Modular Control System, Method, Medium and Product of a Mounter in Monitoring Mode

Abstract

The present application discloses a modular control system, method, medium and product of a mounter in monitoring mode, which relates to the technical field of automatic production equipment control. The method includes dividing the mounter control system into multiple independent modules, such as a main control module, a sub-motion module, and a sub-vision module. The main control module generates a movement instruction to drive the sub-motion module to a preset position and triggers the sub-vision module to take a photo to obtain a chip image. The sub-vision module calculates the matching degree and deviation degree of the chip and feeds back to the main control module and the sub-motion module in real time. The main control module judges the qualification of the chip according to preset conditions and sends an adjustment or stop instruction to the sub-motion module. The sub-motion module adjusts or stops the movement according to the instruction and feeds back the movement state in real time. Through the independent operation of each subsystem and the real-time scheduling of the main control system, the present application not only improves the flexibility and response speed of the system, but also ensures the accuracy and efficiency of user operations.

Description

Technical Field

[0001] This application relates to the technical field of automated production equipment control, and particularly to a modular control system, method, medium and product of a pick-and-place machine in a listening mode. Background Art

[0002] With the rapid development of technology, automated production equipment is increasingly widely used in the manufacturing industry. Especially in the fields of semiconductor packaging, electronic assembly, etc., the use of pick-and-place machines has become a key link to improve production efficiency and ensure product quality.

[0003] However, with the trend of miniaturization and precision of products, higher requirements are put forward for the control accuracy, flexibility and intelligent level of pick-and-place machines.

[0004] Traditional pick-and-place machine control systems often adopt a centralized architecture, and all functions are integrated in a main controller. This not only makes the system structure complex and difficult to maintain, but also difficult to adapt to rapidly changing production requirements. In addition, traditional control methods lack real-time monitoring and fault warning mechanisms. Once a fault occurs, it often causes production interruption and seriously affects production efficiency. Summary of the Invention

[0005] The purpose of this application is to provide a modular control system, method, medium and product of a pick-and-place machine in a listening mode, which can improve the processing task speed and response speed of the pick-and-place machine.

[0006] To achieve the above purpose, this application provides the following solutions:

[0007] In a first aspect, this application provides a modular control system of a pick-and-place machine in a listening mode, including:

[0008] A main control module, a sub-motion module, and a sub-vision module;

[0009] The main control module is respectively connected to the sub-motion module and the sub-vision module, and the sub-motion module is also connected to the sub-vision module;

[0010] The main control module is configured to generate a first movement instruction according to the pick-and-place instruction input by the user and send it to the sub-motion module to control the sub-motion module to move to a first preset position; when the sub-motion module moves to the first preset position, the main control module generates a first photographing instruction and sends it to the sub-vision module;

[0011] The sub-vision module is configured to photograph the chip according to the received first photographing instruction, obtain a chip image, and calculate the matching degree and deviation degree of the chip according to the chip image; feedback the matching degree and deviation degree of the chip to the main control module and the sub-motion module;

[0012] The main control module is further configured to determine whether the chip is qualified according to a preset condition, and obtain a first judgment result; the preset condition is that the matching degree fed back by the sub-vision module is equal to or greater than a preset graphic matching degree; if the first judgment result is yes, an adjustment instruction is sent to the sub-motion module; if the first result is no, a stop instruction is sent to the sub-motion module;

[0013] The sub-motion module is configured to receive and execute the moving instruction sent by the main control module, and when receiving the adjustment instruction of the main control module, drive the mechanical execution mechanism of the chip mounter to perform the chip mounting operation according to the deviation degree fed back by the sub-vision module; when receiving the stop instruction of the main control module, drive the mechanical execution mechanism of the chip mounter to stop moving; the sub-motion module is further configured to feedback the motion state and position information to the main control module in real time.

[0014] Optionally, the modular control system of the chip mounter in the monitoring mode further includes: a sub-communication module;

[0015] The sub-communication module is respectively connected to the main control module and the user's EAP system;

[0016] The main control module is further configured to generate a wafer data download instruction and send it to the sub-communication module when receiving the user's communication start instruction;

[0017] The sub-communication module is configured to obtain Wafer Map data from the user's EAP system according to the received wafer data download instruction, and send the obtained Wafer Map data to the main control module.

[0018] Optionally, the modular control system of the chip mounter in the monitoring mode further includes: a sub-path planning module;

[0019] The sub-path planning module is respectively connected to the main control module and the sub-motion module;

[0020] The main control module is further configured to generate a path planning instruction and send it to the sub-path planning module when receiving the user's wafer map start instruction, and send the Wafer Map data to the sub-path planning module; meanwhile, generate a second moving instruction and send it to the sub-motion module to control the sub-motion module to move to a second preset position;

[0021] When the sub-motion module moves to the second preset position, the main control module generates a second photographing instruction and sends it to the sub-vision module; the sub-vision module takes a photograph according to the received second photographing instruction to obtain an overall image of the wafer; the sub-vision module identifies each chip on the wafer according to the overall image of the wafer, obtains the actual position coordinate information of each chip, and sends it to the main control module;

[0022] The main control module is also used to send the actual position coordinate information of each chip to the sub-path planning module;

[0023] The sub-path planning module is used to generate a wafer map according to the received path planning instruction, Wafer Map data, and the actual position coordinate information of each chip; on the wafer map, according to the preset reference chip position coordinate and the preset mountable chip position coordinate, generate the optimal movement path from the reference chip to all mountable chips, and send the optimal movement path to the sub-motion module.

[0024] Second, the present application provides a modular control method for a mounter in a monitoring mode, including:

[0025] The main control module determines whether the chip is qualified according to the matching degree and deviation degree; the matching degree and deviation degree are obtained by the sub-vision module taking a photo of the chip when the sub-motion module moves to the first preset position to obtain a chip image and calculating based on the captured chip image;

[0026] If the chip is qualified, the main control module controls the sub-motion module to perform the chip mounting operation;

[0027] If the chip is unqualified, the main control module controls the sub-motion module to stop moving.

[0028] Optionally, the matching degree and deviation degree are obtained by the sub-vision module taking a photo of the chip when the sub-motion module moves to the first preset position to obtain a chip image and calculating based on the captured chip image, specifically including:

[0029] The sub-vision module includes a plurality of preset vision model templates and recognition algorithms;

[0030] The sub-vision module calls the corresponding vision model template according to the chip image;

[0031] The similarity between the chip image and the corresponding vision model template is calculated by the recognition algorithm to obtain the matching degree of the chip, and the center point deviation between the chip image and the corresponding vision model template is calculated to obtain the deviation degree.

[0032] Optionally, the calculation formula for the matching degree is:

[0033] ;

[0034] Among them, M represents the matching degree between the chip image and the vision model template, represents the number of features in the chip image that match the vision model template, represents the total number of features used for matching in the vision model template;

[0035] The deviation degree is:

[0036] ;

[0037] ;

[0038] Among them, and respectively represent the deviation amount between the center of the chip image and the reference position in the X-axis direction and the deviation amount between the center of the chip image and the reference position in the Y-axis direction; and respectively represent the actual measured position of the center of the chip image in the X-axis direction and the actual measured position of the center of the chip image in the Y-axis direction, and respectively represent the reference position of the center of the chip image in the X-axis direction and the reference position of the center of the chip image in the Y-axis direction in the vision model template.

[0039] Optionally, it further includes a wafer map generation and path planning step, specifically:

[0040] The sub-path planning module generates a wafer map according to the received path planning instruction, Wafer Map data, and the actual position coordinate information of each chip; among them, the actual position coordinate information of each chip is obtained when the main control module controls the sub-motion module to move to the second preset position, and the main control module controls the sub-vision module to take a picture to obtain an overall image of the wafer; the sub-vision module identifies each chip on the wafer based on the overall image of the wafer.

[0041] On the wafer map generated by the sub-path planning module, according to the preset reference chip position coordinates and the preset mountable chip position coordinates, the optimal movement path from the reference chip to all mountable chips is generated.

[0042] Optionally, after generating the optimal movement path from the reference chip to all mountable chips, it further includes:

[0043] Obtain the number I of mountable chips;

[0044] When the main control module controls the sub-motion module to move to the chip position of the i-th mountable chip according to the optimal planned path, it controls the sub-vision module to take a picture of the i-th mountable chip, and calculates the matching degree and deviation degree of the i-th mountable chip;

[0045] The main control module controls the sub-motion module to mount the i-th mountable chip according to the matching degree and deviation degree of the i-th mountable chip;

[0046] After the placement is completed, set i = i + 1, and return to the step "When the main control module controls the sub-motion module to move to the chip position of the i-th chip to be placed according to the optimal planned path, control the sub-vision module to take a picture of the i-th chip to be placed, and calculate the matching degree and deviation degree of the i-th chip to be placed", until i = I, then end the placement.

[0047] In a third aspect, the present application provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the modular control method of the mounter in the listening mode described in any one of the above are implemented.

[0048] In a fourth aspect, the present application provides a computer program product, including a computer program. When the computer program is executed by a processor, the steps of the modular control method of the mounter in the listening mode described in any one of the above are implemented.

[0049] According to the specific embodiments provided by the present application, the present application has the following technical effects:

[0050] The present application provides a modular control system, method, medium and product of a chip mounter in a monitoring mode. By dividing the chip mounter control system into multiple independent modules, such as a main control module, a sub-motion module and a sub-vision module, the technical problems of high functional integration of each component in the traditional chip mounter control system, difficulty in debugging and maintenance, and difficulty in achieving high precision and high efficiency are solved. After the user inputs the placement instruction, the main control module generates a first movement instruction according to the instruction, and sends it to the sub-motion module to control it to move to the first preset position, which solves the problem that the traditional chip mounter lacks effective scheduling and precise positioning after receiving the instruction, and ensures the initial accuracy of the placement process. At the same time, after the sub-motion module reaches the preset position, the main control module generates a first photo-taking instruction and sends it to the sub-vision module, which provides a basis for subsequent visual inspection. The chip is photographed according to the photo-taking instruction by the sub-vision module, and the matching degree and deviation degree of the chip are calculated, and then the information is fed back to the main control module and the sub-motion module. The main control module then determines whether the chip is qualified according to the preset conditions, and sends an adjustment instruction or a stop instruction to the sub-motion module accordingly. The problem that traditional chip mounters cannot detect the chip status in real time and make precise adjustments during the mounting process is solved. Through the visual inspection of the sub-vision module, the matching degree and deviation degree of the chip can be obtained in real time, thereby achieving strict control of the chip quality. At the same time, the main control module makes corresponding instructions based on the detection results to ensure that only qualified chips will continue to be mounted, and unqualified chips will be stopped in time, thereby improving the mounting quality and efficiency. In addition, the sub-motion module not only receives and executes the movement instructions of the main control module during the whole process, but also makes precise adjustments according to the adjustment instructions, and stops the movement according to the stop instructions. At the same time, the sub-motion module also feeds back the movement status and position information to the main control module in real time, providing real-time and accurate feedback information to the main control module, further enhancing the stability and reliability of the system.

[0051] In summary, this application realizes real-time monitoring and precise control of the placement process through a modular control system, method, medium and product of a placement machine in monitoring mode. This not only improves the placement quality and efficiency, but also reduces the rework rate and cost caused by placement errors. At the same time, the modular design of the system enables efficient collaboration between modules, enhances the scalability and maintainability of the system, and provides strong support for the intelligent and automated development of placement machines. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0053] Figure 1 Schematic diagram of functional modules of a modular control system for a mounter in a listening mode provided by an embodiment of the present application;

[0054] Figure 2 For Figure 1 Schematic diagram of refined functional modules of the neutron vision module;

[0055] Figure 3 Schematic diagram of the process after enabling the wafer map mode provided by an embodiment of the present application;

[0056] Figure 4 For Figure 1 Schematic diagram of refined functional modules for anti - mixing instruction control of the encapsulation framework of the neutron communication module;

[0057] Figure 5 Schematic diagram of the wafer image file provided by an embodiment of the present application;

[0058] Figure 6 Schematic diagram of the process of a modular control method for a mounter in a listening mode provided by an embodiment of the present application;

[0059] Figure 7 Schematic diagram of the subsequent steps for generating the optimal movement path from a reference chip to all mountable chips provided by an embodiment of the present application. Detailed implementation manners

[0060] First, some technical terms involved in the embodiments of the present application are introduced.

[0061] The alignment system of the mounter has experienced a process from the earliest mechanical alignment, laser alignment to vision alignment, and the alignment accuracy has been gradually improved. The vision alignment system generally includes an illumination light source, an imaging lens, a photoelectric conversion camera, an acquisition card for data transmission and processing, and processing software.

[0062] Currently, the alignment between the chip and the target placement position is mainly achieved through visual alignment. In manual and semi-automatic placement equipment, alignment is directly performed by overlapping images. In fully automatic placement equipment, alignment is mainly achieved indirectly through multi-dimensional visual image detection, which includes at least two independent imaging systems. The camera captures images, extracts the edges of the images, and identifies the center position of the images through image algorithms. Generally, upper and lower field cameras are arranged to obtain the feature points on the chip or the chip's outer shape, as well as the feature points associated with the target placement position, so as to establish the coordinate relationship between the chip and the target position points. During the process of establishing the coordinate position, according to different placement accuracies, the alignment methods used for the target placement position (substrate or wafer) are divided into global alignment and local alignment. Global alignment has high efficiency and can complete the coordinate positioning of the target position in one alignment. The prerequisite is that the surface accuracy of the substrate or wafer is high. Local alignment can adapt to the deviations of different array positions, identify and position each placement position separately, and is suitable for high-precision placement. However, due to frequent alignment, the production rate is relatively low.

[0063] The vision subsystem in the system is completely independent. Changes to hardware such as cameras, lenses, and light sources will not affect the main control system. The vision system provides methods such as taking pictures, positioning, and scale measurement to the main control system through a unified interface.

[0064] The mainstream vision solution software in the current market includes Halcon (High-Speed Vision Library Containing Algorithms and Example), Cognex, etc. The vision subsystem can use any of these solutions, and the main control system cannot perceive the changes in the vision subsystem solutions.

[0065] The existing technology does not divide sub-modules, and all data processing is completed in a main system. The disadvantage is that it cannot respond to requests in a timely manner, resulting in the inability to improve the processing speed. In view of this, the embodiments of this application provide a modular control system for a placement machine in a listening mode. By adopting a low-coupling software architecture with multiple independent sub-modules, the entire set of software is divided into independent subsystems. Each subsystem independently processes internal affairs, improving the processing task speed and response speed, and greatly improving the output per unit hour. Among them, the benefits of the low-coupling subsystems are as follows:

[0066] 1. Each subsystem runs independently in its own thread. If a failure occurs within any one subsystem, it will not cause the collapse of the entire control system.

[0067] 2. The subsystems are independent of each other and interact through subscription notifications. The sending and receiving of notifications will not cause the failure of the entire system due to the failure of either the message sender or the subscriber.

[0068] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0069] To make the above objects, features, and advantages of the present application more obvious and understandable, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0070] As Figure 1 shown, the present application provides a modular control system for a chip mounter in a monitoring mode, including: a main control module, a sub-motion module, and a sub-vision module.

[0071] The main control module is respectively connected to the sub-motion module and the sub-vision module, and the sub-motion module is also connected to the sub-vision module.

[0072] The main control module is configured to generate a first movement instruction according to the mounting instruction input by the user and send it to the sub-motion module to control the sub-motion module to move to a first preset position; when the sub-motion module moves to the first preset position, the main control module generates a first photographing instruction and sends it to the sub-vision module.

[0073] The sub-vision module is configured to photograph the chip according to the received first photographing instruction to obtain a chip image, and calculate the matching degree and deviation degree of the chip according to the chip image; and feed back the matching degree and deviation degree of the chip to the main control module and the sub-motion module.

[0074] The main control module is further configured to judge whether the chip is qualified according to a preset condition to obtain a first judgment result; the preset condition is that the matching degree fed back by the sub-vision module is equal to or greater than a preset graphic matching degree; if the first judgment result is yes, an adjustment instruction is sent to the sub-motion module; if the first result is no, a stop instruction is sent to the sub-motion module.

[0075] The sub-motion module is used to receive and execute the movement instructions sent by the main control module, and when receiving the adjustment instructions from the main control module, drive the mechanical actuator of the chip mounter to perform the chip mounting operation according to the deviation degree fed back by the sub-vision module; when receiving the stop instruction from the main control module, drive the mechanical actuator of the chip mounter to stop moving; the sub-motion module is also used to feedback the motion state and position information to the main control module in real time. Among them, the sub-motion module runs in an independent CPU (Central Processing Unit) core, is not scheduled by the Windows operating system, and has absolute priority use of the CPU clock. The main control module conducts data interaction with the sub-motion module through the TCP / IP communication protocol (Transmission Control Protocol / Internet Protocol). In the automatic operation state of the sub-motion module, it monitors the data requests of the sub-motion module by means of the callback method of monitoring the variables of the sub-motion module, and notifies the relevant sub-modules to execute the corresponding operations.

[0076] Among them, when implementing this implementation method, Figure 1 The IO (Input / Output) here is responsible for accessing the electrical signals of external devices such as sensors. The driver is responsible for receiving the motion instructions and converting them into electrical signals to drive the motor to move. The sensor is responsible for monitoring information such as temperature and whether the moving parts are in place, and feeds back signals through IO.

[0077] Among them, when implementing this implementation method, the modular control system of the chip mounter in the listening mode further includes: a sub-communication module. Among them, the sub-communication module is specifically: a SECS / GEM (Equipment Communications Standard / Generic Equipment Model) module.

[0078] The sub-communication module is respectively connected to the main control module and the user's EAP (Equipment Automatic Process) system. The communication data format of the SECS / GEM sub-module fully complies with the E30 and E5 standards provided by the SEMI (Semiconductor Equipment and Materials International) organization.

[0079] The main control module is also used to generate a wafer data download instruction and send it to the sub-communication module when receiving the user's communication start instruction.

[0080] The sub-communication module is used to obtain Wafer Map data from the user's EAP system according to the received wafer data download instruction, and send the obtained Wafer Map data to the main control module.

[0081] The sub-communication module also transmits the variable data, alarm information, and recipe information of the equipment to the upstream information system. Among them, the variable data includes: equipment count variables, such as the number of times the ejector pin is used and the number of times the nozzle is used; parameters during equipment operation, such as the ejector pin lifting height and the pre-lifting height of the ejector pin. The schematic diagram of the anti-mixing instruction control for loading the leadframe is as Figure 4 shown. The die bonder sends a request S6F11 to the EAP server, and this request is used to check the anti-mixing situation of the leadframe. This request contains a parameter, namely "{leadframe ID}", which is used to identify a specific leadframe. The EAP server confirms the leadframe anti-mixing inspection request sent by the die bonder through the S6F12 device. If the leadframe anti-mixing inspection request is successfully confirmed, the EAP server will send a request to set the leadframe status to the die bonder. This request contains a parameter "name" and possibly other data related to the leadframe status. After receiving the request to set the leadframe status, the die bonder will perform corresponding operations (such as updating the leadframe status), and then send a confirmation request to the EAP server to indicate that the leadframe status has been successfully set. Through the above process, the mixing problem during the leadframe loading process can be effectively prevented, improving production efficiency and product quality.

[0082] Among them, when implementing this implementation manner, the modular control system of the mounter in the listening mode further includes: a sub-path planning module.

[0083] The sub-path planning module is respectively connected to the main control module and the sub-motion module.

[0084] The main control module is further used to generate a path planning instruction and send it to the sub-path planning module when receiving the user's wafer map opening instruction, and send the Wafer Map data to the sub-path planning module; at the same time, generate a second movement instruction and send it to the sub-motion module to control the sub-motion module to move to the second preset position.

[0085] When the sub-motion module moves to the second preset position, the main control module generates a second photographing instruction and sends it to the sub-vision module; the sub-vision module takes a photograph according to the received second photographing instruction to obtain an overall image of the wafer; the sub-vision module identifies each chip on the wafer according to the overall image of the wafer, obtains the actual position coordinate information of each chip, and sends it to the main control module.

[0086] The main control module is further used to send the actual position coordinate information of each chip to the sub-path planning module.

[0087] The sub-path planning module is used to generate a wafer map according to the received path planning instruction, Wafer Map data, and the actual position coordinate information of each chip; on the wafer map, according to the preset reference chip position coordinates and the preset mountable chip position coordinates, generate the optimal movement path from the reference chip to all mountable chips, and send the optimal movement path to the sub-motion module.

[0088] Substrate mapping (or wafer mapping) is a process of representing the performance of semiconductor devices on a substrate through a map, which shows the performance in a color-coded grid, such as Figure 5 shown. Different colors represent different chip classification information (Bincode). For example, Bincode = 1 is represented by green, and Bincode = 2 is represented by red-yellow. This map can conveniently represent the performance changes across the entire substrate, as the distribution of these changes may be a clue to their causes. Like many projects in the semiconductor process field, there are available standards for this process step. The latest and most promising standard is the E142 standard provided by the SEMI organization. This standard was approved by voting and released in 2005.

[0089] The sub-path planning module is fully compatible with various format files such as SEMI E142, SEMI G85, SINF (Simplified Integrator Nested Format), STIF (STMicroelectronics inkless File), and CSV (Comma-Separated Values).

[0090] The sub-path planning module informs the main control module of the quality of the current row and column chips by notification. The main control module commands the sub-vision module to take pictures and identify by calling the vision API (Application Programming Interface). The sub-vision module informs the sub-motion module of the current chip's picture recognition result through TCP / IP communication. The sub-motion module determines whether to pick up the current chip based on the recognition result and feeds back the pick-up result through variable data. The main control system obtains information by monitoring the variable data of the motion control system and notifies the sub-vision module and the sub-path planning module.

[0091] The main control module coordinates the main thread and the background sub-threads of the subsystem through functions such as the Dispatch function and asynchronous delegation provided by Microsoft Visual Studio (VS), ensuring that there are no conflicts between the UI (User Interface) operation experience of user operations and background data processing, and preventing UI response delays or unresponsiveness.

[0092] In another embodiment of the present application, as Figure 6 shown, a modular control method for a chip mounter in monitoring mode is provided, and this method includes the following steps 101 to 103. Among them:

[0093] Step 101, the main control module determines whether the chip is qualified according to the matching degree and deviation degree; the matching degree and deviation degree are obtained by the sub-vision module taking a photo of the chip when the sub-motion module moves to the first preset position, obtaining a chip image, and calculating based on the captured chip image.

[0094] Step 102, if the chip is qualified, the main control module controls the sub-motion module to perform the chip mounting operation.

[0095] Step 103, if the chip is unqualified, the main control module controls the sub-motion module to stop moving.

[0096] Implementing the above steps 101 to 103 can achieve high-precision, high-efficiency and intelligent automatic mounting control of the chip mounter in monitoring mode.

[0097] Among them, implementing this implementation method, as Figure 2 shown, the matching degree and deviation degree in step 101 are obtained by the sub-vision module taking a photo of the chip when the sub-motion module moves to the first preset position, obtaining a chip image, and calculating based on the captured chip image. Specifically, it includes:

[0098] The sub-vision module includes multiple preset vision model templates and recognition algorithms.

[0099] The sub-vision module calls the corresponding vision model template according to the chip image.

[0100] The similarity between the chip image and the corresponding vision model template is calculated through the recognition algorithm to obtain the matching degree of the chip, and the center point deviation between the chip image and the corresponding vision model template is calculated to obtain the deviation degree.

[0101] Among them, implementing this implementation method, the calculation formula for the matching degree is:

[0102] .

[0103] Among them, M represents the matching degree between the chip image and the visual model template, represents the number of features in the chip image that match the visual model template, represents the total number of features used for matching in the visual model template. The matching features include, but are not limited to, key points such as the contour shape of the chip, the texture pattern on the surface, the color distribution, specific marks or hole positions, as well as the overall size of the chip or the size of a specific part.

[0104] Taking the center point of the visual model template as the origin, taking the horizontal direction in which the chip is mounted as the X-axis, and taking the direction perpendicular to the X-axis as the Y-axis to construct a coordinate system, the deviation degree is:

[0105] .

[0106] .

[0107] Among them, and respectively represent the deviation amount between the center of the chip image and the reference position in the X-axis direction and the deviation amount between the center of the chip image and the reference position in the Y-axis direction; and respectively represent the actual measured position of the center of the chip image in the X-axis direction and the actual measured position of the center of the chip image in the Y-axis direction, and respectively represent the reference position of the center of the chip image in the X-axis direction and the reference position of the center of the chip image in the Y-axis direction in the visual model template. The deviation degree is used for the sub-motion module to control the axis position of the mechanical actuator of the mounter.

[0108] In another exemplary embodiment of the present application, a modular control method for a mounter in a listening mode further includes a wafer map generation and path planning step, specifically:

[0109] The sub-path planning module generates a wafer map according to the received path planning instruction, Wafer Map data, and the actual position coordinate information of each chip; among them, the actual position coordinate information of each chip is obtained when the main control module controls the sub-motion module to move to the second preset position, and the main control module controls the sub-vision module to take a photo to obtain an overall image of the wafer; the sub-vision module identifies each chip on the wafer according to the overall image of the wafer.

[0110] On the wafer map generated by the sub-path planning module, according to the preset reference chip position coordinates and the preset mountable chip position coordinates, an optimal movement path from the reference chip to all mountable chips is generated.

[0111] In another exemplary embodiment of the present application, as Figure 7After generating the optimal movement path from the reference chip to all the mountable chips, the following steps are further included:

[0112] Obtain the number I of mountable chips.

[0113] When the main control module controls the sub-movement module to move to the chip position of the i-th mountable chip according to the optimal planned path, it controls the sub-vision module to take a picture of the i-th mountable chip, and calculates the matching degree and deviation degree of the i-th mountable chip.

[0114] The main control module controls the sub-movement module to mount the i-th mountable chip according to the matching degree and deviation degree of the i-th mountable chip.

[0115] After the mounting is completed, set i = i + 1, and return to the step "When the main control module controls the sub-movement module to move to the chip position of the i-th mountable chip according to the optimal planned path, it controls the sub-vision module to take a picture of the i-th mountable chip, and calculates the matching degree and deviation degree of the i-th mountable chip", until i = I, then end the mounting.

[0116] In an exemplary embodiment, the five modules operate independently within the system. The main control module is responsible for monitoring each sub-module and timely scheduling the requests of the sub-modules. In order to improve the performance of each sub-module to the highest level and without interference, each independent sub-module is created in the form of a highly cohesive independent dynamic link library, and the event subscription method with low coupling is used to monitor the running status and functional requests of each sub-module.

[0117] Among them, the main control module acts as the main process. When the application program starts, the main process is started, and the main process starts the sub-module sub-threads. The started sub-module sub-threads run independently in the main process. The main control module issues tasks to each sub-module in the form of commands, and each module subscribes to the requests of other sub-modules in a subscription manner.

[0118] In another exemplary embodiment, it specifically includes steps 201-205.

[0119] Step 201, the main control module issues an automatic operation command to the sub-movement module.

[0120] Step 202, after the sub-movement module receives the automatic operation command, it starts to execute the device self-check program. After the self-check passes, it starts the command axis movement. When the movement execution process requires the sub-vision module to take pictures and identify, the sub-movement module sends a picture-taking request.

[0121] Step 203: The sub-vision module system subscribes to the photographing request information of the sub-motion module. Upon receiving the photographing request through the subscribed information, it performs operations such as photographing, image processing, and positioning information processing. The sub-vision module determines whether the image information is qualified. If it is qualified, the information is sent to the sub-motion module, and the main control module sends a command to the sub-motion module to continue moving.

[0122] The main control module obtains the image processing data of the sub-vision module through the subscribed message, and displays and saves the data. Whether the image is qualified or not, the main control module always displays the camera image collected by the sub-vision module in real time. Whether to save the image is controlled by a switch in the software. The user controls the switch to decide whether to retain the picture. The saved image is used for analysis when the photographing fails or the matching degree is lower than expected.

[0123] If the main control module determines that the image processing information is unqualified, it sends an unqualified information processing command to the sub-motion module. After receiving the unqualified information command, the sub-motion module stops moving; at the same time, the main control module triggers an alarm and displays the alarm information to the operator. Among them, the main control module determines whether it is qualified through the graphic matching degree, and the matching degree score is set by the user himself (0 - 100%).

[0124] Step 204: The flowchart when the user enables the wafer map mode in the main control module is as Figure 3As shown, the main control module issues a command to start the wafer map to the sub-motion module and notifies the sub-path planning module to call up the user operation interface. The user imports the Wafer Map file through the operator interface of the sub-path planning module, and a prompt is popped up to prompt the user to set the reference chip and the information of the mountable chips. After the user finishes setting, the sub-path planning module prompts the user to create a vision template for the chips. The user calls up the vision template interface through the vision template command of the sub-path planning module, and notifies the sub-vision module to generate a template and set the search range through the vision template interface. After the vision template is created, the user clicks the path finding function on the sub-path planning module interface. The sub-path planning module generates a moving path from the reference chip to its starting point and notifies the sub-motion module to move according to the moving path. After the sub-motion module receives the moving command, the main control module notifies the sub-vision module to take a picture. The sub-vision module sends the picture-taking information to the main control module. The main control module judges the vision recognition result and controls the movement of the sub-motion module. After the movement, the information of successful movement is notified to the sub-path planning module. The sub-motion module continues to request the sub-path planning module for the position of the next chip. The sub-path planning module sends the position of the next chip to the sub-motion module. When the sub-motion module reaches the position of the next chip, it requests the sub-vision module to take a picture and moves. This process is repeated until the end of the moving path. The sub-motion module notifies the main control module that it has reached the end of the path. The main control module prompts the user to confirm whether the moving route is correct. After the user confirms that it is correct, the user clicks the run button of the main control module. The main control module issues a command for circular movement to the sub-motion module and generates a moving path. The main control module requests the sub-vision module to take a picture. The main control module controls the movement of the sub-motion module according to the data sent by the vision subsystem. The main control module updates the Map diagram and loops until the end of the Map diagram. The sub-motion module notifies the main control module that the operation is completed. After receiving the notification, the main control module pops up a window to prompt the user that the operation is completed.

[0125] Step 205: When the user enables the SECS / GEM sub-communication module function, the SECS / GEM sub-communication module enables the listening mode to listen to the network address and port. When the user executes the wafer map operation mode, the sub-path planning module notifies the main control module to issue Wafer Map data. After receiving the notification, the main control module notifies the SECS / GEM sub-communication module to request Wafer Map data. After receiving the command from the main control module, the SECS / GEM sub-communication module applies to the user's EAP system for Wafer Map data. And wait for the EAP system instruction. If the EAP system permits, it will send down the Wafer Map data through the network. The SECS / GEM sub-communication module sends the obtained Wafer Map data to the sub-path planning module through the main control module. The sub-path planning module draws and generates a wafer map through the Wafer Map data. And notifies the user to set the reference point and the mountable chips, and returns to step 204.

[0126] The sub-vision module and the sub-motion module are sub-modules that must be enabled. The sub-path planning module and the SECS / GEM sub-communication system can be selectively enabled or disabled according to user requirements. The main control module determines whether to monitor these two sub-modules based on the enabled status of the sub-path planning module and the SECS / GEM sub-communication system. It comprehensively demonstrates the multi-module and complexity of the system. At the same time, the system architecture mode can quickly integrate newly added sub-modules in the future without affecting the current system structure and without the need to reconstruct the software architecture. The enabling and disabling of sub-modules do not affect the operation of the entire system.

[0127] In an exemplary embodiment, through the modular control system of a chip mounter in a listening mode of the present application, the unit-hour output (according to different processes) and the mounting accuracy of the device have been greatly improved:

[0128] (1) The UPH (Units Per Hour, productivity) of the soft solder device has increased from 4,000 pieces per hour to 6,000 pieces per hour, and the mounting accuracy has increased from ±80 microns to ±50 microns.

[0129] (2) The UPH of the silver paste device has increased from 10,000 pieces per hour to 15,000 pieces per hour, and the mounting accuracy has increased from ±50 to ±25 microns.

[0130] (3) The eutectic device has increased from 12,000 pieces per hour to 20,000 pieces per hour, and the mounting accuracy has increased from ±50 to ±25 microns.

[0131] The present application also provides an application scenario that applies the modular control method of the chip mounter in the above-mentioned listening mode. Specifically: The modular control method of the chip mounter in the listening mode provided in this embodiment can be applied in an automated chip mounting production scenario. The automated chip mounting production scenario includes a raw material preparation link, a chip mounting processing link, and a finished product output link; the chip enters the chip mounting processing link from the raw material preparation link, undergoes precise mounting operations through a modular collaborative method, and enters the downstream finished product output link. The modular control method of the chip mounter in the listening mode provided in this embodiment belongs to the precise control link in the chip mounting processing link. Specifically, in the process of the chip mounting processing link for the chip, precise chip mounting can be performed based on the collaborative method of the main control module, the sub-motion module, and the sub-vision module, that is, the mechanical actuator of the chip mounter is adjusted according to the matching degree and deviation degree calculated from the chip image for the chip mounting operation.

[0132] In an exemplary embodiment, a computer-readable storage medium is provided, storing a computer program, which when executed by a processor implements the steps in the above method embodiments.

[0133] In an exemplary embodiment, a computer program product is provided, including a computer program which, when executed by a processor, implements the steps in the above method embodiments.

[0134] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use, and processing of relevant data need to comply with relevant regulations.

[0135] Those of ordinary skill in the art can understand that all or part of the processes of implementing the methods in the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the above method embodiments. Among them, any reference to a memory, database, or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memories. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc.

[0136] The databases involved in the embodiments provided in this application can include at least one of relational databases and non-relational databases. Non-relational databases can include distributed databases based on blockchain, etc., without limitation. The processors involved in the embodiments provided in this application can be general-purpose processors, central processors, graphics processors, digital signal processors, programmable logic devices, data processing logics based on quantum computing, etc., without limitation.

[0137] The technical features of the above embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0138] Specific examples are used in this article to elaborate on the principles and implementation manners of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application; at the same time, for those of ordinary skill in the art, according to the idea of the present application, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A modular control system for a chip mounter in monitoring mode, characterized in that: The modular control system of the chip mounter in the monitoring mode includes: Main control module, sub-motion module, sub-vision module and sub-path planning module; The main control module is connected to the sub-motion module and the sub-vision module respectively, and the sub-motion module is also connected to the sub-vision module; the sub-path planning module is connected to the main control module and the sub-motion module respectively; each independent sub-module is created by an independent dynamic link library; the main control module issues tasks to each sub-module by issuing commands, and each module subscribes to requests from other sub-modules in a subscription manner; The main control module is used to generate a first moving instruction according to the placement instruction input by the user and send it to the sub-motion module to control the sub-motion module to move to a first preset position; when the sub-motion module moves to the first preset position, the main control module generates a first photographing instruction and sends it to the sub-vision module; The sub-vision module is used to take a picture of the chip according to the received first photographing instruction, obtain a chip image, and calculate the matching degree and deviation degree of the chip according to the chip image; feed back the matching degree and deviation degree of the chip to the main control module and the sub-motion module; the sub-vision module includes a plurality of preset vision model templates and recognition algorithms; the sub-vision module calls the corresponding vision model template according to the chip image; calculates the similarity between the chip image and the corresponding vision model template through the recognition algorithm to obtain the matching degree of the chip, and calculates the central point deviation between the chip image and the corresponding vision model template to obtain the deviation degree; The calculation formula of the matching degree is: ； Among them, M represents the matching degree between the chip image and the visual model template. Indicates the number of features in the chip image that match the visual model template, Represents the total number of features used for matching in the visual model template; The deviation is: ； ； in, and They respectively represent the deviation between the chip image center and the reference position in the X-axis direction and the Y-axis direction; and They represent the actual measured position of the chip image center in the X-axis direction and the actual measured position in the Y-axis direction, respectively. and They respectively represent the reference position of the chip image center in the X-axis direction and the Y-axis direction in the visual model template; The main control module is further used to determine whether the chip is qualified according to a preset condition to obtain a first judgment result; the preset condition is that the matching degree fed back by the sub-vision module is equal to or greater than the preset graphic matching degree; if the first judgment result is yes, an adjustment instruction is sent to the sub-motion module; if the first result is no, a stop instruction is sent to the sub-motion module; The sub-motion module is used to receive and execute the movement instructions sent by the main control module, and when receiving the adjustment instructions from the main control module, drive the mechanical actuator of the placement machine to perform chip placement operations according to the deviation feedback from the sub-vision module; when receiving the stop instruction from the main control module, drive the mechanical actuator of the placement machine to stop moving; the sub-motion module is also used to feed back the movement state and position information to the main control module in real time; The main control module is also used to generate a path planning instruction and send it to the sub-path planning module when receiving a user's instruction to open the wafer map, and send the wafer map data to the sub-path planning module; at the same time, generate a second movement instruction and send it to the sub-motion module to control the sub-motion module to move to the second preset position; when the sub-motion module moves to the second preset position, the main control module generates a second photo-taking instruction and sends it to the sub-vision module; the sub-vision module takes a photo according to the received second photo-taking instruction to obtain an overall image of the wafer; the sub-vision module identifies each chip on the wafer according to the overall image of the wafer, obtains the actual position coordinate information of each chip, and sends it to the main control module; The main control module is also used to send the actual position coordinate information of each chip to the sub-path planning module; the sub-path planning module is used to generate a wafer map according to the received path planning instructions, Wafer Map data and the actual position coordinate information of each chip; on the wafer map, according to the preset reference chip position coordinates and the preset mountable chip position coordinates, generate the optimal movement path from the reference chip to all mountable chips, and send the optimal movement path to the sub-motion module.

2. The modular control system for chip mounters in monitoring mode according to claim 1, characterized in that: The modular control system of the chip mounter in the monitoring mode further includes: a sub-communication module; The sub-communication module is connected to the main control module and the user's EAP system respectively; The main control module is further configured to generate a wafer data download instruction and send it to the sub-communication module upon receiving a communication start instruction from a user; The sub-communication module is used to obtain WaferMap data from the user's EAP system according to the received wafer data download instruction, and send the obtained WaferMap data to the main control module.

3. A modular control method for a chip mounter in a monitoring mode, characterized in that: The modular control method of the chip mounter in the monitoring mode is applied to the main control module of the modular control system of the chip mounter in the monitoring mode according to any one of claims 1 to 2, and the modular control method of the chip mounter in the monitoring mode comprises: The main control module determines whether the chip is qualified according to the matching degree and the deviation degree; the matching degree and the deviation degree are obtained by the sub-vision module taking a picture of the chip when the sub-motion module moves to the first preset position to obtain the chip image, and the sub-vision module calculates based on the captured chip image, specifically including: The sub-vision module includes a plurality of preset vision model templates and recognition algorithms; The sub-vision module calls the corresponding vision model template according to the chip image; The similarity between the chip image and the corresponding visual model template is calculated by the recognition algorithm to obtain the chip matching degree, and the deviation between the center point of the chip image and the corresponding visual model template is calculated to obtain the deviation degree; The calculation formula of the matching degree is: ； Among them, M represents the matching degree between the chip image and the visual model template. Indicates the number of features in the chip image that match the visual model template, Represents the total number of features used for matching in the visual model template; The deviation is: ； ； in, and They respectively represent the deviation between the chip image center and the reference position in the X-axis direction and the Y-axis direction; and They represent the actual measured position of the chip image center in the X-axis direction and the actual measured position in the Y-axis direction, respectively. and They respectively represent the reference position of the chip image center in the X-axis direction and the Y-axis direction in the visual model template; If the chip is qualified, the main control module controls the sub-motion module to perform chip placement operations; If the chip is unqualified, the main control module controls the sub-motion module to stop moving.

4. The modular control method of the chip mounter in the monitoring mode according to claim 3, characterized in that: It also includes wafer map generation and path planning steps, specifically: The sub-path planning module generates a wafer map according to the received path planning instructions, Wafer Map data and the actual position coordinate information of each chip; wherein, when the main control module controls the sub-motion module to move to the second preset position, the main control module controls the sub-vision module to take pictures to obtain the overall image of the wafer; the sub-vision module identifies each chip on the wafer according to the overall image of the wafer; On the wafer map generated by the sub-path planning module, the optimal moving path from the reference chip to all mountable chips is generated according to the preset reference chip position coordinates and the preset mountable chip position coordinates.

5. The modular control method of a chip mounter in a monitoring mode according to claim 4, characterized in that: Generates the optimal move path from the reference die to all mountable dies, followed by: Get the number of mountable chips I; When the main control module controls the sub-motion module to move to the chip position of the i-th mountable chip according to the optimal planning path, the sub-vision module is controlled to take a picture of the i-th mountable chip and calculate the matching degree and deviation degree of the i-th mountable chip; The main control module controls the sub-motion module to mount the i-th mountable chip according to the matching degree and deviation degree of the i-th mountable chip; After the mounting is completed, let i=i+1 and return to step "When the main control module controls the sub-motion module to move to the chip position of the i-th mountable chip according to the optimal planning path, the sub-vision module is controlled to take a picture of the i-th mountable chip and calculate the matching degree and deviation degree of the i-th mountable chip", until i=I, the mounting is completed.

6. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the modular control method of the chip mounter in the monitoring mode described in any one of claims 3 to 5 is implemented.

7. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the modular control method of the chip mounter in the monitoring mode described in any one of claims 3 to 5 is implemented.

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