure 6 Non-anodizable portion 612 of first member 602 is shown in a close-up cross-sectional view of an area of ​​substantially similar non-anodizable portion 912. In some examples, all or a portion of the surface of non-anodizable portion 912 may define any number, size, and / or shape of additional interlocking features, such as undercut features 913.

[0085] In some examples, the non-anodizable portion 912 may define an opening having a first width W3, which may lead to an undercut region that extends at least partially into the non-anodizable portion 912 and is further defined by the non-anodizable portion. In some examples, the first width W3 may be between about 5 microns and about 100 microns, or between about 10 microns and about 50 microns, such as about 30 microns. The undercut region may have a second width W4 that is wider than the first width W3. In some examples, the second width W4 may be between about 5 microns and about 100 microns, or between about 10 microns and about 50 microns, such as about 35 microns. The undercut region of the feature 913 may have a height H2. The height H2 may also be considered as the distance or depth that the feature 913 extends into the non-anodizable portion 912. In some examples, the ratio of the height H2 of the feature 913 to the second width W4 may be between about 0.5 and about 1, or between about 0.6 and about 0.9. Although illustrated as having a substantially spherical or circular undercut shape, in some examples, feature 913 may have substantially any shape or shapes as desired, including regular and / or irregular shapes, or combinations thereof.

[0086] In some examples, feature 921 can be formed in non-anodizable portion 912 before porous aluminum oxide layer 923 is formed on adjacent aluminum portion 922. In some examples, feature 913 can be formed by any process or combination of processes, such as etching and / or machining processes. In some examples, feature 913 can be formed by a non-aqueous anodizing process as described herein, for example, while porous aluminum oxide layer 923 is formed on adjacent aluminum portion 922.

[0087] Fig. 10A A close-up cross-sectional view of an aluminum portion 1022 of a component as described herein is shown. The aluminum portion 1022 can be substantially similar to the aluminum portion 922 described herein, and can be included in a component including a non-anodizable portion bonded thereto, or can be a component itself. In some examples, the aluminum portion 1022 can define one or more undercut features 1021, which can include a porous aluminum oxide film 1023 ( Fig. 10B ). The porous alumina layer 1023 may be formed by a non-aqueous anodization process, as described herein.

[0088] As this article is relative to Fig. 10A As described, the non-metallic material 1006 may be bonded or joined to the aluminum portion 1022, and may at least partially fill or line the undercut features 1021 defined by the aluminum portion 1022. In some examples, the non-metallic material 1006 may completely or substantially completely fill one or all of the undercut features 1021. Thus, in some examples, there may be substantially no gap or spacing between the portion of the non-metallic material 1006 disposed in the undercut features 1021 and the porous alumina layer 1023 and / or the surface of the aluminum portion 1022 defining the features 1021. In some examples, the features 1021 may increase the surface area of ​​the aluminum portion 1022, thereby enhancing the bond strength between the aluminum portion 1022 and the non-metallic material 1006. Additionally, the undercut nature of the features 1021 may provide a degree of mechanical bonding between the features 1021 and the non-metallic material 1006, thereby enhancing the bond strength.

[0089] Fig. 10B A close-up cross-sectional view of the porous alumina layer 1023 is shown including an aluminum portion 1022 of a non-metallic material 1006 that at least partially extends into pores 1025 defined by the porous alumina layer 1023 .

[0090] In some examples, at least partial penetration of non-metallic material 1006 into pores 1025 can enhance the bonding or pulling strength between aluminum portion 1022 and non-metallic material 1006. In some examples, those portions of non-metallic material 1006 disposed and / or retained within pores 1025 can be referred to as being chemically and / or mechanically bonded at the nanoscale, while those portions of non-metallic material 1006 disposed and / or retained within pores 1025 can be referred to as being chemically and / or mechanically bonded at the nanoscale. Fig. 10A Those portions within the illustrated feature 1021 may be referred to as being mechanically bonded at the micrometer level. In some examples, the bond between the non-metallic material 1006 and the porous alumina layer 1023 may have a tensile strength of at least about 15 MPa, at least about 20 MPa, at least about 25 MPa, at least about 30 MPa, or more.

[0091] While any number or types of components of electronic devices may be formed from or may include a member including aluminum and a porous aluminum oxide layer formed by a non-aqueous anodizing process, the structure of these components may be, for example, a composite component including an aluminum portion joined to a second non-anodizable portion, as described herein. The structure of the aluminum portion and the non-anodizable portion and the materials of the non-anodizable portion, as well as the composite component itself, may be applied not only to the specific examples discussed herein, but also to any number or types of embodiments in any combination. FIG. 11A to FIG. 11C Various embodiments of components, electronic devices, and methods of forming the same are described.

[0092] Fig.11A A process flow chart of a method 1100 for anodizing a component including an aluminum portion and a non-anodizable portion (such as a ferrous metal portion) is shown. At block 1102, the component may be immersed in a non-aqueous solution containing an electrolyte. In some examples, the non-aqueous solution may include a non-aqueous solvent and one or more electrolytes. In some examples, the solvent may include an organic solvent. In some examples, the solvent may include a non-hydrolyzable organic solvent. In some examples, the non-aqueous solvent includes at least one of ethylene glycol or glycerol. In some examples, the electrolyte may include any electrolyte used in a conventional aluminum anodizing process. In some examples, the electrolyte may include a weak acid. In some examples, the electrolyte may include at least one of phosphoric acid, oxalic acid, or citric acid. In some examples, the electrolyte may include any combination of weak acids. In some examples, the solvent may include ethylene glycol, and the electrolyte may include phosphoric acid.

[0093] At block 1104, a voltage may be applied to an electrolytic cell comprising a cathode and a member acting as an anode, as described herein. In some examples, a voltage between about 1V and about 1000V may be applied to the electrolytic cell as desired. In some examples, the member may have an anode potential between about 5V and about 100V, between about 25V and about 75V, or between about 50V and about 70V. In some examples, the member may have an anode potential of about 65V. In some examples, the surface of the aluminum portion of the member may have a current density between about 0.01 amperes per square decimeter (ASD) and about 10ASD (e.g., about 0.5ASD).

[0094] At block 1106, a porous aluminum oxide layer is formed from at least some of the aluminum of the component, as described herein. The porous aluminum oxide layer may be disposed on some or all of the surface of the aluminum portion. Although described as a separate block, it should be understood that the formation of the aluminum oxide layer may occur simultaneously with the application of voltage to the electrolytic cell in block 1104.

[0095] Fig. 11B A process flow chart of a method 1200 for anodizing a component comprising aluminum and ferrous metal is shown. At block 1202, the component may be immersed in a non-aqueous solution comprising an electrolyte. In some examples, the non-aqueous solution may include a non-aqueous solvent and one or more electrolytes. In some examples, block 1202 may be substantially similar or identical to block 1102. At block 1204, a voltage may be applied to an electrolytic cell comprising a cathode and a component acting as an anode, as described herein. In some examples, block 1204 may be substantially similar or identical to block 1104. At block 1206, a porous aluminum oxide layer is formed by at least some of the aluminum of the component, as described herein. In some examples, block 1206 may be substantially similar or identical to block 1106, and may occur simultaneously or in parallel with block 1204. At block 1208, a cavity or feature may be formed in or on the surface of the ferrous metal or non-anodizable portion of the component. In some examples, the cavity may include an undercut feature, such as Fig. 9C Although described as a separate block, it should be understood that the formation of the cavity can occur simultaneously with one or both of blocks 1204, 1206. However, in some examples, block 1208 can occur at a different time and can be attributed to one or more processes performed before or after blocks 1202, 1204, and / or 1206.

[0096] Fig. 11CA process flow chart of a method 1300 for forming a component, such as a component of an electronic device, is shown. At block 1302, as described herein, a component comprising aluminum and a ferrous metal or other non-anodizable material may be immersed in a non-aqueous solution comprising an electrolyte. In some examples, the non-aqueous solution may include a non-aqueous solvent and one or more electrolytes. In some examples, block 1302 may be substantially similar or identical to blocks 1102 and 1202. At block 1304, a voltage may be applied to an electrolytic cell comprising a cathode and a component acting as an anode, as described herein. In some examples, block 1304 may be substantially similar or identical to blocks 1104 and 1204. At block 1306, a porous aluminum oxide layer is formed from at least some of the aluminum of the component, as described herein. In some examples, block 1306 may be substantially similar or identical to blocks 1106 and 1206, and may occur simultaneously or in parallel with block 1304.

[0097] At block 1308, a cavity or feature may be formed in or on the surface of the ferrous metal or non-anodizable portion of the component. In some examples, the cavity may include an undercut feature, such as a Fig. 9C Although described as a separate block, it should be understood that the formation of the cavity can occur simultaneously with one or both of blocks 1304, 1306. However, in some examples, block 1308 can occur at a different time and can be attributed to one or more processes performed before or after blocks 1302, 1304, and / or 1306. In some examples, block 1308 can be substantially similar or identical to block 1208.

[0098] At block 1310 , at least some of the cavities defined by the ferrous metal portion and / or the pores defined by the porous alumina layer may be at least partially filled with a non-metallic material, as described herein.

[0099] In some examples, and as described herein, as non-limiting examples, the non-metallic material may include an electrically inert or insulating material, such as a plastic and / or resin. In some examples, the non-metallic material may not be insulating. In some examples, the non-metallic material may include a polymer material, a glass material, a ceramic material, or a combination thereof. In some examples, the non-metallic material may include a material that can flow, and may be made to flow or move at least partially into a hole and / or cavity of a component as described herein. In some examples, the non-metallic material may include a material that can change or transform between a flowable state and a substantially solid or non-flowable state, for example, by cooling, curing, or any other process or technology.

[0100] Any features or aspects of the components, devices and methods discussed herein may be combined or included in any combination of variations. For example, any method of forming a porous alumina membrane may be used on any component, member or feature of the electronic device described herein. The steps, stages or frames of any method described herein may be performed in any desired order and may be performed simultaneously if necessary. In addition, the housing of the device may include a member comprising a porous alumina membrane formed by a non-aqueous anodizing process as described herein. Although certain methods and components are described relative to the housing, housing or frame of an electronic device, the methods and components described herein may also be or form any number of additional components of the electronic device, including internal components, external components, housings, surfaces or partial surfaces. As used herein, the terms exterior, outside, interior and inside are used for reference purposes only. The exterior portion or exterior portion of a composite component may form a portion of the outer surface of the component, but does not necessarily form its entire exterior surface or outer surface.

[0101] To the extent applicable to the present technology, the collection and use of data obtained from various sources can be used to improve the delivery of inspirational content or any other content that may be of interest to users. The present disclosure contemplates that in some instances, the collected data may include personal information data that uniquely identifies or can be used to contact or locate a specific person. Such personal information data may include demographic data, location-based data, phone numbers, email addresses, ID, home address, data or records related to the user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), date of birth, or any other identifying or personal information.

[0102] The present disclosure recognizes that the use of such personal information data in the present invention technology can be used to benefit users. For example, the personal information data can be used to deliver targeted content that users are more interested in. Therefore, the use of such personal information data enables users to have planned control over the content delivered. In addition, the present disclosure also anticipates other uses of personal information data that benefit users. For example, health and fitness data can be used to provide insights into the user's overall health status, or can be used as positive feedback for individuals who use technology to pursue health goals.

[0103] This disclosure envisions that entities responsible for collecting, analyzing, disclosing, transmitting, storing or otherwise using such personal information data will comply with established privacy policies and / or privacy practices. Specifically, such entities should implement and adhere to privacy policies and practices that are recognized as meeting or exceeding industry or government requirements for maintaining the privacy and security of personal information data. Such policies should be easily accessible to users and should be updated as the collection and / or use of data changes. Personal information from users should be collected for legitimate and reasonable purposes of the entity and not shared or sold outside of these legitimate uses. In addition, such collection / sharing should be performed after receiving informed consent from the user. In addition, such entities should consider taking any necessary steps to defend and secure access to such personal information data and ensure that others who have access to personal information data comply with their privacy policies and processes. In addition, such entities may subject themselves to third-party assessments to demonstrate their compliance with widely accepted privacy policies and practices. In addition, policies and practices should be adjusted to specific types of personal information data collected and / or accessed, and to applicable laws and standards including specific considerations of jurisdiction. For example, in the United States, the collection or access of certain health data may be governed by federal and / or state laws, such as the Health Insurance Portability and Accountability Act (HIPAA), while health data in other countries may be subject to other regulations and policies and should be handled accordingly. Therefore, different privacy practices should be maintained in each country for different types of personal data.

[0104] Regardless of the foregoing, the present disclosure also contemplates implementation schemes in which users selectively block the use or access of personal information data. That is, the present disclosure contemplates that hardware elements and / or software elements may be provided to prevent or block access to such personal information data. For example, with respect to an advertising delivery service, the technology of the present invention may be configured to allow a user to choose to "opt in" or "opt out" at any time during or after registration for the service to participate in the collection of personal information data. In another example, a user may choose not to provide emotion-related data for a target content delivery service. In another example, a user may choose to limit the length of time that emotion-related data is retained, or completely prohibit the development of basic emotional conditions. In addition to providing "opt-in" and "opt-out" options, the present disclosure contemplates providing notifications related to access or use of personal information. For example, a user may be notified that their personal information data will be accessed when downloading an application, and then the user may be reminded again just before the personal information data is accessed by the application.

[0105] In addition, it is an object of the present disclosure that personal information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use. Risks can be minimized by limiting data collection and deleting data once it is no longer needed. In addition, and when applicable, including in certain health-related applications, data de-identification can be used to protect the privacy of users. De-identification can be facilitated by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or specificity of stored data (e.g., collecting location data at the city level rather than at the address level), controlling how data is stored (e.g., aggregating data on users), and / or other methods when appropriate.

[0106] Thus, while the present disclosure broadly covers the use of personal information data to implement one or more of the various disclosed embodiments, the present disclosure also contemplates that various embodiments may also be implemented without access to such personal information data. That is, various embodiments of the present technology will not fail to function properly due to the lack of all or a portion of such personal information data. For example, content may be selected and delivered to a user by inferring preferences based on non-personal information data or an absolute minimum amount of personal information, such as content requested by a device associated with the user, other non-personal information available to a content delivery service, or publicly available information.

[0107] As used herein, the terms exterior, outside, interior, inside, top, and bottom are used for reference purposes only. An exterior portion or exterior portion of a component may form a portion of an exterior surface of a component, but may not necessarily form the entire exterior of the exterior surface of the component. Similarly, an interior portion or interior portion of a component may form or define an interior portion or interior portion of a component, but may also form or define a portion of an exterior surface or exterior surface of a component. In some orientations of a component, a top portion of a component may be located above a bottom portion of the component, but may also be in line with, below, or in other spatial relationships with the bottom portion depending on the orientation of the component.

[0108] Various inventions are described herein with reference to certain specific embodiments and examples. However, those skilled in the art will recognize that many variations may be made without departing from the scope and spirit of the invention disclosed herein, as those inventions set forth in the following claims are intended to cover all variations and modifications disclosed herein without departing from the spirit of the invention. The terms "including" and "having" as used in the specification and claims shall have the same meaning as the term "comprising".

[0109] For the purpose of illustration, the foregoing description uses specific nomenclature to provide a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that the embodiments can be practiced without specific details. Therefore, for the purpose of illustration and description, the foregoing description of the specific embodiments described herein is presented. They are not intended to be exhaustive or to limit the embodiments to the precise form disclosed. It will be apparent to those of ordinary skill in the art that, in view of the above teachings, many modifications and variations are feasible.

Claims

1. A component, comprising: a substrate comprising a first metal; a second metal secured to the substrate and defining an outer surface of the member, the first metal comprising aluminum and the second metal being different from the first metal; a porous aluminum oxide layer formed from the substrate and disposed adjacent to an interface between the substrate and the second metal; as well as A non-metallic material is directly coupled to the second metal and the porous alumina layer.

2. The component of claim 1, wherein the second metal is denser than the second metal. The component of claim 1 , wherein the substrate is thicker than the second metal.

4. The component of claim 1, wherein the non-metallic material comprises a polymer.

5. The member of claim 1, wherein the outer surface is curved.

6. The component of claim 1, wherein the non-metallic material comprises a flowable material.

7. The component of claim 6, wherein the flowable material is disposed within a plurality of pores of the porous alumina layer.

8. A housing for an electronic device, comprising: A side wall, the side wall comprising: a first metal defining an outer surface; and a second metal directly secured to the first metal, the second metal being less dense than the first metal and comprising a porous oxide layer; an oxide layer formed on a surface of the second metal; and A polymer portion is directly coupled to the oxide layer.

9. The housing of claim 8, wherein the first metal is denser than the second metal.

10. The housing of claim 9, wherein the second metal comprises aluminum.

11. The housing of claim 8, wherein the polymer portion comprises plastic.

12. The housing of claim 8, wherein the polymer portion comprises a resin.

13. The housing of claim 8, wherein the oxide layer includes etched bonding features.

14. The housing of claim 13, wherein the polymer portion interlocks with the engagement feature.

15. The housing of claim 8, wherein the first metal is secured to the second metal via a surface interlocking structure.

16. A component for an electronic device, comprising: A component, the component comprising: Metal; aluminum, the aluminum being directly secured to the metal; and a porous aluminum oxide layer defining at least one of a plurality of holes or etched bonding features, the porous aluminum oxide layer covering at least some of the aluminum and disposed adjacent an interface between the aluminum and the metal; and A non-metallic material is bonded to the member and extends into the plurality of holes.

17. The component of claim 16, wherein the aluminum is disposed between the non-metallic material and the metal.

18. The component of claim 16, wherein the etched engagement features define undercut features and the non-metallic material fills at least some of the undercut features.

19. The component of claim 16, wherein the non-metallic material comprises a polymer.

20. The component of claim 19, wherein the non-metallic material comprises at least one of a plastic or a resin.

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