Chip cover planting method and cover planting equipment

Abstract

The invention discloses a chip cover planting method and equipment, the cover planting method comprises a chip feeding step, a protective cover feeding step, a cover planting step, a hot pressing step and a discharging step, and the cover planting method further comprises a code picking step of picking up a pattern of an identification code on a chip. And a code printing step of processing the identification code obtained in the code picking step on the protective cover, in the cover planting process of planting the protective cover on the chip, the pattern of the identification code on the chip is firstly obtained before the protective cover is not planted, and then the same identification code pattern is processed and formed on the protective cover planted on the chip, so that the identification code can be printed on the chip. Therefore, the chip is completely consistent with the pattern of the identification code on the protective cover planted on the chip without additionally establishing a matching relationship between the chip and the protective cover, so that the chip and the protective cover accurately correspond to each other, a disorder phenomenon is avoided in a subsequent product traceability process, and the traceability accuracy of the chip is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a chip capping method and a chip capping device. Background Art

[0002] Since the chip itself is easy to break, during the chip production process, it is usually necessary to encapsulate the chip in a metal shell with a certain strength for protection, that is, it is necessary to put a protective cover on the chip. During the specific capping operation, the dispensing mechanism dispenses glue on the chip, then puts the protective cover on the chip, and then presses the protective cover and the chip together through the pressing mechanism, thus completing the chip capping process.

[0003] In order to enable each chip to be traced, the chip is usually provided with an identification code after it is produced by the upstream process. However, after the capping process is completed, the above identification code will be blocked by the protective cover, and the identification code is usually not accessible from the outside. Therefore, before the capping process, the commonly used practice is to add an identification code to each protective cover, and then, during the capping process, establish a correspondence between the identification code on the chip and the identification code on the protective cover, so that the chip can be traced according to the identification code on the protective cover. However, in the process of automated production, if there is a misalignment or error in information binding, it will lead to confusion in the actual product information and cause inaccurate chip traceability information. There is currently no effective preventive measure to solve this problem. Summary of the invention

[0004] The object of the present invention is to provide a chip capping method to solve one or more problems of the prior art.

[0005] To achieve the above object, the technical solution adopted by the present invention is: a chip capping method for placing a protective cover on a chip, the capping method comprising:

[0006] A chip loading step for transferring the chip to a processing station;

[0007] A protective cover loading step, for loading the protective cover to a preset position;

[0008] A capping step, placing the protective cover on the chip;

[0009] A heat pressing step of pressing the protective cover onto the chip;

[0010] a blanking step, blanking the chip with the protective cover implanted thereon,

[0011] The capping method further includes a code picking step of picking up the pattern of the identification code on the chip, and a coding step of processing the identification code obtained in the code picking step on the protective cover, wherein the code picking step is arranged before the capping step and the coding step, and the coding step is arranged between the protective cover feeding step and the capping step, or between the capping step and the hot pressing step, or between the hot pressing step and the unloading step.

[0012] In some embodiments, the code picking step is provided after the chip loading step.

[0013] In some embodiments, during the execution of the code picking step and the code printing step, the chip is always located on the processing station.

[0014] In some embodiments, in the coding step, a laser is used to process and form the identification code on the protective cover.

[0015] In some embodiments, the cover planting step includes a glue dispensing step of adding glue on the chip, and a cover placing step of placing the protective cover on the chip so that the protective cover is bonded to the glue.

[0016] Another object of the present invention is to provide a chip capping device.

[0017] To achieve the above object, the technical solution adopted by the present invention is: a chip capping device, used for placing a protective cover on a chip, the capping device comprising:

[0018] A chip loading mechanism, used for transferring the chip to a processing station;

[0019] A protective cover feeding mechanism, used for transferring the protective cover to a preset position;

[0020] A glue dispensing mechanism, used for adding glue on the chip;

[0021] A capping mechanism, used for placing the protective cover on the chip;

[0022] A pressing mechanism, used for pressing the protective cover onto the chip,

[0023] The planting cover device also includes:

[0024] A visual module, used for acquiring a pattern of the identification code on the chip;

[0025] A coding module is used to process and form the identification code on the protective cover.

[0026] A control module is communicatively connected with the visual module and the coding module, so that the coding module processes the identification code acquired by the visual module onto the protective cover.

[0027] In some embodiments, the coding module includes a laser and a processing work head. The position of the processing work head is adjustable, and the processing work head is arranged on the light output path of the laser.

[0028] In some embodiments, the processing work head is arranged at the processing station.

[0029] In some embodiments, the capping equipment further includes a pressing station and a unloading station, the chip passes through the processing station, the pressing station and the unloading station sequentially along the transmission path, and the processing work head is arranged at the pressing station or the unloading station.

[0030] In some embodiments, the capping device performs the capping method described above.

[0031] Due to the application of the above technical scheme, the present invention has the following advantages compared with the prior art: the chip capping method and the capping device of the present invention, wherein, in the process of capping the protective cover on the chip, the pattern of the identification code on the chip is first obtained before the protective cover is placed, and then the same identification code pattern is formed on the protective cover placed on the chip. In this way, the pattern of the identification code on the chip and the protective cover implanted thereon are completely consistent, and there is no need to establish an additional matching relationship between the two, so that the two correspond accurately, and there will be no confusion in the traceability process of subsequent products, which is conducive to ensuring the accuracy of chip traceability. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Attached Figure 1 This is a schematic diagram of the overall structure of the chip capping device according to Embodiment 1 of the present invention;

[0033] Attached Figure 2 This is a schematic diagram of the distribution of various mechanisms in the chip implantation device of Example 1;

[0034] Attached Figure 3 This is a schematic diagram of the connection relationship between the coding module, the code picking module and the control module in the chip capping device of Example 1;

[0035] Attached Figure 4 This is a schematic diagram of the structure of the coding module in Example 1;

[0036] Attached Figure 5 For attachment Figure 4 A partial structural diagram of a coding module;

[0037] Attached Figure 6It is a schematic diagram of the overall structure of a carrier with a protective cover implanted on the chip;

[0038] Attached Figure 7 This is a schematic diagram of the overall structure of a chip capping device according to Embodiment 2 of the present invention;

[0039] Attached Figure 8 This is a schematic diagram of the distribution of various mechanisms in the chip implantation device of Example 7;

[0040] Wherein: 100, carrier; 101, chip; 102, protective cover;

[0041] 1. Chip loading mechanism; 2. Protective cover loading mechanism; 3. Glue dispensing mechanism; 4. Cap planting mechanism; 5. Pressing mechanism; 6. Unloading mechanism; 7. Vision module; 8. Coding module; 81. Mounting seat; 82. Laser; 83. Processing work head; 9. Control module. DETAILED DESCRIPTION

[0042] The technical solution of the present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0043] Example 1

[0044] See also Figure 1 The chip capping device shown is used to place a protective cover 102 on the chip 101, wherein Figure 6 The carrier 100 shown has a plurality of chips 101 thereon, and a protective cover 102 has been placed on each chip 101. The carrier 100 is transferred to a capping device for capping processing.

[0045] See also Figure 1 to Figure 2 As shown, the capping device includes a chip loading mechanism 1, a protective cover loading mechanism 2, a glue dispensing mechanism 3, a capping mechanism 4, a pressing mechanism 5 and a discharging mechanism 6. The capping device is provided with a loading station S1, a pressing station S2 and a discharging station S3 in the upper transmission direction. The chip loading mechanism 1 is used to transfer the chip 101 to the processing station S1; the protective cover loading mechanism 2 is used to transfer the protective cover 102 to a preset position; the glue dispensing mechanism 3 is used to add glue on the chip 101, that is, on the chip 101 The glue is dispensed at a preset position; the cap planting mechanism 4 is used to place the protective cover 102 on the chip 101 so that the periphery of the protective cover 102 contacts the glue; the pressing mechanism 5 is used to press the carrier 100 with the protective cover 102 placed on the chip 101 at the pressing station S2 in the up and down directions so that the protective cover 102 and the chip 101 are bonded by glue; the unloading mechanism 6 is used to transfer the pressed carrier 100 to the next process at the unloading station S3.

[0046] When the chip is capped using the above-mentioned capping equipment, the chip loading mechanism 1 performs the chip loading step to transfer the chip 101 to the processing station; the protective cover loading mechanism 2 performs the protective cover loading step to load the protective cover to a preset position; the glue dispensing mechanism 3 cooperates with the capping mechanism 4 to perform the capping step, including a glue dispensing sub-step of adding glue to the chip 101 by the glue dispensing mechanism 3, and a cap placing step of placing the protective cover 102 on the chip 101 by the capping mechanism 4 so that the protective cover 102 is bonded to the glue; the pressing mechanism 5 performs the hot pressing step, which presses the protective cover 102 on the chip 101 at the pressing station S2; the unloading mechanism 6 performs the unloading step at the unloading station S3 to unload the chip 101 with the protective cover 102.

[0047] The specific structures of the above-mentioned chip loading mechanism 1, protective cover loading mechanism 2, glue dispensing mechanism 3, cap planting mechanism 4, pressing mechanism 5 and unloading mechanism 6 are not the focus of the present invention. Their specific structures can adopt the structure in Chinese Patent Publication No. CN115954278A, which will not be repeated here.

[0048] As shown in the accompanying drawings, the chip implanting device of this embodiment also includes a visual module 7, a coding module 8 and a control module 9, wherein the visual module 7 is used to obtain the pattern of the identification code on the chip 101; the coding module 8 is used to process the protective cover 102 to form the above-mentioned identification code, and the control module 9 is communicated with the above-mentioned visual module 7 and the coding module 8, so that the pattern of the identification code on the chip 101 obtained by the visual module 7 is transmitted to the control module 9, and the control module 9 then controls the coding module 8 to code on the protective cover 102 to form a same pattern of identification code, so that the identification code on the protective cover 102 is consistent with the pattern of the identification code on the chip 101 it covers. In this way, there is no need to bind the different identification codes on the protective cover 102 and the chip 101, thereby avoiding the problem of inaccuracy caused by confusion of product information.

[0049] In the present embodiment, the coding module 8 specifically performs coding by means of laser, and the coding module 8 includes a mounting seat 81, a laser 82 and a processing work head 83 which are adjustable in height on the mounting seat 81, and the processing work head 83 is arranged on the light output path of the laser 82, wherein the processing work head 83 is adjustably arranged relative to the laser 82, including the horizontal position and angle along the X-direction and the Y-direction, so that the processing work head 83 can be adjusted to correspond to the position on the protective cover 102 where coding is required.

[0050] During the capping process of the capping device, the visual module 7 also performs a code picking step, and the coding module 8 performs a coding step. In this embodiment, the visual module 7 and the coding module 8 are both arranged at the processing station S1, wherein the code picking step is arranged before the capping step and the coding step, and the coding step is arranged between the protective cover feeding step and the capping step, or between the capping step and the hot pressing step. That is to say, before the protective cover 102 is placed on the chip 101, the visual module 7 takes a photo to obtain the identification code on the chip 101. Before the protective cover 102 is placed on the chip 101, or after the protective cover 102 is placed on the chip 101, the coding module 8 can be used to code the protective cover 102 at the processing station S1, so that the protective cover 102 is marked with an identification code with the same pattern as that on the chip 101.

[0051] Example 2

[0052] See also Figure 7 , Figure 8 As shown, the main difference between this embodiment and embodiment 1 is that the visual module 7 of this embodiment is arranged at the processing station S1, and the processing head 83 of the coding module 8 is arranged at the blanking station S3, and the coding step is performed between the hot pressing step and the blanking step. In other embodiments, the processing head 83 can also be arranged at the pressing station S2.

[0053] In summary, the chip implanting method and the chip implanting device of the present invention, wherein, during the implanting process of implanting the protective cover 102 on the chip 101, the pattern of the identification code on the chip 101 is obtained by the visual module 7, and then the coding module 8 processes and forms the same identification code pattern on the protective cover 102 implanted on the chip 101. In this way, the pattern of the identification code on the chip 101 and the protective cover 102 implanted thereon are completely consistent, and there is no need to establish an additional matching relationship between the two, so that the two correspond accurately, and there will be no confusion in the traceability process of subsequent products, which is conducive to ensuring the accuracy of chip traceability.

[0054] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it. They cannot be used to limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip capping method for placing a protective cover on a chip, the capping method comprising: A chip loading step for transferring the chip to a processing station; A protective cover loading step, for loading the protective cover to a preset position; A capping step, placing the protective cover on the chip; A heat pressing step of pressing the protective cover onto the chip; a blanking step, blanking the chip with the protective cover implanted thereon, The invention is characterized in that: the capping method further comprises a code picking step of picking up the pattern of the identification code on the chip, and a coding step of processing the identification code obtained in the code picking step on the protective cover, wherein the code picking step is arranged before the capping step and the coding step, and the coding step is arranged between the protective cover feeding step and the capping step, or between the capping step and the hot pressing step, or between the hot pressing step and the unloading step.

2. The chip implantation method according to claim 1, characterized in that: The code picking step is arranged after the chip loading step.

3. The chip implantation method according to claim 2, characterized in that: During the execution of the code picking step and the code printing step, the chip is always located on the processing station.

4. The chip implantation method according to claim 1, characterized in that: In the coding step, a laser is used to process the identification code on the protective cover.

5. The chip implantation method according to claim 1, characterized in that: The step of planting the cover includes a glue dispensing sub-step of adding glue on the chip, and a cover placing step of placing the protective cover on the chip so that the protective cover is bonded to the glue.

6. A chip capping device for placing a protective cover on a chip, the capping device comprising: A chip loading mechanism, used for transferring the chip to a processing station; A protective cover feeding mechanism, used for transferring the protective cover to a preset position; A glue dispensing mechanism, used for adding glue on the chip; A capping mechanism, used for placing the protective cover on the chip; A pressing mechanism, used for pressing the protective cover onto the chip, Characterized in that: the planting cover equipment also includes: A visual module, used for acquiring a pattern of the identification code on the chip; A coding module is used to process and form the identification code on the protective cover. A control module is communicatively connected with the visual module and the coding module, so that the coding module processes the identification code acquired by the visual module onto the protective cover.

7. The chip implantation device according to claim 6, characterized in that: The coding module comprises a laser and a processing head. The position of the processing head is adjustable and the processing head is arranged on the light output path of the laser.

8. The chip implantation device according to claim 6, characterized in that: The processing work head is arranged at the processing station.

9. The chip implantation device according to claim 6, characterized in that: The capping equipment further comprises a pressing station and a material unloading station. The chip passes through the processing station, the pressing station and the material unloading station sequentially along the transmission path. The processing work head is arranged at the pressing station or the material unloading station.

10. The chip implantation device according to claim 6, characterized in that: The capping device performs the capping method according to any one of claims 1 to 5.

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