Chip mounter modular control system and method in monitoring mode, medium and product

Abstract

The invention discloses a chip mounter modular control system and method in a monitoring mode, a medium and a product, and relates to the technical field of automatic production equipment control, and the method comprises the step of dividing the chip mounter control system into a plurality of independent modules, such as a main control module, a sub-motion module and a sub-vision module. And the main control module generates a moving instruction to drive the sub-motion module to a preset position, and triggers the sub-visual module to photograph and obtain a chip image. The sub-vision module calculates the matching degree and the deviation degree of the chip and feeds back the matching degree and the deviation degree to the main control module and the sub-motion module in real time. And the main control module judges the qualification of the chip according to a preset condition, and sends an adjusting or stopping instruction to the sub-motion module. And the sub-motion module adjusts or stops motion according to the instruction and feeds back the motion state in real time. Through independent operation of the subsystems and real-time scheduling of the main control system, the flexibility and the response speed of the system are improved, and the accuracy and the high efficiency of user operation are ensured.

Description

Technical Field

[0001] The present application relates to the field of automated production equipment control technology, and in particular to a modular control system, method, medium and product for a placement machine in a monitoring mode. Background Art

[0002] With the rapid development of science and technology, the application of automated production equipment in the manufacturing industry is becoming more and more extensive. Especially in the fields of semiconductor packaging and electronic assembly, the use of placement machines has become a key link in improving production efficiency and ensuring product quality.

[0003] However, with the trend of miniaturization and precision of products, higher requirements are placed on the control accuracy, flexibility and intelligence level of the placement machine.

[0004] Traditional SMT control systems often adopt a centralized architecture, with all functions integrated into a main controller. This not only makes the system structure complex and difficult to maintain, but also makes it difficult to adapt to rapidly changing production needs. In addition, traditional control methods lack real-time monitoring and fault warning mechanisms. Once a fault occurs, it often causes production interruptions, seriously affecting production efficiency. Summary of the invention

[0005] The purpose of this application is to provide a modular control system, method, medium and product for a placement machine in a monitoring mode, which can improve the processing task speed and response speed of the placement machine.

[0006] To achieve the above objectives, this application provides the following solutions: In a first aspect, the present application provides a modular control system for a chip mounter in a monitoring mode, comprising: Main control module, sub-motion module, sub-vision module; The main control module is connected to the sub-motion module and the sub-vision module respectively, and the sub-motion module is also connected to the sub-vision module; The main control module is used to generate a first moving instruction according to the placement instruction input by the user and send it to the sub-motion module to control the sub-motion module to move to a first preset position; when the sub-motion module moves to the first preset position, the main control module generates a first photographing instruction and sends it to the sub-vision module; The sub-vision module is used to take a picture of the chip according to the received first photographing instruction, obtain a chip image, and calculate the matching degree and deviation degree of the chip according to the chip image; and feed back the matching degree and deviation degree of the chip to the main control module and the sub-motion module; The main control module is further used to determine whether the chip is qualified according to a preset condition to obtain a first judgment result; the preset condition is that the matching degree fed back by the sub-vision module is equal to or greater than the preset graphic matching degree; if the first judgment result is yes, an adjustment instruction is sent to the sub-motion module; if the first result is no, a stop instruction is sent to the sub-motion module; The sub-motion module is used to receive and execute the movement instructions sent by the main control module, and when receiving the adjustment instructions from the main control module, drive the mechanical actuator of the placement machine to perform chip placement operations according to the deviation feedback from the sub-vision module; when receiving the stop instruction from the main control module, drive the mechanical actuator of the placement machine to stop moving; the sub-motion module is also used to feed back the movement status and position information to the main control module in real time.

[0007] Optionally, the modular control system for the chip mounter in the monitoring mode further includes: a sub-communication module; The sub-communication module is connected to the main control module and the user's EAP system respectively; The main control module is further configured to generate a wafer data download instruction and send it to the sub-communication module upon receiving a communication start instruction from a user; The sub-communication module is used to obtain Wafer Map data from the user's EAP system according to the received wafer data download instruction, and send the obtained Wafer Map data to the main control module.

[0008] Optionally, the modular control system for the chip mounter in the monitoring mode further includes: a sub-path planning module; The sub-path planning module is connected to the main control module and the sub-motion module respectively; The main control module is also used to generate a path planning instruction and send it to the sub-path planning module when receiving a user's instruction to open the wafer map, and send the wafer map data to the sub-path planning module; at the same time, generate a second movement instruction and send it to the sub-motion module to control the sub-motion module to move to a second preset position; When the sub-motion module moves to the second preset position, the main control module generates a second photographing instruction and sends it to the sub-vision module; the sub-vision module takes pictures according to the received second photographing instruction to obtain the overall image of the wafer; the sub-vision module identifies each chip on the wafer according to the overall image of the wafer, obtains the actual position coordinate information of each chip, and sends it to the main control module; The main control module is also used to send the actual position coordinate information of each chip to the sub-path planning module; The sub-path planning module is used to generate a wafer map based on the received path planning instructions, Wafer Map data and the actual position coordinate information of each chip; on the wafer map, based on the preset reference chip position coordinates and the preset mountable chip position coordinates, generate the optimal movement path from the reference chip to all mountable chips, and send the optimal movement path to the sub-motion module.

[0009] In a second aspect, the present application provides a modular control method for a placement machine in a monitoring mode, comprising: The main control module determines whether the chip is qualified according to the matching degree and the deviation degree; the matching degree and the deviation degree are obtained by the sub-vision module taking a picture of the chip to obtain a chip image when the sub-motion module moves to the first preset position, and the sub-vision module calculates based on the captured chip image; If the chip is qualified, the main control module controls the sub-motion module to perform chip placement operations; If the chip is unqualified, the main control module controls the sub-motion module to stop moving.

[0010] Optionally, the matching degree and the deviation degree are obtained by the sub-vision module taking a picture of the chip to obtain a chip image when the sub-motion module moves to the first preset position, and are calculated based on the captured chip image, specifically including: The sub-vision module includes a plurality of preset vision model templates and recognition algorithms; The sub-vision module calls the corresponding vision model template according to the chip image; The similarity between the chip image and the corresponding visual model template is calculated by the recognition algorithm to obtain the chip matching degree, and the deviation between the center point of the chip image and the corresponding visual model template is calculated to obtain the deviation degree.

[0011] Optionally, the calculation formula of the matching degree is: ; Among them, M represents the matching degree between the chip image and the visual model template. Indicates the number of features in the chip image that match the visual model template, Represents the total number of features used for matching in the visual model template; The deviation is: ; ; in, and They respectively represent the deviation between the chip image center and the reference position in the X-axis direction and the Y-axis direction; and They represent the actual measured position of the chip image center in the X-axis direction and the actual measured position in the Y-axis direction, respectively. and They respectively represent the reference position of the chip image center in the X-axis direction and the Y-axis direction in the visual model template.

[0012] Optionally, the process also includes wafer map generation and path planning steps, specifically: The sub-path planning module generates a wafer map according to the received path planning instructions, Wafer Map data and the actual position coordinate information of each chip; wherein, when the main control module controls the sub-motion module to move to the second preset position, the main control module controls the sub-vision module to take pictures to obtain the overall image of the wafer; the sub-vision module identifies each chip on the wafer according to the overall image of the wafer; On the wafer map generated by the sub-path planning module, the optimal moving path from the reference chip to all mountable chips is generated according to the preset reference chip position coordinates and the preset mountable chip position coordinates.

[0013] Optionally, an optimal moving path from the reference chip to all mountable chips is generated, followed by: Get the number of mountable chips I; When the main control module controls the sub-motion module to move to the chip position of the i-th mountable chip according to the optimal planning path, the sub-vision module is controlled to take a picture of the i-th mountable chip and calculate the matching degree and deviation degree of the i-th mountable chip; The main control module controls the sub-motion module to mount the i-th mountable chip according to the matching degree and deviation degree of the i-th mountable chip; After the mounting is completed, let i=i+1 and return to the step "When the main control module controls the sub-motion module to move to the chip position of the i-th mountable chip according to the optimal planning path, the sub-vision module is controlled to take a photo of the i-th mountable chip and calculate the matching degree and deviation degree of the i-th mountable chip" until i=I, and the mounting is completed.

[0014] In a third aspect, the present application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the modular control method for a chip placement machine in a monitoring mode as described above.

[0015] In a fourth aspect, the present application provides a computer program product, including a computer program, which, when executed by a processor, implements the steps of the modular control method of a placement machine in the monitoring mode described in any one of the above.

[0016] According to the specific embodiments provided in this application, this application has the following technical effects: The present application provides a modular control system, method, medium and product of a chip mounter in a monitoring mode. By dividing the chip mounter control system into multiple independent modules, such as a main control module, a sub-motion module and a sub-vision module, the technical problems of high functional integration of each component in the traditional chip mounter control system, difficulty in debugging and maintenance, and difficulty in achieving high precision and high efficiency are solved. After the user inputs the placement instruction, the main control module generates a first movement instruction according to the instruction, and sends it to the sub-motion module to control it to move to the first preset position, which solves the problem that the traditional chip mounter lacks effective scheduling and precise positioning after receiving the instruction, and ensures the initial accuracy of the placement process. At the same time, after the sub-motion module reaches the preset position, the main control module generates a first photo-taking instruction and sends it to the sub-vision module, which provides a basis for subsequent visual inspection. The chip is photographed according to the photo-taking instruction by the sub-vision module, and the matching degree and deviation degree of the chip are calculated, and then the information is fed back to the main control module and the sub-motion module. The main control module then determines whether the chip is qualified according to the preset conditions, and sends an adjustment instruction or a stop instruction to the sub-motion module accordingly. The problem that traditional chip mounters cannot detect the chip status in real time and make precise adjustments during the mounting process is solved. Through the visual inspection of the sub-vision module, the matching degree and deviation degree of the chip can be obtained in real time, thereby achieving strict control of the chip quality. At the same time, the main control module makes corresponding instructions based on the detection results to ensure that only qualified chips will continue to be mounted, and unqualified chips will be stopped in time, thereby improving the mounting quality and efficiency. In addition, the sub-motion module not only receives and executes the movement instructions of the main control module during the whole process, but also makes precise adjustments according to the adjustment instructions, and stops the movement according to the stop instructions. At the same time, the sub-motion module also feeds back the movement status and position information to the main control module in real time, providing real-time and accurate feedback information to the main control module, further enhancing the stability and reliability of the system.

[0017] In summary, this application realizes real-time monitoring and precise control of the placement process through a modular control system, method, medium and product of a placement machine in monitoring mode. This not only improves the placement quality and efficiency, but also reduces the rework rate and cost caused by placement errors. At the same time, the modular design of the system enables efficient collaboration between modules, enhances the scalability and maintainability of the system, and provides strong support for the intelligent and automated development of placement machines. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic diagram of functional modules of a modular control system for a chip mounter in a monitoring mode provided by an embodiment of the present application; Figure 2 for Figure 1 Schematic diagram of the detailed functional modules of the Neutron Vision module; Figure 3 A schematic diagram of a process flow after a wafer map mode is enabled according to an embodiment of the present application; Figure 4 for Figure 1 Schematic diagram of detailed functional modules of the packaging framework of the neutron communication module and the anti-mixing instruction control; Figure 5 A schematic diagram of a wafer image file provided in an embodiment of the present application; Figure 6 A schematic flow chart of a modular control method for a chip mounter in a monitoring mode provided by an embodiment of the present application; Figure 7 A schematic flow chart of the steps involved in generating an optimal moving path from a reference chip to all mountable chips according to an embodiment of the present application. DETAILED DESCRIPTION

[0020] First, some technical terms involved in the embodiments of the present application are introduced.

[0021] The alignment system of the placement machine has gone through a process from the earliest mechanical alignment, laser alignment to visual alignment, and the alignment accuracy has gradually improved. The visual alignment system generally includes a lighting source, an imaging lens, a photoelectric conversion camera, an acquisition card for data transmission and processing, and processing software.

[0022] At present, the alignment of the chip and the target patch position is mainly carried out by visual alignment. In manual and semi-automatic patch equipment, alignment is performed directly by image overlap. Fully automatic patch equipment is mainly indirectly aligned by multi-dimensional visual image detection, which includes at least two independent imaging systems. The camera collects images, extracts image edges, and identifies the center position of the image through image algorithms. Generally, upper and lower field of view cameras are arranged to obtain feature points on the chip or chip appearance, as well as feature points associated with the target patch position, so as to establish the coordinate relationship between the chip and the target position point. In the process of establishing the coordinate position, according to the different patch accuracy, the alignment method used for the target patch position (substrate or wafer) is divided into global alignment and local alignment. Global alignment has high efficiency and can complete the target position coordinate positioning in one alignment. The prerequisite is that the surface accuracy of the substrate or wafer is high. Local alignment can adapt to the deviation of different array positions and identify and locate each patch position separately. It is suitable for high-precision patch, but due to frequent alignment, the yield is relatively low.

[0023] The visual subsystem in the system is completely independent. Changes to hardware such as the camera, lens, and light source will not affect the main control system. The visual system provides the main control system with methods such as photo taking, positioning, and scale measurement through a unified interface.

[0024] The mainstream vision solution software on the current market includes Halcon (High-Speed ​​Vision Library Containing Algorithms and Example), Cognex, etc. The vision subsystem can use any of these solutions, and the main control system cannot perceive changes in the vision subsystem solution.

[0025] The existing technology does not divide sub-modules, and all data processing is completed in a main system. The disadvantage is that it cannot respond to requests in time, resulting in a lack of processing speed. In view of this, the embodiment of the present application provides a modular control system for a patch machine in monitoring mode. By adopting a low-coupling software architecture in which multiple sub-modules are independent of each other, the entire software is divided into independent subsystems. Each subsystem handles internal affairs independently, improving the processing speed and response speed, and greatly improving the output per hour. Among them, the benefits of the low-coupling subsystem are: 1. Each subsystem runs independently in its own thread. A failure in any subsystem will not cause the collapse of the entire control system.

[0026] 2. The subsystems are independent of each other and interact through subscription notifications. The sending and receiving of notifications will not cause the entire system to fail due to the failure of either the message sender or the subscriber.

[0027] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0028] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0029] like Figure 1 As shown, the present application provides a modular control system for a placement machine in a monitoring mode, including: a main control module, a sub-motion module, and a sub-vision module.

[0030] The main control module is connected to the sub-motion module and the sub-vision module respectively, and the sub-motion module is also connected to the sub-vision module.

[0031] The main control module is used to generate a first moving instruction according to the mounting instruction input by the user and send it to the sub-motion module to control the sub-motion module to move to a first preset position; when the sub-motion module moves to the first preset position, the main control module generates a first photographing instruction and sends it to the sub-vision module.

[0032] The sub-vision module is used to take a picture of the chip according to the received first photographing instruction, obtain a chip image, and calculate the matching degree and deviation degree of the chip according to the chip image; and feed back the matching degree and deviation degree of the chip to the main control module and the sub-motion module.

[0033] The main control module is also used to determine whether the chip is qualified according to preset conditions to obtain a first judgment result; the preset condition is that the matching degree fed back by the sub-vision module is equal to or greater than the preset graphic matching degree; if the first judgment result is yes, an adjustment instruction is sent to the sub-motion module; if the first result is no, a stop instruction is sent to the sub-motion module.

[0034] The sub-motion module is used to receive and execute the movement instructions sent by the main control module, and when receiving the adjustment instructions from the main control module, drive the mechanical actuator of the placement machine to perform chip placement operations according to the deviation feedback from the sub-vision module; when receiving the stop instruction from the main control module, drive the mechanical actuator of the placement machine to stop moving; the sub-motion module is also used to feedback the movement state and position information to the main control module in real time. Among them, the sub-motion module runs in an independent CPU (Central Processing Unit) kernel, is not scheduled by the Windows operating system, and has absolute priority to use the CPU clock. The main control module exchanges data with the sub-motion module through the TCP / IP communication protocol (Transmission Control Protocol / Internet Protocol). When the sub-motion module is in the automatic running state, the sub-motion module's data request is monitored by monitoring the callback method of the sub-motion module variable, and the relevant sub-module is notified to perform the corresponding operation.

[0035] Among them, implementing this embodiment, Figure 1 The IO (Input / Output) in the diagram indicates the electrical signal connection of external devices such as sensors, and the driver is responsible for receiving motion instructions and converting them into electrical signals to drive the motor. The sensor is responsible for monitoring the temperature, whether the moving parts are in place, and other information, and feedback signals through IO.

[0036] In this embodiment, the modular control system of the chip mounter in the monitoring mode further includes: a sub-communication module. The sub-communication module is specifically: a SECS / GEM (Equipment Communications Standard / GenericEquipment Model, semiconductor equipment communication standard / generic equipment model) module.

[0037] The sub-communication module is connected to the main control module and the user's EAP (Equipment Automatic Process) system respectively. The communication data format of the SECS / GEM sub-module fully complies with the E30 and E5 standards provided by the SEMI (Semiconductor Equipment and Materials International) organization.

[0038] The main control module is further configured to generate a wafer data download instruction and send it to the sub-communication module upon receiving a communication start instruction from a user.

[0039] The sub-communication module is used to obtain Wafer Map data from the user's EAP system according to the received wafer data download instruction, and send the obtained Wafer Map data to the main control module.

[0040] The sub-communication module also transmits the equipment's variable data, alarm information, and recipe information to the upstream information system. The variable data includes: equipment counting variables, such as the number of times the ejector pin is used and the number of times the nozzle is used; equipment operating parameters, such as the ejector pin lifting height and the ejector pin pre-lifting height. Figure 4 As shown. The die bonder sends a request S6F11 to the EAP server, which is used to check the anti-mixing status of the frame. This request contains a parameter, namely "{frame ID}", which is used to identify a specific frame. The EAP server confirms the frame anti-mixing check request sent by the die bonder through the S6F12 device. If the frame anti-mixing check request is successfully confirmed, the EAP server will send a request to set the frame status to the die bonder. This request contains a parameter "name" and possible other data related to the frame status. After receiving the request to set the frame status, the die bonder will perform the corresponding operation (such as updating the frame status), and then send a confirmation request to the EAP server to indicate that the frame status has been successfully set. The above process can effectively prevent the problem of mixing materials during the frame installation process and improve production efficiency and product quality.

[0041] Wherein, in implementing this embodiment, the modular control system of the placement machine in the monitoring mode further includes: a sub-path planning module.

[0042] The sub-path planning module is connected to the main control module and the sub-motion module respectively.

[0043] The main control module is also used to generate a path planning instruction and send it to the sub-path planning module when receiving a user's instruction to open the wafer map, and send the wafer map data to the sub-path planning module; at the same time, generate a second movement instruction and send it to the sub-motion module to control the sub-motion module to move to a second preset position.

[0044] When the sub-motion module moves to the second preset position, the main control module generates a second photo-taking instruction and sends it to the sub-vision module; the sub-vision module takes photos according to the received second photo-taking instruction to obtain the overall image of the wafer; the sub-vision module identifies each chip on the wafer based on the overall image of the wafer, obtains the actual position coordinate information of each chip, and sends it to the main control module.

[0045] The main control module is also used to send the actual position coordinate information of each chip to the sub-path planning module.

[0046] The sub-path planning module is used to generate a wafer map based on the received path planning instructions, Wafer Map data and the actual position coordinate information of each chip; on the wafer map, based on the preset reference chip position coordinates and the preset mountable chip position coordinates, generate the optimal movement path from the reference chip to all mountable chips, and send the optimal movement path to the sub-motion module.

[0047] Substrate mapping (or wafer mapping) is the process of mapping the performance of semiconductor devices on a substrate using a color-coded grid to display the performance, e.g. Figure 5 As shown. Different colors represent different chip classification information (Bincode), for example: Bincode=1 is represented by green, Bincode=2 is represented by red and yellow. This map can be convenient for representing performance variations across the substrate, as the distribution of these variations may be a clue to their cause. As with many items in the semiconductor process field, there are standards available for this process step. The newest and most promising standard is the E142 standard provided by the SEMI organization. This standard was approved by vote and published in 2005.

[0048] The sub-path planning module is fully compatible with SEMI E142, SEMI G85, SINF (Simplified Integrator Nested Format), STIF (STMicroelectronics inkless File), CSV (Comma-Separated Values) and other file formats.

[0049] The sub-path planning module informs the main control module of the quality of the current row and column chips by notification. The main control module instructs the sub-vision module to take photos and identify by calling the visual API (Application Programming Interface). The sub-vision module informs the sub-motion module of the photo identification result of the current chip through TCP / IP communication. The sub-motion module determines whether to pick up the current chip based on the identification result and feeds back the picking result through variable data. The main control system obtains information by monitoring the variable data of the motion control system and notifies the sub-vision module and the sub-path planning module.

[0050] The main control module coordinates the main thread and subsystem background sub-threads through the Dispatch function and asynchronous delegation function provided by Microsoft Visual Studio (VS) to ensure that the user's UI (User Interface) operation experience and background data processing do not conflict, causing UI response delays or no response.

[0051] In another embodiment of the present application, Figure 6 As shown, a modular control method for a chip placement machine in a monitoring mode is provided, and the method includes the following steps 101 to 103. Among them: Step 101, the main control module determines whether the chip is qualified according to the matching degree and the deviation degree; the matching degree and the deviation degree are obtained when the sub-motion module moves to the first preset position, the sub-vision module takes a picture of the chip, obtains the chip image, and is calculated based on the photographed chip image.

[0052] Step 102: If the chip is qualified, the main control module controls the sub-motion module to perform chip mounting operations.

[0053] Step 103: If the chip is unqualified, the main control module controls the sub-motion module to stop moving.

[0054] By implementing the above steps 101 to 103 , high-precision, high-efficiency and intelligent automatic placement control of the placement machine in the monitoring mode can be achieved.

[0055] Among them, implementing this embodiment, such as Figure 2 As shown, the matching degree and deviation degree in step 101 are obtained by the sub-vision module taking a picture of the chip to obtain a chip image when the sub-motion module moves to the first preset position, and the sub-vision module is calculated based on the captured chip image, which specifically includes: The sub-vision module includes a plurality of preset vision model templates and recognition algorithms.

[0056] The sub-vision module calls the corresponding vision model template according to the chip image.

[0057] The similarity between the chip image and the corresponding visual model template is calculated by the recognition algorithm to obtain the chip matching degree, and the deviation between the center point of the chip image and the corresponding visual model template is calculated to obtain the deviation degree.

[0058] Wherein, in this implementation mode, the calculation formula of the matching degree is: .

[0059] Among them, M represents the matching degree between the chip image and the visual model template. Indicates the number of features in the chip image that match the visual model template, Indicates the total number of features used for matching in the visual model template. Matching features include but are not limited to the chip's contour shape, surface texture pattern, color distribution, key points such as specific marks or hole positions, and the overall size of the chip or the size of a specific part.

[0060] A coordinate system is constructed with the center point of the visual model template as the origin, the horizontal direction of the chip being mounted as the X-axis, and the direction perpendicular to the X-axis as the Y-axis. The deviation is: .

[0061] . in, and They respectively represent the deviation between the chip image center and the reference position in the X-axis direction and the Y-axis direction; and They represent the actual measured position of the chip image center in the X-axis direction and the actual measured position in the Y-axis direction, respectively. and They represent the reference position of the chip image center in the X-axis direction and the Y-axis direction in the visual model template. The deviation is used by the sub-motion module to control the axis position of the mechanical actuator of the placement machine.

[0062] In another exemplary embodiment of the present application, a modular control method for a chip mounter in a monitoring mode further includes a wafer map generation and path planning step, specifically: The sub-path planning module generates a wafer map according to the received path planning instructions, Wafer Map data and the actual position coordinate information of each chip; wherein the actual position coordinate information of each chip is when the main control module controls the sub-motion module to move to the second preset position, the main control module controls the sub-vision module to take pictures to obtain the overall image of the wafer; the sub-vision module identifies each chip on the wafer according to the overall image of the wafer.

[0063] On the wafer map generated by the sub-path planning module, the optimal moving path from the reference chip to all mountable chips is generated according to the preset reference chip position coordinates and the preset mountable chip position coordinates.

[0064] In another exemplary embodiment of the present application, Figure 7 As shown, after generating the optimal moving path from the reference chip to all mountable chips, the following steps are also included: Get the number of mountable chips I.

[0065] When the main control module controls the sub-motion module to move to the chip position of the i-th mountable chip according to the optimal planning path, the sub-vision module is controlled to take a picture of the i-th mountable chip and calculate the matching degree and deviation degree of the i-th mountable chip.

[0066] The main control module controls the sub-motion module to mount the i-th mountable chip according to the matching degree and deviation degree of the i-th mountable chip.

[0067] After the mounting is completed, let i=i+1 and return to the step "When the main control module controls the sub-motion module to move to the chip position of the i-th mountable chip according to the optimal planning path, the sub-vision module is controlled to take a photo of the i-th mountable chip and calculate the matching degree and deviation degree of the i-th mountable chip" until i=I, and the mounting is completed.

[0068] In an exemplary embodiment, the five modules run independently within the system. The main control module is responsible for monitoring each sub-module and scheduling the sub-module requests in a timely manner. In order to maximize the performance of each sub-module without interfering with each other, a highly cohesive independent dynamic link library method is adopted to create each independent sub-module, and a low-coupling event subscription method is adopted to monitor the operating status and function requests of each sub-module.

[0069] Among them, the main control module is the main process. When the application is started, the main process is started, and the main process starts each sub-module thread. After the sub-module thread is started, it runs independently in the main process. The main control module sends tasks to each sub-module by issuing commands, and each module subscribes to the requests of other sub-modules by subscription.

[0070] In another exemplary embodiment, steps 201-205 are specifically included.

[0071] Step 201: The main control module sends an automatic operation command to the sub-motion module.

[0072] Step 202, after receiving the automatic operation command, the sub-motion module starts to execute the equipment self-check program, and starts to command the axis movement after the self-check passes. When the sub-vision module is required to take a photo during the movement, the sub-motion module sends a photo request.

[0073] Step 203, the sub-vision module system subscribes to the photo request information of the sub-motion module, receives the photo request through the subscribed information, performs photo taking, image processing, positioning information processing and other operations, and the sub-vision module determines whether the image information is qualified. If qualified, the information is sent to the sub-motion module, and the main control module sends a command to continue the movement to the sub-motion module.

[0074] The main control module obtains the image processing data of the sub-vision module through the subscribed messages, and displays and saves the data. Regardless of whether the image is qualified, the main control module displays the camera image collected by the sub-vision module in real time. Whether the image is saved is controlled by the switch in the software. The user controls the switch to decide whether to keep the image. The saved image is used for analysis when the photo fails or the matching degree is lower than expected.

[0075] If the main control module determines that the image processing information is unqualified, it will send an unqualified information processing command to the sub-motion module. After receiving the unqualified information command, the sub-motion module stops moving; at the same time, the main control module triggers an alarm and displays the alarm information to the operator. Among them, the main control module determines whether it is qualified based on the graphic matching degree, and the matching degree score is set by the user (0-100%).

[0076] Step 204, when the user turns on the wafer map mode in the main control module, the flow chart is as follows Figure 3 As shown, the main control module sends a wafer map opening command to the sub-motion module, and notifies the sub-path planning module to call out the user operation interface. The user imports the Wafer Map file through the operator interface of the sub-path planning module, and a prompt pops up to prompt the user to set the reference chip and the mountable chip information. After the user completes the setting, the sub-path planning module prompts the user to make a visual template for the chip. The user calls out the visual template interface through the visual template command of the sub-path planning module, and notifies the sub-visual module to generate a template and set the search range through the visual template interface. After the visual template is formulated, the user clicks the path-finding function on the sub-path planning module interface. The sub-path planning module generates a moving path from the reference chip to the actual point, and notifies the sub-motion module to move along the moving path. After the sub-motion module receives the moving command, the main control module notifies the sub-vision module to take a photo. The sub-vision module sends the photo information to the main control module. The main control module determines the visual recognition result and controls the sub-motion module to move. After moving, the sub-motion module notifies the sub-path planning module of the successful movement information. The sub-motion module continues to request the next chip position from the sub-path planning module. The sub-path planning module sends the next chip position to the sub-motion module. When the sub-motion module reaches the next chip position, it requests the sub-vision module to take a photo and move. Repeat this process until the end of the moving path is reached. The sub-motion module notifies the main control module to reach the end of the path. The main control module prompts the user to confirm whether the moving route is correct. After the user confirms that it is correct, click the run button of the main control module. The main control module sends a circular motion command to the sub-motion module and generates a moving path. The main control module requests the sub-vision module to take a photo, and the main control module controls the sub-motion module to move according to the data sent by the visual subsystem. The main control module updates the map and executes it in a loop until the end of the map. The sub-motion module notifies the main control module that the operation is completed. After receiving the notification, the main control module pops up a window to remind the user that the operation is completed.

[0077] Step 205, when the user turns on the SECS / GEM sub-communication module function, the SECS / GEM sub-communication module enables the monitoring mode, monitors the network address and port, and when the user executes the wafer map operation mode, the sub-path planning module notifies the main control module to send the Wafer Map data. After receiving the notification, the main control module notifies the SECS / GEM sub-communication module to request the Wafer Map data. After receiving the command from the main control module, the SECS / GEM sub-communication module applies for the Wafer Map data from the user's EAP system. Wait for the EAP system instruction. If the EAP system allows, the Wafer Map data will be sent down through the network. The SECS / GEM sub-communication module sends the acquired Wafer Map data to the sub-path planning module through the main control module, and the sub-path planning module generates a wafer map by drawing the Wafer Map data. Notify the user to set the reference point and the mountable chip, and return to step 204.

[0078] The sub-visual module and sub-motion module are sub-modules that must be enabled, and the sub-path planning module and SECS / GEM sub-communication system can be enabled or disabled according to user needs. The main control module determines whether to monitor the sub-path planning module and SECS / GEM sub-communication system based on their enabled status. The system's multi-module and complexity are fully demonstrated. At the same time, the system architecture model can quickly integrate the sub-modules that will be added in the future without affecting the current system structure. There is no need to rebuild the software architecture, and the enabling and disabling of sub-modules will not affect the operation of the entire system.

[0079] In an exemplary embodiment, through a modular control system of a placement machine in a monitoring mode of the present application, the hourly output (according to different processes) and placement accuracy of the equipment are greatly improved: (1) The UPH (Units Per Hour) of soft solder equipment has been increased from 4,000 pieces per hour to 6,000 pieces per hour, and the placement accuracy has been increased from ±80 microns to ±50 microns.

[0080] (2) The UPH of the silver paste equipment increased from 10,000 pieces per hour to 15,000 pieces per hour, and the placement accuracy increased from ±50 to ±25 microns.

[0081] (3) The eutectic equipment capacity was increased from 12,000 pieces per hour to 20,000 pieces per hour, and the placement accuracy was increased from ±50 to ±25 microns.

[0082] The present application also provides an application scenario, which applies the modular control method of the patch machine in the monitoring mode mentioned above. Specifically: The modular control method of the patch machine in the monitoring mode provided in this embodiment can be applied in the automated patch production scenario. The automated patch production scenario includes a raw material preparation link, a patch processing link and a finished product output link; the chip enters the patch processing link from the raw material preparation link, obtains precise mounting operations through modular collaboration, and enters the downstream finished product output link. The modular control method of the patch machine in the monitoring mode provided in this embodiment belongs to the precise control link in the patch processing link. Specifically, in the patch processing link process for the chip, the chip can be precisely mounted based on the collaborative method of the main control module, the sub-motion module and the sub-vision module, that is, according to the matching degree and deviation degree calculated from the chip image, the mechanical actuator of the patch machine is adjusted to perform the chip mounting operation.

[0083] In an exemplary embodiment, a computer-readable storage medium is provided, storing a computer program, and when the computer program is executed by a processor, the steps in the above method embodiments are implemented.

[0084] In an exemplary embodiment, a computer program product is provided, including a computer program, and when the computer program is executed by a processor, the steps in the above method embodiments are implemented.

[0085] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0086] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM may be in various forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM).

[0087] The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. The non-relational database may include a distributed database based on blockchain, etc., but is not limited thereto. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but is not limited thereto.

[0088] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and core ideas of this application. At the same time, for those skilled in the art, according to the ideas of this application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting this application.

Claims

1. A modular control system for a chip mounter in monitoring mode, characterized in that: The modular control system of the chip mounter in the monitoring mode includes: Main control module, sub-motion module, sub-vision module; The main control module is connected to the sub-motion module and the sub-vision module respectively, and the sub-motion module is also connected to the sub-vision module; The main control module is used to generate a first moving instruction according to the placement instruction input by the user and send it to the sub-motion module to control the sub-motion module to move to a first preset position; when the sub-motion module moves to the first preset position, the main control module generates a first photographing instruction and sends it to the sub-vision module; The sub-vision module is used to take a picture of the chip according to the received first photographing instruction, obtain a chip image, and calculate the matching degree and deviation degree of the chip according to the chip image; feed back the matching degree and deviation degree of the chip to the main control module and the sub-motion module; the sub-vision module includes a plurality of preset vision model templates and recognition algorithms; the sub-vision module calls the corresponding vision model template according to the chip image; calculates the similarity between the chip image and the corresponding vision model template through the recognition algorithm to obtain the matching degree of the chip, and calculates the central point deviation between the chip image and the corresponding vision model template to obtain the deviation degree; The calculation formula of the matching degree is: ； in, M Indicates the matching degree between the chip image and the visual model template, Indicates the number of features in the chip image that match the visual model template, Represents the total number of features used for matching in the visual model template; The deviation is: ； ； in, and They respectively represent the deviation between the chip image center and the reference position in the X-axis direction and the Y-axis direction; and They represent the actual measured position of the chip image center in the X-axis direction and the actual measured position in the Y-axis direction, respectively. and They respectively represent the reference position of the chip image center in the X-axis direction and the Y-axis direction in the visual model template; The main control module is further used to determine whether the chip is qualified according to a preset condition to obtain a first judgment result; the preset condition is that the matching degree fed back by the sub-vision module is equal to or greater than the preset graphic matching degree; if the first judgment result is yes, an adjustment instruction is sent to the sub-motion module; if the first result is no, a stop instruction is sent to the sub-motion module; The sub-motion module is used to receive and execute the movement instructions sent by the main control module, and when receiving the adjustment instructions from the main control module, drive the mechanical actuator of the placement machine to perform chip placement operations according to the deviation feedback from the sub-vision module; when receiving the stop instruction from the main control module, drive the mechanical actuator of the placement machine to stop moving; the sub-motion module is also used to feed back the movement status and position information to the main control module in real time.

2. The modular control system for chip mounters in monitoring mode according to claim 1, characterized in that: The modular control system of the chip mounter in the monitoring mode further includes: a sub-communication module; The sub-communication module is connected to the main control module and the user's EAP system respectively; The main control module is further configured to generate a wafer data download instruction and send it to the sub-communication module upon receiving a communication start instruction from a user; The sub-communication module is used to obtain WaferMap data from the user's EAP system according to the received wafer data download instruction, and send the obtained WaferMap data to the main control module.

3. The modular control system of the chip mounter in the monitoring mode according to claim 1, characterized in that: The modular control system of the chip mounter in the monitoring mode further includes: a sub-path planning module; The sub-path planning module is connected to the main control module and the sub-motion module respectively; The main control module is also used to generate a path planning instruction and send it to the sub-path planning module when receiving a user's instruction to open the wafer map, and send the wafer map data to the sub-path planning module; at the same time, generate a second movement instruction and send it to the sub-motion module to control the sub-motion module to move to a second preset position; When the sub-motion module moves to the second preset position, the main control module generates a second photographing instruction and sends it to the sub-vision module; the sub-vision module takes pictures according to the received second photographing instruction to obtain the overall image of the wafer; the sub-vision module identifies each chip on the wafer according to the overall image of the wafer, obtains the actual position coordinate information of each chip, and sends it to the main control module; The main control module is also used to send the actual position coordinate information of each chip to the sub-path planning module; The sub-path planning module is used to generate a wafer map based on the received path planning instructions, Wafer Map data and the actual position coordinate information of each chip; on the wafer map, based on the preset reference chip position coordinates and the preset mountable chip position coordinates, generate the optimal movement path from the reference chip to all mountable chips, and send the optimal movement path to the sub-motion module.

4. A modular control method for a chip mounter in a monitoring mode, characterized in that: The modular control method of the chip mounter in the monitoring mode is applied to the main control module of the modular control system of the chip mounter in the monitoring mode according to any one of claims 1 to 3, and the modular control method of the chip mounter in the monitoring mode comprises: The main control module determines whether the chip is qualified according to the matching degree and the deviation degree; the matching degree and the deviation degree are obtained by the sub-vision module taking a picture of the chip when the sub-motion module moves to the first preset position to obtain the chip image, and the sub-vision module calculates based on the captured chip image, specifically including: The sub-vision module includes a plurality of preset vision model templates and recognition algorithms; The sub-vision module calls the corresponding vision model template according to the chip image; The similarity between the chip image and the corresponding visual model template is calculated by the recognition algorithm to obtain the chip matching degree, and the deviation between the center point of the chip image and the corresponding visual model template is calculated to obtain the deviation degree; The calculation formula of the matching degree is: ； in, M Indicates the matching degree between the chip image and the visual model template, Indicates the number of features in the chip image that match the visual model template, Represents the total number of features used for matching in the visual model template; The deviation is: ； ； in, and They respectively represent the deviation between the chip image center and the reference position in the X-axis direction and the Y-axis direction; and They represent the actual measured position of the chip image center in the X-axis direction and the actual measured position in the Y-axis direction, respectively. and They respectively represent the reference position of the chip image center in the X-axis direction and the Y-axis direction in the visual model template; If the chip is qualified, the main control module controls the sub-motion module to perform chip placement operations; If the chip is unqualified, the main control module controls the sub-motion module to stop moving.

5. The modular control method of a chip mounter in a monitoring mode according to claim 4, characterized in that: It also includes wafer map generation and path planning steps, specifically: The sub-path planning module generates a wafer map according to the received path planning instructions, Wafer Map data and the actual position coordinate information of each chip; wherein, when the main control module controls the sub-motion module to move to the second preset position, the main control module controls the sub-vision module to take pictures to obtain the overall image of the wafer; the sub-vision module identifies each chip on the wafer according to the overall image of the wafer; On the wafer map generated by the sub-path planning module, the optimal moving path from the reference chip to all mountable chips is generated according to the preset reference chip position coordinates and the preset mountable chip position coordinates.

6. The modular control method of a chip mounter in monitoring mode according to claim 5, characterized in that: Generates the optimal move path from the reference die to all mountable dies, followed by: Get the number of mountable chips I; When the main control module controls the sub-motion module to move to the chip position of the i-th mountable chip according to the optimal planning path, the sub-vision module is controlled to take a picture of the i-th mountable chip and calculate the matching degree and deviation degree of the i-th mountable chip; The main control module controls the sub-motion module to mount the i-th mountable chip according to the matching degree and deviation degree of the i-th mountable chip; After the mounting is completed, let i=i+1 and return to step "When the main control module controls the sub-motion module to move to the chip position of the i-th mountable chip according to the optimal planning path, the sub-vision module is controlled to take a picture of the i-th mountable chip and calculate the matching degree and deviation degree of the i-th mountable chip", until i=I, the mounting is completed.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the modular control method of the placement machine in the monitoring mode described in any one of claims 4 to 6 is implemented.

8. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the modular control method of the placement machine in the monitoring mode described in any one of claims 4 to 6 is implemented.

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