Water-cooled built-in integrated capacitor

Abstract

This application relates to the technical field of capacitors, and in particular to a water-cooled built-in integrated capacitor, which includes a capacitor box body, a box cover, a plurality of cores, a heat-conducting partition bracket, a busbar stack, and multiple groups of water-cooled heat dissipation components. The heat-conducting partition bracket is installed inside the capacitor box body and divides the internal space of the capacitor box body into an upper chamber and a lower chamber. A plurality of cores are arranged in a vertical and horizontal array in the lower chamber. The lower surface of the water-cooled heat dissipation component is attached to and spaced from the heat-conducting partition bracket. The busbar stack is attached to the upper surface of the water-cooled heat dissipation component. The busbar stack is electrically connected to a plurality of cores connected in series and parallel. The box cover is buckled at the opening of the capacitor box body. For the water-cooled built-in integrated capacitor of this application, when working, the heat generated by the cores is indirectly transferred to the water-cooled heat dissipation component through the heat-conducting partition bracket, and the heat generated by the busbar stack during operation is directly transferred to the water-cooled heat dissipation component to discharge the heat, with better heat dissipation effect, improving the stability and service life of the capacitor.

Description

Technical Field

[0001] This application relates to the technical field of capacitors, and particularly to a water-cooled built-in integrated capacitor. Background Art

[0002] Capacitors play an important role in circuits such as tuning, bypassing, coupling, and filtering. The operating temperature of a capacitor directly affects the performance and lifespan of the capacitor. If the temperature of the capacitor is too high during operation, the performance and lifespan of electrolytic capacitors depend on their operating temperature. If the ambient temperature during the operation of electrolytic capacitors is too high, it will have a great adverse impact on the capacitor performance and even lead to the termination of its lifespan. Especially in the field of wind power generation, in addition to relatively high requirements for capacitor performance, the heat dissipation requirements for products are even more stringent.

[0003] For example, Chinese Patent with Application No. 202311667516.7 discloses a capacitor, which includes a plurality of capacitor cores, a first busbar, and a second busbar. The first busbar includes a first welding part, and the first welding part is connected to the first end faces of the plurality of capacitor cores; the second busbar includes a connecting part, the connecting part is stacked with the first welding part and an insulating dielectric layer is provided at the stacked part to insulate the connecting part and the first welding part between the positive and negative poles. Second welding parts extend from both sides of the connecting part, and the second welding parts are connected to the second end faces of the plurality of capacitor cores.

[0004] Regarding the above related technologies, the inventor believes that there are the following technical defects to be improved:

[0005] During the working process, not only do the capacitor cores generate relatively more heat, but the busbars also generate some heat during the working process. Common integrated capacitors generally design some heat dissipation structures for the capacitor cores, and often such conventional heat dissipation structures and methods cannot take into account the heat generated by the busbar work. Overall, the heat dissipation effect is not good enough, and the stability and service life of the capacitor need to be improved. Summary of the Invention

[0006] This application provides a water-cooled built-in integrated capacitor to improve the following technical problems:

[0007] Common integrated capacitors generally design some heat dissipation structures for the capacitor cores, and often such conventional heat dissipation structures and methods cannot take into account the heat generated by the busbar work. Overall, the heat dissipation effect is not good enough, and the stability and service life of the capacitor need to be improved.

[0008] This application provides a water-cooled built-in integrated capacitor, adopting the following technical solutions:

[0009] A water-cooled built-in integrated capacitor includes a capacitor box body, a box cover, a plurality of cores, a heat-conducting partition bracket, a stacked busbar, and multiple groups of water-cooled heat dissipation components. The heat-conducting partition bracket is installed inside the capacitor box body and divides the internal space of the capacitor box body into an upper chamber and a lower chamber. A plurality of the cores are arranged in a vertical and horizontal array in the lower chamber. The water-cooled heat dissipation components are integrally presented in a flattened plate-like structure. The lower surface of the water-cooled heat dissipation components is attached and spacedly installed on the heat-conducting partition bracket and located in the upper chamber. The stacked busbar is attached and installed on the upper surface of the water-cooled heat dissipation components. The stacked busbar is electrically connected to the plurality of cores connected in series and parallel. A plurality of wiring terminals are provided on both opposite sides of the stacked busbar. Holes for the wiring terminals to extend out are provided on both opposite sides of the box cover. The box cover is buckled at the opening of the capacitor box body.

[0010] In an implementable technical solution of the present application, the water-cooled heat dissipation components include a water-cooling pipe arranged in a bent and circuitous manner and a plurality of heat dissipation plates. Water inlets and water outlets are respectively provided at both ends of the water-cooling pipe. The heat dissipation plates are fixedly connected to the water-cooling pipe. The water-cooling pipe is attached to and heat-conductively connected to the heat-conducting partition bracket. The plurality of heat dissipation plates are arranged in parallel at intervals. The lower surface of the heat dissipation plates is attached to the upper surface of the water-cooled heat dissipation components. The upper surface of the heat dissipation plates is attached to the lower surface of the stacked busbar. A first notch adapted for the water inlet to extend out and a second notch adapted for the water outlet to extend out are provided on the side surface of the capacitor box body.

[0011] In an implementable technical solution of the present application, the plurality of heat dissipation plates include a U-shaped clamping plate arranged with an opening facing downwards. A U-shaped attaching plate is provided on one side of the U-shaped clamping plate. A bottom attaching plate is provided at the bottom of the other side of the U-shaped clamping plate. The opening of the U-shaped attaching plate faces away from the bottom attaching plate. An arc-shaped U-groove adapted to be clamped and attached to the outer peripheral wall of the water-cooling pipe is provided inside the U-shaped clamping plate. The depth of the arc-shaped U-groove is equal to the outer diameter of the water-cooling pipe.

[0012] In an implementable technical solution of the present application, the upper surface of the U-shaped attaching plate is flush with the top surface of the U-shaped clamping plate, and the lower surface of the U-shaped attaching plate is flush with the lower surface of the bottom attaching plate.

[0013] In an implementable technical solution of the present application, the plurality of heat dissipation plates include a U-shaped clamping plate arranged with an opening facing downwards. A U-shaped attaching plate is provided on each of the two sides of the U-shaped clamping plate. The two U-shaped clamping plates are symmetrically arranged with their openings facing horizontally away from each other. An arc-shaped U-groove adapted to be clamped and attached to the outer peripheral wall of the water-cooling pipe is provided inside the U-shaped clamping plate. The depth of the arc-shaped U-groove is equal to the outer diameter of the water-cooling pipe.

[0014] In an achievable technical solution of the present application, the upper surfaces of the two U-shaped pasting plates are flush with the top surface of the U-shaped cardboard, and the lower surfaces of the two U-shaped pasting plates are flush with the lower surface of the U-shaped cardboard.

[0015] In an achievable technical solution of the present application, the water inlet and the water outlet are located on the same side of the capacitor box, and the side where the water inlet and the water outlet are located is inconsistent with the side where the terminal is located.

[0016] In an achievable technical solution of the present application, the heat-conducting separation bracket includes a plurality of T-shaped support portions fixed to the inner bottom of the capacitor box body and a heat-conducting plate, the T-shaped support portions are located in the gaps between some adjacent core bodies, and the heat-conducting plate is fixed to the plurality of T-shaped support portions by bolts and arranged horizontally.

[0017] In an achievable technical solution of the present application, a first hole is stamped on the heat conducting plate and bent to form a vertically arranged baffle, and the baffle is used to block and fix the water cooling tube along the length direction of the water cooling tube.

[0018] In an achievable technical solution of the present application, a second hole is stamped on the heat conducting plate and bent to form an S-shaped elastic clamp, a clamping gap is formed between the S-shaped elastic clamp and the upper surface of the heat conducting plate, and the bottom of one end of the heat dissipation plate is inserted and clamped in the clamping gap.

[0019] In summary, the present application includes at least one of the following beneficial technical effects:

[0020] During operation, a large amount of heat generated by the core is indirectly transferred to the water-cooled heat dissipation component through the heat-conducting separation bracket. During operation, part of the heat generated by the busbar stack is directly transferred to the water-cooled heat dissipation component through contact. Under the premise that the circulating cooling medium (which can be coolant or other compressed gas) is passed through the water-cooled heat dissipation component, the flowing cooling medium takes away the temperature generated by the capacitor, so that the capacitor ambient temperature reaches a balanced state, with better heat dissipation effect, and significantly improves the stability and service life of the capacitor;

[0021] The upper chamber formed by the thermally conductive partition bracket and the stacked busbars can be used to install and fix the water-cooled heat dissipation components with a flat plate structure. The overall structure is simple, compact and stable, which facilitates the integration of capacitors into small-volume products. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0023] Figure 1 It is a schematic structural diagram of the water-cooled built-in integrated capacitor in the first embodiment of the present application.

[0024] Figure 2 It is an exploded view of the water-cooled built-in integrated capacitor in the first embodiment of the present application.

[0025] Figure 3 It is a schematic structural diagram of the heat dissipation plate and the heat conduction plate in the first embodiment of the present application.

[0026] Figure 4 It is a schematic structural diagram of the heat dissipation plate in the second embodiment of the present application.

[0027] Description of the reference numerals:

[0028] 1. Capacitor box body; 11. First notch; 12. Second notch;

[0029] 2. Box cover; 21. Hole;

[0030] 3. Core body;

[0031] 4. Heat conduction partition bracket; 41. T-shaped support part; 42. Heat conduction plate; 421. Baffle; 422. S-shaped elastic splint;

[0032] 5. Mother bus bar stack; 51. Wiring terminal;

[0033] 6. Water-cooled heat dissipation component; 61. Water-cooled pipe; 62. Heat dissipation plate; 621. U-shaped clamping plate; 622. U-shaped pasting plate; 623. Bottom pasting plate; 63. Water inlet; 64. Water outlet. Detailed implementation manners

[0034] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the following further details the present application in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0035] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0036] It should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0037] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more, unless otherwise specifically defined.

[0038] The following will further elaborate on the present application in conjunction with the attached Figures 1-4 drawings.

[0039] Embodiment 1 of the present application discloses a water-cooled built-in integrated capacitor. Referring to Figures 1-3 , the water-cooled built-in integrated capacitor includes a capacitor box body 1, a box cover 2, a plurality of cores 3, a heat-conducting partition bracket 4, a busbar stack 5, and multiple groups of water-cooled heat dissipation components 6. The heat-conducting partition bracket 4 is installed inside the capacitor box body 1 and divides the internal space of the capacitor box body 1 into an upper chamber and a lower chamber. A plurality of cores 3 are arranged in a vertical and horizontal array in the lower chamber. The water-cooled heat dissipation components 6 are integrally presented as a flattened plate-like structure. The lower surface of the water-cooled heat dissipation components 6 is attached and spacedly installed on the heat-conducting partition bracket 4 and is located in the upper chamber. The busbar stack 5 is attached and installed on the upper surface of the water-cooled heat dissipation components 6. The busbar stack 5 is electrically connected to the plurality of cores 3 connected in series and parallel. A plurality of terminal blocks 51 are provided on both opposite sides of the busbar stack 5. Holes 21 for the terminal blocks 51 to extend out are provided on both opposite sides of the box cover 2. The box cover 2 is buckled at the opening of the capacitor box body 1.

[0040] In this embodiment, the water-cooled heat dissipation components 6 include a water-cooling pipe 61 arranged in a curved and circuitous manner and multiple heat dissipation plates 62. One water-cooling pipe 61 corresponds to four heat dissipation plates 62. Water inlets 63 and water outlets 64 are respectively provided at both ends of the water-cooling pipe 61. The heat dissipation plates 62 are fixedly connected to the water-cooling pipe 61. The water-cooling pipe 61 is attached to the heat-conducting partition bracket 4 and is heat-conductively connected. The multiple heat dissipation plates 62 are arranged in parallel at intervals. The lower surface of the heat dissipation plates 62 is attached to the upper surface of the water-cooled heat dissipation components 6. The upper surface of the heat dissipation plates 62 is attached to the lower surface of the busbar stack 5. A first notch 11 for the water inlet 63 to extend out and a second notch 12 for the water outlet 64 to extend out are provided on the side surface of the capacitor box body 1.

[0041] For the water-cooled heat dissipation component 6 designed above, the cooling medium in the water-cooling pipe 61 can enter and exit through the water inlet 63 and the water outlet 64. The heat dissipation plate 62 will be firmly clamped in the upper chamber by the bus bar stack 5 and the heat conduction partition bracket 4. Not only can heat be quickly conducted between the heat dissipation plate 62 and the water-cooling pipe 61, but also the heat dissipation plate 62 has a good fixing effect on the water-cooling pipe 61, effectively preventing structural shaking.

[0042] To improve the heat conduction efficiency and the stability of the heat dissipation plate 62 after being clamped, multiple heat dissipation plates 62 include a U-shaped clamping plate 621 arranged with the opening facing downwards. One side of the U-shaped clamping plate 621 is provided with a U-shaped attaching plate 622, and the bottom of the other side of the U-shaped clamping plate 621 is provided with a bottom attaching plate 623. The opening of the U-shaped attaching plate 622 faces away from the side of the bottom attaching plate 623. An arc U-groove adapted to be clamped and fitted to the outer peripheral wall of the water-cooling pipe 61 is arranged inside the U-shaped clamping plate 621, and the depth of the arc U-groove is equal to the outer diameter of the water-cooling pipe 61. The upper surface of the U-shaped attaching plate 622 is flush with the top surface of the U-shaped clamping plate 621, and the lower surface of the U-shaped attaching plate 622 is flush with the lower surface of the bottom attaching plate 623.

[0043] The above design of the U-shaped attaching plate 622 and the bottom attaching plate 623 has a larger contact area with the bus bar stack 5 and the heat conduction partition bracket 4 to accelerate heat transfer.

[0044] In this embodiment, to facilitate the connection of external inlet and outlet water pipes and is conducive to the arrangement of pipelines, the water inlet 63 and the water outlet 64 are located on the same side of the capacitor box body 1, and the side where the water inlet 63 and the water outlet 64 are located is not the same as the side where the wiring terminal 51 is located, thereby effectively separating the water interface and the electrical interface, with relatively high safety.

[0045] In this embodiment, the heat conduction partition bracket 4 includes a plurality of T-shaped support portions 41 fixed to the inner bottom of the capacitor box body 1 and a heat conduction plate 42. The T-shaped support portions 41 are located in the gaps between some adjacent cores 3, and the heat conduction plate 42 is fixed to the plurality of T-shaped support portions 41 by bolts and is horizontally arranged.

[0046] The heat conduction partition bracket 4 designed above is not only simple in structure, firm and stable, convenient for the installation and fixation of the water-cooled heat dissipation component 6, but also conducive to collecting a large amount of heat generated when the core 3 works. The water-cooling pipe 61 is a metal water pipe with good heat conductivity, and the heat dissipation plate 62 and the heat conduction plate 42 are aluminum plates or copper plates so as to have good heat conduction and heat dissipation effects.

[0047] In this embodiment, to prevent the water-cooling pipe 61 from shaking randomly in the upper chamber, a first hole is punched on the heat conduction plate 42 and a vertically arranged baffle 421 is formed by bending. Along the length direction of the water-cooling pipe 61, the baffle 421 is used to block and fix the water-cooling pipe 61, and the baffle 421 also has a certain positioning effect when installing the water-cooled heat dissipation component 6.

[0048] In this embodiment, in order to prevent the heat dissipation plate 62 from swaying randomly in the upper chamber, a second hole is punched and formed on the heat conduction plate 42, and an S-shaped elastic clamping plate 422 is bent. A clamping gap is formed between the S-shaped elastic clamping plate 422 and the upper surface of the heat conduction plate 42. One end of the bottom of the heat dissipation plate 62 is inserted and clamped in the clamping gap.

[0049] The beneficial technical effects of the water-cooled built-in integrated capacitor of the present application embodiment are roughly as follows:

[0050] When working, a large amount of heat generated by the core body 3 is indirectly transferred to the water-cooled heat dissipation assembly 6 through the heat conduction partition bracket 4. When working, part of the heat generated by the bus bar stack 5 is directly transferred to the water-cooled heat dissipation assembly 6 by contact. On the premise that a circulating cooling medium (which can be a coolant or other compressed gas) is introduced into the water-cooled heat dissipation assembly 6, the heat can be quickly discharged, with a better heat dissipation effect, significantly improving the stability and service life of the capacitor;

[0051] The upper chamber formed by the heat conduction partition bracket 4 and the bus bar stack 5 can just be used to install and fix the water-cooled heat dissipation assembly 6 in a flattened plate-like structure. The overall structure is simple, compact and stable, which is convenient for integrating the capacitor into a small-volume product.

[0052] Embodiment II of the present application discloses a water-cooled built-in integrated capacitor. Refer to Figure 2 and Figure 4 , the difference from Embodiment I is:

[0053] Multiple heat dissipation plates 62 include U-shaped clamping plates 621 arranged with openings facing downwards. One U-shaped attaching plate 622 is provided on each side of the U-shaped clamping plate 621. The two U-shaped clamping plates 621 are symmetrically arranged with their openings facing horizontally away from each other. An arc U-groove adapted to be clamped and fitted to the outer peripheral wall of the water-cooled tube 61 is arranged inside the U-shaped clamping plate 621. The depth of the arc U-groove is equal to the outer diameter of the water-cooled tube 61. The upper surfaces of the two U-shaped attaching plates 622 are flush with the top surface of the U-shaped clamping plate 621, and the lower surfaces of the two U-shaped attaching plates 622 are flush with the bottom surface of the U-shaped clamping plate 621.

[0054] The heat dissipation plate 62 designed above also has a larger contact area with the bus bar stack 5 and the heat conduction partition bracket 4 to accelerate heat transfer, and the structure is also simple and stable.

[0055] The above are only the preferred embodiments of the present application, and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the application shall be included in the protection scope of the present application.

Claims

1. A water-cooled built-in integrated capacitor, characterized in that, It includes a capacitor box body (1), a box cover (2), multiple cores (3), a heat-conducting partition bracket (4), a busbar stack (5) and multiple groups of water-cooled heat dissipation components (6). The heat-conducting partition bracket (4) is installed inside the capacitor box body (1) and divides the internal space of the capacitor box body (1) into an upper chamber and a lower chamber. Multiple cores (3) are arranged in a vertical and horizontal array in the lower chamber. The water-cooled heat dissipation component (6) is integrally presented as a flattened plate-like structure. The lower surface of the water-cooled heat dissipation component (6) is attached and installed at intervals on the heat-conducting partition bracket (4) and is located in the upper chamber. The busbar stack (5) is attached and installed on the upper surface of the water-cooled heat dissipation component (6). The busbar stack (5) is electrically connected to multiple cores (3) connected in series and parallel. Multiple wiring terminals (51) are provided on both opposite sides of the busbar stack (5). Holes (21) for the wiring terminals (51) to extend out are provided on both opposite sides of the box cover (2). The box cover (2) is buckled at the opening of the capacitor box body (1); The water-cooled heat dissipation component (6) includes a water-cooling pipe (61) arranged in a bent and circuitous manner and multiple heat dissipation plates (62). Water inlets (63) and water outlets (64) are respectively provided at both ends of the water-cooling pipe (61). The heat dissipation plates (62) are fixedly connected to the water-cooling pipe (61). The water-cooling pipe (61) is attached to and heat-conductively connected to the heat-conducting partition bracket (4). Multiple heat dissipation plates (62) are arranged in parallel at intervals. The lower surface of the heat dissipation plate (62) is attached to the upper surface of the water-cooled heat dissipation component (6). The upper surface of the heat dissipation plate (62) is attached to the lower surface of the busbar stack (5). A first notch (11) adapted for the water inlet (63) to extend out and a second notch (12) adapted for the water outlet (64) to extend out are provided on the side surface of the capacitor box body (1); The heat-conducting partition bracket (4) includes multiple T-shaped support parts (41) fixed to the inner bottom of the capacitor box body (1) and a heat-conducting plate (42). The T-shaped support parts (41) are located in the gaps between some adjacent cores (3). The heat-conducting plate (42) is fixed to multiple T-shaped support parts (41) by bolts and is horizontally arranged. Second holes are punched on the heat-conducting plate (42) and an S-shaped elastic clamping plate (422) is formed by bending. A clamping gap is formed between the S-shaped elastic clamping plate (422) and the upper surface of the heat-conducting plate (42). One end bottom of the heat dissipation plate (62) is inserted and clamped in the clamping gap.

2. The water-cooled built-in integrated capacitor according to claim 1, characterized in that The multiple heat dissipation plates (62) include a U-shaped clamping plate (621) with an opening facing downward. One side of the U-shaped clamping plate (621) is provided with a U-shaped attaching plate (622), and the bottom of the other side of the U-shaped clamping plate (621) is provided with a bottom attaching plate (623). The opening of the U-shaped attaching plate (622) faces away from the side of the bottom attaching plate (623). An arc U-shaped groove that is adapted to be clamped and fit to the outer peripheral wall of the water cooling pipe (61) is arranged in the U-shaped clamping plate (621), and the depth of the arc U-shaped groove is equal to the outer diameter of the water cooling pipe (61).

3. The water-cooled built-in integrated capacitor according to claim 2, characterized in that, The upper surface of the U-shaped attaching plate (622) is flush with the top surface of the U-shaped clamping plate (621), and the lower surface of the U-shaped attaching plate (622) is flush with the lower surface of the bottom attaching plate (623).

4. The water-cooled built-in integrated capacitor according to claim 1, wherein The multiple heat dissipation plates (62) include a U-shaped clamping plate (621) with an opening facing downward. One U-shaped attaching plate (622) is arranged on each of the two sides of the U-shaped clamping plate (621). The two U-shaped clamping plates (621) are symmetrically arranged and their openings face horizontally away from each other. An arc U-shaped groove that is adapted to be clamped and fit to the outer peripheral wall of the water cooling pipe (61) is arranged in the U-shaped clamping plate (621), and the depth of the arc U-shaped groove is equal to the outer diameter of the water cooling pipe (61).

5. The water-cooled built-in integrated capacitor according to claim 4, wherein The upper surfaces of the two U-shaped attaching plates (622) are flush with the top surface of the U-shaped clamping plate (621), and the lower surfaces of the two U-shaped attaching plates (622) are flush with the lower surface of the U-shaped clamping plate (621).

6. The water-cooled built-in integrated capacitor according to claim 1, characterized in that, The water inlet (63) and the water outlet (64) are located on the same side of the capacitor box body (1), and the side where the water inlet (63) and the water outlet (64) are located is not the same as the side where the wiring terminal (51) is located.

7. The water-cooled built-in integrated capacitor according to claim 6, wherein A first hole is punched and formed on the heat conducting plate (42), and a vertically arranged baffle (421) is bent. Along the length direction of the water cooling pipe (61), the baffle (421) is used to block and fix the water cooling pipe (61).

Images