Method and device for testing temperature control performance of server

Abstract

This application provides a method for testing server temperature control performance. The method includes: responding to a target test request for the server and obtaining the server's business information; converting the business information into component operation information of the server components during the business process indicated by the business information; configuring fault information of the heat dissipation components in the server based on the component operation information and the temperature information of the server components; detecting the server's operating temperature information while controlling the operation of the server components according to the component operation information and controlling the operation of the heat dissipation components according to the fault information; and predicting the target temperature control performance of the server under heat dissipation failure conditions based on the operating temperature information. This application solves the problem of low testing efficiency for server temperature control performance in related technologies, thereby improving the testing efficiency for server temperature control performance.

Description

Technical Field

[0001] This application relates to the field of computers, and more specifically, to a method and apparatus for testing the temperature control performance of a server. Background Technology

[0002] Driven by cloud computing and big data, the improvement of server performance and power consumption has become a significant trend in the IT industry. However, the increased power consumption of high-performance servers also brings heat dissipation challenges. In particular, when the cooling system fails, the abnormal rise in internal server temperature can lead to serious safety issues. Therefore, testing the temperature control performance of servers under extreme environments is crucial for improving server stability and security. In related technologies, to test whether a server meets safety regulations after a heat dissipation failure during business operations, a method is often based on experience to select some fans in the server and lock them to simulate a heat dissipation failure. However, this simulation scenario is relatively simple and relies on experience, resulting in low efficiency in testing server temperature control performance. Summary of the Invention

[0003] This application provides a method and apparatus for testing server temperature control performance, which at least solves the problem of low testing efficiency for server temperature control performance in related technologies.

[0004] According to one embodiment of this application, a method for testing server temperature control performance is provided, comprising:

[0005] In response to a target test request for the server, the service information of the server is obtained, wherein the target test request is used to request a test of the temperature control performance of the server under a heat dissipation failure state, and the service information is used to indicate the business conditions that the server is allowed to handle;

[0006] Based on the business information, component operation information of the server component during the process of handling the business indicated by the business information is converted, wherein the component operation information is used to indicate the temporal changes in the operating status of the server component;

[0007] The fault information of the heat dissipation component in the server is configured according to the component operation information and the temperature information of the server component, wherein the fault information is used to indicate the fault status of the heat dissipation component during operation, and the temperature information is used to indicate the operating temperature of the server component under different operating conditions;

[0008] During the process of controlling the operation of the server components according to the component operation information and controlling the operation of the heat dissipation components according to the fault information, the operating temperature information of the server is detected;

[0009] Predict the target temperature control performance of the server under heat dissipation failure conditions based on the operating temperature information.

[0010] Optionally, configuring the fault information of the heat dissipation components in the server based on the component operating information and the temperature information of the server components includes:

[0011] The target operating state when the operating temperature is greater than or equal to a set temperature is determined from the temperature mapping relationship of each target component included in the plurality of server components, wherein the temperature mapping relationship records the correlation between the operating state of the server component and the operating temperature, and the temperature information includes the temperature mapping relationship;

[0012] Select a target heat dissipation component from the plurality of heat dissipation components for dissipating heat from the target component;

[0013] Configure the downtime of each target heat dissipation component according to the component operation information, wherein the fault information includes the downtime.

[0014] Optionally, configuring the downtime of each target heat dissipation component based on the component operation information includes:

[0015] Extract the running time of the target component in the target running state from the component running information; configure the running time as the downtime of the target heat dissipation component.

[0016] Optionally, configuring the fault information of the heat dissipation components in the server based on the component operating information and the temperature information of the server components includes:

[0017] The temperature mapping relationship of the server component is used to convert the reference temperature corresponding to multiple reference operating states included in the component operation information of the server component. The temperature mapping relationship records the correlation between the operating state of the server component and the operating temperature. The temperature information includes the temperature mapping relationship.

[0018] The temperature change information of the server component is constructed according to the time sequence of changes in the reference operating state indicated by the component operating information, wherein the temperature information records the relationship between the operating temperature of the server component and the change over time.

[0019] The temperature change information is input into the target prediction model to obtain the temperature field distribution information inside the server during the operation of the server component. The target prediction model records the influence relationship between temperature and the airflow distribution inside the server. The temperature field distribution information is used to indicate the relationship between the temperature distribution inside the server and time during the operation of the server component.

[0020] The downtime of each heat dissipation component is configured according to the temperature field distribution information, wherein the fault information includes the downtime.

[0021] Optionally, the step of converting the server component's component operation information during the process of handling the business indicated by the business information based on the business information includes:

[0022] The target load status of the server components is detected during the process of the server processing the business indicated by the business information. The target load status is the operating state in which the load of the server components is greater than or equal to the target load during the process of the server processing the business indicated by the business information.

[0023] The target load state is determined as a candidate operating state of the server component in the process of handling the business indicated by the business information, and the component operating information includes the candidate operating state.

[0024] Optionally, after detecting the operating temperature information of the server, the method further includes:

[0025] The internal operating temperature of the server is matched with the protection temperature of the server components, wherein the server components trigger a shutdown protection function when the temperature of the server components exceeds the protection temperature.

[0026] When the operating temperature inside the server is greater than or equal to the protection temperature, the shutdown protection function controlling the server component is disabled.

[0027] Optionally, predicting the target temperature control performance of the server under heat dissipation failure conditions based on the operating temperature information includes:

[0028] Match the maximum operating temperature in the operating temperature information with the temperature threshold configured for the server;

[0029] If the maximum operating temperature in the operating temperature information is less than or equal to the temperature threshold, it is determined that the target temperature control performance of the server meets the temperature control performance requirements of the server.

[0030] According to another embodiment of this application, a test apparatus for server temperature control performance is provided, comprising:

[0031] The acquisition module is used to respond to a target test request to the server and acquire the server's business information. The target test request is used to request a test of the server's temperature control performance under heat dissipation failure conditions, and the business information is used to indicate the business conditions that the server is allowed to handle.

[0032] The conversion module is used to convert the server component's component operation information during the process of handling the business indicated by the business information, wherein the component operation information is used to indicate the temporal changes in the operating status of the server component;

[0033] A configuration module is used to configure fault information of the heat dissipation component in the server according to the component operation information and the temperature information of the server component, wherein the fault information is used to indicate the fault state of the heat dissipation component during operation, and the temperature information is used to indicate the operating temperature of the server component under different operating states;

[0034] The detection module is used to detect the operating temperature information of the server during the process of controlling the operation of the server component according to the component operation information and controlling the operation of the heat dissipation component according to the fault information.

[0035] The prediction module is used to predict the target temperature control performance of the server under heat dissipation failure conditions based on the operating temperature information.

[0036] According to yet another embodiment of this application, a computer-readable storage medium is also provided, wherein a computer program is stored therein, and the computer program is configured to perform the steps in any of the above method embodiments when it is run.

[0037] According to yet another embodiment of this application, an electronic device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.

[0038] This application addresses the issue of low testing efficiency for server temperature control performance under thermal failure conditions by responding to a test request. It acquires business information indicating the permitted business operations of the server, then converts this information into component operation information indicating the temporal changes in the server components' operating status during business operations. Based on the business information and temperature information indicating the operating temperature of server components under different operating states, it configures fault information for the server's heat dissipation components to indicate their failure states during operation. This simulates a heat dissipation component failure during business operations. The application then controls the operation of server components and the heat dissipation components according to the component operation information and the fault information, while simultaneously monitoring the server's operating temperature. Based on this temperature information, it predicts the target temperature control performance of the server under thermal failure conditions. By simulating real thermal failures during business operations, the application tests the server's temperature control performance under thermal failure conditions, making the tested performance more consistent with the server's actual state. Therefore, it solves the problem of low testing efficiency for server temperature control performance in related technologies, thus improving the efficiency of server temperature control performance testing. Attached Figure Description

[0039] Figure 1 This is a hardware structure block diagram of a server device for a server temperature control performance testing method according to an embodiment of this application;

[0040] Figure 2 This is a flowchart of a method for testing server temperature control performance according to an embodiment of this application;

[0041] Figure 3 This is a flowchart of a server safety temperature rise test method based on BMC control strategy according to an embodiment of this application;

[0042] Figure 4 This is a structural block diagram of a server temperature control performance testing device according to an embodiment of this application. Detailed Implementation

[0043] The embodiments of this application will be described in detail below with reference to the accompanying drawings and examples.

[0044] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0045] The methods and embodiments provided in this application can be executed on a server device or a similar computing device. Taking running on a server device as an example, Figure 1This is a hardware structure block diagram of a server device for a server temperature control performance testing method according to an embodiment of this application. (See diagram below.) Figure 1 As shown, the server device may include one or more ( Figure 1 Only one is shown in the diagram. A processor 102 (which may include, but is not limited to, a microprocessor MCU or a programmable logic device FPGA, etc.) and a memory 104 for storing data are also shown. The server device may further include a transmission device 106 for communication functions and an input / output device 108. Those skilled in the art will understand that... Figure 1 The structure shown is for illustrative purposes only and does not limit the structure of the server equipment described above. For example, the server equipment may also include components that are more... Figure 1 The more or fewer components shown, or having the same Figure 1 The different configurations shown.

[0046] The memory 104 can be used to store computer programs, such as application software programs and modules, like the computer program corresponding to the server temperature control performance testing method in this embodiment. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, thus implementing the above-described method. The memory 104 may include high-speed random access memory and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may further include memory remotely located relative to the processor 102, and these remote memories can be connected to the server device via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0047] The transmission device 106 is used to receive or send data via a network. Specific examples of the network described above may include a wireless network provided by a communication provider for the server device. In one example, the transmission device 106 includes a Network Interface Controller (NIC), which can connect to other network devices via a base station to communicate with the Internet. In another example, the transmission device 106 may be a Radio Frequency (RF) module used for wireless communication with the Internet.

[0048] This embodiment provides a method for testing the temperature control performance of a server. Figure 2 This is a flowchart of a server temperature control performance testing method according to an embodiment of this application, such as... Figure 2 As shown, the process includes the following steps:

[0049] Step S202: Respond to the target test request for the server and obtain the service information of the server, wherein the target test request is used to request a test of the temperature control performance of the server under heat dissipation failure state, and the service information is used to indicate the business conditions that the server is allowed to handle;

[0050] Step S204: Based on the business information, extract the component operation information of the server component during the process of handling the business indicated by the business information, wherein the component operation information is used to indicate the temporal changes in the operating status of the server component;

[0051] Step S206: Configure the fault information of the heat dissipation component in the server according to the component operation information and the temperature information of the server component, wherein the fault information is used to indicate the fault status of the heat dissipation component during operation, and the temperature information is used to indicate the operating temperature of the server component under different operating states.

[0052] Step S208: During the process of controlling the operation of the server component according to the component operation information and controlling the operation of the heat dissipation component according to the fault information, the operating temperature information of the server is detected.

[0053] Step S210: Predict the target temperature control performance of the server under heat dissipation failure state based on the operating temperature information.

[0054] Through the above steps, by responding to test requests for server temperature control performance under thermal failure conditions, business information indicating the permitted business operations of the server is obtained. Then, component operation information indicating the temporal changes in the server components' operating status during business operations is derived from this business information. Furthermore, based on the business information and temperature information indicating the operating temperature of server components under different operating states, fault information indicating fault states of the heat dissipation components during operation is configured for them. This simulates a fault in the server's heat dissipation components during business operations. The server components are controlled according to the component operation information, and the heat dissipation components are controlled according to the fault information. During this process, the server's operating temperature is monitored, and the target temperature control performance of the server under thermal failure conditions can be predicted based on this temperature information. Therefore, by simulating real thermal failures during server business operations, the server's temperature control performance under thermal failure conditions is tested, making the tested temperature control performance more consistent with the server's actual state. Thus, this solves the problem of low testing efficiency for server temperature control performance in related technologies, achieving a significant improvement in testing efficiency.

[0055] In the embodiment provided in step S202 above, by testing the temperature control performance of the server under heat dissipation failure, the server's temperature control capability under extreme conditions can be effectively evaluated, and the heat dissipation bottlenecks and potential heat dissipation design problems of the server under high load conditions can be revealed. In turn, the server heat dissipation system design can be optimized based on the test results, the server's thermal management performance can be improved, and its stability and security can be ensured under various business scenarios.

[0056] Optionally, in this embodiment, the business information is used to indicate the types of business that the server is allowed to handle, such as running large models, transmitting data, storing data, and maintaining status. Then, based on different usage requirements of the server, the temperature control performance of the server when a heat dissipation failure occurs in different business scenarios is tested.

[0057] In the embodiment provided in step S204 above, component operation information is used to indicate the running time of server components and the business load of server components in various time periods. Based on the business information, component operation information of server components in processing specific business processes is derived. Essentially, this involves analyzing the business characteristics of the server's current business at different processing stages to predict the load of each key component involved in the business processing within the server at different points in time. For example, the server's business information indicates that the business it is processing is running an image recognition algorithm based on a deep neural network. This task begins after the server starts and continues to run for 24 hours, including three stages: data preprocessing, model training, and result verification. Based on this business information, it can be deduced that: in the first hour, the CPU is used for data preprocessing, such as image decoding, format conversion, and dataset preparation, at which time the CPU is under medium load; in the next 18 hours, the image recognition model enters the intensive training stage, at which time the GPU is responsible for the main computing tasks, while the CPU is responsible for coordination and control, and the load of both the GPU and CPU reaches its peak; in the 3 hours after training ends, the server enters the result verification and model optimization stage, at which time the CPU load decreases, while the GPU still maintains a high load for image recognition post-processing and model performance evaluation.

[0058] In the embodiment provided in step S206 above, the fault information is used to indicate the temporal relationship of the fault status of the heat dissipation components in the server, that is, the fault type of each heat dissipation component in the server and the time when the fault occurs. The fault type of the heat dissipation component can be complete shutdown (such as fan stoppage, complete blockage of air outlets, interruption of coolant circulation, etc.) or reduced heat dissipation performance (such as reduced fan speed, partial blockage of air outlets, reduced coolant circulation flow rate, etc.). When configuring the fault information of the heat dissipation components in the server, the fault type will be preferentially set to complete shutdown of the heat dissipation component to simulate the temperature control performance of the server under extreme conditions. The time when the heat dissipation component fails can be set according to the time of server business processing or the business load of the server during business processing. For example, the time when the heat dissipation component fails can be at the start time of business processing or when the load reaches a certain threshold during business processing. This solution does not limit this.

[0059] Optionally, in this embodiment, the temperature information of the server component is used to indicate the operating temperature of the server component under different operating states. The server component usually has a lower temperature under low load and a higher temperature under high load. For example (taking the CPU as an example), when the CPU is processing regular data transmission or data storage services, its load is usually low and the temperature is usually between 45-65°C. However, when processing a large amount of data or running complex tasks (such as processing a large number of high-concurrency services), its load will increase significantly, resulting in a higher operating temperature, which can reach 75-80°C.

[0060] Optionally, in this embodiment, the fault information of the heat dissipation components in the server is configured according to the component operation information and the temperature information of the server components. This can simulate the failure of the heat dissipation components under specific business loads and time points of the server to evaluate the server's real temperature control performance and coping strategies. For example, when the server is performing periodic database backup operations, the load on the hard disk and network interface will increase significantly between 12:00 am and 2:00 am. During this period, the failure of fan speed reduction or fan stoppage can be simulated to test the server's heat dissipation capacity and emergency handling mechanism under data-intensive operations.

[0061] In the embodiment provided in step S208 above, while controlling the server components to operate according to the operating state indicated by the business information, and simultaneously controlling the heat dissipation components to operate according to the set fault information, the system will monitor and record the server's operating temperature information in real time. The server's operating temperature can be detected by installing a temperature sensor inside the server, or by attaching thermal coupling wires to various locations on the server. This solution does not limit this to either method.

[0062] In the embodiment provided in step S210 above, the server's operating temperature information can be the temperature rise curve of the server components. Based on the collected operating temperature information, the server's temperature control performance under heat dissipation failure can be predicted. The temperature value corresponding to the highest point of the temperature rise curve of the server components can be compared with the temperature limit value required by the safety standard. If the temperature value corresponding to the highest point of the temperature rise curve is less than the temperature limit value required by the safety standard, it is considered that the server's temperature control performance under heat dissipation failure meets the safety requirements.

[0063] As an optional embodiment, configuring the fault information of the heat dissipation component in the server based on the component operating information and the temperature information of the server component includes:

[0064] The target operating state when the operating temperature is greater than or equal to a set temperature is determined from the temperature mapping relationship of each target component included in the plurality of server components, wherein the temperature mapping relationship records the correlation between the operating state of the server component and the operating temperature, and the temperature information includes the temperature mapping relationship;

[0065] Select a target heat dissipation component from the plurality of heat dissipation components for dissipating heat from the target component;

[0066] Configure the downtime of each target heat dissipation component according to the component operation information, wherein the fault information includes the downtime.

[0067] Optionally, in this embodiment, the temperature mapping relationship records the operating temperature of the server component under different operating states (such as idle, low load, high load, etc.), and determines the target operating state when the operating temperature is greater than or equal to the set temperature based on the temperature mapping relationship. The target operating state is used to indicate the working condition of the server component under high load, high power consumption or high heat generation, so as to control the fault state of the heat dissipation component when the server component is operating under high load, so as to test the temperature control performance of the server under extreme conditions.

[0068] Optionally, in the embodiments of this application, the server typically includes multiple heat dissipation components. The physical connection between different heat dissipation components and the target component may be different. Therefore, it is necessary to select the target heat dissipation component that directly acts on the target component from among the multiple heat dissipation components based on the physical connection relationship between the heat dissipation components and the target component. Then, the downtime of each target heat dissipation component is configured according to the component operation information, so as to simulate the temperature control performance of the server component under the target operation state when the heat dissipation equipment is shut down (such as the fan stops or the heat sink is blocked).

[0069] By configuring the heat dissipation components based on the above methods and the component operation information and temperature information, the temperature control performance of the server under extreme conditions can be evaluated more accurately. Furthermore, by screening the target heat dissipation components based on the physical connection relationship between the heat dissipation components and the target components, it is possible to determine which heat dissipation components are most critical to the temperature control of the target components. This allows for a more reasonable allocation of server resources, avoids comprehensive testing of the entire heat dissipation system, and improves the testing efficiency of server temperature control performance.

[0070] As an optional embodiment, configuring the downtime of each target heat dissipation component based on the component operation information includes:

[0071] Extract the running time of the target component in the target running state from the component running information; configure the running time as the downtime of the target heat dissipation component.

[0072] Optionally, in this embodiment of the application, the component operation information records the operating time periods corresponding to different operating states of each server component. Then, the operating time period corresponding to the target component being in the peak business load period (target operating state) can be extracted from the component operation information, and the operating time of the target component in the high load state can be determined as the downtime of the heat dissipation component.

[0073] By using the above method, based on the downtime of each target heat dissipation component according to the component operation information, the real scenario of the server encountering heat dissipation failure during peak business periods can be accurately simulated, improving the accuracy and practicality of server temperature control performance testing.

[0074] As an optional embodiment, configuring the fault information of the heat dissipation component in the server based on the component operating information and the temperature information of the server component includes:

[0075] The temperature mapping relationship of the server component is used to convert the reference temperature corresponding to multiple reference operating states included in the component operation information of the server component. The temperature mapping relationship records the correlation between the operating state of the server component and the operating temperature. The temperature information includes the temperature mapping relationship.

[0076] The temperature change information of the server component is constructed according to the time sequence of changes in the reference operating state indicated by the component operating information, wherein the temperature information records the relationship between the operating temperature of the server component and the change over time.

[0077] The temperature change information is input into the target prediction model to obtain the temperature field distribution information inside the server during the operation of the server component. The target prediction model records the influence relationship between temperature and the airflow distribution inside the server. The temperature field distribution information is used to indicate the relationship between the temperature distribution inside the server and time during the operation of the server component.

[0078] The downtime of each heat dissipation component is configured according to the temperature field distribution information, wherein the fault information includes the downtime.

[0079] Optionally, in this embodiment of the application, multiple reference operating states are extracted from the component operating information, and then the reference operating states are converted into corresponding reference temperatures according to the temperature mapping relationship. The temperature change information of the server components is constructed by combining the change sequence of the reference temperatures and reference operating states. The temperature change information records the temperature change trend and actual temperature value of each component of the server at different time points.

[0080] Optionally, in this embodiment, a target prediction model is constructed using thermodynamic and fluid dynamic principles, combined with actual data on the internal airflow distribution of the server. This model can consider factors such as the location of heat dissipation components, airflow direction, and heat conduction path to predict the temperature field distribution inside the server. The target prediction model can be constructed through the following steps: S1: Acquire infrared images of the server under operating conditions using an infrared thermal imager to obtain real-time data on the thermal state of the server surface; S2: Collect server runtime sequence information, including CPU utilization, memory usage, and hard drive read / write frequency, which reflects the operating status and heat generation changes of server components; S3: Establish a heat dissipation model based on the server's internal layout and the power consumption and temperature requirements of its components. The model includes the CPU, memory, and hard drive. Simulation software is used to analyze the server's heat dissipation system to obtain the temperature distribution and airflow distribution inside the server under different temperature changes. This data is then used as a sample to train the initial prediction model to obtain the target prediction model. Temperature change information is then input into the target prediction model to obtain the temperature field distribution information inside the server during the operation of the server components, output by the target prediction model.

[0081] Optionally, in this embodiment of the application, the temperature field distribution information characterizes the relationship between the internal temperature distribution of the server and the change over time. Therefore, the locations where the temperature is greater than or equal to the target temperature value in each time period are extracted, and the target heat dissipation device for dissipating heat at that location is selected from multiple heat dissipation devices. Thus, the target heat dissipation device is configured to be in a shutdown state during that time period, that is, the time period is the shutdown time of the target heat dissipation device.

[0082] By constructing a target prediction model that records the relationship between temperature and the distribution of airflow within the server, the influence of factors such as the location of heat dissipation components, airflow direction, and heat conduction path on the heat dissipation performance of the heat dissipation equipment can be further considered. This improves the accuracy of configuring fault information of heat dissipation components and enhances the testing efficiency and accuracy of server temperature control performance.

[0083] As an optional embodiment, the step of converting the server component's component operation information during the process of handling the business indicated by the business information, based on the business information, includes:

[0084] The target load status of the server components is detected during the process of the server processing the business indicated by the business information. The target load status is the operating state in which the load of the server components is greater than or equal to the target load during the process of the server processing the business indicated by the business information.

[0085] The target load state is determined as a candidate operating state of the server component in the process of handling the business indicated by the business information, and the component operating information includes the candidate operating state.

[0086] Optionally, in this embodiment, the target load is typically the load corresponding to a high load on a server component during business processing. When the load on a server component reaches or exceeds the target load, it is considered to be in the target load state, which indicates that the component may face the risk of overheating. Therefore, the target load state is determined as a candidate operating state of the server component during the business process indicated by the business information.

[0087] The above methods can accurately identify and record the operating status of server components when handling high-load business based on business information, which helps to test the temperature control performance of the server under extreme operating conditions.

[0088] As an optional embodiment, after detecting the operating temperature information of the server, the method further includes:

[0089] The internal operating temperature of the server is matched with the protection temperature of the server components, wherein the server components trigger a shutdown protection function when the temperature of the server components exceeds the protection temperature.

[0090] When the operating temperature inside the server is greater than or equal to the protection temperature, the shutdown protection function controlling the server component is disabled.

[0091] Optionally, in this embodiment, the protection temperature of the server component is used to indicate the temperature at which the server component triggers the overheat protection mechanism. When the internal operating temperature of the server is greater than or equal to the protection temperature, the shutdown protection function of the server component is disabled. This can simulate the temperature control performance of the server under polling function failure conditions and avoid interrupting the test process due to frequent triggering of the overheat protection mechanism.

[0092] The above methods can further simulate the server's temperature control performance when the polling function fails, thereby further improving the testing efficiency of the server's temperature control performance under extreme conditions.

[0093] As an optional embodiment, predicting the target temperature control performance of the server under a heat dissipation failure state based on the operating temperature information includes:

[0094] Match the maximum operating temperature in the operating temperature information with the temperature threshold configured for the server;

[0095] If the maximum operating temperature in the operating temperature information is less than or equal to the temperature threshold, it is determined that the target temperature control performance of the server meets the temperature control performance requirements of the server.

[0096] Optionally, as an alternative implementation, the temperature threshold configured for the server is the highest temperature that the server can withstand under normal operating conditions. The temperature threshold configured for the server can be the temperature limit value required by safety standards. Then, the maximum operating temperature in the operating temperature information is compared with the temperature threshold to evaluate whether the temperature control performance of the server under heat dissipation failure conditions meets the requirements. If the maximum operating temperature is less than or equal to the temperature threshold, it means that the maximum temperature of the server under normal operating conditions is still within the controllable range. Even if the heat dissipation system fails partially, the server can still maintain a safe temperature level through the remaining heat dissipation capacity or other thermal management strategies (such as frequency reduction, load reduction, etc.).

[0097] By comparing the maximum operating temperature with the temperature threshold in the operating temperature information using the above method, the temperature control performance of the server under heat dissipation failure can be accurately evaluated, which helps to improve the thermal management efficiency of the server and optimize the heat dissipation design of the server system.

[0098] As an optional embodiment, this application also provides a server safety temperature rise test method based on BMC control strategy, which aims to effectively assess the safety risks of servers under extreme and harsh conditions, avoid the risk of burns, fires and other safety risks caused by servers encountering extreme abnormal conditions during operation, and ultimately ensure the safety of servers, computer rooms and personnel.

[0099] Figure 3This is a flowchart of a server safety temperature rise test method based on a BMC control strategy according to an embodiment of this application, as shown below. Figure 3 As shown:

[0100] (1) Turn off the temperature polling function of BMC, and perform fan blocking and chassis hole blocking operations in sequence (block one fan or block one chassis side at a time). At this time, the remaining blocked fans will not increase their speed because the temperature polling function is turned off. The temperature of each component in the server chassis will gradually rise. Record the temperature rise curve of the accessible components of the server until the temperature curve stabilizes.

[0101] Judgment method: Compare whether the highest temperature of the accessible parts exceeds the temperature limit required by the safety standard.

[0102] (2) Activate the BMC temperature polling function, simultaneously shut down all fans, and block all openings on all sides of the chassis. Observe the server's operating status and record the temperature rise curves of accessible components until the temperature curves stabilize. Since the testing conditions are quite stringent when all fans and ventilation holes are blocked, the server may automatically shut down. This is because CPUs are generally designed to automatically power off at high temperatures, and temperature thresholds are set. Additionally, some servers' BMC temperature polling function is set to automatically shut down the system when a component or chip exceeds a set temperature threshold. Of course, it's also possible that due to the server's limited functionality, even with all fans and ventilation holes blocked, the server may not shut down for an extended period; therefore, it's still necessary to record the temperature rise curves during the test.

[0103] Determination method: Observe whether the server automatically shuts down for protection. If automatic shutdown protection is not activated, read the stable temperature value and compare it with the maximum temperature of accessible components to see if it exceeds the temperature limit required by safety standards.

[0104] This methodology is designed to be applicable to all server products. It assesses server security risks under harsh anomaly and failure conditions, ultimately ensuring server operational reliability.

[0105] The following detailed implementation method will further illustrate this solution:

[0106] 1. Thermal coupling wires for all accessible components of the server.

[0107] 2. Block the server fans one at a time.

[0108] 3. Power on the server and disable the BMC temperature polling function.

[0109] 4. Run the test software to put the server at full power consumption.

[0110] 5. Observe the server's operating status until the temperature rise curve stabilizes, and then record all temperature data.

[0111] 6. Block the ventilation holes of the server chassis, blocking only one side at a time.

[0112] 7. Run the test software to put the server at full power consumption.

[0113] 8. Observe the server's operating status until the temperature rise curve stabilizes, and then record all temperature data.

[0114] 9. Enable the temperature polling function of BMC.

[0115] 10. Block all the server fans at once.

[0116] 11. Run the test software to put the server at full power consumption.

[0117] 12. Observe the server's operating status until the temperature rise curve stabilizes, and then record all temperature data.

[0118] 13. Seal off all the ventilation openings on all sides of the server chassis at once.

[0119] 14. Run the test software to put the server at full power consumption.

[0120] 15. Observe the server's operating status to see if the server automatically shuts down.

[0121] This solution combines all test conditions to determine whether the server meets the temperature rise safety requirements under abnormal and fault conditions, thereby ensuring that the company's products meet the product safety requirements under abnormal and fault conditions, preventing accidents such as fires, and maximizing the server's heat dissipation performance so that the server can operate with greater continuous power consumption without failure.

[0122] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0123] This embodiment also provides a server temperature control performance testing device, which is used to implement the above embodiments and preferred embodiments; details already described will not be repeated. As used below, the term "module" can refer to a combination of software and / or hardware that performs a predetermined function. Although the device described in the following embodiments is preferably implemented in software, hardware implementation, or a combination of software and hardware, is also possible and contemplated.

[0124] Figure 4 This is a structural block diagram of a server temperature control performance testing device according to an embodiment of this application, as shown below. Figure 4 As shown, the device includes:

[0125] The acquisition module 402 is used to respond to a target test request to the server and acquire the service information of the server, wherein the target test request is used to request a test of the temperature control performance of the server under heat dissipation failure conditions, and the service information is used to indicate the business conditions that the server is allowed to handle;

[0126] The conversion module 404 is used to convert the server component's component operation information during the process of handling the business indicated by the business information based on the business information, wherein the component operation information is used to indicate the temporal changes in the operating status of the server component;

[0127] Configuration module 406 is used to configure fault information of heat dissipation component in server according to component operation information and temperature information of server component, wherein the fault information is used to indicate the fault state of heat dissipation component during operation, and the temperature information is used to indicate the operating temperature of server component under different operating states;

[0128] The detection module 408 is used to detect the operating temperature information of the server during the process of controlling the operation of the server component according to the component operation information and controlling the operation of the heat dissipation component according to the fault information.

[0129] The prediction module 410 is used to predict the target temperature control performance of the server under heat dissipation failure state based on the operating temperature information.

[0130] Through the aforementioned device, by responding to a test request for the server's temperature control performance under a heat dissipation failure state, business information indicating the permitted business operations of the server is obtained. Then, based on the business information, component operation information indicating the temporal changes in the operating state of server components during business operations is derived. Furthermore, based on the business information and temperature information indicating the operating temperature of server components under different operating states, fault information indicating the fault state of the heat dissipation components during operation is configured for the heat dissipation components in the server. This simulates a fault condition of the server's heat dissipation components during business operations. The server component operation is controlled according to the component operation information, and the heat dissipation component operation is controlled according to the fault information. During this process, the server's operating temperature information is detected, and the target temperature control performance of the server under a heat dissipation failure state can be predicted based on the operating temperature information. Thus, by simulating a real heat dissipation failure during server business operations, the temperature control performance of the server under a heat dissipation failure state is tested, making the tested temperature control performance more consistent with the server's actual state. Therefore, this solves the problem of low testing efficiency for server temperature control performance in related technologies, achieving an improvement in the testing efficiency of server temperature control performance. Optionally, the configuration module includes:

[0131] The first determining unit is configured to determine a target operating state when the operating temperature is greater than or equal to a set temperature from the temperature mapping relationship of each target component included in the plurality of server components, wherein the temperature mapping relationship records the correlation between the operating state of the server component and the operating temperature, and the temperature information includes the temperature mapping relationship;

[0132] A screening unit is used to screen out a target heat dissipation component for dissipating heat from a plurality of heat dissipation components;

[0133] The first configuration unit is configured to configure the downtime of each target heat dissipation component according to the component operation information, wherein the fault information includes the downtime.

[0134] Optionally, the first configuration unit is further configured to:

[0135] Extract the running time of the target component in the target running state from the component running information; configure the running time as the downtime of the target heat dissipation component.

[0136] Optionally, the configuration module further includes:

[0137] A conversion unit is used to convert the reference temperature corresponding to multiple reference operating states included in the component operating information of the server component using the temperature mapping relationship of the server component. The temperature mapping relationship records the correlation between the operating state of the server component and the operating temperature. The temperature information includes the temperature mapping relationship.

[0138] A construction unit is used to construct temperature change information of the server component according to the time sequence of changes in the reference operating state indicated by the component operation information, wherein the temperature information records the relationship between the operating temperature of the server component and the change over time.

[0139] The input unit is used to input the temperature change information into the target prediction model to obtain the temperature field distribution information inside the server during the operation of the server component output by the target prediction model. The target prediction model records the influence relationship between temperature and the airflow distribution inside the server. The temperature field distribution information is used to indicate the relationship between the temperature distribution inside the server and time during the operation of the server component.

[0140] The second configuration unit is used to configure the downtime of each heat dissipation component according to the temperature field distribution information, wherein the fault information includes the downtime.

[0141] Optionally, the conversion module includes:

[0142] The detection unit is used to detect the target load state of the server components during the process of the server processing the business indicated by the business information, wherein the target load state is the operating state in which the load of the server components is greater than or equal to the target load during the process of the server processing the business indicated by the business information.

[0143] The second determining unit is used to determine the target load state as a candidate operating state of the server component in the process of handling the business indicated by the business information, wherein the component operating information includes the candidate operating state.

[0144] Optionally, the device further includes:

[0145] The matching module is used to match the internal operating temperature of the server with the protection temperature of the server components after detecting the operating temperature information of the server, wherein the server components trigger the shutdown protection function when the temperature of the server components is higher than the protection temperature.

[0146] The control module is used to disable the shutdown protection function of the server component when the operating temperature inside the server is greater than or equal to the protection temperature.

[0147] Optionally, the prediction module includes:

[0148] A matching unit is used to match the maximum operating temperature in the operating temperature information with the temperature threshold configured for the server;

[0149] The third determining unit is used to determine that the target temperature control performance of the server meets the temperature control performance requirements of the server when the maximum operating temperature in the operating temperature information is less than or equal to the temperature threshold.

[0150] It should be noted that the above modules can be implemented by software or hardware. For the latter, they can be implemented in the following ways, but are not limited to: all the above modules are located in the same processor; or, the above modules are located in different processors in any combination.

[0151] Embodiments of this application also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the above method embodiments when run.

[0152] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.

[0153] Embodiments of this application also provide an electronic device, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.

[0154] In one exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor and the input / output device is connected to the processor.

[0155] Embodiments of this application also provide a computer program product, which includes a computer program that, when executed by a processor, implements the steps in any of the above method embodiments.

[0156] Embodiments of this application also provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps in any of the above method embodiments.

[0157] The embodiments described herein also provide a computer program that includes computer instructions stored in a computer-readable storage medium; a processor of a computer device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the computer device to perform the steps in any of the above method embodiments.

[0158] Specific examples in this embodiment can be found in the examples described in the above embodiments and exemplary implementations, and will not be repeated here.

[0159] Obviously, those skilled in the art should understand that the modules or steps of this application described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. They can be implemented using computer-executable program code, and thus can be stored in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, this application is not limited to any particular combination of hardware and software.

[0160] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A method for testing the temperature control performance of a server, characterized in that, include: In response to a target test request for the server, the service information of the server is obtained, wherein the target test request is used to request a test of the temperature control performance of the server under a heat dissipation failure state, and the service information is used to indicate the business conditions that the server is allowed to handle; Based on the business information, component operation information of the server component during the process of handling the business indicated by the business information is converted, wherein the component operation information is used to indicate the temporal changes in the operating status of the server component; The fault information of the heat dissipation component in the server is configured according to the component operation information and the temperature information of the server component. The fault information is used to indicate the fault status of the heat dissipation component during operation, and the temperature information is used to indicate the operating temperature of the server component under different operating conditions. The fault information includes downtime. During the process of controlling the operation of the server components according to the component operation information and controlling the operation of the heat dissipation components according to the fault information, the operating temperature information of the server is detected; Predict the target temperature control performance of the server under heat dissipation failure conditions based on the operating temperature information.

2. The method according to claim 1, characterized in that, The step of configuring fault information for the heat dissipation components in the server based on the component operating information and the temperature information of the server components includes: The target operating state when the operating temperature is greater than or equal to a set temperature is determined from the temperature mapping relationship of each target component included in the plurality of server components, wherein the temperature mapping relationship records the correlation between the operating state of the server component and the operating temperature, and the temperature information includes the temperature mapping relationship; Select a target heat dissipation component from the plurality of heat dissipation components for dissipating heat from the target component; Configure the downtime of each target heat dissipation component based on the component operation information.

3. The method according to claim 2, characterized in that, The step of configuring the downtime of each target heat dissipation component based on the component operation information includes: Extract the running time of the target component in the target running state from the component running information; The runtime is configured as the downtime of the target heat dissipation component.

4. The method according to claim 1, characterized in that, The step of configuring fault information for the heat dissipation components in the server based on the component operating information and the temperature information of the server components includes: The temperature mapping relationship of the server component is used to convert the reference temperature corresponding to multiple reference operating states included in the component operation information of the server component. The temperature mapping relationship records the correlation between the operating state of the server component and the operating temperature. The temperature information includes the temperature mapping relationship. The temperature change information of the server component is constructed according to the time sequence of changes in the reference operating state indicated by the component operating information, wherein the temperature information records the relationship between the operating temperature of the server component and the change over time. The temperature change information is input into the target prediction model to obtain the temperature field distribution information inside the server during the operation of the server component. The target prediction model records the influence relationship between temperature and the airflow distribution inside the server. The temperature field distribution information is used to indicate the relationship between the temperature distribution inside the server and time during the operation of the server component. Configure the downtime of each heat dissipation component according to the temperature field distribution information.

5. The method according to claim 1, characterized in that, The step of converting the server component's operation information during the process of handling the business indicated by the business information based on the business information includes: The target load status of the server component is detected during the process of the server processing the business indicated by the business information. The target load status is the operating state in which the load of the server component is greater than or equal to the target load during the process of the server processing the business indicated by the business information. The target load state is determined as a candidate operating state of the server component in the process of handling the business indicated by the business information, and the component operating information includes the candidate operating state.

6. The method according to claim 1, characterized in that, After detecting the operating temperature information of the server, the method further includes: The internal operating temperature of the server is matched with the protection temperature of the server components, wherein the server components trigger a shutdown protection function when the temperature of the server components exceeds the protection temperature; When the operating temperature inside the server is greater than or equal to the protection temperature, the shutdown protection function controlling the server component is disabled.

7. The method according to claim 1, characterized in that, The step of predicting the target temperature control performance of the server under heat dissipation failure conditions based on the operating temperature information includes: Match the maximum operating temperature in the operating temperature information with the temperature threshold configured for the server; If the maximum operating temperature in the operating temperature information is less than or equal to the temperature threshold, it is determined that the target temperature control performance of the server meets the temperature control performance requirements of the server.

8. A testing device for server temperature control performance, characterized in that, include: The acquisition module is used to respond to a target test request to the server and acquire the server's business information. The target test request is used to request a test of the server's temperature control performance under heat dissipation failure conditions, and the business information is used to indicate the business conditions that the server is allowed to handle. The conversion module is used to convert the server component's component operation information during the process of handling the business indicated by the business information, wherein the component operation information is used to indicate the temporal changes in the operating status of the server component; A configuration module is used to configure fault information of the heat dissipation component in the server according to the component operation information and the temperature information of the server component. The fault information is used to indicate the fault status of the heat dissipation component during operation, and the temperature information is used to indicate the operating temperature of the server component under different operating conditions. The fault information includes downtime. The detection module is used to detect the operating temperature information of the server during the process of controlling the operation of the server component according to the component operation information and controlling the operation of the heat dissipation component according to the fault information. The prediction module is used to predict the target temperature control performance of the server under heat dissipation failure conditions based on the operating temperature information.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the method described in any one of claims 1 to 7.

10. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method described in any one of claims 1 to 7.

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