A folded tile extensible phased array front-end architecture, antenna array, and radar

Abstract

The application discloses a kind of folded tile type expandable phased array front-end architecture, antenna array and radar, by multifunctional frame and at least three layers high-density rigid-flex board, each high-density rigid-flex board is connected by multilayer flexible circuit board, at least three layers high-density rigid-flex board includes power board, at least one digital board and at least one radio frequency board;Power board includes patch energy storage capacitor and switching power supply chip respectively pasted on two opposite surfaces;Each digital board is equipped with main control chip on the surface of switching power supply chip side close to power board, and the surface of other side is equipped with analog-digital conversion chip;Each radio frequency board is equipped with at least one frequency conversion module and at least one transceiver module on the surface of analog-digital conversion chip side close to digital board, the application adopts high-density rigid-flex board, surface mount device is mounted on both sides, high-density rigid-flex board is connected using flexible circuit board, and the degree of integration is high, and maintenance cost is low.

Description

Technical Field

[0001] This application relates to the field of phased array radar technology, and in particular to a foldable tile-type scalable phased array front-end architecture, antenna array, and radar. Background Technology

[0002] In recent years, radar and electronic warfare phased array systems have drastically reduced the channel spacing of their antenna arrays to cover higher operating frequency bands. This has led to increased demands for array integration, as the traditional phased array architecture design dimensions can no longer meet application requirements.

[0003] Phased array front-end architectures mainly fall into two categories: blade-type and tile-type. Blade-type front-end architectures employ a vertically integrated design, with internal microwave modules spliced ​​and interconnected via cables. The entire front-end architecture is large, with numerous connectors, and the front dimensions of the components are generally larger than the array antenna aperture. To accommodate smaller-diameter antennas and microwave front-end functional modules, additional antenna extension layers are often required, resulting in increased wiring losses. Current phased array front-end architectures suffer from insufficient array thinness, inability to expand and splice front-end subarrays, low integration levels, and high maintenance costs. Summary of the Invention

[0004] The main purpose of this application is to provide a foldable tile-type scalable phased array front-end architecture, antenna array, and radar, aiming to solve the technical problems of insufficient array thinness, low integration, and high maintenance cost of the current phased array front-end architecture.

[0005] To achieve the above objectives, this application provides a foldable tile-type scalable phased array front-end architecture, comprising: a multifunctional frame and at least three layers of high-density rigid-flex boards inserted within the multifunctional frame, wherein the at least three layers of high-density rigid-flex boards are stacked and connected by multilayer flexible circuit boards, and the at least three layers of high-density rigid-flex boards include a power board, at least one digital board and at least one radio frequency board; the power board includes surface-mount energy storage capacitors and switching power supply chips respectively attached to two opposite surfaces; each digital board has a main control chip on the surface near the switching power supply chip of the power board and an analog-to-digital converter chip on the surface away from the power board; each radio frequency board has at least one frequency conversion module and at least one transceiver module on the surface near the analog-to-digital converter chip of the digital board.

[0006] Optionally, the high-density rigid-flex board includes a flexible circuit board and a rigid board bonded to both sides of the flexible circuit board; wherein, the flexible circuit board uses polyimide material as the core, copper foil is covered on both sides of the polyimide material, and circuit diagrams are etched on the copper foil, and the rigid board is made of FR4 or a high-frequency board doped with ceramic material.

[0007] Optionally, the transceiver module is a dual-stacked module, which includes a multi-channel amplitude and phase modulation chip and a power amplifier transceiver chip.

[0008] Optionally, the multi-channel amplitude and phase modulation chip and the power amplifier transceiver chip are packaged in silicon-based MEMS and formed into the dual-stacked module using BGA stacking technology.

[0009] Optionally, the switching power supply chip, the main control chip, and the analog-to-digital converter chip are all surface-mount packaged.

[0010] Optionally, the multifunctional frame has multiple slots, and each of the high-density rigid-flex plates is inserted into each slot of the multifunctional frame. The multifunctional frame has a flexible radio frequency connector. The device further includes a feed wiring layer and at least one antenna unit that is communicatively connected to one side of the feed wiring layer. The other side of the feed wiring layer is connected to the radio frequency board in the multifunctional frame through the flexible radio frequency connector.

[0011] Optionally, the multifunctional frame also integrates an inlet channel, an outlet channel, a flexible RF through-wall connector, an integrated power supply network, and a high-low frequency hybrid connector. At least two water-cooled plates are inserted into the slots, each water-cooled plate being inserted between two adjacent high-density rigid-flex boards. Each water-cooled plate is connected in series via water pipes to form a heat dissipation group, which is connected in series with the inlet channel and the outlet channel, respectively. The integrated power supply network is connected to the power board and at least one high-density rigid-flex board, and is used to distribute at least one of power signals, control signals, high-speed digital signals, and RF signals to each high-density rigid-flex board. One of the high-density rigid-flex boards has a high-low frequency hybrid plug, which is plugged into the high-low frequency hybrid connector. The flexible RF through-wall connector is used to connect the power supply wiring layer and one high-density rigid-flex board near the power supply wiring layer, respectively.

[0012] In addition, to achieve the above objectives, this application also provides an antenna unit having the foldable tile-type scalable phased array front-end architecture provided in any of the foregoing embodiments.

[0013] In addition, to achieve the above objectives, this application also provides an antenna array having the antenna elements provided in the above embodiments.

[0014] In addition, to achieve the above objectives, this application also provides a radar, characterized in that it has the antenna array provided in the above embodiments.

[0015] This application proposes a foldable tile-type scalable phased array front-end architecture, antenna array, and radar. It utilizes a multi-functional frame and at least three layers of high-density rigid-flex boards (HDBs) inserted within the frame. The HDBs are stacked and connected via multi-layer flexible circuit boards. Each HDB includes a power board, at least one digital board, and at least one radio frequency (RF) board. The power board includes surface-mount energy storage capacitors and switching power supply chips mounted on two opposite surfaces. Each digital board has a main control chip on the surface near the power supply chip and an analog-to-digital converter (ADC) chip on the surface away from the power supply chip. Each RF board has at least one frequency conversion module and at least one transceiver module on the surface near the ADC chip. This application employs flexible circuitry to connect the HDBs, achieving a foldable design and avoiding inter-board interconnects. The HDBs feature surface-mount devices on both sides, resulting in high integration, small size, easy replacement, and low maintenance costs. Attached Figure Description

[0016] Figure 1 A high-density rigid-flex plate is provided for an embodiment of the foldable tile-type scalable phased array front-end architecture of this application;

[0017] Figure 2 A block diagram illustrating the working principle of an embodiment of the foldable tile-type scalable phased array front-end architecture of this application;

[0018] Figure 3 A cross-sectional view of the phased array front-end architecture provided in an embodiment of the foldable tile-type scalable phased array front-end architecture of this application;

[0019] Figure 4 An unfolded diagram of the front-end integrated module provided in an embodiment of the foldable tile-type scalable phased array front-end architecture of this application;

[0020] Figure 5 A cross-sectional view of a heat dissipation structure provided in an embodiment of the foldable tile-type scalable phased array front-end architecture of this application;

[0021] Figure 6 This is a schematic diagram of an antenna array provided for an embodiment of the foldable tile-type scalable phased array front-end architecture of this application.

[0022] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0024] Reference Figure 1 , Figure 2 and Figure 3 The first embodiment of this application provides a foldable tile-type scalable phased array front-end architecture, which may include: a multifunctional frame 10 and at least three layers of high-density rigid-flex boards 20 inserted into the multifunctional frame 10. The at least three layers of high-density rigid-flex boards 20 are stacked, and each high-density rigid-flex board 20 is connected via a multilayer flexible circuit board 30. Each of the at least three layers of high-density rigid-flex boards 20 includes a power board 201, at least one digital board 202, and at least one radio frequency board 203. 201 includes a surface-mount energy storage capacitor 2011 and a switching power supply chip 2012 respectively mounted on two opposite surfaces; each of the digital boards 202 has a main control chip 2022 on the surface of the switching power supply chip 2012 near the power board 201, and an analog-to-digital converter chip 2023 on the surface of the switching power supply chip 2012 away from the power board 201; each of the radio frequency boards 203 has at least one frequency conversion module 2031 and at least one transceiver module 2032 on the surface of the analog-to-digital converter chip 2023 near the digital board 202.

[0025] The multi-functional frame 10 provides flexible radio frequency connections for the antenna and front-end integrated module. At least three high-density rigid-flex boards 20 are stacked, and each high-density rigid-flex board 20 is connected via a multi-layer flexible circuit board 30. Each high-density rigid-flex board 20 includes a power board 201, at least one digital board 202, and at least one radio frequency board 203. The power board 201 includes a patch energy storage capacitor 2011 and a switching power supply chip 2012 respectively attached to two opposite surfaces. Each digital board 202 has a main control chip 2022 on the surface near the switching power supply chip 2012 of the power board 201, and an analog-to-digital converter chip 2023 on the surface away from the power board 201. Each radio frequency board 203 has at least one frequency conversion module 2031 and at least one transceiver module 2032 on the surface near the analog-to-digital converter chip 2023 of the digital board 202.

[0026] refer to Figure 3For example, the front-end integrated module can be composed of a flexible circuit board 30 and a high-density rigid-flex board 20. The three high-density rigid-flex boards 20 are functionally divided into an RF board 203, a digital board 202, and a power board 201. The RF board 203 has an RF contact interface and a high-low frequency hybrid plug on the front, and a transceiver module 2032 and a frequency conversion module 2031 are installed on the back. The digital board 202 has a digital-to-analog converter chip and a main control chip 2022 arranged on the front and back, respectively. The digital-to-analog converter chip can be an AD / DA chip, and the main control chip 2022 can be an FPGA. The power board 201 has a switching power supply chip 2012 and a surface-mount energy storage capacitor 2011 arranged on the front and back, respectively.

[0027] refer to Figure 2 The main function of the foldable tile-type scalable phased array front-end architecture is to convert the received digital baseband signal into a radio frequency (RF) signal and modulate the amplitude and phase information of the RF signal in each transceiver channel to synthesize an electromagnetic beam in a specified direction in space. The front-end signal transmission and reception workflow is as follows: The transceiver module 2032 performs amplitude limiting, amplification, phase shifting, and amplitude weighting operations on the received spatial electromagnetic signal. The signal is then synthesized and converted into a lower intermediate frequency (IF) baseband signal by the frequency converter module 2031. This IF signal is then converted into a digital signal by the analog-to-digital converter chip 2023 (AD chip) and processed in the back-end processing cabinet, completing the signal reception. When transmitting a signal, based on the input digital interference baseband, the digital-to-analog converter chip (DA chip) generates a baseband IF signal. This IF signal enters the frequency converter module 2031 for mixing and filtering to convert the baseband IF to the RF band. The transceiver module 2032 then performs phase shifting, amplitude and phase weighting, and power amplification operations on the RF signal. Finally, the signal is radiated into space through the antenna, forming an electromagnetic beam. During both receiving and transmitting, the main control chip 2022 issues a main control signal to control the coordinated operation of each part.

[0028] In the embodiments of this application, the high-density rigid-flex board 20 includes a flexible circuit board 30 and a rigid board bonded to both sides of the flexible circuit board 30. The flexible circuit board 30 uses polyimide material as its core, copper foil is covered on both sides of the polyimide material, and a circuit pattern is etched on the copper foil. The rigid board is made of FR4 or a high-frequency board doped with ceramic material.

[0029] Specifically, the high-density rigid-flex board 20 uses a flexible polyimide material as its core, covered with copper foil on both sides, and has circuit patterns etched on it. Rigid boards are then bonded to its top and bottom surfaces. These rigid boards are primarily FR4 or high-frequency boards doped with ceramic materials. Repeating this process yields a high-density rigid-flex board 20 with interconnected multilayer flexible circuit boards 30. This high-density rigid-flex board 20, which integrates high and low frequencies, can realize transmission channels for various signal characteristics, achieving functions such as radio frequency signals, low-frequency control signals, high-speed digital signal transmission, and power supply on the three rigid boards. This application utilizes surface-mount devices on the high-density rigid-flex board 20, completing the mounting process in one step, resulting in low manufacturing costs and high assembly efficiency. The folded design of the multilayer flexible circuit board 30 avoids the use of interconnecting connectors between the high-density rigid-flex boards 20, saving layout space.

[0030] In the embodiments of this application, the transceiver module 2032 is a dual-stacked module, and the transceiver module 2032 includes a multi-channel amplitude and phase modulation chip and a power amplifier transceiver chip.

[0031] Specifically, the multi-channel amplitude and phase modulation chip and the power amplifier transceiver chip are packaged in silicon-based MEMS and formed into the dual-stacked module using BGA stacking technology.

[0032] For example, the transceiver module 2032 mainly contains a silicon-based CMOS multi-channel amplitude and phase modulation chip and a power amplifier transceiver chip. The transceiver module 2032 adopts a silicon-based MEMS package to form a dual-stacked module. The first layer encapsulates the channel amplitude and phase modulation chip at the bottom, and the second layer is stacked on the first layer using BGA technology, encapsulating the power amplifier transceiver chip inside, and using the top as a heat dissipation surface.

[0033] In the embodiments of this application, the switching power supply chip 2012, the main control chip 2022, and the analog-to-digital converter chip 2023 are all surface-mount packaged.

[0034] For example, the switching power supply chip 2012, the main control chip 2022, and the analog-to-digital converter chip 2023 can be packaged in surface mount technology (SMT) forms such as QFN (Quad Flat No Leads), BGA (Ball Grid Array), CSP (Chip Scale Package), and SOP (Small Outline Package). During assembly, solder paste is printed on both sides, components are mounted on both sides, and the process is completed in one pass using a nitrogen-protected multi-temperature zone reflow oven, making it suitable for mass production.

[0035] In embodiments of this application, the multifunctional frame 10 has multiple slots 101, and each of the high-density rigid-flex plates 20 is respectively inserted into each slot 101 of the multifunctional frame 10. The multifunctional frame 10 has a flexible radio frequency connector 102. The device further includes: a feed wiring layer 40 and at least one antenna unit 50 communicatively connected to one side of the feed wiring layer 40. The other side of the feed wiring layer 40 is connected to the radio frequency board 203 within the multifunctional frame 10 via the flexible radio frequency connector 102.

[0036] Specifically, the antenna section is mounted at the very front of the multi-functional frame 10, i.e. Figure 3 The top of the antenna can be connected using a flexible connector or a small-sized connector such as an SMP connector. The antenna component consists of an antenna element 50 and a feed wiring layer 40, and can be compatible with various antenna types according to system requirements. The antenna element 50 is mounted on the front of the feed wiring layer 40, and an RF contact interface or a miniature RF interface is reserved on the back. The antenna element 50 can be a printed antenna, a metal aperture antenna, etc. The feed wiring layer 40 carries the connection between the antenna element 50 and the multi-functional frame 10. Its main function is to lead the input antenna excitation port to the corresponding antenna element 50 through internal traces of equal length. This application can be compatible with various antenna types according to system requirements.

[0037] It is worth noting that, due to the high-density device arrangement and folding design employed in this application, the overall planar dimension of the front-end architecture is smaller than the antenna aperture. (Reference) Figure 6 In applications requiring larger arrays, this application can be used to build a large array framework. Specifically, this application can use a generalized front-end structure to assemble and form a larger array front-end component. When repairing and debugging a larger array front-end component assembled from multiple front-end structures, the sub-array unit can be replaced simply by plugging and unplugging, resulting in a simple and neat architecture.

[0038] refer to Figure 4In the embodiments of this application, the multifunctional frame 10 further integrates a water inlet channel 104, a water outlet channel 105, a flexible RF connector 102, an integrated power supply network, and a high-low frequency hybrid connector 106. At least two water-cooled plates 103 are inserted into the slot 101, each water-cooled plate 103 being inserted between two adjacent high-density rigid-flexible composite plates 20. The water-cooled plates 103 are connected in series via water pipes to form a heat dissipation group, which is connected in series with the water inlet channel 104 and the water outlet channel 105, respectively. The integrated power supply network is connected to... Connecting the power board 201 and at least one of the high-density rigid-flex boards 20, the integrated power supply network is used to distribute at least one of power signals, control signals, high-speed digital signals, and radio frequency signals to each of the high-density rigid-flex boards 20; one of the high-density rigid-flex boards 20 has a high-low frequency hybrid plug, which is plugged into the high-low frequency hybrid connector 106; the flexible radio frequency connector 102 is used to connect the power supply wiring layer 40 and one of the high-density rigid-flex boards 20 adjacent to the power supply wiring layer 40, respectively.

[0039] For example, the multi-functional frame 10 can realize the functions of array connection, provide array structure support, provide access to water cooling channels, and provide flexible RF connection between antenna unit 50 and front-end integrated module. The integrated feed network built into the multi-functional frame 10 can provide the distribution of various electrical signals such as power, digital signals, and RF signals. Among them, the power supply link inputs DC high voltage through a high-low frequency mixed plug, transmits it to the power board 201 through the flexible board, the power board 201 converts the input DC high voltage through DC voltage regulation in the power module to obtain various power supply voltages, and then distributes them to the RF board 203 and digital board 202 by the flexible board. The water cooling plate 103 can include a primary water cooling plate and a secondary water cooling plate. There are a total of 5 heat dissipation surfaces available at the front end of the array, including the back of the multi-functional frame 10, the front and back of the primary water cooling plate, and the front and back of the secondary water cooling plate. The RF board 203 and digital board 202, which generate significant heat, are primarily cooled by primary water-cooling plates on both sides. The back of digital board 202 and power board 201 generate less heat and are cooled by secondary water-cooling plates on both sides. (Continue to refer to...) Figure 5Specifically, this application can adopt a two-stage water-cooled plate structure. The main water channel is provided by the multi-functional frame 10, and the water flows into the primary water-cooled plate and the secondary water-cooled plate in series and back into the main water channel. Further, during heat dissipation, the front of the RF board 203 is cooled by contact with the multi-functional frame 10, and the back of the RF board 203 is cooled by contact with the front of the primary water-cooled plate. The front of the digital board 202 is cooled by contact with the back of the primary water-cooled plate, and the back of the digital board 202 is cooled by contact with the front of the secondary water-cooled plate. The front of the power board 201 is cooled by contact with the back of the secondary water-cooled plate. Capacitors are mounted on the back of the power board 201, resulting in less heat, which can be dissipated through through-holes. In other words, this application adopts a folded tile-type array, with the cold-dissipating surface and the printed circuit board's heating surface arranged alternately. The heating devices can dissipate heat on both sides, with the top contacting the cold surface for heat dissipation and the bottom contacting the cold surface through a heat conduction channel, thereby significantly improving heat dissipation efficiency.

[0040] Based on the above embodiments, this application also proposes an antenna array having a foldable tile-type scalable phased array front-end architecture as provided in any of the foregoing embodiments, with reference to... Figure 6 , Figure 6 This refers to a large array framework, i.e., an antenna array, built using the front-end architecture of a phased array.

[0041] Based on the above embodiments, this application also proposes a radar having the antenna array provided in the above embodiments.

[0042] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A foldable tile-type scalable phased array front-end architecture, characterized in that, include: A multifunctional frame and at least three high-density rigid-flex boards inserted into the multifunctional frame, wherein the at least three high-density rigid-flex boards are stacked and each of the high-density rigid-flex boards is connected by a multi-layer flexible circuit board, and the at least three high-density rigid-flex boards include a power board, at least one digital board and at least one radio frequency board. The power board includes surface-mount energy storage capacitors and switching power supply chips respectively attached to two opposite surfaces. Each of the digital boards has a main control chip on the surface of the switching power supply chip side close to the power board, and an analog-to-digital converter chip on the surface of the switching power supply chip side away from the power board. Each of the radio frequency boards has at least one frequency conversion module and at least one transceiver module on the surface of the analog-to-digital conversion chip side near the digital board; The multifunctional frame has multiple slots, and each of the high-density rigid-flex plates is respectively inserted into the slots of the multifunctional frame. The multifunctional frame has a flexible radio frequency connector. The foldable tile-type scalable phased array front-end architecture also includes: The feed wiring layer and at least one antenna unit are communicatively connected to one side of the feed wiring layer, and the other side of the feed wiring layer is connected to the radio frequency board within the multifunctional frame via the flexible radio frequency connector.

2. The foldable tile-type scalable phased array front-end architecture as described in claim 1, characterized in that, The high-density rigid-flex board includes a flexible circuit board and a rigid board bonded to both sides of the flexible circuit board. The flexible circuit board uses polyimide material as its core, with copper foil covering both sides of the polyimide material and circuit diagrams etched on the copper foil. The rigid board is made of FR4 or a high-frequency board doped with ceramic material.

3. The foldable tile-type scalable phased array front-end architecture as described in claim 1, characterized in that, The transceiver module is a dual-stacked module, which includes a multi-channel amplitude and phase modulation chip and a power amplifier transceiver chip.

4. The foldable tile-type scalable phased array front-end architecture as described in claim 3, characterized in that, The multi-channel amplitude and phase modulation chip and the power amplifier transceiver chip are packaged in silicon-based MEMS and formed into the dual-stacked module using BGA stacking technology.

5. The foldable tile-type scalable phased array front-end architecture as described in claim 1, characterized in that, The switching power supply chip, the main control chip, and the analog-to-digital converter chip are all surface-mount packaged.

6. The foldable tile-type scalable phased array front-end architecture as described in claim 1, characterized in that, The multifunctional frame also integrates a water inlet channel, a water outlet channel, a flexible radio frequency through-wall connector, a comprehensive power supply network, and a high- and low-frequency hybrid connector. At least two water-cooled plates are also inserted into the slot, with each water-cooled plate inserted between two adjacent high-density rigid-flex plates. Each of the water-cooled plates is connected in series by water pipes to form a heat dissipation group, and the heat dissipation group is connected in series with the water inlet channel and the water outlet channel respectively; The integrated power supply network connects to at least one of the high-density rigid-flex plates, and the integrated power supply network is used to distribute at least one of power signals, control signals, high-speed digital signals, and radio frequency signals to each of the high-density rigid-flex plates. One of the high-density rigid-flex plates has a high-low frequency hybrid plug, which is plugged into the high-low frequency hybrid connector. The flexible RF through-wall connector is used to connect the feed wiring layer and a high-density rigid-flex board near the feed wiring layer, respectively.

7. An antenna array, characterized in that, It has a foldable tile-type scalable phased array front-end architecture as described in any one of claims 1 to 6.

8. A radar, characterized in that, It has the antenna array as described in claim 7.

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