Copper block projection angle measuring method and heat dissipation circuit board

Abstract

The invention discloses a copper block projection angle measuring method and a heat dissipation circuit board. The method for measuring the projection angle of the copper block comprises a copper block adsorption step, a copper block arrangement step and a measurement step. In the copper block adsorption step, a copper block is adsorbed through an adsorption unit. In the copper block setting step, the copper block is moved through the adsorption unit and is arranged in a through hole of a circuit substrate to form a heat dissipation circuit board. The copper block partially protrudes from the through hole. In the measuring step, the copper block is measured to protrude from the through hole, and the protruding angle of the copper block protruding from the through hole is calculated according to the maximum height and the width of the copper block. The protruding angle is not larger than 0.1 degree.

Description

Technical Field

[0001] The invention relates to a copper block angle measurement method and a circuit board, in particular to a copper block protrusion angle measurement method and a heat dissipation circuit board. Background Art

[0002] In the prior art, a copper block is disposed in a through hole of a circuit substrate by sucking the copper block with a suction cup and then moving the copper block into the through hole. However, when the copper block is sucked with a suction cup, the copper block may be tilted because the center of gravity of the copper block is not accurately sucked by the suction cup, thereby causing the copper block to protrude from the through hole of the circuit substrate. Therefore, it is necessary to measure the angle at which the copper block protrudes from the through hole to determine whether a defective product is produced. Summary of the invention

[0003] The invention discloses a copper block protrusion angle measurement method and a heat dissipation circuit board, which are mainly used to improve the problem that after the copper block is set in the through hole of the circuit substrate with a suction cup, the angle of the copper block protruding from the through hole needs to be measured to determine whether a defective product is produced.

[0004] One embodiment of the present invention discloses a copper block protrusion angle measurement method, which comprises: a copper block adsorption step, wherein a copper block is adsorbed by an adsorption unit; a copper block placement step, wherein the copper block is moved by the adsorption unit and the copper block is placed in a through hole of a circuit substrate to form a heat dissipation circuit board; wherein the copper block partially protrudes from the through hole; and

[0005] A measuring step is to measure a maximum height of the copper block protruding from the through hole, and to calculate a protruding angle of the copper block protruding from the through hole based on the maximum height and the width of the copper block; wherein the protruding angle of the copper block is not greater than 0.1 degrees.

[0006] Optionally, a maximum height of the copper block protruding from the through hole is no greater than 20 micrometers.

[0007] Optionally, at least two protrusions are formed on the ring side of the copper block, and the line connecting the at least two protrusions passes through the center point of the surface of the copper block; wherein the distance between the two protrusions is defined as a maximum width of the copper block, and the distance between the positions at both ends of the copper block where no protrusions are formed is defined as a minimum width of the copper block; wherein, in the measuring step, the protrusion angle of the copper block is calculated based on the maximum height and the minimum width of the copper block.

[0008] Optionally, the maximum width is between 9 mm and 13 mm, and the minimum width is between 8.5 mm and 12.5 mm.

[0009] Optionally, six protrusions are formed on the ring side surface of the copper block, and the six protrusions are arranged at equal intervals.

[0010] One embodiment of the present invention discloses a heat dissipation circuit board, which comprises: a circuit substrate; wherein a through hole is formed on a surface of the circuit substrate; and

[0011] A copper block is disposed in the through hole; wherein a protruding angle of the copper block protruding from the through hole is not greater than 0.1 degrees.

[0012] Optionally, a maximum height of the copper block protruding from the through hole is no greater than 20 micrometers.

[0013] Optionally, at least two protrusions are formed on the ring side surface of the copper block, and a line connecting the at least two protrusions passes through a center point of a surface of the copper block.

[0014] Optionally, the distance between two bosses is defined as a maximum width of the copper block, and the distance between the positions at both ends of the copper block where no bosses are formed is defined as a minimum width of the copper block; wherein the maximum width is between 9 mm and 13 mm, and the minimum width is between 8.5 mm and 12.5 mm.

[0015] Optionally, six protrusions are formed on the ring side surface of the copper block, and the six protrusions are arranged at equal intervals.

[0016] In summary, one of the beneficial effects of the present invention is that the copper block protrusion angle measurement method and heat dissipation circuit board provided by the present invention can improve the problem that after the copper block is set in the through hole of the circuit substrate with a suction cup, the angle of the copper block protruding from the through hole needs to be measured to determine whether defective products are produced through the technical solutions of "copper block adsorption step, copper block setting step and measurement step" and "the protrusion angle of the copper block is not greater than 0.1 degree".

[0017] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Flow chart of a copper block protrusion angle measurement method according to an embodiment of the present invention.

[0019] Figure 2 It is a three-dimensional schematic diagram of the copper block adsorption step of the copper block protrusion angle measurement method according to an embodiment of the present invention.

[0020] Figure 3 It is a three-dimensional schematic diagram of the copper block setting step of the copper block protrusion angle measurement method according to an embodiment of the present invention.

[0021] Figure 4 The figure is a three-dimensional schematic diagram of a heat dissipation circuit board according to an embodiment of the present invention.

[0022] Figure 5 It is a three-dimensional schematic diagram of a copper block of a heat dissipation circuit board according to an embodiment of the present invention.

[0023] Figure 6 FIG. 1 is a schematic top view of a copper block of a heat dissipation circuit board according to an embodiment of the present invention. DETAILED DESCRIPTION

[0024] The following is an explanation of the implementation methods of the "copper block protrusion angle measurement method and heat dissipation circuit board" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0025] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0026] [Method for measuring the protruding angle of copper block]

[0027] See also Figure 1 As shown, Figure 1 Flow chart of the copper block protrusion angle measurement method according to an embodiment of the present invention. The embodiment of the present invention provides a copper block protrusion angle measurement method. The copper block protrusion angle measurement method comprises a copper block adsorption step S110, a copper block setting step S120 and a measurement step S130. Of course, the copper block protrusion angle measurement method may include other steps according to the requirements, and the present invention is not limited thereto.

[0028] See also Figure 2 As shown, Figure 2The figure is a three-dimensional schematic diagram of the copper block adsorption step of the copper block protrusion angle measurement method according to an embodiment of the present invention. In the copper block adsorption step S110, a copper block 2 is adsorbed by an adsorption unit S. The adsorption unit S can be, for example, a suction cup, and the suction cup can be, for example, connected to a robotic arm (not shown) so that the copper block 2 can be moved by the robotic arm and the suction cup. In addition, in this embodiment, the shape of the copper block 2 is taken as a substantially cylindrical body, but the present invention does not limit the shape of the copper block. In other embodiments not shown in the present invention, the shape of the copper block 2 can also be substantially a cube.

[0029] See also Figure 3 As shown, Figure 3 Schematic diagram of the copper block setting step of the copper block protrusion angle measurement method according to an embodiment of the present invention. In the copper block setting step S120, the copper block 2 is moved by the adsorption unit S and is set in a through hole 1a of a circuit substrate 1 to form a heat dissipation circuit board 100. It is worth mentioning that in the copper block adsorption step S110, the copper block 2 is adsorbed by the adsorption unit S, so when the position where the adsorption unit S adsorbs the copper block 2 does not correspond to the center of gravity of the copper block 2, the copper block 2 may be slightly tilted by the adsorption unit S. Therefore, in the copper block setting step S120, the copper block 2 may be slightly tilted in the through hole 1a and partially protrude from the through hole 1a.

[0030] See also Figure 1 And with Figure 4 As shown, Figure 4 In the measuring step S130, a maximum height H of the copper block 2 protruding from the through hole 1a is measured, and a protruding angle A of the copper block 2 protruding from the through hole 1a is calculated from the maximum height H and the width of the copper block 2.

[0031] Specifically, the relevant personnel can check the specifications of the copper block 2 in advance to know the width of the copper block 2 to be set in the through hole 1a, and measure the maximum height H of the copper block 2 protruding from the through hole 1a through relevant measuring tools or measuring software, and then the relevant personnel can calculate the inverse tangent (i.e. tan-1) of the maximum height H and the width of the copper block 2 through calculation software to obtain the value of the protruding angle A. However, as long as the relevant personnel can calculate the value of the protruding angle A, the present invention does not limit the method for the relevant personnel to calculate the protruding angle A. For example, the relevant personnel can also use a calculator to calculate the protruding angle A.

[0032] See also Figure 4 Match with Figure 5 and Figure 6 As shown, Figure 5 is a three-dimensional schematic diagram of a copper block of a heat dissipation circuit board according to an embodiment of the present invention, and Figure 6 Schematic diagram of a top view of a copper block of a heat dissipation circuit board according to an embodiment of the present invention. In one embodiment, at least two bosses 21 are formed on the ring side surface of the copper block 2, and the line between at least two of the bosses 21 passes through the center point of the surface of the copper block 2, the distance between the two bosses 21 is defined as a maximum width W1 of the copper block 2, and the distance between the positions at both ends of the copper block 2 where the bosses 21 are not formed is defined as a minimum width W2 of the copper block 2. The bosses 21 can be mainly used to enable the copper block 2 to be selectively engaged in the through hole 1a of the circuit substrate 1.

[0033] In addition, in the measuring step S130, the protruding angle A of the copper block 2 can be calculated from the maximum height H and the minimum width W2 of the copper block 2. It should be noted that the protruding angle A of the copper block 2 can be regarded as the angle between the top surface of the copper block 2 and the surface of the circuit substrate 1 on which the through hole 1a is formed. It should be noted that, in the copper block setting step S120, the through hole 1a will squeeze the protruding column 21 of the copper block 2, causing the maximum width W1 of the copper block 2 to change. Therefore, in the measuring step S130, the protruding angle A can be calculated more accurately from the maximum height H and the minimum width W2 of the copper block 2.

[0034] In this embodiment, the maximum width W1 is between 9 mm and 13 mm, and the minimum width W2 is between 8.5 mm and 12.5 mm, but the present invention is not limited thereto. It should be noted that the maximum width W1 and the minimum width W2 of the copper block 2 can be changed according to needs or in accordance with the size of the through hole 1a.

[0035] In this embodiment, six protrusions 21 are formed on the ring side of the copper block, and the six protrusions 21 are arranged at equal intervals. However, the number of the protrusions 21 included in the copper block 2 can be changed according to needs. In other embodiments not shown in the present invention, the copper block 2 can include two, four, or eight protrusions 21, and the present invention does not limit the number of the protrusions 21 included in the copper block 2.

[0036] The protruding angle A of the copper block 2 protruding from the through hole 1a is not greater than 0.1 degrees. Optionally, the maximum height H of the copper block 2 protruding from the through hole 1a is not greater than 20 micrometers, but the present invention is not limited thereto.

[0037] [Heat dissipation circuit board]

[0038] See also Figure 4 As shown, the embodiment of the present invention further provides a heat dissipation circuit board 100. The above copper block protrusion angle measurement method can be used to measure the copper block protrusion angle in the heat dissipation circuit board 100, but the present invention is not limited thereto.

[0039] The heat dissipation circuit board 100 includes a circuit substrate 1 and a copper block 2. A through hole 1a is formed on the surface of the circuit substrate 1. In this embodiment, the circuit substrate 1 is a single layer, but the present invention is not limited thereto. In other embodiments not shown in the present invention, the circuit substrate may also be a multi-layer structure.

[0040] The copper block 2 is disposed in the through hole 1a, and a protrusion angle A of the copper block 2 protruding from the through hole is not greater than 0.1 degrees. The maximum height H of the copper block 2 protruding from the through hole 1a may be no greater than 20 microns. Optionally, the protrusion angle A of the copper block 2 protruding from the through hole 1a may be between 0.05 degrees and 0.1 degrees, and the maximum height H of the copper block 2 protruding from the through hole 1a may be between 1 micron and 17 microns, but the present invention is not limited thereto.

[0041] At least two bosses 21 may be formed on the annular side surface of the copper block 2, and the line between at least two of the bosses 21 passes through the center point of the surface of the copper block 2. The distance between the two bosses 21 is defined as a maximum width W1 of the copper block 2, and the distance between the positions at both ends of the copper block 2 where the bosses 21 are not formed is defined as a minimum width W2 of the copper block 2. The maximum width W1 is between 9 mm and 13 mm, and the minimum width W2 is between 8.5 mm and 12.5 mm. In this embodiment, six bosses 21 are formed on the annular side surface of the copper block 2, and the six bosses 21 are arranged at equal distances, but the present invention is not limited thereto.

[0042] [Beneficial Effects of Embodiments]

[0043] In summary, one of the beneficial effects of the present invention is that the copper block protrusion angle measurement method and heat dissipation circuit board provided by the present invention can improve the problem that after the copper block is set in the through hole of the circuit substrate with a suction cup, the angle of the copper block protruding from the through hole needs to be measured to determine whether defective products are produced through the technical solutions of "copper block adsorption step, copper block setting step and measurement step" and "the protrusion angle of the copper block is not greater than 0.1 degree".

[0044] The above description is only a preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the present invention.

Claims

1. A method for measuring the protrusion angle of a copper block, characterized in that: The copper block protrusion angle measurement method comprises: a copper block adsorption step, wherein a copper block is adsorbed by an adsorption unit; a copper block setting step, moving the copper block by the adsorption unit and setting the copper block in a through hole of a circuit substrate to form a heat dissipation circuit board; wherein the copper block partially protrudes from the through hole; and A measuring step is to measure a maximum height of the copper block protruding from the through hole, and to calculate a protruding angle of the copper block protruding from the through hole based on the maximum height and the width of the copper block; wherein the protruding angle of the copper block is not greater than 0.1 degrees.

2. The copper block protrusion angle measurement method according to claim 1, characterized in that: The maximum height of the copper block protruding from the through hole is no greater than 20 micrometers.

3. The copper block protrusion angle measurement method according to claim 1, characterized in that: At least two protrusions are formed on the ring side surface of the copper block, and the line connecting at least two of the protrusions passes through the center point of the surface of the copper block; wherein the distance between the two protrusions is defined as a maximum width of the copper block, and the distance between the positions at both ends of the copper block where the protrusions are not formed is defined as a minimum width of the copper block; wherein, in the measuring step, the protrusion angle of the copper block is calculated based on the maximum height and the minimum width of the copper block.

4. The copper block protrusion angle measurement method according to claim 3, characterized in that: The maximum width is between 9 mm and 13 mm, and the minimum width is between 8.5 mm and 12.5 mm.

5. The copper block protrusion angle measurement method according to claim 3, characterized in that: Six protrusions are formed on the ring side surface of the copper block, and the six protrusions are arranged at equal distances.

6. A heat dissipation circuit board, characterized in that: The heat dissipation circuit board comprises: A circuit substrate; wherein a through hole is formed on a surface of the circuit substrate; and A copper block is disposed in the through hole; wherein the copper block protrudes from the through hole at an angle not greater than 0.1 degrees.

7. The heat dissipation circuit board according to claim 6, characterized in that: The maximum height of the copper block protruding from the through hole is no greater than 20 micrometers.

8. The heat dissipation circuit board according to claim 6, characterized in that: At least two protrusions are formed on the ring side surface of the copper block, and a line connecting at least two of the protrusions passes through the center point of the surface of the copper block.

9. The heat dissipation circuit board according to claim 8, characterized in that: The distance between the two protrusions is defined as a maximum width of the copper block, and the distance between the positions at both ends of the copper block where the protrusions are not formed is defined as a minimum width of the copper block; The maximum width is between 9 mm and 13 mm, and the minimum width is between 8.5 mm and 12.5 mm.

10. The heat dissipation circuit board according to claim 8, characterized in that: Six protrusions are formed on the ring side surface of the copper block, and the six protrusions are arranged at equal distances.

Images