Laser cutting tiny optical element decomposition method and system

Abstract

The invention provides a laser cutting tiny optical element decomposition method and system.The decomposition method comprises the steps that a cutting track is formed on an element blank through pulse laser cutting equipment according to the appearance pattern of an element needing to be decomposed, the cutting track comprises a cutting line, and the cutting line comprises a plurality of thin holes arranged at intervals; the element blank is installed in liquid injection equipment and kept for a first set time length, the liquid injection equipment is controlled to provide pressure difference for the two sides of the element blank in a negative pressure or positive pressure mode, and liquid is injected into the thin holes; and taking out the element blank injected with the liquid from the liquid injection equipment, putting the element blank into a freezing environment of refrigeration equipment for a second set time length, so that the liquid in the fine holes is frozen and expanded, and cracking the element blank along the cutting line. According to the embodiment of the invention, the decomposition operation is convenient to implement, the efficiency is high, the decomposition method has small damage to the optical element, the decomposition quality is high, the decomposition method is wide in application range, the time duration of injecting liquid into pores is shortened, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of optical lens processing, and in particular to a method and system for decomposing micro-optical elements by laser cutting. Background Art

[0002] With the development of technology, the optical components used in many optical fields are small in size and have high precision requirements. For example, the diameter of the lens in the endoscope is required to be less than 1mm or even 0.35mm, and the accuracy of the centering edge grinding is required to be within 0.01mm or even 0.005mm. For example, the aspherical lens used in AR / VR requires a light cross-section of 1mm*2mm in the shape of a racetrack (such as Figure 1 ), and the accuracy of centering and edge grinding is required to be 0.01mm, which makes processing difficult.

[0003] Laser cutting of glass is a modern process. In many cases, centering and trimming can replace traditional mechanical centering and grinding. There are two common schemes for laser cutting of optical components. One is to directly ablate and vaporize the optical material on the set path to form a slit, which can be used to cut optical components with a size that is not too small (a few millimeters to tens of millimeters) and a precision requirement that is not too high (a few strands to tens of strands); the other scheme is to use a high-frequency pulsed laser, such as a 100-watt near-infrared picosecond fiber laser cutting machine, to punch a series of micron-sized holes with a micron-sized diameter and a micron-sized spacing along the set path, and then perform a decomposition (or splitting) operation, which is used to process optical components with a small size (a few tenths of a millimeter to a few millimeters) and high precision requirements (a few microns to tens of microns).

[0004] The decomposition process after the high-frequency pulse laser drilling string is a technical difficulty. Existing technologies have tried mechanical impact decomposition, CO2 laser burn (using laser to burn the cutting line) decomposition, high and low temperature impact decomposition, and ultrasonic vibration decomposition, but they can only be used to decompose components that are not too small and have low precision requirements, and cannot be used to decompose tiny and precise components. In other words, they either cause damage to the optical components (such as mechanical impact method and laser burn method) or fail to decompose the optical components (such as high and low temperature impact method and ultrasonic vibration method). Summary of the invention

[0005] The embodiment of the present invention provides a laser cutting micro optical element decomposition method and system, which can be used to decompose micro optical elements with high precision requirements, the decomposition operation is convenient and efficient, the decomposition method causes little damage to the optical element, the decomposition quality is high, and the decomposition method has a wide range of applications. It also shortens the time length for liquid injection into fine holes and improves production efficiency.

[0006] In a first aspect, an embodiment of the present invention provides a method for decomposing a micro-optical element by laser cutting, comprising:

[0007] On the component blank, a cutting track is punched out by a pulse laser cutting device according to the outer shape pattern of the desired decomposed component, wherein the cutting track includes a cutting line, and the cutting line includes a plurality of fine holes arranged at intervals;

[0008] The component blank is installed in a liquid injection device and maintained for a first set time, and the liquid injection device is controlled to provide a pressure difference for two sides of the component blank in a negative pressure or positive pressure manner, so that the liquid is injected into the pores;

[0009] The component blank injected with liquid is taken out from the liquid injection device, and placed in a freezing environment of a refrigeration device for a second set time, so that the liquid in the pores freezes and expands, and the component blank is cracked along the cutting line.

[0010] Optionally, after the liquid-injected component blank is taken out from the liquid injection device and placed in a freezing environment of a refrigeration device for a second set time to freeze and expand the liquid in the pores and to crack the component blank along the cutting line, the method further includes:

[0011] The element blank is taken out from the refrigeration equipment, and after returning to temperature, the required decomposition elements and scraps are separated to complete the optical element decomposition.

[0012] Optionally, the cutting track further includes an auxiliary cutting line, which is located at the periphery of the cutting line, connected to the cutting line, and includes a plurality of the pores arranged at intervals.

[0013] Optionally, the plurality of auxiliary cutting lines include a first auxiliary cutting line, a second auxiliary cutting line, a third auxiliary cutting line and a fourth auxiliary cutting line sequentially arranged around the cutting line;

[0014] The first auxiliary cutting line is opposite to the third auxiliary cutting line, and the second auxiliary cutting line is opposite to the fourth auxiliary cutting line.

[0015] Optionally, the pulse laser cutting equipment includes a fiber laser, the wavelength of the fiber laser is near infrared, visible light or near ultraviolet, and the pulse frequency is picosecond or femtosecond.

[0016] Optionally, the pressure difference range is set to 0.05 MPa to 2 MPa.

[0017] Optionally, the liquid comprises water;

[0018] Alternatively, the liquid comprises water and a surfactant.

[0019] In a second aspect, an embodiment of the present invention provides a laser cutting micro-optical element decomposition system, comprising:

[0020] A pulse laser cutting device is used to punch a cutting track on the component blank according to the outer shape pattern of the required decomposed component, wherein the cutting track includes a cutting line, and the cutting line includes a plurality of fine holes arranged at intervals;

[0021] A liquid injection device, used to provide negative pressure or positive pressure to provide a pressure difference between two sides of the element blank so that the liquid is injected into the fine hole;

[0022] The refrigeration device is used to freeze and expand the liquid in the pores, so as to crack the element blank along the cutting line.

[0023] Optionally, the liquid injection device comprises:

[0024] A fixing member, wherein the fixing member is a pipe body with an internal thread;

[0025] The pipe fitting is a pipe body with external threads, and the element blank is tightened and fixed by the cooperation of the internal threads and the external threads; the side of the pipe fitting away from the element blank forms a cavity for accommodating the liquid.

[0026] Optionally, the liquid injection device further comprises a sealing protection member, wherein the sealing protection member is arranged on a side of the element blank facing the tube and / or on a side of the element blank away from the tube.

[0027] In the laser-cut micro-optical element decomposition method provided in the embodiment of the present invention, a liquid (such as water) that can solidify and expand at low temperature is injected into the fine holes of the cutting line, and then frozen, and the fine holes are propped open by the solidification and expansion of the liquid, forming cracks along the cutting line. Compared with the prior art, the beneficial effects of this method are: it can be used to decompose micro-optical elements with high precision requirements (it is also suitable for decomposing elements with general precision requirements and larger sizes), the decomposition operation is convenient and efficient, the decomposition method causes little damage to the optical element, the decomposition quality is high, and the decomposition method has a wide range of applications. Furthermore, the embodiment of the present invention also controls the liquid injection equipment to provide a pressure difference on both sides of the element blank in the form of negative pressure or positive pressure, so that the liquid is injected into the fine holes, the liquid injection process is accelerated, the length of time for the liquid to be injected into the fine holes is shortened, and production efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of an optical element having a racetrack-shaped cross section;

[0029] Figure 2 It is a schematic diagram of the laser cutting lines and auxiliary lines of the racetrack-shaped cross-section element;

[0030] Figure 3 A flow chart of a method for decomposing a micro-optical element by laser cutting provided by an embodiment of the present invention;

[0031] Figure 4A flow chart of another method for decomposing a micro-optical element by laser cutting provided by an embodiment of the present invention;

[0032] Figure 5 A schematic diagram of a liquid injection device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0033] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0034] Figure 2 This is a schematic diagram of the laser cutting lines and auxiliary lines of the racetrack-shaped cross-section element. Figure 3 A flowchart of a method for decomposing a micro-optical element by laser cutting provided by an embodiment of the present invention, referring to Figure 2 and Figure 3 , laser cutting micro-optical component decomposition methods include:

[0035] S101. On the component blank, a cutting track is punched out by a pulse laser cutting device according to the outer shape pattern of the component to be decomposed. The cutting track includes a cutting line, and the cutting line includes a plurality of fine holes arranged at intervals.

[0036] refer to Figure 2 The micro-optical element includes a desired decomposition element 1. The shape pattern of the desired decomposition element 1 is in the shape of a racetrack, but is not limited thereto. The shape pattern of the desired decomposition element 1 can be set as required. In this step, according to the shape pattern of the desired decomposition element 1, a pulsed laser cutting device is used to punch at least a cutting line 2 on the element blank. The cutting line 2 includes a plurality of fine holes ( Figure 2 ), that is to say, the cutting line 2 includes a string formed by a plurality of fine holes, referred to as a fine hole string for short.

[0037] Among them, micro optical elements refer to products after being split. For example, the size is usually less than 3mm or even less than 1mm. The element blank can be small or large. For example, if one product is cut from one piece, the element blank is usually only about 3mm. If multiple products are cut from one piece (array blank), the element blank may be larger, such as 20mm*20mm.

[0038] S102, installing the component blank in the liquid injection device and maintaining the first set time, controlling the liquid injection device to provide a pressure difference for both sides of the component blank in a negative pressure or positive pressure manner, so that the liquid is injected into the pores.

[0039] In this step, the component blank is installed in the liquid injection device and maintained for a first set time. During the first set time, the liquid is injected into the fine holes of the cutting line 2. It has been found through research that the liquid is injected into the fine holes for a relatively long time by relying on the natural penetration of the liquid. And because the pore size is small, for the small pores with a small pore size, it is not conducive to the injection of liquid due to the surface tension of the liquid. In this step, by controlling the liquid injection device to provide a pressure difference on both sides of the component blank in a negative pressure or positive pressure manner, the liquid is injected into the fine holes, the liquid injection process is accelerated, the length of time for the liquid to be injected into the fine holes is shortened, and the production efficiency is improved.

[0040] S103, taking the liquid-injected component blank out of the liquid injection device, and placing it in a freezing environment of a refrigeration device for a second set time, so that the liquid in the pores freezes and expands, and the component blank is cracked along the cutting line.

[0041] In the laser-cut micro-optical element decomposition method provided in the embodiment of the present invention, a liquid (such as water) that can solidify and expand at low temperature is injected into the fine holes of the cutting line, and then frozen, and the fine holes are propped open by the solidification and expansion of the liquid, forming cracks along the cutting line. Compared with the prior art, the beneficial effects of this method are: it can be used to decompose micro-optical elements with high precision requirements (it is also suitable for decomposing elements with general precision requirements and larger sizes), the decomposition operation is convenient and efficient, the decomposition method causes little damage to the optical element, the decomposition quality is high, and the decomposition method has a wide range of applications. Furthermore, the embodiment of the present invention also controls the liquid injection equipment to provide a pressure difference on both sides of the element blank in the form of negative pressure or positive pressure, so that the liquid is injected into the fine holes, the liquid injection process is accelerated, the length of time for the liquid to be injected into the fine holes is shortened, and production efficiency is improved.

[0042] In one embodiment, the cutting trajectory further includes an auxiliary cutting line. Figure 4 A flowchart of another method for decomposing a micro-optical element by laser cutting provided by an embodiment of the present invention, referring to Figure 2 and Figure 4 , laser cutting micro-optical component decomposition methods include:

[0043] S201. On the component blank, a cutting track is punched out by a pulse laser cutting device according to the outer shape pattern of the component to be decomposed. The cutting track includes a cutting line and an auxiliary cutting line. Both the cutting line and the auxiliary cutting line include a plurality of fine holes arranged at intervals.

[0044] refer to Figure 2 The cutting track also includes an auxiliary cutting line. The auxiliary cutting line 3 is located outside the cutting line 2, and the auxiliary cutting line 3 is connected to the cutting line 2. The auxiliary cutting line 3 includes a plurality of spaced fine holes ( Figure 2 not shown).

[0045] Optionally, the pulse laser cutting equipment includes a fiber laser, the wavelength of the fiber laser is near infrared, visible light or near ultraviolet, and the pulse frequency is picosecond or femtosecond. The power range of the fiber laser can be selected from watts to hundreds of watts.

[0046] For example, reference Figure 2 , the component blank with a diameter of 5mm and a central thickness of 2mm obtained by the previous cold processing, molding or etching methods, needs to be dug out from the middle of the required decomposition component 1 with a length of 2mm and a width of 1mm. The required decomposition component 1 is a flat-convex aspheric glass lens, and the centering accuracy is required to be better than 0.01mm and the peripheral collapse defect is not greater than 0.03mm. The cutting equipment uses a 1064nm near-infrared picosecond laser cutting machine with a power of 70 watts.

[0047] For example, the laser head parameters are adjusted to make a series of fine holes on the component blank, with the diameter of the fine hole series not greater than 10um and the hole spacing not greater than 20um. In this embodiment, the diameter of the fine holes is 5um and the hole spacing is 8um, which means that the subsequent fragment decomposition will break through the 3um "joint meat" part between the holes. Figure 2 The circumference of the required decomposed component 1 is 5.14 mm, so theoretically the number of holes punched on the cutting line 2 is 642. After subsequent normal fragmentation, the component forms a side column surface with a convexity of 2.5 um, similar to the tooth edge of a stamp.

[0048] Exemplarily, the light-transmitting surface of the required decomposition element 1 includes a curved surface or a flat surface. The required decomposition element 1 includes a lens, a prism, a filter or an optical structure, wherein the optical structure plays a supporting role, for example, it may include a support or a support frame. The required decomposition element 1 includes a single layer or a multi-layer assembly. The material of the required decomposition element 1 includes optical glass or crystal.

[0049] Exemplarily, the cross-sectional shape of the desired decomposition element 1 includes a circular shape, an elliptical shape, a rectangular shape or a racetrack shape. Figure 2 The required decomposition component 1 has an equivalent circle diameter of 1.5 mm. This method can be applied to the decomposition of components with an equivalent circle diameter smaller than 1 mm. Obviously, this method is also applicable to the decomposition of large-sized components. The equivalent circle refers to a circle with the same area as a given geometric figure.

[0050] exist Figure 2 In the example, one component blank includes one required decomposition component 1. In other embodiments, one component blank may also include multiple required decomposition components 1. That is, in this embodiment, one finished product is dug out from one component blank. If there are multiple dug areas with smaller equivalent circle diameters distributed on the component blank, it means that multiple optical components can be cut and decomposed at one time.

[0051] S202, installing the component blank in the liquid injection device and maintaining the first set time, controlling the liquid injection device to provide a pressure difference for both sides of the component blank in a negative pressure or positive pressure manner, so that the liquid is injected into the pores.

[0052] In this step, the liquid injection device is controlled to provide a pressure difference for the two sides of the component blank, so that the liquid is injected into the fine holes of the auxiliary cutting line 3 and the cutting line 2.

[0053] In one embodiment, the liquid comprises water. Water is capable of solidifying and expanding at low temperatures.

[0054] In another embodiment, the liquid includes water and a surfactant. Since the aperture of the laser drilling is fine, ranging from micrometers to silk levels, under natural conditions, it is easy to inject water (or water seepage) into the coarser holes above the silk level, while for the finer pores, it is not conducive to the injection of water due to the surface tension of water. In this case, the liquid mixed with a surfactant can be prepared to reduce the surface tension and make the liquid easy to inject into the pores.

[0055] Exemplarily, the method of pressurized liquid injection can be negative pressure (i.e., vacuuming to draw liquid into the pores) or positive pressure (pressing the liquid into the pores). In one embodiment, negative pressure can only provide a pressure difference of 0.1 MPa at most, while positive pressure can make the pressure difference higher. Methods for generating pressure difference include hydraulic pressure and gas pressure, hydraulic pressure, such as direct mechanical pressure above the liquid surface, gas pressure, such as pressurization with compressed air above the liquid surface.

[0056] Optionally, the pressure difference range is set to 0.05MPa to 2MPa. If the pressure difference is less than 0.05MPa, the excessively small pressure difference prolongs the pressure-maintaining and liquid-injection time, affecting production efficiency; if the pressure difference is greater than 2MPa, the excessively large pressure difference increases the requirements for the pressure-maintaining device. The embodiment of the present invention sets the pressure difference range to 0.05MPa to 2MPa, balancing the liquid-injection time and the requirements for the pressure-maintaining device.

[0057] Exemplarily, the first set time does not exceed one hour, that is, the set time for pressure-maintaining and liquid injection does not exceed one hour.

[0058] For example, a large cutting hole with a diameter of wire grade uses a pressure difference of half a kilogram to one kilogram (0.05-0.1MPa), a small cutting hole with a diameter of micron grade uses a pressure difference of one kilogram to ten kilograms (0.1-1MPa), and a relatively higher pressure difference is required for cutting thick glass. The pressure difference set in this embodiment is 1MPa, and the pressure-maintaining liquid injection setting time is ten minutes. Among them, the cutting hole refers to the fine hole punched by the pulse laser cutting equipment. The component blank with the cutting line 2 punched can be regarded as a push-type microporous ceramic filter membrane. Since the area of ​​the component blank is very small, the pressure required to generate a pressure of 1MPa is very small, which can ensure that the liquid is injected into the fine hole without causing the component blank to burst.

[0059] S203, taking out the liquid-injected component blank from the liquid injection device, and placing it in a freezing environment of a refrigeration device for a second set time, so that the liquid in the pores freezes and expands, and the component blank is cracked along the cutting line and the auxiliary cutting line.

[0060] In this step, the component blank filled with liquid is placed in a refrigeration device. The freezing environment of the refrigeration device causes the liquid injected into the pores of the auxiliary cutting line 3 and the cutting line 2 to freeze and expand, and the component blank is cracked along the cutting line 2 and the auxiliary cutting line 3. The freezing and expansion of the liquid refers to the solidification and expansion of the liquid. Freezing and solidification have the same meaning.

[0061] For example, after the liquid-filled component blank is taken out from the liquid-filling device and before the liquid-filled component blank is placed into the freezing environment of the refrigeration device, the surface of the component blank may be slightly wiped dry.

[0062] Exemplarily, this embodiment is frozen in an industrial refrigerator at -40 degrees for ten minutes to freeze the liquid column in the pores and expand (for example, the volume of water will increase by 10% after freezing), so that the component blank is broken along the cutting line and the auxiliary line.

[0063] S204, taking out the component blank from the refrigeration equipment, and separating the required decomposition components and scraps after returning to temperature, thereby completing the optical component decomposition.

[0064] For example, after the temperature is restored, the required decomposition element 1 and the scraps are separated to complete the optical element decomposition. If a small amount of scraps are not completely decomposed, they are cleaned with a cotton swab or in an ultrasonic bath, because the cutting line has been frozen and expanded by the liquid column, causing stress damage.

[0065] In the laser cutting micro-optical element decomposition method provided in the embodiment of the present invention, on the basis of the above embodiment, radial auxiliary cutting lines 3 are further provided on the periphery of the cutting line 2, and the auxiliary cutting lines 3 are helpful for the decomposition of the fragments. After the temperature is restored, the required decomposition elements and the scraps are separated. It should be noted that the expansion and cracking is achieved in a low temperature environment, and the sorting of products and scraps is operated at room temperature.

[0066] The decomposition method provided in the embodiment of the present invention provides cutting and decomposition of precision optical components. The accuracy of the cutting and decomposition size and shape and position tolerance of the required decomposed component 1 can reach several microns, which is mainly guaranteed by the accuracy of the laser cutting machine equipment. The equipment accuracy of the actual embodiment is 2um, so it can meet the centering accuracy of 0.01m requirement of the embodiment. Obviously, this method is also suitable for the decomposition of components with low dimensional accuracy requirements, and subsequent normal crack decomposition will not produce new cracks, which can ensure that the crack of the embodiment is not greater than the requirement of 0.03mm.

[0067] Optionally, refer to Figure 2, the plurality of auxiliary cutting lines 3 include a first auxiliary cutting line 31, a second auxiliary cutting line 32, a third auxiliary cutting line 33 and a fourth auxiliary cutting line 34 which are sequentially arranged around the cutting line 2. The first auxiliary cutting line 31 and the third auxiliary cutting line 33 are opposite to each other, and the second auxiliary cutting line 32 and the fourth auxiliary cutting line 34 are opposite to each other. The first auxiliary cutting line 31, the second auxiliary cutting line 32, the third auxiliary cutting line 33 and the fourth auxiliary cutting line 34 cut the scrap into four small pieces, which helps to decompose the scrap. In other embodiments, other numbers of auxiliary cutting lines 3 may also be used, and the present invention is not limited thereto.

[0068] For example, reference Figure 2 One end of the auxiliary cutting line 3 is connected to the cutting line 2, and the other end is connected to the outer edge of the component blank. The auxiliary cutting line 3 extends along the radial direction of the component blank. The auxiliary cutting line 3 is a straight line. In other embodiments, the auxiliary cutting line 3 can also be a curve.

[0069] The embodiment of the present invention also provides a laser cutting micro-optical component decomposition system, which includes a pulsed laser cutting device, a liquid injection device, and a refrigeration device. The pulsed laser cutting device is used to punch a cutting track on the component blank according to the shape pattern of the desired decomposed component, and the cutting track includes a cutting line, and the cutting line includes a plurality of fine holes arranged at intervals. The liquid injection device is used to provide negative pressure or positive pressure to provide a pressure difference between the two sides of the component blank so that liquid is injected into the fine holes. The refrigeration device is used to freeze and expand the liquid in the fine holes, so as to crack the component blank along the cutting line.

[0070] Figure 5 A schematic diagram of a liquid injection device provided in an embodiment of the present invention, referring to Figure 2 and Figure 5 ,exist Figure 5 The fine hole of the cutting line 2 is schematically shown. The fine hole penetrates the component blank in the thickness direction. The liquid injection device includes a fixing member 5 and a pipe fitting 6. The fixing member 5 is a tube body with an internal thread. The pipe fitting 6 is a tube body with an external thread, and the fixing member 5 and the pipe fitting 6 are threadedly connected. The component blank is tightened and fixed by the cooperation of the internal thread and the external thread. It can be understood that after the component blank is placed in the fixing member 5, the pipe fitting 6 moves toward the fixing member 5 through the cooperation of the internal thread and the external thread to tighten and fix the component blank. The side of the pipe fitting 6 away from the component blank forms a cavity for containing liquid.

[0071] In one embodiment, liquid can be contained in the cavity, and hydraulic pressure or gas pressure is provided on the side of the liquid away from the element blank to provide positive pressure for the liquid, so that the liquid is injected into the pores of the cutting line 2 and / or the auxiliary cutting line 3.

[0072] In another embodiment, negative pressure can be provided on the side of the element blank away from the liquid. For example, a negative pressure device is provided at the bottom opening of the fixing member 5, and the negative pressure device provides negative pressure to inject liquid into the pores of the cutting line 2 and / or the auxiliary cutting line 3.

[0073] Optionally, refer to Figure 5 The liquid injection device further comprises a sealing protection member 4, which is arranged on the side of the component blank facing the pipe 6, and / or, the sealing protection member 4 is arranged on the side of the component blank away from the pipe 6. The component blank is protected and sealed by the sealing protection member 4 at the top and bottom, for example, a rubber O-ring.

[0074] For example, a piston and lever mechanism ( Figure 5 The liquid level 7 is mechanically pressed downward (not shown) and the component blank is directly hydraulically injected. The equipment is simple and the operation is safe and controllable.

[0075] It should be noted that Figure 5 It is only a simple pressurized liquid injection structure, and those skilled in the art can expand it into a variety of structures without creative labor, but the method of pressurizing and injecting liquid into the fine holes of the cutting line and / or the auxiliary cutting line is protected by this application.

[0076] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A method for decomposing micro-optical components by laser cutting, characterized in that: include: On the component blank, a cutting track is punched out by a pulse laser cutting device according to the outer shape pattern of the desired decomposed component, wherein the cutting track includes a cutting line, and the cutting line includes a plurality of fine holes arranged at intervals; The component blank is installed in a liquid injection device and maintained for a first set time, and the liquid injection device is controlled to provide a pressure difference for two sides of the component blank in a negative pressure or positive pressure manner, so that the liquid is injected into the pores; The component blank injected with liquid is taken out from the liquid injection device, and placed in a freezing environment of a refrigeration device for a second set time, so that the liquid in the pores freezes and expands, and the component blank is cracked along the cutting line.

2. The decomposition method according to claim 1, characterized in that: After the liquid-injected component blank is taken out from the liquid injection device and placed in a freezing environment of a refrigeration device for a second set time, so that the liquid in the pores freezes and expands, and the component blank is cracked along the cutting line, the method further includes: The element blank is taken out from the refrigeration equipment, and after returning to temperature, the required decomposition elements and scraps are separated to complete the optical element decomposition.

3. The decomposition method according to claim 1, characterized in that: The cutting track also includes an auxiliary cutting line, which is located at the periphery of the cutting line, connected to the cutting line, and includes a plurality of the pores arranged at intervals.

4. The decomposition method according to claim 3, characterized in that: The plurality of auxiliary cutting lines include a first auxiliary cutting line, a second auxiliary cutting line, a third auxiliary cutting line and a fourth auxiliary cutting line sequentially arranged around the cutting line; The first auxiliary cutting line is opposite to the third auxiliary cutting line, and the second auxiliary cutting line is opposite to the fourth auxiliary cutting line.

5. The decomposition method according to claim 1, characterized in that: The pulse laser cutting equipment comprises a fiber laser, the wavelength of the fiber laser is near infrared, visible light or near ultraviolet, and the pulse frequency is picosecond or femtosecond.

6. The method for decomposing micro-optical components by laser cutting according to claim 1, characterized in that: The pressure difference range is set to be 0.05 MPa to 2 MPa.

7. The decomposition method according to claim 1, characterized in that: The liquid includes water; Alternatively, the liquid comprises water and a surfactant.

8. Laser cutting micro optical element decomposition system, characterized in that: include: A pulse laser cutting device is used to punch a cutting track on the component blank according to the outer shape pattern of the required decomposed component, wherein the cutting track includes a cutting line, and the cutting line includes a plurality of fine holes arranged at intervals; A liquid injection device, used to provide negative pressure or positive pressure to provide a pressure difference between two sides of the element blank so that the liquid is injected into the fine hole; The refrigeration device is used to freeze and expand the liquid in the pores, so as to crack the element blank along the cutting line.

9. The decomposition system according to claim 8, characterized in that: The liquid injection equipment comprises: A fixing member, wherein the fixing member is a pipe body with an internal thread; The pipe fitting is a pipe body with external threads, and the element blank is tightened and fixed by the cooperation of the internal threads and the external threads; the side of the pipe fitting away from the element blank forms a cavity for accommodating the liquid.

10. The decomposition system according to claim 9, characterized in that: The liquid injection device further comprises a sealing protection member, which is arranged on a side of the element blank facing the tube and / or on a side of the element blank away from the tube.

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