An adjustable computer heat dissipation device and heat dissipation method

Abstract

The present invention relates to an adjustable computer heat dissipation device and a heat dissipation method, which includes a computer main chassis, a heat dissipation module, an adjustment module and a controller. The heat dissipation module is fixedly connected with an installation component. The heat dissipation module includes a fan blade and a heat sink. The fan blade is electrically connected to a driving member, and the driving member is connected to the installation component; the adjustment module includes a replacement plate, a heat dissipation chamber is provided in the replacement plate, a number of air flow pipes are installed in the heat dissipation chamber, a deformable ring is sleeved on the outer side wall of the air flow pipe, and an energy storage chamber is formed between the air flow pipe and the deformable ring. One end of the air flow pipe is provided with a through hole; the controller is signal-connected to a monitoring component, and the controller adjusts the power of the driving member according to the real-time temperature data monitored by the monitoring component. Compared with the prior art, the detachable and adjustable design of the present invention enables the heat dissipation device to easily adapt to computer main chassis of different models and specifications, and can automatically adjust the heat dissipation performance according to the real-time monitored temperature and wind speed data.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and in particular, to an adjustable computer cooling device and a cooling method. Background Art

[0002] With the rapid development of computer technology, the performance of computer hardware has been continuously improved. As a result, the density of electronic components inside the computer main chassis has become increasingly high, and the power consumption has also increased sharply. This trend has made the temperature problem inside the main chassis become increasingly prominent, and heat dissipation has become a key factor in ensuring the stable operation of the computer.

[0003] Traditional cooling devices, such as fixed fans and heat sinks, can alleviate the temperature problem inside the computer main chassis to a certain extent, but their cooling efficiency is often limited and their adaptability is poor. Especially in the fields of high-performance computers and servers, since these devices need to run at high loads for a long time, the heat dissipation problem has become one of the key factors restricting their performance and stable operation.

[0004] For example, the invention with the publication number CN107291183A discloses a special cooling chassis for computer hardware, including a main chassis. The upper surface of the main chassis is inlaid with a first cooling screen, and the right surface of the main chassis is inlaid with a second cooling screen. The computer hardware motherboard arranged inside the main chassis is fixedly connected to the main chassis through a motherboard fixing groove, and the computer hardware motherboard is fixedly connected to the heat sink through a heat conducting plate. A small fan motor is fixedly installed on the front surface of the inside of the main chassis, and the small fan motor is fixedly connected to a small fan blade. A fan motor group is fixedly installed on the left side of the heat sink, and the main shaft of the fan motor group is fixedly connected to the main shaft of the fan group. An air outlet net is arranged on the main chassis on the right side of the heat sink.

[0005] In addition, different models of computer main chassis have differences in size, structure, and heat dissipation requirements, which pose higher requirements for the design of cooling devices. An ideal cooling device should have good versatility and flexibility, be able to adapt to different models of main chassis, and meet various heat dissipation requirements. However, most of the existing cooling devices on the market adopt a fixed design and are difficult to meet the heat dissipation requirements of different models of main chassis. This results in users having to purchase specific cooling devices for different models of main chassis, which not only increases the usage cost but also brings inconvenience to the installation and use of users.

[0006] In addition, traditional cooling devices also have deficiencies in terms of energy consumption. Due to the change of heat dissipation requirements, traditional devices often cannot dynamically adjust their working states according to real-time heat dissipation requirements, resulting in excessive energy consumption. This not only wastes energy but also increases the operating cost of users. Summary of the Invention

[0007] The object of the present invention is to provide an adjustable computer heat dissipation device and a heat dissipation method to overcome the problem in the prior art that the working state cannot be dynamically adjusted according to the real-time heat dissipation requirements of the computer, resulting in excessive energy consumption.

[0008] The object of the present invention can be achieved by the following technical solutions:

[0009] This solution provides

[0010] An adjustable computer heat dissipation device, including a chassis, a heat dissipation module and an adjustment module. The heat dissipation module is detachably installed at one end of the chassis for discharging the heat in the chassis. The adjustment module includes a replacement plate, an air flow duct and an elastic ring. The air flow duct is in a hourglass shape structure. The replacement plate is detachably installed on the chassis. A heat dissipation chamber is provided in the replacement plate. The heat dissipation chamber is divided into a plurality of exhaust chambers by the elastic ring, and each exhaust chamber communicates with the outside of the heat dissipation chamber.

[0011] The air flow duct is installed in the heat dissipation chamber. One end of the heat dissipation chamber communicates with the inside of the chassis, and the other end is connected to the outside of the chassis. The elastic ring surrounds the outside of the air flow duct. An energy storage chamber is formed between the inner side wall of the elastic ring and the outer side wall of the air flow duct. A through hole is provided on the side wall of the air flow duct close to the chassis, and the energy storage chamber communicates with the air flow duct through the through hole.

[0012] Preferably, the heat dissipation module includes a mounting component, a driving motor, a fan blade and a heat sink;

[0013] The mounting component is detachably installed at one end of the chassis. The driving motor is fixed on the side of the mounting component close to the inside of the chassis. The fan blade is drivingly connected to the driving motor. The heat sink is connected to the heat dissipation structure and is arranged in front of the fan blade on the side away from the driving motor.

[0014] Preferably, the mounting component includes a mounting plate, a connecting rod and an adjusting member;

[0015] The mounting plate is fixed on the chassis. The adjusting member is rotatably fixed on the mounting plate. A sliding groove is provided on the side of the mounting plate close to the inside of the chassis. The connecting rod is slidably arranged in the sliding groove. One end of the connecting rod is drivingly connected to the adjusting member, and the other end abuts against the inner wall of the chassis.

[0016] The number of the sliding grooves and the connecting rods are both multiple. Each sliding groove is circumferentially and arrayedly distributed around the adjusting member for one week. Adjacent sliding grooves are perpendicular to each other. Each connecting rod is evenly distributed in the sliding groove. The ends of each connecting member away from the adjusting member are respectively located at the four corners of the same square.

[0017] Preferably, the adjusting member includes a handle, a gear, a rack and a locking rod;

[0018] The rack is installed at one end of the connecting rod. The gear is rotatably fixed on the mounting plate. The gear meshes with the rack. One end of the handle is fixed to the gear and is adapted to drive the gear to rotate. The other end of the handle is connected to the locking rod. A jack is provided on the mounting plate, and the locking rod is movably inserted into the jack;

[0019] The number of the jacks is multiple, and each jack is distributed along the movement track of the locking rod. The central axes of the locking rod and the jack are parallel to each other.

[0020] Preferably, the connecting rod is of an L-shaped structure and includes a driving rod and a mounting rod which are perpendicularly connected to each other. The driving rod is located in the sliding groove. The mounting rod is perpendicular to the plane where the mounting plate is located, and a suction cup is mounted on the mounting rod;

[0021] One end of the mounting rod in contact with the chassis is provided with a boss. The boss includes a first end face and a second end face which are perpendicular to each other. The first end face of the boss on the mounting rod and the second end face of the boss on the adjacent mounting rod are in the same plane.

[0022] Preferably, the diameter of the air flow duct gradually decreases from the air inlet to the through hole and gradually increases from the through hole to the air outlet;

[0023] The number of the air flow ducts is multiple, and each air flow duct is distributed in a rectangular array on the replacement plate. A plurality of bolt holes are also provided on the replacement plate, and each bolt hole is evenly distributed around the replacement plate.

[0024] Preferably, micro-nano self-cleaning coatings are provided on the surfaces of the heat sink and the air flow duct, which are suitable for adsorbing and decomposing dust particles in the air flow.

[0025] Preferably, the device further includes a controller and a monitoring component. The controller is respectively signal-connected to the driving motor and the monitoring component. The monitoring component is used for measuring the real-time temperature inside the chassis and the real-time wind speed inside the air flow duct.

[0026] Preferably, the controller is signal-connected to an early warning module and a remote monitoring module. The early warning module includes a buzzer and an indicator light. The remote monitoring module includes a mobile device, and the mobile device is wirelessly communicatively connected to the controller;

[0027] The adjusting module further includes a power component. The power component is connected to the controller and is used for adjusting the shape of the elastic ring.

[0028] This solution also provides an adjustable computer heat dissipation method, including the following steps:

[0029] Obtain the real-time temperature inside the chassis and the real-time wind speed in the air flow pipeline; when the real-time temperature inside the chassis is greater than the temperature threshold, increase the heat dissipation efficiency of the heat dissipation module; otherwise, decrease the heat dissipation efficiency of the heat dissipation module; when the deviation between the real-time wind speed and the ideal wind speed is greater than the preset threshold, adjust the shape of the elastic ring until the deviation between the real-time wind speed and the ideal wind speed is less than the preset threshold.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] 1. In this solution, the heat dissipation device exchanges heat with the components inside the chassis, and the heat after the exchange is discharged to the outside of the chassis through the air flow pipeline with the air flow, so as to dissipate heat from the computer. When the temperature inside the chassis rises, the elastic ring deforms due to heat, pushing the air in the energy storage chamber into the air flow pipeline through the through hole, increasing the pressure difference at both ends of the air flow pipeline, accelerating the air flow in the air flow pipeline, and improving the heat dissipation effect of the heat dissipation module.

[0032] By installing the replacement plate on one side of the chassis as the side wall of the chassis and setting the air flow pipeline communicating the inside and outside of the chassis on the replacement plate, when the temperature inside the chassis rises, the elastic ring compresses the energy storage chamber to send air to the air inlet end of the air flow pipeline, accelerating the air flow in the air flow pipeline, thereby improving the heat dissipation effect of the chassis. Utilizing the influence of the temperature change on the volume of the energy storage chamber, the adjustment module can adjust the heat dissipation filling according to the real-time heat dissipation demand, improving the heat dissipation efficiency and response speed of the heat dissipation device.

[0033] 2. Compared with the fixed heat dissipation devices in the prior art, by designing the detachable connection between the heat dissipation module and the computer main chassis and the adaptability of the installation components to different models of computer main chassis, the versatility and flexibility of the heat dissipation device are greatly improved. Users can easily install or replace the heat dissipation module according to the actual needs and the model of the computer main chassis, without having to purchase specific heat dissipation devices for different models of computer main chassis, reducing the usage cost.

[0034] 3. Compared with the heat dissipation devices lacking intelligent control in the prior art, through the collaborative work of the controller and the monitoring components, the real-time monitoring of the temperature inside the computer main chassis and the intelligent adjustment of the power of the driving parts are realized. This intelligent control strategy can not only accurately adjust the working state of the heat dissipation module according to the temperature data to avoid overheating or insufficient heat dissipation, but also reduce energy consumption while ensuring the heat dissipation effect, achieving green energy conservation.

[0035] 4. Compared with the complex-structured heat dissipation devices in the prior art, this solution reduces unnecessary components and complex connection structures through a simple and efficient design, thereby reducing the manufacturing and maintenance costs of the heat dissipation device. At the same time, the design of the deformable ring and the energy storage chamber also enhances the reliability and durability of the heat dissipation device, enabling the device to maintain good heat dissipation performance during long-term use. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 Isometric view of an embodiment of the computer heat dissipation device with automatic control according to the present invention;

[0037] Figure 2 Cross-sectional view of the computer main chassis in an embodiment of the computer heat dissipation device with automatic control according to the present invention;

[0038] Figure 3 Isometric view of the mounting component in an embodiment of the computer heat dissipation device with automatic control according to the present invention;

[0039] Figure 4 Rear view of the mounting component in an embodiment of the computer heat dissipation device with automatic control according to the present invention;

[0040] Figure 5 Schematic diagram of the installation of the mounting component and the heat dissipation module in an embodiment of the computer heat dissipation device with automatic control according to the present invention;

[0041] Figure 6 Rear view of the mounting component and the heat dissipation module in an embodiment of the computer heat dissipation device with automatic control according to the present invention;

[0042] Figure 7 Cross-sectional view of the replacement block in an embodiment of the computer heat dissipation device with automatic control according to the present invention;

[0043] Figure 8 Is Figure 7 Enlarged schematic view of part A in

[0044] Reference numerals in the drawings of the specification include: 1, chassis; 2, fan blade; 3, motor; 4, replacement plate; 401, heat dissipation chamber; 5, air flow duct; 6, elastic ring; 7, energy storage chamber; 8, round hole; 9, exhaust chamber; 10, mounting plate; 11, chute; 12, connecting rod; 121, driving rod; 122, mounting rod; 13, rack; 14, handle; 15, gear; 16, locking rod; 17, jack; 18, bolt hole. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0045] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Components of the embodiments of the present invention usually described and illustrated in the drawings here can be arranged and designed in various different configurations.

[0046] Therefore, the detailed description of the embodiments of the present invention provided in the drawings below is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0047] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0048] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this invention is customarily placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0049] It should be noted that the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality" means two or more unless otherwise specifically defined.

[0050] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0051] Embodiment 1

[0052] As shown in the attached Figures 1 to 8Shown: An automatically controllable computer cooling device, including a chassis 1, a heat dissipation module and an adjustment module detachably connected to the chassis 1. The heat dissipation module is used to discharge the heat generated inside the chassis 1, and the adjustment module is used to dynamically adjust the working state of the heat dissipation module according to the heat dissipation requirements. The heat dissipation module is fixedly connected with an installation component, and the installation component is used to adjust the size according to different models of the chassis 1 and install the heat dissipation module inside the chassis 1. Through the design of the installation component, the heat dissipation module can flexibly adapt to different models of the chassis 1, improving the versatility and practicability of the device of the present invention. The heat dissipation module includes a fan blade 2 and heat dissipation fins. The fan blade 2 is electrically connected to a driving member, and in this embodiment, the driving member is a motor 3. The driving member is fixedly connected to the installation component, and the heat dissipation fins are located in front of the side of the fan blade 2 away from the driving member. The fan blade 2 and the heat dissipation fins are reasonably designed and can effectively discharge the heat inside the chassis 1. That is, when the air flow passes through the heat dissipation fins, the heat dissipation fins absorb the heat inside the chassis 1 and transfer it to the air flow, thereby realizing heat exchange. The air flow after heat exchange is discharged from the chassis 1 through the air flow duct 5 to achieve the purpose of heat dissipation.

[0053] The installation component includes an installation plate 10. A plurality of sliding grooves 11 are opened on the installation plate 10. In this embodiment, there are four sliding grooves 11, and the sliding grooves 11 all extend towards the four corners of the installation plate 10. Connecting rods 12 are slidably fitted in the sliding grooves 11. The connecting rods 12 are of an L-shaped structure and include a driving rod 121 and an installation rod 122 connected perpendicularly to each other. The driving rod 121 is located in the sliding groove 11 and is welded with a rack 13. The installation rod 122 is perpendicular to the plane where the installation plate 10 is located, and a plurality of suction cups are installed on the installation rod 122. A handle 14 is rotatably fitted on the installation plate 10. One end of the handle 14 penetrates through the installation plate 10 and is coaxially and fixedly connected with a gear 15. The gear 15 meshes with the rack 13. A locking member for fixing the handle 14 is installed on the handle 14. The design of the locking member ensures that the handle 14 can be firmly fixed after being adjusted in place to prevent accidental movement. The locking member includes a locking rod 16. The locking rod 16 is slidably fitted with the end of the handle 14 away from the gear 15. A plurality of jacks 17 matching the locking rod 16 are opened on the installation plate 10.

[0054] The adjustment module includes a replacement plate 4. A heat dissipation chamber 401 is provided in the replacement plate 4. A number of air flow pipes 5 are installed in the heat dissipation chamber 401. An elastic ring 6 made of metal sheets is sleeved on the outer side wall of the air flow pipe 5. An energy storage chamber 7 is formed between the outer side wall of the air flow pipe 5 and the inner side wall of the elastic ring 6. The air flow pipe 5 connects the inside and the outside of the computer main case. A round hole 8 is opened at one end of the air flow pipe 5. The air flow pipe 5 communicates with the energy storage chamber 7 through the round hole 8. The remaining area of the heat dissipation chamber 401 is separated by the elastic ring 6 into exhaust cavities 9, and the exhaust cavities 9 are all communicated with the outside of the heat dissipation chamber 401; the cross section of the air flow pipe 5 is in the shape of a hourglass. A number of bolt holes 18 are opened on the replacement plate 4, and the bolt holes 18 are evenly distributed circumferentially around the replacement plate 4. In addition to their own functions, the jacks 17 on the mounting plate 10 and the bolt holes 18 on the replacement plate 4 can also play a role in ventilation and heat dissipation to a certain extent.

[0055] Among them, the design of the hourglass-shaped air flow pipe can generate a pressure difference inside the pipe by reducing the cross-sectional area of the pipe, so as to effectively control the flow rate. This design helps to ensure the stable flow of the air flow in the pipe and avoid the situation of too fast or too slow flow velocity. At the same time, the transition section of the hourglass shape can gradually reduce or increase the cross-sectional area of the pipe, making the pressure change of the air flow in the pipe more stable and reducing the energy loss and noise generated due to sudden pressure changes.

[0056] Moreover, the design of the hourglass-shaped air flow pipe helps to enhance the turbulence degree of the air flow in the pipe, thereby improving the heat exchange efficiency. Turbulence can increase the contact area and contact time between the air flow and the heat sink, so that heat can be transferred to the air flow faster and taken away. In addition, the hourglass-shaped pipe can better utilize the Coanda effect principle. By adjusting the pipe shape, the direction and speed of the air flow can be guided, so that the air flow can pass through the heat sink more effectively and take away heat.

[0057] Furthermore, the design of the bolt holes enables the replacement plate to be firmly connected to the computer main case through bolts. Since the bolt holes are evenly distributed circumferentially around the replacement plate, users can select the appropriate bolt hole positions for installation according to actual needs, thus improving the installation flexibility. At the same time, the evenly distributed bolt holes can ensure that the replacement plate is evenly stressed during installation, avoiding deformation or damage caused by uneven stress and improving the installation stability. The design of the bolt holes can be applied to a variety of different models of computer main cases. This design enhances the versatility and interchangeability of the heat dissipation module, enabling users to share the replacement plate between different devices and reducing the cost of spare parts.

[0058] Among them, the driving component is signal-connected to a controller, and the controller is signal-connected to a monitoring component. The monitoring component includes a temperature sensor, which is used to monitor the temperature inside the chassis 1 in real time and send the temperature data to the controller. The controller adjusts the power of the driving component according to the real-time temperature data monitored by the monitoring component, realizing the intelligent control of the heat dissipation effect. This intelligent adjustment method not only improves the heat dissipation efficiency but also reduces the energy consumption.

[0059] The specific implementation process is as follows: During use, remove the originally screw-fixed outer casings on both the left and right sides (i.e., the air intake side and the air outlet side) of the chassis 1 to make room for the installation of the heat dissipation module and the adjustment module. Install the heat dissipation module inside the chassis 1 through the installation component. During the installation process, first rotate the handle 14 on the mounting plate 10. The rotation of the handle 14 will drive the gear 15 fixedly connected coaxially with it to rotate together. The gear 15 drives the rack 13 meshing with it to move, and the rack 13 drives the connecting rod 12 to slide in the chute 11. Since the connecting rod 12 has an L-shaped structure, one end of the connecting rod 12 far from the chute 11 will gradually fit the inner side wall of the chassis 1 as it slides in the chute 11, and the suction cup on the connecting rod 12 is used to fix the connecting rod 12 to the inner side wall of the chassis 1. After fixation, push the locking rod 16 on the handle 14, and the locking rod 16 is inserted into the jack 17 on the mounting plate 10 to fix the handle 14, ensuring that the handle 14 can be firmly fixed after being adjusted in place to prevent accidental movement.

[0060] In this embodiment, through the sliding cooperation of the chute and the connecting rod of the installation component, as well as the meshing transmission of the rack and the gear, the user can flexibly adjust the position of the connecting rod according to the internal structure and size of different models of computer main chassis. This design not only improves the installation flexibility of the heat dissipation module but also enables it to adapt to more models of computer main chassis, enhancing the versatility and market competitiveness of the heat dissipation device. The user only needs to rotate the handle to drive the gear to rotate and drive the rack and the connecting rod to slide along the chute, thereby quickly adjusting the position of the suction cup. This mechanical adjustment method is easy to operate, without complex tools or steps, greatly reducing the installation difficulty and time cost for the user. At the same time, the setting of the locking part ensures that the handle can be firmly fixed at the required position after the adjustment is completed, preventing position changes caused by accidental touch or vibration and enhancing the user experience.

[0061] Among them, the sliding fit between the locking rod and the handle, as well as the design of the jack on the mounting plate, enable the user to easily fix the handle at the desired position by simply sliding the locking rod into the corresponding jack. This operation method is not only simple and fast, but also avoids the loosening or falling off of the handle caused by improper fixation, improving the safety and stability of the operation. After the locking rod is inserted into the jack, it can effectively prevent the handle from rotating due to accidental touch, vibration or external force, thus ensuring that the connecting rod remains in the set position and enhancing the firmness and reliability of the installation of the heat dissipation module. This design enables the heat dissipation module to maintain a stable heat dissipation effect in various complex environments, ensuring the normal operation of the computer main chassis.

[0062] After completing the installation of the heat dissipation module, the replacement plate 4 in the adjustment module needs to be installed on both sides of the chassis 1 next. A number of bolt holes 18 are evenly distributed on the replacement plate 4, and these bolt holes 18 are matched with the corresponding screw holes on the chassis 1. Therefore, the replacement plate 4 can be firmly installed on the chassis 1 with the shell removed through bolts, and can flexibly adapt to different models of the chassis 1.

[0063] After the installation is completed, the heat dissipation device enters the working state. The temperature sensor on the monitoring component is used to monitor the temperature inside the chassis 1 in real time, and the real-time monitored temperature data is transmitted to the controller, and the controller conducts real-time comparison and analysis of the real-time temperature data with the preset temperature threshold.

[0064] If the real-time temperature data is greater than the preset temperature threshold, it indicates that the temperature inside the chassis 1 is too high, and the heat dissipation module needs to be started for heat dissipation. At this time, the controller will start the motor 3 in the heat dissipation module, and the motor 3 drives the fan blade 2 to rotate. The rotation of the fan blade 2 will generate air flow. These air flows will pass through the heat sink, and the heat sink will absorb the heat inside the chassis 1 and transfer it to the air flow, thus realizing heat exchange. The air flow after heat exchange will be discharged from the chassis 1 through the air flow duct 5 to achieve the purpose of heat dissipation. During the entire heat dissipation process, the controller will intelligently adjust the power of the motor 3 according to the temperature data real-time monitored by the temperature sensor. When the temperature is high, the controller will increase the power of the motor 3 to improve the heat dissipation efficiency; when the temperature gradually decreases, the controller will decrease the power of the motor 3 to reduce energy consumption. This intelligent adjustment method not only improves the heat dissipation efficiency but also reduces energy consumption, making the heat dissipation device more energy-saving and environmentally friendly.

[0065] When the temperature in the chassis 1 continues to rise due to the increase in the running time and running load and reaches the metal sheet deformation temperature (40 °C), combined with the appendix Figure 3As indicated by the arrow shown, the elastic ring 6 in the air flow duct 5 of the replacement plate 4 will deform. The deformation of the elastic ring 6 will exert pressure on the original air in the energy storage chamber 7, causing the air in the energy storage chamber 7 to be discharged into the air flow duct 5 through the round hole 8. As the air in the energy storage chamber 7 is discharged, according to the Coandă effect principle, the air outside the chassis 1 is inhaled into the interior of the chassis 1, accelerating the air flow inside the chassis 1, thereby discharging the hot air inside the chassis 1.

[0066] When the temperature in the air flow duct 5 drops below the temperature threshold (such as 35 °C) at which the elastic ring 6 returns to its original shape, the elastic ring 6 will return to its original shape. At this time, if the temperature inside the chassis 1 rises again and reaches the temperature threshold at which the metal sheet deforms, the elastic ring 6 will deform again and repeat the above heat dissipation process. In this way, the heat dissipation device can continuously dissipate heat from the interior of the chassis 1 to ensure the stable operation of the computer.

[0067] Embodiment 2:

[0068] This embodiment is basically the same as Embodiment 1, except that the device further includes an intelligent warning module. The intelligent warning module includes a buzzer and an indicator light. The indicator light is used to flash and emit different colors of light to represent different warning reminders. For example, when the temperature inside the chassis 1 is lower than the safety threshold and does not rise, the indicator light may stay on with green light. When the temperature inside the chassis 1 is slightly on the high side but has not reached a dangerous level, the indicator light may flash with yellow light to remind the user to pay attention to the heat dissipation situation. And when the temperature rises abnormally and exceeds the preset safety threshold, the indicator light will switch to red light and flash quickly, indicating that the situation is urgent and immediate measures need to be taken. The buzzer is used to emit different alarm sounds. For example, when the temperature is slightly on the high side, the buzzer may emit a soft reminder sound, while when the temperature rises abnormally, it will emit a rapid and harsh alarm sound to attract the user's attention.

[0069] Both the indicator light and the buzzer are signal-connected to the controller; when the monitoring component detects that the temperature inside the chassis 1 is abnormal and the abnormal value exceeds the preset safety threshold, the intelligent warning module will immediately trigger an alarm, the indicator light will switch to red light and flash quickly, and the buzzer will also emit a rapid alarm sound. At the same time, the controller will automatically adjust the power of the driving component in the heat dissipation module to increase the heat dissipation efficiency and quickly reduce the temperature inside the chassis 1 to the safe range.

[0070] The specific implementation process is as follows: After installing the heat dissipation device and the adjustment module, signal-connect the intelligent warning module to the controller. Set the preset safety threshold to ensure that when the temperature rises abnormally, the intelligent warning module can trigger an alarm in a timely manner.

[0071] The monitoring component starts to monitor the temperature inside the chassis 1 in real time and sends the temperature data to the controller. When the controller receives the temperature data, it will conduct real-time comparison and analysis with the preset safety threshold. If the temperature data exceeds the preset safety threshold, the controller will immediately send a signal to the intelligent warning module to trigger an alarm. The indicator light of the intelligent warning module switches to red light and flashes rapidly, and the buzzer emits a rapid alarm sound. At the same time, the controller automatically adjusts the power of the driving component in the heat dissipation module to increase the heat dissipation efficiency.

[0072] After the user hears the alarm sound and sees the flashing of the indicator light, they should immediately check the heat dissipation situation of the chassis 1 and take necessary measures to ensure the normal operation of the device.

[0073] Embodiment 3:

[0074] This embodiment is basically the same as Embodiment 2, except that the adjustment module further includes a power component for adjusting the air flow duct 5. The power component is signal-connected to the controller. The controller controls the power component according to the temperature and wind speed data monitored by the monitoring component in real time, and dynamically adjusts the shape of the elastic ring 6 of the air flow duct 5 through the power component, thereby changing the cross-sectional area and air flow path of the air flow duct 5. In this embodiment, the power component is an electric cylinder, and the shape of the elastic ring 6 is adjusted by the telescopic movement of the electric cylinder.

[0075] The monitoring component further includes a wind speed sensor. The wind speed sensors are respectively arranged on the air flow ducts 5 of the replacement plates 4 on the air inlet side and the air outlet side, and are used to monitor the actual wind speed at the corresponding positions in real time and send the wind speed data to the controller. When the wind speed sensor detects that the deviation between the actual wind speed on the air inlet side or the air outlet side and the ideal wind speed is greater than the preset threshold, the controller adjusts the shape of the elastic ring 6 through the power component until the deviation between the actual wind speed detected by the wind speed sensor and the ideal wind speed is less than the threshold; at the same time, the controller also comprehensively judges and adjusts the power component according to the data of the temperature sensor.

[0076] The specific implementation process is as follows: The wind speed sensors in the monitoring component monitor the wind speeds on the air inlet side and the air outlet side in real time, and transmit the real-time monitored wind speed data to the controller. The controller conducts real-time comparison and analysis of the real-time wind speed data with the preset wind speed threshold. When the real-time wind speed data is less than the preset wind speed threshold, the controller sends a start command to the electric cylinder to control the telescopic movement of the electric cylinder.

[0077] The telescopic movement of the electric cylinder will drive the elastic ring 6 in the air flow pipeline 5 of the replacement plate 4 to deform. The deformation of the elastic ring 6 will exert pressure on the original air in the energy storage chamber 7, causing the air in the energy storage chamber 7 to be discharged into the air flow pipeline 5 through the round hole 8. As the air in the energy storage chamber 7 is discharged, according to the Coandă effect principle, the air outside the chassis 1 will be sucked into the air flow pipeline 5, thereby accelerating the air flow speed inside the chassis 1. This can not only more effectively discharge the hot air inside the chassis 1, but also adjust the cross-sectional area and air flow path of the air flow pipeline 5, making the actual wind speed gradually approach the ideal wind speed.

[0078] The controller continuously monitors the temperature and wind speed data and adjusts the electric cylinder according to the actual situation. When the temperature drops to the safe range and the deviation between the actual wind speed and the ideal wind speed is less than the preset threshold, the controller will stop adjusting the electric cylinder and maintain the current heat dissipation efficiency.

[0079] The adjustment component of the air flow pipeline dynamically adjusts the shape of the deformable ring of the air flow pipeline through the power component, so that the cross-sectional area and air flow path of the air flow pipeline can be changed in real time. This design enables the heat dissipation system to flexibly adjust the air flow according to the temperature and wind speed data monitored in real time, so as to maximize the heat dissipation efficiency. When the wind speed sensor detects a deviation between the actual wind speed on the air inlet side or the air outlet side and the ideal wind speed, the controller can quickly adjust the shape of the deformable ring through the power component until the deviation between the actual wind speed and the ideal wind speed is less than the preset threshold. This precise wind speed control helps to optimize the heat dissipation performance and ensure that the heat dissipation system always maintains the best working state. The controller also comprehensively considers the data of the temperature sensor. By comprehensively judging the change trends of temperature and wind speed, the controller can more accurately predict the heat dissipation requirements and adjust the power component in advance, thereby avoiding overheating or insufficient wind speed of the system and improving the overall stability of the system.

[0080] Embodiment 4:

[0081] This embodiment is basically the same as Embodiment 3, except that the device further includes a self-cleaning module. The self-cleaning module includes a micro-nano self-cleaning coating. The coating uses nanotechnology and has unique superhydrophobicity and superoleophilicity. When dust particles in the air come into contact with the coating surface, they will be adsorbed and fixed by the coating. Subsequently, under the action of sunlight, ultraviolet light or other external energy, the active components in the coating will start to decompose these dust particles, especially the organic substances in them, and finally convert them into harmless substances. This process not only reduces the accumulation of dust in the heat dissipation channels, but also keeps the surfaces of the heat sink and the air flow pipeline 5 clean, thereby improving the heat dissipation efficiency. The micro-nano self-cleaning coating covers the surfaces of the heat sink and the air flow pipeline 5. The micro-nano self-cleaning coating is used to adsorb and decompose dust particles in the air, reduce the risk of blockage of the heat dissipation channels, and maintain the heat dissipation efficiency.

[0082] Meanwhile, the controller automatically activates a reverse air blowing mode once according to a preset time interval or cumulative operation duration, and uses the airflow generated by the reversed fan to scour the surfaces of the heat sink and the air duct 5 to assist in cleaning, thereby extending the service life of the heat dissipation device and reducing the maintenance cost.

[0083] The specific implementation process is as follows: The controller monitors the operating status of the heat dissipation module in real time, including parameters such as temperature and wind speed. When the preset activation conditions for the reverse air blowing mode are met, the controller automatically enters the preparation stage.

[0084] The controller sends a reverse rotation command to the fan, and the fan starts to rotate in reverse and generates a reverse airflow. The reverse airflow scours the surfaces of the heat sink and the air duct 5, washing away the attached dust particles. During the scouring process, the micro-nano self-cleaning coating continues to perform its self-cleaning function and decomposes the residual organic matter.

[0085] After the reverse air blowing mode ends, the controller can evaluate the cleaning effect by monitoring parameters such as heat dissipation efficiency and wind speed. If the cleaning effect is not good, the controller can adjust the activation frequency or duration of the reverse air blowing mode. The controller can send a maintenance reminder to the user according to the usage situation of the self-cleaning module, and recommend manual cleaning or replacement of the micro-nano self-cleaning coating, etc.

[0086] Embodiment 5:

[0087] This embodiment is basically the same as Embodiment 4, except that the device further includes a remote monitoring module, which is used for the user to remotely view the real-time data of the temperature inside the chassis 1 and the fan speed through a mobile phone APP or computer software, and remotely adjust the working power of the heat dissipation module.

[0088] The specific implementation process is as follows: Connect the heat dissipation device to the Internet to ensure normal operation. Register and log in to the user account in the mobile phone APP or computer software, and add the heat dissipation device to the monitoring list. Through the mobile phone APP or computer software, the user can view the temperature inside the chassis 1 and the fan speed data in real time. The software interface should clearly display the current data and provide a historical data query function for the user to analyze the heat dissipation trend.

[0089] According to the real-time data, the user can remotely adjust the working power of the heat dissipation module in the mobile phone APP or computer software. The adjusted power setting should take effect immediately and be reflected in the real-time data. When abnormal temperature or fan speed is detected, the remote monitoring module should be able to automatically trigger an alarm and send a notification to the user through the mobile phone APP or computer software. The user can take timely measures according to the alarm information to ensure the safe operation of the chassis 1.

[0090] Users can understand the heat dissipation status of the chassis 1 in real time through the mobile APP or computer software without having to visit the site in person. The remote monitoring module supports querying historical data, which helps users analyze the heat dissipation trend and formulate corresponding maintenance plans. When the heat dissipation equipment malfunctions, the remote monitoring module can quickly trigger an alarm and notify the user to avoid potential safety hazards. Users can remotely adjust the heat dissipation power to avoid damage or failure caused by overheating of the equipment. The remote monitoring module reduces users' dependence on on-site monitoring and lowers the maintenance cost. Users can remotely adjust the heat dissipation power according to real-time data to avoid unnecessary energy waste.

[0091] The preferred specific embodiments of the present invention have been described in detail above. It should be understood that those of ordinary skill in the art can make many modifications and variations based on the concept of the present invention without creative efforts. Therefore, all technical solutions that can be obtained by those skilled in the art in the technical field of the present invention through logical analysis, reasoning, or limited experiments based on the concept of the present invention on the basis of the prior art should be within the protection scope determined by the claims.

Claims

1. An adjustable computer cooling device, characterized in that: The invention comprises a chassis (1), a heat dissipation module and an adjustment module, wherein the heat dissipation module is detachably mounted on one end of the chassis (1) and is used to discharge heat from the chassis (1); the adjustment module comprises a replacement plate (4), an airflow duct (5) and an elastic ring (6), wherein the airflow duct (5) is an hourglass-shaped structure, the replacement plate (4) is detachably mounted on the chassis (1), a heat dissipation chamber (401) is provided in the replacement plate (4), the heat dissipation chamber (401) is divided into a plurality of exhaust chambers (9) by the elastic ring (6), and each exhaust chamber (9) is connected to the outside of the heat dissipation chamber (401); The wind duct (5) is installed in the heat dissipation chamber (401); one end of the heat dissipation chamber (401) is connected to the inside of the chassis (1), and the other end is connected to the outside of the chassis (1); the elastic ring (6) is enclosed on the outside of the wind duct (5); the inner wall of the elastic ring (6) and the outer wall of the wind duct (5) enclose an energy storage chamber (7); a through hole (8) is provided on the side wall of the wind duct (5) at one end close to the chassis (1); and the energy storage chamber (7) is connected to the wind duct (5) through the through hole (8); The heat dissipation process of the computer heat dissipation device is as follows: Acquiring the real-time temperature inside the chassis (1) and the real-time wind speed of the airflow duct; when the real-time temperature inside the chassis (1) is greater than a temperature threshold, improving the heat dissipation efficiency of the heat dissipation module; On the contrary, the heat dissipation efficiency of the heat dissipation module is reduced; when the deviation between the real-time wind speed and the ideal wind speed is greater than the preset threshold, the shape of the elastic ring is adjusted until the deviation between the real-time wind speed and the ideal wind speed is less than the preset threshold.

2. The adjustable computer cooling device according to claim 1, characterized in that: The heat dissipation module comprises a mounting assembly, a drive motor (3), fan blades (2) and a heat sink; The mounting assembly is detachably mounted on one end of the chassis (1); the drive motor (3) is fixed to a side of the mounting assembly close to the interior of the chassis (1); the fan blade (2) is drivingly connected to the drive motor (3); and the heat sink is connected to the heat dissipation structure and is arranged in front of a side of the fan blade (2) away from the drive motor (3).

3. The adjustable computer cooling device according to claim 2, characterized in that: The mounting assembly comprises a mounting plate (10), a connecting rod (12) and an adjusting member; The mounting plate (10) is fixed on the chassis (1), the adjusting member is rotatably fixed on the mounting plate (10), a slide groove (11) is provided on one side of the mounting plate (10) close to the inside of the chassis (1), the connecting rod (12) is slidably arranged in the slide groove (11), one end of the connecting rod (12) drives the connecting adjusting member, and the other end abuts against the inner wall of the chassis (1); The number of the slide grooves (11) and the connecting rods (12) are both multiple, the slide grooves (11) are distributed in a circular array around the adjusting member, adjacent slide grooves (11) are perpendicular to each other, the connecting rods (12) are evenly distributed in the slide grooves (11), and the ends of the connecting members (12) away from the adjusting member are respectively located at the four corners of the same square.

4. The adjustable computer cooling device according to claim 3, characterized in that: The adjusting member comprises a handle (14), a gear (15), a rack (13) and a locking rod (16); The rack (13) is mounted on one end of the connecting rod (12); the gear (15) is rotatably fixed on the mounting plate (10); the gear (15) is meshed with the rack (13); one end of the handle (14) is fixed on the gear (15) and is suitable for driving the gear (15) to rotate; the other end of the handle (14) is connected to a locking rod (16); a socket (17) is provided on the mounting plate (10); and the locking rod (16) is movably inserted into the socket (17); There are a plurality of the insertion holes (17), each of which is distributed along the movement trajectory of the locking rod (16), and the central axes of the locking rod (16) and the insertion holes (17) are parallel to each other.

5. The adjustable computer cooling device according to claim 4, characterized in that: The connecting rod (12) is an L-shaped structure, comprising a driving rod (121) and a mounting rod (122) which are vertically connected to each other, the driving rod (121) is located in the slide groove (11), the mounting rod (122) is perpendicular to the plane where the mounting plate (10) is located, and a suction cup is installed on the mounting rod (122); One end of the mounting rod (122) contacting the chassis (1) is provided with a boss, the boss comprising a first end face and a second end face perpendicular to each other, the first end face of the boss on the mounting rod and the second end face of the boss on the adjacent mounting rod being located in the same plane.

6. The adjustable computer cooling device according to claim 1, characterized in that: The diameter of the air flow duct (5) gradually decreases from the air inlet to the through hole (8), and gradually increases from the through hole (8) to the air outlet; The number of the air flow ducts (5) is multiple, and the air flow ducts (5) are distributed on the replacement plate (4) in a rectangular array. The replacement plate (4) is also provided with multiple bolt holes (18), and the bolt holes (18) are evenly distributed around the replacement plate (4).

7. The adjustable computer cooling device according to claim 2, characterized in that: The surfaces of the heat sink and the air flow duct (5) are both provided with a micro-nano self-cleaning coating suitable for absorbing and decomposing dust particles in the air flow.

8. The adjustable computer cooling device according to claim 1, characterized in that: The device also includes a controller and a monitoring component, wherein the controller is signal-connected to the drive motor (3) and the monitoring component respectively, and the monitoring component is used to measure the real-time temperature inside the chassis (1) and the real-time wind speed in the wind duct (5).

9. The adjustable computer cooling device according to claim 8, characterized in that: The controller signal is connected to an early warning module and a remote monitoring module, the early warning module includes a buzzer and an indicator light, and the remote monitoring module includes a mobile device, and the mobile device is wirelessly connected to the controller; The adjustment module further comprises a power piece, the power piece is connected to the controller, and the power piece is used to adjust the shape of the elastic ring (6).

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