Manufacturing process optimization control method and system for main control board electronic components

Abstract

The present application provides a manufacturing process optimization control method and system for electronic components of a main control panel, and relates to the field of manufacturing process optimization technology, including: obtaining a historical manufacturing database of electronic components in a main control panel of a steering wheel; extracting a first historical record in a historical electronic manufacturing data record; analyzing the first manufacturing process record to obtain an optimal historical manufacturing plan, and using the optimal historical manufacturing plan as an initial optimal solution; optimizing the initial optimal solution according to a first constraint in a predetermined optimization constraint to obtain a first optimal candidate solution; optimizing an optimal solution set formed based on the first optimal candidate solution; and designing and manufacturing a multi-layer PCB board for electronic components according to the target optimal solution. The present application can solve the technical problem of signal interference caused by unreasonable wiring in PCB board design in the prior art, and achieve the technical effect of improving circuit board performance and enhancing system stability and reliability.

Description

Technical Field

[0001] The present application relates to the technical field of manufacturing process optimization, and in particular to a manufacturing process optimization control method and system for electronic components of a main control board. Background Art

[0002] The electronic part of the steering wheel main control board is usually composed of multi-layer PCB boards. These circuit boards realize complex circuit functions by stacking multiple circuit layers in order to carry more electronic components and provide stronger performance. The design and manufacturing of PCB boards directly affect the functional stability of the main control board. The rationality of the design and the quality control during the manufacturing process are the key factors to ensure the normal operation of the circuit board.

[0003] At present, there are still some technical challenges and defects in the electronic design and manufacturing process of the steering wheel main control board. In the design process of the PCB board, if the wiring is unreasonable, it may cause problems such as signal interference and electrical performance degradation. Especially in high-density, multi-layer PCB design, how to reasonably arrange the circuits of each layer, reduce signal transmission delays, and avoid cross interference is an urgent problem to be solved. Excessive wiring or inappropriate signal paths will cause delays and quality problems in signal transmission, affecting the performance of the circuit board. For example, some signals may cause transmission delays due to long current loops, which in turn affects the response speed of the entire system and even causes system failure. In order to ensure the normal operation of the steering wheel main control board and the safety of the system, it is urgent to strengthen precision control, optimize design solutions, improve process levels, and solve potential problems such as signal failure, current short circuit, and overheating during PCB design and manufacturing.

[0004] In summary, the prior art has technical problems such as signal interference caused by unreasonable wiring in PCB board design, too long signal transmission path and inappropriate signal path, which further affects the response speed of the circuit board, performance stability and normal operation of the system. Summary of the invention

[0005] The purpose of this application is to provide a manufacturing process optimization control method and system for main control board electronic components, so as to solve the technical problems in the prior art that signal interference is caused by unreasonable wiring in PCB board design, too long signal transmission path and inappropriate signal path, which further affects the response speed of the circuit board, performance stability and normal operation of the system.

[0006] In view of the above problems, the present application provides a manufacturing process optimization control method and system for electronic components of a main control board.

[0007] In the first aspect, the present application provides a manufacturing process optimization control method for electronic components of a main control board, which is implemented by a manufacturing process optimization control system for electronic components of a main control board, including: obtaining a historical manufacturing database of electronic components in the main control board of a steering wheel, the historical manufacturing database including historical electronic manufacturing data records of the electronic components; extracting a first historical record in the historical electronic manufacturing data record, the first historical record refers to a first manufacturing process record of a first multi-layer PCB board; introducing a primary evaluation strategy to analyze the first manufacturing process record to obtain an optimal historical manufacturing plan, and using the optimal historical manufacturing plan as an initial optimal solution; reading a predetermined optimization constraint, and optimizing the initial optimal solution according to the first constraint in the predetermined optimization constraint to obtain a first optimal candidate solution; introducing an intermediate evaluation strategy to optimize the optimal solution set formed based on the first optimal candidate solution to obtain a target optimal solution; and designing and manufacturing a multi-layer PCB board for the electronic component according to the target optimal solution.

[0008] In a second aspect, the present application further provides a manufacturing process optimization control system for electronic components of a main control panel, which is used to execute the manufacturing process optimization control method for electronic components of a main control panel as described in the first aspect, including: a data acquisition module, the data acquisition module is used to acquire a historical manufacturing database of electronic components in the main control panel of the steering wheel, the historical manufacturing database includes historical electronic manufacturing data records of the electronic components; a record extraction module, the record extraction module is used to extract a first historical record in the historical electronic manufacturing data record, the first historical record refers to a first manufacturing process record of a first multi-layer PCB board; a record analysis module, the record analysis module is used to A primary evaluation strategy is introduced to analyze the first manufacturing process record to obtain the optimal historical manufacturing plan, and the optimal historical manufacturing plan is used as the initial optimal solution; an optimization module, the optimization module is used to read the predetermined optimization constraints, and optimize the initial optimal solution according to the first constraint in the predetermined optimization constraints to obtain a first optimal candidate solution; an optimization analysis module, the optimization analysis module is used to introduce an intermediate evaluation strategy to perform optimization analysis on the optimal solution set composed based on the first optimal candidate solution to obtain a target optimal solution; a design and manufacturing module, the design and manufacturing module is used to design and manufacture a multi-layer PCB board for the electronic component according to the target optimal solution.

[0009] The technical solution provided in the present application has at least the following technical effects or advantages: by obtaining a historical manufacturing database of electronic components in a main control panel of a steering wheel, the historical manufacturing database includes historical electronic manufacturing data records of the electronic components; extracting a first historical record in the historical electronic manufacturing data record, the first historical record refers to a first manufacturing process record of a first multi-layer PCB board; introducing a primary evaluation strategy to analyze the first manufacturing process record to obtain an optimal historical manufacturing plan, and using the optimal historical manufacturing plan as an initial optimal solution; reading a predetermined optimization constraint, and optimizing the initial optimal solution according to the first constraint in the predetermined optimization constraint to obtain a first optimal candidate solution; introducing an intermediate evaluation strategy to optimize and analyze the optimal solution set formed based on the first optimal candidate solution to obtain a target optimal solution; designing and manufacturing a multi-layer PCB board for the electronic component according to the target optimal solution, that is, by achieving the technical goals of optimizing PCB design and reducing signal interference, the technical effects of improving signal transmission efficiency, improving circuit board performance, and enhancing system stability and reliability are achieved.

[0010] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented according to the contents of the specification, and in order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are specifically cited below. It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present application, nor is it intended to limit the scope of the present application. Other features of the present application will become easy to understand through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the present application or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0012] Figure 1 A schematic diagram of the process flow of the manufacturing process optimization control method for the electronic components of the main control board used in this application;

[0013] Figure 2 This is a schematic diagram of the structure of the manufacturing process optimization control system used for the electronic components of the main control board in this application.

[0014] Description of reference numerals:

[0015] Data acquisition module 11, record extraction module 12, record analysis module 13, optimization module 14, optimization analysis module 15, design and manufacturing module 16. DETAILED DESCRIPTION

[0016] This application provides a manufacturing process optimization control method and system for the electronic components of the main control board, which solves the technical problem in the prior art that signal interference is caused by unreasonable wiring in the PCB board design, too long signal transmission path, and inappropriate signal path, which further affects the response speed, performance stability and normal operation of the circuit board. The technical goal of optimizing PCB design and reducing signal interference is achieved, and the technical effect of improving signal transmission efficiency, improving circuit board performance, and enhancing system stability and reliability is achieved.

[0017] Below, the technical solutions in the present application will be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments of the present application. It should be understood that the present application is not limited to the example embodiments described herein. Based on the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application. It should also be noted that, for the convenience of description, only the parts related to the present application are shown in the accompanying drawings, rather than all of them.

[0018] For example, please refer to the attached Figure 1 The present application provides a manufacturing process optimization control method for a main control board electronic component, which is applied to a manufacturing process optimization control system for a main control board electronic component, and specifically includes the following steps:

[0019] Step 1: Acquire a historical manufacturing database of electronic components in a main control panel of a steering wheel, wherein the historical manufacturing database includes historical electronic manufacturing data records of the electronic components.

[0020] Specifically, the historical manufacturing database of the electronic components in the main control board of the steering wheel is obtained. The historical manufacturing database includes all information related to the production of electronic components in the main control board in the historical time, that is, the electronic manufacturing data record of the main control board, that is, the detailed data of the electronic parts involved in each manufacturing process, such as the selection of electronic components, layout design, circuit board production process, welding process parameters, etc., which are used to trace the manufacturing process of the main control board in different production batches and provide important references for quality control and fault analysis. Among them, the historical manufacturing database is as follows:

[0021]

[0022] Step 2: Extract a first historical record from the historical electronic manufacturing data record, where the first historical record refers to a first manufacturing process record of a first multi-layer PCB board.

[0023] Specifically, historical records are randomly extracted from historical electronic manufacturing data records as first historical records. The first historical records contain the manufacturing process data of the first multi-layer PCB board used in the production process of the main control board as the first manufacturing process record. Among them, the multi-layer PCB board is a circuit board composed of multiple circuit layers stacked together, each layer carries different circuit functions and is connected by welding or other processes. The first multi-layer PCB board refers to the multi-layer PCB board corresponding to the first historical record. The first manufacturing process record refers to the manufacturing process record corresponding to the first multi-layer PCB board. The manufacturing process record in the first historical record describes the process flow adopted by the PCB board during production, such as the temperature and pressure parameters during the stacking process, or the wiring method of each layer of circuit pattern, etc., so as to provide a basis for subsequent quality improvement or problem analysis.

[0024] Step three: Introduce a primary evaluation strategy to analyze the first manufacturing process record to obtain an optimal historical manufacturing plan, and use the optimal historical manufacturing plan as the initial optimal solution.

[0025] Specifically, the primary evaluation strategy refers to the evaluation criteria and detection process for signal transmission quality, which is used to ensure that the signal transmission on the circuit board is not interfered with and the loss is minimal. The primary evaluation strategy is introduced to analyze the first manufacturing process record. Among them, the first manufacturing process record contains parameters in the process, such as temperature, pressure, production process, etc. By evaluating the impact of different factors on the production results, such as welding quality, wiring design, etc., the process links that are critical to the final result are determined, and the optimal historical manufacturing plan is obtained. The optimal historical manufacturing plan may be manifested as high production efficiency and low failure rate. The optimal historical manufacturing plan is used as the initial optimal solution for further improvement and adjustment to ensure that the new production process can achieve better performance or higher efficiency on the existing basis.

[0026] Step 4: Read the predetermined optimization constraints, and optimize the initial optimal solution according to the first constraint in the predetermined optimization constraints to obtain a first optimal candidate solution.

[0027] Specifically, the predetermined optimization constraints are read, and the conditions or standards used to limit or guide the optimization process are obtained from the pre-set optimization goals to ensure that the optimization process is carried out under the premise of meeting certain practical requirements or design rules. The predetermined optimization constraints can be parameters such as maximum signal transmission speed, minimum energy consumption, and shortest wiring length. According to the first constraint in the predetermined optimization constraint as a guiding principle, the initial optimal solution is further adjusted or optimized to achieve a design solution that better meets the first constraint condition. The optimization process not only seeks the optimal solution, but also ensures that the solution meets these specific constraints, the total length of the signal line or the total length of the loop is within the corresponding threshold constraint, and the manufacturing process that meets the signal integrity requirements is used as the optimal candidate solution, and then the first optimal candidate solution is obtained, and it is used as one of the candidate solutions. The candidate solution meets the predetermined performance standards or design requirements better than the initial solution. By introducing constraints for optimization based on the initial optimal solution, a design solution that better meets the actual use conditions can be obtained, thereby improving the performance and reliability of the circuit.

[0028] Step 5: Introduce an intermediate evaluation strategy to perform optimization analysis on the optimal solution set based on the first optimal candidate solution to obtain the target optimal solution.

[0029] Specifically, an intermediate evaluation strategy is introduced. The intermediate evaluation strategy is used to evaluate the quality of different solutions, such as performance, stability, and feasibility. It can perform multi-dimensional analysis on candidate solutions to help determine which solutions are more practical. Next, the optimal solution set based on the first optimal candidate solution is optimized, which means that after obtaining the first optimal candidate solution, these candidate solutions are used to create an optimal solution set. The optimal solution set includes multiple solutions that have been initially optimized, and then further analysis is performed to find the most suitable solution. For example, if the initially optimized solution set includes different wiring schemes and component layouts, the next step is to further screen out the best performance solution through optimization analysis to obtain the target optimal solution. After optimization analysis, a final solution that meets all predetermined standards and can achieve the best performance is obtained. The target optimal solution is the most ideal solution after multiple optimizations and evaluations, which may achieve the best balance in terms of signal transmission, cost control, power consumption, etc. By introducing the intermediate evaluation strategy, the optimization process is more accurate, and the most practical and optimal solution can be selected from a set of candidate solutions, thereby improving the overall performance and reliability of the circuit.

[0030] Step six: designing and manufacturing a multi-layer PCB board for the electronic component according to the target optimal solution.

[0031] Specifically, the target optimal solution is applied to the actual design and production of the main control board, and the multi-layer PCB board is designed and manufactured for the electronic components in the main control board. The target optimal solution is the best design solution obtained through optimization and evaluation, including circuit layout, signal transmission, component arrangement and other aspects. For example, the target optimal solution may include the optimal wiring scheme between a power module and a processor, or specify the layout method of each layer of circuit to ensure the efficiency and reliability of signal transmission. Next, the multi-layer PCB board is designed based on the optimal solution. A multi-layer PCB board refers to a circuit board composed of multiple circuit layers stacked together, which can accommodate more circuits and functional modules in a limited space and can be used in complex electronic products. In the design process, the circuit wiring, component layout, etc. of each layer are reasonably arranged to ensure the performance and stability of the entire circuit. Finally, according to the design drawings and process requirements, the actual multi-layer PCB board is produced using the corresponding production equipment, and a circuit board that can be used to assemble electronic components is finally formed through multiple steps such as material selection, lamination, drilling, and welding. Designing and manufacturing a multi-layer PCB board according to the target optimal solution can ensure that the circuit design of the product is both efficient and stable, and can meet the performance requirements in actual applications.

[0032] The manufacturing process optimization control method for the main control board electronic components is applied to the manufacturing process optimization control system of the main control board electronic components, which can achieve the technical goals of optimizing PCB design and reducing signal interference, and achieve the technical effects of improving signal transmission efficiency, enhancing circuit board performance, and enhancing system stability and reliability.

[0033] Furthermore, the present application also includes: extracting the integrity evaluation plan in the primary evaluation strategy; performing signal integrity detection on the first multi-layer PCB board according to the integrity evaluation plan to obtain a first integrity result; when the first integrity result reaches a predetermined signal integrity threshold, extracting the actual performance evaluation plan in the primary evaluation strategy; performing historical fault analysis on the first multi-layer PCB board according to the actual performance evaluation plan to obtain a first fault index; when the first fault index is within a predetermined fault index threshold, adding the first manufacturing process record to the candidate solution set; arranging the candidate solution set in ascending order based on the number of signal layers to obtain an ascending list of candidate solutions; and taking the first candidate solution in the ascending list of candidate solutions as the initial optimal solution.

[0034] Specifically, the integrity evaluation plan in the primary evaluation strategy is extracted, and the methods and steps for judging signal integrity are extracted. For example, the integrity evaluation plan includes the frequency range and test equipment required for detection.

[0035] According to the standards and methods specified in the integrity evaluation plan, the first multi-layer PCB board is tested to evaluate the quality of the signal on the circuit board, whether there are problems such as reflection, noise or attenuation, and the test results obtained are quantified as the first integrity results.

[0036] The predetermined signal integrity threshold is obtained by a person skilled in the art through a custom setting according to actual conditions. When the first integrity result reaches the predetermined signal integrity threshold, it indicates that the signal transmission quality meets the preset signal integrity threshold, and then the actual performance evaluation plan in the primary evaluation strategy is extracted, and after the signal integrity test is qualified, the actual performance evaluation is performed.

[0037] According to the actual performance evaluation plan, a historical failure analysis is performed on the first multi-layer PCB board to obtain a first failure index. The historical failure analysis collects and analyzes the failure records of the board during past use, thereby calculating a comprehensive failure index, which further reflects the stability and reliability of the multi-layer PCB board in actual use.

[0038] When the first fault index is within the predetermined fault index threshold, the first manufacturing process record is added to the candidate solution set. If the fault index obtained by analysis is lower than the predetermined threshold value, it indicates that the PCB board performs well and is taken as part of the candidate solution. The candidate solution set refers to multiple manufacturing process records that meet the conditions and are used as the preferred solution.

[0039] The candidate solution set is arranged in ascending order based on the number of signal layers to obtain an ascending list of candidate solutions, and the candidate solutions are sorted according to the number of signal layers in each candidate solution. The number of signal layers refers to the number of layers used to transmit signals in the PCB board. Among them, the more signal layers, the higher the complexity of the circuit design, the higher the possibility of signal failure, and vice versa. By arranging in ascending order, the solutions with fewer signal layers are listed first, and the most promising design solutions are gradually screened out.

[0040] From the sorted candidate solution list, select the first solution with the least number of signal layers as the preliminary optimal solution. This solution may be the simplest and most cost-effective solution and can be used as the starting point for subsequent optimization.

[0041] Through multiple steps, the most suitable manufacturing process solution is gradually screened out to provide a basis for further optimization and production.

[0042] Furthermore, the present application also includes: obtaining a first fault record of the first multi-layer PCB board, the first fault record including a first signal failure timing, a first current short circuit timing and a first line temperature timing; reading a predetermined fault timing indicator, and based on the predetermined fault timing indicator, sequentially collecting features of the first signal failure timing, the first current short circuit timing and the first line temperature timing, to obtain a first timing indicator parameter group, a second timing indicator parameter group and a third timing indicator parameter group, respectively; sequentially weighting the first timing indicator parameter group, the second timing indicator parameter group and the third timing indicator parameter group after standardization, to obtain a first weighted index, a second weighted index and a third weighted index, respectively; according to the actual performance evaluation plan, taking the maximum value of the first weighted index, the second weighted index and the third weighted index as the first fault index.

[0043] Specifically, a fault record is obtained from the first multi-layer PCB board as the first fault record. The first fault record includes a first signal failure timing, a first current short circuit timing and a first line temperature timing, that is, timing records of signal failure, current short circuit and line temperature abnormality are extracted from the historical fault data of the multi-layer PCB board. The timing record refers to the record of the time when the fault occurs.

[0044] The predetermined fault timing index refers to the time point, duration, frequency, etc. of the fault occurrence, which are used to quantify the fault. Read the predetermined fault timing index. Based on the predetermined fault timing index, the first signal failure timing, the first current short circuit timing, and the first line temperature timing are sequentially characterized and the timing characteristic parameters related to the signal failure are extracted from the first signal failure timing, the characteristics related to the current short circuit are extracted from the second current short circuit timing, and the characteristics of the temperature change are extracted from the third line temperature timing, and the first timing indicator parameter group, the second timing indicator parameter group, and the third timing indicator parameter group are respectively obtained for subsequent analysis.

[0045] The first, second and third timing indicator parameter groups are standardized to unify data standards. The first, second and third timing indicator parameter groups after standardization are weighted calculated in turn, and different weights are assigned for weighted calculation to obtain the first weighted index, the second weighted index and the third weighted index respectively, and the influence of different features on the overall fault analysis is analyzed to obtain the importance of each fault feature.

[0046] Since the maximum value represents the most serious situation in the fault performance and reflects the most critical performance indicator of the multi-layer PCB board during actual use, according to the evaluation criteria of the actual performance, the maximum value is selected from the weighted indexes of the first weighted index, the second weighted index and the third weighted index as the final fault index, and finally the first fault index is obtained, that is, a comprehensive evaluation of the overall fault condition of the PCB board is obtained.

[0047] By extracting and analyzing fault sequence data, the occurrence sequence of different fault types is identified, and the data is feature extracted based on predetermined indicators. Then, the weighted index of each fault feature is obtained through weighted calculation. Finally, the most serious fault manifestation is selected as the first fault index, providing an effective quantitative basis for fault analysis and early warning, thereby helping to identify and solve potential quality problems.

[0048] Furthermore, the present application also includes: the predetermined optimization constraints at least include a signal line total length threshold and a loop total length threshold.

[0049] Specifically, the predetermined optimization constraint includes at least a total signal line length threshold. The total signal line length threshold refers to a limit set during the optimization design process on the total length of the signal line. The total signal line length refers to the total length of all signal transmission lines in the circuit board. The circuit design requires the length of the signal line to be as short as possible to reduce signal attenuation, delay, and noise interference.

[0050] The total loop length threshold is a limit set on the length of the loop layout during the optimization process. In circuit design, a loop refers to a loop or closed path that is part of a signal transmission or current flow. The length of the loop affects the stability or efficiency of the circuit, so a threshold needs to be set for the total length of the loop.

[0051] The purpose of pre-setting optimization constraints is to ensure that the circuit design has the best performance in terms of signal transmission and stability, while avoiding the adverse effects caused by too long signal lines or loops. By setting the total length threshold of the signal line and the total length threshold of the loop, the circuit layout is optimized, possible signal distortion or delay is reduced, and the overall performance of the circuit is improved.

[0052] Furthermore, the present application also includes: adjusting the initial optimal solution based on the first constraint to obtain a first solution; performing a signal integrity test on a first multi-layer PCB test board made based on the first solution to obtain a first test board integrity result; if the first test board integrity result does not reach the predetermined signal integrity threshold, adjusting the first solution to obtain a second solution; performing a signal integrity test on a second multi-layer PCB test board made based on the second solution to obtain a second test board integrity result; if the second test board integrity result reaches the predetermined signal integrity threshold, adding the second solution to the first optimal candidate solution.

[0053] Specifically, the first constraint refers to the conditions or restrictions that need to be met during the design process. The initial optimal solution is adjusted based on the first constraint, and the first solution obtained is a new solution that better meets the actual requirements.

[0054] The signal integrity test is performed on the first multi-layer PCB test board made based on the first solution to obtain the integrity result of the first test board, and a multi-layer PCB test board is made and subjected to signal integrity test. Signal integrity test is used to evaluate whether the signal is interfered or distorted when it is transmitted on the circuit board to ensure that the signal can be transmitted clearly and stably. If a design parameter in the first solution changes, such as the adjustment of the signal line length, the impact of these changes on the signal quality is detected, and the integrity result of the first test board obtained will indicate whether there are signal transmission quality problems on the circuit board, such as reflection, noise or delay.

[0055] If the signal integrity of the first test board does not meet the requirements, that is, it does not meet the set signal integrity threshold standard, it is necessary to further optimize the plan and make modifications based on the test results, such as adding shielding measures, optimizing wiring paths, etc., to obtain a new design plan, namely the second solution.

[0056] The signal integrity test is performed on the second multi-layer PCB test board made based on the second solution, that is, the signal integrity of the second PCB test board is manufactured and tested to verify whether the second solution can meet the predetermined signal integrity requirements and obtain the integrity result of the second test board. If the second solution is better optimized than the first solution, the signal quality of the test board may be improved.

[0057] If the integrity result of the second test board reaches the predetermined signal integrity threshold, the second solution is added to the first optimal candidate solution. When the signal integrity test result of the second test board meets the standard, the second solution will be regarded as a valid candidate solution and added to the set of all possible optimization solutions. The second solution may become a better design solution, providing reliability and quality of signal transmission.

[0058] By adjusting the initial optimal solution and combining it with the first constraint, a new first solution is obtained, and the first solution is verified by signal integrity testing. If the first solution does not meet the predetermined requirements, the second solution is further adjusted and verified by testing again. If the second solution meets the standards, it is added to the solution set as a better candidate solution, and then through multiple iterations and verifications, the design solution is continuously optimized to ensure that the best circuit performance and signal quality are finally achieved.

[0059] Furthermore, the present application also includes: obtaining any solution in the optimal solution set, and making any multi-layer PCB board based on the arbitrary solution; visualizing the arbitrary multi-layer PCB board based on the wiring visual plan in the intermediate evaluation strategy to obtain an arbitrary wiring visual graph; performing matrix-vector processing on the arbitrary wiring visual graph to obtain an arbitrary wiring eigenvalue; and screening to obtain the target optimal solution with the minimum eigenvalue as the target.

[0060] Specifically, a solution is selected from the optimal solution set and used as the design basis to manufacture a multi-layer PCB board. The optimal solution set refers to a set of possible best solutions obtained after optimization calculation, where each solution represents a possible design scheme. An arbitrary solution refers to randomly selecting one from the best solutions for further processing. For example, if the optimal solution set contains different signal routing methods, an arbitrary solution is to select a routing method from it and manufacture a multi-layer PCB board based on this solution. A multi-layer PCB board refers to a circuit board composed of multiple circuit layers stacked together, which can accommodate more functional modules and more complex circuits.

[0061] Based on the wiring visual plan in the intermediate evaluation strategy, any multi-layer PCB board is visualized to obtain any wiring visual diagram. According to the visualization scheme provided by the intermediate evaluation strategy, the manufactured multi-layer PCB board is graphically displayed. The wiring visual plan is used to display the wiring on the circuit board in the form of a visual diagram, which is convenient for analysis and optimization. For example, the signal lines and ground lines on the circuit board are displayed as lines of different colors, so that designers can intuitively check whether the wiring is reasonable and whether there are problems such as short circuits or interference.

[0062] Convert the visual wiring diagram into a mathematical matrix form, and then extract the key features of the wiring diagram. Matrix vectorization is a data processing method that can convert graphic data into a format that can be mathematically analyzed and calculated. Through the conversion, the wiring visualization can be expressed as a set of values, each of which represents a certain feature of the wiring, such as the density, length, number of intersections, etc. of the wiring. The characteristic value can help evaluate the quality of the wiring scheme, such as whether the wiring is too long, whether there are excessive intersections, etc.

[0063] The optimal solution of the target is obtained by screening with the minimum characteristic value of any wiring as the goal. By comparing all possible wiring characteristic values, the solution with the smallest characteristic value is selected as the final optimal solution. Minimizing the wiring characteristic value is usually to optimize the performance of the circuit board, such as reducing signal delay, reducing noise interference, etc. For example, if the wiring path of some solutions in the wiring characteristic value is longer or has more intersections, the characteristic value will be larger, and vice versa. The solution with the smallest characteristic value represents the optimal wiring design, which can provide more stable signal transmission and more efficient circuit performance.

[0064] Through multiple iterative analyses, the most effective solution is gradually found, which improves the accuracy and reliability of circuit design.

[0065] Furthermore, the present application also includes: assembling an electronic component set of the arbitrary multi-layer PCB board, and extracting the first electronic component and the second electronic component in the electronic component set in turn; obtaining the connecting line between the first electronic component and the second electronic component, and collecting features of the connecting line to obtain line feature information; quantitatively analyzing the line feature information according to the wiring visual plan to obtain the line visible length; taking the first electronic component and the second electronic component as endpoints, and combining the line visible length to obtain the arbitrary wiring visual diagram.

[0066] Specifically, all electronic components (such as resistors, capacitors, transistors, etc.) on the multi-layer PCB are summarized into a set. Then, random electronic components are extracted from the set as the first electronic component and the second electronic component, such as a power module and a processor module. The extracted components help analyze and optimize the connections between components in the subsequent design steps.

[0067] Acquire the connection line between the first electronic component and the second electronic component, that is, analyze the line connection mode between the first electronic component and the second electronic component, such as the connection line may be a wire on a circuit board, copper foil or other forms of electrical conductors. Collect features of the connection line to obtain line feature information. Feature collection refers to recording various aspects of these connection lines, such as length, width, material type, etc. Collecting feature information provides data support for subsequent optimization and evaluation.

[0068] According to the visual wiring plan, the line feature information is quantitatively analyzed, and the feature information of the connecting line is analyzed and quantified to obtain the visible length of the line, such as converting the line length, width, bending angle and other information into numerical indicators that can be calculated and compared.

[0069] The first electronic component and the second electronic component are regarded as the starting and ending endpoints of the wiring, and then the wiring visualization diagram between the two is drawn in combination with the visible length of the line of quantitative analysis results. The wiring visualization diagram is a graphical display of the circuit wiring process, which can help designers to intuitively view the signal path, wiring density, potential interference points, etc. By combining the visible length of the line, the visualization diagram can reflect the actual layout of the line and its impact on the circuit performance.

[0070] By assembling a set of electronic components and extracting specific components, we can determine the circuit components that need to be analyzed. Next, we obtain the connection lines between the components and extract relevant feature information, such as length, material, etc. After that, we quantify the feature information to obtain the visible length of the line, and finally combine them to generate a wiring visualization diagram to help optimize the circuit wiring and ensure the quality of signal transmission and the reliability of the circuit.

[0071] Furthermore, the present application also includes: reading predetermined line indicators; collecting characteristics of the connecting line based on the predetermined line indicators to obtain the line characteristic information; wherein the predetermined line indicators at least include line length, line current loop length and line characteristic impedance.

[0072] Specifically, the predetermined line index is read to obtain parameter indexes related to circuit design. The predetermined line index is key data used to measure and optimize the performance of the connection line when designing the circuit. For example, the index may include the length of the line, the length of the current loop, and the impedance of the line. By reading the predetermined line index, the value that has an important impact on the circuit performance can be obtained for subsequent optimization design.

[0073] After obtaining the predetermined line indicators, they are applied to specific circuit connection lines and analyzed in detail. Feature collection refers to the collection of various information related to the connection lines, such as line length, current capacity, impedance characteristics, etc., which can provide the necessary basis for subsequent design decisions.

[0074] Among them, the predetermined line indicators include at least line length, line current loop length and line characteristic impedance. Line length refers to the physical length of the wire connecting two electronic components, which directly affects the transmission speed and quality of the signal. Line current loop length refers to the length of the path for the current to flow in the loop, which has an impact on the current efficiency and electromagnetic interference of the circuit. Line characteristic impedance is the resistance characteristic of the line to the current when transmitting signals, which is directly related to the reflection, attenuation and distortion of the signal. Each indicator reflects the performance of the circuit line from different angles, and these factors are comprehensively considered to optimize the circuit design.

[0075] By obtaining important parameters of circuit connection lines from pre-set design standards, including line length, current loop length and impedance, etc., the characteristics of the connection lines are collected to obtain detailed data about the lines to assist in subsequent design optimization, thereby ensuring the optimization of signal transmission quality and circuit performance.

[0076] In summary, the manufacturing process optimization control method for the electronic components of the main control board provided in the present application has the following technical effects: by obtaining the historical manufacturing database of the main control board of the steering wheel, the historical manufacturing database includes the historical electronic manufacturing data records of the main control board; extracting the first historical record in the historical electronic manufacturing data record, the first historical record refers to the first manufacturing process record of the first multi-layer PCB board; introducing a primary evaluation strategy to analyze the first manufacturing process record to obtain the optimal historical manufacturing plan, and using the optimal historical manufacturing plan as the initial optimal solution; reading the predetermined optimization constraint, and optimizing the initial optimal solution according to the first constraint in the predetermined optimization constraint to obtain the first optimal candidate solution; introducing an intermediate evaluation strategy to optimize the optimal solution set based on the first optimal candidate solution to obtain the target optimal solution; designing and manufacturing the multi-layer PCB board for the main control board according to the target optimal solution, that is, by achieving the technical goals of optimizing PCB design and reducing signal interference, the technical effects of improving signal transmission efficiency, improving circuit board performance, and enhancing system stability and reliability are achieved.

[0077] Embodiment 2: Based on the manufacturing process optimization control method for the electronic components of the main control board in the previous embodiment, the present application also provides a manufacturing process optimization control system for the electronic components of the main control board, please refer to the attached Figure 2 , including: a data acquisition module 11, the data acquisition module 11 is used to obtain a historical manufacturing database of electronic components in a main control panel of a steering wheel, the historical manufacturing database includes historical electronic manufacturing data records of the electronic components; a record extraction module 12, the record extraction module 12 is used to extract a first historical record in the historical electronic manufacturing data record, the first historical record refers to a first manufacturing process record of a first multi-layer PCB board; a record analysis module 13, the record analysis module 13 is used to introduce a primary evaluation strategy to analyze the first manufacturing process record to obtain an optimal historical manufacturing plan, and use the optimal historical manufacturing plan as an initial optimal solution; an optimization module 14, the optimization module 14 is used to read a predetermined optimization constraint, and optimize the initial optimal solution according to a first constraint in the predetermined optimization constraint to obtain a first optimal candidate solution; an optimization analysis module 15, the optimization analysis module 15 is used to introduce an intermediate evaluation strategy to optimize the optimal solution set formed based on the first optimal candidate solution to obtain a target optimal solution; a design and manufacturing module 16, the design and manufacturing module 16 is used to design and manufacture a multi-layer PCB board for the electronic component according to the target optimal solution.

[0078] Furthermore, the manufacturing process optimization control system for electronic components of the main control board is also used to: extract the integrity evaluation plan in the primary evaluation strategy; perform signal integrity detection on the first multi-layer PCB board according to the integrity evaluation plan to obtain a first integrity result; when the first integrity result reaches a predetermined signal integrity threshold, extract the actual performance evaluation plan in the primary evaluation strategy; perform historical fault analysis on the first multi-layer PCB board according to the actual performance evaluation plan to obtain a first fault index; when the first fault index is within a predetermined fault index threshold, add the first manufacturing process record to the candidate solution set; arrange the candidate solution set in ascending order based on the number of signal layers to obtain an ascending list of candidate solutions; and use the first candidate solution in the ascending list of candidate solutions as the initial optimal solution.

[0079] Further, the manufacturing process optimization control system for the electronic components of the main control board is also used to: obtain a first fault record of the first multi-layer PCB board, the first fault record including a first signal failure timing, a first current short circuit timing and a first line temperature timing; read a predetermined fault timing indicator, and based on the predetermined fault timing indicator, sequentially collect characteristics of the first signal failure timing, the first current short circuit timing and the first line temperature timing to obtain a first timing indicator parameter group, a second timing indicator parameter group and a third timing indicator parameter group, respectively; sequentially perform weighted calculations on the first timing indicator parameter group, the second timing indicator parameter group and the third timing indicator parameter group after standardization to obtain a first weighted index, a second weighted index and a third weighted index, respectively; and according to the actual performance evaluation plan, take the maximum value of the first weighted index, the second weighted index and the third weighted index as the first fault index.

[0080] Furthermore, the manufacturing process optimization control system for the main control board electronic components is also used for: the predetermined optimization constraints at least include a signal line total length threshold and a loop total length threshold.

[0081] Furthermore, the manufacturing process optimization control system for the main control board electronic components is also used to: adjust the initial optimal solution based on the first constraint to obtain a first solution; perform a signal integrity test on a first multi-layer PCB test board made based on the first solution to obtain a first test board integrity result; if the first test board integrity result does not reach the predetermined signal integrity threshold, adjust the first solution to obtain a second solution; perform a signal integrity test on a second multi-layer PCB test board made based on the second solution to obtain a second test board integrity result; if the second test board integrity result reaches the predetermined signal integrity threshold, add the second solution to the first optimal candidate solution.

[0082] Furthermore, the manufacturing process optimization control system for electronic components of the main control board is also used to: obtain any solution in the optimal solution set, and make any multi-layer PCB board based on the arbitrary solution; visualize the arbitrary multi-layer PCB board based on the wiring visual plan in the intermediate evaluation strategy to obtain an arbitrary wiring visual graph; perform matrix-vector processing on the arbitrary wiring visual graph to obtain an arbitrary wiring eigenvalue; and screen the target optimal solution with the minimum eigenvalue as the target.

[0083] Furthermore, the manufacturing process optimization control system for the electronic components of the main control board is also used to: assemble the electronic component set of the arbitrary multi-layer PCB board, and extract the first electronic component and the second electronic component in the electronic component set in turn; obtain the connecting line between the first electronic component and the second electronic component, and collect features of the connecting line to obtain line feature information; quantitatively analyze the line feature information according to the wiring visual plan to obtain the line visible length; take the first electronic component and the second electronic component as endpoints, and combine the line visible length to obtain the arbitrary wiring visual diagram.

[0084] Furthermore, the manufacturing process optimization control system for the main control board electronic components is also used to: read predetermined line indicators; collect characteristics of the connecting lines based on the predetermined line indicators to obtain the line characteristic information; wherein the predetermined line indicators include at least line length, line current loop length and line characteristic impedance.

[0085] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The manufacturing process optimization control method for main control board electronic components and the specific examples in the aforementioned embodiment one are also applicable to the manufacturing process optimization control system for main control board electronic components in this embodiment. Through the aforementioned detailed description of the manufacturing process optimization control method for main control board electronic components, those skilled in the art can clearly understand the manufacturing process optimization control system for main control board electronic components in this embodiment, so for the sake of brevity of the specification, it will not be described in detail here.

[0086] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

[0087] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application belong to the scope of the present application and its equivalent technology, the present application is also intended to include these modifications and variations.

Claims

1. A manufacturing process optimization control method for electronic components of a main control board, characterized in that: include: Acquire a historical manufacturing database of electronic components in a main control panel of a steering wheel, wherein the historical manufacturing database includes historical electronic manufacturing data records of the electronic components; Extracting a first historical record from the historical electronic manufacturing data record, wherein the first historical record refers to a first manufacturing process record of a first multi-layer PCB board; Introducing a primary evaluation strategy to analyze the first manufacturing process record to obtain an optimal historical manufacturing solution, and using the optimal historical manufacturing solution as an initial optimal solution, including: Extracting the integrity assessment plan in the primary assessment strategy; Performing signal integrity testing on the first multi-layer PCB board according to the integrity evaluation plan to obtain a first integrity result; When the first integrity result reaches a predetermined signal integrity threshold, extracting an actual performance evaluation plan in the primary evaluation strategy; Performing a historical fault analysis on the first multi-layer PCB board according to the actual performance evaluation plan to obtain a first fault index; When the first fault index is within a predetermined fault index threshold, adding the first manufacturing process record to a candidate solution set; Arranging the candidate solution set in ascending order based on the number of signal layers to obtain an ascending list of candidate solutions; Taking the first candidate solution in the ascending list of candidate solutions as the initial optimal solution; Reading a predetermined optimization constraint, and optimizing the initial optimal solution according to a first constraint in the predetermined optimization constraint to obtain a first optimal candidate solution; An intermediate evaluation strategy is introduced to perform optimization analysis on the optimal solution set formed based on the first optimal candidate solution to obtain the target optimal solution, including: Obtain any solution in the optimal solution set, and make any multi-layer PCB board based on the arbitrary solution; Visualize the arbitrary multi-layer PCB board based on the wiring visual plan in the intermediate evaluation strategy to obtain an arbitrary wiring visual diagram; Performing matrix vectorization processing on the arbitrary wiring visibility graph to obtain an arbitrary wiring eigenvalue; Taking the minimum characteristic value of any wiring as the goal, screening to obtain the optimal solution of the goal; A multi-layer PCB board is designed and manufactured for the electronic component according to the target optimal solution.

2. The manufacturing process optimization control method for the electronic components of the main control board according to claim 1 is characterized in that: Performing a historical fault analysis on the first multi-layer PCB board according to the actual performance evaluation plan to obtain a first fault index includes: Acquire a first fault record of the first multi-layer PCB board, the first fault record including a first signal failure timing sequence, a first current short circuit timing sequence, and a first line temperature timing sequence; Reading a predetermined fault timing indicator, and based on the predetermined fault timing indicator, sequentially collecting characteristics of the first signal failure timing, the first current short circuit timing, and the first line temperature timing, to obtain a first timing indicator parameter group, a second timing indicator parameter group, and a third timing indicator parameter group, respectively; Performing weighted calculation on the first timing indicator parameter group, the second timing indicator parameter group, and the third timing indicator parameter group after the standardization processing in sequence to obtain a first weighted index, a second weighted index, and a third weighted index respectively; According to the actual performance evaluation plan, the maximum value among the first weighted index, the second weighted index and the third weighted index is taken as the first fault index.

3. The manufacturing process optimization control method for the electronic components of the main control board according to claim 1 is characterized in that: The predetermined optimization constraints at least include a signal line total length threshold and a loop total length threshold.

4. The manufacturing process optimization control method for the electronic components of the main control board according to claim 1 is characterized in that: Reading a predetermined optimization constraint, and optimizing the initial optimal solution according to a first constraint in the predetermined optimization constraint to obtain a first optimal candidate solution, including: Adjusting the initial optimal solution based on the first constraint to obtain a first solution; Performing a signal integrity test on a first multi-layer PCB test board manufactured based on the first solution to obtain a first test board integrity result; If the first test board integrity result does not reach the predetermined signal integrity threshold, adjusting the first solution to obtain a second solution; Performing a signal integrity test on a second multi-layer PCB test board manufactured based on the second solution to obtain a second test board integrity result; If the second test board integrity result reaches the predetermined signal integrity threshold, the second solution is added to the first optimal candidate solution.

5. The manufacturing process optimization control method for the electronic components of the main control board according to claim 1 is characterized in that: Based on the wiring visual plan in the intermediate evaluation strategy, the arbitrary multi-layer PCB board is visualized to obtain an arbitrary wiring visual diagram, including: Assembling an electronic component set of the arbitrary multi-layer PCB board, and sequentially extracting a first electronic component and a second electronic component from the electronic component set; Acquire a connection line between the first electronic component and the second electronic component, and collect features of the connection line to obtain line feature information; Quantitatively analyzing the line feature information according to the wiring visual plan to obtain the line visual length; The first electronic component and the second electronic component are taken as endpoints and combined with the visible length of the line to obtain the arbitrary wiring visible graph.

6. The manufacturing process optimization control method for the electronic components of the main control board according to claim 5 is characterized in that: Collecting features of the connecting lines to obtain line feature information includes: Read the predetermined line indicator; Collecting features of the connection lines based on the predetermined line index to obtain the line feature information; Wherein, the predetermined line index at least includes line length, line current loop length and line characteristic impedance.

7. A manufacturing process optimization control system for electronic components of a main control board, characterized in that: The steps for implementing the manufacturing process optimization control method for the main control board electronic component according to any one of claims 1 to 6 include: A data acquisition module, the data acquisition module is used to acquire a historical manufacturing database of electronic components in a main control panel of a steering wheel, the historical manufacturing database including historical electronic manufacturing data records of the electronic components; A record extraction module, the record extraction module is used to extract a first historical record in the historical electronic manufacturing data record, the first historical record refers to a first manufacturing process record of a first multi-layer PCB board; A record analysis module, the record analysis module is used to introduce a primary evaluation strategy to analyze the first manufacturing process record to obtain an optimal historical manufacturing solution, and use the optimal historical manufacturing solution as an initial optimal solution; An optimization module, the optimization module is used to read a predetermined optimization constraint, and optimize the initial optimal solution according to a first constraint in the predetermined optimization constraint to obtain a first optimal candidate solution; An optimization analysis module, wherein the optimization analysis module is used to introduce an intermediate evaluation strategy to perform optimization analysis on the optimal solution set formed based on the first optimal candidate solution to obtain a target optimal solution; A design and manufacturing module is used to design and manufacture a multi-layer PCB board for the electronic component according to the target optimal solution.

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