Tungsten wire electroplating brass production device and method

Abstract

The invention belongs to the technical field of tungsten filament processing and production, and particularly relates to a tungsten filament electroplating brass production device and method.The tungsten filament electroplating brass production device comprises a surface treatment device, and the surface treatment device comprises a cleaning tank, a first box body and a first circulation pipeline arranged between the cleaning tank and the first box body; an ultrasonic device and a polar plate are arranged in the cleaning tank; the pre-plating device is used for plating nickel on the surface of the tungsten filament; the copper plating device is used for plating copper on the surface of the tungsten filament; the galvanizing device is used for galvanizing the surface of the tungsten filament; each of the copper plating device and the zinc plating device comprises an upper electrolytic bath, a lower electrolytic bath, a second box body and a second circulating pipeline arranged between the two electrolytic baths; the tungsten filament is wound between the two winding rollers and penetrates through the two electrolytic cells; the heat diffusion device is used for heating the surface of the tungsten filament; the cleaning device cleans the surface of the tungsten filament. Through cooperation of electrolytic degreasing, alkali chemical degreasing and ultrasonic waves, oil stain treatment on the surface of the tungsten filament is more thorough, the tungsten filament is wound on the winding roller for multiple times so that the tungsten filament can penetrate through the two electrolytic cells for multiple times, and then the occupied space of the equipment is effectively reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of tungsten wire processing and production, and specifically relates to a tungsten wire electroplating brass production device and method. Background Art

[0002] At present, in the process of using tungsten wire to produce diamond wire or steel cord, the tungsten wire needs to be electroplated, and a layer of brass alloy is plated on its surface to make electroplated brass wire, and then it is processed into the required product through subsequent production. The brass plating process includes pre-treatment of the tungsten wire, followed by copper plating, zinc plating and thermal diffusion. In the current production process, due to incomplete oil treatment on the surface of the tungsten wire, the subsequent coating cannot be plated on the tungsten wire, and during plating, in order to ensure uniform coating, multiple stages of electroplating are required, resulting in a longer production line, a larger footprint of the overall equipment, and troublesome maintenance. Summary of the invention

[0003] The present invention aims to solve the problems in the existing electroplated brass wire production process that the subsequent plating layer cannot be plated on the tungsten wire due to incomplete treatment of oil stains on the surface of the tungsten wire, and during the plating, in order to ensure uniform plating, multiple stages of electroplating are required, resulting in a long production line, a large footprint of the overall equipment, and troublesome maintenance. A tungsten wire electroplated brass production device and method are provided. Electrolytic degreasing, alkaline chemical degreasing and ultrasonic wave are combined to ensure that the oil stains on the surface of the tungsten wire are treated more thoroughly. The winding roller is wound multiple times so that the tungsten wire passes through the electrolytic cell multiple times during the electroplating process, thereby effectively reducing the space occupied by the equipment, facilitating maintenance, reducing the use of plating solution, and reducing costs.

[0004] In order to achieve the above object, the technical solution of the present invention is: A tungsten wire brass electroplating production device comprises a surface treatment device, a pre-plating device, a copper plating device, a galvanizing device and a heat diffusion device connected in sequence; the surface treatment device comprises two cleaning tanks connected end to end, a first box is arranged below each of the cleaning tanks, and a first circulation pipeline is arranged between each cleaning tank and the corresponding first box; an ultrasonic device and at least two pole plates are arranged in each of the cleaning tanks, and the pole plates in the two cleaning tanks are respectively connected to the positive pole and the negative pole of the power supply, and electrolytic degreasing is realized by energizing the pole plates, and alkaline chemical degreasing is realized by circulating the alkaline solution in the first circulation pipeline, and ultrasonic waves are emitted by the ultrasonic device to further accelerate the separation of oil stains on the surface of the tungsten wire.

[0005] The copper plating device and the galvanizing device both include a plating device, each of which includes two electrolytic cells arranged vertically, a second box is provided on one side of the electrolytic cell, and a second circulation pipeline is provided between the second box and the electrolytic cell; winding rollers are provided at both ends of the electrolytic cell, the tungsten wire is wound between the two winding rollers, the tungsten wire extending tangentially along the upper side of the winding roller passes through the upper electrolytic cell, and the tungsten wire extending tangentially along the lower side of the winding roller passes through the lower electrolytic cell, the winding roller is provided with a plurality of winding grooves, the tungsten wire is wound on the plurality of winding grooves in sequence, and the tungsten wire is wound multiple times between the winding rollers so that the tungsten wire passes through the electrolytic cell multiple times, thereby ensuring the plating quality.

[0006] Cleaning devices are provided between the surface treatment device and the pre-plating device, between the pre-plating device and the copper plating device, between the copper plating device and the galvanizing device, between the galvanizing device and the heat diffusion device, and at the rear side of the heat diffusion device. Air blowing devices are provided at the ends of the cleaning devices located on the front and rear sides of the heat diffusion device. The cleaning device is used to wash away the residual liquid on the surface of the tungsten wire, and the air blowing device is used to dry the surface of the tungsten wire.

[0007] Preferably, two first partitions are provided in each of the cleaning tanks, two overflow plates are provided between the two first partitions, a plurality of overflow grooves are opened on the upper side of each overflow plate, an ultrasonic device is provided between the two overflow plates, and the pole plate is located above the corresponding ultrasonic device.

[0008] Preferably, a first end plate is provided at both ends of each cleaning tank, two first partitions are located between the two first end plates, and first strip holes are provided on the first partitions and the first end plates; a rotating shaft is provided between adjacent first partitions and the first end plates, and a plurality of wire wheels are rotatably sleeved on the rotating shaft, and the wire wheels correspond one by one to the plurality of overflow grooves, and the spacing between the tungsten wires is ensured and kept horizontal by the wire wheels.

[0009] Preferably, there is a gap between the ultrasonic device and the inner bottom surface of the cleaning tank, and there is a gap between the electrode plate and the ultrasonic device; the electrode plate adopts a mesh plate structure, the electrode plate in one of the two cleaning tanks is an anode plate, and the electrode plate in the other cleaning tank is a cathode plate, and the electrode plates in each cleaning tank are arranged at intervals to ensure the diffusion of ultrasonic waves in the cleaning tank and the contact between the electrode plate and the alkaline solution.

[0010] Preferably, two second partitions are provided in each electrolytic cell, and corresponding second strip holes are opened on the side plates at both ends and the second partitions of the electrolytic cell. A plurality of trays are provided between the two second partitions, and plating blocks lower than the second strip holes are provided on the trays to ensure that the plating liquid immerses the plating blocks.

[0011] Preferably, there are gaps between the tray and the inner wall of the electrolytic cell and between multiple trays; a partition is provided on the tray, a plating block is provided on the partition, and the partition is made of conductive material; the partition is a layered structure made of polypropylene fiber, and the partition prevents the plating block from falling off, while ensuring sufficient contact between the plating block and the plating solution.

[0012] Preferably, each electrolytic cell is provided with at least one second liquid inlet pipe, and the second circulation pipeline is connected with the interior of the corresponding electrolytic cell through the second liquid inlet pipe. The second liquid inlet pipe is lower than the tray in the electrolytic cell and is provided with multiple liquid outlets. The multiple liquid outlets ensure rapid diffusion of the plating solution in the electrolytic cell and have a certain disturbing effect on the plating solution in the electrolytic cell.

[0013] A tungsten wire electroplated brass production method is realized by the above-mentioned tungsten wire electroplated brass production device, comprising the following steps: surface treatment, one water washing, one pickling, two water washings, pre-plating, three water washings, copper plating, four water washings, zinc plating, five water washings, thermal diffusion, two picklings, and six water washings; The surface treatment step comprises: step 1, the tungsten wire passes through the cleaning tank through the first strip hole, and the distance between two adjacent tungsten wires is set to 8-12mm; Step 2: circulate the alkaline solution between the cleaning tank and the first box through the first circulation pipeline; The level of alkaline solution in the cleaning tank should be at least 0.5 cm higher than the tungsten wire; Step 3: Power the plates and adjust the current density in the cleaning tank to 5-20A / dm 2 ; At the same time, the ultrasonic device is powered on, the current is controlled at 1.5-3A, and 30-40KHZ ultrasonic waves are emitted into the alkaline solution; Control line speed to 24.5-25.5m / min; Pre-plating: Control the tungsten wire speed to 25m / min, and pre-plating a nickel layer on the surface of the tungsten wire, the thickness of the nickel layer is 0.0001-0.0004mm; The copper plating and zinc plating steps both include: step 1, winding at least one tungsten wire on two winding rollers for multiple turns, the minimum spacing between two adjacent turns of the same tungsten wire is 4 mm, and the minimum spacing between two adjacent tungsten wires is 8 mm, and after the winding is completed, the line speed is controlled at 3-20 m / min; Step 2, circulating the plating solution between the second box and the electrolytic cell through the second circulation pipeline; The plating solution level in the electrolytic cell is at least 0.5 cm higher than the tungsten wire; Step 3, making the tray and the tungsten wire conductive, and controlling the line speed at 25±0.5m / min; Thermal diffusion: The tungsten wire is heated at 500-600°C for 3-4s to achieve copper-zinc diffusion on the surface of the tungsten wire and obtain the brass coating required for subsequent drawing. The thickness of the brass coating is greater than 0.001 and less than 0.00125mm.

[0014] Preferably, the distance between two adjacent tungsten wires in step 1 of the surface treatment step is 10 mm; In step 2 of the surface treatment step, the alkaline solution is a sodium hydroxide solution with a concentration of 30-100 g / L, a pH value of 10-14, and a temperature set to 50-70° C.; In step 3 of the surface treatment step, the line speed is controlled to be 25 m / min.

[0015] Preferably, the plating blocks in the copper plating step are multiple copper blocks, the plating solution is a mixed solution of copper pyrophosphate, potassium pyrophosphate, pyrophosphoric acid and pure water, the copper ion concentration is 27±7 g / L, the pH value is 8.3±0.4, the temperature is set at 50±5°C, the concentration ratio of copper ions to pyrophosphate ions in the plating solution is 1:7.5±1, and the thickness of the copper plating layer is 0.001±0.00005 mm; The plating blocks in the galvanizing step are multiple zinc blocks, the plating solution is a zinc sulfate solution prepared by mixing zinc sulfate and pure water, the concentration of the zinc sulfate solution is 225±75g / L, the pH value is 1.4-2.2, the temperature is set at 35±5°C, and the thickness of the galvanized layer is 0.00025±0.00005mm; When the tungsten wire is arranged on the winding rod, the distance between two adjacent turns of the same tungsten wire is 5 mm, and the distance between two adjacent tungsten wires is 10 mm.

[0016] Through the above technical solution, the beneficial effects of the present invention are: 1. In the surface treatment step of the tungsten wire of the present invention, two groups of cleaning tanks are set up to perform surface treatment on the tungsten wire, thereby effectively ensuring the surface treatment effect of the tungsten wire. After the treatment in the previous cleaning tank is completed, the tungsten wire directly enters the next cleaning tank to avoid oxidation. On this basis, it is treated again to avoid the treated tungsten wire surface from contacting with the air again and then oxidizing, and to avoid impurities such as oil and graphite emulsion from combining with the tungsten wire again to increase the difficulty of treatment and affect the efficiency of the tungsten wire surface treatment.

[0017] 2. The present invention sets an ultrasonic device in the cleaning tank, and then uses ultrasonic waves to propagate in the solution, which can form cavities inside the solution. The cavities are in a vacuum state, and the gas in the solution enters the vacuum cavities to form bubbles. When the bubbles are formed, they burst under the action of pressure to generate a strong shock wave, which is used to impact and peel off the oil and impurities on the surface of the tungsten wire, thereby effectively improving the cleaning effect of the tungsten wire surface.

[0018] 3. The present invention places the electrode plates in an alkaline solution, and respectively places the electrode plates in two cleaning tanks as the cathode plate and the anode plate of the electrolytic reaction, and then uses the solution and the tungsten wire to form an electrolytic circuit, thereby effectively ensuring the electrolysis effect, and at the same time effectively increasing the contact area between the tungsten wire and the solution to ensure the electrolysis effect; the present invention combines alkaline chemical degreasing, electrolytic degreasing and ultrasonic degreasing on the surface of the tungsten wire to effectively ensure the effective removal of oil stains on the surface of the tungsten wire, thereby avoiding the problem of failure to plate the nickel layer or discontinuity of the nickel layer in the subsequent pre-plating process.

[0019] 4. In the steps of copper plating and zinc plating on the surface of the tungsten wire of the present invention, a winding roller and two electrolytic cells corresponding to the upper and lower parts are arranged, so that the tungsten wire passes through the electrolytic cells for many times during the process of being wound on the two winding rollers, and the electroplating process is completed in the electrolytic cells. Compared with the existing method of electroplating in which multiple electrolytic cells are connected end to end, the floor space of the equipment is effectively reduced, the amount of plating solution used in the electroplating process is reduced, and the processing efficiency of electroplated brass is improved. By adopting the plating device of the present invention, the total length of the electrolytic cell is reduced from 40m to about 4m, the number of pumps is greatly reduced, and the equipment cost and electricity cost are reduced by about 80%.

[0020] 5. The present invention effectively avoids interference caused by mutual contact when the tungsten wires are wound on the winding roller by opening a plurality of winding grooves on the winding roller.

[0021] 6. The present invention adopts a tray with a mesh structure, so that the tray is in full contact with the plating solution, effectively increasing the contact area between the tray and the plating solution. At the same time, the tray structure and the partition arranged thereon are used to lift the plating block to prevent it from falling from the mesh holes of the tray. The block-shaped plating block is used to increase the contact area between the plating block and the plating solution, effectively increasing the electrolysis efficiency and ensuring the plating effect on the tungsten wire surface.

[0022] 7. The present invention arranges a liquid inlet pipe in the electrolytic cell and opens a plurality of liquid outlets on the liquid inlet pipe, so that the plating solution diffuses evenly after entering the electrolytic cell, so that the plating solution is in full, uniform and effective contact with materials such as tungsten wire, tray, plating block, etc., and at the same time, the plating solution is transported into the electrolytic cell through the plurality of liquid outlets, thereby disturbing and stirring the plating solution in the electrolytic cell.

[0023] 8. The surface coating of the tungsten wire of the present invention is uniform, and the bonding strength and ductility are improved. According to tests, in the subsequent process of drawing the tungsten wire from a diameter of 0.06 mm to 0.031 mm for diamond wire production, 200 km of diamond wire busbars were continuously produced without any out-of-tolerance problems. The diameter of the 200 km diamond wire busbars produced using the method of the present application was maintained at 0.031 ± 0.0005 mm. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the present invention.

[0025] Figure 2 It is a schematic structural diagram of the surface treatment device of the present invention.

[0026] Figure 3 It is a schematic structural diagram of the connection between the cleaning tank and the first box body of the present invention.

[0027] Figure 4 It is a schematic diagram of the cross-sectional structure of the cleaning tank of the present invention.

[0028] Figure 5 The structural diagram of the positional relationship between the electrode plate and the ultrasonic device of the present invention is shown in FIG. Figure 1 .

[0029] Figure 6 The structural diagram of the positional relationship between the electrode plate and the ultrasonic device of the present invention is shown in FIG. Figure 2 .

[0030] Figure 7 It is a structural schematic diagram of the overflow plate of the present invention.

[0031] Figure 8 The structure of the plating device of the present invention is shown in FIG. Figure 1 .

[0032] Fig. 9 The structure of the plating device of the present invention is shown in FIG. Figure 2 .

[0033] Fig.10 It is a schematic diagram of the installation structure of the second liquid inlet pipe of the present invention.

[0034] Fig.11 It is a schematic diagram of the structure of the plating device of the present invention after the tungsten wire is wound.

[0035] Fig.12 It is a schematic diagram of the structure of winding tungsten wire on the winding roller of the present invention.

[0036] Fig.13 For the present invention Fig.12 Enlarged view of point A in the middle.

[0037] The reference numerals in the accompanying drawings are: 1 is a surface treatment device, 2 is a pre-plating device, 3 is a copper plating device, 4 is a galvanizing device, 5 is a heat diffusion device, 6 is a cleaning device, and 7 is a tungsten wire; 11 is a cleaning tank, 12 is a first box body, 13 is an ultrasonic device, 14 is a plate, 15 is a first partition plate, 16 is a first end plate, 17 is an overflow plate, 18 is an overflow groove, 19 is a first strip hole, 110 is a first liquid inlet pipe, 111 is a first liquid outlet pipe, 112 is an overflow pipe, 113 is a first delivery pump, and 114 is a first filter; 31 is an electrolytic cell, 32 is a second box body, 33 is a winding roller, 34 is a winding groove, 35 is a second partition plate, 36 is a second strip hole, 37 is a tray, 38 is a plating block, 39 is a liquid supply pipe, 310 is a second liquid outlet pipe, 311 is a second liquid inlet pipe, 312 is a second delivery pump, and 313 is a liquid discharge port. DETAILED DESCRIPTION

[0038] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments: like Figures 1 to 13 As shown, this embodiment provides a tungsten wire brass electroplating production device, including a surface treatment device 1, a pre-plating device 2, a copper plating device 3, a galvanizing device 4 and a heat diffusion device 5 connected in sequence, wherein the surface treatment device 1 is used to remove oil stains on the surface of the tungsten wire 7.

[0039] like Figure 2-7 As shown, the surface treatment device 1 includes two cleaning tanks 11 connected end to end, and a first box 12 is arranged under each of the cleaning tanks 11. An alkaline solution with a pH value of 10-14 is arranged in the first box 12. The concentration of the alkaline solution is 30-100g / L, and the temperature is maintained at 50-70°C. Specifically, the alkaline solution is a sodium hydroxide solution prepared by mixing sodium hydroxide and pure water. The alkaline solution can saponify and emulsify the oil on the surface of the tungsten wire, absorb it, and in the process, part of the impurities such as graphite emulsion or oxide scale on the surface of the tungsten wire fall off. A first circulation pipeline is arranged between each cleaning tank 11 and the corresponding first box 12.

[0040] The first circulation pipeline is provided with a first delivery pump 113 and a first filter 114. In actual use, the first delivery pump 113 allows the alkaline solution to circulate between the first box 12 and the cleaning tank 11 through the first circulation pipeline. On the one hand, effective contact between the alkaline solution and the tungsten wire is ensured. In this process, impurities therein are removed by the first filter 114 to ensure the reaction effect between the alkaline solution delivered to the cleaning tank 11 and the oil stain on the surface of the tungsten wire.

[0041] Two first partitions 15 are arranged in each of the cleaning tanks 11, and two overflow plates 17 are arranged between the two first partitions 15. The two overflow plates 17 and the side walls of the cleaning tank 11 together form an electrolytic reaction space. The adjacent first partitions 15 and the overflow plates 17 cooperate with the side walls of the cleaning tank 11 to form an overflow space, that is, the two overflow spaces are located at the two ends of the corresponding electrolytic reaction space. The space between the two first partitions 15 of each cleaning tank 11 is divided into overflow space-electrolytic reaction space-overflow space in sequence. A plurality of overflow grooves 18 are opened on the upper side of each overflow plate 17. When the liquid level of the alkaline solution in the electrolytic reaction space rises to a certain height, it flows from the overflow grooves 18 at both ends to the overflow space.

[0042] The first circulation pipeline includes a first liquid inlet pipe 110, a first liquid outlet pipe 111 and an overflow pipe 112. The inner diameter of the first liquid inlet pipe 110 is larger than that of the first liquid outlet pipe 111. One end of the first liquid inlet pipe 110 is connected to the lower part of the first box 12, and the other end is connected to the electrolytic reaction space in the corresponding cleaning tank 11. The first liquid inlet pipe 110 is provided with a first delivery pump 113 and a first filter 114. The first filter 114 is located on the outlet side of the first delivery pump 113. The first filter 114 adopts a precision chemical liquid filter of model JF-2004. The alkaline solution in the first box 12 is delivered to the first filter 114 through the first delivery pump 113. After the solid impurities are separated in the first filter 114, they are delivered to the electrolytic reaction space in the cleaning tank 11 through the first liquid inlet pipe 110. One end of the first liquid outlet pipe 111 is connected to the upper part of the first box 12, and the other end is connected to the corresponding electrolytic reaction space. The alkaline solution in the electrolytic reaction space flows back to the first box 12 through the first liquid outlet pipe 111. Since the inner diameter of the first liquid inlet pipe 110 is larger than the first liquid outlet pipe 111, the liquid level of the alkaline solution in the electrolytic reaction space gradually rises and immerses the tungsten wire 7 passing through the electrolytic reaction space, reacts with the oil on the surface of the tungsten wire, and at the same time, during the circulation process, washes away the impurities on the surface of the tungsten wire. When the liquid level in the electrolytic reaction space rises to the height of the overflow tank 18, it flows out of the electrolytic reaction space from the overflow tank 18 and enters the two overflow spaces. One end of the overflow pipe 112 is connected to the upper part of the first box 12, and the other end is connected to the overflow space in the corresponding cleaning tank 11. The alkaline solution in the overflow space flows into the first box 12 through the overflow pipe 112.

[0043] The first liquid outlet pipe 111 is provided with a valve for adjusting the flow of the first liquid outlet pipe 111, and then adjusting the valve opening to adjust the liquid level in the electrolytic reaction space to ensure that the tungsten wire is immersed in the alkaline solution and the surface treatment effect of the tungsten wire is ensured.

[0044] Each of the cleaning tanks 11 is provided with an ultrasonic device 13 and at least two pole plates 14. The distance between two adjacent pole plates 14 in the same cleaning tank 11 is at least 2 cm. The difference between the current entering the cleaning tank 11 and the current on the pole plates 14 is reduced by the multiple pole plates 14, thereby further ensuring the uniform current distribution in the electrolytic reaction space and the electrolytic degreasing effect on the surface of the tungsten wire. The pole plates 14 in the two cleaning tanks 11 are respectively connected to the positive and negative poles of the power supply, and then the pole plates 14 as the positive and negative poles are connected to the tungsten wire 7 through the solution, and the pole plates 14 are electrically connected to the power supply, thereby forming a current loop, and the power supply is supplied to the pole plates 14. The surface of the tungsten wire 7 is electrolyzed by electricity. Under the electrolysis conditions, the polarization of the electrode will reduce the surface tension of the oil stain and the solution, and the wettability of the solution to the surface of the tungsten wire 7 will increase, so that the adhesion between the oil film and the metal will be reduced, and the oil stain is easy to peel off and dispersed into the solution for emulsification and removal. At the same time, under the action of electrolysis, a large amount of gas is precipitated on the surface of the tungsten wire 7. These gases are adsorbed on the surface of the oil film, tearing the oil film into small oil droplets and bringing them to the liquid surface, so that the oil stain on the surface of the tungsten wire 7 is separated from the tungsten wire. At the same time, the gas stirs the solution, so that the solution near the surface of the tungsten wire is continuously updated, accelerating the oil removal process. In the actual electrolysis process, the electrolysis current density is guaranteed to be 5-20A / dm 2 .

[0045] An ultrasonic device 13 is arranged between the two overflow plates 17. The ultrasonic device 6 adopts an X6 type ultrasonic generator produced by Zhangjiagang Huawei Electronics Co., Ltd. The ultrasonic device 13 is used to emit ultrasonic waves to the solution in the cleaning tank 11. Ultrasonic waves are high-frequency sound waves with a frequency greater than 20KHZ. When propagating in the solution, cavities can be formed inside the solution. The cavities are in a vacuum state, and the gas in the solution will enter the vacuum cavities to form bubbles. When the bubbles are formed, the bubbles burst under the action of pressure to produce a strong shock wave. Ultrasonic degreasing uses the "cavitation" effect to impact and peel off the oil on the metal surface to achieve the purpose of cleaning the surface. In actual use, the ultrasonic current is controlled at 1.5A-3A, and the ultrasonic frequency is controlled at 30KHZ-40KHZ.

[0046] The electrode plate 14 is located above the corresponding ultrasonic device 13, and there is a gap between the electrode plate 14 and the ultrasonic device 13. The electrode plate 14 adopts a mesh plate structure. The electrode plate 14 in one of the two cleaning tanks 11 is an anode plate, and the electrode plate 14 in the other cleaning tank 11 is a cathode plate. The electrode plates 14 in each cleaning tank 11 are arranged at intervals from each other. There is a gap between the ultrasonic device 13 and the inner bottom surface of the cleaning tank 11, which ensures the diffusion of the ultrasonic wave emitted by the ultrasonic device 13 in the alkaline solution, and at the same time ensures sufficient and effective contact between the electrode plate 14 and the alkaline solution.

[0047] Each cleaning tank 11 is provided with a first end plate 16 at both ends, and two first partition plates 15 are located between the two first end plates 16 . The first partition plates 15 and the first end plates 16 are both provided with a first strip hole 19 for the tungsten wire 7 to pass through.

[0048] A rotating shaft is arranged between the adjacent first partition plate 15 and the first end plate 16, and a plurality of wire wheels are rotatably sleeved on the rotating shaft. The wire wheels correspond one to one with the plurality of overflow grooves 18, that is, the tungsten wire 7 passes through the overflow space, the electrolytic reaction space, and the overflow space and then passes through the wire wheel again, thereby effectively ensuring the height of the tungsten wire 7 and the spacing between the plurality of tungsten wires 7, and avoiding interference between adjacent tungsten wires 7.

[0049] The pre-plating device 2 is used for pre-plating a nickel layer on the surface of the tungsten wire 7. The nickel plating process mainly involves immersing the tungsten wire in an aminosulfonic acid solution, setting nickel as an anode in the solution, and electrolyzing the tungsten wire 7 as a cathode to plate the nickel on the surface of the tungsten wire 7. Therefore, the pre-plating device 2 can adopt existing equipment that can meet the requirements of immersing the tungsten wire 7 and passing through the aminosulfonic acid solution at a line speed of 25m / min, and circulating the solution at the same time, for example, or a nickel plating device disclosed in a diamond wire nickel plating device with authorization announcement number CN206447958U.

[0050] The copper plating device 3 is used for electroplating copper outside the nickel layer on the surface of the tungsten wire 7 .

[0051] The galvanizing device 4 is used for electroplating zinc outside the copper layer on the surface of the tungsten wire 7 .

[0052] The copper plating device 3 and the zinc plating device 4 both include a plating device such as Figure 8-13 As shown, each of the plating devices includes two electrolytic cells 31 arranged vertically, a second box 32 is provided on one side of the electrolytic cell 31, and a plating solution is provided in the second box 32. When copper is plated on the tungsten wire, the plating solution is a mixed solution of copper pyrophosphate, potassium pyrophosphate, pyrophosphoric acid and pure water, wherein the copper ion concentration is 27±7g / L, the pH value is 8.3±0.4, the temperature is set at 50±5°C, and the concentration ratio of copper ions to pyrophosphate ions in the plating solution is 1:7.5±1.

[0053] When galvanizing the tungsten wire, the plating solution is a zinc sulfate solution prepared by mixing zinc sulfate and pure water. The concentration of the zinc sulfate solution is 225±75 g / L, the pH value is 1.4-2.2, and the temperature is set at 35±5°C.

[0054] A second circulation pipeline is arranged between the second box body 32 and the electrolytic cell 31 for circulating the plating solution between the second box body 32 and the electrolytic cell 31. A second delivery pump 312 and a second filter are arranged on the second circulation pipeline. In actual use, the second delivery pump 312 allows the plating solution to circulate between the second box body 32 and the electrolytic cell 31 through the second circulation pipeline. On the one hand, sufficient and effective contact between the plating solution and the tungsten wire 7 is ensured to ensure the plating quality. On the other hand, during the circulation of the plating solution, impurities in the plating solution are removed by the filter.

[0055] Two second partitions 35 are arranged in each electrolytic cell 31. The side plates at both ends of the electrolytic cell 31 and the second partitions 35 are provided with corresponding second strip holes 36. When in use, the tungsten wire 7 passes through the second strip holes 36 to enter and exit the electrolytic cell 31. A plurality of trays 37 are arranged between the two second partitions 35. The trays 37 are tray structures surrounded by mesh plates, thereby effectively ensuring the contact area between the plating solution and the trays. A plating block 38 lower than the second strip holes 36 is arranged on the tray 37. A plurality of groups of support blocks are arranged between the two second partitions 35. Each group of support blocks is provided with a tray 37. Each group of support blocks is It is composed of two rows of symmetrical multiple L-shaped blocks, the horizontal ends of the two rows of L-shaped blocks are opposite, and the vertical ends are upward. There are gaps between the tray 37 and the inner wall of the electrolytic cell 31 and between the multiple trays 37. The tray 37 is a tray surrounded by a mesh plate made of titanium. A partition is arranged on the tray 37, and a plating block 38 is arranged on the partition. The plating block 38 is a plurality of copper blocks or a plurality of zinc blocks. The partition is made of conductive material and is a layered structure made of polypropylene fiber. On the one hand, the partition will not affect the transmission of current. On the other hand, the partition can effectively prevent the plating block 14 from falling through the mesh of the tray 7.

[0056] When copper is plated on the tungsten wire, the plating solution and the copper block used in the copper plating are used as anodes, and the tungsten wire 15 is used as a cathode. Under the action of electrolysis, copper ions are precipitated and plated on the surface of the tungsten wire. The pyrophosphoric acid in the plating solution reacts with the copper block, so that the copper block is dissolved into copper ions, ensuring that the copper ion concentration in the plating solution is in dynamic equilibrium.

[0057] When galvanizing the tungsten wire, the plating solution and the zinc block used in the galvanizing process serve as the anode, and the tungsten wire 15 serves as the cathode. Under the action of electrolysis, zinc particles are precipitated and plated on the surface of the tungsten wire, and the sulfuric acid in the plating solution reacts with the zinc block, so that the zinc block dissolves into zinc ions, thereby ensuring that the zinc ion concentration in the plating solution is in dynamic equilibrium.

[0058] Winding rollers 33 are provided at both ends of the electrolytic cell 31. The tungsten wire 7 is wound between the two winding rollers 33. The winding direction can be clockwise or counterclockwise. The tungsten wire 7 extending tangentially along the upper side of the winding roller 33 passes through the upper electrolytic cell 31, and the tungsten wire 7 extending tangentially along the lower side of the winding roller 33 passes through the lower electrolytic cell 31. The tungsten wire 7 extending tangentially along the upper side of the winding roller 33 passes through the second strip hole 36 of the upper electrolytic cell 31, and the tungsten wire 7 extending tangentially along the lower side of the winding roller 33 passes through the second strip hole 36 of the lower electrolytic cell 31. Through the arrangement of the two winding rollers 33, the tungsten wire 7 passes through the electrolytic cell 31 between the two winding rollers 33 during the process of being wound on the winding roller 33. The tungsten wire 7 passes through the corresponding electrolytic cell 31 through the second strip hole 36, and The tungsten wire 7 is immersed in the plating solution in the electrolytic cell 31. The tungsten wire 7 is wound multiple times and then passes through the electrolytic cell 31 multiple times, so that the residence time of the tungsten wire 7 in the plating solution is 60-80s. At the same time, the concentration of copper ions or zinc ions in the electrolytic cell 31 is in dynamic equilibrium. Therefore, only two electrolytic cells 31 cooperate with the winding roller 33 to effectively reduce the space occupied by the equipment while ensuring the plating quality (that is, two electrolytic cells 31 replace the original dozen or even more electrolytic cells 31), effectively reduce the cost, and reduce the amount of plating solution used (the volume of the plating solution used when copper is plated using the plating device of the present invention is about 6% of the original volume, and the volume of the plating solution used when zinc is plated using the plating device of the present invention is about 15% of the original volume), further reducing the cost.

[0059] The winding roller 33 is provided with a plurality of winding grooves 34, which are arranged in sequence along the axial direction of the winding roller 33. The tungsten wires 7 are wound on the plurality of winding grooves 34 in sequence, and the tungsten wires 7 wound on the winding roller 33 are separated by the winding grooves 34 to avoid mutual contact and interference, thereby ensuring smooth electroplating.

[0060] The second circulation pipeline includes a liquid supply pipe 39 and a second liquid outlet pipe 310. One end of the liquid supply pipe 39 is connected to the lower end of the second box 32, and the other end is connected to the inside of the corresponding electrolytic cell 31. The liquid supply pipe 39 is provided with a second delivery pump 312 and a second filter. The second filter is located on the outlet side of the second delivery pump 312. The plating liquid in the second box 32 is delivered to the electrolytic cell 31 (between the two second partitions 35 in the electrolytic cell 31) through the liquid supply pipe 39 by the second delivery pump 312. With continuous delivery, the plating liquid level in the electrolytic cell 31 rises to the second strip on the second partition 35. The liquid flows from the second strip hole 36 into the end side plate of the electrolytic cell 31 and the second partition plate 35 adjacent thereto. A drain port 313 is provided at the bottom of the electrolytic cell 31 on the side away from the two second partition plates 35. The drain port 313 is connected to a second liquid outlet pipe 310. One end of the second liquid outlet pipe 310 away from the drain port 313 is connected to the upper end of the second box body 32. After the plating solution between the two second partition plates 35 overflows to the drain port 313, it flows back to the second box body 32 through the second liquid outlet pipe 310. In this process, the plating solution submerges the tungsten wire 7 passing through the second strip hole 36.

[0061] At least one second liquid inlet pipe 311 is provided in each electrolytic cell 31, and the second circulation pipeline is connected with the interior of the corresponding electrolytic cell 31 through the second liquid inlet pipe 311. The liquid supply pipe 39 is connected with the interior of the electrolytic cell 31 through the second liquid inlet pipe 311. The second liquid inlet pipe 311 is lower than the tray 37 in the electrolytic cell 31, and a plurality of liquid outlets are provided on its side. The liquid supply pipe 39 transports the plating solution to the corresponding second liquid inlet pipe 311 and enters the electrolytic cell 31 through the plurality of liquid outlets. The plurality of liquid outlets are provided to allow the plating solution to diffuse rapidly in the electrolytic cell 31, and to have a certain disturbance and stirring effect on the plating solution in the electrolytic cell 31, thereby further ensuring that the plating solution near the tungsten wire 7 is continuously renewed, ensuring the concentration of copper ions or zinc ions near the tungsten wire 7, and ensuring the electroplating coating effect.

[0062] As an implementation method, the bottom surface of the electrolytic cell 31 on the side away from the two second partitions 35 is set as a slope, and the lower end of the slope extends to the drain port 313, so that the plating solution can quickly flow back to the second box body 32.

[0063] As an implementable embodiment, a spray pipe (not shown in the figure) is arranged above each of the winding rollers 33, which is used to spray and rinse the tungsten wire 7 extending out of the electrolytic cell 31 and wound on the winding roller 33, so as to rinse away the copper or zinc that is not plated on the surface of the tungsten wire 7 but attached to the surface of the tungsten wire 7 during the electroplating process, so as to avoid affecting the subsequent electroplating process.

[0064] The heat diffusion device 5 is used to heat the copper layer and the zinc layer on the surface of the tungsten wire 7 to form a brass layer. The heat diffusion device 5 is mainly used to heat the tungsten wire when it passes through, so that the tungsten wire 7 is heated at a temperature of 500-600°C for 3-4s, so as to achieve the diffusion of copper and zinc on the surface of the tungsten wire and obtain the brass coating required for subsequent drawing. The thickness of the brass coating is greater than 0.001 and less than 0.00125mm. Therefore, the heat diffusion device 5 can be implemented by selecting an existing heating box or other heating equipment that meets the heating and insulation environment. For example, the heat diffusion device 5 includes an insulation box, and an electric heating tube and an asbestos insulation layer are arranged in the insulation box. When the tungsten wire 7 passes through the insulation box, the temperature in the insulation box reaches 500-600°C through the electric heating tube, and the asbestos insulation layer reduces heat loss to ensure that the tungsten wire is in an environment of 500-600°C for 3-4s.

[0065] A cleaning device 6 is provided between the surface treatment device 1 and the pre-plating device 2, between the pre-plating device 2 and the copper plating device 3, between the copper plating device 3 and the galvanizing device 4, between the galvanizing device 4 and the heat diffusion device 5, and on the rear side of the heat diffusion device 5. The cleaning device is a trough body in which liquid circulation can be realized. When the tungsten wire 7 passes through the device, it is immersed below the liquid level therein, and the solution or impurities remaining on the surface of the tungsten wire 7 are cleaned.

[0066] The ends of the cleaning devices 6 located at the front and rear sides of the heat diffusion device 5 are both provided with air blowing devices, which are blowing nozzles connected to an air source for pressurizing and blowing out hot air to dry the residual water on the surface of the tungsten wire 7 .

[0067] A tungsten wire electroplated brass production method is realized by the above-mentioned tungsten wire electroplated brass production device, comprising the following steps: surface treatment, one water washing, one pickling, two water washings, pre-plating, three water washings, copper plating, four water washings, zinc plating, five water washings, thermal diffusion, two picklings, and six water washings; The surface treatment step comprises: step 1, the tungsten wire passes through the cleaning tank through the first strip hole, and the distance between two adjacent tungsten wires is set to 8-12mm; Furthermore, in step 1 of the surface treatment step, the distance between two adjacent tungsten wires is 10 mm; Step 2: circulate the alkaline solution between the cleaning tank and the first box through the first circulation pipeline; The first delivery pump is started, and the alkaline solution circulates between the electrolytic reaction space and the first box through the first circulation pipeline; The level of alkaline solution in the cleaning tank should be at least 0.5 cm higher than the tungsten wire; Furthermore, in step 2 of the surface treatment step, the alkaline solution is a sodium hydroxide solution with a concentration of 30-100 g / L, a pH value of 10-14, and a temperature set to 50-70° C.; Step 3: Power the plates and adjust the current density in the cleaning tank to 5-20A / dm 2 ; At the same time, the ultrasonic device is powered on, the current is controlled at 1.5-3A, and 30-40KHZ ultrasonic waves are emitted into the alkaline solution; Control line speed to 24.5-25.5m / min; Furthermore, in step 3 of the surface treatment step, the line speed is controlled to be 25 m / min; Pre-plating: Control the tungsten wire speed to 25m / min, and pre-plating a nickel layer on the surface of the tungsten wire, the thickness of the nickel layer is 0.0001-0.0004mm; Furthermore, the nickel layer has a thickness of 0.00015 mm; The copper plating and zinc plating steps both include: step 1, winding at least one tungsten wire on two winding rollers for 7-10 turns, the minimum spacing between two adjacent turns of the same tungsten wire is 4 mm, and the minimum spacing between two adjacent tungsten wires is 8 mm, and after the winding is completed, the line speed is controlled at 3-20 m / min; Furthermore, after the tungsten wire is wound on the winding roller, the speed limit is controlled to be 3m / min, or 11m / min, or 20m / min to avoid the tungsten wire from moving suddenly when power is subsequently turned on, which may cause damage to the tungsten wire; Furthermore, when the tungsten wire is wound on the winding roller, the spacing between two adjacent turns of the same tungsten wire is 5 mm, and they are respectively located in two adjacent winding grooves, and the spacing between two adjacent tungsten wires is 10 mm, that is, there is a winding groove between the two turns that are closest to each other (such as Fig.13 shown); Step 2, circulating the plating solution between the second box and the electrolytic cell through the second circulation pipeline; The plating solution level in the electrolytic cell is at least 0.5 cm higher than the tungsten wire; Step 3, making the tray and the tungsten wire conductive, and controlling the line speed at 25±0.5m / min; Furthermore, in step 3 of the copper plating and zinc plating steps, after the tray and the tungsten wire are made conductive, the line speed is controlled at 24.5 m / min, or 25 m / min, or 25.5 m / min, to ensure that the residence time of the tungsten wire in the plating solution is 60 s, 70 s or 80 s; Thermal diffusion: Heat the tungsten wire at 500-600°C for 3-4s to achieve copper-zinc diffusion on the surface of the tungsten wire and obtain the brass coating required for subsequent drawing. The thickness of the brass coating is greater than 0.001 and less than 0.00125mm. Furthermore, the thickness of the brass plating is 0.0012 mm.

[0068] The plating blocks in the copper plating step are multiple copper blocks, the plating solution is a mixed solution of copper pyrophosphate, potassium pyrophosphate, pyrophosphoric acid and pure water, the copper ion concentration is 27±7g / L, the pH value is 8.3±0.4, the temperature is set at 50±5°C, the concentration ratio of copper ions to pyrophosphate ions in the plating solution is 1:7.5±1, and the thickness of the copper plating layer is 0.001±0.00005mm; In actual use, copper pyrophosphate is mixed with pure water to ensure that the copper ion concentration in the solution is 27±7 g / L, pyrophosphoric acid is used to adjust the pH value of the plating solution to 8.3±0.4, and potassium pyrophosphate is added to adjust the concentration ratio of copper ions to pyrophosphate ions in the plating solution to 1:7.5±1.

[0069] The plating blocks in the galvanizing step are multiple zinc blocks, the plating solution is a zinc sulfate solution prepared by mixing zinc sulfate and pure water, the concentration of the zinc sulfate solution is 225±75g / L, the pH value is 1.4-2.2, the temperature is set at 35±5°C, and the thickness of the galvanized layer is 0.00025±0.00005mm; In actual use, the pH value of the plating solution is adjusted to 1.4-2.2 by adding sulfuric acid into the plating solution.

[0070] The cleaning devices 6 used in the first water washing, second water washing, third water washing, fourth water washing, fifth water washing and sixth water washing are all water washing tanks; the cleaning devices 6 used in the first acid washing and second acid washing are all acid washing tanks; the first water washing step is to use circulating pure water to wash the alkaline solution remaining on the surface of the tungsten wire; the first acid washing step is to use the circulating aminosulfonic acid solution to absorb the alkaline solution remaining on the surface of the tungsten wire, and activate the surface of the tungsten wire at the same time, which is conducive to the subsequent pre-nickel plating; the second water washing step is to use pure water to wash the aminosulfonic acid solution remaining on the surface of the tungsten wire liquid; the three water washing steps are to use the circulating pure water to wash the residual nickel sulfamate plating solution on the surface of the tungsten wire; the four water washing steps are to use the circulating pure water to wash the residual copper pyrophosphate plating solution (i.e. the plating solution during copper plating) on ​​the surface of the tungsten wire; the five water washing steps are to use the circulating pure water to wash the residual zinc sulfate plating solution (i.e. the plating solution during zinc plating) on ​​the surface of the tungsten wire; the secondary pickling step is to use the circulating sulfamate solution to clean the zinc oxide absorbed on the surface of the tungsten wire; the six water washing steps are to use the circulating pure water to clean the residual sulfamate solution on the surface of the tungsten wire.

[0071] The embodiments described above are only preferred embodiments of the present invention and are not intended to limit the scope of implementation of the present invention. Therefore, any equivalent changes or modifications made according to the structures, features and principles described in the patent scope of the present invention should be included in the scope of the patent application of the present invention.

Claims

1. A tungsten wire electroplating brass production device, characterized in that: It comprises a surface treatment device (1), a pre-plating device (2), a copper plating device (3), a galvanizing device (4) and a heat diffusion device (5) which are connected in sequence; A cleaning device (6) is provided between the surface treatment device (1) and the pre-plating device (2), between the pre-plating device (2) and the copper plating device (3), between the copper plating device (3) and the galvanizing device (4), between the galvanizing device (4) and the heat diffusion device (5), and at the rear side of the heat diffusion device (5); and an air blowing device is provided at the end of the cleaning device (6) located at the front and rear sides of the heat diffusion device (5); The surface treatment device (1) comprises two cleaning tanks (11) connected end to end, a first box (12) is arranged below each cleaning tank (11), and a first circulation pipeline is arranged between each cleaning tank (11) and the corresponding first box (12); Each of the cleaning tanks (11) is provided with an ultrasonic device (13) and at least two electrode plates (14), and the electrode plates (14) in the two cleaning tanks (11) are respectively connected to the positive electrode and the negative electrode of a power source; The copper plating device (3) and the zinc plating device (4) both comprise a plating device, each of the plating devices comprises two electrolytic cells (31) arranged vertically, a second box (32) is provided on one side of the electrolytic cell (31), and a second circulation pipeline is provided between the second box (32) and the electrolytic cell (31); Winding rollers (33) are provided at both ends of the electrolytic cell (31), and the tungsten wire (7) is wound between the two winding rollers (33). The tungsten wire (7) extending tangentially along the upper side of the winding roller (33) passes through the upper electrolytic cell (31), and the tungsten wire (7) extending tangentially along the lower side of the winding roller (33) passes through the lower electrolytic cell (31). The winding roller (33) is provided with a plurality of winding grooves (34), and the tungsten wire (7) is sequentially wound on the plurality of winding grooves (34).

2. The tungsten wire electroplating brass production device according to claim 1, characterized in that: Two first partitions (15) are arranged in each cleaning tank (11), two overflow plates (17) are arranged between the two first partitions (15), a plurality of overflow grooves (18) are opened on the upper side of each overflow plate (17), an ultrasonic device (13) is arranged between the two overflow plates (17), and the pole plate (14) is located above the corresponding ultrasonic device (13).

3. The tungsten wire electroplating brass production device according to claim 2, characterized in that: Each cleaning tank (11) is provided with a first end plate (16) at both ends, the two first partition plates (15) are located between the two first end plates (16), and the first partition plates (15) and the first end plates (16) are both provided with a first strip-shaped hole (19); A rotating shaft is provided between adjacent first partition plates (15) and first end plates (16), and a plurality of guide wheels are rotatably sleeved on the rotating shaft, wherein the guide wheels correspond one to one to the plurality of overflow grooves (18).

4. The tungsten wire electroplating brass production device according to claim 2, characterized in that: There is a gap between the ultrasonic device (13) and the inner bottom surface of the cleaning tank (11), and there is a gap between the electrode plate (14) and the ultrasonic device (13); the electrode plate (14) adopts a mesh plate structure, the electrode plate (14) in one of the two cleaning tanks (11) is an anode plate, and the electrode plate (14) in the other cleaning tank (11) is a cathode plate, and the electrode plates in each cleaning tank (11) are arranged at intervals from each other.

5. The tungsten wire electroplating brass production device according to claim 1, characterized in that: Two second partitions (35) are arranged in each electrolytic cell (31), and corresponding second strip holes (36) are opened on the side plates at both ends of the electrolytic cell (31) and the second partitions (35). A plurality of trays (37) are arranged between the two second partitions (35), and a plating block (38) is arranged on the tray (37) and is lower than the second strip holes (36).

6. The tungsten wire electroplating brass production device according to claim 5, characterized in that: There are gaps between the tray (37) and the inner wall of the electrolytic cell (31) and between multiple trays (37); The tray (37) is provided with a partition, a plating block (38) is provided on the partition, and the partition is made of a conductive material; The partition layer is a layered structure made of polypropylene fibers.

7. The tungsten wire electroplating brass production device according to claim 5, characterized in that: At least one second liquid inlet pipe (311) is provided in each electrolytic cell (31), and the second circulation pipeline is connected to the interior of the corresponding electrolytic cell (31) through the second liquid inlet pipe (311). The second liquid inlet pipe (311) is lower than the tray (37) in the electrolytic cell (31) and is provided with a plurality of liquid outlets.

8. A method for producing tungsten wire electroplated brass, characterized in that: The process is realized by a tungsten wire electroplating brass production device as described in any one of claims 3 to 7, comprising the following steps: surface treatment, one water washing, one pickling, two water washings, pre-plating, three water washings, copper plating, four water washings, zinc plating, five water washings, thermal diffusion, two picklings, and six water washings; The surface treatment step comprises: step 1, the tungsten wire passes through the cleaning tank through the first strip hole, and the distance between two adjacent tungsten wires is set to 8-12mm; Step 2: circulate the alkaline solution between the cleaning tank and the first box through the first circulation pipeline; The level of alkaline solution in the cleaning tank should be at least 0.5 cm higher than the tungsten wire; Step 3: Power the plates and adjust the current density in the cleaning tank to 5-20A / dm 2 ; At the same time, the ultrasonic device is powered on, the current is controlled at 1.5-3A, and 30-40KHZ ultrasonic waves are emitted into the alkaline solution; Control line speed to 24.5-25.5m / min; Pre-plating: Control the tungsten wire speed to 25m / min, and pre-plating a nickel layer on the surface of the tungsten wire, the thickness of the nickel layer is 0.0001-0.0004mm; The copper plating and zinc plating steps both include: step 1, winding at least one tungsten wire on two winding rollers for multiple turns, the minimum spacing between two adjacent turns of the same tungsten wire is 4 mm, and the minimum spacing between two adjacent tungsten wires is 8 mm, and after the winding is completed, the line speed is controlled at 3-20 m / min; Step 2, circulating the plating solution between the second box and the electrolytic cell through the second circulation pipeline; The plating solution level in the electrolytic cell is at least 0.5 cm higher than the tungsten wire; Step 3, making the tray and the tungsten wire conductive, and controlling the line speed at 25±0.5m / min; Thermal diffusion: The tungsten wire is heated at 500-600°C for 3-4s to achieve copper-zinc diffusion on the surface of the tungsten wire and obtain the brass coating required for subsequent drawing. The thickness of the brass coating is greater than 0.001 and less than 0.00125mm.

9. The method for producing tungsten wire electroplated brass according to claim 8, characterized in that: In step 1 of the surface treatment step, the distance between two adjacent tungsten wires is 10 mm; In step 2 of the surface treatment step, the alkaline solution is a sodium hydroxide solution with a concentration of 30-100 g / L, a pH value of 10-14, and a temperature set to 50-70° C.; In step 3 of the surface treatment step, the line speed is controlled to be 25 m / min.

10. The method for producing tungsten wire electroplated brass according to claim 8, characterized in that: The plating blocks in the copper plating step are multiple copper blocks, the plating solution is a mixed solution of copper pyrophosphate, potassium pyrophosphate, pyrophosphoric acid and pure water, the copper ion concentration is 27±7g / L, the pH value is 8.3±0.4, the temperature is set at 50±5°C, the concentration ratio of copper ions to pyrophosphate ions in the plating solution is 1:7.5±1, and the thickness of the copper plating layer is 0.001±0.00005mm; The plating blocks in the galvanizing step are multiple zinc blocks, the plating solution is a zinc sulfate solution prepared by mixing zinc sulfate and pure water, the concentration of the zinc sulfate solution is 225±75g / L, the pH value is 1.4-2.2, the temperature is set at 35±5°C, and the thickness of the galvanized layer is 0.00025±0.00005mm; When the tungsten wire is arranged on the winding rod, the distance between two adjacent turns of the same tungsten wire is 5 mm, and the distance between two adjacent tungsten wires is 10 mm.

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